Panasonic Devices Europe EM250A ZigBee module PAN4570 / ETRX2 User Manual 1

Panasonic Industrial Devices Europe GmbH ZigBee module PAN4570 / ETRX2 1

Contents

user manual

CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 1 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt Application for Production Panasonic Electronic Devices (Europe) GmbH Zeppelinstrasse 19 21337 Lüneburg Applicant / Manufacturer Hardware Germany Ember Inc. Applicant / Manufacturer Software Contents Approval for Mass Production Customer CHECKED / APPROVED: DATE: NAME: SIGNATURE: NOTE: AT LEAST ONE SET OF APPROVED SPECIFICATIONS SHOULD BE RETURNED TO THE ADDRESS OF THE ISSUING PARTY.
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 2 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt TABLE OF CONTENTS 1. Key Features...................................................................................................................4 2. Applications for the Module.............................................................................................4 3. Description of the Module................................................................................................5 3.1. On board DC Regulator .........................................................................................5 3.2. On Board reference Crystal ...................................................................................5 4. Scope of this Document ..................................................................................................6 5. History for this Document................................................................................................6 6. Terminal Layout...............................................................................................................7 7. Block Diagram...............................................................................................................10 8. Key Parts List ................................................................................................................10 9. Test Conditions .............................................................................................................10 10. Absolute Maximum Ratings...........................................................................................11 11. Operating Conditions.....................................................................................................11 12. DC Electrical Characteristics.........................................................................................12 13. A/D converter Characteristics........................................................................................13 14. AC Electrical Characteristics.........................................................................................13 15. Soldering Temperature-time profile (for reflow soldering).............................................15 15.1. For lead solder .....................................................................................................15 15.2. For lead free solder..............................................................................................15 16. Module Dimensions.......................................................................................................16 17. Foot Print of the Module................................................................................................16 18. Labeling Drawing...........................................................................................................17 19. Mechanical Requirements.............................................................................................17 20. Recommended Land Pattern ........................................................................................18 21. Software ........................................................................................................................19 22. Reliability Tests .............................................................................................................20 23. Packaging......................................................................................................................20 24. Application Notes ..........................................................................................................20 24.1. Cautions for safety ...............................................................................................20 24.2. Design engineering notes ....................................................................................21 24.3. Storage conditions ...............................................................................................22 25. Ordering Information .....................................................................................................22 26. RoHS Declaration..........................................................................................................23 27. Data Sheet Status .........................................................................................................23 28. Regulatory Information..................................................................................................24 28.1. FCC Notice ..........................................................................................................24 28.2. Caution.................................................................................................................24 28.3. Labeling Requirements ........................................................................................24
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 3 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 28.4. Antenna Warning .................................................................................................25 28.5. Approved Antenna List.........................................................................................25 28.6. RF Exposure PAN4570........................................................................................25 29. Related Documents.......................................................................................................26 30. General Information.......................................................................................................27 31. Life Support Policy ........................................................................................................27
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 4 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 1. KEY FEATURES Schlüsseleigenschaften • short range 2,4GHz ISM band IEEE802.15.4 [1] compliant transceiver • Complete system based on the ZigBeeTM compliant platform EM250 that combines the transceiver with a powerful, efficient industry proven 16-bit microprocessor with comprehensive hardware supported network-level debugging features • designed specifically for use with EmberZNet, Embers ZigBee compliant embedded mesh networking • powerful 16-bit microprocessor • 128k flash ROM and 5k of SRAM memory • high Rx sensitivity of –97dBm at 1% Packet Error Rate • 3dBm Tx maximum output power with power control over 20dB range • Small size 20mm x 26,5mm x 3,0mm • single port antenna terminal (pcb pad, U.FL socket or chip antenna versions available) • Integrated ADC module with 12-bit resolution • two 16-bit general purpose timers; one 16-bit sleep timer • 17 GPIO pins with alternate functions • two sleep modes for increased battery life • low voltage detect/reset • complies with ETSI EN300 328 and FCC part 15 2. APPLICATIONS FOR THE MODULE Anwendungen für das Modul • ZigBeeTM FFD (full functional) and RFD (reduced functional) devices working in star and mesh networks • Wireless sensor and actuator networks • Remote control and wire replacement in industrial systems • Building automation and control • Inventory and logistics management • HID (Human Interface Devices) • Toys • Home gateways
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 5 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 3. DESCRIPTION OF THE MODULE Beschreibung des Moduls PAN4570 contains the single chip EM250 [2] from Ember Inc., a 24MHz reference crystal and RF frontend circuitry optimized for best RF performance. As single ended RF output the module is available with integrated antenna or 50ohms or U.FL male socket [3] or 50 ohms pad terminal on the bottom of the module. Two additional hardware options are available on request: 3.1. ON BOARD DC REGULATOR Although the EM250 already contains a dc regulator internally, the module can be requested with an extra onboard linear low dropout (LDO) regulator. Some applications could benefit from this additional regulator because as of for example: (1) Further extension of the input voltage range or (2) Extented battery life by replacing the regulator within EM250 by a special ultra low quiescent current regulator or (3) allowing for operation on very noisy power supplies 3.2. ON BOARD REFERENCE CRYSTAL A second option that is available is an on board 32,768kHz crystal reference. This option is provided for applications that require a precision reference clock. Where a precision 32,768kHz reference is already available on the applicationboard, it could be fed to pin 4 instead and this option is not needed. Please contact the manufacturer if one of the options could be useful for your product design. PAN4570 is used for ZigBeeTM (www.zigbee.org) applications working with EmberZNetTM of Ember Inc. (www.ember.com). EmberZNetTM is a fully ZigBeeTM compliant networking stack. For code development Insight DesktopTM, a comprehensive integrated development environment (IDE) and C-language compiler toolchain from Ember Inc. is required. Insight DesktopTM is part of Ember development kits and can currently be purchased together with programming adaptors as EM250 jumpstart kit at a price of USD 2500,- directly from Ember Inc. (www.ember.com). When using ZigBeeTM technology for a product the following additional costs have to be taken into account: 1. Membership of the ZigBeeTM alliance, as least as adopter member for US$ 3500,-. 2. The cost of a ZigBeeTM product certification at a testhouse (TÜV Rheinland) ranges from approximately US$ 4000,- to US$ 10000,-, depending on the implemented software. 3. Products qualifying for ZigBeeTM certification at the ZigBeeTM alliance need a logo
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 6 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt administration fee of USD 1000,- for the first product, and USD 500,- for each additional product. For more details on ZigBeeTM software see also part 21. 4. SCOPE OF THIS DOCUMENT Umfang dieses Dokumentes This product specification applies to the ZigBee ready modem ENWCZA0xyzE. The characters xyz indicate different versions (refer to part 22 Ordering Information). The used chip is the EM250 from the US company Ember Inc. www.ember.com. Diese Produktionsunterlagen beziehen sich auf das ZigBee ready Modem ENWCZA0xyzE Die Zeichen xyz bezeichnen verschiedene Versionen (Erklärung im Kapitel 25 Ordering Information). Der verwendete ZigBee Chip ist EM250 der US Firma Ember Inc.. 5. HISTORY FOR THIS DOCUMENT Versionsverwaltung dieses Dokumentes Revision Version Date Datum Modification / Remarks Änderungen / Bemerkungen 01 19.05.2006 preliminary draft version 02 10.07.2006 ordering part number update, some minor corrections 03 27.07.2006 update chapter Labeling Drawing 04 31.07.2006 Add chapter Regulatory Information, correct chapter Block Diagram
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 7 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 6. TERMINAL LAYOUT Anschlußbelegung Top View25123456789104140393837 42 43 44 4645313029282726,5 mm20,0 mmHeight3,0 mm2647 482021222324 1918 17 1516 141311123233343536Antenna Pin No. Pin Name Pin Signal Pin Type Description 1 VBAT VBAT I module dc supply voltage 2 REG_OUT REG_OUT O output of EM250 regulator voltage VREG_OUT (1) 3 RESET RESET I reset of module 4 OSC32A OSC32A I/O 32.768kHz clock input (2) 5 OSC32B OSC32B I/O NC 6 GPIO0 GPIO0 MOSI MOSI TMR1IA.1 I/O O I I Digital I/O SPI master data out of serial controller SC2 SPI slave data in of serial controller SC2 Capture Input A of Timer 1 7 GPIO1 GPIO1 MISO MISO SDA TMR2IA.2 I/O I O I/O I Digital I/O SPI master data in of Serial Controller SC2 SPI slave data out of Serial Controller SC2 I2C data of Serial Controller SC2 Capture Input A of Timer 2 8 GPIO2 GPIO2 MSCLK MSCLK SCL I/O O I I/O Digital I/O SPI master clock of Serial Controller SC2 SPI slave clock of Serial Controller SC2 I2C clock of Serial Controller SC2
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 8 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt Pin No. Pin Name Pin Signal Pin Type Description TMR2IB.2 I Capture Input B of Timer 2 9 GPIO3 GPIO3 SSEL TMR1IB.1 I/O I I Digital I/O SPI slave select of Serial Controller SC2 Capture Input B of Timer 1 10 GPIO4 GPIO4 ADC0 PTI_EN I/O Analog O Digital I/O ADC Input 0 Frame signal of Packet Trace Interface (PTI) 11 GPIO5 GPIO5 ADC1 PTI_DATA I/O Analog O Digital I/O ADC Input 1 Data signal of Packet Trace Interface (PTI) 12 GPIO6 GPIO6 ADC2 TMR2CLK TMR1ENMSK I/O Analog I I Digital I/O ADC Input 2 External clock input of Timer 2 External enable mask of Timer 1 13 GND1 GND I/O ground 14 GPIO7 GPIO7 ADC3 REG_EN I/O Analog O Digital I/O ADC Input 3 External regulator open collector output 15 GPIO8 GPIO8 VREF_OUT TMR1CLK TMR2ENMSK IRQA I/O Analog I I I Digital I/O ADC reference output External clock input of Timer 1 External enable mask of Timer 2 External interupt source A 16 GPIO9 GPIO9 TXD MO MSDA TMR1IA.2 I/O O O I/O I Digital I/O UART transmit data of Serial Controller SC1 SPI master data out of Serial Controller SC1 I2C data of Serial Controller SC2 Capture Input A of Timer 1 17 GPIO10 GPIO10 RXD MI MSCL TMR1IB.2 I/O I I I/O I Digital I/O UART receive data of Serial Controller SC1 SPI master data in of Serial Controller SC1 I2C clock of Serial Controller SC1 Capture Input B of Timer 2 18 GPIO11 GPIO11 CTS MCLK TMR2IA.1 I/O I O I Digital I/O UART CTS handshake of Serial Controller SC1 SPI master clock of Serial Controller SC1 Capture Input A of Timer 2 19 GPIO12 GPIO12 RTS TMR2IB.1 I/O O I Digital I/O UART RTS handshake of Serial Controller SC1 Capture Input B for Timer 2 20 GPIO13 GPIO13 TMR2OA TMR1IA.3 I/O O I Digital I/O Waveform Output A of Timer 2 Capture Input A of Timer 1 21 GPIO14 GPIO14 TMR2OB TMR1IB.3 IRQB I/O O I I Digital I/O Waveform Output B of Timer 2 Capture Input B of Timer 1 External interrupt source B 22 GPIO15 GPIO15 TMR1OA TMR2IA.3 I/O O I Digital I/O Waveform Output A of Timer 1 Capture Input A of Timer 2
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 9 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt Pin No. Pin Name Pin Signal Pin Type Description IRQC I External interrupt source C 23 GPIO16 GPIO16 TMR1OB TMR2IB.3 IRQD I/O O I I Digital I/O Waveform Output B of Timer 1 Capture Input B of Timer 2 External interrupt source D 24 GND2 GND I/O ground 25 SIF_CLK SIF_CLK I Serial interface, clock (internal pull-down) 26 SIF_MISO SIF_MISO O Serial interface, master in / slave out 27 SIF_MOSI SIF_MOSI I Serial interface, master out / slave in 28 SIF_LOADB SIF_LOADB I/O Serial interface, load strobe (open-collector with internal pull-up) 29 NC NC NC do not connect 30 GND3 GND I/O ground 31 GND4 GND I/O ground 32 GND5 GND I/O ground 33 GND6 GND I/O ground 34 GND7 GND I/O ground 35 GND8 GND I/O ground 36 GND9 GND I/O ground 37 GND10 GND I/O ground 38 RF RF I/O RF input/output terminal 39 GND11 GND I/O ground 40 VC1 TX_ACTIVE O Logic-level control for external Rx/Tx switch 41 NC NC NC do not connect 42 NC NC NC do not connect 43 NC NC NC do not connect 44 NC NC NC do not connect 45 NC NC NC do not connect 46 REG_EN REG_EN I enable of integrated dc regulator (optional) 47 REG_IN REG_IN I input of integrated dc regulator (optional) 48 GND12 GND I/O ground Notes: (1) In case the onboard regulator option is mounted this pin is connected to the output voltage of the onboard regulator option and NOT to the output voltage VREG_OUT of the EM250 (2) NC if module contains an onboard 32,768kHz reference crystal (option)
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 10 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 7. BLOCK DIAGRAM Blockdiagramm 24MHz 32,768kHz(optional)EM250RF transceiver 2,4GHz16-bit XAP2b uC128kB flash / 5k RAMGPIO0 GPIO16 I / Oprogramming4 SIF LDO (optional) VBATREG_IN REG_OUTRESET RESETBALUNintegrated antenna pad U.FL socket rf terminal selection, filtering and matching circuitry 8. KEY PARTS LIST Liste der Schlüsselkomponenten Part Name Teilenummer Material Material P.W.Board Leiterplatte Glass cloth epoxide resin with gold plating FR4 mit Goldauflage Casing Deckel CuNi18Zn20 (EN) RF-IC part name RF IC Name EM250 from Ember Inc.(www.ember.com) 9. TEST CONDITIONS Meßbedingungen Measurements shall be made under room temperature and humidity unless otherwise specified. Messungen unter normalen Bedingungen, Abweichungen sind gesondert notiert. Temperature 25 ± 10°C Humidity 40 to 85%RH Temperatur 25 ± 10°C Luftfeuchtigkeit 40 to 85%RH
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 11 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 10. ABSOLUTE MAXIMUM RATINGS Absolute Grenzwerte The maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the module will result. No. Item Punkt Symbol Zeichen Absolute Maximum Ratings Absolute Grenzwerte Unit Einheit 1 Supply voltage VBAT -0.1 to +3.6 Vdc 2 Voltage on any GPIO[16:0] , SIF_CLK, SIF_MISO, SIF_MOSI, SIF_LOADB, OSC32A, OSC32B, RESET, REG_OUT Vin -0.3 to VBAT+0.3 Vdc 3 Voltage on VC1 Vin 2.0 Vdc 4 Storage temperature range Tstg -40 to +105 °C 5 Operating temperature range Top -40 to +85 °C 6 Input RF level Pmax 0 dBm 7 ESD on any pin(3) according to Human Body Model (HBM) circuit description VTHHBM ±2 kV 8 Lead temperature Löttemperatur TDeath Please see chapter 15.2 °C Notes: (3) Input must be current limited to the value specified 11. OPERATING CONDITIONS Betriebsbedingungen No. Item Condition / Remark Symbol Value Unit Min Typ Max 1 Supply voltage The typical value is recommended VDD 2.1 3.0 3.6 Vdc 2 RF Input Frequency fC 2405 2480 MHz 3 RF Input Power pIN 0 dBm 4 maximum Tx output power Tx normal mode pout 3 dBm 5 Return loss of load applied to RF terminals pin 38 or U.FL 50Ω is reference load a -10 0 dB 6 Logic Input Voltage Low VIL 0 0.2x VBAT V 7 Logic Input Voltage High VIH 0.8x VBAT VBAT V 8 SPI clock rate The typical value is recommended fSPI 12 MHz 9 Operating temperature range Top -40 +85 °C
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 12 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 12. DC ELECTRICAL CHARACTERISTICS VBAT = 3.0V, Tamb = 25°C if nothing else stated No. Item Condition / Remark Symbol Value Unit Min Typ Max 1 Module supply voltage VBAT VBAT 2.1 3.0 3.6 Vdc 2 Internal regulated core voltage connected to REG_OUT pin 2(4) VCORE 1.7 1.8 1.9 Vdc 3 Quiescent current, including internal RC oscillator(5) 1.0 uA 4 Quiescent current, including 32,768kHz oscillator(5) 1.5 uA 5 Transmit current consumption total at +3dBm maximum output power ITX 35.5 mA 6 Transmit current consumption total at +5dBm maximum output power at boost mode ITX 41.5 mA 7 Transmit current consumption total at -32dBm minimum output power IDDT 28 mA 8 Receive current consumption total IRX 35.5 mA 9 Receive current consumption total (boost mode) IRX 37.5 mA 10 External load on internal regulated core voltage connected to REG_OUT pin 2(4) IRX 2 mA 11 Input voltage for logic 0 VIL 0 0.2x VBAT Vdc 12 input voltage for logic 1 VIH 0.8x VBAT VBAT Vdc 13 Input current for logic 0 IIL -0.5 uA 14 input current for logic 1 IIH 0.5 uA 15 input pull-up resistor value RIPU 30 kΩ 16 input pull-down resistor value RIPD 30 kΩ 17 Output voltage for logic 0 VOL 0 0.18x VBAT Vdc 18 Output voltage for logic 1 VOH 0.82x VBAT VBAT Vdc 19 Output source current (standard current pad) IOHS 4 mA 20 Output sink current (standard current pad) IOLS 4 mA 21 Output source current (high current pad: GPIO[16:13] ) IOHH 8 mA 22 Output sink current (high current pad: GPIO[16:13] ) IOLH 8 mA 23 Total output current for I/O pads IOH + IOL 40 mA 24 Input voltage threshold for OSC32A 0.2 0.8x VBAT Vdc 25 Output voltage level for VC1 VVC1 0.18x VBAT 0.82x VBAT Vdc
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 13 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt (4) In case the dc regulator option is mounted REG_OUT is connected to the regulator option output instead and the internal regulated core voltage is not accessible (5) In case the dc regulator option is mounted as regulator, use the REG_EN signal from EM250 (GPIO7) and connect it to REG_EN pin 46 and to an external high ohmic pull-up resistor tied to VBAT. The purpose is that during deep sleep the open collector output of REG_EN EM250 can disable the active-high enabled regulator in order to maintain low deep sleep currents. 13. A/D CONVERTER CHARACTERISTICS No Item 1 ATD characteristics refer to datasheet EM250 part 5.5 ADC Module 2 ATD timing/performance characteristics refer to datasheet EM250 part 5.5 ADC Module 14. AC ELECTRICAL CHARACTERISTICS VBAT = 3.0V, Tamb = 25°C, measured at 50Ω terminal load at pin 38 RF or U.FL socket, for all channels number 11,12,..., 26 according to [1] No Limit Unit Receiver Min Typ Max 1 Sensitivity for 1% Packet Error Rate (PER) -85 -96 - dBm 2 Sensitivity for 1% Packet Error Rate (PER) (boost mode) -85 -97 - dBm 3 Saturation (maximum input level for correct operation, low gain) 0 - - dBm 4 Adjacent Channel Rejection (1% PER and desired signal –82dBm acc. to [1]) 35 dB 5 Alternate Channel Rejection (1% PER and desired signal –82dBm acc. to [1]) 40 dB 6 Channel Rejection for all other channels (1% PER and desired signal –82dBm acc. to [1]) 40 dB 7 802.11g rejection centered at +12MHz or –13MHz (1% PER and desired signal –82dBm acc. to [1]) 40 dB 8 Co-channel rejection (1% PER and desired signal –82dBm acc. to [1]) -6 dBc 9 Relative frequency error (2x40ppm required by [1]) -120 120 ppm 10 Relative timing error (2x40ppm required by [1]) -120 120 ppm 11 Linear RSSI range 40 dB 12 Spurious Emissions <1GHz - TBD -57 dBm 13 Spurious Emissions >1GHz - TBD -47 dBm
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 14 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt No Limit Unit Transmitter Min Typ Max 14 Output power at highest power setting normal mode 0 3 dBm 15 Output power at highest power setting boost mode 5 dBm 16 Output power at lowest power setting normal mode -32 dBm 17 Error vector magnitude 15 35 % 18 Carrier frequency error -40 40 ppm 19 PSD mask relative 3.5MHz distance from carrier -20 dB 20 PSD mask absolute 3.5MHz distance from carrier -30 dBm 21 2nd harmonic at highest power setting normal mode - -55 -30 dBm 22 3rd harmonic at highest power setting normal mode - -55 -30 dBm 23 2nd harmonic at highest power setting boost mode - -50 -30 dBm 24 3rd harmonic at highest power setting boost mode - -50 -30 dBm 25 Spurious Emissions <1GHz - < -54 -36 dBm 26 Spurious Emissions >1GHz - < -60 -30 dBm No Limit Unit Standby Min Typ Max 27 Spurious Emissions <1GHz - TBD -57 dBm 28 Spurious Emissions >1GHz - TBD -47 dBm No Limit Unit Sythesizer characteristics Min Typ Max 29 Lock time from off state, with correct VCO DAC settings 100 uS 30 Relock time, channel change or Rx/Tx turnaround 100 us No Limit Unit Power On Reset (POR) specifications Min Typ Max 31 VBAT POR release 1.0 1.2 1.4 Vdc 32 VBAT POR assert 0.5 0.6 0.7 Vdc 33 1.8Vdc (internal regulated core voltage) POR release 1.35 1.5 1.65 Vdc 34 1.8Vdc (internal regulated core voltage) POR hysteresis 0.08 0.1 0.12 Vdc
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 15 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 15. SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING) Temperatur-Zeit Profil für die Reflowlötung 15.1. FOR LEAD SOLDER Recommended temp. profile for reflow soldering Temp.[°C] Time [s] 235°C max. 220 ±5°C 200°C150 ±10°C 90 ±30s 10 ±1s 30 +20/-10s 15.2. FOR LEAD FREE SOLDER Our used temp. profile for reflow soldering Temp.[°C] Time [s] 230°C -250°C max. 220°C150°C – 190°C 90 ±30s 30 +20/-10s Reflow permissible cycle: 2 Opposite side reflow is prohibited due to module weight.
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 16 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 16. MODULE DIMENSIONS Modulabmessungen No. Item Punkt Dimension Abmessung Tolerance Toleranz Remark Bemerkung 1 Width 20.00 ± 0.20 2 Lenght 26.50 ± 0.20 3 Height 2.80 ± 0.20 With case 17. FOOT PRINT OF THE MODULE Lötpads vom Modul Top View26,5 mm20,0 mmAntenna48 x 1.004 x P1 = 0.70 40 x P2 = 0.4048 x 1.000.10 around the edgesPin 1Sign "1" on the Module (Bottom Side)Pad48 x 1.00 x 1.002.002.30 Dimensions in mm.
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 17 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 18. LABELING DRAWING Kennzeichnung des Moduls durch Label 26,5 mm20,0 mmAntennaENWCZA0xyzE0201ES0000001060602FCC ID: T7VEM250A Imprint Aufdruck Description Beschreibung ENWCZA0xyzE This is the ordering code from Panasonic, details could be found under chapter 25. Date Code Production Date Code in the format YYMMDD, e.g. 060602 02 Indication for software revision for our final test, customer are able to flash there own software. 01ES Indication for the hardware revision, ES indicates the ES status, will be removed after MP ready. 0000001 Indication for the serial number. (FCC ID: T7VEM250A) This is the FCC ID in future, should be labelled only after FCC approval. 2D-Barcode Information in the 2D-Barcode are the serial number [7 signs], the ENW-Part-Number [11 signs], identifier for the software release [2 signs], the identifier for the hardware release [2 signs] and the production date code in the format Year-Month-Day [6 signs], separated by a semicolon. The IEEE802.15.4 MAC Address [12 characters] are stored in the Ember IC EM250, therefore it could not be on the label, but must be stored in the final test report to have a reference betweeen MAC address and serial number. 19. MECHANICAL REQUIREMENTS Mechanische Anforderungen No. Item Punkt Limit Grenzwerte Condition Bedingung 1 Solderability Lötfähigkeit More than 75% of the soldering area shall be coated by solder Mehr als 75% der Lötfläche soll mit Lötpaste bedeckt sein. Reflow soldering with recommendable temperature profile 2 Resistance to soldering heat It shall be satisfied electrical requirements and not be mechanical damage Please see chapter 15.2
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 18 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 20. RECOMMENDED LAND PATTERN Empfohlenes Land Pattern Top View26,5 mm (Module Lenght)20,0 mm (Module Width)Antenna48 x 1.004 x P1 = 0.70 40 x P2 = 0.401.00Pin 1Sign "1" on the Module (Bottom Side)Pad #112 x 1.00 x 1.002.002.301.000.40 1.300.20Pad #236 x 1.00 x 1.300.201.305.05.0Restricted Area(no ground, no line)9.0Dimensions in mm. The land pattern dimensions above can serve as a guidance, but this information is given without any legal responsibility. We recommend the use of the same pad dimensions for the solder paste screen as for the copper pads, but slight different measures and shapes of the solder paste screen cutouts might be optimum depending on your soldering process, for example on the chosen solder paste screen thickness. The solder screen thickness depends on your soldering technology, we recommend 120µm to 150µm. IMPORTANT: The bottom side of PAN4570 is fully coated, nevertheless no copper, such as through hole vias, planes or tracks on your board component layer should be located below PAN4570 in order to avoid short cuts. In cases where a track or through hole via has to be located under the module it has to be kept away from PAN4570 via holes. The PAN4570 multilayer pcb contains a inner rf shielding ground plane, therefore no pcb copper plane directly below PAN4570 is needed. If the integrated antenna version of PAN4570 is used, it has to be mounted on a board with a full copper plane layer of at least 50mm x 50mm, else the radiation performance is degraded. Place the antenna on the edge of your carrier board and avoid conductive or shielding parts other than the carrier board in the near of the integrated antenna.
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 19 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 21. SOFTWARE Software Software tools In order to develop code and ZigBeeTM networks the Ember Insight Desktop Development Environment is required. This environment works with the preceeding EM2420, the EM250 and the upcoming EM260. For code development it comprises the Integrated Development Environment (IDE) named xIDE based on eclipse 3.1.0 for editing, compiling and debugging of C–applications. In addition network visualization and debugging tools are included. For programming the Ember Insight Adapter is required. This adaptor has to be linked to the computer where the Ember Insight Desktop is installed on over an Ethernet network connection. Before connecting PAN4570 to the Ember Insight Adaptor study the latest Ember Insight Adaptor documentation. The following pins of PAN4570 have to be connected to the signals on the debug connector of the Ember Insight adaptor: PAN4570 pin PAN4570 signal name Insight Adapter signal name various ground ground 1(6) VBAT 3.0Vdc 3 RESET RSTB 25 SIF_CLK SIF_CLK 26 SIF_MISO SIF_MISO 27 SIF_MOSI SIF_MOSI 28 SIF_LOADB SIF_LOADB as packet trace interface (PTI) also connect the following signals: 10 GPIO4 GPIO4 11 GPIO5 GPIO5 (6) only if the Ember Insight Adaptor is set to powering the target device PAN4570 Ember ZigBeeTM Stack EmberZNet (currently version 2.2) is the ZigBee stack provided with EM250. It supports as networking topologies true mesh, star and cluster networks. As ZigBee devices ZigBee Coordinator, ZigBee Full Fuctional Device and ZigBee End Devices are supported. For the ease of application programming EmberZNet is controlled by the application over API commands. Direct ZigBee APS layer APIs are provided for applications that require low level ZigBee control. According to [1] each ZigBee device has a unique address. This address is supplied with PAN4570 in a file containing a table with serial numbers and addresses.
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 20 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt For more information on the items above see the website of Ember Inc. (www.ember.com) and the documentation included in the Ember Insight Desktop package as part of the Ember development kits. 22. RELIABILITY TESTS Zuverlässigkeitstests The measurement should be done after exposed to room temperature and humidity for 1 hour. Die Messungen sollten erst nach einer Stunde Lagerung unter normalen Bedingungen erfolgen. No. Item Punkt Limit Grenzwerte Condition Bedingung 1 Vibration test Electrical parameter should be in specification a) Freq.:10~50Hz,Amplitude:1.5mm a) 20min. / cycle,1hrs. each of XYZ axis b) Freq.:30~100Hz, 6G b) 20min. / cycle,1hrs. each of XYZ axis 2 Shock test the same as the above Dropped onto hard wood from height of 50cm for 3 times 3 Heat cycle test the same as the above -40°C for 30min. and +85°C for 30min.; each temperature 300 cycles 4 Moisture test the same as the above +60°C, 90% RH, 300h 5 Low temp. test the same as the above -40°C, 300h 6 High temp. test the same as the above +85°C, 300h 23. PACKAGING Verpackung Will be finalized in the next revisions. 24. APPLICATION NOTES Applikationshinweise 24.1. CAUTIONS FOR SAFETY Sicherheitshinweise These specifications are intended to preserve the quality assurance of products as individual components. Before use, check and evaluate their operation when mounted on your products. Abide by these specifications, without deviation when using the products.These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 21 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt anticipated when a short circuit occurs, then at least, provide the following failsafe functions, as a minimum. (1) Ensure the safety of the whole system by installing a protection circuit and a protection device. (2) Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. 24.2. DESIGN ENGINEERING NOTES Designhinweise Heat is the major cause of shortening the life of these products. Avoid assembly and use of the target equipment in conditions where the products' temperature may exceed the maximum allowable. Failure to do so may result in degrading of the product’s functions and damage to the product. If pulses or other transient loads (a large load applied in a short time) are applied to the products, then before use, check and evaluate their operation when assembled on your products. Carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat. Carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components. If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur. These products are intended for general purpose and standard use in general electronic equipment, such as home appliances, office equipment, information and communication equipment. These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their performance and reliability under the said special conditions carefully to determine whether or not they can be used in such a manner. (1) In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. (2) In direct sunlight, outdoors, or in a dusty environment (3) In an environment where condensation occurs. (4) In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOx) If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. Mechanic stress during assembly on board and operation has to be avoived. Pressing on parts of the metal cover or fastening objects to the metal cover is not allowed.
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 22 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 24.3. STORAGE CONDITIONS Lagerbedingungen The module may not be stressed mechanically during storage. Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected: (1) Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX (2) Storage in direct sunlight (3) Storage in an environment where the temperature may be outside the range of 5°C to 35°C range, or where the humidity may be outside the 45 to 85% range. (4) Storage of the products for more than one year after the date of delivery at your company if all the above conditions (1) to (3) have been avoided. 25. ORDERING INFORMATION Ordering part number Description MOQ(7) ENWCZA02A3E (8) Engineering Sample PAN4570 PAN4570 with integrated ceramic antenna (U.FL socket will not be mounted, when the module is in mass production) 1 ENWCZA03N2E (8) Engineering Sample PAN4570 PAN4570 with U.FL male socket (ceramic antenna will not be mounted, when the module is in mass production) 1 ENWCZA04N4E (8) Engineering Sample PAN4570 PAN4570 with RF out on a SMD pad (U.FL plug and ceramic antenna will not be mounted, when the module is in mass production) 1 Notes: (7) Abbreviation for Minimum Order Quantity (MOQ) (8) As long as the module has engineering status, the sign ES are available on the label. The “Z” in the ordering part number indicates the engineering sample status. After mass production the “Z” will be changed to the “9” and the ES sign on the label will be deleted.
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 23 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 26. ROHS DECLARATION RoHS-Erklärung Declaration of environmental compatibility for supplied products: Hereby we declare to our best present knowledge based on declaration of our suppliers that this product do not contain by now the following substances which are banned by Directive 2002/95/EC (RoHS) or if contain a maximum concentration of 0,1% by weight in homogeneous materials for • Lead and lead compounds • Mercury and mercury compounds • Chromium (VI) • PBB (polybrominated biphenyl) category • PBDE (polybrominated biphenyl ether) category And a maximum concentration of 0,01% by weight in homogeneous materials for • Cadmium and cadmium compounds 27. DATA SHEET STATUS Datenblatt Status This data sheet contains data from the PRELIMINARY specification. Supplementary data will be published at a later date. Panasonic Electronic Devices (Europe) GmbH reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Please consult the most recently issued data sheet before initiating or completing a design.
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 24 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 28. REGULATORY INFORMATION 28.1. FCC NOTICE The device PAN4570, including the ceramic antenna (ENWC9A02A3E) complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) This device must accept any interference received, including interference that may cause undesired operation. 28.2. CAUTION The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Panasonic Electronic Devices Europe GmbH may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help 28.3. LABELING REQUIREMENTS The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above. The FCC identifier are FCCID: T7VEM250A. This FCC identifier is only valid for the part number ENWC9A02A3E (PAN4570 with mounted ceramic antenna). For details, please see the chapter 25. Ordering Information. The EUT is labelled with FCC ID: T7VEM250A. This Label must be visible for the user in the end product. If the module is inside of an end product, the label will not be visible. In this case the end product will be labelled exterior with "Contains FCC ID: T7VEM250A"
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 25 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 28.4. ANTENNA WARNING The related part number for this device is ENWC9A03N2E (PAN4570 with mounted connector). For details, please see the chapter 25. Ordering Information. This device will be tested with an UFL connector from company Hirose and with the antennas listed below. When integrated in the OEMs product, these fixed antennas require installation preventing end-users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and Section 15.247 for emissions. The FCC identifier for this device will be available, after a first measurement with an approved antenna. 28.5. APPROVED ANTENNA LIST Note: We are able to qualify your antenna and will add to this list as that process is completed. Item Part Number Manufacturer Frequency Band Type Gain (dBi) 1 2 28.6. RF EXPOSURE PAN4570 To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure that the approved antenna in the previous table must be installed and/or configured to operate with a separation distance of 2.5cm or more from all persons to satisfy RF Exposure compliance. The preceding statement must be included as a CAUTION statement in manuals for products operating with the approved antennas in the previous table to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of PAN4570 with mounted ceramic antenna (FCC ID: T7VEM250A) is far below the FCC radio frequency exposure limits. Nevertheless, the PAN4570 shall be used in such a manner that the potential for human contact during normal operation is minimized. The EUT meets the requirements of FCC section 15.249, even if the EUT transmitted at the maximum allowed field strength (50,000 uV/m),which the equivalent e.i.r.p would be 0.75 mW. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance.
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 26 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 29. RELATED DOCUMENTS Mitgeltende Dokumente [1] IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) [2] Data Sheet EM250, Ember Inc. (www.ember.com) [3] Data Sheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height
CLASSIFICATION Einstufung PRODUCT SPECIFICATION Produktspezifikation No. DS-4570-2400-102 REV. 04 SUBJECT Thema MODEM FOR IEEE802.15.4 (ZIGBEE) “ZigBee” Modem“ (IEEE802.15.4) PAGE Seite 27 of 27 CUSTOMER’S CODE PAN4570 PANASONIC’S CODE ENWCZA0xyzE DATE Datum 31.07.2006 HIGH FREQUENCY PRODUCTS DIVISION Module Business PANASONIC ELECTRONIC DEVICES (EUROPE) GmbH APPROVED genehmigt CHECKED geprüft DESIGNED erstellt 30. GENERAL INFORMATION Allgemeine Informationen © Panasonic Electronic Devices (Europe) GmbH 2006. All rights reserved. This product description does not lodge the claim to be complete and free of mistakes. Please contact the related product manager in every case. If we deliver samples to the customer, these samples have the status Engineering Samples. This means, the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and there may be differences to be published Data Sheet. Engineering Samples are not qualified and are not to be used for reliability testing or series production. Disclaimer: Customer acknowledges that samples may deviate from the Data Sheet and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic Electronic Devices (Europe) GmbH rejects any liability or product warranty for Engineering Samples. In particular, Panasonic Electronic Devices (Europe) GmbH disclaims liability for damages caused by • the use of the Engineering Sample other than for Evaluation Purposes, particularly the installation or integration in an other product to be sold by Customer, • deviation or lapse in function of Engineering Sample, • improper use of Engineering Samples. Panasonic Electronic Devices (Europe) GmbH disclaimes any liability for consequential and incidental damages. In case of any questions, please contact your local sales partner or the related product manager. 31. LIFE SUPPORT POLICY Politik für Lebenserhaltungssysteme This Panasonic Electronic Devices (Europe) GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Electronic Devices (Europe) GmbH for any damages resulting.

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