ST Microelectronics S R L ZB32C2 ZigBee Module User Manual
ST Microelectronics S.R.L. ZigBee Module
User manual
SPZB32W1A2.1 / SPZB32W1C2.1 IEEE 802.15.4 Module Tentative FEATURES • Integrated 2.4GHz , IEEE 802.15.4-compliant transceiver • 3 dBm nominal TX output power • -99 dBm RX sensitivity • RX filtering for co-existence with IEEE 802.11g and Bluetooth devices • Integrated VCO and loop filter • Integrated IEEE 802.15.4 PHY and MAC • 128kB Embedded flash and 8kB integrated RAM for program and data storage • 22 GPIO with alternate functions: • GPIOs • UART • I2C • SPI • ADC • 2 16-bit general purpose timers; one 16-bit sleep timer • ADC , sigma-delta converter with 12 bit resolution • On board 24 MHz stable Xtal • Selectable Integrated RC oscillator ( typ 10KHz) or 32.768kHz Xtal for low power operation • 0.8 uA typ power consumption in Deep sleep mode • Watchdog timer and power on reset • Pins available for Non-intrusive debug interface (SIF) • Integrated Antenna (SPZB32W1A2.1) or integrated RF UFL connector for external antenna (SPZB32W1C2.1) • Single voltage supply • FCC and CE compliant • Small Form Factor : 16.4 x 26.5 mm APPLICATIONS • Industrial controls • Sensor Networking • Monitoring of remote systems • Home/Building Automation • Security systems • Lighting controls DESCRIPTION SPZB32W1A2.1 / SPZB32W1C2.1 are ready-to-use ZigBee ® modules optimized for embedded applications requiring short range performances. These highperformance, very compact modules enable OEMs to easily add short range reach wireless capability to electronic devices by optimizing time-to-market, cost and size of their target applications. The modules are based on STM32W single chip ZigBee® solution which integrates a 2.4GHz, IEEE 802.15.4compliant transceiver together with an embedded processor. 24 MHz high stability Xtal is available aboard the modules to perform the timing requirements as per ZigBee ® specifications; additionally a 32.768kHz Xtal is provided for low power operation. A single supply voltage is requested to power the modules. An innovative 2.5 GHz RF design and the relevant internal RF Amplifier aboard ensure the optimal exploitation of the link budget, an excellent sensitivity and still low power consumption for battery powered operation. The voltage supply also determines the I/O ports level allowing an easy interface with additional peripherals. A 128kB of embedded flash memory and 8kB of RAM are available for data and program storage. To support user defined applications, a number of peripherals such as GPIO,UART,I2C, ADC and general purpose timers are available and user selectable. Modules are available with two different antenna options: • • SPZB32W1A2.1 with integrated ceramic antenna aboard SPZB32W1C2.1 with UFL RF connector for the connection of an external antenna. (for details on STM32W refer to the related Datasheet ) SPZB32W1A2.1 / SPZB32W1C2.1 Contents Block diagram ……………………………………………………………………………. 3 Pin Configuration …………………………………………………………………………3 Electrical Characteristics ………………………………………………………………. 4 3.1 Absolute Maximum Ratings …………………………………………………………… 4 3.2 Recommended Operating Conditions ……..…………………………………………… 4 3.3 DC Electrical characteristics …………………………………………………………… 4 3.4 Digital I/O Specifications …………………………………………………………….. 4 3.5 RF Electrical characteristics …………………………………………………………… 4 Pins Description …………………………………………………………………………5 Mechanical Dimensions ………………………………………………………………….. 8 Soldering ………………………………………………………………………………….. 9 Appendix A - FCC Statement ..……………………………………………………… 10 2/12 SPZB32W1A2.1 / SPZB32W1C2.1 1-BLOCK DIAGRAM Vdd SIF GPIO 32.768 kHz Xtal 24 MHz Xtal STM32W Tranceiver RF antenna balun BPF CONTR SIGN Figure 1. SPZB32W1A2.1 Block diagram Vdd SIF GPIO 32.768 kHz Xtal RF antenna 24 MHz Xtal STM32W Tranceiver balun BPF CONTR SIGN Figure 2. SPZB32W1C2.1 Block diagram 2-PIN CONFIGURATION Figure3. Pin configuration 3/12 SPZB32W1A2.1 / SPZB32W1C2.1 3 – ELECTRICAL CHARACTERISTICS 3.1 - ABSOLUTE MAXIMUM RATINGS Table 1. Absolute maximum ratings Symbol VDD Vin Tstg Tsold. Parameter Module supply voltage Input voltage on any digital pin Storage tempeature Soldering temperature < 10s Min Max Unit - 0.3 - 0.3 -40 3.6 Vdd + 0.3 +85 250 °C °C 3.2 - RECOMMENDED OPERATING CONDITIONS Table 2. Recommended operating conditions Symbol VDD Tstg Parameter Module supply voltage Operating ambient temperature Conditions Min Typ Max Unit -40°C < T < +85 C 2.8 -40 3.3 3.6 +85 °C Typ Max Unit 3.3 - DC ELECTRICAL CHARACTERISTICS Table3. DC Electrical Characteristics Symbol Parameter IRX RX current ITX TX current IDS Deep Sleep Current (32.768kHz oscillator) Conditions Vdd = 3.3 V Min T= 25 °C Po = 3 dBm Vdd = 3.3 V T= 25 °C F=2450 Mhz Vdd = 3.3 V T = 25°C 28 mA 32 mA 1.3 µΑ 3.4 - DIGITAL I/O SPECIFICATIONS Table 4. Digital I/O Specifications Symbol Parameter Conditions Min VIL Low Level Input Voltage 2.8 < Vdd < 3.6 V VIH Iil Iih Ripu Ripd High level input voltage Input current for logic 0 Input current for logic 1 Input pull-up resistor Input pull-down resistor 2.8 < Vdd < 3.6 V 2.8 < Vdd < 3.6 V 2.8 < Vdd < 3.6 V 0.62 x Vdd VOL Low level output voltage VOH IOHS IOLS IOHH IOLH IOTot High level output voltage Output source current (standard ) Output sink current (standard) Output source current (high current) Output sink current (high current) Total output current for I/O Typ Max Unit 0.5 x Vdd Vdd -0.5 0.5 30 30 0.18 x Vdd Vdd 40 0.82 x Vdd µΑ µΑ κΩ κΩ mA mA mA mA mA 3.5 - RF ELECTRICAL CHARACTERISTICS Table 5. RF Electrical Characteristics Symbol TX RX CFE Parameter Frequency range Output power Sensitivity Carrier frequency error Adjacent channel rejection Conditions Vdd = 3.3 V Vdd = 3.3 V Vdd = 3.3V Vd d= 3.3V T= 25 °C T= 25 °C 1% PER -40 / + 85 °C +/- 5 MHz +/- 10 MHZ Min Typ Max Unit -95 2480 - 97 t.b.d. MHz dBm dBm ppm 2405 t.b.d. 35 40 dBm 4/12 SPZB32W1A2.1 / SPZB32W1C2.1 4 – PIN DESCRIPTION Table 6. Pin Description Module Pin Number PIN Name Direction STM32W pin I/O 43 Digital I/O Analog 43 ADC Input 0 TIM2CLK 43 Timer 2 external clock input TIM1MSK 43 Timer 1 external clock mask input PB5 ADC0 I/O 27 Digital I/O Analog 27 ADC Input 1 PTI_DATA 27 Frame signal of PTI (Packet Trace Interface) nBOOTMODE 27 Embedded serial bootloader activation out of reset TRACEDATA3 27 Synchrounus CPU trace data bit 3 I/O 26 Digital I/O Analog 26 ADC Input 0 PTI_EN 26 Frame signal of PTI (Packet Trace Interface) TRACEDATA2 26 Synchrounus CPU trace data bit 2 I/O 25 Digital I/O SC2nSSEL 25 SPI SLAVE SELECT of Serial Controller 2 TIM2_CH2 I/O 25 Timer 2 channel 2 output (or input - Disable remap with TIM2_OR[5]) TRACECLK 25 Synchrounus CPU trace clock nRESET 12 Active low reset ( an internal pull-up of 30 kohm typ. is provided) PB3 I/O 19 Digital I/O 19 UART CTS handshake of Serial Controller 1 SC1SCLK I/O 19 SPI slaver clock of Serial Controller SC1 / SPI master clock of Serial Controller SC1 TIM2_CH3 I/O 19 Timer 2 channel 3 input / Timer 2 channel 3 output PB4 I/O 20 Digital I/O UART_RTS 20 UART RTS handshake of Serial Controller 1 TIM2_CH4 I/O 20 Timer 2 channel 4 input / Timer 2 channel 4 output SC1nSSEL 20 SPI slave select of Serial Controller 1 I/O 21 Digital I/O SC2MOSI 21 SPI Master data out of Serial Controller 2 SC2MOSI 21 SPI Slave data in of Serial Controller 2 TIM2_CH1 I/O 21 Timer 2 channel 1 input / Timer 2 channel 1 output PA1 I/O 22 Digital I/O SC2MISO 22 SPI Master data in of Serial Controller 2 SC2MISO 22 SPI Slave data out of Serial Controller 2 SC2SDA I/O 22 TWI (I2C) data of Serial Controller 2 TIM2_CH3 I/O 22 Timer 2 channel 3 input / Timer 2 channel 3 output PA2 I/O 24 Digital I/O SC2SCLK 24 SPI Master clock of Serial Controller 2 SC2SCLK 24 SPI Slave clock of Serial Controller 2 I/O 24 TWI (I2C) clock of Serial Controller 2 PA5 Description ADC5 PA4 ADC4 PA3 UART_CTS 10 PA0 SC2SCL 5/12 SPZB32W1A2.1 / SPZB32W1C2.1 TIM2_CH4 I/O 24 Timer 2 channel 4 input / Timer 2 channel 4 output Ground 11 GND -- 49 12 VDD Power 16,23,28,37 13 PC1 I/O 38 Digital I/O ADC3 Analog 38 ADC Input 3 SWO 38 Serial Wire Output ayncronous trace output to debugger TRACEDATA0 38 Syncronous CPU trace data bit 0 I/O 36 Digital I/O VREF (O/I) Analog 36 ADC reference output / ADC reference input TIM1CLK 36 Timer 1 external clock input TIM2MSK 36 Timer 2 external clock mask input IRQA 36 External interrupt source A TRACECLK 36 Syncronous CPU trace clock I/O 30 Digital I/O SC1TXD 30 UART transmit data of Serial Controller 1 SC1MOSI / SC1MISO 30 SPI master data out of Serial Controller 1 / SPI slave data out of Serial Controller 1 SC1SDA I/O 30 TWI (I2C) data of Serial Controller 1 TIM2_CH1 I/O 30 Timer 2 channel 1 input / Timer 2 channel 1 output PB2 I/O 31 Digital I/O SC1RXD 31 UART receive data of Serial Controller 1 SC1MISO / SC1MOSI 31 SPI master data in of Serial Controller SC1 / SPI slave data in of Serial Controller 1 SC1SCL I/O 31 TWI (I2C) clock of Serial Controller 1 TIM2_CH2 I/O 31 Timer 2 channel 2 input / Timer 2 channel 2 output 32 JTAG clock input from debugger SWCLK I/O 32 Serial Wire clock input/output with debugger PC2 I/O 33 Digital I/O 33 JTAG data out to debugger SWO 33 Serial Wire Output asyncronous trace output to debugger PC3 I/O 34 Digital I/O JTDI 34 JTAG data in from debugger PC4 I/O 35 Digital I/O 35 JTAG mode select from debugger SWDIO I/O 35 Serial Wire bidirectional data to/from debugger PC0 I/O 40 Digital I/O (high current) JRST 40 JTAG reset input from debugger TRACEDATA1 40 Syncronous CPU trace data bit 1 IRQD 40 External interrupt source D I/O 41 Digital I/O TIM1_CH2 41 Timer 1 channel 2 output TIM1 _CH2 41 Timer 1 channel 2 input IRQC 41 External interrupt source C ADC2 41 ADC input 2 I/O 42 Digital I/O 14 15 16 17 18 PB0 PB1 JTCK JTDO 19 20 JTMS 21 22 23 PB7 PB6 Input power supply 6/12 SPZB32W1A2.1 / SPZB32W1C2.1 24 25 26 TIM1_CH1 42 Timer 1 channel 1 output TIM1_CH1 42 Timer 1 channel 1 input IRQB 42 External interrupt source B ADC1 Analog 42 ADC input 1 I/O 29 Digital I/O TIM1_CH3 29 Timer 1 channel 3 output TIM1_CH3 29 Timer 1 channel 3 input I/O 18 Digital I/O TIM1_CH4 18 Timer 1 channel 4 output TIM1_CH4 18 Timer 1 channel 4 input REG_EN 18 External regulator open drain output (enabled after reset) I/O 11 Digital I/O 11 Logic level control for external Rx/Tx switch PA6 PA7 PC5 TX_ACTIVE 7/12 SPZB32W1A2.1 / SPZB32W1C2.1 5 - MECHANICAL DIMENSIONS Figure 4 Mechanical dimensions Figure 5 Pin land pattern 8/12 SPZB32W1A2.1 / SPZB32W1C2.1 6 - SOLDERING Soldering phase has to be carefully executed: in order to avoid undesired melting phenomenon, particular attention has to be taken on the set up of the Peak Temperature. Here following some suggestions for the temperature profile based on IPC/JEDEC J-STD-020C, July 2004 recommendations Profile feature Average ramp up rate ( TSMAX to TP) Preheat Temperature min ( TS MIN) Temperature max ( TS MAX) Time (TS MIN to TS MAX) ( tS ) Time maintained above : Temperature TL Time tL Peak Temperature (Tp) Time within 5°C of actual peak temperature (tP) Ramp down rate Time from 25° C to peak temperature PB free assembly 3°C / sec max 150 ° C 200 ° C 60 – 100 sec 217 ° C 40 – 70 sec 240 + 0 ° C 10 – 20 sec 6 °C / sec 8 minutes max 9/12 SPZB32W1A2.1 / SPZB32W1C2.1 Appendix A - FCC Statement This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: − Reorient or relocate the receiving antenna − Increase the separation between the equipment and receiver − Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio/TV technician for help Antenna Our module type SPZB32W1x2.1 is for OEM integrations only. The end-user product will be professionally installed in such a manner that only the authorized antennas are used. Caution Any changes or modifications not expressed approved by the part responsible for compliance could cause the module to cease to comply with FCC rules part 15, and thus void the user’s authority to operate the equipment. A.1 - LABEL INSTRUCTION INSTRUCTION MANUAL FOR FCC ID LABELING Module type : ZigBee® module FCC-ID : S9NZB32C2 SPZB32W1A2.1 / SPZB32W1C2.1 This intends to inform you how to specify the FCC ID of our ZigBee module SPZB32W1A2.1 / SPZB32W1C2.1 on your final product. Based on the Public Notice from FCC, the product into which our transmitter module is installed must display a label referring to the enclosed module. The label should use wording such as “Contains Transmitter module FCC ID: S9NZB32C2 or “Contains FCC ID: S9NZB32C2 , any similar wording that expressed the same meaning may be use. It shows an example below Contains FCC ID: S9NZB32C2 10/12 SPZB32W1A2.1 / SPZB32W1C2.1 A.2 - Special requirement for Modular application The following requirements are fulfilled: 1) The modular transmitter must have its own RF shielding: The RF module used on the board fulfils the emission requirements of the FCC rules without additional shielding. 2) The modular transmitter must have buffered modulation/data inputs: The module has a memory management unit inside of the IC. The processor interfacing with the external application by means general purpose I/O ( GPIO) , Uart, SPI. The processor interfaces also the RF part of the module exchanging data and command with it. Inside the processor a flash memory is available to download the customer application and the ZigBee profiles. 3) The modular transmitter must have its own power supply regulation: The IC contains an own voltage regulation. In case of changes in the supply voltage VCC (for example caused by temperature changes or other effects), the internal voltage will be stabilized. 4) The modular transmitter must comply with the antenna requirements of Section 15.203 and 15.204: The RF module is for OEM (Original Equipment Manufacturer) integration only. The end-user product will be professionally installed in such a manner that only the authorized antenna is used. 5) The modular transmitter must be tested in a stand-alone configuration: The RF module was tested in a stand-alone configuration. 6) The modular transmitter must be labelled with its own FCC ID number: The RF module will be labelled with its own FCC ID number. When the module is installed inside the end-product, the label is not visible. The OEM manufacturer is instructed how to apply the exterior label. 7) The modular transmitter must comply with any specific rule or operating requirements applicable to the transmitter and the manufacturer must provide adequate instructions along with the module to explain any such requirements: The EUT is compliant with all applicable FCC rules. Detail instructions are given in the product Users Guide. 8) The modular transmitter must comply with any applicable RF exposure requirements. • • Maximum measured power output: 1.90 mW (2.77 dBm ) Maximum antenna gain: 2.2 dBi (see also FCC test report) Maximum permissible exposure defined in 47 CFR 1.1310: 1 mW/cm². The RF module operates at low power level so it does not exceed the Commission’s RF exposure guidelines limits; furthermore, Spread spectrum transmitters operate according to the Section 15.247 are categorically excluded from routine environmental evaluation. 11/12 SPZB32W1A2.1 / SPZB32W1C2.1 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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