ST Microelectronics S R L SPSGPE SPSGPE-915 SubGiga Module User Manual

ST Microelectronics S.R.L. SPSGPE-915 SubGiga Module

User Manual

February 2017 DocID0xxxxx Rev 0.xx 1/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com SPSGPE Sub1GHz (433 or 868 or 915 MHz) programmable transceiver module Preliminary Datasheet Features  LGA-SMT module  Complete RF-ready module based on: o SPIRIT1 low data rate, low power sub-GHz transceiver by ST Microelectronics o STM32L151RDY6 Ultra low power ARM-based 32-bit microcontroller by ST Microelectronics with 32 MHz CPU, 384 KB Flash Memory and 48 KB RAM o Embedded balun and filtering network.  Compact size: 27.15 mm x 16 mm x 2.5 mm  Operating on ETSI band 433.05 MHz to 434.79 MHz (SPSGPE-433)  Operating on ETSI bands 868 MHz to 868.6 MHz and 869.4 MHz to 869.65 MHz (SPSGPE-868),  Operating on FCC band is configured by uploading the relevant application firmware image (see section 0) band 902.0 MHz to 928.0 MHz (SPSGPE-915).  Operating from a single 1.9 V to 3.6 V supply  Output power up to +10.5 dBm (SPSGPE-868/SPSGPE-915) and up to +10 dBm (SPSGPE-433)  Data rates up to 50 kbps  Modulation scheme GFSK  Operating temperature range: -40°C to +85°C  UART and USB interface with AT command set.
List of tables February 2017 DocID0xxxxx Rev 0.xx 2/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com Contents 1 Description .............................................................................................................................. 5 2 Hardware specifications........................................................................................................... 6 2.1 Recommended operating conditions .................................................................................. 6 2.2 Absolute maximum ratings ................................................................................................. 6 2.3 I/O operating specifications ................................................................................................ 6 2.4 Current consumption .......................................................................................................... 7 2.5 RF compliance limits .......................................................................................................... 7 2.6 RF sensitivity data .............................................................................................................. 8 2.7 Pin assignment ................................................................................................................... 9 2.8 Pin placement................................................................................................................... 10 2.9 Memory resources ............................................................................................................ 11 2.10 Hardware block diagram ............................................................................................... 11 3 Hardware design ................................................................................................................... 12 3.1 Pin usage ......................................................................................................................... 12 3.2 Typical application circuits ................................................................................................ 13 3.3 Layout guidelines ............................................................................................................. 16 3.4 Recommended footprint ................................................................................................... 18 3.5 Module reflow installation ................................................................................................. 19 4 Module operation ................................................................................................................... 20 5 Package mechanical data ...................................................................................................... 21 6 Regulatory compliance .......................................................................................................... 22 6.1 CE certification ................................................................................................................. 22 6.2 FCC certification ............................................................................................................... 22 6.3 IC certification................................................................................................................... 22 6.4 Labeling instructions ......................................................................................................... 23 6.5 Product manual instructions ............................................................................................. 24 7 Ordering information .............................................................................................................. 25 Appendix 1 Document revision history ........................................................................................ 26
List of tables February 2017 DocID0xxxxx Rev 0.xx 3/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com List of tables Table 1. Recommended operating conditions. ................................................................................ 6 Table 2. Absolute maximum ratings. ............................................................................................... 6 Table 3. I/O operating specifications. .............................................................................................. 6 Table 4. Current consumption. ........................................................................................................ 7 Table 5. RF compliance limits. ........................................................................................................ 7 Table 6 RF sensitivity data. ............................................................................................................ 8 Table 7. Pin assignment. ................................................................................................................ 9 Table 7. Memory resources. ......................................................................................................... 11 Table 8. SPSGPE pins requiring connections, when the module is connected to a host microcontroller unit. ...................................................................................................................... 12 Table 9. SPSGPE pins requiring connections, when the module is connected to a host computer via USB. ....................................................................................................................................... 12 Table 10. Outputs to external LED by pin STAT_LED (TP10). ...................................................... 15 Table 11. Soldering profile. ........................................................................................................... 19 Table 12. Ordering information. .................................................................................................... 25 Table 13. Document revision history. ............................................................................................ 26
List of figures February 2017 DocID0xxxxx Rev 0.xx 4/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com List of figures Figure 1. Pin Placement (top view of LGA pads placed on bottom side).Errore. Il segnalibro non è definito. Figure 2. Hardware block diagram ................................................................................................ 11 Figure 3. Typical application circuit of SPSGPE connected to a host microcontroller. ................... 13 Figure 4. Typical application circuit of SPSGPE connected to a host computer via USB. ............. 13 Figure 5. Example of SPSGPE layout. .......................................................................................... 13 Figure 6. Recommended SPSGPE footprint. ................................................................................ 18 Figure 7. Soldering profile. ............................................................................................................ 19 Figure 8. Package mechanical data…………………………………………………………… 21
February 2017 DocID0xxxxx Rev 0.xx 5/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 1 Description SPSGPE is a hardware LGA-SMT module for easy development of high performance wireless network applications for a wide range of applications. Compact-sized, low power and fully integrated, SPSGPE is available in 3 versions:  SPSGPE-433 operating on ETSI 433 MHz band  SPSGPE-868 operating on ETSI 868 MHz band  SPSGPE-915 operating FCC 915 MHz band. All versions have the same pin-out and mechanical shape. SPSGPE is based on SPIRIT1 RF sub-GHz transceiver (with integrated SMPS) and STM32L151RDY6 microcontroller by ST Microelectronics. Balun and filtering network are embedded in the module. An external antenna can be connected through one pin of the module which requires an impedance-controlled track of 50 Ω. The UART host interface and USB device interface allow simple connection to an external microcontroller with a standard firmware or a host computer, enabling AT commands to facilitate RF configuration, data transmission and reception, using simple point-to-point communication. Selected STM32L1 GPIO and peripherals are available to interface external devices and enable user applications. Advanced features of SPIRIT1 radio are also accessible. SPSGPE is designed and engineered to build OEM solutions and applications primarily in the following domains:  Internet of Things (IoT) and Machine-to-Machine (M2M);  Smart Cities;  Smart Grids and Energy Management;  Home & Building Automation;  Wireless Sensor Networks;  Data acquisition equipment management;  Industrial condition and asset monitoring.
February 2017 DocID0xxxxx Rev 0.xx 6/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 2 Hardware specifications Unless otherwise specified, typical data are based on TA = 25 °C, VDD = 3.3 V. 2.1 Recommended operating conditions Symbol Parameter Min. Typ. Max. Unit TA Operating ambient temperature range -40 - +85 °C VDD Operating supply voltage (1) 1.9 3.3 3.6 V FREQ RF frequency 1 for SPSGPE-433 433.05 - 434.79 MHz FREQ RF frequency 1 in ETSI band for SPSGPE-868 868 - 868.6 MHz FREQ RF frequency 2 in ETSI band for SPSGPE-868 869.4 - 869.65 MHz FREQ RF frequency 1 in FCC band for SPSGPE-915 902.0 - 928.0 MHz (1) USB is not functional below VDD=2.0V. Should be USB compliant from I/O voltage standpoint, the minimum VDD is 3.0 V. For further details, please refer to STM32L151RDY6 datasheet. Table 1. Recommended operating conditions. 2.2 Absolute maximum ratings Symbol Parameter Min. Typ. Max. Unit TSTG Storage temperature range -40 - +85 °C VDD Operating supply voltage -0.3 - 3.9 V VIO I/O pin voltage -0.3 - 5.5 V Table 2. Absolute maximum ratings. 2.3 I/O operating specifications Symbol Parameter Min. Typ. Max. Unit VIL(1) I/O input low level voltage -0.3 - 0.3 VDD V VIH(1) I/O input high level voltage 0.7 VIN - VDD+0.3 V (1) For further details, please refer to STM32L151RDY6 datasheet, I/O port features. Table 3. I/O operating specificat
February 2017 DocID0xxxxx Rev 0.xx 7/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 2.4 Current consumption Symbol Parameter Test conditions Typ. Unit IDD Supply current Operating mode TX, +11 dBm, freq. 868MHz 27 mA IDD Supply current Operating mode TX, +10.5 dBm, freq. 915MHz 39 mA IDD Supply current Operating mode TX, +10 dBm, freq. 433MHz 24 mA IDD Supply current Operating mode RX, freq. 868MHz 19 mA IDD Supply current Operating mode RX, freq. 915MHz 28 mA IDD Supply current Operating mode RX, freq. 433MHz 18 mA IDD Supply current Stand-by (Radio off, STM32L151RDY6 in Stop mode with RTC) 5 µA Table 4. Current consumption. 2.5 RF compliance limits RF compliance limits for CE and FCC certifications, referring to factory loaded firmware. If applying a custom firmware, please ensure these limits are not exceeded, voiding CE and FCC certifications. Standards Parameter Max. Unit FCC Part 15.207 (1) FCC Part 15.247 (1) EN 300 220-2 V2.4.1 (2) EN 301 489-01 V1.9.2 (2) EN 301 489-03 V1.4.1 (2) Data rate 50 kbps Output power (ETSI 868 MHz and FCC 915 MHz band) +10.5 dbm Output power (ETSI 433 MHz band) +10 Modulation GFSK (1) FCC standards are only applicable to SPSGPE-915 operating in the FCC 915 MHz band (2) EN standards are only applicable to SPSGPE-433 and SPSGPE-868 operating in the ETSI 433MHz and ETSI 868MHz respectively. Table 5. RF compliance limits.
February 2017 DocID0xxxxx Rev 0.xx 8/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 2.6 RF sensitivity data RF sensitivity data for all the versions of SPSGPE are reported in Table 6. Parameter SPSGPE version Test conditions Typ. Unit Sensitivity (1% BER) SPSGPE-433 FREQ = 434 MHz, Data Rate = 50 kbps (25 kHz dev. CH Filter=125kHz), VDD = 3.3 V, TA = 25°C Spirit1 SMPS enabled -98 dBm Sensitivity (1% BER) SPSGPE-868 FREQ = 868 MHz, Data Rate = 50 kbps (25 kHz dev. CH Filter=125kHz), VDD = 3.3 V, TA = 25°C Spirit1 SMPS enabled -104 dBm Sensitivity (1% BER) SPSGPE-915 FREQ = 915 MHz, Data Rate = 50 kbps (25 kHz dev. CH Filter=125kHz), VDD = 3.3 V, TA = 25°C Spirit1 SMPS enabled -105 dBm Table 6 RF sensitivity data.
February 2017 DocID0xxxxx Rev 0.xx 9/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 2.7 Pin assignment Pin Name Type Description STM32L151RDY6 pin(1) TP1 I2C1_SCL(4) I/O I2C clock(3) or general purpose input/output PB8 TP2 SWDIO I/O Serial wire I/O(2) PA13 TP3 GPIO_11 I/O General purpose input/output PB7 TP4 GPIO_12 I/O General purpose input/output PC12 TP5 GPIO_13 I/O General purpose input/output PA15 TP6 RESET I Reset input, active low, internal pull-up NRST TP9 I2C1_SDA(4) I/O I2C data in/out(3) or general purpose input/output PB9 TP10 STAT_LED O Status indicator LED PB6 TP11 USB_DEV_CONN I Pull high, if USB is used/connected, pull low, if USB is not used/connected PB5 TP12 GPIO_8 I/O General purpose input/output PB4 TP13 GPIO_10 I/O General purpose input/output PB3 TP14 PWR_MON O Power ON monitor, goes high if the module is powered on, goes low if the module is not powered PC11 TP15 GPIO_14 I/O General purpose input/output PD2 TP16 SWCLK I Serial wire clock(2) PA14 TP17 GND Power Ground - TP18 USB_P / RTS I/O USB DATA- or Request to send signal from DTE, depending on firmware configuration PA12 TP19 USB_N / CTS I/O USB DATA+ or Clear to send signal to DTE, depending on firmware configuration PA11 TP20 UART2_RX I Serial data input from DTE PA10 TP21 UART2_TX O Serial data output to DTE PA9 TP22 GPIO_9 I/O General purpose input/output PC6 TP23 SPI_MISO(4) I/O SPI MISO or general purpose input/output PB14 TP24 SPI_MOSI(4) I/O SPI MOSI or general purpose input/output PB15 TP25 RI O Ring indicator to DTE PB12 TP26 SPI_CLK(4) I/O SPI clock or general purpose input/output PB13 TP27 VDD Power Supply input voltage - TP28 DTR I Data terminal ready from DTE PB2 TP29 TX_AUX O Auxiliary serial data output for debug/test PB10 TP30 ADC_01 I/O ADC input or general purpose input/output PB0 TP31 GPIO_6 I/O General purpose input/output PC5 TP32 GPIO_5 I/O General purpose input/output PC4 TP33 ON/OFF I Input for switching ON or OFF the module PA0 TP34 UART1_RX I/O Serial data input PA3 TP35 UART1_TX I/O Serial data output PA2 TP36 ALARM/GPIO_1 I/O Alarm output or general purpose input/output PCO TP37 GPIO_4 I/O General purpose input/output PC3 TP38 GPIO_2/RF_TX_MON O RF transmitter ON monitor or general purpose input/output PC1 TP39 RX_AUX I Auxiliary serial data input for debug/test PB11 TP40 ADC_01 I/O ADC input or general purpose input/output PB1 TP41 RESERVED - Must be left unconnected (for future uses) PA8 TP42 GPIO_7 I/O General purpose input/output PA1
February 2017 DocID0xxxxx Rev 0.xx 10/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com TP43 GPIO_3 I/O General purpose input/output PC2 TP44 GND Power Ground - TP45 ANT I/O Connection pin for external antenna (50 Ω) - TP46 GND Power Ground - Table 7. Pin assignment. (1) For further details, please refer to STM32L151RDY6 datasheet, Pin descriptions section. (2) Do not use SWD interface for any reason, unless to intentionally erase module flash memory and install a different firmware image. Any attempt to use SWD interface will force an immediate flash memory full erase, leaving SPSGPE in a clean state. Please notice that “FW Copy Protection Level 1” of STM32L151RDY6 microcontroller is activated. (3) For I2C operation at 100 kHz an external pull-up resistor of 4.7 kΩ needs to be used. For I2C operation at 400 kHz an external pull-up resistor of 4.7 kΩ needs to be used. (4) Pin may be configured either as the function indicated in the pin name, or as general purpose input/output. 2.8 Pin placement Figure 1. Pin placement (top view of LGA pads placed on bottom side).
February 2017 DocID0xxxxx Rev 0.xx 11/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 2.9 Memory resources Memory resources available in the STM32L151RDY6 microcontroller unit adopted in all SPSGPE versions are listed in Table 8. For further details, please refer to STM32L151RDY6 microcontroller unit datasheet and user manual, and SPSGPE user manual. Item Value Flash Memory(1) 384 kByte RAM 48 kByte I/O(2) 39 channels Table 8. Memory resources. (1) Amount of Flash memory available without any firmware installed on SPSGPE. To calculate the amount of available Flash memory with SPSGPE firmware, please refer to SPSGPE software user manual. For further details, please refer to STM32L151RDY6 datasheet. (2) The number of available I/O channels may change depending on actual hardware configuration. For further details, please refer to par. 0and 0. 2.10 Hardware block diagram Figure 1. Hardware block diagram
February 2017 DocID0xxxxx Rev 0.xx 12/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 3 Hardware design 3.1 Pin usage If used with default firmware and interfaced to a host microcontroller unit, SPSGPE requires minimum power, ground and UART to transmit and receive signals, that is to be connected. Other signals are optional and provide additional functionality. Unused signals must be left unconnected. In case the module is connected to a host microcontroller unit, SPSGPE pins requiring connections are outlined in Table 9. Pin Name Description Optional TP27 VDD Supply input voltage No TP17 GND Ground No TP44 TP46 TP21 UART2_TX Serial data output to DTE No TP20 UART2_RX Serial data input from DTE No TP18 USB_P / RTS Request to send signal from DTE, if used. If flow controls are not used, this pin must be connected to GND. It could be left floating, if USB is supported by firmware. Yes TP33 ON/OFF Input for switching ON or OFF the module(1) (toggle command) Yes TP6 RESET Reset input, active low, internal pull-up(1) No TP45 ANT Connection pin for external antenna (50 Ω) No (1) Open drain connection is required. Table 9. SPSGPE pins requiring connections, when the module is connected to a host microcontroller unit. In another typical application circuit, SPSGPE is connected to a host computer through a standard USB connector. In this case, module pins requiring connections are listed in Table 10. Pin Name Description Optional TP27 VDD Supply input voltage No TP17 GND Ground No TP44 TP46 TP18 USB_P / RTS USB Data– (90 Ω differential) No TP19 USB_N / CTS USB Data+ (90 Ω differential) No TP11 USB_DEV_CONN Input for detecting the connection to the USB cable. Pull it high when USB cable is connected. No TP33 ON/OFF Input for switching module ON or OFF (toggle command) Yes TP6 RESET Reset input, active low, internal pull-up No TP45 ANT Connection pin for external antenna (50 Ω) No Table 10. SPSGPE pins requiring connections, when the module is connected to a host computer via USB.
February 2017 DocID0xxxxx Rev 0.xx 13/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 3.2 Typical application circuits In a typical application circuit, SPSGPE is connected to a host microcontroller unit through a standard UART to transmit and receive signals. This application is pictured in Figure 2. Figure 2. Typical application circuit of SPSGPE connected to a host microcontroller. Please notice that “USB / RTS” could be left floating if USB is supported by firmware. In another typical application circuit, SPSGPE is connected to a host computer through a standard USB connector. This application is pictured in Figure 3. Figure 3. Typical application circuit of SPSGPE connected to a host computer via USB.
February 2017 DocID0xxxxx Rev 0.xx 14/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com NOTE: when using the SPSGPE in a USB self-powered application, USB back-voltage test requirement must be met (i.e. a maximum of 400 mV may be measured on the VBUS, D+, or D- when the device is not plugged into a USB port). For this purposes, SPSGPE requires to receive on the pin USB_DEV_CONN a signal indicating, when set at high logical level, that the VBUS is detected in order to properly control the internal pull-up resistor connected to D+ line available internally to the STM32L151RDY6. For further details, please refer to STM32L151RDY6 datasheet.
February 2017 DocID0xxxxx Rev 0.xx 15/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com Special features are enabled by the following pins: - STAT_LED (pin TP10): output to drive an external LED and indicated status of SPSGPE connections. If this pin is used as output to an external LED, possible outputs are listed in Table 11. LED Output Description Periodic single flashing with long ON time and short OFF time. Application is waiting for commands from DTE. Periodic single flashing with short ON time and long OFF time. Application has started and SPSGPE is seeking for connection. Periodic fast double flashing. Application has started and SPSGPE is connected to a gateway. Table 11. Outputs to external LED by pin STAT_LED (TP10). - RESET (pin TP6): internal pulled-up signal for resetting SPSGPE. It has to be tied low for at least 100 ms and then released to perform SPSGPE unconditional hardware restart. Please notice that unconditional hardware restart must not be used during normal device operation, since it does not detach the device from the network. It shall be kept as emergency exit procedure in the rare case the module gets stacked waiting for network response. It is suggested to implement unconditional hardware restart (through a GPIO of the host microcontroller unit, to be configured as open drain or through a push button) on SPSGPE applications only as emergency exit procedure. - ON/OFF (pin TP33): it performs the turning on/off procedure for SPSGPE when voltage supply at VDD (pin 27) stands within recommended operating range (please refer to Table 1). To start the turning off procedure when the module is turned on, the ON/OFF signal needs to be tied low for at least 2 seconds. Similarly, to start the turning on procedure when the module is turned off, the ON/OFF signal needs to be tied low for at least 2 seconds. The turning on/off procedure can also be performed via AT commands (please refer to SPSGPE software guide). - PWR_MON (pin TP14): output signal indicating SPSGPE power status. It climbs high when SPSGPE is properly powered on, and it climbs down when SPSGPE is not powered. - USB_DEV_CONN (pin TP11): input signal to detect USB cable connections. It has to be high when USB is connected, and low when USB is disconnected. Considering a 5 V tolerant pin, it is recommended to connect it to the VBUS pin of USB connector with proper protection and filtering network, adopting components like diode, ferrite bead and capacitors. If USB is used, UART interface to DTE is automatically disabled. To re-enable UART, this pin has to be tied low.
February 2017 DocID0xxxxx Rev 0.xx 16/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 3.3 Layout guidelines When adopting SPSGPE, please consider the following guidelines for a correct PCB design: 1. A minimum four-layer PCB is suggested. 2. At least one of the PCB layers should be used to implement a copper ground plane without cuts. 3. Copper planes and/or heavy traces are recommended to implement power supply connections. 4. Decoupling capacitors (recommended values are 100 nF and 10 µF in parallel) have to be placed very close to power supply pins. 5. Routing of traces (especially noisy and high frequency ones) across the power supply should be avoided. 6. The ANT pin (pin TP45) needs to be used for connecting the module to an external antenna. Its related RF ground is represented by pins TP44 and TP46. A trace having a controlled impedance of 50 Ω needs to be used to connect the ANT pin (pin TP45) to an external antenna (microstrip or grounded coplanar waveguide solutions of 50 Ω are suggested). 7. Routing of traces (especially noisy, high frequency and power supply ones) near or across the connection between the ANT pin (pin TP45) and the external antenna should be avoided. 8. Connection of all ground metallization and/or layers should have as many vias as possible. Number and density of these vias should be increased in the connection area between the ANT pin (pin TP45) and the external antenna. 9. A differential trace of 90 Ω needs to be used to connect pins TP18 and TP19 (USB_P / RTS and USB_N / CTS, respectively) to a USB connector, in case they are used as USB traces. It is also strongly recommended to follow all hardware and layout guidelines by USB standards. An example of SPSGPE layout is pictured in Figure 4.
February 2017 DocID0xxxxx Rev 0.xx 17/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com Figure 4. Example of SPSGPE layout.
February 2017 DocID0xxxxx Rev 0.xx 18/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 3.4 Recommended footprint Figure 5. Recommended SPSGPE footprint. All dimensions are in millimeters.
February 2017 DocID0xxxxx Rev 0.xx 19/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 3.5 Module reflow installation SPSGPE is a surface mount module supplied on a 46-pin, 6-layer PCB, with gold surface finish. Final assembly recommended reflow profile is outlined below, based on IPC/JEDEC JSTD-020C, July 2004 recommendations. Profile feature Lead-free assembly Average ramp-up rate (TSMAX to TP) 1.7°C/sec max Preheat: - Temperature min (TS min.) - Temperature max (TS max.) - Time (TS min. to TS max.) (tS) 150°C 200°C 60-100 sec (suggested: 85 sec) Time maintained above: - Temperature TL - Temperature TL 217 °C 60-100 sec (suggested: 99 sec) Peak temperature (TP) 242 °C Time within 5°C of actual peak temperature (TP) 10-20 sec Ramp-down rate 2°C/sec Time from 25°C to peak temperature 8 minutes max. Table 12. Soldering profile. Figure 6. Soldering profile.
February 2017 DocID0xxxxx Rev 0.xx 20/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 4 Module operation SPSGPE software architecture is based on SPSGPE.OS operating system and provides a set of precompiled firmware libraries to manage module operation. Two operational modes are supported:  SPSGPE working as a “communication module”, using AT/HDLC commands;  SPSGPE working as a “standalone module”, running embedded standalone application. When using SPSGPE as a communication module, the module acts as a wireless RF module. SPSGPE.OS operating system handles SPSGPE internal transceiver and any external device connected to it, providing mesh routing connectivity. Thus, it allows to configure SPSGPE either as a node or as a gateway, enabling different application domains including and not limited to low-power applications. This operational mode enables module configuration and status interrogation, and supports two different high-level communication interfaces: AT command set and HDLC command interface. AT and HDLC command interfaces assume communications with an external host processor via USB and/or UART serial interfaces, in a scenario where SPSGPE acts as an RF modem device and the user application runs on the host processor. The two types of command modes are briefly described below: - AT command: it implements a set of AT commands compliant with Hayes standard AT command set and expanded through Paradox Engineering proprietary AT command set for special purposes. - HDLC command: it offers a fast optimized binary HDLC protocol with a set of HDLC commands for managing and controlling SPSGPE. When using SPSGPE as a standalone module, the user can develop its own application code and link it to SPSGPE.OS, or customize a standard SPSGPE application firmware image through the scripting tool. Once developed with the scripting tool, compiled script programs can be uploaded and executed under the control of SPSGPE Script Engine. For further details about SPSGPE software architecture, command and operating modes, please refer to SPSGPE Application and Software – User Guide (document reference: tbd)
February 2017 DocID0xxxxx Rev 0.xx 21/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 5 Package mechanical data Figure 7. Package mechanical data. All dimensions are in millimeters.
February 2017 DocID0xxxxx Rev 0.xx 22/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 6 Regulatory compliance NOTE: this section will be completed and confirmed after the certification process is done. 6.1 CE certification SPSGPE-433 and SPSGPE-868 are certified in accordance with the following standards: EN 300 220-2 V2.4.1 EN 301 489-01 V1.9.2 EN 301 489-03 V1.6.1 Receiver category: Class 2 receiver. 6.2 FCC certification SPSGPE-915 is certified in accordance with the following standards: FCC Part 15.207 FCC Part 15.247 FCC ID: S9NSPSGPE 6.3 IC certification SPSGPE-915 is certified in accordance with the following standards: RSS-247 Issue 1 IC ID: 8976C-SPSGPE (Please, refer to Appendix A of this document for the French translation).
February 2017 DocID0xxxxx Rev 0.xx 23/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 6.4 Labeling instructions When integrating SPSGPE-915 into a finished product, the OEM must ensure that FCC labeling requirements are satisfied. A statement must be placed over the finished product to indicate it includes a certified module. The label should state the following (or similar wording that conveys the same meaning): Contains FCC ID: S9NSPSGPE OR This product contains FCC ID: S9NSPSGPE The OEM must place the following statements over the finished product unless it is too small (e.g. less than 4 x 4 inches): This device complies with Part 15 of FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including any interference that may cause undesired operation. When integrating SPSGPE-915 into a finished product, the OEM must ensure that IC labeling requirements are satisfied. A statement must be placed over the finished product to indicate it includes a certified module. The label should state the following (or similar wording that conveys the same meaning): Contains IC ID: 8976C-SPSGPE OR This product contains IC ID: 8976C-SPSGPE The OEM must place the following statements over the finished product unless it is too small (e.g. less than 4 x 4 inches): This device complies with RSS-247 of IC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including any interference that may cause undesired operation.
February 2017 DocID0xxxxx Rev 0.xx 24/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 6.5 Product manual instructions This paragraph applies to OEM finished products containing SPSGPE and subject to FCC compliance. The finished product manual must contain the following statement (or similar wording that conveys the same meaning): WARNING: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. In cases the OEM seeks Class B (residential) limits for the finished product, the following statement must be included in the finished product manual: NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with given instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur under certain circumstances. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: – Reorient or relocate the receiving antenna. – Increase the separation between the equipment and receiver. – Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. – Consult the dealer or an experienced radio/TV technician for help. In cases the OEM seeks Class A digital device category for the finished product, the following statement must be included in the finished product manual: NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expenses.
February 2017 DocID0xxxxx Rev 0.xx 25/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 7 Ordering information Product name EAN code Description SPSGPE-433 tbd Version operating on ETSI 433 MHz band (Region 1, Europe) SPSGPE-868 tbd Version operating on ETSI 868 MHz band (Region 1, Europe SPSGPE-915 tbd Version operating on FCC 915 MHz band (Region 2, The Americas) Table 13. Ordering information.
February 2017 DocID0xxxxx Rev 0.xx 26/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com Appendix A Déclaration de conformité A.1 Certification FCC Le module SPSGPE-915 a été testé et déclaré conforme avec la section 15 de la Règlementation FCC. Ces limitations sont stipulées afin de procurer une protection raisonnable contre les interférences gênantes dans les installations approuvées. Cet appareil génère, utilise et diffuse des ondes radio et, s’il n’est pas installé et utilisé en conformité avec les instructions dont il fait l’objet, peut causer des interférences gênantes sur les communications radio. Il n’y a cependant pas de garantie qu’une interférence ne se produira pas dans une installation particulière. Cet appareil est en conformité avec la section 15 des règlements FCC. L’utilisation est soumise aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférences nocives, et (2) Cet appareil doit supporter toute interférence reçue, y compris des interférences qui peuvent provoquer un fonctionnement non désiré. Tout changement ou modification fait(e) à cet appareil et non expressément approuvé(e) par STMicroelectronics peut annuler l’autorisation pour l’utilisateur de faire fonctionner l’appareil. Approbation du module FCC ID: S9NSPSGPE Conformément à la section 15 des règlements FCC, le module SPSGPE-915 est répertorié comme un dispositif émetteur modulaire. Ce module n’est évalué que pour une utilisation autonome. Les produits finis incorporant plusieurs émetteurs doivent être conformes à la colocation et aux exigences d'exposition RF en concordance avec les procédures FCC multi-émetteurs. D’autres émetteurs fonctionnant dans des dispositifs portables exposés aux RF (par exemple, situés à moins de 20 cm des personnes avec dispositifs portatifs ou portés contre le corps) peuvent nécessiter d'une approbation séparée. A.1.1 Instructions d'étiquetage Lors de l'intégration du module SPSGPE-915 dans le produit final, le fabricant doit s’assurer que les exigences en matière d'étiquetage de la FCC sont satisfaites. Une déclaration doit être placée sur l’étiquette extérieure du produit final indiquant que le produit comprend un module certifié. L'étiquette doit comporter les informations suivantes (ou une mention analogue que recouvre la même notion): Contient FCC ID: S9NSPSGPE OU Ce produit contient FCC ID: S9NSPSGPE Le sous-traitant doit inclure les énoncés suivants sur l’étiquette extérieure du produit final à moins que le produit ne soit trop petit (par exemple moins de 4 x 4 pouces): Cet appareil est en conformité avec la section 15 des règlements FCC. L’utilisation est soumise aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférences nocives, et (2) Cet appareil doit supporter toute interférence reçue, y compris des interférences qui peuvent provoquer un fonctionnement non désiré.
February 2017 DocID0xxxxx Rev 0.xx 27/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com A.1.2 Instructions pour l’utilisation du produit La présente section concerne les produits finis contenant le module SPSGPE-915, assujettis aux normes FCC. Le manuel du produit final doit contenir la déclaration suivante (ou une mention analogue que recouvre la même notion): “ Avertissement: Les changements ou modifications non expressément approuvés par la partie responsable de la conformité pourraient annuler l'autorisation de l'utilisateur de faire fonctionner cet équipement. (Section 15.21)” Dans le cas où le produit finis d’un fabriquant OEM rentre dans les limites de la Classe B (résidentiel), les énoncés suivants doivent être inclus dans le manuel du produit finis: “Remarque : Cet équipement a été testé et déclaré conforme aux limitations prévues dans le cadre de la classe B des appareils numériques, définies par la section 15 du règlement de la FCC. Ces limites sont conçues pour fournir une protection raisonnable contre toute interférence dangereuse issue d'une installation résidentielle. Cet équipement produit, utilise et peut émettre de l'énergie radio électrique et, s'il n'est pas installé et utilisé conformément aux présentes instructions, peut causer des interférences nuisibles aux communications radio. Cependant, il se peut que des interférences se produisent dans une installation particulière. Si cet appareil cause des interférences nuisibles à la réception des signaux de radio ou de télévision, ce qui peut être déterminé en allumant et en éteignant l'appareil, on encourage l'utilisateur d'essayer de corriger ces interférences par l'un des moyens suivants: – Réorienter ou repositionner l'antenne de réception. – Augmenter la distance séparant l’équipement du récepteur. – Connecter l’équipement à une prise appartenant à un circuit différent de celui sur lequel le récepteur est connecté. – Consulter le revendeur ou un technicien radio/TV expérimenté pour obtenir de l’aide.” Dans le cas où le produit fini d’un sous-traitant rentre dans les limites imposées aux appareils numériques de classe A, les énoncés suivants doivent être inclus dans le manuel du produit finis: “REMARQUE : Cet appareil a été testé et certifié conforme aux spécifications d'un appareil électronique de classe A (class A digital device), conformément à la partie 15 du règlement de la FCC. Ces contraintes sont destinées à fournir une protection raisonnable contre les interférences nuisibles quand l'appareil est utilisé dans une installation commerciale. Cet équipement produit, utilise et peut émettre de l'énergie radio électrique et, s'il n'est pas installé et utilisé conformément aux présentes instructions, peut causer des interférences nuisibles aux communications radio. L'utilisation de cet appareil dans une installation résidentielle peut entraîner des interférences nuisibles et l'utilisateur devra corriger les interférences à ses propres frais.”
February 2017 DocID0xxxxx Rev 0.xx 28/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com A.2 Certification IC (a) Le module SPSGPE-915 a été testé et déclaré conforme avec la Règlementation IC CNR-210. Ces limitations sont stipulées afin de procurer une protection raisonnable contre les interférences gênantes en installations approuvées. Cet appareil génère, utilise et diffuse des ondes radio et, s’il n’est pas installé et utilisé en conformité avec les instructions dont il fait l’objet, peut causer des interférences gênantes sur les communications radio. Il n’y a cependant pas de garantie qu’une interférence ne se produira pas dans une installation particulière. Ce produit répond aux exigences de la norme CNR-210 d'Industrie Canada. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférences nocives, et (2) Cet appareil doit supporter toute interférence reçue, y compris des interférences qui peuvent provoquer un fonctionnement non désiré. Tout changement ou modification fait(e) à cet appareil et non expressément approuvé(e) par STMicroelectronics peut annuler l’autorisation pour l’utilisateur de faire fonctionner l’appareil. Approbation du module IC: 8976C-SPSGPE Conformément à IC CNR-210, le module SPSGPE-915 est répertorié comme un dispositif émetteur modulaire Ce module n’est évalué que pour une utilisation autonome. Les produits finis incorporant plusieurs émetteurs doivent être conformes à la colocation et aux exigences d'exposition RF en concordance avec les procédures FCC multi-émetteurs. D’autres émetteurs fonctionnant dans des dispositifs portables exposés aux RF (par exemple, situés à moins de 20 cm des personnes avec dispositifs portatifs ou portés contre le corps) peuvent nécessiter d'une approbation séparée. A.2.1 Instructions d'étiquetage Lors de l'intégration du module SPSGPE-915 dans le produit final, le fabricant doit s’assurer que les exigences en matière d'étiquetage de la IC sont satisfaites. Une déclaration doit être placée sur l’étiquette extérieure du produit final indiquant que le produit comprend un module certifié. L'étiquette doit comporter les informations suivantes (ou une mention analogue que recouvre la même notion): Contient IC ID: 8976C-SPSGPE OU Ce produit contient IC ID: 8976C-SPSGPE Le sous-traitant doit inclure les énoncés suivants sur l’étiquette extérieure du produit final à moins que le produit ne soit trop petit (par exemple moins de 4 x 4 pouces): Cet appareil est en conformité aux normes IC. L’utilisation est soumise aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférences nocives, et (2) Cet appareil doit supporter toute interférence reçue, y compris des interférences qui peuvent provoquer un fonctionnement non désiré
February 2017 DocID0xxxxx Rev 0.xx 29/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com A.2.2 Instructions pour l’utilisation du produit La présente section concerne les produits finis contenant le module SPSGPE-915, assujettis aux normes IC. Le manuel du produit final doit contenir la déclaration suivante (ou une mention analogue que recouvre la même notion): “Avertissement: Les changements ou modifications non expressément approuvés par la partie responsable de la conformité pourraient annuler l'autorisation de l'utilisateur de faire fonctionner cet équipement. (CNR-210)” Dans le cas où le produit finis d’un fabriquant OEM rentre dans les limites de la Classe B (résidentiel), les énoncés suivants doivent être inclus dans le manuel du produit finis: “ Remarque : Cet équipement a été testé et déclaré conforme aux limitations prévues dans le cadre de la classe B des appareils numériques, définies par la norme CNR-210 d'Industrie Canada. Ces limites sont conçues pour fournir une protection raisonnable contre toute interférence dangereuse issue d'une installation résidentielle. Cet équipement produit, utilise et peut émettre de l'énergie radio électrique et, s'il n'est pas installé et utilisé conformément aux présentes instructions, peut causer des interférences nuisibles aux communications radio. Cependant, il se peut que des interférences se produisent dans une installation particulière. Si cet appareil cause des interférences nuisibles à la réception des signaux de radio ou de télévision, ce qui peut être déterminé en allumant et en éteignant l'appareil, nous encourageons l'utilisateur à essayer de corriger ces interférences par l'un des moyens suivants: – Réorienter ou repositionner l'antenne de réception. – Augmenter la distance séparant l’équipement du récepteur. – Connecter l’équipement à une prise appartenant à un circuit différent de celui sur lequel le récepteur est connecté. – Consulter le revendeur ou un technicien radio/TV expérimenté pour obtenir de l’aide.” Dans le cas où le produit finis d’un fabriquant OEM rentre dans le cadre des limites imposées aux appareils numériques de classe A, les énoncés suivants doivent être inclus dans le manuel du produit finis: “ REMARQUE: Cet appareil a été testé et certifié conforme aux spécifications d'un appareil électronique de classe A (class A digital device), conformément à la norme CNR-210 d'Industrie Canada. Ces contraintes sont destinées à fournir une protection raisonnable contre les interférences nuisibles quand l'appareil est utilisé dans une installation commerciale. Cet équipement produit, utilise et peut émettre de l'énergie radio électrique et, s'il n'est pas installé et utilisé conformément aux présentes instructions, peut causer des interférences nuisibles aux communications radio. L'utilisation de cet appareil dans une installation résidentielle peut entraîner des interférences nuisibles et l'utilisateur devra corriger les interférences à ses propres frais.”
February 2017 DocID0xxxxx Rev 0.xx 30/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com A.3 Certification CE Le module SPSGPE a obtenu une certification de conformité aux normes suivantes: – EN 300 328 V1.8.1 :2012 – EN 300 328 V1.9.1 :2015 – EN 301 489-17 V2.2.1 :2009 – EN 301 489-1 V1.9.2:2011 – EN 62479 :2010 – EN60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2 :2013 Le module est certifié CE.
February 2017 DocID0xxxxx Rev 0.xx 31/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com
February 2017 DocID0xxxxx Rev 0.xx 32/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com Appendix 1 Document revision history Date Revision Changes 2016-09-15 1.0 First release 2016-10-11 1.1 by A.R. 2017-02-16 1.2 By A.R. Table 14. Document revision history
February 2017 DocID0xxxxx Rev 0.xx 33/27 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B) AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2014 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com

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