SAGEMCOM BROANDS HILONC-3GPS Qual-Band GSM/GPRS/EDGE Voice and Data Module User Manual rev1
SAGEMCOM SAS Qual-Band GSM/GPRS/EDGE Voice and Data Module rev1
User manual rev1
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| Document ID | 1685824 |
| Application ID | vyYp8lCql/ZClMgoXT7Ddg== |
| Document Description | User manual rev1 |
| Short Term Confidential | No |
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| Document Type | User Manual |
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| Filesize | 382.39kB (4779894 bits) |
| Date Submitted | 2012-04-30 00:00:00 |
| Date Available | 2012-10-27 00:00:00 |
| Creation Date | 2012-04-16 18:05:07 |
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| Document Lastmod | 2012-04-16 18:30:18 |
| Document Title | User manual rev1 |
| Document Creator | Microsoft® Office Word 2007 |
Direction des Recherches et des Développements Etablissement de RUEIL-MALMAISON RUEIL-MALMAISON R&D Center NOTE D'ETUDE / TECHNICAL DOCUMENT REFERENCE ETUDE / PROJECT URD1 – OTL 5696.1–022/ NOM DE L’ETUDE Code 72740 TA1 HILONC-3GPS TITRE / TITLE : HILONC- 3GPS APPLICATION NOTE Edition N° Nom 0.4 Approbations /Approvals Rédacteur(s) Chef de projet Chef Unité Project design manager Responsable d’entité / Product design manager R&D unit manager Assurance Qualité R&D quality assurance Author(s) CC Hsieh CC Hsieh CW Sheu P. NOM Harry Lin 01/08/2011 19/09/2011 19/09/2011 28/07/2011 21/09/2011 Aaron Wang CC Hsieh Ruth Chu Name Date Signature Harry Lin RESUME / SUMMARY This document is the application notes of the HILONC-3GPS module. Mots clés / Keywords : HiLoNC-3GPS, application Note DIFFUSION INTERNE / INTERNAL DISTRIBUTION REDACTEUR(S) / AUTHOR (S) + F.FREULON, F.GOUERE . DIFFUSION EXTERNE sous convention de confidentialité : EXTERNAL DISTRIBUTION with confidentiality agreement : …………. Enregistrement relatif à la qualité (ERQ) / Quality record A déposer en enveloppe soleau / Put in a soleau envelope Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE01/08/ 2011 - page 1/41 NOTE D'ETUDE / TECHNICAL DOCUMENT FICHE RECAPITULATIVE / SUMMARY SHEET Ed Date Référence Rédacteur(s) Relecteur(s) Date Reference Author(s) Reviser(s) 0.1 23/09/2011 0.2 17/10/2011 0.3 09/11/2011 0.4 03/12/2011 URD1 OTL 5696.1 022 72740 ed 0.1 HiLoNC-3GPS Application Note URD1 OTL 5696.1 022 72740 ed 0.2 HiLoNC-3GPS Application Note URD1 OTL 5696.1 022 72740 ed 0.3 HiLoNC-3GPS Application Note URD1 OTL 5696.1 022 72740 ed 0.4 HiLoNC-3GPS Application Note SAGEMCOM SAGEMCOM. SAGEMCOM SAGEMCOM SAGEMCOM SAGEMCOM SAGEMCOM SAGEMCOM Pages modifiées / Changed pages All Observations Comments First Draft release Modification in the Sim schematics, PU on sim data removed MSL chapter added RTC and mechanical chapters improved Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE 01/08/20111 - Page 2 / 41 SOMMAIRE / CONTENTS 1. 2. 3. 4. 5. 6. 7. OVERVIEW................................................................................................................................................................... 1.1. Document Objectives .......................................................................................................................................... 1.2. Reference Documents......................................................................................................................................... 1.3. Document Modifications...................................................................................................................................... 1.4. Conventions .......................................................................................................................................................... Block Diagram............................................................................................................................................................... Functional Integration.................................................................................................................................................... 3.1. How to connect a SIM card ................................................................................................................................ 3.2. Audio Connection............................................................................................................................................... 3.2.1. PCM Digital Audio ...................................................................................................................................... 3.3. PWM .................................................................................................................................................................... 3.3.1. PWM for Buzzer connection ..................................................................................................................... 3.3.2. Network LED............................................................................................................................................... 3.4. Power Requirements ......................................................................................................................................... 3.5. UART ................................................................................................................................................................... 3.5.1. Complete V24 Connection of HILONC-3GPS to host .......................................................................... 3.5.2. Complete V24 Interface with PC.............................................................................................................. 3.5.3. Partial V24 (RX-TX-RTS-CTS) Connection of HILONC-3GPS to host.............................................. 3.5.4. Partial V24 (RX-TX) Connection of HILONC-3GPS to host ................................................................ 3.6. GPIO .................................................................................................................................................................... 3.7. ADC...................................................................................................................................................................... 3.8. Backup Battery ................................................................................................................................................... 3.8.1. Backup Battery Function Features .......................................................................................................... 3.8.2. Internal HILONC-3GPS Charging Function ........................................................................................... 3.8.3. Backup Battery Technology...................................................................................................................... 3.9. USB ...................................................................................................................................................................... Power Management ...................................................................................................................................................... 4.1. Power Modes...................................................................................................................................................... 4.2. Module Power up ............................................................................................................................................... 4.2.1. PWON Power up ........................................................................................................................................ 4.2.2. IO DC Presence before Power on ........................................................................................................... 4.3. Power on and Sleep Diagrams ........................................................................................................................ 4.4. Module Power off ............................................................................................................................................... 4.4.1. UART Interface........................................................................................................................................... 4.4.2. USB Interface ............................................................................................................................................. 4.5. Sleep Mode......................................................................................................................................................... ESD & EMC Recommendations .................................................................................................................................. 5.1. HILONC-3GPS Handling .................................................................................................................................. 5.2. ESD Recommendations.................................................................................................................................... 5.2.1. Avoiding ESD.............................................................................................................................................. 5.3. EMC recommendations..................................................................................................................................... Radio Integration .......................................................................................................................................................... 6.1. Antenna Connection .......................................................................................................................................... 6.1.1. Antenna Pad ............................................................................................................................................... 6.1.2. Antenna Recommendations ..................................................................................................................... 6.2. Ground Link Area ............................................................................................................................................... 6.3. Layout .................................................................................................................................................................. 6.4. Mechanical Recommendations........................................................................................................................ 6.5. Other Recommendation - production/design test.......................................................................................... Audio Integration.......................................................................................................................................................... 7.1. Mechanical integration and acoustics ............................................................................................................. 7.2. Electronics and layout ....................................................................................................................................... Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE 01/08/20111 - Page 3 / 41 11 11 14 14 15 15 16 16 17 18 19 19 20 20 20 20 21 21 21 21 22 22 22 22 22 23 23 23 24 24 24 24 24 24 25 25 26 27 27 27 27 27 27 28 8. Recommendations on customer board layout ............................................................................................................... 8.1. General recommendations on layout .............................................................................................................. 8.1.1. Ground......................................................................................................................................................... 8.1.2. Ground layout guidelines .......................................................................................................................... 8.1.3. Digital ground.............................................................................................................................................. 8.1.4. Analog/RF ground ...................................................................................................................................... 8.1.5. Power supply .............................................................................................................................................. 8.1.6. Clocks .......................................................................................................................................................... 8.1.7. Data bus and other signals ....................................................................................................................... 8.1.8. Radio............................................................................................................................................................ 8.1.9. Shielding...................................................................................................................................................... 8.2. Example of a customer board layout............................................................................................................... 9. Moisture sensitivity level precautions .......................................................................................................................... 10 CUSTOMER PROCESS ................................................................................................................................................ 10.1 PACKAGE............................................................................................................................................................. 10.2 Stencil .................................................................................................................................................................... 10.2.1 Fotprint ........................................................................................................................................................... 10.2.2 Recommended Stencil design .................................................................................................................... 10.3 Solder Paste ......................................................................................................................................................... 10.4 Profile for Reflow soldering................................................................................................................................. 10.5 SMT Machine........................................................................................................................................................ 10.5.1 Nozzles........................................................................................................................................................... 10.5.2 Fiducials ......................................................................................................................................................... 10.6 Underfill ................................................................................................................................................................. 10.7 Second reflow soldering....................................................................................................................................... 10.8 Hand soldering ..................................................................................................................................................... 10.9 UnsolderING ......................................................................................................................................................... 11. Labelling .................................................................................................................................................................. 12 CE/FCC/IC warning statement............................................................................................................................. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111NOTE - Page 4 / 41 28 28 28 28 29 29 29 29 29 29 29 30 30 31 31 32 32 33 33 33 34 34 34 34 34 35 35 35 35 Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE 01/08/20111 - Page 5 / 41 1. OVERVIEW 1.1. Document Objectives The aim of this document is to provide examples of hardware solutions for development of products based around the Sagemcom HiLo NC-3GPS Module. Most of these solutions are not mandatory. Use them as suggestions of what should be done to achieve a working product and what should be avoided according to our own experiences. This document gives suggestions on how to integrate the HiLo NC-3GPS module into devices for automotive applications, AMM (Automatic Metering Management), tracking systems; including connection with external devices, layout advices, external components (decoupling capacitors…), etc. 1.2. Reference Documents [1] URD1 OTL 5696 3 001 72497- HILONC-3GPS technical specifications [2] URD1 OTL 5696.1 006 72370- AT Command Set for SAGEM HILONC-3GPS Modules 1.3. Document Modifications The information presented in this document should be accurate and reliable. However Sagemcom assumes no responsibility for its use, nor any infringement of patents or other third party rights which may result from its use. This document is subject to change without notice. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. 1.4. Conventions SIGNAL NAMES: All signal names written on the pins of the HILONC-3GPS module are in italics. Special attention must be paid to the information on them. 2. Block Diagram Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE 01/08/20111 - Page 6 / 41 Diversity Ant. Primary Ant. Antenna Port GPS Ant. R F _ Con Power Supply HILONC-3GPS V B AT( 4 ) V B A CK UP Power on Signal Power Control V GP I O 2.85V GN D( 4 ) DC Battery 3.7V 47uF P WON UART Reset RESET USB Slave USB Master UA R T _ DS R UA R T _ DCD UA R T _ T X UA R T _ CT S US B _ DP UA R T _ R X US B _ DN UA R T _ R T S V US B Full UART UA R T _ R I UA R T _ DT R GPIO UA R T _ DS R GP I O 1 Six GPIOs GP I O 2 GP I O 3 GP I O 4 Vibrating device PWM P WM GP I O 5 External Analog input GP I O 6 ADC A DC Digital Audio USB Slave SIM 3V & 1.8V S I M_ CL K P CM_ I N SI M_ RST P CM_ S YN C SIM_DATA P CM_ OUT VSI M PCM P CM_ CL K : HILONC-3GPS module block diagram Note d’étude / Technical document : 01/08/20111 - Page 7 / 41 URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE 3. Functional Integration Advancements in silicon technology have brought about concurrent functionality improvements that allow lower power consumption. The HILONC-3GPS module with 116 pin LGA is a very compact design with dimensions of only 28.5 x 34 x 2.35 mm and weighing less than 7 grams. All digital I/Os among the 116 pin LGA are within the 1.8V domain suitable for most systems with the exception of SIM I/O's, which can also be in the 3V domain depending on SIM-card use, and SDIOs which are in the 2.85V domain. Analog I/Os occupy the following power domains: · VSIM SIM I/Os are in the 1.8V or 3V domain · VBACKUP 3V domain ·VGPIO 2.85V domain ·VBAT from 3.4V to 4.2V. 3.7V is normal. ·VUSB 5V ·ADC 2.2V ·Antenna RF power amplifier is in the VBAT domain Do not power on the module I/O with a voltage over the specified limits. This could cause damage to the module. In order to achieve accurate audio performance from customer products it is necessary to have a basic competency in acoustic engineering. In order to achieve accurate radio performance from customer products it is necessary to have a basic competency in radio engineering. : HILONC-3GPS module LGA pad side Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE 01/08/20111 - Page 8 / 41 : HILONC-3GPS module top side 3.1. How to connect a SIM card PIN No. C1 C2 C3 C4 C5 C6 C7 C8 Name VCC RST CLK NA GND VPP I/O N/A : SIM Card signals The HILONC-3GPS module provides SIM signals to the 116 pins of the LGA. A SIM card holder with 6 pins must be adopted to access SIM functions. Decoupling capacitors must be added on to the VSIM,SIM_DATA,SIM_RST,and SIM_CLK signals as close as possible to the SIM card connector to avoid EMC issues and in order to pass SIM card approval tests. Vsim must be used only for the SIM card. Use ESD protection components to protect the SIM card and module I/Os against electrostatic discharge. The following schematic shows how to protect SIM access of the 6 pin connector. This must be performed every time the SIM card holder is accessed by the end user. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE 01/08/20111 - Page 9 / 41 VSIM : EMC and ESD protection components in the vicinity of the SIM If it is necessary to use long SIM bus lines of over 100 mm, it is recommended to adopt serial resistors to avoid electrical overshoot on SIM bus signals. Use 56 Ω for the clock line and 10Ω for the reset and data lines. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 10 / 41 NC R601 56 SIM_CLK_CARD VSIM_CARD 10 33pF C602 10nF SIM_DATA_CARD C601 R601 10 VSIM_CARD NC R602 10 SIM_RST_CARD 2.2k R616 C60322pF SIM_GPIO GND : Serial resistors for protection of long SIM bus lines The schematic above includes a hardware SIM card presence detector. It can be connected to GPIO2. GPIO2 is the design default for SIM card detection. Use a 22pF capacitor to debounce the GPIO2 detection signal. The SIM card must not be removed from its holder while it is still powered. Switch the module off with the AT command, then remove the SIM card from its holder. 3.2. Audio Connection The HILONC-3GPS module features one input audio path and one output audio path. The input path is a PCM digital input. The output path is a PCM digital output. 3.2.1. PCM Digital Audio HILONC-3GPS can be used for connection to an external codec through the integrated PCM interface. The interface supports an 8 kHz short sync mode at 2048 kHz and an 8 kHz long sync mode at 128 kHz. In shortsync (primary PCM) mode, the HILONC-3GPS can act as master or slave. In long-sync (auxiliary PCM) mode, the HILONC-3GPS is always a master; there is no slave support. Note d’étude / Technical document : 01/08/20111 - Page 11 / 41 URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE : Primary PCM mode timing parameter Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 12 / 41 Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 13 / 41 : Auxiliary PCM mode timing parameter 3.3. PWM A single PWM pin is available on the HILONC-3GPS. This is a general purpose PWM which can be used to drive a vibrating device, keypad backlight or LED. The PWM pin can be controlled by AT commands, allowing several periods and duty cycles. More details are given in the AT commands specifications document. PWM output can be set by the user: Frequency between: 0.125Hz and 8KHz Duty range from: 0 to 100% 3.3.1. PWM for Buzzer connection The HILONC-3GPS module can utilize PWM output to drive a buzzer. The buzzer can serve as an abnormal status alarm. Resistors must be added to protect the buzzer. The value of these resistors depends on the buzzer and the transistor. Normally, they are set at 1KΩ. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 14 / 41 : Buzzer connection 3.3.2. Network LED The HILONC-3GPS module can manage a network LED which can be connected to 2G_RF_IND. The transistors can be found in a single package referred to as the UMDXX or PUMDXX Family. The value of resistor R depends on the characteristics of the LED; its purpose is to limit the current passing through the diode. Use the AT command to set the 2G_RF_IND used to control the LED. : Network LED connection 3.4. Power Requirements Input Rating : 3.4V ~ 4.2VDC , 700mA , Operation Temperature : -40℃~85℃ . The host system must supply 3.4V ~ 4.2Vof power to the VBAT. Within normal 2G and 3G operational modes, the maximum average current is approximately 1.1A depending on RF output power. In 2G mode peak current can be as high as 2A under matched antenna conditions. Peak current could be as high as 1.75A in the case of a mismatched antenna. In 3G mode and under conditions of antenna mismatch, peak current may increase by up to 700mA. VBAT traces are required to be as short and as wide as possible. VBAT ceramic decoupling capacitors of at least 100μF/10V are required to ensure good RF performance. It is strongly recommended to place capacitors close to the module’s connection pad and connected via low resistance tracks to VBAT and GND. Host power must be capable of sourcing enough current to accommodate maximum power in the event of 2G transmission bursts. This can be done, for example, by adding a large capacitor with a low ESR value. PCB tracks must be well dimensioned to support a maximum current of 2.2A. Voltage ripple caused by serial resistance of the power supply path could result in instances of voltage drop. The HILONC-3GPS does not support battery charging. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 15 / 41 3.5. UART The HILONC-3GPS has a UART port that can be used in low-speed, full-speed, and high-speed modes. The UART communicates with serial data ports conforming to the RS-232 interface protocol. With a properly written and user-defined download program, the UART port can be used for testing and debugging. Provision of external access to the V24 interface for easy upgrade of software is recommended. Baud rate up to 4Mbps. Unused signals remain disconnected. Signal name (DCE point of view) Signal view) UART_DTR DTE_DSR Signal UART interface is ON DTE_DCD Signal data connection in progress UART_DCD UART_RX name (DTE point DTE_TX UART_RTS DTE_CTS UART_TX DTE_RX UART_CTS UART_RI Signal use (DTE point of view) Transmit data HILONC-3GPS commands is ready to receive Receive data Wakes up the module when Ksleep=1 is used DTE_RI Signal incoming calls (voice and data), SMS, etc. Prevents the HILONC-3GPS from entering sleep mode Switches between data mode and command mode Wakes the module up. DTE_DTR Complete V24 Connection of HILONC-3GPS to host The 40 pins of the HILONC-3GPS module provide a V24 interface with the following signals: RTS/CTS, RXD/TXD, DSR, DTR, DCD, RI. Use of this complete V24 connection is required whenever your application exchanges data. HiLoNC-3GPS UART1_TX pin60 AT DTE_RTS UART_DSR 3.5.1. of DTE_RX DTE device UART1_RX pin17 DTE_TX UART1_RTS pin59 DTE_CTS UART1_CTS pin16 UART1_DSR pin15 UART1_DTR pin14 UART1_DCD pin58 UART1_RI pin61 DTE_RTS DTE_DTR DTE_DSR DTE_DCD DTE_RI GND is not represented. : Complete V24 connection of HILONC-3GPS to host This configuration allows the use of flow control RTS & CTS to avoid overflow error during data transfer. In addition, UART_RTS is used to inform DTE whether the HILONC-3GPS is ready to receive an AT command after power up sequence or wake up from the sleep mode. Note d’étude / Technical document : 01/08/20111 - Page 16 / 41 URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE TBD : RTS versus PWRON signal during power on sequence This signal configuration also enables all signals: · UART_RI signal is used when programmed to indicate an incoming voice or data call or SMS incoming message, etc. · UART_DCD signal is used to indicate GPRS connections. · UART_DTR signal is used to indicate that the module’s UART interface is ON. · UART_DSR signal is used to prevent the HILONC-3GPS from entering sleep mode, switching between Data and AT commands, hanging up a call or waking up the module etc. Avoid supplying power to the UART before the HILONC-3GPS is ON, as this may result in power up sequence error. 3.5.2. Complete V24 Interface with PC To use the V24 interface some adaptation of components is necessary. This is because HILONC-3GPS signals need to be converted to +/- 5V signals compatible with a PC. HiLoNC3GPS pin60 UART1_TX UART1_RX pin17 UART1_RTS pin59 UART1_CTS pin16 RS232 Transceiver IN OUT IN OUT IN OUT RTS OUT IN DTR IN OUT DSR IN OUT DCD IN OUT RI UART1_DCD pin58 UART1_RI pin61 CTS IN UART1_DTR pin14 TXD OUT UART1_DSR pin15 RXD GND is not represented. SUBD9 Female Note: pin 5 is GND : Connection to a data cable Avoid supplying power to the UART before the HILONC-3GPS is ON, as this could result in power up sequence error. UART_DTR signal used to indicate module UART interface is ON (need to pull high the UART_DTR signal with 470 K ohms to external 3V, as shown below): Note d’étude / Technical document : 01/08/20111 - Page 17 / 41 URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE GND is not reprenested. HiLoNC3GPS UART1_TX pin60 DTE_RX DTE device UART1_RX DTE_TX pin17 UART1_RTS pin59 DTE_CTS UART1_CTS DTE_RTS pin16 UART1_DSR DTE_DTR pin15 UART1_DTR DTE_DSR pin14 UART1_DCD DTE_DCD pin58 UART1_RI DTE_RI pin61 470K External 1.8V 3.5.3. Partial V24 (RX-TX-RTS-CTS) Connection of HILONC-3GPS to host When using only RX/TX/RTS/CTS instead of the complete V24 link, the following schematic can be used: HiLoNC3GPS UART1_TX pin60 DTE_TX UART1_RTS pin59 UART1_CTS pin16 pin15 UART1_DTR pin14 UART1_DCD pin58 NC UART1_RI NC pin61 DTE device UART1_RX pin17 UART1_DSR DTE_RX DTE_CTS DTE_RTS GND is not represented. : Partial V24 connection (4 wires) of HILONC-3GPS to host As UART_DTR is active (low electrical level) once HILONC-3GPS is switched on, UART_DSR is also active (low electrical level), therefore the AT command AT+Ksleep can switch between the two sleep modes availableHILONC. UART_DCD and UART_RI can remain disconnected and floating when not in use. Otherwise use 100KΩ to pull power up to 1.8V. This configuration allows use of flow control RTS & CTS to avoid overflow error during data transfer. Moreover UART_RTS is used to indicate when the HILONC-3GPS module is ready to receive an AT command after power up sequence or wake up from sleep mode. However this configuration does not allow signals such as: · UART_RI signal used when programmed to indicate an incoming voice or data call or incoming SMS etc…. · UART_DCD signal used to indicate DATA connections. · UART_DTR signal used to indicate module UART interface is ON. Note d’étude / Technical document : 01/08/20111 - Page 18 / 41 URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE · The UART_DSR signal is used to prevent HILONC-3GPS from entering sleep mode or to switch between DATA and AT commands or to hang up a call or to wake up the module etc…. 3.5.4. Partial V24 (RX-TX) Connection of HILONC-3GPS to host When using only RX/TX instead of the complete V24 link the following schematic can be used: HiLoNC3GPS UART1_TX pin60 UART1_RX pin17 UART1_RTS pin59 UART1_CTS pin16 DTE_RX DTE device DTE_TX UART1_DSR pin15 UART1_DTR pin14 UART1_DCD pin58 NC UART1_RI NC pin61 GND is not represented. : Partial V24 connection (2 wires) of HILONC-3GPS to host As UART_DTR is active (low electrical level) once HILONC-3GPS is switched on, UART_DSR is also active (low electrical level), therefore the AT command “AT+Ksleep” can switch between the two available sleep modesHILONC. As UART_RTS is active (low electrical level) once HILONC-3GPS is switched on, UART_CTS is also active (low electrical level), therefore the AT command “AT+Ksleep” can switch between the two available sleep modesHILONC. The HILONC-3GPS's firmware allows activation of UART_RTS during sleep state even when looped to the UART_CTS signal. UART_DCD and UART_RI can remain disconnected and floating when not in use. Note that this configuration does not allow the below signals: · RI signal used when programmed to indicate an incoming voice or data call or incoming SMS etc…. · UART_DCD signal used to indicate GPRS connections. · UART_DTR signal used to indicate the module UART interface is ON. · UART_DSR signal used to prevent the HILONC-3GPS module from entering sleep mode. 3.6. GPIO There are six GPIOs available on the HILONC-3GPS. Customer applications can directly access them through appropriate AT commands such as: - Output: pin is set to High or Low state. - Input: pin is read on request and customer application is responded to. As an input different scenarios are possible to cover a maximum range of customer applications: · Synchronous answer to AT command. · Asynchronous answer to AT command. Customer’s application prior to the read request has configured the GPIO to react to falling/rising edges. The customer application is notified asynchronously by AT command answer when the configured trigger occurs. Note d’étude / Technical document : 01/08/20111 - Page 19 / 41 URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE : Programmable GPIO configurations By utilizing other special AT commands, GPIOs can be used to, for example: 1. Perform I/O toggling while the module is attached to the network. 2. Perform I/O toggling when a pre-set temperature is reached. 3. Serve as an input to detect the presence of an antenna (with some additional external power.) 4. GPIO2 serves as an input default to detect SIM card presence …etc. 3.7. ADC The HILONC-3GPS has one ADC input pin which can be used to read the value of the voltage applied. The following conditions must be met to ensure correct performance: · Input signal voltage must be within 0V to 2.1V. · Input impedance of the pin is 2KΩ. · Input capacitance typically is 53pF. The AT command AT+KADC will produce a voltage value with the following characteristics: · 15 bits resolution · Maximum sampling frequency of 2.4MHz. 3.8. Backup Battery 3.8.1. Backup Battery Function Features A backup battery can be connected to the module in order to supply internal RTC (Real Time Clock) when the main power supply is removed. Thus, when the main power supply is removed, the RTC is still supplied with power and the module keeps the time register running. ·If VBAT < 3V, internal RTC is supplied by VBACKUP. · If VBAT ≥3V, internal RTC is supplied by VBAT. 3.8.2. Internal HILONC-3GPS Charging Function HILONC-3GPS has a charging function that does not require any additional external power supply (power supply for the charging is provided by the HILONC-3GPS). Charge of the back-up battery occurs only when main power supply VBAT is provided. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 20 / 41 : Internal charging of backup battery or 10μF capacitor The value of resistor R depends on the charging current value of the backup battery manufacturer. 3.8.3. Backup Battery Technology Capacitor batteries do not have the disadvantages of lithium ion rechargeable batteries: · Maximum discharge current is generally greater, · No need to regulate charge current. Moreover, this kind of battery is available in the same kind of package as a lithium ion cell and is fully compatible from a mechanical perspective. The only disadvantage is that the capacity is significantly lower than a manganese silicon lithium ion battery. 3.9. USB The HILONC-3GPS module has a set of USB_DP and USB_DN bi-directional differential USB data lines that comply with USB 2.0 specifications. HILONC-3GPS acts as the USB-Slave and the customer application acts as the USB-Master. · Integrated high-speed USB PHY. · In compliance with USB 2.0 specifications for a peripheral device. ·The USB 2.0 specification requires hosts such as PCs to support all three USB speeds, namely low-speed (1.5 Mbps), full-speed (12 Mbps) and high-speed (480 Mbps). The USB 2.0 specification allows peripheral devices to support any one or more of these speeds. The USB_DP and USB_DN signals are routed as a ~90 Ω differential pair. These signals must be routed side by side and on the same layer and their trace length should be matched as closely as possible. A 2pF capacitor is required to be installed between USB_DP and USB_DN close to the HILONC-3GPS. These signals have relatively fast edges, so they should be routed away from sensitive circuits and signals such as 19.2 MHz TCXO, sleep XTAL, and RF. Therefore, avoid routing these signals on surface layers; routing in the inner layer sandwiched between power and ground is preferable. 4. Power Management The host system should supply 3.4V~4.2V to VBAT for powering the baseband, logics circuit and RF circuit. 4.1. Power Modes Depending on the status of the HILONC-3GPS, different power consumption modes can be identified. Active mode (Active communication) All systems on HILONC-3GPS are active. In this mode, the module is registered to the network and a voice/data Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 21 / 41 call is actively transmitting data. Sleep mode (Active idle) All systems on HILONC-3GPS are active including the USB bus. In this mode, the module is registered to the network but it is idle/paging only. No voice/data call connection is established. Fly mode The processor is still active but the radio section is powered down. This mode can be controlled by sending an AT command to the module. 4.2. Module Power up Starting the HILONC-3GPS via PWON. 4.2.1. PWON Power up To start the module, first power up VBAT, which must be in the range 3.4V ~ 4.2V, and must be able to supply 1.75A during TX bursts. PWON is a low level active signal internally pulled up to a dedicated power domain of 1.8V. As PWON is internally pulled up, a simple open collector or open drain transistor must be used for ignition. To start the module, a low level pulse must be applied on PWON for 500ms. After a few seconds, the UART_RTS enters active state and the module is ready to receive AT commands. VGPIO is a supply output from the module that can be used to check if the module is active. · When VGPIO = 0V the module is OFF. · When VGPIO = 2.85V the module is ON. TBD : Power on sequence TBD : Power off sequence Send AT COMMAND “AT+CPOF” to power off module. 4.2.2. IO DC Presence before Power on When VBAT is available but the module has not yet powered up, the following I/O's raise their output. VBACKUP raise to 3V PWON raise to 1.8V 4.3. Power on and Sleep Diagrams The 2 diagrams below show the behavior of the module and the DTE during power on and then in sleep modes. Note: the module cannot enter sleep mode if USB bus is connected. TBD : Diagram for power on TBD : Diagram for sleep mode 4.4. Module Power off Note d’étude / Technical document : 01/08/20111 - Page 22 / 41 URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE 4.4.1. UART Interface To turn the module off, use the AT command AT+CPOF. If PWON is not pulled down the module will switch to OFF mode after the AT command, otherwise the module restarts immediately (OFF sequence is performed followed by power ON sequence). : Power off sequence for PWON, VGPIO and UART_RTS 4.4.2. USB Interface As the module can also be turned on when a USB cable is plugged in, the module turn off sequence requires the USB interface to be OFF or VBUS disconnected once the command is sent and acknowledged by the module. Thus, to turn the module off when USB interface is in use, use the AT command AT+CPOF, then disconnect VBUS signal (unplug the USB cable or use a command switch to switch off VBUS) when the module acknowledges (responds with an OK message) the command, otherwise the module will restart immediately (an OFF sequence is performed followed by a power ON sequence). 4.5. Sleep Mode The AT command AT+KSLEEP allows configuration of the sleep mode. When AT+KSLEEP=1 has been configured: · The HILONC-3GPS module decides by itself when to enter sleep mode (no tasks running). · “0x00” character on serial link wakes up the HILONC-3GPS module. When AT+KSLEEP=0 has been configured: · The HILONC-3GPS module is active when UART_DSR signal is active (low electrical level). · When UART_DSR is deactivated (high electrical level), the HILONC-3GPS module enters sleep mode after a certain period of time. · On UART_DSR activation (low electrical level), the HILONC-3GPS module wakes up. When AT+KSLEEP=2 has been configured: · The HILONC-3GPS module is prevented from ever entering sleep mode. In sleep mode the module reduces power consumption and waits for a wake up signal from either the network, Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 23 / 41 from the operating system or from the host controller. Note: The module cannot enter sleep mode if USB bus is connected. 5. ESD & EMC Recommendations Adopting the Human Body Model of the JEDEC JESD 22-A114 standard, the HILONC-3GPS can support 2KV on each LGA pad. 5.1. HILONC-3GPS Handling HILONC-3GPS modules are packaged in boxes. HILONC-3GPS modules contain electronic circuits sensitive to the electrostatic electricity of the human hand. Handling without ESD protection could result in permanent damage or even destruction of the module. 5.2. ESD Recommendations If customer’s design requires the ability to withstand more than 2KV of electrostatic discharge, the following must be observed: ESD current is able to penetrate into the device via the following typical components: · SIM connector · Battery / data connector · All parts with conductive paint. as much as possible try to decrease the level of ESD current on electronic components located inside the device (customer’s board, HILONC-3GPS inputs, etc…) 5.2.1. Avoiding ESD HILONC-3GPS to the customer’s board. ould be shielded and FPC connectors should be correctly grounded at each extremity. Put a 100nF capacitor to the battery, or even better put a varistor or ESD diode in parallel on battery and charger wires (if any) and on all power wires connected to the module. Following are the pin numbers to be protected from discharge of over 2KV and the varistor references. Pin29/43/44: VBAT Pin67/68/69: USB Pin71: VGPIO Pin33/34/35/79: USIM Part Vendor Part number Varistor LITTLEFUSE V0402MHS12NR Varistor (for USB line) COOPER 0402ESDA-MLP1 5.3. EMC recommendations To avoid EMC issues, place the capacitors or filters as close as possible to high speed data lines such as USB and SDIO. 6. Radio Integration Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 24 / 41 The HILONC-3GPS module incorporates RF transceiver technology that converts received signals directly from RF-to-baseband and transmits signals directly from baseband-to-RF (known as direct conversion or zero intermediate frequency (ZIF) processing). This technique eliminates the need for large IF surface acoustic wave (SAW) filters and supporting IF and LO circuits. 6.1. Antenna Connection The HILONC-3GPS module is equipped with an RF LGA pad for antenna connection. Definition of the reference antenna connector: · Strictly 50 ohms matched impedance PCB tracks · Straight PCB tracks Antenna gain: · Radiation pattern: depending on antenna position and size of device · Gain average in space in all frequencies: > -3dBi · Maximum VSWR: < 1.5:1 with 50 ohm reference impedance In order to achieve optimum sensitivity and output power, it is recommended to implement a matching circuit between the module and the antenna: : Antenna connection reference 6.1.1. Antenna Pad Three 50 ohm RF pads on the HILONC-3GPS PCB are available for antenna connection. One is for the Primary antenna, the second is for Diversity RX and the other is for GPS antenna. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 25 / 41 : RF pads 6.1.2. Antenna Recommendations Antenna for HILONC-3GPS should resonate in the operating bands (GSM 850, 900, 1800, 1900 + UMTS band 1, 8) depending on the actual application of the specific HILONC-3GPS module. Note that the RF-impedance of the HILONC-3GPS is 50Ω. Use low loss antenna cable (max. 0.5dB). To avoid interference choose an antenna type with a radiation pattern that does not interfere with the module. . Circular polarized antennas are preferable. Verify operation of the antenna by measuring the total radiated power. Avoid placing a transmitting antenna near sensitive areas. Apply EMC-design rules and follow shielding concepts. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 26 / 41 Keep EMC-sensitive and high-emission areas separate. 6.2. Ground Link Area Good ground contact between the module and customer’s board is required to achieve optimum radio performance (spurious, sensitivity…) All HILONC-3GPS ground pads must be connected to the ground of the customer’s board. The thermal ground pads (pads 93~113) must be soldered to the ground of the customer’s board to achieve better thermal dissipation. TBD : Thermal pads 6.3. Layout Isolate RF line and antenna from other bus or signals Signals should avoid being in the vicinity of 50 ohms. If not possible, add ground shielding using different layers. Do not add any ground layer under the antenna contact area. Do not add unvarnished layout traces on the first layer of the customer board, or unvarnished via holes under the module shield area or it will result in short circuit of those signals. This is mandatory. Free CAD software can be used to calculate the stack-up parameters to ensure a compliant 50 ohm RF track. 6.4. Mechanical Recommendations Do not apply mechanical pressure on the HILONC-3GPS shield. Doing so could damage the mechanical structure of the shield and lead to internal short-circuits or other issues. Avoid having metallic parts in the vicinity of the antenna area. Keep FPCs and battery contact (if any) away from antenna area. FPC's (if any) have to be shielded. 6.5. Other Recommendation - production/design test Sagemcom guarantees RF performance in conductive mode but strongly recommends carrying out RF measurements in an anechoic chamber in radiated mode (test conditions for FTA): radiated performance relies heavily on radio integration (layout, antenna, matching circuit, ground area….) 7. Audio Integration The HILONC-3GPS module provides only a digital PCM interface for audio. A PCM codec must be put in customer’s board if analog audio is required. The audio specifications which describe the audio tests are 3GPP TS 26.131 & 3GPP TS 26.132. 7.1. Mechanical integration and acoustics Particular care of Handset Mode: To achieve a more ideal audio output design (speaker part): The speaker must be completely sealed on the front side. The front aperture must in compliance with specifications of the speaker supplier. The back volume must be completely sealed. Note d’étude / Technical document : 01/08/20111 - Page 27 / 41 URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION NOTE The sealed back volume must be in compliance with specifications of the speaker supplier. Pay attention to the design of the speaker gasket (elastomer). Make sure to leave sufficient space for the artificial ear gasket. To achieve a more ideal audio input design (microphone part) : Pay attention to the design of the microphone (elastomer). All receivers must be completely sealed on the front side. Microphone sensitivity depends on the shape of the device but should be in the region of –40 ±3 dBV/Pa. Encourage the use of a pre-amplified microphone. If needed, use a pre-amplification stage. As audio input and output are strongly linked: Place the microphone and the speaker as far away as possible from one another. 7.2. Electronics and layout Avoiding Distortion & Burst Noise Audio signals must be symmetric (same components on each path). Differential signals must be routed in parallel. Audio layer must be surrounded by 2 ground layers. The link from one component to the ground must be as short as possible. If possible separate the PCBs of the microphone and speaker. Reduce the number of electronic components as much as possible (to avoid loss of quality and greater dispersion). Audio tracks must be larger than 0.5 mm. 8. Recommendations on customer board layout 8.1. General recommendations on layout There are many different types of signals in the module which may interfere with each other. Particularly, audio signals are very sensitive to external signals such as VBAT. Therefore it is very important to follow some basic guidelines to avoid signal disruption or abnormal behavior. Magnetic fields generated by VBAT tracks may cause speaker interference and burst noise. In this case, modify layout of the VBAT tracks to reduce the phenomenon. 8.1.1. Ground Ensure the ground plane is as complete as possible. Grounding of components should be connected to the ground layer through a number of irregularly distributed vias. Top and bottom layer should set aside as much space for the ground plane as possible. Flood remaining empty surfaces of the layout of those two layers with a ground plane connected to the main ground through as many vias as possible. 8.1.2. Ground layout guidelines Proper grounding is crucial to end-product performance. At least one layer must be a dedicated ground plane. This ground plane is the common point referenced by all end-product circuits. In addition to the dedicated ground plane layer, unused space on all PCB layers should be filled with grounding to provide the most robust grounding possible from layer to layer. Bypass capacitors should be connected directly to their surface layer ground fill. Multiple vias should connect Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 28 / 41 each capacitor directly to the main ground plane, with one via in the capacitor’s pad plus several vias within the surface layer ground fill area. 8.1.3. Digital ground Digital ground should connect directly to the main ground plane. In addition, each layer between layer 1 and the main ground should include ground fills directly below the center grid area’s digital pins, with each stack of vias connecting to each ground fill area. The large mass of copper tied together using this technique provides optimal electrical grounding and thermal conductivity. 8.1.4. Analog/RF ground The analog/RF ground pins are connected to each other, but isolated from the digital ground (until main ground). Like the digital pins, the analog/RF pins should connect directly to the main ground plane. In addition, each layer between layer 1 and the main ground should include ground fills directly below the outer layer’s analog/RF pins, with each stack of vias connecting to each ground fill area. The large mass of copper tied together using this technique provides optimal electrical grounding and thermal conductivity. 8.1.5. Power supply A layer for power supply signals (VBAT, VGPIO) is recommended. Looping of power signal layouts must be avoided in device design. Ensure suitable power supply (VBAT, VGPIO) track width and thickness. 8.1.6. Clocks Clock signals must be shielded between two ground layers and bordered with ground vias. 8.1.7. Data bus and other signals Data bus and commands have to be routed on the same layer. Lines of the bus should not be parallel to other lines. Line crossings should be perpendicular. Other signals should have suitable track width and thickness. Data bus must be protected by upper and lower ground planes 8.1.8. Radio Provide a 50 Ohm micro strip line for antenna connection. 8.1.9. Shielding The following shielding comments are provided for designer consideration: At the very least the following devices and circuits should be shielded: · High-speed memory · RF front-end components · Crystal circuits · DC/DC circuits · RF circuitry Recommended shield partitioning: · For RF matching components do not locate matching inductors too close to shield walls (this may cause electromagnetic coupling and inductor de-Q). · Memory devices must be shielded. · Crystal circuits (other than reference circuits for RF frequency synthesizers) must be very close to their Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 29 / 41 corresponding pins. · Metalized plastic is not as effective as metal cans. · Shielded inductors might be needed on the DC/DC circuits, or they might need to be placed in their own shield area. 8.2. Example of a customer board layout The following figure is an example of layer allocation for a 6-layer circuit (for reference purposes only): Depending on the customer’s design the layout could also be done using 4 layers. : 6 layer PCB stack 9. Moisture sensitivity level precautions According to IPC/JEDEC J-STD 20, the HiLoNC 3GPS has the following MSL level: 3 Customer modules are shipped under a Dry package with all the MSL information labelled. Level Floor Life Soak requirements Standard Accelerated Equivalent Time (hours) Conditions Time (hours) Conditions 192 +5/-0 30°C / 60% RH 40 +1/-0 60°C / 60%RH Time Conditions 168 <= 30°C/60% RH hours It means that the customer’s factory must process and solder the HiLoNC 3GPS on the customer’s board up to 168 hours (7 days) after the HiLoNC 3GPS sealed package have been opened. This duration is given for factory floor conditions of T°<30°C, HR 60%. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 30 / 41 If this maximum 7 days duration can not be fulfilled, the HiLoNC 3GPS part must be baked again. Unless the factory floor conditions are perfectly controlled, SAGEMCOM does not recommend to wait until this maximum 7 days duration before soldering the HiLoNC 3GPS on customer’s board. For any module exposed to ambient moisture it is therefore highly recommended to proceed to a baking according to the JEDEC (125°C during 24H) to dry the module before any soldering process 10 CUSTOMER PROCESS 10.1 PACKAGE The HILONC-3GPS module is delivered in Tape and Reel package which is hermetically sealed to prevent from moisture and ESD. The characteristics of the T&R are given in the drawing below. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 31 / 41 10.2 Stencil Below are given soldering characteristics to report the HILONC-3GPS on the customer’s board. 10.2.1 Fotprint Notes: all dimensions are in millimeter. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 32 / 41 10.2.2 Recommended Stencil design Stencil design advise thickness : 0.08mm ~ 0.13mm. Solder paste advise thickness : 0.10mm ~ 0.18mm 10.3 Solder Paste SAGEMCOM recommends Use of "No Clean" ASAHI soldering paste is strongly recommended, as it does not require cleaning after the soldering process has taken place. The paste listed in the example below meets these criteria. Solder paste: ACS-SN100C-MA1-S4 (Asahi Chemical (S) Pte Ltd.) Alloy composition: Sn-0.7Cu-0.05Ni+Ge (99.2% Tin / 0.7 % Copper / 0.05% Nickel / Germanium) Melting temperature: solidus 227°C / Peak 250°C / liquidus 227°C 10.4 Profile for Reflow soldering A convection type soldering oven is recommended. Typical usable profile is shown on the next figure. The final profile has to be tuned depending on other elements like solder paste, customer’s board, other components… Peak temperature: 235~250 Degree C. Reflow zone (Above 220 Degree C): 30~70 sec. Preheat zone (140~190 Degree C.): 60~120 sec. Average ramp up rate : 2~4°C/second Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 33 / 41 10.5 SMT Machine 10.5.1 Nozzles SAGEMCOM recommends using SMT machine with nozzle diameters up to 10 mm in order to always have best prehension of the HILONC-3GPS module. SAGEMCOM recommends using the following references of nozzles: For the Panasonic, the nozzle 1005 10.5.2 Fiducials There is no fiducials design on the bottom side of the HILONC-3GPS. 10.6 Underfill The HILONC-3GPS’s shield did not be designed accordingly to allow this underfill process. 10.7 Second reflow soldering Even if SAGEMCOM recommends a single reflow soldering, a second reflow soldering can be conceivable. Positive tests have been performed with HILONC-3GPS on the bottom side. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 34 / 41 10.8 Hand soldering Hand soldering is impossible for HILONC-3GPS. 10.9 Unsoldering Manual unsoldering is possible, for repair purpose for example. A special care must be considered in order to avoid overheating the HILONC-3GPS. For repairing: Usage of hot plate like example below can be considered with additional metallic cubic plate whose dimensions are HILONC-3GPS's ones (to heat only HILONC-3GPS surface) Customer must remember to not have components on the HILONC-3GPS opposite side of the customer’s board. 11. Labelling The HILONC-3GPS module is labeled with its own FCC ID (XXXHILONC-3GPS) on the shield side. When the module is installed inside customer’s product, the FCC ID label on the module will not be visible. To avoid this scenario an exterior label must be stuck on the surface of the customer’s product to indicate the FCC ID of the enclosed module. The label can use the following wording: “Contains transmitter module FCC ID: XXXHILONC3GPS” or “Contains FCC ID: XXXHILONC-3GPS”. 12. CE/FCC/IC warning statement Europe – EU Declaration of Conformity This device complies with the essential requirements of the R&TTE Directive 1999/5/EC. The following test methods have been applied in order to prove presumption of conformity with the essential requirements of the R&TTE Directive 1999/5/EC: EN 60950-1: 2006+A11:2009:+A1:2010+A12:2011 Safety of Information Technology Equipment EN 301 908-2 V5.2.1 EN 62311: 2008 Assessment of electronic and electrical equipment related to human exposure restrictions for electromagnetic fields (0 Hz-300 GHz) (IEC 62311:2007 (Modified)) EN 301 908-1 V4.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS), Repeaters and User Equipment (UE) for IMT-2000 Third-Generation cellular networks; Part 1: Harmonized EN for IMT-2000, introduction and common requirements, covering essential requirements of article 3.2 of the R&TTE Directive EN 301 511 V9.0.2: 2003 Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 35 / 41 - Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC) EN 301 489-1 V1.8.1: 2008 Electromagnetic compatibility and Radio Spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common technical requirements EN 301 489-7 V1.3.1: 2005 ElectroMagnetic compatibility and Radio spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment ad services; Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS) EN 301 489-24 V1.5.1: 2010 Electromagnetic compatibility and Radio Spectrum Matters (ERM); ElectroMagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment EN 301 489-3 V1.4.1 0682 Česky [Czech] [Jméno výrobce] tímto prohlašuje, že tento [typ zařízení] je ve shodě se základními požadavky a dalšími příslušnými ustanoveními směrnice 1999/5/ES. Dansk [Danish] Deutsch [German] Undertegnede [fabrikantens navn] erklærer herved, at følgende udstyr [udstyrets typebetegnelse] overholder de væsentlige krav og øvrige relevante krav i direktiv 1999/5/EF. Hiermit erklärt [Name des Herstellers], dass sich das Gerät [Gerätetyp] in Übereinstimmung mit den grundlegenden Anforderungen und den übrigen einschlägigen Bestimmungen der Richtlinie 1999/5/EG befindet. Käesolevaga kinnitab [tootja nimi = name of manufacturer] seadme [seadme tüüp = type of equipment] vastavust direktiivi 1999/5/EÜ põhinõuetele ja nimetatud direktiivist tulenevatele teistele asjakohastele sätetele. Hereby, [name of manufacturer], declares that this [type of equipment] is in compliance with the essential requirements and other relevant provisions of Directive 1999/5/EC. Por medio de la presente [nombre del fabricante] declara que el [clase de equipo] cumple con los requisitos esenciales y cualesquiera otras disposiciones aplicables o exigibles de la Directiva 1999/5/CE. ΜΕ ΗΝ ΠΑΡΟΣΑ[name of manufacturer] ΔΗΛΩΝΕΙ ΟΙ [type of equipment] ΣΜΜΟΡΦΩΝΕΑΙΠΡΟΙΟΣΙΩΔΕΙΑΠΑΙΗΕΙΚΑΙ ΙΛΟΙΠΕΤΕΙΚΕ ΔΙΑΑΞΕΙΗΟΔΗΓΙΑ1999/5/ΕΚ. Eesti [Estonian] English Español [Spanish] Ελληνική [Greek] Français [French] Italiano [Italian] Latviski [Latvian] Lietuvių [Lithuanian] Nederlands [Dutch] Malti [Maltese] Magyar [Hungarian] Par la présente [nom du fabricant] déclare que l'appareil [type d'appareil] est conforme aux exigences essentielles et aux autres dispositions pertinentes de la directive 1999/5/CE. Con la presente [nome del costruttore] dichiara che questo [tipo di apparecchio] è conforme ai requisiti essenziali ed alle altre disposizioni pertinenti stabilite dalla direttiva 1999/5/CE. Ar šo [name of manufacturer / izgatavotāja nosaukums] deklarē, ka [type of equipment / iekārtas tips] atbilst Direktīvas 1999/5/EK būtiskajām prasībām un citiem ar to saistītajiem noteikumiem. Šiuo [manufacturer name] deklaruoja, kad šis [equipment type] atitinka esminius reikalavimus ir kitas 1999/5/EB Direktyvos nuostatas. Hierbij verklaart [naam van de fabrikant] dat het toestel [type van toestel] in overeenstemming is met de essentiële eisen en de andere relevante bepalingen van richtlijn 1999/5/EG. Hawnhekk, [isem tal-manifattur], jiddikjara li dan [il-mudel tal-prodott] jikkonforma mal-ħtiġijiet essenzjali u ma provvedimenti oħrajn relevanti li hemm fid-Dirrettiva 1999/5/EC. Alulírott, [gyártó neve] nyilatkozom, hogy a [... típus] megfelel a vonatkozó alapvetõ követelményeknek és az 1999/5/EC irányelv egyéb elõírásainak. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 36 / 41 Polski [Polish] Português [Portuguese] Slovensko [Slovenian] Slovensky [Slovak] Suomi [Finnish] Svenska [Swedish] Niniejszym [nazwa producenta] oświadcza, że [nazwa wyrobu] jest zgodny z zasadniczymi wymogami oraz pozostałymi stosownymi postanowieniami Dyrektywy 1999/5/EC. [Nome do fabricante] declara que este [tipo de equipamento] está conforme com os requisitos essenciais e outras disposições da Directiva 1999/5/CE. [Ime proizvajalca] izjavlja, da je ta [tip opreme] v skladu z bistvenimi zahtevami in ostalimi relevantnimi določili direktive 1999/5/ES. [Meno výrobcu] týmto vyhlasuje, že [typ zariadenia] spĺňa základné požiadavky a všetky príslušné ustanovenia Smernice 1999/5/ES. [Valmistaja = manufacturer] vakuuttaa täten että [type of equipment = laitteen tyyppimerkintä] tyyppinen laite on direktiivin 1999/5/EY oleellisten vaatimusten ja sitä koskevien direktiivin muiden ehtojen mukainen. Härmed intygar [företag] att denna [utrustningstyp] står I överensstämmelse med de väsentliga egenskapskrav och övriga relevanta bestämmelser som framgår av direktiv 1999/5/EG. Federal Communication Commission Interference Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: - Reorient or relocate the receiving antenna. - Increase the separation between the equipment and receiver. - Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. -Consult the dealer or an experienced radio/TV technician for help. FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 37 / 41 Industry Canada statement: This device complies with RSS-210 of the Industry Canada Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Ce dispositif est conforme à la norme CNR-210 d'Industrie Canada applicable aux appareils radio exempts de licence. Son fonctionnement est sujet aux deux conditions suivantes: (1) le dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer un fonctionnement indésirable. Radiation Exposure Statement: This equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body. Declaration d'exposition aux radiations: Cet equipement est conforme aux limites d'exposition aux rayonnements IC etablies pour un environnement non controle. Cet equipement doit etre installe et utilise avec un minimum de 20 cm de distance entre la source de rayonnement et votre corps. This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed Cet appareil est conçu uniquement pour les intégrateurs OEM dans les conditions suivantes: (Pour utilisation de dispositif module) 1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les utilisateurs, et 2) Le module émetteur peut ne pas être coïmplanté avec un autre émetteur ou antenne. Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour toutes exigences de conformité supplémentaires requis pour ce module installé. IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC/Canada authorization is no longer considered valid and the FCC/IC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC/Canada authorization. NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est plus considéré comme valide et l'ID IC ne peut pas être utilisé sur le produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une autorisation distincte au Canada. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 38 / 41 End Product Labeling This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: VW3HILONC-3GPS” ”Contains IC: 9140A-HILONC-3GPS” The grantee's FCC ID/IC ID can be used only when all FCC/Canada compliance requirements are met. Plaque signalétique du produit final Ce module émetteur est autorisé uniquement pour une utilisation dans un dispositif où l'antenne peut être installée de telle sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le produit final doit être étiqueté dans un endroit visible avec l'inscription suivante: "Contient des IC: 9140AHILONC-3GPS". Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Manuel d'information à l'utilisateur final L'intégrateur OEM doit être conscient de ne pas fournir des informations à l'utilisateur final quant à la façon d'installer ou de supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module. Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme indiqué dans ce manuel. This device has been designed to operate with a dipole antenna have a maximum gain of [0.6] dB. Antenna having a higher gain is strictly prohibited per regulations of Industry Canada. The required antenna impedance is 50 ohms. Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. This radio transmitter (IC: 9140A-HILONC-3GPS / Model: HiLoNC-3GPS ) has been approved by Industry Canada to operate with the antenna type, maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this user’s manual, having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device. Ce dispositif a été conçu pour fonctionner avec une antenne ayant un gain maximal de dipole antenne avec dB [0.6]. Une antenne à gain plus élevé est strictement interdite par les règlements d'Industrie Canada. L'impédance d'antenne requise est de 50 ohms. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 39 / 41 Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peutfonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pourl'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectriqueà l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que lapuissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire àl'établissement d'une communication satisfaisante. Le présent émetteur radio (IC: 9140A-HILONC-3GPS / Modèle: HiLoNC-3GPS ) a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés ci-dessous et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur. Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 40 / 41 Declaration of Conformity We, Sagemcom SAS Address: 250 Route de l'Empereur, 92848 Rueil Malmaison Cedex France Declare under our own responsibility that the product: Model: HiLoNC-3GPS Intended use: Qual-Band GSM/GPRS/EDGE and Dual-Band WCDMA/HSDPA/HSUPA/HSPA+ Voice and Data Module Complies with the essential requirements of Article 3 of the R&TTE 1999/5/EC Directive, if used for its intended use and that the following standards have been applied: 1. Health (Article 3.1(a) of the R&TTE Directive) Applied Standard(s): EN62311 :2008 2. Safety (Article 3.1(a) of the R&TTE Directive) Applied Standard(s): EN 60950-1:2006+A11:2009+A1:2010+A12:2011 3. Electromagnetic compatibility (Article 3.1 (b) of the R&TTE Directive) Applied Standard(s): EN 301 489-1 V1.8.1/-3 V1.4.1/-7V1.3.1/-24V1.5.1 4. Radio frequency spectrum usage (Article 3.2 of the R&TTE Directive) Applied Standard(s): EN 300 440-1V1.6.1/EN 300 440-2 V1.4.1 EN 301 908-2 V5.2.1/EN 301 908-1V4.2.1 EN301 511 V 9.0.2 Note d’étude / Technical document : URD1– OTL 5696.1– 022 / 72740 Edition 0.4 HILONC- 3GPS APPLICATION 01/08/20111 - PageNOTE 41 / 41
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