STMicroelectronicsS DZSTM32WA DZ-SB-S-A Zigbee Module User Manual chip antenna datasheet
STMicroelectronics DZ-SB-S-A Zigbee Module chip antenna datasheet
Contents
- 1. manual
- 2. chip antenna datasheet
chip antenna datasheet
RainSunCorporation
http://www.rainsun.com 1of9Aug,2006
Ver.1.1
AN0835
MultilayerChipAntennafor
2.4GHzWirelessCommunication
RainSunCorporation
http://www.rainsun.com 2of9Aug,2006
Ver.1.1
AN0835 Multilayer Chip Antenna
◆Features
yLightweightandlowprofile8.0mm(L)×3.5mm(W)×1.0mm(H)
yOmni-directional in azimuth
yLead (Pb) Free
◆Applications
Applications
y2.4GHz wireless communications
y2.4GHz Modules
yBluetooth System
y802.11b/g Wireless LAN System
Specifications
2.45 GHz
1 dBi
-40 °C ~ +85 °C
-40 °C ~ +85 °C
2.0 (max)
50 Ohm
3W (max)
180 MHz
Omni-directional
Linear
Center frequency
Peak gain
Operation temperature
Storage temperature
VSWR
Input Impedance
Power handling
Bandwidth
Azimuth beamwidth
Polarization
RainSunCorporation
http://www.rainsun.com 3of9Aug,2006
Ver.1.1
Solder termination3
Feed point mark2
Feed termination1
Pin assignmentPin No
Pin configuration
0.30 ±0.05E
1.00 ±0.20H
0.50 ±0.05D
1.50 ±0.02C
3.50 ±0.10B
8.00 ±0.10A
Dimensions(mm)Symbol
Dimensions
1
3
2
Topview
PCBFootPrint
8.0I
1.9H
1.0G
Dimensions(mm)Symbol
RainSunCorporation
http://www.rainsun.com 4of9Aug,2006
Ver.1.1
GroundPlane
Boardthickness:0.6mm
Boardmaterial:FR4
Unit:mm
50Ohm
Transmissionline
SMAconnector
Topview Bottomview
RecommendedTestBoardPattern
TestingSetup
MeasurementTestingInstrument:
Anritsu37369CVNA(VectorNetwork
Analyzer)
VNAcalibratewith1pathreflection
onlycalibrationsequenceontestboard
feedpoint.
Thetestboarddimensionandit’s
layoutisthesameasFig‐1.
Fig-1
RainSunCorporation
http://www.rainsun.com 5of9Aug,2006
Ver.1.1
Returnloss
TypicalElectricalCharacteristics
SmithChart
Markerdata:
1:f=2.556GHz
2:f=2.368GHz
3:f=2.451GHz
RainSunCorporation
http://www.rainsun.com 6of9Aug,2006
Ver.1.1
2.45GHzH‐Plane
2.45GHzE‐Plane
TypicalRadiationPatterns
RainSunCorporation
http://www.rainsun.com 7of9Aug,2006
Ver.1.1
TypicalSolderingProfileforLead‐freeProcess
Temperature ( °C )
Time (sec.)
340°C
300°C
150°C
Peak temp 340°C
Do not exceed 30 secs.
25 sec.
5 sec.
Pre-heating
Temperature ( °C )
Time (sec.)
260°C
230°C
180°C
10 sec, max
Reflow Soldering
60 sec.
30 sec.
Pre-heating
RainSunCorporation
http://www.rainsun.com 8of9Aug,2006
Ver.1.1
Packing
Blister Tape Specifications
mm±0.101.40K0
mm±0.050.30T
mm±0.108.20B0
mm±0.103.70A0
mm±0.102.00P2
mm±0.108.00P
mm±0.104.00P0
mm
+0.25
‐0.00
1.50D1
mm±0.101.50D
mm±0.107.50F
mm±0.101.75E
mm±0.3016.00W
UnitToleranceDimensionSymbol
RainSunCorporation
http://www.rainsun.com 9of9Aug,2006
Ver.1.1
ReelSpecifications
16.7±0.3
W
(mm)
19.5±1.02.2±0.560±0.513±0.2178±1161,000
W1
(mm)
E
(mm)
B
(mm)
C
(mm)
A
(mm)
TapeWidth
(mm)
Quantity
PerReel