ST Microelectronics S R L SPBTLERF SPBTLE-RF Bluetooth Low Energy Module User Manual SPBT2632C1A AT
ST Microelectronics S.R.L. SPBTLE-RF Bluetooth Low Energy Module SPBT2632C1A AT
Datasheet
SPBTLE-RF Bluetooth® V4.1 Smart module Product preview Features Bluetooth Radio Bluetooth specification v4.1 compliant Master and slave Smart Bluetooth network processor module Embedded Bluetooth low energy protocol stack: GAP, GATT, SM, L2CAP, LL, RF-PHY Bluetooth low energy profiles provided separately Preliminary module picture 11.5 mm x 13.5 mm x 2.0 mm Operating temperature range: -40°C to 85°C Host Interface SPI, IRQ, and RESET Antenna on board CE, FCC, IC qualified BQE certified Jan 2015 - rev 0.1 This is preliminary information on a new product now in development or undergoing evaluation. subject to change without notice. www.st.com Details are www.st.com SPBTLE-RF 1 Description The SPBTLE-RF is an easy to use Bluetooth® module, compliant with Bluetooth® v4.1. The module provides a complete RF platform in a tiny form factor. The SPBTLE-RF enables wireless connectivity into electronic devices, not requiring any RF experience or expertise for integration into the final product. The SPBTLE-RF module, being a certified solution, optimizes the time to market of the final applications. The module has been designed for maximum performance in a minimal space. Optimized design allows the integration of a complete working Bluetooth® modem in the minimum possible size. Module interface is SPI serial interface. 2 Applications Watches Fitness, wellness and sports Consumer medical Security/proximity Remote control Home and industrial automation Assisted living Mobile phone peripherals PC peripherals Page |2 Rev 0.1 SPBTLE-RF 3 Block Diagram Figure 1. HW block diagram Battery or External Supply BLUETOOTH L.E.. 2014 Module INTERNAL 2.45 GHz RF antenna SUPPLY FILTER Bead Ferrite Host Controller interface RF BALUN + Filter SPI LINE BLUETOOTH BLUENRG 32.768 kHz Crystal 32 MHz clock Internal / Ext. 32.768 kHz clock External LPO (32.768 kHz) OPTIONAL PIN FUNCTION Rev 0.1 Page |3 SPBTLE-RF 4 Software Architecture Bluetooth Firmware implementation Figure 2. SPBTLE-RF Application Block Diagaram Page |4 Rev 0.1 SPBTLE-RF 5 Hardware Specifications General Conditions (VIN= 2.2V and 25°C) 5.1 Absolute Maximum Ratings Table 1. Absolute maximum rating Rating Storage temperature range Min -40 Typical Max +85 Unit °C Supply voltage, VIN I/O pin Voltage (VIO five-volt tolerant pin) RF saturation input power -0.3 + 3.9 Volts -0.3 + 3.9 Volts dBm 5.2 Recommended Operating Conditions Table 2. Recommended operating conditions Rating Operating Temperature Range Min -40 Typical Max 85 Unit °C Supply Voltage VIN Signals & I/O Pin Voltage (according Supply Voltage) RF Frequency 2.0 3.3 3.6 Volts 2.0 3.6 Volts 2402 2480 MHz 5.3 Pin assignement Figure 3. Pin connection Rev 0.1 Page |5 SPBTLE-RF Table 3. Pin Assignement Name Type Pin # Description ALT Function V max. Tolerant SPI Interface SPI_IRQ SPI IRQ(SLAVE has data for MASTER) Vin SPI_CLK SPI CLOCK (Max. 8 MHz) Vin SPI_MISO SPI MISO (MASTER in / SLAVE out) Vin SPI_MOSI SPI MOSI (MASTER out SLAVE in) Vin SPI_CS 10 SPI “Chip Select” (SPI slave select) Vin (2.0V + 3.6V max.) Power and Ground Vin Vin GND GND 11 Reset input (active low < 0.35 Vin) (2.0V + 3.6V max.). EXT_LPCLK Not connected / Optional pin function (2.0V + Vin max.). GPIO2 I/O Not connected ANA TEST 0 Not connected Reset BT_RESET LPO Page |6 Rev 0.1 Initial State SPBTLE-RF 6 Mechanical dimensions Figure 4. Mechanical dimensions Rev 0.1 Page |7 SPBTLE-RF Figure 5. Recommend land pattern top view Page |8 Rev 0.1 SPBTLE-RF 7 Hardware design SPBTLE-RF module supports SPI hardware interfaces. Notes All unused pins should be left floating; do not ground. All GND pins must be well grounded. The area around the module should be free of any ground planes, power planes, trace routings, or metal for 6 mm from the module antenna position, in all directions. Traces should not be routed underneath the module. 8 Reflow soldering The SPBTLE-RF is a high temperature strength surface mount Bluetooth® module supplied on a 11 pin, 4-layer PCB. The final assembly recommended reflow profiles are indicated here below. Soldering phase has to be executed with care: in order to avoid undesired melting phenomenon, particular attention has to be taken on the set up of the peak temperature. Here following some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations. Table 4. Soldering Profile feature PB-free assembly Average ramp up rate (TSMAX to Tp) 3°C/ sec max Preheat Temperature min (TS mn) 150 °C Temperature max (TS max) 200 °C Time (tS min to tS max) (tS) 60-100 sec Time maintained above: Temperature TL 217 °C Time tL 60-70 sec Peak temperature (TP) 240 + 0 °C Time within 5 °C of actual peak temperature (TP) 10-20 sec Ramp down rate 6 °C/sec Time from 25 °C to peak temperature 8 minutes max Rev 1.0 Page |9 SPBTLE-RF Figure 6. Soldering profiles 9 RoHS compliance ST Bluetooth modules comply with the ECOPACK2 level of RoHS compliance grade. 10 Ordering Information Table 5. Ordering information Order code Description Packing MOQ SPBTLE-RF Bluetooth® V4.0 Smart module Jedec tray 2’448 pcs P a g e | 10 Rev 0.1 SPBTLE-RF 11 Traceability Each module is univocally identified by serial number stored in a 2D data matrix laser marked on the bottom side of the module itself. The serial number has the following format: WW YY D FF NNN where WW = week YY = year D = product ID family FF = production panel coordinate identification NNN = progressive serial number. Each module bulk is identified by a bulk ID. BULK ID and module 2D data matrix are linked by a reciprocal traceability link. The module 2D data matrix traces the lot number of any raw material used. Rev 1.0 P a g e | 11 SPBTLE-RF 12 12.1 Regulatory compliance FCC certification This module has been tested and found to comply with the FCC part 15 rules. These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference may not occur in a particular installation. This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Modifications or changes to this equipment not expressly approved by STMicroelectronics may render void the user's authority to operate this equipment. Modular approval FCC ID: S9NSPBTLERF In accordance with FCC part 15, the SPBTLE-RF is listed as a modular transmitter device. This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters must comply with colocation and RF exposure requirements in accordance with FCC multi-transmitter product procedures. Collocated transmitters operating in portable RF Exposure conditions (e.g. <20cm from persons including but not limited to body worn and hand held devices) may require separate approval. Labeling instructions When integrating the SPBTLE-RF into the final product, the OEM must ensure that the FCC labeling requirements are satisfied. A statement must be included on the exterior of the final product which indicates the product includes a certified module. The label should state the following (or similar wording that conveys the same meaning): Contains FCC ID: S9NSPBTLERF OR This product contains FCC ID: S9NSPBTLERF The OEM must include the following statements on the exterior of the final product unless the product is too small (e.g. less than 4 x 4 inches): This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including any interference that may cause undesired operation. P a g e | 12 Rev 0.1 SPBTLE-RF Product manual instructions This section applies to OEM final products containing the SPBTLE-RF module, subject to FCC compliance. The final product manual must contain the following statement (or a similar statement that conveys the same meaning): WARNING: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. (Part. 15.21) In the case where an OEM seeks Class B (residential) limits for the final product, the following statement must be included in the final product manual: NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. In the case where an OEM seeks the lesser category of a Class A digital device for the final product, the following statement must be included in the final product manual: NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his expense. Rev 1.0 P a g e | 13 SPBTLE-RF 12.2 IC certification The SPBTLE-RF module has been tested and found compliant with the IC RSS-210 rules. These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference may not occur in a particular installation. This device complies with RSS-210 of the IC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Modifications or changes to this equipment not expressly approved by STMicroelectronics may render void the user's authority to operate this equipment. Modular approval IC: 8976C-SPBTLERF In accordance with IC RSS-210, the SPBTLE-RF is listed as a modular transmitter device. This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters must comply with colocation and RF exposure requirements in accordance with IC multi-transmitter product procedures. Collocated transmitters operating in portable RF Exposure conditions (e.g. <20cm from persons including but not limited to body worn and hand held devices) may require separate approval. 12.2.1 Labeling instructions When integrating the SPBTLE-RF into the final product, the OEM must ensure that the IC labeling requirements are satisfied. A statement must be included on the exterior of the final product which indicates that the product includes a certified module. The label should state the following (or similar wording that conveys the same meaning): Contains IC: 8976C-SPBTLERF OR This product contains IC: 8976C-SPBTLERF The OEM must include the following statements on the exterior of the final product unless the product is too small (e.g. less than 4 x 4 inches): This device complies with RSS-210 of the IC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including any interference that may cause undesired operation. 12.2.2 Product manual instructions This section applies to OEM final products containing the SPBTLE-RF module, subject to IC compliance. The final product manual must contain the following statement (or a similar statement that conveys the same meaning): WARNING: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. (RSS-210) P a g e | 14 Rev 0.1 SPBTLE-RF In the case where an OEM seeks Class B (residential) limits for the final product, the following statement must be included in the final product manual: NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and receiver. Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help. In the case where an OEM seeks the lesser category of a Class A digital device for the final product, the following statement must be included in the final product manual: NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his expense. Rev 1.0 P a g e | 15 SPBTLE-RF CE certification for SPBTLE-RF module The SPBTLE-RF module has been certified according to the following standards: EN 60950-1:2006 + A11:2009 + A12:2011 + A1:2010 + A2:2013 + AC:2011 ETSI EN 301 489-1 V1.9.2:2011 ETSI EN 301 489-17 V2.2.1 ETSI EN 300 328 V1.8.1 :2012 ETSI EN 300 328 V1.9.1 (2015) EN62479 :2010 The module is CE certified: P a g e | 16 Rev 0.1 SPBTLE-RF Please Read Carefully: Information in this document is provided solely in connection with ST products. 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