Rockwell Collins 8222577 HPA-901B High Power Amplifier User Manual
Rockwell Collins Inc HPA-901B High Power Amplifier
User Manual
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| Document ID | 1164177 |
| Application ID | WdGcZQX/wHqZ2cmnGhMO4A== |
| Document Description | User Manual |
| Short Term Confidential | No |
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| Document Type | User Manual |
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| Filesize | 456.75kB (5709432 bits) |
| Date Submitted | 2009-09-03 00:00:00 |
| Date Available | 2009-09-09 00:00:00 |
| Creation Date | 2009-08-11 11:28:21 |
| Producing Software | GPL Ghostscript 8.64 |
| Document Lastmod | 2009-08-11 11:28:21 |
| Document Title | HPA-901B Component Maintenance Manual draft 20090811 |
| Document Creator | PDFCreator Version 0.9.8 |
ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 0DU48 ITS Electronics Inc. 200 Edgeley Blvd., Unit #24-27 Concord, Ontario, CANADA L4K 3Y8 Tel: (905) 660-0405 Fax: (905) 660-0406 Linear High Power Amplifier COMPONENT MAINTENANCE MANUAL WITH ILLUSTRATED PARTS LIST ITS Electronics Part Number Rockwell Collins Part Number PA-1A6-6048-8M 822−2577−XXX XX-XX-XX Page 1 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS COMPONENT MAINTENANCE MANUAL PART NUMBER PA-1A6-6048-8M RECORD OF REVISIONS Revision Revision Number Date Date Filed By Page 2 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS COMPONENT MAINTENANCE MANUAL PART NUMBER PA-1A6-6048-8M RECORD OF TEMPORARY REVISIONS Temporary Revision Number Issue Date Date Inserted/ Inserted By Date Removed/ Removed By Date Incorporated Page 3 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS COMPONENT MAINTENANCE MANUAL PART NUMBER PA-1A6-6048-8M SERVICE BULLETIN LIST Service Bulletin / Revision Number Issue Date Date Incorporated Title Page 4 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS COMPONENT MAINTENANCE MANUAL PART NUMBER PA-1A6-6048-8M TABLE OF CONTENTS SUBJECT TITLE PAGE Description and Operation Testing and Fault Isolation 12 Automatic Test Requirements Not Applicable Disassembly 24 Cleaning 32 Check 32 Repair 32 Assembly 33 Fits and Clearances Not Applicable Special Tools, Fixtures, and Equipment Not Applicable Illustrated Parts List 39 Page 5 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Introduction This manual provides instructions to perform fault isolation, test and maintenance on the HPA−901B, ITS product P/N: PA-1A6-6048-8M, Rockwell Collins Part Number (RCPN) 822−2577−XXX, linear High Power Amplifier (HPA). 1.1 Abbreviations AMSS ARINC ATP BIT DUT HPA Hz ITS LED LRU MCU MHz PC PSMCPT RAM RF RMS ROM SDI SRU VA VAC VSWR 2.1 Aeronautical Mobile Satellite Services Aeronautical Radio, Inc. Acceptance Test Procedures Built-in Test Device under Test High Power Amplifier Hertz ITS Electronics, Inc. Light Emitting Diode Line Replaceable Unit Modular Concept Unit Megahertz Personal Computer Power Supply, Monitoring, Control and Pilot Tone Random-access Memory Radio Frequency Root Mean Square Read-Only Memory Source Destination Identifier Shop Replaceable Unit Volt-Ampere Volt Alternating Current Voltage Standing Wave Ratio Watt Description and Operation General The HPA is an 8-MCU 60 watt (W) L-Band linear high power amplifier. It is intended for use as part of a system that provides the Aeronautical Mobile Satellite Services (AMSS). 2.2 Electrical Description The HPA will operate from an aircraft supplied power of 115 volt alternating current (VAC) root mean square (RMS), single phase, 400 hertz (Hz) nominal, Page 6 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 600 volts−amperes (VA) maximum, 500 VA nominal. Its operation frequency range is 1626.5 to 1660.5 megahertz (MHz). The HPA is a forced-air cooled in accordance with ARINC 600. The architecture, internal layout, front and rear views are shown in Figure 2.1, Figure 2.2 and Figure 2.3. Its front and rear panel connector details are shown in Figure 2.4 and Figure 2.5. Upon application of power, and at other times when the test mode is commanded via the ARINC 429 serial input bus, the HPA will perform microprocessor RAM and ROM tests. Continuous monitoring of the following functions is performed: • Power Supply • Control Bus Input • RF Power Input • VSWR • Temperature Four front−panel LED indicators are identified as follows: • OVER TEMP: Illuminated when an overtemperature condition exists (thermal limiting) • POWER SUPPLY FAULT: Illuminated when an internal power supply fault is detected • RF FAULT: Illuminated when an internal RF fault is detected • CONTROLLER FAULT: Illuminated when an internal control function fault is detected. The HPA has two external electrical connectors: • Front Panel Connector • Rear Panel Connector The Front Panel Connector is MS3102 type circular connector. It is not wired or used on the aircraft. This connector is for the HPA testing at the manufacturer or another shop facility. This connector pin-out is indicated as in Figure 2.4. The Rear Panel Connector is of the “low insertion force, shell size 2” type, as defined in ARINC Specification 600. This connector is wired on the aircraft. It provides main interface with ARINC 429 buses, discrete Mute control and SDI. This connector pin-out is indicated as in Figure 2.5. Page 7 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Figure 2.1 HPA Architecture and Internal Layout Page 8 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Figure 2.2 HPA Front View Figure 2.3 HPA Rear View Page 9 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Pin Function Internal Connection To Controller A RS-232 Transmit B RS-232 Receive To Controller C RS-232 Ground To Controller Figure 2.4 HPA Front Panel and Test Connector Details Pin TP1A TP1B TP1C TP1D TP3A TP3B TP3C TP3D TP5A Function ARINC 429 Input A ARINC 429 Input B ARINC 429 Output A ARINC 429 Output B HPA Mute Top/Port A HPA Mute Top/Port B HPA Mute Starboard A HPA Mute Starboard B SDI #1 Internal Connection To Controller To Controller To Controller To Controller To Controller To Controller To Controller Top Plug To Controller To Controller TP5B SDI #2 To Controller TP5D SDI Common To Controller TPC1 RF Input To RF Module MPC1 RF Output 115 VAC Input BP1 (Hot) 115 VAC Input BP7 (Cold) BP8 To RF Module To Power Supply To Power Supply To Power Chassis Ground Supply Bottom Plug Figure 2.5 HPA Rear Connector Details Page 10 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 2.3 Mechanical Description The HPA mechanical outline details are described in Figure 2.6 (Drawing Number is ODH4800000). Figure 2.6 HPA Mechanical Outline The HPA mechanical construction is illustrated in Figure 2.1. The HPA is intended for installations on the aircraft in the Equipment Racks that are compliant to the requirements of ARINC Specification 600. Therefore, the HPA Enclosure is designed to conform to the ARINC Specification 600. The Enclosure size is 8 Modular Concept Units (8-MCU). The Enclosure assembly is comprised of: • bottom, left and right side panel/chassis • front panel • rear panel • top panel • two handles • two hold-down hooks • associated hardware Page 11 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS All Enclosure parts are metallic. The panels’ material is aluminum alloy. Interior and bottom surface finish is chemical conversion coating. Exterior (except bottom) surface finish is paint. The HPA cooling medium is forced air moving through the HPA in the upward or downward direction. To provide the interface between the HPA and the aircraft cooling system, the Enclosure top and bottom panels have air inlet/outlet apertures (sets of multiple individual openings). The two Shop Replaceable Units are mounted to the sides of the Enclosure. A low insertion force, shell size 2 Connector, as defined in ARINC Specification 600, is mounted to the rear panel. An MS3201 type Connector is mounted to the front panel. The four LEDs are mounted to the front panel. The two handles and two hold-down hooks are mounted to the front panel. The forced air enters either from the inlet of the top lid or from the bottom lid and goes through the heat sinks of the two SRUs to cool the internal components. The hot air exits from the outlet of the opposite lid. 2.4 The HPA Family Tree and Block Diagram The HPA consists of the following SRUs: • • Power Supply, Monitoring, Control and Pilot Tone (PSMCPT) Module (Part No. H4800200) RF Module (Part No. H4800900) LRU on-line Fault Diagnosis HPA has BIT to provide seven-byte information for fault diagnosis purpose. The details of the BIT information are in Table 3.1. Each state has its own hex-value “mask” when turned on. The masks of the turned on states aggregate to the hex value of a byte. For example, if “Low Input Power” (mask “02”) and “Input Power Overdrive” (mask “04”) are turned on, the hex value of the first byte will be “06” (i.e. “02”+”04”). In Table 3.1, only the states marked in the “Fault” column turned on will represent LRU failure. Page 12 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Flag Pwr t1 Byte No. Mask 01 02 04 08 10 20 40 80 01 02 04 08 10 20 40 80 01 02 t2 Ov 04 08 10 20 40 80 01 02 04 08 10 20 Uv 40 80 01 02 04 08 10 20 Description Return Loss Low Input Power Input Power Overdrive Output Power Too High N/A N/A N/A N/A HPA 1 Over-Temp Warning HPA 1 Over-Temp Mute HPA 1 Over-Temp Shutdown HPA 1 Under-Temp HPA 2 Over-Temp Warning HPA 2 Over-Temp Mute HPA 2 Over-Temp Shutdown HPA 2 Under-Temp MCU Over-Temp Warning MCU Over-Temp Mute MCU Over-Temp Shutdown MCU Under-Temp N/A N/A N/A N/A 9V Over-Voltage 32V Over-Voltage Spare Over-Voltage N/A 32V Over-Current Measured 32V Over-Current Low Cutoff 32V Over-Current High Cutoff N/A 9V Under-Voltage 32V Under-Voltage Spare Under-Voltage N/A 32V Under-Current Measured N/A Effect Mute +32V Shutdown Fault Page 13 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Mem Msc 40 80 01 02 04 08 10 20 40 80 01 02 04 08 10 20 40 80 N/A N/A Application ROM CRC EEPROM CRC RAM Array Fault RAM Data Line Fault RAM Addr Line Fault N/A N/A N/A Pilot Tone Tx Lock Pilot Tone Rx Lock ARINC Rx Timeout ARINC HW Failure N/A N/A N/A N/A Table 3.1 Seven-byte BIT information matrix Page 14 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 3.1 LRU Remove/Replace/Back-to-Normal-Status Verification Procedures Once the LRU BIT test shows “FAULT” state, follow the below described procedures to remove the faulty LRU from the aircraft and install a replacement LRU. Send the faulty LRU back to the original manufacturer for repair. 3.2 Tool list No tools are needed. 3.3 LRU Removal Procedures WARNING: THE HPA LRU WEIGHS 30 LBS REMOVE IT WITH CARE TO PREVENT PERSONAL INJURY Step 1: Release the two hold-down hooks and pull out the LRU from the rack 3.4 LRU Installation Procedures WARNING: THE HPA LRU WEIGHS 30 LBS INSTALL IT WITH CARE TO PREVENT PERSONAL INJURY Step 1: Push the LRU into the rack and fix the two hold-down hooks 3.5 LRU Repair Verification Procedures After installing the LRU properly by the above procedures, check if the BIT result shows no error. Page 15 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 4.1 LRU Shop Testing, Fault Isolation and Procedures LRU Test Environment Setup Procedures Test Conditions Unless specified otherwise, the tests shall be performed at the following conditions: Ambient Temperature: +25°C ±5°C Altitude: 0 to 6,000 feet mean sea level Vibration and Shock: None Relative Humidity: 20% to 85%, non-condensing Power Source: 115.0 ±2.3 VAC at 400 ±8 Hertz Forced Air Cooling (minimum air flow rate): 34 Kg/hr Suggested Test Equipment Arbitrary Waveform Generator - Agilent PSG-D Series E8267C ARINC Bus Box - Ballard Model BB1020 Signal Generators 1 and 2 - Hewlett-Packard 8648C Splitter - Mini-Circuits ZFSC-2-2500 Power Meter - Hewlett-Packard E4419B Power Sensors - Hewlett-Packard 9300A Spectrum Analyzer - Hewlett-Packard E4407B High Power RF Cable - 500 W, N-male to N-male Directional Coupler - 10 dB, A.M.Electronics SMC4030-10 40 dB Attenuator - 100 W, Weinschel 48-40-XX 10 dB Attenuator - Mini-Circuits BW-S10W2 Personal Computer - with standard serial port and USB port Power Supply - Hewlett-Packard 6813A Note The test equipment models listed here are for reference only. Available equivalents may be used. Note The Arbitrary Waveform Generator may be substituted with the Signal Generator 1 for single-tone measurements, and with the Signal Generators 1 and 2 and the Splitter for two-tone measurements. Page 16 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 4.2 PC Test Environment Setup Procedures 1. 2. Use mouse to click “Start”, then choose “Programs”, then click “Accessories”, then “Communications” and then choose “Hyperterminal” A setup window, as in Figure 4.1, will show up. Enter a name that you want to give to the connection, choose an icon for the connection and click “OK” Figure 4.1 Hyperterminal setup (1) 3. A connection setup window, as in Figure 4.2, will show up. Choose the appropriate connection port and click “OK” Figure 4.2 Hyperterminal setup (2) 4. A port property setup window, as in Figure 4.3, will show up. Choose the values as shown in Figure 4.3 and click “OK” Page 17 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Figure 4.3 Hyperterminal setup (3) 5. A text-based Hyperterminal window will show up as in Figure 4.4. Figure 4.4 Hyperterminal setup (4) 6. After few seconds, a welcome message and command prompt will show up as in Figure 4.5. If nothing shows up, check the connection cable and setup. If connection is correct, then it means the LRU has failed. Page 18 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Figure 4.5 Hyperterminal setup (5) 4.3 LRU Hardware Fault Verification Procedures Fault Verification by BIT Step 1: After connecting the LRU to PC and test equipments and setting up the Hyperterminal in PC properly, if nothing shows up, then it means the LRU failed. Step 2: Type the command “d1” (note: it is the numerical digit “one”, not the alphabet “l”) and press “enter”. The diagnostic information will be shown in Figure 4.6 as an example. The seven hex-value numbers, titled as “diag”, in Figure 4.6 represent the seven bytes of BIT results. Page 19 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Figure 4.6 BIT diagnostic information Step 3: Type the command “df” and press “enter”, the explanatory BIT diagnostic information will be displayed as in Figure 4.7. Figure 4.7 Explanatory BIT diagnostic information For example, in Figure 4.6 and Figure 4.7, the second BIT byte is “73” in hex value. By Table 3.1, this is equivalent to “01”+“02”+”10”+”20”+”40”, which Page 20 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS means “HPA 1 Over-Temp Warning”, “HPA 1 Over-Temp Mute”, “HPA 2 Over-Temp Warning”, “HPA 2 Over-Temp Mute” and “HPA 2 Over-Temp Shutdown” as in the first five lines of the explanatory message in Figure 4.7. The fifth BIT byte is “02”, which means “32V Under-Voltage” as in the sixth line of the explanatory message in Figure 4.7. The seventh BIT byte is “07” (ie. “01”+”02”+”04”), which means “Pilot Tone Tx Lock”, “Pilot Tone Rx Lock” and “ARINC Rx Timeout” according to Table 3.1, as in the last three lines of the explanatory message in Figure 4.7. Since “32V Under-Voltage” is turned on here and marked as a “FAULT State” in Table 3.1, we can conclude that the LRU is faulty. Fault Verification by Acceptance Test Procedures (ATP) If BIT test shows no fault, test the “Intermodulation, Power Dissipation” per ATP by the following procedures. Run the ARINC 429 user interface software (filename “RCI HPA-901B ARINC429 M&C.exe”) on the PC. Step 1: Connect the Arbitrary Waveform Generator to the RF IN of the DUT as shown in Figure 4.8. Figure 4.8 ATP setup Page 21 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Step 2: Set the output power of the Arbitrary Waveform Generator to two tone mode, –14 dBm total power. Or, if using two separate signal generators, set the output power of each tone to -17 dBm. Step 3: Set the tone frequencies to 1626.5 and 1660.5 MHz (band middle, 34 MHz spacing). Step 4: Apply power to the DUT as required. Step 5: Set the DUT gain to the 0 dB back-off. Step 6: Adjust output power of the Arbitrary Waveform Generator so that the output of the DUT is 47.8 dBm (60W). Step 7: Measure the intermodulation product level and AC power consumption. Step 8: Calculate power dissipation by subtracting 60 Watt from the measured AC power consumption. Step 9: Reduce the output power of the DUT to 47 dBm (50W). Step 10: Measure the intermodulation product level. Step 11: If the results are beyond the threshold limits as stated in Table 4.1, the LRU has failed the test. Page 22 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 4.4 SRU Hardware Fault Isolation Procedures From the results of the test procedures described above, the faulty SRU can be isolated according to Table 4.1. Test Threshold limits beyond which represent LRU failure status BIT BIT BIT BIT BIT 9V Over Voltage 32V Over Voltage 32V Over-Current Measured 32V Over-Current Low Cutoff 32V Over-Current High Cutoff Shop Diagnostic Results Most 2nd most likely likely faulty faulty SRU SRU PSCPT PSCPT RF Module PSMCPT Module RF Module PSMCPT Module RF Module PSMCPT Module PSMCPT Module PSMCPT Module RF Module BIT 9V Under-Voltage BIT 32V Under-Voltage BIT 32V Under-Current Measured BIT Application ROM CRC BIT EEPROM CRC BIT RAM Array Fault BIT RAM Data Line Fault BIT RAM Addr Line Fault PSMCPT Module PSMCPT Module PSMCPT Module PSMCPT Module PSMCPT Module BIT Pilot Tone Tx Lock PSMCPT Module BIT Pilot Tone Rx Lock BIT ARINC HW Failure Intermodulation product level at 60W should be −31.5 dBc or lower ATP Paragraph Intermodulation product level at 50W should be −42.5 dBc or lower 7.1.5 The power consumption shall not exceed 300 W PSMCPT Module PSMCPT Module PSMCPT Module RF Module PSMCPT Module RF Module PSMCPT Module RF Module PSMCPT Module Table 4.1 SRU Fault Isolation Criteria Page 23 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Disassembly Instruction of the HPA−901B 5.1 General: this section describes how to disassemble the High Power Amplifier HPA-901B 5.2 Materials: Refer to Table A1 in Appendix A for the parts necessary to assemble the unit 5.3 Disassembly Procedure Figure 5.1 Fully Assembled HPA−901B Page 24 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Figure 5.1 5.4 Top Lid and Front Panel Disassembly − Remove eight #4-40 x 5/16" Flat Head Philips Screws (38) that secure the HPA Lid Assembly to the Housing (Figure 5.1). − Remove the rest of the Flat Head Philips Screws from the top lid. All screws have been assembled with Loctite locking compound, so higher initial torque force must be applied to unlock the screws − Remove top three screws from the front panel as shown on the Figure 5.2. − Remove Top Panel Figure 5.2 HPA with Removed Lid Page 25 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 5.5 Front Panel Disassembly − Remove two #4x40 3/8” Screws to uninstall D-Sub Connector (2) from the housing (see Figure 5.3) − Remove the rest of the screws from the front panel − Remove front panel Figure 5.3 Page 26 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 5.6 Top Bracket Removal − Remove #4-40 x 5/16" Flat Head Philips Screws (36) holding two top brackets (18). − Remove two middle screws item (48) securing two steel plated clamps item (47). Please note – middle screws have hardware on the back side of the bracket. See Figure 5.3 a) and b) below − Remove the clamps item (47) holding cables and harnesses together. See Figure 5.5 a) Figure 5.4 b) Figure 5.5 Top view after brackets removed Page 27 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 5.7 RF and DC Heat-sink Gasket Cover Assemblies Removal − Remove 8 screws item (38) located on the bottom cover Figure 5.6 a) and b) in order to uninstall RF and DC Heat-sink Gasket Cover Assemblies items (16) and (17). Please note, all the screws are locked with Loctite 290 compound, so higher initial torque force must be applied a) Figure 5.6 b) Page 28 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 5.8 Power Supply Removal − Remove four screws from J8 and J9 of RF module as shown on the picture Figure 5.7 a) and b) (shown with red arrows) then disconnect Pilot Tone Cables 1 and 2. items (14) and (15) − Disconnect J6 and J7 Semi-rigid cable connectors of the Power Supply Module (shown with blue arrows) − Remove screws item (27) from the left side cover of the drawing Figure 5.7 to uninstall Power Supply sub-assembly − In order to remove Power Supply assembly first shift it for approximately 3’’ to gain the access to the rest of the cables and then remove two connectors (J4 and J15 shown on the drawings Figure 5.7 a) and b) and on Figure 5.8 a) and b) with green color) − Remove Power Supply from the housing b) a) Figure 5.7 Page 29 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS a) b) Figure 5.8 Figure 5.9 Power Supply Assembly Page 30 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 5.9 RF Module Removal: − Remove all the screws item (27) holding RF Module from the right side on the Figure 5.7 a). Please note all screws are locked with Loctite 290 compound, so higher initial torque force must be applied − Shift RF Module off the side panel for approx. 2" distance − Disconnect two Semi-rigid Cables J10 and J13 at locations shown on Figure 5.8 a) with yellow circles and on the Figure 5.10 below − Remove RF Module from the housing J13 J10 Figure 5.10 Figure 5.11 RF Module Sub-assembly Page 31 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Cleaning − No cleaning operation for HPA901B is required Check − Checking is limited to visual inspection of the following • • • Ensure that the air channels are not obstructed. Ensure that all connectors are secure. Ensure that the HPA is mounted securely. Repair − Because of the complexity of the HPA901B, field servicing is not practical. Should a fault be identified within a unit, the unit should be returned to the factory, in its original packing material if possible, for repair or replacement. − Refurbished replacement units will be functionally tested prior to being shipped to the customer. Based on the type of fault, ITS Electronics Inc. will determine the types of tests required to verify the integrity and serviceability of the unit. These tests will be listed on the functional test sheet that accompanies the unit. Page 32 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Assembly 9.1 RF Module Installation − Place RF Module into the housing Figure 8.1 a) − Connect Semi-rigid Cables to J10 and J13 as shown on Figure 8.1 b) − Install 13 screws item (27) securing RF module to the housing. All screws must be assembled with Loctite 290 locking compound J13 a) Figure 8.1 b) Page 33 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. J10 ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 9.2 Power Supply Installation − Place Power Supply onto the housing away from the back cover to more easily plug connectors and cables as shown on the Figure 8.2 a) − Install two connectors J4 and J15 as shown on the drawings Figure 8.2 a) and b) − Install Pilot Tone Cables 1 and 2 item (14) and (15) – J6 and J7 of the Power Supply Module and J8 and J9 of RF module as shown on the picture Figure 8.2 b) − Align Power Supply Module mounting holes with side cover − Install 12 screws item (27) as shown on the drawing Figure 5.7 to secure Power Supply sub-assembly in place All screws must be assembled with Loctite 290 locking compound J15 Figure 8.2 a) c) J6 J7 J9 J4 J8 b) Installed RF and Power Supply Page 34 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 9.3 RF and DC Heat-sink Gasket Cover Assemblies Installation − Place items(16) and (17) - RF and DC Heat-sink Gasket Cover Assemblies into the housing as shown on the Figure 8.3 a) and b) − Install 8 screws item (38) to the bottom cover Figure 8.3 a) and c) in order to secure RF and DC Heat-sink Gasket Cover Assemblies. All screws must be assembled with Loctite 290 locking compound b) a) Figure 8.3 c) Page 35 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 9.4 Top Bracket Installation − Install 2 steel plated clamps item (47) to the cables and harnesses per Figure 8.4 a) − Place Top bracket item (18) onto the housing − Install two middle screws item (48) with nut, flat and lock washers items (28), (30) and (31) holding clamps item (47), see Figure 8.4 b) and c) − Install #4-40 x 5/16" Flat Head Philips Screws item (36) holding the brackets. All screws without lock washers must be assembled with Loctite 290 locking compound Use this clamp to hold J1, J2 and cable B from item 5 and item 15 a) b) Use this clamp to hold J1 and cable B from item 5 and item 15 c) Figure 8.4 Page 36 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 9.5 Front Panel Assembly − Place the front panel onto the housing − Plug D-Sub Connector item (2) on the J12 on the Power Supply module as shown on Figure 8.5 a) and secure with two #4x40 3/8” screws − Install the front panel screws except top three as shown on the picture 8.5 b) All screws must be assembled with Loctite 290 locking compound a) Figure 8.5 b) Page 37 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS 9.6 Top Lid and Front Panel Assembly − Place top lid onto the housing as shown on the Figure 8.6 − Align RF and DC Heat-sink Gasket Covers with the top lid holes − Install eight #4-40 x 5/16" Flat Head Philips Screws (38) that secure the top lid to the RF and DC Heat-sink Gasket Covers items (16) and (17) as shown on Figure 5.1 with red circle. − Install top three screws from the front panel as shown on the Figure 8.5 b) − Install the rest of Flat Head Philips Screws on the top lid. All screws must be assembled with Loctite 290 locking compound Figure 8.6 Page 38 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS Appendix A. ILLUSTRATED PARTS LIST A.1 General • • • The Illustrated Parts List (IPL) includes a list, as in Table A1 and illustration drawings, Figure A1 ~ Figure A7. A Numerical Index is included in this section. Supplier (vendor) information includes the name, address, and CAGE code for each supplier. A.2 Explanation and Usage • • • • • • Each SRU or part has its unique cross reference index, the “ITEM NO.”, specified in Table A1 as well as in the drawings. The number of a specific SRU or part in a HPA is shown in the “QTY” column. The measurement unit of a specific SRU or part in a HPA is shown in the “UM” column. “EA” means that SRU or part is counted individually as one piece. “IN” means that material is counted in length (inches) while “CC” means that material measured in volume (cubic centimeters). Each SRU or part has its own unique identification as in the “PART NUMBER” column The characteristics of a specific SRU or part is describe in the “PART DESCRIPTION” column The “MANUFACTURER” column shows the manufacturer of that SRU or part. For the general parts, such as washer, screw, no manufacturer is specified. Page 39 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS ITEM QTY UM EA PART NUMBER H4800400 EA 16-500324 EA EA EA EA EA H4800200 H4800900 H4802700 H4802800 H4802900 NOT IN USE EA CR1-3008-0000-I 10 A/R EA 05805A500BK 11 A/R EA 05805A250GY 12 13 14 15 16 17 18 19 EA EA EA EA EA EA EA NOT IN USE H4804300 H4800700 H4800800 H4804500 H4804600 H4800021 MS25043-10DA 20 EA 5805-23-P 21 EA 909-0059 22 EA 909-0060 23 24 25 26 14 EA EA EA EA 909-0055 909-0073 909-0069 909-0119 27 25 EA 909-0621 28 29 30 31 32 12 10 22 12 18 EA EA EA EA EA 909-0063 909-0067 909-0022 909-0579 909-0003 33 22 EA 909-0106 34 35 36 37 38 39 40 41 42 43 44 10 16 13.5 1.5 1.5 1.5 EA EA CC IN EA IN IN IN IN IN EA 909-0244 HV420-7 290 LC136-1-500 909-0174 FIT-221V3/32 FIT-221V5/16 FIT-221V1/4 PLF100-3/4-BLK-4 PLF100-1-BLK-4 PLT1M-M76 45 EA ABMM-AT-CO 46 47 48 IN EA EA Sn63Pb37 SPN-6 909-0247 PART DESCRIPTION 8MCU Enclosure 15 pos male , D-sub connector, shell nickel plated, solder cup 50 micro inch gold plated Power Supply Module Assembly RF Module Assembly ARINC Harness Assembly DC to RF Control DB25 Wiring Harness DC to RF 32V Power 2W2 Wiring Harness LED, CR series T1 3/4, high effic. red, no res., IP66, #24 MIL-W-22759/33 wires HT-805(A)-. 500 Black, Black Medium Grade Cellular Silicone HT-805(A)-. 250 Gray, Gray, Medium Grade Cellular Silicone MANUFACTURER Churchill CONEC ITS ITS ITS ITS ITS WILBRECHT Rogers Co. Rogers Co. Service Connector Wiring Harness Pilot Tone Cable 1 Pilot Tone Cable 2 DC HEATSINK GASKET COVER ASSEMBLY RF HEATSINK GASKET COVER ASSEMBLY TOP BRACKET Dust Cap with sash chain. (BLACK) ITS ITS ITS ITS ITS ITS ITT Cannon W AVE SHAPE SPRING WASHER, STNLS 301-304, PASSIVATED, ID=0.350"" OD=0.492"" THK=0.007" Seastrom #10 FLAT WASHER N TYPE B, OD. 0.406 x 0.040 #10 HELICAL SPRING LOCK WASHER, 0.334" MAX. OD, 0.047"THK. #4-40 x 1/2" PAN HEAD PHILLIPS SCREW #4-40 x 3/8" SCKT. HEAD SCREW #4-40 HEX. NUT, 3/16" HEX. x 3/32" #6-32 x 1/4" FLAT HEAD PHILLIPS SCREW BLACK PAINTED HEAD #6-32 x 3/8"L 100 deg flat head phillips machine screw #6-32 HEX NUT, 5/16" HEX.x 0.108 #6-32 x 1/2" PAN HEAD PHILLIPS SCREW #6 FLAT WASHER OD: 0.312 x 0.032, TYPE B, N #6 SPRING LOCK WASHER OD: 0.266 x 0.040 #4 Helical Spring Lock Washer, 0.031 THK. #4 FLAT WASHER 0.209 O.D. x 0.032 THK. (NAS620C4) #10-32 x 1/2" SOCKET HEAD SCREW #HV420-7 Oval-Internal Thread Handle. 5" x2.25" LOCTITE 290 LACING TAPE #4-40 x 5/16" FLAT HEAD PHILLIPS SCREW HEAT SHRINK TUBING (0.094" ID) HEAT SHRINK TUBING (0.312" ID) HEAT SHRINK TUBING (0.250" ID) HEAT SHRINK TUBING (0.75" ID) HEAT SHRINK TUBING (1" ID) TEFZEL 4" BLUE CABLE TIE 4 way adhesive backed mount, Black, 0.75"x0.75", Material: ABS SOLDER WIRE Sn63Pb37 STEEL PLATED SANTOPRENE CLAMP, 3/8" ID #6-32 x 1" FLAT HEAD PHILLIPS SCREW not specified not specified not specified not specified not specified not specified Churchill not specified not specified not specified not specified not specified not specified not specified HANDLE UNLIMITED LOCTITE ALPHA not specified ALPHA WIRE ALPHA WIRE ALPHA WIRE PLASTRONIC PLASTRONIC PANDUIT PANDUIT KESTER RICHCO not specified Table A1 - HPA Part List Page 40 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS A.3 Vendors (Suppliers) VODU48 ITS Electronics Inc. 200 Edgeley Blvd., Unit #24-27 Concord, Ontario, CANADA L4K 3Y8 VCAGE ALPHA Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS VCAGE ALPHAWIRE Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS VCAGE Churchill Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS VCAGE CONEC Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS VCAGE HANDLE UNLIMITED Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS VCAGE ITT Cannon Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS VCAGE KESTER Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS VCAGE Loctite Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS VCAGE PANDUIT Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS VCAGE PLASTRONIC Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS Page 41 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc. ITS ELECTRONICS INC. MICROWAVE COMPONENTS AND SUBSYSTEMS VCAGE RICHCO Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS VCAGE Rogers Co. Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS VCAGE Seastrom Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS VCAGE WILBRECHT Address and CAGE code to be supplied by ITS Address and CAGE code to be supplied by ITS Page 42 of 42 The information contained herein is proprietary to ITS Electronics Inc. and is to be used by the recipient for the sole purpose for which it has been supplied. It shall not be disclosed, in whole or in part to any other party without the prior written permission of ITS Electronics Inc.
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