SOLiD 700P800P Multiple-Enclosure Booster System User Manual PS Manual SC MRU700PS800PS AC

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SC‐DAS
Installation and Operation Manual
Document Reference:
Version:
V5.0
Document Status:
Release 5
Issue Date:
Feb. 13, 2013
Author:
Kyung Eun Han
Department:
R&D Division Team 3
Authorizing Manager:
Young shin Yeo
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REVISION HISTORY
No. of
Pages
Version
Issue Date
Initials
Details of Revision Changes
V 1.0
April. 11, 2011
V 2.0
Dec. 08,2011
Add Sprint band
V 3.0
Jan. 06,2012
Add Sprint band
V 4.0
Jan. 07,2013
Add VzW (MRU MIMO) band
V 5.0
Feb. 13,2013
Add PS (MRU) band
Original
Technical Support
SOLiD serial numbers must be available to authorize technical support and/or to establish a return
authorization for defective units. The serial numbers are located on the back of the unit, as well as on
the box in which they were delivered. Additional support information may be obtained by accessing
the SOLiD, Inc. website at www.solid.co.kr or send email at sjkim@solid.co.kr
This manual is produced by Global Business Division Business Team 1. Printed in Korea.
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Contents
Section1
Safety & Certification Notice....................................................................... 12
Section2
System Overview ....................................................................................... 15
2.1
General overview ............................................................................................ 16
2.2 System overview............................................................................................. 18
Section3
3.1
System Specifications ................................................................................ 21
System specifications ...................................................................................... 22
3.1.1
Physical Specifications .............................................................................. 22
3.1.2
Optical wavelength and Laser power......................................................... 23
3.1.3
Environmental specifications .................................................................... 23
3.1.4
Available Frequency Bands ........................................................................ 23
3.1.5
Band Specifications ................................................................................... 24
Section4
System Configuration and Functions ........................................................... 25
4.1 BIU (BTS Interface Unit) .................................................................................. 26
4.1.1 BIU Specifications .................................................................................................... 26
4.1.2 BIU block diagram ................................................................................................... 27
4.1.3 BIU assemblies ........................................................................................................ 27
4.1.4 Sub Assembly Description ........................................................................................ 28
4.1.5 BIU front/rear panel overview .................................................................................. 32
4.2 ODU (Optic distribution Unit) .......................................................................... 35
4.2.1 ODU specifications................................................................................................... 35
4.2.2 ODU block diagram ................................................................................................. 36
4.2.3 ODU assemblies ....................................................................................................... 36
4.2.4
Sub Assembly description ......................................................................... 37
4.2.5 ODU front/rear panel overview ................................................................................ 38
4.2.6ODU Interface with BIU ............................................................................................ 40
4.3 OEU (Optic Expansion Unit) ............................................................................. 42
4.3.1 Specifications of OEU ............................................................................................... 42
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4.3.2
OEU block diagram ................................................................................... 43
4.3.3 OEU assemblies ....................................................................................................... 43
4.3.4Sub Assembly description ........................................................................................ 44
4.3.5
OEU front/rear panel overview.................................................................. 47
4.4 ROU (Remote Optic Unit) ................................................................................ 48
4.4.1
ROU specifications .................................................................................... 49
4.4.2
ROU block diagram ................................................................................... 50
4.4.2.1
Combination of MRU 1900PCS+850C/ARU 700LTE+AWS‐1 ........................... 50
4.4.2.2
Combination of MRU 1900PCS/ARU 900I+800I ........................................... 50
4.4.2.3
Combination of MRU 700LTE+AWS‐1.......................................................... 51
4.4.2.4 Combination of MRU 700PS+800PS ........................................................... 51
4.4.2.5
Combination of MRU 1900PCS+850C/ARU 700LTE+AWS‐1 ........................... 52
4.4.2.6 Combination of MRU 1900PCS/ARU 900I+800I ........................................... 53
4.4.2.7
Combination of MRU 700LTE+AWS‐1.......................................................... 54
4.4.3
Sub Assembly description ......................................................................... 56
4.4.4
Bottom of ROU ......................................................................................... 58
4.4.5
Top of ROU ............................................................................................... 60
4.4.5.1
Combination of MRU1900PCS+850C/ARU700LTE+AWS‐1 ............................ 60
4.4.5.2
Combination of MRU1900PCS/ARU900I+800I ............................................. 60
4.4.5.3
Combination of MRU700LTE+AWS‐1 .......................................................... 61
4.4.5.4 Combination of MRU700PS+800PS ............................................................ 61
Section5
5.1
System Installation & Operation ................................................................. 62
BIU Installation ............................................................................................... 63
5.1.1 BIU Shelf Installation ....................................................................................... 63
5.1.2 BIU Power Cabling .......................................................................................... 64
5.1.3 BIU/RF interface .............................................................................................. 66
5.1.4 MDBU installation ........................................................................................... 69
5.1.5 ODU Interface ................................................................................................. 70
5.1.6 BIU power consumption .................................................................................. 72
5.2 ODU Installation .............................................................................................. 73
5.2.1 ODU Shelf Installation ..................................................................................... 73
5.2.2 ODU Power Cabling ......................................................................................... 73
5.2.3 ODU Optic Cabling .......................................................................................... 73
5.2.4 DOU installation .............................................................................................. 74
5.2.5 ODU Power consumption ................................................................................ 75
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5.3 ROU Installation .............................................................................................. 76
5.3.1 ROU Enclosure installation .............................................................................. 76
5.3.2 ROU Power Cabling ......................................................................................... 83
5.3.3 Optical Cabling ................................................................................................ 84
5.3.4 GND Terminal Connection ............................................................................... 84
5.3.5 Coaxial cable and Antenna Connection ............................................................ 85
5.3.6 LED explanation on ROU ................................................................................. 86
5.3.7 ROU Power consumption ................................................................................ 86
5.3.8 Cable connection between MRU and ARU ........................................................ 87
5.4 OEU Installation .............................................................................................. 88
5.4.1 OEU chassis installation ................................................................................... 88
5.4.2 OEU Power Cabling ......................................................................................... 88
5.4.3 OEU Optic Cabling ........................................................................................... 89
5.4.4 DOU installation with an OEU .......................................................................... 90
5.4.5 OEU Power Consumption ................................................................................ 91
Section6
Operation .................................................................................................. 92
6.1 BIU Overview .................................................................................................. 93
6.1.1 BIU ................................................................................................................. 93
6.1.2 BIU TX parameters .......................................................................................... 93
6.1.3 BIU RX parameters .......................................................................................... 98
6.1.4 BIU Logic Sequence Diagram ........................................................................... 99
6.1.5 Interaction with the BIU ................................................................................ 101
6.2 ROU Overview .............................................................................................. 102
6.2.1 ROU Operation.............................................................................................. 102
6.3 OEU Operation .............................................................................................. 109
6.3.1 OEU Operation .............................................................................................. 109
Section7
7.1
Additive functions .................................................................................... 113
Shutdown function (TX output shutdown) .................................................... 114
7.2 Total Power Limit function (TX Output ALC) .................................................. 114
7.3 Automatic Output power setting function (TX Output AGC)........................... 115
7.4 Input power AGC function (TX Input AGC) ..................................................... 115
7.5 Input power limit function (TX Input ALC) ..................................................... 116
7.6 Optical loss compensation............................................................................. 116
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Figures
Figure 1.1 – Basic system topology supporting SISO configuration ...................... 18
Figure 2.2 – Basic system topology supporting MIMO configuration .................. 18
Figure 2.3 – Expansion system topology supporting SISO configuration ............. 20
Figure 2.4 – Expansion system topology supporting MIMO configuration .......... 20
Figure 4.1 – BIU front and side views ................................................................. 26
Figure 4.2 – BIU block diagram ......................................................................... 27
Figure 4.3 – BIU mounting diagram ................................................................... 27
Figure 4.4 – MDBU at a glance .......................................................................... 29
Figure 4.5 – MCDU at a glance .......................................................................... 30
Figure 4.6 – MCPU at a glance .......................................................................... 31
Figure 4.7 – MPSU at a glance ........................................................................... 32
Figure 4.8 – BIU front panel view ...................................................................... 32
Figure 4.9 – Rear panel view ............................................................................. 34
Figure 4.10 – ODU at a glance ........................................................................... 35
Figure 4.11 – ODU block diagram ....................................................................... 36
Figure 4.12 – ODU Internal View ........................................................................ 37
Figure 4.13 – DOU
at a glance ......................................................................... 38
Figure 4.14 – 2Way Divider at a glance ............................................................... 38
Figure 4.15 – ODU front panel view ................................................................... 39
Figure 4.16 – ODU Rear panel view ................................................................... 39
Figure 4.17 BIU/ODU interface .......................................................................... 40
Figure 4.18 – BIU/ODU Interface rear view ........................................................ 40
Figure 4.19 – BIU/ODU interface details ............................................................. 41
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Figure 4.20 – OEU at a glance ........................................................................... 42
Figure 4.21 – OEU block diagram ....................................................................... 43
Figure 4.22 – OEU internal view ........................................................................ 43
Figure 4.23 – DOU at a glance ........................................................................... 44
Figure 4.24 – EWDM at a glance ........................................................................ 45
Figure 4.25 – ECPU at a glance .......................................................................... 45
Figure 4.26 – ERFM at a glance ......................................................................... 46
Figure 4.27 – EPSU at a glance .......................................................................... 46
Figure 4.28 – OEU front panel view ................................................................... 47
Figure 4.29 – Rear panel view ........................................................................... 47
Figure 4.30 – ROU at a glance ........................................................................... 48
Figure 4.31 – ROU block diagram for MRU 1900PCS+850C and ARU 700LTE+AWS‐1
................................................................................................................ 50
Figure 4.32 – ROU block diagram for MRU 1900PCS and ARU 900I+800I ............ 50
Figure 4.33 – ROU block diagram for MRU 700LTE+AWS‐1 ................................. 51
Figure 4.34 – ROU block diagram for MRU 700PS+800PS .................................. 51
Figure 4.35 – ROU internal view for MRU1900PCS+850C and ARU 700LTE+AWS‐1
................................................................................................................ 52
Figure 4.36– ROU internal view for MRU 1900PCS and ARU 900I+800I .............. 53
Figure 4.37 – ROU internal view for MRU 700LTE+AWS‐1 ................................... 54
Figure 4.38 – ROU internal view for 700PS+800PS............................................. 54
Figure 4.39 – PSU at a glance ............................................................................ 57
Figure 4.40 – ROU Bottom view........................................................................ 58
Figure 4.41 – ROU Power Port View .................................................................. 59
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Figure 4.42 – ROU Top View for MRU 1900P+850C and ARU 700LTE+AWS‐1 ....... 60
Figure 4.42 – ROU Top View for MRU 1900P and ARU 900I+800I ....................... 60
Figure 4.44 – ROU Top View for MRU700LTE+AWS‐1 ......................................... 61
Figure 4.45 – ROU Top View for MRU700PS+800PS ........................................... 61
Figure 5.1 – RACK Installation............................................................................ 63
Figure 5.2 – Power interface diagrm .................................................................. 64
Figure 5.3 – PSU LED indicator information ....................................................... 65
Figure 5.4 – BIU RF interface diagram ............................................................... 67
Figure 5.5 – BTS /BIU connections ..................................................................... 68
Figure 5.6 –BDA Interface using Circulator ........................................................ 68
Figure 5.7 –BDA Interface using Duplexer ......................................................... 69
Figure 5.8 –MDBU LED indicator information .................................................. 70
Figure 5.9 –Interface port between BIU and ODU.............................................. 71
Figure 5.10 –Cabling interface diagram between BIU and ODU ........................... 72
Figure 5.11 –SC/APC fiber termination ................................................................ 74
Figure 5.12 – ODU rear view with DOUs inserted ................................................ 74
Figure 5.13 – Wall mount dimensions for the ROU.............................................. 76
Figure 5.14 – ROU installation procedure side by side ........................................ 77
Figure 5.15 – ROU installation diagram side by side ............................................ 78
Figure 5.16 – ROU installation procedure for stacked mounting ......................... 78
Figure 5.17 – ROU installation diagram for stacked mounting ............................. 79
Figure 5.18 – ROU installation procedure for vertical rack .................................. 80
Figure 5.19 – ROU installation diagram for vertical rack...................................... 81
Figure 5.20 – ROU installation procedure for horizontal rack ............................. 82
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Figure 5.21 – ROU installation diagram for horizontal rack ................................. 82
Figure 5.22 – ROU Power Port view ................................................................... 83
Figure 5.23 – ROU optical Port view .................................................................. 84
Figure 5.24 – ROU GND Port view ..................................................................... 85
Figure 5.25 – ROU LED indicator information ..................................................... 86
Figure 5.26 – OEU Power interface diagram ...................................................... 89
Figure 5.27 – Optical cable with SC/ACP Type Connectors................................... 90
Figure 5.28 – OEU with DOUs inserted .............................................................. 90
Figure 6.1 – SC‐DAS Link budget for the BIU ...................................................... 93
Figure 6.2 –MDBU information assigned at theBIU ............................................ 95
Figure 6.3 –MDBU menu information at the BIU ................................................ 95
Figure 6.4 –MDBU name assignment at theBIU ................................................. 97
Figure 6.5 –MDBU name assignment at the tree ................................................ 97
Figure 6.6 –MDBU Module Failure information at the BIU ................................. 98
Figure 6.7 –Configuration of BIU‐ODU‐ROU for basic topology .......................... 99
Figure 6.8 –Configuration of BIU‐ODU‐ROU for expansion topology ................ 100
Figure 6.9 –DOU assignment at the BIU .......................................................... 101
Figure 6.10 –ODU Menu information ............................................................... 101
Figure 6.11 –SC‐DAS Link budget for ROU ........................................................ 102
Figure 6.12 –Optical information at the ROU.................................................... 105
Figure 6.13 –ROU information assignment ...................................................... 106
Figure 6.14 –ROU Menu information ............................................................... 106
Figure 6.15 –ROU Softkey information ............................................................ 108
Figure 6.16 –SC‐DAS Link Budget for OEU ....................................................... 109
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Figure 6.17 –OEU Optical information .............................................................. 111
Figure 7.1 –Shutdown logic diagram ................................................................ 114
Figure 7.2 –Optical loss information ................................................................ 117
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Section1
Safety & Certification Notice
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“Only qualified personnel are allowed to handle this unit. Read and obey all the warning
labels attached in this user manual”
Any personnel involved in installation, operation or service of the SOLiD Technology repeaters
must understand and obey the following:
‐ Obey all general and regional installation and safety regulations relating to work on high voltage
installations, as well as regulations covering correct use of tools and personal protective
equipment.
‐ The power supply unit in repeaters contains dangerous voltage levels which can cause electric
shock. Switch the mains off prior to any work in such a repeater. Any local regulations are to be
followed when servicing repeaters.
‐ The repeater cover (door) should be securely fastened in open position(with a cord), during
outdoor work in order to prevent door from slamming due to wind (which could cause bodily
harm or damage).
‐ Use this unit only for the purpose specified by the manufacturer. Do not carry out any modifications
or replace any parts which are not sold or recommended by the manufacturer. This could cause
fire, electric shock or other injuries.
‐ Repeaters generate radio signals and thereby give rise to electromagnetic fields that may be
hazardous to any person in the immediate proximity of the repeater and the repeater antennas
for an extended period of time.
‐ Due to power dissipation, this repeater may reach a very high temperature. Do not operate this unit
on or close to flammable materials.
‐ Do not use any solvents, chemicals, or cleaning solutions containing alcohol, ammonia, or abrasives.
‐ Signal booster warning label message should include (Class B Industrial Booster)
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‐ Any DAS system or Fiber BDA will generate radio (RF) signals and continuously emit RF energy. Avoid
prolonged exposure to the antennas. SOLiD recommends maintaining a 34.0cm (13.4 inches)
minimum clearance from the antenna while the system is operating.
‐ Certification
 FCC: This equipment complies with the applicable sections of Title 47 CFR Parts 15,22,24 and
90

UL/CUL: This equipment complies with UL and CUL 1950‐1 Standard for safety for information
technology equipment,including electrical business equipment

FDA/CDRH: This equipment uses a Class 1 LASER according to FDA/CDRH Rules.This product
conforms to all applicable standards of 21 CFR Chapter 1, Subchaper J, Part 1040
‐For PLUGGABLE EQUIPMENT, the socket‐outlet shall be installed near the equipment and shall be
easily accessible.
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Section2
System Overview
2.1
General overview
2.2 System overview
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2.1
General overview
SC‐DAS platform is a coverage system for in‐building services delivering seamless, high quality voice
and data As a distributed antenna system, it provides analog and digital phone services in multiple
bands through one antenna.
The system covers public and private venues such as:

Shopping malls

Hotels

Campus areas

Airports

Clinics

Subways

Multi‐use stadiums, convention centers, etc.
The system enhances in‐building radio environments that lack signal quality by improving the RSSI
and Ec/Io. By providing communication services throughout the building, the system enables users to
make a calls anywhere in the coverage area.
The system uses both analog (AMPS) and digital (TDMA, CDMA and WCDMA) methods.
The SC‐DAS system supports communication standards and public interface protocols in worldwide
use.

Frequencies: VHF,UHF, 700MHz, 800MHz,850MHz 900MHz,1900MHz,2100MHz, etc.

Voice protocols: AMPS,TDMA, CDMA,GSM,IDEN, etc.

Data protocols: EDGE,GPRS,WCDMA,CDMA2000,Paging,LTE, etc.
SC‐DAS comprises frequency specific modules. Coverage for a specific frequency band is
accomplished by inserting a corresponding frequency module into each unit. Because it delivers
multiple signals with one strand of single mode fiber, the system, requires no additional hardware
modifications whenever a new frequency is added.
The system is featured with the following:



Flexibiltiy & Scalabiltiy

Supports fiber‐optic ports up to 32 or 60(using OEU)

Connects multiple‐buildings (campus) as one DAS
Modular structures

Modular frequency upgrade

Plug‐in type modules
Multi‐Band, Single operator

Supports multiple services from one WSP
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

Support multi‐operator in a band(Max. 2 operator)
Low OPEX / CAPEX

Compact design

Upgradable design

Easy installation and maintenance

Adopts auto ID scheme
The SC‐DAS platform will serve two primary segments; first as a carrier deployed coverage
enhancement product for their specific frequencies and second as a low cost, public safety / single
carrier product.
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2.2
System overview
SC‐DAS comprises the components listed below.
The base system consists of a BIU (BTS Interfcace Unit), an ODU (Optic distribution Unit) and a ROU
(Remote Optic Unit). For use with multiple ROU’s, it has OEU (Optic Expansion Unit).
The BIU has two layer which support both SISO and MIMO configuration using separate optical fiber
cable. Fig2.1 shows basic system topology for SISO
Figure 1.1 – Basic system topology supporting SISO configuration
Figure 2.2 – Basic system topology supporting MIMO configuration
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As shown at Fig.’s 2.1 and 2.2, one strand of fiber is needed for SISO configuration but two strands
are needed for MIMO cofiguration when connected with an ROU. Applications requiring up to
32ROU’s for SISO are possible with one BIU.
Each SISO ROU will require an additional strand of
fiber and an additional 32 ROU’s can be added to the same system for MIMO applications. MIMO
requires 2 strands of fiber per ROU as well as MIMO specific ODU’s.
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To reduce number of optical cables between multi‐building applications, we can utilize the
OEU(Optical Expansion Unit)
Fig 2.3 shows expansion system topology supporting SISO configuration using OEUs
Figure 2.3 – Expansion system topology supporting SISO configuration
Figure 2.4 – Expansion system topology supporting MIMO configuration
Fig 2.4 shows expansion system topology supporting MIMO configuration using OEU
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Section3
System Specifications
3.1
System specifications
3.1.1
Physical Specifications
3.1.2
Optic wavelength and Laser power
3.1.3
Environmental specifications
3.1.4
Available frequency bands
3.1.5
Band Specifications
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3.1
System specifications
3.1.1 Physical Specifications
Parameter
RF Connectors
External
Alarm
connector
(Dry contacts)
Serial
Interface
connector
Fiber connector
BIU
ODU
OEU
MRU
1 N‐type
4 SMA pairs(TX,RX)
2 SMA
per MDBU
‐
2SMA :optical
2SMA :RF
TB: 4pcs for output
‐
TB: 3pcs for input
1 USB(B) type
‐
ARU
2SMA :optical
2SMA :RF
‐
‐
‐
1 USB(B) type
1 USB(B) type
1 USB(B) type
1 SC/APC for ODU
‐
System status
System status
8pcs, SC/APC for
1 SC/APC for ODU
ROU
8 SC/APC for ROU
EWDM Status

Power status

ALM status
DOU1 Status
MCPU
Status Indicator
LD status

PD status
DOU1 Status
MDBU Status
LED Alarm and


Power status

TX Comm

RX Comm

ALM status
MPSU

Power status

DC ALM status

LD status

PD1/2/3/4

LD status
status

PD1/2/3/4
DOU2 Status

Power status

Power status
status

LD status

TX Comm

TX Comm
DOU2 Status

PD1/2/3/4

RX Comm

RX Comm
status

ALM status

ALM status

Opt status

LD status

PD1/2/3/4
System status
status

Power status

TX1 Comm

RX1 Comm

TX2 Comm

RX2 Comm

ALM status
Normal Range: 120VAC
AC Power
‐
50/60Hz
‐
Operating range
Same to left side
108~132VAC,50/60Hz
Normal range: ‐48
DC Power
VDC
Normal: ‐48 VDC
Be provided by BIU
Operating range:
Operating range:
Same to left side
‐40.8 ~ ‐57.6VDC
‐40.8 ~ ‐57.6VDC
SISO Mode : 162W
(Including SISO ODU
4EA)
MIMO Mode : 315W
consumption
(Including SISO ODU
4EA+MIMO
MRU1900P+850C:50W
28W
Power
ODU
(Including
DOU2EA)
40W
MRU 1900P:45W
ARU700LTE+AWS:40W
(Including DOU2EA)
MRU700LTE+AWS:50W
ARU900I+800I:44W
MRU700P+800P:50W
4EA)
Enclosure
482.6(19”)
Dimensions
221.5(5U) x 450
43.6(1U) x 450
Weight[Full Load]
26.2Kg
6Kg
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482.6(19”)
x 88.1(2U) x 450
9.6Kg
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300 x 200 x 258
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6.6Kg~7.1Kg
6.8Kg
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3.1.2 Optical wavelength and Laser power
Parameter
ODU
OEU
ROU
West optic
TX: 1310nm
TX: 1550nm,
RX: 1550nm
East optic
RX: 1310nm
TX: 1550nm
Optical Wavelength
RX: 1310nm
TX: 1310nm,
RX: 1550nm
1dBm±1dBm to ROU
Output power
1.5dBm±1dBm to ROU,OEU
7dBm±1dBm to ODU
7dBm±1dBm to ODU
Return loss
<45dB
<45dB
<45dB
3.1.3 Environmental specifications
Parameter
BIU, ODU, OEU
Operating Temperature
‐10
Operating Humidity, non condensing
‐
to +50°C
ROU/AOR
‐10 to +50°C
5% to 90%
3.1.4 Available Frequency Bands
Standard
Unit naming
Description
Frequency range
TX(MHz)
RX(MHz)
Status
iDEN
700PS
Iden
758 to 775
788 to 805
Completed
iDEN
800PS+I
Iden
851 to 869
806 to 824
Completed
Cellular
850C
Cellular
869 to 894
824 to 849
Completed
iDEN
900I
Iden
935 to 940
896 to 901
Completed
Paging
900 PA
Paging
929 to 930
896 to 902
In future
PCS
1900P
PCS
1930 to 1995
1850 to 1915
Completed
AWS‐1
AWS‐1
AWS‐1
2110 to 2155
1710 to 1755
Completed
VHF
VHF
Public safety
136 to 174
136 to 174
Completed
396 to 450
396 to 450
450 to 512
450 to 512
380 to 434
380 to 434
434 to 496
434 to 496
UHF
Public safety(Band1)
Completed
UHF
E‐UHF
Public safety(Band2)
Completed
698 to 716
LTE
700LTE
Long Term Evolution
728 to 757
Completed
777 to 787
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3.1.5 Band Specifications
SC‐DAS platform allows many band combinations as well as
different output power levels
within the band depending on the combination.
1) Output power level
Below table shows Output power level as a function of band combination
Band Combinations
MRU
ARU
700PS
700LTE
800PS/I
850C
900I
1900P
AWS
1900P+850C
700LTE+AWS
‐
24dBm
‐
24dBm
‐
28dBm
28dBm
1900P
900I+800I
‐
‐
26dBm
‐
26dBm
31dBm
‐
700LTE+AWS
‐
‐
28dBm
‐
‐
‐
‐
28dBm‐
700PS+800PS
‐
27dBm
‐
27dBm
‐
‐
‐
‐
1900P+AWS
‐
‐
‐
‐
‐
‐
30dBm
30dBm
21dBm
‐
30dBm
‐
1900P+850C
700PS+800PS
21dBm
On the loadmap
‐
21dBm
VHF
UHF
24dBm
24dBm
2) General Specifications
Parameter
Specifications
Remark
TX
25dB/step 1dB
ROU
RX
20dB/step 1dB
BIU
Gain Control range
TX input power
‐20dBm~+10dBm
Spurious Emission
< ‐13dBm
Optical Link AGC
>10dB
VSWR
1.8:1
Pass‐band Ripple
4dBp‐p
Max optical Loss
5dBo
Optical wavelength
1310nm/1550nm with WDM
RX output power
0dBm
RX input power
‐50dBm Max
Noise Figure
< 8dB
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Section4
System Configuration and Functions
4.1 BIU (BTS Interface Unit)
4.2 ODU (Optic distribution Unit)
4.3 OEU (Optic Expansion Unit
4.4 ROU (Remote Optic Unit)
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4.1
BIU (BTS Interface Unit)
The BIU receives signals from the BTS or BDA through coaxial cable and transmits to four
ODUs (Optic Distribution Unit).and The BIU separates RX signals received from ODUs
according to their frequency band.
Figure 4.1 – BIU front and side views
4.1.1 BIU Specifications
Item
Spec.
Remark
Size
482.6(19”) x 221.5(5U) x 450
mm
Weight
26 Kg
SISO Mode : 168 W(Including SISO ODU 4EA)
Power consumption
MIMO Mode : 315W(Including SISO ODU
Full Load
4EA+MIMO ODU 4EA)
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4.1.2 BIU block diagram
MCPU
SISO
SISO
MIMO
MIMO
SISO MCDU
MIMO MCDU
M th B
MPSU
Figure 4.2 – BIU block diagram
4.1.3 BIU assemblies
Figure 4.3 – BIU mounting diagram
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No.
Unit
Description
Remark
Main Drive BTS Unit
MDBU
Amplify & adjust downlink RF signal
Max 4EA
Amplify & adjust uplink RF signal
Main Com/Div Unit
MCDU
Combine 3EA downlink signal and divide 4EA signal to ODU
Combine 4EA uplink signal and divide 3EA signal to MDBU
Support VHF/UHF interface port
Main Central Processor Unit
MCPU
Control and monitoring system status
Control and monitoring with USB(B)
Allows access to upper‐level network through GSM or Ethernet
MPSU
Main Power Supply Unit
Input power: DC ‐48V, Output power: 9V, 6V
Mother Board
Provide signal interface and power for each unit
M/B
Provide four ports for dry contact output
Provide three ports for input
Provide two Aux ports for future usage
Shelf
19 inch, 5U
4.1.4 Sub Assembly Description
1) Main Drive BTS Unit (MDBU)
MDBU delivers TX signals from the BTS or BDA to related devices as well as delivers RX signals from
these devices to the BTS or BDA. This unit also monitors TX input level. Using the input AGC function,
it automatically adjusts input ATT according to input power. It also has an ATT to adjust RX gain. The
MDBU varies per frequency band to including the following:
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No
Unit naming
In/out RF Port
Description
TX
RX
1900P+850C
Dual Band
4 Port
4 Port
700LTE+AWS‐1
Dual Band
4 Port
4 Port
1900P
Single Band
2 Port
2 Port
900I+800I
Dual Band
4 Port
4 Port
700PS+800PS
Dual Band
4 Port
4 Port
1900P+AWS‐1
Dual Band
4 Port
4 Port
2 Port
2 Port
900I
On the loadmap
Dual Band
Figure 4.4 – MDBU at a glance
2) Main Com/Div Unit (MCDU)
MCDU combines TX signals that are delivered from MDBU per frequency band and delivers them to
four ODUs. It also combines RX signals from up to four ODUs and sends them to up to four
MDBUs.The unit has a port to interface with VHF&UHF signals. It has an ATT for input monitoring and
input control.
The unit has a reserved port for future usage such as LMU interface, additive MDBU interface ,etc,
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Figure 4.5 – MCDU at a glance
VHF+UHF
frequency band includes the following: for use in future
No
Unit naming
VHF+UHF
Description
Dual Band
In/out RF Port
TX
RX
1 Port
1 Port
3) Main Central Processor Unit (MCPU)
MCPU can inquire and control the state of the modules that are installed in the BIU.
This unit can inquire and control the state of up to four ODUs. Through communication, it also can
inquire and control ROUs that are connected.
In addition, the unit has USB(B) port for local monitoring so that it can inquire and control state of
devices through a PC. On the front panel, it has communication LED indicators to check
communication state with ROU. It also has ALM LED indicators to show whether a device is faulty.
For access to upper network, it has a port to insert an Ethernet port and GSM modem in it.
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Figure 4.6 – MCPU at a glance
In the Main Central Processor Unit, a lithium battery is installed for RTC (Real Time Control) function.
CAUTION
RISK OF EXPLOSION MAY OCCUR IF BATTERY IS REPLACED BY AN INCORRECT TYPE
DIPOSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS
[INSTRUCTION]
The equipment and accessories including inner lithium battery are to be disposed of safely after the
life span of them according to the national regulation. Do not attempt to replace the lithium battery
unless authorized by a qualified service personnel, to avoid any risk of explosion.
4) Main Power Supply Unit (MPSU)
The MPSU takes a ‐48V input and outputs +6V and +9V DC power.
On the front panel, this unit has an output test port and it also has DC ALM LED Indicator to show
faulty output.
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Figure 4.7 – MPSU at a glance
4.1.5 BIU front/rear panel overview
1) Front panel
Figure 4.8 – BIU front panel view
Item
1. Alarm LED & Reset
Description
Communication state with devices, alarm status of the system and reset
switch
USB port for communication and diagnosis of devices through PC/laptop
2. DEBUG (USB B)
This equipment isfor indoor use only and all the communication wirings are
limited to indoor use as well.
3. NMS(Ethernet port)
Ethernet port for upper network
The supporting network mode is UDP protocol
4. MDBU LED
LED to show whether MDBU is installed and is operating properly
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5. RF Monitor Port
20dB Coupling compared with TX Input Level
20dB Coupling compared with RX Output Level
6. Pwr Test Port & ALM
Output DC power test port and ALM LED to show abnormal state, if any
7. Power switch
Power ON/OFF switch
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2) Rear panel
10
MIMO SIDE
2 1
SISO SIDE
11
Figure 4.9 – Rear panel view
Item
Description
1. DC Input Port
Input terminal for DC ‐48V
2. External ALM Port
Input/output terminal for dry contact
3. GND Port
System ground terminal
4. AUX I/O Port
Reserved Port for future uses
5. MIMO ODU I/O Port
RF signal interface terminal for ODU
6. MIMO ODU signal Port
Power and signal interface terminal for ODU
7. MIMO BTS/BDA I/O Port
Input/output interface terminal of BTS/BDA
8. V/UHF I/O Port
RF signal interface terminal of VHF&UHF
9. SISO ODU I/O Port
RF signal interface terminal for ODU
10. SISO ODU signal Port
Power and signal interface terminal for ODU
11. SISO BTS/BDA I/O Port
Input/output interface terminal of BTS/BDA
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4.2 ODU (Optic distribution Unit)
ODU receives TX RF signals from upper BIU and converts them into optical signals. The optical
signals are sent to ROU through optical cables. This unit converts optical signals from ROU into RF
signals and sends the converted signals to BIU.
For each shelf of the ODU, up to two DOUs (Donor Optic Unit) can be installed in it.
One DOU is supported with four optical ports. Therefore, one ODU can be connected with eight
ROUs.
Up to four ODUs can be connected with BIU each SISO and MIMO path
450
400
482.6m
43.6mm
(1U)
(19”)
Figure 4.10 – ODU at a glance
4.2.1 ODU specifications
Item
Spec.
Remark
Size
482.6(19”) x 43.6(1U) x 450
mm
Weight
6 kg
Power consumption
27 W
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Full Load
SC‐DAS
4.2.2 ODU block diagram
Figure 4.11 – ODU block diagram
4.2.3 ODU assemblies
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Figure 4.12 – ODU Internal View
No.
Unit
Description
Remark
Donor Optic Unit
DOU
Converts TX RF signals into optical signals;
Converts RX optical signals into RF signals;
Max 2 ea.
Provides up to four optical ports per DOU
2Way Divider
2W
Divides TX RF signals into two;
Combines two RX RF signals into one
DU
Shelf
Accessories
Distribution Unit
Distributes power and signals to DOU
19” rack, 1RU
25PIN DSUB, Male to female 1pcs
RF Coaxial Cable Assembly 2pcs
4.2.4 Sub Assembly description
1) Donor Optic Unit (DOU)
The DOU performs the RF to optical conversion of TX signals as well as the optical to RF conversion
of RX signals.
Using an optical splitter, this unit divides optical signals from a Laser Diode into four and then
distributes them to each optical port. With a total of four Photo Diodes in RX, the DOU performs the
optical to RF conversion of signals received from each optical port. In addition, the unit is equipped
with an ATT to compensate for optical loss in the fiber or fiber connectors.
Since is uses a WDM, it uses only one strand of fiber for each ROU it connects to.
With internal FSK modem, it will allow operation from a remote site.
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Figure 4.13 – DOU
at a glance
2) 2Way Divider (2W)
The 2 way divider is equipped with two 2‐way splitters in a single housing and the splitters work for
TX/RX signals, respectively.
Designed in broadband type, the divider combines and splits signals from/to the BIU
Figure 4.14 – 2Way Divider at a glance
4.2.5 ODU front/rear panel overview
1) Front panel
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Figure 4.15 – ODU front panel view
Item
1,2
Description
LED indicator to check for faulty DOU module.
2) Rear panel
Figure 4.16 – ODU Rear panel view
Item
Description
1. Optic Port
SC/APC optical connector terminal; use one optical cable per ROU.
2. DC I/O Port
Terminal for power and state values
3. RX RF Port
RX RF signal interface terminal
4. TX RF Port
TX RF signal interface terminal
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