Sierra Wireless HL7650 HL7650 module User Manual

Sierra Wireless Inc. HL7650 module

User manual

Product Technical Specification AirPrime HL7650 41110363 4.0 October 18, 2017
41110363 Rev 4.0 October 18, 2017 2 Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without proper device certifications. These areas include environments where cellular radio can interfere such as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitations of Liability This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or implied, including any implied warranties of merchantability, fitness for a particular purpose, or noninfringement. The recipient of the manual shall endorse all risks arising from its use. The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product.
41110363 Rev 4.0 October 18, 2017 3 Product Technical Specification Patents This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM®. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from MMP Portfolio Licensing. Copyright © 2017 Sierra Wireless. All rights reserved. Trademarks Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries. Watcher® is a registered trademark of NETGEAR, Inc., used under license. Windows® and Windows Vista® are registered trademarks of Microsoft Corporation. Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other countries. QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license. Other trademarks are the property of their respective owners. Contact Information Sales information and technical support, including warranty and returns Web: sierrawireless.com/company/contact-us/ Global toll-free number: 1-877-687-7795 6:00 am to 5:00 pm PST Corporate and product information Web: sierrawireless.com
41110363 Rev 4.0 October 18, 2017 4 Product Technical Specification Document History Version Date Updates 1.0 January 26, 2017 Creation 1.1 February 01, 2017 Changed remaining instances of SIM to USIM 2.0 May 04, 2017 Updated:  Protocol Stack row of Table 2 General Features  3.2 Current Consumption  3.16.2 RF Performances  4 Mechanical Drawings 3.0 June 22, 2017 Added section 5.3 Hardware Fast Shut Down Updated:  3.2 Current Consumption  Table 20 Digital I/O Electrical Characteristics  3.16.2 RF Performances  3.16.3 TX_ON Indicator (TX_ON)  4 Mechanical Drawings 4.0 October 18, 2017 Added 7 FCC Regulations Updated Table 43 TX_ON Burst Characteristics
41110363 Rev 4.0 October 18, 2017 5 Contents 1. INTRODUCTION ................................................................................................ 10 1.1. Common Flexible Form Factor (CF3) ................................................................................ 10 1.2. Physical Dimensions ......................................................................................................... 10 1.3. General Features ............................................................................................................... 11 1.4. Architecture........................................................................................................................ 13 1.5. Interfaces ........................................................................................................................... 13 1.6. Connection Interface ......................................................................................................... 14 1.7. ESD ................................................................................................................................... 15 1.8. Environmental and Certifications ....................................................................................... 15 1.8.1. Environmental Specifications ................................................................................... 15 1.8.2. Regulatory ................................................................................................................ 16 1.8.3. RoHS Directive Compliant ....................................................................................... 16 1.8.4. Disposing of the Product .......................................................................................... 16 1.9. References ........................................................................................................................ 16 2. PAD DEFINITION ............................................................................................... 17 2.1. Pad Types .......................................................................................................................... 21 2.2. Pad Configuration (Top View, Through Module) ............................................................... 22 3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 23 3.1. Power Supply..................................................................................................................... 23 3.2. Current Consumption ........................................................................................................ 24 3.3. VGPIO ............................................................................................................................... 25 3.4. BAT_RTC .......................................................................................................................... 25 3.5. USIM Interface ................................................................................................................... 26 3.5.1. UIMx_CLK ................................................................................................................ 27 3.5.2. UIMx_DET ............................................................................................................... 27 3.6. USB Interface .................................................................................................................... 28 3.7. Electrical Information for Digital I/O ................................................................................... 29 3.8. General Purpose Input/Output (GPIO) .............................................................................. 29 3.9. Main Serial Link (UART1) .................................................................................................. 30 3.10. POWER-ON Signal (PWR_ON_N).................................................................................... 31 3.11. Reset Signal (RESET_IN_N) ............................................................................................. 31 3.12. Analog to Digital Converter (ADC)..................................................................................... 32 3.13. Clock Out Interface ............................................................................................................ 33 3.14. Digital Audio (PCM) Interface ............................................................................................ 34 3.14.1. PCM Waveforms ...................................................................................................... 35 3.14.2. PCM Master Mode ................................................................................................... 36 3.14.3. PCM Slave Mode ..................................................................................................... 37
41110363 Rev 4.0 October 18, 2017 6 Product Technical Specification 3.15. JTAG .................................................................................................................................. 38 3.16. RF Interface ....................................................................................................................... 39 3.16.1. RF Connection ......................................................................................................... 39 3.16.2. RF Performances ..................................................................................................... 39 3.16.3. TX_ON Indicator (TX_ON) ....................................................................................... 40 4. MECHANICAL DRAWINGS ............................................................................... 42 5. DESIGN GUIDELINES ....................................................................................... 45 5.1. Power-Up Sequence ......................................................................................................... 45 5.2. Module Switch-Off ............................................................................................................. 45 5.3. Hardware Fast Shut Down ................................................................................................ 46 5.4. Emergency Power OFF ..................................................................................................... 46 5.5. Sleep Mode Management ................................................................................................. 46 5.6. Power Supply Design ........................................................................................................ 47 5.7. EMC and ESD Guidelines for USIM .................................................................................. 47 5.8. ESD Guidelines for USB .................................................................................................... 48 5.9. USIM Application ............................................................................................................... 49 5.9.1. Single USIM Design ................................................................................................. 49 5.9.2. Dual SIM Single Standby Design............................................................................. 50 6. RELIABILITY SPECIFICATION ......................................................................... 51 6.1. Reliability Compliance ....................................................................................................... 51 6.2. Reliability Prediction Model ............................................................................................... 51 6.2.1. Life Stress Test ........................................................................................................ 51 6.2.2. Environmental Resistance Stress Tests .................................................................. 52 6.2.3. Corrosive Resistance Stress Tests ......................................................................... 52 6.2.4. Thermal Resistance Cycle Stress Tests .................................................................. 53 6.2.5. Mechanical Resistance Stress Tests ....................................................................... 54 6.2.6. Handling Resistance Stress Tests ........................................................................... 55 7. FCC REGULATIONS ......................................................................................... 56 8. ORDERING INFORMATION .............................................................................. 58 9. TERMS AND ABBREVIATIONS ........................................................................ 59
41110363 Rev 4.0 October 18, 2017 7 List of Figures Figure 1. Architecture Overview ..................................................................................................... 13 Figure 2. Mechanical Overview (Top and Bottom Views) .............................................................. 14 Figure 3. AirPrime HL7650 Top View ............................................................................................. 14 Figure 4. AirPrime HL7650 Bottom View ........................................................................................ 14 Figure 5. Pad Configuration ............................................................................................................ 22 Figure 6. UIMx Timing Waveform ................................................................................................... 27 Figure 7. CLKOUTx Timing Waveform ........................................................................................... 33 Figure 8. PCM Timing Waveform ................................................................................................... 35 Figure 9. PCM Master Mode Timing ............................................................................................... 36 Figure 10. PCM Master Mode Timing ............................................................................................... 37 Figure 11. JTAG Timing Waveform .................................................................................................. 38 Figure 12. TX_ON State During Transmission ................................................................................. 41 Figure 13. Mechanical Drawing ........................................................................................................ 42 Figure 14. Dimensions Drawing ....................................................................................................... 43 Figure 15. Footprint .......................................................................................................................... 44 Figure 16. PWR_ON_N Sequence with VGPIO Information ............................................................ 45 Figure 17. Power OFF Sequence for PWR_ON_N, VGPIO ............................................................. 45 Figure 18. Fast Shutdown Power OFF Sequence ............................................................................ 46 Figure 19. Voltage Limiter Example ................................................................................................. 47 Figure 20. EMC and ESD Components Close to the USIM ............................................................. 48 Figure 21. ESD Protection for USB .................................................................................................. 48 Figure 22. Single USIM Application (1 USIM Slot and 1 USIM Connector) ..................................... 49 Figure 23. Dual SIM Single Standby Application (1 USIM Slot and 2 USIM Connectors) ............... 50
41110363 Rev 4.0 October 18, 2017 8 List of Tables Table 1. Supported Bands/Connectivity ........................................................................................ 10 Table 2. General Features ............................................................................................................ 11 Table 3. ESD Specifications .......................................................................................................... 15 Table 4. Environmental Specifications .......................................................................................... 15 Table 5. Pad Definition .................................................................................................................. 17 Table 6. Pad Types ....................................................................................................................... 21 Table 7. Power Supply Pad Description ........................................................................................ 23 Table 8. Power Supply Electrical Characteristics .......................................................................... 23 Table 9. Current Consumption ...................................................................................................... 24 Table 10. Current Consumption per Power Supply ......................................................................... 24 Table 11. VGPIO Pad Description ................................................................................................... 25 Table 12. VGPIO Electrical Characteristics ..................................................................................... 25 Table 13. BAT_RTC Pad Description .............................................................................................. 25 Table 14. BAT_RTC Electrical Characteristics................................................................................ 26 Table 15. UIM1 Pad Description ..................................................................................................... 26 Table 16. UIM2 Pad Description ..................................................................................................... 26 Table 17. UIM1 and UIM2 Electrical Characteristics ....................................................................... 27 Table 18. USB Pad Description ....................................................................................................... 28 Table 19. USB Electrical Characteristics ......................................................................................... 28 Table 20. Digital I/O Electrical Characteristics ................................................................................ 29 Table 21. GPIO Pad Description ..................................................................................................... 29 Table 22. UART1 Pad Description .................................................................................................. 30 Table 23. PWR_ON_N Pad Description .......................................................................................... 31 Table 24. PWR_ON_N Electrical Characteristics ........................................................................... 31 Table 25. RESET_IN_N Pad Description ........................................................................................ 32 Table 26. RESET_IN_N Electrical Characteristics .......................................................................... 32 Table 27. ADC Pad Description ...................................................................................................... 32 Table 28. ADC Electrical Characteristics ........................................................................................ 32 Table 29. Clock Out Interface Pad Description ............................................................................... 33 Table 30. Clock Out Interface Electrical Characteristics ................................................................. 33 Table 31. Digital Audio Pad Description .......................................................................................... 34 Table 32. Digital Audio Electrical Characteristics ............................................................................ 34 Table 33. PCM Master Mode Parameters ....................................................................................... 36 Table 34. PCM Slave Mode Parameters ......................................................................................... 37 Table 35. JTAG Pad Description ..................................................................................................... 38 Table 36. JTAG Electrical Characteristics ....................................................................................... 38 Table 37. RF Main Connection ........................................................................................................ 39
41110363 Rev 4.0 October 18, 2017 9 Product Technical Specification Table 38. RF Diversity Connection .................................................................................................. 39 Table 39. Conducted RX Sensitivity (dBm) – UMTS Bands @ 25°C .............................................. 39 Table 40. Conducted RX Sensitivity (dBm) – LTE Bands @ 25°C ................................................. 40 Table 41. TX_ON Indicator Pad Description ................................................................................... 40 Table 42. Burst Indicator States ...................................................................................................... 40 Table 43. TX_ON Burst Characteristics .......................................................................................... 40 Table 44. Standards Conformity ...................................................................................................... 51 Table 45. Life Stress Test................................................................................................................ 51 Table 46. Environmental Resistance Stress Tests ......................................................................... 52 Table 47. Corrosive Resistance Stress Tests ................................................................................. 52 Table 48. Thermal Resistance Cycle Stress Tests ......................................................................... 53 Table 49. Mechanical Resistance Stress Tests .............................................................................. 54 Table 50. Handling Resistance Stress Tests .................................................................................. 55 Table 51. Ordering Information ....................................................................................................... 58
41110363 Rev 4.0 October 18, 2017 10 1. Introduction This document is the Product Technical Specification for the AirPrime HL7650 Embedded Module. It defines the high-level product features and illustrates the interfaces for these features. This document is intended to cover the hardware aspects of the product, including electrical and mechanical. The AirPrime HL7650 belongs to the AirPrime HL Series from Essential Connectivity Module family. These are industrial grade Embedded Wireless Modules that provides data connectivity on LTE and 3G networks (as listed in Table 1 Supported Bands/Connectivity). The HL7650 supports a large variety of interfaces such as USB 2.0, UART, Digital Audio, ADC, USIM and GPIOs to provide customers with the highest level of flexibility in implementing high-end solutions. Table 1. Supported Bands/Connectivity RF Band Transmit Band (Tx) Receive Band (Rx) Maximum Output Power Uplink Downlink Uplink Downlink LTE B3 1710 MHz 1785 MHz 1805 MHz 1880 MHz 23 dBm ± 2 dBm LTE B5 824 MHz 849 MHz 869 MHz 894 MHz 23 dBm ± 2 dBm LTE B8 880 MHz 915 MHz 925 MHz 960 MHz 23 dBm ± 2 dBm LTE B28 703 MHz 748 MHz 758 MHz 808 MHz 23 dBm ± 2 dBm UMTS B1 1920 MHz 1980 MHz 2110 MHz 2170 MHz 24 dBm +1 / -3 dBm UMTS B5 824 MHz 849 MHz 869 MHz 894 MHz 24 dBm +1 / -3 dBm UMTS B8 880 MHz 915 MHz 925 MHz 960 MHz 24 dBm +1 / -3 dBm 1.1. Common Flexible Form Factor (CF3) The AirPrime HL7650 belongs to the Common Flexible Form Factor (CF3) family of modules. This family consists of a series of WWAN modules that share the same mechanical dimensions (same width and length with varying thicknesses) and footprint. The CF3 form factor provides a unique solution to a series of problems faced commonly in the WWAN module space as it:  Accommodates multiple radio technologies (from 3G to LTE advanced) and band groupings  Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions  Offers electrical and functional compatibility  Provides Direct Mount as well as Socket-ability depending on customer needs 1.2. Physical Dimensions AirPrime HL7650 modules are compact, robust, fully shielded modules with the following dimensions:  Length: 23 mm  Width: 22 mm  Thickness: 2.5 mm  Weight: 3.5 g Note: Dimensions specified above are typical values.
41110363 Rev 4.0 October 18, 2017 11 Product Technical Specification Introduction 1.3. General Features The table below summarizes the AirPrime HL7650 features. Table 2. General Features Feature Description Physical  Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x 2.5mm (nominal)  Metal shield can  RF connection pads (RF main interface)  Baseband signals connection Electrical Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V RF Quad-band LTE (B3, B5, B8 and B28) and tri-band UMTS (B1, B5 and B8) USIM interface  Dual SIM Single Standby (DSSS)  1.8V/3V support  SIM extraction / hot plug detection  SIM/USIM support  Conforms to ETSI UICC Specifications.  Supports SIM application tool kit with proactive SIM commands Note: Although UIM2 connectivity is available in the hardware, this feature is not activated in the firmware. Application interface  NDIS NIC interface support (Windows 7, Windows 8, Linux)  MBIM support  Multiple non-multiplexed USB channel support  Dial-up networking  USB selective suspend to maximize power savings  CMUX multiplexing over UART  AT command interface – 3GPP 27.007 standard, plus proprietary extended AT commands Protocol stack  LTE mode operation:  LTE FDD, bandwidth 1.4-20 MHz  System Release: 3GPP Rel. 9  Category 1 (up to 10 Mbit/s in downlink, 5 Mbit/s in uplink)  Rx Diversity  Max modulation 64 QAM DL, 16 QAM UL  Intra-frequency and inter-frequency mobility  SON ANR  Public Warning System PWS  HSDPA (High Speed Downlink Packet Access)  Compliant with 3GPP Rel. 8  Category 10 (10.1Mbps)  IPv6 support  HSUPA (High Speed Uplink Packet Access)  Compliant with 3GPP Release 8  Category 6 (5.76Mbps)
41110363 Rev 4.0 October 18, 2017 12 Product Technical Specification Introduction Feature Description SMS  SMS over SGs and IMS  SMS MO and MT  SMS saving to SIM card or ME storage  SMS reading from SIM card or ME storage  SMS sorting  SMS concatenation  SMS Status Report  SMS replacement support  SMS storing rules (support of AT+CNMI, AT+CNMA) Connectivity  Multiple (up to 20) cellular packet data profiles  Sleep mode for minimum idle power draw  Mobile-originated PDP context activation / deactivation  Support QoS profile  Release 97 – Precedence Class, Reliability Class, Delay Class, Peak Throughput, Mean Throughput  Release 99 QoS negotiation – Background, Interactive, and Streaming  Static and Dynamic IP address. The network may assign a fixed IP address or dynamically assign one using DHCP (Dynamic Host Configuration Protocol).  Supports PAP and CHAP authentication protocols  PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context  RFC1144 TCP/IP header compression Environmental Operating temperature ranges (industrial grade):  Class A: -30°C to +70°C  Class B: -40°C to +85°C RTC Real Time Clock (RTC) with calendar
41110363 Rev 4.0 October 18, 2017 13 Product Technical Specification Introduction 1.4. Architecture The figure below presents an overview of the AirPrime HL7650 internal architecture and external interfaces. AirPrime HL7650SAWFilters26MHz 32.768KHzUART1 (8 pins)VBAT TGNDVGPIOBAT_RTCGPIO x 12RESET _IN_ NRF MainJTAGLGA-146 BasebandUSIM1MCU DSPPMU RFAnalog BasebandPeripheralsLGA-146 26M_CLKOUT32K_CLKOUTPWR_ON_NDulpexerPAUSBAntennaSwitchAntennaSwitchRX_LTERFRF DIVTX_LTERFRX_LTETX_ONADC x 2Memory(Flash + RAM)USIM2PCM Figure 1. Architecture Overview 1.5. Interfaces The AirPrime HL7650 module provides the following interfaces and peripheral connectivity:  1x – VGPIO  1x – BAT_RTC Backup Battery Interface  2x – 1.8V/3V USIM  1x – USB 2.0  12x – GPIOs (1 of which is multiplexed)  1x – 8-wire UART  1x – Active Low PWR_ON_N  1x – Active Low RESET_IN_N  2x – ADC  2x – System Clock out (32.768 KHz and 26 MHz)  1x – Digital Audio Interface (PCM)  1x – JTAG Interface  1x – RF Main Antenna  1x – RF Diversity  1x – TX Indicator
41110363 Rev 4.0 October 18, 2017 14 Product Technical Specification Introduction 1.6. Connection Interface The AirPrime HL7650 module is an LGA form factor device. All electrical and mechanical connections are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB. Figure 2. Mechanical Overview (Top and Bottom Views) The 146 pads have the following distribution:  66 inner signal pads, 1x0.5mm, pitch 0.8mm  1 reserved test point (do not connect), 1.0mm diameter  7 test point (JTAG), 0.8mm diameter, 1.20mm pitch  64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm  4 inner corner ground pads, 1x1mm  4 outer corner ground pads, 1x0.9mm Figure 3. AirPrime HL7650 Top View Figure 4. AirPrime HL7650 Bottom View
41110363 Rev 4.0 October 18, 2017 15 Product Technical Specification Introduction 1.7. ESD Refer to the following table for ESD Specifications. Table 3. ESD Specifications Category Connection Specification Operational RF ports IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test) Non-operational Host connector interface Unless otherwise specified:  JESD22-A114 ± 1kV Human Body Model  JESD22-A115 ± 200V Machine Model  JESD22-C101C ± 250V Charged Device Model Signals USIM connector Adding ESD protection is highly recommended at the point where the USIM contacts are exposed, and for any other signals that would be subjected to ESD by the user. Other host signals 1.8. Environmental and Certifications 1.8.1. Environmental Specifications The environmental specification for both operating and storage conditions are defined in the table below. Table 4. Environmental Specifications Conditions Range Operating Class A -30°C to +70°C Operating Class B -40°C to +85°C Storage -40°C to +85°C Class A is defined as the operating temperature ranges that the device:  Shall exhibit normal function during and after environmental exposure.  Shall meet the minimum requirements of 3GPP or appropriate wireless standards. Class B is defined as the operating temperature ranges that the device:  Shall remain fully functional during and after environmental exposure  Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even when one or more environmental constraint exceeds the specified tolerance.  Unless otherwise stated, full performance should return to normal after the excessive constraint(s) have been removed.
41110363 Rev 4.0 October 18, 2017 16 Product Technical Specification Introduction 1.8.2. Regulatory Sierra Wireless hereby declares that the HL7650 is in compliance with all essential requirements of Directive <TBD>. The Declaration of Conformity will be available for viewing at the following location in the EU community: Sierra Wireless (UK) Limited Suite 5, The Hub Fowler Avenue Farnborough Business Park Farnborough, United Kingdom GU14 7JP 1.8.3. RoHS Directive Compliant The AirPrime HL7650 module is compliant with RoHS Directive 2011/65/EU which sets limits for the use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”. 1.8.4. Disposing of the Product This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical and Electronic Equipment (WEEE). As such, this product must not be disposed of at a municipal waste collection point. Please refer to local regulations for directions on how to dispose of this product in an environmental friendly manner. 1.9. References [1] AirPrime HL Series Customer Process Guidelines Reference Number: 4114330 [2] AirPrime HL76xx AT Commands Interface Guide Reference Number: 4118395 [3] AirPrime HL Series Development Kit User Guide Reference Number: 4114877
41110363 Rev 4.0 October 18, 2017 17 2. Pad Definition AirPrime HL7650 pads are divided into 2 functional categories.  Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of modules. These Core functions are always available and always at the same physical pad location. A customer platform using only these functions and associated pads is guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.  Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it is always at the same pad location. Other pads marked as “not connected” or “reserved” should not be used. Table 5. Pad Definition Pad # Signal Name Function I/O I/O HW Reset State Active Low/High Power Supply Domain Recommendation for Unused Pads Type 1 GPIO1 General purpose input/output I/O I, T - 1.8V Left Open Extension 2 UART1_RI UART1 Ring indicator O O, L - 1.8V Connect to test point Core 3 UART1_RTS UART1 Request to send I I, T/PU L 1.8V Connect to test point Core 4 UART1_CTS UART1 Clear to send O I, T/PU L 1.8V Connect to test point Core 5 UART1_TX UART1 Transmit data I I, T/PD - 1.8V Connect to test point Core 6 UART1_RX UART1 Receive data O I, T/PU - 1.8V Connect to test point Core 7 UART1_DTR UART1 Data terminal ready I I, T/PD L 1.8V Connect to test point Core 8 UART1_DCD UART1 Data carrier detect O O, L L 1.8V Connect to test point Core 9 UART1_DSR UART1 Data set ready O O, H L 1.8V Connect to test point Core 10 GPIO2 General purpose input/output I/O O, L - 1.8V Connect to test point Core 11 RESET_IN_N Input reset signal I N/A L 1.8V Left Open Core
41110363 Rev 4.0 October 18, 2017 18 Product Technical Specification Pad Definition Pad # Signal Name Function I/O I/O HW Reset State Active Low/High Power Supply Domain Recommendation for Unused Pads Type 12 USB_D- USB Data Negative (Low / Full Speed) I/O T - 3.3V Connect to test point Extension USB Data Negative (High Speed) 0.38V 13 USB_D+ USB Data Positive (Low / Full Speed) I/O T - 3.3V Connect to test point Extension USB Data Positive (High Speed) 0.38V 14 NC Not Connected - - - Not connected 15 NC Not Connected - - - Not connected 16 USB_VBUS USB VBUS I N/A - 5V Connect to test point Extension 17 NC Not Connected (Reserved for future use) - - - Left Open Not connected 18 NC Not Connected (Reserved for future use) - - - Left Open Not connected 19 NC Not Connected (Reserved for future use) - - - Left Open Not connected 20 NC Not Connected (Reserved for future use) - - - Left Open Not connected 21 BAT_RTC Power supply for RTC backup I/O N/A - 1.8V Left Open Extension 22 26M_CLKOUT 26MHz System Clock Output O I, T/PD - 1.8V Left Open Extension 23 32K_CLKOUT 32.768kHz System Clock Output O I, T/PD - 1.8V Left Open Extension 24 ADC1 Analog to digital converter I N/A - 1.2V Left Open Extension 25 ADC0 Analog to digital converter I N/A - 1.2V Left Open Extension 26 UIM1_VCC 1.8V/3V USIM1 Power supply O N/A - 1.8V/3V Mandatory connection Core 27 UIM1_CLK 1.8V/3V USIM1 Clock O O, L - 1.8V/3V Mandatory connection Core 28 UIM1_DATA 1.8V/3V USIM1 Data I/O O, L - 1.8V/3V Mandatory connection Core 29 UIM1_RESET 1.8V/3V USIM1 Reset O O, L L 1.8V/3V Mandatory connection Core 30 GND Ground 0V N/A - 0V Mandatory connection Extension 31 RF_DIV RF Input - Diversity - N/A - Mandatory connection Extension 32 GND Ground 0V N/A - 0V Mandatory connection Extension 33 PCM_OUT PCM data out O I, T/PD - 1.8V Left Open Extension 34 PCM_IN PCM data in I I, T/PD - 1.8V Left Open Extension 35 PCM_SYNC PCM sync out I/O I, T/PD - 1.8V Left Open Extension
41110363 Rev 4.0 October 18, 2017 19 Product Technical Specification Pad Definition Pad # Signal Name Function I/O I/O HW Reset State Active Low/High Power Supply Domain Recommendation for Unused Pads Type 36 PCM_CLK PCM clock I/O I, T/PD - 1.8V Left Open Extension 37 GND Ground 0V N/A - 0V Mandatory connection Core 38 NC Not Connected (Reserved for future use) - - - Left Open Not connected 39 GND Ground 0V N/A - 0V Mandatory connection Core 40 GPIO7 General purpose input/output I/O I, T/PD - 1.8V Left Open Core 41 GPIO8 General purpose input/output I/O O, L - 1.8V Connect to test point Core 42 NC Not Connected (Reserved for future use) - - - Left Open Not connected 43 NC Not Connected (Reserved for future use) - - - Left Open Not connected 44 GPIO13 General purpose input/output O I, T/PU - 1.8V Left Open Extension 45 VGPIO GPIO voltage output O N/A - 1.8V Left Open Core 46 GPIO6 General purpose input/output I/O I, T/PD - 1.8V Left Open Core 47 NC Not Connected (Reserved for future use) - - - Left Open Not connected 48 GND Ground 0V N/A - 0V Mandatory connection Core 49 RF_MAIN RF Input/output - N/A - Mandatory connection Core 50 GND Ground 0V N/A - 0V Mandatory connection Core 51 GPIO14 General purpose input/output I I, T/PU - 1.8V Left Open Extension 52 GPIO10 General purpose input/output I/O I, T/PD - 1.8V Left Open Extension 53 GPIO11 General purpose input/output I/O I, T/PD - 1.8V Left Open Extension 54 GPIO15 General purpose input/output I/O I, T/PU - 1.8V Left Open Extension 55 UIM2_VCC 1.8V/3V USIM2 Power supply O N/A - 1.8V/3V Mandatory connection Core 56 UIM2_DATA 1.8V/3V USIM2 Data I/O O, L - 1.8V/3V Mandatory connection Core 57 UIM2_RESET 1.8V/3V USIM2 Reset O O, L L 1.8V/3V Mandatory connection Core 58 UIM2_CLK 1.8V/3V USIM2 Clock O O, L 1.8V/3V Mandatory connection Core 59 PWR_ON_N Active Low Power On control signal I N/A L 1.8V Mandatory connection Core 60 TX_ON TX burst indicator O N/A 2.3V Left Open Extension
41110363 Rev 4.0 October 18, 2017 20 Product Technical Specification Pad Definition Pad # Signal Name Function I/O I/O HW Reset State Active Low/High Power Supply Domain Recommendation for Unused Pads Type 61 VBATT_PA Power supply (refer to section 3.1 Power Supply for more information) I N/A - 3.2V (min) 3.7V (typ) 4.5V (max) Mandatory connection Core 62 VBATT_PA Power supply (refer to section 3.1 Power Supply for more information) I N/A - 3.2V (min) 3.7V (typ) 4.5V (max) Mandatory connection Core 63 VBATT Power supply I N/A - 3.2V (min) 3.7V (typ) 4.5V (max) Mandatory connection Core 64 UIM1_DET UIM1 Detection I/O I, T/PD H 1.8V Left Open Core 65 UIM2_DET/GPIO4 UIM2 Detection / General purpose input/output I/O I, T/PD H 1.8V Left Open Extension 66 GPIO5 General purpose input/output I/O I, T - 1.8V Left Open Extension 67-70 GND Ground 0V N/A 0V Core 71 - 166 Note: These pads are not available on the AirPrime HL7650 module. 167 - 234 GND Ground 0V N/A - 0V Core 236 JTAG_RESET JTAG RESET I I, T L 1.8V Left Open Extension 237 JTAG_TCK JTAG Test Clock I I, PD - 1.8V Left Open Extension 238 JTAG_TDO JTAG Test Data Output O O, T - 1.8V Left Open Extension 239 JTAG_TMS JTAG Test Mode Select I I, PU - 1.8V Left Open Extension 240 JTAG_TRST JTAG Test Reset I I, PD L 1.8V Left Open Extension 241 JTAG_TDI JTAG Test Data Input I I, PU - 1.8V Left Open Extension 242 JTAG_RTCK JTAG Returned Test Clock O I, PD - 1.8V Left Open Extension
41110363 Rev 4.0 October 18, 2017 21 Product Technical Specification Pad Definition 2.1. Pad Types Table 6. Pad Types Type Definition I Digital Input O Digital Output I/O Digital Input / Output L Active High H Active Low T Tristate T/PU Tristate with pull-up enabled T/PD Tristate with pull-down enabled N/A No Applicable
41110363 Rev 4.0 October 18, 2017 22 Product Technical Specification Pad Definition 2.2. Pad Configuration (Top View, Through Module) 1681691671701817161514131211109876432156665646362616059343536373838394041424243434445464849505147475857565553525470671920212223242526272829303233316968192 193 194 195 196 197 198 171191 214 215 216 217 218 199 172190 213 228 229 230 219 200 173189 212 227 234 231 220 201 174188 211 226 233 232 221 202 175187 210 225 224 223 222 203 176186 209 208 207 206 205 204 177185 184 183 182 181 180 179 178236237238239240241242GNDGPIO5UIM2_DET / GPIO4 UIM1_DETVBATTVBATT_PAVBATT_PATX_ONPWR_ON_NUIM2_CLKUIM2_RESETUIM2_DATAUIM2_VCCGPIO15GPIO11GPIO10GNDGNDNCNCBAT_RTC26M_CLKOUT32K_CLKOUTADC1ADC0UIM1_VCCUIM1_CLKUIM1_DATAUIM1_RESETGNDRF_DIVGNDPCM_OUTGNDPCM_INPCM_SYNCPCM_CLKGNDNCGNDGPIO7GPIO8NCNCGPIO13VGPIOGPIO6NCGNDRF_MAINGNDGPIO14NCNCUSB_VBUSNCNCUSB_D+USB_D-RESET_IN_NGPIO2UART1_DSRUART1_DCDUART1_DTRUART1_RXUART1_TXUART1_CTSUART1_RTSUART1_RIGPIO1JTAG_RTCKJTAG_TDIJTAG_TRSTJTAG_TMSJTAG_TDOJTAG_TCKJTAG_RESETCore padExtension pad236237238239240241242 Figure 5. Pad Configuration
41110363 Rev 4.0 October 18, 2017 23 3. Detailed Interface Specifications Note: If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of 25°C. For standard applications, VBATT and VBATT_PA must be tied externally to the same power supply. For some specific applications, AirPrime HL7650 module supports separate VBATT and VBATT_PA connection if requirements below are fulfilled. 3.1. Power Supply The AirPrime HL7650 module is supplied through the VBATT and VBATT_PA signals. Refer to the following table for the pad description of the Power Supply interface. Table 7. Power Supply Pad Description Pad Number Signal Name I/O Description 63 VBATT I Power supply (base band) 61, 62 VBATT_PA I Power supply (radio frequency) 37, 39, 48, 67-70, 167-234 GND Ground Refer to the following table for the electrical characteristics of the Power Supply interface. Table 8. Power Supply Electrical Characteristics Supply Minimum Typical Maximum VBATT voltage (V) 3.21 3.7 4.5 VBATT_PA voltage (V) Full Specification 3.21 3.7 4.5 VBATT_PA voltage (V) Extended Range 2.82 3.7 4.5 1 This value has to be guaranteed during the burst 2 No guarantee of 3GPP performances over extended range Note: Load capacitance for VBATT is around 140µF ± 20% embedded inside the module. Load capacitance for VBATT_PA is around 20µF ± 20% embedded inside the module.
41110363 Rev 4.0 October 18, 2017 24 Product Technical Specification Detailed Interface Specifications 3.2. Current Consumption The following table lists the current consumption of the AirPrime HL7650 at different conditions. Note: Typical values are defined for VBATT/VBATT_PA at 3.7V and 25°C, for 50Ω impedance at all RF ports with VSWR1:1 and CMW500. Maximum values are defined with worst conditions among supported ranges of voltages and temperature (50Ω, VSWR1:1 and CMW500). Table 9. Current Consumption Parameter Typical Maximum Unit Off mode 110 300 µA Sleep mode – LTE DRX8 USB disconnected Band 3 1.7 5.5 mA Band 5 1.9 6.0 mA Band 8 1.7 5.7 mA Band 28 1.9 6.0 mA Sleep mode – WCDMA DRX8 USB disconnected Band 1 1.2 4.95 mA Band 5 1.2 4.95 mA Band 8 1.2 4.95 mA LTE in communication mode (TX Max) Band 3 595 740 mA Band 5 585 730 mA Band 8 665 815 mA Band 28 765 920 mA WCDMA in communication mode (TX Max) Band 1 515 630 mA Band 5 490 605 mA Band 8 490 610 mA Note: Maximum current peak measured for VSWR3:1 is 1100 mA. Table 10. Current Consumption per Power Supply Parameter (at nominal voltage, 3.7 V) Typical Maximum Unit VBATT LTE in communication mode (TX Max) Band 3 235 355 mA Band 5 230 355 mA Band 8 235 380 mA Band 28 240 380 mA WCDMA in communication mode (TX Max) Band 1 130 230 mA Band 5 125 220 mA Band 8 125 220 mA VBATT_PA LTE in communication mode (TX Max) Band 3 360 385 mA Band 5 355 375 mA Band 8 430 435 mA Band 28 525 540 mA WCDMA in communication mode (TX Max) Band 1 385 400 mA Band 5 365 385 mA Band 8 365 390 mA
41110363 Rev 4.0 October 18, 2017 25 Product Technical Specification Detailed Interface Specifications 3.3. VGPIO The VGPIO output can be used to:  Pull-up signals such as I/Os  Supply the digital transistors driving LEDs The VGPIO output is available when the AirPrime HL7650 module is switched ON. Refer to the following table for the pad description of the VGPIO interface. Table 11. VGPIO Pad Description Pad Number Signal Name I/O Description 45 VGPIO O GPIO voltage output Refer to the following table for the electrical characteristics of the VGPIO interface. Table 12. VGPIO Electrical Characteristics Parameter Minimum Typical Maximum Remarks Voltage level (V) 1.7 1.8 1.9 Both active mode and sleep mode Current capability Active Mode (mA) - - 50 Power management support up to 50mA output in Active mode Current capability Sleep Mode (mA) - - 3 Power management support up to 3mA output in Sleep mode Rise Time (ms) - - 1.5 Start-Up time from 0V 3.4. BAT_RTC The AirPrime HL7650 module provides an input/output to connect a Real Time Clock power supply. This pad is used as a back-up power supply for the internal Real Time Clock. The RTC is supported when VBATT is available but a back-up power supply is needed to save date and hour when VBATT is switched off. If VBATT is available, the back-up battery can be charged by the internal 1.8V power supply regulator. Refer to the following table for the pad description of the BAT_RTC interface. Table 13. BAT_RTC Pad Description Pad Number Signal Name I/O Description 21 BAT_RTC I/O Power supply for RTC backup Refer to the following table for the electrical characteristics of the BAT_RTC interface.
41110363 Rev 4.0 October 18, 2017 26 Product Technical Specification Detailed Interface Specifications Table 14. BAT_RTC Electrical Characteristics Parameter Minimum Typical Maximum Unit Input voltage 1.7 1.8 1.9 V Input current consumption - 2.5 (TBC) - µA Output voltage -5% 1.8 +5% V Max charging current (@VBATT=3.7V) - 25 (TBC) - mA 3.5. USIM Interface The AirPrime HL7650 has two physical USIM interfaces, UIM1 and UIM2. Both UIM1 and UIM2 allow control of a 1.8V/3V USIM and is fully compliant with GSM 11.11 recommendations concerning SIM functions. The five signals used by the UIMx interface are as follows:  UIMx_VCC: Power supply  UIMx_CLK: Clock  UIMx_DATA: I/O port  UIMx_RESET: Reset  UIMx_DET: Hardware SIM detection UIM1 is used in single SIM applications, and has optional support for dual SIM applications with an external SIM switch (for use in Dual SIM Single Standby (DSSS) applications). A second UIM interface, UIM2, is also available for Dual SIM Single Standby (DSSS) option. Note: Although UIM2 connectivity is available in the hardware, this feature is not activated in the firmware. For USIM design examples, refer to section 5.9 USIM Application. Refer to the following table for the pad description of both UIM interfaces. Table 15. UIM1 Pad Description Pad Number Signal Name Description Multiplex 26 UIM1_VCC 1.8V/3V USIM1 Power supply 27 UIM1_CLK 1.8V/3V USIM1 Clock 28 UIM1_DATA 1.8V/3V USIM1 Data 29 UIM1_RESET 1.8V/3V USIM1 Reset 64 UIM1_DET USIM1 Detection Table 16. UIM2 Pad Description Pad Number Signal Name Description Multiplex 55 UIM2_VCC 1.8V/3V USIM2 Power supply 58 UIM2_CLK 1.8V/3V USIM2 Clock 56 UIM2_DATA 1.8V/3V USIM2 Data
41110363 Rev 4.0 October 18, 2017 27 Product Technical Specification Detailed Interface Specifications Pad Number Signal Name Description Multiplex 57 UIM2_RESET 1.8V/3V USIM2 Reset 65 UIM2_DET USIM2 Detection GPIO4 Refer to the following table for the electrical characteristics of both UIM1 and UIM2 interfaces. Table 17. UIM1 and UIM2 Electrical Characteristics Parameter Minimum Typical Maximum Units Remarks UIMx Interface Voltage (VCC, CLK, IO, RESET) - 2.9 - V The appropriate output voltage is auto detected and selected by software. - 1.80 - V UIMx Detect - 1.80 - V High active UIMx_VCC Current - - 10 mA Max output current in sleep mode = 3 mA UIMx_VCC Line Regulation - - 50 mV/V At Iout_Max UIMx_VCC Power-up Setting Time from power down - 10 - µs UIMx_CLK clock period (ti1) 205 307 - ns UIMx_CLK high time (ti2) 82 - - ns UIMx_CLK high time (ti3) 82 - - ns UIMx_CLK rise time/fall time (tR / tF) - - 50 ns UIMx_IO rise time/fall time (tR / tF) - - 1000 ns 3.5.1. UIMx_CLK The following figure shows the UIMx_CLK timing waveform. Figure 6. UIMx Timing Waveform 3.5.2. UIMx_DET UIMx_DET is used to detect and notify the application about the insertion and removal of a USIM device in the USIM socket connected to the USIM interface (UIM1 or UIM2). When a USIM is inserted, the state of UIMx_DET transitions from logic 0 to logic 1. Inversely, when a USIM is removed, the state of UIMx_DET transitions from logic 1 to logic 0. While UIM1_DET has a dedicated pad (pad 64), UIM2_DET is multiplexed with GPIO4 (pad 65).
41110363 Rev 4.0 October 18, 2017 28 Product Technical Specification Detailed Interface Specifications Enabling or disabling this UIM detect feature can be done using the AT+KSIMDET command. For more information about this command, refer to document [2] AirPrime HL76xx AT Commands Interface Guide. 3.6. USB Interface The AirPrime HL7650 has one Universal Serial Bus interface complaint with USB Rev 2.0. Refer to the following table for the pad description of the USB interface. Table 18. USB Pad Description Pad Number Signal Name I/O Function 12 USB_D- I/O USB Data Negative 13 USB_D+ I/O USB Data Positive 16 USB_VBUS I USB VBUS Note: When the 5V USB supply is not available, connect USB_VBUS to VBATT to supply the USB interface. Refer to the following table for the electrical characteristics of the USB interface. Table 19. USB Electrical Characteristics Parameter Minimum Typical Maximum Units Test Condition Input voltage at pads USB_D+ / USB_D- -0.3 - 3.6 V Voltage USB_VBUS 0 - 5.25 V Full Speed Mode Signal Rate 11.994 - 12.006 Mbit/s EOP (end of packet) Width 160 - 175 ns Rising Edge 4 - 20 ns At 10% and 90% Falling Edge 4 - 20 ns At 10% and 90% High Speed Mode Signal Rate 479.760 - 480.024 Mbit/s EOP (end of packet) Width 15.625 - 17.7073 ns Rising Edge 500 - ps At 10% and 90% Falling Edge 500 - ps At 10% and 90%
41110363 Rev 4.0 October 18, 2017 29 Product Technical Specification Detailed Interface Specifications 3.7. Electrical Information for Digital I/O The AirPrime HL7650 supports two groups of digital interfaces with varying current drain limits. The following list enumerates these interfaces.  Group 1 (6mA current drain limit)  GPIO2, GPIO4, GPIO6, GPIO8, GPIO10, GPIO11, GPIO13, GPIO14, GPIO15  Group 2 (1mA current drain limit)  GPIO1, GPIO5, GPIO7  UART1  JTAG Refer to the following table for the electrical characteristics of the Digital I/O interface. Table 20. Digital I/O Electrical Characteristics Parameter Symbol Minimum Maximum Remarks Input Current-High (µA) IIH - -240 Input Current-Low (µA) IIL - 240 Group 1 DC Output Current-High (mA) IOH - 6 DC Output Current-Low (mA) IOL -6 - Group 2 DC Output Current-High (mA) IOH - 1 DC Output Current-Low (mA) IOL -1 - Input Voltage-High (V) VIH 1.33 1.90 Input Voltage-Low (V) VIL -0.20 0.34 Output Voltage-High (V) VOH 1.45 - IOH = -6mA VOH 1.60 - IOH = -0.1mA Output Voltage-Low (V) VOL - 0.35 IOL = 6mA VOL - 0.20 IOL = 0.1mA 3.8. General Purpose Input/Output (GPIO) The AirPrime HL7650 module provides 12 GPIOs, 1 of which is multiplexed. Refer to the following table for the pad description of the GPIO interface. Table 21. GPIO Pad Description Pad Number Signal Name Multiplex I/O Power Supply Domain 1 GPIO1 I/O 1.8V 10 GPIO2 I/O 1.8V 40 GPIO7 I/O 1.8V 41 GPIO8 I/O 1.8V 44 GPIO13 I/O 1.8V
41110363 Rev 4.0 October 18, 2017 30 Product Technical Specification Detailed Interface Specifications Pad Number Signal Name Multiplex I/O Power Supply Domain 46 GPIO6 I/O 1.8V 51 GPIO14 I/O 1.8V 52 GPIO10 I/O 1.8V 53 GPIO11 I/O 1.8V 54 GPIO15 I/O 1.8V 65 GPIO4 UIM2_DET I/O 1.8V 66 GPIO5 I/O 1.8V 3.9. Main Serial Link (UART1) The main serial link (UART1) is used for communication between the AirPrime HL7650 module and a PC or host processor. It consists of a flexible 8-wire serial interface that complies with RS-232 interface. The supported baud rates of the UART1 are 300, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 500000, 750000, 921600, 1843200, 3000000 and 3250000 bit/s. The signals used by UART1 are as follows:  TX data (UART1_TX)  RX data (UART1_RX)  Request To Send (UART1_RTS)  Clear To Send (UART1_CTS)  Data Terminal Ready (UART1_DTR)  Data Set Ready (UART1_DSR)  Data Carrier Detect (UART1_DCD)  Ring Indicator (UART1_RI) Note: Signal names are according to PC view. Refer to the following table for the pad description of the main serial link (UART1) interface. Table 22. UART1 Pad Description Pad # Signal Name* I/O* Description 2 UART1_RI O Signal incoming calls (data only), SMS, etc. 3 UART1_RTS I Request to send 4 UART1_CTS O AirPrime HL7650 is ready to receive AT commands 5 UART1_TX I Transmit data 6 UART1_RX O Receive data 7 UART1_DTR I (active low) Prevents the AirPrime HL7650 from entering sleep mode, switches between data mode and command mode, and wakes the module up. 8 UART1_DCD O Signal data connection in progress 9 UART1_DSR O Signal UART interface is ON * According to PC view.
41110363 Rev 4.0 October 18, 2017 31 Product Technical Specification Detailed Interface Specifications 3.10. POWER-ON Signal (PWR_ON_N) A low-level signal has to be provided to switch the AirPrime HL7650 module ON. It is internally connected to the permanent 1.8V supply regulator inside the HL7650 via a pull-up resistor. Once VBAT is supplied to the HL7650 module, this 1.8V supply regulator will be enabled and so the PWR_ON_N signal is by default at high level. Refer to the following table for the pad description of the PWR_ON_N interface. Table 23. PWR_ON_N Pad Description Pad Number Signal Name I/O Description 59 PWR_ON_N I Power On the HL7650 module Refer to the following table for the electrical characteristics of the PWR_ON_N interface. Table 24. PWR_ON_N Electrical Characteristics Parameter Minimum Typical Maximum Input Voltage-Low (V) - 0.51 Input Voltage-High (V) 1.33 - 2.2 Power-up period (ms) from PWR_ON_N falling edge 2000 - - PWR_ON_N assertion time (ms) 25 Note: As PWR_ON_N is internally pulled up with 100kΩ, an open collector or open drain transistor must be used for ignition. VGPIO is an output from the module that can be used to check if the module is active.  When VGPIO = 0V, the module is OFF  When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode) Note: PWR_ON_N signal cannot be used to power the module off. To power the module off, use AT command AT+CPWROFF. 3.11. Reset Signal (RESET_IN_N) To reset the module, a low-level pulse must be sent on the RESET_IN_N pad for 20ms. This action will immediately restart the AirPrime HL7650 module with the PWR_ON_N signal at low level. (If the PWR_ON_N signal is at high level, the module will be powered off.) As RESET_IN_N is internally pulled up, an open collector or open drain transistor should be used to control this signal. The RESET_IN_N signal will reset the registers of the CPU and reset the RAM memory as well, for the next power on. Note: As RESET_IN_N is referenced to the VRTC (200kΩ pull-up resistor to VRTC 1.8V) an open collector or open drain transistor has to be used to control this signal. Refer to the following table for the pad description of the RESET_IN_N interface.
41110363 Rev 4.0 October 18, 2017 32 Product Technical Specification Detailed Interface Specifications Table 25. RESET_IN_N Pad Description Pad Number Signal Name I/O Description 12 RESET_IN_N I Hardware Reset Refer to the following table for the electrical characteristics of the RESET_IN_N interface. Table 26. RESET_IN_N Electrical Characteristics Parameter Minimum Typical Maximum Input Voltage-Low (V) - 0.51 Input Voltage-High (V) 1.33 - 2.2 Reset assertion time (ms) 20 - - Power-up period (ms) from RESET_IN_N falling edge* 2000 - - * With the PWR_ON_N Signal at low level. 3.12. Analog to Digital Converter (ADC) Two Analog to Digital Converter inputs, ADC0 and ADC1, are provided by the AirPrime HL7650 module. These converters are 10-bit resolution ADCs ranging from 0 to 1.2V. Typical ADC use is for monitoring external voltage, wherein an application is used to safely power OFF an external supply in case of overvoltage. Refer to the following table for the pad description of the ADC interface. Table 27. ADC Pad Description Pad Number Signal Name I/O Description 24 ADC1 I Analog to digital converter 25 ADC0 I Analog to digital converter Refer to the following table for the electrical characteristics of the ADC interface. Table 28. ADC Electrical Characteristics Parameter Minimum Typical Maximum Remarks ADCx Resolution (bits) - 10 - Input Voltage Range (V) 0 - 1.2 General purpose input Update rate per channel (kHz) - - 125 Integral Nonlinearity (bits) - - ± 2 LSB Offset Error (bits) - - ± 1 LSB Gain 849 853 858 Absolute gain drift - - ± 0.05 Input Resistance (MΩ) 1 - - Input Capacitance (pF) - 1 -
41110363 Rev 4.0 October 18, 2017 33 Product Technical Specification Detailed Interface Specifications Parameter Minimum Typical Maximum Remarks Current tolerance - - ± 3% Quiescent current (µA) - 710 - Wake-up time from power save (µs) - 50 - 3.13. Clock Out Interface The AirPrime HL7650 module supports two digital clock out interfaces. Enabling or disabling the clock out feature can be done using AT commands. For more information about AT commands, refer to document [2] AirPrime HL76xx AT Commands Interface Guide. Refer to the following table for the pad description of the clock out interface. Table 29. Clock Out Interface Pad Description Pad Number Signal Name I/O I/O Type Description 22 26M_CLKOUT O 1.8V 26MHz Digital Clock output 23 32K_CLKOUT O 1.8V 32.768kHz Digital Clock output Refer to the following table for the electrical characteristics of the clock out interface. Table 30. Clock Out Interface Electrical Characteristics Parameter Symbol Minimum Typical Maximum Units CLKOUTn period at 26MHz (tr1) - 38 - ns CLKOUTn low time at 26MHz (tr2) 10 - - ns CLKOUTn high time at 26MHz (tr3) 10 - - ns CLKOUTn period at 32.768KHz (tr1) - - - ns CLKOUTn low time at 32.768KHz (tr2) - - - ns CLKOUTn high time at 32.768KHz (tr3) - - - ns Period jitter - - 4 ns The following figure shows the clock out (CLKOUT) timing waveform. Figure 7. CLKOUTx Timing Waveform
41110363 Rev 4.0 October 18, 2017 34 Product Technical Specification Detailed Interface Specifications 3.14. Digital Audio (PCM) Interface The Digital Audio (PCM) Interface allows connectivity with standard audio peripherals. It can be used, for example, to connect an external audio codec. The programmability of this interface allows addressing a large range of audio peripherals. The PCM interface is a high speed full duplex interface that can be used to send and receive digital audio data to external audio ICs. The Digital Audio Interface also features the following:  PCM master or slave  16 bits data word length, linear mode  MSB first  Configurable PCM bit clock rate on 256kHz, 384kHz or 512kHz  Long frame sync The signals used by the Digital Audio Interface are as follows:  PCM_SYNC: The frame synchronization signal delivers an 8 kHz frequency pulse that synchronizes the frame data in and the frame data out.  PCM_CLK: The frame bit clock signal controls data transfer with the audio peripheral.  PCM_OUT: The frame “data out” relies on the selected configuration mode.  PCM_IN: The frame “data in” relies on the selected configuration mode. Refer to the following table for the pad description of the digital audio interface. Table 31. Digital Audio Pad Description Pad # Signal Name I/O I/O Type Description 36 PCM_CLK O 1.8V PCM clock 35 PCM_SYNC O 1.8V PCM synchronization 34 PCM_IN I 1.8V PCM data in 33 PCM_OUT O 1.8V PCM data out Refer to the following table for the electrical characteristics of the digital audio interface. Table 32. Digital Audio Electrical Characteristics Signal Description Minimum Typical Maximum Unit Tsync_low + Tsync_high PCM_SYNC frequency 8 KHz Tsync_low + Tsync_high PCM_SYNC period 125 µs Tsync_low PCM_SYNC low time 124 µs Tsync_high PCM_SYNC high time 1 µs TCLK-cycle PCM_CLK period - 3.9 - µs TIN-setup PCM_IN setup time 59.6 - - ns
41110363 Rev 4.0 October 18, 2017 35 Product Technical Specification Detailed Interface Specifications Signal Description Minimum Typical Maximum Unit TIN-hold PCM_IN hold time 12 - - ns TOUT-delay PCM_OUT delay time - - 21.6 ns TSYNC-delay PCM_SYNC output delay -24 - 31.2 ns VDD PCM Signaling Voltage 1.7 1.8 1.9 V VIH I/O Voltage input low 0.35*VDD - VDD+0.3 V VIL I/O Voltage input high -0.3 - 0.65*VDD V VOL I/O Voltage output low - - 0.45 V VOH I/O Voltage output high VDD-0.45 - - V IL I/O Leakage current - - ±0.7 µA 3.14.1. PCM Waveforms The following figure shows the PCM timing waveform. Figure 8. PCM Timing Waveform
41110363 Rev 4.0 October 18, 2017 36 Product Technical Specification Detailed Interface Specifications 3.14.2. PCM Master Mode Figure 9. PCM Master Mode Timing Table 33. PCM Master Mode Parameters Symbol Description Minimum Typical Maximum Unit Test Condition tI2Sbm1 PCM_CLK clock period T-4 T - ns T = M_T tI2Sbm2 PCM_CLK low time T/2 – 20 T/2 - ns T = M_T tI2Sbm3 PCM_CLK high time T/2 – 20 T/2 - ns T = M_T tI2Sbm4 PCM_SYNC high begin after clock PCM_CLK high begin -24 - 2 x tcp + 12 ns tcp = 9.6 ns tI2Sbm5 PCM_SYNC high end after PCM_CLK how end -24 - 2 x tcp + 12 ns tcp = 9.6 ns tI2Sbm6 PCM_OUT invalid before PCM_CLK low-end - - 24 ns tI2Sbm7 PCM_OUT valid after PCM_CLK high begin - - tcp + 12 ns tcp = 9.6 ns tI2Sbm8 PCM_IN setup time before PCM_CLK high end tcp + 50 - - ns tcp = 9.6 ns tI2Sbm9 PCM_IN hold time after PCM_CLK low begin 12 - - Ns Note: T corresponds to the audio sampling rate (48 kHz, 44.1 kHz, 32 kHz, 24 kHz, 22.05 kHz, 16 kHz, 12 kHz, 11.025 kHz and 8 kHz) and to the frame length (17 bit, 18bit, 32bit, 48bit or 64 bit).
41110363 Rev 4.0 October 18, 2017 37 Product Technical Specification Detailed Interface Specifications 3.14.3. PCM Slave Mode Figure 10. PCM Master Mode Timing Table 34. PCM Slave Mode Parameters Symbol Description Minimum Typical Maximum Unit Test Condition tI2Sbs1 PCM_CLK clock period T - - n T=M_T tI2Sbs2 PCM_CLK low time 120 - - ns tI2Sbs3 PCM_CLK high time 120 - - ns tI2Sbs4 PCM_SYNC high begin before PCM_CLK low begin (latching edge of PCM_CLK) 2 x tcp + 17 - - ns tcp = 9.6 ns tI2Sbs5 PCM_SYNC low begin before PCM_CLK low begin (latching edge of PCM_CLK) 2 x tcp + 17 - - ns tcp = 9.6 ns tI2Sbs6 PCM_OUT invalid before PCM_CLK rising edge (shifting edge of PCM_CLK ) - - 12 ns tI2Sbs7 PCM_OUT valid after PCM_CLK rising edge (shifting edge of PCM_CLK ) - - 3 x tcp + 12 ns tcp = 9.6 ns tI2Sbs8 PCM_IN setup time before PCM_CLK falling edge tcp + 12 - - ns tcp = 9.6 ns tI2Sbs9 PCM_IN hold time after PCM_CLK falling edge 24 - - ns Note: T corresponds to the audio sampling rate (48 kHz, 44.1 kHz, 32 kHz, 24 kHz, 22.05 kHz, 16 kHz, 12 kHz, 11.025 kHz and 8 kHz) and to the frame length (17 bit, 18bit, 32bit, 48bit or 64 bit).
41110363 Rev 4.0 October 18, 2017 38 Product Technical Specification Detailed Interface Specifications 3.15. JTAG The JTAG interface provides debug access to the core of the AirPrime HL7650 module. These JTAG signals are accessible through solderable test points. Refer to the following table for the pad description of the JTAG interface. Table 35. JTAG Pad Description Pad Number Signal Name Function 236 JTAG_RESET JTAG RESET 237 JTAG_TCK JTAG Test Clock 238 JTAG_TDO JTAG Test Data Output 239 JTAG_TMS JTAG Test Mode Select 240 JTAG_TRST JTAG Test Reset 241 JTAG_TDI JTAG Test Data Input 242 JTAG_RTCK JTAG Returned Test Clock Note: It is recommended to provide access through Test Points to this interface the JTAG pads (for Failure Analysis debugging). All signals listed in table above shall be outputs on the customer board to allow JTAG debugging. Refer to the following table for the electrical characteristics of the JTAG interface. Table 36. JTAG Electrical Characteristics Symbol Parameter Minimum Typical Maximum Unit Ftck JTAG_TCK clock period 0.038 26 78 MHz tc2 JTAG_TCK clock period high 12 - - ns tc3 JTAG_TCK clock period low 12 - - ns tc4 JTAG_TDI setup time to JTAG_TCK 12 - - ns tc5 JTAG_TDI hold time from JTAG_TCK 10 - - ns tc6 JTAG_TDO valid before JTAG_TCK low-end - 0 - s tc7 JTAG_TDO valid after JTAG_TCK high begin - 20 - ns The following figure shows the JTAG timing waveform. Figure 11. JTAG Timing Waveform
41110363 Rev 4.0 October 18, 2017 39 Product Technical Specification Detailed Interface Specifications 3.16. RF Interface The RF interface of the AirPrime HL7650 module allows the transmission of RF signals. This interface has a 50Ω nominal impedance. Note that if the final application is a single antenna receiver (does not use the diversity antenna), it is recommended that the diversity antenna be disabled using AT command AT+WMANTSEL. Disabling the diversity antenna when not used:  prevents any noise in the diversity antenna input from degrading the overall sensitivity performance of the main RF input, and  reduces the power consumption of the module. Refer to document [2] AirPrime HL76xx AT Commands Interface Guide for more information regarding AT+WMANTSEL. 3.16.1. RF Connection A 50Ω (with maximum VSWR 1.1:1, and 0.5 dB loss) RF track is recommended to be connected to standard RF connectors such as SMA, UFL, etc. for antenna connection. Refer to the following tables for the pad description of the RF interface. Table 37. RF Main Connection Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max) 49 RF_MAIN 50Ω 1.5:1 1.5:1 Table 38. RF Diversity Connection Pad Number RF Signal Impedance VSWR Rx (max) VSWR Tx (max) 31 RF_DIV 50Ω 1.5:1 --- 3.16.2. RF Performances Table 39. Conducted RX Sensitivity (dBm) – UMTS Bands @ 25°C Frequency Band Primary (Typical) Secondary (Typical) UMTS B1 0.1% BER 12.2 kbps -108 -111 UMTS B5 -111 -112 UMTS B8 -110 -111.5 4G RF performances are compliant with 3GPP recommendation TS 36.101.
41110363 Rev 4.0 October 18, 2017 40 Product Technical Specification Detailed Interface Specifications Table 40. Conducted RX Sensitivity (dBm) – LTE Bands @ 25°C Frequency Band Primary (Typical) Secondary (Typical) SIMO (Typical) LTE B3 Full RB; BW: 20 MHz* -93 (TBC) -95.5 (TBC) -97 (TBC) LTE B5 Full RB; BW: 10 MHz* -97 -99.5 -101 LTE B8 Full RB; BW: 10 MHz* -97 -99.5 -101 LTE B28 Full RB; BW: 20 MHz* -89 -96 -97 * Sensitivity values scale with bandwidth: x_MHz_Sensitivity = 10 MHz_Sensitivity – 10*log (10 MHz/x_MHz) 3.16.3. TX_ON Indicator (TX_ON) The AirPrime HL7650 provides a signal, TX_ON, for TX indication. The TX_ON is a 2.3V (TBC) signal and its status signal depends on the module’s transmitter state. Refer to the following table for the pad description of the TX_ON signal. Table 41. TX_ON Indicator Pad Description Pad Number Signal Name Function I/O type Power Supply Domain 60 TX_ON TX indicator O 2.3V (TBC) Refer to the following table for the status of the TX_ON signal depending on the embedded module’s state. Table 42. Burst Indicator States Embedded Module State TX_ON During TX burst High No TX Low During TX burst, there is a higher current drain from the VBATT_PA power supply which causes a voltage drop. This voltage drop from VBATT_PA is a good indication of a high current drain situation during TX burst. The blinking frequency is about 217 Hz in 2G, continuous in 3G (TBC) and blinking in 4G at (TBC) Hz. The output logic high duration, Tduration, depends on the number of TX slots and is computed as follows: T duration = T advance + (0.577ms x number of TX slots) + T delay Table 43. TX_ON Burst Characteristics Parameter Minimum Typical Maximum Tadvance 30µs Tdelay 0µs
41110363 Rev 4.0 October 18, 2017 41 Product Technical Specification Detailed Interface Specifications TX_ONVBATT _PAT durationT advanceT delayVoltage drop Figure 12. TX_ON State During Transmission
41110363 Rev 4.0 October 18, 2017 42 4. Mechanical Drawings Figure 13. Mechanical Drawing
41110363 Rev 4.0 October 18, 2017 43 Product Technical Specification Mechanical Drawings Figure 14. Dimensions Drawing
41110363 Rev 4.0 October 18, 2017 44 Product Technical Specification Mechanical Drawings Figure 15. Footprint
41110363 Rev 4.0 October 18, 2017 45 5. Design Guidelines 5.1. Power-Up Sequence Apply a low-level logic to the PWR_ON_N pad (pad 59); within approximately 25ms, VGPIO will appear to be at 1.8V. Either UART1 or the USB interface could be used to send AT commands. The AT command interface is available in about 7 seconds after PWR_ON_N for either UART or USB. When using UART, the AT command interface is available after the transition of UART1_CTS from high to low level. When using a USB connection, the HL7650 will start communicating with the host after USB enumeration. The time when AT commands can be sent will depend on the initialization time on the USB host. Figure 16. PWR_ON_N Sequence with VGPIO Information Note: As PWR_ON_N is internally pulled up with 100kΩ, an open collector or open drain transistor must be used for ignition. The PWR_ON_N pad has the minimum assertion time requirement of 25ms, with LOW active. Once the valid power on trigger is detected, the PWR_ON_N pad status can be left open. 5.2. Module Switch-Off AT command AT+CPWROFF enables the user to properly switch the AirPrime HL7650 module off. Figure 17. Power OFF Sequence for PWR_ON_N, VGPIO Note: PWR_ON_N is internally pulled up by 100kΩ to 1.8V.
41110363 Rev 4.0 October 18, 2017 46 Product Technical Specification Design Guidelines 5.3. Hardware Fast Shut Down The fast shutdown event can be triggered by either AT+CPWROFF=1 or a GPIO edge. UART TXGPIO ShutdownOther GPIOsVGPIOorFast Detach requestFast Detach doneShutdown request:- NVMs and other processes-GPIOs All GPIO off VGPIO offt3 = 60 to 80 ms t4 = 180 to 1500 ms t5 = 10 ms t1 = 2 ms t2 = 300 µsIO TRIGGEREDAT+CPWROFF=1 Figure 18. Fast Shutdown Power OFF Sequence Note that the timings for fast detach and mobile shutdown (t3 and t4 in the diagram above) are dependent on operators and network conditions. Starting the shutdown procedure during the boot phase should be avoided as this may cause the shutdown to take more time. 5.4. Emergency Power OFF If required, the module can be switched off by controlling the RESET_IN_N pad (pad 11). This must only be used in emergency situations if the system freezes (not responding to AT commands). To perform an emergency power off, a low-level pulse must be sent on the RESET_IN_N pad for 20ms while the PWR_ON_N signal is inactive (high level). This action will immediately shut the HL7650 module down and the registers of the CPU and RAM memory will be reset for the next power on. 5.5. Sleep Mode Management AT command AT+KSLEEP enables sleep mode configuration. Note that this is only used with serial link UART1. AT+KSLEEP=0:  The module is active when DTR signal is active (low electrical level).  When DTR is deactivated (high electrical level), the module enters sleep mode after a while.  On DTR activation (low electrical level), the module wakes up.
41110363 Rev 4.0 October 18, 2017 47 Product Technical Specification Design Guidelines AT+KSLEEP=1:  The module determines when it enters sleep mode (when no more tasks are running).  “0x00” character on the serial link wakes the module up. AT+KSLEEP=2: The module never enters sleep mode. 5.6. Power Supply Design The AirPrime HL7650 module should not be supplied with voltage over 4.5V even temporarily or however briefly. If the system’s main board power supply unit is unstable or if the system’s main board is supplied with over 4.5V, even in the case of transient voltage presence on the circuit, the module’s power amplifier may be severely damaged. To avoid such issues, add a voltage limiter to the module’s power supply lines so that VBATT and VBATT_PA signal pads will never receive a voltage surge over 4.5V. The voltage limiter can be as simple as a Zener diode with decoupling capacitors as shown in the diagram below. Power Supply VBATT/VBATT _PAD4040.5 pFD405C4041.5 mF ++C405150 µFC407100 nF Figure 19. Voltage Limiter Example 5.7. EMC and ESD Guidelines for USIM Decoupling capacitors must be added according to the drawings below as close as possible to the USIM connectors on UIMx_CLK, UIMx_RST, UIMx_VCC, UIMx_DATA and UIMx_DET signals to avoid EMC issues and to comply with the requirements of ETSI and 3GPP standards covering the USIM electrical interface. A typical schematic including USIM detection is provided below.
41110363 Rev 4.0 October 18, 2017 48 Product Technical Specification Design Guidelines UIMx_VCCUIMx_DATAUIMx_CLKUIMx_RESETUIMx_DETVGPIO100nFDNIUIMx_VCCUIMx_RESETUIMx_CLK1KΩ 100KΩ DNI1nF1 VCC2 RST3 CLK4 C49 SW_A SW_B 10C8 8I/O 7VPP 6GND 5D10012pFCN100UIMx_DATAUIMx_DET Figure 20. EMC and ESD Components Close to the USIM Sierra Wireless recommends using diode ESDALC6V1-5P6 ESD for D100. 5.8. ESD Guidelines for USB When the USB interface is externally accessible, it is required to have ESD protection on the USB_VBUS, USB_D+ and USB_D- signals. Figure 21. ESD Protection for USB
41110363 Rev 4.0 October 18, 2017 49 Product Technical Specification Design Guidelines Note: It is not recommended to have an ESD diode with feedback path from USB_VBUS to either USB_D+ or USB_D-. Sierra Wireless recommends using components:  90Ω DLP0NSN900HL2L EMC filter for FIL400, and  RCLAMP0503N or ESD5V3U2U-03LRH ESD diode for D400. 5.9. USIM Application The AirPrime HL7650 supports either a single USIM design or a dual USIM configuration using DSSS (Dual SIM Single Standby). 5.9.1. Single USIM Design Single USIM design is supported using the following:  1 USIM slot  1 USIM connector  1 GPIO SIM detect Figure 22. Single USIM Application (1 USIM Slot and 1 USIM Connector)
41110363 Rev 4.0 October 18, 2017 50 Product Technical Specification Design Guidelines 5.9.2. Dual SIM Single Standby Design Dual SIM Single Standby (DSSS) with fast network switching is supported using the following:  1 USIM slot  1 or 2 external switches  2 USIM connectors  2 GPIO SIM Detect  1 GPIO switch command Figure 23. Dual SIM Single Standby Application (1 USIM Slot and 2 USIM Connectors)
41110363 Rev 4.0 October 18, 2017 51 6. Reliability Specification AirPrime HL7650 module is tested against the Sierra Wireless Industrial Reliability Specification defined below. 6.1. Reliability Compliance AirPrime HL7650 modules connected on a development kit board application are compliant with the following requirements. Table 44. Standards Conformity Abbreviation Definition IEC International Electro technical Commission ISO International Organization for Standardization 6.2. Reliability Prediction Model 6.2.1. Life Stress Test The following tests the AirPrime HL7650 module’s product performance. Table 45. Life Stress Test Designation Condition Performance Test PT3T & PTRT Standard: N/A Special conditions:  Temperature:  Class A: -30°C to +70°C  Class B: -40°C to +85°C  Rate of temperature change: ± 3°C/min  Recovery time: 3 hours Operating conditions: Powered Duration: 14 days
41110363 Rev 4.0 October 18, 2017 52 Product Technical Specification Reliability Specification 6.2.2. Environmental Resistance Stress Tests The following tests the AirPrime HL7650 module’s resistance to extreme temperature. Table 46. Environmental Resistance Stress Tests Designation Condition Cold Test Active COTA Standard: IEC 680068-2-1, Test Ad Special conditions:  Temperature: -40°C  Temperature variation: 1°C/min Operating conditions: Powered ON with a power cycle of 1 minute ON and 2 minutes OFF Duration: 3 days Resistance to Heat Test RH Standard: IEC 680068-2-2, Test Bb Special conditions:  Temperature: +85°C  Temperature variation: 1°C/min Operating conditions: Powered ON with a power cycle of 15 minutes ON and 15 minutes OFF Duration: 50 days 6.2.3. Corrosive Resistance Stress Tests The following tests the AirPrime HL7650 module’s resistance to corrosive atmosphere. Table 47. Corrosive Resistance Stress Tests Designation Condition Humidity Test HUT Standard: IEC 60068-2-3, Test Ca Special conditions:  Temperature: +65°C  RH: 95%  Temperature variation: 3 ± 0.6°C/min Operating conditions: Powered on, DUT is powered up for 15 minutes and OFF for 15 minutes Duration: 10 days
41110363 Rev 4.0 October 18, 2017 53 Product Technical Specification Reliability Specification Designation Condition Component Solder Wettability CSW Standard: JESD22 – B102, Method 1/Condition C, Solderability Test Method Special conditions:  Test method: Dip and Look Test with Steam preconditioning 8 h ±15min. dip for 5 +0/-0.5 seconds Operating conditions: Un-powered Duration: 1 day Moist Heat Cyclic Test MHCT Standard: IEC 60068-2-30, Test Db Special conditions:  Upper temperature: +40 ± 2°C  Lower temperature: +25 ± 5°C  RH:  Upper temperature: 93%  Lower temperature: 95%  Number of cycles: 21 (1 cycle/24 hours)  Temperature Variation: 3 ± 0.6°C/min Operating conditions: Powered ON for 15 minutes during each 3 hours ramp up and 3 hours ramp down (in middle) for every cycle Duration: 21 days 6.2.4. Thermal Resistance Cycle Stress Tests The following tests the AirPrime HL7650 module’s resistance to extreme temperature cycling. Table 48. Thermal Resistance Cycle Stress Tests Designation Condition Thermal Shock Test TSKT Standard: IEC 60068-2-14, Test Na Special conditions:  Temperature: -30°C to +80°C  Temperature Variation: less than 30s  Number of cycles: 600  Dwell Time: 10 minutes Operating conditions: Un-powered Duration: 9 days Temperature Change TCH Standard: IEC 60068-2-14, Test Nb Special conditions:  Temperature: -40°C to +90°C  Temperature Variation: 3 ±- 0.6°C/min  Number of cycles: 400  Dwell Time: 10 minutes Operating conditions: Un-powered Duration: 29 days
41110363 Rev 4.0 October 18, 2017 54 Product Technical Specification Reliability Specification 6.2.5. Mechanical Resistance Stress Tests The following tests the AirPrime HL7650 module’s resistance to vibrations and mechanical shocks. Table 49. Mechanical Resistance Stress Tests Designation Condition Sinusoidal Vibration Test SVT Standard: IEC 60068-2-6, Test Fc Special conditions:  Frequency range: 16 Hz to 1000 Hz  Displacement: 0.35mm (peak-peak)  Acceleration:  5G from 16 to 62 Hz  3G from 62 to 200 Hz  1G from 200 to 1000 Hz  Sweep rate: 1 octave / cycle  Number of Sweep: 20 sweeps/axis  Sweep direction: ± X, ± Y, ± Z Operating conditions: Un-powered Duration: 2 days Random Vibration Test RVT Standard: IEC 60068-2-64, Test Fh Special conditions:  Frequency range: 10 Hz – 2000 Hz  Power Spectral Density in [(m/s²)²/Hz]  0.1 g2/Hz at 10Hz  0.01 g2/Hz at 250Hz  0.005 g2/Hz at 1000Hz  0.005 g2/Hz at 2000Hz  Peak factor: 3  Duration per Axis: 1 hr / axis Operating conditions: Un-powered Duration: 1 day Mechanical Shock Test MST Standard: IEC 60068-2-27, Test Ea Special conditions:  Shock Test 1:  Wave form: Half sine  Peak acceleration: 30g  Duration: 11ms  Number of shocks: 8  Direction: ±X, ±Y, ±Z  Shock Test 2:  Wave form: Half sine  Peak acceleration: 100g  Duration: 6ms  Number of shocks: 3  Direction: ±X, ±Y, ±Z Operating conditions: Un-powered Duration: 72 hours
41110363 Rev 4.0 October 18, 2017 55 Product Technical Specification Reliability Specification 6.2.6. Handling Resistance Stress Tests The following tests the AirPrime HL7650 module’s resistance to handling malfunctions and damage. Table 50. Handling Resistance Stress Tests Designation Condition ESDC Test Standard: JESD22-A114, JESD22-A115, JESD22-C101 Special conditions:  HBM (Human Body Model): 1KV (Class 1C)  MM (Machine Model): 200V  CDM (Charged Device Model): 250V (Class II) Operating conditions: Powered Duration: 3 days ESD Test Standard: IEC 61000-4-2 Special conditions:  Contact Voltage: ±2kV, ±4kV, ±6kV  Air Voltage: ±2kV, ±4kV, ±8kV Operating conditions: Powered Duration: 3 days Free Fall Test FFT 1 Standard: IEC 60068-2-32, Test Ed Special conditions:  Number of drops: 2 drops per unit  Height: 1m Operating conditions: Un-powered Duration: 6 hours
41110363 Rev 4.0 October 18, 2017 56 7. FCC Regulations The HL7650 module has been granted modular approval for mobile applications. Integrators may use the HL7650 module in their final products without additional FCC certification if they meet the following conditions. Otherwise, additional FCC approvals must be obtained. 1. At least 20 cm separation distance between the antenna and the user’s body must be maintained at all times. 2. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only exposure condition must not exceed:  5 dBi in LTE Band 5 3. The HL7650 module must not transmit simultaneously with other collocated radio transmitters within a host device. 4. The RF signal must be routed on the application board using tracks with a 50Ω characteristic impedance. Basically, the characteristic impedance depends on the dielectric, the track width and the ground plane spacing. In order to respect this constraint, Sierra Wireless recommends using MicroStrip or StripLine structure and computing the Tracks width with a simulation tool (like AppCad shown in the figure below and that is available free of charge at http://www.agilent.com).
41110363 Rev 4.0 October 18, 2017 57 Product Technical Specification FCC Regulations If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital, analog or supply). If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An example of proper routing is shown in the figure below. Stripline and Coplanar design requires having a correct ground plane at both sides. Consequently, it is necessary to add some vias along the RF path. It is recommended to use Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not shielded. Consequently, the RF signal (when transmitting) may interfere with neighbouring electronics (AF amplifier, etc.). In the same way, the neighbouring electronics (micro-controllers, etc.) may degrade the reception performances. The antenna connector is intended to be directly connected to a 50Ω antenna and no matching is needed. 5. A label must be affixed to the outside of the end product into which the HL7650 module is incorporated, with a statement similar to the following: This device contains FCC ID: N7NHL7650 6. A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines. The end product with an embedded HL7650 module may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15. Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093.
41110363 Rev 4.0 October 18, 2017 58 8. Ordering Information Table 51. Ordering Information Model Name Description Part Number HL7650 HL7650 embedded module Contact Sierra Wireless for the latest SKU DEV-KIT HL Series Development Kit 6000620
41110363 Rev 4.0 October 18, 2017 59 9. Terms and Abbreviations Abbreviation Definition ADC Analog to Digital Converter AGC Automatic Gain Control AT Attention (prefix for modem commands) CDMA Code Division Multiple Access CF3 Common Flexible Form Factor CLK Clock CODEC Coder Decoder CPU Central Processing Unit DAC Digital to Analog Converter DTR Data Terminal Ready EGNOS European Geostationary Navigation Overlay Service EMC Electromagnetic Compatibility EMI Electromagnetic Interference EN Enable ESD Electrostatic Discharges ETSI European Telecommunications Standards Institute FDMA Frequency-division multiple access GAGAN GPS aided geo augmented navigation GLONASS Global Navigation Satellite System GND Ground GNSS Global Navigation Satellite System GPIO General Purpose Input Output GPRS General Packet Radio Service GSM Global System for Mobile communications Hi Z High impedance (Z) IC Integrated Circuit IMEI International Mobile Equipment Identification I/O Input / Output LED Light Emitting Diode LNA Low Noise Amplifier MAX Maximum MIN Minimum MSAS Multi-functional Satellite Augmentation System N/A Not Applicable PA Power Amplifier PC Personal Computer PCB Printed Circuit Board PCL Power Control Level PLL Phase Lock Loop PWM Pulse Width Modulation QZSS Quasi-Zenith Satellite System
41110363 Rev 4.0 October 18, 2017 60 Product Technical Specification Terms and Abbreviations Abbreviation Definition RF Radio Frequency RFI Radio Frequency Interference RMS Root Mean Square RST Reset RTC Real Time Clock RX Receive SCL Serial Clock SDA Serial Data SIM Subscriber Identification Module SMD Surface Mounted Device/Design SPI Serial Peripheral Interface SW Software PSRAM Pseudo Static RAM TBC To Be Confirmed TBD To Be Defined TP Test Point TX Transmit TYP Typical UART Universal Asynchronous Receiver-Transmitter UICC Universal Integrated Circuit Card USB Universal Serial Bus UIM User Identity Module VBATT Main Supply Voltage from Battery or DC adapter VSWR Voltage Standing Wave Ratio WAAS Wide Area Augmentation System

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