Sierra Wireless HL7650 HL7650 module User Manual

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AirPrime HL7650
Product Technical Specification
41110363
4.0
October 18, 2017
Product Technical Specification
Important Notice
Due to the nature of wireless communications, transmission and reception of data can never be
guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant
delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used
in a normal manner with a well-constructed network, the Sierra Wireless modem should not be used
in situations where failure to transmit or receive data could result in damage of any kind to the user or
any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or
received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or
receive such data.
Safety and Hazards
Do not operate the Sierra Wireless modem in areas where cellular modems are not advised without
proper device certifications. These areas include environments where cellular radio can interfere such
as explosive atmospheres, medical equipment, or any other equipment which may be susceptible to
any form of radio interference. The Sierra Wireless modem can transmit signals that could interfere
with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is
on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard
systems.
Note:
Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door
is open. Sierra Wireless modems may be used at this time.
The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of
a vehicle. Doing so will detract from the driver or operator’s control and operation of that vehicle. In
some states and provinces, operating such communications devices while in control of a vehicle is an
offence.
Limitations of Liability
This manual is provided “as is”. Sierra Wireless makes no warranties of any kind, either expressed or
implied, including any implied warranties of merchantability, fitness for a particular purpose, or
noninfringement. The recipient of the manual shall endorse all risks arising from its use.
The information in this manual is subject to change without notice and does not represent a
commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL,
GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING,
BUT NOT LIMITED TO, LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR
REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS
PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY
THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability
arising under or in connection with the Sierra Wireless product, regardless of the number of events,
occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.
41110363
Rev 4.0
October 18, 2017
Product Technical Specification
Patents
This product may contain technology developed by or for Sierra Wireless Inc.
This product includes technology licensed from QUALCOMM®.
This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents
licensed from MMP Portfolio Licensing.
Copyright
© 2017 Sierra Wireless. All rights reserved.
Trademarks
Sierra Wireless®, AirPrime®, AirLink®, AirVantage®, WISMO®, ALEOS® and the Sierra Wireless and
Open AT logos are registered trademarks of Sierra Wireless, Inc. or one of its subsidiaries.
Watcher® is a registered trademark of NETGEAR, Inc., used under license.
Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.
Macintosh® and Mac OS X® are registered trademarks of Apple Inc., registered in the U.S. and other
countries.
QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license.
Other trademarks are the property of their respective owners.
Contact Information
Sales information and technical support,
including warranty and returns
Web: sierrawireless.com/company/contact-us/
Global toll-free number: 1-877-687-7795
6:00 am to 5:00 pm PST
Corporate and product information
Web: sierrawireless.com
41110363
Rev 4.0
October 18, 2017
Product Technical Specification
Document History
Version
Date
Updates
1.0
January 26, 2017
Creation
May 04, 2017
Updated:

Protocol Stack row of Table 2 General Features

3.2 Current Consumption

3.16.2 RF Performances

4 Mechanical Drawings
1.1
2.0
February 01, 2017
Changed remaining instances of SIM to USIM
Added section 5.3 Hardware Fast Shut Down
3.0
June 22, 2017
4.0
October 18, 2017
41110363
Updated:

3.2 Current Consumption

Table 20 Digital I/O Electrical Characteristics

3.16.2 RF Performances

3.16.3 TX_ON Indicator (TX_ON)

4 Mechanical Drawings
Added 7 FCC Regulations
Updated Table 43 TX_ON Burst Characteristics
Rev 4.0
October 18, 2017
Contents
1. INTRODUCTION ................................................................................................ 10
1.1.
Common Flexible Form Factor (CF3) ................................................................................ 10
1.3.
General Features ............................................................................................................... 11
1.2.
Physical Dimensions ......................................................................................................... 10
1.4.
Architecture........................................................................................................................ 13
1.5.
Interfaces ........................................................................................................................... 13
1.6.
1.7.
1.8.
1.9.
Connection Interface ......................................................................................................... 14
ESD ................................................................................................................................... 15
Environmental and Certifications ....................................................................................... 15
1.8.1.
Environmental Specifications................................................................................... 15
1.8.2.
Regulatory................................................................................................................ 16
1.8.3.
RoHS Directive Compliant ....................................................................................... 16
1.8.4.
Disposing of the Product .......................................................................................... 16
References ........................................................................................................................ 16
2. PAD DEFINITION ............................................................................................... 17
2.1.
Pad Types.......................................................................................................................... 21
2.2.
Pad Configuration (Top View, Through Module) ............................................................... 22
3. DETAILED INTERFACE SPECIFICATIONS ..................................................... 23
3.1.
Power Supply..................................................................................................................... 23
3.3.
VGPIO ............................................................................................................................... 25
3.2.
3.4.
3.5.
3.6.
Current Consumption ........................................................................................................ 24
BAT_RTC .......................................................................................................................... 25
USIM Interface ................................................................................................................... 26
3.5.1.
UIMx_CLK ................................................................................................................ 27
3.5.2.
UIMx_DET ............................................................................................................... 27
3.7.
3.8.
3.9.
3.10.
3.11.
3.12.
3.13.
USB Interface .................................................................................................................... 28
Electrical Information for Digital I/O ................................................................................... 29
General Purpose Input/Output (GPIO) .............................................................................. 29
Main Serial Link (UART1) .................................................................................................. 30
POWER-ON Signal (PWR_ON_N).................................................................................... 31
Reset Signal (RESET_IN_N) ............................................................................................. 31
Analog to Digital Converter (ADC)..................................................................................... 32
Clock Out Interface ............................................................................................................ 33
3.14. Digital Audio (PCM) Interface ............................................................................................ 34
3.14.1. PCM Waveforms ...................................................................................................... 35
3.14.2. PCM Master Mode ................................................................................................... 36
3.14.3. PCM Slave Mode ..................................................................................................... 37
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Product Technical Specification
3.15.
JTAG .................................................................................................................................. 38
3.16. RF Interface ....................................................................................................................... 39
3.16.1. RF Connection ......................................................................................................... 39
3.16.2. RF Performances ..................................................................................................... 39
3.16.3. TX_ON Indicator (TX_ON) ....................................................................................... 40
4. MECHANICAL DRAWINGS ............................................................................... 42
5. DESIGN GUIDELINES ....................................................................................... 45
5.1.
Power-Up Sequence ......................................................................................................... 45
5.3.
Hardware Fast Shut Down ................................................................................................ 46
5.2.
5.4.
5.5.
5.6.
5.7.
5.8.
5.9.
Module Switch-Off ............................................................................................................. 45
Emergency Power OFF ..................................................................................................... 46
Sleep Mode Management ................................................................................................. 46
Power Supply Design ........................................................................................................ 47
EMC and ESD Guidelines for USIM .................................................................................. 47
ESD Guidelines for USB.................................................................................................... 48
USIM Application ............................................................................................................... 49
5.9.1.
Single USIM Design ................................................................................................. 49
5.9.2.
Dual SIM Single Standby Design............................................................................. 50
6. RELIABILITY SPECIFICATION ......................................................................... 51
6.1.
6.2.
Reliability Compliance ....................................................................................................... 51
Reliability Prediction Model ............................................................................................... 51
6.2.1.
Life Stress Test ........................................................................................................ 51
6.2.2.
Environmental Resistance Stress Tests .................................................................. 52
6.2.3.
Corrosive Resistance Stress Tests ......................................................................... 52
6.2.4.
Thermal Resistance Cycle Stress Tests .................................................................. 53
6.2.5.
Mechanical Resistance Stress Tests ....................................................................... 54
6.2.6.
Handling Resistance Stress Tests ........................................................................... 55
7. FCC REGULATIONS ......................................................................................... 56
8. ORDERING INFORMATION .............................................................................. 58
9. TERMS AND ABBREVIATIONS ........................................................................ 59
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October 18, 2017
List of Figures
Figure 1.
Architecture Overview ..................................................................................................... 13
Figure 3.
AirPrime HL7650 Top View ............................................................................................. 14
Figure 2.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
Figure 22.
Figure 23.
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Mechanical Overview (Top and Bottom Views) .............................................................. 14
AirPrime HL7650 Bottom View ........................................................................................ 14
Pad Configuration ............................................................................................................ 22
UIMx Timing Waveform ................................................................................................... 27
CLKOUTx Timing Waveform ........................................................................................... 33
PCM Timing Waveform ................................................................................................... 35
PCM Master Mode Timing ............................................................................................... 36
PCM Master Mode Timing ............................................................................................... 37
JTAG Timing Waveform .................................................................................................. 38
TX_ON State During Transmission ................................................................................. 41
Mechanical Drawing ........................................................................................................ 42
Dimensions Drawing ....................................................................................................... 43
Footprint .......................................................................................................................... 44
PWR_ON_N Sequence with VGPIO Information ............................................................ 45
Power OFF Sequence for PWR_ON_N, VGPIO ............................................................. 45
Fast Shutdown Power OFF Sequence ............................................................................ 46
Voltage Limiter Example ................................................................................................. 47
EMC and ESD Components Close to the USIM ............................................................. 48
ESD Protection for USB .................................................................................................. 48
Single USIM Application (1 USIM Slot and 1 USIM Connector) ..................................... 49
Dual SIM Single Standby Application (1 USIM Slot and 2 USIM Connectors) ............... 50
Rev 4.0
October 18, 2017
List of Tables
Table 1.
Supported Bands/Connectivity ........................................................................................ 10
Table 3.
ESD Specifications .......................................................................................................... 15
Table 2.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Table 18.
Table 19.
Table 20.
Table 21.
Table 22.
Table 23.
Table 24.
Table 25.
Table 26.
Table 27.
Table 28.
Table 29.
Table 30.
Table 31.
Table 32.
Table 33.
Table 34.
Table 35.
Table 36.
Table 37.
41110363
General Features ............................................................................................................ 11
Environmental Specifications .......................................................................................... 15
Pad Definition .................................................................................................................. 17
Pad Types ....................................................................................................................... 21
Power Supply Pad Description ........................................................................................ 23
Power Supply Electrical Characteristics .......................................................................... 23
Current Consumption ...................................................................................................... 24
Current Consumption per Power Supply ......................................................................... 24
VGPIO Pad Description ................................................................................................... 25
VGPIO Electrical Characteristics ..................................................................................... 25
BAT_RTC Pad Description .............................................................................................. 25
BAT_RTC Electrical Characteristics................................................................................ 26
UIM1 Pad Description ..................................................................................................... 26
UIM2 Pad Description ..................................................................................................... 26
UIM1 and UIM2 Electrical Characteristics ....................................................................... 27
USB Pad Description ....................................................................................................... 28
USB Electrical Characteristics......................................................................................... 28
Digital I/O Electrical Characteristics ................................................................................ 29
GPIO Pad Description ..................................................................................................... 29
UART1 Pad Description .................................................................................................. 30
PWR_ON_N Pad Description .......................................................................................... 31
PWR_ON_N Electrical Characteristics ........................................................................... 31
RESET_IN_N Pad Description ........................................................................................ 32
RESET_IN_N Electrical Characteristics .......................................................................... 32
ADC Pad Description ...................................................................................................... 32
ADC Electrical Characteristics ........................................................................................ 32
Clock Out Interface Pad Description ............................................................................... 33
Clock Out Interface Electrical Characteristics ................................................................. 33
Digital Audio Pad Description .......................................................................................... 34
Digital Audio Electrical Characteristics ............................................................................ 34
PCM Master Mode Parameters ....................................................................................... 36
PCM Slave Mode Parameters ......................................................................................... 37
JTAG Pad Description ..................................................................................................... 38
JTAG Electrical Characteristics ....................................................................................... 38
RF Main Connection ........................................................................................................ 39
Rev 4.0
October 18, 2017
Product Technical Specification
Table 38.
RF Diversity Connection .................................................................................................. 39
Table 40.
Conducted RX Sensitivity (dBm) – LTE Bands @ 25°C ................................................. 40
Table 39.
Table 41.
Table 42.
Table 43.
Table 44.
Table 45.
Table 46.
Table 47.
Table 48.
Table 49.
Table 50.
Table 51.
41110363
Conducted RX Sensitivity (dBm) – UMTS Bands @ 25°C.............................................. 39
TX_ON Indicator Pad Description ................................................................................... 40
Burst Indicator States ...................................................................................................... 40
TX_ON Burst Characteristics .......................................................................................... 40
Standards Conformity...................................................................................................... 51
Life Stress Test................................................................................................................ 51
Environmental Resistance Stress Tests ......................................................................... 52
Corrosive Resistance Stress Tests ................................................................................. 52
Thermal Resistance Cycle Stress Tests ......................................................................... 53
Mechanical Resistance Stress Tests .............................................................................. 54
Handling Resistance Stress Tests .................................................................................. 55
Ordering Information ....................................................................................................... 58
Rev 4.0
October 18, 2017
1. Introduction
This document is the Product Technical Specification for the AirPrime HL7650 Embedded Module. It
defines the high-level product features and illustrates the interfaces for these features. This document
is intended to cover the hardware aspects of the product, including electrical and mechanical.
The AirPrime HL7650 belongs to the AirPrime HL Series from Essential Connectivity Module family.
These are industrial grade Embedded Wireless Modules that provides data connectivity on LTE and
3G networks (as listed in Table 1 Supported Bands/Connectivity).
The HL7650 supports a large variety of interfaces such as USB 2.0, UART, Digital Audio, ADC, USIM
and GPIOs to provide customers with the highest level of flexibility in implementing high-end
solutions.
Table 1.
Supported Bands/Connectivity
Transmit Band (Tx)
Receive Band (Rx)
Uplink
Downlink
Uplink
Downlink
LTE B3
1710 MHz
1785 MHz
1805 MHz
1880 MHz
23 dBm ± 2 dBm
LTE B8
880 MHz
915 MHz
925 MHz
960 MHz
23 dBm ± 2 dBm
RF Band
LTE B5
824 MHz
LTE B28
UMTS B1
UMTS B5
UMTS B8
1.1.
703 MHz
849 MHz
748 MHz
1920 MHz
1980 MHz
880 MHz
915 MHz
824 MHz
849 MHz
869 MHz
758 MHz
2110 MHz
869 MHz
925 MHz
894 MHz
808 MHz
2170 MHz
894 MHz
960 MHz
Maximum Output
Power
23 dBm ± 2 dBm
23 dBm ± 2 dBm
24 dBm +1 / -3 dBm
24 dBm +1 / -3 dBm
24 dBm +1 / -3 dBm
Common Flexible Form Factor (CF3)
The AirPrime HL7650 belongs to the Common Flexible Form Factor (CF3) family of modules. This
family consists of a series of WWAN modules that share the same mechanical dimensions (same
width and length with varying thicknesses) and footprint. The CF3 form factor provides a unique
solution to a series of problems faced commonly in the WWAN module space as it:

Accommodates multiple radio technologies (from 3G to LTE advanced) and band groupings

Offers electrical and functional compatibility


1.2.
Supports bit-pipe (Essential Module Series) and value add (Smart Module Series) solutions
Provides Direct Mount as well as Socket-ability depending on customer needs
Physical Dimensions
AirPrime HL7650 modules are compact, robust, fully shielded modules with the following dimensions:

Length: 23 mm

Thickness: 2.5 mm


Note:
41110363
Width: 22 mm
Weight: 3.5 g
Dimensions specified above are typical values.
Rev 4.0
October 18, 2017
10
Product Technical Specification
1.3.
Introduction
General Features
The table below summarizes the AirPrime HL7650 features.
Table 2.
General Features
Feature
Description




Physical
Electrical
RF
Single or double supply voltage (VBATT and VBATT_PA) – 3.2V – 4.5V
Quad-band LTE (B3, B5, B8 and B28) and tri-band UMTS (B1, B5 and B8)
USIM interface
Note:
Application interface






Dual SIM Single Standby (DSSS)
1.8V/3V support
SIM extraction / hot plug detection
SIM/USIM support
Conforms to ETSI UICC Specifications.
Supports SIM application tool kit with proactive SIM commands







NDIS NIC interface support (Windows 7, Windows 8, Linux)
MBIM support
Multiple non-multiplexed USB channel support
Dial-up networking
USB selective suspend to maximize power savings
CMUX multiplexing over UART
AT command interface – 3GPP 27.007 standard, plus proprietary
extended AT commands

Protocol stack


41110363
Small form factor (146-pad solderable LGA pad) – 23mm x 22mm x
2.5mm (nominal)
Metal shield can
RF connection pads (RF main interface)
Baseband signals connection
Although UIM2 connectivity is available in the hardware, this feature is
not activated in the firmware.
LTE mode operation:

LTE FDD, bandwidth 1.4-20 MHz

System Release: 3GPP Rel. 9

Category 1 (up to 10 Mbit/s in downlink, 5 Mbit/s in uplink)

Rx Diversity

Max modulation 64 QAM DL, 16 QAM UL

Intra-frequency and inter-frequency mobility

SON ANR

Public Warning System PWS
HSDPA (High Speed Downlink Packet Access)

Compliant with 3GPP Rel. 8

Category 10 (10.1Mbps)

IPv6 support
HSUPA (High Speed Uplink Packet Access)

Compliant with 3GPP Release 8

Category 6 (5.76Mbps)
Rev 4.0
October 18, 2017
11
Product Technical Specification
Feature
SMS
Introduction
Description













Connectivity




Environmental
RTC
41110363
SMS over SGs and IMS
SMS MO and MT
SMS saving to SIM card or ME storage
SMS reading from SIM card or ME storage
SMS sorting
SMS concatenation
SMS Status Report
SMS replacement support
SMS storing rules (support of AT+CNMI, AT+CNMA)
Multiple (up to 20) cellular packet data profiles
Sleep mode for minimum idle power draw
Mobile-originated PDP context activation / deactivation
Support QoS profile

Release 97 – Precedence Class, Reliability Class, Delay Class,
Peak Throughput, Mean Throughput

Release 99 QoS negotiation – Background, Interactive, and
Streaming
Static and Dynamic IP address. The network may assign a fixed IP
address or dynamically assign one using DHCP (Dynamic Host
Configuration Protocol).
Supports PAP and CHAP authentication protocols
PDP context type (IPv4, IPv6, IPv4v6). IP Packet Data Protocol context
RFC1144 TCP/IP header compression
Operating temperature ranges (industrial grade):

Class A: -30°C to +70°C

Class B: -40°C to +85°C
Real Time Clock (RTC) with calendar
Rev 4.0
October 18, 2017
12
Product Technical Specification
1.4.
Introduction
Architecture
The figure below presents an overview of the AirPrime HL7650 internal architecture and external
interfaces.
VBAT T
Baseband
GND
VGPIO
BAT_RTC
Memory
(Flash + RAM)
USIM1
USIM2
USB
LGA146
AirPrime HL7650
GPIO x 12
MCU
DSP
PWR_ON_N
PMU
RF
UART1 (8 pins )
RESET _IN_N
RX_LTE
Dulpexer
TX_LTE
PA
RF
Antenna
Switch
RF Main
LGA146
Analog Baseband
ADC x 2
32K_CLKOUT
Peripherals
26M_CLKOUT
PCM
RX_LTE
SAW
Filters
RF
Antenna
Switch
RF DIV
JTAG
TX_ON
26MHz
Figure 1.
Architecture Overview
1.5.
Interfaces
32.768KHz
The AirPrime HL7650 module provides the following interfaces and peripheral connectivity:

1x – VGPIO

2x – 1.8V/3V USIM













41110363
1x – BAT_RTC Backup Battery Interface
1x – USB 2.0
12x – GPIOs (1 of which is multiplexed)
1x – 8-wire UART
1x – Active Low PWR_ON_N
1x – Active Low RESET_IN_N
2x – ADC
2x – System Clock out (32.768 KHz and 26 MHz)
1x – Digital Audio Interface (PCM)
1x – JTAG Interface
1x – RF Main Antenna
1x – RF Diversity
1x – TX Indicator
Rev 4.0
October 18, 2017
13
Product Technical Specification
Introduction
1.6.
Connection Interface
Figure 2.
Mechanical Overview (Top and Bottom Views)
The AirPrime HL7650 module is an LGA form factor device. All electrical and mechanical connections
are made through the 146 Land Grid Array (LGA) pads on the bottom side of the PCB.
The 146 pads have the following distribution:

66 inner signal pads, 1x0.5mm, pitch 0.8mm

7 test point (JTAG), 0.8mm diameter, 1.20mm pitch




1 reserved test point (do not connect), 1.0mm diameter
64 inner ground pads, 1.0x1.0mm, pitch 1.825mm/1.475mm
4 inner corner ground pads, 1x1mm
4 outer corner ground pads, 1x0.9mm
Figure 3.
AirPrime HL7650 Top View
Figure 4.
AirPrime HL7650 Bottom View
41110363
Rev 4.0
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14
Product Technical Specification
1.7.
Introduction
ESD
Refer to the following table for ESD Specifications.
Table 3.
ESD Specifications
Category
Connection
Specification
Operational
RF ports
IEC-61000-4-2 — Level (Electrostatic Discharge Immunity Test)
Non-operational
Host connector
interface
USIM connector
Signals
Other host signals
1.8.
Unless otherwise specified:



JESD22-A114 ± 1kV Human Body Model
JESD22-A115 ± 200V Machine Model
JESD22-C101C ± 250V Charged Device Model
Adding ESD protection is highly recommended at the point where
the USIM contacts are exposed, and for any other signals that
would be subjected to ESD by the user.
Environmental and Certifications
1.8.1.
Environmental Specifications
The environmental specification for both operating and storage conditions are defined in the table
below.
Table 4.
Environmental Specifications
Conditions
Range
Operating Class A
-30°C to +70°C
Storage
-40°C to +85°C
Operating Class B
-40°C to +85°C
Class A is defined as the operating temperature ranges that the device:


Shall exhibit normal function during and after environmental exposure.
Shall meet the minimum requirements of 3GPP or appropriate wireless standards.
Class B is defined as the operating temperature ranges that the device:



41110363
Shall remain fully functional during and after environmental exposure
Shall exhibit the ability to establish an SMS or DATA call (emergency call) at all times even
when one or more environmental constraint exceeds the specified tolerance.
Unless otherwise stated, full performance should return to normal after the excessive
constraint(s) have been removed.
Rev 4.0
October 18, 2017
15
Product Technical Specification
1.8.2.
Introduction
Regulatory
Sierra Wireless hereby declares that the HL7650 is in compliance with all essential requirements of
Directive .
The Declaration of Conformity will be available for viewing at the following location in the EU
community:
Sierra Wireless (UK) Limited
Suite 5, The Hub
Fowler Avenue
Farnborough Business Park
Farnborough, United Kingdom GU14 7JP
1.8.3.
RoHS Directive Compliant
1.8.4.
Disposing of the Product
The AirPrime HL7650 module is compliant with RoHS Directive 2011/65/EU which sets limits for the
use of certain restricted hazardous substances. This directive states that “from 1st July 2006, new
electrical and electronic equipment put on the market does not contain lead, mercury, cadmium,
hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE)”.
This electronic product is subject to the EU Directive 2012/19/EU for Waste Electrical
and Electronic Equipment (WEEE). As such, this product must not be disposed of at a
municipal waste collection point. Please refer to local regulations for directions on how
to dispose of this product in an environmental friendly manner.
1.9.
[1]
[2]
[3]
41110363
References
AirPrime HL Series Customer Process Guidelines
Reference Number: 4114330
AirPrime HL76xx AT Commands Interface Guide
Reference Number: 4118395
AirPrime HL Series Development Kit User Guide
Reference Number: 4114877
Rev 4.0
October 18, 2017
16
2.
Pad Definition
AirPrime HL7650 pads are divided into 2 functional categories.


Core functions and associated pads cover all the mandatory features for M2M connectivity and will be available by default across all CF3 family of
modules. These Core functions are always available and always at the same physical pad location. A customer platform using only these functions
and associated pads is guaranteed to be forward and/or backward compatible with the next generation of CF3 modules.
Extension functions and associated pads bring additional capabilities to the customer. Whenever an Extension function is available on a module, it
is always at the same pad location.
Other pads marked as “not connected” or “reserved” should not be used.
Table 5.
Pad Definition
Pad
Signal Name
Function
I/O
I/O HW
Reset
State
GPIO1
General purpose input/output
I/O
I, T
UART1_RTS
UART1 Request to send
I, T/PU
I, T/PD
10
11
41110363
UART1_RI
UART1_CTS
UART1_TX
UART1_RX
UART1_DTR
UART1 Ring indicator
UART1 Clear to send
UART1 Receive data
UART1 Transmit data
UART1 Data terminal ready
UART1_DCD
UART1 Data carrier detect
GPIO2
General purpose input/output
UART1_DSR
RESET_IN_N
UART1 Data set ready
Input reset signal
Rev 4.0
I/O
Active
Low/High
Power
Supply
Domain
1.8V
Recommendation
for Unused Pads
Left Open
Type
Extension
O, L
1.8V
Connect to test point
Core
I, T/PU
1.8V
Connect to test point
Core
1.8V
1.8V
Connect to test point
Connect to test point
Core
Core
I, T/PU
1.8V
Connect to test point
Core
O, L
1.8V
Connect to test point
Core
I, T/PD
O, H
O, L
N/A
1.8V
1.8V
1.8V
1.8V
Connect to test point
Connect to test point
Connect to test point
Left Open
October 18, 2017
Core
Core
Core
Core
17
Product Technical Specification
Pad
Signal Name
12
USB_D-
13
USB_D+
14
NC
16
USB_VBUS
15
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
41110363
NC
Pad Definition
I/O
I/O HW
Reset
State
Active
Low/High
I/O
I/O
Not Connected
USB VBUS
N/A
Function
USB Data Negative (Low / Full Speed)
USB Data Negative (High Speed)
USB Data Positive (Low / Full Speed)
USB Data Positive (High Speed)
Not Connected
NC
Not Connected (Reserved for future use)
NC
Not Connected (Reserved for future use)
NC
NC
BAT_RTC
26M_CLKOUT
32K_CLKOUT
ADC1
Not Connected (Reserved for future use)
Not Connected (Reserved for future use)
Power supply for RTC backup
26MHz System Clock Output
32.768kHz System Clock Output
I/O
N/A
I, T/PD
I, T/PD
Power
Supply
Domain
3.3V
0.38V
3.3V
0.38V
5V
Type
Connect to test point
Extension
Connect to test point
Extension
Not connected
Extension
Left Open
Not connected
Left Open
1.8V
1.8V
1.8V
Not connected
Connect to test point
Left Open
Recommendation
for Unused Pads
Left Open
Left Open
Left Open
Left Open
Not connected
Not connected
Not connected
Extension
Extension
Extension
Analog to digital converter
N/A
1.2V
Left Open
Extension
UIM1_VCC
1.8V/3V USIM1 Power supply
N/A
1.8V/3V
Mandatory connection
Core
UIM1_DATA
1.8V/3V USIM1 Data
I/O
ADC0
UIM1_CLK
UIM1_RESET
GND
RF_DIV
GND
PCM_OUT
PCM_IN
PCM_SYNC
Analog to digital converter
1.8V/3V USIM1 Clock
1.8V/3V USIM1 Reset
N/A
O, L
O, L
O, L
1.2V
1.8V/3V
1.8V/3V
1.8V/3V
Left Open
Mandatory connection
Mandatory connection
Extension
Core
Core
Mandatory connection
Core
Mandatory connection
Extension
Ground
0V
N/A
0V
Ground
0V
N/A
0V
Mandatory connection
Extension
PCM data in
I, T/PD
1.8V
Left Open
Extension
RF Input - Diversity
PCM data out
PCM sync out
I/O
Rev 4.0
N/A
I, T/PD
I, T/PD
1.8V
1.8V
Mandatory connection
Left Open
Left Open
October 18, 2017
Extension
Extension
Extension
18
Product Technical Specification
Pad Definition
Pad
Signal Name
Function
36
PCM_CLK
PCM clock
38
NC
Not Connected (Reserved for future use)
37
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
41110363
GND
GND
I/O
I/O
I, T/PD
Power
Supply
Domain
Recommendation
for Unused Pads
1.8V
Left Open
Type
Extension
0V
N/A
0V
Mandatory connection
Core
Ground
0V
N/A
0V
Mandatory connection
Core
General purpose input/output
I/O
O, L
1.8V
Connect to test point
Core
Left Open
Not connected
General purpose input/output
NC
Not Connected (Reserved for future use)
NC
Active
Low/High
Ground
GPIO7
GPIO8
I/O HW
Reset
State
Not Connected (Reserved for future use)
I/O
I, T/PD
Left Open
1.8V
1.8V
1.8V
Left Open
Left Open
Core
Not connected
GPIO13
General purpose input/output
I, T/PU
GPIO6
General purpose input/output
I/O
I, T/PD
GND
Ground
0V
N/A
0V
Mandatory connection
Core
Ground
0V
N/A
0V
Mandatory connection
Core
General purpose input/output
I/O
I, T/PD
1.8V
Left Open
Extension
VGPIO
NC
RF_MAIN
GND
GPIO voltage output
Not Connected (Reserved for future use)
RF Input/output
General purpose input/output
GPIO11
General purpose input/output
GPIO15
GPIO14
GPIO10
General purpose input/output
I/O
I/O
N/A
N/A
I, T/PU
I, T/PD
I, T/PU
1.8V
Left Open
Not connected
Left Open
Left Open
Left Open
Mandatory connection
1.8V
1.8V
1.8V
Left Open
Left Open
Left Open
Extension
Core
Core
Not connected
Core
Extension
Extension
Extension
UIM2_VCC
1.8V/3V USIM2 Power supply
N/A
1.8V/3V
Mandatory connection
Core
UIM2_RESET
1.8V/3V USIM2 Reset
O, L
1.8V/3V
Mandatory connection
Core
N/A
1.8V
Mandatory connection
Core
UIM2_DATA
1.8V/3V USIM2 Data
I/O
O, L
UIM2_CLK
1.8V/3V USIM2 Clock
O, L
TX_ON
TX burst indicator
N/A
PWR_ON_N
Active Low Power On control signal
Rev 4.0
1.8V/3V
1.8V/3V
2.3V
Mandatory connection
Mandatory connection
Left Open
October 18, 2017
Core
Core
Extension
19
Product Technical Specification
Pad Definition
Pad
Signal Name
Function
I/O
I/O HW
Reset
State
Active
Low/High
61
VBATT_PA
Power supply (refer to section 3.1 Power
Supply for more information)
N/A
62
VBATT_PA
Power supply (refer to section 3.1 Power
Supply for more information)
N/A
63
VBATT
Power supply
N/A
64
UIM1_DET
UIM1 Detection
I/O
I, T/PD
1.8V
66
GPIO5
General purpose input/output
1.8V
65
67-70
71 166
167 234
236
237
238
239
240
241
242
41110363
UIM2_DET/GPIO4
GND
Note:
GND
UIM2 Detection / General purpose
input/output
I/O
I, T/PD
Ground
0V
N/A
I/O
0V
JTAG_TCK
JTAG Test Clock
JTAG_TMS
JTAG Test Mode Select
JTAG_RESET
JTAG_TRST
JTAG_TDI
JTAG_RTCK
Recommendation
for Unused Pads
Type
Mandatory connection
Core
Mandatory connection
Core
3.2V (min)
3.7V (typ)
4.5V (max)
Mandatory connection
Core
1.8V
Left Open
Left Open
Core
3.2V (min)
3.7V (typ)
4.5V (max)
3.2V (min)
3.7V (typ)
4.5V (max)
0V
Left Open
Extension
Extension
Core
These pads are not available on the AirPrime HL7650 module.
Ground
JTAG_TDO
I, T
Power
Supply
Domain
JTAG RESET
JTAG Test Data Output
JTAG Test Data Input
Rev 4.0
I, PD
I, T
O, T
JTAG Returned Test Clock
JTAG Test Reset
N/A
I, PU
I, PD
I, PU
I, PD
0V
1.8V
Left Open
1.8V
Left Open
1.8V
1.8V
1.8V
1.8V
1.8V
Left Open
Left Open
Left Open
Left Open
Left Open
October 18, 2017
Core
Extension
Extension
Extension
Extension
Extension
Extension
Extension
20
Product Technical Specification
2.1.
Table 6.
Pad Definition
Pad Types
Pad Types
Type
Definition
Digital Input
Digital Output
I/O
Digital Input / Output
Active High
Tristate
Active Low
T/PU
Tristate with pull-up enabled
T/PD
Tristate with pull-down enabled
N/A
41110363
No Applicable
Rev 4.0
October 18, 2017
21
Product Technical Specification
197
198
171
190
213
228
229
230
219
200
173
210
186
225
209
224
208
184
232
223
207
183
206
182
181
40
41
185
231
233
220
221
222
205
180
199
201
202
203
204
179
172
174
175
176
177
178
50
51
187
234
226
218
48
49
227
211
217
46
47
47
212
188
216
42
42
43
43
189
215
44
45
214
196
195
194
191
10
12
11
14
13
16
15
193
38
38
39
GND
192
36
37
69
18
17
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
68
NC
NC
BAT_RTC
26M_CLKOUT
32K_CLKOUT
ADC1
ADC0
UIM1_VCC
UIM1_CLK
UIM1_DATA
UIM1_RESET
GND
RF_DIV
GND
PCM_OUT
JTAG_RESET
JTAG_TCK
GND
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
GPIO5
UIM2_DET / GPIO4
UIM1_DET
VBATT
VBATT_PA
VBATT_PA
TX_ON
PWR_ON_N
UIM2_CLK
UIM2_RESET
UIM2_DATA
UIM2_VCC
GPIO15
GPIO11
GPIO10
70
Core pad
Extension pad
GND
GPIO14
GND
GND
RF_MAIN
GPIO6
NC
VGPIO
NC
GPIO13
GPIO8
NC
GND
GPIO7
PCM_CLK
GND
NC
170
PCM_IN
PCM_SYNC
41110363
JTAG_TDO
242 241 240 239 238 237 236
169
Figure 5.
JTAG_TMS
167
242 241 240 239 238 237 236
GND
JTAG_TRST
JTAG_TDI
168
JTAG_RTCK
GPIO1
UART1_RI
UART1_CTS
UART1_RTS
UART1_DTR
UART1_RX
UART1_TX
UART1_DSR
UART1_DCD
GPIO2
NC
NC
USB_D+
USB_VBUS
NC
USB_DRESET_IN_N
Pad Configuration (Top View, Through Module)
NC
2.2.
Pad Definition
Pad Configuration
Rev 4.0
October 18, 2017
22
3. Detailed Interface Specifications
Note:
If not specified, all electrical values are given for VBATT=3.7V and an operating temperature of
25°C.
For standard applications, VBATT and VBATT_PA must be tied externally to the same power
supply. For some specific applications, AirPrime HL7650 module supports separate VBATT and
VBATT_PA connection if requirements below are fulfilled.
3.1.
Power Supply
The AirPrime HL7650 module is supplied through the VBATT and VBATT_PA signals.
Refer to the following table for the pad description of the Power Supply interface.
Table 7.
Power Supply Pad Description
Pad Number
63
Signal Name
VBATT
61, 62
37, 39, 48, 67-70, 167-234
VBATT_PA
GND
I/O
Description
Power supply (base band)
Power supply (radio frequency)
Ground
Refer to the following table for the electrical characteristics of the Power Supply interface.
Table 8.
Power Supply Electrical Characteristics
Supply
Minimum
Typical
Maximum
VBATT voltage (V)
3.21
3.7
4.5
VBATT_PA voltage (V)
Extended Range
2.82
3.7
4.5
VBATT_PA voltage (V)
Full Specification
Note:
41110363
3.21
3.7
4.5
This value has to be guaranteed during the burst
No guarantee of 3GPP performances over extended range
Load capacitance for VBATT is around 140µF ± 20% embedded inside the module.
Load capacitance for VBATT_PA is around 20µF ± 20% embedded inside the module.
Rev 4.0
October 18, 2017
23
Product Technical Specification
Detailed Interface Specifications
3.2.
Current Consumption
Note:
Typical values are defined for VBATT/VBATT_PA at 3.7V and 25°C, for 50Ω impedance at all RF
ports with VSWR1:1 and CMW500. Maximum values are defined with worst conditions among
supported ranges of voltages and temperature (50Ω, VSWR1:1 and CMW500).
The following table lists the current consumption of the AirPrime HL7650 at different conditions.
Table 9.
Current Consumption
Parameter
Typical
Off mode
Sleep mode – LTE
DRX8
USB disconnected
Sleep mode – WCDMA
DRX8
USB disconnected
LTE in communication mode
(TX Max)
WCDMA in communication
mode (TX Max)
Note:
Table 10.
300
Unit
µA
Band 3
1.7
5.5
mA
Band 8
1.7
5.7
mA
Band 5
Band 28
Band 1
Band 5
Band 8
Band 3
Band 5
Band 8
Band 28
Band 1
Band 5
Band 8
1.9
1.9
1.2
1.2
1.2
595
585
665
765
515
490
490
6.0
6.0
4.95
4.95
4.95
740
730
815
920
630
605
610
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Maximum current peak measured for VSWR3:1 is 1100 mA.
Current Consumption per Power Supply
Parameter (at nominal voltage, 3.7 V)
VBATT
VBATT_PA
41110363
110
Maximum
LTE in
communication mode
(TX Max)
WCDMA in
communication mode
(TX Max)
LTE in
communication mode
(TX Max)
WCDMA in
communication mode
(TX Max)
Typical
Maximum
Unit
Band 3
235
355
mA
Band 8
235
380
mA
Band 5
230
355
mA
Band 28
240
380
mA
Band 5
125
220
mA
Band 1
Band 8
Band 3
Band 5
Band 8
130
125
360
355
430
230
220
385
375
435
mA
mA
mA
mA
mA
Band 28
525
540
mA
Band 5
365
385
mA
Band 1
Band 8
Rev 4.0
385
365
400
390
October 18, 2017
mA
mA
24
Product Technical Specification
3.3.
Detailed Interface Specifications
VGPIO
The VGPIO output can be used to:


Pull-up signals such as I/Os
Supply the digital transistors driving LEDs
The VGPIO output is available when the AirPrime HL7650 module is switched ON.
Refer to the following table for the pad description of the VGPIO interface.
Table 11.
VGPIO Pad Description
Pad Number
Signal Name
I/O
Description
45
VGPIO
GPIO voltage output
Refer to the following table for the electrical characteristics of the VGPIO interface.
Table 12.
VGPIO Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Remarks
Voltage level (V)
1.7
1.8
1.9
Both active mode and sleep mode
50
1.5
Current capability
Active Mode (mA)
Current capability
Sleep Mode (mA)
Rise Time (ms)
3.4.
Power management support up to
50mA output in Active mode
Power management support up to
3mA output in Sleep mode
Start-Up time from 0V
BAT_RTC
The AirPrime HL7650 module provides an input/output to connect a Real Time Clock power supply.
This pad is used as a back-up power supply for the internal Real Time Clock. The RTC is supported
when VBATT is available but a back-up power supply is needed to save date and hour when VBATT
is switched off.
If VBATT is available, the back-up battery can be charged by the internal 1.8V power supply regulator.
Refer to the following table for the pad description of the BAT_RTC interface.
Table 13.
BAT_RTC Pad Description
Pad Number
Signal Name
I/O
Description
21
BAT_RTC
I/O
Power supply for RTC backup
Refer to the following table for the electrical characteristics of the BAT_RTC interface.
41110363
Rev 4.0
October 18, 2017
25
Product Technical Specification
Table 14.
Detailed Interface Specifications
BAT_RTC Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Unit
Input voltage
1.7
1.8
1.9
1.8
+5%
Input current consumption
2.5 (TBC)
Max charging current (@VBATT=3.7V)
25 (TBC)
Output voltage
3.5.
-5%
µA
mA
USIM Interface
The AirPrime HL7650 has two physical USIM interfaces, UIM1 and UIM2.
Both UIM1 and UIM2 allow control of a 1.8V/3V USIM and is fully compliant with GSM 11.11
recommendations concerning SIM functions.
The five signals used by the UIMx interface are as follows:

UIMx_VCC: Power supply

UIMx_DATA: I/O port



UIMx_CLK: Clock
UIMx_RESET: Reset
UIMx_DET: Hardware SIM detection
UIM1 is used in single SIM applications, and has optional support for dual SIM applications with an
external SIM switch (for use in Dual SIM Single Standby (DSSS) applications).
A second UIM interface, UIM2, is also available for Dual SIM Single Standby (DSSS) option.
Note:
Although UIM2 connectivity is available in the hardware, this feature is not activated in the firmware.
For USIM design examples, refer to section 5.9 USIM Application.
Refer to the following table for the pad description of both UIM interfaces.
Table 15.
UIM1 Pad Description
Pad Number
Signal Name
Description
26
UIM1_VCC
1.8V/3V USIM1 Power
supply
28
UIM1_DATA
27
29
64
Table 16.
UIM1_CLK
1.8V/3V USIM1 Clock
UIM1_RESET
1.8V/3V USIM1 Reset
UIM1_DET
Signal Name
55
UIM2_VCC
56
UIM2_DATA
41110363
1.8V/3V USIM1 Data
USIM1 Detection
UIM2 Pad Description
Pad Number
58
Multiplex
UIM2_CLK
Description
Multiplex
1.8V/3V USIM2 Power supply
1.8V/3V USIM2 Clock
1.8V/3V USIM2 Data
Rev 4.0
October 18, 2017
26
Product Technical Specification
Pad Number
57
Detailed Interface Specifications
Signal Name
Description
Multiplex
UIM2_DET
USIM2 Detection
GPIO4
UIM2_RESET
65
1.8V/3V USIM2 Reset
Refer to the following table for the electrical characteristics of both UIM1 and UIM2 interfaces.
Table 17.
UIM1 and UIM2 Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Units
Remarks
2.9
1.80
UIMx Detect
1.80
The appropriate
output voltage is auto
detected and selected
by software.
High active
UIMx_VCC Line Regulation
50
mV/V
At Iout_Max
ns
UIMx Interface Voltage
(VCC, CLK, IO, RESET)
UIMx_VCC Current
UIMx_VCC Power-up Setting Time
from power down
UIMx_CLK clock period (ti1)
3.5.1.
82
UIMx_CLK rise time/fall time (tR / tF)
UIMx_IO rise time/fall time (tR / tF)
307
82
10
10
205
UIMx_CLK high time (ti2)
UIMx_CLK high time (ti3)
50
1000
mA
µs
Max output current in
sleep mode = 3 mA
ns
ns
ns
ns
UIMx_CLK
The following figure shows the UIMx_CLK timing waveform.
Figure 6.
3.5.2.
UIMx Timing Waveform
UIMx_DET
UIMx_DET is used to detect and notify the application about the insertion and removal of a USIM
device in the USIM socket connected to the USIM interface (UIM1 or UIM2). When a USIM is
inserted, the state of UIMx_DET transitions from logic 0 to logic 1. Inversely, when a USIM is
removed, the state of UIMx_DET transitions from logic 1 to logic 0.
While UIM1_DET has a dedicated pad (pad 64), UIM2_DET is multiplexed with GPIO4 (pad 65).
41110363
Rev 4.0
October 18, 2017
27
Product Technical Specification
Detailed Interface Specifications
Enabling or disabling this UIM detect feature can be done using the AT+KSIMDET command. For more
information about this command, refer to document [2] AirPrime HL76xx AT Commands Interface
Guide.
3.6. USB Interface
The AirPrime HL7650 has one Universal Serial Bus interface complaint with USB Rev 2.0.
Refer to the following table for the pad description of the USB interface.
Table 18.
USB Pad Description
Pad Number
Signal Name
12
USB_D-
16
USB_VBUS
13
I/O
I/O
USB_D+
Note:
Function
USB Data Negative
I/O
USB Data Positive
USB VBUS
When the 5V USB supply is not available, connect USB_VBUS to VBATT to supply the USB
interface.
Refer to the following table for the electrical characteristics of the USB interface.
Table 19.
USB Electrical Characteristics
Parameter
Minimum
Typical
Maximum
Units
Input voltage at pads
USB_D+ / USB_D-
-0.3
3.6
Voltage USB_VBUS
Full Speed Mode
Signal Rate
11.994
Rising Edge
EOP (end of packet) Width
Falling Edge
High Speed Mode
175
ns
20
ns
Rising Edge
500
41110363
Mbit/s
479.760
Falling Edge
12.006
160
Signal Rate
EOP (end of packet) Width
5.25
15.625
500
Rev 4.0
20
480.024
17.7073
Test Condition
ns
At 10% and 90%
At 10% and 90%
Mbit/s
ns
ps
ps
At 10% and 90%
At 10% and 90%
October 18, 2017
28
Product Technical Specification
3.7.
Detailed Interface Specifications
Electrical Information for Digital I/O
The AirPrime HL7650 supports two groups of digital interfaces with varying current drain limits. The
following list enumerates these interfaces.


Group 1 (6mA current drain limit)

GPIO2, GPIO4, GPIO6, GPIO8, GPIO10, GPIO11, GPIO13, GPIO14, GPIO15

GPIO1, GPIO5, GPIO7

JTAG
Group 2 (1mA current drain limit)
UART1

Refer to the following table for the electrical characteristics of the Digital I/O interface.
Table 20.
Digital I/O Electrical Characteristics
Parameter
Symbol
Minimum
Maximum
Input Current-High (µA)
IIH
-240
DC Output Current-High (mA)
IOH
DC Output Current-High (mA)
IOH
VIH
1.33
1.90
VOH
1.45
IOH = -6mA
0.35
IOL = 6mA
Input Current-Low (µA)
Group 1
DC Output Current-Low (mA)
Group 2
DC Output Current-Low (mA)
Input Voltage-High (V)
Input Voltage-Low (V)
IOL
IOL
VIL
Output Voltage-High (V)
VOH
VOL
Output Voltage-Low (V)
3.8.
IIL
VOL
Remarks
240
-6
-1
-0.20
1.60
0.34
0.20
IOH = -0.1mA
IOL = 0.1mA
General Purpose Input/Output (GPIO)
The AirPrime HL7650 module provides 12 GPIOs, 1 of which is multiplexed.
Refer to the following table for the pad description of the GPIO interface.
Table 21.
GPIO Pad Description
Pad Number
Signal Name
I/O
Power Supply Domain
GPIO1
I/O
1.8V
GPIO7
I/O
1.8V
10
GPIO2
41
GPIO8
40
44
41110363
Multiplex
I/O
I/O
GPIO13
I/O
Rev 4.0
1.8V
1.8V
1.8V
October 18, 2017
29
Product Technical Specification
Pad Number
Signal Name
46
GPIO6
52
GPIO10
51
Detailed Interface Specifications
Multiplex
I/O
GPIO14
53
54
GPIO4
66
I/O
1.8V
I/O
UIM2_DET
GPIO5
3.9.
1.8V
I/O
GPIO15
65
I/O
I/O
GPIO11
Power Supply Domain
I/O
I/O
1.8V
1.8V
1.8V
1.8V
1.8V
Main Serial Link (UART1)
The main serial link (UART1) is used for communication between the AirPrime HL7650 module and a
PC or host processor. It consists of a flexible 8-wire serial interface that complies with RS-232
interface.
The supported baud rates of the UART1 are 300, 1200, 2400, 4800, 9600, 19200, 38400, 57600,
115200, 230400, 460800, 500000, 750000, 921600, 1843200, 3000000 and 3250000 bit/s.
The signals used by UART1 are as follows:

TX data (UART1_TX)

Request To Send (UART1_RTS)






Note:
RX data (UART1_RX)
Clear To Send (UART1_CTS)
Data Terminal Ready (UART1_DTR)
Data Set Ready (UART1_DSR)
Data Carrier Detect (UART1_DCD)
Ring Indicator (UART1_RI)
Signal names are according to PC view.
Refer to the following table for the pad description of the main serial link (UART1) interface.
Table 22.
UART1 Pad Description
Pad #
Signal Name*
I/O*
Description
UART1_RI
Signal incoming calls (data only), SMS, etc.
UART1_CTS
AirPrime HL7650 is ready to receive AT commands
UART1_RTS
UART1_TX
UART1_RX
UART1_DTR
I (active low)
UART1_DCD
UART1_DSR
41110363
Request to send
Transmit data
Receive data
Prevents the AirPrime HL7650 from entering sleep mode,
switches between data mode and command mode, and
wakes the module up.
Signal data connection in progress
Signal UART interface is ON
According to PC view.
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Product Technical Specification
Detailed Interface Specifications
3.10. POWER-ON Signal (PWR_ON_N)
A low-level signal has to be provided to switch the AirPrime HL7650 module ON.
It is internally connected to the permanent 1.8V supply regulator inside the HL7650 via a pull-up
resistor. Once VBAT is supplied to the HL7650 module, this 1.8V supply regulator will be enabled and
so the PWR_ON_N signal is by default at high level.
Refer to the following table for the pad description of the PWR_ON_N interface.
Table 23.
PWR_ON_N Pad Description
Pad Number
Signal Name
I/O
Description
59
PWR_ON_N
Power On the HL7650 module
Refer to the following table for the electrical characteristics of the PWR_ON_N interface.
Table 24.
PWR_ON_N Electrical Characteristics
Parameter
Minimum
Input Voltage-Low (V)
Input Voltage-High (V)
Power-up period (ms) from PWR_ON_N falling edge
PWR_ON_N assertion time (ms)
Note:
1.33
2000
25
Typical
Maximum
0.51
2.2
As PWR_ON_N is internally pulled up with 100kΩ, an open collector or open drain transistor must
be used for ignition.
VGPIO is an output from the module that can be used to check if the module is active.


Note:
When VGPIO = 0V, the module is OFF
When VGPIO = 1.8V, the module is ON (it can be in idle, communication or sleep mode)
PWR_ON_N signal cannot be used to power the module off. To power the module off, use AT
command AT+CPWROFF.
3.11. Reset Signal (RESET_IN_N)
To reset the module, a low-level pulse must be sent on the RESET_IN_N pad for 20ms. This action
will immediately restart the AirPrime HL7650 module with the PWR_ON_N signal at low level. (If the
PWR_ON_N signal is at high level, the module will be powered off.) As RESET_IN_N is internally
pulled up, an open collector or open drain transistor should be used to control this signal.
The RESET_IN_N signal will reset the registers of the CPU and reset the RAM memory as well, for
the next power on.
Note:
As RESET_IN_N is referenced to the VRTC (200kΩ pull-up resistor to VRTC 1.8V) an open
collector or open drain transistor has to be used to control this signal.
Refer to the following table for the pad description of the RESET_IN_N interface.
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Product Technical Specification
Table 25.
Detailed Interface Specifications
RESET_IN_N Pad Description
Pad Number
Signal Name
I/O
Description
12
RESET_IN_N
Hardware Reset
Refer to the following table for the electrical characteristics of the RESET_IN_N interface.
Table 26.
RESET_IN_N Electrical Characteristics
Parameter
Minimum
Input Voltage-Low (V)
Input Voltage-High (V)
1.33
Power-up period (ms) from RESET_IN_N falling edge*
2000
Reset assertion time (ms)
Typical
Maximum
0.51
20
2.2
With the PWR_ON_N Signal at low level.
3.12. Analog to Digital Converter (ADC)
Two Analog to Digital Converter inputs, ADC0 and ADC1, are provided by the AirPrime HL7650
module. These converters are 10-bit resolution ADCs ranging from 0 to 1.2V.
Typical ADC use is for monitoring external voltage, wherein an application is used to safely power
OFF an external supply in case of overvoltage.
Refer to the following table for the pad description of the ADC interface.
Table 27.
ADC Pad Description
Pad Number
Signal Name
I/O
Description
24
ADC1
Analog to digital converter
25
ADC0
Analog to digital converter
Refer to the following table for the electrical characteristics of the ADC interface.
Table 28.
ADC Electrical Characteristics
Parameter
Minimum
Typical
Maximum
ADCx Resolution (bits)
10
Remarks
Input Voltage Range (V)
1.2
General purpose input
Integral Nonlinearity (bits)
±2
LSB
849
853
858
Update rate per channel (kHz)
Offset Error (bits)
Gain
Absolute gain drift
Input Capacitance (pF)
Input Resistance (MΩ)
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Rev 4.0
125
±1
LSB
± 0.05
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Product Technical Specification
Detailed Interface Specifications
Parameter
Current tolerance
Minimum
Typical
710
Quiescent current (µA)
Wake-up time from power save (µs)
Maximum
Remarks
± 3%
50
3.13. Clock Out Interface
The AirPrime HL7650 module supports two digital clock out interfaces.
Enabling or disabling the clock out feature can be done using AT commands. For more information
about AT commands, refer to document [2] AirPrime HL76xx AT Commands Interface Guide.
Refer to the following table for the pad description of the clock out interface.
Table 29.
Clock Out Interface Pad Description
Pad Number
Signal Name
I/O
I/O Type
Description
22
26M_CLKOUT
1.8V
26MHz Digital Clock output
23
32K_CLKOUT
1.8V
32.768kHz Digital Clock output
Refer to the following table for the electrical characteristics of the clock out interface.
Table 30.
Clock Out Interface Electrical Characteristics
Parameter
Symbol
Minimum
Typical
Maximum
Units
CLKOUTn period at 26MHz
(tr1)
38
ns
CLKOUTn high time at 26MHz
(tr3)
10
ns
CLKOUTn low time at 32.768KHz
(tr2)
CLKOUTn low time at 26MHz
(tr2)
CLKOUTn period at 32.768KHz
(tr1)
CLKOUTn high time at 32.768KHz
(tr3)
Period jitter
10
ns
ns
ns
ns
ns
The following figure shows the clock out (CLKOUT) timing waveform.
Figure 7.
41110363
CLKOUTx Timing Waveform
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Product Technical Specification
Detailed Interface Specifications
3.14. Digital Audio (PCM) Interface
The Digital Audio (PCM) Interface allows connectivity with standard audio peripherals. It can be used,
for example, to connect an external audio codec.
The programmability of this interface allows addressing a large range of audio peripherals.
The PCM interface is a high speed full duplex interface that can be used to send and receive digital
audio data to external audio ICs. The Digital Audio Interface also features the following:

PCM master or slave

MSB first



16 bits data word length, linear mode
Configurable PCM bit clock rate on 256kHz, 384kHz or 512kHz
Long frame sync
The signals used by the Digital Audio Interface are as follows:




PCM_SYNC: The frame synchronization signal delivers an 8 kHz frequency pulse that
synchronizes the frame data in and the frame data out.
PCM_CLK: The frame bit clock signal controls data transfer with the audio peripheral.
PCM_OUT: The frame “data out” relies on the selected configuration mode.
PCM_IN: The frame “data in” relies on the selected configuration mode.
Refer to the following table for the pad description of the digital audio interface.
Table 31.
Digital Audio Pad Description
Pad #
Signal Name
I/O
I/O Type
Description
36
PCM_CLK
1.8V
PCM clock
34
PCM_IN
1.8V
PCM data in
35
PCM_SYNC
33
PCM_OUT
1.8V
1.8V
PCM synchronization
PCM data out
Refer to the following table for the electrical characteristics of the digital audio interface.
Table 32.
Digital Audio Electrical Characteristics
Signal
Description
Tsync_low +
Tsync_high
PCM_SYNC frequency
KHz
Tsync_low
PCM_SYNC period
PCM_SYNC low time
125
µs
PCM_SYNC high time
Tsync_low +
Tsync_high
Tsync_high
TCLK-cycle
TIN-setup
41110363
PCM_CLK period
PCM_IN setup time
Rev 4.0
Minimum
Typical
Maximum
124
59.6
3.9
Unit
µs
October 18, 2017
µs
µs
ns
34
Product Technical Specification
Signal
TIN-hold
TOUT-delay
Detailed Interface Specifications
Description
PCM_IN hold time
PCM_OUT delay time
Minimum
12
Typical
Maximum
21.6
ns
ns
TSYNC-delay
PCM_SYNC output delay
-24
VIH
I/O Voltage input low
0.35*VDD
0.45
±0.7
µA
VDD
VIL
VOL
VOH
IL
PCM Signaling Voltage
I/O Voltage input high
I/O Voltage output low
I/O Voltage output high
I/O Leakage current
1.7
-0.3
VDD-0.45
31.2
Unit
ns
1.8
1.9
0.65*VDD
VDD+0.3
3.14.1. PCM Waveforms
The following figure shows the PCM timing waveform.
Figure 8.
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PCM Timing Waveform
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Product Technical Specification
Detailed Interface Specifications
3.14.2. PCM Master Mode
Figure 9.
PCM Master Mode Timing
Table 33.
PCM Master Mode Parameters
Symbol
Description
Minimum
Typical
Maximum
Unit
Test
Condition
tI2Sbm1
PCM_CLK clock period
T-4
ns
T = M_T
tI2Sbm3
PCM_CLK high time
T/2 – 20
T/2
ns
T = M_T
tI2Sbm2
tI2Sbm4
tI2Sbm5
tI2Sbm6
tI2Sbm7
tI2Sbm8
tI2Sbm9
Note:
41110363
PCM_CLK low time
PCM_SYNC high begin after
clock PCM_CLK high begin
PCM_SYNC high end after
PCM_CLK how end
PCM_OUT invalid before
PCM_CLK low-end
PCM_OUT valid after
PCM_CLK high begin
PCM_IN setup time before
PCM_CLK high end
PCM_IN hold time after
PCM_CLK low begin
T/2 – 20
-24
T/2
ns
2 x tcp + 12
ns
T = M_T
tcp = 9.6 ns
-24
2 x tcp + 12
ns
tcp = 9.6 ns
24
ns
tcp + 12
ns
tcp = 9.6 ns
tcp + 50
ns
tcp = 9.6 ns
12
Ns
T corresponds to the audio sampling rate (48 kHz, 44.1 kHz, 32 kHz, 24 kHz, 22.05 kHz, 16 kHz, 12
kHz, 11.025 kHz and 8 kHz) and to the frame length (17 bit, 18bit, 32bit, 48bit or 64 bit).
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Product Technical Specification
Detailed Interface Specifications
3.14.3. PCM Slave Mode
Figure 10.
PCM Master Mode Timing
Table 34.
PCM Slave Mode Parameters
Symbol
Description
Minimum
Typical
Maximum
Unit
Test
Condition
tI2Sbs1
PCM_CLK clock period
T=M_T
tI2Sbs3
PCM_CLK high time
120
ns
tI2Sbs2
tI2Sbs4
tI2Sbs5
tI2Sbs6
tI2Sbs7
tI2Sbs8
tI2Sbs9
Note:
41110363
PCM_CLK low time
PCM_SYNC high begin
before PCM_CLK low begin
(latching edge of PCM_CLK)
120
ns
2 x tcp + 17
ns
tcp = 9.6 ns
2 x tcp + 17
ns
tcp = 9.6 ns
12
ns
PCM_OUT valid after
PCM_CLK rising edge
(shifting edge of PCM_CLK )
3 x tcp + 12
ns
tcp = 9.6 ns
PCM_IN hold time after
PCM_CLK falling edge
ns
tcp = 9.6 ns
24
ns
PCM_SYNC low begin
before PCM_CLK low begin
(latching edge of PCM_CLK)
PCM_OUT invalid before
PCM_CLK rising edge
(shifting edge of PCM_CLK )
PCM_IN setup time before
PCM_CLK falling edge
tcp + 12
T corresponds to the audio sampling rate (48 kHz, 44.1 kHz, 32 kHz, 24 kHz, 22.05 kHz, 16 kHz, 12
kHz, 11.025 kHz and 8 kHz) and to the frame length (17 bit, 18bit, 32bit, 48bit or 64 bit).
Rev 4.0
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37
Product Technical Specification
Detailed Interface Specifications
3.15. JTAG
The JTAG interface provides debug access to the core of the AirPrime HL7650 module. These JTAG
signals are accessible through solderable test points.
Refer to the following table for the pad description of the JTAG interface.
Table 35.
JTAG Pad Description
Pad Number
Signal Name
Function
236
JTAG_RESET
JTAG RESET
238
JTAG_TDO
237
239
240
241
242
Note:
JTAG_TCK
JTAG Test Clock
JTAG Test Data Output
JTAG_TMS
JTAG Test Mode Select
JTAG_TDI
JTAG Test Data Input
JTAG_TRST
JTAG Test Reset
JTAG_RTCK
JTAG Returned Test Clock
It is recommended to provide access through Test Points to this interface the JTAG pads (for
Failure Analysis debugging). All signals listed in table above shall be outputs on the customer board
to allow JTAG debugging.
Refer to the following table for the electrical characteristics of the JTAG interface.
Table 36.
Symbol
Ftck
JTAG Electrical Characteristics
Parameter
Minimum
JTAG_TCK clock period
0.038
Typical
26
Maximum
78
Unit
MHz
tc2
JTAG_TCK clock period high
12
ns
tc4
JTAG_TDI setup time to JTAG_TCK
12
ns
tc3
tc5
tc6
tc7
JTAG_TCK clock period low
JTAG_TDI hold time from JTAG_TCK
JTAG_TDO valid before JTAG_TCK low-end
JTAG_TDO valid after JTAG_TCK high begin
12
10
ns
ns
20
ns
The following figure shows the JTAG timing waveform.
Figure 11.
41110363
JTAG Timing Waveform
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Product Technical Specification
Detailed Interface Specifications
3.16. RF Interface
The RF interface of the AirPrime HL7650 module allows the transmission of RF signals. This interface
has a 50Ω nominal impedance.
Note that if the final application is a single antenna receiver (does not use the diversity antenna), it is
recommended that the diversity antenna be disabled using AT command AT+WMANTSEL. Disabling
the diversity antenna when not used:


prevents any noise in the diversity antenna input from degrading the overall sensitivity
performance of the main RF input, and
reduces the power consumption of the module.
Refer to document [2] AirPrime HL76xx AT Commands Interface Guide for more information
regarding AT+WMANTSEL.
3.16.1. RF Connection
A 50Ω (with maximum VSWR 1.1:1, and 0.5 dB loss) RF track is recommended to be connected to
standard RF connectors such as SMA, UFL, etc. for antenna connection.
Refer to the following tables for the pad description of the RF interface.
Table 37.
RF Main Connection
Pad Number
RF Signal
Impedance
VSWR Rx (max)
VSWR Tx (max)
49
RF_MAIN
50Ω
1.5:1
1.5:1
Table 38.
RF Diversity Connection
Pad Number
RF Signal
Impedance
VSWR Rx (max)
VSWR Tx (max)
31
RF_DIV
50Ω
1.5:1
---
3.16.2. RF Performances
Table 39.
Conducted RX Sensitivity (dBm) – UMTS Bands @ 25°C
Frequency Band
UMTS B1
UMTS B5
UMTS B8
Primary (Typical)
0.1% BER 12.2 kbps
-108
-111
-110
Secondary (Typical)
-111
-112
-111.5
4G RF performances are compliant with 3GPP recommendation TS 36.101.
41110363
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39
Product Technical Specification
Table 40.
Detailed Interface Specifications
Conducted RX Sensitivity (dBm) – LTE Bands @ 25°C
Frequency Band
Primary (Typical)
Secondary (Typical)
SIMO (Typical)
LTE B3
Full RB; BW: 20 MHz*
-93 (TBC)
-95.5 (TBC)
-97 (TBC)
LTE B8
Full RB; BW: 10 MHz*
-97
-99.5
-101
LTE B5
Full RB; BW: 10 MHz*
LTE B28
Full RB; BW: 20 MHz*
-97
-99.5
-89
-96
-101
-97
Sensitivity values scale with bandwidth: x_MHz_Sensitivity = 10 MHz_Sensitivity – 10*log (10 MHz/x_MHz)
3.16.3. TX_ON Indicator (TX_ON)
The AirPrime HL7650 provides a signal, TX_ON, for TX indication. The TX_ON is a 2.3V (TBC) signal
and its status signal depends on the module’s transmitter state.
Refer to the following table for the pad description of the TX_ON signal.
Table 41.
TX_ON Indicator Pad Description
Pad Number
Signal Name
Function
I/O type
Power Supply Domain
60
TX_ON
TX indicator
2.3V (TBC)
Refer to the following table for the status of the TX_ON signal depending on the embedded module’s
state.
Table 42.
Burst Indicator States
Embedded Module State
TX_ON
During TX burst
High
No TX
Low
During TX burst, there is a higher current drain from the VBATT_PA power supply which causes a
voltage drop. This voltage drop from VBATT_PA is a good indication of a high current drain situation
during TX burst.
The blinking frequency is about 217 Hz in 2G, continuous in 3G (TBC) and blinking in 4G at (TBC) Hz.
The output logic high duration, Tduration, depends on the number of TX slots and is computed as
follows:
T duration = T advance + (0.577ms x number of TX slots) + T delay
Table 43.
TX_ON Burst Characteristics
Parameter
Minimum
Tadvance
30µs
Tdelay
41110363
Typical
Maximum
0µs
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40
Product Technical Specification
TX_ON
Detailed Interface Specifications
T duration
VBATT _PA
Voltage drop
T advance
Figure 12.
41110363
T delay
TX_ON State During Transmission
Rev 4.0
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41
4. Mechanical Drawings
Figure 13.
41110363
Mechanical Drawing
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42
Product Technical Specification
Figure 14.
41110363
Mechanical Drawings
Dimensions Drawing
Rev 4.0
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43
Product Technical Specification
Figure 15.
41110363
Mechanical Drawings
Footprint
Rev 4.0
October 18, 2017
44
5. Design Guidelines
5.1.
Power-Up Sequence
Apply a low-level logic to the PWR_ON_N pad (pad 59); within approximately 25ms, VGPIO will appear
to be at 1.8V. Either UART1 or the USB interface could be used to send AT commands. The AT
command interface is available in about 7 seconds after PWR_ON_N for either UART or USB.
When using UART, the AT command interface is available after the transition of UART1_CTS from high
to low level.
When using a USB connection, the HL7650 will start communicating with the host after USB
enumeration. The time when AT commands can be sent will depend on the initialization time on the
USB host.
Figure 16.
PWR_ON_N Sequence with VGPIO Information
Note:
As PWR_ON_N is internally pulled up with 100kΩ, an open collector or open drain transistor must be
used for ignition.
The PWR_ON_N pad has the minimum assertion time requirement of 25ms, with LOW active. Once the
valid power on trigger is detected, the PWR_ON_N pad status can be left open.
5.2.
Module Switch-Off
Figure 17.
Power OFF Sequence for PWR_ON_N, VGPIO
Note:
PWR_ON_N is internally pulled up by 100kΩ to 1.8V.
AT command AT+CPWROFF enables the user to properly switch the AirPrime HL7650 module off.
41110363
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Product Technical Specification
5.3.
Design Guidelines
Hardware Fast Shut Down
The fast shutdown event can be triggered by either AT+CPWROFF=1 or a GPIO edge.
AT+CPWROFF=1
UART TX
or
GPIO Shutdown
t1 = 2 ms
IO TRIGGERED
t2 = 300 µs
Other GPIOs
VGPIO
t3 = 60 to 80 ms
Fast Detach
request
Figure 18.
t4 = 180 to 1500 ms
Fast Detach done
Shutdown request:
- NVMs and other processes
-GPIOs
All GPIO off
t5 = 10 ms
VGPIO off
Fast Shutdown Power OFF Sequence
Note that the timings for fast detach and mobile shutdown (t3 and t4 in the diagram above) are
dependent on operators and network conditions.
Starting the shutdown procedure during the boot phase should be avoided as this may cause the
shutdown to take more time.
5.4.
Emergency Power OFF
If required, the module can be switched off by controlling the RESET_IN_N pad (pad 11). This must
only be used in emergency situations if the system freezes (not responding to AT commands).
To perform an emergency power off, a low-level pulse must be sent on the RESET_IN_N pad for 20ms
while the PWR_ON_N signal is inactive (high level). This action will immediately shut the HL7650
module down and the registers of the CPU and RAM memory will be reset for the next power on.
5.5.
Sleep Mode Management
AT command AT+KSLEEP enables sleep mode configuration. Note that this is only used with serial link
UART1.
AT+KSLEEP=0:

The module is active when DTR signal is active (low electrical level).

On DTR activation (low electrical level), the module wakes up.

41110363
When DTR is deactivated (high electrical level), the module enters sleep mode after a while.
Rev 4.0
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46
Product Technical Specification
Design Guidelines
AT+KSLEEP=1:


The module determines when it enters sleep mode (when no more tasks are running).
“0x00” character on the serial link wakes the module up.
AT+KSLEEP=2: The module never enters sleep mode.
5.6.
Power Supply Design
The AirPrime HL7650 module should not be supplied with voltage over 4.5V even temporarily or
however briefly.
If the system’s main board power supply unit is unstable or if the system’s main board is supplied with
over 4.5V, even in the case of transient voltage presence on the circuit, the module’s power amplifier
may be severely damaged.
To avoid such issues, add a voltage limiter to the module’s power supply lines so that VBATT and
VBATT_PA signal pads will never receive a voltage surge over 4.5V. The voltage limiter can be as
simple as a Zener diode with decoupling capacitors as shown in the diagram below.
Power Supply
C405
150 µF
C407
100 nF
C404
1.5 mF
D405
D404
0.5 pF
VBATT/VBATT _PA
Figure 19.
Voltage Limiter Example
5.7.
EMC and ESD Guidelines for USIM
Decoupling capacitors must be added according to the drawings below as close as possible to the
USIM connectors on UIMx_CLK, UIMx_RST, UIMx_VCC, UIMx_DATA and UIMx_DET signals to avoid
EMC issues and to comply with the requirements of ETSI and 3GPP standards covering the USIM
electrical interface.
A typical schematic including USIM detection is provided below.
41110363
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Product Technical Specification
Design Guidelines
D100
UIMx_VCC
UIMx_CLK
UIMx_RESET
UIMx_DET
12pF
GND 5
UIMx_RESET
2 RST
VPP 6
3 CLK
I/O 7
4 C4
C8 8
Figure 20.
100nF
DNI
UIMx_CLK
VGPIO
9 SW_A
SW _B 10
CN100
UIMx_DATA
1KΩ
UIMx_DET
DNI
1 VCC
100KΩ
UIMx_VCC
1nF
UIMx_DATA
EMC and ESD Components Close to the USIM
Sierra Wireless recommends using diode ESDALC6V1-5P6 ESD for D100.
5.8.
ESD Guidelines for USB
Figure 21.
ESD Protection for USB
When the USB interface is externally accessible, it is required to have ESD protection on the
USB_VBUS, USB_D+ and USB_D- signals.
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Product Technical Specification
Note:
Design Guidelines
It is not recommended to have an ESD diode with feedback path from USB_VBUS to either USB_D+
or USB_D-.
Sierra Wireless recommends using components:


90Ω DLP0NSN900HL2L EMC filter for FIL400, and
RCLAMP0503N or ESD5V3U2U-03LRH ESD diode for D400.
5.9.
USIM Application
The AirPrime HL7650 supports either a single USIM design or a dual USIM configuration using DSSS
(Dual SIM Single Standby).
5.9.1.
Single USIM Design
Single USIM design is supported using the following:

1 USIM slot

1 GPIO SIM detect

Figure 22.
41110363
1 USIM connector
Single USIM Application (1 USIM Slot and 1 USIM Connector)
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Product Technical Specification
5.9.2.
Design Guidelines
Dual SIM Single Standby Design
Dual SIM Single Standby (DSSS) with fast network switching is supported using the following:

1 USIM slot

2 USIM connectors



Figure 23.
41110363
1 or 2 external switches
2 GPIO SIM Detect
1 GPIO switch command
Dual SIM Single Standby Application (1 USIM Slot and 2 USIM Connectors)
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50
6. Reliability Specification
AirPrime HL7650 module is tested against the Sierra Wireless Industrial Reliability Specification defined
below.
6.1.
Reliability Compliance
AirPrime HL7650 modules connected on a development kit board application are compliant with the
following requirements.
Table 44.
Standards Conformity
Abbreviation
Definition
IEC
International Electro technical Commission
ISO
6.2.
International Organization for Standardization
Reliability Prediction Model
6.2.1.
Life Stress Test
The following tests the AirPrime HL7650 module’s product performance.
Table 45.
Life Stress Test
Designation
Condition
Performance Test
PT3T & PTRT
Standard: N/A
Special conditions:

Temperature:

Class A: -30°C to +70°C

Class B: -40°C to +85°C

Rate of temperature change: ± 3°C/min

Recovery time: 3 hours
Operating conditions: Powered
Duration: 14 days
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Product Technical Specification
6.2.2.
Reliability Specification
Environmental Resistance Stress Tests
The following tests the AirPrime HL7650 module’s resistance to extreme temperature.
Table 46.
Environmental Resistance Stress Tests
Designation
Condition
Cold Test Active
COTA
Standard: IEC 680068-2-1, Test Ad
Special conditions:

Temperature: -40°C

Temperature variation: 1°C/min
Operating conditions: Powered ON with a power cycle of 1 minute ON and
2 minutes OFF
Resistance to Heat Test
RH
Duration: 3 days
Standard: IEC 680068-2-2, Test Bb
Special conditions:

Temperature: +85°C

Temperature variation: 1°C/min
Operating conditions: Powered ON with a power cycle of 15 minutes ON
and 15 minutes OFF
Duration: 50 days
6.2.3.
Corrosive Resistance Stress Tests
The following tests the AirPrime HL7650 module’s resistance to corrosive atmosphere.
Table 47.
Corrosive Resistance Stress Tests
Designation
Condition
Humidity Test
HUT
Standard: IEC 60068-2-3, Test Ca
Special conditions:

Temperature: +65°C

RH: 95%

Temperature variation: 3 ± 0.6°C/min
Operating conditions: Powered on, DUT is powered up for 15 minutes and
OFF for 15 minutes
Duration: 10 days
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Product Technical Specification
Designation
Component Solder Wettability
CSW
Reliability Specification
Condition
Standard: JESD22 – B102, Method 1/Condition C, Solderability Test
Method
Special conditions:

Test method: Dip and Look Test with Steam preconditioning 8
h ±15min. dip for 5 +0/-0.5 seconds
Operating conditions: Un-powered
Moist Heat Cyclic Test
MHCT
Duration: 1 day
Standard: IEC 60068-2-30, Test Db
Special conditions:

Upper temperature: +40 ± 2°C

Lower temperature: +25 ± 5°C

RH:

Upper temperature: 93%

Lower temperature: 95%

Number of cycles: 21 (1 cycle/24 hours)

Temperature Variation: 3 ± 0.6°C/min
Operating conditions: Powered ON for 15 minutes during each 3 hours
ramp up and 3 hours ramp down (in middle) for every cycle
Duration: 21 days
6.2.4.
Thermal Resistance Cycle Stress Tests
The following tests the AirPrime HL7650 module’s resistance to extreme temperature cycling.
Table 48.
Thermal Resistance Cycle Stress Tests
Designation
Thermal Shock Test
TSKT
Condition
Standard: IEC 60068-2-14, Test Na
Special conditions:

Temperature: -30°C to +80°C

Temperature Variation: less than 30s

Number of cycles: 600

Dwell Time: 10 minutes
Operating conditions: Un-powered
Duration: 9 days
Temperature Change
TCH
Standard: IEC 60068-2-14, Test Nb
Special conditions:

Temperature: -40°C to +90°C

Temperature Variation: 3 ±- 0.6°C/min

Number of cycles: 400

Dwell Time: 10 minutes
Operating conditions: Un-powered
Duration: 29 days
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Product Technical Specification
6.2.5.
Reliability Specification
Mechanical Resistance Stress Tests
The following tests the AirPrime HL7650 module’s resistance to vibrations and mechanical shocks.
Table 49.
Mechanical Resistance Stress Tests
Designation
Condition
Standard: IEC 60068-2-6, Test Fc
Sinusoidal Vibration Test
SVT
Special conditions:

Frequency range: 16 Hz to 1000 Hz

Displacement: 0.35mm (peak-peak)

Acceleration:

5G from 16 to 62 Hz

3G from 62 to 200 Hz

1G from 200 to 1000 Hz

Sweep rate: 1 octave / cycle

Number of Sweep: 20 sweeps/axis

Sweep direction: ± X, ± Y, ± Z
Operating conditions: Un-powered
Duration: 2 days
Random Vibration Test
RVT
Standard: IEC 60068-2-64, Test Fh
Special conditions:

Frequency range: 10 Hz – 2000 Hz

Power Spectral Density in [(m/s²)²/Hz]

0.1 g2/Hz at 10Hz

0.01 g2/Hz at 250Hz

0.005 g2/Hz at 1000Hz

0.005 g2/Hz at 2000Hz

Peak factor: 3

Duration per Axis: 1 hr / axis
Operating conditions: Un-powered
Duration: 1 day
Standard: IEC 60068-2-27, Test Ea
Mechanical Shock Test
MST
Special conditions:

Shock Test 1:

Wave form: Half sine

Peak acceleration: 30g

Duration: 11ms

Number of shocks: 8

Direction: ±X, ±Y, ±Z

Shock Test 2:

Wave form: Half sine

Peak acceleration: 100g

Duration: 6ms

Number of shocks: 3

Direction: ±X, ±Y, ±Z
Operating conditions: Un-powered
Duration: 72 hours
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Product Technical Specification
6.2.6.
Reliability Specification
Handling Resistance Stress Tests
The following tests the AirPrime HL7650 module’s resistance to handling malfunctions and damage.
Table 50.
Handling Resistance Stress Tests
Designation
ESDC Test
Condition
Standard: JESD22-A114, JESD22-A115, JESD22-C101
Special conditions:

HBM (Human Body Model): 1KV (Class 1C)

MM (Machine Model): 200V

CDM (Charged Device Model): 250V (Class II)
Operating conditions: Powered
ESD Test
Duration: 3 days
Standard: IEC 61000-4-2
Special conditions:

Contact Voltage: ±2kV, ±4kV, ±6kV

Air Voltage: ±2kV, ±4kV, ±8kV
Operating conditions: Powered
Duration: 3 days
Free Fall Test
FFT 1
Standard: IEC 60068-2-32, Test Ed
Special conditions:

Number of drops: 2 drops per unit

Height: 1m
Operating conditions: Un-powered
Duration: 6 hours
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7. FCC Regulations
The HL7650 module has been granted modular approval for mobile applications. Integrators may use
the HL7650 module in their final products without additional FCC certification if they meet the
following conditions. Otherwise, additional FCC approvals must be obtained.
1. At least 20 cm separation distance between the antenna and the user’s body must be
maintained at all times.
2. To comply with FCC regulations limiting both maximum RF output power and human
exposure to RF radiation, the maximum antenna gain including cable loss in a mobile-only
exposure condition must not exceed:

5 dBi in LTE Band 5
3. The HL7650 module must not transmit simultaneously with other collocated radio transmitters
within a host device.
4. The RF signal must be routed on the application board using tracks with a 50Ω characteristic
impedance. Basically, the characteristic impedance depends on the dielectric, the track width
and the ground plane spacing. In order to respect this constraint, Sierra Wireless
recommends using MicroStrip or StripLine structure and computing the Tracks width with a
simulation tool (like AppCad shown in the figure below and that is available free of charge at
http://www.agilent.com).
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Product Technical Specification
FCC Regulations
If a multi-layered PCB is used, the RF path on the board must not cross any signal (digital,
analog or supply).
If necessary, use StripLine structure and route the digital line(s) "outside" the RF structure. An
example of proper routing is shown in the figure below.
Stripline and Coplanar design requires having a correct ground plane at both sides.
Consequently, it is necessary to add some vias along the RF path. It is recommended to use
Stripline design if the RF path is fairly long (more than 3cm), since MicroStrip design is not
shielded. Consequently, the RF signal (when transmitting) may interfere with neighbouring
electronics (AF amplifier, etc.). In the same way, the neighbouring electronics (microcontrollers, etc.) may degrade the reception performances. The antenna connector is
intended to be directly connected to a 50Ω antenna and no matching is needed.
5. A label must be affixed to the outside of the end product into which the HL7650 module is
incorporated, with a statement similar to the following:
This device contains FCC ID: N7NHL7650
6. A user manual with the end product must clearly indicate the operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure
guidelines.
The end product with an embedded HL7650 module may also need to pass the FCC Part 15
unintentional emission testing requirements and be properly authorized per FCC Part 15.
Note:
41110363
If this module is intended for use in a portable device, you are responsible for separate approval to
satisfy the SAR requirements of FCC Part 2.1093.
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8. Ordering Information
Table 51.
Ordering Information
Model Name
Description
Part Number
HL7650
HL7650 embedded module
Contact Sierra Wireless for the latest SKU
DEV-KIT
41110363
HL Series Development Kit
Rev 4.0
6000620
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9. Terms and Abbreviations
Abbreviation
Definition
ADC
Analog to Digital Converter
AGC
AT
CDMA
Automatic Gain Control
Attention (prefix for modem commands)
Code Division Multiple Access
CF3
Common Flexible Form Factor
CODEC
Coder Decoder
DAC
Digital to Analog Converter
CLK
CPU
DTR
Clock
Central Processing Unit
Data Terminal Ready
EGNOS
European Geostationary Navigation Overlay Service
EMI
Electromagnetic Interference
ESD
Electrostatic Discharges
EMC
EN
ETSI
FDMA
GAGAN
GLONASS
GND
Electromagnetic Compatibility
Enable
European Telecommunications Standards Institute
Frequency-division multiple access
GPS aided geo augmented navigation
Global Navigation Satellite System
Ground
GNSS
Global Navigation Satellite System
GPRS
General Packet Radio Service
GPIO
General Purpose Input Output
GSM
Global System for Mobile communications
IC
Integrated Circuit
I/O
Input / Output
LNA
Low Noise Amplifier
Hi Z
IMEI
LED
MAX
High impedance (Z)
International Mobile Equipment Identification
Light Emitting Diode
Maximum
MIN
Minimum
N/A
Not Applicable
PC
Personal Computer
MSAS
PA
Multi-functional Satellite Augmentation System
Power Amplifier
PCB
Printed Circuit Board
PLL
Phase Lock Loop
QZSS
Quasi-Zenith Satellite System
PCL
PWM
41110363
Power Control Level
Pulse Width Modulation
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Product Technical Specification
Abbreviation
Terms and Abbreviations
Definition
RF
Radio Frequency
RMS
Root Mean Square
RTC
Real Time Clock
SCL
Serial Clock
RFI
RST
RX
SDA
SIM
Radio Frequency Interference
Reset
Receive
Serial Data
Subscriber Identification Module
SMD
Surface Mounted Device/Design
SW
Software
SPI
PSRAM
TBC
TBD
TP
TX
TYP
UART
UICC
Serial Peripheral Interface
Pseudo Static RAM
To Be Confirmed
To Be Defined
Test Point
Transmit
Typical
Universal Asynchronous Receiver-Transmitter
Universal Integrated Circuit Card
USB
Universal Serial Bus
VBATT
Main Supply Voltage from Battery or DC adapter
UIM
VSWR
WAAS
41110363
User Identity Module
Voltage Standing Wave Ratio
Wide Area Augmentation System
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