MtM Plus Technology M904S M904S User Manual
MtM Technology Corporation M904S
User Manual
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| Document ID | 3233085 |
| Application ID | JkL7RtwEOmATsITTXqDzxQ== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 174.71kB (2183895 bits) |
| Date Submitted | 2016-12-19 00:00:00 |
| Date Available | 2017-06-18 00:00:00 |
| Creation Date | 2016-12-16 17:54:44 |
| Producing Software | Microsoft® Word 2010 |
| Document Lastmod | 2016-12-19 09:18:29 |
| Document Title | User Manual |
| Document Creator | Microsoft® Word 2010 |
| Document Author: | User1 |
Product Specification Product Name: M904S Bluetooth SiP Module -BT 4.0 LE Version: 1.04 Doc No: Date: th Nov 25 , 2016 MtM Technology Corporation 8F, 178 MinQuan East Road Section 3, Taipei, Taiwan (R.O.C.) www.mtmtech.com.tw MtM Technology Corporation Document History Date Jan. 23, 2014 Revise Contents Initial Version Revise by Version Brian Juang XA Apr. 28, 2015 1.01 Dec. 29, 2015 1.02 Jun. 14, 2016 Add the antenna Design guide, and Modify Power consumption PJ Chang 1.03 Nov. 25, 2016 1. Revise the reference scheme PJ Chang 1.04 2. Add FCC Related information © MtM Technology Corporation. All rights reserved. Page 2 / 27 MtM Technology Corporation INDEX 1 Description ...................................................................................................................... 4 2 Feature ............................................................................................................................ 5 3 Block Diagram ................................................................................................................ 6 4 Technical Specification .................................................................................................. 7 4.1Recommendable Operation Condition ......................................................................... 7 4.1Temperature, humidity ................................................................................................. 7 4.2Voltage ......................................................................................................................... 7 4.3 Wireless Specifications ............................................................................................... 7 4.4 Radio Specifications Bluetooth 4.0 Low Energy........................................................ 8 4.5 External Antenna Design Guide ....................................................................... ..........9 4.5.1 PCB Antenna Design Guide .......................................................................... ..........9 4.5.2 Chip Antenna Design Guide .................................................................................. 11 4.6 Power Consumption .................................................................................................. 14 5 Dimensions ................................................................................................................... 17 6 Pin Assignments ..........................................................................................................19 7 Recommend Footprint ............................................................................................... 20 8 Reference Design Circuit ........................................................................................... 21 9 Recommended Reflow Profile ................................................................................... 22 10 SiP Module Preparation .......................................................................................... 23 10.1 Handling ................................................................................................................ 23 10.2 SMT Preparation ................................................................................................... 23 11 Package Information ............................................................................................... 24 11.1 Product Marking ..................................................................................................... 24 11.2 Package Information ............................................................................................... 25 12 BQB / CE/ FCC Certification .................................................................................. 26 © MtM Technology Corporation. All rights reserved. Page 3 / 27 MtM Technology Corporation 1 Description The SiP module M904S is a small size module with conformal shielding. The module provides full function of Bluetooth 4.0 Low Energy in a tiny module via 48 pins LGA Foot Print. The M904S module provides everything required to create Bluetooth 4.0 Low Energy product with RF, baseband, MCU, qualified Bluetooth v4.0 stack and customer application running on a single IC. M904S enables ultra-low power connectivity and basic data transfer for applications previously limited by the power consumption, size constraints and complexity of other wireless standards. The low power consumption and excellent radio performance make it the best solution for OEM /ODM customers who require embedded Bluetooth 4.0 Low Energy feature, such as, IP camera, car key, sport and fitness watch, mouse, led light bulb etc. For the software and driver development, we provide extensive technical document and reference software code for the system integration. Hardware evaluation kit and development utilities will be released base on listed OS and processors to OEM customers. © MtM Technology Corporation. All rights reserved. Page 4 / 27 MtM Technology Corporation 2 Feature Bluetooth® v4.0 LE radio technology -90 dBm sensitivity in Bluetooth® low energy mode 250 kbps, 1 Mbps, 2 Mbps supported data rates TX Power -20 to +4 dBm in 4 dB steps TX Power -30 dBm Whisper mode 12 mA peak RX, 10 mA peak TX (0 dBm) 256 kB embedded flash program memory Supply voltage range 1.8 V to 3.6 V SPI Master/Slave Low power comparator Temperature sensor Two-wire Master (I2C compatible) UART (CTS/RTS) AES HW encryption Real Timer Counter (RTC) Demo SW Open source on nRF51SDK v8/SoftDevice version 1 Supports the nRF51SDK v11/SoftDevice v2 LGA-48 package, 6.5 x 6.5 mm ORDRING INFORMATION Part Number Description M904S CLASS 2 Bluetooth single mode Module according BT-4.0. Bluetooth SMART © MtM Technology Corporation. All rights reserved. Page 5 / 27 MtM Technology Corporation 3 Block Diagram M904S supports UART command line interface to connect to the host processor. The simplified block diagram is depicted in the Fig. as below.. © MtM Technology Corporation. All rights reserved. Page 6 / 27 MtM Technology Corporation 4 Technical Specification 4.1 Recommendable Operation Condition Temperature, humidity The M904S module has to withstand the operational requirements as listed in the table below No Description Value Unit –0.3 to 3.9 Ratings Over Operating Free-Air Temperature Range Supply voltage All supply pins must have the same voltage Voltage on any digital pin Operating ambient temperature TBD –25 to 75 °C –35 to 75 °C range Storage temperature range Bluetooth RF output 4±1 dBm 4..2Voltage Power supply for the M904S module will be provided by the host via the power pins Operating Condition Min. Typ. Max. DVDD_3V3 1.8 3.3 3.6 I/O supply voltage (VDD_PADS) 1.2 3.3 3.6 4.3 Wireless Specifications The M904S module compliance with the following features and standards Features Description Bluetooth Standards Bluetooth core v4.0 Low Energy Antenna Port Support Single Antenna for Bluetooth Frequency Band 2.402 – 2.480 GHz © MtM Technology Corporation. All rights reserved. Page 7 / 27 MtM Technology Corporation 4.4 Radio Specifications Bluetooth 4.0 Low Energy Features Description Frequency Band 2.402– 2.480 GHz (2.4 GHz ISM Band) Number of selectable Sub channels 40 channels Modulation GFSK Supported rates <2Mbps Maximum receive level -10dBm (with PER <30. 8%) Parameter RX sensitivity Maximum input Frequency range Output power adjustment ranger Output power Output power variation Mode and Conditions © MtM Technology Corporation. All rights reserved Page 8 / 27 Min. Typ. Max. Unit. 2400 -90 -10 2483 dBm dBm MHz -20 dBm dBm dB MtM Technology Corporation 4.5 External Antenna Design Guide 4.5.1 PCB Antenna Design Guide: Peak Gain: -2dBi Typ. / Avg. Gain: -3.5dBi Typ. (XZ-V) Return Loss © MtM Technology Corporation. All rights reserved MtM Technology Corporation Page 9 / 27 Radiation Patterns © MtM Technology Corporation. All rights reserved MtM Technology Corporation Page 10 / 27 4.5.2 Chip Antenna Design Guide Dimensions and Recommended PC Board Pattern © MtM Technology Corporation. All rights reserved MtM Technology Corporation Page11 / 27 Return Loss\With Matching Circuits © MtM Technology Corporation. All rights reserved Page 12 / 27 MtM Technology Corporation © MtM Technology Corporation. All rights reserved Page 13 / 27 MtM Technology Corporation 4.5.2 Dipole Antenna Design Guide: Return Loss Radiation Patterns xy-plane xz-plane yz-plane © MtM Technology Corporation. All rights reserved Page 14 / 27 MtM Technology Corporation 4.5.4 PIFA Antenna Design Guide: Return Loss MtM Technology Corporation Radiation Patterns Vertical, Horizontal and Total Gain Patterns at 2400MHz Vertical, Horizontal and Total Gain Patterns at 2440MHz Vertical, Horizontal and Total Gain Patterns at 2480MHz © MtM Technology Corporation. All rights reserved Page 14 / 27 MtM Technology Corporation 4.6 Power Consumption Item Tx mode Rx mode Condition 3.3V 3.3V System ON Constant Latency Sleep Mode Power Management © MtM Technology Corporation. All rights reserved Page 14 / 27 Typ. 9.76mA 12.15mA 0.41uA MtM Technology Corporation Radio Current Consumption © MtM Technology Corporation. All rights reserved Page 15 / 27 MtM Technology Corporation Transmitter Specifications © MtM Technology Corporation. All rights reserved Page 16 / 27 MtM Technology Corporation 5 Dimensions The size and thickness of the M904 module 6.5mm (W) x 6.5mm (L) x 1.3mm (H): Top-View: Bottom-View: © MtM Technology Corporation. All rights reserved Page 17 / 27 Side-View: MtM Technology Corporation Dimensions © MtM Technology Corporation. All rights reserved. Page 18 / 27 MtM Technology Corporation 6 Pin Assignments 6.1Pin Description The foot print dimension and pin definition is defined as below © MtM Technology Corporation. All rights reserved. Page 19 / 27 MtM Technology Corporation 7 Recommend Footprint Suggest on PCB: SMD (1:1) © MtM Technology Corporation. All rights reserved. Page 20 / 27 MtM Technology Corporation 8 Reference Design Circuit 8.1 Reference Schematic AVDD DC Power VDD R4 0R_0402 35 GND P0_04_AIN5 P0_05_AIN6 RTC (External) VDD 32 31 P0_26 R2 0R_0402 P0_27 Y 1 NM_32.768kHz 29 28 27 26 25 24 23 P0_27 P0_00 P0_02 R3 0R_0402 C2 1.0uF_0402 P0_01 P0_03 P0_04 C17 12PF_0402 2.4GHz Antenna U11 ANT P0_05 ANT 50 Ohm trace © MtM Technology Corporation. All rights reserved. Page 21 / 27 C9 0R_0402 RF L7 N.L_0402 P0_06 P0_08 C16 12PF_0402 P0_26 30 P0_06_AIN7_AREF1 P0_03_AIN4 33 22 P0_08 P0_09 21 P0_09 20 P0_13 P0_13 19 18 13 DEC2 P0_14 GND P0_14 JTAG RF ANT P0_15 RF 34 NC 36 37 GND AVDD 38 39 GND GND 40 41 GND GND 42 43 GND GND 44 P0_01_AIN2 DEC 12 GND P0_15 11 P0_02_AIN3 P0_16 10 P0_00_AREF0 GND 17 RF VDD GND 16 GND M904S_BLE_Module PWR GND P0_16 P0_27_AIN1_XL1 GND SWDIO_nRESET U1 GND SWDCLK P0_26_AIN0_XL2 15 GND GND SWDIO DEC2 ANT_TEST RTC AVDD R5 0R_0402 GND DEC2 GND 14 SWDCLK GND GND GND GND GND 48 47 46 45 C3 1.0uF_0402 L6 N.L_0402 MtM Technology Corporation 8.2 Layout Guide The following points are observed for antenna. Reference Description The RF traces bends must be gradual with an appoximate maximum bend of 45 degrees RF traces must have via on ground plane beside the RF trace on both sides RF traces must have constant impedance (microstrip transmission line) RF trace gound layer must be the solid ground layer immediately below RF trace. There must be no trace and ground under antenna section RF Section Layout RF Section Layout CPW impedance Calculation 9 Recommended Reflow Profile Profile Condition a. Suitable for Lead-Free solder b. Between 155~160°C: 60~90 sec. c. Above 220°C: 60~90 sec. d. Peak Temperature: 240~245 (<10 sec.) © MtM Technology Corporation. All rights reserved. Page 22 / 27 MtM Technology Corporation 10 SiP Module Preparations 10.1 Handling Handling the module must wear the anti-static wrist strap to avoid ESD damage. After each module is aligned and tested, it should be transport and storage with anti-static tray and packing. This protective package must be remained in suitable environment until the module is assembled and soldered onto the main board. 10.2 SMT Preparation 1. Calculated shelf life in sealed bag: 6 months at <40℃ and <90% relative humidity (RH). 2. Peak package body temperature: 250℃. 3. After bag was opened, devices that will be subjected to reflow solder or other high temperature process must. A. Mounted within: 72 hours of factory conditions <30℃/60% RH. B. Stored at ≦10% RH with N2 flow box. 4. Devices require baking, before mounting, if: A. Package bag does not keep in vacuumed while first time open. B. Humidity Indicator Card is >10% when read at 23±5℃. C. Expose at 3A condition over 8 hours or Expose at 3B condition over 24 hours. 5. If baking is required, devices may be baked for 12 hours at 125±5℃. © MtM Technology Corporation. All rights reserved. Page 23 / 27 MtM Technology Corporation 11 Package Information 11.1 Product Marking © MtM Technology Corporation. All rights reserved. Page 24 / 27 MtM Technology Corporation 11.2 Package Information ---------------------------------------------------------------------------------------------------------------------------------------- ---------------------------------------------------------------------------------------------------------------------------------------- ---------------------------------------------------------------------------------------------------------------------------------------- © MtM Technology Corporation. All rights reserved. Page 25 / 27 MtM Technology Corporation 12 BQB/CE/FCC Certification 12.1 FCC (USA) Federal Communication Commission Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. Increase FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This device and its antenna(s) must not be co-located or operating in conjunction with any other antenna or transmitter. IMPORTANT NOTE: FCC Radiation Exposure Statement: This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. © MtM Technology Corporation. All rights reserved. Page 26 / 27 IMPORTANT NOTE: This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. Appropriate measurements (e.g. 15 B compliance) and if applicable additional equipment authorizations (e.g. Verification , Doc) of the host device to be addressed by the integrator/manufacturer. IMPORTANT NOTE: This module is intended for OEM integrator. The OEM integrator is still responsible for the FCC compliance requirement of the end product, which integrates this module. 20cm minimum distance has to be able to be maintained between the antenna and the users for the host this module is integrated into. Under such configuration, the FCC radiation exposure limits set forth for an population/uncontrolled environment can be satisfied. Any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. USERS MANUAL OF THE END PRODUCT: In the users manual of the end product, the end user has to be informed to keep at least 20cm separation with the antenna while this end product is installed and operated. The end user has to be informed that the FCC radio-frequency exposure guidelines for an uncontrolled environment can be satisfied. The end user has to also be informed that any changes or modifications not expressly approved by the manufacturer could void the user's authority to operate this equipment. If the size of the end product is smaller than the palm of the hand, then additional FCC part 15.19 statement is required to be available in the users manual: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. LABEL OF THE END PRODUCT: The final end product must be labeled in a visible area with the following " Contains TX FCC ID: 2AJ9P-M904S". If the size of the end product is larger than the palm of the hand, then the following FCC part 15.19 statement has to also be available on the label: This device complies with Part 15 of FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation. Professional installation Section 15.204(b) states that an approved "transmission system" must always be marketed as a complete system including the antenna. © MtM Technology Corporation. All rights reserved. Page 27 / 27
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