ST Microelectronics S R L SPSGPE SPSGPE-915 SubGiga Module User Manual
ST Microelectronics S.R.L. SPSGPE-915 SubGiga Module
User Manual
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| Document ID | 3335275 |
| Application ID | 3xqy+7XEYOcEWRfSud/wVQ== |
| Document Description | User Manual |
| Short Term Confidential | No |
| Permanent Confidential | No |
| Supercede | No |
| Document Type | User Manual |
| Display Format | Adobe Acrobat PDF - pdf |
| Filesize | 96.11kB (1201321 bits) |
| Date Submitted | 2017-03-28 00:00:00 |
| Date Available | 2017-09-24 00:00:00 |
| Creation Date | 2017-03-22 16:18:00 |
| Producing Software | Microsoft® Office Word 2007 |
| Document Lastmod | 2017-03-22 16:18:00 |
| Document Title | User Manual |
| Document Creator | Microsoft® Office Word 2007 |
| Document Author: | STMICROELECTRONICS |
SPSGPE Sub1GHz (433 or 868 or 915 MHz) programmable transceiver module Preliminary Datasheet Features LGA-SMT module Complete RF-ready module based on: o SPIRIT1 low data rate, low power sub-GHz transceiver by ST Microelectronics o STM32L151RDY6 Ultra low power ARM-based 32-bit microcontroller by ST Microelectronics with 32 MHz CPU, 384 KB Flash Memory and 48 KB RAM o Embedded balun and filtering network. Compact size: 27.15 mm x 16 mm x 2.5 mm Operating on ETSI band 433.05 MHz to 434.79 MHz (SPSGPE-433) Operating on ETSI bands 868 MHz to 868.6 MHz and 869.4 MHz to 869.65 MHz (SPSGPE-868), Operating on FCC band is configured by uploading the relevant application firmware image (see section 0) band 902.0 MHz to 928.0 MHz (SPSGPE-915). Operating from a single 1.9 V to 3.6 V supply Output power up to +10.5 dBm (SPSGPE-868/SPSGPE-915) and up to +10 dBm (SPSGPE-433) Data rates up to 50 kbps Modulation scheme GFSK Operating temperature range: -40°C to +85°C UART and USB interface with AT command set. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 1/27 List of tables Contents Description .............................................................................................................................. 5 Hardware specifications........................................................................................................... 6 2.1 Recommended operating conditions ..................................................................................6 2.2 Absolute maximum ratings .................................................................................................6 2.3 I/O operating specifications ................................................................................................6 2.4 Current consumption ..........................................................................................................7 2.5 RF compliance limits ..........................................................................................................7 2.6 RF sensitivity data ..............................................................................................................8 2.7 Pin assignment ...................................................................................................................9 2.8 Pin placement...................................................................................................................10 2.9 Memory resources ............................................................................................................11 2.10 Hardware block diagram...............................................................................................11 Hardware design ................................................................................................................... 12 3.1 Pin usage .........................................................................................................................12 3.2 Typical application circuits ................................................................................................13 3.3 Layout guidelines .............................................................................................................16 3.4 Recommended footprint ...................................................................................................18 3.5 Module reflow installation .................................................................................................19 Module operation ................................................................................................................... 20 Package mechanical data...................................................................................................... 21 Regulatory compliance .......................................................................................................... 22 6.1 CE certification .................................................................................................................22 6.2 FCC certification ...............................................................................................................22 6.3 IC certification...................................................................................................................22 6.4 Labeling instructions .........................................................................................................23 6.5 Product manual instructions .............................................................................................24 Ordering information .............................................................................................................. 25 Appendix 1 Document revision history ........................................................................................26 February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 2/27 List of tables List of tables Table 1. Recommended operating conditions. ................................................................................ 6 Table 2. Absolute maximum ratings. ............................................................................................... 6 Table 3. I/O operating specifications. .............................................................................................. 6 Table 4. Current consumption......................................................................................................... 7 Table 5. RF compliance limits. ........................................................................................................ 7 Table 6 RF sensitivity data. ............................................................................................................ 8 Table 7. Pin assignment. ................................................................................................................ 9 Table 7. Memory resources. ......................................................................................................... 11 Table 8. SPSGPE pins requiring connections, when the module is connected to a host microcontroller unit. ...................................................................................................................... 12 Table 9. SPSGPE pins requiring connections, when the module is connected to a host computer via USB. ....................................................................................................................................... 12 Table 10. Outputs to external LED by pin STAT_LED (TP10). ...................................................... 15 Table 11. Soldering profile. ........................................................................................................... 19 Table 12. Ordering information. .................................................................................................... 25 Table 13. Document revision history. ............................................................................................ 26 February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 3/27 List of figures List of figures Figure 1. Pin Placement (top view of LGA pads placed on bottom side).Errore. Il segnalibro non è definito. Figure 2. Hardware block diagram ................................................................................................ 11 Figure 3. Typical application circuit of SPSGPE connected to a host microcontroller. ................... 13 Figure 4. Typical application circuit of SPSGPE connected to a host computer via USB. ............. 13 Figure 5. Example of SPSGPE layout........................................................................................... 13 Figure 6. Recommended SPSGPE footprint. ................................................................................ 18 Figure 7. Soldering profile. ............................................................................................................ 19 Figure 8. Package mechanical data…………………………………………………………… 21 February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 4/27 1 Description SPSGPE is a hardware LGA-SMT module for easy development of high performance wireless network applications for a wide range of applications. Compact-sized, low power and fully integrated, SPSGPE is available in 3 versions: SPSGPE-433 operating on ETSI 433 MHz band SPSGPE-868 operating on ETSI 868 MHz band SPSGPE-915 operating FCC 915 MHz band. All versions have the same pin-out and mechanical shape. SPSGPE is based on SPIRIT1 RF sub-GHz transceiver (with integrated SMPS) and STM32L151RDY6 microcontroller by ST Microelectronics. Balun and filtering network are embedded in the module. An external antenna can be connected through one pin of the module which requires an impedance-controlled track of 50 Ω. The UART host interface and USB device interface allow simple connection to an external microcontroller with a standard firmware or a host computer, enabling AT commands to facilitate RF configuration, data transmission and reception, using simple point-to-point communication. Selected STM32L1 GPIO and peripherals are available to interface external devices and enable user applications. Advanced features of SPIRIT1 radio are also accessible. SPSGPE is designed and engineered to build OEM solutions and applications primarily in the following domains: Internet of Things (IoT) and Machine-to-Machine (M2M); Smart Cities; Smart Grids and Energy Management; Home & Building Automation; Wireless Sensor Networks; Data acquisition equipment management; Industrial condition and asset monitoring. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 5/27 2 Hardware specifications Unless otherwise specified, typical data are based on T A = 25 °C, VDD = 3.3 V. 2.1 Recommended operating conditions Symbol Parameter TA Operating ambient temperature range VDD Operating supply voltage (1) Min. Typ. Max. Unit -40 +85 °C 1.9 3.3 3.6 433.05 434.79 MHz FREQ RF frequency 1 for SPSGPE-433 FREQ RF frequency 1 in ETSI band for SPSGPE-868 868 868.6 MHz FREQ RF frequency 2 in ETSI band for SPSGPE-868 869.4 869.65 MHz FREQ RF frequency 1 in FCC band for SPSGPE-915 902.0 928.0 MHz (1) USB is not functional below VDD=2.0V. Should be USB compliant from I/O voltage standpoint, the minimum VDD is 3.0 V. For further details, please refer to STM32L151RDY6 datasheet. Table 1. Recommended operating conditions. 2.2 Absolute maximum ratings Symbol Parameter Min. Typ. Max. Unit TSTG Storage temperature range -40 +85 °C VDD Operating supply voltage -0.3 3.9 VIO I/O pin voltage -0.3 5.5 Table 2. Absolute maximum ratings. 2.3 I/O operating specifications Symbol (1) VIL VIH (1) Parameter Min. Typ. Max. Unit I/O input low level voltage -0.3 0.3 VDD I/O input high level voltage 0.7 VIN VDD+0.3 (1) For further details, please refer to STM32L151RDY6 datasheet, I/O port features. Table 3. I/O operating specificat February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 6/27 2.4 Current consumption Symbol Parameter Test conditions Operating mode TX, +11 dBm, freq. 868MHz Operating mode IDD Supply current TX, +10.5 dBm, freq. 915MHz Operating mode IDD Supply current TX, +10 dBm, freq. 433MHz Operating mode IDD Supply current RX, freq. 868MHz Operating mode IDD Supply current RX, freq. 915MHz Operating mode IDD Supply current RX, freq. 433MHz Stand-by (Radio off, STM32L151RDY6 in Stop IDD Supply current mode with RTC) Table 4. Current consumption. IDD Supply current Typ. 27 Unit mA 39 mA 24 mA 19 mA 28 mA 18 mA µA 2.5 RF compliance limits RF compliance limits for CE and FCC certifications, referring to factory loaded firmware. If applying a custom firmware, please ensure these limits are not exceeded, voiding CE and FCC certifications. Standards FCC Part 15.207 (1) FCC Part 15.247 (1) EN 300 220-2 V2.4.1 Parameter Max. Unit Data rate 50 kbps Output power (2) EN 301 489-01 V1.9.2 (2) EN 301 489-03 V1.4.1 (2) (ETSI 868 MHz and FCC 915 MHz band) Output power (ETSI 433 MHz band) Modulation +10.5 dbm +10 GFSK (1) FCC standards are only applicable to SPSGPE-915 operating in the FCC 915 MHz band (2) EN standards are only applicable to SPSGPE-433 and SPSGPE-868 operating in the ETSI 433MHz and ETSI 868MHz respectively. Table 5. RF compliance limits. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 7/27 2.6 RF sensitivity data RF sensitivity data for all the versions of SPSGPE are reported in Table 6. Parameter SPSGPE version Sensitivity (1% BER) SPSGPE-433 Sensitivity (1% BER) SPSGPE-868 Sensitivity (1% BER) SPSGPE-915 Test conditions FREQ = 434 MHz, Data Rate = 50 kbps (25 kHz dev. CH Filter=125kHz), VDD = 3.3 V, TA = 25°C Spirit1 SMPS enabled FREQ = 868 MHz, Data Rate = 50 kbps (25 kHz dev. CH Filter=125kHz), VDD = 3.3 V, TA = 25°C Spirit1 SMPS enabled FREQ = 915 MHz, Data Rate = 50 kbps (25 kHz dev. CH Filter=125kHz), VDD = 3.3 V, TA = 25°C Spirit1 SMPS enabled Typ. Unit -98 dBm -104 dBm -105 dBm Table 6 RF sensitivity data. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 8/27 2.7 Pin assignment Pin Name Type Description (4) I/O I/O I/O I/O I/O I2C1_SDA (4) I/O TP10 STAT_LED TP11 USB_DEV_CONN TP12 TP13 GPIO_8 GPIO_10 I/O I/O TP14 PWR_MON TP15 TP16 TP17 GPIO_14 SWCLK GND I/O Power TP18 USB_P / RTS I/O TP19 USB_N / CTS I/O TP20 TP21 TP22 TP23 TP24 TP25 TP26 TP27 TP28 TP29 TP30 TP31 TP32 TP33 TP34 TP35 UART2_RX UART2_TX GPIO_9 (4) SPI_MISO (4) SPI_MOSI RI (4) SPI_CLK VDD DTR TX_AUX ADC_01 GPIO_6 GPIO_5 ON/OFF UART1_RX UART1_TX I/O I/O I/O I/O Power I/O I/O I/O I/O I/O TP36 ALARM/GPIO_1 I/O TP37 GPIO_4 I/O TP38 GPIO_2/RF_TX_MON TP39 TP40 TP41 TP42 RX_AUX ADC_01 RESERVED GPIO_7 I/O I/O TP1 TP2 TP3 TP4 TP5 TP6 I2C1_SCL SWDIO GPIO_11 GPIO_12 GPIO_13 RESET TP9 February 2017 I C clock (3) or general purpose input/output (2) Serial wire I/O General purpose input/output General purpose input/output General purpose input/output Reset input, active low, internal pull-up (3) I C data in/out or general purpose input/output Status indicator LED Pull high, if USB is used/connected, pull low, if USB is not used/connected General purpose input/output General purpose input/output Power ON monitor, goes high if the module is powered on, goes low if the module is not powered General purpose input/output (2) Serial wire clock Ground USB DATA- or Request to send signal from DTE, depending on firmware configuration USB DATA+ or Clear to send signal to DTE, depending on firmware configuration Serial data input from DTE Serial data output to DTE General purpose input/output SPI MISO or general purpose input/output SPI MOSI or general purpose input/output Ring indicator to DTE SPI clock or general purpose input/output Supply input voltage Data terminal ready from DTE Auxiliary serial data output for debug/test ADC input or general purpose input/output General purpose input/output General purpose input/output Input for switching ON or OFF the module Serial data input Serial data output Alarm output or general purpose input/output General purpose input/output RF transmitter ON monitor or general purpose input/output Auxiliary serial data input for debug/test ADC input or general purpose input/output Must be left unconnected (for future uses) General purpose input/output STM32L151RDY6 (1) pin PB8 PA13 PB7 PC12 PA15 NRST PB9 PB6 PB5 PB4 PB3 PC11 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com PD2 PA14 PA12 PA11 PA10 PA9 PC6 PB14 PB15 PB12 PB13 PB2 PB10 PB0 PC5 PC4 PA0 PA3 PA2 PCO PC3 PC1 PB11 PB1 PA8 PA1 9/27 TP43 TP44 GPIO_3 GND I/O Power General purpose input/output Ground PC2 TP45 ANT I/O Connection pin for external antenna (50 Ω) TP46 GND Power Ground Table 7. Pin assignment. (1) For further details, please refer to STM32L151RDY6 datasheet, Pin descriptions section. (2) Do not use SWD interface for any reason, unless to intentionally erase module flash memory and install a different firmware image. Any attempt to use SWD interface will force an immediate flash memory full erase, leaving SPSGPE in a clean state. Please notice that “FW Copy Protection Level 1” of STM32L151RDY6 microcontroller is activated. (3) For I C operation at 100 kHz an external pull-up resistor of 4.7 kΩ needs to be used. For I C operation at 400 kHz an external pull-up resistor of 4.7 kΩ needs to be used. (4) Pin may be configured either as the function indicated in the pin name, or as general purpose input/output. 2.8 Pin placement Figure 1. Pin placement (top view of LGA pads placed on bottom side). February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 10/27 2.9 Memory resources Memory resources available in the STM32L151RDY6 microcontroller unit adopted in all SPSGPE versions are listed in Table 8. For further details, please refer to STM32L151RDY6 microcontroller unit datasheet and user manual, and SPSGPE user manual. Item (1) Flash Memory RAM (2) I/O Table 8. Memory resources. Value 384 kByte 48 kByte 39 channels (1) Amount of Flash memory available without any firmware installed on SPSGPE. To calculate the amount of available Flash memory with SPSGPE firmware, please refer to SPSGPE software user manual. For further details, please refer to STM32L151RDY6 datasheet. (2) The number of available I/O channels may change depending on actual hardware configuration. For further details, please refer to par. 0and 0. 2.10 Hardware block diagram Figure 1. Hardware block diagram February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 11/27 3 Hardware design 3.1 Pin usage If used with default firmware and interfaced to a host microcontroller unit, SPSGPE requires minimum power, ground and UART to transmit and receive signals, that is to be connected. Other signals are optional and provide additional functionality. Unused signals must be left unconnected. In case the module is connected to a host microcontroller unit, SPSGPE pins requiring connections are outlined in Table 9. Pin TP27 TP17 TP44 TP46 TP21 TP20 TP18 TP33 TP6 TP45 (1) Name VDD Description Supply input voltage Optional No GND Ground No UART2_TX UART2_RX Serial data output to DTE Serial data input from DTE Request to send signal from DTE, if used. USB_P / If flow controls are not used, this pin must be connected to RTS GND. It could be left floating, if USB is supported by firmware. (1) Input for switching ON or OFF the module ON/OFF (toggle command) (1) RESET Reset input, active low, internal pull-up ANT Connection pin for external antenna (50 Ω) Open drain connection is required. No No Yes Yes No No Table 9. SPSGPE pins requiring connections, when the module is connected to a host microcontroller unit. In another typical application circuit, SPSGPE is connected to a host computer through a standard USB connector. In this case, module pins requiring connections are listed in Table 10. Pin TP27 TP17 TP44 TP46 TP18 TP19 Name VDD Description Supply input voltage Optional No GND Ground No USB Data– (90 Ω differential) No USB Data+ (90 Ω differential) No Input for detecting the connection to the USB cable. TP11 No Pull it high when USB cable is connected. Input for switching module ON or OFF TP33 ON/OFF Yes (toggle command) TP6 RESET Reset input, active low, internal pull-up No TP45 ANT Connection pin for external antenna (50 Ω) No Table 10. SPSGPE pins requiring connections, when the module is connected to a host computer via USB. USB_P / RTS USB_N / CTS USB_DEV_CO NN February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 12/27 3.2 Typical application circuits In a typical application circuit, SPSGPE is connected to a host microcontroller unit through a standard UART to transmit and receive signals. This application is pictured in Figure 2. Figure 2. Typical application circuit of SPSGPE connected to a host microcontroller. Please notice that “USB / RTS” could be left floating if USB is supported by firmware. In another typical application circuit, SPSGPE is connected to a host computer through a standard USB connector. This application is pictured in Figure 3. Figure 3. Typical application circuit of SPSGPE connected to a host computer via USB. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 13/27 NOTE: when using the SPSGPE in a USB self-powered application, USB back-voltage test requirement must be met (i.e. a maximum of 400 mV may be measured on the VBUS, D+, or D- when the device is not plugged into a USB port). For this purposes, SPSGPE requires to receive on the pin USB_DEV_CONN a signal indicating, when set at high logical level, that the VBUS is detected in order to properly control the internal pull-up resistor connected to D+ line available internally to the STM32L151RDY6. For further details, please refer to STM32L151RDY6 datasheet. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 14/27 Special features are enabled by the following pins: - STAT_LED (pin TP10): output to drive an external LED and indicated status of SPSGPE connections. If this pin is used as output to an external LED, possible outputs are listed in Table 11. LED Output Periodic single flashing with long ON time and short OFF time. Periodic single flashing with short ON time and long OFF time. Description Application is waiting for commands from DTE. Periodic fast double flashing. Application has started and SPSGPE is connected to a gateway. Application has started and SPSGPE is seeking for connection. Table 11. Outputs to external LED by pin STAT_LED (TP10). RESET (pin TP6): internal pulled-up signal for resetting SPSGPE. It has to be tied low for at least 100 ms and then released to perform SPSGPE unconditional hardware restart. Please notice that unconditional hardware restart must not be used during normal device operation, since it does not detach the device from the network. It shall be kept as emergency exit procedure in the rare case the module gets stacked waiting for network response. It is suggested to implement unconditional hardware restart (through a GPIO of the host microcontroller unit, to be configured as open drain or through a push button) on SPSGPE applications only as emergency exit procedure. ON/OFF (pin TP33): it performs the turning on/off procedure for SPSGPE when voltage supply at VDD (pin 27) stands within recommended operating range (please refer to Table 1). To start the turning off procedure when the module is turned on, the ON/OFF signal needs to be tied low for at least 2 seconds. Similarly, to start the turning on procedure when the module is turned off, the ON/OFF signal needs to be tied low for at least 2 seconds. The turning on/off procedure can also be performed via AT commands (please refer to SPSGPE software guide). PWR_MON (pin TP14): output signal indicating SPSGPE power status. It climbs high when SPSGPE is properly powered on, and it climbs down when SPSGPE is not powered. USB_DEV_CONN (pin TP11): input signal to detect USB cable connections. It has to be high when USB is connected, and low when USB is disconnected. Considering a 5 V tolerant pin, it is recommended to connect it to the VBUS pin of USB connector with proper protection and filtering network, adopting components like diode, ferrite bead and capacitors. If USB is used, UART interface to DTE is automatically disabled. To re-enable UART, this pin has to be tied low. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 15/27 3.3 Layout guidelines When adopting SPSGPE, please consider the following guidelines for a correct PCB design: 1. A minimum four-layer PCB is suggested. 2. At least one of the PCB layers should be used to implement a copper ground plane without cuts. 3. Copper planes and/or heavy traces are recommended to implement power supply connections. 4. Decoupling capacitors (recommended values are 100 nF and 10 µF in parallel) have to be placed very close to power supply pins. 5. Routing of traces (especially noisy and high frequency ones) across the power supply should be avoided. 6. The ANT pin (pin TP45) needs to be used for connecting the module to an external antenna. Its related RF ground is represented by pins TP44 and TP46. A trace having a controlled impedance of 50 Ω needs to be used to connect the ANT pin (pin TP45) to an external antenna (microstrip or grounded coplanar waveguide solutions of 50 Ω are suggested). 7. Routing of traces (especially noisy, high frequency and power supply ones) near or across the connection between the ANT pin (pin TP45) and the external antenna should be avoided. 8. Connection of all ground metallization and/or layers should have as many vias as possible. Number and density of these vias should be increased in the connection area between the ANT pin (pin TP45) and the external antenna. 9. A differential trace of 90 Ω needs to be used to connect pins TP18 and TP19 (USB_P / RTS and USB_N / CTS, respectively) to a USB connector, in case they are used as USB traces. It is also strongly recommended to follow all hardware and layout guidelines by USB standards. An example of SPSGPE layout is pictured in Figure 4. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 16/27 Figure 4. Example of SPSGPE layout. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 17/27 3.4 Recommended footprint Figure 5. Recommended SPSGPE footprint. All dimensions are in millimeters. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 18/27 3.5 Module reflow installation SPSGPE is a surface mount module supplied on a 46-pin, 6-layer PCB, with gold surface finish. Final assembly recommended reflow profile is outlined below, based on IPC/JEDEC JSTD-020C, July 2004 recommendations. Profile feature Average ramp-up rate (TSMAX to TP) Preheat: - Temperature min (TS min.) - Temperature max (TS max.) - Time (TS min. to TS max.) (tS) Time maintained above: - Temperature TL - Temperature TL Peak temperature (TP) Time within 5°C of actual peak temperature (T P) Ramp-down rate Time from 25°C to peak temperature Lead-free assembly 1.7°C/sec max 150°C 200°C 60-100 sec (suggested: 85 sec) 217 °C 60-100 sec (suggested: 99 sec) 242 °C 10-20 sec 2°C/sec 8 minutes max. Table 12. Soldering profile. Figure 6. Soldering profile. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 19/27 4 Module operation SPSGPE software architecture is based on SPSGPE.OS operating system and provides a set of precompiled firmware libraries to manage module operation. Two operational modes are supported: SPSGPE working as a “communication module”, using AT/HDLC commands; SPSGPE working as a “standalone module”, running embedded standalone application. When using SPSGPE as a communication module, the module acts as a wireless RF module. SPSGPE.OS operating system handles SPSGPE internal transceiver and any external device connected to it, providing mesh routing connectivity. Thus, it allows to configure SPSGPE either as a node or as a gateway, enabling different application domains including and not limited to low-power applications. This operational mode enables module configuration and status interrogation, and supports two different high-level communication interfaces: AT command set and HDLC command interface. AT and HDLC command interfaces assume communications with an external host processor via USB and/or UART serial interfaces, in a scenario where SPSGPE acts as an RF modem device and the user application runs on the host processor. The two types of command modes are briefly described below: AT command: it implements a set of AT commands compliant with Hayes standard AT command set and expanded through Paradox Engineering proprietary AT command set for special purposes. HDLC command: it offers a fast optimized binary HDLC protocol with a set of HDLC commands for managing and controlling SPSGPE. When using SPSGPE as a standalone module, the user can develop its own application code and link it to SPSGPE.OS, or customize a standard SPSGPE application firmware image through the scripting tool. Once developed with the scripting tool, compiled script programs can be uploaded and executed under the control of SPSGPE Script Engine. For further details about SPSGPE software architecture, command and operating modes, please refer to SPSGPE Application and Software – User Guide (document reference: tbd) February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 20/27 5 Package mechanical data Figure 7. Package mechanical data. All dimensions are in millimeters. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 21/27 6 Regulatory compliance NOTE: this section will be completed and confirmed after the certification process is done. 6.1 CE certification SPSGPE-433 and SPSGPE-868 are certified in accordance with the following standards: EN 300 220-2 V2.4.1 EN 301 489-01 V1.9.2 EN 301 489-03 V1.6.1 Receiver category: Class 2 receiver. 6.2 FCC certification SPSGPE-915 is certified in accordance with the following standards: FCC Part 15.207 FCC Part 15.247 FCC ID: S9NSPSGPE 6.3 IC certification SPSGPE-915 is certified in accordance with the following standards: RSS-247 Issue 1 IC ID: 8976C-SPSGPE (Please, refer to Appendix A of this document for the French translation). February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 22/27 6.4 Labeling instructions When integrating SPSGPE-915 into a finished product, the OEM must ensure that FCC labeling requirements are satisfied. A statement must be placed over the finished product to indicate it includes a certified module. The label should state the following (or similar wording that conveys the same meaning): Contains FCC ID: S9NSPSGPE OR This product contains FCC ID: S9NSPSGPE The OEM must place the following statements over the finished product unless it is too small (e.g. less than 4 x 4 inches): This device complies with Part 15 of FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including any interference that may cause undesired operation. When integrating SPSGPE-915 into a finished product, the OEM must ensure that IC labeling requirements are satisfied. A statement must be placed over the finished product to indicate it includes a certified module. The label should state the following (or similar wording that conveys the same meaning): Contains IC ID: 8976C-SPSGPE OR This product contains IC ID: 8976C-SPSGPE The OEM must place the following statements over the finished product unless it is too small (e.g. less than 4 x 4 inches): This device complies with RSS-247 of IC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including any interference that may cause undesired operation. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 23/27 6.5 Product manual instructions This paragraph applies to OEM finished products containing SPSGPE and subject to FCC compliance. The finished product manual must contain the following statement (or similar wording that conveys the same meaning): WARNING: Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. In cases the OEM seeks Class B (residential) limits for the finished product, the following statement must be included in the finished product manual: NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with given instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur under certain circumstances. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: – Reorient or relocate the receiving antenna. – Increase the separation between the equipment and receiver. – Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. – Consult the dealer or an experienced radio/TV technician for help. In cases the OEM seeks Class A digital device category for the finished product, the following statement must be included in the finished product manual: NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expenses . February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 24/27 7 Ordering information Product name EAN code SPSGPE-433 tbd SPSGPE-868 tbd SPSGPE-915 tbd Description Version operating on ETSI 433 MHz band (Region 1, Europe) Version operating on ETSI 868 MHz band (Region 1, Europe Version operating on FCC 915 MHz band (Region 2, The Americas) Table 13. Ordering information. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 25/27 Appendix A Déclaration de conformité A.1 Certification FCC Le module SPSGPE-915 a été testé et déclaré conforme avec la section 15 de la Règlementation FCC. Ces limitations sont stipulées afin de procurer une protection raisonnable contre les interférences gênantes dans les installations approuvées. Cet appareil génère, utilise et diffuse des ondes radio et, s’il n’est pas installé et utilisé en conformité avec les instructions dont il fait l’objet, peut causer des interférences gênantes sur les communications radio. Il n’y a cependant pas de garantie qu’une interférence ne se produira pas dans une installation particulière. Cet appareil est en conformité avec la section 15 des règlements FCC. L’utilisation est soumise aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférences nocives, et (2) Cet appareil doit supporter toute interférence reçue, y compris des interférences qui peuvent provoquer un fonctionnement non désiré. Tout changement ou modification fait(e) à cet appareil et non expressément approuvé(e) par STMicroelectronics peut annuler l’autorisation pour l’utilisateur de faire fonctionner l’appareil. Approbation du module FCC ID: S9NSPSGPE Conformément à la section 15 des règlements FCC, le module SPSGPE-915 est répertorié comme un dispositif émetteur modulaire. Ce module n’est évalué que pour une utilisation autonome. Les produits finis incorporant plusieurs émetteurs doivent être conformes à la colocation et aux exigences d'exposition RF en concordance avec les procédures FCC multi-émetteurs. D’autres émetteurs fonctionnant dans des dispositifs portables exposés aux RF (par exemple, situés à moins de 20 cm des personnes avec dispositifs portatifs ou portés contre le corps) peuvent nécessiter d'une approbation séparée. A.1.1 Instructions d'étiquetage Lors de l'intégration du module SPSGPE-915 dans le produit final, le fabricant doit s’assurer que les exigences en matière d'étiquetage de la FCC sont satisfaites. Une déclaration doit être placée sur l’étiquette extérieure du produit final indiquant que le produit comprend un module certifié. L'étiquette doit comporter les informations suivantes (ou une mention analogue que recouvre la même notion): OU Contient FCC ID: S9NSPSGPE Ce produit contient FCC ID: S9NSPSGPE Le sous-traitant doit inclure les énoncés suivants sur l’étiquette extérieure du produit final à moins que le produit ne soit trop petit (par exemple moins de 4 x 4 pouces): Cet appareil est en conformité avec la section 15 des règlements FCC. L’utilisation est soumise aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférences nocives, et (2) Cet appareil doit supporter toute interférence reçue, y compris des interférences qui peuvent provoquer un fonctionnement non désiré. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 26/27 A.1.2 Instructions pour l’utilisation du produit La présente section concerne les produits finis contenant le module SPSGPE-915, assujettis aux normes FCC. Le manuel du produit final doit contenir la déclaration suivante (ou une mention analogue que recouvre la même notion): “ Avertissement: Les changements ou modifications non expressément approuvés par la partie responsable de la conformité pourraient annuler l'autorisation de l'utilisateur de faire fonctionner cet équipement. (Section 15.21)” Dans le cas où le produit finis d’un fabriquant OEM rentre dans les limites de la Classe B (résidentiel), les énoncés suivants doivent être inclus dans le manuel du produit finis: “Remarque : Cet équipement a été testé et déclaré conforme aux limitations prévues dans le cadre de la classe B des appareils numériques, définies par la section 15 du règlement de la FCC. Ces limites sont conçues pour fournir une protection raisonnable contre toute interférence dangereuse issue d'une installation résidentielle. Cet équipement produit, utilise et peut émettre de l'énergie radio électrique et, s'il n'est pas installé et utilisé conformément aux présentes instructions, peut causer des interférences nuisibles aux communications radio. Cependant, il se peut que des interférences se produisent dans une installation particulière. Si cet appareil cause des interférences nuisibles à la réception des signaux de radio ou de télévision, ce qui peut être déterminé en allumant et en éteignant l'appareil, on encourage l'utilisateur d'essayer de corriger ces interférences par l'un des moyens suivants: – Réorienter ou repositionner l'antenne de réception. – Augmenter la distance séparant l’équipement du récepteur. – Connecter l’équipement à une prise appartenant à un circuit différent de celui sur lequel le récepteur est connecté. – Consulter le revendeur ou un technicien radio/TV expérimenté pour obtenir de l’aide.” Dans le cas où le produit fini d’un sous-traitant rentre dans les limites imposées aux appareils numériques de classe A, les énoncés suivants doivent être inclus dans le manuel du produit finis: “REMARQUE : Cet appareil a été testé et certifié conforme aux spécifications d'un appareil électronique de classe A (class A digital device), conformément à la partie 15 du règlement de la FCC. Ces contraintes sont destinées à fournir une protection raisonnable contre les interférences nuisibles quand l'appareil est utilisé dans une installation commerciale. Cet équipement produit, utilise et peut émettre de l'énergie radio électrique et, s'il n'est pas installé et utilisé conformément aux présentes instructions, peut causer des interférences nuisibles aux communications radio. L'utilisation de cet appareil dans une installation résidentielle peut entraîner des interférences nuisibles et l'utilisateur devra corriger les interférences à ses propres frais.” February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 27/27 A.2 Certification IC (a) Le module SPSGPE-915 a été testé et déclaré conforme avec la Règlementation IC CNR-210. Ces limitations sont stipulées afin de procurer une protection raisonnable contre les interférences gênantes en installations approuvées. Cet appareil génère, utilise et diffuse des ondes radio et, s’il n’est pas installé et utilisé en conformité avec les instructions dont il fait l’objet, peut causer des interférences gênantes sur les communications radio. Il n’y a cependant pas de garantie qu’une interférence ne se produira pas dans une installation particulière. Ce produit répond aux exigences de la norme CNR-210 d'Industrie Canada. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférences nocives, et (2) Cet appareil doit supporter toute interférence reçue, y compris des interférences qui peuvent provoquer un fonctionnement non désiré. Tout changement ou modification fait(e) à cet appareil et non expressément approuvé(e) par STMicroelectronics peut annuler l’autorisation pour l’utilisateur de faire fonctionner l’appareil. Approbation du module IC: 8976C-SPSGPE Conformément à IC CNR-210, le module SPSGPE-915 est répertorié comme un dispositif émetteur modulaire Ce module n’est évalué que pour une utilisation autonome. Les produits finis incorporant plusieurs émetteurs doivent être conformes à la colocation et aux exigences d'exposition RF en concordance avec les procédures FCC multi-émetteurs. D’autres émetteurs fonctionnant dans des dispositifs portables exposés aux RF (par exemple, situés à moins de 20 cm des personnes avec dispositifs portatifs ou portés contre le corps) peuvent nécessiter d'une approbation séparée. A.2.1 Instructions d'étiquetage Lors de l'intégration du module SPSGPE-915 dans le produit final, le fabricant doit s’assurer que les exigences en matière d'étiquetage de la IC sont satisfaites. Une déclaration doit être placée sur l’étiquette extérieure du produit final indiquant que le produit comprend un module certifié. L'étiquette doit comporter les informations suivantes (ou une mention analogue que recouvre la même notion): Contient IC ID: 8976C-SPSGPE OU Ce produit contient IC ID: 8976C-SPSGPE Le sous-traitant doit inclure les énoncés suivants sur l’étiquette extérieure du produit final à moins que le produit ne soit trop petit (par exemple moins de 4 x 4 pouces): Cet appareil est en conformité aux normes IC. L’utilisation est soumise aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférences nocives, et (2) Cet appareil doit supporter toute interférence reçue, y compris des interférences qui peuvent provoquer un fonctionnement non désiré February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 28/27 A.2.2 Instructions pour l’utilisation du produit La présente section concerne les produits finis contenant le module SPSGPE-915, assujettis aux normes IC. Le manuel du produit final doit contenir la déclaration suivante (ou une mention analogue que recouvre la même notion): “Avertissement: Les changements ou modifications non expressément approuvés par la partie responsable de la conformité pourraient annuler l'autorisation de l'utilisateur de faire fonctionner cet équipement. (CNR-210)” Dans le cas où le produit finis d’un fabriquant OEM rentre dans les limites de la Classe B (résidentiel), les énoncés suivants doivent être inclus dans le manuel du produit finis: “ Remarque : Cet équipement a été testé et déclaré conforme aux limitations prévues dans le cadre de la classe B des appareils numériques, définies par la norme CNR-210 d'Industrie Canada. Ces limites sont conçues pour fournir une protection raisonnable contre toute interférence dangereuse issue d'une installation résidentielle. Cet équipement produit, utilise et peut émettre de l'énergie radio électrique et, s'il n'est pas installé et utilisé conformément aux présentes instructions, peut causer des interférences nuisibles aux communications radio. Cependant, il se peut que des interférences se produisent dans une installation particulière. Si cet appareil cause des interférences nuisibles à la réception des signaux de radio ou de télévision, ce qui peut être déterminé en allumant et en éteignant l'appareil, nous encourageons l'utilisateur à essayer de corriger ces interférences par l'un des moyens suivants: – Réorienter ou repositionner l'antenne de réception. – Augmenter la distance séparant l’équipement du récepteur. – Connecter l’équipement à une prise appartenant à un circuit différent de celui sur lequel le récepteur est connecté. – Consulter le revendeur ou un technicien radio/TV expérimenté pour obtenir de l’aide.” Dans le cas où le produit finis d’un fabriquant OEM rentre dans le cadre des limites imposées aux appareils numériques de classe A, les énoncés suivants doivent être inclus dans le manuel du produit finis: “ REMARQUE: Cet appareil a été testé et certifié conforme aux spécifications d'un appareil électronique de classe A (class A digital device), conformément à la norme CNR-210 d'Industrie Canada. Ces contraintes sont destinées à fournir une protection raisonnable contre les interférences nuisibles quand l'appareil est utilisé dans une installation commerciale. Cet équipement produit, utilise et peut émettre de l'énergie radio électrique et, s'il n'est pas installé et utilisé conformément aux présentes instructions, peut causer des interférences nuisibles aux communications radio. L'utilisation de cet appareil dans une installation résidentielle peut entraîner des interférences nuisibles et l'utilisateur devra corriger les interférences à ses propres frais.” February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 29/27 A.3 Certification CE Le module SPSGPE a obtenu une certification de conformité aux normes suivantes: – EN 300 328 V1.8.1 :2012 – EN 300 328 V1.9.1 :2015 – EN 301 489-17 V2.2.1 :2009 – EN 301 489-1 V1.9.2:2011 – EN 62479 :2010 – EN60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2 :2013 Le module est certifié CE. February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 30/27 February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 31/27 Appendix 1 Date 2016-09-15 2016-10-11 2017-02-16 Document revision history Revision 1.0 1.1 1.2 Changes First release by A.R. By A.R. Table 14. Document revision history February 2017 DocID0xxxxx Rev 0.xx This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com 32/27 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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