Philips Group Innovation Research 0031357 Philips Wi-Fi reference design User Manual Product Requirements Specification

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Date Submitted	2017-08-14 00:00:00
Date Available	2017-09-28 00:00:00
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Document Title	Product Requirements Specification_template
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Document Author:	Dungen, Wim van den

Philips Innovation Services
PInS WiFi reference design
Datasheet PInS WiFi module Draft
PRELIMINARY
3000 003 13562
FCC ID: 2AALC0031357
IC: 22799-0031357
HVIN:
3000 003
13592
COMPONENT FOR PHILIPS PRODUCT USE ONLY
CLASS NO.
1 2017-06-08
2 2017-06-29
Philips Innovation Services
WiFi HW reference Design 1.0
3000 003 1359
Approved
NAME
DATA FMT
Tmpl v2.0
Wim van den Dungen SUPERS
PDF
CHECK
DATE 2017-02-15
None
28
190
10
 KONINKLIJKE PHILIPS N.V. 2017
A4
Philips Innovation Services
Datasheet WiFi module
Printed copies are uncontrolled unless authenticated
TABLE OF CONTENT
COMPONENT FOR PHILIPS PRODUCT USE ONLY
DOCUMENT CHANGE HISTORY
INTRODUCTION
1.1
1.2
1.3
1.4
1.5
INTRODUCTION
OVERVIEW SPECIFICATIONS
FUNCTIONAL BLOCK DIAGRAM
OPEN POINTS
DEFINITIONS, ACRONYMS & ABBREVIATIONS
APPLICATIONS
INTERFACE
3.1
4 MAIN INTERFACES
ANTENNAS
10
10
11
4.1 EXTERNAL ANTENNA
4.1.1
APPROVED ANTENNA
11
11
OPERATION, STORAGE AND TRANSPORT CONDITIONS
5.1
5.2
5.3
5.4
5.5
OPERATIONAL CONDITIONS NORMAL OPERATION
OPERATIONAL CONDITIONS STORAGE
OPERATIONAL CONDITIONS TRANSPORT
ADDITIONAL CONDITIONAL SPECIFICATIONS
ENVIRONMENTAL
ARCHITECTURAL CHOICES AND CONSTRAINTS
6.1
6.2
STRATEGIC INTERFACES
STRATEGIC MODULE SIZE
GENERAL, SAFETY, LEGAL & SECURITY STANDARDS
7.1
7.2
7.3
7.3.1
7.3.2
7.3.3
7.4
7.5
7.6
GENERAL STANDARDS
CONTAMINATION
FCC, IC, SRRC, ETSI COMPLIANCE
IC COMPLIANCE
CONFORMITÉ AUX NORMES D’INDUSTRIE CANADA
FCC STATEMENT
INSTALLATION INSTRUCTION
LABEL REQUIREMENTS FOR END PRODUCT
UL COMPLIANCE
SPECIFICATIONS
8.1
8.2
8.3
8.4
MECHANICAL
ELECTRICAL
TYPICAL VALUES
COMMUNICATION
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8.5
8.6
8.7
ABSOLUTE MAXIMUM RATINGS
MODULE LEVEL RECOMMENDED MAXIMUM RATINGS
ELECTROSTATIC DISCHARGE SPECIFICATIONS
RF CHARACTERISTICS
21
10
RELIABILITY
22
11
REFLOW PROFILE
22
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11.1
11.2
19
19
20
TYPICAL PROFILE
MEASURED REFLOW PROFILE DURING TEST RUNS
22
22
12
FOOTPRINT DETAILS
23
13
ORDERING INFORMATION
26
13.1
13.2
13.3
14
ORDERING VARIANT OF MODULE, PRODUCT SPECIFIC
COMMON PINS HW VARIANT, PCBA 12NC ORDERING INFORMATION
MODULE LABELING
REFERENCES
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Datasheet WiFi module
DOCUMENT CHANGE HISTORY
Person
Wim van den Dungen
Wim van den Dungen
Wim van den Dungen
Wim van den Dungen
Wim van den Dungen
Wim van den Dungen
Ioannis Pappous
Version
0.1
0.2
0.9
0.91
0.92
0.93
0.94
21-06-2017
Luc Tan
1.0
Printed copies are uncontrolled unless authenticated
Date
15-02-2017
29-03-2017
31-03-2017
03-04-2017
14-04-2017
14-04-2017
02-06-2017
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Reason
First draft
Cleanup and added details
Proposed for release
Added footprint information
Minor updates MSL level, Footprint
Minor updates, explaining MSL level and WoW
Added information about standards compliance.
Update labeling, added external antenna
information. Layout schematics included. Added
missing information. Document reorganized
Release the document
 Add country settings.
 State that China regulation is under
development.
 Update external antenna directivity.
 Update FCC ID and IC ID.
 Clarify the 12 variants
 Use full 12NC not 11NC+x
 Add HVIN:
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Datasheet WiFi module
1 Introduction
1.1
Introduction
PInS WiFi module V1.0 is a PCB Wi-Fi module designed by Philips innovation services (PInS) and based
Printed copies are uncontrolled unless authenticated
on the latest Cypress WiFI SoC. The design is based on an internal Philips study and is backwards
compatible with an already used Philips module called Philips YD (obsolete), Additional functionality is
added to optimize usability and a cost effective solution of adding connectivity to Philips products.
The design is aligned with Philips CDPP, PSSO, PInS, and multiple business and making fast and easy
integration possible.
See datasheet of CYW43903 WICED™™ IEEE 802.11 a/b/g/n SoC with an Embedded Applications
Processor [1] for detailed specifications.
General description of the CYW43903 SoC that forms the bases of the module reference design:
The Cypress CYW43903 embedded wireless system-on-a-chip (SoC) is uniquely suited for Internet-ofThings applications. It is IEEE 802.11n compliant and provides full IEEE 802.11 b/g legacy compatibility with
enhanced performance. The device includes an ARM Cortex-based applications processor, a single stream
IEEE 802.11n MAC/baseband/radio, a power amplifier (PA), and a receive low-noise amplifier (LNA). It also
supports optional antenna diversity for improved RF performance in difficult environments. The CYW43903 is
an optimized SoC targeting embedded Internet-of-Things applications in the industrial and medical sensor,
home appliance markets. Using advanced design techniques and process technology to reduce active and
idle power, the device is designed for embedded applications that require minimal power consumption and a
compact size. The device includes a PMU for simplifying system power topology and allows for direct
operation from a battery while maximizing battery life.
Figure 1: Block Diagram
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Datasheet WiFi module
1.2
Overview specifications
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• Dual ARM clocked at 160 MHz
• 1 MB of SRAM and 640 KB ROM available for the
applications processor.
• 64Mb encrypted flash storage
• IEEE 802.11 b/g/n 1×1 2.4 GHz radio.
• Single- and dual-antenna support. PCB and
external including diversity.
The module supports the following standards:
• IEEE 802.11n
• IEEE 802.11b
• IEEE 802.11g
• IEEE 802.11d
• IEEE 802.11h
• IEEE 802.11i
• Security:
– WEP
– WPA Personal
– WPA2 Personal
– WMM
– WMM-PS (U-APSD)
– WMM-SA
– AES (hardware accelerator)
– TKIP (hardware accelerator)
– CKIP (software support)
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Proprietary Protocols:
– CCXv2
– CCXv3
– CCXv4
– CCXv5
– WFAEC
The module supports the following additional
standards:
• IEEE 802.11r—Fast Roaming (between APs)
• IEEE 802.11w—Secure Management Frames
• IEEE 802.11 Extensions:
– IEEE 802.11e QoS enhancements (already
supported as per the WMM specification)
– IEEE 802.11i MAC enhancements
– IEEE 802.11k radio resource measurement
Supported countries:
- Europe (ETSI)
- United states
- Canada
- China (TBC)
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Datasheet WiFi module
•
•
•
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•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
External Flash 8MB
(1) PCB Trace antenna
(2) Connector for external
antenna
Antenna diversity
(3) Castellation SMT solder
mounting
(4) 10 pin wire connector
16 I/O (14 shared)
I2C
SPI
Main UART
Debug UART
JTAG
3V3 supply voltage
(5) High speed production
programming
RF Shield
FCC, ETSI, IC module certified
SRCC TBC
Wi- Fi Alliance certified
40mm * 22mm * 9mm
Figure 2: Module Design
1.3
Functional block diagram
Figure 3: Functional block diagram
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Datasheet WiFi module
1.4
Open Points
Adding details on request of Philips Business units and manufacturer.
Printed copies are uncontrolled unless authenticated
1.5
Definitions, Acronyms & Abbreviations
PInS
CDPP
Wi-Fi
RF
IEEE
PCB
PCBA
MAC
AP
ARM
SMT
ESD
EU
USA
FCC
SRRC
RSS
ETSI
ISTA
PMU
IEC
MCU
MSL
CE
UL
TLL
UART
I2C
SPI
JTAG
I/O
RX
FW
HW
SoC
AWG
PVC
DSSS
OFDM
PSDU
MCS
LNA
PER
STBC
GI
BLE
EMC
ESF
WEP
WPA
AES
TKIP
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Philips Innovation Services
Philips Connected Digital Platforms & Propositions
Wireless Fidelity
Radio Frequency
Institute of Electrical and Electronics Engineers
Printed Circuit Board
Printed Circuit Board Assembly
Media Access Control
Access Point
Semiconductor IP company
Surface Mount Technology
Electrostatic Discharge
European Union
United States of America
Federal Communications Commission
State Radio Regulation of China
Radio Standards Specifications
European Telecommunications Standard Institute
International Safe Transit Association
Power Management Unit
International Electrotechnical Commission
Micro-Controller Units
Moisture Sensitive Level
Conformity European
Underwriters Laboratories (safety organization)
Transistor-Transistor Logic
Universal Asynchronous Receiver/ Transmitter
Inter-Integrated Circuit
Serial Peripheral Interface
Joint Test Action Group (electronics industry association)
Input/ Output
Receiver
FirmWare
HardWare
System on Chip
American Wire Gauge
Polyvinylchloride
Direct-Sequence Spread Spectrum
Orthogonal Frequency Division Multiplexing
Physical layer Service Data Unit
Modulation and Coding Scheme
Low-Noise Amplifier
Packet Error Rate
Space-Time Block Codes
Guard Interval
Bluetooth Low Energy
Electromagnetic Compatibility
European Safety Federation
Wired Equivalent Privacy
Wi-Fi Protected Access
Advanced Encryption Standard
Temporal Key Integrity Protocol
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CKIP
WMM
SRAM
ROM
TBC
HVIN
Cisco Key Integrity Protocol
Wi-Fi Multimedia
Static Random-Access Memory
Read-Only Memory
To Be Confirmed
Hardware Version Identification Number
2 Applications
Printed copies are uncontrolled unless authenticated
The PInS Wi-Fi reference design / platform is intended to be used inside Philips to enable connected
propositions and maximize the re-use with Philips and CDPP connectivity platforms. The application
supported are all Philips products including medical class products. The module is designed to be nonblocking for medical product integration (all tests and documentation are available). The module itself is not a
medical device as such.
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Datasheet WiFi module
3 Interface
The interfaces of the module are defined as below. The interfaces are considered part of the platform in
order to have a common base, to maximize re-use and to provide backward compatibility and future
extensions of the platform.
Printed copies are uncontrolled unless authenticated
3.1
4 main interfaces
There are 4 main interface sections in the module design (see Figure 2):
- (3) Castellations. Main interface for SMT placement of the module on product specific PCB board
holding communication, programming, supply and test interfaces. (X101..X124)
- (4) 10 pin AWG24 Board to Wire connector (JST SM10B-ZPDSS-TF(LF)(SN)): Main interface for
product integration based on Wired connection. This connector having Supply, Main UART, SPI, I2C
and I/O. (X125)
- (2) RF external connector (Hirose U.FL-R-SMT-1(10)), interface to support external antenna and
antenna diversity. (X2)
- (5) Fast programming pads: The fast programming pads are intended for in production high speed
programming and testing. (I1…I9)
Figure 4: Interface functions
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Datasheet WiFi module
4 Antennas
The design includes 3 antenna options, PCB trace antenna, external antenna and antenna diversity.
The PCB trace antenna is design to have a performance of > 30% efficiency and maximum gain of 3dBi.
Printed copies are uncontrolled unless authenticated
4.1
External Antenna

This chapter gives an overview of the external antenna that can be fitted to the WiFi module.
This radio transmitter IC has been approved by Industry Canada to operate with the antenna
type listed below with the maximum permissible gain and required antenna impedance for each
antenna type indicated. Antenna types not included in this list, having a gain greater than the
maximum gain indicated for that type, are strictly prohibited for use with this device.

Le chapitre suivant donne un aperçu de l'antenne externe qui peut être installée sur le module
WiFi. Cet émetteur radio IC été approuvé par Industry Canada pour fonctionner avec
le type d’antenne énumérés ci-dessous avec le gain maximum autorisé et l’impédance
nécessaire pour chaque type d’antenne indiqué. Les types d’antenne ne figurant pas dans cette
liste et ayant un gain supérieur au gain maximum indiqué pour ce type-là sont strictement
interdits d’utilisation avec cet appareil.
For each antenna, the "Approvals" field defines in which test reports the antenna is included. Definitions
of the «Approvals» field are:
 FCC - The antenna is included in the FCC test reports and thus approved for use in
countries that accept the FCC radio approvals, primarily US.
 IC - The antenna is included in the IC (Industry Canada) test reports and thus approved for
use in countries that accept the IC radio approvals, primarily Canada.
 ETSI - The antenna is included in the ETSI test reports and thus approved for use in
countries that accept the ETSI radio approvals (EU).
 SRRC – TBC.
4.1.1 Approved antenna
TE
Manufacturer
Part Number
Polarization
Gain
Impedance
Size
Connector
Approval
TE connectivity
2118309-2
Linear
2.5 dBi (2.4GHz band)
50 Ω
40.0 x 8.0 x 1.0 mm
u.fl
FCC, IC and ETSI (SRCC TBC)
5 Operation, storage and transport conditions
5.1
Operational conditions normal operation
Description
Temperature range
Atmospheric pressure range
Relative humidity range
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Range
-20°C...+70°C
60kPa...110kPa
5%...95%
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5.2
Operational conditions storage
Description
Temperature range
Atmospheric pressure
range
Relative humidity range
Tested for time in storage
Printed copies are uncontrolled unless authenticated
Devices are stored in a
vacuum sealed barrier bag
and stored in a reel to
support SMT pick and
place mounting
5.3
Range
5°C...+50°C
60 ... 110 kPa
10 ... 95 % rH
non-condensing
6 months.
MSL3
Operational conditions Transport
Description
Temperature range
Atmospheric pressure
range
Relative humidity range
Conform broadband
random vibrations
according to IEC 60068-264
conform the shock test IEC
60068-2-27 mounting
The device packaging
complies with ISTA
standard 2A
5.4
Range
-30 ... 70 °C
60 ... 120 kPa
10 ... 95 % rH
non-condensing
Severity level IEC 60721-47, Class- 7M2
And in line with ISTA
standard
Severity level IEC 60724-47 Class-7M3
And in line with ISTA
standard
ISTA standard 2A
Additional conditional specifications
5.5
Module is MSL 3 level, transport and storage in sealed packaging,
(limit open air “life out of the bag” to <168 hours: make use of sealed vacuum bag which will limit
exposure of the chip to moisture to less than 168 hours prior to the last reflow round (MSL3= 168
hours). in case the chips were exposed for more than 168 hours, IPC/JEDEC J-STD-020B defines a
“baking” process to get the parts fit for use again. (min 8 hours @125°C))
Packaging supports SMT (Pick and Place) tape and reel.
Module should be handle as component, handle with care, and ESD protection should be used.
Supply should be within specifications and clean, injected noise can be amplified and cause the
module to fail and work out of specification.
All modules are functional tested, Wi-Fi connection speed, Carrier Wave tests, I/O tests and UART
tests. The Wired interface connector is not tested, needs to be tested at product level when used.
Maximum reflow processes allowed is 1. (Critical Murata 2.4 GHz filter).
Environmental
Module complies to Philips Regulated Substances List PHGR-GS-BP01-012.
CE compliance
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Datasheet WiFi module
6 Architectural Choices and Constraints
The PInS Wi-Fi reference design is based on an internal Philips study on common requirements and product
examples. Out of this study the below strategic interfaces, shape and dimensions are defined.
Strategic interfaces, shape and dimensions of the reference design are beneficial to leverage scale,
compatibility and future updates and extensions. Wi-Fi and BLE chip updates, combo solutions and other IoT
technologies are on the roadmap and planned to be compatible.
Printed copies are uncontrolled unless authenticated
6.1
Strategic interfaces
1- PCB Trace antenna (Omnidirectional and optimized for easy integration, > 30% efficiency)
2- Connector for external antenna option (In combination with RF switch optional) (Diversity option)
3- Castellation’s, SMT solder mounting option, See specific interface functions in figure 4.
4- Connector (AWG 24 compatible wires connector), strategic, Main MCU interface, Supply, SPI, I2C and I/O
(see figure 2).
5- Direct High Speed Flash programming, production.
Image 1: Connector
6.2
Strategic module size
Model strategic size is 40mm (+/- 0.25mm) * 22mm (+/- 0.25mm) * 9mm
The module can be mounted into a slotted sliding fixture. Mechanical castellations are added for locking in
place. See detailed mechanical drawings in chapter 8.1 for more information.
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Datasheet WiFi module
7 General, Safety, Legal & Security Standards
See Philips Safety, Legal and security standards used, see specific documents available on request. Fully
compliant with Product and Services Security Office (PSSO) and fully compliant to Philips requirements.
On request detailed documentation can be provided on Production, Approbation and certification. For
specific requirements and tractability.
Contact PInS for re-use module level certification and referrals
7.1
General Standards
The PInS WiFi module complies to the Safety Standard EN 62368-1 and is manufactured following the
ROHS/REACH directives.
7.2
Contamination
Printed copies are uncontrolled unless authenticated
The module is validated as Pollution degree 2 equipment, normally only nonconductive pollution occurs.
Temporary conductivity caused by condensation is to be expected.
7.3
FCC, IC, SRRC, ETSI Compliance
The following modes of operation is supported by the module with
WLAN Firmware
: wl0: Dec 19 2016 19:29:37 version 7.15.168.78 (r663126) FWID 01-8ba7c839
Country/setting
US
Canada
Europe
China
XX/17
Applicable
Applicable
Applicable
TBC
NL/1
Not Applicable
Not Applicable
Applicable
TBC
The system is designed to comply with the standards as mentioned below as part of a complete assembly.
The unit is classified as a class B product.
The PInS WiFi module is IC and FCC certified for the radio aspects (in the USA and Canada) and complies
with radio tests ETSI EN 300 328 V2.1.1 for EU. In addition, the module is complies with the EMC standards
for USA (FCC 15.209), EU (ETSI EN 301 489-17) and Canada. The certification of China is to be confirmed.
7.3.1 IC compliance
This device complies with Industry Canada license-exempt RSS standard(s).
Operation is subject to the following two conditions:
1. This device may not cause interference, and
2. This device must accept any interference, including interference that may cause undesired operation
of the device.
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and
maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio
interference to other users, the antenna type and its gain should be chosen in such a way that the equivalent
isotropically radiated power (e.i.r.p.) is not more than that is necessary for successful communication.
This equipment complies with IC RSS-102 radiation exposure limits set forth for an uncontrolled
environment.
7.3.2 Conformité aux normes d’Industrie Canada
Cet appareil est conforme à la(aux) norme(s) RSS sans licence d’Industry Canada.
Son utilisation est soumise aux deux conditions suivantes :
1. Cet appareil ne doit pas causer d’interférences et
2. il doit accepter toutes interférences reçues, y compris celles susceptibles d’avoir des effets
indésirables sur son fonctionnement.
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Datasheet WiFi module
Conformément aux réglementations d’Industry Canada, cet émetteur radio ne peut fonctionner qu’à l’aide
d’une antenne dont le type et le gain maximal (ou minimal) ont été approuvés pour cet émetteur par Industry
Canada. Pour réduire le risque d’interférences avec d’autres utilisateurs, il faut choisir le type d’antenne et
son gain de telle sorte que la puissance isotrope rayonnée équivalente (p.i.r.e) ne soit pas supérieure à celle
requise pour obtenir une communication satisfaisante. Cet équipement respecte les limites d’exposition aux
rayonnements IC CNR-102 définies pour un environnement non contrôlé.
Printed copies are uncontrolled unless authenticated
7.3.3 FCC statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired
operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference to
radio communications. However, there is no guarantee that the interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the interference by
one or more of the following measures:
 Reorient or relocate the receiving antenna
 Increase the separation between the equipment and receiver
 Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
The PInS WiFi module is for OEM integrations only. The end-user product will be professionally installed in
such a manner that only the authorized antennas are used.
7.4
Installation instruction
Changes or modifications made to the module not expressly approved by Philips Innovation Services may
void the FCC / IC authorization to operate this equipment.
The use of the transceiver module is authorized in mobile or fixed host devices taking into account the
conditions listed below:

Philips Business Units (integrator) must ensure that the end user manual may not contain any
information about the way to install or remove the module from the final product.

Depending on the final host device additional authorization requirements for the non-transmitter
functions of the transmitter module may be required (i.e., Verification, or Declaration of Conformity)
Philips Business Units (integrator) are responsible for ensuring that after the module is installed and
operational the host continues to be compliant with the Part 15B unintentional radiator requirements.

The information on the label and in the user manual is required to be incorporated in the user
manual of the final host. see 47 CFR15 requirements for more details (e.g. 15.19 / 15.21 / 15.101 /
15.105 / RSS-GEN / ICES)

The module must be installed and used in strict accordance with Philips Innovation Services
instructions as described in the user documentation that comes with the module.

The end user manual for the final host product operating with this transmitter must include operating
instructions to satisfy RF exposure compliance requirements.
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e.g
Radiofrequency radiation exposure Information:
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance of 20
cm between the radiator and your body.
This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Printed copies are uncontrolled unless authenticated
Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un
environnement non contrôlé. Cet équipement doit être installé et utilisé avec un minimum de
20 cm de distance entre la source de rayonnement et votre corps.
7.5

The antenna of the module may not be removed, replaced nor modified. The
antenna must not be co-located or operating in conjunction with any other antenna
or transmitter. No additional antenna must be used.

When the final host product operating with this transmitter deviate from above,
installation of this module into specific final hosts may require the submission of a
Class II permissive change application containing data pertinent to RF Exposure,
spurious emissions, ERP/EIRP, and host/module authentication, or new application
if appropriate.
Label requirements for end product
For an end product using the PInS WiFI module there must be a label containing, at least, the following
information:
This device contains
FCC ID: 2AALC0031357
IC ID: 22799-0031357
CMIIT ID: TBC
The label must be affixed on an exterior surface of the end product such that it will be visible upon inspection
in compliance with the modular approval guidelines developed by the FCC.
In accordance with 47 CFR § 15.19, the end product shall bear the following statement in a conspicuous
location on the device:
"This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions;
(1) This device may not cause harmful interference, and
(2) This device must accept any interference received, including interference that may cause undesired
operation."
7.6
UL compliance
UL94V-0 compliance on PCB level.
8 Specifications
8.1
Mechanical
The dimensions and footprint are part of the platform and are considered strategic to have a common base.
Supporting backwards compatibility and future extensions of the platform proposition.
The main dimensions are 40mm * 22mm (+/- 0.250mm) and a maximum height of <9mm.
Refer to the latest sheet 110 [3] of the PCB for more information about the mechanical drawings.
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Figure 9: Mechanical drawing
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8.2
Electrical
General electrical specifications as tested on module level, for detailed specifications see datasheet of
CYW43903 WICED™™ IEEE 802.11 a/b/g/n SoC with an Embedded Applications Processor.
8.3
Typical Values
Printed copies are uncontrolled unless authenticated
Description
Supply voltage
I/O input high voltage
I/O input low voltage i
I/O output high voltage
equal or larger than
I/O output low voltage
equal or less than
Supply voltage
8.4
Value
3.3V
3.3V
0V
2.4V
0.4V
Vpp <5mV recommended,
use correct decoupling and
filters if needed
Communication
Description
Main product UART
interface that operates at
3V3 TTL levels.
Debug UART interface that
operates at 3V3 TTL levels
SPI 4-wire master interface
bit-bang driver
SPI 4-wire master interface
hardware driver
I2C master interface
operating at a frequency
JTAG interface
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Typical
115200
115200
1Mbps
20Mbps
100kHz and 400kHz
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8.5
Absolute Maximum Ratings
Caution! The absolute maximum ratings indicate levels where permanent damage to the device can occur,
even if these limits are exceeded for only a brief duration. Functional operation is not guaranteed under
these conditions. Operation at absolute maximum conditions for extended periods can adversely affect longterm reliability of the device. Information out of CYW43903 datasheet core SoC.
Printed copies are uncontrolled unless authenticated
Parameter
3.3V DC supply voltage
Maximum undershoot voltage for I/O
Maximum overshoot voltage for I/O
Maximum junction temperature
8.6
Symbol
VDD_3P3
Vundershoot
Vovershoot
TJ
Value
-0.5 to 3.9
-0.5
VDD_3P3 + 0.5
-0.5 to 3.9
Unit
°C
Module level recommended Maximum ratings
Description
Supply voltage in the range
I/O input high voltage in the range
I/O input low voltage in the range
I/O output high voltage equal or larger than
I/O output low voltage equal or less than
Supply voltage
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Range
3.13V…3.6V
2.0 V…3.8V
-0.5V…0.8V
2.4V
0.4V
Vpp <5mV recommended, use correct decoupling
and filters if needed
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8.7
Electrostatic Discharge Specifications
Extreme caution must be exercised to prevent electrostatic discharge (ESD) damage. Proper use of wrist
and heel grounding straps to discharge static electricity is required when handling these devices. Always
store unused material in its antistatic packaging. ESD specifications are based directly on the core
components specifications. No additional protection added on module level.
Printed copies are uncontrolled unless authenticated
ESD specifications
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9 RF characteristics
Printed copies are uncontrolled unless authenticated
Also see datasheet of CYW43903 WICED™™ IEEE 802.11 a/b/g/n SoC with an Embedded Applications
Processor.
Description
Closed-loop TX power variation at highest power
level stetting.
Across full temperature and voltage range.
Applies to 10dBm to 20dB output power range
Range
Max +/- 1.5dB
See [1] for actual value
See datasheet CYW43903 WICED™ IEEE 802.11 a/b/g/n SoC with an Embedded Applications Processor
[1] for additional information.
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10 Reliability
Lifetime target of 7 years,
Field failure rate target equal to or less than 0.5%
Target warranty period of 2 years
11 Reflow profile
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11.1 Typical profile
Figure 11: Reflow profile
11.2 Measured reflow profile during test runs
Figure 12: Reflow profile during test runs
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12 Footprint details
Printed copies are uncontrolled unless authenticated
TOP view












Handle it as a module, black box to solder it on a PCB
Module length 40 mm
Module width 22 mm
Module PCB thickness = 0.8±0.1 mm
Module max height 10 mm (connector)
Solder method is reflow
Number of SMD pins are 23.
Pad – edge shape from the module are castellation shapes.
Use Partly metallized mounting base terminal
Implement PCB edge indication = top of metal screening box (28 mm from the bottom)
Place route keep out under the component (no via’s and prevent interference)
There are 2 position non plated 1.3 mm castellation shapes at the side, needed for its own PCB
assembly.
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Figure 13: Layout
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Figure 14: Layout detail
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13 Ordering information
13.1 Ordering variant of module, product specific
1. Business needs to supply specific module FW 12NC (product specific, including MAC,
Security ICP KEYS and Cloud ID)
2. Select common PInS HW variant 12NC, see below
3. Business needs to create and supply new module 12NC (product specific)
13.2 Common PInS HW variant, PCBA 12NC ordering information
Printed copies are uncontrolled unless authenticated
There will be 12 different variants.
Hardware Version
0 ohms
Identification Number
resistor
(12NC-PCBA)
3000 003 13592
Mounted
3000 003 13682
X125
Antenna setup
PCB-Antenna
Mounted
Mounted
EXT
3000 003 13612
Mounted
Ant
Switch
RF-Signal
3000 003 13722
3000 003 13742
Mounted
3000 003 13762
3000 003 13782
PCB-Antenna
Mounted
Mounted
Mounted
RF-Signal
3000 003 13802
3000 003 13822
Mounted
3000 003 13842
PCB-Antenna
Mounted
Mounted
EXT
3000 003 13862
Mounted
Ant
RF-Signal
3000 003 13882
In case the 0 ohms resistors mounted GPIO (X103 and X109), I2C (X107 and X108) and SPI bus
(X110, X112, X115 and X116) are available on the castelations.
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13.3 Module Labeling
3000 003 13562
FCC ID: 2AALC0031357
IC: 22799-0031357
Printed copies are uncontrolled unless authenticated
HVIN:
3000 003
13592
10
Image2: Module labeling
Label
Number
Description
12NC-PCBA
Model 12NC
QR code
PHILIPS
POS UL code
Cavity number
Silkscreen 7
10
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CMIIT
Identification
IC
Identification
FCC
Identification
12NC-PCB
Process:
Classification:
Hardware version identification number (HVIN)
Identification of specific product code including
end-application
Traceability information of the single module.
See content below.
Manufacturer name
Needs to be added by the PCB supplier.
Identification of the bare-board materials.
Needs to be added by the PCB supplier or End
supplier.
Added for traceability purpose.
China
(Position for the china ID)
Canada
United States
Identification of the bare-board.
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QR CODE LABEL INFORMATION
CODE
INFORMATION
YY
WW
YEAR
WEEK
H: MONDAY
I: TUESDAY
J: WEDNESDAY
K: THURSDAY
L: FRIDAY
M: SATURDAY
N: SUNDAY
XXXXXXXXXXXX
XXXXXXXXXXXX
(PRODUCTION DAY)
Printed copies are uncontrolled unless authenticated
MAC Address (12 digit)
Model 12NC (12 digit)
14 References
Ref.#
[1]
[2]
[3]
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Document Title
CYW43903 WICED™™ IEEE 802.11 a/b/g/n SoC with an
Embedded Applications Processor Datasheet
Integration manual PInS Wi-Fi module V0.1
3000_003_13xxx_110_2017xxxx_WIFI_MECH
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Document ID
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N/A
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---

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Title                           : Product Requirements Specification_template
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