Samsung Electronics Co ATKM005000 IOT Module User Manual ARTIK 050 Datasheet
Samsung Electronics Co Ltd IOT Module ARTIK 050 Datasheet
User Manual
Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet Samsung’s ARTIK™ 050 Module is a highly-integrated module for secure Internet of Things (IoT) devices that require Wi-Fi. It is based on an ARM® Cortex® -R4 core with on-chip memories, a complete 2.4GHz Wi-Fi Phy, MAC layer processing, a large complement of standard digital buses, including audio (I S), and power management. The module is packaged with additional external Flash memory, a hardware Secure Element and a single integrated 2.4GHz structural antenna. The application processor is fully available for applications, since the Wi-Fi stack through the MAC layer is handled by a co-processor. Aimed especially at power-sensitive devices needing Wi-Fi, the ARTIK 050 Module provides excellent performance in a portable environment, with a feature set tailored specifically for IoT end nodes. Top View Processor Main CPU ARTIK 050 MODULE WLAN CPU INTERFACES RADIO SECURITY PROCESSOR Memory User Embedded RAM FLASH Security Secure Element 2MB 8MB SPI Flash on Module Hardware-protected key storage with secure point-to-point authentication and data transfer Radio Wi-Fi Power Management POWER MGT. ARM Cortex-R4, 32-bit address and data paths @ 320MHz, 32KB I$, 32KB D$ ARM Cortex-R4,32-bit address and data paths @ 160MHz MEMORY Single Supply IEEE802.11™ b/g/n 2.4GHz radio Provides all power on the ARTIK 050 Module using on board regulators Interfaces ARTIK 050 Module Block Diagram Digital I/O USB2.0, 2x I2C, 1x I2S, 2x SPI, 2x 2-UART, 6x PWM, 11x GPIOs (Dedicated), 5x GPIOs (Multiplexed) SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or other-wise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. Samsung Confidential Specifications in this document are tentative and subject to change. Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet TABLE OF CONTENTS Table of Contents ................................................................................................................................................................... 3 List of Figures ........................................................................................................................................................................................ 4 List of Tables .......................................................................................................................................................................................... 4 Version History ...................................................................................................................................................................................... 5 ARTIK 050 Module Block Diagram ....................................................................................................................................... 6 ARTIK 050 Module PADS ....................................................................................................................................................................... 6 ARTIK 050 Module Wi-Fi ....................................................................................................................................................................... 6 ARTIK 050 Module Flash ....................................................................................................................................................................... 7 ARTIK 050 Module Secure Element ..................................................................................................................................................... 7 ARTIK 050 Module Power Management ............................................................................................................................................. 8 ARTIK 050 Module Media SoC.............................................................................................................................................................. 8 ARTIK 050 Module PADs ...................................................................................................................................................... 10 ARTIK 050 Module GPIO Alternate Functions ................................................................................................................... 14 ARTIK 050 Module Booting Process ................................................................................................................................... 17 ARTIK 050 Module Electrical Specifications ...................................................................................................................... 18 Absolute Maximum Ratings ............................................................................................................................................................... 18 Recommended Operating Conditions .............................................................................................................................................. 18 Power Supply Requirements .............................................................................................................................................................. 19 ESD Ratings .......................................................................................................................................................................................... 21 DC Electrical Characteristics .............................................................................................................................................................. 22 AC Electrical Characteristics .............................................................................................................................................................. 23 ARTIK 050 Module Mechanical Specifications .................................................................................................................. 29 Ordering Information .......................................................................................................................................................... 31 FCC Certification ................................................................................................................................................................... 32 Legal Information ................................................................................................................................................................. 33 Samsung Confidential Specifications in this document are tentative and subject to change. Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet LIST OF FIGURES Figure 1. ARTIK 050 Module Functional Block Diagram ................................................................................................................ 6 Figure 2. ARTIK 050 Module Main SoC Block Diagram .................................................................................................................. 9 Figure 3. ARTIK 050 Module – Top View........................................................................................................................................... 9 Figure 4. ARTIK 050 Module PADs Bottom View ........................................................................................................................... 10 Figure 5. ARTIK 050 Module Power Distribution .......................................................................................................................... 19 Figure 6. ARTIK 050 Module Power Sequence ............................................................................................................................... 20 Figure 7. I S Tx Timing Diagram ..................................................................................................................................................... 23 Figure 8. I S Rx Timing Diagram ..................................................................................................................................................... 23 Figure 9. I S Frame Level Timing .................................................................................................................................................... 24 Figure 10. USB2.0 Bus Reset to High-Speed Mode Operation .................................................................................................... 25 Figure 11. USB2.0 High Speed Mode Transmit Timing ................................................................................................................ 25 Figure 12. USB2.0 High Speed Mode Receive Timing ................................................................................................................... 26 Figure 13. ARTIK 050 Module Mechanical Drawing Views .......................................................................................................... 29 Figure 14. ARTIK 050 Module Part Placement and Part Values.................................................................................................. 30 LIST OF TABLES Table 1. PAD Description ................................................................................................................................................................. 11 Table 2. GPIO Alternate Functions ................................................................................................................................................. 14 Table 3. GPIO Alternate Functions (continued) ............................................................................................................................ 16 Table 4. Absolute Maximum Ratings ............................................................................................................................................. 18 Table 5. Recommended Operating Conditions............................................................................................................................. 18 Table 6. ESD Ratings ........................................................................................................................................................................ 21 Table 7.I/O DC Characteristics ........................................................................................................................................................ 22 Table 8. I S Tx/Rx Timing Parameters ............................................................................................................................................ 24 Table 9. I S M_CLK Specification ..................................................................................................................................................... 24 Table 10. USB2.0 Timing Parameters ............................................................................................................................................ 27 Table 11. USB1.1 Timing Parameters ............................................................................................................................................ 27 Table 12.I/O AC Characteristics ...................................................................................................................................................... 28 Samsung Confidential Specifications in this document are tentative and subject to change. Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet VERSION HISTORY Revision Date Description Maturity 1.0 February 22, 2016 First version of datasheet Alpha Candidate 1.1 March 04, 2016 Added Table 9, Table 10, Table 11 and Table 12. Added Top view of the ARTIK 050 Module, Updated Figure 4. Alpha Candidate 1.15 March 07, 2016 Changed Figure 7, Figure 8, Figure 9, Figure 10, Figure 11, Figure 12. Changed Section Module Booting Process. Alpha Candidate 1.20 March 30, 2016 Changed Figure 3, Figure 4, added Figure 13, added Figure 14. Updated Front Page. Changed Module Flash Section. Updated section ARTIK 050 Module Media SoC section. Updated Table 1-5, updated Table 7,8. Changed Table 13. Alpha Candidate 1.21 April 4, 2016 Formatting, changed Top Logo, and first page. Alpha Release 1.22 April 11, 2016 Version Numbering Changed, changed first page. Alpha Release 1.23 April 27, 2016 Removed 802.11a functionality, Updated Page 1, Updated Figure 1, Updated Module Wi-Fi section, Updated Module Flash section, Updated Secure Element section, Updated Figure 2, Updated Figure 3, Updated Figure 4 Label, Updated ARTIK 050 Module Booting Process, Updated ARTIK 050 Module mechanical specifications and drawing section. Alpha Release 1.24 May 26, 2016 Updated Figure 1, 3, 4, 5, 13. Changed section ARTIK 050 Module Media SoC. Changed first Page and picture on first page. Updated Table 1, 2, 3, 4, 8. Changed WiFi-> Wi-Fi. Changes are based on HW small HW update. Alpha Release 1.25 May 27, 2016 Updated Figure 1. Updated Firgure 13. Updated Table 1. Alpha Release 1.26 June 13, 2016 Updated Table 1. Alpha Release 1.27 July 6, 2016 Updated Table 1, 7, 8. Added FCC certification section. ADDED figure 6, Power Up sequence. Updated to new template. Alpha Release Samsung Confidential Specifications in this document are tentative and subject to change. Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ARTIK 050 MODULE BLOCK DIAGRAM 58 PADS 11 GND VDD_VBAT VDDIO_RMII BCM43907 UART VDDIO_AUDIO 2N7002DW LEVEL VDDIO SHIFTER VDDIO USB_VDD_3V3 VDDIO_SD RF_ANT0 3V3 JTAG SPI (2x) IM8123SN DC-DC USB UART I2S (1+1) GPIO I2C (2x) PWM GND VDDIO RESET VIN UART PWR_RST SPI MX25L6433F 8MB FLASH VDDIO S3FT9MF SE METAL STRUCTURAL ANTENNA Figure 1. ARTIK 050 Module Functional Block Diagram ARTIK 050 MODULE PADS The ARTIK 050 Module utilizes 58 individual I/O PADS supporting Power, GND, RESET, GPIO, PWM, I C, I S, SPI, JTAG, UART and USB. The I/O PADS are directly available on the PCB to guarantee an absolute low cost solution. ARTIK 050 MODULE WI-FI The BCM43907 SoC, as part of the ARTIK 050 Module, provides IEEE 802.11™ b/g/n functionality into a single SoC. There is one 2.4GHz band which provides operation for IEEE 802.11n and legacy IEEE802.11b/g. In addition to the radio technology that is integrated into the device, there is a 2.4GHz power amplifier (PA) with integrated transmit and receive baluns. This level of integration guarantees an overall system cost that is very attractive for the ARTIK 050 Module. For detailed information on the BCM43907, contact Broadcom Ltd. Samsung Confidential Specifications in this document are tentative and subject to change. Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ARTIK 050 MODULE FLASH The ARTIK 050 Module carries a 64Mb (8MB) bits serial flash memory unit. The most important hardware features of the Serial Flash Memory are: 67108864x1 bit structure, 33554432x2 bit structure or 16777216x4 bit structure 2048 equal sectors of 4KB each, that can be erased individually 256 equal sectors of 32KB each, that can be erased individually 128 equal sectors of 64KB each, that can be erased individually The flash memory contains the OS and application code that is loaded during the boot sequence. For detailed information on the MX25L6433F, contact Macronix International Co., LTD. ARTIK 050 MODULE SECURE ELEMENT The S3FT9MF is a Secure Element from Samsung Electronics providing an ISO/IEC 7816 & 14443 compliant interface. The most important hardware features of the Secure Element are: Dedicated 16-bit SecuCalm CPU core Crypto co-processor Modular Multiplication accelerator RSA 2080bits ECC 512 bits Data security Memory encryption for all memory 256B read only and 256B non erasable area Selective reset operation if abnormal voltages/frequencies are detected Embedded tamper-free memory 32KB ROM 264KB FLASH 8.5KB Static RAM including 2.5KB crypto memory Serial interfaces: ISO 7816-3 compliant interface Asynchronous half-duplex character receive/transmit serial interface For more information on S3FT9MF contact Samsung Electronics Co., Ltd. Samsung Confidential Specifications in this document are tentative and subject to change. Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ARTIK 050 MODULE POWER MANAGEMENT The ARTIK 050 Module has dedicated power management, containing an IM8123SN high-efficiency step-down DC-DC convertor. The power management is set up such that it provides all power requirements for the module. The most important features of the power management on the ARTIK 050 Module are: Wide input range 4.5V ≤ VIN ≤ 18V Low shut down current Ishutdown ~ 5µ A Thermal shutdown protection High Switching Frequency 500 kHz For additional information on the IM8123SN, contact IMS Semiconductor Co., Ltd. ARTIK 050 MODULE MEDIA SOC The main SoC on the ARTIK 050 Module is based on the BCM43907 from Broadcom Ltd. Figure 2 shows the block schematic of the SoC. The system is architected with 2 dedicated Cortex-R4 cores. The first Cortex-R4 core, running at 160MHz, is solely responsible for WLAN activities. It contains 512KB of Tightly-Coupled (TC) RAM in addition to 320KB of TC ROM. The tight coupling assures that the WLAN functionality can operate fully autonomously. The second core, also a Cortex-R4, is specifically added for application processing. The core is supported by 2MB of SRAM for application code. The core can run in 2 speed modes. The 160MHz mode is available when conserving power is important, while the 320MHz mode can be used when more intensive processing is required. In addition to the dual core Cortex-R4, there is a wide array of interfaces available. The ARTIK 050 Module has 2x UART (2-pin), 2x I C, 11x GPIO (dedicated) + 5x GPIO (shared between JTAG), 6x PWM, 1x 4-pin I S (No Data In), 1x 5-pin I S, 2x SPI, 2x I C, 1x USB and 1x JTAG (that shared 5 GPIO pins) interface for debugging and bring-up activities. The great variety of interfaces makes the ARTIK 050 Module the right module for a wide variety of IoT markets. Samsung Confidential Specifications in this document are tentative and subject to change. Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet BCM43907 ALWAYS ON DOMAIN WLAN DOMAIN PMU 512KB RAM 320KB ROM IEEE 802.11 MAC PMU CONTROLLER 2.4GHz RADIO RTC IEEE 802.11n PHY CORTEX-R4 PS RAM AXI BRIDGE AXI BRIDGE APPS DOMAIN AXI BRIDGE AXI BRIDGE CRYPTOGRAPHY CORTEX-R4 32KB I-CACHE 32KB D-CACHE AXI BRIDGE High Speed I/F 2MB RAM 640KB ROM Multi Media Peripherals I2S UART BSC PWM SPI|BSC GPIO JTAG USB 2.0 AUDIO Figure 2. ARTIK 050 Module Main SoC Block Diagram Figure 3 shows the top side of the ARTIK 050 Module that is populated with the ARM application processor, the flash memory, the Secure Element and the Level Shifter. SECURE ELEMENT S3FT9MF LEVEL SHIFTER 2N7002DW PROCESSOR BCM43907 FLASH MX25L6433F STRUCTURAL ANTENNA WSANT2G01 Figure 3. ARTIK 050 Module – Top View Samsung Confidential Specifications in this document are tentative and subject to change. Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ARTIK 050 MODULE PADS The ARTIK 050 Module utilizes 58 individual PADS straight on the PCB. The 58 individual PADS provide Power, GND, RESET, GPIO, PWM, I2C, I2S, SPI, JTAG, UART and USB functionality. In Figure 4, logical listing is provided of all power/signal names that are assigned to physical pins of the PADS. In addition, Table 1 provides an in depth description of the functionality of each signal available on the PADS. GPIO_1_GSPI_MODE SPI_1_CLK SPI_1_MISC SPI_1_CS SPI_1_MOSI I2S1_MCK I2S1_SCK_BCLK I2S1_SD_IN I2S1_SD_OUT I2S1_WS_LRCLK I2C_1_SDA I2C_1_SCL RF_SW_CTRL_7_RSRC_INIT_MODE_ART1_TX_OUT RF_SW_CTRL_6_UART1_RX_IN GND GPIO_6_JTAG_TRST_L GPIO_5_JTAG_TDO GPIO_4_JTAG_TDI GPIO_16 I2S0_MCK I2S_SD_OUT I2S_SCK_BCLK PWR_RST VIN GND SPI_0_CLK SPI_0_CS SPI_0_MOSI 3.3V_OUT SPI_0_MISO RESET_N I2S0_WS_LRCLK GPIO_3_JTAG_TMS ARTIK 050 MODULE BOTTOM VIEW GPIO_15_HOST_VTRIM GPIO_2_JTAG_TCK 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 10 11 12 13 14 15 16 17 18 19 20 21 22 23 I2C_0_SCL I2C_0_SDA PWM_5 PWM_4 PWM_3 PWM_2 PWM_0 PWM_1 GPIO_0 GND USB2_DN USB2_DP GND GPIO_7_WCPU_BOOT_MODE GPIO_8_TAP_SEL GPIO_9_USB_HSIC_SEL GPIO_11_ACPU_BOOT_MODE UART_TXD UART_RXD GND GPIO_12 GPIO_14 GPIO_13_SDIO_MODE 35 34 33 32 31 30 29 28 27 26 25 24 Figure 4. ARTIK 050 Module PADs Bottom View Samsung Confidential Specifications in this document are tentative and subject to change. 10 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet Table 1. PAD Description DF Active Mode Low Power Mode Power Down Mode BCM I/O PU 3V35 BCM I/O PU PWM_5 3V35 BCM I/O PWM_4 3V35 BCM I/O PWM_3 3V35 BCM I/O PWM_2 3V35 BCM I/O PWM_0 3V35 PWM_1 PAD Name Voltage I/O [V] Type I2C_0_SCL 3V35 I2C_0_SDA DS Default [mA] Function Comments Comments for Design I2C0 CLK Internal 4.7K / 3.3V Pull-up I2C0 DATA Internal 4.7K / 3.3V Pull-up PWM 5 PWM 4 PWM 3 PWM 2 BCM I/O PWM 0 3V35 BCM I/O PWM 1 BCM I/O IN/PD IO/PU/P D/NP IO/PU/PD/N High-Z/NP USB20H_CTL GPIO 0 GPIO_0 3V35 10 GND 0V0 NA NA NA NA NA NA NA Ground USB2_DN For USB mode, need to connect overcurrent flag pin with 4.7K Pull-up 11 USB2_DN 3V35 BCM USB 12 USB2_DP 3V35 BCM USB USB2_DP 13 GND 0V0 NA NA NA NA NA NA NA Ground Boot Wireless CPU from Tightly Coupled RAM Internal 10K/3.3V Pull-up for boot mode : not recommended Pull down resistor GPIO 8, default function TAP_SEL_P Internal 10K/3.3V Pull-up for boot mode : not recommended Pull-down resistor Only fo Input, Not support Output GPIO_9 USB 2.0 PHY is selected Internal 10K/3.3V Pull-up for boot mode : not recommended Pull-down resistor Boot Main CPU from internal ROM For boot mode : not recommended Pull-up resistor Level Shifted UART_TXD Level Shifted UART_TXD, need to Pull-up resistor for UART communication 14 15 GPIO_7_WCPU_B OOT_MODE GPIO_8_TAP_SEL 16 GPIO_9_USB_HSI C_SEL 17 GPIO_11_ACPU_B OOT_MODE 18 UART_TXD 3V35 3V35 BCM I/O BCM I/O 3V35 BCM I 3V35 BCM I/O 3V35 BCM UART (LS) IN/PU IN/PU IO/PU/P D/NP IO/PU/P D/NP IO/PU/PD/N IO/PU/PD/N IN/PU IO/PU/P D/NP IO/PU/PD/N IN/PD IO/PU/P D/NP IO/PU/PD/N Samsung Confidential High-Z/NP High-Z/NP High-Z/NP High-Z/NP GPIO_8 Specifications in this document are tentative and subject to change. 11 Samsung Semiconductor, Inc. PAD ARTIK 050 Module Data Sheet Voltage I/O [V] Type Name DF BCM UART (LS) 0V0 NA NA 19 UART_RXD 3V35 20 GND Active Mode Low Power Mode Power Down Mode DS Default [mA] Function Comments Comments for Design Level Shifted UART_RXD, need to Pull-up resistor for UART communication 1K serial resistor after Levelshifter, not recommended serial resister over 1K Level Shifted UART_RXD NA NA NA NA NA Ground IN/NP IO/PU/P D/NP IO/PU/PD/N High-Z/NP GPIO_12 GPIO 12 IN/NP IO/PU/P D/NP IO/PU/PD/N High-Z/NP GPIO_14 GPIO 14 IN/PU IO/PU/P D/NP IO/PU/PD/N GPIO 13 boot strap SDIO_MODE Internal 10K/3.3V Pull-up for boot mode : not recommended Pull up resistor IO/PU/PD/N High-Z/NP GPIO 15 boot strap VTRIM_EN for boot mode : not recommanded Pull-up resistor 21 GPIO_12 3V35 BCM I/O 22 GPIO_14 3V35 BCM I/O 23 GPIO_13_SDIO_M ODE 3V35 BCM I/O 24 GPIO_15_HOST_V TRIM 3V35 BCM I/O IN/PD IO/PU/P D/NP 25 GPIO_16 3V35 BCM I/O IN/NP IO/PU/P D/NP IO/PU/PD/N High-Z/NP GPIO 16 26 I2S0_MCK 3V35 BCM I/O I2S 0 MCK 27 I2S0_SCK_BLCK 3V35 BCM I/O I2S 0 SCK_BLCK 28 I2S0_SD_OUT 3V35 BCM I/O I2S 0 SD_OUT 29 I2S0_WS_LRCLK 3V35 BCM I/O I2S 0 WS_LRCLK 30 PWR_RST NA Power En Input if PWR_RST is 0 DCDC disabled 31 GND 0V0 NA NA NA NA NA NA NA Ground Ground NA NA NA NA NA NA Power MIN 4.75 ~ MAX 18V High-Z/NP 150Kohm PU, 75Kohm PD, VIH 1.45V, VIL 0.4V 32 VIN 4V5 Power Input 33 SPI_0_CLK 3V35 BCM I/O SPI 0 CLK 34 SPI_0_MOSI 3V35 BCM I/O SPI 0 MOSI 35 SPI_0_MISO 3V35 BCM I/O SPI 0 MISO 36 SPI_0_CS 3V35 BCM I/O SPI 0 CS 37 3.3V_OUT 3V35 NA NA NA NA NA NA NA Power Power pin for 050 IO port, Current limit 100mA @3.3V 38 RESET_N 3V35 BCM RESET Reset ARTIK 050 Module Reset pin, not recommended Pull-down resister 39 GPIO_3_JTAG_TM 3V35 BCM I/O IN/PD IO/PU/P D/NP IO/PU/PD/N High-Z/NP GCI_GPIO(1) Debug_JTAG 40 GPIO_4_JTAG_TDI 3V35 BCM I/O IN/NP IO/PU/P D/NP IO/PU/PD/N High-Z/NP GCI_GPIO(2) Debug_JTAG Samsung Confidential Specifications in this document are tentative and subject to change. 12 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet DF Active Mode Low Power Mode Power Down Mode BCM I/O NP IO/PU/P D/NP IO/PU/PD/N High-Z/NP GCI_GPIO(0) Debug_JTAG 3V35 BCM I/O IN/PD IO/PU/P D/NP IO/PU/PD/N High-Z/NP GCI_GPIO(3) Debug_JTAG GPIO_6_JTAG_TRS T_L 3V35 BCM I/O IN/NP IO/PU/P D/NP IO/PU/PD/N High-Z/NP GCI_GPIO(4) Debug_JTAG 44 GND 0V0 NA NA NA NA NA NA NA Ground 45 RF_SW_CTRL_6_U ART1_RX_IN 3V35 BCM I/O OUT/NP O/NP O/NP High-Z RF_SW+CTRL_6 Debug_UART_RX 46 RF_SW_CTRL_7_R SRC_INIT_MODE_ UART1_TX_OUT 3V35 BCM I/O IN/PD O/NP O/NP High-Z RF_SW+CTRL_7 PMU enable strap Debug_UART_TX 47 I2C_1_SCL 3V35 BCM I/O PU I2C 1 SCL Internal 4.7K/3.3V Pull-up 48 I2C_1_SDA 3V35 BCM I/O PU I2C 1 SDA Internal 4.7K/3.3V Pull-up 49 I2S1_WS_LRCLK 3V35 BCM I/O I2S 1 WS_LRCLK 50 I2S1_SD_OUT 3V35 BCM I/O I2S 1 SD_OUT 51 I2S1_SD_IN 3V35 BCM I/O I2S 1 SD_IN 52 I2S1_SCK_BCLK 3V35 BCM I/O I2S 1 SCK_BCLK 53 I2S1_MCK 3V35 BCM I/O I2S 1 MCK 54 SPI_1_MOSI 3V35 BCM I/O SPI 1 MOSI 55 SPI_1_CS 3V35 BCM I/O SPI 1 CS 56 SPI_1_MISO 3V35 BCM I/O SPI 1 MISO 57 SPI_1_CLK 3V35 BCM I/O SPI 1 CLK 58 GPIO_1_GSPI_MO DE 3V35 BCM I/O NP IO/PU/P D/NP IO/PU/PD/N GPIO 1 with GSPI_MODE strap PAD Voltage I/O [V] Type Name 41 GPIO_2_JTAG_TC 3V35 42 GPIO_5_JTAG_TD 43 High-Z/NP DS Default [mA] Function Comments Comments for Design For boot mode : not recommended Pull-up resistor *PU = Pull Up, PD = Pull Down, NP = No Pull Samsung Confidential Specifications in this document are tentative and subject to change. 13 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ARTIK 050 MODULE GPIO ALTERNATE FUNCTIONS All the GPIOs, as indicated in Table 1, have alternate functions that can be programmed using the GPIO API provided in the SW development environment. In Table 2 and Table 3, the alternate functions of all GPIOs connected only to the BCM43907 that are available on the PADS of the ARTIK 050 Module are described. Table 2. GPIO Alternate Functions PAD Name DF F1 F2 F3 F4 F5 I2C_0_SCL I2C_0_SDA I2C0_CLK GPIO_22 GPIO_29 I2C0_SDATA GPIO_21 GPIO_28 PWM_5 PWM5 GPIO_8 GPIO_23 PWM_4 PWM4 GPIO_6 GPIO_22 PWM_3 PWM3 GPIO_5 GPIO_21 PWM_2 PWM2 GPIO_4 GPIO_20 PWM_0 PWM0 GPIO_2 GPIO_18 PWM_1 PWM1 GPIO_3 GPIO_19 GPIO_0 USB20H_CT GPIO_0 UART0_RXD I2C1_SDATA PWM0 SPI1_MISO 14 GPIO_7_WCPU_BOOT_MODE GPIO_7 UART0_RTS_OU PWM1 PWM3 SPI1_CS 15 GPIO_8_TAP_SEL GPIO_8 GPIO_8 SPI1_MISO PWM2 PWM4 UART0_RXD 16 GPIO_9_USB_HSIC_SEL GPIO_9 GPIO_9 SPI1_CLK PWM3 PWM5 UART0_TXD 17 GPIO_11_ACPU_BOOT_MODE GPIO_11 SPI1_CS PWM5 I2C1_CLK UART0_RTS_OU 21 GPIO_12 GPIO_12 GPIO_12 I2C1_SDATA UART0_RXD SPI1_MISO PWM2 22 GPIO_14 GPIO_14 GPIO_14 PWM0 UART0_CTS_IN SPI1_MOSI I2C1_SDATA 23 GPIO_13_SDIO_MODE GPIO_13 I2C1_CLK UART0_TXD SPI1_CLK PWM3 SPI1_CS I2C1_CLK 24 GPIO_15_HOST_VTRIM GPIO_15 PWM1 UART0_RTS_OU 25 GPIO_16 GPIO_16 UART0_CTS_IN PWM0 PWM2 SPI1_MOSI 26 I2S0_MCK I2S_MCLK0 GPIO_23 GPIO_0 27 I2S0_SCK_BLCK I2S_SCLK0 GPIO_24 GPIO_2 28 I2S0_SD_OUT I2S_SDATAO0 GPIO_27 GPIO_5 29 I2S0_WS_LRCLK I2S_LRCLK0 GPIO_25 GPIO_3 33 SPI_0_CLK SPI0_CLK GPIO_18 GPIO_25 34 SPI_0_MOSI SPI0_MOSI GPIO_19 GPIO_26 35 SPI_0_MISO SPI0_MISO GPIO_17 GPIO_24 36 SPI_0_CS SPI0_CS GPIO_20 GPIO_27 39 GPIO_3_JTAG_TMS GCI_GPIO(1) GPIO_3 GCI_GPIO_ 40 GPIO_4_JTAG_TDI GCI_GPIO(2) GPIO_4 GCI_GPIO_ 41 GPIO_2_JTAG_TCK GCI_GPIO(0) GPIO_2 GCI_GPIO_ 42 GPIO_5_JTAG_TDO GCI_GPIO(3) GPIO_5 GCI_GPIO_ 43 GPIO_6_JTAG_TRST_L GCI_GPIO(4) GPIO_6 GCI_GPIO_ 45 RF_SW_CTRL_6_UART1_RX_IN RF_SW+CTRL_ UART_DBG_RX SECI_IN Samsung Confidential Specifications in this document are tentative and subject to change. 14 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet PAD Name DF F1 F2 F3 F4 F5 46 RF_SW_CTRL_7_RSRC_INIT_ MODE_UART1_TX_OUT RF_SW+CTRL_ UART_DBG_TX SECI_OUT 49 I2S1_WS_LRCLK I2S_LRCLK1 GPIO_0 GPIO_31 50 I2S1_SD_OUT I2S_SDATAO1 GPIO_28 GPIO_6 51 I2S1_SD_IN I2S_SDATAI1 GPIO_29 GPIO_8 52 I2S1_SCK_BCLK I2S_SCLK1 GPIO_31 GPIO_30 53 I2S1_MCK I2S_MCLK1 GPIO_30 GPIO_17 58 GPIO_1_GSPI_MODE GPIO_1 UART0_TXD I2C1_CLK PWM1 SPI1_CLK Samsung Confidential Specifications in this document are tentative and subject to change. 15 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet Table 3. GPIO Alternate Functions (continued) PAD Name F6 F7 F8 F9 F10 F11 I2C_0_SCL I2C_0_SDA PWM_5 PWM_4 PWM_3 PWM_2 PWM_0 PWM_1 GPIO_0 PWM2 GPIO_12 GPIO_8 PWM4 USB20H_CTL 14 GPIO_7_WCPU_BOOT_MODE I2C1_CLK GPIO_15 GPIO_11 PMU_TEST_O PWM5 PWM0 15 GPIO_8_TAP_SEL GPIO_16 GPIO_12 TAP_SEL_P I2C1_SDAT 16 GPIO_9_USB_HSIC_SEL GPIO_0 GPIO_13 I2C1_CLK PWM1 17 GPIO_11_ACPU_BOOT_MODE PWM1 GPIO_7 GPIO_15 PWM3 SDIO_SEP_INT PWM2 21 GPIO_12 PWM4 GPIO_8 GPIO_16 PWM0 SDIO_SEP_ INT_0D 22 GPIO_14 GPIO_10 PWM4 23 GPIO_13_SDIO_MODE PWM5 GPIO_9 GPIO_0 PWM1 24 GPIO_15_HOST_VTRIM GPIO_11 GPIO_7 PWM5 PWM3 25 GPIO_16 I2C1_SDATA GPIO_14 GPIO_10 RF_DISABLE_L PWM4 26 I2S0_MCK 27 I2S0_SCK_BLCK 28 I2S0_SD_OUT 29 I2S0_WS_LRCLK 33 SPI_0_CLK 34 SPI_0_MOSI 35 SPI_0_MISO 36 SPI_0_CS 39 GPIO_3_JTAG_TMS TMS 40 GPIO_4_JTAG_TDI TDI 41 GPIO_2_JTAG_TCK TCK 42 GPIO_5_JTAG_TDO TDO 43 GPIO_6_JTAG_TRST_L TRST_L 45 RF_SW_CTRL_6_UART1_RX_IN 46 RF_SW_CTRL_7_RSRC_INIT_ MODE_UART1_TX_OUT 49 I2S1_WS_LRCLK 50 I2S1_SD_OUT 51 I2S1_SD_IN 52 I2S1_SCK_BCLK 53 I2S1_MCK 58 GPIO_1_GSPI_MODE PWM3 GPIO_13 GPIO_9 PWM5 Samsung Confidential Specifications in this document are tentative and subject to change. 16 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ARTIK 050 MODULE BOOTING PROCESS When booting the ARTIK 050 Module, various strapping options are used to guarantee a certain booting behavior. In addition, some GPIOs are set to perform alternate functions instead of their default boot-up behavior. The following summary provides a list reflecting what strapping options were used and what states certain GPIOs will attain: Boot Wireless CPU from tightly coupled RAM using GPIO_7_WCPU_BOOT_MODE as high during boot Boot main CPU from internal ROM using GPIO_11_ACPU_BOOT_MODE as low during boot Set GPIO_8_TAP_SEL in TAP_SEL_P default mode Enable USB 2.0 PHY using GPIO_9_USB_HSIC_SEL as high during boot Enable PMU resource initialization mode selection using RF_SW_CTRL_7_RSRC_INIT_MODE_UART1_TX_OUT as low during boot Set RF_SW_CTRL_6_UART1_RX_IN in UART_DBG_RX default mode Set GPIO_2_JTAG_TCK as JTAG_TCK default mode Set GPIO_3_JTAG_TMS as JTAG_TMS default mode Set GPIO_4_JTAG_TDI as JTAG_TDI default mode Set GPIO_5_JTAG_TDO as JTAG_TDO default mode Set GPIO_6_JTAG_TRST_L as JTAG_TRST_L default mode Once the boot is completed, most of the GPIO pins that are not set for alternate functions can be used as generic GPIOs. In addition, the GPIO pins can always be reprogrammed to functions that serve the product’s design needs. Samsung Confidential Specifications in this document are tentative and subject to change. 17 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ARTIK 050 MODULE ELECTRICAL SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS Absolute maximum ratings are those ratings where permanent damage to the ARTIK 050 Module can occur. Functional operation at absolute maximum ratings is not guaranteed and not recommended. Table 4. Absolute Maximum Ratings PAD:[Pin#] Symbol Condition Min Typ Max Units VIN Input voltage VIN on the high efficiency step down converter (IM8123SM) – – 20 PAD:[1,2,3,4,5,6,7,8,9,14,15, 16,17,21,22,23,24,25,26,27, 28,29,33,34,35,36,39,40, 41,42,43,45,46,47,48,49,50, 51,52,53,54,55,56,57,58] Vundershoot Undershoot voltage for I/O -0.50 – – PAD:[30] PWR_RST – -0.30 – 20.3 VMAX IO is running at 3.3V level shifter is closed so 60+3.3 – – 63.3 Continuous – – 115 mA Continuous at 100°C – – 73 mA Pulsed – – 800 mA PAD:[32] PAD:[18,19] IMAX RECOMMENDED OPERATING CONDITIONS The following table describes the operating conditions of the ARTIK 050 Module: Table 5. Recommended Operating Conditions PAD:[Pin#] PAD:[32] – Symbol Condition Min Typ Max Units VIN Input voltage VIN on the high efficiency step down converter (IM8123SM) 4.50 – 18.0 TO Maximum operating temperature -25 – 85 °C TS Storage temperature -40 – 125 °C Samsung Confidential Specifications in this document are tentative and subject to change. 18 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet POWER SUPPLY REQUIREMENTS PWR_RST VIN 58 PADS GND VDDIO IM8123SN DC-DC GND VDD_VBAT 3V3 VDDIO_RMII BCM43907 VDDIO USB_VDD_3V3 MX25L6433F 8MB FLASH VDDIO_SD 2N7002DW LEVEL VDDIO SHIFTER VDDIO_AUDIO VDDIO S3FT9MF SE Figure 5. ARTIK 050 Module Power Distribution The power management of the ARTIK 050 Module, as depicted in Figure 5, contains the IM8123SN high-efficiency DC-DC convertor that will handle all power requirements for the ARTIK 050 Module. Samsung Confidential Specifications in this document are tentative and subject to change. 19 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet Figure 6. ARTIK 050 Module Power Sequence Note : The BCM43907 has an internal power-on reset (POR) circuit. The device will be held in reset for a maximum of 110 ms after VDDC and VDDIO have both passed the POR threshold. Note : The 10%-90% VBAT rise time should not be faster than 40µ s. VBAT should be up before or at the same time as VDDIO. VDDIO should not be present first or be held high before VBAT is high. Samsung Confidential Specifications in this document are tentative and subject to change. 20 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ESD RATINGS Table 6. ESD Ratings Parameter Min Typ Max Units ESD stress voltage Human Body Model -1.0 – 1.0 kV – 250 – ESD stress voltage Charged Device Model Samsung Confidential Specifications in this document are tentative and subject to change. 21 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet DC ELECTRICAL CHARACTERISTICS Table 7 below describes the DC characteristics for all GPIO pins that are available on the PAD. Table 7.I/O DC Characteristics PAD:[Pin#] PAD:[1,2,3,4,5,6,7,8,9,14, 15,16,17,21,22,23,24,25, 26,27,28,29,33,34,35, 36,39,40,41,42,43,45,46, 47,48,49,50,51,52,53,54, 55,56,57,58] PAD:[19] PAD:[45,46]* Symbo Condition Min Typ Max Unit VIH Input high voltage 2.00 – – VIL Input low voltage – – 0.80 VOH Output high voltage @ 2mA 2.90 – – VOL Output low voltage @ 2mA – – 0.40 VIH Input high voltage 3.5 20 VIL Input low voltage – – 0.2 CIN Input capacitance – – pF *Programmable 2mA to 16mA drive strength. The default is 10mA. Samsung Confidential Specifications in this document are tentative and subject to change. 22 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet AC ELECTRICAL CHARACTERISTICS This section describes the timing and its associated constraints on the various interfaces (I C, I S, etc.) that can be found on the PAD. I S TX TIMING DIAGRAM tHC = 0.35T tRC thtr = 0 I2S_SCLK VH = 2.0V VL = 0.8V tLC = 0.35T tdtr = 0.8T I2S_SDATAO and I2S_LRCK T = Clock Period Ttr = Minimum allowed Clock Period for transmitter T > Ttr tRC is only relevant for transmitters in Slave mode Figure 7. I S Tx Timing Diagram I S RX TIMING DIAGRAM tHC = 0.35T VH = 2.0V VL = 0.8V tLC = 0.35T I2S_SCLK tsr = 0.2T thr = 0 I2S_SDATAI and I2S_LRCK T = Clock Period Tr = Minimum allowed Clock Period for transmitter T > Tr Figure 8. I S Rx Timing Diagram Samsung Confidential Specifications in this document are tentative and subject to change. 23 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet I S RECEIVER/TRANSMITTER TIMING PARAMETERS Table 8. I S Tx/Rx Timing Parameters Transmitter Lower Limit Parameter Receiver Upper Limit Lower Limit Minimu Maximu Minimu Maximu Minimu Maximu Ttr – – – Ttr – Clock HIGH, tHC – 0.35Tr – – – 0.35Tr Clock LOW, tLC – 0.35Tr – – – 0.35Tr Clock rise time, tRC – – 0.15Tr – – – Transmitter Delay, tdtr – – – 0.8T – – Transmitter Hold Time, thtr – – – – – Receiver Setup Time, tsr – – – – – 0.2Tr Receiver Hold Time, thr – – – – – Clock Period T Slave Mode: – Table 9. I S M_CLK Specification Minimu Parameter Typica Maximu Unit Frequency Range – 40 MHz Frequency Accuracy (with respect to the XTAL frequency) – – ppb Tuning Resolution – 50 – ppb Tuning Range – 1000 – ppm Tuning Step Size – – 10 ppm Tuning Rate – – ppm/ms Baseband Jitter (100Hz–40kHz) – – 100 ps rms Wideband Jitter (100Hz–1MHz) – – 200 ps rms I S FRAME LEVEL TIMING 1/fs Left Channel I2S_LRCLK Right Channel I2S_SCLK 1 clock I/O Data 1 2 3 1 clock n-2 n-1 n MSB 1 2 3 LSB MSB n-2 n-1 n LSB Figure 9. I S Frame Level Timing Samsung Confidential Specifications in this document are tentative and subject to change. 24 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet USB PHY TIMING DIAGRAMS 40 to 60 µs < 100 µs DP DM 100 to 500 µs Idle HS Data High-Speed Chirp Device K-Chirp Idle 3 to 3.125 ms HS Data > 1.0 ms 100 to 875 µs < 7 ms > 10 ms Start of Reset Device goes into FullSpeed Mode Start of Host (Hub) Chirp End of Host (Hub) Chirp End of Reset Device Tests for Single-Ended Zero (SE0 State) Figure 10. USB2.0 Bus Reset to High-Speed Mode Operation 96 bits DP/DM Latency = 42 bits CLK60 TXDATA TXVALID PID B0 B1 Tx driver is enabled here TXREADY XVERSEL 00 OPMODE 00 TERMSEL Figure 11. USB2.0 High Speed Mode Transmit Timing Samsung Confidential Specifications in this document are tentative and subject to change. 25 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet Latency = 72 bits 64 bits DP/DM CLK60 RXDATA B0 B1 B2 RXACTIVE RXVALID XVERSEL 00 OPMODE 00 TERMSEL Figure 12. USB2.0 High Speed Mode Receive Timing Samsung Confidential Specifications in this document are tentative and subject to change. 26 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet USB PHY TIMING PARAMETERS Table 10. USB2.0 Timing Parameters Minimu Typica Maximu Parameter Symbol Conditions Units Baud Rate BPS – – 480 – Mbps Unit Interval UI – – 2083 – ps Receiver in HS Mode Differential Input Voltage Sensitivity VHSDI Static Condition |VIDP-VIDN| 300 – – mV Input Common Mode Voltage Range VHSCM – -50 – 500 mV Receiver Jitter Tolerance ΔTHSRX – -0.15 – 0.15 UI Input Impedance RIN Single Ended 40.5 45 49.5 Ω Ouput High Voltage VHSOH Static Condition 360 400 440 mV Output Low Voltage VHSOL Static Condition -10 10 mV Ouput Rise Time THSR 10% – 90% 500 – – ps Transmitter in HS Mode Output Fall Time THSF 90% – 10% 500 – – ps Transmitter Jitter ΔτHSTX Transmit Output Jitter -0.05 – 0.05 UI Output Impedance RO Single Ended 40.5 45 49.5 Ω Chirp-J Output Voltage (Differential) VCHIRPJ HS Termination Disabled. 1.5kΩ±5% Pull-up Resistor Connected 700 – 1100 mV Chirp-K Output Voltage (Differential) VCHIRPK HS Termination Disabled. 1.5kΩ±5% Pull-up Resistor Connected -900 – -500 mV Table 11. USB1.1 Timing Parameters Minimu Typica Maximu Units Parameter Symbol Conditions Baud Rate FS BPS – – 12 – Mbps Baud Rate LS BPS – – 1.5 – Mbps Unit Interval FS UI – – 83.33 – ns Unit Interval LS UI – – 666.67 – ns 200 – – mV Receiver Differential Input Voltage Sensitivity VFSDI Static Condition |VIDP-VIDN| Input Common Mode Voltage Range VFSCM – 0.8 – 2.5 Input Impedance ZIN – 300 – – kΩ Input High Voltage VFSIH Static Condition 2.0 – – Input Low Voltage VFSIL Static Condition – – 0.8 Ouput High Voltage VFSOH Static Condition 2.8 – – Output Low Voltage VFSOL Static Condition – – 0.3 Ouput Rise/Fall Time for Fast Speed TFSR , TFSF 10% – 90% – 20 ns Ouput Rise/Fall Time for Low Speed TLSR , TLSF 10% – 90% 75 – 300 ns Fast Speed Jitter ΔτFSTX – -2 – ns Low Speed Jitter ΔτLSTX – -25 – 25 ns Ouput Impedance RO Single Ended 28 – 44 Ω Transmitter Samsung Confidential Specifications in this document are tentative and subject to change. 27 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet Table 12.I/O AC Characteristics PAD:[Pin#] Symbol Condition Min Typ Max Units – 37.8 50 pF – 12.4 25 pF – 6.5 pF – 5.85 20 ns – 12.5 20 ns Dynamic Characteristics CISS PAD:[18,19] Input Capacitance COSS Output Capacitance CRSS Reverse Transfer Capacitance VPAD:[33,34,35,36]=28.3V, f=1.0MHz Switching Characteristics tD(ON) Turn-on Delay Time tD(OFF) Turn-off Delay Time V*PAD-PAD =30V, IPAD-PAD=0.2A, VGEN=10V, RL=150Ω, RGEN=25Ω *PAD-PAD means from PAD:[18] to PAD:[18] or from PAD:[19] to PAD:[19], it is the voltage swing over time on PAD:[18] or PAD:[19] Samsung Confidential Specifications in this document are tentative and subject to change. 28 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ARTIK 050 MODULE MECHANICAL SPECIFICATIONS The ARTIK 050 Module supports 58x PADs. The mechanical dimensions of the top view and bottom view of the ARTIK 050 Module with its dimensions can be found in Figure 13. Figure 14 provides the part placement and part values of the most important components on the ARTIK 050 Module. 18mm Do not place any component on bottom except defined solder plates. 16mm North North Wi-Fi antenna is placed at the north side. TOP BOTTOM 58 West 40mm East 38mm 40mm 23 solder plates 27.0mm East South 36 South 1.5mm 1.3mm 0.2mm 35 2.1mm 23 solder plates 27.0mm West 23 1.5mm 24 12 solder plates 13.8mm 2.1mm 0.6mm 1.2mm 0.6mm 0.6mm Figure 13. ARTIK 050 Module Mechanical Drawing Views Samsung Confidential Specifications in this document are tentative and subject to change. 29 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet Figure 14. ARTIK 050 Module Part Placement and Part Values Samsung Confidential Specifications in this document are tentative and subject to change. 30 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet ORDERING INFORMATION Please contact via ARTIK official webpage – http://www.artik.io Samsung Confidential Specifications in this document are tentative and subject to change. 31 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet FCC CERTIFICATION This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. 2. This device may not cause harmful interference, and This device must accept any interference received, including interference that may cause undesired operation. Caution: Any changes or modifications to the equipment not expressly approved by the party responsible for compliance could void user’s authority to operate the equipment. This appliance and its antenna must not be co-located or operation in conjunction with any other antenna or transmitter. A minimum separation distance of 20cm must be maintained between the antenna and the person for this appliance to satisfy the RF exposure requirements. Instruction to OEM This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions: 1. This device may not cause interference and 2. This device must accept any interference, including interference that may cause undesired operation of the device. This application and its antenna must not be co-located or operation in conjunction with any other antenna or transmitter. A minimum separation distance of 20cm must be maintained between the antenna and the person for this appliance to satisfy the RF exposure requirements. Host labeling requirement: “Contains transmitter module FCC ID: A3LATKM005000 IC ID: 649E-ATKM005000” This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: 1. 2. This device may not cause harmful interference, and This device must accept any interference received, including interference that may cause undesired operation. Samsung Confidential Specifications in this document are tentative and subject to change. 32 Samsung Semiconductor, Inc. ARTIK 050 Module Data Sheet LEGAL INFORMATION INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH THE SAMSUNG ARTIK™ DEVELOPMENT KIT AND ALL RELATED PRODUCTS, UPDATES, AND DOCUMENTATION (HEREINAFTER “SAMSUNG PRODUCTS”). NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. THE LICENSE AND OTHER TERMS AND CONDITIONS RELATED TO YOUR USE OF THE SAMSUNG PRODUCTS ARE GOVERNED EXCLUSIVELY BY THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT THAT YOU AGREED TO WHEN YOU REGISTERED AS A DEVELOPER TO RECEIVE THE SAMSUNG PRODUCTS. EXCEPT AS PROVIDED IN THE SAMSUNG ARTIK™ DEVELOPER LICENSE AGREEMENT, SAMSUNG ELECTRONICS CO., LTD. AND ITS AFFILIATES (COLLECTIVELY, “SAMSUNG”) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION CONSEQUENTIAL OR INCIDENTAL DAMAGES, AND SAMSUNG DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, ARISING OUT OF OR RELATED TO YOUR SALE, APPLICATION AND/OR USE OF SAMSUNG PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATED TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT. SAMSUNG RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION, DOCUMENTATION AND SPECIFICATIONS WITHOUT NOTICE. THIS INCLUDES MAKING CHANGES TO THIS DOCUMENTATION AT ANY TIME WITHOUT PRIOR NOTICE. THIS DOCUMENTATION IS PROVIDED FOR REFERENCE PURPOSES ONLY, AND ALL INFORMATION DISCUSSED HEREIN IS PROVIDED ON AN “AS IS” BASIS, WITHOUT WARRANTIES OF ANY KIND. SAMSUNG ASSUMES NO RESPONSIBILITY FOR POSSIBLE ERRORS OR OMISSIONS, OR FOR ANY CONSEQUENCES FROM THE USE OF THE DOCUMENTATION CONTAINED HEREIN. Samsung Products are not intended for use in medical, life support, critical care, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. This document and all information discussed herein remain the sole and exclusive property of Samsung. All brand names, trademarks and registered trademarks belong to their respective owners. For updates or additional information about Samsung ARTIK™, contact the Samsung ARTIK™ team via the Samsung ARTIK™ website at www.artik.io. Copyright © 2016 Samsung Electronics Co., Ltd. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior written consent of Samsung Electronics. Samsung Confidential Specifications in this document are tentative and subject to change. 33
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