Qisda H20 HSUPA PCI Express mini card module User Manual H20 Manual 2
Qisda Corporation HSUPA PCI Express mini card module H20 Manual 2
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UserMan 20090313
Datasheet
H20
HSUPA PCI Express mini card module
Datasheet
Rev. 0.1
2008/04/30
Copyright Qisda Corporation
This document contains proprietary technical information which is the property of Qisda
Corporation and is issued in strict confidential and shall not be disclosed to others parties in whole
or in parts without written permission of Qisda Corporation
The documents contain information on a product, which is under development and is issued for
customer evaluation purposes only.
Qisda may make changes to product specifications at any time, without notice.
Qisda Corporation
Mobile Communications BG
18 JiHu Road, Nei-Hu, Taipei 114, Taiwan, R.O.C.
Tel: +886-2-2799-8800
Fax: +886-2-2656-6390
http://www.Qisda.com
H20 Datasheet
HISTORY
Version Date Notes
VER: 0.1 2008-APR-30 FIRST RELEASE
1. INTRODUCTION .................................................................................................... 4
1.1 Description.............................................................................................................4
1.2 Application Device .................................................................................................4
2. FEATURES ............................................................................................................... 5
2.1 General Characteristics ..........................................................................................5
2.2 RF Functionalities ..................................................................................................6
Maximum TX Power............................................................................................6
Parametric Performance ......................................................................................6
Sensitivity.............................................................................................................7
Radio Frequency ..................................................................................................7
3. HARDWARE DESCRIPTION................................................................................... 10
3.1 System Interface....................................................................................................10
3.2 Functional Diagram .............................................................................................11
3.3 Pin Description ....................................................................................................12
3.4 Terminal Definition..............................................................................................14
3.5 Electrical Characteristics ......................................................................................16
DC characteristics ..............................................................................................16
Digital interface..................................................................................................17
USB Transceiver DC characteristics ...................................................................17
USIM Interface...................................................................................................18
3.6 Environmental......................................................................................................19
3.7 Physical Package ...................................................................................................20
4. SOFTWARE CHARACTERISTICS............................................................................ 23
4.1 Introduction .........................................................................................................23
4.2 Software Architecture ...........................................................................................23
1. INTRODUCTION
1.1 Description
Overview
This document describes all the functions, features, and interfaces of the
HSUPA PCI Express Mini Card Module – H20 from Qisda. Qisda H20 HSUPA
module supports Tri-band WCDMA/HSDPA/HSUPA and Quad-band
GSM/GPRS/EDGE network connection capability.
Qisda H20 HSUPA card can provides high speed data connection, the data
speed of downlink and uplink path is up to 7.2Mbps and 5.76Mbps respectively.
Furthermore, users can ease to use this module by using the “HMTool” application
software that we provide for Windows XP and Vista system.
With the Qisda H20 HSUPA module, devices are enhanced in both
functionality and usability based on state of the art wireless technology.
1.2 Application Device
Scope
Qisda H20 module is a high speed modem card with PCI Express minicard
form factor and is focusing on the Notebook, UMPC, MID and other portable
device marketing.
¾ Notebook
¾ Ultra Mobile PC
¾ Mobile Internet Device
¾ Wireless Router
¾ USB Modem
¾ Car Embedded System
2. FEATURES
2.1 General Characteristics
z Bands:
Tri Band WCDMA and Quad Band GSM
Band TX RX
GSM850 824~849 MHz 869~894MHz
EGSM900 880~915 MHz 925~960MHz
DCS1800 1710~1785MHz 1805~1880MHz
PCS1900 1850~1910MHz 1930~1990MHz
WCDMA850 824~849 MHz 869~894MHz
WCDMA1900 1850~1910MHz 1930~1990MHz
WCDMA2100 1920~1980MHz 2110~2170MHz
z Support SIM Interface: 1.8V/3V
z Form factor
i. Dimension: 50.95 x 30 x 5.0 mm
ii. Weight: 12g
z Power
Operation Voltage: 3.3V +/- 9%
z Power Consumption:
Speech Mode:
Band Typ Max Unit
GSM850 / PCL=5 385 410 mA
EGSM900 / PCL=5 385 410 mA
DCS / PCL=0 330 350 mA
PCS / PCL=0 330 350 mA
WCDMA (all band) 750 820 mA
Standby Mode:
Typ (Average) Max (Average) Unit
GSM / Page frame=2 3.5 4.5 mA
GSM / Page frame=9 1.5 3 mA
DCS / Page frame=2 3.5 4.5 mA
DCS / Page frame=9 1.9 3.5 mA
PCS / Page frame=2 3.5 4.5 mA
PCS / Page frame=9 1.6 3 mA
WCDMA / DRX=6 (0.64 S) 4.2 5.5 mA
WCDMA / DRX=9 (5.12 S) 1.7 3 mA
z Hardware Interface:
52 Pins PCI Express Mini Card connector interface
2 RF Antenna Coaxial Connectors
z Software Interface:
USB driver
HMTool software tool.
2.2 RF Functionalities
Maximum TX Power
The performance of the transmitter meets test requirement ETSI TS 151 010-1 chapter
13.3 for GSM, chapter 13.17.3 for EDGE and TS 34.121 chapter 5.2&5.4.3 for
WCDMA, chapter 5.2A for HSDPA, chapter 5.2B for HSUPA.
Band Max Min
GSM850 33 dBm ±2dBm 5 dBm ±5dBm
EGSM 33 dBm ±2dBm 5 dBm ±5dBm
DCS 30 dBm ±2dBm 0 dBm ±5dBm
PCS 30 dBm ±2dBm 0 dBm ±5dBm
GSM850(EDGE) 27 dBm ±3dBm 5 dBm ±5dBm
EGSM(EDGE) 27 dBm ±3dBm 5 dBm ±5dBm
DCS(EDGE) 26 dBm ±3dBm 2 dBm ±5dBm
PCS(EDGE) 26 dBm ±3dBm 2 dBm ±5dBm
UMTS-2100 24 dBm +1/-3dBm Less than -50dBm
UMTS-1900 24 dBm +1/-3dBm Less than -50dBm
UMTS-850 24 dBm +1/-3dBm Less than -50dBm
1/15≦βo/βd≦12/15 (HS-DPCCH) 24 dBm +1/-3dBm
13/15≦βo/βd≦15/8 (HS-DPCCH) 23 dBm +2/-3dBm
15/7≦βo/βd≦15/0 (HS-DPCCH) 22 dBm +3/-3dBm
Sub-test 1 (E-DCH) 24 dBm +1.7/-5.2dBm
Sub-test 2 (E-DCH) 22 dBm +3.7/-5.2dBm
Sub-test 3 (E-DCH) 23 dBm +2.7/-5.2dBm
Sub-test 4 (E-DCH) 22 dBm +3.7/-5.2dBm
Sub-test 5 (E-DCH) 24 dBm +1.7/-5.2dBm
Parametric Performance
Tests carried out at -20ºC, 25ºC and 60ºC for each voltage 3V, 3.3V and 3.6V. The
Measured Peak Phase, RMS Phase, frequency error, power level, and static sensitivity
meets ETSI TS 151 010-1 chapter 13.1 for GSM and TS 34.121 chapter 5.13.1 for
WCDMA, chapter 5.13.1A for HSDPA
Band (GSM) Peak Phase Error RMS Phase Error
GSM850 <20° <5°
EGSM <20° <5°
DCS <20° <5°
PCS <20° <5°
Band (GSM) Peak Phase Error RMS Phase Error
Band (WCDMA) Error Vector Magnitude
UMTS-2100(HS-DPCCH) <17.5%
UMTS-1900(HS-DPCCH) <17.5%
UMTS-850(HS-DPCCH) <17.5%
Sensitivity
The performance of the receiver meets test requirement ETSI TS 151 010-1 chapter
14.2.1 for GSM, chapter 14.18.1 for EDGE and TS 34.121 chapter 6.2 for WCDMA.
Band Typical Min
GSM850 -107 dBm -104 dBm
EGSM -107 dBm -104 dBm
DCS -107 dBm -103 dBm
PCS -107 dBm -103 dBm
EDGE(GMSK modulation) -107 dBm -104 dBm
EDGE(8-PSK modulation) -104 dBm -102 dBm
UMTS-2100(Primary) -109 dBm -106.7 dBm
UMTS-2100(Secondary) -109 dBm N/A
UMTS-1900(Primary) -107 dBm -104.7 dBm
UMTS-1900(Secondary) -109 dBm N/A
UMTS-850(Primary) -109 dBm -106.7 dBm
UMTS-850(Secondary) -109 dBm N/A
Radio Frequency
GSM850 (850 MHz)
Frequency Range TX 824-849 MHz; RX 869-894 MHz
Channel Spacing 200 KHz
Number of Channels 124 Carriers x 8 (TDMA)
Modulation GMSK / 8-PSK
Duplex Spacing 45 MHz
Frequency Stability +/- 0.1 ppm (Uplink TX)
Power Output 33 dBm Class 8 (2 W peak) – 5 dBm
Output Impedance 50 Ohm
Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz)
EGSM (900 MHz)
Frequency Range TX 880-915 MHz; RX 925-960 MHz
Channel Spacing 200 KHz
Number of Channels 124 Carriers x 8 (TDMA)
Modulation GMSK / 8-PSK
Duplex Spacing 45 MHz
Frequency Stability +/- 0.1 ppm (Uplink TX)
Power Output 33 dBm Class 8 (2 W peak) – 5 dBm
Output Impedance 50 Ohm
Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz)
DCS (1800 MHz)
Frequency Range TX 1710-1785 MHz; RX 1805-1880 MHz
Channel Spacing 200 KHz
Number of Channels 374 Carriers x 8 (TDMA)
Modulation GMSK / 8-PSK
Duplex Spacing 95 MHz
Frequency Stability +/- 0.1 ppm (Uplink TX)
Power Output 30 dBm – 0 dBm
Output Impedance 50 Ohm
Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz)
Compatible with phase 2 feature
PCS (1900 MHz)
Frequency Range TX: 1850~1910MHz; RX: 1930~1990MHz
Channel Spacing 200KHz
Number of Channels 299 Carriers x 8 (TDMA)
Modulation GMSK / 8-PSK
Duplex Spacing 80 MHz
Frequency Stability +/- 0.1 ppm (Uplink TX)
Power Output 30 dBm – 0 dBm
Output Impedance 50 Ohm
Spurious Emission -36 dBm up to 1 GHz (< -30 dBm > 1 GHz)
Compatible with phase 2 feature
WCDMA_IMT (2100 MHz)
Frequency Range TX: 1920~1980MHz; RX: 2110~2170MHz
Channel Raster 200KHz
Number of Channels 299 Carriers x 8 (TDMA)
Modulation QPSK
Duplex Spacing 190 MHz
Frequency Stability +/- 0.1 ppm (Uplink TX)
Power Output 24 dBm +1/-3dBm - less than -50dBm
Output Impedance 50 Ohm
Spurious Emission -67dBm(925-935MHz);-79dBm(935-960MHz);-71dBm(1805-1880MHz)
;-60dBm(1845-1880MHz);-41dBm(1885-1920MHz)
WCDMA_PCS (1900 MHz)
Frequency Range TX: 1850~1910MHz; RX: 1930~1990MHz
Channel Raster 200KHz
Number of Channels 299 Carriers x 8 (TDMA)
Modulation QPSK
Duplex Spacing 80 MHz
Frequency Stability +/- 0.1 ppm (Uplink TX)
Power Output 24 dBm +1/-3dBm - less than -50dBm
Output Impedance 50 Ohm
Spurious Emission
WCDMA_850 (850 MHz)
Frequency Range TX 824-849 MHz; RX 869-894 MHz
Channel Raster 200KHz
Number of Channels 299 Carriers x 8 (TDMA)
Modulation QPSK
Duplex Spacing 45 MHz
Frequency Stability +/- 0.1 ppm (Uplink TX)
Power Output 24 dBm +1/-3dBm - less than -50dBm
Output Impedance 50 Ohm
Spurious Emission -60dBm(869-894MHz;1930-1990MHz;2110-2155MHz)
3. HARDWARE DESCRIPTION
3.1 System Interface
The I/O connectors of H20 module are PCI EXPRESS MINI CARD and two RF
antenna connectors. Table 3-1 summarizes the 25 signals and 18 power lines that are
supported by the PCI Express Mini Card System Interface. Table 3-2 shows the
antenna interface.
Table 3-1 System Interface
Signal Group Pin no. Description
Power 5 3.3V power source
GND 13 Return current path
USB 2 USB serial data interface compliant to the USB 2.0 specification
PERST# 1 Function reset to the card
W_DISABLE# 1 Shutdown the HSDPA module
UIM 4 SIM function
LED 3 Status indicators
Table 3-2 Antenna interface
Signal Group Connector no. Description
ANT 2 Antenna interface
3.2 Functional Diagram
3.3 Pin Description
Pin Signal name Direction Description
1 NC No connect
2 +3.3Vaux Power 3.3V power source
3 NC No connect
4 GND Power Return current path
5 NC No connect
6 NC No connect
7 NC No connect
8 UIM_PWR Output Power source for the USIM
9 GND Power Return current path
10 UIM_DATA Input / Output USIM data signal
11 NC No connect
12 UIM_CLK Output USIM clock signal
13 NC No connect
14 UIM_RESET Output USIM reset signal
15 GND Power Return current path
16 NC No connect
17 NC No connect
18 GND Power Return current path
19 NC No connect
20 W_DISABLE# Input
Active low signal.
This signal is used by the system to
shutdown the HSDPA module.
21 GND Power Return current path
22 PERST# Input Active low signal.
Function reset to the card.
23 NC No connect
24 +3.3Vaux Power 3.3V power source
25 NC No connect
26 GND Power Return current path
27 GND Power Return current path
28 NC No connect
29 GND Power Return current path
30 NC No connect
31 NC No connect
32 NC No connect
33 NC No connect
34 GND Power Return current path
35 GND Power Return current path
36 USB_D- Input / Output USB serial data interface (negative)
37 GND Power Return current path
38 USB_D+ Input / Output USB serial data interface (postive)
39 +3.3Vaux Power 3.3V power source
40 GND Power Return current path
41 +3.3Vaux Power 3.3V power source
42 LED_WWAN# Output Active low signal.
WAN status LED driver.
43 GND Power Return current path
44 LED_WLAN# Output Active low signal.
LAN status LED driver.
45 NC No connect
46 LED_WPAN# Output Active low signal.
PAN status LED driver.
47 NC No connect
48 NC No connect
49 NC No connect
50 GND Power Return current path
51 NC No connect
52 +3.3Vaux Power 3.3V power source
3.4 Terminal Definition
Recommend antenna connect
Hirose Coaxial Connectors
System connector
52 pins PCI Express Mini Card
3.5 Electrical Characteristics
DC characteristics
Pin
Function/ Name Direction Parameter Min
Typ
Max
Unit
1 NC
2 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V
3 NC
4 GND Power Ground
5 NC
6 NC
7 NC
Supply Voltage 1.5 2.85 3.05 V
8 UIM_PWR Output
Current 150 mA
9 GND Power Ground
10 UIM_DATA Input / Output
11 NC
12 UIM_CLK Output
13 NC
14 UIM_RESET Output
15 GND Power Ground
16 NC
17 NC
18 GND Power Ground
19 NC
Logic High Input Voltage 1.69 2.6 3.3 V
20 W_DISABLE# Input
Logic Low Input Voltage -0.3 0 0.91 V
21 GND Power Ground
Logic High Input Voltage 1.69 2.6 3.3 V
22 PERST# Input
Logic Low Input Voltage -0.3 0 0.91 V
23 NC
24 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V
25 NC
26 GND Power Ground
27 GND Power Ground
28 NC
29 GND Power Ground
30 NC
31 NC
32 NC
33 NC
34 GND Power Ground
35 GND Power Ground
36 USB_D- Input / Output Termination Voltage 3.0 3.3 3.6 V
37 GND Power Ground
38 USB_D+ Input / Output Termination Voltage 3.0 3.3 3.6 V
39 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V
40 GND Power Ground
41 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V
42 LED_WWAN# Output Driver current 0 150 mA
43 GND Power Ground
44 LED_WLAN# Output Driver current 0 150 mA
45 NC
46 LED_WPAN# Output Driver current 0 300 mA
47 NC
48 NC
49 NC
50 GND Power Ground
51 NC
52 +3.3Vaux Power Power Supply Voltage 3.0 3.3 3.6 V
Digital interface
Parameter Min Typ Max Unit
Logic High Input Voltage 1.69 2.6 2.9 V
Logic Low Input Voltage -0.3 0 0.91 V
Logic High Output Voltage 2.15 2.6 2.6 V
Logic Low Output Voltage -0.3 0 0.45 V
USB Transceiver DC characteristics
The USB interface is powered from 3.3V power source.
Parameter Comments Min Ty p Max Unit
Input sensitivity (differential) |D+－D-|, VIN=0.8 to 2.5V 0.2 V
Output voltage
Logic LOW
Logic HIGH
RL=1.5KΩ to 3.6V
RL=1.5KΩ to GND, IO=1mA
2.8
0.3
3.6
V
V
Series output resistance D+, D- 28 33 44 Ω
Internal pull-up resistor 3.3V to D+, 3.3V to D- 1.425 1.5 1.575 KΩ
Internal pull-down resistor D+ to GND, D- to GND 14.3 15 24.8 KΩ
USIM Interface
The USIM signals are defined on system connector to provide the interface between
the removable User Identity Module. USIM interface usually run off either 1.8V or
3.0V.
Pin Name Direction Description
8 UIM_PWR Output Power source for the USIM
10 UIM_DATA Input / Output USIM data signal
12 UIM_CLK Output USIM clock signal
14 UIM_RESET Output USIM reset signal
Parameter Comments Min Typ Max Unit
Logic High Input Voltage 1.8525 2.85 3.15 V
Logic Low Input Voltage -0.3 0 0.9975 V
Logic High Output Voltage 2.4 2.85 2.85 V
Logic Low Output Voltage -0.3 0 0.45 V
Schmitt Hysteresis 150 mV
Logic input leakage current -200 200 nA
Internal pull-up resistor Programmable range 1 30 KΩ
3.6 Environmental
Operational temperature: -20 ~ +60 ℃
Functional temperature: -20 ~ +70 ℃
Storage temperature: -40 ~ +85 ℃
Note:
¾ The maximum case temperature (Tc) of shielding case cover should be under 90
℃ (@RF TX power = 24dBm) for ensure all of the characteristics of H20 module
can be fulfilled the ETSI specification.
¾
3.7 Physical Package
Top View
Bottom View
Side View
4. SOFTWARE CHARACTERISTICS
4.1 Introduction
We provide the PC Tool – HMTool for H20 HSUPA card. The main functions in this
tool are Contacts (only SIM card), SMS, Settings, and Network Management.
4.2 Software Architecture
-28-
FEDERAL COMMUNICATIONS COMMISSION INTERFERENCE STATEMENT
This mobile device meets guidelines for exposure to radio waves. Your mobile device is a radio
transmitter and receiver. It is designed not to exceed the limits for exposure to radio waves
recommended by international guidelines.
This equipment has been tested and found to comp ly with the limits for a Class B digit al
device, pursuant to P art 15 of the FCC Ru les. Thes e limit s are designed to provide
reasonable protection against harmful interfer ence in a residential inst allation. This
equipment generates, uses and c an radiate radio frequency energy and, if not inst alled
and used in accordance with the instructions, may cause harmful interference to radio
communications. However , there is no guarant ee that interference will not occur in a
particular inst allation. If this equipment does cause harmful i nterference to radio or
television reception, which c an be determined by turning the equipment of f and on, th e
user is encouraged to try to correct the interference by one or more of the following
measures:
– Reorient or relocate the receiving antenna.
– Increase the separation between the equipment and receiver.
– Connect the equipment into an outlet on a circ uit dif ferent from that to w hich the
receiver is connected.
– Consult the dealer or an experienced radio/TV technician for help.
CAUTION:
Any changes or modifications not expre ssly approved by the p arty responsible for
compliance could void the user's authority to operate the equipment.
FCC RF Radiation Exposure Statement
This equipment complies with F CC RF radiation exposure limits set forth for an uncontrolled
environment. This equipment must be inst alled and operated with a minimum dist ance of
20cm between the radiator and your body.