ST Microelectronics S R L ZB32C1 SPZB32Wxy1.z series IEE802.15.4 / ZigBee® Module User Manual SPZB32Wxy1 z

ST Microelectronics S.R.L. SPZB32Wxy1.z series IEE802.15.4 / ZigBee® Module SPZB32Wxy1 z

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DRAFT28 July 2011 Doc ID xxxxx Rev 1 1/1919SPZB32Wxy1.z802.15.4 ZigBee® modules based on the STM32W chipsetFeatures■2.4 GHz IEEE 802.15.4-compliant SMD modules based on the ST STM32W chipset solution featuring:– Integrated 2.4 GHz transceiver– PHY and MAC IEEE 802.15.4 features– Integrated ARM® Cortex-M3 core– Integrated embedded Flash and RAM– Integrated encryption (AES-128) accelerator■Power amplified RF performances:– Up to 20 dBm nominal TX output power– Up to 105 dBm RX sensitivity■Robust Wi-Fi and Bluetooth® coexistence■16 channels (IEEE 802.15.4 channel 11 to 26)■Multiple configurable interfaces available (UART, SPI, I2C, ADC, GPIOs)■Industry standard JTAG programming■Onboard 24 MHz and 32.768 kHz stable Xtal■Less than 2 uA typ power consumption in deep sleep mode (32.768 Xtal)■Multiple antenna options: integrated antenna or integrated UFL connector■Multiple Protocol Stack Options■Single voltage supply (2.1 to 3.6 V)■FCC and CE compliant qualified■Small Form Factor : 16.4 x 26.5 mm■Operating temperature range: -40 °C to +85 °Cwww.st.com

DRAFTContents SPZB32Wxy1.z2/19 Doc ID xxxxx Rev 1Contents1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65.1 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116.2 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116.3 DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116.4 Digital I/O specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126.5 RF electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149 Product approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159.1 FCC approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159.1.1 FCC labeling requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 169.2 European certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1610 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1711 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

SPZB32Wxy1.z DescriptionDoc ID xxxxx Rev 1 3/19 DRAFT1 DescriptionSPZB32Wxy1.z is a series of ready-to-use IEEE 802.15.4/ZigBee compliant and power amplified RF modules optimized for embedded applications that require low data rate communications and high transmission range capabilities based on the STM32W single chip that integrates a 2.4 GHz, IEEE 802.15.4-compliant transceiver together with an ARM® Cortex embedded processor . The modules are very compact and enable OEMs to easily add wireless capabilities to electronics devices by optimizing time-to-market, cost, size, and consumption of their target applications. No RF experience or expertise is required to add this powerful networking capability to the final product.24 MHz high stability Xtal is available aboard the modules to perform the timing requirements as per IEEE 802.15.4/ZigBee® specifications; additionally a 32.768kHz Xtal is also provided onboard for low power operation.A single supply voltage is requested to power the modules. The supply is in the range of 2.1 to 3.6 V. The voltage supply also determines the I/O ports level allowing an easy interface with additional peripherals. An advanced solution integrating PA and LNA in a single package is aboard to ensure excellent power transmission and receiver sensitivity performances. To support user defined applications, a number of peripherals such as GPIO, UART, I2C, ADC and general purpose timers are available and user selectable. The size and footprint of this series of modules is equivalent to that of the series SPZB32Wxy2.z to facilitate the evaluation of the different range options on the target application.The series groups multiple versions that differ in terms of memory size , antenna (ceramic antenna or integrated u.fl connector for the connection of an external antenna) and stacks options (ZigBee, RF4CE, SimpleMAC).The SPZB32W1y1.z versions are based on the STM32W108CB chipset integrating 128 kB of embedded flash memory and 8 kB of RAM available for data and program storage. For technical details on the STM32W108CB chipset refer to the related datasheet. For technical details on the supported stacks refer to the related user guide and application notes.

DRAFTRoHS compliance SPZB32Wxy1.z4/19 Doc ID xxxxx Rev 12 RoHS complianceST modules are RoHS compliant and comply with ECOPACK® norms.3 Application●Smart energy applications●Machine2Machine industrial control●Wireless sensor networks●Home/building automation●Smart appliances●Wireless alarms and security systems●Lighting control●Remote monitoring

SPZB32Wxy1.z Block diagramDoc ID xxxxx Rev 1 5/19 DRAFT4 Block diagramFigure 1. SPZB32WxA1.z block diagramFigure 2. SPZB32WxC1.z block diagram- (Z8TAL34- 73OC6DD*TAG'0)/S3YSTEM3IGNALS2&ANTENNAK(Z8TAL"0&".W,.!0! - (Z8TAL34- 73O#6DD*TAG'0)/S3YSTEM3IGNALS5&)#ONNECTORK(Z8TAL"0&".W,.!0! 

DRAFTPin settings SPZB32Wxy1.z6/19 Doc ID xxxxx Rev 15 Pin settings5.1 Pin connectionsFigure 3. Pin connection diagramTOP VIEWAntennaAM09235V1

DRAFTSPZB32Wxy1.z Pin settingsDoc ID xxxxx Rev 1 7/195.2 Pin description Table 1. Pin description Module pin n° Pin name Direction STM32W pin Description1PB5 I/O 43 Digital I/OADC0 Analog 43 ADC Input 0TIM2CLK I 43 Timer 2 external clock inputTIM1MSK I 43 Timer 1 external clock mask input2PA5 I/O 27 Digital I/OADC5 Analog 27 ADC Input 1PTI_DATA O 27 Frame signal of PTI (Packet Trace Interface) nBOOTMODE I 27 Embedded serial bootloader activation out of resetTRACEDATA3 0 27 Synchrounus CPU trace data bit 33PA4 I/O 26 Digital I/OADC4 Analog 26 ADC Input 0PTI_EN O 26 Frame signal of PTI (Packet Trace Interface) TRACEDATA2 O 26 Synchrounus CPU trace data bit 24PA3 I/O 25 Digital I/OSC2nSSEL I 25 SPI SLAVE SELECT of Serial Controller 2TIM2_CH2 I/O 25 Timer 2 channel 2 output (or input - Disable remap with TIM2_OR[5])TRACECLK O 25 Synchrounus CPU trace clock5 nRESET I 12 Active low reset ( an internal pull-up of 30 kohm typ. is provided)6PB3 I/O 19 Digital I/OUART_CTS I 19 UART CTS handshake of Serial Controller 1SC1SCLK I/O 19 SPI slaver clock of Serial Controller SC1 / SPI master clock of Serial Controller SC1TIM2_CH3 I/O 19 Timer 2 channel 3 input / Timer 2 channel 3 output

DRAFTPin settings SPZB32Wxy1.z8/19 Doc ID xxxxx Rev 17PB4 I/O 20 Digital I/OUART_RTS O 20 UART RTS handshake of Serial Controller 1TIM2_CH4 I/O 20 Timer 2 channel 4 input / Timer 2 channel 4 outputSC1nSSEL I 20 SPI slave select of Serial Controller 18PA0 I/O 21 Digital I/OSC2MOSI O 21 SPI Master data out of Serial Controller 2SC2MOSI I 21 SPI Slave data in of Serial Controller 2TIM2_CH1 I/O 21 Timer 2 channel 1 input / Timer 2 channel 1 output9PA1 I/O 22 Digital I/OSC2MISO I 22 SPI Master data in of Serial Controller 2SC2MISO O 22 SPI Slave data out of Serial Controller 2SC2SDA I/O 22 TWI (I2C) data of Serial Controller 2TIM2_CH3 I/O 22 Timer 2 channel 3 input / Timer 2 channel 3 output10 PA2 I/O 24 Digital I/OSC2SCLK O 24 SPI Master clock of Serial Controller 2SC2SCLK I 24 SPI Slave clock of Serial Controller 2SC2SCL I/O 24 TWI (I2C) clock of Serial Controller 2TIM2_CH4 I/O 24 Timer 2 channel 4 input / Timer 2 channel 4 output11 GND -- 49 Ground12 VDD Power 16,23,28,37 Input power supply 13PC1 I/O 38 Digital I/OADC3 Analog 38 ADC Input 3SWO O 38 Serial Wire Output ayncronous trace output to debugger TRACEDATA0 O 38 Syncronous CPU trace data bit 0Table 1. Pin description (continued)Module pin n° Pin name Direction STM32W pin Description

DRAFTSPZB32Wxy1.z Pin settingsDoc ID xxxxx Rev 1 9/1914PB0 I/O 36 Digital I/OVREF (O/I) Analog 36 ADC reference output / ADC reference inputTIM1CLK I 36 Timer 1 external clock inputTIM2MSK I 36 Timer 2 external clock mask inputIRQA I 36 External interrupt source ATRACECLK O 36 Syncronous CPU trace clock15PB1 I/O 30 Digital I/OSC1TXD O 30 UART transmit data of Serial Controller 1SC1MOSI / SC1MISO O 30 SPI master data out of Serial Controller 1 / SPI slave data out of Serial Controller 1SC1SDA I/O 30 TWI (I2C) data of Serial Controller 1TIM2_CH1 I/O 30 Timer 2 channel 1 input / Timer 2 channel 1 output16PB2 I/O 31 Digital I/OSC1RXD I 31 UART receive data of Serial Controller 1SC1MISO / SC1MOSI I 31 SPI master data in of Serial Controller SC1 / SPI slave data in of Serial Controller 1SC1SCL I/O 31 TWI (I2C) clock of Serial Controller 1TIM2_CH2 I/O 31 Timer 2 channel 2 input / Timer 2 channel 2 output17 JTCK I 32 JTAG clock input from debuggerSWCLK I/O 32 Serial Wire clock input/output with debugger18PC2 I/O 33 Digital I/OJTDO O 33 JTAG data out to debuggerSWO O 33 Serial Wire Output asyncronous trace output to debugger19 PC3 I/O 34 Digital I/OJTDI I 34 JTAG data in from debugger20PC4 I/O 35 Digital I/OJTMS I 35 JTAG mode select from debuggerSWDIO I/O 35 Serial Wire bidirectional data to/from debuggerTable 1. Pin description (continued)Module pin n° Pin name Direction STM32W pin Description

DRAFTPin settings SPZB32Wxy1.z10/19 Doc ID xxxxx Rev 121PC0 I/O 40 Digital I/O (high current)JRST I 40 JTAG reset input from debuggerTRACEDATA1 O 40 Syncronous CPU trace data bit 1IRQD I 40 External interrupt source D22PB7 I/O 41 Digital I/OTIM1_CH2 O 41 Timer 1 channel 2 outputTIM1 _CH2 I 41 Timer 1 channel 2 inputIRQC I 41 External interrupt source CADC2 I 41 ADC input 223PB6 I/O 42 Digital I/OTIM1_CH1 O 42 Timer 1 channel 1 outputTIM1_CH1 I 42 Timer 1 channel 1 inputIRQB I 42 External interrupt source BADC1 Analog 42 ADC input 124LNA/ENABLE I 29Digital input, module firmware dependent, externally forced by the user dedicated firmware. This signal is dedicated to manage the SIGE-SE2432L internal LNA. (HIGH= internal LNA enabled, LOW= internal LNA disabled).PA6/LNA_ENABLE O 29Digital output, module firmware dependent, internally forced by application dedicated firmware. This signal is dedicated to manage the SIGE-SE2432L internal LNA. (HIGH= internal LNA enabled, LOW= internal LNA disabled).25RF_STANDBY I 18Digital input, module firmware dependent, externally forced by the user dedicated firmware. This signal is dedicated to manage the SIGE-SE2432L front-end STANDBY state. (HIGH= Front-end enabled, LOW= Front-end forced in the STANDBY state).PA7/RF_STANDBY O 18Digital output, module firmware dependent, internally forced by application dedicated firmware. This signal is dedicated to manage the SIGE-SE2432L front-end STANDBY state. (HIGH= Front-end enabled, LOW= Front-end forced into STANDBY state).Table 1. Pin description (continued)Module pin n° Pin name Direction STM32W pin Description

SPZB32Wxy1.z Electrical characteristicsDoc ID xxxxx Rev 1 11/19 DRAFT6 Electrical characteristics6.1 Absolute maximum ratings6.2 Recommended operating conditions6.3 DC electrical characteristicsTable 2. Absolute maximum ratingsSymbol Parameter Min. Max. UnitVDD Module supply voltage - 0.3 3.6 VVin Input voltage on any digital pin - 0.3 Vdd + 0.3 VTstg Storage temperature -40 +85 °CTsold Soldering temperature < 10s 250 °CTable 3. Recommended operating conditionsSymbol Parameter Conditions Min. Typ. Max. UnitVDD Module supply voltage -40 °C < T < +85 °C 2.1 3.3 3.6 VTstg Operating ambient temperature -40 +85 °CTable 4. DC electrical characteristicsSymbol Parameter Conditions Min. Typ. Max. UnitIRX RX current Vdd = 3.3 V, T= 25 °C - 20 - mAITX TX current Po = 18 dBm, Vdd = 3.3 V, T = 25 °C, F = 2450MHz -120 - mAIDS Deep sleep current(32.768 kHz oscillator) Vdd = 3.3 V, T = 25 °C - 1.3 - mA

DRAFTElectrical characteristics SPZB32Wxy1.z12/19 Doc ID xxxxx Rev 16.4 Digital I/O specifications6.5 RF electrical characteristicsTable 5. Digital I/O specificationsSymbol Parameter Conditions Min. Typ. Max. UnitVIL Low level input voltage 2.1 < Vdd < 3.6 V 0 0.5 x Vdd VVIH High level input voltage 2.1 < Vdd < 3.6 V 0.62 x Vdd Vdd VIil Input current for logic 0 2.1 < Vdd < 3.6 V -0.5 mAIih Input current for logic 1 2.1 < Vdd < 3.6 V 0.5 mARipu Input pull-up resistor 30 kΩRipd Input pull-down resistor 30 kΩVOL Low level output voltage 0 0.18 x Vdd VVOH High level output voltage 0.82 x Vdd Vdd VIOHS Output source current (standard) 4 mAIOLS Output sink current (standard) 4 mAIOHH Output source current (high current) 8 mAIOLH Output sink current (high current) 8 mAIOTot Total output current for I/O 40 mATable 6. Electrical characteristicsSymbol Parameter Conditions Min. Typ. Max. UnitFrequency range Vdd = 3.3 V, T= 25 °C 2405 2480 MHzTX Output power Vdd = 3.3 V, T= 25 °C 20 dBmRX Sensitivity Vdd = 3.3 V, 1 % PER -105 dBmAdjacent channel rejection ±5 MHz±10 MHZ3540 dBm

SPZB32Wxy1.z Mechanical dimensionsDoc ID xxxxx Rev 1 13/19 DRAFT7 Mechanical dimensions Figure 4. Mechanical dimensionsFigure 5. Pin land pattern (dimensions in mm)[SLWFK PP7ROHUDQFHV PP%277209,(:6FDOH7239,(:$QWHQQD[5(&200(1'('/$1'3$77(517239,(:SLWFK !-6

SPZB32Wxy1.z Product approvalsDoc ID xxxxx Rev 1 15/19 DRAFT9 Product approvalsThis series of modules has been designed to meet national regulations for world wide use. Different versions of modules belonging to the same series are orderable as it is specified in the Section 10. They differ in terms of integrated memory size and protocol stack enabled to run while sharing the same manufacturing , design and radios capabilities. As representative of the series from the RF design and radios capabilities, the versions using 128 kB Flash/8kB RAM and Zigbee PRO Protocol stack (i.e. SPZB32W1A1.1 and SPZB32W1C1.1) have been used during the certification tests. The following certifications have been obtained.9.1 FCC approvalsThe SPZB32W1A1.1 device, with integrated antenna, as well as the SPZB32W1C1.1, with the antenna specified in Ta b l e 8 , have been tested and found to comply with the limits for a Class B digital device , pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:●Reorient or relocate the receiving antenna●Increase the separation between the equipment and receiver●Connect the equipment into an outlet on a circuit different from that to which the receiver is connectedConsult the dealer or an experienced radio/TV technician for helpModule type: ZigBee® module SPZB32W1A1.1 / SPZB32W1C1.1FCC-ID: S9NZB32C1Modular type: single modular Any changes or modifications not expressed approved by the part responsible for compliance could cause the module to cease to comply with FCC rules part 15, and thus void the user’s authority to operate the equipment.While the applicant for a device into which the SPZB32W1A1.1 or the SPZB32W1C2.1 with the antenna specified in Ta b l e 8 installed is not required to obtain new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the end product.Table 8. Antenna used for FCC approvalsITEM Part N° Manufacturer1 2010B4844-01 (Titanis Antenna) Antenova

DRAFTProduct approvals SPZB32Wxy1.z16/19 Doc ID xxxxx Rev 19.1.1 FCC labeling requirementsWhen integrating the SPZB32W1A1.1 / SPZB32W1C1.1 into the final product, il must be ensured that the FCC labelling requirements, as specified below, are satisfied.Based on the Public Notice from FCC, the product into which our transmitter module is installed must display a label referring to the enclosed module. The label should use wording such as “Contains Transmitter module FCC ID: S9NZB32C1 or “Contains FCC ID: S9NZB32C1” , any similar wording that expressed the same meaning may be used.An example is:Contains FCC ID: S9NZB32C19.2 European certificationSPZB32W1A1.1 and SPZB32W1C2.1 devices are CE certified:Expert opinion N. xxx-xxxxxx released by IMQ refers to the following normative:Radio: EN300 328: V1.7.1:2006-10EMC: EN301 489 17 V2.1.1:2009Safety: EN60950-1:2006 + A11:20090051

SPZB32Wxy1.z Ordering information schemeDoc ID xxxxx Rev 1 17/19 DRAFT10 Ordering information schemeNote: Check availability of the different versions with your ST sales representative. Table 9. Ordering information schemeSPZB 32Wx y 1 .z802.15.4 / ZigBee modules Memory options: x --> 1: 128 kB Flash; 8 kB RAMx --> 2: 256 kB Flash; 16 kB RAMAntenna options:y --> A: Integrated ceramic antennay --> C: Integrated UFL connector1: Long TX rangeFirmware options:z --> 1: ZigBee PRO (EmberZnet)z --> 2: STM ZigBeez --> 3: RF4CEz --> 4: SimpleMACz --> 5: Zigbee IP

DRAFTRevision history SPZB32Wxy1.z18/19 Doc ID xxxxx Rev 111 Revision history Table 10. Document revision historyDate Revision Changes28-Jul-2011 1 Initial release