Rockwell Collins 8222577 HPA-901B High Power Amplifier User Manual

Rockwell Collins Inc HPA-901B High Power Amplifier

User Manual

    Page 1 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. 0DU48     ITS Electronics Inc. 200 Edgeley Blvd., Unit #24-27 Concord, Ontario, CANADA L4K 3Y8 Tel: (905) 660-0405 Fax: (905) 660-0406     Linear High Power Amplifier    COMPONENT MAINTENANCE MANUAL WITH ILLUSTRATED PARTS LIST    ITS Electronics Part Number      Rockwell Collins Part Number PA-1A6-6048-8M        822−2577−XXX        XX-XX-XX
    Page 2 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. COMPONENT MAINTENANCE MANUAL PART NUMBER PA-1A6-6048-8M   RECORD OF REVISIONS   Revision Number  Revision Date  Date Filed  By
    Page 3 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. COMPONENT MAINTENANCE MANUAL PART NUMBER PA-1A6-6048-8M  RECORD OF TEMPORARY REVISIONS  Temporary Revision Number Issue Date  Date Inserted/ Inserted By Date Removed/ Removed By Date Incorporated
    Page 4 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. COMPONENT MAINTENANCE MANUAL PART NUMBER PA-1A6-6048-8M  SERVICE BULLETIN LIST  Service Bulletin / Revision Number  Issue Date  Date Incorporated  Title
    Page 5 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. COMPONENT MAINTENANCE MANUAL PART NUMBER PA-1A6-6048-8M   TABLE OF CONTENTS  SUBJECT TITLE             PAGE   Description and Operation                6  Testing and Fault Isolation               12  Automatic Test Requirements              Not Applicable  Disassembly                   24  Cleaning                    32  Check           32  Repair                     32  Assembly                    33  Fits and Clearances                 Not Applicable  Special Tools, Fixtures, and Equipment            Not Applicable  Illustrated Parts List                         39
    Page 6 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. 1  Introduction  This manual provides instructions to perform fault isolation, test and maintenance on the HPA−901B, ITS product P/N: PA-1A6-6048-8M, Rockwell Collins Part Number (RCPN) 822−2577−XXX, linear High Power Amplifier (HPA). 1.1  Abbreviations  AMSS              Aeronautical Mobile Satellite Services  ARINC  Aeronautical Radio, Inc. ATP                 Acceptance Test Procedures BIT                   Built-in Test  DUT  Device under Test HPA  High Power Amplifier Hz  Hertz ITS  ITS Electronics, Inc. LED  Light Emitting Diode LRU  Line Replaceable Unit MCU  Modular Concept Unit MHz  Megahertz PC  Personal Computer PSMCPT          Power Supply, Monitoring, Control and Pilot Tone RAM  Random-access Memory RF  Radio Frequency RMS   Root Mean Square ROM  Read-Only Memory SDI  Source Destination Identifier SRU  Shop Replaceable Unit VA  Volt-Ampere VAC  Volt Alternating Current  VSWR              Voltage Standing Wave Ratio W  Watt   2  Description and Operation 2.1  General  The HPA is an 8-MCU 60 watt (W) L-Band linear high power amplifier. It is intended for use as part of a system that provides the Aeronautical Mobile Satellite Services (AMSS).  2.2  Electrical Description  The HPA will operate from an aircraft supplied power of 115 volt alternating current (VAC) root mean square (RMS), single phase, 400 hertz (Hz) nominal,
    Page 7 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. 600 volts−amperes (VA) maximum, 500 VA nominal. Its operation frequency range is 1626.5 to 1660.5 megahertz (MHz).  The HPA is a forced-air cooled in accordance with ARINC 600. The architecture, internal layout, front and rear views are shown in Figure 2.1, Figure 2.2 and Figure 2.3. Its front and rear panel connector details are shown in Figure 2.4 and Figure 2.5.   Upon application of power, and at other times when the test mode is commanded via the ARINC 429 serial input bus, the HPA will perform microprocessor RAM and ROM tests. Continuous monitoring of the following functions is performed: •  Power Supply •  Control Bus Input •  RF Power Input •  VSWR •  Temperature  Four front−panel LED indicators are identified as follows: •  OVER TEMP: Illuminated when an overtemperature condition exists (thermal limiting) •  POWER SUPPLY FAULT: Illuminated when an internal power supply fault is detected •  RF FAULT: Illuminated when an internal RF fault is detected •  CONTROLLER FAULT: Illuminated when an internal control function fault is detected.  The HPA has two external electrical connectors: •  Front Panel Connector •  Rear Panel Connector  The Front Panel Connector is MS3102 type circular connector. It is not wired or used on the aircraft. This connector is for the HPA testing at the manufacturer or another shop facility. This connector pin-out is indicated as in Figure 2.4.   The Rear Panel Connector is of the “low insertion force, shell size 2” type, as defined in ARINC Specification 600. This connector is wired on the aircraft. It provides main interface with ARINC 429 buses, discrete Mute control and SDI. This connector pin-out is indicated as in Figure 2.5.
    Page 8 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.                        Figure 2.1 HPA Architecture and Internal Layout
    Page 9 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  Figure 2.2 HPA Front View   Figure 2.3 HPA Rear View
    Page 10 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.   Pin Function Internal Connection A  RS-232 Transmit  To Controller B  RS-232 Receive To Controller C  RS-232 Ground To Controller                Figure 2.4 HPA Front Panel and Test Connector Details      Pin Function Internal Connection TP1A ARINC 429 Input A  To Controller TP1B ARINC 429 Input B  To Controller TP1C ARINC 429 Output A  To Controller TP1D ARINC 429 Output B  To Controller TP3A HPA Mute Top/Port A  To Controller TP3B HPA Mute Top/Port B  To Controller TP3C HPA Mute Starboard A  To Controller TP3D HPA Mute Starboard B  To Controller TP5A SDI #1  To Controller TP5B SDI #2  To Controller TP5D SDI Common  To Controller TPC1 RF Input  To RF Module MPC1 RF Output  To RF Module BP1  115 VAC Input (Hot)  To Power Supply BP7  115 VAC Input (Cold)  To Power Supply BP8  Chassis Ground  To Power Supply                 Figure 2.5 HPA Rear Connector Details Top Plug Bottom Plug
    Page 11 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.   2.3  Mechanical Description  The HPA mechanical outline details are described in Figure 2.6 (Drawing Number is ODH4800000).  Figure 2.6 HPA Mechanical Outline   The HPA mechanical construction is illustrated in Figure 2.1.  The HPA is intended for installations on the aircraft in the Equipment Racks that are compliant to the requirements of ARINC Specification 600. Therefore, the HPA Enclosure is designed to conform to the ARINC Specification 600. The Enclosure size is 8 Modular Concept Units (8-MCU).  The Enclosure assembly is comprised of: •  bottom, left and right side panel/chassis •  front panel •  rear panel •  top panel •  two handles •  two hold-down hooks •  associated hardware
    Page 12 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. All Enclosure parts are metallic. The panels’ material is aluminum alloy. Interior and bottom surface finish is chemical conversion coating. Exterior (except bottom) surface finish is paint.  The HPA cooling medium is forced air moving through the HPA in the upward or downward direction. To provide the interface between the HPA and the aircraft cooling system, the Enclosure top and bottom panels have air inlet/outlet apertures (sets of multiple individual openings).  The two Shop Replaceable Units are mounted to the sides of the Enclosure.  A low insertion force, shell size 2 Connector, as defined in ARINC Specification 600, is mounted to the rear panel.  An MS3201 type Connector is mounted to the front panel.  The four LEDs are mounted to the front panel.  The two handles and two hold-down hooks are mounted to the front panel.  The forced air enters either from the inlet of the top lid or from the bottom lid and goes through the heat sinks of the two SRUs to cool the internal components. The hot air exits from the outlet of the opposite lid.  2.4  The HPA Family Tree and Block Diagram   The HPA consists of the following SRUs:   •  Power Supply, Monitoring, Control and Pilot Tone (PSMCPT) Module (Part No. H4800200) •  RF Module (Part No. H4800900)  3  LRU on-line Fault Diagnosis HPA has BIT to provide seven-byte information for fault diagnosis purpose. The details of the BIT information are in Table 3.1. Each state has its own hex-value “mask” when turned on. The masks of the turned on states aggregate to the hex value of a byte. For example, if “Low Input Power” (mask “02”) and “Input Power Overdrive” (mask “04”) are turned on, the hex value of the first byte will be “06” (i.e. “02”+”04”).    In Table 3.1, only the states marked in the “Fault” column turned on will represent LRU failure.
    Page 13 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. Effect Flag  Byte No.  Mask Description  Mute  +32V Shutdown  Fault 01  Return Loss          02  Low Input Power          04  Input Power Overdrive          08  Output Power Too High  X       10  N/A          20  N/A              40  N/A          Pwr  1 80  N/A          01  HPA 1 Over-Temp Warning         02  HPA 1 Over-Temp Mute  X       04  HPA 1 Over-Temp Shutdown  X  X    08  HPA 1 Under-Temp          10  HPA 2 Over-Temp Warning         20  HPA 2 Over-Temp Mute  X       40  HPA 2 Over-Temp Shutdown  X  X    t1  2 80  HPA 2 Under-Temp          01  MCU Over-Temp Warning          02  MCU Over-Temp Mute  X       04  MCU Over-Temp Shutdown  X  X    08  MCU Under-Temp          10  N/A          20  N/A              40  N/A          t2  3 80  N/A          01  9V Over-Voltage        x 02  32V Over-Voltage        x 04  Spare Over-Voltage          08  N/A          10  32V Over-Current Measured  X  X  x 20  32V Over-Current Low Cutoff  X     x 40  32V Over-Current High Cutoff  X  X  x Ov  4 80  N/A          01  9V Under-Voltage        x 02  32V Under-Voltage        x 04  Spare Under-Voltage          08  N/A          10  32V Under-Current Measured        x Uv  5 20  N/A
    Page 14 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. 40  N/A          80  N/A          01  Application ROM CRC  X     x 02  EEPROM CRC  X     x 04  RAM Array Fault  X     x 08  RAM Data Line Fault  X     x 10  RAM Addr Line Fault  X     x 20  N/A              40  N/A          Mem  6 80  N/A          01  Pilot Tone Tx Lock  X     x 02  Pilot Tone Rx Lock  X     x 04  ARINC Rx Timeout          08  ARINC HW Failure        x 10  N/A          20  N/A              40  N/A          Msc  7 80  N/A                           Table 3.1 Seven-byte BIT information matrix
    Page 15 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  3.1   LRU Remove/Replace/Back-to-Normal-Status Verification Procedures Once the LRU BIT test shows “FAULT” state, follow the below described procedures to remove the faulty LRU from the aircraft and install a replacement LRU. Send the faulty LRU back to the original manufacturer for repair.  3.2  Tool list No tools are needed. 3.3  LRU Removal Procedures  WARNING:  THE HPA LRU WEIGHS 30 LBS REMOVE IT WITH CARE TO PREVENT PERSONAL INJURY  Step 1: Release the two hold-down hooks and pull out the LRU from the rack   3.4  LRU Installation Procedures  WARNING: THE HPA LRU WEIGHS 30 LBS INSTALL IT WITH CARE TO PREVENT PERSONAL INJURY  Step 1: Push the LRU into the rack and fix the two hold-down hooks  3.5  LRU Repair Verification Procedures  After installing the LRU properly by the above procedures, check if the BIT result shows no error.
    Page 16 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  4  LRU Shop Testing, Fault Isolation and Procedures 4.1  LRU Test Environment Setup Procedures  Test Conditions Unless specified otherwise, the tests shall be performed at the following conditions: Ambient Temperature: +25°C ±5°C Altitude: 0 to 6,000 feet mean sea level Vibration and Shock: None Relative Humidity: 20% to 85%, non-condensing Power Source: 115.0 ±2.3 VAC at 400 ±8 Hertz Forced Air Cooling (minimum air flow rate): 34 Kg/hr  Suggested Test Equipment   Arbitrary Waveform Generator -  Agilent PSG-D Series E8267C   ARINC Bus Box -  Ballard Model BB1020   Signal Generators 1 and 2 -  Hewlett-Packard 8648C   Splitter -  Mini-Circuits ZFSC-2-2500   Power Meter -  Hewlett-Packard E4419B   Power Sensors -  Hewlett-Packard 9300A   Spectrum Analyzer -  Hewlett-Packard E4407B   High Power RF Cable -  500 W, N-male to N-male   Directional Coupler -  10 dB, A.M.Electronics SMC4030-10   40 dB Attenuator -  100 W, Weinschel 48-40-XX   10 dB Attenuator -  Mini-Circuits BW-S10W2   Personal Computer -  with standard serial port and USB port   Power Supply -  Hewlett-Packard 6813A  Note  The test equipment models listed here are for reference only. Available  equivalents may be used.  Note  The Arbitrary Waveform Generator may be substituted with the Signal Generator 1 for single-tone measurements, and with the Signal Generators 1 and 2 and the Splitter for two-tone measurements.
    Page 17 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  4.2  PC Test Environment Setup Procedures  1.  Use mouse to click “Start”, then choose “Programs”, then click “Accessories”, then “Communications” and then choose “Hyperterminal”  2.  A setup window, as in Figure 4.1, will show up. Enter a name that you want to give to the connection, choose an icon for the connection and click “OK”          Figure 4.1 Hyperterminal setup (1)   3.  A connection setup window, as in Figure 4.2, will show up. Choose the appropriate connection port and click “OK”         Figure 4.2 Hyperterminal setup (2)  4.  A port property setup window, as in Figure 4.3, will show up. Choose the values as shown in Figure 4.3 and click “OK”
    Page 18 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.       Figure 4.3 Hyperterminal setup (3)  5.  A text-based Hyperterminal window will show up as in Figure 4.4.              Figure 4.4 Hyperterminal setup (4)   6.  After few seconds, a welcome message and command prompt will show up as in Figure 4.5. If nothing shows up, check the connection cable and setup. If connection is correct, then it means the LRU has failed.
    Page 19 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.                                  Figure 4.5 Hyperterminal setup (5)  4.3  LRU Hardware Fault Verification Procedures Fault Verification by BIT        Step 1:  After connecting the LRU to PC and test equipments and setting    up the Hyperterminal in PC properly, if nothing shows up, then it means the LRU failed. Step 2:  Type the command “d1” (note: it is the numerical digit “one”, not the alphabet “l”) and press “enter”. The diagnostic information will be shown in Figure 4.6 as an example.  The seven hex-value numbers, titled as “diag”, in Figure 4.6 represent the seven bytes of BIT results.
    Page 20 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.                           Figure 4.6 BIT diagnostic information  Step 3: Type the command “df” and press “enter”, the explanatory BIT diagnostic information will be displayed as in Figure 4.7.                Figure 4.7 Explanatory BIT diagnostic information  For example, in Figure 4.6 and Figure 4.7, the second BIT byte is “73” in hex value. By Table 3.1, this is equivalent to “01”+“02”+”10”+”20”+”40”, which
    Page 21 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. means “HPA 1 Over-Temp Warning”, “HPA 1 Over-Temp Mute”, “HPA 2 Over-Temp Warning”, “HPA 2 Over-Temp Mute” and “HPA 2 Over-Temp Shutdown” as in the first five lines of the explanatory message in Figure 4.7. The fifth BIT byte is “02”, which means “32V Under-Voltage” as in the sixth line of the explanatory message in Figure 4.7. The seventh BIT byte is “07” (ie. “01”+”02”+”04”), which means “Pilot Tone Tx Lock”, “Pilot Tone Rx Lock” and “ARINC Rx Timeout” according to Table 3.1, as in the last three lines of the explanatory message in Figure 4.7.  Since “32V Under-Voltage” is turned on here and marked as a “FAULT State” in Table 3.1, we can conclude that the LRU is faulty.   Fault Verification by Acceptance Test Procedures (ATP)  If BIT test shows no fault, test the “Intermodulation, Power Dissipation” per ATP by the following procedures.    Run the ARINC 429 user interface software (filename “RCI HPA-901B ARINC429 M&C.exe”) on the PC.  Step 1: Connect the Arbitrary Waveform Generator to the RF IN of the DUT as shown in Figure 4.8.                 Figure 4.8 ATP setup
    Page 22 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. Step 2: Set the output power of the Arbitrary Waveform Generator to two tone mode, –14 dBm total power. Or, if using two separate signal generators, set the output power of each tone to -17 dBm.  Step 3: Set the tone frequencies to 1626.5 and 1660.5 MHz (band middle, 34 MHz spacing).  Step 4: Apply power to the DUT as required.  Step 5: Set the DUT gain to the 0 dB back-off.  Step 6: Adjust output power of the Arbitrary Waveform Generator so that the output of the DUT is 47.8 dBm (60W).  Step 7: Measure the intermodulation product level and AC power consumption.  Step 8: Calculate power dissipation by subtracting 60 Watt from the measured AC  power consumption.  Step 9: Reduce the output power of the DUT to 47 dBm (50W).  Step 10: Measure the intermodulation product level.  Step 11: If the results are beyond the threshold limits as stated in Table 4.1, the LRU has failed the test.
    Page 23 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  4.4  SRU Hardware Fault Isolation Procedures  From the results of the test procedures described above, the faulty SRU can be isolated according to Table 4.1.    Shop Diagnostic Results Test  Threshold limits beyond which represent LRU failure status Most likely  faulty SRU 2nd most  likely faulty  SRU BIT  9V Over Voltage PSCPT  - BIT  32V Over Voltage PSCPT  - BIT  32V Over-Current Measured RF Module  PSMCPT Module BIT  32V Over-Current Low Cutoff RF Module  PSMCPT Module BIT  32V Over-Current High Cutoff RF Module  PSMCPT Module BIT  9V Under-Voltage PSMCPT  Module  - BIT  32V Under-Voltage PSMCPT  Module  - BIT  32V Under-Current Measured RF Module  PSMCPT Module BIT  Application ROM CRC PSMCPT  Module  - BIT  EEPROM CRC PSMCPT  Module  - BIT  RAM Array Fault PSMCPT  Module  - BIT  RAM Data Line Fault PSMCPT  Module  - BIT  RAM Addr Line Fault PSMCPT  Module  - BIT  Pilot Tone Tx Lock PSMCPT  Module  - BIT  Pilot Tone Rx Lock PSMCPT  Module  - BIT  ARINC HW Failure PSMCPT  Module  - Intermodulation product level at 60W should be −31.5 dBc or lower RF Module  PSMCPT Module Intermodulation product level at 50W should be −42.5 dBc or lower RF Module  PSMCPT Module ATP  Paragraph  7.1.5  The power consumption shall not exceed 300 W RF Module  PSMCPT Module                             Table 4.1 SRU Fault Isolation Criteria
    Page 24 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. 5  Disassembly Instruction of the HPA−901B 5.1  General: this section describes how to disassemble the High Power Amplifier HPA-901B 5.2  Materials: Refer to Table A1 in Appendix A for the parts necessary to assemble the unit 5.3  Disassembly Procedure      Figure 5.1 Fully Assembled HPA−901B
    Page 25 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. 5.4  Top Lid and Front Panel Disassembly  −  Remove eight #4-40 x 5/16" Flat Head Philips Screws (38) that secure the HPA Lid   Assembly to the Housing (Figure 5.1). −  Remove the rest of the Flat Head Philips Screws from the top lid. All screws have been assembled with Loctite  locking compound, so higher initial torque force must be applied to unlock  the screws −  Remove top three screws from the front panel as shown on the Figure 5.2.  −  Remove Top Panel               Figure 5.2 HPA with Removed Lid Figure 5.1
    Page 26 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. 5.5  Front Panel Disassembly  −  Remove two #4x40 3/8” Screws to uninstall D-Sub Connector (2) from the housing (see Figure 5.3) −  Remove the rest of the screws from the front panel −  Remove front panel                                                            Figure 5.3
    Page 27 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  5.6  Top Bracket Removal   −  Remove #4-40 x 5/16" Flat Head Philips Screws (36) holding two top brackets (18). −  Remove two middle screws item (48) securing two steel plated clamps item (47). Please note – middle screws have hardware on the back side of the bracket. See Figure 5.3 a) and b) below −  Remove the clamps item (47) holding cables and harnesses together. See Figure 5.5                   a)  Figure 5.4                               b)                  Figure 5.5 Top view after brackets removed
    Page 28 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. 5.7  RF and DC Heat-sink Gasket Cover Assemblies Removal   −  Remove 8 screws item (38) located on the bottom cover Figure 5.6 a) and b) in order to uninstall RF and DC Heat-sink Gasket Cover Assemblies items (16) and (17). Please note, all the screws are locked with Loctite 290 compound, so higher initial torque force must be applied              a)                Figure 5.6                         b)
    Page 29 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  5.8  Power Supply Removal  −  Remove four screws from J8 and J9 of RF module as shown on the picture Figure 5.7 a) and b) (shown with red arrows) then disconnect Pilot Tone Cables 1 and 2. items (14) and (15) −  Disconnect J6 and J7 Semi-rigid cable connectors of the Power Supply Module (shown with blue arrows) −  Remove screws item (27) from the left side cover of the drawing Figure 5.7 to uninstall Power Supply sub-assembly −  In order to remove Power Supply assembly first shift it for approximately 3’’ to gain the access to the rest of the cables and then remove two connectors (J4 and J15 shown on the drawings Figure 5.7 a) and b) and on Figure 5.8 a) and b) with green color) −  Remove Power Supply from the housing                     b)      a)  Figure 5.7
    Page 30 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.                      a)  b)      Figure 5.8                  Figure 5.9 Power Supply Assembly
    Page 31 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  5.9  RF Module Removal:  −  Remove all the screws item (27) holding RF Module from the right side on the Figure 5.7 a). Please note all screws are locked with Loctite 290 compound, so higher initial torque force must be applied  −  Shift RF Module off the side panel for approx. 2" distance  −  Disconnect two Semi-rigid Cables J10 and J13 at locations shown on Figure 5.8 a) with yellow circles and on the Figure 5.10 below −  Remove RF Module from the housing                   Figure 5.10                                      Figure 5.11 RF Module Sub-assembly J13  J10
    Page 32 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  6  Cleaning  −  No cleaning operation for HPA901B is required  7  Check −  Checking is limited to visual inspection of the following  •  Ensure that the air channels are not obstructed. •  Ensure that all connectors are secure. •  Ensure that the HPA is mounted securely.  8  Repair −  Because of the complexity of the HPA901B, field servicing is not practical. Should a fault be identified within a unit, the unit should be returned to the factory, in its original packing material if possible, for repair or replacement.  −  Refurbished replacement units will be functionally tested prior to being shipped to the customer. Based on the type of fault, ITS Electronics Inc. will determine the types of tests required to verify the integrity and serviceability of the unit. These tests will be listed on the functional test sheet that accompanies the unit.
    Page 33 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  9  Assembly 9.1  RF Module Installation  −  Place RF Module into the housing Figure 8.1 a) −  Connect Semi-rigid Cables to J10 and J13 as shown on Figure 8.1 b) −  Install 13 screws item (27) securing RF module to the housing.  All screws must be assembled with Loctite 290 locking compound                   a)    Figure 8.1  b) J13  J10
    Page 34 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  9.2  Power Supply Installation  −  Place Power Supply onto the housing away from the back cover to more easily plug connectors and cables as shown on the Figure 8.2 a) −  Install two connectors J4 and J15 as shown on the drawings Figure 8.2 a) and b) −  Install Pilot Tone Cables 1 and 2 item (14) and (15) – J6 and J7 of the Power Supply Module and J8 and J9 of RF module as shown on the picture Figure 8.2 b)  −  Align Power Supply Module mounting holes with side cover  −  Install 12 screws item (27) as shown on the drawing Figure 5.7 to secure Power Supply sub-assembly in place  All screws must be assembled with Loctite 290 locking compound            Figure 8.2        a)     c)                 b)  Installed RF and Power Supply   J4 J15 J6 J7 J8 J9
    Page 35 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  9.3  RF and DC Heat-sink Gasket Cover Assemblies Installation   −  Place items(16) and (17) - RF and DC Heat-sink Gasket Cover Assemblies into the housing as shown on the Figure 8.3 a) and b) −  Install 8 screws item (38) to the bottom cover Figure 8.3 a) and c) in order to secure RF and DC Heat-sink Gasket Cover Assemblies.   All screws must be assembled with Loctite 290 locking compound                      b)          a)   Figure 8.3  c)
    Page 36 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  9.4  Top Bracket Installation   −  Install 2 steel plated clamps item (47) to the cables and harnesses per Figure 8.4 a) −  Place Top bracket item (18) onto the housing −  Install two middle screws item (48) with nut, flat and lock washers items (28), (30) and (31) holding clamps item (47), see Figure 8.4 b) and c) −  Install #4-40 x 5/16" Flat Head Philips Screws item (36) holding the brackets. All screws without lock washers must be assembled with Loctite 290 locking compound              a)                      b)         c) Figure 8.4  Use this clamp to hold J1, J2 and cable B from item 5 and item 15 Use this clamp to hold J1 and cable B from item 5 and item 15
    Page 37 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  9.5  Front Panel Assembly  −  Place the front panel onto the housing −  Plug D-Sub Connector item (2) on the J12 on the Power Supply module as shown on Figure 8.5 a) and secure with two #4x40 3/8” screws −  Install the front panel screws except top three as shown on the picture  8.5 b)  All screws must be assembled with Loctite 290 locking compound                     a)     Figure 8.5          b)
    Page 38 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  9.6  Top Lid and Front Panel Assembly −  Place top lid onto the housing as shown on the Figure 8.6 −  Align RF and DC Heat-sink Gasket Covers with the top lid holes  −  Install eight #4-40 x 5/16" Flat Head Philips Screws (38) that secure the top lid to the RF and DC Heat-sink Gasket Covers items (16) and (17) as shown on Figure 5.1 with red circle. −  Install top three screws from the front panel as shown on the Figure 8.5 b) −  Install the rest of Flat Head Philips Screws on the top lid.   All screws must be assembled with Loctite 290 locking compound                            Figure 8.6
    Page 39 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  Appendix A. ILLUSTRATED PARTS LIST   A.1 General  •  The Illustrated Parts List (IPL) includes a list, as in Table A1 and illustration drawings, Figure A1 ~ Figure A7. •  A Numerical Index is included in this section. •  Supplier (vendor) information includes the name, address, and CAGE code for each supplier.  A.2 Explanation and Usage  •  Each SRU or part has its unique cross reference index, the “ITEM NO.”, specified in Table A1 as well as in the drawings. •  The number of a specific SRU or part in a HPA is shown in the “QTY” column. •  The measurement unit of a specific SRU or part in a HPA is shown in the “UM” column. “EA” means that SRU or part is counted individually as one piece. “IN” means that material is counted in length (inches) while “CC” means that material measured in volume (cubic centimeters). •  Each SRU or part has its own unique identification as in the “PART NUMBER” column  •  The characteristics of a specific SRU or part is describe in the “PART DESCRIPTION” column •  The “MANUFACTURER” column shows the manufacturer of that SRU or part. For the general parts, such as washer, screw, no manufacturer is specified.
    Page 40 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  ITEMQTYUMPART NUMBERPART DESCRIPTIONMANUFACTURER1 1 EA H4800400 8MCU Enclosure Churchill2 1 EA 16-500324 15 pos male , D-sub connector, shell nickel plated, solder cup 50 micro inch gold plated CONEC3 1 EA H4800200Power Supply Module AssemblyITS4 1 EA H4800900 RF Module Assembly ITS5 1 EA H4802700ARINC Harness AssemblyITS6 1 EA H4802800 DC to RF Control DB25 Wiring Harness ITS7 1 EA H4802900 DC to RF 32V Power 2W2 Wiring Harness ITS8 NOT IN USE9 4 EA CR1-3008-0000-I LED, CR series T1 3/4, high effic. red, no res., IP66, #24 MIL-W-22759/33 wiresWILBRECHT10 A/R EA 05805A500BK HT-805(A)-. 500 Black, Black Medium Grade Cellular SiliconeRogers Co.11 A/R EA 05805A250GY HT-805(A)-. 250 Gray, Gray, Medium Grade Cellular SiliconeRogers Co.12 NOT IN USE13 1 EA H4804300 Service Connector Wiring Harness ITS14 1 EA H4800700Pilot Tone Cable 1ITS15 1 EA H4800800 Pilot Tone Cable 2 ITS16 1 EA H4804500DC HEATSINK GASKET COVER ASSEMBLYITS17 1 EA H4804600 RF HEATSINK GASKET COVER ASSEMBLY ITS18 2 EA H4800021TOP BRACKETITS19 1 EA MS25043-10DA Dust Cap with sash chain. (BLACK) ITT Cannon20 4 EA 5805-23-P WAVE SHAPE SPRING WASHER, STNLS 301-304, PASSIVATED, ID=0.350"" OD=0.492"" THK=0.007" Seastrom21 4 EA 909-0059 #10 FLAT WASHER N TYPE B, OD. 0.406 x 0.040 not specified22 4 EA 909-0060 #10 HELICAL SPRING LOCK WASHER, 0.334" MAX. OD, 0.047"THK.not specified23 4 EA 909-0055 #4-40 x 1/2"  PAN HEAD PHILLIPS SCREW not specified24 14 EA 909-0073#4-40 x 3/8" SCKT. HEAD SCREWnot specified25 4 EA 909-0069 #4-40 HEX. NUT, 3/16"  HEX. x 3/32" not specified26 8 EA 909-0119#6-32 x 1/4" FLAT HEAD PHILLIPS SCREWnot specified27 25 EA 909-0621 BLACK PAINTED HEAD #6-32  x  3/8"L 100 deg flat head phillips machine screw Churchill28 12 EA 909-0063 #6-32 HEX NUT, 5/16" HEX.x  0.108 not specified29 10 EA 909-0067 #6-32 x 1/2" PAN HEAD PHILLIPS SCREW not specified30 22 EA 909-0022#6 FLAT WASHER OD: 0.312 x 0.032, TYPE B, Nnot specified31 12 EA 909-0579 #6 SPRING LOCK WASHER OD: 0.266 x 0.040 not specified32 18 EA 909-0003#4 Helical Spring Lock Washer, 0.031 THK.not specified33 22 EA 909-0106 #4 FLAT WASHER 0.209 O.D. x 0.032 THK. (NAS620-C4)not specified34 4 EA 909-0244 #10-32 x 1/2" SOCKET HEAD SCREW not specified35 2 EA HV420-7 #HV420-7 Oval-Internal Thread Handle. 5" x2.25" HANDLE UNLIMITED36 2 CC 290 LOCTITE 290 LOCTITE37 10 IN LC136-1-500 LACING TAPE ALPHA38 16 EA 909-0174#4-40 x 5/16" FLAT HEAD PHILLIPS SCREWnot specified39 13.5 IN FIT-221V3/32 HEAT SHRINK TUBING (0.094" ID) ALPHA WIRE40 2 IN FIT-221V5/16HEAT SHRINK TUBING (0.312" ID)ALPHA WIRE41 1.5 IN FIT-221V1/4 HEAT SHRINK TUBING (0.250" ID) ALPHA WIRE42 1.5 IN PLF100-3/4-BLK-4HEAT SHRINK TUBING (0.75" ID)PLASTRONIC43 1.5 IN PLF100-1-BLK-4 HEAT SHRINK TUBING (1" ID) PLASTRONIC44 1 EA PLT1M-M76 TEFZEL 4" BLUE CABLE TIE PANDUIT45 1 EA ABMM-AT-CO 4 way adhesive backed mount, Black, 0.75"x0.75", Material: ABS PANDUIT46 1 IN Sn63Pb37SOLDER WIRE Sn63Pb37KESTER47 2 EA SPN-6 STEEL PLATED SANTOPRENE CLAMP, 3/8" ID RICHCO48 2 EA 909-0247#6-32 x 1" FLAT HEAD PHILLIPS SCREWnot specified                                                       Table A1 - HPA Part List
    Page 41 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. A.3 Vendors (Suppliers)  VODU48  ITS Electronics Inc. 200 Edgeley Blvd., Unit #24-27 Concord, Ontario, CANADA L4K 3Y8  VCAGE  ALPHA Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS  VCAGE  ALPHAWIRE Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS  VCAGE  Churchill Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS  VCAGE  CONEC Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS  VCAGE  HANDLE UNLIMITED Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS  VCAGE  ITT Cannon Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS  VCAGE  KESTER Address and CAGE code to be supplied by ITS               Address and CAGE code to be supplied by ITS  VCAGE  Loctite Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS  VCAGE  PANDUIT Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS   VCAGE  PLASTRONIC Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS
    Page 42 of 42   ITS ELECTRONICS INC.MICROWAVE COMPONENTS AND SUBSYSTEMSThe information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.  VCAGE  RICHCO Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS  VCAGE  Rogers Co. Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS  VCAGE  Seastrom Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS  VCAGE  WILBRECHT Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS

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