Qisda H20 HSUPA PCI Express mini card module User Manual H20 Manual 2

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Date Submitted	2009-03-13 00:00:00
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Creation Date	2009-03-09 14:06:18
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Document Title	Microsoft Word - H20 Manual - 2.doc
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Document Author:	Blair.Wang

Datasheet
H20 Datasheet
H20
HSUPA PCI Express mini card module
Datasheet
Rev. 0.1
2008/04/30
Copyright Qisda Corporation
This document contains proprietary technical information which is the property of Qisda
Corporation and is issued in strict confidential and shall not be disclosed to others parties in whole
or in parts without written permission of Qisda Corporation
The documents contain information on a product, which is under development and is issued for
customer evaluation purposes only.
Qisda may make changes to product specifications at any time, without notice.
Qisda Corporation
Mobile Communications BG
18 JiHu Road, Nei-Hu, Taipei 114, Taiwan, R.O.C.
Tel: +886-2-2799-8800
Fax: +886-2-2656-6390
http://www.Qisda.com
HISTORY
Version
Date
VER: 0.1
2008-APR-30
Notes
FIRST RELEASE
1. INTRODUCTION .................................................................................................... 4
1.1 Description.............................................................................................................4
1.2 Application Device .................................................................................................4
2. FEATURES ............................................................................................................... 5
2.1 General Characteristics ..........................................................................................5
2.2 RF Functionalities ..................................................................................................6
Maximum TX Power............................................................................................6
Parametric Performance ......................................................................................6
Sensitivity .............................................................................................................7
Radio Frequency ..................................................................................................7
3. HARDWARE DESCRIPTION................................................................................... 10
3.1 System Interface....................................................................................................10
3.2 Functional Diagram ............................................................................................. 11
3.3 Pin Description ....................................................................................................12
3.4 Terminal Definition..............................................................................................14
3.5 Electrical Characteristics ......................................................................................16
DC characteristics ..............................................................................................16
Digital interface..................................................................................................17
USB Transceiver DC characteristics ...................................................................17
USIM Interface...................................................................................................18
3.6 Environmental......................................................................................................19
3.7 Physical Package ...................................................................................................20
4. SOFTWARE CHARACTERISTICS............................................................................ 23
4.1 Introduction .........................................................................................................23
4.2 Software Architecture ...........................................................................................23
1. INTRODUCTION
1.1 Description
Overview
This document describes all the functions, features, and interfaces of the
HSUPA PCI Express Mini Card Module – H20 from Qisda. Qisda H20 HSUPA
module supports Tri-band WCDMA/HSDPA/HSUPA and Quad-band
GSM/GPRS/EDGE network connection capability.
Qisda H20 HSUPA card can provides high speed data connection, the data
speed of downlink and uplink path is up to 7.2Mbps and 5.76Mbps respectively.
Furthermore, users can ease to use this module by using the “HMTool” application
software that we provide for Windows XP and Vista system.
With the Qisda H20 HSUPA module, devices are enhanced in both
functionality and usability based on state of the art wireless technology.
1.2 Application Device
Scope
Qisda H20 module is a high speed modem card with PCI Express minicard
form factor and is focusing on the Notebook, UMPC, MID and other portable
device marketing.
¾ Notebook
¾ Ultra Mobile PC
¾ Mobile Internet Device
¾ Wireless Router
¾ USB Modem
¾ Car Embedded System
2. FEATURES
2.1 General Characteristics
Bands:
Tri Band WCDMA and Quad Band GSM
Band
TX
RX
GSM850
824~849 MHz
869~894MHz
EGSM900
880~915 MHz
925~960MHz
DCS1800
1710~1785MHz
1805~1880MHz
PCS1900
1850~1910MHz
1930~1990MHz
WCDMA850
824~849 MHz
869~894MHz
WCDMA1900
1850~1910MHz
1930~1990MHz
WCDMA2100
1920~1980MHz
2110~2170MHz
z Support SIM Interface: 1.8V/3V
z Form factor
i.
Dimension: 50.95 x 30 x 5.0 mm
ii. Weight: 12g
z Power
Operation Voltage: 3.3V +/- 9%
z Power Consumption:
Speech Mode:
Band
Typ
Max
Unit
GSM850 / PCL=5
385
410
mA
EGSM900 / PCL=5
385
410
mA
DCS / PCL=0
330
350
mA
PCS / PCL=0
330
350
mA
WCDMA (all band)
750
820
mA
Typ (Average)
Max (Average)
Unit
GSM / Page frame=2
3.5
4.5
mA
GSM / Page frame=9
1.5
mA
DCS / Page frame=2
3.5
4.5
mA
DCS / Page frame=9
1.9
3.5
mA
PCS / Page frame=2
3.5
4.5
mA
PCS / Page frame=9
1.6
mA
WCDMA / DRX=6 (0.64 S)
4.2
5.5
mA
WCDMA / DRX=9 (5.12 S)
1.7
mA
Standby Mode:
z Hardware Interface:
52 Pins PCI Express Mini Card connector interface
2 RF Antenna Coaxial Connectors
z Software Interface:
USB driver
HMTool software tool.
2.2 RF Functionalities
Maximum TX Power
The performance of the transmitter meets test requirement ETSI TS 151 010-1 chapter
13.3 for GSM, chapter 13.17.3 for EDGE and TS 34.121 chapter 5.2&5.4.3 for
WCDMA, chapter 5.2A for HSDPA, chapter 5.2B for HSUPA.
Band
Max
Min
GSM850
33 dBm ±2dBm
5 dBm ±5dBm
EGSM
33 dBm ±2dBm
5 dBm ±5dBm
DCS
30 dBm ±2dBm
0 dBm ±5dBm
PCS
30 dBm ±2dBm
0 dBm ±5dBm
GSM850(EDGE)
27 dBm ±3dBm
5 dBm ±5dBm
EGSM(EDGE)
27 dBm ±3dBm
5 dBm ±5dBm
DCS(EDGE)
26 dBm ±3dBm
2 dBm ±5dBm
PCS(EDGE)
26 dBm ±3dBm
2 dBm ±5dBm
UMTS-2100
24 dBm +1/-3dBm
Less than -50dBm
UMTS-1900
24 dBm +1/-3dBm
Less than -50dBm
UMTS-850
24 dBm +1/-3dBm
Less than -50dBm
1/15≦βo/βd≦12/15 (HS-DPCCH)
24 dBm +1/-3dBm
13/15≦βo/βd≦15/8 (HS-DPCCH)
23 dBm +2/-3dBm
15/7≦βo/βd≦15/0 (HS-DPCCH)
22 dBm +3/-3dBm
Sub-test 1 (E-DCH)
24 dBm +1.7/-5.2dBm
Sub-test 2 (E-DCH)
22 dBm +3.7/-5.2dBm
Sub-test 3 (E-DCH)
23 dBm +2.7/-5.2dBm
Sub-test 4 (E-DCH)
22 dBm +3.7/-5.2dBm
Sub-test 5 (E-DCH)
24 dBm +1.7/-5.2dBm
Parametric Performance
Tests carried out at -20ºC, 25ºC and 60ºC for each voltage 3V, 3.3V and 3.6V. The
Measured Peak Phase, RMS Phase, frequency error, power level, and static sensitivity
meets ETSI TS 151 010-1 chapter 13.1 for GSM and TS 34.121 chapter 5.13.1 for
WCDMA, chapter 5.13.1A for HSDPA
Band (GSM)
Peak Phase Error
RMS Phase Error
GSM850
<20°
<5°
EGSM
<20°
<5°
DCS
<20°
<5°
PCS
<20°
<5°
Band (GSM)
Band (WCDMA)
Peak Phase Error
Error Vector Magnitude
UMTS-2100(HS-DPCCH)
<17.5%
UMTS-1900(HS-DPCCH)
<17.5%
UMTS-850(HS-DPCCH)
<17.5%
RMS Phase Error
Sensitivity
The performance of the receiver meets test requirement ETSI TS 151 010-1 chapter
14.2.1 for GSM, chapter 14.18.1 for EDGE and TS 34.121 chapter 6.2 for WCDMA.
Band
Typical
Min
GSM850
-107 dBm
-104 dBm
EGSM
-107 dBm
-104 dBm
DCS
-107 dBm
-103 dBm
PCS
-107 dBm
-103 dBm
EDGE(GMSK modulation)
-107 dBm
-104 dBm
EDGE(8-PSK modulation)
-104 dBm
-102 dBm
UMTS-2100(Primary)
-109 dBm
-106.7 dBm
UMTS-2100(Secondary)
-109 dBm
N/A
UMTS-1900(Primary)
-107 dBm
-104.7 dBm
UMTS-1900(Secondary)
-109 dBm
N/A
UMTS-850(Primary)
-109 dBm
-106.7 dBm
UMTS-850(Secondary)
-109 dBm
N/A
Radio Frequency
GSM850 (850 MHz)
Frequency Range
TX 824-849 MHz; RX 869-894 MHz
Channel Spacing
200 KHz
Number of Channels
124 Carriers x 8 (TDMA)
Modulation
GMSK / 8-PSK
Duplex Spacing
45 MHz
Frequency Stability
+/- 0.1 ppm (Uplink TX)
Power Output
33 dBm Class 8 (2 W peak) – 5 dBm
Output Impedance
50 Ohm
Spurious Emission
-36 dBm up to 1 GHz (< -30 dBm > 1 GHz)
EGSM (900 MHz)
Frequency Range
TX 880-915 MHz; RX 925-960 MHz
Channel Spacing
200 KHz
Number of Channels
124 Carriers x 8 (TDMA)
Modulation
GMSK / 8-PSK
Duplex Spacing
45 MHz
Frequency Stability
+/- 0.1 ppm (Uplink TX)
Power Output
33 dBm Class 8 (2 W peak) – 5 dBm
Output Impedance
50 Ohm
Spurious Emission
-36 dBm up to 1 GHz (< -30 dBm > 1 GHz)
DCS (1800 MHz)
Frequency Range
TX 1710-1785 MHz; RX 1805-1880 MHz
Channel Spacing
200 KHz
Number of Channels
374 Carriers x 8 (TDMA)
Modulation
GMSK / 8-PSK
Duplex Spacing
95 MHz
Frequency Stability
+/- 0.1 ppm (Uplink TX)
Power Output
30 dBm – 0 dBm
Output Impedance
50 Ohm
Spurious Emission
-36 dBm up to 1 GHz (< -30 dBm > 1 GHz)
Compatible with phase 2 feature
PCS (1900 MHz)
Frequency Range
TX: 1850~1910MHz; RX: 1930~1990MHz
Channel Spacing
200KHz
Number of Channels
299 Carriers x 8 (TDMA)
Modulation
GMSK / 8-PSK
Duplex Spacing
80 MHz
Frequency Stability
+/- 0.1 ppm (Uplink TX)
Power Output
30 dBm – 0 dBm
Output Impedance
50 Ohm
Spurious Emission
-36 dBm up to 1 GHz (< -30 dBm > 1 GHz)
Compatible with phase 2 feature
WCDMA_IMT (2100 MHz)
Frequency Range
TX: 1920~1980MHz; RX: 2110~2170MHz
Channel Raster
200KHz
Number of Channels
299 Carriers x 8 (TDMA)
Modulation
QPSK
Duplex Spacing
190 MHz
Frequency Stability
+/- 0.1 ppm (Uplink TX)
Power Output
24 dBm +1/-3dBm - less than -50dBm
Output Impedance
50 Ohm
Spurious Emission
-67dBm(925-935MHz);-79dBm(935-960MHz);-71dBm(1805-1880MHz)
;-60dBm(1845-1880MHz);-41dBm(1885-1920MHz)
WCDMA_PCS (1900 MHz)
Frequency Range
TX: 1850~1910MHz; RX: 1930~1990MHz
Channel Raster
200KHz
Number of Channels
299 Carriers x 8 (TDMA)
Modulation
QPSK
Duplex Spacing
80 MHz
Frequency Stability
+/- 0.1 ppm (Uplink TX)
Power Output
24 dBm +1/-3dBm - less than -50dBm
Output Impedance
50 Ohm
Spurious Emission
WCDMA_850 (850 MHz)
Frequency Range
TX 824-849 MHz; RX 869-894 MHz
Channel Raster
200KHz
Number of Channels
299 Carriers x 8 (TDMA)
Modulation
QPSK
Duplex Spacing
45 MHz
Frequency Stability
+/- 0.1 ppm (Uplink TX)
Power Output
24 dBm +1/-3dBm - less than -50dBm
Output Impedance
50 Ohm
Spurious Emission
-60dBm(869-894MHz;1930-1990MHz;2110-2155MHz)
3. HARDWARE DESCRIPTION
3.1 System Interface
The I/O connectors of H20 module are PCI EXPRESS MINI CARD and two RF
antenna connectors. Table 3-1 summarizes the 25 signals and 18 power lines that are
supported by the PCI Express Mini Card System Interface. Table 3-2 shows the
antenna interface.
Table 3-1 System Interface
Signal Group
Pin no.
Description
Power
3.3V power source
GND
13
Return current path
USB
USB serial data interface compliant to the USB 2.0 specification
PERST#
Function reset to the card
W_DISABLE#
Shutdown the HSDPA module
UIM
SIM function
LED
Status indicators
Table 3-2 Antenna interface
Signal Group
ANT
Connector no.
Description
Antenna interface
3.2 Functional Diagram
3.3 Pin Description
Pin
Signal name
Direction
Description
NC
No connect
+3.3Vaux
NC
GND
NC
No connect
NC
No connect
NC
No connect
UIM_PWR
Output
Power source for the USIM
GND
Power
Return current path
10
UIM_DATA
11
NC
12
UIM_CLK
13
NC
14
UIM_RESET
Output
USIM reset signal
15
GND
Power
Return current path
16
NC
No connect
17
NC
No connect
18
GND
19
NC
Power
3.3V power source
No connect
Power
Input / Output
Return current path
USIM data signal
No connect
Output
USIM clock signal
No connect
Power
Return current path
No connect
Active low signal.
20
W_DISABLE#
Input
This signal is used by the system to
shutdown the HSDPA module.
21
GND
Power
Return current path
22
PERST#
Input
23
NC
24
+3.3Vaux
25
NC
26
GND
Power
Return current path
27
GND
Power
Return current path
28
NC
29
GND
30
NC
No connect
31
NC
No connect
Active low signal.
Function reset to the card.
No connect
Power
3.3V power source
No connect
No connect
Power
Return current path
32
NC
No connect
33
NC
No connect
34
GND
Power
Return current path
35
GND
Power
Return current path
36
USB_D-
37
GND
38
USB_D+
Input / Output
39
+3.3Vaux
Power
3.3V power source
40
GND
Power
Return current path
41
+3.3Vaux
Power
3.3V power source
42
LED_WWAN#
Output
43
GND
Power
44
LED_WLAN#
Output
45
NC
46
LED_WPAN#
47
NC
No connect
48
NC
No connect
49
NC
No connect
50
GND
51
NC
52
+3.3Vaux
Input / Output
Power
USB serial data interface (negative)
Return current path
USB serial data interface (postive)
Active low signal.
WAN status LED driver.
Return current path
Active low signal.
LAN status LED driver.
No connect
Output
Power
Active low signal.
PAN status LED driver.
Return current path
No connect
Power
3.3V power source
3.4 Terminal Definition
Recommend antenna connect
Hirose Coaxial Connectors
System connector
52 pins PCI Express Mini Card
3.5 Electrical Characteristics
DC characteristics
Pin
Function/ Name
NC
+3.3Vaux
NC
GND
NC
NC
NC
UIM_PWR
Direction
Parameter
Power
Power Supply Voltage
Power
Ground
Supply Voltage
Min Typ Max Unit
3.0
3.3
3.6
1.5
2.85
3.05
Output
Current
GND
Power
10
UIM_DATA
Input / Output
11
NC
12
UIM_CLK
13
NC
14
UIM_RESET
Output
15
GND
Power
Ground
16
NC
17
NC
18
GND
Power
Ground
19
NC
20
W_DISABLE#
150
mA
Ground
Output
Logic High Input Voltage
1.69
2.6
3.3
Logic Low Input Voltage
-0.3
0.91
Logic High Input Voltage
1.69
2.6
3.3
Logic Low Input Voltage
-0.3
0.91
Power
Power Supply Voltage
3.0
3.3
3.6
Input
21
GND
Power
22
PERST#
Input
Ground
23
NC
24
+3.3Vaux
25
NC
26
GND
Power
Ground
27
GND
Power
Ground
28
NC
29
GND
Power
Ground
30
NC
31
NC
32
NC
33
NC
34
GND
Power
Ground
35
GND
Power
Ground
36
USB_D-
Input / Output
Termination Voltage
37
GND
Power
Ground
38
USB_D+
Input / Output
39
+3.3Vaux
40
3.0
3.3
3.6
Termination Voltage
3.0
3.3
3.6
Power
Power Supply Voltage
3.0
3.3
3.6
GND
Power
Ground
41
+3.3Vaux
Power
Power Supply Voltage
3.0
3.3
3.6
42
LED_WWAN#
Output
Driver current
150
mA
43
GND
Power
Ground
44
LED_WLAN#
Output
Driver current
150
mA
45
NC
46
LED_WPAN#
Output
Driver current
300
mA
47
NC
48
NC
49
NC
50
GND
Power
Ground
51
NC
52
+3.3Vaux
Power
Power Supply Voltage
3.0
3.6
Parameter
Min
Typ
Max
Unit
Logic High Input Voltage
1.69
2.6
2.9
Logic Low Input Voltage
-0.3
0.91
Logic High Output Voltage
2.15
2.6
2.6
Logic Low Output Voltage
-0.3
0.45
3.3
Digital interface
USB Transceiver DC characteristics
The USB interface is powered from 3.3V power source.
Parameter
Comments
Input sensitivity (differential)
|D+－D-|, VIN=0.8 to 2.5V
Min
Typ
Max
0.2
Unit
Output voltage
Logic LOW
RL=1.5KΩ to 3.6V
Logic HIGH
RL=1.5KΩ to GND, IO=1mA
2.8
Series output resistance
D+, D-
28
33
0.3
3.6
44
Ω
Internal pull-up resistor
3.3V to D+, 3.3V to D-
1.425
1.5
1.575
KΩ
Internal pull-down resistor
D+ to GND, D- to GND
14.3
15
24.8
KΩ
USIM Interface
The USIM signals are defined on system connector to provide the interface between
the removable User Identity Module. USIM interface usually run off either 1.8V or
3.0V.
Pin
Name
Direction
Description
UIM_PWR
Output
Power source for the USIM
10
UIM_DATA
Input / Output
USIM data signal
12
UIM_CLK
Output
USIM clock signal
14
UIM_RESET
Output
USIM reset signal
Parameter
Min
Typ
Max
Unit
Logic High Input Voltage
1.8525
2.85
3.15
Logic Low Input Voltage
-0.3
0.9975
Logic High Output Voltage
2.4
2.85
2.85
Logic Low Output Voltage
-0.3
0.45
Schmitt Hysteresis
150
Logic input leakage current
-200
200
nA
30
KΩ
Internal pull-up resistor
Comments
Programmable range
mV
3.6 Environmental
Operational temperature: -20 ~ +60 ℃
Functional temperature: -20 ~ +70 ℃
Storage temperature: -40 ~ +85 ℃
Note:
¾ The maximum case temperature (Tc) of shielding case cover should be under 90
℃ (@RF TX power = 24dBm) for ensure all of the characteristics of H20 module
can be fulfilled the ETSI specification.
¾
3.7 Physical Package
Top View
Bottom View
Side View
4. SOFTWARE CHARACTERISTICS
4.1 Introduction
We provide the PC Tool – HMTool for H20 HSUPA card. The main functions in this
tool are Contacts (only SIM card), SMS, Settings, and Network Management.
4.2 Software Architecture
FEDERAL COMMUNICATIONS COMMISSION INTERFERENCE STATEMENT
This mobile device meets guidelines for exposure to radio waves. Your mobile device is a radio
transmitter and receiver. It is designed not to exceed the limits for exposure to radio waves
recommended by international guidelines.
This equipment has been tested and found to comp ly with the limits for a Class B digit al
device, pursuant to P art 15 of the FCC Ru les. Thes e limit s are designed to provide
reasonable protection against harmful interfer ence in a residential inst allation. This
equipment generates, uses and c an radiate radio frequency energy and, if not inst alled
and used in accordance with the instructions, may cause harmful interference to radio
communications. However , there is no guarant ee that interference will not occur in a
particular inst allation. If this equipment does cause harmful i nterference to radio or
television reception, which c an be determined by turning the equipment of f and on, th e
user is encouraged to try to correct the interference by one or more of the following
measures:
– Reorient or relocate the receiving antenna.
– Increase the separation between the equipment and receiver.
– Connect the equipment into an outlet on a circ
uit dif ferent from that to w hich the
receiver is connected.
– Consult the dealer or an experienced radio/TV technician for help.
CAUTION:
Any changes or modifications not expre
ssly approved by the p arty responsible for
compliance could void the user's authority to operate the equipment.
FCC RF Radiation Exposure Statement
This equipment complies with F CC RF radiation exposure limits set forth for an uncontrolled
environment. This equipment must be inst alled and operated with a minimum dist ance of
20cm between the radiator and your body.
-28-

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