SUNGALE ELECTRONICS TYBT3 Bluetooth module User Manual TYBT2 EN V1x

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Document ID	4006181
Application ID	/aqZo31ULS1ccDxEB1Ihmg==
Document Description	15_TYBT3 UserMan
Short Term Confidential	No
Permanent Confidential	No
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Document Type	User Manual
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Date Submitted	2018-09-14 00:00:00
Date Available	2018-09-14 00:00:00
Creation Date	2018-03-02 10:37:11
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Document Lastmod	2018-09-13 16:24:35
Document Title	Microsoft Word - TYBT2_EN_V1.docx
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Document Author:	35003

TYBT3 DATASHEET
Bluetooth module
1. Product Overview
TYBT3 is a Bluetooth (BLE) moduledesigned by HangZhouTuya Technology Corporation.
The BLE Module consistsof a highly integratedwireless Bluetooth chipTLSR8266 and someextra
electric circuitsthathave been programed with Bluetoothnetwork protocol and plenty of software
examples.TYBT3 includea 32-bit CPU, BLE, 512K byte flash, 16k SRAM, and 9 multiplex IO
pins.
Figure 1 shows the block diagramof the TYBT3.
Figure 1. The block diagram of the TYBT3
3.3V input
BLE
IO interface
I2C
UART
PWM
MCU FREQ
48MHz
SRAM
16K Bytes
FLASH
12M
Crystal
512K
BLE 4.0/Slave
2.4GHz radio
PCB
on-board
antenna
1.1 Features





Integrated low power consumption 32-bit CPU, also known as application processor
Basic frequency of the CPU can support 48 MHz
Supply voltage range: 1.9V to 3.6V
Peripherals: 5*PWM,1*I2C, 1*UART
BLE RF features:
 Compatible with BLE 4.2
 Transmitting data rate can go up to 1Mbps
 TX transmitting power: +7dBm
 RX receiving sensitivity: -92dBm
 AES hardware encryption
 On-board PCB antenna
TYBT3 DATASHEET

Operating temperature range: -20℃ to 125℃
1.2 Main ApplicationFields



Intelligent LED
Intelligent household applications
Intelligent low-power consumptionsensors
TYBT3 DATASHEET
2. Dimensions and Footprint
2.1Dimensions
TYBT3have double sides of pins. The distance between each Pin is 2.0mm.
Size of TYBT3: 15mm(W)*16.5mm(L).
Figure 2 shows the dimensions of TYBT3.
Figure 2. The dimensions of TYBT3
2.2 Pin Definition
Table 1 shows the generalpin attributes of TYBT3
Table 1. The typical pin definitionof TYBT3
PIN NO.
NAME
TYP
DESCRIPTION
SDA
I/O
I2C, data interface,internal pull-up 4.7k resistance
SCL
I/O
I2C, clock interface, internal pull-up 4.7k resistance
I/O
normal IO pin, can be used as PWM output pin, default for
Green LED line
I/O
normal IO pin, can be used as PWM output pin, default for Blue
LED line
WW
I/O
normal IO pin, can be used as PWM output pin, default for
Warm White LED line
CW
I/O
normal IO pin, can be used as PWM output pin, default for Cold
White LED line
I/O
normal IO pin, can be used as PWM output pin, default for Red
LED line
3.3V
Supply voltage
TYBT3 DATASHEET
TX
I/O
UART TX,can be used as normal IO pin
10
RX
I/O
UART RX,can be used as normal IO pin
11
GND
Ground
12
SW
I/O
Bluetooth chipset burning pin
13
RST
reset pin for the module,internal pull-up 4.7k resistance
14
GND
Ground
Note: P: Power supply pins; I/O: Digital input or output pins.
SW pin is ONLY used for burning firmware, Can NOT be used for other functions.
There are 4.7 pull-up resistance internally for I2C pins, external pull-up resistances are not
necessary.
When WW pin is outputting PWM signal, It has opposite phase comparing the PWM signal
from R/G/B/CW pin.
If there’s any customization needed for PWM output, please contact our BD manager.
Sleep mode
TYBT3 DATASHEET
3. Electrical Characteristics
3.1 Absolute Maximum Ratings
Table 2. Absolute Maximum Ratings
PARAMETERS
DESCRIPTION
MIN
MAX
UNIT
Ts
Storage
temperature
-20
125
℃
VCC
Supply voltage
-0.3
3.9
Electrostatic release quantity
(Human body model)
TAMB-25℃
KV
Electrostatic release quantity
(Machine model)
TAMB-25℃
0.5
KV
3.2 Electrical Conditions
Table 3. Electrical Conditions
PARAMETERS
Ta
DESCRIPTION
MIN
Temperature for Commercial grade
-20
TYPIC
AL
MAX
125
UNIT
℃
VCC
Supply voltage
1.9
3.3
3.6
VIL
IO negative level input
-0.3
VCC*0.3
VIH
IO positive level input
VOL
IO negative level output
VoH
IO positive level output
VCC*0.7
VCC
VSS
0.3
VCC-0.3
VCC
3.3Transmitting Current Consumptions
Table 4. TX current consumption
PARAMETERS
MODE
Itx
Continuously transmitting, 0dBm power output
Irx
Continuously receiving
12
mA
IDC
Normal working mode
27
mA
18
uA
Ideepsleep
Sleep mode
TYPICAL
15
UNIT
mA
TYBT3 DATASHEET
4. Radio Specification
4.1 Basic Radio Frequency Characteristics
Table 5.Basic Radio frequency characteristics
PARAMETERS
DESCRIPTION
Working Frequency
2.4GHz ISM band
Radio standard
Data transmitting rate
BLE 4.2
1Mbps,2Mbps
Type of Antenna
On-board PCB Antenna
4.2TransmittingPower
Table 6. Transmitting power
PARAMETERS
MIN
TYPICAL
RF Average output power
consumption
3.8
20dB bandwidth (1M)
1300
2600
20dB bandwidth (2M)
MAX
UNIT
dBm
KHz
KHz
4.3Receiving Sensitivity
Table 7. Receiving sensitivity
PARAMETERS
RX sensitivity
Frequency bias error
Co-channel interference Restrain
MIN
TYPICAL
MAX
1Mbps
-93
-92
-90
2Mbps
-90
-89
-86
1Mbps
-300
+300
2Mbps
-200
+200
-7
UNIT
dBm
KHz
dB
TYBT3 DATASHEET
5. Antenna Information
5.1 Antenna Type
Antenna for TYBT3 module is using 2.4 GHz MIFAOn-board PCBantenna.
5.2 Reduce Antenna Interference
nterference
Inn order to have the best RF performance, it’s recommended to keep a minimum15mm
distance between the antenna part and the other metal pieces.
Since PCBA
A manufacture use SMT process to weld TYBT3 module and other electrical
components onto the PCB board, RF performance will depend on the layout location and patt
pattern
of the On-board
board PCB antenna. The following figures are some recommended and
dis-recommended demonstrations from out R&D team.
In demonstration 1 and 2 of figure 3, the on
on-board PCB antenna lays outside of the PCB
frame. It’s recommended to use layout pattern shown in demonstration 1 and 2. Either the
on-board PCB antenna lays outside of the PCB frame directly or PCB frame carve
car out a certain
area for the antenna. The overall PCBA performance for these two ways will be the same as
testing the module independently.
Restricted due to some reason, iif the on-board PCB antenna layout
ut has to be inside the PCB
frame, it’s suggested to refer
er to demonstration 3. The antenna
enna lays inside the PCB frame, but no
copperor wire beneath the antenna. RF performance will have some loss, approximately 1~2 dBm.
It’s NOT recommended to use demonstra
demonstration 4, the antenna lays inside the PCB frame, and
there are copper and wire beneath it. RF performance will have significantattenuation
attenuation.
Figure 3.layoutdemostrations
Demonstration 1: Antenna lay outside the
Demonstration 2: Antenna lay outside
PCB frame
the PCB frame with carved area
TYBT3 DATASHEET
Demonstration 3: Antenna lay inside the PCB
Demonstration 4: Antenna lay inside the PCB
frame without copper or wire beneath it
frame with copper or wire beneath it
TYBT3 DATASHEET
6. Packaging Information And Production Guide
6.1 Mechanical Dimensions
Figure 4.Dimensionsof the module
6.2 Production Guide

The storage for the delivered module should meet the following condition:
1. The anti-moisture bag should be kept in the environment withtemperature< 30℃ and
humidity< 85% RH.
2. The expiration date is 6 months since the dry packaging products was sealed.
 Cautions:
1. All the operators should wear electrostatic ringin the whole process of production.
2. While operating, water and dirt should not have any contact with the modules.
TYBT3 DATASHEET
This device complies with Part 15 of the FCC rules. Operation is subject to the
following two conditions: 1) this device may not cause harmful interference, and 2)
this device must accept any interference received, including interference that may
cause undesired operation.
Note: This equipment has been tested and found to comply with the limits for a Class
B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential installation.
This equipment generates uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that
interference will not occur in particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be determined by
turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
--Reorient or relocate the receiving antenna.
--Increase the separation between the equipment and receiver.
--Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
--Consult the dealer or an experienced radio/TV technician for help.
Changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
FCC Radiation Exposure Statement
This modular complies with FCC RF radiation exposure limits set forth for an
uncontrolled environment. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
Note 1: Compliance of this device in all final host configurations is the responsibility of the
Grantee. OEM integrators are responsible to satisfy RF exposure requirements. SAR evaluation is
valid for portable, mobile and fixed applications.
Note 2: Any modifications made to the module will void the Grant of Certification, this module is
limited to OEM installation only and must not be sold to end-users, end-user has no manual
instructions to remove or install the device, only software or operating procedure shall be placed
in the end-user operating manual of final products.
Note 3: The device must not transmit simultaneously with any other antenna or transmitter.
Note 4: To ensure compliance with all non-transmitter functions the host manufacturer is
responsible for ensuring compliance with the module(s) installed and fully operational. For
example, if a host was previously authorized as an unintentional radiator under the Declaration
of Conformity procedure without a transmitter certified module and a module is added, the host
manufacturer is responsible for ensuring that the after the module is installed and operational
the host continues to be compliant with the Part 15B unintentional radiator requirements. Since
this may depend on the details of how the module is integrated with the host, The manufacturer
shall provide guidance to the host manufacturer for compliance with the Part 15B requirements.
Note 5: FCC ID label on the final system must be labeled with “Contains FCC ID: XBI-TYBT3”
The transmitter module must be installed and used in strict accordance with the manufacturer's
instructions as described in the user documentation that comes with the host product.
SUNGALE ELECTRONICS (SHENZHEN) CO.,LTD is responsible for the compliance of the
module in all final hosts.

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