ST Microelectronics S R L ZB32C2 ZigBee Module User Manual

SPZB32W1A2.1 / SPZB32W1C2.1

IEEE 802.15.4 Module

Tentative

FEATURES

• Integrated 2.4GHz , IEEE 802.15.4-compliant

transceiver

• 3 dBm nominal TX output power

• -99 dBm RX sensitivity

• RX filtering for co-existence with IEEE

802.11g and Bluetooth devices

• Integrated VCO and loop filter

• Integrated IEEE 802.15.4 PHY and MAC

• 128kB Embedded flash and 8kB integrated RAM

for program and data storage

• 22 GPIO with alternate functions:

• GPIOs

• UART

• I2C

• SPI

• ADC

• 2 16-bit general purpose timers; one 16-bit sleep

timer

• ADC , sigma-delta converter with 12 bit resolution

• On board 24 MHz stable Xtal

• Selectable Integrated RC oscillator ( typ 10KHz)

or 32.768kHz Xtal for low power operation

• 0.8 uA typ power consumption in Deep sleep

mode

• Watchdog timer and power on reset

• Pins available for Non-intrusive debug interface

(SIF)

• Integrated Antenna (SPZB32W1A2.1) or

integrated RF UFL connector for external antenna

(SPZB32W1C2.1)

• Single voltage supply

• FCC and CE compliant

• Small Form Factor : 16.4 x 26.5 mm

APPLICATIONS

• Industrial controls

• Sensor Networking

• Monitoring of remote systems

• Home/Building Automation

• Security systems

• Lighting controls

DESCRIPTION

SPZB32W1A2.1 / SPZB32W1C2.1 are ready-to-use

ZigBee ® modules optimized for embedded applications

requiring short range performances. These high-

performance, very compact modules enable OEMs to easily

add short range reach wireless capability to electronic

devices by optimizing time-to-market, cost and size of their

target applications.

The modules are based on STM32W single chip ZigBee®

solution which integrates a 2.4GHz, IEEE 802.15.4-

compliant transceiver together with an embedded

processor.

24 MHz high stability Xtal is available aboard the modules

to perform the timing requirements as per ZigBee ®

specifications; additionally a 32.768kHz Xtal is provided

for low power operation.

A single supply voltage is requested to power the modules.

An innovative 2.5 GHz RF design and the relevant internal

RF Amplifier aboard ensure the optimal exploitation of the

link budget, an excellent sensitivity and still low power

consumption for battery powered operation.

The voltage supply also determines the I/O ports level

allowing an easy interface with additional peripherals.

A 128kB of embedded flash memory and 8kB of RAM are

available for data and program storage.

To support user defined applications, a number of

peripherals such as GPIO,UART,I2C, ADC and general

purpose timers are available and user selectable.

Modules are available with two different antenna options:

• SPZB32W1A2.1 with integrated ceramic

antenna aboard

• SPZB32W1C2.1 with UFL RF connector for

the connection of an external antenna.

(for details on STM32W refer to the related Datasheet )

SPZB32W1A2.1 / SPZB32W1C2.1

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Contents

1 Block diagram ……………………………………………………………………………. 3

2 Pin Configuration …………………………………………………………………………3

3 Electrical Characteristics ………………………………………………………………. 4

3.1 Absolute Maximum Ratings …………………………………………………………… 4

3.2 Recommended Operating Conditions ……..…………………………………………… 4

3.3 DC Electrical characteristics …………………………………………………………… 4

3.4 Digital I/O Specifications …………………………………………………………….. 4

3.5 RF Electrical characteristics …………………………………………………………… 4

4 Pins Description …………………………………………………………………………5

5 Mechanical Dimensions ………………………………………………………………….. 8

6 Soldering ………………………………………………………………………………….. 9

7 Appendix A - FCC Statement ..……………………………………………………… 10

SPZB32W1A2.1 / SPZB32W1C2.1

3/12

1-BLOCK DIAGRAM

2-PIN CONFIGURATION

24 MHz

Xtal

STM32W

Tranceiver

Vdd

SIF

GPIO

CONTR SIGN

RF

antenna

32.768 kHz

Xtal

balun BPF

Figure 1. SPZB32W1A2.1 Block diagram

Figure3. Pin configuration

24 MHz

Xtal

STM32W

Tranceiver

Vdd

SIF

GPIO

CONTR SIGN

RF

antenna

32.768 kHz

Xtal

balun BPF

Figure 2. SPZB32W1C2.1 Block diagram

SPZB32W1A2.1 / SPZB32W1C2.1

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3 – ELECTRICAL CHARACTERISTICS

3.1 - ABSOLUTE MAXIMUM RATINGS

Table 1. Absolute maximum ratings

Symbol Parameter Min Max Unit

VDD Module supply voltage - 0.3 3.6 V

Vin Input voltage on any digital pin - 0.3 Vdd + 0.3 V

Tstg Storage tempeature -40 +85 °C

Tsold. Soldering temperature < 10s 250 °C

3.2 - RECOMMENDED OPERATING CONDITIONS

Table 2. Recommended operating conditions

Symbol Parameter Conditions Min Typ Max Unit

VDD Module supply voltage -40°C < T < +85 C 2.8 3.3 3.6 V

Tstg Operating ambient temperature -40 +85 °C

3.3 - DC ELECTRICAL CHARACTERISTICS

Table3. DC Electrical Characteristics

Symbol Parameter Conditions Min Typ Max Unit

IRX RX current Vdd = 3.3 V T= 25 °C 28 mA

ITX TX current Po = 3 dBm Vdd = 3.3 V T= 25 °C

F=2450 Mhz 32 mA

IDS Deep Sleep Current (32.768kHz

oscillator) Vdd = 3.3 V T = 25°C 1.3 µΑ

3.4 - DIGITAL I/O SPECIFICATIONS

Table 4. Digital I/O Specifications

Symbol Parameter Conditions Min Typ Max Unit

VIL Low Level Input Voltage 2.8 < Vdd < 3.6 V 0 0.5 x

Vdd V

VIH High level input voltage 2.8 < Vdd < 3.6 V 0.62 x Vdd Vdd V

Iil Input current for logic 0 2.8 < Vdd < 3.6 V -0.5

µΑ

Iih Input current for logic 1 2.8 < Vdd < 3.6 V 0.5

µΑ

Ripu Input pull-up resistor 30 κΩ

Ripd Input pull-down resistor 30 κΩ

VOL Low level output voltage 0 0.18 x

Vdd V

VOH High level output voltage 0.82 x Vdd Vdd V

IOHS Output source current (standard ) 4 mA

IOLS Output sink current (standard) 4 mA

IOHH Output source current (high current) 8 mA

IOLH Output sink current (high current) 8 mA

IOTot Total output current for I/O 40 mA

3.5 - RF ELECTRICAL CHARACTERISTICS

Table 5. RF Electrical Characteristics

Symbol Parameter Conditions Min Typ Max Unit

Frequency range Vdd = 3.3 V T= 25 °C 2405 2480 MHz

TX Output power Vdd = 3.3 V T= 25 °C 3 6 dBm

RX Sensitivity Vdd = 3.3V 1% PER -95 - 97 dBm

CFE Carrier frequency error Vd d= 3.3V -40 / + 85 °C

- t.b.d. t.b.d. ppm

Adjacent channel rejection +/- 5 MHz

+/- 10 MHZ 35

40 dBm

SPZB32W1A2.1 / SPZB32W1C2.1

5/12

4 – PIN DESCRIPTION

Table 6. Pin Description

Module

Number

Name Direction STM32W

pin Description

1 PB5 I/O 43 Digital I/O

ADC0 Analog 43 ADC Input 0

TIM2CLK I 43 Timer 2 external clock input

TIM1MSK I 43 Timer 1 external clock mask input

2 PA5 I/O 27 Digital I/O

ADC5 Analog 27 ADC Input 1

PTI_DATA O 27 Frame signal of PTI (Packet Trace Interface)

nBOOTMODE I 27 Embedded serial bootloader activation out of reset

TRACEDATA3 0 27 Synchrounus CPU trace data bit 3

3 PA4 I/O 26 Digital I/O

ADC4 Analog 26 ADC Input 0

PTI_EN O 26 Frame signal of PTI (Packet Trace Interface)

TRACEDATA2 O 26 Synchrounus CPU trace data bit 2

4 PA3 I/O 25 Digital I/O

SC2nSSEL I 25 SPI SLAVE SELECT of Serial Controller 2

TIM2_CH2 I/O 25 Timer 2 channel 2 output (or input - Disable remap with TIM2_OR[5])

TRACECLK O 25 Synchrounus CPU trace clock

5 nRESET I 12 Active low reset ( an internal pull-up of 30 kohm typ. is provided)

6 PB3 I/O 19 Digital I/O

UART_CTS I 19 UART CTS handshake of Serial Controller 1

SC1SCLK I/O 19 SPI slaver clock of Serial Controller SC1 / SPI master clock of Serial Controller SC1

TIM2_CH3 I/O 19 Timer 2 channel 3 input / Timer 2 channel 3 output

7 PB4 I/O 20 Digital I/O

UART_RTS O 20 UART RTS handshake of Serial Controller 1

TIM2_CH4 I/O 20 Timer 2 channel 4 input / Timer 2 channel 4 output

SC1nSSEL I 20 SPI slave select of Serial Controller 1

8 PA0 I/O 21 Digital I/O

SC2MOSI O 21 SPI Master data out of Serial Controller 2

SC2MOSI I 21 SPI Slave data in of Serial Controller 2

TIM2_CH1 I/O 21 Timer 2 channel 1 input / Timer 2 channel 1 output

9 PA1 I/O 22 Digital I/O

SC2MISO I 22 SPI Master data in of Serial Controller 2

SC2MISO O 22 SPI Slave data out of Serial Controller 2

SC2SDA I/O 22 TWI (I2C) data of Serial Controller 2

TIM2_CH3 I/O 22 Timer 2 channel 3 input / Timer 2 channel 3 output

10 PA2 I/O 24 Digital I/O

SC2SCLK O 24 SPI Master clock of Serial Controller 2

SC2SCLK I 24 SPI Slave clock of Serial Controller 2

SC2SCL I/O 24 TWI (I2C) clock of Serial Controller 2

SPZB32W1A2.1 / SPZB32W1C2.1

6/12

TIM2_CH4 I/O 24 Timer 2 channel 4 input / Timer 2 channel 4 output

11 GND -- 49 Ground

12 VDD Power 16,23,28,37 Input power supply

13 PC1 I/O 38 Digital I/O

ADC3 Analog 38 ADC Input 3

SWO O 38 Serial Wire Output ayncronous trace output to debugger

TRACEDATA0 O 38 Syncronous CPU trace data bit 0

14 PB0 I/O 36 Digital I/O

VREF (O/I) Analog 36 ADC reference output / ADC reference input

TIM1CLK I 36 Timer 1 external clock input

TIM2MSK I 36 Timer 2 external clock mask input

IRQA I 36 External interrupt source A

TRACECLK O 36 Syncronous CPU trace clock

15 PB1 I/O 30 Digital I/O

SC1TXD O 30 UART transmit data of Serial Controller 1

SC1MOSI /

SC1MISO O 30 SPI master data out of Serial Controller 1 / SPI slave data out of Serial Controller 1

SC1SDA I/O 30 TWI (I2C) data of Serial Controller 1

TIM2_CH1 I/O 30 Timer 2 channel 1 input / Timer 2 channel 1 output

16 PB2 I/O 31 Digital I/O

SC1RXD I 31 UART receive data of Serial Controller 1

SC1MISO /

SC1MOSI I 31 SPI master data in of Serial Controller SC1 / SPI slave data in of Serial Controller 1

SC1SCL I/O 31 TWI (I2C) clock of Serial Controller 1

TIM2_CH2 I/O 31 Timer 2 channel 2 input / Timer 2 channel 2 output

17 JTCK I 32 JTAG clock input from debugger

SWCLK I/O 32 Serial Wire clock input/output with debugger

18 PC2 I/O 33 Digital I/O

JTDO O 33 JTAG data out to debugger

SWO O 33 Serial Wire Output asyncronous trace output to debugger

19 PC3 I/O 34 Digital I/O

JTDI I 34 JTAG data in from debugger

20 PC4 I/O 35 Digital I/O

JTMS I 35 JTAG mode select from debugger

SWDIO I/O 35 Serial Wire bidirectional data to/from debugger

21 PC0 I/O 40 Digital I/O (high current)

JRST I 40 JTAG reset input from debugger

TRACEDATA1 O 40 Syncronous CPU trace data bit 1

IRQD I 40 External interrupt source D

22 PB7 I/O 41 Digital I/O

TIM1_CH2 O 41 Timer 1 channel 2 output

TIM1 _CH2 I 41 Timer 1 channel 2 input

IRQC I 41 External interrupt source C

ADC2 I 41 ADC input 2

23 PB6 I/O 42 Digital I/O

SPZB32W1A2.1 / SPZB32W1C2.1

7/12

TIM1_CH1 O 42 Timer 1 channel 1 output

TIM1_CH1 I 42 Timer 1 channel 1 input

IRQB I 42 External interrupt source B

ADC1 Analog 42 ADC input 1

24 PA6 I/O 29 Digital I/O

TIM1_CH3 O 29 Timer 1 channel 3 output

TIM1_CH3 I 29 Timer 1 channel 3 input

25 PA7 I/O 18 Digital I/O

TIM1_CH4 O 18 Timer 1 channel 4 output

TIM1_CH4 I 18 Timer 1 channel 4 input

REG_EN O 18 External regulator open drain output (enabled after reset)

26 PC5 I/O 11 Digital I/O

TX_ACTIVE O 11 Logic level control for external Rx/Tx switch

SPZB32W1A2.1 / SPZB32W1C2.1

8/12

5 - MECHANICAL DIMENSIONS

Figure 4 Mechanical dimensions

Figure 5 Pin land pattern

SPZB32W1A2.1 / SPZB32W1C2.1

9/12

6 - SOLDERING

Soldering phase has to be carefully executed: in order to avoid undesired melting phenomenon, particular attention has to be

taken on the set up of the Peak Temperature.

Here following some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations

Profile feature PB free assembly

Average ramp up rate ( TSMAX to TP) 3°C / sec max

Preheat

Temperature min ( TS MIN)

Temperature max ( TS MAX)

Time (TS MIN to TS MAX) ( tS )

150 ° C

200 ° C

60 – 100 sec

Time maintained above :

Temperature TL

Time tL

217 ° C

40 – 70 sec

Peak Temperature (Tp) 240 + 0 ° C

Time within 5°C of actual peak temperature (tP) 10 – 20 sec

Ramp down rate 6 °C / sec

Time from 25° C to peak temperature 8 minutes max

SPZB32W1A2.1 / SPZB32W1C2.1

10/12

Appendix A - FCC Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two

conditions: (1) this device may not cause harmful interference, and (2) this device must accept

any interference received, including interference that may cause undesired operation.

NOTE: This equipment has been tested and found to comply with the limits for a Class B

digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide

reasonable protection against harmful interference in a residential installation. This equipment

generates, uses and can radiate radio frequency energy and, if not installed and used

in accordance with the instructions, may cause harmful interference to radio communications.

However, there is no guarantee that interference will not occur in a particular installation.

If this equipment does cause harmful interference to radio or television reception, which

can be determined by turning the equipment off and on, the user is encouraged to try to correct

the interference by one or more of the following measures:

− Reorient or relocate the receiving antenna

− Increase the separation between the equipment and receiver

− Connect the equipment into an outlet on a circuit different from that to which the receiver

is connected

Consult the dealer or an experienced radio/TV technician for help

Antenna

Our module type SPZB32W1x2.1 is for OEM integrations only. The end-user product will be

professionally installed in such a manner that only the authorized antennas are used.

Caution

Any changes or modifications not expressed approved by the part responsible for compliance could cause the

module to cease to comply with FCC rules part 15, and thus void the user’s authority to operate the equipment.

.

A.1 - LABEL INSTRUCTION

INSTRUCTION MANUAL FOR FCC ID LABELING

Module type : ZigBee® module SPZB32W1A2.1 / SPZB32W1C2.1

FCC-ID : S9NZB32C2

This intends to inform you how to specify the FCC ID of our ZigBee module SPZB32W1A2.1 /

SPZB32W1C2.1 on your final product.

Based on the Public Notice from FCC, the product into which our transmitter module is installed must

display a label referring to the enclosed module.

The label should use wording such as “Contains Transmitter module FCC ID: S9NZB32C2 or “Contains

FCC ID: S9NZB32C2 , any similar wording that expressed the same meaning may be use.

It shows an example below

Contains FCC ID: S9NZB32C2

SPZB32W1A2.1 / SPZB32W1C2.1

11/12

A.2 - Special requirement for Modular application

The following requirements are fulfilled:

1) The modular transmitter must have its own RF shielding:

The RF module used on the board fulfils the emission requirements of the FCC rules without additional shielding.

2) The modular transmitter must have buffered modulation/data inputs:

The module has a memory management unit inside of the IC. The processor interfacing with the external application

by means general purpose I/O ( GPIO) , Uart, SPI. The processor interfaces also the RF part of the module

exchanging data and command with it. Inside the processor a flash memory is available to download the customer

application and the ZigBee profiles.

3) The modular transmitter must have its own power supply regulation:

The IC contains an own voltage regulation. In case of changes in the supply voltage VCC (for example caused by

temperature changes or other effects), the internal voltage will be stabilized.

4) The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204:

The RF module is for OEM (Original Equipment Manufacturer) integration only. The end-user product will be

professionally installed in such a manner that only the authorized antenna is used.

5) The modular transmitter must be tested in a stand-alone configuration:

The RF module was tested in a stand-alone configuration.

6) The modular transmitter must be labelled with its own FCC ID number:

The RF module will be labelled with its own FCC ID number. When the module is installed inside the end-product,

the label is not visible. The OEM manufacturer is instructed how to apply the exterior label.

7) The modular transmitter must comply with any specific rule or operating requirements applicable to the

transmitter and the manufacturer must provide adequate instructions along with the module to explain any such

requirements:

The EUT is compliant with all applicable FCC rules. Detail instructions are given in the product Users Guide.

8) The modular transmitter must comply with any applicable RF exposure requirements.

• Maximum measured power output: 1.90 mW (2.77 dBm )

• Maximum antenna gain: 2.2 dBi (see also FCC test report)

Maximum permissible exposure defined in 47 CFR 1.1310: 1 mW/cm².

The RF module operates at low power level so it does not exceed the Commission’s RF exposure guidelines limits;

furthermore, Spread spectrum transmitters operate according to the Section 15.247 are categorically excluded from

routine environmental evaluation.

SPZB32W1A2.1 / SPZB32W1C2.1

12/12

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ST Microelectronics S R L ZB32C2 ZigBee Module User Manual

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