STMicroelectronicsS DZSTM32WA DZ-SB-S-A Zigbee Module User Manual chip antenna datasheet

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Document ID	1313172
Application ID	vrE4l6aAQyxrrVCyy8Hdmw==
Document Description	chip antenna datasheet
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	23.12kB (288945 bits)
Date Submitted	2010-07-19 00:00:00
Date Available	2010-07-19 00:00:00
Creation Date	2006-08-10 10:07:13
Producing Software	Acrobat Distiller 7.0.5 (Windows)
Document Lastmod	2006-08-10 10:23:53
Document Title	Microsoft PowerPoint - RainSun AN0835 Datasheet Ver.1.1
Document Creator	PScript5.dll Version 5.2
Document Author:	Judy Lee

AN0835
Multilayer Chip Antenna for
2.4GHz Wireless Communication
RainSun Corporation
http://www.rainsun.com
1 of 9
Aug, 2006
Ver.1.1
AN0835 Multilayer Chip Antenna
◆ Features
y Light weight and low profile 8.0mm(L) × 3.5mm(W) × 1.0mm(H)
y Omni-directional in azimuth
y Lead (Pb) Free
◆ Applications
y 2.4GHz wireless communications
y 2.4GHz Modules
y Bluetooth System
y 802.11b/g Wireless LAN System
Specifications
Center frequency
Peak gain
Operation temperature
Storage temperature
VSWR
Input Impedance
Power handling
Bandwidth
Azimuth beamwidth
Polarization
RainSun Corporation
http://www.rainsun.com
2.45 GHz
1 dBi
-40 °C ~ +85 °C
-40 °C ~ +85 °C
2.0 (max)
50 Ohm
3W (max)
180 MHz
Omni-directional
Linear
2 of 9
Aug, 2006
Ver.1.1
Pin configuration
Top view
Pin No
Pin assignment
Feed termination
Feed point mark
Solder termination
Dimensions
Symbol
Dimensions(mm)
8.00 ± 0.10
3.50 ± 0.10
1.50 ± 0.02
0.50 ± 0.05
0.30 ± 0.05
1.00 ± 0.20
PCB Foot Print
RainSun Corporation
http://www.rainsun.com
Symbol
Dimensions(mm)
1.0
1.9
8.0
3 of 9
Aug, 2006
Ver.1.1
Recommended Test Board Pattern
Top view
Bottom view
50 Ohm
Transmission line
Ground Plane
SMA connector
Unit : mm
Board thickness : 0.6mm
Board material : FR4
Fig-1
Testing Setup
Measurement
Testing Instrument:
Anritsu 37369C VNA(Vector Network
Analyzer)
VNA calibrate with 1 path reflection
only calibration sequence on test board
feed point.
The test board dimension and it’s
layout is the same as Fig‐1.
RainSun Corporation
http://www.rainsun.com
4 of 9
Aug, 2006
Ver.1.1
Typical Electrical Characteristics
Return loss
Smith Chart
Marker data:
1 : f=2.556 GHz
2 : f=2.368 GHz
3 : f=2.451 GHz
RainSun Corporation
http://www.rainsun.com
5 of 9
Aug, 2006
Ver.1.1
Typical Radiation Patterns
2.45 GHz H‐Plane
2.45 GHz E‐Plane
RainSun Corporation
http://www.rainsun.com
6 of 9
Aug, 2006
Ver.1.1
Typical Soldering Profile for Lead‐free Process
Peak temp 340°C
Temperature ( °C )
340°C
300°C
150°C
5 sec.
25 sec.
Pre-heating
Time (sec.)
Do not exceed 30 secs.
Reflow Soldering
10 sec, max
Temperature ( °C )
260°C
230°C
180°C
30 sec.
60 sec.
Pre-heating
Time (sec.)
RainSun Corporation
http://www.rainsun.com
7 of 9
Aug, 2006
Ver.1.1
Packing
Blister Tape Specifications
Symbol
Dimension
Tolerance
Unit
16.00
± 0.30
mm
1.75
± 0.10
mm
7.50
± 0.10
mm
1.50
± 0.10
mm
D1
1.50
+0.25
‐0.00
mm
P0
4.00
± 0.10
mm
8.00
± 0.10
mm
P2
2.00
± 0.10
mm
A0
3.70
± 0.10
mm
B0
8.20
± 0.10
mm
K0
1.40
± 0. 10
mm
0.30
± 0.05
mm
RainSun Corporation
http://www.rainsun.com
8 of 9
Aug, 2006
Ver.1.1
Reel Specifications
Quantity
Per Reel
Tape Width
(mm)
(mm)
(mm)
(mm)
(mm)
(mm)
W1
(mm)
1,000
16
178±1
13±0.2
60±0.5
2.2±0.5
16.7±0.3
19.5±1.0
RainSun Corporation
http://www.rainsun.com
9 of 9
Aug, 2006
Ver.1.1

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Title                           : Microsoft PowerPoint - RainSun AN0835 Datasheet Ver.1.1
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