Panasonic Devices Europe 9320 Wireless LAN Embedded Module User Manual TABLE OF CONTENTS

Panasonic Industrial Devices Europe GmbH Wireless LAN Embedded Module TABLE OF CONTENTS

15_ENW49A013EF_(PAN9320+PAN9310)_UserMan

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Document Description15_ENW49A013EF_(PAN9320+PAN9310)_UserMan
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Date Submitted2016-03-18 00:00:00
Date Available2016-03-18 00:00:00
Creation Date2016-03-18 07:41:05
Document Lastmod2016-03-18 07:41:05
Document TitleTABLE OF CONTENTS
Document Author: Hostadt

CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
1 of 43
14.03.2016
Product Specification
Applicant / Manufacturer
Hardware
Panasonic Industrial Devices Europe GmbH
Zeppelinstrasse 19
21337 Lüneburg
Germany
Applicant / Manufacturer
Please refer to chapter 28. Ordering Information
Software
Software Version
Please refer to chapter 29. Software Versions
By purchase of any of products described in this document the customer accepts the document's
validity and declares their agreement and understanding of its contents and recommendations.
Panasonic reserves the right to make changes as required without notification.
Power Electronics R&D Center
Wireless Connectivity
Panasonic Industrial Devices Europe GmbH
APPROVED
CHECKED
DESIGNED
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
2 of 43
14.03.2016
TABLE OF CONTENTS
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
Scope of this Document ................................................................................................ 5
History for this Document .............................................................................................. 5
Data Sheet Status ......................................................................................................... 5
Related Documents ....................................................................................................... 5
Key Features ................................................................................................................. 6
Applications for the PAN9320 ........................................................................................ 6
Wireless Local Area Network Overview ......................................................................... 7
Description of the PAN9320 .......................................................................................... 7
Difference PAN9320 to PAN9310.................................................................................. 7
Detailed Description ...................................................................................................... 8
10.1. PAN9320 / PAN9310 Terminal Layout ................................................................. 8
10.2. Common Terminal Pin-Configuration ................................................................... 8
General Features ........................................................................................................ 10
HOST Interfaces ......................................................................................................... 10
12.1. UART0 Interface ................................................................................................ 10
12.2. UART1 Interface ................................................................................................ 10
Peripheral Bus Interface .............................................................................................. 11
WLAN Features........................................................................................................... 12
14.1. IEEE 802.11 / Standards .................................................................................... 12
14.2. WLAN MAC ........................................................................................................ 12
14.3. WLAN Baseband................................................................................................ 12
14.4. WLAN Radio ...................................................................................................... 13
14.5. WLAN Encryption ............................................................................................... 13
Block Diagram ............................................................................................................. 14
15.1. PAN9320............................................................................................................ 14
15.2. PAN9310............................................................................................................ 14
Key Parts List .............................................................................................................. 15
Test Conditions ........................................................................................................... 15
General Requirements and Operation ......................................................................... 15
18.1. Absolute Maximum Ratings ................................................................................ 15
18.2. Recommended Operating Conditions................................................................. 15
18.3. Digital Pin Characteristics .................................................................................. 16
18.4. Electrical characeristics ...................................................................................... 16
18.4.1. Current Consumption ............................................................................ 16
18.5. Internal Operating Frequencies .......................................................................... 16
18.6. Power Up Sequence .......................................................................................... 17
18.7. Firmware related Timing..................................................................................... 17
18.8. Coexistence Interface Specification.................................................................... 18
18.8.1. Marvell® 3/4-Wire Timing Data .............................................................. 18
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
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CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
No.
DS-9320-2400-102
DATE
REV.
1.1
3 of 43
14.03.2016
18.8.2. WL_ACTIVE 2/3/4-Wire Timing Data .................................................... 19
18.9. Host Interface Specification ................................................................................ 20
18.9.1. UART0 Command Interface .................................................................. 20
18.9.2. UART1 Binary Data Interface ................................................................ 20
18.9.3. UART1 Dual Interface ........................................................................... 21
18.10. Peripheral Interface Specification ................................................................... 22
18.10.1. Configurable GPIOs .............................................................................. 22
18.10.2. Firmware defined GPIOs ....................................................................... 22
18.10.3. Quad Serial Peripheral Interface (QSPI) ............................................... 23
18.10.3.1. List of supported Flash Memories ................................................... 23
18.10.3.1. Firmware supported QSPI Characteristic ........................................ 23
RF Electrical Characteristics ....................................................................................... 24
19.1. WLAN Radio Specification ................................................................................. 24
19.2. WLAN RF Characteristics .................................................................................. 25
19.2.1. RF Characteristics for IEEE 802.11b ..................................................... 25
19.2.2. RF Characteristics for IEEE 802.11g ..................................................... 26
19.2.3. RF Characteristics for IEEE 802.11n (BW 20 MHz) ............................... 27
19.2.4. RF Characteristics for IEEE 802.11n (BW 40 MHz)............................... 28
Soldering Temperature-Time Profile (for reflow soldering)........................................... 29
20.1. For lead solder ................................................................................................... 29
20.2. For leadfree solder ............................................................................................. 29
PAN9320 / PAN9310 Module Dimension .................................................................... 30
PAN9320 / PAN9310 Footprint of the Module ............................................................. 31
Case Marking (Example for PAN9320 – FCC Version) ................................................ 32
Mechanical Requirements ........................................................................................... 33
Reliability Tests ........................................................................................................... 33
Cautions ...................................................................................................................... 33
26.1. Design Notes ..................................................................................................... 33
26.2. Installation Notes................................................................................................ 34
26.3. Usage Conditions Notes..................................................................................... 34
26.4. Storage Notes .................................................................................................... 34
26.5. Safety Cautions .................................................................................................. 35
26.6. Other cautions .................................................................................................... 35
Packaging ................................................................................................................... 36
27.1. Tape Dimension ................................................................................................. 36
27.2. Packing in Tape ................................................................................................. 36
27.3. Component Direction ......................................................................................... 37
27.4. Reel Dimension .................................................................................................. 37
27.5. Label for Package .............................................................................................. 38
27.6. Total Package .................................................................................................... 38
Ordering Information ................................................................................................... 39
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
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CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
29.
30.
31.
32.
33.
No.
DS-9320-2400-102
DATE
REV.
1.1
4 of 43
14.03.2016
Software Versions ....................................................................................................... 39
RoHS Declaration ....................................................................................................... 39
Regulatory Information ................................................................................................ 40
31.1. FCC for US ........................................................................................................ 40
31.1.1. FCC Notice ........................................................................................... 40
31.1.2. Caution ................................................................................................. 40
31.1.3. Label Requirements .............................................................................. 40
31.1.4. Antenna Warning .................................................................................. 40
31.1.5. Approved Antenna List .......................................................................... 41
31.1.6. RF Exposure ......................................................................................... 41
31.2. Industry Canada Certification ............................................................................. 41
31.2.1. IC Notice ............................................................................................... 41
31.2.2. Labeling Requirements ......................................................................... 42
31.3. European R&TTE Declaration of Conformity ...................................................... 42
General Information..................................................................................................... 43
Life Support Policy ...................................................................................................... 43
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
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CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
5 of 43
14.03.2016
1. SCOPE OF THIS DOCUMENT
This product specification applies to Panasonic’s Wi-Fi IEEE 802.11 b/g/n full embedded module with brand
names PAN9320 and PAN9310.
2. HISTORY FOR THIS DOCUMENT
Revision
Date
Modification / Remarks
0.1
22.04.2015
1st preliminary version
1.0
26.11.2015
Adapt Panasonic’s Code by adding model ENW49A02x3EF
Adapt information in chapter:
4 Related Documents, 5 Key Features, 7 WLAN Overview, 8 Description of the , 10 Detailed Description,
11 General Features, 15 Block Diagram, 18.9 Host Interface Specification, 19 RF Electrical Characteristics,
21 PAN9320 / PAN9310 Module Dimension, 22 PAN9320 / PAN9310 Footprint of the Module,
23 Case Marking (Example for PAN9320 – FCC Version) , and 28 Ordering Information
Add chapter: 13 Peripheral Bus Interface, 18.6 Power Up Sequence, 18.7 Firmware related Timing,
29 Software Versions, and 31 Regulatory Information
1.1
14.03.2016
Adapt information in chapter 31.1.6 RF Exposure
3. DATA SHEET STATUS
This data sheet contains the PRELIMINARY specification. Supplementary data will be published at a later
date.
Panasonic reserves the right to make changes at any time without notice.
Consult the most recently issued data sheet before initiating or completing a design.
4. RELATED DOCUMENTS
Search these homepages for documentation updates.
[1] PAN9320 Flyer
PAN9320 Download Page (Flyer)
[2] PAN9320 Design Guide
PAN9320 Download Page (Design Guide)
[3] PAN9320 Quick Start Guide
PAN9320 Download Page (Quick Start Guide)
[4] PAN9320 Communication Specification
PAN9320 Download Page (Communication Specification)
[5] PAN9320 Application Note
PAN9320 Download Page (Application Note)
[6] Semiconductor Datasheet
®
88MC200 from Marvell
®
88W8782 from Marvell
[7] Application Note Land Grid Array
Land Grid Array
[8] REACH and RoHS Certificate
WM-REACH_and_RoHS_directive
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
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CLASSIFICATION
SUBJECT
No.
DS-9320-2400-102
PRODUCT SPECIFICATION
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
6 of 43
14.03.2016
5. KEY FEATURES

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Surface Mount Type (SMT) measured 29.0 x 13.5 x 2.66 [mm]³
Wireless Local Area Network (WLAN) module with integrated MCU and Radio
Operating in the 2.4GHz ISM band
Supports the following IEEE 802.11 standards:
 IEEE 802.11b/g payload data rates
 IEEE 802.11n high throughput data rates
 IEEE 802.11i security: WEP and WPA/WPA2 (TKIP, AES-CCMP)
 IEEE 802.11e Quality of Service (QoS)
TX power up to +18dBm (for IEEE 802.11b)
Outstanding RX sensitivity
 -98dBm (IEEE 802.11b DSSS 1Mbps)
 -75dBm (IEEE 802.11g OFDM 54Mbps)
 -73dBm (IEEE 802.11n MCS7 HT20 65Mbps)
 -70dBm (IEEE 802.11n MCS7 HT40 135Mbps)
Marvell® 88W8782 WLAN System-on-Chip (SoC) and 88MC200 (MCU) inside
High performance low power CPU core
Coexistence interface for external co-located 2.4GHz radios (e.g. Bluetooth)
Internal crystal oscillators for Radio (40MHz) and MCU (32MHz)
Integrated memory flash for customer web contents and configuration file (1MByte)
Memory extension with an external QSPI flash (2MByte) is optional
Two UART interfaces (command and binary data)
Integrated shielding to resist EMI
Manufactured in conformance with RoHS
Available with either integrated antenna (PAN9320) or dedicated RF pad for external antennas
(PAN9310)
6. APPLICATIONS FOR THE PAN9320
All Embedded Wireless Applications






White Good
Home Automation
Internet of Things
Fitness Equipment
Lighting Control
M2M Communication






PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
Printer
Smart Meters
Media Player
Sensors
POS Terminal
Patient Monitors
www.pideu.panasonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
7 of 43
14.03.2016
7. WIRELESS LOCAL AREA NETWORK OVERVIEW
A Wireless Local Area Network (WLAN) is a medium range, wireless network based on the IEEE 802.11
standard, and uses the ubiquities ISM (Industrial, Scientific and Medical) frequency range of 2,4GHz. The
802.11 standard pertains to the first two layers of the OSI model, and covers Physical Layer (PHY), the Data
Link Layer (DLL) with its two sub-layers: Logical Link Control (LLC), and Media Access Control (MAC).
WLAN networks utilize two operating modes to connect stations (STAs) equipped with a wireless network
adapter. The first is known as the Infrastructure Mode where the wireless STAs are connected via one or
more access points (APs). An AP is a device that allows STAs to connect with each other or to a wired
network. The second is the Ad-hoc mode, where wireless STAs are connected without any access point.
WLAN devices typically have a high transmit power, of 15 to 20 dBm, allowing them to reach a range of up to
100 meters. Furthermore, WLAN devices are commonly used to transmit high throughput data such as Audio
or Video streaming using Orthogonal Frequency Division Multiplexing (OFDM) modulation. The Carrier
Sense Multiple Access with Collosion Avoidance (CSMA/CA) mechanism enables the parallel access of
more than one device to the wireless medium of a IEEE 802.11 network. The following security mechanisms
are deployed: 1. Adavanced Encryption Standard (AES) with Counter Mode CBC-MAC Protocol (CCMP), 2.
Cipher-Based Message Authentication Code (CMAC) and 3. Wired Equivalent Privacy (WEP) with Temporal
Key Integrity Protocol (TKIP). Video, voice and multimedia applications are supported by the IEEE 802.11e
Quality of Service amendment.
8. DESCRIPTION OF THE PAN9320
The PAN9320 module is a WLAN embedded module with a 2.4GHz ISM band wireless radio and an MCU
for introduce WLAN connectivity into various electronic devices. A block diagram can be found in chapter 15.
The module is a cost-effective, low-power, fully embedded WLAN solution for the Internet of Things (IoT). It
offers the customer an easy integration with a low bill-of-material. The module offers Internet functionality
through HTML and JavaScript Web technologies. The PAN9320 combines advanced 802.11 wireless radio,
baseband processor, medium access controller (MAC), encryption units, controlled by a powerful CPU.
Furthermore, MCU offers an in-system programmable flash memory as well as many other powerful
supporting features and peripherals. The module is suitable for wireless network systems based on IEEE
802.11 b/g/n 2.4GHz where small form factor, highly integration, high throughput data rates and low RF
expertise are required. It supports simultaneous Access-Point and Infrastructure Mode.
The PAN9320 integrated MCU’s firmware consists of software modules with TCP/IP Network Stack, TLS1.2
Security Suite, UDP Name Services and various applications like Web Server, SMTP(s) Client, HTTP(s)
Client and Cloud Communication Client on top of the 802.11 WLAN stack with WPA/WPA2 Supplicant.
The integrated flash is used for customer web contents and configuration files with a usable memory size of
1 MByte. The memory size can be extended by using an external QSPI flash memory of 2 MByte. The radio
driver, MCU firmware, configuration files and web content can be updated Over-The-Air (OTA).
[1]
[1]
Refer to Quick Start Guide , Communication Specification , Design Guide
Information.
[4]
and chapter 28. Ordering
Please contact your local sales office for further details on additional options and services:
www.panasonic.com/rfmodules for the US,
http://industrial.panasonic.com/eu/i/29606/wireless_modules/wireless_modules.html for EU
or write an e-mail to wireless@eu.panasonic.com.
9. DIFFERENCE PAN9320 TO PAN9310
The PAN9320 has an integrated antenna and the PAN9310 has a dedicated RF pad for external antenna
connection.
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CLASSIFICATION
SUBJECT
No.
DS-9320-2400-102
PRODUCT SPECIFICATION
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
REV.
1.1
8 of 43
DATE
14.03.2016
10. DETAILED DESCRIPTION
10.1. PAN9320 / PAN9310 TERMINAL LAYOUT
Top View, Application PCB
PAN9310 RF bottom pad is marked with a blue circle
Command UART0 (2 pads) and binary data UART1 (4 pads) are marked with a blue rectangular box
Top View
35
34
32
31
30
29
37
F1
F2
F3
F4
F5
38
E1
E2
E3
E4
E5
28
27
26
25
D1
D2
D3
D4
D5
40
C1
C2
C3
C4
C5
23
22
21
20
GND
THERMO
39
24
GND
THERMO
19
18
GND
THERMO
GND
THERMO
41
B1
B2
B3
B4
B5
17
42
A1
A2
A3
A4
A5
16
Chip
Antenna
33
36
10
11
12
13
14
15
10.2. COMMON TERMINAL PIN-CONFIGURATION
No
10
11
12
13
14
15
16
17
18
19
20
21
Pin Name
GND
GPIO44 1
GPIO45 1
USB AVDD 33
NC
NC
3.3V
3.3V
UART1 CTS
UART1 RTS
UART1 TXD
UART1 RXD
QSPI CS2 4
GND
GND
NC / RF
GND
GND
GND
GND
GND
Pin Type
Ground Pin
Digital I/O
Digital I/O
Power
NC
NC
Power
Power
Digital In
Digital Out
Digital Out
Digital In
Digital Out
Ground Pin
Ground Pin
NC / Analog IO
Ground Pin
Ground Pin
Ground Pin
Ground Pin
Ground Pin
Description
Connect to Ground
Digital I/O #44
Digital I/O #45
Don’t connect, only for internal purpose
Don’t connect
Don’t connect
3.0V – 3.6V power supply connection (typical 3.3V)
3.0V – 3.6V power supply connection (typical 3.3V)
CTSn for UART1 (using hardware flow control)
RTSn for UART1 (using hardware flow control)
TXD for UART1
RXD for UART1
Chip select external flash (connect for usage of external QSPI flash memory)
Connect to Ground
Connect to Ground
PAN9320: NC / PAN9310: RF in/out over 50 bottom pad
Connect to Ground
Connect to Ground
Connect to Ground
Connect to Ground
Connect to Ground
All GPIO’s are initially set to output with low level
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CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
No
Pin Name
22
GND
23
GND
24
GND
25
GND
26
W STAT LED
27
UART0 TXD / DUAL STAT
28
UART0 RXD / DUAL SW
29
GPIO4
30
GPIO5
31
GPIO6
32
GPIO7
33
STAT LED1
34
STAT LED2
35
STAT LED3
36
GND
37
RESETn
38
WAKE UP0
39
BOOT
40
GPIO28 1
41
MCU READY
42
FACTORY RESET
A1
NC
A2
NC
A3
NC
A4
NC
A5
NC
B1
NC
B2
BT FREQ
B3
BT GRANTN
B4
BT REQ
B5
BT STATE
C1
NC
C2
NC
C3
WAKE UP1 3
C4
QSPI CLK
C5
QSPI D3 4
D1
TDI
D2
TRSTn
D3
NC
D4
QSPI D0 4
D5
QSPI D1 4
E1
TDO
E2
TCK
E3
TMS
E4
QSPI D2 4
E5
QSPI CS 4
F1
W PDn
F2
W RESETn
F3
GND
F4
GND
F5
GND
GND THERMO
GND THERMO
GND THERMO
GND THERMO
Pin Type
Ground Pin
Ground Pin
Ground Pin
Ground Pin
Digital Out
Digital Out
Digital In
Digital I/O
Digital I/O
Digital I/O
Digital I/O
Digital Out
Digital Out
Digital Out
Ground Pin
Digital In
Digital In
Digital In
Digital I/O
Digital Out
Digital In
NC
NC
NC
NC
NC
NC
Input Signal
Output Signal
Input Signal
Input Signal
NC
NC
Digital In
Digital Out
Digital I/O
Digital In
Digital In
NC
Digital I/O
Digital I/O
Digital Out
Digital Out
Digital I/O
Digital I/O
Digital Out
Digital In
Input Signal
Ground Pin
Ground Pin
Ground Pin
Thermal Pin
Thermal Pin
Thermal Pin
Thermal Pin
DATE
REV.
1.1
9 of 43
14.03.2016
Description
Connect to Ground
Connect to Ground
Connect to Ground
Connect to Ground
Connect to LED wireless (WLAN) status, active low
TXD for UART0 / UART1 state (binary data or command)
RXD for UART0 / UART1 toggle switch for controlling the state
Digital I/O #4
Digital I/O #5
Digital I/O #6
Digital I/O #7
Connect to LED MCU status (heartbeat), active low
Connect to LED IP-Connectivity (allocated IP), active low
Connect to LED Error (active during booting), active low
Connect to Ground
Reset MCU, active low (also option for flashing in production process)
Don’t connect, only for internal purpose
Boot option, high level boot from internal flash memory 2
Digital I/O #28
Connect to LED MCU ready (booting ready), active high
Factory reset (valid after 10 seconds), active high
Don’t connect
Don’t connect
Don’t connect
Don’t connect
Don’t connect
Don’t connect
Information BT using channel which overlaps WLAN channel or not
Indicate permission to transmit, low BT can transmit
BT device request access to medium
Information BT_REQ priority (1- or 2-bit) and direction BT RX/TX
Don’t connect
Don’t connect
Wake up signal for WLAN SoC (Host-to-SoC), active high 3
Clock for QSPI (connect for usage of external QSPI flash memory)
Data3 for QSPI (connect for usage of external QSPI flash memory)
TDI for JTAG (option for flashing in production process)
TRSTn for JTAG (option for flashing in production process)
Don’t connect
Data0 for QSPI (connect for usage of external QSPI flash memory)
Data1 for QSPI (connect for usage of external QSPI flash memory)
TDO for JTAG (option for flashing in production process)
TCK for JTAG (option for flashing in production process)
TMS for JTAG (option for flashing in production process)
Data2 for QSPI (connect for usage of external QSPI flash memory)
Don’t connect, only for internal purpose
Don’t connect, only for internal purpose (pull-up resistor internally)
Don’t connect, only for internal purpose (pull-up resistor internally)
Connect to Ground
Connect to Ground
Connect to Ground
Connect to Ground
Connect to Ground
Connect to Ground
Connect to Ground
Connect the BOOT pin over a 100 Ohm resistor to VCC
Connect to HOST MCU (wake up after shut-off mode, active high), use 10 kOhm resistor to GND at pin
Connect only in case of using external QSPI flash memory, otherwise do not connect
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
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CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
10 of 43
14.03.2016
11. GENERAL FEATURES
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

Surface Mount Type (SMT) measured 29.0 x 13.5 x 2.66 mm³
Wireless Local Area Network (WLAN) module with integrated MCU and Radio
Supports IEEE 802.11 b/g/n in the 2.4 GHz ISM band
TX power up to +18dBm (for IEEE 802.11b)
Outstanding RX sensitivity -98dBm (for IEEE 802.11b DSSS 1Mbps)
Marvell® 88W8782 WLAN System-on-Chip (SoC) and 88MC200 (MCU) inside
Two internal crystal oscillators with 32MHz and 40MHz
HOST communication interfaces UART0 (command) and UART1 (binary data)
Integrated TCP/IP network stack: IPv4, ARP, and AutoIP
UDP Name Services: DHCP, DNS, mDNS, and DNS-SD
HTTP(s) server with AJAX technology using JavaScript (JSON)
HTTP(s) client for integrated cloud communication
SMTP(s) client for E-Mail notifications
TLS1.2 security with user / group authentication including X.509 Certificate
802.11 supplicant: WEP, WPA, WPA2, and WPA2 mixed mode
Wireless update of radio driver and MCU firmware with integrated boot loader
Integrated QSPI flash memory for customer web contents up to 1 Mbyte (externally extendable)
Evaluation and development software available for Windows
Getting started tutorials, libraries, and APIs
Easy-To-Use (ETU) evaluation board for quick development and reduced time to market
Programming over standard JTAG
Shielding to resist EMI
12. HOST INTERFACES
12.1. UART0 INTERFACE






2-wire data transfer (RX, TX)
Programmable baud rate (300 bps to 1.5 Mbps)
Data format (LSB first)
Data bit: (5-8 bit)
Parity bit: (0-4 bit)
Stop bit: (1-2 bit)
12.2. UART1 INTERFACE






4-wire data transfer (RX, TX, RTS, CTS)
Programmable baud rate (300 bps to 1.5 Mbps)
Data format (LSB first)
Data bit: (5-8 bit)
Parity bit: (0-4 bit)
Stop bit: (1-2 bit)
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13. PERIPHERAL BUS INTERFACE

Embedded WLAN Radio (SoC) with following features:
 Clocked Serial Unit (CSU)
 3-Wire, 4-Wire (3W4W) Interface
 2-Wire Serial Interface (TWSI)
 1-Wire Serial Interface


General-Purpose I/O (GPIO) Interface
 Defined GPIOs, I/O configured to either input or output
 GPIO “W STAT LED” with LED output functionality
 LED pulse stretching to observe short duration of status events
 Two software controlled blink rates to indicate events
Embedded MCU with following features:
 JTAG
 Standard JTAG interface

Quad Serial Peripheral Interface
 Integrated QSPI controller (master) with synchronous serial peripheral for slave
device connection
 Integrated QSPI slave device with allocated Firmware range and web content
 16 Mbit / 2 Mbyte (1 Mbyte is reserved for customer web content)
 256 byte per programmable page with configurable length 1 to 256
 Uniform sector erase (4 Kbytes)
 Uniform block erase (64 Kbytes)
 Erase/Program suspend and resume
 Standard / Dual / Quad SPI Support
 Flash controller for fetching code or read-only data
 200 Mbps max. serial data rate in quad mode with 50 MHz functional clock
 Chip Select (CS2) for parallel operation of module internal and external QSPI flash
 External QSPI slave device can be connected for customer web content memory
extension
 Macronix QSPI flash MX25L1633E is supported
 Maximum 16Mbit / 2MByte is supported by firmware

Wake Up
 External signal for HOST-to-SoC wake-up after shut-off mode

General-Purpose I/O (GPIO) interface
 Defined GPIOs, I/O configured to either input or output (on/off)
 GPIOs with LED status functionality (Ready, Heartbeat, IP-Connectivity and Error)
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14. WLAN FEATURES
14.1. IEEE 802.11 / STANDARDS











802.11 data rates 1 and 2 Mbps (DSSS)
802.11b data rates 5.5 and 11 Mbps (CCK)
802.11g data rates 6, 9, 12, 18, 24, 36, 48 and 54 Mbps (OFDM)
802.11b/g performance enhancements
802.11n compliant with maximum data rates up to 72 Mbps (20 MHz channel) and
150 Mbps (40 MHz channel)
802.11d international roaming
802.11i enhanced security (WEP, WPA, WPA2)
802.11k radio resource measurement
802.11r fast hand-off for AP roaming
802.11w protected management frames
Support clients (stations) implementing IEEE Power Save mode
14.2. WLAN MAC
















Ad-Hoc and Infrastructure Modes
RTS/CTS for operation und DCF
Hardware filtering of 32 multicast addresses and duplicate frame detection for up to 32 unicast
addresses
WLAN SoC with TX and RX FIFO for maximum throughput
Open System and Shared Key Authentication services
A-MPDU RX (de-aggregation) and TX (aggregation)
20/40 MHz channel coexistence
Reduced Inter-Frame Spacing (RIFS) bursting
Management Information Base (MIB) counter
Radio resource measurement counters
Block acknowledgement with 802.11n extensions
Transmit beam former support
Transmit rate adaptation
Transmit power control
Long and short preamble generation on a frame-by-frame basis for 802.11b frames
®
Marvell Mobile Hotspot technology (MMH)
14.3. WLAN BASEBAND







802.11n 1x1 SISO (WLAN SoC with SISO RF radio)
Backward compatibility with legacy 802.11b/g technology
PHY data rates up to 150 Mbps (802.11n - MCS7)
20 MHz bandwidth/channel, 40 MHz bandwidth/channel, upper/lower 20 MHz bandwidth in 40
MHz channel and 20 MHz duplicate legacy bandwidth in 40 MHz channel mode operation
Modulation and Coding Scheme MCS 0 ~ 7 and MCS 32 (duplicate 6 Mbps)
Radio resource measurement
Optional 802.11n SISO features:
 20/40 MHz coexistence
 1-stream Space-Time-Block-Coding (STBC) reception
 Short Guard Interval
 RIFS on receive path
 Beamformer function and hardware acceleration
 Greenfield TX/RX
Hardware supported, not implemented in the pre-installed firmware stack
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14.4. WLAN RADIO


20 and 40 MHz channel bandwidth
Embedded WLAN Radio SoC with following features:
 Direct conversion radio (no SAW filter)
 2.4GHz TX/RX switch, Power Amplifier (PA) and Low Noise Amplifier (LNA) path
 Gain selectable LNAs with optimized noise figure and power consumption
 Power Amplifiers with power control
 Closed loop power control (0.5 dB step increments)
 Optimized TX gain distribution for linearity and noise performance
 Fine channel step with AFC (adaptive frequency control)
14.5. WLAN ENCRYPTION

Embedded WLAN Radio SoC with following features:
 WEP 64-bit and 128-bit encryption with hardware TKIP processing (WPA)
 AES-CCMP hardware implementation as part of 802.11i security standard (WPA2)
 Enhanced AES engine performance
 AES-Cipher-Based Message Authentication Code (CMAC) as part of the 802.11w security
standard
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15. BLOCK DIAGRAM
15.1. PAN9320
15.2. PAN9310
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16. KEY PARTS LIST
Part Name
Material
P.W.Board
Glass cloth epoxy resin with gold plating
Casing
Material: C7521, thickness 0.30mm
IC (WLAN SoC)
88W8782 (Marvell®, www.marvell.com)
IC (Microcontroller Unit)
88MC200 (Marvell , www.marvell.com)
IC (QSPI flash memory)
MX25L1633E (Macronix , http://www.macronix.com)
®
®
17. TEST CONDITIONS
Measurements shall be made under operating free-air temperature range unless otherwise specified.
Temperature
Humidity
Supply Voltage
25 ± 10°C
40 to 85%RH
3.3V
18. GENERAL REQUIREMENTS AND OPERATION
All specifications are over temperature and process, unless indicated otherwise.
18.1. ABSOLUTE MAXIMUM RATINGS
The maximum ratings may not be exceeded under any circumstances, not even momentarily and
individually, as permanent damage to the module will result.
Symbol
Parameter
Condition
TSTOR
Storage temperature
VESD
ESD robustness
Min.
Typ.
-40
All pads, according to human-body model, JEDEC
STD 22, method A114
According to charged-device model, JEDEC STD 22,
method C101
Max.
Units
+85
°C
1000
500
+20
dBm
PRF
RF input level
VDDMAX
Maximum voltage
Maximum power supply voltage from any pin with
respect to VSS (GND)
-0.3
3.6
VDIG
Voltage on any digital pins
GPIOs, RESETn, UART, QSPI, Coex I/F
-0.3
VDDMAX
18.2. RECOMMENDED OPERATING CONDITIONS
The maximum ratings may not be exceeded under any circumstances, not even momentarily and
individually, as permanent damage to the module will result.
Symbol
Parameter
TA
Ambient operating
temperature range
VDD
3V3 Supply voltage
Condition
Min.
Extended grade
-30
Voltage on pins 7, 8 (3.3V)
I/O supply voltage internally connected to VDD / VCC
3.0
Typ.
3.3
Max.
Units
+70
°C
3.6
The supply current must be limited to max. 1A
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18.3. DIGITAL PIN CHARACTERISTICS
Symbol
Parameter
VIH
High level input voltage
VIL
Low level input voltage
IPS @ 0.5VDD
Pull-up / down strength
IOH @ VDD-0.4V
High level output current
IOL @ 0.4V
Low level output current 7
Condition
Min.
3.3V Operation (VIO = VDD)
Typ.
Max.
Units
0.7VDD
VDD+0.3
3.3V Operation (VIO = VDD)
-0.3
0.3VDD
VDigital Pin=0.5 x VDD
10
50
µA
3.3V Operation (VIO = VDD)
mA
3.3V Operation (VIO = VDD)
mA
18.4. ELECTRICAL CHARACERISTICS
The current consumption depends on the user scenario and the setup and timing in the power modes.
Assume VDD = 3.3V, Tamb = 25°C if nothing else stated
18.4.1. Current Consumption
Symbol
ITX
IRX
Parameter
Active Transmit
Active Receive
Condition
Min.
Typ.
Max.
Units
PTX = +18 dBm for 802.11b @ 11 Mbps
430
mA
PTX = +15 dBm for 802.11g @ 54 Mbps
370
mA
PTX = +13 dBm for 802.11n (20MHz) @ 65 Mbps
350
mA
802.11b @ 11 Mbps
150
mA
802.11g @ 54 Mbps
155
mA
802.11n @ 65 Mbps
160
mA
IRXIdle
Receive Idle 10
Passive receive state, ready to receive packets, but
no active decoding
145
mA
IShut-off
Shut-off
MCU and Radio in shut-off mode
27
mA
18.5. INTERNAL OPERATING FREQUENCIES
Symbol
Parameter
Condition
fSYSCLK1
CPU/System/Encryption
clock speed
fSYSCLK2
fREFCLK1
fREFCLK2
Min.
Typ.
Max.
Units
Refers to clock speed of WLAN SoC
128
MHz
CPU/System clock speed
Refers to clock speed of MCU
200
MHz
WLAN SoC Crystal
fundamental frequency
Microcontroller Crystal
fundamental frequency
Frequency tolerance < ±10 ppm over operating
temperature and process
Frequency tolerance < ±10 ppm over operating
temperature and process
40
MHz
32
MHz
The capacitive load should not be larger than 50 pF for all I/O’s when using the default driver strength settings. Generally, large capacitance loads increase the overall current
consumption.
Peak values for specified output power level and data rate with UDP traffic between the AP and Device (STA).
Peak values for specified data rate with UDP traffic between the AP and Device (STA)..
10
The device is powered on and is ready to receive packets, but is not actively decoding.
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18.6. POWER UP SEQUENCE
When the power is turned on, set reset signal to low (RESETn = low). After the V DD is stable, release
the reset (RESETn = high).
18.7. FIRMWARE RELATED TIMING
Symbol
Parameter
T MCU READY
Time period from Power up or Reset until MCU READY pin is active
Min.
Typ.
Max.
Units
sec
100
ms
10
sec
Time period need to set pin active to wake-up from shut-off mode
(afterwards firmware is booting)
Time period need to set pin active to release factory reset
(afterwards firmware is booting)
Time period in Infrastructure mode from WLAN association request until
association with selected Access-Point’s SSID
sec
T DE-ASSO SCAN
Time period between de-association from AP until next scan is released
60
sec
T IP DHCP
Time period from IP DHCP request until IP assignment
T WAKE UP
T FACTORY RESET
T INFRA ASSO
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18.8. COEXISTENCE INTERFACE SPECIFICATION
The Coexistence Interface pins are powered from the VIO voltage supply internally connected to
VDD = 3.3V. See Chapter 18.3 Digital Pin Characteristics for DC specification.
18.8.1. Marvell® 3/4-Wire Timing Data
Symbol
Parameter
Min.
Typ.
Max.
Units
T1
Priority[0] info is valid in BT_STATE on and after T1 from BT_REQ rise.
100
µs
T2
TxRx Info is valid in BT_STATE on and after T2. The BT_STATE must hold until
there is any change of direction in the next slots.
19
100
µs
T3
Time from TxRx Info valid to BCA grant decision (T3 = T7 – T4 – T2 – T8 – T1).
40
594
µs
80
594
µs
40
600
µs
15
25
µs
150
600
µs
10
100
µs
T4
T5
T6
T7
T8
BT_GRANTn needs to be valid T4 time before the upcoming slot. BT_GRANTn
indicates Tx grant, and may also indicate Rx grant. Once a slot is granted, the
subsequent slots are also granted unless there is a change in direction from Rx to
Tx. Rx to Tx change always re-arbitrates.
TxRx Info for the next slot is valid on and after T5 to the start of the next slot. If
direction remains the same for the next slot, then BT_STATE must not change
during the current slot. If the direction changes for the next slot, the BT_STATE
must change only after the last bit of Bluetooth data is transferred; otherwise the
transfer may be disrupted.
The BT_REQ signal de-asserts T6 time after last bit of Bluetooth data is transferred.
Time from BT_REQ rise to first Bluetooth slot boundary. Bluetooth slot boundary is
marked by first bit of Bluetooth data.
Optional
Priority[1] information is valid in BT_STAT on and after T8. This time parameter only
exists if BCA is configured for 2-bit priority on same BT_STATE pin. Otherwise, the
start of T2 would come after T1.
Ttx
Slot time (fixed fpr Bluetooth)
625
µs
Trx
Slot time (fixed fpr Bluetooth)
625
µs
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18.8.2. WL_ACTIVE 2/3/4-Wire Timing Data
Symbol
Parameter
Min.
T1
 If WLAN can be stopped, WL_ACTIVE will de-asser prior to Bluetooth slot start
(T1 < T2)
 If the Bluetooth device samples WL_ACTIVE before starting priority transfer,
WL_ACTIVE needs to de-assert earlier than the sampling time.
T2
Time from BT_PRIORITY rise to start of Bluetooth activity.
20
T3
Time from end of Bluetooth activity to BT_PRIORITY fall.
T4
Slot time (fixed fpr Bluetooth)
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Typ.
Max.
Units
499
µs
50
499
µs
499
µs
625
µs
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18.9. HOST INTERFACE SPECIFICATION
18.9.1. UART0 Command Interface
UART0 command interface bus signals:
Module Pin No
Signal Name
27
28
UART0 TXD
UART0 RXD
Function
Command
Description
Transmit data output
Receive data input
Protocol:
Item
Range
Default
Baudrate
Data Bits
Parity Bits
Stop Bit
300 ~ 1500000
5 ~ 8 (LSB first)
0~4
1 / 1,5 / 2
115200
Comment
LSB first
Supported Baud Rates:
Item
Baud
Baudrate
300
56000
600
57600
1200
115200
4800
128000
9600
256000
14400
520000
19200
780000
28800
1500000
38400
14400
520000
19200
780000
28800
1500000
38400
UART0 timing diagram:
18.9.2. UART1 Binary Data Interface
UART1 binary data interface bus signals:
Module Pin No
Signal Name
Function
Description
10
11
12
UART1 CTS
UART1 RTS
UART1 TXD
UART1 RXD
Binary data
Clear to send
Request to send
Transmit data output
Receive data input
Comment
Protocol:
Item
Range
Default
Baudrate
Data Bits
Parity Bits
Stop Bit
300 ~ 1500000
5 ~ 8 (LSB first)
0~4
1 / 1,5 / 2
115200
LSB first
Supported Baud Rates:
Item
Baud
Baudrate
300
56000
600
57600
1200
115200
4800
128000
9600
256000
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UART1 timing diagram:
18.9.3. UART1 Dual Interface
UART1 dual interface bus signals:
Module Pin No
Signal Name
GPIO
definition
10
11
12
27
28
UART1 CTS
UART1 RTS
UART1 TXD
UART1 RXD
DUAL STAT
DUAL SW
OUT
IN
IN
OUT
OUT
IN
GPIO level
default
State
default
HIGH
Binary data
Description
Clear to send
Request to send
Transmit data output
Receive data input
UART1 state condition (binary or command)
UART1 toggle switch for binary / command
See Chapter 18.9.2 UART1 Binary Data Interface for specification of protocol and supported baud
rates.
The usage of the UART1 dual interface needs to be configured at the customer content of firmware.
After booting the MCU READY pin is changing from low to high level. For start condition the DUAL SW
input pin needs to be pre-set from the HOST by changing from high to low level. The DUAL STAT
output pin is signalling high level as Binary state. In this case the HOST is able to transmit or receive
binary data. To change from Binary to Command state the DUAL SW input pin needs to be toggled
(low - high - low level change) from the HOST: 1. The change of state is initiated by changing the
DUAL SW input pin from low to high level (set toggle switch). 2. After the DUAL STAT pin is changing
the state from high to low level the Command state is active and the DUAL SW input pin can be reset
from high to low level (reset toggle). 3. The HOST is now able to send commands. After the commands
are sent it is recommended to change back to Binary state by toggling the DUAL SW input pin again.
UART1 dual interface bus and control timing diagram:
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18.10. PERIPHERAL INTERFACE SPECIFICATION
The Peripheral Interface pins are powered from the VIO voltage supply internally connected to
VDD = 3.3V. See Chapter 18.3 Digital Pin Characteristics for DC specification.
18.10.1. Configurable GPIOs
GPIO pin name
GPIO function
Input IN
State
GPIO4
GPIO5
GPIO6
GPIO7
GPIO28
GPIO44
GPIO45
YES
YES
YES
YES
YES
YES
YES
ON
YES
YES
YES
YES
YES
YES
YES
Output OUT
Default by firmware
OFF
YES
YES
YES
YES
YES
YES
YES
OFF
OUT
OUT
OUT
OUT
OUT
OUT
OUT
The function of the configurable GPIOs are set by firmware default, but can be reconfigured by HOST
command interface (UART).
18.10.2. Firmware defined GPIOs
GPIO definition
GPIO level
Firmware state
GPIO pin name
Input
Output
Default
Active
Boot
STAT LED1
NO
YES
LOW
OFF
STAT LED2
NO
YES
LOW
OFF
STAT LED3
NO
YES
LOW
ON
W STAT LED
NO
YES
LOW
OFF
MCU READY
NO
YES
HIGH
OFF
Firmware application active
OFF: Shut-off
BLINK (1sec): Firmware active
OFF: no IP assined
ON: IP assigned
OFF: no error
ON: error appeared
OFF: no AP connection
BLINK (0.3s): Scanning for AP
BLINK (1.2s): WLAN Error
ON: Associated with AP
OFF: Shut-off
ON: Firmware ready
Firmware function
MCU Status (heartbeat)
IP-Connectivity
in Infrastructure mode
MCU firmware error
WLAN connectivity in
Infrastructure mode
Firmware application is ready
FACTORY RESET
YES
NO
LOW
11
HIGH
inactive
Set active for min. 10 seconds
Re-store firmware default
WAKE UP1
YES
NO
LOW
11
HIGH
inactive
Set active for min. 100 ms
Wake up after shut-off
HIGH
12
HIGH
active
inactive after booting
Radio firmware to be loaded
from internal flash memory
BOOT
YES
NO
The function of the firmware defined GPIOs are fixed and can’t be changed.
11
Set default level by using resistor with 10kOhm to GND
12
Set default level with resistor 100 Ohm to Vcc
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CLASSIFICATION
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DS-9320-2400-102
PRODUCT SPECIFICATION
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
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REV.
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18.10.3. Quad Serial Peripheral Interface (QSPI)
18.10.3.1. List of supported Flash Memories
QSPI flash memory supported:
Parts Name
Manufacturer
Memory type
SPI Mode
SPI Clock
Memory size
Page size
MX25L1633E
Macronix
QSPI
1 / 2 / 4 I/O
104 / 85 MHz
16Mbit
256 byte
18.10.3.1. Firmware supported QSPI Characteristic
QSPI characteristic:
Symbol
Parameter
Min.
Typ.
Max.
Units
t cyc
QSPI clock cycle time
20
ns
tW
Clock high and low time
t cyc / 2-6.67
ns
t SU (RX)
Data input setup time
5.5
ns
t h (RX)
Data input hold time
ns
t out (TX)
Data output delay time
3.2
ns
QSPI timing diagram:
QSPI command set (used by firmware):
Command
Description
1st
byte
WREN
Write enable
06 (hex)
sets the (WEL) write enable latch bit
WRDI
Write disable
04 (hex)
resets the (WEL) write enable latch bit
RDID
Read identification
9F (hex)
outputs JEDEC ID: 1-byte Manufacturer ID &
2-byte Device ID
RDSR
Read status register
05 (hex)
WRSR
Write status register
01 (hex)
Values
READ
Read data
03 (hex)
AD1
A23-A16
AD2
A15-A8
AD3
A7-A0
FAST READ
Fast read data
0B (hex)
AD1
AD2
AD3
BB (hex)
ADD(2)
ADD(2) &
Dummy(2)
n bytes read out by 2 x I/O until CS# goes high
Dummy(4)
n bytes read out by 4 x I/O until CS# goes high
AD2
AD3
2READ
2 I/O read
2nd
byte
3rd
byte
4th
byte
5th
byte
Action
to read out the values of the status register
to write new values of the status register
n bytes read out until CS# goes high
Dummy
n bytes read out until CS# goes high
4READ
4 I/O read
EB (hex)
ADD(4) &
Dummy(4)
PP
Page program
02 (hex)
AD1
4PP
Quad page program
38 (hex)
AD1
Sector Erase
4 KB sector erase
20 (hex)
AD1
AD2
AD3
to erase the selected sector
Block Erase
64 KB block ersae
D8 (hex)
AD1
AD2
AD3
to erase the selected block
Chip Erase
2 MB full chip erase
60 or C7
(hex)
to program the selected page
quad input to program the selected page
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CLASSIFICATION
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DS-9320-2400-102
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WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
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19. RF ELECTRICAL CHARACTERISTICS
19.1. WLAN RADIO SPECIFICATION
Parameter
Operation mode
Specification
IEEE 802.11 / IEEE 802.11b
Standard Conformance
IEEE 802.11g
IEEE 802.11n
Modulation
IEEE 802.11b
DSSS / CCK
IEEE 802.11g
OFDM
IEEE 802.11n
OFDM @ MCS0~7 and MCS32 (duplicate 6 Mbps)
IEEE 802.11
1, 2 Mbps @ DSSS
IEEE 802.11b
5.5, 11 Mbps @ DSSS / CCK
IEEE 802.11g
6, 9, 12, 18, 24, 36, 48, 54 Mbps
Physical layer data rates
LGI
6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps
SGI
7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65, 72.2 Mbps
LGI
13.5, 27, 40.5, 54, 81, 108, 121.5, 135 Mbps
SGI
15, 30, 45, 60, 90, 120, 135, 150 Mbps
HT20
Supported data rates
IEEE 802.11n
MCS0~7
HT40
Supported bandwidth
IEEE 802.11n
20, 40 MHz (BW)
Supported channel mode operation
IEEE 802.11n
20 MHz BW / channel, 40 MHz BW / channel,
upper / lower 20 MHz BW @ 40 MHz channel,
20 MHz duplicate legacy BW @ 40 MHz channel
Supported Guard Interval
IEEE 802.11n
400 ns (SGI), 800 ns (LGI)
IEEE 802.11g
North America (US)
1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11
Canada (CA)
1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11
Europe (EU)
1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13
France (FR)
10, 11, 12, 13
Japan MMK (JP)
1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13
Supported channel 2.4GHz 13
North America (US)
Canada (CA)
1-5, 2-6, 3-7, 4-8, 5-9, 6-10, 7-11
IEEE 802.11n
Europe (EU)
France (FR)
Japan MMK (JP)
13
In order to comply with relevant regulatory requirements, for the model’s supported channels please refer to the chapter 28. Ordering Information
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19.2. WLAN RF CHARACTERISTICS
19.2.1. RF Characteristics for IEEE 802.11b
Assume VDD = 3.3V, Tamb = 25°C if nothing else stated
50 Ohm terminal load connected to the RF connector
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2400
2483.5
MHz
Carrier frequency tolerance
-25
+25
ppm
+20
dBm
fC ± 11 MHz
-30
dBr
fC ± 22 MHz
-50
Transmit output power
+18
Spectrum mask
Power-on / Power-down ramp
µs
RF Carrier suppression
-15
dB
35
Error Vector Magnitude (EVM)
Peak
1 Mbps (DSSS)
FER ≤ 8%
-98
-86
dBm
2 Mbps (DSSS)
FER ≤ 8%
-95
-83
dBm
5.5 Mbps (CCK)
FER ≤ 8%
-91
-79
dBm
11 Mbps (CCK)
FER ≤ 8%
-88
-76
dBm
Minimum Receive Sensitivity
Maximum Input Level
FER ≤ 8%
-10
dBm
Adjacent Channel Rejection
FER ≤ 8%
35
dB
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DS-9320-2400-102
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19.2.2. RF Characteristics for IEEE 802.11g
Assume VDD = 3.3V, Tamb = 25°C if nothing else stated
50 Ohm terminal load connected to the RF connector
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2400
2483.5
MHz
Carrier frequency tolerance
-25
+25
ppm
6 Mbps ~ 36 Mbps
+16
+18
dBm
48 Mbps ~ 54 Mbps
+15
+17
dBm
fC ± 11 MHz
-20
dBr
fC ± 20 MHz
-28
dBr
fC ± 30 MHz
-40
dBr
-15
dB
+2
dB
BPSK, CR 1/2 (6 Mbps)
-5
dB
BPSK, CR 3/4 (9 Mbps)
-8
dB
QPSK, CR 1/2 (12 Mbps)
-10
dB
QPSK, CR 3/4 (18 Mbps)
-13
dB
16-QAM, CR 1/2 (24 Mbps)
-16
dB
16-QAM, CR 3/4 (36 Mbps)
-19
dB
64-QAM, CR 2/3 (48 Mbps)
-22
dB
64-QAM, CR 3/4 (54 Mbps)
-25
dB
Transmit output power
Spectrum mask
Transmitter center frequency leakage
Transmitter Spectral Flatness
-2
Constellation Error (EVM)
BPSK, CR 1/2 (6 Mbps)
PER ≤ 10%
-91
-82
dBm
BPSK, CR 3/4 (9 Mbps)
PER ≤ 10%
-90
-81
dBm
QPSK, CR 1/2 (12 Mbps)
PER ≤ 10%
-89
-79
dBm
QPSK, CR 3/4 (18 Mbps)
PER ≤ 10%
-87
-77
dBm
16-QAM, CR 1/2 (24 Mbps)
PER ≤ 10%
-84
-74
dBm
16-QAM, CR 3/4 (36 Mbps)
PER ≤ 10%
-80
-70
dBm
64-QAM, CR 2/3 (48 Mbps)
PER ≤ 10%
-76
-66
dBm
64-QAM, CR 3/4 (54 Mbps)
PER ≤ 10%
-75
-65
dBm
-20
dBm
Minimum Receive Sensitivity
PER ≤ 10%
Maximum Input Level
BPSK, CR 1/2 (6 Mbps)
PER ≤ 10%
16
dB
64-QAM, CR 3/4 (54 Mbps)
PER ≤ 10%
-1
dB
Adjacent channel rejection
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DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
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19.2.3. RF Characteristics for IEEE 802.11n (BW 20 MHz)
Assume VDD = 3.3V, Tamb = 25°C if nothing else stated
50 Ohm terminal load connected to the RF connector
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2400
2483.5
MHz
Carrier frequency tolerance
-25
+25
ppm
Transmit output power
Spectrum mask
MCS0 ~ MCS2
+15
+17
dBm
MCS3 ~ MCS4
+14
+16
dBm
MCS5 ~ MCS7
+13
+15
dBm
fC ± 11 MHz
-20
dBr
fC ± 20 MHz
-28
dBr
fC ± 30 MHz
-45
dBr
-15
dB
+2
dB
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
Transmitter center frequency leakage
Transmitter Spectral Flatness
-2
Constellation Error (EVM)
Minimum Receive Sensitivity
6.5 Mbps (MCS0)
PER ≤ 10%
-91
-82
dBm
13 Mbps (MCS1)
PER ≤ 10%
-88
-79
dBm
19.5 Mbps (MCS2)
PER ≤ 10%
-86
-77
dBm
26 Mbps (MCS3)
PER ≤ 10%
-83
-74
dBm
39 Mbps (MCS4)
PER ≤ 10%
-79
-70
dBm
52 Mbps (MCS5)
PER ≤ 10%
-75
-66
dBm
58.5 Mbps (MCS6)
PER ≤ 10%
-74
-65
dBm
65 Mbps (MCS7)
PER ≤ 10%
-73
-64
dBm
-20
dBm
14
PER ≤ 10%
Maximum Input Level
Adjacent channel rejection
15
65 Mbps (MCS7)
PER ≤ 10%
14
The Minimum Sensitivity levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI and BCC.
15
The Adjacent Channel Rejection levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI and BCC.
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-2
dB
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19.2.4. RF Characteristics for IEEE 802.11n (BW 40 MHz)
Assume VDD = 3.3V, Tamb = 25°C if nothing else stated
50 Ohm terminal load connected to the RF connector
Parameter
Condition
Min.
Typ.
Max.
Units
RF frequency range
2400
2483.5
MHz
Carrier frequency tolerance
-25
+25
ppm
Transmit output power
Spectrum mask
MCS0 ~ MCS2
+13
+15
dBm
MCS3 ~ MCS4
+12
+14
dBm
MCS5 ~ MCS7
+11
+13
dBm
fC ± 21 MHz
-20
dBr
fC ± 40 MHz
-28
dBr
fC ± 60 MHz
-45
dBr
-15
dB
+2
dB
BPSK, CR 1/2 (MCS0)
-5
dB
QPSK, CR 1/2 (MCS1)
-10
dB
QPSK, CR 3/4 (MCS2)
-13
dB
16-QAM, CR 1/2 (MCS3)
-16
dB
16-QAM, CR 3/4 (MCS4)
-19
dB
64-QAM, CR 2/3 (MCS5)
-22
dB
64-QAM, CR 3/4 (MCS6)
-25
dB
64-QAM, CR 5/6 (MCS7)
-27
dB
Transmitter center frequency leakage
Transmitter Spectral Flatness
-2
Constellation Error (EVM)
13.5 Mbps (MCS0)
PER ≤ 10%
-88
-79
dBm
27 Mbps (MCS1)
PER ≤ 10%
-85
-76
dBm
40.5 Mbps (MCS2)
PER ≤ 10%
-83
-74
dBm
54 Mbps (MCS3)
PER ≤ 10%
-80
-71
dBm
81 Mbps (MCS4)
PER ≤ 10%
-76
-67
dBm
108 Mbps (MCS5)
PER ≤ 10%
-72
-63
dBm
121.5 Mbps (MCS6)
PER ≤ 10%
-71
-62
dBm
135 Mbps (MCS7)
PER ≤ 10%
-70
-61
dBm
-20
dBm
Minimum Receive Sensitivity 14
PER ≤ 10%
Maximum Input Level
Adjacent channel rejection
15
135 Mbps (MCS7)
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-2
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DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
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20. SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
20.1. FOR LEAD SOLDER
10 1s
Recommended temp. profile
for reflow soldering
30 +20/-10s
235°C max.
Temp.[°C]
220 5°C
200°C
150 10°C
90 30s
Time [s]
20.2. FOR LEADFREE SOLDER
Our used temp. profile
for reflow soldering
30 +20/-10s
Temp.[°C]
230°C -250°C max.
220°C
150°C – 190°C
90 30s
Time [s]
Reflow permissible cycle: 2
Opposite side reflow is prohibited due to module weight.
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DS-9320-2400-102
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21. PAN9320 / PAN9310 MODULE DIMENSION
No.
Item
Dimension
Tolerance
Width
13.50
 0.30
Length
29.00
 0.30
Height
2.66
 0.20
Remark
with case
29
,50
2,66
13
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22. PAN9320 / PAN9310 FOOTPRINT OF THE MODULE
All dimensions are in millimeters.
The outer dimensions have a tolerance of  0.3mm.
Top view, Application PCB
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23. CASE MARKING (EXAMPLE FOR PAN9320 – FCC VERSION)
No.
Remark
PAN9320 or PAN9310 (Brand Name), see chapter 28. Ordering Information
Hardware / Software version
Model Name, see chapter 28. Ordering Information
Lot code: YearYear, WeekWeek, Day, LotLot
Serial Number (8 digits)
WLAN MAC address (12 digits)
FCC ID, refer to chapter 31.1 FCC for US
IC Canada, refer to chapter 31.2 Industry Canada Certification
Marking for Pin 1 (Circle 0,15 mm)
10
2D-Code, for internal usage only and can be change without any notice
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24. MECHANICAL REQUIREMENTS
No.
Item
Solderability
Resistance to soldering heat
Limit
Condition
More than 75% of the soldering area shall be coated by
solder
It shall be satisfied electrical requirements and not be
mechanical damage
Reflow soldering with recommendable
temperature profile
See chapter 20.2
25. RELIABILITY TESTS
The measurement should be done after being exposed to room temperature and humidity for 1 hour.
No.
Item
Limit
Condition
Vibration test
Electrical parameter should be in
specification
a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
Shock test
the same as above
Dropped onto hard wood from height of 50cm for 3 times
Heat cycle test
the same as above
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
Moisture test
the same as above
+60°C, 90% RH, 300h
Low temp. test
the same as above
-40°C, 300h
High temp. test
the same as above
+85°C, 300h
26. CAUTIONS
Failure to follow the guidelines set forth in this document may result in degrading of the product’s functions
and damage to the product.
26.1. DESIGN NOTES
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Follow the conditions written in this specification, especially the control signals of this
module.
The supply voltage must be free of AC ripple voltage (for example from a battery or a low
noise regulator output). For noisy supply voltages, provide a decoupling circuit (for
example a ferrite in series connection and a bypass capacitor to ground of at least 47uF
directly at the module).
This product should not be mechanically stressed when installed.
Keep this product away from heat. Heat is the major cause of decreasing the life of these
products.
Avoid assembly and use of the target equipment in conditions where the products '
temperature may exceed the maximum tolerance.
The supply voltage should not be exceedingly high or reversed. It should not carry noise
and/or spikes.
Keep this product away from other high frequency circuits.
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26.2. INSTALLATION NOTES
(1)
Reflow soldering is possible twice based on the conditions in chapter 15.
Set up the temperature at the soldering portion of this product according to this reflow
profile.
(2) Carefully position the products so that their heat will not burn into printed circuit boards or
affect the other components that are susceptible to heat.
(3) Carefully locate these products so that their temperatures will not increase due to the
effects of heat generated by neighboring components.
(4) If a vinyl-covered wire comes into contact with the products, then the cover will melt and
generate toxic gas, damaging the insulation. Never allow contact between the cover and
these products to occur.
(5) This product should not be mechanically stressed or vibrated when reflowed.
(6) To repair the board by hand soldering, follow the conditions set forth in this chapter.
(7) Do not wash this product.
(8) Refer to the recommended pattern when designing a board.
(9) Pressing on parts of the metal cover or fastening objects to the metal will cause damage to
the unit.
(10) For more details on LGA (Land Grid Array) soldering processes refer to the application
[7]
note .
26.3. USAGE CONDITIONS NOTES
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Take measures to protect the unit against static electricity.
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, check and evaluate their operation befor assembly on the final products.
Do not use dropped products.
Do not touch, damage or soil the pins.
Follow the recommended condition ratings about the power supply applied to this product.
Electrode peeling strength: Do not add pressure of more than 4.9N when soldered on PCB.
Pressing on parts of the metal cover or fastening objects to the metal cover will cause
damage.
These products are intended for general purpose and standard use in general electronic
equipment, such as home appliances, office equipment, information and communication
equipment.
26.4. STORAGE NOTES
(1)
(2)
(3)
(4)
(5)
The module should not be stressed mechanically during storage.
Do not store these products in the following conditions or the performance characteristics
of the product, such as RF performance will be adversely affected:
 Storage in salty air or in an environment with a high concentration of corrosive gas, such as
Cl2, H2S, NH3, SO2, or NOX
 Storage in direct sunlight
 Storage in an environment where the temperature may be outside the range of 5° C to 35°C
range, or where the humidity may be outside the 45 to 85% range.
 Storage of the products for more than one year after the date of delivery Storage period:
Please check the adhesive strength of the embossed tape and soldering after 6 months of
storage.
Keep this product away from water, poisonous gas and corrosive gas.
This product should not be stressed or shocked when transported.
Follow the specification when stacking packed crates (max. 10).
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
35 of 43
14.03.2016
26.5. SAFETY CAUTIONS
These specifications are intended to preserve the quality assurance of products and individual
components.
Before use, check and evaluate the operation when mounted on your products. Abide by these
specifications, without deviation when using the products. These products may short-circuit. If electrical
shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs,
then provide the following failsafe functions, as a minimum.
(1) Ensure the safety of the whole system by installing a protection circuit and a protection
device.
(2) Ensure the safety of the whole system by installing a redundant circuit or another system to
prevent a single fault causing an unsafe status.
26.6. OTHER CAUTIONS
(1)
(2)
(3)
(4)
(5)
(6)
(7)
This specification sheet is copyrighted. Do not disclose it to a third party.
Do not use the products for other purposes than those listed.
Be sure to provide an appropriate fail-safe function on your product to prevent an additional
damage that may be caused by the abnormal function or the failure of the product.
This product has been manufactured without any ozone chemical controlled under the
Montreal Protocol.
These products are not intended for other uses, other than under the special conditions
shown below. Before using these products under such special conditions, check th eir
performance and reliability under the said special conditions carefully to determine whether
or not they can be used in such a manner.
 In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid
may splash.
 In direct sunlight, outdoors, or in a dusty environment
 In an environment where condensation occurs.
 In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2,
H2S, NH3, and NOX)
If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to provide
normal performance even if their electronic characteristics and appearances appear
satisfactory.
When you have any question or uncertainty, contact Panasonic.
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
36 of 43
14.03.2016
27. PACKAGING
Mass production status product -- as indicated in Chapter 3 -- will be delivered in the package described
below.
27.1. TAPE DIMENSION
27.2. PACKING IN TAPE
Empty spaces in component packed area shall be less than two per reel and those spaces shall not be
consecutive.
Top cover tape shall not be found on reel holes and shall not stick out from reel.
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
37 of 43
14.03.2016
27.3. COMPONENT DIRECTION
27.4. REEL DIMENSION
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
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CLASSIFICATION
SUBJECT
No.
DS-9320-2400-102
PRODUCT SPECIFICATION
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
38 of 43
14.03.2016
27.5. LABEL FOR PACKAGE
The picture shows an example from similar product.
-AAA
(3P): PAN9320
Company
RoHS
ENW49A01A3EF
xy/ab
500
Country of Origin: Slovakia
(1T) Lot code [YYWWDLL-AAA]
Example from above:
YY
year
printed 08
WW
normal calendar week
printed 01
day
printed 5 (Friday)
line identifier, if more as one
printed 1
lot identifier per day
printed 1
AAA number of the reel (example 001, 002,…, 999)
printed 001
(1P) Customer Order Code, if any, otherwise company name will be printed
(2P) Panasonic Order Code: ENW49A01A3EF (see chapter 28 Ordering Information)
(3P) Model type (see chapter 28. Ordering Information)
(9D) Date code as [YYWW]
(Q) Quantity [XXXX], variable max. 500
(HW/SW) Hardware/Software Release
27.6. TOTAL PACKAGE
moisture-sensitive print
(already exist on barrier bag)
barcode
label
barrier bag
sealed
desiccant 1) 2)
moisture indicator
barcode
label
1) quantity of desiccant according
to calculation
2) optional: desiccant placed into
the corner of the barrier bag
inner carton box
size 340 x 340 x 41 mm³
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
39 of 43
14.03.2016
28. ORDERING INFORMATION
Model Name
Brand Name
Regulatory
ENW49A01A3EF
PAN9320
FCC / IC
for US and
for Canada
Channel 1 ~ 11
2412 ~ 2462 MHz
ETSI (2)
for EU
and other
Channel 1 ~ 13
2412 ~ 2472 MHz
ENW49A01C3EF
PAN9310
ENW49A02A3EF
PAN9320
ENW49A02C3EF
PAN9310
Supported Channel
(1)
(3)
(3)
Description
MOQ
WLAN IEEE 802.11 b/g/n 2.4GHz Full Embedded
Module with ceramic chip-antenna
WLAN IEEE 802.11 b/g/n 2.4GHz Full Embedded
Module with RF bottom pad
WLAN IEEE 802.11 b/g/n 2.4GHz Full Embedded
Module with ceramic chip-antenna
WLAN IEEE 802.11 b/g/n 2.4GHz Full Embedded
Module with RF bottom pad
(4)
500
500
500
500
The PAN9320 / PAN9310 will be delivered with a pre-installed firmware, see PAN9320 Communication
[3]
[1]
Specification and PAN9320 Design Guide .
Notes:
(1) The model with Regulatory Domain FCC / IC (M/N: ENW49A01A3EF) are only intended to be used in the countries of US
and Canada because only the channels 1 ~ 11 (2412 ~ 2462 MHz) are supported in the 2.4GHz ISM band. It is not
possible to change the pre-stored Region Code in order to change the Regulatory Domain. Thus the module labeling
contains the FCC Grant ID.
(2) The model with Regulatory Domain ETSI (M/N: ENW49A02A3EF) are mainly intended to be used in European countries
because the channels 1 ~ 13 (2412 ~ 2472 MHz) are supported. The Region Code is pre-configured (using Default Config
Content in Flash memory) to Regulatory Domain ETSI and thus the module labeling doesn’t contain the FCC ID. At the
end the customer is able to change applied Region Code by his own Customer Config Content to be stored during
customer OEMs product production in the flash memory. It means the FCC Regulatory Domain can be configured as well,
but the customer has to certify the end product by itself.
(3) The models with brand name PAN9310 don’t have the Chip antenna on module. The Grant ID’s marked on module
labelling are referenced and are only valid in case of customer is applying the same antenna (listed in 31.1.5) including
the reference design described in the Design Guide [1]. In this case the customer can refer to the pre-qualified module’s
modular approval which needs finally to be approved by the certification body of regulatory authority.
(4) Abbreviation for Minimum Order Quantity (MOQ). The standard MOQ for mass production is 500 pieces, fewer only on
customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels.
29. SOFTWARE VERSIONS
The version numbers of the embedded MCU firmware and WLAN SoC firmware can be read out by UART
[3]
commands which are specified in the PAN9320 Communication Specification and listed below:
No.
Item
UART Command
Response example
MCU firmware version
get system firmware
get system firmware 0 1.9.0.1
WLAN SoC firmware version
get system wifi_ver
get system wifi_ver 0 "w8782-B0, RF878X, FP69, 14.69.12.p40"
30. ROHS DECLARATION
Declaration of environmental compatibility for supplied products:
Hereby we declare to our best present knowledge based on declaration of our suppliers that this product
does not contain the following substances which are banned by Directive 2002/95/EC (RoHS) or contains a
maximum concentration of 0.1% by weight in homogeneous materials for





Lead and lead compounds
Mercury and mercury compounds
Chromium (VI)
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0.01% by weight in homogeneous materials for

Cadmium and cadmium compounds
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
40 of 43
14.03.2016
31. REGULATORY INFORMATION
31.1. FCC FOR US
31.1.1. FCC Notice
The PAN9320, including the ceramic antenna (ENW49A01A3EF) and the PAN9310 SMD type
(ENW49A01C3EF), including with the antennas, which are listed in 31.1.5, complies with Part 15 of
the FCC Rules.
The device meets the requirements for modular transmitter approval as detailed in FCC public
Notice DA00-1407.transmitter Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause
undesired operation.
(16)
The FCC identifier for ENW49A01x3EF is FCC ID: T7V-9320
31.1.2. Caution
The FCC requires the user to be notified that any changes or modifications made to this device that
are not expressly approved by Panasonic Industrial Devices Europe GmbH may void the user's
authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection
against harmful interference in a residential installation. This equipment generates uses and can
radiate radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause harmful
interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by one or more of the following
measures:




Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
Consult the dealer or an experienced radio/TV technician for help
31.1.3. Label Requirements
The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are
met. This includes a clearly visible label (laser marking) on the outside of the OEM enclosure
specifying the appropriate Panasonic FCC identifier for this product as well as the FCC Notice
(16)
above. The FCC identifier is FCC ID: T7V-9320 for model ENW49A01x3EF .
This FCC identifier is valid for PAN9320, for details see the Chapter 28 Ordering Information. In
any case the end product must be labelled exterior with
"Contains FCC ID: T7V-9320"
31.1.4. Antenna Warning
The related model number for the device is ENW49A01C3EF (PAN9310 with SMD pad). For
details, see the Chapter 28 Ordering Information. The device is tested with a standard SMA
connector and with the antenna listed below. When integrated in the OEMs product, these fixed
antennas require installation preventing end-users from replacing them with non-approved
antennas. Any antenna not in the following table must be tested to comply with FCC Section
15.203 for unique antenna connectors and Section 15.247 for emissions. The FCC identifier for the
device with the antenna listed in chapter 31.1.5 is the same (FCC ID: T7V-9320).
16
x = „A“ for PAN9320 and x = „C“ for PAN9310 (e.g. ENW49A01A3EF  x = “A”)
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
CLASSIFICATION
SUBJECT
No.
DS-9320-2400-102
PRODUCT SPECIFICATION
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
41 of 43
14.03.2016
31.1.5. Approved Antenna List
Item
Part Number
ANT2012LL13R2400A
Manufacturer
Yageo
Frequency Band
2.4GHz
Type
Gain (dBi)
Chip-Antenna
+0.8
Note: We are able to qualify your antenna and will add to this list as that process is completed.
31.1.6. RF Exposure
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must
ensure that the approved antenna in the previous table must be installed.
The preceding statement must be included as a CAUTION statement in manuals for products
operating with the approved antennas in the previous table to alert users on FCC RF Exposure
compliance.
Any notification to the end user of installation or removal instructions about the integrated radio
module is not allowed.
The RF exposure requirements of PAN9320 with mounted ceramic chip antenna (FCC ID: T7V9320 for model ENW49A01A3EF) are fulfilled for mobile configuration. The installation of the
module is restricted to mobile host devices. Nevertheless, the PAN9320 shall be used in such a
manner that the potential for human contact during normal operation is minimized.
End users may not be provided with the module installation instructions. OEM integrators and end
users must be provided with transmitter operating conditions for satisfying RF exposure compliance.
31.2. INDUSTRY CANADA CERTIFICATION
PAN9320 and versions are licensed to meet the regulatory requirements of Industry Canada (IC),
(16)
License for M/N: ENW49A01x3EF : IC: 216Q-9320
(16)
License for M/N: ENW49A02x3EF : IC: 216Q-9320
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify
any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can
obtain Canadian information on RF exposure and compliance from www.ic.gc.ca.
This device has been designed to operate with the antennas listed in 31.1.5 above, having a
maximum gain of +0.8dBi. Antennas not included in this list or having a gain greater than +0.8dBi
are strictly prohibited for use with this device. The required antenna impedance is 50 ohms. The
antenna used for this transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.
Due to the model size the IC identifier is displayed in the installation instruction only and can’t be
displayed on the modules label due to the limited size.
31.2.1. IC Notice
The device PAN9320 and versions, for details refer to Chapter 28. Ordering Information, including
the antennas, which are listed in 31.1.5, complies with Canada RSS-GEN Rules. The device meets
the requirements for modular transmitter approval as detailed in RSS-GEN.
Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause
undesired operation.
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
42 of 43
14.03.2016
31.2.2. Labeling Requirements
The Original Equipment Manufacturer (OEM) must ensure that IC labelling requirements are met.
This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate
Panasonic IC identifier for this product as well as the IC Notice above.
(16)
The IC identifiers are:
IC: 216Q-9320 (for M/N: ENW49A01x3EF )
(16)
IC: 216Q-9320 (for M/N: ENW49A02x3EF )
This IC identifier is valid for all PAN9320, for details, see the Chapter 28 Ordering Information. In
any case the end product must be labelled exterior with:
"Contains IC: 216Q-9320”
Les fabricants d’équipements (OEM) doivent s’assurer que les obligations d’étiquetage du produit
final sont remplies. Ces obligations incluent une étiquette clairement visible à l’extérieur de
l’emballage externe, comportant l’identifiant IC du module Panasonic inclus, ainsi que la notification
ci-dessus.
(16)
Les identifiants IC sont: IC: 216Q-9320
(pour M/N: ENW49A01x3EF )
(16)
IC: 216Q-9320
(pour M/N: ENW49A02x3EF )
Ces identifiants sont valides pour tous les PAN9320 (28 Ordering Information). Dans tous les cas
les produits finaux doivent indiquer sur leur emballage externe une des mentions suivantes:
"Contient IC: 216Q-9320”
31.3. EUROPEAN R&TTE DECLARATION OF CONFORMITY
All modules described in this data sheet comply to the standards according R&TTE article:
3.1a Safety/Health: EN60950-1:2006+A11:2009+A1:2010+A12:2011+AC:2011+A2:2013
EN62311:2008
3.1b EMC:
EN 301 489-1 V1.8.1:2008-04
EN 301 489-17 V2.2.1:2012-09
3.2 Radio:
EN 300 328 V1.8.1:2012-06
As a result of the conformity assessment procedure described in Annex III of the Directive
1999/5/EC, the end-customer equipment should be labelled as follows:
The end-customer has to assure that the device has a distance of more than 20cm from the human
body under all circumstances.
The end-customer equipment must meet the actual Safety/Health requirements according R&TTE.
PAN9320 and their model versions in the specified reference design can be used in the following
countries: Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany,
Greece, Hungary, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Poland, Portugal, Slovakia,
Slovenia, Spain, Sweden, Netherland, the United Kingdom, Switzerland, and Norway.
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de
CLASSIFICATION
SUBJECT
PRODUCT SPECIFICATION
No.
DS-9320-2400-102
WI-FI IEEE 802.11 BGN FULL EMBEDDED MODULE PAGE
CUSTOMER’S CODE
PANASONIC’S CODE
PAN9320 / PAN9310
ENW49A01x3EF & ENW49A02x3EF
DATE
REV.
1.1
43 of 43
14.03.2016
32. GENERAL INFORMATION
© Panasonic Industrial Devices Europe GmbH 2015.
All rights reserved.
This product description does not lodge the claim to be complete and free of mistakes.
Please contact the related product manager in every case.
If ES samples are delivered to the customer, these samples have the status Engineering Samples. This
means, the design of this product is not yet concluded. Engineering Samples may be partially or fully
functional, and there may be differences to be published Data Sheet.
Engineering Samples are not qualified and are not to be used for reliability testing or series production.
Disclaimer:
Customer acknowledges that samples may deviate from the Data Sheet and may bear defects due to
their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic
disclaims liability for damages caused by:
 The use of the Engineering Sample other than for Evaluation Purposes, particularly the
installation or integration in another product to be sold by Customer,
 Deviation or lapse in function of Engineering Sample,
 Improper use of Engineering Samples.
Panasonic Industrial Devices Europe GmbH disclaimes any liability for consequential and incidental
damages. In case of any questions, please contact your local sales partner or the related product
manager.
33. LIFE SUPPORT POLICY
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support
appliances, devices, or systems where malfunction can reasonably be expected to result in a significant
personal injury to the user, or as a critical component in any life support device or system whose failure to
perform can be reasonably expected to cause the failure of the life support devi ce or system, or to affect
its safety or effectiveness. Customers using or selling these products for use in such applications do so at
their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages
resulting.
PANASONIC INDUSTRIAL DEVICES EUROPE GMBH
www.pideu.panasonic.de

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FCC ID Filing: T7V-9320

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