Quectel Wireless Solutions 201703FC20N WiFi Module User Manual

Quectel Wireless Solutions Company Limited WiFi Module

User Manual

FC20-N Series Hardware Design Wi-Fi Module Series Rev. FC20-N_Series_Hardware_Design_V1.0 Date: 2016-11-02 www.quectel.com
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 1 / 47 Our aim is to provide customers with timely and comprehensive service. For any assistance, please contact our company headquarters: Quectel Wireless Solutions Co., Ltd. Office 501, Building 13, No.99, Tianzhou Road, Shanghai, China, 200233 Tel: +86 21 5108 6236 Email: info@quectel.com Or our local office. For more information, please visit: http://www.quectel.com/support/salesupport.aspx For technical support, or to report documentation errors, please visit: http://www.quectel.com/support/techsupport.aspx Or email to: Support@quectel.com GENERAL NOTES QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO CHANGE WITHOUT PRIOR NOTICE. COPYRIGHT THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF QUECTEL CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY MODEL OR DESIGN. Copyright © Quectel Wireless Solutions Co., Ltd. 2016. All rights reserved.
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 2 / 47 About the Document History Revision Date Author Description 1.0 2016-11-02 Power JIN Initial
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 3 / 47 Contents About the Document ................................................................................................................................... 2 Contents ....................................................................................................................................................... 3 Table Index ................................................................................................................................................... 5 Figure Index ................................................................................................................................................. 6 1 Introduction .......................................................................................................................................... 7 1.1. Safety Information ................................................................................................................... 7 2 Product Concept .................................................................................................................................. 9 2.1. General Description ................................................................................................................. 9 2.2. Directives and Standards ........................................................................................................ 9 2.2.1. FCC Statement ................................................................................................................. 9 2.2.2. FCC Radiation Exposure Statement ................................................................................ 9 2.3. Key Features ......................................................................................................................... 10 2.4. Functional Diagram ............................................................................................................... 11 2.5. Evaluation Board ................................................................................................................... 12 3 Application Interfaces ....................................................................................................................... 13 3.1. General Description ............................................................................................................... 13 3.2. Pin Assignment ...................................................................................................................... 14 3.3. Pin Description ...................................................................................................................... 15 3.4. Power Supply ........................................................................................................................ 18 3.5. WLAN Interface ..................................................................................................................... 20 3.5.1. WAKE_ON_WIRELESS Interface ................................................................................. 21 3.5.2. WLAN_EN ...................................................................................................................... 21 3.5.3. SDIO Interface ............................................................................................................... 21 3.6. Coexistence Interface ............................................................................................................ 23 3.7. Other Interfaces ..................................................................................................................... 23 3.7.1. DBG_TXD Interface ....................................................................................................... 23 3.7.2. 32KHz_IN Interface ........................................................................................................ 24 3.8. Antenna Interface .................................................................................................................. 24 3.8.1. Pin Definition of the RF Antenna .................................................................................... 24 3.8.2. Operating Frequency ..................................................................................................... 25 3.8.3. Reference Design .......................................................................................................... 25 3.8.4. Antenna Requirements .................................................................................................. 25 3.8.5. Install the Antenna with RF Connector .......................................................................... 26 4 Electrical, Reliability and Radio Characteristics ............................................................................ 29 4.1. General Description ............................................................................................................... 29 4.2. Electrical Characteristics ....................................................................................................... 29 4.3. I/O Interface Characteristics .................................................................................................. 30 4.4. Current Consumption ............................................................................................................ 30
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 4 / 47 4.5. RF Performance .................................................................................................................... 32 4.6. Electrostatic Discharge .......................................................................................................... 34 5 Mechanical Dimensions .................................................................................................................... 35 5.1. Mechanical Dimensions of the Module ................................................................................. 35 5.2. Recommended Footprint and Stencil .................................................................................... 37 5.3. Top and Bottom View of the Module ..................................................................................... 39 6 Storage, Manufacturing and Packaging .......................................................................................... 40 6.1. Storage .................................................................................................................................. 40 6.2. Soldering ............................................................................................................................... 41 6.3. Packaging .............................................................................................................................. 42 6.3.1. Tape and Reel Packaging .............................................................................................. 42 7 Appendix A References ..................................................................................................................... 44
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 5 / 47 Table Index TABLE 1: FC20 SERIES PRODUCTS ................................................................................................................ 7 TABLE 2: KEY FEATURES ............................................................................................................................... 10 TABLE 3: I/O PARAMETERS DEFINITION ....................................................................................................... 15 TABLE 4: PIN DESCRIPTION ........................................................................................................................... 15 TABLE 5: POWER SUPPLY PINS AND GND PINS .......................................................................................... 18 TABLE 6: PIN DEFINITION OF WAKE_ON_WIRELESS ................................................................................. 21 TABLE 7: PIN DEFINITION OF WLAN_EN ....................................................................................................... 21 TABLE 8: PIN DEFINITION OF THE SDIO INTERFACE .................................................................................. 21 TABLE 9: PIN DEFINITION OF COEXISTENCE INTERFACE ......................................................................... 23 TABLE 10: PIN DEFINITION OF DBG_TXD INTERFACE ................................................................................ 24 TABLE 11: PIN DEFINITION OF 32KHZ_IN INTERFACE ................................................................................ 24 TABLE 12: PIN DEFINITION OF THE RF ANTENNA ....................................................................................... 24 TABLE 13: OPERATING FREQUENCY OF THE MODULE ............................................................................. 25 TABLE 14: ANTENNA CABLE REQUIREMENTS ............................................................................................. 26 TABLE 15: ANTENNA REQUIREMENTS .......................................................................................................... 26 TABLE 16: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 29 TABLE 17: RECOMMENDED OPERATING CONDITIONS .............................................................................. 30 TABLE 18: GENERAL DC ELECTRICAL CHARACTERISTICS ....................................................................... 30 TABLE 19: CURRENT CONSUMPTION OF THE MODULE IN LOW POWER MODE .................................... 30 TABLE 20: CURRENT CONSUMPTION OF THE MODULE ............................................................................ 31 TABLE 21: CONDUCTED RF OUTPUT POWER AT 2.4GHZ .......................................................................... 32 TABLE 22: CONDUCTED RF OUTPUT POWER AT 5GHZ ............................................................................. 33 TABLE 23: CONDUCTED RF RECEIVING SENSITIVITY AT 2.4GHZ ............................................................. 33 TABLE 24: CONDUCTED RF RECEIVING SENSITIVITY AT 5GHZ ................................................................ 34 TABLE 25: REEL PACKAGING ......................................................................................................................... 43 TABLE 26: RELATED DOCUMENTS ................................................................................................................ 44 TABLE 27: TERMS AND ABBREVIATIONS ...................................................................................................... 44
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 6 / 47 Figure Index FIGURE 1: FUNCTIONAL DIAGRAM OF FC20-N MODULE ............................................................................ 11 FIGURE 2: PIN ASSIGNMENT OF FC20 SERIES MODULE ........................................................................... 14 FIGURE 3: REFERENCE CIRCUIT FOR VDD_3V3 ........................................................................................ 19 FIGURE 4: TIMING OF POWER ON/OFF THE FC20 SERIES MODULE ....................................................... 20 FIGURE 5: WLAN INTERFACE CONNECTION ............................................................................................... 20 FIGURE 6: SDIO INTERFACE CONNECTION ................................................................................................. 22 FIGURE 7: COEXISTENCE INTERFACE CONNECTION ................................................................................ 23 FIGURE 8: REFERENCE CIRCUIT FOR RF ANTENNA INTERFACE ............................................................ 25 FIGURE 9: DIMENSIONS OF THE UF.L-R-SMT CONNECTOR (UNIT: MM) .................................................. 26 FIGURE 10: MECHANICALS OF UF.L-LP CONNECTORS (UNIT: MM) .......................................................... 27 FIGURE 11: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ............................................................ 27 FIGURE 12: FC20 TOP AND SIDE DIMENSIONS (UNIT: MM) ........................................................................ 35 FIGURE 13: FC20 BOTTOM DIMENSIONS (UNIT: MM) ................................................................................. 36 FIGURE 14: RECOMMENDED FOOTPRINT (UNIT: MM) ................................................................................ 37 FIGURE 15: RECOMMENDED STENCIL (UNIT: MM) ..................................................................................... 38 FIGURE 16: TOP VIEW OF THE MODULE ...................................................................................................... 39 FIGURE 17: BOTTOM VIEW OF THE MODULE .............................................................................................. 39 FIGURE 18: REFLOW SOLDERING THERMAL PROFILE .............................................................................. 41 FIGURE 19: TAPE DIMENSIONS (UNIT: MM) .................................................................................................. 42 FIGURE 20: REEL DIMENSIONS (UNIT: MM) ................................................................................................. 43
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 7 / 47 1 Introduction This document defines the FC20 series module and describes its hardware interface which is connected with the customer’s application as well as its air interface. The document can help customers quickly understand module interface specifications, as well as the electrical and mechanical details. Associated with application note and user guide, customers can use FC20 series module to design and set up mobile applications easily. FC20 series module contains two variants: FC20 and FC20-N. Customers can choose the dedicated type basing on their requirements. The following table shows the entire models of FC20 series. Table 1: FC20 Series Products 1.1. Safety Information The following safety precautions must be observed during all phases of the operation, such as usage, service or repair of any cellular terminal or mobile incorporating FC20 series module. Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for the customer’s failure to comply with these precautions. Full attention must be given to driving at all times in order to reduce the risk of an accident. Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an accident. You must comply with laws and regulations restricting the use of wireless devices while driving. Module Wi-Fi BT FC20-N 2.4GHz Not Supported
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 8 / 47 Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden, so as to prevent interference with communication systems. Consult the airline staff about the use of wireless devices on boarding the aircraft, if your device offers an Airplane Mode which must be enabled prior to boarding an aircraft. Switch off your wireless device when in hospitals, clinics or other health care facilities. These requests are desinged to prevent possible interference with sensitive medical equipment. Cellular terminals or mobiles operating over radio frequency signal and cellular network cannot be guaranteed to connect in all conditions, for example no mobile fee or with an invalid SIM card. While you are in this condition and need emergent help, please remember using emergency call. In order to make or receive a call, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Your cellular terminal or mobile contains a transmitter and receiver. When it is ON, it receives and transmits radio frequency energy. RF interference can occur if it is used close to TV set, radio, computer or other electric equipment. In locations with potentially explosive atmospheres, obey all posted signs to turn off wireless devices such as your phone or other cellular terminals. Areas with potentially explosive atmospheres include fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities, areas where the air contains chemicals or particles such as grain, dust or metal powders, etc.
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 9 / 47 2 Product Concept 2.1. General Description FC20-N module is a low-power and low-cost wireless module based on QCA9377-3. FC20-N module only supports 1×1 IEEE 802.11 b/g/n WLAN standards. 2.2. Directives and Standards The FC20-N module is designed to comply with the FCC statements. FCC ID: XMR201703FC20N The Host system using FC20-N should have label “contains FCC ID: XMR201701FC20N 2.2.1. FCC Statement Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. 2.2.2. FCC Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator and your body as well as kept minimum 20cm from radio antenna depending on the Mobile status of this module usage. This module should NOT be installed and operating simultaneously with other radio. The manual of the host system, which uses FC20-N, must include RF exposure warning statement to advice user should keep minimum 20cm from the radio antenna of FC20-N module depending on the Mobile status. Note: If a portable device (such as PDA) uses FC20-N module, the device needs to do permissive change and SAR testing. Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 10 / 47 interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: -Reorient or relocate the receiving antenna. -Increase the separation between theequipment and receiver. -Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. 2.3. Key Features The following table describes the detailed features of FC20-N module. Table 2: Key Features Features Implementation Power Supply Main supply voltage: 3.3V, 400mA IO supply voltage: 1.8V Transmission Data FC20-N: 802.11b: 1, 2, 5.5, 11Mbps 802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps Transmitting Power FC20-N: 802.11b/11Mbps: 17dBm 802.11g/54Mbps: 15dBm 802.11n/HT20 MCS7: 14dBm 802.11n/HT40 MCS7: 13dBm Protocol Features FC20-N: IEEE 802.11b/g/n Operator Mode AP STA* Modulation 802.11b: DSSS 802.11g/n20/n40: OFDM WLAN Interface SDIO 3.0 Antenna Interface Wi-Fi antenna, 50Ω Physical Characteristics Size: 16.6±0.15 × 13±0.15 × 2.1±0.2mm Interface: LCC+LGA Weight: about 0.81g Temperature Range Operating temperature range: -35°C~+75°C 1) Extended temperature range : -40°C~+85°C 2)
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 11 / 47 1. 1) Within operation temperature range, the module is IEEE compliant. 2. 2) Within extended temperature range, the module remains the ability for data transmission. There is no unrecoverable malfunction. There are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to the normal operating temperature levels, the module will meet IEEE compliant again. 2.4. Functional Diagram The following figure shows a block diagram of FC20-N module and illustrates the major functional parts.  Power supply  SDIO  PCM and UART  RF antenna WLAN_EN RF_ANTVDD_3V3VIODiplexer48MHzXOTX/RXSDIOMAC/BB/Radio 2.4G FilterCOEX_UARTWAKE_ON_WIRELESS Figure 1: Functional Diagram of FC20-N Module RoHS All hardware components are fully compliant with EU RoHS directive NOTES NOTE
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 12 / 47 Please keep these pins open in FC20-N. 2.5. Evaluation Board In order to help customers to develop applications with FC20-N module, Quectel supplies an evaluation board (EVB), a RS-232 to USB cable, a USB data cable, a power adapter, 4 antennas and other peripherals to control or test the module. For details, please refer to document [1].
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 13 / 47 3 Application Interfaces 3.1. General Description FC20-N module is equipped with 38 LCC pads and 14 LGA pads that can be connected to the cellular application platform. Sub-interfaces included in these pads are described in details in following chapters:  Power supply  WLAN interface  Coexistence interface  Antenna interface
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 14 / 47 3.2. Pin Assignment 323435333637382928303127262423252221201917161815141347484946WLAN_ENGNDRF_ANTGNDGNDSDIO_CMDSDIO_CLKSDIO_D0SDIO_D1SDIO_D2SDIO_D3VDD_3V3GNDGNDRESERVEDDBG_TXDBT_UART_CTSBT_ENVIORESERVEDGND PinsLTE_UART_TXDLTE_UART_RXDBT_UART_RTS34215689710111251 50524039414244 4543PCM_INPCM_SYNCPCM_CLKPCM_OUTBT_UART_TXDBT_UART_RXD32KHz_INGNDGNDRESERVEDRESERVEDRESERVEDRESERVEDWAKE_ON_WIRELESSPower PinsGNDSignal Pins Reserved Pins Figure 2: Pin Assignment of FC20 Series Module Please keep all RESERVED pins open. NOTE
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 15 / 47 3.3. Pin Description The following tables show the pin definition of FC20 series. Table 3: I/O Parameters Definition Type Description IO Bidirectional input/output DI Digital input DO Digital output PI Power input Table 4: Pin Description Power Supply Pin Name Pin No. I/O Description DC Characteristics Comment VDD_3V3 21 PI Main power supply for module Vmax=3.46V Vmin=3.14V Vnorm=3.3V It must be able to provide sufficient current up to 0.9A. VIO 11 PI Power supply for module IO pin Vmax=1.89V Vmin=1.71V Vnorm=1.8V It is powered by EC20 R2.0/EC21/EC25 module. GND 1, 12, 20, 28, 29, 31, 36, 38~40, 43~45, 48~52 Ground WLAN Interface Pin Name Pin No. I/O Description DC Characteristics Comment WAKE_ON_ WIRELESS 32 DO Wake up host VOLmax=0.18V VOHmin=1.62V 1.8V power domain. Active low. If unused, keep this pin open. WLAN_EN 9 DI WLAN enabled VILmin=-0.3V VILmax=0.54V 1.8V power domain. Active high.
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 16 / 47 VIHmin=1.26V VIHmax=2.0V SDIO_D3 22 IO SDIO data pin bit 3 VOLmax=0.18V VOHmin=1.62V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain SDIO_D2 23 IO SDIO data pin bit 2 VOLmax=0.18V VOHmin=1.62V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain. Require external pull-up to 1.8V. SDIO_D1 24 IO SDIO data pin bit 1 VOLmax=0.18V VOHmin=1.62V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain SDIO_D0 25 IO SDIO data pin bit 0 VOLmax=0.18V VOHmin=1.62V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain SDIO_CLK 26 DI SDIO clock VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain SDIO_CMD 27 IO SDIO command VOLmax=0.18V VOHmin=1.62V VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain BT Interface Pin Name Pin No. I/O Description DC Characteristics Comment BT_EN 10 DI Bluetooth enabled VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain. Active high.
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 17 / 47 PCM_IN 13 DI Bluetooth PCM data input VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain. If unused, keep this pin open. PCM_SYNC 14 DI Bluetooth PCM data frame sync signal VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain. If unused, keep this pin open. PCM_CLK 15 DI Bluetooth PCM clock VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain. If unused, keep this pin open. PCM_OUT 16 DO Bluetooth PCM data output VOLmax=0.18V VOHmin=1.62V 1.8V power domain. If unused, keep this pin open. BT_UART_ RTS 7 DO Request to send VOLmax=0.18V VOHmin=1.62V 1.8V power domain. If unused, keep this pin open. BT_UART_ CTS 8 DI Clear to send VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain. If unused, keep this pin open. BT_UART_ TXD 17 DO Bluetooth transmits data VOLmax=0.18V VOHmin=1.62V 1.8V power domain. If unused, keep this pin open. BT_UART_ RXD 18 DI Bluetooth receives data VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain. If unused, keep this pin open. Coexistence Interface Pin Name Pin No. I/O Description DC Characteristics Comment LTE_UART_ TXD 5 DO LTE coexistence signal VOLmax=0.18V VOHmin=1.62V 1.8V power domain. If unused, keep this pin open. LTE_UART_ RXD 6 DI LTE coexistence signal VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain. If unused, keep this pin open. RF Interface Pin Name Pin No. I/O Description DC Characteristics Comment
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 18 / 47 RF_ANT 30 IO WLAN and BT antenna 50Ω impedance. Other Pins Pin Name Pin No. I/O Description DC Characteristics Comment DBG_TXD 4 DO Software debugging VOLmax=0.18V VOHmin=1.62V 1.8V power domain. If unused, keep this pin open. 32KHz_IN 19 DI Low power. External 32.768KHz clock input is required in sleep mode. VILmin=-0.3V VILmax=0.54V VIHmin=1.26V VIHmax=2.0V 1.8V power domain. If unused, keep this pin open. RESERVED Pins Pin Name Pin No. I/O Description DC Characteristics Comment RESERVED 2, 3, 33~35, 37, 41, 42, 46, 47 Reserved Keep these pins unconnected. FC20-N module does not support BT interface and coexistence interface. 3.4. Power Supply The following table shows the power supply pins and the ground pins of FC20 series. The VIO is powered by EC20 R2.0/EC21/EC25. Table 5: Power Supply Pins and GND Pins Pin Name Pin No. Description Min. Typ. Max. Unit VDD_3V3 21 Main power supply for module 3.14 3.3 3.46 V VIO 11 Power supply for module IO 1.71 1.8 1.89 V GND 1, 12, 20, Ground NOTE
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 19 / 47 28, 29, 31, 36, 38~40, 43~45, 48~52 FC20 series is powered by VDD_3V3, and it is recommended to use power supply chip whose maximum output current is more than 1.2A. The following figure shows a reference design for VDD_3V3, which is controlled by PM_ENABLE. And PM_ENABLE should be connected to pin 127 of EC20 R2.0/EC21/EC25. For more details, please refer to document [2], [3] or [4]. TPS630242L1L1L2L2VINVINVINVINAGNDENVOUTVOUTVOUTPFM/PWMFBPGNDD2D3E1E2E3E4C4D1 B1A1L1 L2PGNDPGNDU402D4B2B3A2A3A4B4C1C2C3C406R408C40510uF1ML4011uHR407100K22uFC40722uFPM_ENABLEDC_5VDC_5VVDD_3V3 Figure 3: Reference Circuit for VDD_3V3
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 20 / 47 The following figure shows the recommended power on/off sequences for FC20 series. VDD_3V3≥ 5usModule Status RunnigWLAN_ENPower up Power downTBDPM_ENABLE>0 > 0VIOBT_EN Figure 4: Timing of Power ON/OFF the FC20 Series Module Execute AT command AT+QWIFI=1 to open VDD_3V3 and WLAN. 3.5. WLAN Interface The following figure shows the WLAN interface connection between FC20 series and EC20 R2.0/EC21/EC25. EC20 R2.0/EC21/EC25FC20 SeriesSDIOWLAN_ENWLAN_ENWAKE_ON_WIRELESSWAKE_ON_WIRELESSSDIO Figure 5: WLAN Interface Connection
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 21 / 47 3.5.1. WAKE_ON_WIRELESS Interface WAKE_ON_WIRELESS interface is used to wake up the EC20 R2.0/EC21/EC25. When WAKE_ON_WIRELESS is pulled down, EC20 R2.0/EC21/EC25 can be woken up. Table 6: Pin Definition of WAKE_ON_WIRELESS Pin Name Pin No. I/O Description Comment WAKE_ON_WIRELESS 32 DO Wake up host Active low. If unused, keep this pin open. 3.5.2. WLAN_EN WLAN_EN is used to control the WLAN function of FC20 series. When WLAN_EN is at high level voltage, WLAN function will be enabled. Table 7: Pin Definition of WLAN_EN Pin Name Pin No. I/O Description Comment WLAN_EN 9 DI WLAN enabled Active high WLAN_EN is a sensitive signal, which should be guarded by ground and routed as close as possible to FC20 series module. 3.5.3. SDIO Interface The following table shows the pin definition of the SDIO interface of FC20 series. Table 8: Pin Definition of the SDIO Interface Pin Name Pin No. I/O Description Comment SDIO_D3 22 IO SDIO data pin bit 3 1.8V power domain SDIO_D2 23 IO SDIO data pin bit 2 1.8V power domain. Require external pull-up to NOTE
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 22 / 47 1.8V. SDIO_D1 24 IO SDIO data pin bit 1 1.8V power domain SDIO_D0 25 IO SDIO data pin bit 0 1.8V power domain SDIO_CLK 26 DI SDIO clock 1.8V power domain SDIO_CMD 27 IO SDIO command 1.8V power domain The following figure shows the SDIO interface connection between FC20 series and EC20 R2.0/EC21/EC25. SDIO_CLKSDIO_CMDSDIO_D0SDIO_D1SDIO_D2SDIO_D3EC20 R2.0/EC21/EC25FC20 SeriesSD1_D0SD1_D1SD1_D2SD1_D3SD1_CLKSD1_CMD10KNM_10KVIO VIO VIO VIO VIO VIONM_10KNM_10KNM_10KNM_10KNM_10nF Figure 6: SDIO Interface Connection In order to ensure the performance of SDIO, please comply with the following principles:  SDIO signals are very high-speed signals. Please prevent crosstalk between them and other sensitive signals.  Keep SDIO traces as parallel as possible in the same layer. Make sure SDIO lines are guarded by ground vias and not crossed.  Do not route SDIO signal traces under crystals, oscillators, magnetic devices and RF signal traces.  The pull-up resistor on SDIO_D2 line must be mounted.  Keep SDIO traces as short as possible with equal length, and impedance control as 50Ω.  The spacing to all other signals is greater than 2 times of the line width.
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 23 / 47 3.6. Coexistence Interface Coexistence function is only supported by FC20. Please keep these pins open in FC20-N. The following table shows the pin definition of FC20’s coexistence interface. Table 9: Pin Definition of Coexistence Interface Pin Name Pin No. I/O Description Comment LTE_UART_TXD 5 DO LTE coexistence signal If unused, keep this pin open. LTE_UART_RXD 6 DI LTE coexistence signal If unused, keep this pin open. FC20 module supports LTE-WLAN coexistence and LTE-BT coexistence. The following figure shows the coexistence interface connection between FC20 and EC20 R2.0/EC21/EC25. LTE_UART_RXDLTE_UART_TXDFC20 COEX_UART_RXCOEX_UART_TXEC2 R2.0/EC21/EC25 Figure 7: Coexistence Interface Connection LTE-BT coexistence function is under development. 3.7. Other Interfaces 3.7.1. DBG_TXD Interface DBG_TXD interface can be used for log output. NOTE
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 24 / 47 Table 10: Pin Definition of DBG_TXD Interface Pin Name Pin No. I/O Description Comment DBG_TXD 4 DO Software debugging If unused, keep this pin open. 3.7.2. 32KHz_IN Interface The 32KHz clock is used in low power mode such as IEEE power saving mode and sleep mode. It serves as a timer to determine when to wake up FC20 series module to receive beacons in various power saving schemes, and to maintain basic logic operations when in sleep mode. The sleep clock signal is transferred from EC20 R2.0/EC21/EC25 module. Table 11: Pin Definition of 32KHz_IN Interface Pin Name Pin No. I/O Description Comment 32KHz_IN 19 DI Low power. External 32.768KHz clock input is required in sleep mode. If unused, keep this pin open. 3.8. Antenna Interface The pin 30 is the RF antenna pad. And the RF interface has an impedance of 50Ω. 3.8.1. Pin Definition of the RF Antenna Table 12: Pin Definition of the RF Antenna Pin Name Pin No. I/O Description Comment GND 28 Ground GND 29 Ground
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 25 / 47 RF_ANT 30 IO RF antenna pad 50Ω impedance GND 31 Ground 3.8.2. Operating Frequency Table 13: Operating Frequency of the Module Feature Frequency Unit WLAN-2.4GHz 2.412~2.462 GHz 3.8.3. Reference Design FC20 series module provides an RF antenna pad for antenna connection. The RF trace in host PCB connected to the module’s RF antenna pad should be microstrip line or other types of RF trace, whose characteristic impendence should be close to 50Ω. FC20 series module comes with grounding pads which are next to the antenna pad in order to give a better grounding. The RF external circuit is recommended as following figure. And a π-type matching circuit should be reserved for better RF performance. The capacitors are not mounted by default. RF_ANT R1 C1NMC2NMFC20 Series0R Figure 8: Reference Circuit for RF Antenna Interface 3.8.4. Antenna Requirements The following table shows the requirements on RF antenna.
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 26 / 47 Table 14: Antenna Cable Requirements Type Requirements 2.412~2.462GHz Cable insertion loss <1dB Table 15: Antenna Requirements Type Requirements Frequency Range 2.412~2.462GHz VSWR <2:1 recommended Gain (dBi) 1 typical Max Input Power (W) 50 Input Impedance (Ω) 50 Polarization Type Vertical 3.8.5. Install the Antenna with RF Connector The following figure is the antenna installation with RF connector provided by HIROSE. The recommended RF connector is UF.L-R-SMT. Figure 9: Dimensions of the UF.L-R-SMT Connector (Unit: mm)
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 27 / 47 Customers can use U.FL-LP serial connector listed in the following figure to match the UF.L-R-SMT. Figure 10: Mechanicals of UF.L-LP Connectors (Unit: mm) The following figure describes the space factor of mated connector Figure 11: Space Factor of Mated Connector (Unit: mm)
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 28 / 47 For more details, please visit http://www.hirose.com.
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 29 / 47 4 Electrical, Reliability and Radio Characteristics 4.1. General Description This chapter mainly introduces the electrical and the radio frequency characteristics of FC20 series module, which are listed in detail in the following chapters:  Electrical characteristics  I/O interface characteristics  Current consumption  RF performance  Electrostatic discharge 4.2. Electrical Characteristics The following table shows the absolute maximum ratings. Table 16: Absolute Maximum Ratings Parameter Min. Max. Unit VDD_3V3 -0.3 4.0 V VIO -0.3 1.89 V Digital I/O input voltage -0.3 VIO+0.2 V
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 30 / 47 The following table shows the recommended operating conditions for FC20 series module. Table 17: Recommended Operating Conditions Parameter Min. Typ. Max. Unit VDD_3V3 3.14 3.3 3.46 V VIO 1.71 1.8 1.89 V 4.3. I/O Interface Characteristics The following table shows the general DC electrical characteristics over recommended operating conditions (unless otherwise specified). Table 18: General DC Electrical Characteristics Symbol Parameter Min. Max. Unit VIH High Level Input Voltage 0.7*VIO VIO+0.2 V VIL Low Level Input Voltage -0.3 0.3*VIO V VOH High Level Output Voltage 0.9*VIO VIO V VOL Low Level Output Voltage 0 0.1*VIO V IIL Input Leakage Current -5 5 uA 4.4. Current Consumption The values of current consumption are shown as below. Table 19: Current Consumption of the Module in Low Power Mode Description Conditions IWLAN_3V3 IVIO Unit OFF State AT+QWIFI=0 0 554 uA
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 31 / 47 Description Conditions IWLAN_3V3 IVIO Unit Idle AT+QWIFI=1 66 6.5 mA Table 20: Current Consumption of the Module Description Conditions IWLAN_3V3 Unit 802.11b TX 1Mbps @17.5dBm 370 mA TX 11Mbps @17.2dBm 357 mA RX 1Mbps 48 mA RX 11Mbps 49 mA 802.11g TX 6Mbps @16dBm 328 mA TX 54Mbps @14.8dBm 245 mA RX 6Mbps 49 mA RX 54Mbps 50 mA 802.11n TX HT20-MCS0 @15.8dBm 322 mA TX HT20-MCS7 @13.5dBm 234 mA TX HT40-MCS0 @14.5dBm 291 mA TX HT40-MCS7 @12.5dBm 194 mA RX HT20-MCS0 49 mA RX HT20-MCS7 50 mA RX HT40-MCS0 54 mA RX HT40-MCS7 52 mA 802.11a TX HT20 MCS0 @dBm TBD mA TX HT20 MCS7 @dBm TBD mA RX HT20 MCS0 TBD mA RX HT20 MCS7 TBD mA
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 32 / 47 Description Conditions IWLAN_3V3 Unit TX VHT20 MCS0 @13.2dBm 378 mA 802.11ac TX VHT20 MCS8 @12.5dBm 289 mA TX VHT40 MCS0 @13.5dBm 372 mA TX VHT40 MCS9 @10.5dBm 244 mA TX VHT80 MCS0 @13dBm 355 mA TX VHT80 MCS9 @10dBm 220 mA RX VHT20 MCS0 78 mA RX VHT20 MCS8 78 mA RX VHT40 MCS0 85 mA RX VHT40 MCS9 84 mA RX VHT80 MCS8 92 mA RX VHT80 MCS9 91 mA OFF state: Execute AT+QWIFI=0 to bring the module to this state. Under the state, the sleep clock is disabled and no data is saved. 4.5. RF Performance The following tables summarize the transmitter and receiver characteristics of FC20 series. Table 21: Conducted RF Output Power at 2.4GHz Frequency Min. Typ. Unit 802.11b @1Mbps 16.8 17.5 dBm 802.11b @11Mbps 16.5 17 dBm NOTE
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 33 / 47 802.11g @6Mbps 15 15.5 dBm 802.11g @54Mbps 14.5 15 dBm 802.11n, HT20 @MCS0 15 15.5 dBm 802.11n, HT20 @MCS7 13.5 14 dBm Table 22: Conducted RF Output Power at 5GHz Frequency Min. Typ. Unit 802.11a @6Mbps 13 13.5 dBm 802.11a @54Mbps 12.5 13 dBm 802.11ac, HT20 @MCS0 13 13.5 dBm 802.11ac, HT20 @MCS7 12.5 13 dBm 802.11ac, HT40 @MCS0 13 13.5 dBm 802.11ac, HT40 @MCS7 10.5 11 dBm 802.11ac, HT80 @MCS0 13 13.5 dBm 802.11ac, HT80 @MCS7 10 10.5 dBm Table 23: Conducted RF Receiving Sensitivity at 2.4GHz Frequency Receive Sensitivity (Typ.) 802.11b, 1Mbps TBD 802.11b, 11 Mbps -85 802.11g, 6Mbps TBD 802.11g, 54Mbps -73 802.11n, HT20, MCS0 TBD 802.11n, HT20, MCS7 -70 802.11n, HT40, MCS0 TBD
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 34 / 47 802.11n, HT40, MCS7 -68 Table 24: Conducted RF Receiving Sensitivity at 5GHz Frequency Receive Sensitivity (Typ.) 802.11a, 6Mbps TBD 802.11a, 54Mbps -68 802.11ac,VHT20, MCS0 TBD 802.11ac,VHT20, MCS8 -68 802.11ac, VHT40, MCS0 TBD 802.11ac, VHT40, MCS9 -62 802.11ac, VHT80, MCS0 TBD 802.11ac, VHT80, MCS9 -57 4.6. Electrostatic Discharge The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is subject to ESD handling precautions that typically apply to ESD sensitive components. Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates the module.
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 35 / 47 5 Mechanical Dimensions This chapter describes the mechanical dimensions of FC20 series module. 5.1. Mechanical Dimensions of the Module Figure 12: FC20 Top and Side Dimensions (Unit: mm)
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 36 / 47 Figure 13: FC20 Bottom Dimensions (Unit: mm)
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 37 / 47 5.2. Recommended Footprint and Stencil Figure 14: Recommended Footprint (Unit: mm)
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 38 / 47 The recommended stencil design for FC20 series is shown as below. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm. Figure 15: Recommended Stencil (Unit: mm) 1. For easy maintenance of the module, please keep about 3mm between the module and other components in host PCB. 2. Keep the RESERVED pins unconnected. NOTES
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 39 / 47 5.3. Top and Bottom View of the Module Figure 16: Top View of the Module Figure 17: Bottom View of the Module These are design effect drawings of FC20 series module. For more accurate pictures, please refer to the module that you get from Quectel. NOTE
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 40 / 47 6 Storage, Manufacturing and Packaging 6.1. Storage FC20 series module is stored in a vacuum-sealed bag. The storage restrictions are shown as below. 1. Shelf life in the vacuum-sealed bag: 12 months at <40ºC and <90% RH. 2. After the vacuum-sealed bag is opened, devices that need to be mounted directly must be:  Mounted within 72 hours at the factory environment of ≤30ºC and <60%RH.  Stored at <10% RH. 3. Devices require baking before mounting, if any circumstance below occurs.  When the ambient temperature is 23ºC±5ºC and the humidity indication card shows the humidity is >10% before opening the vacuum-sealed bag.  Device mounting cannot be finished within 72 hours when the ambient temperature is <30ºC and the humidity is <60%.  Stored at >10% RH. 4. If baking is required, devices should be baked for 48 hours at 125ºC±5ºC. As the plastic package cannot be subjected to high temperature, it should be removed from devices before high temperature (125ºC ) baking. If shorter baking time is desired, please refer to IPC/JEDECJ-STD-033 for baking procedure. NOTE
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 41 / 47 6.2. Soldering Push the squeegee to apply the solder paste on the surface of stencil, thus making the paste fill the stencil openings and then penetrate to the PCB. The force on the squeegee should be adjusted properly so as to produce a clean stencil surface on a single pass. To ensure the module soldering quality, the thickness of stencil for the module is recommended to be 0.18mm. For more details, please refer to document [5]. It is suggested that the peak reflow temperature is from 235ºC to 245ºC (for SnAg3.0Cu0.5 alloy). The absolute maximum reflow temperature is 260ºC. To avoid damage to the module caused by repeated heating, it is suggested that the module should be mounted after reflow soldering for the other side of PCB has been completed. Recommended reflow soldering thermal profile is shown below: Time (s)50 100 150 200 250 30050100150200250 160℃ 200℃217070s~120s40s~60sBetween 1~3℃/SPreheat Heating Cooling℃sLiquids Temperature Figure 18: Reflow Soldering Thermal Profile
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 42 / 47 6.3. Packaging FC20 module is packaged in a vacuum-sealed bag which is ESD protected. The bag should not be opened until the devices are ready to be soldered onto the application. 6.3.1. Tape and Reel Packaging FC20 is packaged in tape and reel carriers. The figures below show the packaging details. Figure 19: Tape Dimensions (Unit: mm)
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 43 / 47 Figure 20: Reel Dimensions (Unit: mm) Table 25: Reel Packaging Model Name MOQ for MP Minimum Package: 250pcs Minimum Package × 4=1000pcs FC20-N 250pcs Size: 370mm × 350mm × 56mm N.W: 0.203kg G.W: 0.945kg Size: 380mm × 250mm × 365mm N.W: 0.81kg G.W: 4.33kg
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 44 / 47 7 Appendix A References Table 26: Related Documents SN Document Name Remark [1] Quectel_FC20_EVB_User_Guide FC20 EVB user guide [2] Quectel_EC25_Reference_Design EC25 reference design [3] Quectel_EC21_Reference_Design EC21 reference design [4] Quectel_EC20_R2.0_Reference_Design EC20 R2.0 reference design [5] Quectel_Module_Secondary_SMT_User_Guide Module secondary SMT user guide Table 27: Terms and Abbreviations Abbreviation Description AP Access Point BPSK Binary Phase Shift Keying BT Bluetooth CCK Complementary Code Keying CTS Clear To Send ESD Electrostatic Discharge GND Ground HT High Throughput IEEE Institute of Electrical and Electronics Engineers IIL Input Leakage Current I/O Input/Output
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 45 / 47 LTE Long Term Evolution Mbps Million Bits Per Second MCS Modulation and Coding Scheme MOQ Minimum Order Quantity MP Manufacture Product PCB Printed Circuit Board PCM Pulse Code Modulation QAM Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying RF Radio Frequency RH Relative Humidity RoHS Restriction of Hazardous Substances RTS Request To Send RX Receive Direction SDIO Secure Digital Input and Output Card TBD To Be Determined TX Transmitting Direction UART Universal Asynchronous Receiver Transmitter USB Universal Serial Bus VDD Voltage Power for Digital Device VHT Very High Throughput VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value
FC20-N Series Hardware Design FC20-N_Series_Hardware_Design Confidential / Released 46 / 47 VIO Voltage for Input/Output Port VOLmax Maximum Output Low Level Voltage Value VOHmin Minimum Output High Level Voltage Value VSWR Voltage Standing Wave Ratio Wi-Fi Wireless-Fidelity WLAN Wireless Local Area Networks

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