STMicroelectronicsS DZSTM32WA DZ-SB-S-A Zigbee Module User Manual chip antenna datasheet

STMicroelectronics DZ-SB-S-A Zigbee Module chip antenna datasheet

Contents

chip antenna datasheet

RainSunCorporationhttp://www.rainsun.com 1of9Aug,2006Ver.1.1AN0835MultilayerChipAntennafor2.4GHzWirelessCommunication
RainSunCorporationhttp://www.rainsun.com 2of9Aug,2006Ver.1.1AN0835 Multilayer Chip Antenna◆FeaturesyLightweightandlowprofile8.0mm(L)×3.5mm(W)×1.0mm(H)yOmni-directional in azimuthyLead (Pb) Free◆ApplicationsApplicationsy2.4GHz wireless communicationsy2.4GHz ModulesyBluetooth Systemy802.11b/g Wireless LAN SystemSpecifications2.45 GHz1 dBi-40 °C ~ +85 °C-40 °C ~ +85 °C2.0 (max)50 Ohm3W (max)180 MHzOmni-directionalLinearCenter frequencyPeak gainOperation temperatureStorage temperatureVSWRInput ImpedancePower handlingBandwidthAzimuth beamwidth Polarization
RainSunCorporationhttp://www.rainsun.com 3of9Aug,2006Ver.1.1Solder termination3Feed point mark2Feed termination1Pin assignmentPin NoPin configuration 0.30 ±0.05E1.00 ±0.20H0.50 ±0.05D1.50 ±0.02C3.50 ±0.10B8.00 ±0.10ADimensions(mm)SymbolDimensions132TopviewPCBFootPrint8.0I1.9H1.0GDimensions(mm)Symbol
RainSunCorporationhttp://www.rainsun.com 4of9Aug,2006Ver.1.1GroundPlaneBoardthickness:0.6mmBoardmaterial:FR4Unit:mm50OhmTransmissionlineSMAconnectorTopview BottomviewRecommendedTestBoardPatternTestingSetupMeasurementTestingInstrument:Anritsu37369CVNA(VectorNetworkAnalyzer)VNAcalibratewith1pathreflectiononlycalibrationsequenceontestboardfeedpoint.Thetestboarddimensionandit’slayoutisthesameasFig‐1.Fig-1
RainSunCorporationhttp://www.rainsun.com 5of9Aug,2006Ver.1.1ReturnlossTypicalElectricalCharacteristicsSmithChartMarkerdata:1:f=2.556GHz2:f=2.368GHz3:f=2.451GHz
RainSunCorporationhttp://www.rainsun.com 6of9Aug,2006Ver.1.12.45GHzH‐Plane2.45GHzE‐PlaneTypicalRadiationPatterns
RainSunCorporationhttp://www.rainsun.com 7of9Aug,2006Ver.1.1TypicalSolderingProfileforLead‐freeProcessTemperature ( °C )Time (sec.)340°C300°C150°CPeak temp 340°CDo not exceed 30 secs.25 sec. 5 sec. Pre-heatingTemperature ( °C )Time (sec.)260°C230°C180°C10 sec, maxReflow Soldering60 sec. 30 sec. Pre-heating
RainSunCorporationhttp://www.rainsun.com 8of9Aug,2006Ver.1.1PackingBlister Tape Specificationsmm±0.101.40K0mm±0.050.30Tmm±0.108.20B0mm±0.103.70A0mm±0.102.00P2mm±0.108.00Pmm±0.104.00P0mm+0.25‐0.001.50D1mm±0.101.50Dmm±0.107.50Fmm±0.101.75Emm±0.3016.00WUnitToleranceDimensionSymbol
RainSunCorporationhttp://www.rainsun.com 9of9Aug,2006Ver.1.1ReelSpecifications16.7±0.3W(mm)19.5±1.02.2±0.560±0.513±0.2178±1161,000W1(mm)E(mm)B(mm)C(mm)A(mm)TapeWidth(mm)QuantityPerReel

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