ST Microelectronics S R L ZB32C2 ZigBee Module User Manual

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Document ID	1373151
Application ID	h9fCuYvYxJPAY9oxh4SN9Q==
Document Description	User manual
Short Term Confidential	No
Permanent Confidential	No
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Document Type	User Manual
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Filesize	17.34kB (216736 bits)
Date Submitted	2010-11-09 00:00:00
Date Available	2010-11-12 00:00:00
Creation Date	2010-10-11 17:05:57
Producing Software	Acrobat Distiller 6.0 (Windows)
Document Lastmod	2010-10-11 17:05:57
Document Title	Microsoft Word - SPZB32W1x2_1_TentativeDatasheet_04
Document Creator	PScript5.dll Version 5.2.2
Document Author:	alessandro rizzoli

SPZB32W1A2.1 / SPZB32W1C2.1
IEEE 802.15.4 Module
Tentative
FEATURES
• Integrated 2.4GHz , IEEE 802.15.4-compliant
transceiver
• 3 dBm nominal TX output power
• -99 dBm RX sensitivity
• RX filtering for co-existence with IEEE
802.11g and Bluetooth devices
• Integrated VCO and loop filter
• Integrated IEEE 802.15.4 PHY and MAC
• 128kB Embedded flash and 8kB integrated RAM
for program and data storage
• 22 GPIO with alternate functions:
• GPIOs
• UART
• I2C
• SPI
• ADC
• 2 16-bit general purpose timers; one 16-bit sleep
timer
• ADC , sigma-delta converter with 12 bit resolution
• On board 24 MHz stable Xtal
• Selectable Integrated RC oscillator ( typ 10KHz)
or 32.768kHz Xtal for low power operation
• 0.8 uA typ power consumption in Deep sleep
mode
• Watchdog timer and power on reset
• Pins available for Non-intrusive debug interface
(SIF)
• Integrated Antenna (SPZB32W1A2.1) or
integrated RF UFL connector for external antenna
(SPZB32W1C2.1)
• Single voltage supply
• FCC and CE compliant
• Small Form Factor : 16.4 x 26.5 mm
APPLICATIONS
• Industrial controls
• Sensor Networking
• Monitoring of remote systems
• Home/Building Automation
• Security systems
• Lighting controls
DESCRIPTION
SPZB32W1A2.1 / SPZB32W1C2.1 are ready-to-use
ZigBee ® modules optimized for embedded applications
requiring short range performances. These highperformance, very compact modules enable OEMs to easily
add short range reach wireless capability to electronic
devices by optimizing time-to-market, cost and size of their
target applications.
The modules are based on STM32W single chip ZigBee®
solution which integrates a 2.4GHz, IEEE 802.15.4compliant transceiver together with an embedded
processor.
24 MHz high stability Xtal is available aboard the modules
to perform the timing requirements as per ZigBee ®
specifications; additionally a 32.768kHz Xtal is provided
for low power operation.
A single supply voltage is requested to power the modules.
An innovative 2.5 GHz RF design and the relevant internal
RF Amplifier aboard ensure the optimal exploitation of the
link budget, an excellent sensitivity and still low power
consumption for battery powered operation.
The voltage supply also determines the I/O ports level
allowing an easy interface with additional peripherals.
A 128kB of embedded flash memory and 8kB of RAM are
available for data and program storage.
To support user defined applications, a number of
peripherals such as GPIO,UART,I2C, ADC and general
purpose timers are available and user selectable.
Modules are available with two different antenna options:
•
•
SPZB32W1A2.1 with integrated ceramic
antenna aboard
SPZB32W1C2.1 with UFL RF connector for
the connection of an external antenna.
(for details on STM32W refer to the related Datasheet )
SPZB32W1A2.1 / SPZB32W1C2.1
Contents
Block diagram ……………………………………………………………………………. 3
Pin Configuration …………………………………………………………………………3
Electrical Characteristics ………………………………………………………………. 4
3.1
Absolute Maximum Ratings …………………………………………………………… 4
3.2
Recommended Operating Conditions ……..…………………………………………… 4
3.3
DC Electrical characteristics …………………………………………………………… 4
3.4
Digital I/O Specifications …………………………………………………………….. 4
3.5
RF Electrical characteristics …………………………………………………………… 4
Pins Description …………………………………………………………………………5
Mechanical Dimensions ………………………………………………………………….. 8
Soldering ………………………………………………………………………………….. 9
Appendix A - FCC Statement ..……………………………………………………… 10
2/12
SPZB32W1A2.1 / SPZB32W1C2.1
1-BLOCK DIAGRAM
Vdd
SIF
GPIO
32.768 kHz
Xtal
24 MHz
Xtal
STM32W
Tranceiver
RF
antenna
balun
BPF
CONTR SIGN
Figure 1. SPZB32W1A2.1 Block diagram
Vdd
SIF
GPIO
32.768 kHz
Xtal
RF
antenna
24 MHz
Xtal
STM32W
Tranceiver
balun
BPF
CONTR SIGN
Figure 2. SPZB32W1C2.1 Block diagram
2-PIN CONFIGURATION
Figure3. Pin configuration
3/12
SPZB32W1A2.1 / SPZB32W1C2.1
3 – ELECTRICAL CHARACTERISTICS
3.1 - ABSOLUTE MAXIMUM RATINGS
Table 1. Absolute maximum ratings
Symbol
VDD
Vin
Tstg
Tsold.
Parameter
Module supply voltage
Input voltage on any digital pin
Storage tempeature
Soldering temperature < 10s
Min
Max
Unit
- 0.3
- 0.3
-40
3.6
Vdd + 0.3
+85
250
°C
°C
3.2 - RECOMMENDED OPERATING CONDITIONS
Table 2. Recommended operating conditions
Symbol
VDD
Tstg
Parameter
Module supply voltage
Operating ambient temperature
Conditions
Min
Typ
Max
Unit
-40°C < T < +85 C
2.8
-40
3.3
3.6
+85
°C
Typ
Max
Unit
3.3 - DC ELECTRICAL CHARACTERISTICS
Table3. DC Electrical Characteristics
Symbol
Parameter
IRX
RX current
ITX
TX current
IDS
Deep Sleep Current (32.768kHz
oscillator)
Conditions
Vdd = 3.3 V
Min
T= 25 °C
Po = 3 dBm Vdd = 3.3 V
T= 25 °C
F=2450 Mhz
Vdd = 3.3 V
T = 25°C
28
mA
32
mA
1.3
µΑ
3.4 - DIGITAL I/O SPECIFICATIONS
Table 4. Digital I/O Specifications
Symbol
Parameter
Conditions
Min
VIL
Low Level Input Voltage
2.8 < Vdd < 3.6 V
VIH
Iil
Iih
Ripu
Ripd
High level input voltage
Input current for logic 0
Input current for logic 1
Input pull-up resistor
Input pull-down resistor
2.8 < Vdd < 3.6 V
2.8 < Vdd < 3.6 V
2.8 < Vdd < 3.6 V
0.62 x Vdd
VOL
Low level output voltage
VOH
IOHS
IOLS
IOHH
IOLH
IOTot
High level output voltage
Output source current (standard )
Output sink current (standard)
Output source current (high current)
Output sink current (high current)
Total output current for I/O
Typ
Max
Unit
0.5 x
Vdd
Vdd
-0.5
0.5
30
30
0.18 x
Vdd
Vdd
40
0.82 x Vdd
µΑ
µΑ
κΩ
κΩ
mA
mA
mA
mA
mA
3.5 - RF ELECTRICAL CHARACTERISTICS
Table 5. RF Electrical Characteristics
Symbol
TX
RX
CFE
Parameter
Frequency range
Output power
Sensitivity
Carrier frequency error
Adjacent channel rejection
Conditions
Vdd = 3.3 V
Vdd = 3.3 V
Vdd = 3.3V
Vd d= 3.3V
T= 25 °C
T= 25 °C
1% PER
-40 / + 85 °C
+/- 5 MHz
+/- 10 MHZ
Min
Typ
Max
Unit
-95
2480
- 97
t.b.d.
MHz
dBm
dBm
ppm
2405
t.b.d.
35
40
dBm
4/12
SPZB32W1A2.1 / SPZB32W1C2.1
4 – PIN DESCRIPTION
Table 6. Pin Description
Module
Pin
Number
PIN
Name
Direction
STM32W
pin
I/O
43
Digital I/O
Analog
43
ADC Input 0
TIM2CLK
43
Timer 2 external clock input
TIM1MSK
43
Timer 1 external clock mask input
PB5
ADC0
I/O
27
Digital I/O
Analog
27
ADC Input 1
PTI_DATA
27
Frame signal of PTI (Packet Trace Interface)
nBOOTMODE
27
Embedded serial bootloader activation out of reset
TRACEDATA3
27
Synchrounus CPU trace data bit 3
I/O
26
Digital I/O
Analog
26
ADC Input 0
PTI_EN
26
Frame signal of PTI (Packet Trace Interface)
TRACEDATA2
26
Synchrounus CPU trace data bit 2
I/O
25
Digital I/O
SC2nSSEL
25
SPI SLAVE SELECT of Serial Controller 2
TIM2_CH2
I/O
25
Timer 2 channel 2 output (or input - Disable remap with TIM2_OR[5])
TRACECLK
25
Synchrounus CPU trace clock
nRESET
12
Active low reset ( an internal pull-up of 30 kohm typ. is provided)
PB3
I/O
19
Digital I/O
19
UART CTS handshake of Serial Controller 1
SC1SCLK
I/O
19
SPI slaver clock of Serial Controller SC1 / SPI master clock of Serial Controller SC1
TIM2_CH3
I/O
19
Timer 2 channel 3 input / Timer 2 channel 3 output
PB4
I/O
20
Digital I/O
UART_RTS
20
UART RTS handshake of Serial Controller 1
TIM2_CH4
I/O
20
Timer 2 channel 4 input / Timer 2 channel 4 output
SC1nSSEL
20
SPI slave select of Serial Controller 1
I/O
21
Digital I/O
SC2MOSI
21
SPI Master data out of Serial Controller 2
SC2MOSI
21
SPI Slave data in of Serial Controller 2
TIM2_CH1
I/O
21
Timer 2 channel 1 input / Timer 2 channel 1 output
PA1
I/O
22
Digital I/O
SC2MISO
22
SPI Master data in of Serial Controller 2
SC2MISO
22
SPI Slave data out of Serial Controller 2
SC2SDA
I/O
22
TWI (I2C) data of Serial Controller 2
TIM2_CH3
I/O
22
Timer 2 channel 3 input / Timer 2 channel 3 output
PA2
I/O
24
Digital I/O
SC2SCLK
24
SPI Master clock of Serial Controller 2
SC2SCLK
24
SPI Slave clock of Serial Controller 2
I/O
24
TWI (I2C) clock of Serial Controller 2
PA5
Description
ADC5
PA4
ADC4
PA3
UART_CTS
10
PA0
SC2SCL
5/12
SPZB32W1A2.1 / SPZB32W1C2.1
TIM2_CH4
I/O
24
Timer 2 channel 4 input / Timer 2 channel 4 output
Ground
11
GND
--
49
12
VDD
Power
16,23,28,37
13
PC1
I/O
38
Digital I/O
ADC3
Analog
38
ADC Input 3
SWO
38
Serial Wire Output ayncronous trace output to debugger
TRACEDATA0
38
Syncronous CPU trace data bit 0
I/O
36
Digital I/O
VREF (O/I)
Analog
36
ADC reference output / ADC reference input
TIM1CLK
36
Timer 1 external clock input
TIM2MSK
36
Timer 2 external clock mask input
IRQA
36
External interrupt source A
TRACECLK
36
Syncronous CPU trace clock
I/O
30
Digital I/O
SC1TXD
30
UART transmit data of Serial Controller 1
SC1MOSI /
SC1MISO
30
SPI master data out of Serial Controller 1 / SPI slave data out of Serial Controller 1
SC1SDA
I/O
30
TWI (I2C) data of Serial Controller 1
TIM2_CH1
I/O
30
Timer 2 channel 1 input / Timer 2 channel 1 output
PB2
I/O
31
Digital I/O
SC1RXD
31
UART receive data of Serial Controller 1
SC1MISO /
SC1MOSI
31
SPI master data in of Serial Controller SC1 / SPI slave data in of Serial Controller 1
SC1SCL
I/O
31
TWI (I2C) clock of Serial Controller 1
TIM2_CH2
I/O
31
Timer 2 channel 2 input / Timer 2 channel 2 output
32
JTAG clock input from debugger
SWCLK
I/O
32
Serial Wire clock input/output with debugger
PC2
I/O
33
Digital I/O
33
JTAG data out to debugger
SWO
33
Serial Wire Output asyncronous trace output to debugger
PC3
I/O
34
Digital I/O
JTDI
34
JTAG data in from debugger
PC4
I/O
35
Digital I/O
35
JTAG mode select from debugger
SWDIO
I/O
35
Serial Wire bidirectional data to/from debugger
PC0
I/O
40
Digital I/O (high current)
JRST
40
JTAG reset input from debugger
TRACEDATA1
40
Syncronous CPU trace data bit 1
IRQD
40
External interrupt source D
I/O
41
Digital I/O
TIM1_CH2
41
Timer 1 channel 2 output
TIM1 _CH2
41
Timer 1 channel 2 input
IRQC
41
External interrupt source C
ADC2
41
ADC input 2
I/O
42
Digital I/O
14
15
16
17
18
PB0
PB1
JTCK
JTDO
19
20
JTMS
21
22
23
PB7
PB6
Input power supply
6/12
SPZB32W1A2.1 / SPZB32W1C2.1
24
25
26
TIM1_CH1
42
Timer 1 channel 1 output
TIM1_CH1
42
Timer 1 channel 1 input
IRQB
42
External interrupt source B
ADC1
Analog
42
ADC input 1
I/O
29
Digital I/O
TIM1_CH3
29
Timer 1 channel 3 output
TIM1_CH3
29
Timer 1 channel 3 input
I/O
18
Digital I/O
TIM1_CH4
18
Timer 1 channel 4 output
TIM1_CH4
18
Timer 1 channel 4 input
REG_EN
18
External regulator open drain output (enabled after reset)
I/O
11
Digital I/O
11
Logic level control for external Rx/Tx switch
PA6
PA7
PC5
TX_ACTIVE
7/12
SPZB32W1A2.1 / SPZB32W1C2.1
5 - MECHANICAL DIMENSIONS
Figure 4 Mechanical dimensions
Figure 5 Pin land pattern
8/12
SPZB32W1A2.1 / SPZB32W1C2.1
6 - SOLDERING
Soldering phase has to be carefully executed: in order to avoid undesired melting phenomenon, particular attention has to be
taken on the set up of the Peak Temperature.
Here following some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations
Profile feature
Average ramp up rate ( TSMAX to TP)
Preheat
Temperature min ( TS MIN)
Temperature max ( TS MAX)
Time (TS MIN to TS MAX) ( tS )
Time maintained above :
Temperature TL
Time tL
Peak Temperature (Tp)
Time within 5°C of actual peak temperature (tP)
Ramp down rate
Time from 25° C to peak temperature
PB free assembly
3°C / sec max
150 ° C
200 ° C
60 – 100 sec
217 ° C
40 – 70 sec
240 + 0 ° C
10 – 20 sec
6 °C / sec
8 minutes max
9/12
SPZB32W1A2.1 / SPZB32W1C2.1
Appendix A - FCC Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
NOTE: This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide
reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used
in accordance with the instructions, may cause harmful interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation.
If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct
the interference by one or more of the following measures:
− Reorient or relocate the receiving antenna
− Increase the separation between the equipment and receiver
− Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected
Consult the dealer or an experienced radio/TV technician for help
Antenna
Our module type SPZB32W1x2.1 is for OEM integrations only. The end-user product will be
professionally installed in such a manner that only the authorized antennas are used.
Caution
Any changes or modifications not expressed approved by the part responsible for compliance could cause the
module to cease to comply with FCC rules part 15, and thus void the user’s authority to operate the equipment.
A.1 - LABEL INSTRUCTION
INSTRUCTION MANUAL FOR FCC ID LABELING
Module type
: ZigBee® module
FCC-ID
: S9NZB32C2
SPZB32W1A2.1 / SPZB32W1C2.1
This intends to inform you how to specify the FCC ID of our ZigBee module SPZB32W1A2.1 /
SPZB32W1C2.1 on your final product.
Based on the Public Notice from FCC, the product into which our transmitter module is installed must
display a label referring to the enclosed module.
The label should use wording such as “Contains Transmitter module FCC ID: S9NZB32C2 or “Contains
FCC ID: S9NZB32C2 , any similar wording that expressed the same meaning may be use.
It shows an example below
Contains FCC ID: S9NZB32C2
10/12
SPZB32W1A2.1 / SPZB32W1C2.1
A.2 - Special requirement for Modular application
The following requirements are fulfilled:
1) The modular transmitter must have its own RF shielding:
The RF module used on the board fulfils the emission requirements of the FCC rules without additional shielding.
2) The modular transmitter must have buffered modulation/data inputs:
The module has a memory management unit inside of the IC. The processor interfacing with the external application
by means general purpose I/O ( GPIO) , Uart, SPI. The processor interfaces also the RF part of the module
exchanging data and command with it. Inside the processor a flash memory is available to download the customer
application and the ZigBee profiles.
3) The modular transmitter must have its own power supply regulation:
The IC contains an own voltage regulation. In case of changes in the supply voltage VCC (for example caused by
temperature changes or other effects), the internal voltage will be stabilized.
4) The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204:
The RF module is for OEM (Original Equipment Manufacturer) integration only. The end-user product will be
professionally installed in such a manner that only the authorized antenna is used.
5) The modular transmitter must be tested in a stand-alone configuration:
The RF module was tested in a stand-alone configuration.
6) The modular transmitter must be labelled with its own FCC ID number:
The RF module will be labelled with its own FCC ID number. When the module is installed inside the end-product,
the label is not visible. The OEM manufacturer is instructed how to apply the exterior label.
7)
The modular transmitter must comply with any specific rule or operating requirements applicable to the
transmitter and the manufacturer must provide adequate instructions along with the module to explain any such
requirements:
The EUT is compliant with all applicable FCC rules. Detail instructions are given in the product Users Guide.
8) The modular transmitter must comply with any applicable RF exposure requirements.
•
•
Maximum measured power output: 1.90 mW (2.77 dBm )
Maximum antenna gain:
2.2 dBi
(see also FCC test report)
Maximum permissible exposure defined in 47 CFR 1.1310: 1 mW/cm².
The RF module operates at low power level so it does not exceed the Commission’s RF exposure guidelines limits;
furthermore, Spread spectrum transmitters operate according to the Section 15.247 are categorically excluded from
routine environmental evaluation.
11/12
SPZB32W1A2.1 / SPZB32W1C2.1
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