Panasonic Devices Europe 9320 Wireless LAN Embedded Module User Manual TABLE OF CONTENTS

Panasonic Industrial Devices Europe GmbH Wireless LAN Embedded Module TABLE OF CONTENTS

15_ENW49A013EF_(PAN9320+PAN9310)_UserMan

CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 1  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   Power Electronics R&D Center Wireless Connectivity Panasonic Industrial Devices Europe GmbH APPROVED  CHECKED  DESIGNED    Product Specification  Applicant / Manufacturer Hardware Panasonic Industrial Devices Europe GmbH Zeppelinstrasse 19 21337 Lüneburg Germany   Applicant / Manufacturer Software Please refer to chapter 28. Ordering Information    Software Version Please refer to chapter 29. Software Versions            By purchase of any of products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required without notification.
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 2  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  TABLE OF CONTENTS  1. Scope of this Document ................................................................................................ 5 2. History for this Document .............................................................................................. 5 3. Data Sheet Status ......................................................................................................... 5 4. Related Documents ....................................................................................................... 5 5. Key Features ................................................................................................................. 6 6. Applications for the PAN9320 ........................................................................................ 6 7. Wireless Local Area Network Overview ......................................................................... 7 8. Description of the PAN9320 .......................................................................................... 7 9. Difference PAN9320 to PAN9310 .................................................................................. 7 10. Detailed Description ...................................................................................................... 8 10.1. PAN9320 / PAN9310 Terminal Layout ................................................................. 8 10.2. Common Terminal Pin-Configuration ................................................................... 8 11. General Features ........................................................................................................ 10 12. HOST Interfaces ......................................................................................................... 10 12.1. UART0 Interface ................................................................................................ 10 12.2. UART1 Interface ................................................................................................ 10 13. Peripheral Bus Interface .............................................................................................. 11 14. WLAN Features ........................................................................................................... 12 14.1. IEEE 802.11 / Standards .................................................................................... 12 14.2. WLAN MAC ........................................................................................................ 12 14.3. WLAN Baseband ................................................................................................ 12 14.4. WLAN Radio ...................................................................................................... 13 14.5. WLAN Encryption ............................................................................................... 13 15. Block Diagram ............................................................................................................. 14 15.1. PAN9320............................................................................................................ 14 15.2. PAN9310............................................................................................................ 14 16. Key Parts List .............................................................................................................. 15 17. Test Conditions ........................................................................................................... 15 18. General Requirements and Operation ......................................................................... 15 18.1. Absolute Maximum Ratings ................................................................................ 15 18.2. Recommended Operating Conditions ................................................................. 15 18.3. Digital Pin Characteristics .................................................................................. 16 18.4. Electrical characeristics ...................................................................................... 16 18.4.1. Current Consumption ............................................................................ 16 18.5. Internal Operating Frequencies .......................................................................... 16 18.6. Power Up Sequence .......................................................................................... 17 18.7. Firmware related Timing ..................................................................................... 17 18.8. Coexistence Interface Specification.................................................................... 18 18.8.1. Marvell® 3/4-Wire Timing Data .............................................................. 18
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 3  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  18.8.2. WL_ACTIVE 2/3/4-Wire Timing Data .................................................... 19 18.9. Host Interface Specification ................................................................................ 20 18.9.1. UART0 Command Interface .................................................................. 20 18.9.2. UART1 Binary Data Interface ................................................................ 20 18.9.3. UART1 Dual Interface ........................................................................... 21 18.10. Peripheral Interface Specification ................................................................... 22 18.10.1. Configurable GPIOs .............................................................................. 22 18.10.2. Firmware defined GPIOs ....................................................................... 22 18.10.3. Quad Serial Peripheral Interface (QSPI) ............................................... 23 18.10.3.1. List of supported Flash Memories ................................................... 23 18.10.3.1. Firmware supported QSPI Characteristic ........................................ 23 19. RF Electrical Characteristics ....................................................................................... 24 19.1. WLAN Radio Specification ................................................................................. 24 19.2. WLAN RF Characteristics .................................................................................. 25 19.2.1. RF Characteristics for IEEE 802.11b ..................................................... 25 19.2.2. RF Characteristics for IEEE 802.11g ..................................................... 26 19.2.3. RF Characteristics for IEEE 802.11n (BW 20 MHz) ............................... 27 19.2.4. RF Characteristics for IEEE 802.11n (BW 40 MHz) ............................... 28 20. Soldering Temperature-Time Profile (for reflow soldering) ........................................... 29 20.1. For lead solder ................................................................................................... 29 20.2. For leadfree solder ............................................................................................. 29 21. PAN9320 / PAN9310 Module Dimension .................................................................... 30 22. PAN9320 / PAN9310 Footprint of the Module ............................................................. 31 23. Case Marking (Example for PAN9320 – FCC Version) ................................................ 32 24. Mechanical Requirements ........................................................................................... 33 25. Reliability Tests ........................................................................................................... 33 26. Cautions ...................................................................................................................... 33 26.1. Design Notes ..................................................................................................... 33 26.2. Installation Notes ................................................................................................ 34 26.3. Usage Conditions Notes ..................................................................................... 34 26.4. Storage Notes .................................................................................................... 34 26.5. Safety Cautions .................................................................................................. 35 26.6. Other cautions .................................................................................................... 35 27. Packaging ................................................................................................................... 36 27.1. Tape Dimension ................................................................................................. 36 27.2. Packing in Tape ................................................................................................. 36 27.3. Component Direction ......................................................................................... 37 27.4. Reel Dimension .................................................................................................. 37 27.5. Label for Package .............................................................................................. 38 27.6. Total Package .................................................................................................... 38 28. Ordering Information ................................................................................................... 39
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 4  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  29. Software Versions ....................................................................................................... 39 30. RoHS Declaration ....................................................................................................... 39 31. Regulatory Information ................................................................................................ 40 31.1. FCC for US ........................................................................................................ 40 31.1.1. FCC Notice ........................................................................................... 40 31.1.2. Caution ................................................................................................. 40 31.1.3. Label Requirements .............................................................................. 40 31.1.4. Antenna Warning .................................................................................. 40 31.1.5. Approved Antenna List .......................................................................... 41 31.1.6. RF Exposure ......................................................................................... 41 31.2. Industry Canada Certification ............................................................................. 41 31.2.1. IC Notice ............................................................................................... 41 31.2.2. Labeling Requirements ......................................................................... 42 31.3. European R&TTE Declaration of Conformity ...................................................... 42 32. General Information ..................................................................................................... 43 33. Life Support Policy ...................................................................................................... 43
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 5  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  1. SCOPE OF THIS DOCUMENT  This product specification applies to Panasonic’s Wi-Fi IEEE 802.11 b/g/n full embedded module with  brand names PAN9320 and PAN9310.  2. HISTORY FOR THIS DOCUMENT  Revision Date Modification / Remarks 0.1 22.04.2015 1st preliminary version 1.0 26.11.2015 Adapt Panasonic’s Code by adding model ENW49A02x3EF Adapt information in chapter:                                                                                                                             4 Related Documents, 5 Key Features, 7 WLAN Overview, 8 Description of the , 10 Detailed Description,   11 General Features, 15 Block Diagram, 18.9 Host Interface Specification, 19 RF Electrical Characteristics, 21 PAN9320 / PAN9310 Module Dimension, 22 PAN9320 / PAN9310 Footprint of the Module,                    23 Case Marking (Example for PAN9320 – FCC Version) , and 28 Ordering Information Add chapter: 13 Peripheral Bus Interface, 18.6 Power Up Sequence, 18.7 Firmware related Timing,            29 Software Versions, and 31 Regulatory Information 1.1 14.03.2016 Adapt information in chapter 31.1.6 RF Exposure  3. DATA SHEET STATUS  This data sheet contains the PRELIMINARY specification. Supplementary data will be published at a later date. Panasonic reserves the right to make changes at any time without notice. Consult the most recently issued data sheet before initiating or completing a design.  4. RELATED DOCUMENTS  Search these homepages for documentation updates. [1]  PAN9320 Flyer PAN9320 Download Page (Flyer) [2]  PAN9320 Design Guide PAN9320 Download Page (Design Guide) [3]  PAN9320 Quick Start Guide PAN9320 Download Page (Quick Start Guide) [4]  PAN9320 Communication Specification PAN9320 Download Page (Communication Specification) [5]  PAN9320 Application Note PAN9320 Download Page (Application Note) [6]  Semiconductor Datasheet 88MC200 from Marvell® 88W8782 from Marvell® [7]  Application Note Land Grid Array Land Grid Array [8]  REACH and RoHS Certificate WM-REACH_and_RoHS_directive
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 6  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  5. KEY FEATURES    Surface Mount Type (SMT) measured 29.0 x 13.5 x 2.66 [mm]³   Wireless Local Area Network (WLAN) module with integrated MCU and Radio   Operating in the 2.4GHz ISM band   Supports the following IEEE 802.11 standards:   IEEE 802.11b/g payload data rates   IEEE 802.11n high throughput data rates   IEEE 802.11i security: WEP and WPA/WPA2 (TKIP, AES-CCMP)    IEEE 802.11e Quality of Service (QoS)   TX power up to +18dBm (for IEEE 802.11b)   Outstanding RX sensitivity   -98dBm (IEEE 802.11b DSSS 1Mbps)   -75dBm (IEEE 802.11g OFDM 54Mbps)   -73dBm (IEEE 802.11n MCS7 HT20 65Mbps)   -70dBm (IEEE 802.11n MCS7 HT40 135Mbps)   Marvell® 88W8782 WLAN System-on-Chip (SoC) and 88MC200 (MCU) inside   High performance low power CPU core   Coexistence interface for external co-located 2.4GHz radios (e.g. Bluetooth)   Internal crystal oscillators for Radio (40MHz) and MCU (32MHz)   Integrated memory flash for customer web contents and configuration file (1MByte)   Memory extension with an external QSPI flash (2MByte) is optional   Two UART interfaces (command and binary data)   Integrated shielding to resist EMI   Manufactured in conformance with RoHS   Available with either integrated antenna (PAN9320) or dedicated RF pad for external antennas (PAN9310)   6. APPLICATIONS FOR THE PAN9320  All Embedded Wireless Applications    White Good   Printer   Home Automation   Smart Meters   Internet of Things   Media Player   Fitness Equipment   Sensors   Lighting Control   POS Terminal  M2M Communication   Patient Monitors
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 7  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  7. WIRELESS LOCAL AREA NETWORK OVERVIEW  A Wireless Local Area Network (WLAN) is a medium range, wireless network based on the IEEE 802.11 standard, and uses the ubiquities ISM (Industrial, Scientific and Medical) frequency range of 2,4GHz. The 802.11 standard pertains to the first two layers of the OSI model, and covers Physical Layer (PHY), the Data Link Layer (DLL) with its two sub-layers: Logical Link Control (LLC), and Media Access Control (MAC). WLAN networks utilize two operating modes to connect stations (STAs) equipped with a wireless network adapter. The first is known as the Infrastructure Mode where the wireless STAs are connected via one or more access points (APs). An AP is a device that allows STAs to connect with each other or to a wired network. The second is the Ad-hoc mode, where wireless STAs are connected without any access point. WLAN devices typically have a high transmit power, of 15 to 20 dBm, allowing them to reach a range of up to 100 meters. Furthermore, WLAN devices are commonly used to transmit high throughput data such as Audio or Video streaming using Orthogonal Frequency Division Multiplexing (OFDM) modulation. The Carrier Sense Multiple Access with Collosion Avoidance (CSMA/CA) mechanism enables the parallel access of more than one device to the wireless medium of a IEEE 802.11 network. The following security mechanisms are deployed: 1. Adavanced Encryption Standard (AES) with Counter Mode CBC-MAC Protocol (CCMP), 2. Cipher-Based Message Authentication Code (CMAC) and 3. Wired Equivalent Privacy (WEP) with Temporal Key Integrity Protocol (TKIP). Video, voice and multimedia applications are supported by the IEEE 802.11e Quality of Service amendment.  8. DESCRIPTION OF THE PAN9320  The PAN9320 module is a WLAN embedded module with a 2.4GHz ISM band wireless radio and an MCU for introduce WLAN connectivity into various electronic devices. A block diagram can be found in chapter 15. The module is a cost-effective, low-power, fully embedded WLAN solution for the Internet of Things (IoT).   It offers the customer an easy integration with a low bill-of-material. The module offers Internet functionality through HTML and JavaScript Web technologies. The PAN9320 combines advanced 802.11 wireless radio, baseband processor, medium access controller (MAC), encryption units, controlled by a powerful CPU. Furthermore, MCU offers an in-system programmable flash memory as well as many other powerful supporting features and peripherals. The module is suitable for wireless network systems based on IEEE 802.11 b/g/n 2.4GHz where small form factor, highly integration, high throughput data rates and low RF expertise are required. It supports simultaneous Access-Point and Infrastructure Mode. The PAN9320 integrated MCU’s firmware consists of software modules with TCP/IP Network Stack, TLS1.2 Security Suite, UDP Name Services and various applications like Web Server, SMTP(s) Client, HTTP(s) Client and Cloud Communication Client on top of the 802.11 WLAN stack with WPA/WPA2 Supplicant. The integrated flash is used for customer web contents and configuration files with a usable memory size of 1 MByte. The memory size can be extended by using an external QSPI flash memory of 2 MByte. The radio driver, MCU firmware, configuration files and web content can be updated Over-The-Air (OTA). Refer to Quick Start Guide[1], Communication Specification[1], Design Guide[4] and chapter 28. Ordering Information. Please contact your local sales office for further details on additional options and services: www.panasonic.com/rfmodules for the US, http://industrial.panasonic.com/eu/i/29606/wireless_modules/wireless_modules.html for EU                           or write an e-mail to wireless@eu.panasonic.com.  9. DIFFERENCE PAN9320 TO PAN9310  The PAN9320 has an integrated antenna and the PAN9310 has a dedicated RF pad for external antenna connection.
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 8  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  10. DETAILED DESCRIPTION  10.1. PAN9320 / PAN9310 TERMINAL LAYOUT  Top View, Application PCB PAN9310 RF bottom pad is marked with a blue circle Command UART0 (2 pads) and binary data UART1 (4 pads) are marked with a blue rectangular box 36 22Top View151161718192021424140393837Chip AntennaF1 F2 F3 F4 F5E1 E2 E3 E4 E5D1 D2 D3 D4 D5C1 C2 C3 C4 C5B1 B2 B3 B4 B5A1 A2 A3 A4 A52 3 4 5 6 7 8 9 10 11 12 13 1435 34 33 32 31 30 29 28 27 26 25 24 23GND THERMO GND THERMOGND THERMO GND THERMO  10.2. COMMON TERMINAL PIN-CONFIGURATION  No Pin Name Pin Type Description 1 GND Ground Pin Connect to Ground 2 GPIO44 1 Digital I/O Digital I/O #44 3 GPIO45 1 Digital I/O Digital I/O #45 4 USB AVDD 33 Power Don’t connect, only for internal purpose 5 NC NC Don’t connect 6 NC NC Don’t connect 7 3.3V Power 3.0V – 3.6V power supply connection (typical 3.3V) 8 3.3V Power 3.0V – 3.6V power supply connection (typical 3.3V) 9 UART1 CTS Digital In CTSn for UART1 (using hardware flow control) 10 UART1 RTS Digital Out RTSn for UART1 (using hardware flow control) 11 UART1 TXD Digital Out TXD for UART1 12 UART1 RXD Digital In RXD for UART1 13 QSPI CS2 4 Digital Out Chip select external flash (connect for usage of external QSPI flash memory) 14 GND Ground Pin Connect to Ground 15 GND Ground Pin Connect to Ground 16 NC / RF NC / Analog IO PAN9320: NC / PAN9310: RF in/out over 50 bottom pad 17 GND Ground Pin Connect to Ground 18 GND Ground Pin Connect to Ground 19 GND Ground Pin Connect to Ground 20 GND Ground Pin Connect to Ground 21 GND Ground Pin Connect to Ground                                                 1 All GPIO’s are initially set to output with low level
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 9  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  No Pin Name Pin Type Description 22 GND Ground Pin Connect to Ground 23 GND Ground Pin Connect to Ground 24 GND Ground Pin Connect to Ground 25 GND Ground Pin Connect to Ground 26 W STAT LED Digital Out Connect to LED wireless (WLAN) status, active low 27 UART0 TXD / DUAL STAT Digital Out TXD for UART0 / UART1 state (binary data or command) 28 UART0 RXD / DUAL SW Digital In RXD for UART0 / UART1 toggle switch for controlling the state 29 GPIO4 1 Digital I/O Digital I/O #4 30 GPIO5 1 Digital I/O Digital I/O #5 31 GPIO6 1 Digital I/O Digital I/O #6 32 GPIO7 1 Digital I/O Digital I/O #7 33 STAT LED1 Digital Out Connect to LED MCU status (heartbeat), active low 34 STAT LED2 Digital Out Connect to LED IP-Connectivity (allocated IP), active low 35 STAT LED3 Digital Out Connect to LED Error (active during booting), active low 36 GND Ground Pin Connect to Ground 37 RESETn Digital In Reset MCU, active low (also option for flashing in production process) 38 WAKE UP0 Digital In Don’t connect, only for internal purpose 39 BOOT Digital In Boot option, high level boot from internal flash memory 2 40 GPIO28 1 Digital I/O Digital I/O #28 41 MCU READY Digital Out Connect to LED MCU ready (booting ready), active high 42 FACTORY RESET Digital In Factory reset (valid after 10 seconds), active high A1 NC NC Don’t connect A2 NC NC Don’t connect A3 NC NC Don’t connect A4 NC NC Don’t connect A5 NC NC Don’t connect B1 NC NC Don’t connect B2 BT FREQ Input Signal Information BT using channel which overlaps WLAN channel or not B3 BT GRANTN Output Signal Indicate permission to transmit, low BT can transmit B4 BT REQ Input Signal BT device request access to medium B5 BT STATE Input Signal Information BT_REQ priority (1- or 2-bit) and direction BT RX/TX C1 NC NC Don’t connect C2 NC NC Don’t connect C3 WAKE UP1 3 Digital In Wake up signal for WLAN SoC (Host-to-SoC), active high 3 C4 QSPI CLK 4 Digital Out Clock for QSPI (connect for usage of external QSPI flash memory) C5 QSPI D3 4 Digital I/O Data3 for QSPI (connect for usage of external QSPI flash memory) D1 TDI Digital In TDI for JTAG (option for flashing in production process) D2 TRSTn Digital In TRSTn for JTAG (option for flashing in production process) D3 NC NC Don’t connect D4 QSPI D0 4 Digital I/O Data0 for QSPI (connect for usage of external QSPI flash memory) D5 QSPI D1 4 Digital I/O Data1 for QSPI (connect for usage of external QSPI flash memory) E1 TDO Digital Out TDO for JTAG (option for flashing in production process) E2 TCK Digital Out TCK for JTAG (option for flashing in production process) E3 TMS Digital I/O TMS for JTAG (option for flashing in production process) E4 QSPI D2 4 Digital I/O Data2 for QSPI (connect for usage of external QSPI flash memory) E5 QSPI CS 4 Digital Out Don’t connect, only for internal purpose F1 W PDn Digital In Don’t connect, only for internal purpose (pull-up resistor internally) F2 W RESETn Input Signal Don’t connect, only for internal purpose (pull-up resistor internally) F3 GND Ground Pin Connect to Ground F4 GND Ground Pin Connect to Ground F5 GND Ground Pin Connect to Ground GND THERMO Thermal Pin Connect to Ground GND THERMO Thermal Pin Connect to Ground GND THERMO Thermal Pin Connect to Ground GND THERMO Thermal Pin Connect to Ground                                                     2 Connect the BOOT pin over a 100 Ohm resistor to VCC 3 Connect to HOST MCU (wake up after shut-off mode, active high), use 10 kOhm resistor to GND at pin 4 Connect only in case of using external QSPI flash memory, otherwise do not connect
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 10  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  11. GENERAL FEATURES    Surface Mount Type (SMT) measured 29.0 x 13.5 x 2.66 mm³   Wireless Local Area Network (WLAN) module with integrated MCU and Radio   Supports IEEE 802.11 b/g/n in the 2.4 GHz ISM band   TX power up to +18dBm (for IEEE 802.11b)   Outstanding RX sensitivity -98dBm (for IEEE 802.11b DSSS 1Mbps)   Marvell® 88W8782 WLAN System-on-Chip (SoC) and 88MC200 (MCU) inside   Two internal crystal oscillators with 32MHz and 40MHz   HOST communication interfaces UART0 (command) and UART1 (binary data)   Integrated TCP/IP network stack: IPv4, ARP, and AutoIP   UDP Name Services: DHCP, DNS, mDNS, and DNS-SD   HTTP(s) server with AJAX technology using JavaScript (JSON)   HTTP(s) client for integrated cloud communication   SMTP(s) client for E-Mail notifications   TLS1.2 security with user / group authentication including X.509 Certificate  802.11 supplicant: WEP, WPA, WPA2, and WPA2 mixed mode   Wireless update of radio driver and MCU firmware with integrated boot loader   Integrated QSPI flash memory for customer web contents up to 1 Mbyte (externally extendable)   Evaluation and development software available for Windows   Getting started tutorials, libraries, and APIs   Easy-To-Use (ETU) evaluation board for quick development and reduced time to market   Programming over standard JTAG   Shielding to resist EMI   12. HOST INTERFACES  12.1. UART0 INTERFACE    2-wire data transfer (RX, TX)   Programmable baud rate (300 bps to 1.5 Mbps)   Data format (LSB first)   Data bit: (5-8 bit)   Parity bit: (0-4 bit)   Stop bit: (1-2 bit)  12.2. UART1 INTERFACE    4-wire data transfer (RX, TX, RTS, CTS)   Programmable baud rate (300 bps to 1.5 Mbps)   Data format (LSB first)   Data bit: (5-8 bit)   Parity bit: (0-4 bit)   Stop bit: (1-2 bit)
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 11  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  13. PERIPHERAL BUS INTERFACE    Embedded WLAN Radio (SoC) with following features:   Clocked Serial Unit (CSU)   3-Wire, 4-Wire (3W4W) Interface   2-Wire Serial Interface (TWSI)   1-Wire Serial Interface    General-Purpose I/O (GPIO) Interface   Defined GPIOs, I/O configured to either input or output   GPIO “W STAT LED” with LED output functionality   LED pulse stretching to observe short duration of status events   Two software controlled blink rates to indicate events    Embedded MCU with following features:   JTAG   Standard JTAG interface    Quad Serial Peripheral Interface   Integrated  QSPI  controller  (master)  with  synchronous  serial  peripheral  for  slave device connection   Integrated QSPI slave device with allocated Firmware range and web content  16 Mbit / 2 Mbyte (1 Mbyte is reserved for customer web content)   256 byte per programmable page with configurable length 1 to 256   Uniform sector erase (4 Kbytes)   Uniform block erase (64 Kbytes)   Erase/Program suspend and resume   Standard / Dual / Quad SPI Support   Flash controller for fetching code or read-only data  200 Mbps max. serial data rate in quad mode with 50 MHz functional clock   Chip Select (CS2) for parallel operation of module internal and external QSPI flash   External  QSPI  slave  device  can  be connected  for  customer  web content  memory extension   Macronix QSPI flash MX25L1633E is supported   Maximum 16Mbit / 2MByte is supported by firmware    Wake Up   External signal for HOST-to-SoC wake-up after shut-off mode    General-Purpose I/O (GPIO) interface   Defined GPIOs, I/O configured to either input or output (on/off)   GPIOs with LED status functionality (Ready, Heartbeat, IP-Connectivity and Error)
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 12  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  14. WLAN FEATURES  14.1. IEEE 802.11 / STANDARDS   802.11 data rates 1 and 2 Mbps (DSSS)  802.11b data rates 5.5 and 11 Mbps (CCK)  802.11g data rates 6, 9, 12, 18, 24, 36, 48 and 54 Mbps (OFDM)  802.11b/g performance enhancements  802.11n compliant with maximum data rates up to 72 Mbps (20 MHz channel) and 150 Mbps (40 MHz channel)  802.11d international roaming 5   802.11i enhanced security (WEP, WPA, WPA2)   802.11k radio resource measurement 5   802.11r fast hand-off for AP roaming 5   802.11w protected management frames 5   Support clients (stations) implementing IEEE Power Save mode  14.2. WLAN MAC   Ad-Hoc 5 and Infrastructure Modes   RTS/CTS for operation und DCF   Hardware filtering of 32 multicast addresses and duplicate frame detection for up to 32 unicast addresses   WLAN SoC with TX and RX FIFO for maximum throughput   Open System and Shared Key Authentication services   A-MPDU RX (de-aggregation) and TX (aggregation)  20/40 MHz channel coexistence   Reduced Inter-Frame Spacing (RIFS) bursting   Management Information Base (MIB) counter   Radio resource measurement counters   Block acknowledgement with 802.11n extensions   Transmit beam former support   Transmit rate adaptation   Transmit power control  Long and short preamble generation on a frame-by-frame basis for 802.11b frames   Marvell® Mobile Hotspot technology (MMH)  14.3. WLAN BASEBAND   802.11n 1x1 SISO (WLAN SoC with SISO RF radio)   Backward compatibility with legacy 802.11b/g technology   PHY data rates up to 150 Mbps (802.11n - MCS7)   20 MHz bandwidth/channel, 40 MHz bandwidth/channel, upper/lower 20 MHz bandwidth in  40 MHz channel and 20 MHz duplicate legacy bandwidth in 40 MHz channel mode operation   Modulation and Coding Scheme MCS 0 ~ 7 and MCS 32 (duplicate 6 Mbps)   Radio resource measurement   Optional 802.11n SISO features:  20/40 MHz coexistence   1-stream Space-Time-Block-Coding (STBC) reception   Short Guard Interval   RIFS on receive path   Beamformer function and hardware acceleration  Greenfield TX/RX                                                 5 Hardware supported, not implemented in the pre-installed firmware stack
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 13  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  14.4. WLAN RADIO   20 and 40 MHz channel bandwidth   Embedded WLAN Radio SoC with following features:   Direct conversion radio (no SAW filter)   2.4GHz TX/RX switch, Power Amplifier (PA) and Low Noise Amplifier (LNA) path   Gain selectable LNAs with optimized noise figure and power consumption   Power Amplifiers with power control   Closed loop power control (0.5 dB step increments)   Optimized TX gain distribution for linearity and noise performance   Fine channel step with AFC (adaptive frequency control)  14.5. WLAN ENCRYPTION    Embedded WLAN Radio SoC with following features:   WEP 64-bit and 128-bit encryption with hardware TKIP processing (WPA)  AES-CCMP hardware implementation as part of 802.11i security standard (WPA2)   Enhanced AES engine performance  AES-Cipher-Based Message Authentication Code (CMAC) as part of the 802.11w security standard 5
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 14  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  15. BLOCK DIAGRAM  15.1. PAN9320    15.2. PAN9310
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 15  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  16. KEY PARTS LIST  Part Name Material P.W.Board Glass cloth epoxy resin with gold plating Casing Material: C7521, thickness 0.30mm IC (WLAN SoC) 88W8782 (Marvell®, www.marvell.com) IC (Microcontroller Unit) 88MC200 (Marvell®, www.marvell.com) IC (QSPI flash memory) MX25L1633E (Macronix®, http://www.macronix.com)  17. TEST CONDITIONS  Measurements shall be made under operating free-air temperature range unless otherwise specified. Temperature      25 ± 10°C Humidity           40 to 85%RH Supply Voltage    3.3V   18. GENERAL REQUIREMENTS AND OPERATION  All specifications are over temperature and process, unless indicated otherwise.  18.1. ABSOLUTE MAXIMUM RATINGS  The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the module will result. Symbol Parameter Condition Min. Typ. Max. Units TSTOR Storage temperature  -40  +85 °C VESD ESD robustness All pads, according to human-body model, JEDEC STD 22, method A114   1000 V According to charged-device model, JEDEC STD 22, method C101   500 V PRF RF input level    +20 dBm VDDMAX Maximum voltage Maximum power supply voltage from any pin with respect to VSS (GND) -0.3  3.6 V VDIG Voltage on any digital pins GPIOs, RESETn, UART, QSPI, Coex I/F -0.3  VDDMAX V  18.2. RECOMMENDED OPERATING CONDITIONS  The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the module will result. Symbol Parameter Condition Min. Typ. Max. Units TA Ambient operating temperature range Extended grade -30  +70 °C VDD 3V3 Supply voltage 6 Voltage on pins 7, 8 (3.3V) I/O supply voltage internally connected to VDD / VCC 3.0 3.3 3.6 V                                                 6 The supply current must be limited to max. 1A
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 16  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  18.3. DIGITAL PIN CHARACTERISTICS  Symbol Parameter Condition Min. Typ. Max. Units VIH High level input voltage 7 3.3V Operation (VIO = VDD) 0.7VDD  VDD+0.3 V VIL Low level input voltage 7 3.3V Operation (VIO = VDD) -0.3  0.3VDD V IPS @ 0.5VDD Pull-up / down strength VDigital Pin=0.5 x VDD 10  50 µA IOH @ VDD-0.4V High level output current 7 3.3V Operation (VIO = VDD) 4 8  mA IOL @ 0.4V Low level output current 7 3.3V Operation (VIO = VDD) 4 8  mA   18.4. ELECTRICAL CHARACERISTICS  The current consumption depends on the user scenario and the setup and timing in the power modes. Assume VDD = 3.3V, Tamb = 25°C if nothing else stated  18.4.1.  Current Consumption  Symbol Parameter Condition Min. Typ. Max. Units ITX Active Transmit 8 PTX = +18 dBm for 802.11b @ 11 Mbps  430  mA PTX = +15 dBm for 802.11g @ 54 Mbps  370  mA PTX = +13 dBm for 802.11n (20MHz) @ 65 Mbps  350  mA IRX Active Receive 9 802.11b @ 11 Mbps  150  mA 802.11g @ 54 Mbps  155  mA 802.11n @ 65 Mbps  160  mA IRXIdle Receive Idle 10 Passive receive state, ready to receive packets, but no active decoding  145  mA IShut-off Shut-off MCU and Radio in shut-off mode  27  mA   18.5. INTERNAL OPERATING FREQUENCIES   Symbol Parameter Condition Min. Typ. Max. Units fSYSCLK1 CPU/System/Encryption clock speed Refers to clock speed of WLAN SoC   128 MHz fSYSCLK2 CPU/System clock speed Refers to clock speed of MCU   200 MHz fREFCLK1 WLAN SoC Crystal fundamental frequency Frequency tolerance < ±10 ppm over operating temperature and process  40  MHz fREFCLK2 Microcontroller Crystal fundamental frequency Frequency tolerance < ±10 ppm over operating temperature and process  32  MHz                                                 7 The capacitive load should not be larger than 50 pF for all I/O’s when using the default driver strength settings. Generally, large capacitance loads increase the overall current consumption. 8 Peak values for specified output power level and data rate with UDP traffic between the AP and Device (STA). 9 Peak values for specified data rate with UDP traffic between the AP and Device (STA).. 10 The device is powered on and is ready to receive packets, but is not actively decoding.
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 17  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  18.6. POWER UP SEQUENCE  When the power is turned on, set reset signal to low (RESETn = low). After the VDD is stable, release the reset (RESETn = high).     18.7. FIRMWARE RELATED TIMING  Symbol Parameter Min. Typ. Max. Units T MCU READY Time period from Power up or Reset until MCU READY pin is active  4 5 sec T WAKE UP Time period need to set pin active to wake-up from shut-off mode (afterwards firmware is booting)   100 ms T FACTORY RESET Time period need to set pin active to release factory reset            (afterwards firmware is booting)  8 10 sec T INFRA ASSO Time period in Infrastructure mode from WLAN association request until  association with selected Access-Point’s SSID  4  sec T DE-ASSO SCAN Time period between de-association from AP until next scan is released  60  sec T IP DHCP Time period from IP DHCP request until IP assignment   90 sec
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 18  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  18.8. COEXISTENCE INTERFACE SPECIFICATION  The Coexistence Interface pins are powered from the VIO voltage supply internally connected to       VDD = 3.3V. See Chapter 18.3 Digital Pin Characteristics for DC specification.  18.8.1.  Marvell® 3/4-Wire Timing Data  Symbol Parameter Min. Typ. Max. Units T1 Priority[0] info is valid in BT_STATE on and after T1 from BT_REQ rise. 0 1 100 µs T2 TxRx Info is valid in BT_STATE on and after T2. The BT_STATE must hold until there is any change of direction in the next slots. 2 19 100 µs T3 Time from TxRx Info valid to BCA grant decision (T3 = T7 – T4 – T2 – T8 – T1). 2 40 594 µs T4 BT_GRANTn needs to be valid T4 time before the upcoming slot. BT_GRANTn indicates Tx grant, and may also indicate Rx grant. Once a slot is granted, the subsequent slots are also granted unless there is a change in direction from Rx to Tx. Rx to Tx change always re-arbitrates. 2 80 594 µs T5 TxRx Info for the next slot is valid on and after T5 to the start of the next slot. If direction remains the same for the next slot, then BT_STATE must not change during the current slot. If the direction changes for the next slot, the BT_STATE must change only after the last bit of Bluetooth data is transferred; otherwise the transfer may be disrupted. 5 40 600 µs T6 The BT_REQ signal de-asserts T6 time after last bit of Bluetooth data is transferred. 0 15 25 µs T7 Time from BT_REQ rise to first Bluetooth slot boundary. Bluetooth slot boundary is marked by first bit of Bluetooth data. 8 150 600 µs T8 Optional Priority[1] information is valid in BT_STAT on and after T8. This time parameter only exists if BCA is configured for 2-bit priority on same BT_STATE pin. Otherwise, the start of T2 would come after T1. 2 10 100 µs Ttx Slot time (fixed fpr Bluetooth)  625  µs Trx Slot time (fixed fpr Bluetooth)  625  µs
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 19  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  18.8.2.  WL_ACTIVE 2/3/4-Wire Timing Data   Symbol Parameter Min. Typ. Max. Units T1   If WLAN can be stopped, WL_ACTIVE will de-asser prior to Bluetooth slot start (T1 < T2)   If the Bluetooth device samples WL_ACTIVE before starting priority transfer, WL_ACTIVE needs to de-assert earlier than the sampling time. 0  499 µs T2 Time from BT_PRIORITY rise to start of Bluetooth activity. 20 50 499 µs T3 Time from end of Bluetooth activity to BT_PRIORITY fall. 0 0 499 µs T4 Slot time (fixed fpr Bluetooth)  625  µs
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 20  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  18.9. HOST INTERFACE SPECIFICATION  18.9.1.  UART0 Command Interface  UART0 command interface bus signals: Module Pin No Signal Name Function Description 27 UART0 TXD Command Transmit data output 28 UART0 RXD Receive data input  Protocol: Item Range Default Comment Baudrate 300 ~ 1500000 115200  Data Bits 5 ~ 8 (LSB first) 8 LSB first Parity Bits 0 ~ 4 0  Stop Bit 1 / 1,5 / 2 1   Supported Baud Rates: Item Baud Baudrate 300 600 1200 4800 9600 14400 19200 28800 38400 56000 57600 115200 128000 256000 520000 780000 1500000   UART0 timing diagram:     18.9.2.  UART1 Binary Data Interface  UART1 binary data interface bus signals: Module Pin No Signal Name Function Description 9 UART1 CTS Binary data Clear to send 10 UART1 RTS Request to send 11 UART1 TXD Transmit data output 12 UART1 RXD Receive data input  Protocol: Item Range Default Comment Baudrate 300 ~ 1500000 115200  Data Bits 5 ~ 8 (LSB first) 8 LSB first Parity Bits 0 ~ 4 0  Stop Bit 1 / 1,5 / 2 1   Supported Baud Rates: Item Baud Baudrate 300 600 1200 4800 9600 14400 19200 28800 38400 56000 57600 115200 128000 256000 520000 780000 1500000
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 21  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  UART1 timing diagram:   18.9.3.  UART1 Dual Interface  UART1 dual interface bus signals: Module Pin No Signal Name GPIO   definition GPIO level default State   default Description 9 UART1 CTS OUT - - Clear to send 10 UART1 RTS IN Request to send 11 UART1 TXD IN Transmit data output 12 UART1 RXD OUT Receive data input 27 DUAL STAT OUT HIGH Binary data UART1 state condition (binary or command) 28 DUAL SW IN UART1 toggle switch for binary / command  See Chapter 18.9.2 UART1 Binary Data Interface for specification of protocol and supported baud rates. The usage of the UART1 dual interface needs to be configured at the customer content of firmware. After booting the MCU READY pin is changing from low to high level. For start condition the DUAL SW input pin needs to be pre-set from the HOST by changing from high to low level. The DUAL STAT output pin is signalling high level as Binary state. In this case the HOST is able to transmit or receive binary data. To change from Binary to Command state the DUAL SW input pin needs to be toggled (low - high - low level change) from the HOST: 1. The change of state is initiated by changing the DUAL SW input pin from low to high level (set toggle switch). 2. After the DUAL STAT pin is changing the state from high to low level the Command state is active and the DUAL SW input pin can be reset from high to low level (reset toggle). 3. The HOST is now able to send commands. After the commands are sent it is recommended to change back to Binary state by toggling the DUAL SW input pin again.  UART1 dual interface bus and control timing diagram:
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 22  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  18.10. PERIPHERAL INTERFACE SPECIFICATION  The Peripheral Interface pins are powered from the VIO voltage supply internally connected to         VDD = 3.3V. See Chapter 18.3 Digital Pin Characteristics for DC specification.  18.10.1.  Configurable GPIOs  GPIO function  GPIO pin name State GPIO4 GPIO5 GPIO6 GPIO7 GPIO28 GPIO44 GPIO45 Input IN - YES YES YES YES YES YES YES Output OUT  ON YES YES YES YES YES YES YES OFF YES YES YES YES YES YES YES Default by firmware OFF OUT OUT OUT OUT OUT OUT OUT   The function of the configurable GPIOs are set by firmware default, but can be reconfigured by HOST command interface (UART).  18.10.2.  Firmware defined GPIOs  GPIO pin name GPIO definition GPIO level Firmware state  Input Output Default Active Boot Firmware application active Firmware function STAT LED1 NO YES - LOW OFF OFF: Shut-off BLINK (1sec): Firmware active MCU Status (heartbeat) STAT LED2 NO YES - LOW OFF OFF: no IP assined ON: IP assigned IP-Connectivity                      in Infrastructure mode STAT LED3 NO YES - LOW ON OFF: no error ON: error appeared MCU firmware error W STAT LED NO YES - LOW OFF OFF: no AP connection BLINK (0.3s): Scanning for AP BLINK (1.2s): WLAN Error ON: Associated with AP WLAN connectivity in  Infrastructure mode MCU READY NO YES - HIGH OFF OFF: Shut-off ON: Firmware ready Firmware application is ready FACTORY RESET YES NO LOW 11 HIGH inactive Set active for min. 10 seconds Re-store firmware default WAKE UP1 YES NO LOW 11 HIGH inactive Set active for min. 100 ms Wake up after shut-off BOOT YES NO HIGH 12 HIGH active inactive after booting Radio firmware to be loaded from internal flash memory  The function of the firmware defined GPIOs are fixed and can’t be changed.                                                           11 Set default level by using resistor with 10kOhm to GND 12 Set default level with resistor 100 Ohm to Vcc
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 23  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  18.10.3.  Quad Serial Peripheral Interface (QSPI)  18.10.3.1.  List of supported Flash Memories  QSPI flash memory supported: Parts Name Manufacturer Memory type SPI Mode SPI Clock Memory size Page size MX25L1633E Macronix QSPI 1 / 2 / 4 I/O 104 / 85 MHz 16Mbit 256 byte  18.10.3.1.  Firmware supported QSPI Characteristic  QSPI characteristic: Symbol Parameter Min. Typ. Max. Units t cyc QSPI clock cycle time 20   ns t W Clock high and low time t cyc / 2-6.67   ns t SU (RX) Data input setup time 5.5   ns t h (RX) Data input hold time 0   ns t out (TX) Data output delay time 3.2   ns   QSPI timing diagram:   QSPI command set (used by firmware): Command Description 1st byte 2nd byte 3rd byte 4th byte 5th byte Action WREN Write enable 06 (hex)     sets the (WEL) write enable latch bit WRDI Write disable 04 (hex)     resets the (WEL) write enable latch bit RDID Read identification 9F (hex)     outputs JEDEC ID: 1-byte Manufacturer ID &  2-byte Device ID RDSR Read status register 05 (hex)     to read out the values of the status register WRSR Write status register 01 (hex) Values    to write new values of the status register READ Read data 03 (hex) AD1 A23-A16 AD2 A15-A8 AD3 A7-A0  n bytes read out until CS# goes high FAST READ Fast read data 0B (hex) AD1 AD2 AD3 Dummy n bytes read out until CS# goes high 2READ 2 I/O read BB (hex) ADD(2) ADD(2) & Dummy(2)   n bytes read out by 2 x I/O until CS# goes high 4READ 4 I/O read EB (hex) ADD(4) & Dummy(4) Dummy(4)   n bytes read out by 4 x I/O until CS# goes high PP Page program 02 (hex) AD1 AD2 AD3  to program the selected page 4PP Quad page program 38 (hex) AD1    quad input to program the selected page Sector Erase 4 KB sector erase 20 (hex) AD1 AD2 AD3  to erase the selected sector Block Erase 64 KB block ersae D8 (hex) AD1 AD2 AD3  to erase the selected block Chip Erase 2 MB full chip erase 60 or C7 (hex)     to erase whole chip
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 24  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  19. RF ELECTRICAL CHARACTERISTICS  19.1. WLAN RADIO SPECIFICATION   Parameter Operation mode Specification Standard Conformance IEEE 802.11 / IEEE 802.11b IEEE 802.11g IEEE 802.11n Modulation IEEE 802.11b DSSS / CCK IEEE 802.11g OFDM IEEE 802.11n OFDM @ MCS0~7 and MCS32 (duplicate 6 Mbps) Physical layer data rates IEEE 802.11 1, 2 Mbps @ DSSS IEEE 802.11b 5.5, 11 Mbps @ DSSS / CCK Supported data rates IEEE 802.11g 6, 9, 12, 18, 24, 36, 48, 54 Mbps IEEE 802.11n MCS0~7 HT20 LGI 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps SGI 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65, 72.2 Mbps HT40 LGI 13.5, 27, 40.5, 54, 81, 108, 121.5, 135 Mbps SGI 15, 30, 45, 60, 90, 120, 135, 150 Mbps Supported bandwidth IEEE 802.11n 20, 40 MHz (BW) Supported channel mode operation IEEE 802.11n 20 MHz BW / channel, 40 MHz BW / channel,  upper / lower 20 MHz BW @ 40 MHz channel, 20 MHz duplicate legacy BW @ 40 MHz channel Supported Guard Interval IEEE 802.11n 400 ns (SGI), 800 ns (LGI) Supported channel 2.4GHz 13 IEEE 802.11g North America (US) 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 Canada (CA) 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 Europe (EU) 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13 France (FR) 10, 11, 12, 13 Japan MMK (JP) 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13 IEEE 802.11n North America (US) 1-5, 2-6, 3-7, 4-8, 5-9, 6-10, 7-11 Canada (CA) Europe (EU) France (FR) Japan MMK (JP) -                                                       13 In order to comply with relevant regulatory requirements, for the model’s supported channels please refer to the chapter 28. Ordering Information
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 25  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  19.2. WLAN RF CHARACTERISTICS  19.2.1.  RF Characteristics for IEEE 802.11b  Assume VDD = 3.3V, Tamb = 25°C if nothing else stated 50 Ohm terminal load connected to the RF connector  Parameter Condition Min. Typ. Max. Units RF frequency range   2400  2483.5 MHz Carrier frequency tolerance   -25  +25 ppm Transmit output power    +18 +20 dBm Spectrum mask fC ± 11 MHz    -30 dBr fC ± 22 MHz    -50  Power-on / Power-down ramp     2 µs RF Carrier suppression     -15 dB Error Vector Magnitude (EVM) Peak    35 % Minimum Receive Sensitivity 1 Mbps (DSSS) FER ≤ 8%  -98 -86 dBm 2 Mbps (DSSS) FER ≤ 8%  -95 -83 dBm 5.5 Mbps (CCK) FER ≤ 8%  -91 -79 dBm 11 Mbps (CCK) FER ≤ 8%  -88 -76 dBm Maximum Input Level  FER ≤ 8% -10   dBm Adjacent Channel Rejection  FER ≤ 8% 35   dB
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 26  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  19.2.2.  RF Characteristics for IEEE 802.11g  Assume VDD = 3.3V, Tamb = 25°C if nothing else stated 50 Ohm terminal load connected to the RF connector  Parameter Condition Min. Typ. Max. Units RF frequency range   2400  2483.5 MHz Carrier frequency tolerance   -25  +25 ppm Transmit output power 6 Mbps ~ 36 Mbps   +16 +18 dBm 48 Mbps ~ 54 Mbps   +15 +17 dBm Spectrum mask fC ± 11 MHz    -20 dBr fC ± 20 MHz    -28 dBr fC ± 30 MHz    -40 dBr Transmitter center frequency leakage     -15 dB Transmitter Spectral Flatness   -2  +2 dB Constellation Error (EVM) BPSK, CR 1/2 (6 Mbps)    -5 dB BPSK, CR 3/4 (9 Mbps)    -8 dB QPSK, CR 1/2 (12 Mbps)    -10 dB QPSK, CR 3/4 (18 Mbps)    -13 dB 16-QAM, CR 1/2 (24 Mbps)    -16 dB 16-QAM, CR 3/4 (36 Mbps)    -19 dB 64-QAM, CR 2/3 (48 Mbps)    -22 dB 64-QAM, CR 3/4 (54 Mbps)    -25 dB Minimum Receive Sensitivity BPSK, CR 1/2 (6 Mbps) PER ≤ 10%  -91 -82 dBm BPSK, CR 3/4 (9 Mbps) PER ≤ 10%  -90 -81 dBm QPSK, CR 1/2 (12 Mbps) PER ≤ 10%  -89 -79 dBm QPSK, CR 3/4 (18 Mbps) PER ≤ 10%  -87 -77 dBm 16-QAM, CR 1/2 (24 Mbps) PER ≤ 10%  -84 -74 dBm 16-QAM, CR 3/4 (36 Mbps) PER ≤ 10%  -80 -70 dBm 64-QAM, CR 2/3 (48 Mbps) PER ≤ 10%  -76 -66 dBm 64-QAM, CR 3/4 (54 Mbps) PER ≤ 10%  -75 -65 dBm Maximum Input Level  PER ≤ 10%   -20 dBm Adjacent channel rejection BPSK, CR 1/2 (6 Mbps) PER ≤ 10% 16   dB 64-QAM, CR 3/4 (54 Mbps) PER ≤ 10% -1   dB
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 27  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  19.2.3.  RF Characteristics for IEEE 802.11n (BW 20 MHz)  Assume VDD = 3.3V, Tamb = 25°C if nothing else stated 50 Ohm terminal load connected to the RF connector  Parameter Condition Min. Typ. Max. Units RF frequency range   2400  2483.5 MHz Carrier frequency tolerance   -25  +25 ppm Transmit output power MCS0 ~ MCS2   +15 +17 dBm MCS3 ~ MCS4   +14 +16 dBm MCS5 ~ MCS7   +13 +15 dBm Spectrum mask fC ± 11 MHz    -20 dBr fC ± 20 MHz    -28 dBr fC ± 30 MHz    -45 dBr Transmitter center frequency leakage     -15 dB Transmitter Spectral Flatness   -2  +2 dB Constellation Error (EVM) BPSK, CR 1/2 (MCS0)    -5 dB QPSK, CR 1/2 (MCS1)    -10 dB QPSK, CR 3/4 (MCS2)    -13 dB 16-QAM, CR 1/2 (MCS3)    -16 dB 16-QAM, CR 3/4 (MCS4)    -19 dB 64-QAM, CR 2/3 (MCS5)    -22 dB 64-QAM, CR 3/4 (MCS6)    -25 dB 64-QAM, CR 5/6 (MCS7)    -27 dB Minimum Receive Sensitivity 14 6.5 Mbps (MCS0) PER ≤ 10%  -91 -82 dBm 13 Mbps (MCS1) PER ≤ 10%  -88 -79 dBm 19.5 Mbps (MCS2) PER ≤ 10%  -86 -77 dBm 26 Mbps (MCS3) PER ≤ 10%  -83 -74 dBm 39 Mbps (MCS4) PER ≤ 10%  -79 -70 dBm 52 Mbps (MCS5) PER ≤ 10%  -75 -66 dBm 58.5 Mbps (MCS6) PER ≤ 10%  -74 -65 dBm 65 Mbps (MCS7) PER ≤ 10%  -73 -64 dBm Maximum Input Level  PER ≤ 10%   -20 dBm Adjacent channel rejection 15 65 Mbps (MCS7) PER ≤ 10% -2   dB                                                   14 The Minimum Sensitivity levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI and BCC. 15 The Adjacent Channel Rejection levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI and BCC.
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 28  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  19.2.4.  RF Characteristics for IEEE 802.11n (BW 40 MHz)  Assume VDD = 3.3V, Tamb = 25°C if nothing else stated 50 Ohm terminal load connected to the RF connector  Parameter Condition Min. Typ. Max. Units RF frequency range   2400  2483.5 MHz Carrier frequency tolerance   -25  +25 ppm Transmit output power MCS0 ~ MCS2   +13 +15 dBm MCS3 ~ MCS4   +12 +14 dBm MCS5 ~ MCS7   +11 +13 dBm Spectrum mask fC ± 21 MHz    -20 dBr fC ± 40 MHz    -28 dBr fC ± 60 MHz    -45 dBr Transmitter center frequency leakage     -15 dB Transmitter Spectral Flatness   -2  +2 dB Constellation Error (EVM) BPSK, CR 1/2 (MCS0)    -5 dB QPSK, CR 1/2 (MCS1)    -10 dB QPSK, CR 3/4 (MCS2)    -13 dB 16-QAM, CR 1/2 (MCS3)    -16 dB 16-QAM, CR 3/4 (MCS4)    -19 dB 64-QAM, CR 2/3 (MCS5)    -22 dB 64-QAM, CR 3/4 (MCS6)    -25 dB 64-QAM, CR 5/6 (MCS7)    -27 dB Minimum Receive Sensitivity 14 13.5 Mbps (MCS0) PER ≤ 10%  -88 -79 dBm 27 Mbps (MCS1) PER ≤ 10%  -85 -76 dBm 40.5 Mbps (MCS2) PER ≤ 10%  -83 -74 dBm 54 Mbps (MCS3) PER ≤ 10%  -80 -71 dBm 81 Mbps (MCS4) PER ≤ 10%  -76 -67 dBm 108 Mbps (MCS5) PER ≤ 10%  -72 -63 dBm 121.5 Mbps (MCS6) PER ≤ 10%  -71 -62 dBm 135 Mbps (MCS7) PER ≤ 10%  -70 -61 dBm Maximum Input Level  PER ≤ 10%   -20 dBm Adjacent channel rejection 15 135 Mbps (MCS7) PER ≤ 10% -2   dB
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 29  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  20. SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)  20.1. FOR LEAD SOLDER          Recommended temp. profile for reflow soldering Temp.[°C] Time [s] 235°C max. 220 5°C 200°C 150 10°C 90 30s 10 1s 30 +20/-10s   20.2. FOR LEADFREE SOLDER          Our used temp. profile for reflow soldering Temp.[°C] Time [s] 230°C -250°C max. 220°C 150°C – 190°C 90 30s 30 +20/-10s  Reflow permissible cycle: 2 Opposite side reflow is prohibited due to module weight.
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 30  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  2913,502,6621. PAN9320 / PAN9310 MODULE DIMENSION  No. Item Dimension Tolerance Remark 1 Width 13.50  0.30  2 Length 29.00  0.30  3 Height 2.66  0.20 with case
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 31  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  22. PAN9320 / PAN9310 FOOTPRINT OF THE MODULE   All dimensions are in millimeters.  The outer dimensions have a tolerance of  0.3mm.  Top view, Application PCB
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 32  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  23. CASE MARKING (EXAMPLE FOR PAN9320 – FCC VERSION)          No. Remark 1 PAN9320 or PAN9310  (Brand Name), see chapter 28. Ordering Information 2 Hardware / Software version 3 Model Name, see chapter 28. Ordering Information 4 Lot code: YearYear, WeekWeek, Day, LotLot 5 Serial Number (8 digits) 6 WLAN MAC address (12 digits) 7 FCC ID, refer to chapter 31.1 FCC for US 8 IC Canada, refer to chapter 31.2 Industry Canada Certification 9 Marking for Pin 1 (Circle 0,15 mm) 10 2D-Code, for internal usage only and can be change without any notice
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 33  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  24. MECHANICAL REQUIREMENTS  No. Item Limit Condition 1 Solderability More than 75% of the soldering area shall be coated by solder Reflow soldering with recommendable temperature profile 2 Resistance to soldering heat It shall be satisfied electrical requirements and not be mechanical damage See chapter 20.2   25. RELIABILITY TESTS  The measurement should be done after being exposed to room temperature and humidity for 1 hour. No. Item Limit Condition 1 Vibration test Electrical parameter should be in specification a) Freq.:10~50Hz,Amplitude:1.5mm a) 20min. / cycle,1hrs. each of XYZ axis b) Freq.:30~100Hz, 6G b) 20min. / cycle,1hrs. each of XYZ axis 2 Shock test the same as above Dropped onto hard wood from height of 50cm for 3 times 3 Heat cycle test the same as above -40°C for 30min. and  +85°C for 30min.;  each temperature 300 cycles 4 Moisture test the same as above +60°C, 90% RH, 300h 5 Low temp. test the same as above -40°C, 300h 6 High temp. test the same as above +85°C, 300h  26. CAUTIONS  Failure to follow the guidelines set forth in this document may result in degrading of the product’s functions and damage to the product.  26.1. DESIGN NOTES  (1)  Follow the conditions written in this specification, especially the control signals of this module. (2)  The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47uF directly at the module). (3)  This product should not be mechanically stressed when installed. (4)  Keep this product away from heat.  Heat is the major cause of decreasing the life of these products. (5)  Avoid assembly and use of the target equipment in conditions where the products' temperature may exceed the maximum tolerance. (6)  The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes. (7)  Keep this product away from other high frequency circuits.
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 34  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  26.2. INSTALLATION NOTES  (1)  Reflow soldering is possible twice based on the conditions in chapter 15. Set up the temperature at the soldering portion of this product according to this reflow profile. (2)  Carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat. (3)  Carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components. (4)  If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur. (5)  This product should not be mechanically stressed or vibrated when reflowed. (6)  To repair the board by hand soldering, follow the conditions set forth in this chapter. (7)  Do not wash this product. (8)  Refer to the recommended pattern when designing a board. (9)  Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit. (10)  For more details on LGA (Land Grid Array) soldering processes refer to the application note [7].   26.3. USAGE CONDITIONS NOTES  (1)  Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation befor assembly on the final products. (2)  Do not use dropped products. (3)  Do not touch, damage or soil the pins. (4)  Follow the recommended condition ratings about the power supply applied to this product. (5)  Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB. (6)  Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. (7)  These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information and communication equipment.  26.4. STORAGE NOTES  (1)  The module should not be stressed mechanically during storage. (2)  Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected:   Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX   Storage in direct sunlight   Storage in an environment where the temperature may be outside the range of 5°C to 35°C range, or where the humidity may be outside the 45 to 85% range.   Storage of the products for more than one year after the date of delivery Storage period: Please check the adhesive strength of the embossed tape and soldering after 6 months of storage. (3)  Keep this product away from water, poisonous gas and corrosive gas. (4)  This product should not be stressed or shocked when transported. (5)  Follow the specification when stacking packed crates (max. 10).
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 35  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  26.5. SAFETY CAUTIONS   These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications, without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then provide the following failsafe functions, as a minimum. (1)  Ensure the safety of the whole system by installing a protection circuit and a protection device. (2)  Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status.   26.6. OTHER CAUTIONS  (1)  This specification sheet is copyrighted. Do not disclose it to a third party. (2)  Do not use the products for other purposes than those listed. (3)  Be sure to provide an appropriate fail-safe function on your product to prevent an additional damage that may be caused by the abnormal function or the failure of the product. (4)  This product has been manufactured without any ozone chemical controlled under the Montreal Protocol. (5)  These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their performance and reliability under the said special conditions carefully to determine whether or not they can be used in such a manner.   In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash.   In direct sunlight, outdoors, or in a dusty environment  In an environment where condensation occurs.  In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOX) (6)  If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. (7)  When you have any question or uncertainty, contact Panasonic.
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 36  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  27. PACKAGING  Mass production status product -- as indicated in Chapter 3 -- will be delivered in the package described below.  27.1. TAPE DIMENSION        27.2. PACKING IN TAPE    Empty spaces in component packed area shall be less than two per reel and those spaces shall not be consecutive. Top cover tape shall not be found on reel holes and shall not stick out from reel.
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 37  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  27.3. COMPONENT DIRECTION    27.4. REEL DIMENSION
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 38  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  27.5. LABEL FOR PACKAGE  The picture shows an example from similar product.    (1T)  Lot code [YYWWDLL-AAA]                                    Example from above:      YY   year                        printed 08      WW    normal calendar week                              printed 01           D       day                                                 printed 5 (Friday)           L       line identifier, if more as one                       printed 1           L       lot identifier per day                                printed 1           AAA    number of the reel (example 001, 002,…, 999)    printed 001 (1P) Customer Order Code, if any, otherwise company name will be printed (2P) Panasonic Order Code: ENW49A01A3EF (see chapter 28 Ordering Information) (3P) Model type (see chapter 28. Ordering Information) (9D) Date code as [YYWW] (Q)  Quantity [XXXX], variable max. 500 (HW/SW)  Hardware/Software Release       27.6. TOTAL PACKAGE   barcodelabelmoisture-sensitive print(already exist on barrier bag) barcodelabeldesiccant 1) 2)moisture indicatorbarrier bagsealedinner carton boxsize 340 x 340 x 41 mm³1) quantity of desiccant according    to calculation2) optional: desiccant placed into     the corner of the barrier bag (3P): PAN9320  RoHS  -AAA  ENW49A01A3EF  Company  500 xy/ab  Country of Origin: Slovakia
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 39  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  28. ORDERING INFORMATION  Model Name Brand Name Regulatory Supported Channel Description MOQ (4) ENW49A01A3EF PAN9320 FCC / IC (1) for US and for Canada Channel 1 ~ 11 2412 ~ 2462 MHz WLAN IEEE 802.11 b/g/n 2.4GHz Full Embedded Module with ceramic chip-antenna 500 ENW49A01C3EF PAN9310 (3) WLAN IEEE 802.11 b/g/n 2.4GHz Full Embedded Module with RF bottom pad 500 ENW49A02A3EF PAN9320 ETSI (2) for EU and other Channel 1 ~ 13 2412 ~ 2472 MHz WLAN IEEE 802.11 b/g/n 2.4GHz Full Embedded Module with ceramic chip-antenna 500 ENW49A02C3EF PAN9310 (3) WLAN IEEE 802.11 b/g/n 2.4GHz Full Embedded Module with RF bottom pad 500  The PAN9320 / PAN9310 will be delivered with a pre-installed firmware, see PAN9320 Communication Specification [3] and PAN9320 Design Guide [1].  Notes: (1)  The model with Regulatory Domain FCC / IC (M/N: ENW49A01A3EF) are only intended to be used in the countries of US and Canada because only the channels 1 ~ 11 (2412 ~ 2462 MHz) are supported in the 2.4GHz ISM band. It is not possible to change the pre-stored Region Code in order to change the Regulatory Domain. Thus the module labeling contains the FCC Grant ID. (2)  The model with Regulatory Domain ETSI (M/N: ENW49A02A3EF) are mainly intended to be used in European countries because the channels 1 ~ 13 (2412 ~ 2472 MHz) are supported. The Region Code is pre-configured (using Default Config Content in Flash memory) to Regulatory Domain ETSI and thus the module labeling doesn’t contain the FCC ID. At the end the customer is able to change applied Region Code by his own Customer Config Content to be stored during customer OEMs product production in the flash memory. It means the FCC Regulatory Domain can be configured as well, but the customer has to certify the end product by itself. (3)  The models with brand name PAN9310 don’t have the Chip antenna on module. The Grant ID’s marked on module labelling are referenced and are only valid in case of customer is applying the same antenna (listed in 31.1.5) including the reference design described in the Design Guide [1]. In this case the customer can refer to the pre-qualified module’s modular approval which needs finally to be approved by the certification body of regulatory authority. (4)  Abbreviation for Minimum Order Quantity (MOQ). The standard MOQ for mass production is 500 pieces, fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels.  29. SOFTWARE VERSIONS  The version numbers of the embedded MCU firmware and WLAN SoC firmware can be read out by UART commands which are specified in the PAN9320 Communication Specification [3] and listed below:  No. Item UART Command Response example 1 MCU firmware version get system firmware get system firmware 0 1.9.0.1 2 WLAN SoC firmware version get system wifi_ver get system wifi_ver 0 "w8782-B0, RF878X, FP69, 14.69.12.p40"  30. ROHS DECLARATION  Declaration of environmental compatibility for supplied products: Hereby we declare to our best present knowledge based on declaration of our suppliers that this product does not contain the following substances which are banned by Directive 2002/95/EC (RoHS) or contains a maximum concentration of 0.1% by weight in homogeneous materials for      Lead and lead compounds      Mercury and mercury compounds      Chromium (VI)      PBB (polybrominated biphenyl) category      PBDE (polybrominated biphenyl ether) category  And a maximum concentration of 0.01% by weight in homogeneous materials for      Cadmium and cadmium compounds
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 40  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  31. REGULATORY INFORMATION  31.1. FCC FOR US  31.1.1.  FCC Notice The  PAN9320,  including  the  ceramic  antenna  (ENW49A01A3EF)  and  the  PAN9310  SMD  type (ENW49A01C3EF), including with the antennas, which are listed in 31.1.5, complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and                                                                 (2) This device must accept any interference received, including interference that may cause undesired operation. The FCC identifier for ENW49A01x3EF (16) is FCC ID: T7V-9320                                                  31.1.2.  Caution The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Panasonic Industrial Devices Europe GmbH may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:      Reorient or relocate the receiving antenna.      Increase the separation between the equipment and receiver.      Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.      Consult the dealer or an experienced radio/TV technician for help  31.1.3.  Label Requirements The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes a clearly visible label (laser marking) on the outside of the OEM enclosure specifying the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: T7V-9320 for model ENW49A01x3EF (16). This FCC identifier is valid for PAN9320, for details see the Chapter 28 Ordering Information. In any case the end product must be labelled exterior with   "Contains FCC ID: T7V-9320"  31.1.4.  Antenna Warning The related model number for the device is ENW49A01C3EF (PAN9310 with SMD pad). For details, see the Chapter 28 Ordering Information. The device is tested with a standard SMA connector and with the antenna listed below. When integrated in the OEMs product, these fixed antennas require installation preventing end-users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions. The FCC identifier for the device with the antenna listed in chapter 31.1.5 is the same (FCC ID: T7V-9320).                                                 16 x = „A“ for PAN9320 and x = „C“ for PAN9310 (e.g. ENW49A01A3EF  x = “A”)
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 41  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  31.1.5.  Approved Antenna List   Note: We are able to qualify your antenna and will add to this list as that process is completed.  31.1.6.  RF Exposure  To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure that the approved antenna in the previous table must be installed. The preceding statement must be included as a CAUTION statement in manuals for products operating with the approved antennas in the previous table to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The RF exposure requirements of PAN9320 with mounted ceramic chip antenna (FCC ID: T7V-9320 for model ENW49A01A3EF) are fulfilled for mobile configuration. The installation of the module is restricted to mobile host devices. Nevertheless, the PAN9320 shall be used in such a manner that the potential for human contact during normal operation is minimized. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance.  31.2. INDUSTRY CANADA CERTIFICATION  PAN9320 and versions are licensed to meet the regulatory requirements of Industry Canada (IC),  License for M/N: ENW49A01x3EF (16):     IC: 216Q-9320 License for M/N: ENW49A02x3EF (16):     IC: 216Q-9320 Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca. This device has been designed to operate with the antennas listed in 31.1.5 above, having a maximum gain of +0.8dBi. Antennas not included in this list or having a gain greater than +0.8dBi are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.  Due to the model size the IC identifier is displayed in the installation instruction only and can’t be displayed on the modules label due to the limited size.  31.2.1.  IC Notice  The device PAN9320 and versions, for details refer to Chapter 28. Ordering Information, including the antennas, which are listed in 31.1.5, complies with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-GEN.   Operation is subject to the following two conditions:  (1) This device may not cause harmful interference, and  (2) This device must accept any interference received, including interference that may cause undesired operation.   Item Part Number Manufacturer Frequency Band Type Gain (dBi) 1 ANT2012LL13R2400A Yageo 2.4GHz Chip-Antenna +0.8
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 42  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  31.2.2.  Labeling Requirements  The Original Equipment Manufacturer (OEM) must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic IC identifier for this product as well as the IC Notice above.  The IC identifiers are:     IC: 216Q-9320   (for M/N: ENW49A01x3EF (16))                                   IC: 216Q-9320   (for M/N: ENW49A02x3EF (16)) This IC identifier is valid for all PAN9320, for details, see the Chapter 28 Ordering Information. In any case the end product must be labelled exterior with: "Contains IC: 216Q-9320”  Les fabricants d’équipements (OEM) doivent s’assurer que les obligations d’étiquetage du produit final sont remplies. Ces obligations incluent une étiquette clairement visible à l’extérieur de l’emballage externe, comportant l’identifiant IC du module Panasonic inclus, ainsi que la notification ci-dessus.  Les identifiants IC sont:  IC: 216Q-9320       (pour M/N: ENW49A01x3EF (16)) IC: 216Q-9320       (pour M/N: ENW49A02x3EF (16)) Ces identifiants sont valides pour tous les PAN9320 (28 Ordering Information). Dans tous les cas les produits finaux doivent indiquer sur leur emballage externe une des mentions suivantes:  "Contient IC: 216Q-9320”  31.3. EUROPEAN R&TTE DECLARATION OF CONFORMITY  All modules described in this data sheet comply to the standards according R&TTE article: 3.1a Safety/Health:   EN60950-1:2006+A11:2009+A1:2010+A12:2011+AC:2011+A2:2013                        EN62311:2008  3.1b EMC:           EN 301 489-1 V1.8.1:2008-04 EN 301 489-17 V2.2.1:2012-09  3.2 Radio:            EN 300 328 V1.8.1:2012-06  As a result of the conformity assessment procedure described in Annex III of the Directive 1999/5/EC, the end-customer equipment should be labelled as follows:     The end-customer has to assure that the device has a distance of more than 20cm from the human body under all circumstances. The end-customer equipment must meet the actual Safety/Health requirements according R&TTE.  PAN9320 and their model versions in the specified reference design can be used in the following countries: Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, Netherland, the United Kingdom, Switzerland, and Norway.
CLASSIFICATION PRODUCT SPECIFICATION No. DS-9320-2400-102 REV. 1.1 SUBJECT WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE 43  of  43 CUSTOMER’S CODE PAN9320 / PAN9310 PANASONIC’S CODE ENW49A01x3EF & ENW49A02x3EF DATE 14.03.2016   PANASONIC INDUSTRIAL DEVICES EUROPE GMBH www.pideu.panasonic.de  32. GENERAL INFORMATION  © Panasonic Industrial Devices Europe GmbH 2015. All rights reserved. This product description does not lodge the claim to be complete and free of mistakes. Please contact the related product manager in every case.  If ES samples are delivered to the customer, these samples have the status Engineering Samples. This means,  the  design  of  this  product  is  not  yet  concluded.  Engineering  Samples  may  be  partially  or  fully functional, and there may be differences to be published Data Sheet. Engineering Samples are not qualified and are not to be used for reliability testing or series production.  Disclaimer: Customer  acknowledges  that  samples  may  deviate  from  the  Data  Sheet  and  may bear  defects  due  to their status of development and the lack of qualification mentioned above. Panasonic  rejects  any  liability  or  product  warranty  for  Engineering  Samples.  In  particular,  Panasonic disclaims liability for damages caused by:   The  use  of  the  Engineering  Sample  other  than  for  Evaluation  Purposes,  particularly  the installation or integration in another product to be sold by Customer,   Deviation or lapse in function of Engineering Sample,   Improper use of Engineering Samples. Panasonic  Industrial  Devices  Europe  GmbH  disclaimes  any  liability  for  consequential  and  incidental damages.  In  case  of  any  questions,  please  contact  your  local  sales  partner  or  the  related  product manager.   33. LIFE SUPPORT POLICY  This  Panasonic  Industrial  Devices  Europe  GmbH  product  is  not  designed  for  use  in  life  support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting.

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