Panasonic Devices Europe EBMU Bluetooth Module User Manual PAN1320 BT2 1 PO

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Application ID	NgOPsBPM0b3KProvbs9xxg==
Document Description	15_PAN1320 UserMan_Rev1.2
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Date Submitted	2016-01-29 00:00:00
Date Available	2016-01-29 00:00:00
Creation Date	2016-01-06 14:45:24
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Document Title	PAN1320-BT2.1_PO.book
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Document Author:	hkaehler

A u g us t 2 0 1 0
ENW89814A2MF
Blue too t h Q D ID :B0 14 99 9 ( BT V2 . 1 + EDR )
Blue too t h Q D ID :B0 14 94 0 ( BT V2 . 0 + EDR )
B lu eto ot h Q D I D: B0 14 93 6 (B T V1 .2 )
PAN1320-HCI-BT2.1
I nf ine on’ s
B lu eMoon Un ive rsa l P la tf or m
W ir e le s s M o d u le s
Pr oduct O ver vie w
R e v i s i o n 1 . 2 , 2010-08-18
Edition 2010-08-18
Published by
Panasonic Industrial Devices Europe GmbH
Zeppelinstrasse 19
D-21337 Lüneburg, Germany
© 2010 Panasonic Industrial Devices Europe GmbH
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Panasonic Office in Germany or one of our Distributor or write an e-mail to wireless@eu.panasonic.com.
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Panasonic Office.
Panasonic Electronic Devices may only be used in life-support devices or systems with the express written
approval of Panasonic Devices, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
PAN1320-HCI-BT2.1
ENW89814A2MF
CONFIDENTIAL
ENW89814A2MF 12/01 BlueMoonTM Universal Platform
CONFIDENTIAL
Revision History: 2010-08-18, Revision 1.2
Previous Version: no former version where published
Page
Subjects (major changes since last revision)
Rev1.2
Initial version
Trademarks of Infineon Technologies AG
ABM™, BlueMoon™, CONVERGATE™, COSIC™, C166™, FALC™, GEMINAX™, GOLDMOS™, ISAC™,
OMNITUNE™, OMNIVIA™, PROSOC™, SEROCCO™, SICOFI™, SIEGET™, SMARTi™, SMINT™,
SOCRATES™, VINAX™, VINETIC™, VOIPRO™, X-GOLD™, XMM™, X-PMU™, XWAY™
Other Trademarks
Microsoft®, Visio®, Windows®, Windows Vista®, Visual Studio®, Win32® of Microsoft Corporation. Linux® of
Linus Torvalds. FrameMaker®, Adobe® Reader™, Adobe Audition® of Adobe Systems Incorporated. APOXI®,
COMNEON™ of Comneon GmbH & Co. OHG. PrimeCell®, RealView®, ARM®, ARM® Developer Suite™ (ADS),
Multi-ICE™, ARM1176JZ-S™, CoreSight™, Embedded Trace Macrocell™ (ETM), Thumb®, ETM9™, AMBA™,
ARM7™, ARM9™, ARM7TDMI-S™, ARM926EJ-S™ of ARM Limited. OakDSPCore®, TeakLite® DSP Core,
OCEM® of ParthusCeva Inc. IndoorGPS™, GL-20000™, GL-LN-22™ of Global Locate. mipi™ of MIPI Alliance.
CAT-iq™ of DECT Forum. MIPS™, MIPS II™, 24KEc™, MIPS32®, 24KEc™ of MIPS Technologies, Inc. Texas
Instruments®, PowerPAD™, C62x™, C55x™, VLYNQ™, Telogy Software™, TMS320C62x™, Code Composer
Studio™, SSI™ of Texas Instruments Incorporated. Bluetooth® of Bluetooth SIG, Inc. IrDA® of the Infrared Data
Association. Java™, SunOS™, Solaris™ of Sun Microsystems, Inc. Philips®, I2C-Bus® of Koninklijke Philips
Electronics N.V. Epson® of Seiko Epson Corporation. Seiko® of Kabushiki Kaisha Hattori Seiko Corporation.
Panasonic® of Matsushita Electric Industrial Co., Ltd. Murata® of Murata Manufacturing Company. Taiyo Yuden™
of Taiyo Yuden Co., Ltd. TDK® of TDK Electronics Company, Ltd. Motorola® of Motorola, Inc. National
Semiconductor®, MICROWIRE™ of National Semiconductor Corporation. IEEE® of The Institute of Electrical and
Electronics Engineers, Inc. Samsung®, OneNAND®, UtRAM® of Samsung Corporation. Toshiba® of Toshiba
Corporation. Dallas Semiconductor®, 1-Wire® of Dallas Semiconductor Corp. ISO® of the International
Organization for Standardization. IEC™ of the International Engineering Consortium. EMV™ of EMVCo, LLC.
Zetex® of Zetex Semiconductors. Microtec® of Microtec Research, Inc. Verilog® of Cadence Design Systems, Inc.
ANSI® of the American National Standards Institute, Inc. WindRiver® and VxWorks® of Wind River Systems, Inc.
Nucleus™ of Mentor Graphics Corporation. OmniVision® of OmniVision Technologies, Inc. Sharp® of Sharp
Corporation. Symbian OS® of Symbian Software Ltd. Openwave® of Openwave Systems, Inc. Maxim® of Maxim
Integrated Products, Inc. Spansion® of Spansion LLC. Micron®, CellularRAM® of Micron Technology, Inc.
RFMD® of RF Micro Devices, Inc. EPCOS® of EPCOS AG. UNIX® of The Open Group. Tektronix® of Tektronix,
Inc. Intel® of Intel Corporation. Qimonda® of Qimonda AG. 1GOneNAND® of Samsung Corporation.
HyperTerminal® of Hilgraeve, Inc. MATLAB® of The MathWorks, Inc. Red Hat® of Red Hat, Inc. Palladium® of
Cadence Design Systems, Inc. SIRIUS Satellite Radio® of SIRIUS Satellite Radio Inc. TOKO® of TOKO Inc.
The information in this document is subject to change without notice.
Last Trademarks Update 2008-11-17
Product Overview
Revision 1.2, 2010-08-18
PAN1320-HCI-BT2.1
ENW89814A2MF
CONFIDENTIAL
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.1
1.2
1.3
1.4
1.5
1.6
General Device Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Pin Configuration LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
System Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
FW version . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.1
2.2
Basic Operating Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1
3.1.1
3.1.2
3.1.2.1
3.2
3.2.1
3.3
Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HCI / UART Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supported Transport Layers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Baud Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PCM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
WLAN Coexistence Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15
15
15
15
15
17
17
19
4.1
4.2
4.3
4.3.1
General Device Capabilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
HCI+ and Bluetooth Device Data (BD_DATA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Manufacturer Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Firmware ROM Patching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Patch Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
20
20
20
20
20
5.1
5.2
5.3
5.3.1
5.3.1.1
5.3.1.2
5.3.1.3
5.3.1.4
5.3.1.5
5.3.2
5.3.2.1
5.3.2.2
5.3.3
5.3.3.1
5.3.3.2
5.3.3.3
Bluetooth Capabilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supported Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Not-supported Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAN1320-HCI Specifics and Extensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
During Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Scatternet and Piconet Capabilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Role Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Dynamic Polling Strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Adaptive Frequency Hopping (AFH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Channel Quality Driven Data Rate Change (CQDDR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Synchronous Links . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voice Coding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RSSI and Output Power Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Received Signal Strength Indication (RSSI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Power Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Ultra Low Transmit Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
21
21
21
21
21
22
22
22
22
22
22
24
24
24
24
24
6.1
6.2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Product Overview
Revision 1.2, 2010-08-18
PAN1320-HCI-BT2.1
ENW89814A2MF
CONFIDENTIAL
Table of Contents
6.3
6.3.1
6.3.2
6.3.3
6.3.4
6.4
6.4.1
6.5
6.5.1
6.5.1.1
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pad Driver and Input Stages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pull-ups and Pull-downs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Protection Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Characteristics of 32.768 kHz Clock Signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RF Part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Characteristics RF Part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bluetooth Related Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
26
26
28
28
29
29
30
30
30
30
7.1
7.2
7.2.1
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Production Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
34
34
34
35
8.1
8.2
8.3
8.4
8.5
8.6
8.7
8.8
8.9
8.10
Important Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reference Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FCC Class B Digital Devices Regulatory Notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FCC Wireless Notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FCC Interference Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
FCC Identifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
European R&TTE Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Bluetooth Qualified Design ID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Industry Canada Certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Label Design of the Host Product . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Regulatory Test House . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
36
36
37
37
38
38
38
40
40
40
40
9.1
9.2
9.3
9.4
9.4.1
9.4.2
9.4.3
9.5
9.6
9.6.1
9.6.2
9.6.2.1
9.6.2.2
9.7
9.8
9.9
9.9.1
9.9.2
Assembly Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Description of the Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Printed Circuit Board Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Solder Paste Printing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Component Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Mark . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Soldering Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Removal Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Replacement Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Alternative 1: Dispensing Solder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Alternative 2: Printing Solder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Component Salvage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voids in the Solder Joints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Expected Void Content and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parameters with an Impact on Voiding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
41
41
41
42
42
42
42
43
44
45
45
45
45
46
46
46
47
47
47
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Product Overview
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List of Figures
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12
Figure 13
Figure 14
Figure 15
Figure 16
Figure 17
Figure 18
Figure 19
Simplified Block Diagram of PAN1320-HCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Pin Configuration for PAN1320-HCI in Top View (footprint) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Example of a Bluetooth System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
HCI/UART Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
PCM_Signals_Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
WLAN Coexistence Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Package Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Production Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Top View and Bottom View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Reference Design Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Equipment Label. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Pad Layout on the Module (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Pin Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Tape on Reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Eutectic Lead-Solder Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Eutectic Leadfree-Solder Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Solder Printing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
X-ray Picture Showing Voids Conforming to IPC-A-610D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Product Overview
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List of Tables
List of Tables
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Table 7
Table 8
Table 9
Table 10
Table 11
Table 12
Table 13
Table 14
Table 15
Table 16
Table 17
Table 18
Table 19
Table 20
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
UART Baud Rates . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supported Voice Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal1 (1.5 V) Supplied Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal2 (2.5 V) Supplied Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VDDUART Supplied Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VDDPCM Supplied Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ONOFF PIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pull-up and Pull-down Currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current Consumption in Different Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Max. Load at the Different Supply Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PCM Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Timing Characteristics of PCM Interface for the First Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BDR - Transmitter Part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
BDR -Receiver Part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
EDR - Transmitter Part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
EDR -Receiver Part . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Antennas. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Product Overview
10
15
24
25
25
26
26
26
27
27
28
29
29
29
30
30
31
32
33
37
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General Device Overview
1.1
Features
General Device Overview
General
•
•
•
•
•
•
•
•
•
Complete Bluetooth 2.1 + EDR solution
– Configurable for BT 1.2 and 2.0 + EDR
Ultra low power design in 0.13 μm CMOS
Temperature range from -40°C to 85°C
Integrates ARM7TDMI, RAM and patchable ROM
On-module voltage regulators. External supply 2.9 - 4.1 V
On-module EEPROM with configuration data
Reference clock included
Low power clock from internal oscillator or external low power clock (e.g. 32.768 kHz)
Dynamic low power mode switching
Interfaces
•
•
•
•
3.25 MBaud UART with transport layer detection (HCI UART, HCI Three-Wire UART)
PCM/I2S interface for digital audio
WLAN coexistence interface
General purpose I/Os with interrupt capabilities. JTAG for boundary scan and debug
RF
•
•
•
•
•
•
•
Transmit power programmable from -45 dBm to 4.5 dBm
Transmit power typ. 2.5 dBm (default settings)
Receiver sensitivity typ. -86 dBm
Integrated antenna switch, balun and antenna filter
Integrated LNA with excellent blocking and intermodulation performance
No external components except antenna
Digital demodulation for optimum sensitivity and co-/adjacent channel performance
Bluetooth
•
•
•
•
•
•
•
•
Piconet with seven slaves. Scatternet with two slave roles while still being discoverable
SCO and eSCO with hardware accelerated audio signal processing
Audio error correction algorithm (PLC) improving speech quality
Power control and RSSI. Hold and Sniff.
Adaptive Frequency Hopping, Quality of Service, Channel Quality Driven Data Rate
Bluetooth security features: Authentication, Pairing, Encryption and Secure Simple Pairing
Bluetooth test mode
Sniff Subrating for lower Sniff power consumption
Product Overview
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1.2
General Device Overview
Block Diagram
PAN1320 -HCI-BT2.1
EEPROM
VDD_PCM
Ceramic
Antenna
I C
VDD_UART
UART - HCI
PMB8763
BlueMoon
UniCellular
PCM1
V supply
Balun
Filter
Voltage
Regulator
Crystal
26 MHz
Low Power Clock
(Optional)
32.768 kHz
Figure 1
Simplified Block Diagram of PAN1320-HCI
1.3
Pin Configuration LGA
F1
VSS
F2
P1 .2
TDI
RF_ ACTIVE
F3
P0.1 1
TX _CONF
F4
P0. 1 4
TX _CONF
F5
P0.7
UARTCTS
F6
VDDUART
F7
P0 .4
UARTTXD
F8
P0. 6
UARTRTS
F9
VSS
E1
P0. 1 2
SDAO
E2
P0. 1 3
SCL O
E3
P1.3
TDO
SL OT_STATE
E4
P0 .0
PCMFR1
E5
P0 .1
PCMCL K
E6
P0 .5
UARTRXD
E7
NC
E8
VSS
E9
VSS
D2
P0 .8
D3
P1. 1
TCK
D4
P0 .3
PCMOUT
D5
P0.2
PCMIN
D6
NC
D7
VSS
D8
VSS
D9
NC
C1
VREG
C2
P0 .9
C3
JTAG #
C4
TRST#
C5
VDDPCM
C6
NC
C7
NC
C8
VSS
C9
VSS
B1
P1.7
WAKEUP _ BT
B2
P1 .8
WAKEUP _
HOST
B3
P1 .0
TMS
B4
P1.4
RTCK
B5
ONOFF
B6
NC
B7
NC
B8
NC
B9
SL EEPX
A1
VSS
A2
P1.8
A4
VSUPPL Y
A5
VSUPPLY
A6
VSUPPL Y
A7
VSS
A8
P1. 5
CL K3 2
A9
VSS
D1
P0 .1 0
Figure 2
A3
RESET #
Pin Configuration for PAN1320-HCI in Top View (footprint)
Product Overview
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1.4
General Device Overview
Pin Description
The non-shaded cells indicate pins that will be fixed for the product lifetime. Shaded cells indicate that the pin might
be removed/changed in future variants. All pins not listed below shall be not connected.
Table 1
Pin Description
Pin
No.
Symbol
Input /
Output
Supply Voltage During
Reset
After
Reset
Function
A2
P1.6
I/O/OD
Internal1
Port 1.6
A3
RESET#
AI
Internal1
Input
Input
Hardware Reset
A8
P1.5/
CLK32
I/O/OD
Internal1
Input
Input
Port 1.5 or
LPM clock input (e.g.
32.768 kHz)
B1
P1.7/
WAKEUP_BT
I/O/OD
Internal1
PD/
Input
PD/ Input
Port 1.7 or
Bluetooth wake-up signal
B2
P1.8/
WAKEUP_HOST
I/O/OD
Internal1
PD
PD
Port 1.8 or
Host wake-up signal
B3
P1.0/
TMS
I/O/OD
Internal2
PU1)
PU1)
Port 1.0 or
JTAG interface
B4
P1.4/
RTCK
I/O/OD
Internal2
Port 1.4 or
JTAG interface
B5
ONOFF
Turns off module completely
B9
SLEEPX
I/O
VDDUART
PD
Sleep indication signal
C2
P0.9
I/O/OD
Internal2
Port 0.9
C3
JTAG#
Internal2
PU
PU
Mode selection Port 1:
0: JTAG
1: Port
C4
TRST#
Internal2
PD
PD
JTAG interface
D1
P0.10
I/O/OD
Internal2
Port 0.10
D2
P0.8
I/O/OD
Internal2
PD
PD
1)
Port 0.8
1)
D3
P1.1/
TCK
I/O/OD
Internal2
PU
D4
P0.3/
PCMOUT
I/O/OD
VDDPCM
Conf.
PD def.
Conf.
PD def.
Port 0.3 or
PCM data out
D5
P0.2/
PCMIN
I/O/OD
VDDPCM
Port 0.2 or
PCM data in
E1
P0.12/
SDA0
I/O/OD
Internal2
PU
PU
Port 0.12 or
I2C data signal
E2
P0.13/
SCL0
I/O/OD
Internal2
PU
PU
Port 0.13 or
I2C clock signal
E3
P1.3/ TDO/
SLOT_STATE
I/O/OD
Internal2
Port 1.3 or
JTAG interface or
WLAN coexistence interface
E4
P0.0/
PCMFR1
I/O/OD
VDDPCM
PD
PD
Port 0.0 or
PCM frame signal 1
Product Overview
10
PU
Port 1.1 or
JTAG interface
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Table 1
General Device Overview
Pin Description
Pin
No.
Symbol
Input /
Output
Supply Voltage During
Reset
After
Reset
Function
E5
P0.1/
PCMCLK
I/O/OD
VDDPCM
PD
PD
Port 0.1 or
PCM clock
E6
P0.5/
UARTRXD
I/O/OD
VDDUART
Port 0.5 or
UART receive data
F2
P1.2/ TDI/
RF_ACTIVE
I/O/OD
Internal2
PU1)
PU1)
Port 1.2 or
JTAG interface or
WLAN coexistence interface
F3
P0.11/
TX_CONF
I/O/OD
Internal2
Port 0.11or
WLAN coexistence interface
F4
P0.14/
TX_CONF
I/O
VDDUART
Port 0.14 or
WLAN coexistence interface
F5
P0.7/
UARTCTS
I/O/OD
VDDUART
Port 0.7 or
UART CTS flow control
F7
P0.4/
UARTTXD
I/O/OD
VDDUART
PU
PU
Port 0.4 or
UART transmit data
F8
P0.6/
UARTRTS
I/O/OD
VDDUART
PU
PU
Port 0.6 or
UART RTS flow control
A4,
A5,
A6
VSUPPLY
SI
Power supply
C1
VREG
SO
Regulated Power supply
F6
VDDUART
SI
UART interface Power supply
C5
VDDPCM
SI
PCM interface Power supply
A1,
A7,
A9,
C8,
C9,
D7,
D8,
E8,
E9,
F1,
F9
VSS
Ground
1)
Fixed pull-up/pull-down if JTAG interface is selected, not affected by any chip reset. If JTAG interface is not selected the
port is tristate.
Product Overview
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General Device Overview
Descriptions of acronyms used in the pin list:
Acronym
Description
Input
Output
OD
Output with open drain capability
Tristate
PU
Pull-up
PD
Pull-down
Analog (e.g. AI means analog input)
Supply (e.g. SO means supply output)
1.5
System Integration
PCM/ I2S
UART
PAN1320-HCI is optimized for a low bill of material (BOM) and a small PCB size. Figure 3 shows a typical
application example.
UARTRTS
UARTTXD
ANTENNA
UARTRXD
UARTCTS
PCMCLK
PCMFR1
PCMIN
PCMOUT
PAN 1320HCI-BT2.1
HOST
TX_CONF
RF_ ACTIVE
W AKEUP _HOST
WAKEUP _BT
SLOT _STATE
RESET #
WLAN
Subsystem
Power
Supply
VDDPCM
VDDUART
VDDSUP
CLK32
Optional
Bluet oot h_Syst em _Example. vsd
Figure 3
Example of a Bluetooth System
The UART interface is used for Bluetooth HCI communication between the host and PAN1320-HCI. When the HCI
UART transport layer is used, four interface lines are needed: two for data (UARTTXD and UARTRXD) and two
for hardware flow control (UARTRTS and UARTCTS). When the HCI Three-Wire UART transport layer is used the
hardware flow control lines are optional. In addition to the standard Bluetooth HCI commands, PAN1320-HCI
supports a set of Infineon specific commands called HCI+.
Digital audio can either be sent over the HCI interface or over the dedicated PCM/I2S interface. The PCM/I2S
interface is highly configurable.
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General Device Overview
Low power mode control of PAN1320-HCI and the host can be implemented in different ways, either using the
dedicated WAKEUP_HOST and WAKEUP_BT signals or using signaling over the HCI interface. The host can
reset PAN1320-HCI via the RESET# signal.
A low power clock can be connected to CLK32 or generated internally by a low power oscillator. Power is supplied
to a single VSUPPLY input from which internal regulators can generate all required voltages. The UART and the
PCM interfaces have separate supply voltages so that they can comply with host signaling.
If a WLAN subsystem is collocated with PAN1320-HCI the WLAN coexistence interface should be used to
enhance Bluetooth and WLAN performance. To coexist with external WLAN devices PAN1320-HCI supports
adaptive frequency hopping.
1.6
FW version
PAN1320-HCI is available in different versions. Please check corresponding release documents for latest
information.
Product Overview
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Basic Operating Information
Basic Operating Information
2.1
Power Supply
PAN1320-HCI is supplied from a single supply voltage VSUPPLY. This supply voltage must always be present.
The PAN1320-HCI chip is supplied from an internally generated 2.5 V supply voltage. This voltage can be
accessed from the VREG pin. This voltage may not be used for supplying other components in the host system
but can be used for referencing the host interfaces.
The PCM interface and the UART interface are supplied with dedicated, independent, reference levels via the
VDDPCM and VDDUART pins. All other digital I/O pins are supplied internally by either 2.5 V (Internal2) or 1.5
V(Internal1). Section 1.4 provides a mapping between pins and supply voltages.
The I/O power domains (VDDPCM and VDDUART) are completely separated from the other power domains and
can stay present also in low power modes.
2.2
Clocking
PAN1320-HCI has one clock input CLK32 that is optional. If used this 32.768 kHz clock must always be present
to assist PAN1320-HCI to keep the time in low power modes.
The low power clock can be generated internally by the crystal oscillator and/or the low power oscillator or provided
externally.
Product Overview
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Interfaces
Interfaces
3.1
HCI / UART Interface
The HCI/UART interface is the main communication interface between the host and PAN1320-HCI. The standard
HCI commands are supported together with an Infineon-specific set of commands called HCI+.
The interface consists of four UART signals and two wake-up signals as shown in Figure 4. Depending on which
HCI transport layer that is used, some or all of the signals are needed.
UARTTXD
UARTRXD
UARTRTS
UARTCTS
UARTTXD
UARTRXD
UARTRTS
UARTCTS
WAKEUP_BT
WAKEUP_HOST
WAKEUP_BT
WAKEUP_HOST
HCI_UART_Interface.vsd
Figure 4
HCI/UART Interface
3.1.1
Supported Transport Layers
PAN1320-HCI supports the HCI Three-Wire UART transport layer and two derivatives of the HCI UART transport
layer (HCI UART-4W and HCI UART-6W) where the only difference is how low power modes are handled.
PAN1320-HCI automatically detects which transport layer that is used by the host.
3.1.2
UART
The on-chip UART (Universal Asynchronous Receiver and Transmitter) is compatible with standard UARTs and
is optimized for Bluetooth communication. Hardware support for SLIP1) framing and 16-bit CRC calculation
enhances performance with the HCI Three-Wire UART transport layer. A separate supply voltage, VDDUART,
makes it easy to connect the UART interface to any system.
3.1.2.1
Baud Rates
The supported baud rates are listed in Table 2 together with the small deviation error that results from the internal
clock generation. The default baud rate is 115200 Baud.
Table 2
UART Baud Rates
Wanted Baud Rate
Real Baud Rate
Deviation Error (%)
9600
9615
0.16
19200
19230
0.16
1) See http://www.ietf.org/rfc/rfc1055.txt for information about SLIP.
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Table 2
Interfaces
UART Baud Rates (cont’d)
Wanted Baud Rate
Real Baud Rate
Deviation Error (%)
38400
38461
0.16
57600
57522
-0.14
115200
115044
-0.14
230400
230088
-0.14
460800
464285
0.76
921600
928571
0.76
1843200
1857142
0.76
3250000
3250000
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3.2
PCM Interface
The PCM interface is used to exchange synchronous data (usually audio) between PAN1320-HCI and the host as
well as to connect e.g. an external audio codec or an external DSP to PAN1320-HCI. It can be configured as an
industry standard PCM interface supporting long and short frame synchronization, as an I2S interface or as an
IOM-2 interface in terminal mode with reduced capabilities.
The main features of the PCM interface are:
•
•
•
•
•
•
•
•
•
•
•
•
•
Two bidirectional PCM channels
Separate supply voltage (VDDPCM) for easy interfacing to other systems
Support of 16-bit linear samples and 8-bit A-law/μ-law compressed samples as defined in the Bluetooth
specification
8 x 32-bit FIFOs for each channel
Programmable frame length
Programmable frame signal length
Programmable channel start positions
Programmable idle level on PCMOUT
Programmable low-power/inactive levels on all PCM pins
Data word LSB justified or MSB justified with respect to frame signal
Clock master/slave mode
Frame master/slave mode
Fractional divider for PCM clock generation
3.2.1
Overview
The PCM interface consists of five signals as shown in Figure 5 below.
PCMCLK
PCMOUT
PCMIN
M 1
B 4
1 1
3 2
9 8
5 4
1 S
M 1
B 4
1 1
3 2
9 8
5 4
1 S
IDLE
Don’t Care
M 1
B 4
1 1
3 2
9 8
5 4
1 S
M 1
B 4
1 1
3 2
9 8
5 4
1 S
IDLE
Don’t Care
M 1
B 4
1 1
3 2
M 1
B 4
1 1
3 2
PCMFR 1
Channel 2 Start Position
F rame Signal Length
Data W ord Length
F rame Length
PCM_Interface_ PCM_ Signals_Overview.vsd
Figure 5
PCM_Signals_Overview
The clock signal PCMCLK is the timing base for the other signals in the PCM interface. In clock master mode,
PAN1320-HCI generates PCMCLK from the internal system clock using a fractional divider. In clock slave mode
PCMCLK is an input to PAN1320-HCI and has to be supplied by an external source. The maximum PCMCLK
frequency (in both modes) is 1/8 of the internal system clock frequency.
The PCM interface supports up to two bidirectional channels. Data is transmitted on PCMOUT and received on
PCMIN, always with the most significant bit first. 16-bit linear audio samples and 8-bit A-law or μ-law compressed
audio samples are supported.
The samples are organized in frames such that each frame contains one sample in each direction of each active
channel. The frame rate (i.e. sample rate) is controlled by the PCMCLK frequency and the programmable Frame
Length. In the firmware the sample rate has been fixed to 8 kHz. This means that the PCMCLK frequency can be
calculated from Frame Length and does not have to be specified.
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Each channel has its own frame signal (PCMFR1/PCMFR2) that indicates where in the frame the channel starts.
The Frame Signal Length is programmable. The start position of PCMFR2 in the frame is also programmable
(Channel 2 Start Position). PCMFR1 always starts at the beginning of the frame.
In frame master mode, PAN1320-HCI generates PCMFR1 and PCMFR2. In frame slave mode the signal
PCMFR1 is an input to PAN1320-HCI and has to be supplied externally. PCMFR2 is still generated by PAN1320HCI. When only one channel is used PCMFR2 can be switched off with the HCI command
HCI_Infineon_Write_PCM_Mode.
In PAN1320-HCI the second PCM channel cannot be used. The on-module bluetooth controller can handle two
PCM channels but due to restrictions in the controller pinout the second PCM channel cannot be supported when
using EEPROM.
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3.3
WLAN Coexistence Interface
PAN1320-HCI has a WLAN coexistence interface that is based on the IEEE 802.15.2 Packet Traffic Arbitration
(PTA) scheme2). The interface prevents interference between collocated WLAN and Bluetooth devices by not
letting the two devices transmit and/or receive at the same time. WLAN packets and Bluetooth packets are
assigned priorities, and a control unit decides on a per-packet basis which of the devices that should be allowed
to operate.
The interface uses three wires as shown in Figure 6.
PAN1320-HCI-BT2.1
C o n tro l
U n it
Host
TX_CONF
SLOT_STATE
RF_ACTIVE
Host
W LAN_Coexistence_Interface_2 .1.vsd
Figure 6
WLAN Coexistence Interface
2) “802.15.2: Coexistence of Wireless Personal Area Networks with other Wireless Devices Operating in Unlicensed
Frequency Bands”, IEEE, 28 August 2003
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General Device Capabilities
General Device Capabilities
4.1
HCI+ and Bluetooth Device Data (BD_DATA)
In addition to the standard Bluetooth HCI commands and events, PAN1320-HCI supports a set of Infineon-specific
commands and events called HCI+. All Infineon-specific features are accessed using HCI+.
All configuration information that is critical for correct operation of PAN1320-HCI is called Bluetooth Device Data
(BD_DATA). This data is stored in the module’s EEPROM and is initialized during module manufacturing.
BD_DATA can be read and written with the HCI+ commands Infineon_Read_BD_Data and
Infineon_Write_BD_Data.
Note: Each PAN1320-HCI module is delivered with a unique Bluetooth device address in it’s BD_DATA. This
information should not be changed!
4.2
Manufacturer Mode
HCI+ commands that modify critical information are not available during normal operation. To access these
commands the host must first tell PAN1320-HCI to enter manufacturer mode with the
Infineon_Manufacturer_Mode command.
Operations that are only allowed in manufacturer mode are for example:
•
•
•
Changing the Baud rate with Infineon_Set_UART_Baudrate.
Accessing Bluetooth Device Data (BD_DATA) with any of the following commands:
Infineon_Write_BD_Data, Infineon_Read_BD_Data,
Infineon_Write_Ext_EEPROM_Data, Infineon_Read_Ext_EEPROM_Data.
Accessing internal memory and registers with
Infineon_Memory_Write and Infineon_Memory_Read.
It is necessary to leave manufacturer mode before start of normal operation. Leaving manufacturer mode is done
with the Infineon_Manufacturer_Mode command.
4.3
Firmware ROM Patching
4.3.1
Patch Support
PAN1320-HCI contains dedicated hardware that makes it possible to apply patches to any code and data in the
firmware ROM. The hardware is capable of replacing up to 32 blocks of 16 bytes each with new content. In addition
to this, an 8 kByte area of the firmware RAM has been reserved for patches. This area can be filled with any
combination of code and data.
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Bluetooth Capabilities
5.1
Supported Features
Bluetooth Capabilities
PAN1320-HCI supports all new core features in the Bluetooth 2.1 + EDR specification, including:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Enhanced Data Rate up to 3 Mbit/s
Adaptive Frequency Hopping (AFH)
All packet types
All LMP features except those related to the features listed in Chapter 5.2
Authentication, Pairing and Encryption
Secure Simple Pairing
Sniff Subrating
Extended Inquiry Response
Quality of Service
Channel Quality Driven Data Rate change
Sniff, Hold
Role Switch
RSSI and Power Control
Power class 2 and 3
7 point-to-multipoint connections
Scatternet with two slave roles while still being discoverable
2 synchronous links (SCO/eSCO)
A-law, μ-law, CVSD and transparent synchronous data
Dual SCO/eSCO channels in scatternet
5.2
•
•
•
Not-supported Features
Park State
Master Link Key
Broadcast
5.3
PAN1320-HCI Specifics and Extensions
5.3.1
During Connection
5.3.1.1
Scatternet and Piconet Capabilities
PAN1320-HCI supports point-to-multipoint and scatternet scenarios:
•
•
•
•
Up to 7 links
Up to 2 simultaneous slave roles
Always capable of responding to inquiry and remote name request
Always capable of Inquiry
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5.3.1.2
Bluetooth Capabilities
Role Switch
Only one role switch can be performed at a time. If a role switch request is pending, other role switch requests on
the same or other links are rejected. If a role switch fails, PAN1320-HCI will automatically try again a maximum of
three times. Encryption (if present) is stopped in the old piconet before a role switch is performed and re-enabled
when the role switch has succeeded or failed. If the Bluetooth 2.1 introduced feature “pause encryption” is enabled
in PAN1320-HCI and supported in the remote device, the the encryption will instead be paused before the role
switch and resumed after the role switch which leads to an atomic encryption of data throughout the role switch.
If the physical link is in Sniff Mode or Hold Mode, or has any synchronous logical transports, a role switch will not
be performed.
5.3.1.3
Dynamic Polling Strategy
In addition to the regular polling scheme, PAN1320-HCI dynamically assigns unused slots to links where data is
exchanged. This adapts very well to bursty traffic and improves throughput and latency on the links.
5.3.1.4
Adaptive Frequency Hopping (AFH)
PAN1320-HCI supports adaptive frequency hopping according to the Bluetooth 2.1 + EDR specification. AFH
switch and channel classification are supported both as master and slave. Channel classification from the host is
also supported.
A number of HCI+ commands and events are available to provide information about AFH operation. The
commands Infineon_Enable_AFH_Info_Sending and Infineon_Disable_AFH_Info_Sending turn on and off the
Infineon_AFH_Info events that provide detailed information about channel classification, channel maps,
interferers, etc.
If enabled by the Infineon_Enable_Infineon_Events command, the Infineon_AFH_Extraordinary_RSSI event
informs the host whenever extraordinary RSSI measurements in unused slots have been started. This is done
when the number of known good channels has decreased below a critical limit and periodically after a defined time.
The Infineon_Set_AFH_Measurement_Period command can be used to configure the duration of the AFH
measurement period.
5.3.1.5
Channel Quality Driven Data Rate Change (CQDDR)
PAN1320-HCI supports channel quality driven data rate change according to the Bluetooth 2.1 + EDR
specification. A device that receives an LMP_preferred_rate message is not required to follow all
recommendations. PAN1320-HCI normally at least follows the recommendation whether to use forward error
correction (FEC) or not. If possible, recommendations about packet size and modulation scheme will be taken into
account. When PAN1320-HCI sends an LMP_preferred_rate to another device the proposal always includes
preferences for all parameters.
The HCI+ commands Infineon_Enable_CQDDR_Info_Sending and Infineon_Disable_CQDDR_Info_Sending turn
on and off sending of the Infineon_CQDDR_Info event. This event provides information to the host every time a
new CQDDR proposal is sent to a remote device.
The link keys are stored in the module’s EEPROM.
5.3.2
Synchronous Links
PAN1320-HCI supports up to two simultaneous synchronous links (SCO/eSCO).
5.3.2.1
Interface
The interface for synchronous data is either the HCI transport layer or the dedicated PCM/I2S interface. The
choice of interface for a synchronous connection is done with the HCI+ command
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Bluetooth Capabilities
Infineon_Config_Synchronous_Interface and must be done before the connection is established. The default
interface is configurable via the bit Default_SCO_interface in the BD_DATA parameter BB_Conf.
All details about the PCM/I2S interface are described in Section 3.2.
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5.3.2.2
Bluetooth Capabilities
Voice Coding
Table 3 shows the supported values of the Bluetooth parameter Voice_Settings.
Table 3
Supported Voice Settings
Parameter
Supported Values
Input Coding
Linear (PCM/I2S only), μ-law, A-law
Input Data Format
2’s complement
Input Sample Size
16-bit (only relevant for linear input coding)
Air Coding Format
CVSD, μ-law, A-law, Transparent Data
Linear_PCM_Bit_Pos
Not used. Please see the parameter Channel_Pos in the
Infineon_Write_PCM_Mode command for similar functionality.
PAN1320-HCI supports transcoding between any combination of linear, μ-law and A-law. If the air coding format
is “Transparent Data” and the synchronous interface is the transport layer, the input coding is ignored. If
transparent data is sent through the PCM/I2S interface, the input coding determines if 8-bit or 16-bit samples are
used. Transparent Data is the only setting for which data rates other than 64 kbit/s can be used.
5.3.3
RSSI and Output Power Control
5.3.3.1
Received Signal Strength Indication (RSSI)
PAN1320-HCI supports received signal strength measurements and uses LMP signaling to keep the output power
of a remote device within the golden receive power range. The range is set with the BD_DATA parameters
RSSI_Min and RSSI_Max.
5.3.3.2
Output Power Control
PAN1320-HCI supports power control according to the Bluetooth 2.1+EDR specification.
•
•
•
The output power can be controlled in up to 4 configurable steps. PAN1320-HCI can work as a class 2 or 3
device, depending on the settings.
Fine tuning can be used on the power steps.
A default sub-state power step can be set
The power step configuration is set through BD_DATA parameters.
The Inquiry output power can be programmed with the Write Inquiry Transmit Power Level command introduced
in the 2.1 Bluetooth Core specification.
5.3.3.3
Ultra Low Transmit Power
For high security devices the output power can be reduced to a value that reduces the communication range to a
few inches. This mode is enabled with the HCI+ command Infineon_TX_Power_Config.
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Electrical Characteristics
Electrical Characteristics
6.1
Absolute Maximum Ratings
Table 4
Absolute Maximum Ratings
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
Storage temperature
-40
–
125
°C
–
VSUPPLY supply voltage
-0.3
–
6.0
–
VDDUART supply voltage
-0.9
–
4.0
–
VDDPCM supply voltage
-0.9
–
4.0
–
VREG
-0.3
–
4.0
VSUPPLY > 4 V
VREG
-0.3
–
VSUPPLY
VSUPPLY < 4 V
ONOFF
-0.3
–
VSUPPLY+0.3 V
Input voltage range
-0.9
–
4.0
–
Output voltage range
-0.9
–
4.0
-9
ESD
–
–
1.0
kV
According to MIL-STD883D
method 3015.7
Note: Stresses above those listed here are likely to cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage
to the integrated circuit.
Maximum ratings are not operating conditions.
6.2
Operating Conditions
Table 5
Operating Conditions
Parameter
Values
Symbol
Unit
Note / Test Condition
Min.
Typ.
Max.
Operating temperature
-40
–
85
°C
–
Main supply voltage (Vsupply)
2.9
–
4.1
–
VDDUART
1.35
–
3.6
–
VDDPCM
1.35
–
3.6
–
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Electrical Characteristics
6.3
DC Characteristics
6.3.1
Pad Driver and Input Stages
For more information, see Chapter 1.4.
Table 6
Internal1 (1.5 V) Supplied Pins
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
Input low voltage
-0.3
–
0.27
–
Input high voltage
1.15
–
3.6
–
Output low voltage
–
–
0.25
IOL = 1 mA
Output high voltage
1.1
–
–
IOH = -1 mA
–
–
mA
–
Pin Capacitance
–
–
10
pF
–
Magnitude Pin Leakage
–
0.01
μA
Input and output drivers
disabled
Continuous Load
1)
1) The totaled continuous load for all Internal1 supplied pins shall not exceed 2mA at the same time
Table 7
Internal2 (2.5 V) Supplied Pins
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
Input low voltage
-0.3
–
0.45
–
Input high voltage
1.93
–
2.8
P0.10
Input high voltage
1.93
–
3.6
Other pins
Output low voltage
–
–
0.25
IOL = 5 mA
Output low voltage
–
–
0.15
IOL = 2 mA
Output high voltage
2.0
–
–
IOH = -5 mA
Output high voltage
2.1
–
–
IOH = -2 mA
–
–
mA
–
Pin Capacitance
–
–
10
pF
–
Magnitude Pin Leakage
–
0.01
μA
Input and output drivers
disabled
Continuous Load
1)
1) The totaled continuous load for all Internal2 supplied pins shall not exceed 35 mA at the same time
Table 8
VDDUART Supplied Pins
Parameter
Values
Symbol
Unit
Note / Test Condition
Min.
Typ.
Max.
Input low voltage
-0.3
–
0.2*VDDUART
–
Input high voltage
0.7*VDDUART
–
VDDUART+0.3
P0.5/UARTRXD
Input high voltage
0.7*VDDUART
–
3.6
Other pins
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Table 8
Electrical Characteristics
VDDUART Supplied Pins (cont’d)
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
Output low voltage
–
–
0.25
IOL = 5 mA
VDDUART = 2.5 V
Output low voltage
–
–
0.15
IOL = 2 mA
VDDUART = 2.5 V
Output high voltage
VDDUART
-0.25
–
–
IOH = -5 mA
VDDUART = 2.5 V
Output high voltage
VDDUART
-0.15
–
–
IOH = -2 mA
VDDUART = 2.5 V
Continuous Load1)
–
–
mA
–
Pin Capacitance
–
–
10
pF
–
Magnitude Pin Leakage
–
0.01
μA
Input and output drivers
disabled
1) The totaled continuous load for all VDDUART supplied pins shall not exceed 35 mA at the same time
Table 9
VDDPCM Supplied Pins
Parameter
Values
Symbol
Unit
Note / Test Condition
Min.
Typ.
Max.
Input low voltage
-0.3
–
0.2*VDDPCM
–
Input high voltage
0.7*VDDPCM
–
3.6
–
Output low voltage
–
–
0.25
IOL = 5 mA
VDDPCM = 2.5 V
Output low voltage
–
–
0.15
IOL = 2 mA
VDDPCM = 2.5 V
Output high voltage
VDDPCM
-0.25
–
–
IOH = -5 mA
VDDPCM = 2.5 V
Output high voltage
VDDPCM
-0.15
–
–
IOH = -2 mA
VDDPCM = 2.5 V
Continuous Load1)
–
–
mA
–
Pin Capacitance
–
–
10
pF
–
Magnitude Pin Leakage
–
0.01
μA
Input and output drivers
disabled
1) The totaled continuous load for all VDDPCM supplied pins shall not exceed 35 mA at the same time
Table 10
ONOFF PIN
Parameter
Values
Symbol
Unit
Note / Test Condition
Min.
Typ.
Max.
Input low voltage
–
–
0.7
–
Input high voltage
1.7
–
VSUPPLY
–
Input current
-1
0.01
μA
ONOFF = 0 V
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Electrical Characteristics
6.3.2
Pull-ups and Pull-downs
Table 11
Pull-up and Pull-down Currents
Pin
Pull Up Current
Pull Down Current
Unit
Conditions
Pull-up current
measured with
pin voltage = 0 V
Min.
Typ.
Max.
Min.
Typ.
Max.
P0.12/SDA0,
P0.13/SCL0
260
740
1300
N/A
N/A
N/A
μA
TRST#, JTAG#,
P0.0/PCMFR1,
P0.1/PCMCLK,
P0.2/PCMIN,
P0.3/PCMOUT
22
130
350
23
150
380
μA
P0.4/UARTTXD,
P0.5/UARTRXD,
P0.6/UARTRTS,
P0.7/UARTCTS,
P0.10/PSEL1,
P0.8/PAON,
P0.9/PSEL0,
P0.11/RXON,
P0.14/TX_CONF,
P0.15/SLEEPX
4.2
P1.0/TMS,
P1.1/TCK,
P1.2/TDI,
P1.3/TDO,
P1.4/RTCK,
P1.5/CLK32,
P1.6,
P1.7/WAKEUP_BT,
P1.8/WAKEUP_HOST,
1.1
6.3.3
24
68
3.0
20
55
μA
Pull-down current
measured with
pin voltage =
supply voltage
Min measured at 125°C
with supply = 1.35 V
Typ. measured at 27°C
with supply = 2.5V
6.0
17
0.75
5.0
14
μA
Max measured at
-40°C with
supply = 3.63 V
Protection Circuits
All pins have an inverse protection diode against VSS.
P0.10 has an inverse diode against Internal2.
P0.5/UARTRXD has an inverse diode against VDDUART.
All other pins have no diode against their supply.
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6.3.4
Electrical Characteristics
System Power Consumption
The following table shows the Vsupply current consumption. All I/O currents are neglected since they depend
mainly on the external load. T = 25°C, Output Power = 0 dBm
Table 12
Current Consumption in Different Operating Modes
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
Ultra Low Power Mode
–
170
–
μA
–
Page & Inquiry Scan (1.28 s)
–
1.1
–
mA
–
Sniff (1.28 s)
–
0.35
–
mA
–
ACL (Transmit DH1)
–
38
–
mA
Basic Rate, 179.2 kbit/s1)
ACL (Receive DH1)
–
35
–
mA
Basic Rate, 179.2 kbit/s
ACL (Transmit 2-DH1)
–
40
–
mA
Enhanced Data Rate, 358.4 kbit/s1)
ACL (Receive 2-DH1)
–
37
–
mA
Enhanced Data Rate, 358.4 kbit/s1)
ACL (Transmit 3-DH1)
–
40
–
mA
Enhanced Data Rate, 544.0 kbit/s1)
ACL (Receive 3-DH1)
–
37
–
mA
Enhanced Data Rate, 544.0 kbit/s1)
SCO (HV3)
–
19
–
mA
–
eSCO (Symmetric 64 kbit/s, EV3)
–
20
–
mA
–
eSCO (Symmetric 64 kbit/s, 2-EV3)
–
13
–
mA
Enhanced Data Rate
eSCO (Symmetric 64 kbit/s, 3-EV3)
–
11
–
mA
Enhanced Data Rate
eSCO (Symmetric 64 kbit/s, EV5)
–
14
–
mA
–
eSCO (Symmetric 64 kbit/s, 2-EV5)
–
10
–
mA
Enhanced Data Rate
eSCO (Symmetric 64 kbit/s, 3-EV5)
–
8.7
–
mA
Enhanced Data Rate
1) Figure indicates maximum possible data rate with this packet type
I/O currents are not included since they depend mainly on external loads.
Table 13
Max. Load at the Different Supply Voltages
Parameter
Values
Symbol
Vsupply
6.4
AC Characteristics
Table 14
PCM Interface Timing
Parameter
PCMOUT delay from rising clock edge
PCMFRy setup time to falling clock edge
PCMFRy hold time from falling clock edge
Product Overview
Min.
Typ.
Max.
–
–
100
mA
Peak current
Unit
Min.
Typ. Max.
–
–
100
ns
–
–
ns
1001) –
–
ns
100
29
Note / Test Condition
Values
Symbol
td1
ts1
th1
Unit
1)
Note / Test Condition
Revision 1.2, 2010-08-18
PAN1320-HCI-BT2.1
ENW89814A2MF
CONFIDENTIAL
Table 14
Electrical Characteristics
PCM Interface Timing (cont’d)
Parameter
Symbol
ts2
th2
PCMIN setup time to falling clock edge
PCMIN hold time from falling clock edge
Values
Unit
Min.
Typ. Max.
50
–
–
ns
50
–
–
ns
Note / Test Condition
1) In frame slave mode
Table 15
Timing Characteristics of PCM Interface for the First Bit
Parameter
Symbol
Values
Min.
PCMOUT delay from PCMCLK or PCMFR1
PCMFR1 delay from PCMCLK
Typ. Max.
–
td1
td2
-0.25 T
Unit
1)
–
100
ns
–
+0.25 T
ns
Note /
Test Condition
1) T is the PCMCLK period time
6.4.1
Characteristics of 32.768 kHz Clock Signal
The 32.768 kHz clock signal applied to CLK32 must be a rectangular waveform with a duty cycle of between 10%
and 90%. The frequency accuracy must be better than 250 ppm. The rise and fall time of the signal must be less
than 10 μs.
6.5
RF Part
6.5.1
Characteristics RF Part
The characteristics involve the spread of values to be within the specific temperature range. Typical characteristics
are the median of the production.
All values refers to Infineon reference design. All values will be updated after verification/Characterisation.
6.5.1.1
Bluetooth Related Specifications
Table 16
BDR - Transmitter Part
Parameter
Values
Symbol
Unit
Note / Test Condition
Min.
Typ.
Max.
Output power (high gain)
0.5
2.5
4.5
dBm
Default settings
Output power (highest gain)
–
4.5
–
dBm
Maximum settings
Power control step size
dB
–
Frequency range fL
2400
2401.3 –
MHz
–
Frequency range fH
–
2480.7 2483.5
MHz
–
20 dB bandwidth
–
0.930
MHz
–
2nd adjacent channel power
–
-40
-20
dBm
–
3rd adjacent channel power
–
-60
-40
dBm
–
Product Overview
30
Revision 1.2, 2010-08-18
PAN1320-HCI-BT2.1
ENW89814A2MF
CONFIDENTIAL
Table 16
Electrical Characteristics
BDR - Transmitter Part (cont’d)
Parameter
Symbol
Values
Unit
Note / Test Condition
Min.
Typ.
Max.
>3rd adjacent channel power
–
-64
-40
dBm
Max. 2 of 3 exceptions @
52 MHz offset might be used
Average modulation deviation
for 00001111 sequence
140
156
175
kHz
–
Minimum modulation deviation
for 01010101 sequence
115
145
–
kHz
–
Ratio Deviation 01010101 /
Deviation 00001111
0.8
–
Initial carrier frequency
tolerance |foffset|
–
–
75
kHz
–
Carrier frequency drift
(one slot) |fdrift|
–
10
25
kHz
–
Carrier frequency drift
(three slots) |fdrift|
–
10
40
kHz
–
Carrier frequency drift
(five slots) |fdrift|
–
10
40
kHz
–
Carrier frequency driftrate
(one slot) |fdriftrate|
–
20
kHz/50 ms –
Carrier frequency driftrate
(three slots) |fdriftrate|
–
20
kHz/50 ms –
Carrier frequency driftrate
(five slots) |fdriftrate|
–
20
kHz/50 ms –
Table 17
–
BDR -Receiver Part
Parameter
Symbol
Values
Unit
Note / Test Condition
Min. Typ.
Max.
Sensitivity
–
-86
-81
dBm
Ideal wanted signal
C/I-performance:
-4th adjacent channel
–
-51
-40
dB
–
C/I-performance:
-3rd adjacent channel
(1st adj. of image)
–
-46
-20
dB
–
C/I-performance:
-2nd adjacent channel (image)
–
-35
-9
dB
–
C/I-performance:
-1st adjacent channel
–
-4
dB
–
C/I-performance: co. channel
–
11
dB
–
C/I-performance:
+1st adjacent channel
–
-4
dB
–
C/I-performance:
+2nd adjacent channel
–
-40
-30
dB
–
Product Overview
31
Revision 1.2, 2010-08-18
PAN1320-HCI-BT2.1
ENW89814A2MF
CONFIDENTIAL
Table 17
Electrical Characteristics
BDR -Receiver Part (cont’d)
Parameter
Symbol
Values
Unit
Note / Test Condition
Min. Typ.
Max.
C/I-performance:
+3rd adjacent channel
–
-50
-40
dB
–
Blocking performance
30 MHz - 2 GHz
10
–
–
dBm
Some spurious responses, but
according to BT-specification
Blocking performance
2 GHz - 2.4 GHz
-27
–
–
dBm
–
Blocking performance
2.5 GHz - 3 GHz
-27
–
–
dBm
–
Blocking performance
3 GHz - 12.75 GHz
10
–
–
dBm
Some spurious responses, but
according to BT-specification
Intermodulation performance
-39
-34
–
dBm
Valid for all intermodulation tests
Maximum input level
-20
–
–
dBm
–
Table 18
EDR - Transmitter Part
Parameter
Values
Symbol
Unit
Note / Test Condition
Min.
Typ.
Max.
Output power (high gain)
-2.5
–
dBm
Relative transmit power:
PxPSK - PGFSK
-4
-0.6
dB
Carrier frequency stability |ωi|
–
–
75
kHz
–
Carrier frequency stability |ωi+ω0|
–
–
75
kHz
–
Carrier frequency stability |ω0|
–
10
kHz
–
DPSK - RMS DEVM
–
10
20
–
8DPSK - RMS DEVM
–
10
13
–
DPSK - Peak DEVM
–
20
35
–
8DPSK - Peak DEVM
–
20
25
–
DPSK - 99% DEVM
–
–
30
–
8DPSK - 99% DEVM
–
–
20
–
Differential phase encoding
99
100
–
–
1st adjacent channel power
–
-40
-26
dBc
–
2nd adjacent channel power
–
–
-20
dBm
Carrier power measured at basic
rate
3rd adjacent channel power
–
–
-40
dBm
Carrier power measured at basic
rate
Product Overview
32
Revision 1.2, 2010-08-18
PAN1320-HCI-BT2.1
ENW89814A2MF
CONFIDENTIAL
Table 19
Electrical Characteristics
EDR -Receiver Part
Parameter
Symbol
Values
Unit
Note / Test Condition
Min. Typ.
Max.
DQPSK-Sensitivity
–
-88
-83
dBm
Ideal wanted signal
8DPSK-Sensitivityl
–
-83
-77
dBm
Ideal wanted signal
DQPSK - BER Floor Sensitivity
–
-84
-60
dBm
–
8DPSK - BER Floor Sensitivity
–
-79
-60
dBm
–
DQPSK - C/I-performance:
-4th adjacent channel
–
-53
-40
dB
–
DQPSK - C/I-performance:
-3rd adjacent channel (1st adj. of image)
–
-47
-20
dB
–
DQPSK - C/I-performance:
-2nd adjacent channel (image)
–
-31
-7
dB
–
DQPSK - C/I-performance:
-1st adjacent channel
–
-7
dB
–
DQPSK - C/I-performance:
co. channel
–
11
13
dB
–
DQPSK - C/I-performance:
+1st adjacent channel
–
-9
dB
–
DQPSK - C/I-performance:
+2nd adjacent channel
–
-44
-30
dB
–
DQPSK - C/I-performance:
+3rd adjacent channel
–
-50
-40
dB
–
8DPSK - C/I-performance:
-4th adjacent channel
–
-48
-33
dB
–
8DPSK - C/I-performance:
-3rd adjacent channel (1st adj. of image)
–
-44
-13
dB
–
8DPSK - C/I-performance:
-2nd adjacent channel (image)
–
-25
dB
–
8DPSK - C/I-performance:
-1st adjacent channel
–
-5
dB
–
8DPSK - C/I-performance:
co. channel
–
17
21
dB
–
8DPSK - C/I-performance:
+1st adjacent channel
–
-5
dB
–
8DPSK - C/I-performance:
+2nd adjacent channel
–
-36
-25
dB
–
8DPSK - C/I-performance:
+3rd adjacent channel
–
-46
-33
dB
–
Maximum input level
-20
–
–
dBm
–
Product Overview
33
Revision 1.2, 2010-08-18
PAN1320-HCI-BT2.1
ENW89814A2MF
CONFIDENTIAL
Package Information
Package Information
7.1
Package Marking
Ordering Code
Date Code
FCC ID
PAN1320 HW/SW
Version
ENW89814A2MF
YYWWDLL
FCC ID:T7VEBMU
HW – Hardware Version
SW – Software Version
Machine readable
2D bar code
Panasonic usage only ,
could be changed without
any notice
PCB
Case
Figure 7
Package Marking
7.2
Production Package
Production _Package.vsd
Figure 8
Production Package
All dimensions are in mm.
Tolerances on all outer dimensions, height, width and length, are +/- 0.2 mm.
Product Overview
34
Revision 1.2, 2010-08-18
PAN1320-HCI-BT2.1
ENW89814A2MF
CONFIDENTIAL
7.2.1
Package Information
Pin Mark
Pin 1 (A1) is marked on bottom footprint and on the top of the shield on the module according to Figure 9.
Diameter of pin 1 mark on the shield is 0.40 mm.
PAN 1320 12/01
ENW89814A2MF
0902401
FCC ID:T7VEBMU
Pin 1 marking top side
F9
F8
F7
F6
F5
F4
F3
F2
F1
E9
E8
E7
E6
E5
E4
E3
E2
E1
D9
D8
D7
D6
D5
D4
D3
D2
D1
C9
C8
C7
C6
C5
C4
C3
C2
C1
B9
B8
B7
B6
B5
B4
B3
B2
B1
A9
A8
A7
A6
A5
A4
A3
A2
A1
Pin 1 marking bottom side
Top_and _Bottom_Views.vsd
Figure 9
Top View and Bottom View
Product Overview
35
Revision 1.2, 2010-08-18
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PAN1320-HCI-BT2.1
ENW89814A2MF
CONFIDENTIAL
Important Application Information
ENW89814A2MF 12/01 is intended to be installed inside end user equipment. ENW89814A2MF 12/01 is
Bluetoooth-qualified and also FCC-certified and Industry Canada approved, and conforms to R&TTE (European)
requirements and directives with the reference design described in Figure 10. FCC certification is valid together
with the following antennas, having in mind, that this module has the Johansson antenna included:
Table 20
Antennas
Manufacturer
Model
Type
Peak antenna gain Impedance
GigAnt
Titanis
Swivel
4 dBi
50 ohm
Tyco Electronics
P/N 1513151-1
Module
4 dBi
50 ohm
Murata
LDA312G7313F-237 Ceramic chip
0 dBi
50 ohm
Printed inverted F Antenna 4 dBi
(PIFA)
50 ohm
Infineon reference design
Johansson
2450AT43A100
Ceramic chip antenna
2 dBi
50 ohm
Inwave
BST-2450
Dipole antenna
2 dBi
50 ohm
When using any of the above antennas, installed in the appropriate manner, it is possible to re-use the approvals
for the end-product. It is, however, required to have a written consent from Infineon Technologies AG to re-use
the regulatory approvals for the FCC, Canada and Europe.
Manufacturers of mobile, fixed or portable devices incorporating this device are advised to clarify any regulatory
questions and to have their complete product tested and approved for compliance (FCC or other when applicable).
When using other antennas, a “class II permissive change” is required for FCC approval. The normal procedure
is to first provide a technical test report showing that 4 dBi is not exceeded and to continue working with a
regulatory test house to finalize the approval for a new antenna implementation.
There are no parts in ENW89814A2MF 12/01 that can be modified by the user except modifications of the device
BD data and loading of SW patches. Any changes or modifications made to this device that are not expressly
approved by Infineon, may void the user’s authority to operate the equipment.
8.2
FCC Class B Digital Devices Regulatory Notice
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in
a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning the equipment off
and on, the user is encouraged to try to correct the interference by 1 or more of the following measures:
•
•
•
•
Reorient or relocate the antenna
Increase the separation between the equipment and receiver
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected
Consult the dealer or an experienced radio or television technician for help
8.3
FCC Wireless Notice
This product emits radio frequency energy, but the radiated output power of this device is far below the FCC radio
frequency exposure limits. Nevertheless, the device should be used in such a manner that the potential for human
contact with the antenna during normal operation is minimized.
To meet the FCC's RF exposure rules and regulations:
•
The system antenna used for this transmitter must not be co-located or operating in conjunction with any other
antenna or transmitter.
Product Overview
37
Revision 1.2, 2010-08-18
PAN1320-HCI-BT2.1
ENW89814A2MF
CONFIDENTIAL
•
•
Important Application Information
The system antenna used for this module must not exceed 4 dBi.
Users and installers must be provided with antenna installation instructions and transmitter operating
conditions for satisfying RF exposure compliance.
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory
questions and to have their complete product tested and approved for FCC compliance.
8.4
FCC Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference
2. This device must accept any interference received, including interference that may cause undesired operation.
The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes
a clearly visible label (laser marking) on the outside of the OEM enclosure specifying the appropriate Panasonic
FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: T7V-EBMU.
8.5
FCC Identifier
FCC ID: T7VEBMU
8.6
European R&TTE Declaration of Conformity
Hereby, Panasonic Electronic Devices Europe GmbH, declares that the Bluetooth module ENW89814A2MF 12/01
is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC.
As a result of the conformity assessment procedure described in Annex III of the Directive 1999/5/EC, the endcustomer equipment should be labelled as follows:
Figure 11
Equipment Label
PAN1320 in the specified reference design can be used in the following countries:
Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary,
Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, The
Netherlands, the United Kingdom, Switzerland, and Norway.
Product Overview
38
Revision 1.2, 2010-08-18
Panasonic
PAN1320-HCI-BT2.1
ENW89814A2MF
CONFIDENTIAL
Important Application Information
Declaration of Conformity (DoC)
1999/5/EC
We,
Panasonic Electronic Devices Europe GmbH
High Frequency Products Business Group
Zeppelinstrasse 19, 21337 Lueneburg, Germany
declare under our sole responsibility that the product:
Type of equipment:
Bluetooth 2.0+EDR Module
Brand name:
PAN1320
Model name:
ENW89814A2MF
to which this declaration relates, is in compliance with all the applicable essential
requirements, and other provisions of the European Council Directive:
1999/5/EC
Radio and Telecommunications Terminal Equipment Directive (R&TTE)
The conformity assessment procedure used for this declaration is Annex IV of this Directive.
Product compliance has been demonstrated on the basis of:
- IEC 60950-1 (2006)
-EN
-EN
-EN
-EN
301 489-1 Vl.8.1
301 489-17 V2.1.1
300 328 Vl.6.1 (2004-11)
300 328 Vl.7.1 (2006-10)
For article 3.1 (a): Health and Safety of the User
For article 3.1 (b): Electromagnetic Compatibility
For article 3.2 : Effective use of spectrum allocated
The technical contruction file is kept available at:
Panasonic Electronic Devices Europe GmbH, Zeppelinstrasse 19, 21337 Lueneburg, Germany
Issued on:
31st ofMarch 2010
Signed by the manufacturer:
(Company name)
Panasonic Electronic Devices Europe GmbH
Parmsonft.;. Electronic
(Signature)
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