ST Microelectronics S R L ZB32C1 SPZB32Wxy1.z series IEE802.15.4 / ZigBee® Module User Manual SPZB32Wxy1 z

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Document ID	1573694
Application ID	iwsWn1TJtPqOHCC/IDItRg==
Document Description	Manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	38.82kB (485245 bits)
Date Submitted	2011-11-03 00:00:00
Date Available	2011-11-04 00:00:00
Creation Date	2005-10-20 10:47:30
Producing Software	Acrobat Distiller 7.0.5 (Windows)
Document Lastmod	2011-07-28 08:31:46
Document Title	SPZB32Wxy1.z.fm
Document Creator	FrameMaker 7.2
Document Author:	antonio zizzo

SPZB32Wxy1.z
802.15.4 ZigBeeÂŽ modules based on the STM32W chipset
2.4 GHz IEEE 802.15.4-compliant SMD
modules based on the ST STM32W chipset
solution featuring:
– Integrated 2.4 GHz transceiver
– PHY and MAC IEEE 802.15.4 features
– Integrated ARM® Cortex-M3 core
– Integrated embedded Flash and RAM
– Integrated encryption (AES-128)
accelerator
■
Power amplified RF performances:
– Up to 20 dBm nominal TX output power
– Up to 105 dBm RX sensitivity
■
Robust Wi-Fi and BluetoothÂŽ coexistence
■
16 channels (IEEE 802.15.4 channel 11 to 26)
■
Multiple configurable interfaces available
(UART, SPI, I2C, ADC, GPIOs)
■
Industry standard JTAG programming
■
Onboard 24 MHz and 32.768 kHz stable Xtal
■
Less than 2 uA typ power consumption in deep
sleep mode (32.768 Xtal)
■
Multiple antenna options: integrated antenna or
integrated UFL connector
■
Multiple Protocol Stack Options
■
Single voltage supply (2.1 to 3.6 V)
■
FCC and CE compliant qualified
■
Small Form Factor : 16.4 x 26.5 mm
■
Operating temperature range: -40 °C to +85 °C
AF
■
Features
28 July 2011
Doc ID xxxxx Rev 1
1/19
www.st.com
19
Contents
SPZB32Wxy1.z
Contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
RoHS compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.2
Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.3
DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.4
Digital I/O specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6.5
RF electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
AF
5.1
Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Product approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9.1
FCC approvals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9.1.1
9.2
FCC labeling requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
European certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
10
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2/19
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SPZB32Wxy1.z
Description
SPZB32Wxy1.z is a series of ready-to-use IEEE 802.15.4/ZigBee compliant and power
amplified RF modules optimized for embedded applications that require low data rate
communications and high transmission range capabilities based on the STM32W single
chip that integrates a 2.4 GHz, IEEE 802.15.4-compliant transceiver together with an ARMÂŽ
Cortex embedded processor .
The modules are very compact and enable OEMs to easily add wireless capabilities to
electronics devices by optimizing time-to-market, cost, size, and consumption of their target
applications. No RF experience or expertise is required to add this powerful networking
capability to the final product.
24 MHz high stability Xtal is available aboard the modules to perform the timing
requirements as per IEEE 802.15.4/ZigBeeÂŽ specifications; additionally a 32.768kHz Xtal is
also provided onboard for low power operation.
A single supply voltage is requested to power the modules. The supply is in the range of 2.1
to 3.6 V. The voltage supply also determines the I/O ports level allowing an easy interface
with additional peripherals.
An advanced solution integrating PA and LNA in a single package is aboard to ensure
excellent power transmission and receiver sensitivity performances.
AF
To support user defined applications, a number of peripherals such as GPIO, UART, I2C,
ADC and general purpose timers are available and user selectable.
The size and footprint of this series of modules is equivalent to that of the series
SPZB32Wxy2.z to facilitate the evaluation of the different range options on the target
application.
The series groups multiple versions that differ in terms of memory size , antenna (ceramic
antenna or integrated u.fl connector for the connection of an external antenna) and stacks
options (ZigBee, RF4CE, SimpleMAC).
The SPZB32W1y1.z versions are based on the STM32W108CB chipset integrating 128 kB
of embedded flash memory and 8 kB of RAM available for data and program storage.
For technical details on the STM32W108CB chipset refer to the related datasheet. For
technical details on the supported stacks refer to the related user guide and application
notes.
Description
Doc ID xxxxx Rev 1
3/19
RoHS compliance
SPZB32Wxy1.z
RoHS compliance
ST modules are RoHS compliant and comply with ECOPACKÂŽ norms.
Application
Smart energy applications
●
Machine2Machine industrial control
●
Wireless sensor networks
●
Home/building automation
●
Smart appliances
●
Wireless alarms and security systems
●
Lighting control
●
Remote monitoring
●
AF
4/19
Doc ID xxxxx Rev 1
SPZB32Wxy1.z
Block diagram
Figure 1.
SPZB32WxA1.z block diagram
6DD
 K(Z
8TAL
 - (Z
8TAL
2&
ANTENNA
'0)/S
*TAG
34- 7 3OC
,.!
0!
"0&
3YSTEM 3IGNALS
".W
SPZB32WxC1.z block diagram
Figure 2.
6DD
 - (Z
8TAL
AF
 K(Z
8TAL
'0)/S
*TAG
34- 7 3O#
3YSTEM 3IGNALS
,.!
0!
"0&
5&)
#ONNECTOR
".W
Block diagram
Doc ID xxxxx Rev 1
5/19
Pin settings
SPZB32Wxy1.z
Pin settings
5.1
Pin connections
Figure 3.
Pin connection diagram
TOP VIEW
AF
Antenna
6/19
Doc ID xxxxx Rev 1
AM09235V1
Pin description
Table 1.
Pin description
Module pin n°
Pin name
Direction STM32W pin
Description
PB5
I/O
43
Digital I/O
ADC0
Analog
43
ADC Input 0
TIM2CLK
43
Timer 2 external clock input
TIM1MSK
43
Timer 1 external clock mask input
I/O
27
Digital I/O
Analog
27
ADC Input 1
27
Frame signal of PTI (Packet Trace Interface)
27
Embedded serial bootloader activation out of reset
SPZB32Wxy1.z
5.2
PA5
ADC5
PTI_DATA
Doc ID xxxxx Rev 1
nBOOTMODE
27
AF
TRACEDATA3
PA4
I/O
ADC4
Analog
26
PTI_EN
26
TRACEDATA2
26
PA3
I/O
25
SC2nSSEL
25
SPI SLAVE SELECT of Serial Controller 2
TIM2_CH2
I/O
25
Timer 2 channel 2 output (or input - Disable remap with TIM2_OR[5])
TRACECLK
25
Synchrounus CPU trace clock
nRESET
12
Active low reset ( an internal pull-up of 30 kohm typ. is provided)
PB3
I/O
19
Digital I/O
UART_CTS
19
UART CTS handshake of Serial Controller 1
SC1SCLK
I/O
19
SPI slaver clock of Serial Controller SC1 / SPI master clock of Serial Controller SC1
TIM2_CH3
I/O
19
Timer 2 channel 3 input / Timer 2 channel 3 output
26
Synchrounus CPU trace data bit 3
Digital I/O
ADC Input 0
Frame signal of PTI (Packet Trace Interface)
Digital I/O
Synchrounus CPU trace data bit 2
7/19
Pin settings
Pin description (continued)
Module pin n°
Pin name
Direction STM32W pin
Description
PB4
I/O
20
Digital I/O
UART_RTS
20
UART RTS handshake of Serial Controller 1
TIM2_CH4
I/O
20
Timer 2 channel 4 input / Timer 2 channel 4 output
SC1nSSEL
20
SPI slave select of Serial Controller 1
PA0
I/O
21
Digital I/O
21
SPI Master data out of Serial Controller 2
21
SPI Slave data in of Serial Controller 2
I/O
21
Timer 2 channel 1 input / Timer 2 channel 1 output
22
Digital I/O
22
SPI Master data in of Serial Controller 2
Pin settings
8/19
Table 1.
SC2MOSI
SC2MOSI
TIM2_CH1
PA1
I/O
Doc ID xxxxx Rev 1
SC2MISO
SC2MISO
SC2SDA
I/O
22
TIM2_CH3
I/O
22
PA2
I/O
24
SC2SCLK
24
SC2SCLK
24
SC2SCL
I/O
24
TWI (I2C) clock of Serial Controller 2
TIM2_CH4
I/O
24
Timer 2 channel 4 input / Timer 2 channel 4 output
11
GND
--
49
Ground
12
VDD
Power
16,23,28,37
PC1
I/O
38
Digital I/O
ADC3
Analog
38
ADC Input 3
SWO
38
Serial Wire Output ayncronous trace output to debugger
TRACEDATA0
38
Syncronous CPU trace data bit 0
10
22
AF
SPI Slave data out of Serial Controller 2
TWI (I2C) data of Serial Controller 2
Timer 2 channel 3 input / Timer 2 channel 3 output
Digital I/O
SPI Master clock of Serial Controller 2
SPI Slave clock of Serial Controller 2
Input power supply
SPZB32Wxy1.z
13
Pin description (continued)
Module pin n°
Pin name
Direction STM32W pin
Description
PB0
I/O
36
Digital I/O
VREF (O/I)
Analog
36
ADC reference output / ADC reference input
TIM1CLK
36
Timer 1 external clock input
TIM2MSK
36
Timer 2 external clock mask input
IRQA
36
External interrupt source A
36
Syncronous CPU trace clock
I/O
30
Digital I/O
30
UART transmit data of Serial Controller 1
30
SPI master data out of Serial Controller 1 / SPI slave data out of Serial Controller 1
30
TWI (I2C) data of Serial Controller 1
SPZB32Wxy1.z
Table 1.
14
TRACECLK
PB1
SC1TXD
15
Doc ID xxxxx Rev 1
16
SC1MOSI / SC1MISO
SC1SDA
I/O
TIM2_CH1
I/O
PB2
I/O
31
SC1RXD
31
SC1MISO / SC1MOSI
31
SC1SCL
I/O
31
TIM2_CH2
I/O
31
JTCK
32
JTAG clock input from debugger
SWCLK
I/O
32
Serial Wire clock input/output with debugger
PC2
I/O
33
Digital I/O
JTDO
33
JTAG data out to debugger
SWO
33
Serial Wire Output asyncronous trace output to debugger
PC3
I/O
34
Digital I/O
JTDI
34
JTAG data in from debugger
PC4
I/O
35
Digital I/O
JTMS
35
JTAG mode select from debugger
SWDIO
I/O
35
Serial Wire bidirectional data to/from debugger
30
AF
Timer 2 channel 1 input / Timer 2 channel 1 output
Digital I/O
UART receive data of Serial Controller 1
SPI master data in of Serial Controller SC1 / SPI slave data in of Serial Controller 1
Timer 2 channel 2 input / Timer 2 channel 2 output
17
18
TWI (I2C) clock of Serial Controller 1
9/19
20
Pin settings
19
Pin description (continued)
Module pin n°
Pin name
Direction STM32W pin
Description
PC0
I/O
40
Digital I/O (high current)
JRST
40
JTAG reset input from debugger
TRACEDATA1
40
Syncronous CPU trace data bit 1
IRQD
40
External interrupt source D
PB7
I/O
41
Digital I/O
41
Timer 1 channel 2 output
41
Timer 1 channel 2 input
41
External interrupt source C
41
ADC input 2
42
Digital I/O
Pin settings
10/19
Table 1.
21
TIM1_CH2
22
TIM1 _CH2
IRQC
ADC2
Doc ID xxxxx Rev 1
23
PB6
I/O
TIM1_CH1
TIM1_CH1
42
IRQB
42
ADC1
Analog
42
LNA/ENABLE
29
42
24
PA6/LNA_ENABLE
RF_STANDBY
AF
Timer 1 channel 1 output
Timer 1 channel 1 input
External interrupt source B
ADC input 1
Digital input, module firmware dependent, externally forced by the user dedicated
firmware. This signal is dedicated to manage the SIGE-SE2432L internal LNA.
(HIGH= internal LNA enabled, LOW= internal LNA disabled).
18
Digital input, module firmware dependent, externally forced by the user dedicated
firmware. This signal is dedicated to manage the SIGE-SE2432L front-end STANDBY
state.
(HIGH= Front-end enabled, LOW= Front-end forced in the STANDBY state).
18
Digital output, module firmware dependent, internally forced by application dedicated
firmware. This signal is dedicated to manage the SIGE-SE2432L front-end STANDBY
state.
(HIGH= Front-end enabled, LOW= Front-end forced into STANDBY state).
25
PA7/RF_STANDBY
SPZB32Wxy1.z
29
Digital output, module firmware dependent, internally forced by application dedicated
firmware. This signal is dedicated to manage the SIGE-SE2432L internal LNA. (HIGH=
internal LNA enabled, LOW= internal LNA disabled).
SPZB32Wxy1.z
Electrical characteristics
Electrical characteristics
6.1
Absolute maximum ratings
Table 2.
Absolute maximum ratings
Symbol
Max.
Unit
Module supply voltage
- 0.3
3.6
Vin
Input voltage on any digital pin
- 0.3
Vdd + 0.3
Tstg
Storage temperature
-40
+85
°C
Tsold
Soldering temperature < 10s
250
°C
Recommended operating conditions
Recommended operating conditions
Symbol
Table 3.
Parameter
Module supply voltage
Tstg
Operating ambient temperature
Conditions
-40 °C < T < +85 °C
AF
VDD
Min. Typ. Max.
2.1
3.3
-40
Unit
3.6
+85
°C
DC electrical characteristics
Table 4.
Symbol
DC electrical characteristics
Parameter
IRX
RX current
ITX
TX current
IDS
Deep sleep current
(32.768 kHz oscillator)
6.3
Min.
VDD
6.2
Parameter
Conditions
Min. Typ. Max.
Unit
Vdd = 3.3 V, T= 25 °C
20
mA
Po = 18 dBm, Vdd = 3.3 V,
T = 25 °C, F = 2450MHz
120
mA
Vdd = 3.3 V, T = 25 °C
1.3
mA
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Electrical characteristics
SPZB32Wxy1.z
6.4
Digital I/O specifications
Table 5.
Digital I/O specifications
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
VIL
Low level input voltage
2.1 < Vdd < 3.6 V
0.5 x Vdd
VIH
High level input voltage
2.1 < Vdd < 3.6 V
0.62 x Vdd
Vdd
Iil
Input current for logic 0
2.1 < Vdd < 3.6 V
-0.5
mA
Iih
Input current for logic 1
2.1 < Vdd < 3.6 V
0.5
mA
Input pull-up resistor
30
kΊ
Ripd
Input pull-down resistor
30
kΊ
VOL
Low level output voltage
0.18 x Vdd
VOH
High level output voltage
0.82 x Vdd
Vdd
IOHS
Output source current (standard)
mA
IOLS
Output sink current (standard)
mA
IOHH
Output source current (high current)
mA
IOLH
Output sink current (high current)
mA
IOTot
Total output current for I/O
40
mA
Max.
Unit
2480
MHz
Vdd = 3.3 V, T= 25 °C
20
dBm
Vdd = 3.3 V, 1 % PER
-105
dBm
AF
Ripu
6.5
RF electrical characteristics
Table 6.
Electrical characteristics
Parameter
Frequency range
Output power
RX
Sensitivity
TX
Adjacent channel rejection
12/19
Conditions
Min.
Vdd = 3.3 V, T= 25 °C
2405
Symbol
Âą5 MHz
Âą10 MHZ
Doc ID xxxxx Rev 1
Typ.
35
40
dBm
SPZB32Wxy1.z
Mechanical dimensions
Figure 4.
Mechanical dimensions




SLWFK PP
7ROHUDQ FHV “PP


 [


$QWHQQD

6FDOH



Pin land pattern
(dimensions in mm)
5(&200(1'('/$1'3$77(517239,(:
SLWFK 


Figure 5.
%277209,(:

 [
AF






7239,(:

Mechanical dimensions




!-6
Doc ID xxxxx Rev 1
13/19
Soldering
SPZB32Wxy1.z
Soldering
The soldering phase must be carefully executed; in order to avoid undesired melting
phenomenon, particular attention must be paid to the set-up of the peak temperature.
Below are some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C,
July 2004 recommendations
Table 7.
Soldering
Profile feature
PB free assembly
Average ramp up rate (TSMAX to TP)
3 °C / sec max.
150 °C
200 °C
60 – 100 sec
Time maintained above:
Temperature TL
Time tL
217 °C
40 – 70 sec
Peak temperature (Tp)
Preheat
Temperature min. (TS MIN)
Temperature max. (TS MAX)
Time (TS MIN to TS MAX) (tS)
AF
Time within 5 °C of actual peak temperature (tP)
Ramp down rate
Time from 25 °C to peak temperature
14/19
Doc ID xxxxx Rev 1
240 + 0 °C
10 – 20 sec
6 °C / sec
8 minutes max.
SPZB32Wxy1.z
Product approvals
Product approvals
This series of modules has been designed to meet national regulations for world wide use.
Different versions of modules belonging to the same series are orderable as it is specified in
the Section 10. They differ in terms of integrated memory size and protocol stack enabled
to run while sharing the same manufacturing , design and radios capabilities. As
representative of the series from the RF design and radios capabilities, the versions using
128 kB Flash/8kB RAM and Zigbee PRO Protocol stack (i.e. SPZB32W1A1.1 and
SPZB32W1C1.1) have been used during the certification tests. The following certifications
have been obtained.
FCC approvals
The SPZB32W1A1.1 device, with integrated antenna, as well as the SPZB32W1C1.1, with
the antenna specified in Table 8, have been tested and found to comply with the limits for a
Class B digital device , pursuant to part 15 of the FCC rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates, uses and can radiate radio frequency energy and, if not installed
and used in accordance with the instructions, may cause harmful interference to radio
communications.
AF
However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one or more of the following measures:
Reorient or relocate the receiving antenna
●
Increase the separation between the equipment and receiver
●
Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected
●
Consult the dealer or an experienced radio/TV technician for help
Module type: ZigBeeÂŽ module
SPZB32W1A1.1 / SPZB32W1C1.1
FCC-ID: S9NZB32C1
9.1
Modular type: single modular
Table 8.
Antenna used for FCC approvals
ITEM
Part N°
Manufacturer
2010B4844-01 (Titanis Antenna)
Antenova
Any changes or modifications not expressed approved by the part responsible for
compliance could cause the module to cease to comply with FCC rules part 15, and thus
void the user’s authority to operate the equipment.
While the applicant for a device into which the SPZB32W1A1.1 or the SPZB32W1C2.1 with
the antenna specified in Table 8 installed is not required to obtain new authorization for the
module, this does not preclude the possibility that some other form of authorization or
testing may be required for the end product.
Doc ID xxxxx Rev 1
15/19
Product approvals
9.1.1
SPZB32Wxy1.z
FCC labeling requirements
When integrating the SPZB32W1A1.1 / SPZB32W1C1.1 into the final product, il must be
ensured that the FCC labelling requirements, as specified below, are satisfied.
Based on the Public Notice from FCC, the product into which our transmitter module is
installed must display a label referring to the enclosed module.
The label should use wording such as “Contains Transmitter module FCC ID: S9NZB32C1
or “Contains FCC ID: S9NZB32C1” , any similar wording that expressed the same meaning
may be used.
An example is:
Contains FCC ID: S9NZB32C1
9.2
European certification
SPZB32W1A1.1 and SPZB32W1C2.1 devices are CE certified:
0051
AF
Expert opinion N. xxx-xxxxxx released by IMQ refers to the following normative:
Radio: EN300 328: V1.7.1:2006-10
EMC: EN301 489 17 V2.1.1:2009
Safety: EN60950-1:2006 + A11:2009
16/19
Doc ID xxxxx Rev 1
SPZB32Wxy1.z
Ordering information scheme
10
Ordering information scheme
Table 9.
Ordering information scheme
SPZB
32Wx
.z
802.15.4 / ZigBee modules
Memory options:
x --> 1: 128 kB Flash; 8 kB RAM
x --> 2: 256 kB Flash; 16 kB RAM
Antenna options:
y --> A: Integrated ceramic antenna
y --> C: Integrated UFL connector
AF
1: Long TX range
Firmware options:
z --> 1: ZigBee PRO (EmberZnet)
z --> 4: SimpleMAC
z --> 5: Zigbee IP
Note:
z --> 3: RF4CE
z --> 2: STM ZigBee
Check availability of the different versions with your ST sales representative.
Doc ID xxxxx Rev 1
17/19
Revision history
11
SPZB32Wxy1.z
Revision history
Table 10.
Document revision history
Revision
28-Jul-2011
Changes
Initial release
AF
Date
18/19
Doc ID xxxxx Rev 1
SPZB32Wxy1.z
Please Read Carefully:
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right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
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Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
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AF
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Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.4
Linearized                      : Yes
Page Mode                       : UseOutlines
XMP Toolkit                     : 3.1-701
Producer                        : Acrobat Distiller 7.0.5 (Windows)
Creator Tool                    : FrameMaker 7.2
Modify Date                     : 2011:07:28 08:31:46Z
Create Date                     : 2005:10:20 10:47:30Z
Format                          : application/pdf
Title                           : SPZB32Wxy1.z.fm
Creator                         : antonio zizzo
Document ID                     : uuid:b8452b58-79c3-4f50-a3fa-54a06d5fa90d
Instance ID                     : uuid:d7f83b31-b27c-4302-bab3-b32c59182576
Page Count                      : 19
Author                          : antonio zizzo

EXIF Metadata provided by EXIF.tools