Panasonic Devices Europe EM250A ZigBee module PAN4570 / ETRX2 User Manual 1

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CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
1 of 27
DATE
31.07.2006
Datum
Application for Production
Applicant / Manufacturer
Hardware
Panasonic Electronic Devices (Europe) GmbH
Zeppelinstrasse 19
21337 Lüneburg
Germany
Applicant / Manufacturer
Software
Ember Inc.
Contents
Approval for Mass Production
Customer
CHECKED / APPROVED:
DATE:
NAME:
SIGNATURE:
NOTE:
AT LEAST ONE SET OF APPROVED SPECIFICATIONS SHOULD BE RETURNED TO
THE ADDRESS OF THE ISSUING PARTY.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
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CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
2 of 27
DATE
31.07.2006
Datum
TABLE OF CONTENTS
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
19.
20.
21.
22.
23.
24.
25.
26.
27.
28.
Key Features ...................................................................................................................4
Applications for the Module .............................................................................................4
Description of the Module................................................................................................5
3.1. On board DC Regulator .........................................................................................5
3.2. On Board reference Crystal ...................................................................................5
Scope of this Document ..................................................................................................6
History for this Document ................................................................................................6
Terminal Layout...............................................................................................................7
Block Diagram ...............................................................................................................10
Key Parts List ................................................................................................................10
Test Conditions .............................................................................................................10
Absolute Maximum Ratings...........................................................................................11
Operating Conditions.....................................................................................................11
DC Electrical Characteristics.........................................................................................12
A/D converter Characteristics........................................................................................13
AC Electrical Characteristics .........................................................................................13
Soldering Temperature-time profile (for reflow soldering) .............................................15
15.1. For lead solder .....................................................................................................15
15.2. For lead free solder ..............................................................................................15
Module Dimensions.......................................................................................................16
Foot Print of the Module ................................................................................................16
Labeling Drawing...........................................................................................................17
Mechanical Requirements.............................................................................................17
Recommended Land Pattern ........................................................................................18
Software ........................................................................................................................19
Reliability Tests .............................................................................................................20
Packaging......................................................................................................................20
Application Notes ..........................................................................................................20
24.1. Cautions for safety ...............................................................................................20
24.2. Design engineering notes ....................................................................................21
24.3. Storage conditions ...............................................................................................22
Ordering Information .....................................................................................................22
RoHS Declaration..........................................................................................................23
Data Sheet Status .........................................................................................................23
Regulatory Information ..................................................................................................24
28.1. FCC Notice ..........................................................................................................24
28.2. Caution.................................................................................................................24
28.3. Labeling Requirements ........................................................................................24
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
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CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
29.
30.
31.
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
3 of 27
DATE
31.07.2006
Datum
28.4. Antenna Warning .................................................................................................25
28.5. Approved Antenna List.........................................................................................25
28.6. RF Exposure PAN4570........................................................................................25
Related Documents.......................................................................................................26
General Information.......................................................................................................27
Life Support Policy ........................................................................................................27
HIGH FREQUENCY PRODUCTS DIVISION
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(EUROPE) GmbH
APPROVED
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erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
1.
KEY FEATURES
Schlüsseleigenschaften
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
2.
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
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DATE
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Datum
short range 2,4GHz ISM band IEEE802.15.4 [1] compliant transceiver
Complete system based on the ZigBeeTM compliant platform EM250 that combines the
transceiver with a powerful, efficient industry proven 16-bit microprocessor with
comprehensive hardware supported network-level debugging features
designed specifically for use with EmberZNet, Embers ZigBee compliant embedded
mesh networking
powerful 16-bit microprocessor
128k flash ROM and 5k of SRAM memory
high Rx sensitivity of –97dBm at 1% Packet Error Rate
3dBm Tx maximum output power with power control over 20dB range
Small size 20mm x 26,5mm x 3,0mm
single port antenna terminal (pcb pad, U.FL socket or chip antenna versions available)
Integrated ADC module with 12-bit resolution
two 16-bit general purpose timers; one 16-bit sleep timer
17 GPIO pins with alternate functions
two sleep modes for increased battery life
low voltage detect/reset
complies with ETSI EN300 328 and FCC part 15
APPLICATIONS FOR THE MODULE
Anwendungen für das Modul
•
•
•
•
•
•
•
•
ZigBeeTM FFD (full functional) and RFD (reduced functional) devices working in star
and mesh networks
Wireless sensor and actuator networks
Remote control and wire replacement in industrial systems
Building automation and control
Inventory and logistics management
HID (Human Interface Devices)
Toys
Home gateways
HIGH FREQUENCY PRODUCTS DIVISION
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PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
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DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
3.
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
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DATE
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Datum
DESCRIPTION OF THE MODULE
Beschreibung des Moduls
PAN4570 contains the single chip EM250 [2] from Ember Inc., a 24MHz reference crystal and
RF frontend circuitry optimized for best RF performance. As single ended RF output the module
is available with integrated antenna or 50ohms or U.FL male socket [3] or 50 ohms pad terminal
on the bottom of the module.
Two additional hardware options are available on request:
3.1. ON BOARD DC REGULATOR
Although the EM250 already contains a dc regulator internally, the module can be
requested with an extra onboard linear low dropout (LDO) regulator. Some applications
could benefit from this additional regulator because as of for example:
(1) Further extension of the input voltage range or
(2) Extented battery life by replacing the regulator within EM250 by a special ultra low
quiescent current regulator or
(3) allowing for operation on very noisy power supplies
3.2. ON BOARD REFERENCE CRYSTAL
A second option that is available is an on board 32,768kHz crystal reference. This option is
provided for applications that require a precision reference clock.
Where a precision 32,768kHz reference is already available on the applicationboard, it
could be fed to pin 4 instead and this option is not needed.
Please contact the manufacturer if one of the options could be useful for your product design.
PAN4570 is used for ZigBeeTM (www.zigbee.org) applications working with
EmberZNetTM of Ember Inc. (www.ember.com). EmberZNetTM is a fully ZigBeeTM compliant
networking stack. For code development Insight DesktopTM, a comprehensive
integrated development environment (IDE) and C-language compiler toolchain from
Ember Inc. is required. Insight DesktopTM is part of Ember development kits and
can currently be purchased together with programming adaptors as EM250 jumpstart kit at a
price of USD 2500,- directly from Ember Inc. (www.ember.com).
When using ZigBeeTM technology for a product the following additional costs have to
be taken into account:
1. Membership of the ZigBeeTM alliance, as least as adopter member for US$ 3500,-.
2. The cost of a ZigBeeTM product certification at a testhouse (TÜV Rheinland) ranges from
approximately US$ 4000,- to US$ 10000,-, depending on the implemented software.
3. Products qualifying for ZigBeeTM certification at the ZigBeeTM alliance need a logo
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
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CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
6 of 27
DATE
31.07.2006
Datum
administration fee of USD 1000,- for the first product, and USD 500,- for each additional
product.
For more details on ZigBeeTM software see also part 21.
4.
SCOPE OF THIS DOCUMENT
Umfang dieses Dokumentes
This product specification applies to the ZigBee ready modem ENWCZA0xyzE.
The characters xyz indicate different versions (refer to part 22 Ordering Information).
The used chip is the EM250 from the US company Ember Inc. www.ember.com.
Diese Produktionsunterlagen beziehen sich auf das ZigBee ready Modem ENWCZA0xyzE
Die Zeichen xyz bezeichnen verschiedene Versionen (Erklärung im Kapitel 25 Ordering
Information). Der verwendete ZigBee Chip ist EM250 der US Firma Ember Inc..
5.
HISTORY FOR THIS DOCUMENT
Versionsverwaltung dieses Dokumentes
Revision
Version
Date
Datum
Modification / Remarks
Änderungen / Bemerkungen
01
19.05.2006
preliminary draft version
02
10.07.2006
ordering part number update, some minor corrections
03
27.07.2006
update chapter Labeling Drawing
04
31.07.2006
Add chapter Regulatory Information, correct chapter Block Diagram
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
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CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
TERMINAL LAYOUT
Anschlußbelegung
26,5 mm
Antenna
24 23 22 21 20 19 18 17 16 15 14 13
20,0 mm
6.
No.
REV.
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DATE
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Datum
25
26
27
28
29
30
31
32
33
34
35
36
Top View
Height
3,0 mm
12
11
10
37 38 39 40 41 42 43 44 45 46 47 48
Pin
No.
Pin
Name
Pin
Signal
Pin
Type
Description
VBAT
VBAT
module dc supply voltage
REG_OUT
REG_OUT
output of EM250 regulator voltage VREG_OUT
RESET
RESET
reset of module
OSC32A
OSC32A
I/O
32.768kHz clock input (2)
OSC32B
OSC32B
I/O
NC
GPIO0
MOSI
MOSI
TMR1IA.1
GPIO1
MISO
MISO
SDA
TMR2IA.2
GPIO2
MSCLK
MSCLK
SCL
I/O
I/O
I/O
I/O
I/O
Digital I/O
SPI master data out of serial controller SC2
SPI slave data in of serial controller SC2
Capture Input A of Timer 1
Digital I/O
SPI master data in of Serial Controller SC2
SPI slave data out of Serial Controller SC2
I2C data of Serial Controller SC2
Capture Input A of Timer 2
Digital I/O
SPI master clock of Serial Controller SC2
SPI slave clock of Serial Controller SC2
I2C clock of Serial Controller SC2
GPIO0
GPIO1
GPIO2
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(EUROPE) GmbH
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DESIGNED
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CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
Pin
No.
Pin
Name
GPIO3
10
GPIO4
11
GPIO5
12
GPIO6
13
GND1
14
GPIO7
15
GPIO8
16
GPIO9
17
GPIO10
18
GPIO11
19
GPIO12
20
GPIO13
21
GPIO14
22
GPIO15
No.
REV.
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Datum
Pin
Signal
TMR2IB.2
Pin
Type
Capture Input B of Timer 2
GPIO3
SSEL
TMR1IB.1
GPIO4
ADC0
PTI_EN
GPIO5
ADC1
PTI_DATA
GPIO6
ADC2
TMR2CLK
TMR1ENMSK
I/O
I/O
Analog
I/O
Analog
I/O
Analog
Digital I/O
SPI slave select of Serial Controller SC2
Capture Input B of Timer 1
Digital I/O
ADC Input 0
Frame signal of Packet Trace Interface (PTI)
Digital I/O
ADC Input 1
Data signal of Packet Trace Interface (PTI)
Digital I/O
ADC Input 2
External clock input of Timer 2
External enable mask of Timer 1
GND
I/O
ground
GPIO7
ADC3
REG_EN
GPIO8
VREF_OUT
TMR1CLK
TMR2ENMSK
IRQA
GPIO9
TXD
MO
MSDA
TMR1IA.2
GPIO10
RXD
MI
MSCL
TMR1IB.2
GPIO11
CTS
MCLK
TMR2IA.1
GPIO12
RTS
TMR2IB.1
GPIO13
TMR2OA
TMR1IA.3
GPIO14
TMR2OB
TMR1IB.3
IRQB
GPIO15
TMR1OA
TMR2IA.3
I/O
Analog
I/O
Analog
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Digital I/O
ADC Input 3
External regulator open collector output
Digital I/O
ADC reference output
External clock input of Timer 1
External enable mask of Timer 2
External interupt source A
Digital I/O
UART transmit data of Serial Controller SC1
SPI master data out of Serial Controller SC1
I2C data of Serial Controller SC2
Capture Input A of Timer 1
Digital I/O
UART receive data of Serial Controller SC1
SPI master data in of Serial Controller SC1
I2C clock of Serial Controller SC1
Capture Input B of Timer 2
Digital I/O
UART CTS handshake of Serial Controller SC1
SPI master clock of Serial Controller SC1
Capture Input A of Timer 2
Digital I/O
UART RTS handshake of Serial Controller SC1
Capture Input B for Timer 2
Digital I/O
Waveform Output A of Timer 2
Capture Input A of Timer 1
Digital I/O
Waveform Output B of Timer 2
Capture Input B of Timer 1
External interrupt source B
Digital I/O
Waveform Output A of Timer 1
Capture Input A of Timer 2
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
Description
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
Pin
No.
Pin
Name
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
9 of 27
DATE
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Datum
Pin
Signal
IRQC
Pin
Type
External interrupt source C
I/O
Digital I/O
Waveform Output B of Timer 1
Capture Input B of Timer 2
External interrupt source D
Description
23
GPIO16
GPIO16
TMR1OB
TMR2IB.3
IRQD
24
GND2
GND
I/O
ground
25
SIF_CLK
SIF_CLK
Serial interface, clock (internal pull-down)
26
SIF_MISO
SIF_MISO
Serial interface, master in / slave out
27
SIF_MOSI
SIF_MOSI
Serial interface, master out / slave in
28
SIF_LOADB
SIF_LOADB
I/O
Serial interface, load strobe (open-collector with internal pull-up)
29
NC
NC
NC
do not connect
30
GND3
GND
I/O
ground
31
GND4
GND
I/O
ground
32
GND5
GND
I/O
ground
33
GND6
GND
I/O
ground
34
GND7
GND
I/O
ground
35
GND8
GND
I/O
ground
36
GND9
GND
I/O
ground
37
GND10
GND
I/O
ground
38
RF
RF
I/O
RF input/output terminal
39
GND11
GND
I/O
ground
40
VC1
TX_ACTIVE
Logic-level control for external Rx/Tx switch
41
NC
NC
NC
do not connect
42
NC
NC
NC
do not connect
43
NC
NC
NC
do not connect
44
NC
NC
NC
do not connect
45
NC
NC
NC
do not connect
46
REG_EN
REG_EN
enable of integrated dc regulator (optional)
47
REG_IN
REG_IN
input of integrated dc regulator (optional)
48
GND12
GND
I/O
ground
Notes:
(1) In case the onboard regulator option is mounted this pin is connected to the output voltage of the
onboard regulator option and NOT to the output voltage VREG_OUT of the EM250
(2) NC if module contains an onboard 32,768kHz reference crystal (option)
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
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DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
7.
No.
REV.
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04
PAGE
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DATE
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BLOCK DIAGRAM
Blockdiagramm
REG_OUT
REG_IN
VBAT
EM250
LDO
(optional)
GPIO0
I/O
integrated
antenna
RF transceiver 2,4GHz
BALUN
pad
U.FL socket
8.
RESET
rf
terminal
selection,
filtering and
matching
circuitry
24MHz
SIF
RESET
programming
32,768kHz
(optional)
KEY PARTS LIST
Liste der Schlüsselkomponenten
Part Name
Teilenummer
P.W.Board
Leiterplatte
Casing
Deckel
RF-IC part name
RF IC Name
9.
16-bit XAP2b uC
128kB flash / 5k RAM
GPIO16
Material
Material
Glass cloth epoxide resin with gold plating
FR4 mit Goldauflage
CuNi18Zn20 (EN)
EM250 from Ember Inc.(www.ember.com)
TEST CONDITIONS
Meßbedingungen
Measurements shall be made under room temperature and humidity unless otherwise specified.
Messungen unter normalen Bedingungen, Abweichungen sind gesondert notiert.
Temperature
Temperatur
25 ± 10°C
25 ± 10°C
Humidity
Luftfeuchtigkeit
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
40 to 85%RH
40 to 85%RH
APPROVED
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CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
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PAGE
Seite
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DATE
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Datum
10. ABSOLUTE MAXIMUM RATINGS
Absolute Grenzwerte
The maximum ratings may not be exceeded under any circumstances, not even momentarily
and individually, as permanent damage to the module will result.
Item
Punkt
Symbol
Zeichen
Absolute Maximum Ratings
Absolute Grenzwerte
Unit
Einheit
Supply voltage
VBAT
-0.1 to +3.6
Vdc
Voltage on any GPIO[16:0] ,
SIF_CLK, SIF_MISO,
SIF_MOSI, SIF_LOADB,
OSC32A, OSC32B, RESET,
REG_OUT
Vin
-0.3 to VBAT+0.3
Vdc
Voltage on VC1
Vin
2.0
Vdc
Storage temperature range
Tstg
-40 to +105
°C
Operating temperature range
Top
-40 to +85
°C
Input RF level
Pmax
dBm
VTHHBM
±2
kV
TDeath
Please see chapter 15.2
°C
No.
(3)
ESD on any pin according to
Human Body Model (HBM)
circuit description
Lead temperature
Löttemperatur
Notes:
(3) Input must be current limited to the value specified
11. OPERATING CONDITIONS
Betriebsbedingungen
No.
Item
Condition / Remark
The typical value
is recommended
Symbol
VDD
Supply voltage
RF Input Frequency
fC
RF Input Power
pIN
maximum Tx output power
Tx normal mode
Return loss of load applied to
RF terminals pin 38 or U.FL
50Ω is reference
load
Logic Input Voltage Low
Logic Input Voltage High
SPI clock rate
Operating temperature range
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
Value
Typ
2.1
3.0
2405
pout
VIL
VIH
The typical value is
recommended
Min
-10
APPROVED
genehmigt
3.6
Vdc
2480
MHz
dBm
dBm
dB
0.2x
VBAT
0.8x
VBAT
VBAT
12
MHz
+85
°C
fSPI
Top
Unit
Max
-40
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
12 of 27
DATE
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Datum
12. DC ELECTRICAL CHARACTERISTICS
VBAT = 3.0V, Tamb = 25°C if nothing else stated
No.
Item
Condition / Remark
Module supply voltage VBAT
Internal regulated core voltage
connected to
REG_OUT pin 2(4)
Symbol
Min
Value
Typ
VBAT
2.1
3.0
3.6
Vdc
VCORE
1.7
1.8
1.9
Vdc
1.0
uA
1.5
uA
Quiescent current, including
(5)
internal RC oscillator
Quiescent current, including
(5)
32,768kHz oscillator
total at +3dBm maximum
output power
total at +5dBm maximum
output power
at boost mode
total at -32dBm minimum
output power
ITX
Receive current consumption
total
Receive current consumption
10
External load on internal
regulated core voltage
11
Input voltage for logic 0
12
input voltage for logic 1
13
Input current for logic 0
14
Transmit current consumption
Transmit current consumption
Transmit current consumption
Unit
Max
35.5
mA
41.5
mA
28
mA
IRX
35.5
mA
total (boost mode)
IRX
37.5
mA
connected to
(4)
REG_OUT pin 2
IRX
ITX
IDDT
mA
0.2x
VBAT
Vdc
0.8x
VBAT
VBAT
Vdc
IIL
-0.5
uA
input current for logic 1
IIH
0.5
uA
15
input pull-up resistor value
RIPU
30
16
input pull-down resistor value
RIPD
30
17
Output voltage for logic 0
18
Output voltage for logic 1
19
20
21
22
23
24
25
Output source current
(standard current pad)
Output sink current
(standard current pad)
Output source current (high
current pad: GPIO[16:13] )
Output sink current (high
current pad: GPIO[16:13] )
Total output current
for I/O pads
Input voltage threshold for
OSC32A
Output voltage level for VC1
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
VIL
VIH
VOL
VOH
Vdc
0.82x
VBAT
VBAT
Vdc
mA
mA
mA
mA
40
mA
IOLS
IOHH
IOLH
IOH +
IOL
0.2
APPROVED
genehmigt
kΩ
0.18x
VBAT
IOHS
VVC1
kΩ
0.18x
VBAT
CHECKED
geprüft
0.8x
VBAT
0.82x
VBAT
Vdc
Vdc
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
13 of 27
DATE
31.07.2006
Datum
(4) In case the dc regulator option is mounted REG_OUT is connected to the regulator option output
instead and the internal regulated core voltage is not accessible
(5) In case the dc regulator option is mounted as regulator, use the REG_EN signal from EM250 (GPIO7)
and connect it to REG_EN pin 46 and to an external high ohmic pull-up resistor tied to VBAT. The
purpose is that during deep sleep the open collector output of REG_EN EM250 can disable the activehigh enabled regulator in order to maintain low deep sleep currents.
13. A/D CONVERTER CHARACTERISTICS
No
Item
ATD characteristics
refer to datasheet EM250 part 5.5 ADC Module
ATD timing/performance
characteristics
refer to datasheet EM250 part 5.5 ADC Module
14. AC ELECTRICAL CHARACTERISTICS
VBAT = 3.0V, Tamb = 25°C, measured at 50Ω terminal load at pin 38 RF or U.FL socket,
for all channels number 11,12,..., 26 according to [1]
No
10
Receiver
Sensitivity for 1% Packet Error Rate (PER)
Sensitivity for 1% Packet Error Rate (PER)
(boost mode)
Saturation (maximum input level for correct operation,
low gain)
Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Alternate Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Channel Rejection for all other channels
(1% PER and desired signal –82dBm acc. to [1])
802.11g rejection centered at +12MHz or –13MHz
(1% PER and desired signal –82dBm acc. to [1])
Co-channel rejection
(1% PER and desired signal –82dBm acc. to [1])
Relative frequency error
(2x40ppm required by [1])
Relative timing error
(2x40ppm required by [1])
Unit
Limit
Min
Typ
Max
-85
-96
dBm
-85
-97
dBm
dBm
35
dB
40
dB
40
dB
40
dB
-6
dBc
-120
120
ppm
-120
120
ppm
11
Linear RSSI range
40
12
Spurious Emissions <1GHz
TBD
-57
dBm
13
Spurious Emissions >1GHz
TBD
-47
dBm
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
dB
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No
14
15
16
Transmitter
Output power at highest power setting
normal mode
Output power at highest power setting
boost mode
Output power at lowest power setting
normal mode
17
Error vector magnitude
18
Carrier frequency error
19
20
21
22
23
24
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
14 of 27
DATE
31.07.2006
Datum
Unit
Limit
Min
Typ
dBm
dBm
-32
dBm
15
-40
PSD mask relative
3.5MHz distance from carrier
PSD mask absolute
3.5MHz distance from carrier
nd
2 harmonic at highest power setting
normal mode
rd
3 harmonic at highest power setting
normal mode
nd
2 harmonic at highest power setting
boost mode
rd
3 harmonic at highest power setting
boost mode
Max
35
40
ppm
-20
dB
-30
dBm
-55
-30
dBm
-55
-30
dBm
-50
-30
dBm
-50
-30
dBm
25
Spurious Emissions <1GHz
< -54
-36
dBm
26
Spurious Emissions >1GHz
< -60
-30
dBm
No
Standby
Limit
Min
Typ
Max
Unit
27
Spurious Emissions <1GHz
TBD
-57
dBm
28
Spurious Emissions >1GHz
TBD
-47
dBm
No
Sythesizer characteristics
Limit
Min
Unit
Typ
Max
29
Lock time from off state, with correct VCO DAC settings
100
uS
30
Relock time, channel change or Rx/Tx turnaround
100
us
No
Power On Reset (POR) specifications
Unit
Limit
Min
Typ
Max
31
VBAT POR release
1.0
1.2
1.4
Vdc
32
VBAT POR assert
0.5
0.6
0.7
Vdc
33
1.8Vdc (internal regulated core voltage) POR release
1.35
1.5
1.65
Vdc
34
1.8Vdc (internal regulated core voltage) POR hysteresis
0.08
0.1
0.12
Vdc
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
15 of 27
DATE
31.07.2006
Datum
15. SOLDERING TEMPERATURE-TIME PROFILE (FOR REFLOW SOLDERING)
Temperatur-Zeit Profil für die Reflowlötung
15.1. FOR LEAD SOLDER
Recommended temp. profile
for reflow soldering
10 ±1s
30 +20/-10s
235°C max.
Temp.[°C]
220 ±5°C
200°C
150 ±10°C
90 ±30s
Time [s]
15.2. FOR LEAD FREE SOLDER
Our used temp. profile
for reflow soldering
Temp.[°C]
30 +20/-10s
230°C -250°C max.
220°C
150°C – 190°C
90 ±30s
Time [s]
Reflow permissible cycle:
Opposite side reflow is prohibited due to module weight.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
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CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
16 of 27
DATE
31.07.2006
Datum
16. MODULE DIMENSIONS
Modulabmessungen
No.
Item
Punkt
Dimension
Abmessung
Tolerance
Toleranz
Width
20.00
± 0.20
Lenght
26.50
± 0.20
Height
2.80
± 0.20
Remark
Bemerkung
With case
17. FOOT PRINT OF THE MODULE
Lötpads vom Modul
26,5 mm
48 x 1.00
40 x P2 = 0.40
Pad
48 x 1.00 x 1.00
2.30
4 x P1 = 0.70
2.00
Top View
Pin 1
Sign "1" on the Module
(Bottom Side)
0.10 around the edges
20,0 mm
Antenna
48 x 1.00
Dimensions in mm.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
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APPROVED
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DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
17 of 27
DATE
31.07.2006
Datum
18. LABELING DRAWING
Kennzeichnung des Moduls durch Label
FCC ID: T7VEM250A
0000001
02
01ES 060602
20,0 mm
ENWCZA0xyzE
Antenna
26,5 mm
Imprint
Aufdruck
Description
Beschreibung
ENWCZA0xyzE
This is the ordering code from Panasonic, details could be found under chapter 25.
Date Code
Production Date Code in the format YYMMDD, e.g. 060602
Indication for software revision for our final test, customer are able to flash there own
software.
Indication for the hardware revision, ES indicates the ES status, will be removed after MP
ready.
02
01ES
0000001
Indication for the serial number.
(FCC ID: T7VEM250A)
This is the FCC ID in future, should be labelled only after FCC approval.
2D-Barcode
Information in the 2D-Barcode are the serial number [7 signs], the ENW-Part-Number [11
signs], identifier for the software release [2 signs], the identifier for the hardware release [2
signs] and the production date code in the format Year-Month-Day [6 signs], separated by
a semicolon.
The IEEE802.15.4 MAC Address [12 characters] are stored in the Ember IC EM250,
therefore it could not be on the label, but must be stored in the final test report to have a
reference betweeen MAC address and serial number.
19. MECHANICAL REQUIREMENTS
Mechanische Anforderungen
No.
Item
Punkt
Solderability
Lötfähigkeit
Resistance to
soldering heat
Limit
Grenzwerte
More than 75% of the soldering area shall be
coated by solder
Mehr als 75% der Lötfläche soll mit Lötpaste
bedeckt sein.
It shall be satisfied electrical requirements and
not be mechanical damage
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
Condition
Bedingung
Reflow soldering with
recommendable temperature
profile
Please see chapter 15.2
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
18 of 27
DATE
31.07.2006
Datum
26,5 mm (Module Lenght)
2.00
1.30
4 x P1 = 0.70
1.00
40 x P2 = 0.40
Pad #1
12 x 1.00 x 1.00
Pad #2
36 x 1.00 x 1.30
0.20
1.30
Top View
Pin 1
Sign "1" on the Module
(Bottom Side)
0.20
0.40
1.00
Antenna
Restricted Area
(no ground, no line)
9.0
48 x 1.00
20,0 mm (Module Width)
5.0
2.30
5.0
20. RECOMMENDED LAND PATTERN
Empfohlenes Land Pattern
Dimensions in mm.
The land pattern dimensions above can serve as a guidance, but this information is given
without any legal responsibility.
We recommend the use of the same pad dimensions for the solder paste screen as for the
copper pads, but slight different measures and shapes of the solder paste screen cutouts might
be optimum depending on your soldering process, for example on the chosen solder paste
screen thickness. The solder screen thickness depends on your soldering technology, we
recommend 120µm to 150µm.
IMPORTANT:
The bottom side of PAN4570 is fully coated, nevertheless no copper, such as through hole vias,
planes or tracks on your board component layer should be located below PAN4570 in order to
avoid short cuts. In cases where a track or through hole via has to be located under the module
it has to be kept away from PAN4570 via holes. The PAN4570 multilayer pcb contains a inner rf
shielding ground plane, therefore no pcb copper plane directly below PAN4570 is needed.
If the integrated antenna version of PAN4570 is used, it has to be mounted on a board with a
full copper plane layer of at least 50mm x 50mm, else the radiation performance is degraded.
Place the antenna on the edge of your carrier board and avoid conductive or shielding parts
other than the carrier board in the near of the integrated antenna.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
19 of 27
DATE
31.07.2006
Datum
21. SOFTWARE
Software
Software tools
In order to develop code and ZigBeeTM networks the Ember Insight Desktop Development
Environment is required. This environment works with the preceeding EM2420, the EM250 and
the upcoming EM260. For code development it comprises the Integrated Development
Environment (IDE) named xIDE based on eclipse 3.1.0 for editing, compiling and debugging of
C–applications. In addition network visualization and debugging tools are included.
For programming the Ember Insight Adapter is required. This adaptor has to be linked to the
computer where the Ember Insight Desktop is installed on over an Ethernet
network connection. Before connecting PAN4570 to the Ember Insight Adaptor study the latest
Ember Insight Adaptor documentation. The following pins of PAN4570 have to be connected to
the signals on the debug connector of the Ember Insight adaptor:
PAN4570 pin
various
PAN4570 signal name
Insight Adapter signal name
ground
ground
VBAT
3.0Vdc
RESET
RSTB
25
SIF_CLK
SIF_CLK
26
SIF_MISO
SIF_MISO
27
SIF_MOSI
SIF_MOSI
28
SIF_LOADB
SIF_LOADB
(6)
as packet trace interface (PTI) also connect the following signals:
(6)
10
GPIO4
GPIO4
11
GPIO5
GPIO5
only if the Ember Insight Adaptor is set to powering the target device PAN4570
Ember ZigBeeTM Stack
EmberZNet (currently version 2.2) is the ZigBee stack provided with EM250. It supports as
networking topologies true mesh, star and cluster networks. As ZigBee devices ZigBee
Coordinator, ZigBee Full Fuctional Device and ZigBee End Devices are supported.
For the ease of application programming EmberZNet is controlled by the application over API
commands. Direct ZigBee APS layer APIs are provided for applications that require low level
ZigBee control.
According to [1] each ZigBee device has a unique address. This address is supplied
with PAN4570 in a file containing a table with serial numbers and addresses.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
20 of 27
DATE
31.07.2006
Datum
For more information on the items above see the website of Ember Inc. (www.ember.com) and
the documentation included in the Ember Insight Desktop package as part of the Ember
development kits.
22. RELIABILITY TESTS
Zuverlässigkeitstests
The measurement should be done after exposed to room temperature and humidity for
1 hour.
Die Messungen sollten erst nach einer Stunde Lagerung unter normalen Bedingungen erfolgen.
No.
Item
Punkt
Limit
Grenzwerte
Condition
Bedingung
a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
Dropped onto hard wood from height of 50cm for
3 times
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
Vibration test
Electrical parameter should be
in specification
Shock test
the same as the above
Heat cycle test
the same as the above
Moisture test
the same as the above
+60°C, 90% RH, 300h
Low temp. test
the same as the above
-40°C, 300h
High temp. test
the same as the above
+85°C, 300h
23. PACKAGING
Verpackung
Will be finalized in the next revisions.
24. APPLICATION NOTES
Applikationshinweise
24.1. CAUTIONS FOR SAFETY
Sicherheitshinweise
These specifications are intended to preserve the quality assurance of products as
individual components.
Before use, check and evaluate their operation when mounted on your products. Abide by
these specifications, without deviation when using the products.These products may shortcircuit. If electrical shocks, smoke, fire, and/or accidents involving human life are
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
21 of 27
DATE
31.07.2006
Datum
anticipated when a short circuit occurs, then at least, provide the following failsafe
functions, as a minimum.
(1) Ensure the safety of the whole system by installing a protection circuit and a protection
device.
(2) Ensure the safety of the whole system by installing a redundant circuit or another system
to prevent a single fault causing an unsafe status.
24.2. DESIGN ENGINEERING NOTES
Designhinweise
Heat is the major cause of shortening the life of these products. Avoid assembly and use
of the target equipment in conditions where the products' temperature may exceed the
maximum allowable.
Failure to do so may result in degrading of the product’s functions and damage to the
product.
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, then before use, check and evaluate their operation when assembled on your
products.
Carefully position the products so that their heat will not burn into printed circuit boards or
affect the other components that are susceptible to heat.
Carefully locate these products so that their temperatures will not increase due to the
effects of heat generated by neighboring components.
If a vinyl-covered wire comes into contact with the products, then the cover will melt and
generate toxic gas, damaging the insulation. Never allow contact between the cover and
these products to occur.
These products are intended for general purpose and standard use in general electronic
equipment, such as home appliances, office equipment, information and communication
equipment.
These products are not intended for other uses, other than under the special conditions
shown below. Before using these products under such special conditions, check their
performance and reliability under the said special conditions carefully to determine
whether or not they can be used in such a manner.
(1) In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid
may splash.
(2) In direct sunlight, outdoors, or in a dusty environment
(3) In an environment where condensation occurs.
(4) In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2,
H2S, NH3, and NOx)
If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
Mechanic stress during assembly on board and operation has to be avoived.
Pressing on parts of the metal cover or fastening objects to the metal cover is not allowed.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
22 of 27
DATE
31.07.2006
Datum
24.3. STORAGE CONDITIONS
Lagerbedingungen
The module may not be stressed mechanically during storage.
Do not store these products in the following conditions or the performance characteristics
of the product, such as RF performance will be adversely affected:
(1) Storage in salty air or in an environment with a high concentration of corrosive gas, such
as Cl2, H2S, NH3, SO2, or NOX
(2) Storage in direct sunlight
(3) Storage in an environment where the temperature may be outside the range of 5°C to
35°C range, or where the humidity may be outside the 45 to 85% range.
(4) Storage of the products for more than one year after the date of delivery at your company
if all the above conditions (1) to (3) have been avoided.
25. ORDERING INFORMATION
Ordering part number
ENWCZA02A3E (8)
ENWCZA03N2E (8)
ENWCZA04N4E (8)
MOQ(7)
Description
Engineering Sample PAN4570
PAN4570 with integrated ceramic antenna (U.FL socket will not be
mounted, when the module is in mass production)
Engineering Sample PAN4570
PAN4570 with U.FL male socket (ceramic antenna will not be
mounted, when the module is in mass production)
Engineering Sample PAN4570
PAN4570 with RF out on a SMD pad (U.FL plug and ceramic
antenna will not be mounted, when the module is in mass
production)
Notes:
(7) Abbreviation for Minimum Order Quantity (MOQ)
(8) As long as the module has engineering status, the sign ES are available on the label.
The “Z” in the ordering part number indicates the engineering sample status. After mass production
the “Z” will be changed to the “9” and the ES sign on the label will be deleted.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
23 of 27
DATE
31.07.2006
Datum
26. ROHS DECLARATION
RoHS-Erklärung
Declaration of environmental compatibility for supplied products:
Hereby we declare to our best present knowledge based on declaration of our suppliers that this
product do not contain by now the following substances which are banned by Directive
2002/95/EC (RoHS) or if contain a maximum concentration of 0,1% by weight in homogeneous
materials for
•
•
•
•
•
Lead and lead compounds
Mercury and mercury compounds
Chromium (VI)
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0,01% by weight in homogeneous materials for
•
Cadmium and cadmium compounds
27. DATA SHEET STATUS
Datenblatt Status
This data sheet contains data from the PRELIMINARY specification. Supplementary data will be
published at a later date. Panasonic Electronic Devices (Europe) GmbH reserves the right to
change the specification without notice, in order to improve the design and supply the best
possible product.
Please consult the most recently issued data sheet before initiating or completing a design.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
24 of 27
DATE
31.07.2006
Datum
28. REGULATORY INFORMATION
28.1. FCC NOTICE
The device PAN4570, including the ceramic antenna (ENWC9A02A3E) complies with Part
15 of the FCC Rules. The device meets the requirements for modular transmitter approval
as detailed in FCC public Notice DA00-1407.transmitter
Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) This device must accept any interference received, including
interference that may cause undesired operation.
28.2. CAUTION
The FCC requires the user to be notified that any changes or modifications made to this
device that are not expressly approved by Panasonic Electronic Devices Europe GmbH
may void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This
equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications. However, there is no guarantee that interference will not occur in a
particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help
28.3. LABELING REQUIREMENTS
The Original Equipment Manufacturer (OEM) must ensure that FCC labeling requirements
are met. This includes a clearly visible label on the outside of the OEM enclosure
specifying the appropriate Panasonic FCC identifier for this product as well as the FCC
Notice above. The FCC identifier are FCCID: T7VEM250A. This FCC identifier is only
valid for the part number ENWC9A02A3E (PAN4570 with mounted ceramic antenna). For
details, please see the chapter 25. Ordering Information.
The EUT is labelled with FCC ID: T7VEM250A. This Label must be visible for the user in
the end product. If the module is inside of an end product, the label will not be visible. In
this case the end product will be labelled exterior with "Contains FCC ID: T7VEM250A"
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
25 of 27
DATE
31.07.2006
Datum
28.4. ANTENNA WARNING
The related part number for this device is ENWC9A03N2E (PAN4570 with mounted
connector). For details, please see the chapter 25. Ordering Information. This device will
be tested with an UFL connector from company Hirose and with the antennas listed below.
When integrated in the OEMs product, these fixed antennas require installation preventing
end-users from replacing them with non-approved antennas. Any antenna not in the
following table must be tested to comply with FCC Section 15.203 for unique antenna
connectors and Section 15.247 for emissions. The FCC identifier for this device will be
available, after a first measurement with an approved antenna.
28.5. APPROVED ANTENNA LIST
Note: We are able to qualify your antenna and will add to this list as that process is completed.
Item
Part Number
Manufacturer
Frequency Band
Type
Gain (dBi)
28.6. RF EXPOSURE PAN4570
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer
(OEM) must ensure that the approved antenna in the previous table must be installed
and/or configured to operate with a separation distance of 2.5cm or more from all persons
to satisfy RF Exposure compliance.
The preceding statement must be included as a CAUTION statement in manuals for
products operating with the approved antennas in the previous table to alert users on FCC
RF Exposure compliance.
Any notification to the end user of installation or removal instructions about the integrated
radio module is not allowed.
The radiated output power of PAN4570 with mounted ceramic antenna
(FCC ID: T7VEM250A) is far below the FCC radio frequency exposure limits.
Nevertheless, the PAN4570 shall be used in such a manner that the potential for human
contact during normal operation is minimized.
The EUT meets the requirements of FCC section 15.249, even if the EUT transmitted at
the maximum allowed field strength (50,000 uV/m),which the equivalent e.i.r.p would be
0.75 mW. End users may not be provided with the module installation instructions. OEM
integrators and end users must be provided with transmitter operating conditions for
satisfying RF exposure compliance.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
26 of 27
DATE
31.07.2006
Datum
29. RELATED DOCUMENTS
Mitgeltende Dokumente
[1] IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical Layer
(PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs)
[2] Data Sheet EM250, Ember Inc. (www.ember.com)
[3] Data Sheet U.FL-Series 2004.2 Hirose
Ultra Small Surface Mount Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt
CLASSIFICATION
PRODUCT SPECIFICATION
Einstufung
Produktspezifikation
SUBJECT
MODEM FOR IEEE802.15.4 (ZIGBEE)
Thema
“ZigBee” Modem“ (IEEE802.15.4)
CUSTOMER’S CODE
PANASONIC’S CODE
PAN4570
ENWCZA0xyzE
No.
REV.
DS-4570-2400-102
04
PAGE
Seite
27 of 27
DATE
31.07.2006
Datum
30. GENERAL INFORMATION
Allgemeine Informationen
© Panasonic Electronic Devices (Europe) GmbH 2006.
All rights reserved.
This product description does not lodge the claim to be complete and free of mistakes.
Please contact the related product manager in every case.
If we deliver samples to the customer, these samples have the status Engineering Samples.
This means, the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and there may be differences to be published Data Sheet.
Engineering Samples are not qualified and are not to be used for reliability testing or series
production.
Disclaimer:
Customer acknowledges that samples may deviate from the Data Sheet and may bear defects
due to their status of development and the lack of qualification mentioned above.
Panasonic Electronic Devices (Europe) GmbH rejects any liability or product warranty for
Engineering Samples. In particular, Panasonic Electronic Devices (Europe) GmbH disclaims
liability for damages caused by
• the use of the Engineering Sample other than for Evaluation Purposes, particularly the
installation or integration in an other product to be sold by Customer,
• deviation or lapse in function of Engineering Sample,
• improper use of Engineering Samples.
Panasonic Electronic Devices (Europe) GmbH disclaimes any liability for consequential and
incidental damages. In case of any questions, please contact your local sales partner or the
related product manager.
31. LIFE SUPPORT POLICY
Politik für Lebenserhaltungssysteme
This Panasonic Electronic Devices (Europe) GmbH product is not designed for use in life
support appliances, devices, or systems where malfunction can reasonably be expected to
result in a significant personal injury to the user, or as a critical component in any life support
device or system whose failure to perform can be reasonably expected to cause the failure of
the life support device or system, or to affect its safety or effectiveness. Customers using or
selling these products for use in such applications do so at their own risk and agree to fully
indemnify Panasonic Electronic Devices (Europe) GmbH for any damages resulting.
HIGH FREQUENCY PRODUCTS DIVISION
Module Business
PANASONIC ELECTRONIC DEVICES
(EUROPE) GmbH
APPROVED
genehmigt
CHECKED
geprüft
DESIGNED
erstellt

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