Sierra Wireless MC5728 PCA,EVDO MINI-PCI EXPRESS CARD CDMA MODEM User Manual HW Integration Guide

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Document ID	1074535
Application ID	XQONRUf/JyGEaWLiZheUWw==
Document Description	Manual
Short Term Confidential	No
Permanent Confidential	No
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Document Type	User Manual
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Filesize	221.82kB (2772747 bits)
Date Submitted	2009-03-01 00:00:00
Date Available	2009-03-23 00:00:00
Creation Date	2009-02-09 15:54:47
Producing Software	Acrobat Distiller 7.0.5 (Windows)
Document Lastmod	2009-02-10 10:21:39
Document Title	HW Integration Guide.book
Document Creator	FrameMaker 8.0

CDMA and GSM / UMTS Mini Card
Hardware Integration Guide
Proprietary and Confidential
Includes:
MC5725 / MC5725V
MC5727 / MC5727V
MC5728 / MC5728V
MC8775 / MC8775V
MC8780 / MC8781
MC8785V
MC8790 / MC8790V
MC8791V
2130114
Rev 1.9.1
Preface
Important Notice
Due to the nature of wireless communications, transmission
and reception of data can never be guaranteed. Data may be
delayed, corrupted (i.e., have errors) or be totally lost.
Although significant delays or losses of data are rare when
wireless devices such as the Sierra Wireless modem are used in
a normal manner with a well‐constructed network, the Sierra
Wireless modem should not be used in situations where failure
to transmit or receive data could result in damage of any kind
to the user or any other party, including but not limited to
personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting
from delays or errors in data transmitted or received using the
Sierra Wireless modem, or for failure of the Sierra Wireless
modem to transmit or receive such data.
Safety and Hazards
Do not operate the Sierra Wireless modem in areas where
blasting is in progress, where explosive atmospheres may be
present, near medical equipment, near life support equipment,
or any equipment which may be susceptible to any form of
radio interference. In such areas, the Sierra Wireless modem
MUST BE POWERED OFF. The Sierra Wireless modem can
transmit signals that could interfere with this equipment.
Do not operate the Sierra Wireless modem in any aircraft,
whether the aircraft is on the ground or in flight. In aircraft, the
Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that
could interfere with various onboard systems.
Note: Some airlines may permit the use of cellular phones while the
aircraft is on the ground and the door is open. Sierra Wireless
modems may be used at this time.
The driver or operator of any vehicle should not operate the
Sierra Wireless modem while in control of a vehicle. Doing so
will detract from the driver or operatorʹs control and operation
of that vehicle. In some states and provinces, operating such
communications devices while in control of a vehicle is an
offence.
Limitation of
Liability
Rev 1.9.1 Feb.09
The information in this manual is subject to change without
notice and does not represent a commitment on the part of
Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL
DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL,
CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES
INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR
Proprietary and Confidential
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
CDMA and GSM / UMTS Mini Card Hardware Integration Guide
REVENUE OR ANTICIPATED PROFITS OR REVENUE
ARISING OUT OF THE USE OR INABILITY TO USE ANY
SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS
AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE
FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra
Wireless and/or its affiliates aggregate liability arising under or
in connection with the Sierra Wireless product, regardless of
the number of events, occurrences, or claims giving rise to
liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.
Patents
Portions of this product may be covered by some or all of the
following US patents:
5,515,013
5,629,960
5,845,216
5,847,553
5,878,234
5,890,057
5,929,815
6,169,884
6,191,741
6,199,168
6,339,405
6,359,591
6,400,336
6,516,204
6,561,851
6,643,501
6,653,979
6,697,030
6,785,830
6,845,249
6,847,830
6,876,697
6,879,585
6,886,049
6,968,171
6,985,757
7,023,878
7,053,843
7,106,569
7,145,267
7,200,512
7,295,171
7, 287,162 D442,170
D459,303
D599,256
D560,911
and other patents pending.
This product includes technology licensed from
QUALCOMM® 3G.
Manufactured or sold by Sierra Wireless or its licensees under
one or more patents licensed from InterDigital Group.
Copyright
©2009 Sierra Wireless. All rights reserved.
Trademarks
AirCard® and “Heart of the Wireless Machine®” are registered
trademarks of Sierra Wireless. Watcher® is a trademark of
Sierra Wireless, registered in the European Community.
Sierra Wireless, the Sierra Wireless logo, the red wave design,
and the red‐tipped antenna are trademarks of Sierra Wireless.
Windows® is a registered trademark of Microsoft Corporation.
QUALCOMM® is a registered trademark of QUALCOMM
Incorporated. Used under license.
Linux® is a registered trademark of Linus Torvalds.
Other trademarks are the property of the respective owners.
Proprietary and Confidential
2130114
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
Preface
Contact
Information
Sales Desk:
Phone: 1-604-232-1488
Hours: 8:00 AM to 5:00 PM Pacific Time
E-mail: sales@sierrawireless.com
Post: Sierra Wireless
13811 Wireless Way
Richmond, BC
Canada
V6V 3A4
Fax: 1-604-231-1109
Web: www.sierrawireless.com
Consult our website for up‐to‐date product descriptions,
documentation, application notes, firmware upgrades, trouble‐
shooting tips, and press releases:
www.sierrawireless.com
Revision History
Revision
number
1.5
Rev 1.9.1 Feb.09
Release
date
Jul 2007
Changes
•
Added 8780/81 content
•
Added SED description
•
Fixed details about capacitance
•
Added connector pin details
1.6
Unreleased
Changes incorporated into v1.7.
1.7
Apr 2008
•
Removed references to RUIM
(MC57xx products)
•
Removed “Diversity antenna
must fold down” (“Diversity
antenna design requirements
(MC57xx / MC8780 / MC8781 /
MC8785V / MC8790 / MC8790V
/ MC8791V / MC8792V)” on
page 105).
•
Removed references to
MC5720, MC8755, MC8755V,
and MC8765.
•
Corrected LED characteristics
(“Faster blink” on page 64)
•
Added content for MC5725,
MC5725V, and MC8785V
Proprietary and Confidential
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Revision
number
Changes
1.8
Sep 2008
•
Added content for MC8790,
MC8790V, MC8791V, and
MC8792V
1.9
Oct 2008
•
Added AT command entry timing
note and Linux content to testing
chapter
•
Corrected range for external pull
up resistor in Figure 5-2
•
Added content for MC5728 and
MC5728V (FCC)
1.91
Release
date
Feb 2009
Proprietary and Confidential
2130114
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
Table of Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
The Universal Development Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Required connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Guide organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Related documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Power Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Overview of operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Power signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Module power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disconnected state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Normal state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Low power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage monitoring state machine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Temperature monitoring state machine . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
19
19
19
19
20
22
Inrush currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Timing requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Power ramp-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Power-up timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Transmit power wave form (GSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current consumption overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SED (Smart Error Detection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Usage models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Rev 1.9.1 Feb.09
Proprietary and Confidential
27
27
34
34
35
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
RF Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
RF connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Ground connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Antenna and cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Interference and sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power supply noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interference from other wireless devices . . . . . . . . . . . . . . . . . . . . . . . . . .
Device-generated RF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Methods to mitigate decreased Rx performance . . . . . . . . . . . . . . . . . . .
41
41
41
42
42
Radiated sensitivity measurement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sierra Wireless’ sensitivity testing and desensitization investigation . .
OTA test chamber configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Path loss calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Positioning the DUT (Device Under Test) . . . . . . . . . . . . . . . . . . . . . . . . .
Sensitivity vs. frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
43
43
43
44
45
45
Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
System block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Modes of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sidetone support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Echo cancellation support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio signal interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio function partitioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
52
55
55
56
57
58
Host / Module Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Host interface pin details. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
USB interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
USB handshaking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
LED output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
USIM interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Proprietary and Confidential
2130114
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
Table of Contents
USIM operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Extended AT commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73
Thermal considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Design Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .75
Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
AT command entry timing requirement . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Acceptance testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Test requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
Test procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Certification testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
Production testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
Suggested manual functional test procedure . . . . . . . . . . . . . . . . . . . . . . . . .
Suggested test plan procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Testing RF transmission path—MC57xx . . . . . . . . . . . . . . . . . . . . . . . . . .
Testing RF transmission path—MC87xx . . . . . . . . . . . . . . . . . . . . . . . . . .
Testing RF Receive path—MC57xx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Testing RF Receive path—MC87xx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Testing GPS Receiver—MC8775V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Test Audio Loop-back—MC5725V / MC5727V / MC5728V / MC8775V /
MC8785V / MC8790V / MC8791V / MC8792V . . . . . . . . . . . . . . . . . . . . . . .
80
80
85
86
88
90
93
94
Quality assurance testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Suggested testing equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Antenna Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .101
Required antennas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Frequency bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Rev 1.9.1 Feb.09
Proprietary and Confidential
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Antenna design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General antenna design requirements . . . . . . . . . . . . . . . . . . . . . . . . . . .
Main antenna design requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diversity antenna design requirements (MC57xx / MC8780 / MC8781 /
MC8785V / MC8790 / MC8790V / MC8791V / MC8792V) . . . . . . . . . . . . .
GPS antenna design requirements (MC57xx / MC8775V / MC878x) . .
104
104
104
Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage Standing Wave Ratio (VSWR) . . . . . . . . . . . . . . . . . . . . . . . . . . .
Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Antenna-to-antenna isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Peak gain and radiation patterns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
106
106
108
108
109
105
105
Fading correlation coefficient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Safety and hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Important compliance information for North American users . . . . . . . . . . 112
EU regulatory conformity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Acronyms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
10
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2130114
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
1
1: Introduction
Sierra Wireless’ Mini Card modules form the radio component
for the products in which they are embedded. Mini Cards are
available for use on CDMA and GSM networks, including:
Note: Throughout this
document, MC57xx and MC87xx
refer to the entire suites of
CDMA and GSM Mini Cards
respectively.
• MC5725 / MC5725V / MC5727 / MC5727V / MC5728 / MC5728V—
Operate on CDMA networks using the CDMA IS‐95A, 1X,
and 1xEV‐DO (IS‐856) network standards, and support
GPS.
• MC8775 / MC8775V—operate on GSM networks using the
GSM / GPRS / EDGE / UMTS / HSDPA network standards,
and support Standalone GPS functionality.
• MC8780 / MC8781 / MC8785V / MC8790 / MC8790V / MC8791V /
MC8792V—operate on GSM networks using the GSM /
GPRS / EDGE / UMTS / HSDPA / HSUPA network
standards, and support Standalone GPS, gpsOneXTRA™,
A‐GPS, selected enhanced Navigation 2.0 features, and five
NMEA sentences.
Purpose of this guide
This guide addresses issues that affect the integration of Sierra
Wireless modules into host products, and includes design
recommendations for the host products.
Note: An understanding of network technology and experience in
integrating hardware components into electronic equipment is
assumed.
The Universal Development Kit
Sierra Wireless manufactures a Universal Development Kit
(UDK) that facilitates all phases of the integration process.
This kit is a hardware development platform that is designed
to support multiple members of the wireless embedded
module product family. It contains the hardware components
that are typically necessary for evaluating and developing with
the module, including:
• Development board
• Cables
• Antennas
• Other accessories
For instructions on setting up the UDK, see PCI Express Mini
Card Dev Kit Quick Start Guide (Document 2130705).
Rev 1.9.1 Feb.09
Proprietary and Confidential
11
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Required connectors
Note: Contact vendors before
choosing your connectors — the
numbers included here are for
reference only. Choose
connectors that are appropriate
to your design.
When integrating these modules into your host device, you
need the following connector types:
• RF cables that mate with Hirose U.FL connectors (model
U.FL #CL331‐0471‐0‐10). Modules include one or two
connector jacks depending on individual module support
for diversity or GPS functionality.
• Industry‐standard mating connector for 52‐pin EDGE—
some manufacturers include Tyco, Foxconn, and Molex. For
example, the connector used on the Mini Card Dev Kit
board is a Molex 67910‐0001.
• Industry‐standard USIM connector (MC87xx only)—the
actual connector you use depends on how your device
exposes the USIM socket. For example, the USIM connector
used on the Mini Card Dev Kit board is an ITT CCM03‐
3518.
Guide organization
This guide includes the following sections:
1.
2.
3.
4.
5.
6.
7.
8.
9.
12
Introduction (this section)
Power Interface (p.17)
Describes power control signals used by the module and
discusses design issues related to power supply
integration.
RF Integration (p.37)
Describes antenna connection methods and grounding issues,
RF interference and desense issues.
Audio Interface (p.51)
Describes supported audio modes and related details.
Host / Module Interfaces (p.61)
Describes the USB interface for host / module communication,
and the USIM interface for host / module integration.
Thermal Considerations (p.73)
Describes thermal characteristics of the module and provides
suggestions for testing and addressing thermal issues.
Design Checklist (p.75)
Summarizes design considerations for integration of
Mini Cards in your host devices.
Testing (p.77)
Describes suggested acceptance, certification, production, and
quality assurance tests.
Antenna Specification (p.101)
Describes antenna requirements and testing details.
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Introduction
10. Regulatory Information (p.111)
Describes regulatory approvals and regulatory information
requirements.
11. Acronyms and Definitions (p.115)
Lists acronyms and definitions used throughout this guide.
12. Index (p.119)
Note: The term "host" always refers to the host device.
Related documents
This guide deals specifically with hardware integration issues
that are unique to the MC57xx and MC87xx modules.
Table 1‐1 lists other documents referenced in this guide.
Table 1-1: Related documentation
Document title
Description
AT Command Set for User
Equipment (UE) (Release 6)
Standard AT commands for GSM / UMTS devices.
CDMA 1X Standard
Technical requirements for CDMA systems, including
details on sleep cycle index (SCI) values.
Download this document (3GPP TS 27.007) from
www.3gpp.org.
Order this document, CDMA 2000 Series Release A
(2000) (document # TIA/EIA/IS-2000 Series, Release A)
from www.tiaonline.org.
CDMA CnS Reference
(Document 2130754)
CnS (Control and Status) messages that are supported by
the MC5725 / MC5725V
CDMA AT Command Reference
(Document 2130620)
Proprietary, basic AT commands for the MC5725 /
MC5725V / MC5727 / MC5727V / MC5728 / MC5728V.
For MC87xx-specific commands, see UMTS Modems
Supported AT Command Reference (Document 2130617).
CDMA Extended AT Command
Reference (Document
2130621)
Proprietary AT commands for the MC5725 / MC5725V /
MC5727 / MC5727V / MC5728 / MC5728V. For MC87xxspecific commands, see MC87xx Modem Extended AT
Command Reference (Document 2130616).
FCC Regulations - Part 15 Radio Frequency Devices
This section of the FCC Code of Federal Regulations, Title
47 deals with radio frequency devices, including shielding
requirements for embedded modules.
Download this regulation from http://wireless.fcc.gov.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 1-1: Related documentation (Continued)
Document title
Description
IEC-61000-4-2 level 3
Techniques for testing and measuring electrostatic
discharge (ESD) immunity.
Order this document from www.iec.ch.
14
MC5725 Mini Card Product
Specification (Document
2130663)
Features, mechanical and electrical specifications, and
standards compliance of the MC5725.
MC5725V Mini Card Product
Specification (Document
2130671)
Features, mechanical and electrical specifications, and
standards compliance of the MC5725V.
MC5727 Mini Card Product
Specification (Document
2130958)
Features, mechanical and electrical specifications, and
standards compliance of the MC5727.
MC5727V Mini Card Product
Specification (Document
2131023)
Features, mechanical and electrical specifications, and
standards compliance of the MC5727V.
MC5728V Mini Card Product
Specification (Document
2111350)
Features, mechanical and electrical specifications, and
standards compliance of the MC5728V.
MC8775 PCI Express Mini Card
Product Specification
(Document 2130697)
Features, mechanical and electrical specifications, and
standards compliance of the MC8775.
MC8775V with Audio PCI
Express Mini Card Product
Specification (Document
2130700)
Features, mechanical and electrical specifications, and
standards compliance of the MC8775V.
MC8780 / MC8781 PCI Express
Mini Card Product
Specification (Document
2130782)
Features, mechanical and electrical specifications, and
standards compliance of the MC8780 / MC8781.
MC8785V PCI Express Mini
Card Product Specification
(Document 2130932)
Features, mechanical and electrical specifications, and
standards compliance of the MC8785V.
MC8790 PCI Express Mini Card
Product Specification
(Document 2111279)
Features, mechanical and electrical specifications, and
standards compliance of the MC8790.
MC8790V PCI Express Mini
Card Product Specification
(Document 2111280)
Features, mechanical and electrical specifications, and
standards compliance of the MC8790V.
MC8791V PCI Express Mini
Card Product Specification
(Document 2131032)
Features, mechanical and electrical specifications, and
standards compliance of the MC8791V.
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Introduction
Table 1-1: Related documentation (Continued)
Document title
Description
MC8792V PCI Express Mini
Card Product Specification
(Document 2131033)
Features, mechanical and electrical specifications, and
standards compliance of the MC8792V.
MC87XX Modem CnS
Reference (Document
2130602)
CnS (Control and Status) messages supported by the
MC87xx series of modems.
MC87xx Modem CnS Reference
(Voice) (Document 2130817)
Voice-related CnS (Control and Status) messages
supported by the MC8775V, MC8785V,
MC8790V,MC8791V, and MC8792V.
UMTS Modems Supported AT
Command Reference
(Document 2130617)
Proprietary, basic AT commands for the MC87xx. For
MC57xx-specific commands, see the CDMA AT
Command Reference (Document 2130620).
MC87xx Modem Extended AT
Command Reference
(Document 2130616)
Proprietary AT commands for the MC87xx. For MC57xxspecific commands, see the CDMA Extended AT
Command Reference (Document 2130621).
Mobile Station (MS)
Conformance Specification;
Part 4: Subscriber Interface
Module
SIM testing methods.
PCI Express Mini Card Dev Kit
Quick Start Guide (Document
2130705)
Setup and configuration of modules.
PCI Express Mini Card
Electromechanical
Specification Revision 1.1
Download this document from www.pcisig.com.
Universal Serial Bus
Specification, Rev 2.0
Download this specification from www.usb.org.
Rev 1.9.1 Feb.09
Download this document (3GPP TS 11.10-4) from
www.3gpp.org.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
16
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2
2: Power Interface
Overview of operation
Note: This chapter contains information for CDMA (MC57xx) and
GSM (MC87xx) modules.
Information that is unique to specific module types is clearly
identified.
The module is designed to use a 3.3V (nominal) power supply,
provided by the host. It is the host’s responsibility to provide
safe and continuous power to the module at all times; the
module does NOT have an independent power supply, or
protection circuits to guard against electrical issues.
The host controls the module’s power state using the
W_Disable# signal as shown in Figure 2‐1. The signal is driven
low by the host to power off the modem, or left floating (high
impedance) to power on the modem. The module also
monitors its supply voltage and requests shutdown if the
supply is insufficient (see Voltage monitoring state machine,
page 20).
Figure 2-1: Recommended W_Disable# connection (open
drain circuit)
W_Disable#
Control
Power signals
The module must be connected to a 3.3V power supply (as
described in PCI Express Mini Card Electromechanical Specifi‐
cation Revision 1.1).
The MC87xx has more power pins than the MC57xx due to
higher peak current requirements for GSM devices.
For detailed pinout and voltage / current requirements of these
modules, see the Product Specification Document for your
Mini Card.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Note: The Product Specification Document’s pin connection table
describes the internal structure of the module. For example, a Mini
Card standard-compliant host platform provides +3.3Vaux on pin 24,
but this pin is not connected internally on the MC8775V. Thus, the pin
is flagged as ‘No connect’.
Electrostatic discharge (ESD)
You are responsible for ensuring that the host has adequate
ESD protection on digital circuits and antenna ports:
• (Operational) RF port (antenna launch and RF connector):
IEC‐61000‐4‐2 — Level (Electrostatic Discharge Immunity Test)
• (Non‐operational) Host connector interface:
JESD22‐A114‐B +/‐ 1kV Human Body Model and
JESD22‐C101 +/‐ 125 V Charged Device Model
• MC5728/MC5728V only: (Non‐operational) Host connector
interface:
JESD22‐A114‐B +/‐ 200V Human Body Model and
JESD22‐C101 +/‐ 250 V Charged Device Model
MC5728/MC5728V has placeholders for additional ESD
devices, for cases where the device must, per customer
requirements, meet the higher Human Body Model (+/‐1kV)
ESD rating.
Specific recommendations are provided where needed in this
guide, however, the level of protection required depends on
your application.
Note: ESD protection is highly recommended for the USIM connector
at the point where the contacts are exposed, and for any other signals
from the host interface that would be subjected to ESD by the user of
the product.
Module power states
Note: The module unit defaults
to the Normal state when
VCC3.3 is first applied in the
absence of W_Disable# control.
18
The module has four power states:
• Disconnected
No power to the module.
• Off
Power to the module, but the module is powered off.
• Normal
The module is active. Several modes are possible (Receive,
Transmit, Sleep, Shutdown).
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Power Interface
• Low power (“airplane mode”)
The module is active, but RF is disabled.
State machines are implemented in the module to monitor the
power supply and operating temperature.
Disconnected state
Note: The difference between
the Disconnected and Off states
is that, in the Off state, the
module is still connected to the
power source and draws minimal
current.
This state occurs when there is no power to the module — the
host power source is disconnected from the module and all
voltages associated with the module are at 0 V.
Whether the host device is also powered off depends on the
power rail design. If the connection between the power rail
and the module is controlled by the host, the host can stay
powered on and cut the power to put the modem into the
disconnected state. If the power rail is shared between the host
device and the module, the host is powered off when the
module is powered off.
Off state
Note: The module enters the Off
state if W_Disable# is driven low
and power (Vcc) is applied to the
module, or if the module is in a
powered state and W_Disable#
is driven low for a moduledependent minimum period. See
State change: Power off / on on
page 23 for details.
In this state, the host is powered up and the module is
powered down (but still connected to the power source).
The host keeps the module powered off by driving the
W_Disable# signal low. In this state, the module draws minimal
current.
Normal state
Note: This is the default state
when VCC3.3 is first applied in
the absence of W_Disable#
control.
This is the active state of the module. In this state:
• The module is fully powered.
• The module is capable of placing / receiving calls or estab‐
lishing data connections on the wireless network.
• The USB interface is fully active.
Low power mode
In this state, RF (both Rx and Tx) is disabled in the module, but
the USB interface is still active. This low power mode
(ʺairplane modeʺ) is controlled by software commands
through the host interface.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
For instructions on using the commands, refer to AT Command
Set for User Equipment (UE) (Release 6) (+CFUN=0 command),
CDMA CnS Reference (Document 2130754)
(CNS_RADIO_POWER [0x1075] command), or MC87XX
Modem CnS Reference (Document 2130602) (Disable Modem
command).
Voltage monitoring state machine
The module has a state machine to monitor the VCC3.3
(3.0 V‐3.6 V) supply (Figure 2‐2).
Figure 2-2: Voltage monitoring state machine
current_vcc > VOLT_LO_NORM
Host asserts
W_Disable#
Low Supply Voltage
Critical
(Low power mode)
current_vcc
< VOLT_LO_CRIT
current_vcc < VOLT_LO_WARN
Power off.
Handled by
Power State
state machine.
Low Supply Voltage
Warning
Normal
current_vcc > VOLT_LO_NORM
current_vcc > VOLT_HI_CRIT
current_vcc < VOLT_HI_NORM
High Supply Voltage
Critical
(Low power mode)
Host asserts
W_Disable#
Table 2-1: Voltage trigger levels
Condition
Voltage (V)
MC57xx
20
MC8775/75V
MC8780/81
MC8785V
MC8790/90V
MC8791V/92V
VOLT_HI_CRIT
3.6
3.6
3.6
VOLT_HI_NORM
3.5
3.5
3.5
VOLT_LO_NORM
3.1
3.1
3.1
VOLT_LO_WARN
3.0
3.0
3.05
VOLT_LO_CRIT
2.9
2.9
3.00
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Power Interface
State change: Normal mode to Low Power mode
This state change causes the module to switch to low power
mode, suspending RF activity. It occurs when the module’s
supply voltage exceeds the limits described in Table 2‐1
(VOLT_HI_CRIT and VOLT_LO_CRIT).
When this state change occurs, the CnS notification
CNS_RADIO_POWER is issued, if enabled. For a detailed
description of this notification, see CDMA CnS Reference
(Document 2130754) or MC87XX Modem CnS Reference
(Document 2130602).
State change: Low Power mode to Normal mode
This state change causes the module to switch to normal mode,
resuming RF activity. It occurs when the module’s supply
voltage returns from critical to normal limits as described in
Table 2‐1 (VOLT_HI_NORM and VOLT_LO_NORM).
When this state change occurs, the CnS notification
CNS_RADIO_POWER is issued, if enabled. For a detailed
description of this notification, see CDMA CnS Reference
(Document 2130754) or MC87XX Modem CnS Reference
(Document 2130602).
Note: The module is still
connected to the power source
in this state, drawing minimal
power.
State change: Power off / on
The module begins a shutdown sequence and powers off if it
has been in a powered‐on state for more than 10.5 seconds and
the host device drives the W_Disable# signal low for:
• ≥ 50 ms (MC8775 / MC8775V)
• ≥ 500 ms (MC5725 / MC5725V / MC5727 / MC5727V /
MC5728 / MC5728V / MC8780 / MC8781 / MC8785V /
MC8790 / MC8790V / MC8791V / MC8792V)
Note: The module ignores changes in the W_Disable# line for the first
10.5 seconds after it enters a powered-on state.
The module powers on when the host device leaves the
W_Disable# signal floating (high impedance) as shown in
Figure 2‐1 on page 17.
Figure 2‐2 on page 20 shows the transition from ‘Low Supply
Voltage Critical’ or ‘High Supply Voltage Critical’ to ‘Power
off’:
Rev 1.9.1 Feb.09
1.
The module enters low power mode because it detects that
the supply voltage level is critically low (VOLT_LO_CRIT)
or critically high (VOLT_HI_CRIT).
2.
The module sends a CnS notification (Return Radio
Voltage—0x0009) to the host indicating that it is now in
low power mode.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
3.
The host has the option, at this point, of driving W_Disable#
low (forcing the module to power off) to prevent damage
to the unit.
Temperature monitoring state machine
The module has a state machine to monitor the module’s
temperature (Figure 2‐3).
Figure 2-3: Temperature monitoring state machine
current_temp <= TEMP_HI_NORM
Host asserts
W_Disable#
High Temperature
Critical
(Low power mode)
current_temp
> TEMP_HI_CRIT
current_temp > TEMP_HI_WARN
Normal
mode
Power off.
Handled by
Power State
state machine.
High Temperature
Warning
current_temp < TEMP_HI_NORM
current_temp < TEMP_LO_CRIT
current_temp > TEMP_NORM_LO
Low Temperature
Critical
(Low power mode)
Host asserts
W_Disable#
Table 2-2: Temperature trigger levels 1
Condition
22
MC57xx
Temp (°C)
MC87xx
Temp (°C)
TEMP_LO_CRIT
-30
-25
TEMP_NORM_LO
-20
-15
TEMP_HI_NORM
85
85
TEMP_HI_WARN
95
95
TEMP_HI_CRIT
108
108
Module-reported temperatures at the printed circuit board.
Temperature decreases from 10° C–18° C between the PCB
and the module shield, and a further 10° C–18° C between the
shield and host environment (ambient), depending on the efficiency of heat-dissipation in the host device.
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Power Interface
State change: Normal mode to Low Power mode
This state change causes the module to switch to low power
mode, suspending RF activity. It occurs when the module
temperature exceeds the limits described in Table 2‐2
(TEMP_HI_CRIT and TEMP_LO_CRIT).
When this state change occurs, the CnS notification
CNS_RADIO_POWER is issued, if enabled. For a detailed
description of this notification, see CDMA CnS Reference
(Document 2130754) or MC87XX Modem CnS Reference
(Document 2130602). As well, the MC57xx issues the CnS notifi‐
cation Modem Too Hot [0x4500] if it has to drop a call when
shifting to low power mode.
State change: Low Power mode to Normal mode
This state change causes the module to switch to normal mode,
resuming RF activity. It occurs when the module temperature
returns from critical to normal limits as described in Table 2‐2
(TEMP_HI_NORM and TEMP_LO_NORM).
When this state change occurs, the CnS notification
CNS_RADIO_POWER is issued, if enabled. For a detailed
description of this notification, see CDMA CnS Reference
(Document 2130754) or MC87XX Modem CnS Reference
(Document 2130602).
State change: Power off / on
The module begins a shutdown sequence and powers off if it
has been in a powered‐on state for more than 10.5 seconds and
the host device drives the W_Disable# signal low for:
• ≥ 50 ms (MC8775 / MC8775V)
• ≥ 500 ms (MC5725 / MC5725V / MC5727 / MC5727V /
MC5728 / MC5728V / MC8780 / MC8781 / MC8785V /
MC8790 / MC8790V / MC8791V / MC8792V)
Note: The module ignores changes in the W_Disable# line for the first
10.5 seconds after it enters a powered-on state.
The module powers on when the host device leaves the
W_Disable# signal floating (high impedance) as shown in
Figure 2‐1 on page 17.
Figure 2‐3 shows the transition from ‘Low Temperature
Critical’ or ‘High Temperature Critical’ to ‘Power off’.
1.
Rev 1.9.1 Feb.09
The module enters low power mode because it detects that
the operating temperature is critically low
(TEMP_LO_CRIT) or critically high (TEMP_HI_CRIT).
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
2.
The module sends a CnS notification (Return Radio
Temperature—0x0008) to the host indicating that it is now
in low power mode.
3.
The host has the option, at this point, of driving W_Disable#
low (forcing the module to power off) to prevent damage
to the unit.
Note: (MC57xx only) If the ambient temperature of the module
exceeds 60 °C, the RF level is automatically lowered for max power
transmission.
Inrush currents
Two power events can cause large inrush currents from the
host supply to the module on the power pins:
• Application of the host’s power supply
• Host leaves W_Disable# floating (high impedance) to power
up the module (as shown in Figure 2‐1 on page 17).
Figure 2‐4 and Figure 2‐5 show the inrush models for the
MC57xx and MC87xx. Application of the host’s power supply
typically occurs when the switch is open; W_Disable# is left
floating (high impedance) when the switch is closed.
Figure 2-4: Inrush model - MC57xx
Current Probe
MC57xx
Current
PWR (1,2,3,4,5)
32m
38m
+3.3VDC
LDO pass
element
1 ohm typ
10m
15m
250m
ESR
20m
ESR +
trace Z
60m
ESR +
trace Z
40m
RF Cap
4.7uF
Cin
2x 1uF
ESR
20m
ESR
80m
REG
Power source
8.5m
Recommended host power rail
capacitance = 470 µF - 1000 µF
2.8m
Cin
2x 1uF
ON/OFF
(18)
1.7m
Regulator input capacitor
EM board decoupling cap
1uF
2.2m
Regulator
output
capacitor
EM board decoupling cap
24
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Power Interface
Figure 2-5: Inrush model - MC87xx
MC87xx
2 ohm
4.5m
ESR
50m
50m
30m
ON/OFF
47uF
10uF
0.1m
Inrush current via application of host power supply
This event occurs when the host’s supply is enabled, charging
the input capacitors on the Mini Card power rail. The switch
shown in Figure 2‐4 and Figure 2‐5 is open (typically) when
this event occurs.
Note: In some circumstances,
depending on temperature and
the components in use, two or
more regulators may switch on
at the same time. The host
power system must be designed
to handle this possibility.
To limit the inrush current and stabilize the supply of power to
the module, sufficient capacitance must be added to the host
power rail. The recommended capacitance range is
470 μF ‐ 1000 μF.
Peak current (IPEAK) is calculated using:
IPEAK =
RSERIES =
VCC / RSERIES
(impedance from power source (+ive) through to
the Regulator output capacitor)
+ (impedance from power source (-ive) through to
GND pins of the EM regulator)
Inrush current via floating W_Disable#
The second event type occurs when the host leaves the
W_Disable# signal floating (high impedance) to power up the
module. The switch shown in Figure 2‐4 and Figure 2‐5 is
closed when this event occurs. This enables the power
management system of the module, charging several internal
regulator output capacitors.
When W_Disable# is left floating (high impedance), the peak
current is less than 500 mA (with a 30 μs rise time).
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Timing requirements
Power ramp-up
During the first 0.5 seconds, as the internal voltage regulators
are activated in sequence, several current transients of up to
500 mA with a 30 μs rise time may occur.
The supply voltage must remain within specified tolerances
while this is occurring.
Power-up timing
The unit is ready to enumerate with a USB host within a
maximum of 5.1 seconds (depending on module type) after
power‐up. (Most modules enumerate within 4 seconds.)
Note: The actual startup time may vary between the different module
types (for example, MC5725 versus MC8775).
Figure 2-6: Power-up timing diagram
3.3V
W _Disable#
Enum eration
USB D+
Startup tim e
Note: Startup time is the time after power-up when the modem is
ready to begin the enumeration sequence.
Transmit power wave form
(GSM)
As shown in Figure 2‐7, at maximum GSM transmit power, the
input current can remain at 2.4 A for up to 25% of each 4.6 ms
GSM cycle (1.15 ms). For Class 12 operation, the peak could
remain for 2.3 ms (four timeslots). The 2.4 A current draw is
for 50 ohm systems (1:1 VSWR). For worst‐case antenna
designs, such as 3.5:1 VSWR (as stated in Table 2‐5), this
current draw could increase from 2.4 A to 2.75 A, as shown in
26
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Power Interface
the diagram. Beyond the 3.5:1 VSWR as recommended to be
worst‐case in Table A‐5, the current draw could increase
beyond 2.75 A to 3.5 A.
At maximum GSM transmit power, the input current can
remain at 2.4 A for up to 25% of each 4.6 ms GSM cycle
(1.15 ms) after initially reaching a peak of 2.75 A average over
100 μs and with an instantaneous peak current of 3.5 A.
Figure 2-7: GSM transmit power wave form
2.75A peak
2.75
2.4
3.5:1 VSWR = 2.75A
1:1 VSWR = 2.40A
Current
(A)
0.15
25 µs
1.15 ms
4.6 ms
Current consumption
Current consumption depends on the module’s operating
mode at any given time.
This section describes:
• Current consumption for both module types (MC57xx and
MC87xx)
• Operating modes
Current consumption overview
Note: Values in this guide are
taken from the appropriate
product specification documents
(PSDs) (listed in Related
documents, page 13) — in the
case of a discrepancy between
this document and the relevant
PSD, use the value listed in the
PSD.
Electrical requirements and current specifications are listed in
Table 2‐3 (MC57xx), Table 2‐4 (MC8775/MC8775V), Table 2‐5
(MC8780/MC8781), Table 2‐6 (MC8785V), and Table 2‐7
(MC8790 / MC8790V / MC8791V / MC8792V). These specifica‐
tions identify minimum, typical, and maximum current drain
for each operating mode (while in the Normal state):
• Transmit
• Receive
• Sleep
• Deep sleep
• Shutdown
The current consumption values in these tables were measured
using a supply voltage of 3.3 V. The device’s supply voltage is
3.0–3.6 V with a typical voltage of 3.3 V.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Note: For sleep modes, the values shown are for the actual sleep
state. The module wakes at intervals to control timing and check for
traffic — at these moments the current consumption is higher.
Table 2-3: Current specifications (MC57xx)
Current consumption
(mA)
Condition
Min
Typical
Max
CDMA Transmitting
250
300
950
CDMA Transmitting (MC5728/MC5728V)
TBD
TBD
TBD
CDMA Receiving
90
100
120
CDMA Receiving (MC5728/MC5728V)
TBD
TBD
TBD
CDMA Sleep (default slot cycle = 2)
1.4
1.7
1.75
CDMA Sleep, MC5728/MC5728V (default slot
cycle = 2)
TBD
TBD
TBD
Deep Sleep Average
0.5
0.7
1.5
Deep Sleep Average (MC5728/MC5728V)
TBD
TBD
TBD
Shutdown
0.25
0.30
0.35
Shutdown (MC5728/MC5728V)
TBD
TBD
TBD
Current depends on the radio band in use and the
network’s control of the module’s output power.
The ‘Typical’ value is based on:
• 40% full rate, and
• 60% 1/8th rate over -35 to +23.5 dBm.
The module supports slotted mode operation and Quick
Paging Channel (both enable reduced sleep current).
The values shown are the lowest power consumption
during the sleep cycle.
The default Slot Cycle Index (SCI) for slotted mode
operation is determined by the PRI setting (usually 1).
Table 2-4: Current specifications (MC8775 / MC8775V)
Description
Band
Typ
Max
Units
Notes / Configuration
Averaged standby DC current consumption
With Sleep mode activated
(assumes USB bus is fully suspended during measurements)
28
HSDPA / WCDMA
Bands I, II, V
2.9
mA
DRX cycle = 8 (2.56 s)
GSM / GPRS / EDGE
All
2.8
mA
MFRM = 5 (1.175 s)
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Power Interface
Table 2-4: Current specifications (MC8775 / MC8775V) (Continued)
Description
Band
Typ
Max
Units
Notes / Configuration
With Sleep mode deactivated
(assumes USB bus is fully suspended during measurements)
HSDPA / WCDMA
Bands I, II, V
73
80
mA
DRX cycle = 8 (2.56 s)
GSM / GPRS / EDGE
All
46
55
mA
MFRM = 5 (1.175 s)
2.5
mA
This state is entered when
Watcher® (or other
application) shuts down /
turns off the radio.
Low Power Mode (LPM) / Offline Mode
RF disabled, but module is operational
Averaged WCDMA / HSDPA DC current consumption
WCDMA talk current
(AMR 12.2 kbps
vocoder)
Bands I, II, V
WCDMA data current
300
mA
0 dBm Tx power
480
mA
+15 dBm Tx power
650
mA
+21 dBm Tx power
330
mA
64 kbps UL / 384 kbps DL,
+0 dBm Tx power
180
mA
320 mA peak
WCDMA searching
channels
HSDPA current
340
mA
0 dBm Tx power
Maximum peak talk
current
1.2
Max RF output power, full
rate, full operating
temperature range
300
mA
+5 dBm Tx power
210
mA
+13 dBm Tx power
300
mA
+29 dBm Tx power
GSM850 &
GSM900
360
mA
+33 dBm Tx power
GPRS current
(+13 dBm Tx power,
GPRS CS2, averaged
over multiple Tx
frames)
Quad GSM
180
mA
1 Rx / 1 Tx slot
180
mA
2 Rx / 1 Tx slot
240
mA
4 Rx / 2 Tx slot
GSM / GPRS
searching channels
Quad GSM,
GSM850, GSM900
163
mA
489 mA peak
Averaged GSM / EDGE DC current consumption
GSM Talk current
(Full rate GSM
vocoder, averaged
over multiple Tx
frames)
Rev 1.9.1 Feb.09
Quad GSM
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 2-4: Current specifications (MC8775 / MC8775V) (Continued)
Description
Band
Typ
Max
Units
Notes / Configuration
EDGE current
(14 dBm Tx Power,
averaged over
multiple Tx frames)
Quad GSM
180
mA
1 Rx / 1 Tx slot
180
mA
2 Rx / 1 Tx slot
240
mA
4 Rx / 2 Tx slot
2.3
2.75
Max RF output power, Tx
pulse current, full operating
temperature range
Maximum Peak Talk
current
Quad GSM
Miscellaneous DC current consumption
Module OFF leakage
current
All
310
600
μA
USB transmit current
All
10
mA
Full operating temperature
range
Full speed USB connection,
CL = 50 pF on D+ and Dsignals
Table 2-5: Current specifications (MC8780 / MC8781)
Description
Band
Typ
Max
Units
Notes / Configuration
Averaged standby DC current consumption
With Sleep mode activated
(assumes USB bus is fully suspended during measurements)
HSDPA / WCDMA
UMTS bands
mA
DRX cycle = 8 (2.56 s)
GSM / GPRS / EDGE
GSM bands
mA
MFRM = 5 (1.175 s)
With Sleep mode deactivated
(assumes USB bus is fully suspended during measurements)
HSDPA / WCDMA
UMTS bands
46
50
mA
DRX cycle = 8 (2.56 s)
GSM / GPRS / EDGE
GSM bands
50
55
mA
MFRM = 5 (1.175 s)
mA
This state is entered when
Watcher (or other
application) shuts down /
turns off the radio.
Low Power Mode (LPM) / Offline Mode
RF disabled, but module is operational
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Power Interface
Table 2-5: Current specifications (MC8780 / MC8781) (Continued)
Description
Band
Typ
Max
Units
Notes / Configuration
(Maximum power) Averaged WCDMA / HSDPA data current consumption (includes USB bus
current)
WCDMA
UMTS bands
HSUPA
HSDPA
(1.8 Mbps / 3.6 Mbps /
7.2 Mbps)
800
mA
384 kbps at 20 dBm Tx
powera
300
mA
0 dBm Tx power
850
mA
2 Mbps at 20 dBm Tx power
400
mA
0 dBm Tx power
850
mA
All speeds at 20 dBm Tx
powerb
450
mA
0 dBm Tx power
(Maximum power) Averaged GSM / EDGE data current consumption (includes USB bus current)
GSM / GPRS
GSM bands
560
mA
Max PCL for each bandc
230
mA
10 dBm Tx
EDGE
GSM bands
520
mA
Class 12c
Peak current
(averaged over
100 μs)
GSM bands
2.75
Worst case on 850 / 900
band.
a. Highest current is on Band II (PCS1900)
b. Approximate current difference between speeds = 20 mA
Example: Current(7.2 Mbps) = Current(3.6 Mbps) + 20 mA = Current(1.8 Mbps) + 40 mA
c. Highest current is on 850 / 900 band Class 10 (Class 12 implements power backoff). Current on 1800 /
900 bands is typically 100–200 mA less.
Table 2-6: Current specifications (MC8785V)
Description
Band
Typ
Max
Units
Notes / Configuration
Averaged standby DC current consumption
With Sleep mode activated
(assumes USB bus is fully suspended during measurements)
HSDPA / WCDMA
UMTS bands
mA
DRX cycle = 8 (2.56 s)
GSM / GPRS / EDGE
GSM bands
mA
MFRM = 5 (1.175 s)
With Sleep mode deactivated
(assumes USB bus is fully suspended during measurements)
HSDPA / WCDMA
UMTS bands
96
100
mA
DRX cycle = 8 (2.56 s)
GSM / GPRS / EDGE
GSM bands
96
100
mA
MFRM = 5 (1.175 s)
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 2-6: Current specifications (MC8785V) (Continued)
Description
Band
Typ
Max
Units
Notes / Configuration
mA
This state is entered when
Watcher (or other
application) shuts down /
turns off the radio.
Low Power Mode (LPM) / Offline Mode
RF disabled, but module is operational
Averaged Call Mode WCDMA / HSDPA data DC power consumption
WCDMA
UMTS bands
HSUPA
HSDPA
(1.8 Mbps / 3.6 Mbps /
7.2 Mbps)
Peak current
(averaged over
100 μs)
700
mA
384 kbps at 20 dBm Tx
powera
300
mA
0 dBm Tx power
750
mA
2 Mbps at 20 dBm Tx power
340
mA
0 dBm Tx power
750
mA
All speeds at 20 dBm Tx
powerb
340
mA
0 dBm Tx power
780
mA
Averaged Call Mode GSM / EDGE data DC power consumption (with 4 time slots)
GSM / GPRS
GSM bands
650
mA
Max PCL for each bandc
220
mA
10 dBm Tx
EDGE
GSM bands
670
mA
Class 12c
Peak current
(averaged over
100 μs)
GSM bands
2.5
Worst case on 850 / 900
band.
a. Highest current is on Band II (PCS1900)
b. Approximate current difference between speeds = 30 mA
c. Highest current is on 850 / 900 band Class 10 (Class 12 implements power backoff). Current on 1800 /
900 bands is typically 100–200 mA less.
Table 2-7: Current specifications (MC8790 / MC8790V / MC8791V / MC8792V)
Description
Band
Typ
Max
Units
Notes / Configuration
Averaged standby DC current consumption
With Sleep mode activated
(assumes USB bus is fully suspended during measurements)
32
HSDPA / WCDMA
UMTS bands
mA
DRX cycle = 8 (2.56 s)
GSM / GPRS / EDGE
GSM bands
mA
MFRM = 5 (1.175 s)
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Power Interface
Table 2-7: Current specifications (MC8790 / MC8790V / MC8791V / MC8792V)
Description
Band
Typ
Max
Units
Notes / Configuration
With Sleep mode deactivated
(assumes USB bus is fully suspended during measurements)
HSDPA / WCDMA
UMTS bands
40
50
mA
DRX cycle = 8 (2.56 s)
GSM / GPRS / EDGE
GSM bands
40
50
mA
MFRM = 5 (1.175 s)
mA
This state is entered when
Watcher (or other application)
shuts down / turns off the
radio.
Low Power Mode (LPM) / Offline Mode
RF disabled, but module is operational
Averaged Call Mode WCDMA / HSDPA data DC power consumption
WCDMA
UMTS bands
HSUPA
HSDPA
(1.8 Mbps / 3.6 Mbps /
7.2 Mbps)
Peak current (averaged
over 100 μs)
700
mA
384 kbps at 20 dBm Tx
powera
300
mA
0 dBm Tx power
800
mA
2 Mbps at 20 dBm Tx power
350
mA
0 dBm Tx power
800
mA
All speeds at 20 dBm Tx
powerb
370
mA
0 dBm Tx power
720
mA
Averaged Call Mode GSM / EDGE data DC power consumption (with 4 time slots)
GSM / GPRS
GSM bands
650
mA
Max PCL for each bandc
300
mA
10 dBm Tx
EDGE
GSM bands
620
mA
Class 12c
Peak current (averaged
over 100 μs)
GSM bands
2.6
Worst case on 850 / 900
band.
a. Highest current is on Band II (PCS1900)
b. Approximate current difference between speeds = 30 mA
c. Highest current is on 850 / 900 band Class 10 (Class 12 implements power backoff). Current on 1800 / 900
bands is typically 100–200 mA less.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 2-8: Miscellaneous DC power consumption (MC8780 / MC8781 / MC8785V /
MC8790 / MC8790V / MC8791V / MC8792V)
Signal
Description
Band
Typ
Max
Units
VCC
Module OFF
leakage current
All bands
400
600
μA
USB transmit
current
All bands
10
10
mA
Notes / Configuration
Full operating temperature
range
Full speed USB connection,
CL = 50 pF on D+ and Dsignals
Modes
Transmit and Receive modes
Current consumption in transmit or receive mode (in a call or
data connection) is affected by several factors, such as:
• Radio band being used
• Transmit power
• Receive gain settings
• Data rate
• Number of active Transmit time slots (for transmit mode)
Sleep mode
Sleep mode is the normal state of the module between calls or
data connections. In this reduced power mode, the module
cycles between wake (polling the network) and sleep, at an
interval determined by the network provider.
Deep sleep
Deep sleep mode is a reduced power, out‐of‐network‐coverage
mode, that the module enters when it cannot acquire network
service after several minutes.
The module then exits deep sleep periodically to try to acquire
service, and if successful, attempts to register.
Shutdown mode
While in shutdown mode, the module is powered off, but still
draws a minimal current from the host power supply.
SED (Smart Error Detection)
(MC87xx only)
The MC87xx modem uses a form of SED to track recurrent
premature modem resets. In such cases, the modem automati‐
cally forces a pause in boot‐and‐hold mode at power‐on to
accept an expected firmware download to resolve the problem.
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Power Interface
The SED process is implemented as follows:
• The modem tracks consecutive resets of the modem within
30 seconds of power‐on.
• After a third consecutive reset occurs, the modem automati‐
cally waits up to 30 seconds in boot‐and‐hold mode,
waiting for a firmware download to resolve the power‐cycle
problem.
• After 30 seconds (if no firmware download begins), the
modem continues to power‐on.
• If the modem resets again within 30 seconds of power‐on,
the modem again waits in boot‐and‐hold mode.
This process continues until the unexpected power‐cycle issue
is resolved—either a firmware download occurs, or the
modem doesn’t reset spontaneously within 30 seconds of
power‐on.
Usage models
Usage models can be used to calculate expected current
consumption. A sample usage model is provided in Table 2‐9,
based on the values in Table 2‐3 for a CDMA module.
Table 2-9: Power consumption of a sample application
Used by a field worker
(data only)
Used for remote data
logging
Upload (module
Tx)
1000 kB/day
40 kB/h
Download
(module Rx)
500 kB/day
100 kB/day
Coverage / data
rate
1X / 80 kbps
IS-95 / 14.4 kbps
Hours of
operation
8/day (off 16 hrs/day)
24/day
Total power
consumed over
24 hours
60 mAh
200 mAh
This example model applies to a battery‐operated device. In
practice, because the module is isolated from the battery (the
host device manages the power source), the mAh ratings
depend on the device’s supply efficiency.
The module automatically enters slotted sleep mode when
there is no transmission or reception occurring (SCI = 2).
Transmit power is assumed to be +3 dBm.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
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3
3: RF Integration
This chapter provides information related to the RF (Radio
Frequency) integration of the MC57xx and MC87xx modules
with host devices. The frequencies of operation and perfor‐
mance specifications vary depending on the module model
used. RF performance parameters for typical modules are
listed in Table 3‐1 and Table 3‐2.
Note: Values in this guide are taken from the appropriate product
specification documents (PSDs) (listed in Related documents,
page 13) — in the case of a discrepancy between this document and
the relevant PSD, use the value listed in the PSD.
Table 3-1: MC57xx — Typical RF parameters
Band
PCS
Tx Band
(MHz)
1851–1910
Cellular 824–849
Tx Power
(dBm)
Rx Band
(MHz)
Rx Sensitivity
(dBm)
+23 to +25
1930–1990
< -106
+23 to +25
869–894
< -106
1575.42
SA Off: -148
SA On: -152
GPS
Table 3-2: MC87xx— RF parameters
Product
Band
Frequencies
(MHz)
Conducted Rx
Sensitivity (dBm)
Typical
MC8775
MC8775V
MC8780
MC8781
MC8785V
MC8790
MC8790V
MC8791V
MC8792V
Rev 1.9.1 Feb.09
Maximum
GPS
Conducted
Sensitivity
Conducted
Transmit
Power
(dBm)
(dBm)
GSM 850
(2%) CS
Tx: 824–849
Rx: 869-894
-107.5
-106
+32 ± 1 (GMSK)
+27 ± 1 (8PSK)
EGSM 900
(2%) CS
Tx: 880-915
Rx: 925-960
-107.5
-106
+32 ± 1 (GMSK)
+27 ± 1 (8PSK)
DCS 1800
(2%) CS
Tx: 1710-1785
Rx: 1805-1880
-106.5
-105
+29 ± 1 (GMSK)
+26 ± 1 (8PSK)
PCS 1900
(2%) CS
Tx: 1850-1910
Rx: 1930-1990
-106.5
-105
+29 ± 1 (GMSK)
+26 ± 1 (8PSK)
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 3-2: MC87xx— RF parameters (Continued)
Product
Band
Frequencies
(MHz)
Conducted Rx
Sensitivity (dBm)
Typical
38
Maximum
GPS
Conducted
Sensitivity
Conducted
Transmit
Power
(dBm)
(dBm)
MC8775
MC8775V
MC8780
MC8781
MC8785V
MC8790
MC8790V
MC8791V
MC8792V
Band I
Tx: 1920–1980
UMTS 2100
Rx: 2110–2170
(0.1%) 12.2 kbps
-110.5
-109
+23 ± 1
MC8775
MC8775V
MC8780
MC8781
MC8785V
MC8790
MC8790V
MC8792V
Band II
Tx: 1850–1910
UMTS 1900
Rx: 1930–1990
(0.1%) 12.2 kbps
-110.5
-109
+23 ± 1
MC8775
MC8775V
MC8780
MC8781
MC8785V
MC8790
MC8790V
Band V
Tx: 824–849
UMTS 850
Rx: 869–894
(0.1%) 12.2 kbps
-111.5
-110
+23 ± 1
MC8792V
Band VIII
Tx: 880–915
UMTS 900
Rx: 925–960
(0.1%) 12.2 kbps
-110.5
-109
+23 ± 1
MC8775V
MC8780
MC8781
MC8785V
MC8790
MC8790V
MC8791V
MC8792V
GPS
(Band VI is
included as a
subset of
Band V)
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RF Integration
RF connection
When attaching an antenna to the module:
Note: To disconnect the
antenna, make sure you use the
Hirose U.FL connector removal
tool (P/N UFL-LP-N-2(01)) to
prevent damage to the module
or coaxial cable assembly.
• Use a Hirose U.FL connector (model
U.FL #CL331‐0471‐0‐10) to attach an antenna to a
connection point on the module, as shown in Figure 3‐1 (the
main RF connector on the top side; the diversity RF or GPS
connector on the bottom side).
• Match coaxial connections between the module and the
antenna to 50 Ω.
• Minimize RF cable losses to the antenna; the recommended
maximum cable loss for antenna cabling is 0.5 dB.
Figure 3-1: Antenna connection points and mounting holes
Ground connection
When connecting the module to system ground:
• Prevent noise leakage by establishing a very good ground
connection to the module through the host connector.
• Connect to system ground using the two mounting holes at
the top of the module (as shown in Figure 3‐1).
• Minimize ground noise leakage into the RF.
Depending on the host board design, noise could potentially
be coupled to the module from the host board. This is
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
mainly an issue for host designs that have signals traveling
along the length of the module, or circuitry operating at
both ends of the module interconnects.
Shielding
The module is fully shielded to protect against EMI and to
ensure compliance with FCC Part 15 ‐ “Radio Frequency
Devices” (or equivalent regulations in other jurisdictions).
Note: The module shields must NOT be removed.
Antenna and cabling
Note: Values in this guide are
taken from the appropriate
product specification documents
(PSDs) (listed in Related
documents, page 13) — in the
case of a discrepancy between
this document and the relevant
PSD, use the value listed in the
PSD.
When selecting the antenna and cable, it is critical to RF perfor‐
mance to match antenna gain and cable loss.
Choosing the correct antenna and cabling
Consider the following points for proper matching of antennas
and cabling:
• The antenna (and associated circuitry) should have a
nominal impedance of 50 Ω with a return loss ≤ 10 dB
across each frequency band of operation.
• The system gain value affects both radiated power and
regulatory (FCC, IC, CE, etc.) test results.
Developing custom antennas
Consider the following points when developing custom‐
designed antennas:
• A skilled RF engineer should do the development to ensure
that the RF performance is maintained.
• Identify the bands that need to be supported, particularly
when both the MC57xx and MC87xx will be installed in the
same platform. In this case, you may want to develop
separate antennas for maximum performance.
Note: For detailed electrical performance criteria, see Appendix A:
Antenna Specification, page 101.
Determining the antenna’s location
Consider the following points when deciding where to put the
antenna:
• Antenna location may affect RF performance. Although the
module is shielded to prevent interference in most applica‐
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RF Integration
tions, the placement of the antenna is still very important —
if the host device is insufficiently shielded, high levels of
broadband or spurious noise can degrade the module’s
performance.
• Connecting cables between the module and the antenna
must have 50 Ω impedance. If the impedance of the module
is mismatched, RF performance is reduced significantly.
• Antenna cables should be routed, if possible, away from
noise sources (switching power supplies, LCD assemblies,
etc.). If the cables are near the noise sources, the noise may
be coupled into the RF cable and into the antenna.
Disabling the diversity antenna
• MC57xx — If your host device is not designed to use the
MC57xx module’s diversity antenna, terminate the interface
with a 50 Ω load.
• MC8780 / MC8781 / MC8785V / MC8790 / MC8790V /
MC8791V / MC8792V —Use the AT command !RXDEN=0 to
disable receive diversity or !RXDEN=1 to enable receive
diversity.
Interference and sensitivity
Note: These modules are based
on ZIF (Zero Intermediate
Frequency) technologies; when
performing EMC
(Electromagnetic Compatibility)
tests, there are no IF
(Intermediate Frequency)
components from the module to
consider.
Note: Values in this guide are
taken from the appropriate
product specification documents
(PSDs) (listed in Related
documents, page 13) — in the
case of a discrepancy between
this document and the relevant
PSD, use the value listed in the
PSD.
Rev 1.9.1 Feb.09
Several sources of interference can affect the RF performance
of the module (RF desense). Common sources include power
supply noise and device‐generated RF.
RF desense can be addressed through a combination of
mitigation techniques and radiated sensitivity measurement.
Power supply noise
Noise in the power supply can lead to noise in the RF signal.
The power supply ripple limit for the module is no more than
200 mVp‐p 1 Hz to 100 kHz. This limit includes voltage ripple
due to transmitter burst activity.
Interference from other wireless devices
Wireless devices operating inside the host device can cause
interference that affects the module.
To determine the most suitable locations for antennas on your
host device, evaluate each wireless device’s radio system,
considering the following:
• Any harmonics, sub‐harmonics, or cross‐products of signals
generated by wireless devices that fall in the module’s Rx
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
range may cause spurious response, resulting in decreased
Rx performance.
• The Tx power and corresponding broadband noise of other
wireless devices may overload or increase the noise floor of
the module’s receiver, resulting in Rx desense.
The severity of this interference depends on the closeness of
the other antennas to the module’s antenna. To determine
suitable locations for each wireless device’s antenna,
thoroughly evaluate your host device’s design.
Device-generated RF
All electronic computing devices generate RF interference that
can negatively affect the receive sensitivity of the module.
Note: The module can cause
interference with other devices
such as hearing aids and onboard speakers.
Wireless devices such as the
Mini Card transmit in bursts
(pulse transients) for set
durations (RF burst frequencies).
Hearing aids and speakers
convert these burst frequencies
into audible frequencies,
resulting in audible noise.
The proximity of host electronics to the antenna in wireless
devices can contribute to decreased Rx performance. Compo‐
nents that are most likely to cause this include:
• Microprocessor and memory
• Display panel and display drivers
• Switching‐mode power supplies
These and other high‐speed devices (in particular, the
processor) can decrease Rx performance because they run at
frequencies of tens of MHz. The rapid rise and fall of these
clock signals generates higher‐order harmonics that often fall
within the operating frequency band of the module, affecting
the module’s receive sensitivity.
Example
On a sub‐system running at 40 MHz, the 22nd harmonic falls
at 880 MHz, which is within the cellular receive frequency
band.
Note: In practice, there are usually numerous interfering frequencies
and harmonics. The net effect can be a series of desensitized receive
channels.
Note: It is important to
investigate sources of localized
interference early in the design
cycle.
42
Methods to mitigate decreased Rx
performance
To reduce the effect of device‐generated RF on Rx perfor‐
mance:
• Put the antenna as far as possible from sources of inter‐
ference. The drawback is that the module may be less
convenient to use.
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RF Integration
• Shield the host device. The module itself is well shielded to
avoid external interference. However, the antenna cannot
be shielded for obvious reasons. In most instances, it is
necessary to employ shielding on the components of the
host device (such as the main processor and parallel bus)
that have the highest RF emissions.
• Filter out unwanted high‐order harmonic energy by using
discrete filtering on low frequency lines.
• Form shielding layers around high‐speed clock traces by
using multi‐layer PCBs.
• Route antenna cables away from noise sources.
Radiated sensitivity
measurement
A wireless device contains many sources of noise that
contribute to a reduction in Rx performance.
To determine the extent of any desensitization of receiver
performance due to self‐generated noise in the host device,
over‐the‐air (OTA) or radiated testing is required. This testing
can be performed by Sierra Wireless or you can use your own
OTA test chamber for in‐house testing.
Sierra Wireless’ sensitivity testing and
desensitization investigation
Most carriers require a certain level of receiver performance to
ensure proper functioning of the device on their networks.
Although the module has been designed to meet these carrier
requirements, it is still susceptible to various performance
inhibitors.
As part of the Engineering Services package, Sierra Wireless
offers modem OTA sensitivity testing and desensitization
(desense) investigation. For more information, contact your
account manager or the Sales Desk (see page 5).
Note: Sierra Wireless has the capability to measure TIS (Total
Isotropic Sensitivity) and TRP (Total Radiated Power) according to
CTIA's published test procedure.
OTA test chamber configuration
To make OTA measurements, a test chamber is required. A
full‐size anechoic chamber is not necessarily required.
Figure 3‐2 shows a small anechoic chamber manufactured by
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Lindgren. This does not provide power to the same accuracy
as a full‐size anechoic chamber, but is sufficient for this appli‐
cation. A base station simulator, such as an Agilent 8960
(shown) or Rohde & Schwarz CMU200, is used to provide FER
(Frame Error Rate) measurements.
Figure 3-2: Anechoic chamber
Agilent 8960
call box
Approx . 1 m
Path loss calculation
The chamber is calibrated for path loss using a reference
antenna with known gain that is feeding a spectrum analyzer
or power meter. This makes it possible to determine the
radiated power available to the receiving antenna and the path
loss:
Radiated Power =
Measured received power
+ Any cable losses
- Reference receive antenna gain
Path Loss =
Radiated power
- Input power
Note: It is not necessary to know the gain of the transmitting antenna;
it is included in the path loss.
44
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RF Integration
Positioning the DUT (Device Under Test)
To achieve meaningful results, the device must be positioned
such that the peak of the receive antenna pattern is pointed
toward the source antenna. Theoretically, the best way to
accomplish this is to modify the DUT so that antenna output is
through coaxial cable. The device is then rotated until the
receive power is maximized.
Alternate path loss calculation method
Path loss can also be calculated, without modifying the DUT,
by using the transmit capabilities of the unit. This method of
calculation is possible because the position that maximizes
transmitter power provides a sufficiently accurate location for
receiver desense measurements. The unit is placed in a call and
set to generate peak output power, either through a test mode,
or by configuring the base station simulator to issue the appro‐
priate command. The unit is then positioned for maximum
power as determined by the call box.
Sensitivity vs. frequency
For the MC57xx, sensitivity is defined as the input power level
in dBm that produces a FER (Frame Error Rate) of 0.5%. Sensi‐
tivity should be measured at all CDMA frequencies across
each band. For example, Figure 3‐3 illustrates sensitivity in the
US PCS band. There are 25 physical channels with a spacing of
50 KHz; the first CDMA channel is CH25.
For the MC87xx, sensitivity is defined as the input power level
in dBm that produces a BER (Bit Error Rate) of 2% (GSM) or
0.1% (UMTS). Sensitivity should be measured at all GSM /
UMTS frequencies across each band, as shown in Figures 3‐4
through 3‐11.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Sensitivity test results — MC57xx
Figure 3‐3 shows typical test results for the US PCS band for
both conducted and over‐the‐air connections. The conducted
(or ʺconnectorizedʺ) measurements were made using an RF
coaxial cable connection. The over‐the‐air measurements were
made using both an external antenna and a typical device
antenna.
Figure 3-3: US PCS sensitivity measurements
In this test, the external antenna performed best — the
expected result if a high efficiency antenna with some gain is
used. The internal antenna has less gain than the external
antenna, so the internal antennaʹs performance is offset above
the external antenna. The antenna gain must be known to
determine whether the offset is strictly the result of antenna
gain or if broadband desense is present. Narrowband desense
can be seen at channels 325, 625, and 925.
46
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RF Integration
Sensitivity test results — MC87xx
Figures 3‐4 through 3‐11 show typical test results for
conducted connections for the GSM850, GSM900, GSM1800,
GSM1900, UMTS850, UMTS1900, and UMTS2100 bands. The
conducted measurements were made using an RF coaxial cable
connection.
Figure 3-4: GSM850 sensitivity for BERII < 2%
Figure 3-5: EGSM900 sensitivity for BERII < 2%
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Figure 3-6: DCS1800 sensitivity for BERII < 2%
Figure 3-7: PCS1900 sensitivity for BERII < 2%
48
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RF Integration
Figure 3-8: UMTS850 sensitivity for BER < 0.1%
Figure 3-9: UMTS900 sensitivity for BER < 0.1
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Figure 3-10: UMTS1900 sensitivity for BER < 0.1%
Figure 3-11: UMTS2100 sensitivity for BER < 0.1%
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4
4: Audio Interface
The MC5725V / MC5727V / MC5728V / MC8775V / MC8785V /
MC8790V / MC8791V / MC8792V modules support four audio
modes that may be required by a host audio system:
• Handset
• Headset
• Car kit
• Speakerphone
Note: Values in this guide are
taken from the appropriate
product specification documents
(PSDs) (listed in Related
documents, page 13) — in the
case of a discrepancy between
this document and the relevant
PSD, use the value listed in the
PSD.
The modules support both a differential analog interface and
PCM digital audio, and allow dynamic run‐time selection of
the appropriate mode.
Table 4‐1 summarizes the key audio features of these modules.
Table 4-1: Audio features
Feature
Gain (adjustable)
Transmit
MC5725V / MC5727V — Up to
+16 dB analog gain
Receive
Up to +12 dB
MC5728V — Programmable to 0 dB
or +24 dB
MC8775V / MC8785V / MC8790V /
MC8791V / MC8792V — Up to
+48.5 dB analog gain available
(when the analog interface is
selected)
Filtering stages
Several adjustable high-pass and
slope filters
High-pass filter
Noise suppression
Supported
n/a
Echo cancellation
Configurable for each audio mode
(headset, handset, speakerphone,
and car kit)
n/a
Output driver stage
n/a
Supported
FIR (Finite Impulse
Response) filtering
MC87xx — Option of providing 13 tap FIR filtering for receive and
transmit paths to equalize the acoustic response of the speaker
and microphone elements.
Audio pass band
300 Hz–3.4 kHz
These modules are intended to serve as an integral component
of a more complex audio system—for example, a PDA with a
separate codec interfaced to the Host Application processor.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Usually, the interface between the module and the host audio
system is set to line‐level amplitudes with no transducer
considerations. The responsibility of the module codec or host
codec for special functions is detailed in Table 4‐2.
Table 4-2: Functions - responsibility codecs
Function
Responsible Codec
Phone oriented (e.g., echo
cancellation, FIR filtering)
Module codec
Path-switching
Host codec
Transducer interfaces
Host codec
Adjustable gain / volume settings
Either
DTMF / ringer tone generation
Either
Mixing
Host codec
System block diagrams
Note: When integrating the module into your host platform, make sure
the module has sufficient shielding to prevent RF interference.
MC5725V / MC5727V system block
Figure 4‐1 represents the MC5725V / MC5727V module’s audio
system block, and includes the following features:
• Module interconnects are shown on the left side of the
diagram. The audio interface uses the signals:
· MIC_P / MIC_N
· SPK_P / SPK_N
Note: Make sure the host device
includes DC blocking capacitors
on the Audio In lines – the
module does not include series
capacitors.
52
• Dynamic ranges for each programmable gain stage are
listed, with the following constraints:
· MIC_AMP1 is programmable in discrete steps only
· CodecSTGain, when set to the minimum setting, effec‐
tively mutes sidetone in the module codec
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Audio Interface
Figure 4-1: MC5725V / MC5727V Audio system block
MIC_P
TX_HPF_DIS_N
TX_SLOPE_FILT_DIS_N
MIC_N
57.3mVrms
@ 0dBm0
HPF &
Slope
MIC_AMP1_GAIN
+16dB
+8dB
+6dB
-2dB
CodecSTGain
+12dB
-48dB
-96dB
CodecRxGain
AMP_SEL
001 010 100
Echo Cancellation
22p
NS &
AAGC
+12dB
-3dB
-84dB
TxPCMFilt TxVolume
Tx FIR
13K CELP/
EVRC
Encoder
+12dB
0dB
-84dB
MIC_AMP2_BYP
10 01
MIC_SEL
nsSwitch
CodecTxGain
13 bit A/D
RF Filter
33n
Encoder
PCM I/F
Audio In
TX ADC
DTMF Tx Gain
DTMF
Decoder
DTMF
Encoder
Decoder
RF
Interface
DTMF Rx Gain
RX_HPF_DIS_N
35mW @ +3dBm0
SPK_N
13 bit D/A
SPK_P
HPF
Rx FIR
+12dB
0dB
-81dB
Audio Out
AAGC
13K CELP/
EVRC
Decoder
RxVolume
+12dB
-25dB RxPCMFilt
-84dB
RX DAC
MC5728V system block
Figure 4‐2 represents the MC5728V module’s audio system
block, and includes the following features:
• Module interconnects are shown on the left side of the
diagram. The audio interface uses the signals:
· MIC_P / MIC_N
· SPK_P / SPK_N
Note: Make sure the host device
includes DC blocking capacitors
on the Audio In lines – the
module does not include series
capacitors.
Rev 1.9.1 Feb.09
• Dynamic ranges for each programmable gain stage are
listed, with the following constraints:
· MIC_AMP1 is programmable to 0 dB or +24 dB only
· CodecSTGain, when set to the minimum setting, effec‐
tively mutes sidetone in the module codec
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Figure 4-2: MC5728V Audio system block
TX ADC
57.3mVrms
@ 0dBm0
Audio In
nsSw itch
HPF &
Slope
13 bit A/D
NS &
AAGC
TxPCMFilt
+12dB
-3dB
-84dB
TxVolume
Tx FIR
13K CELP/
EVRC
Encoder
+12dB
0dB
-84dB
MIC_A MP1
0 dB or +24 dB
MIC_SEL
CodecSTGain
0dB
-48dB
-96dB
22
PCM I/F
RF Filter
33n
Encoder
TX_HPF_DIS_N
TX_SLOPE_FILT_DIS_
CodecTxGain
CodecRxGain
AMP_SEL
Echo Cancellation
MIC1P
MIC1N
DTMF Tx Gain
DTMF
Decoder
DTMF
Encoder
Decoder
RF
Interface
DTMF Rx Gain
RX_HPF_DIS_N
35mW @ +3dBm0
SPK1P
SPK1N
13 bit D/A
HPF
Rx FIR
+12dB
0dB
-84dB
Audio Out
AAGC
13K CELP/
EVRC
Decoder
RxVolume
+12dB
-25dB RxPCMFilt
-84dB
RX DAC
MC8775V / MC8785V / MC8790V / MC8791V / MC8792V
system block
Figure 4‐3 represents the MC8775V / MC8785V / MC8790V /
MC8791V / MC8792V module’s audio system block, and
includes the following features:
• Module interconnects are shown on the left side of the
diagram. The analog audio interface uses the signals:
· MIC_P / MIC_N
· SPK_P / SPK_N
Note: Make sure the host device
includes DC blocking capacitors
on the analog Audio In lines –
the module does not include
series capacitors.
• The digital PCM audio interface uses the signals:
· PCM_CLK
· PCM_DIN
· PCM_DOUT
· PCM_SYNC
• Dynamic ranges for each programmable gain stage are
listed, with the following constraints:
· MIC_AMP1 is programmable in 1.5 dB steps
· CodecSTGain, when set to the minimum setting, effec‐
tively mutes sidetone in the module codec
• When PCM audio is selected, the RX DAC and TX ADC
blocks are bypassed—the external PCM codec controls
transmit gain, receive gain, and sidetone gain.
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Audio Interface
Note: Data mixing is not supported. If mixing of voice signal is
required, it must be done by the host processor.
Figure 4-3: MC8775V / MC8785V / MC8790V / MC8791V / MC8792V Audio system block
PCM Audio interface
MIC_P
MIC_N
TX_HPF_DIS_N
TX_SLOPE_FILT_DIS_N
57.3mVrms
@ 0dBm0
HPF &
Slope
NS &
AAGC
+12dB
-3dB
-84dB
TxPCMFilt TxVolume
Tx FIR
13K CELP/
EVRC
Encoder
+12dB
0dB
-84dB
MIC_AMP1_GAIN
-6dB to +49.5dB
in 1.5dB steps
PCM I/F
CodecSTGain
+12dB
-48dB
-96dB
22p
CodecRxGain
AMP_SEL
001 010 100
SPK_N
SPK_P
nsSwitch
CodecTxGain
13 bit A/D
RF Filter
33n
Encoder
Echo Cancellation
Audio In
TX ADC
DTMF Tx Gain
DTMF
Decoder
DTMF
Encoder
RF
Interface
DTMF Rx Gain
RX_HPF_DIS_N
35mW @ +3dBm0
13 bit D/A
HPF
Rx FIR
Audio Out
Decoder
+12dB
0dB
-81dB
AAGC
13K CELP/
EVRC
Decoder
RxVolume
+12dB
-25dB RxPCMFilt
-84dB
RX DAC
Modes of operation
These modules support four operational modes: headset,
handset, car kit, and speakerphone—end products can use any
combination of these modes.
The host device must use host‐modem messaging to tell the
module which mode to use for each call.
Sidetone support
The sidetone path mixes the near‐end transmit voice to the
near‐end receive. This gives the near‐end user some feedback
that indicates that the call is up and that the audio system is
functioning.
The sidetone path can be enabled in either the PDA codec or
the Mini Card modem—each path is equally valid. It should
not be added to both devices, and for speakerphone or car kit
applications, both sidetone paths should be disabled.
The typical handset sidetone is 12 dB below transmit voice
levels.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
For Handset and Headset mode, the threshold of pain (+120
dBSPL) must not be exceeded at the maximum volume setting.
A good target for the medium volume setting is +94 dBSPL, as
this is a typical level for conversational speech.
Most audio gain should be added to the host audio front end
(within the PDA style codec gain blocks or amplifiers between
the host codec and transducers). Refer to the appropriate Mini
Card Product Specification Document for reference levels on
the modem receive and transmit side.
Echo cancellation support
The Mini Card offers four modes of echo cancellation to
support unique end‐unit audio capabilities (echo cancellation
can also be turned off completely). All echo cancellation is
near‐end (mobile TX) cancellation only. The network provides
some level of far‐end echo cancellation.
Table 4-3: Echo cancellation details
Mode
Handset
Details
• Short echo path (<16 ms travel time from speaker to
microphone)
• Handset design requires good isolation between
speaker and microphone
• Echo canceller allows full-duplex conversation with
absolute minimum echo
Headset
• Short echo path (<16 ms travel time from speaker to
microphone)
• Headset design may allow higher echo than
handset mode—microphone and speaker are physically closer
• More aggressive echo canceller algorithm allows
full-duplex conversation on headsets with good
isolation
Car kit
• Long echo path (<64 ms travel time from speaker to
microphone)
• Loud echo
• For use with hands-free car kit or speakerphone
applications with mild distortion
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Audio Interface
Table 4-3: Echo cancellation details
Mode
Details
Speakerphone
• Long echo path (<64 ms travel time from speaker to
microphone)
• Loud echo
• For use with speakerphone applications with high
distortion
• Half-duplex algorithm, very aggressive in near-end
Tx muting to eliminate transmitted echo
Off
Audio signal interface
The differential microphone input offers superior noise
rejection performance to the single‐ended approach. The
termination of the differential pair rejects common signals
(such as noise). The pair should be routed together for optimal
noise rejection. Since MIC_P and MIC_N are high impedance
inputs, it is important to isolate these from possible noise
sources (toggling digital lines with fast edges).
The speaker interface can be single‐ended or differential
depending on product. Single‐ended speaker outputs rely on
modem ground as an audio reference.
The audio passband for both receive and transmit paths
(speaker and microphone) extends from 300 Hz to 3.4 kHz. A
programmable sidetone with a range from mute to unity gain
is available for both headset and main audio paths. Sidetone
should be muted for speakerphone use.
Note that certain carriers now require use of hearing‐aid
compatible transducers in a handset design. The Primary
audio path can be interfaced directly to such devices. Refer to
ANSI C63.19 for details regarding reduced RF emissions (ʺU3
ratingʺ) and inductive / telecoil coupling (ʺU3Tʺ rating)
devices.
Table 4-4: Primary audio signal interface
Signal
Rev 1.9.1 Feb.09
Pin #
Type
Directions
Description
MIC_P
Analog
Input
Non-inverted
microphone input (+)
MIC_N
Analog
Input
Inverted microphone
input (-)
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 4-4: Primary audio signal interface
Signal
Pin #
Type
Directions
Description
SPK_P
Analog
Output
Non-inverted
speaker output (+)
SPK_N
Analog
Output
Inverted speaker
output (-)
Table 4-5: PCM digital audio signal interface
Signal
Pin #
Type
Directions
Description
PCM_CLK
45
Digital
Output
PCM clock
PCM_DIN
47
Digital
Input (internal
pull-down)
PCM data in
PCM_DOUT
49
Digital
Output
PCM data out
PCM_SYNC
51
Digital
Input (internal
pull-down)
PCM sync
Audio function partitioning
These phone‐oriented functions are usually under module
control:
• FIR filters—both transmit and receive path
• Noise suppression—required due to high sensitivity and
gain in transmit path
• Echo cancellation—different for each audio path and
environment (handset, headset, car kit, speakerphone)
• High pass filtering / slope filtering functions—required per
phone acoustic requirements
• AGC (Automatic Gain Control)—normalizes audio
volumes in varying acoustic environments
• DTMF tones—the generation and detection of DTMF tones
is required in both directions of the phone interface
• Comfort noise—low level noise injected into receiver path
for user ʺconnectionʺ experience
• Simple ringers—digital and analog tones, melody ringers,
MIDI with limited memory storage
These functions are typically performed in the host codec:
• Voice Memo—performed by the host if significant memory
storage is required
• Polyphonic ringtone—host often supports WAV, MIDI
formats with significant memory storage
• Audio path switching—turn on audio path depending on
user interface selection, or headset detection
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Audio Interface
• Audio path mixing—required for voice memo recording
and playback via multiple audio paths
• Transducer interface—host provides acoustic drivers, must
occur outside of path switching and mixing
These functions can be performed in either host or module
codec, depending on balance of component selection and
engineering resources:
• Volume settings—adjustable gain settings based on user
interface selections
• Sidetone—careful placement of sidetone gain control is
required to prevent the need to adjust sidetone gain with
varying volume settings
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
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5
5: Host / Module Interfaces
This chapter provides information about specific host interface
pin assignments, the host‐module communication interface
(USB interface), LED outputs, USIM interface, and lists
extended AT commands that may be useful for hardware
integration testing.
Host interface pin details
Note: On any given interface (USB, USIM, etc.) leave unused inputs
and outputs as no-connects.
Detailed connector pin information is available in the product
specification documents for each module—refer to these
documents when integrating modules into your host devices.
The following are specific integration considerations relating
to the host interface connector pins:
• On any given interface (USB, USIM, etc.), leave unused
inputs and outputs as no‐connects.
• Table 5‐1 describes MC8775V / MC8785V / MC8790V /
MC8791V / MC8792V‐specific pins that are rated for 2.6 V.
Reference these pins to the MSM_2.6 V rail (pin 11) as the
maximum limit.
Table 5-1: MC8775V / MC8785V / MC8790V / MC8791V /
MC8792V 2.6 V connector pins a
Pin
Rev 1.9.1 Feb.09
Signal name
Description
MIC_P
Microphone Positive
MIC_N
Microphone Negative
GPIO_1
General Purpose I/Ob
16
GPIO_2
General Purpose I/Oa
22
AUXV1
Auxiliary Voltage 1
28
GPIO_3
General Purpose I/Oa
33
MDL_RESET_N
Reset
44
GPIO_4
General Purpose I/Oa
45
CTS1 / PCM_CLK
UART Clear To Send or PCM Clock
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 5-1: MC8775V / MC8785V / MC8790V / MC8791V /
MC8792V 2.6 V connector pins a (Continued)
Pin
Signal name
Description
46
GPIO_5
General Purpose I/Oa
47
RTS1 / PCM_DIN
UART Request To Send or PCM Data In
48
GPIO_6
General Purpose I/Oa
49
RXD1 / PCM_DOUT UART Receive Data or PCM Data Out
51
TXD1 / PCM_SYNC UART Transmit Data or PCM Sync
a. This table is abstracted from the PSD—the PSD takes precedence
b. No defined function—reserved for future use
USB interface
The USB interface is the only path for communication between
the host and module.
The interface complies with the Universal Serial Bus Specifi‐
cation, Rev 2.0.
Features of the USB interface include:
• Support for the full‐speed (12 Mbps) data rate
• (MC8785V / MC8790 / MC8790V / MC8791V / MC8792V)
Support for the high‐speed (480 Mbps) data rate
• Transfer of general, phone diagnostic, and over‐the‐air data
between the module and the host
• Enumeration of the module as a set of Modem (MC57xx) or
COM (MC57xx and MC87xx) ports, using host Windows
drivers
• Enumeration of the module as a set of /dev/ttyUSBn devices
for Linux systems with the Sierra Wireless driver installed
• USB‐compliant transceivers
USB handshaking
Note: If you are using the Windows or Linux drivers provided by
Sierra Wireless, you can skip this section — it is intended for developers who are creating their own USB drivers.
The host must act as a USB host device to interface with the
module.
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Host / Module Interfaces
The module uses the USB standard Suspend and Resume
functions (described further) to control the sleep and wakeup
states. For detailed specifications of Resume and Suspend,
refer to Universal Serial Bus Specification, Rev 2.0.
Suspending
The module supports USB Suspend mode.
When the module enters suspend mode, it shuts down the
USB clock to save power.
While in the suspend state:
• The module provides power to the D+/‐ interface to signal
its current state to the host device.
• The host must maintain the VCC_3V3 voltage.
Refer to Universal Serial Bus Specification, Rev 2.0 for critical
timing parameters for the suspend state.
Resume
USB activity may be resumed by either the USB host or by the
module.
If the host initiates USB activity:
1.
The USB transceiver detects the change in bus activity and
triggers the USB_RESUME interrupt to the moduleʹs
processor.
2.
The module then enables its USB clock and responds to the
host.
If the module initiates USB communication (Remote Wakeup):
1.
The module enables its USB clock.
2.
The module enables the USB transceiver.
3.
The module sends the resume signal for at least 20 ms.
Refer to Universal Serial Bus Specification, Rev 2.0 for critical
timing parameters for the resume state.
Host USB driver requirements
The USB driver on the host device must meet these critical
requirements:
• The host USB driver must support remote wakeup, resume,
and suspend operations as described in Universal Serial Bus
Specification, Rev 2.0.
• The host USB driver must support serial port emulation.
The module implements both 27.010 multiplexing and USB‐
CDC.
• When the host doesn’t have any valid data to send, the host
USB driver should NOT send any SOF tokens (start‐of‐
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
frames) to the module. These tokens keep the module
awake and cause unnecessary power consumption.
LED output
The module drives the LED output according to the PCI‐
Express Mini Card specification (summarized in Table 5‐2,
below).
Table 5-2: LED states
State
Indicates
Characteristics
Off
Module is not
powered.
Light is off.
On
Module is powered
and connected, but
not transmitting or
receiving.
Light is on.
Slow blink
Module is powered
and searching for a
connection.
LED is flashing at a
steady, slow rate.
• 250 ms ± 25% ON
period
• 0.2 Hz ± 25% blink
rate
Faster blink
Module is
transmitting or
receiving.
LED is flashing at a
steady, faster rate.
• Approximately 3 Hz
blink rate
Note: MC572x modules
support customer-defined
LED controls.
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Host / Module Interfaces
Figure 5-1: Example LED
VCC 3.3V
Current limiting Resistor
LED
MiniCard
MIO
USIM interface
Note: This section applies only to GSM (MC87xx) modules.
The module is designed to support one USIM (Universal
Subscriber Identity Module). The USIM holds account infor‐
mation, allowing users to use their account on multiple
devices.
The USIM interface has four signals (plus Ground). These are
defined in Table 5‐3 with an example circuit shown in
Figure 5‐2. (For USIM card contacts, see Figure 5‐3.)
Table 5-3: USIM pins
Pin name
Rev 1.9.1 Feb.09
USIM contact
number
Function
XIM_VCC
USIM VCC
XIM_RESET
Active low USIM reset
XIM_CLK
Serial clock for USIM data
XIM_DATA
Bi-directional USIM data line
XIM_GND
Ground
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Figure 5-2: USIM application interface
4.7uF
X5R
typ
XIM_VCC
(Optional.
Locate near the
USIM socket)
15 kΩ - 30 kΩ
Located near
USIM socket
(Optional.
Locate near the
USIM socket)
47 pF, 51 Ω
XIM_VCC (C1)
XIM_CLK (C3)
XIM_CLK
XIM_IO
XIM_DATA (C7)
XIM_RESET
XIM_RESET (C2)
GND
GND (C5)
USIM card connector
ESD
protection
Located near USIM socket.
NOTE: Carefully consider if ESD
protection is required – it may
increase signal rise time and
lead to certification failure
MC87xx
Figure 5-3: USIM card contacts (contact view)
Contact View (notched corner at top left)
66
RFU
C8
C4
RFU
I/O
C7
C3
CLK
VPP
C6
C2
RST
GND
C5
C1
VCC
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Host / Module Interfaces
USIM operation
Note: For interface design
requirements, refer to:
(2G) 3GPP TS 51.010-1, section
27.17, or
(3G) ETSI TS 102 230 V5.5.0,
section 5.2
When designing the remote USIM interface, you must make
sure that the USIM signal integrity is not compromised. Some
design recommendations include:
• The total impedance of the VCC and GND connections to
the USIM, measured at the module connector, should be
less than 1 Ω to minimize voltage drop (includes any trace
impedance and lumped element components — inductors,
filters, etc.).
Note: The MC87xx is designed for use with either a 1.8 V or 3 V
USIM.
• Position the USIM connector no more than 10 cm from the
•
•
•
•
•
•
•
•
Rev 1.9.1 Feb.09
module. If a longer distance is required because of the
design of the host device, a shielded wire assembly is
recommended—connect one end as close as possible to the
USIM connector and the other end as close as possible to
the module connector. The shielded assembly may help
shield the USIM interface from system noise.
Reduce crosstalk on the XIM_data line to reduce the risk of
failures during GCF approval testing.
Avoid routing the XIM_CLK and XIM_DATA lines in
parallel over distances greater than 2 cm—cross‐coupling of
these lines can cause failures.
Keep USIM signals as short as possible, and keep very low
capacitance traces on the XIM_DATA and XIM_CLK signals
to minimize signal rise time—signal rise time must be <1 μs.
High capacitance increases signal rise time, potentially
causing your device to fail certification tests.
Add external pull‐up resistors (15 kΩ — 30 kΩ), if required,
between the SIM_IO and SIM_VCC lines to optimize the
signal rise time.
3GPP has stringent requirements for I/O rise time (<1 μs),
signal level limits, and noise immunity—consider this
carefully when developing your PCB layout.
The VCC line should be decoupled close to the USIM
socket.
USIM is specified to run up to 5 MHz (USIM clock rate).
Take note of this speed in the placement and routing of the
USIM signals and connectors.
You must decide if, and how much, additional ESD
protection and series resistors are suitable for your product.
The MC87xx already includes additional ESD protection.
Adding more protection (additional circuits) than is
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
•
•
•
•
necessary could decrease signal rise time, increase load
impedance, and cause USIM certification failure.
Putting an optional decoupling capacitor at XIM_VCC near
the USIM socket is recommended—the longer the trace
length (impedance) from the socket to the module, the
greater the capacitance requirement to meet compliance
tests.
Putting an optional series capacitor and resistor termination
(to ground) at XIM_CLK at the USIM socket to reduce EMI
and increase signal integrity is recommended if the trace
length between the USIM socket and module is long—47 pF
and 50 Ω resistor are recommended.
Protect the USIM socket to make sure that the USIM cannot
be removed while the module / host device is powered up.
For example, you could place the socket under the battery
(for portable devices); consider similar options for other
device types.
Test your first prototype host hardware with a Comprion
IT3 USIM test device at a suitable testing facility.
Extended AT commands
Several proprietary AT commands are available for the
MC57xx and MC87xx to use in hardware integration design
and testing (these commands are NOT intended for use by end
users). Refer to CDMA Extended AT Command Reference
(Document 2130621) for the MC57xx, or MC87xx Modem
Extended AT Command Reference (Document 2130616) for the
MC87xx for a list of all available commands and descriptions
of their functionality.
Some useful commands for use in hardware integration are
listed in Table 5‐4 (MC57xx) and Table 5‐5 (MC87xx).
Table 5-4: MC57xx Extended AT commands
Command
Description
Internal commands
!OEM
Unlocks OEM protected commands
Modem state commands
!DIAG
Sets diagnostic mode
!BOOTHOLD
Resets modem and waits in boot loader
RF AT commands
!CHAN
68
Sets RF band and channel
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Host / Module Interfaces
Table 5-4: MC57xx Extended AT commands (Continued)
Command
Description
!RX
Turns on / off the first receiver
!RX2
Turns on / off the second receiver
!RXAGC
Reads Rx AGC
!RX2AGC
Reads second Rx AGC
!TX
Enables Tx chain
!TXAGC
Sets Tx AGC
!KEYON
Turns on transmitter
!KEYOFF
Turns off transmitter
!ALLUP
Turns on transmitter in all ups condition
Provisioning commands
!CARRIERID
Displays the carrier ID
CDMA commands
!STATUS
Displays the status of the modem
!SCI
Gets slot cycle index
Power control commands
!PCSTATE
Power control state
!PCINFO
Reads the power control information
!PCTEMP
Reads the power control temperature
!PCVOLT
Reads the power control voltage
Table 5-5: MC87xx Extended AT commands
Command
Description
Password commands
Rev 1.9.1 Feb.09
!ENTERCND
Enables access to password-protected
commands
!SETCND
Sets AT command password
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 5-5: MC87xx Extended AT commands (Continued)
Command
Description
Modem reset and status commands
!DTEMP
Returns the temperature of the PA (Power
Amplifier) used by the:
• UMTS transceiver, or
• GSM transceiver
!GRESET
Resets the modem
!GSTATUS
Returns the operation status of the modem (mode,
band, channel, and so on)
Diagnostic commands
!BAND
Selects a set of frequency bands or reports
current selection
!GBAND
Reads / sets the current operating band
Test commands
!DAFTMACT
Puts the modem into FTM (Factory Test Mode)
(password protected)
!DAFTMDEACT
Puts the modem into online mode
(password-protected)
(password-protected)
Returns the RSSI (Received Signal Strength
Indicator) in dBm (GSM mode)
!DAGGRSSIRAW
Returns the raw RSSI (GSM mode)
!DAGGRSSI
(password-protected)
!DAGSLOCK
Returns the RF synthesizer lock state
(password-protected)
!DAGSRXBURST
Sets the GSM receiver to burst mode
(password-protected)
!DAGSRXCONT
Sets the GSM receiver continually on
(password-protected)
!DAGSTXFRAME
Sets the GSM Tx frame structure
(password-protected)
!DASBAND
Sets the frequency band (UMTS / GSM)
(password-protected)
(password-protected)
Sets the modem channel (frequency) (UMTS /
GSM)
!DASLNAGAIN
Sets the LNA (Low Noise Amplifier) gain state
!DASCHAN
(password-protected)
!DASPDM
Sets the PDM (Pulse Duration Modulation) value
(password-protected)
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Host / Module Interfaces
Table 5-5: MC87xx Extended AT commands (Continued)
Command
!DASTXOFF
Description
Turns off the Tx PA (Power Amplifier)
(password-protected)
!DASTXON
Turns on the Tx PA (Power Amplifier)
(password-protected)
!DAWGRXAGC
(password-protected)
Returns the Rx AGC (Automatic Gain Control)
value (UMTS)
(password-protected)
Sets the UMTS receiver to factory calibration
settings
!DAWGCTON
Returns the Carrier to Noise ratio (WCDMA)
!DAWSCONFIGRX
(password-protected)
!DAWSPARANGE
Sets the PA range state machine (UMTS)
(password-protected)
!DAWSTXCW
(password-protected)
!OSDSM
(password-protected)
Rev 1.9.1 Feb.09
Sets the waveform used by the transmitter
(UMTS)
Displays memory usage for DSM (Distributed
Shared Memory) buffer pools
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
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6
6: Thermal Considerations
This chapter describes the thermal characteristics of the
module and provides suggestions for testing and addressing
thermal issues.
Thermal considerations
Mini Cards can generate significant amounts of heat that must
be dissipated in the host device for safety and performance
reasons.
The amount of thermal dissipation required depends on the
following factors:
• Supply voltage — Maximum power dissipation for these
modules can be up to 3.1 W at voltage supply limits.
• Usage — Typical power dissipation values depend on the
location within the host, amount of data transferred, etc.
Specific areas requiring heat dissipation include the four shield
cases indicated in Figure 6‐1.
• Transmitter—top shield (next to RF connectors). This is
likely to be the hottest area.
• Baseband 1—bottom shield, below the transmitter
• Receiver—top shield, other side of module from the trans‐
mitter
• Baseband 2—bottom shield, below the receiver
You can enhance heat dissipation by:
• Maximizing airflow over / around the module
• Locating the module away from other hot components
Note: Adequate dissipation of heat is necessary to ensure that the
module functions properly, and to comply with the thermal requirements in PCI Express Mini Card Electromechanical Specification
Revision 1.1.
Module testing
When testing your integration design:
• Test to your worst case operating environment conditions
(temperature and voltage)
• Test using worst case operation (transmitter on 100% duty
cycle, maximum power)
• Monitor temperature at all shield locations. Attach thermo‐
couples to each shield indicated below
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Figure 6-1: Shield locations
Note: Make sure that your system design provides sufficient cooling
for the module. The RF shield temperature should be kept below
90 °C when integrated to prevent damage to the module’s components.
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7
7: Design Checklist
This chapter provides a summary of the design considerations
mentioned throughout this guide. This includes items relating
to the power interface, RF integration, thermal considerations,
cabling issues, and so on.
Note: This is NOT an exhaustive list of design considerations. It is
expected that you will employ good design practices and engineering
principles in your integration.
Table 7-1: Hardware integration design considerations
Suggestion
Section where discussed
Component placement
Protect the USIM socket so that the USIM cannot be removed
while the host is powered up.
USIM operation
If an ESD suppressor is not used, allow space on the USIM
connector for series resistors in layout (up to 100 Ω may be used
depending on ESD testing requirements).
USIM operation
Minimize RF cable losses as these affect the performance values
listed in the product specification document.
RF connection
page 67
page 67
page 39
Antennas
Match the module / antenna coax connections to 50 Ω —
mismatched antenna impedance and cable loss negatively
affects RF performance.
RF connection
If installing both the MC57xx and MC87xx in the same device,
consider using separate antennas for maximum performance.
Antenna and cabling
page 39
page 40
Power
Limit host power rail dips caused by module inrush current by
adding sufficient capacitance to the host power rail.
Inrush currents
Make sure the power supply can handle the maximum current
specified for the module type.
Current consumption overview
Limit the total impedance of VCC and GND connections to the
USIM at the connector to less than 1 Ω (including any trace
impedance and lumped element components — inductors,
filters, etc.). All other lines must have a trace impedance less
than 2 Ω.
USIM operation
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 7-1: Hardware integration design considerations (Continued)
Suggestion
Section where discussed
Decouple the VCC line close to the USIM socket. The longer the
trace length (impedance) from socket to module, the greater the
capacitance requirement to meet compliance tests.
USIM operation
page 67
EMI / ESD
Investigate sources of localized interference early in the design
cycle.
Methods to mitigate decreased
Rx performance
page 42
Provide ESD protection for the USIM connector at the exposed
USIM operation
contact point (in particular, the CLK, VCC, IO, and RESET lines). page 67
Keep very low capacitance traces on the XIM_DATA and
XIM_CLK signals.
To minimize noise leakage, establish a very good ground
connection between the module and host.
Ground connection
Route cables away from noise sources (for example, power
supplies, LCD assemblies, etc.).
Methods to mitigate decreased
Rx performance
page 39
page 42
Shield high RF-emitting components of the host device (for
example, main processor, parallel bus, etc.).
Methods to mitigate decreased
Rx performance
page 42
Use discrete filtering on low frequency lines to filter out unwanted
high-order harmonic energy.
Methods to mitigate decreased
Rx performance
page 42
Use multi-layer PCBs to form shielding layers around high-speed
clock traces.
Methods to mitigate decreased
Rx performance
page 42
Thermal
Test to worst case operating conditions — temperature, voltage,
and operation mode (transmitter on 100% duty cycle, maximum
power).
Thermal considerations
Use appropriate techniques to reduce module temperatures.
(airflow, heat sinks, heat-relief tape, module placement, etc.)
Thermal considerations
page 73
page 73
Host / Modem communication
76
Make sure the host USB driver supports remote wakeup,
resume, and suspend operations, and serial port emulation.
USB handshaking
When no valid data is being sent, do not send SOF tokens from
the host (causes unnecessary power consumption).
USB handshaking
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8
8: Testing
Note: All Sierra Wireless embedded modules are factory-tested to
ensure they conform to published product specifications.
Developers of OEM devices integrating Sierra Wireless
modules should include a series of test phases in their
manufacturing process to make sure that their devices work
properly with the embedded modules.
Suggested phases include:
• Acceptance testing—testing of modules when they are
received from Sierra Wireless
• Certification testing—testing of completed devices to obtain
required certifications before beginning mass production
• Production testing—testing of completed devices with the
modules embedded
• Quality assurance testing—post‐production
AT command entry timing requirement
Some commands require time to process before additional
commands are entered. For example, the modem will return
“OK” when it receives AT!DAFTMACT. If AT!DASBAND is
received too soon after this, the modem will return an error.
When building automated test scripts, ensure that sufficient
delays are embedded where necessary to avoid these errors.
Acceptance testing
Note: Acceptance testing is
typically performed for each
shipment received.
When you receive a shipment from Sierra Wireless, you should
make sure it is suitable before beginning production.
From a random sampling of units, test that:
• The units are operational
• The units are loaded with the correct firmware version
Test requirements
To perform the suggested tests, you require a test system in
which to temporarily install the module, and you must be able
to observe the test device’s LED indicator.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Test procedure
The following is a suggested acceptance testing procedure
using Sierra Wireless’ Watcher software:
Note: You can perform these
tests using appropriate AT
commands.
Test 1: Check power-up and initialization
1.
After installing the module, start the test system.
2.
Launch Watcher.
3.
Check the LED—if the LED is off, there is a problem with
the module or with the connection to the LED.
Test 2: Check version numbers
1.
From Watcher, select Help > About.
2.
Verify that the firmware version in the About window is
correct.
3.
Close the About window.
If the module fails either of these tests, or is not recognized by
Watcher:
1.
Replace the module with one that is known to work
correctly and repeat the tests.
2.
If the tests are successful, reinstall the original module and
repeat the tests.
If the module still does not work correctly, contact your
account manager.
Certification testing
Note: Typically, you need to
pass certification testing of your
device with the integrated
module one time only.
When you produce a host device with an embedded Sierra
Wireless module, you must obtain certifications for the final
product from appropriate regulatory bodies in the jurisdic‐
tions where it will be distributed.
Note: The module itself (MC57xx, MC87xx) has been certified
already—only the integrated device needs certification.
The following are some of the regulatory bodies from which
you may require certification—it is your responsibility to make
sure that you obtain all necessary certifications for your
product from these or other groups:
• FCC (Federal Communications Commission—www.fcc.gov)
• Industry Canada (www.ic.gc.ca)
• CSA (Canadian Standards Association—www.csa.ca)
• Factory Mutual (FM Global—www.allendale.com)
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Testing
• Underwriters Laboratories Inc. (www.ul.com)
• (MC57xx only) CDG (CDMA Development Group—
www.cdg.org)
• (MC87xx only) GCF (Global Certification Forum—
gcf.gsm.org) outside of North America
• (MC87xx only) PTCRB (PCS Type Certification Review
Board—www.ptcrb.com) in North America
Production testing
Note: Production testing
typically continues for the life of
the product.
Each assembled device should be tested to make sure the
module is installed correctly and is functioning within normal
operating parameters.
Note: All Sierra Wireless embedded modules are fully factory-tested
to ensure they conform to published product specifications.
In general, production testing ensures that the module is
installed correctly (I/O signals are passed between the host and
module), and the antenna is connected and performing to
specifications (RF tests).
Typical items to test include host connectivity, the RF assembly
(Tx and/or Rx, as appropriate), and the audio assembly (for
voice‐enabled modules).
Note: The amount and types of tests to perform are your decision—
the tests listed in this section are guidelines only. Make sure that the
tests you perform exercise functionality to the degree that your
situation requires—this may include, for example, testing network
availability, any host device configuration issues, baseband testing
(GPIO / Audio, host / module connectors) and appropriate RF testing
(Tx and/or Rx).
Use an appropriate test station for your testing environment
(see Test requirements on page 77 for suggestions) and use AT
commands to control the integrated module.
Note: Your test location must be protected from ESD to avoid interference with the module and antenna(s) (assuming that your test
computer is in a disassembled state).
Also, consider using an RF shielding box as shown in the suggested
test equipment—local government regulations may prohibit
unauthorized transmissions.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Suggested manual functional
test procedure
This section presents a procedure for performing a basic
manual functional test on a laboratory bench using the Mini
Card and a Mini Card Dev Kit. When you have become
familiar with the testing method, use it to develop your own
automated production testing procedures.
Suggested tests
Consider the following tests when you design your production
test procedures for devices with the MC57xx and/or MC87xx
installed.
• Visual check of the module’s connectors, RF assemblies, and
audio assemblies (if applicable)
• Module is operational
• USB connection is functional
• LED is functional
• W_Disable# (module power down)
• Firmware revision check
• Rx tests on main and auxiliary paths
• Tx test
• Audio (microphone and speaker) tests (for voice‐enabled
modules)
Suggested test plan procedure
Note: The following is a suggested outline for a relatively comprehensive test plan—you must decide which tests are appropriate for
your product.
This is not an exhaustive list of tests—you may wish to add additional
tests that more fully exercise the capabilities of your product.
Note: You may choose to create and run a test program that
automates portions of the test procedure.
Using an appropriate Dev Kit‐based test station (a suggested
setup is described in Suggested testing equipment on page 97),
and referring to the appropriate standard and extended AT
command references:
1.
80
Visually inspect the module’s connectors and RF assem‐
blies for obvious defects before installing it in the test
station.
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Testing
Note: To power-off the module,
drive W_Disable# low for the
required minimum period. See
State change: Power off / on on
page 23 for details.
2.
Ensure that the module is turned off before beginning
your tests (set W_Disable# low).
3.
If using Linux, determine if any USB devices are currently
connected to the computer:
a.
Open a shell window and enter the command ls /dev/
tty/USB*.
b.
Record the ttyUSBn values that are returned; these are
the currently connected USB devices. If the command
returns “no such file or directory”, there are no devices
currently connected.
Test W_Disable#—Turn on the module by letting
W_Disable# float (high impedance). Depending on your
device, this may just require powering up the device. Refer
to the PCI Express Mini Card Dev Kit Quick Start Guide
(Document 2130705) for more details.
4.
5.
·
Test USB functionality—Check for USB enumeration.
(Windows systems) The Device Manager shows Sierra
Wireless items under the Ports ‐ (COM & LPT) entry. The
devices shown depend on the module type. For
example:
· MC87xx
· MC57xx
·
Rev 1.9.1 Feb.09
(Linux systems) Enter the command ls /dev/tty/USB* and
then record and compare the results with those from
Step 3. If there are any new ttyUSBn devices, then the
modem has enumerated successfully. (There should be
three or seven new devices, depending on the module
type.) For example:
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
· MC5725 / MC5725V / MC8775 / MC8775V / MC8780 /
MC8781 (with no other USB devices connected):
(The AT port is the third new enumerated device — /
dev/ttyUSB2.)
· MC5727 / MC5727V /MC5728V/ MC8785V / MC8790 /
MC8790V / MC8791V / MC8792V (with one other USB
device already connected and assigned to ttyUSB1):
(The AT port is the fourth new enumerated device — /
dev/ttyUSB4.)
6.
Some modules cause a Sierra Wireless Network Adapter to
appear in Device Manager, as shown below. Disable the
adapter to allow entry of AT commands when performing
diagnostic tests.
a.
Right‐click the Sierra Wireless Network Adapter to
display the context menu.
b.
Click Disable.
MC57xx
7.
Make sure your modem is connected and running, and
then establish contact with the module:
(Windows systems)
Use a terminal emulation / communications program such
as Microsoft HyperTerminal® to connect over the COM
port reserved for AT commands (see listings in Step 5):
82
a.
Start HyperTerminal.
b.
On the File menu, select Connection Description. The
Connection Description dialog box appears.
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Testing
Note: If necessary, use AT E1 to
enable echo.
c.
Type “Sierra” in the Name box and click OK. The
Connect To dialog box appears.
d.
Click OK without changing any of the displayed infor‐
mation. The Connect dialog box appears.
e.
Click Cancel.
f.
Type ATZ in the HyperTerminal window. If the
connection is established, the message OK appears.
(Linux systems)
Use a terminal emulation / communications program such
as minicom to connect over the device handle for AT com‐
mands (see listings in Step 5):
a.
Note: If the command “minicom”
is not found, then use a different
program, or download minicom
and repeat this step. See
“Downloading and configuring
minicom for Linux systems” on
page 84 for details.
Start minicom:
· First use of the modem: From the command line, type
minicom ‐s. ‐‐ always shows configuration menu
· Subsequent uses: From the command line, type
minicom.
The minicom configuration details appear and the
message OK appears when the connection is estab‐
lished.
8.
·
·
Display the firmware version using this command:
MC57xx: AT+GMR
MC87xx: AT!GVER
Example response:
·
p2005000,0 [Aug 09, 2006 14:28:24],, VID: PID:
Characters 5–6 are the firmware version (50 in this exam‐
ple).
9.
Test the LED—Set the LED in blinking mode using this
command, then visually verify that the LED turns off and
on:
· MC57xx: AT!LED=0,1
· MC87xx: AT!DLED or AT!LEDCTRL
10. Unlock the extended AT command set, using:
· MC57xx: AT!OEM=176
· MC87xx: AT!ENTERCND
Rev 1.9.1 Feb.09
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
11. Put the module in diagnostic / factory test mode using:
· MC57xx: AT!DIAG
· MC87xx: AT!DAFTMACT
12. (MC87xx only) Communicate with the USIM using +CPIN
or +CIMI.
13. Test RF transmission, if desired:
· MC57xx—See Testing RF transmission path—MC57xx
on page 85.
· MC87xx—See Testing RF transmission path—MC87xx
on page 86.
Note: When performing RF
tests, use a test platform similar
to those shown in Figure 8-2
(page 98) and Figure 8-3
(page 99).
14. Test RF reception, if desired:
· MC57xx—See Testing RF Receive path—MC57xx on
page 88.
· MC87xx— See Testing RF Receive path—MC87xx on
page 90.
Note: The GPS receiver does
not need to be tested for UMTS
(MC878x) or CDMA (MC57xx)
modules supporting diversity
because RF connectivity is
validated by testing the diversity
receiver in Step 14.
15. (MC8775V only) Test the GPS receiver, if desired. See
Testing GPS Receiver—MC8775V on page 93.
16. Test Audio loop‐back. See Test Audio Loop‐back—
MC5725V / MC5727V / MC5728V / MC8775V / MC8785V /
MC8790V / MC8791V / MC8792V on page 94.
17. Finish testing
Note: To power-off the module,
drive W_Disable# low for the
required minimum period. See
State change: Power off / on on
page 23 for details.
a.
If the network adapter was disabled in Step 6, re‐
enable it (same instructions, except click Enable
instead of Disable).
b.
Set the W_Disable# signal low and confirm that the
module powers down:
· Windows systems — The Sierra Wireless items under
the Ports (COM & LPT) entry in Device Manager
disappear as the module powers off.
· Linux systems — Enter the command ls /dev/tty/USB*.
The devices enumerated in Step 5 will not appear after
the module powers off.
Downloading and configuring minicom for Linux systems
Note: This procedure is for Ubuntu systems. If you are using a
different Linux distribution, use the appropriate commands for your
system to download minicom.
To download and configure minicom in a Ubuntu system:
Note: To install minicom, you
must have root access, or be
included in the sudoers list.
84
1.
Download and install minicom — enter the following
command:
sudo apt-get install minicom
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Testing
2.
When prompted, enter your user password to begin the
download and installation. When minicom is installed, the
shell prompt appears.
3.
Configure minicom to communicate with your modem:
a.
Start minicom with the following command:
minicom -s
4.
Use the down‐arrow key to select the “Serial port setup”
option.
5.
Refer to Step 5 on page 81 to identify the device file handle
(/dev/ttyUSBn) to use for AT commands.
6.
Indicate the file handle to use for AT commands — enter A
and then replace the serial device string with the AT file
handle (for example, /dev/ttyUSB4 for an MC8792V as
shown in the example in Step 5 on page 81).
7.
Press Enter twice.
8.
Use the down‐arrow key to select Save setup as dfl.
9.
Select Exit.
Testing RF transmission path—MC57xx
Note: This procedure segment is performed in Step 13 of the
Suggested test plan procedure (page 84).
To test the DUT’s transmitter path:
Note: This procedure describes
steps using the "Power Meter:
Gigatronics 8651A” (with Option
12 and Power Sensor 80701A).
Rev 1.9.1 Feb.09
1.
Set up the power meter:
a.
Make sure the meter has been given sufficient time to
warm up, if necessary, to enable it to take accurate
measurements.
b.
Zero‐calibrate the meter.
c.
Enable MAP mode.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Note: These AT commands
generate a modulated test
signal.
2.
Prepare the DUT using the following AT commands:
a.
AT!OEM=176
(Unlocks the extended AT command
set)
b.
AT!DIAG
c.
AT!CHAN=600,1 (PCS band, channel 600)
(Set modem in diagnostic mode)
or
AT!CHAN=384,0 (Cellular band, channel 384)
The power meter should read ‐100 dBm, indicating no
signal.
3.
d.
AT!TX=1
e.
AT!ALLUP=1
f.
AT!TX=0
(Turns on transmitter)
(Enables all ups condition)
The power meter should read from 0–24 dBm,
depending on your setup.
(Turns off transmitter)
Test limits:
Run ten or more good DUTs through this test proce‐
dure to obtain a nominal output power value.
· Apply a tolerance of ±5 to 6 dB to each measurement
(assuming a good setup design).
· Monitor these limits during mass‐production ramp‐up
to determine if further adjustments are needed.
Note: The MC57xx has a nominal output power of +24 dBm ±1 dB.
However, the value measured by the power meter depends on the
test setup (RF cable loss, couplers, splitters) and the DUT design.
Note: When doing the same test over the air in an RF chamber,
values are likely to be significantly lower.
Testing RF transmission path—MC87xx
Note: This procedure segment is performed in Step 13 of the
Suggested test plan procedure (page 84).
Table 8‐1 contains parameters used in the suggested test
procedure that follows.
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Testing
Table 8-1: Test settings for MC87xx transmission path testing
Bands
Mode
WCDMA
GSM
Test category
850
900
1800
1900
2100
Band
22
29
15
Channel
4182
2812
9400
9750
Band
18
10
11
12
Channel
190
65
697
661
To test the DUT’s transmitter path:
Note: This procedure describes
steps using the "Power Meter:
Gigatronics 8651A” (with Option
12 and Power Sensor 80701A).
1.
2.
Set up the power meter:
a.
Make sure the meter has been given sufficient time to
warm up, if necessary, to enable it to take accurate
measurements.
b.
Zero‐calibrate the meter.
c.
Enable MAP mode.
Prepare the DUT using the following AT commands:
a.
AT!UNLOCK=””
(Unlocks extended AT
command set)
or
AT!ENTERCND
b.
c.
AT!DAFTMACT
(Enters test mode)
AT!DASBAND=
· See Table 8‐1 for appropriate  values
d.
AT!DASCHAN=
· See Table 8‐1 for appropriate  values
e.
(GSM mode only)
AT!DAGSTXFRAME=0, 1, 3000, 0
Rev 1.9.1 Feb.09
f.
AT!DASTXON
g.
(WCDMA mode only)
AT!DAWSTXCW=0
(Use a modulated carrier)
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
3.
h.
(WCDMA mode only)
AT!DASPDM=2, 455
(Set the power level, tunable
from 0 to 511)
i.
(WCDMA mode only)
AT!DAWSPARANGE=3(Set to high PA gain state)
j.
Take the measurement.
k.
AT!DASTXOFF
(Turns off the transmitter)
Test limits:
Run ten or more good DUTs through this test proce‐
dure to obtain a nominal output power value.
· Apply a tolerance of ±5 to 6 dB to each measurement
(assuming a good setup design).
· Monitor these limits during mass‐production ramp‐up
to determine if further adjustments are needed.
· For GSM mode, the transmit signal is bursted, so the
transmit power will appear averaged on the power
meter reading.
Note: The MC87xx has a nominal output power of +23 dBm ±1 dB in
WCDMA mode. However, the value measured by the power meter is
significantly influenced (beyond the stated ±1 dB output power
tolerance) by the test setup (host RF cabling loss, antenna efficiency
and pattern, test antenna efficiency and pattern, and choice of shield
box).
Note: When doing the same test over the air in an RF chamber,
values are likely to be significantly lower.
Testing RF Receive path—MC57xx
Note: This procedure segment is performed in Step 14 of the
Suggested test plan procedure (page 84).
To test the DUT’s receive path:
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Testing
Note: This procedure describes
steps using the Agilent 8648C
signal generator—the Rohde &
Schwarz SML03 is shown for
reference only.
1.
Note: This example setup uses
a 200 kHz offset from band
center for testing using a
continuous wave—you can use
any appropriate baseband
frequency offset (for example,
100 kHz, 300 kHz, etc.).
If using a modulated signal, set
the frequency to band center
with no offset.
2.
Set up the signal generator:
a.
Press the Frequency button to set the frequency to
1960.200 MHz for PCS band, Channel 600, or
881.720 MHz for Cellular band, Channel 384
b.
Press the Amplitude button to set the amplitude to
‐55.0 dBm.
c.
Press the RF ON/OFF button to enable or disable the
RF port of the signal generator.
Read back the power level from the main receiver:
a.
AT!OEM=176 (Unlocks the extended AT command set)
b.
AT!DIAG (Sets the modem in Diagnostic mode)
c.
AT!CHAN=600,1 (PCS band, channel 600)
or
AT!CHAN=384,0 (Cellular band, channel 384)
d.
AT!RX=1 (Turns on the main receiver)
e.
AT!RXAGC? (Reads back the power level, in dBm, from
the main receiver)
Response examples:
· RXAGC = 0xFFFFFF33 = ‐77 dBm (when signal
generator’s RF port is OFF)
· RXAGC = 0x0021 = ‐60 dBm (when signal generator’s
RF port is ON) typical
Note: The dBm value displayed is calculated to reflect the power at
the input connector.
f.
Rev 1.9.1 Feb.09
AT!RX2=1 (Turns on diversity receiver)
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
AT!RX2AGC? (Reads back the power level, in dBm,
from the diversity receiver)
Response examples:
· RX2AGC = 0xFFFFFF76 = ‐84 dBm (when signal
generator’s RF port is OFF)
· RX2AGC = 0xFFFFFFC6 = ‐69 dBm (when signal
generator’s RF port is ON) typical
h. AT!RX=0 (Turns off main receiver)
g.
i.
3.
AT!RX2=0 (Turns off diversity receiver)
Test limits
Run ten or more good DUTs through this test proce‐
dure to obtain a nominal received power value.
· Apply a tolerance of ±5 to 6 dB to each measurement
(assuming a good setup design).
· Make sure the measurement is made at a high enough
level that it is not influenced by DUT‐generated and
ambient noise.
· The Signal Generator power level should be at least
‐50 dBm.
· Monitor these limits during mass‐production ramp‐up
to determine if further adjustments are needed.
Note: The value measured by the DUT depends on the test setup and
DUT design. Host RF cabling loss, antenna efficiency and pattern,
test antenna efficiency and pattern, and choice of shield box all significantly influence the measurement.
Note: When doing the same test over the air in an RF chamber,
values are likely to be significantly lower.
Testing RF Receive path—MC87xx
Note: This procedure segment is performed in Step 14 of the
Suggested test plan procedure (page 84).
Table 8‐2 contains parameters used in the suggested test
procedure that follows.
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Testing
Table 8-2: Test settings for MC87xx Receive path testing
Bands
Mode
WCDMA
GSM
Test category
850
900
1800
1900
2100
Frequency1 (MHz)
882.60
948.60
1961.2
2141.2
Band
22
29
15
Channel
4182
2812
9400
9750
Frequency2 (MHz)
881.667 948.067 1842.267
1960.067
Band
18
10
11
12
Channel
190
65
697
661
1 All values offset from actual center channel by +1.2 MHz
2 All values offset from actual center channel by +67 kHz
To test the DUT’s receive path:
Note: This procedure describes
steps using the Agilent 8648C
signal generator—the Rohde &
Schwarz SML03 is shown for
reference only.
1.
Set up the signal generator:
Set the amplitude to:
· ‐80 dBm (WCDMA mode)
· ‐60 dBm (GSM mode)
b. Set the frequency for the band being tested. See
Table 8‐2 for frequency values.
a.
2.
Set up the DUT:
a.
b.
c.
AT!UNLOCK=”” or AT!ENTERCND
AT!DAFTMACT
AT!DASBAND=
· See Table 8‐2 for  values
d.
Rev 1.9.1 Feb.09
AT!DASCHAN=
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
· See Table 8‐2 for  values
e.
AT!DASLNAGAIN=0 (sets the LNA to maximum gain)
f.
(WCDMA mode)
i. AT!DAWGAVGAGC=9400,0 (for PCS1900, channel
9400 as an example)
(GSM mode)
i. AT!DAGSRXBURST=0 (set to receive bursted mode)
ii. AT!DAGGAVGRSSI=190,0 (for channel 190, for
example)
The returned value is the RSSI in dBm.
3.
Test limits:
Run ten or more good DUTs through this test proce‐
dure to obtain a nominal received power value.
· Apply a tolerance of ±5 to 6 dB to each measurement
(assuming a good setup design).
· Make sure the measurement is made at a high enough
level that it is not influenced by DUT‐generated and
ambient noise.
· The Signal Generator power level can be adjusted and
new limits found if the radiated test needs greater
signal strength.
· Monitor these limits during mass‐production ramp‐up
to determine if further adjustments are needed.
Note: The value measured from the DUT is significantly influenced by
the test setup and DUT design (host RF cabling loss, antenna
efficiency and pattern, test antenna efficiency and pattern, and choice
of shield box).
Note: Diversity is not available in
GSM mode.
Note: Setup of the DUT is the
same as in Step 2, except for a
change to AT!DAWGAVGAGC
and the addition of
AT!DAWSSCHAIN.
4.
Test diversity paths for the MC8780 (WCDMA 850 /
WCDMA 2100), MC8781 (WCDMA 850 / WCDMA 1900),
or MC8785V / MC8790 / MC8790V (WCDMA 850 /
WCDMA 1900 / WCDMA 2100):
a.
Set up the signal generator as in Step 1.
b.
Set up the DUT:
i. AT!UNLOCK=”” or AT!ENTERCND
ii. AT!DAFTMACT
iii. AT!DASBAND=
· See Table 8‐2 for  values
iv. AT!DAWSSCHAIN=1 (enables the secondary chain)
v. AT!DASCHAN=
· See Table 8‐2 for  values
vi. AT!DASLNAGAIN=0 (sets the LNA to maximum gain)
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Testing
vii.AT!DAWGAVGAGC=9400,0,1 (the ‘1’ indicates the
diversity path is used)
c.
Test the limits as in Step 3.
Testing GPS Receiver—MC8775V
Note: The GPS receiver does not need to be tested for UMTS
(MC878x) or CDMA (MC57xx) modules supporting diversity because
RF connectivity is validated by testing the diversity receiver in Step 14
of the Suggested test plan procedure (page 84).
Note: This procedure segment is performed in Step 15 of the
Suggested test plan procedure (page 84).
To test the carrier‐to‐noise level for the GPS receive path:
Note: This procedure describes
steps using the Agilent 8648C
signal generator—the Rohde &
Schwarz SML03 is shown for
reference only.
1.
2.
Set up the signal generator:
a.
Set the amplitude to ‐110 dBm.
b.
Set the frequency to 1575.52 MHz. This is100 kHz
above the center frequency for GPS and is needed to
accurately measure the carrier‐to‐noise (C/N) level.
Set up the DUT using the following commands:
a. AT!UNLOCK=””
b. AT!DAFTMACT (Puts modem into factory test mode)
c.
AT!DAAGCTON (Queries power difference between
carrier signal and receiver)
3.
Rev 1.9.1 Feb.09
Test limits:
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Run ten or more good DUTs through this test proce‐
dure to obtain averaged C/N readings.
· The GPS receiver responds to signal levels from
‐130 dBm to ‐80 dBm.
· Measure C/N five times for each DUT to obtain an
average reading at ‐110 dB.
· Make sure the C/N is less than 15 dB when the signal
generator is off.
· Allow for ±5 dB of C/N variation to identify any
problems in the GPS receive path.
Test Audio Loop-back—MC5725V /
MC5727V / MC5728V / MC8775V /
MC8785V / MC8790V / MC8791V /
MC8792V
Note: This procedure segment is performed in Step 16 of the
Suggested test plan procedure (page 84).
The microphone and speaker audio paths for voice‐enable
modules can be tested by using an audio quantity that is suited
to identify known assembly issues, and applying limits to
detect any problems.
To test the audio paths:
Note: This procedure describes
steps using the Keithley Audio
Analyzing DMM, 2016-P.
1.
Set up the audio analyzer to generate a constant tone:
a.
Connect a BNC cable to the “Source Output” port at
the rear panel.
b.
Press the Source button on the front panel to set the
generator to:
· Ampl = 0.20 V
· Impedance = 50 Ω
· Freq = 1.000 kHz
If using a Sierra Wireless Mini Card Dev Kit, connect
the signals as follows:
c.
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Testing
i. Connect the generator output signal to the MIC1_P
(positive) and MIC1_N (negative) header pins
located at CN18 on the Dev Kit.
ii. Connect the analyzer input signal to the SPK1_P
(positive) and SPK1_N (negative) header pins located
at CN18 on the Dev Kit (see Figure 8‐1). For
additional details concerning use of the Dev Kit, see
the PCI Express Mini Card Dev Kit Quick Start Guide
(Document 2130705).
d.
If using a custom host platform:
i. Connect the generator output to the microphone
input (MIC, positive and negative) in the host.
ii. Connect the analyzer input to the Speaker output
(SPK, positive and negative) in the host.
Figure 8-1: Mini Card Dev Kit showing MIC / SPK pins.
2.
Set up the DUT using the following commands:
(MC5725V / MC5727V / MC5728V)
a.
AT!OEM=176
(Unlocks the extended AT command
set)
b.
AT!DIAG
c.
AT!AVAUDIOLPBK=1 (Enables audio loop‐back mode)
d.
AT!CODECGAIN=8000,8000,8000 (Sets codec gains in
the loopback path to +6 dB (Tx), +6 dB (Rx) and ‐6dB
(SideTone).)
· Total loopback gain = Σ(codec gains) ‐ 2 dB
· For this example, total loopback gain = +4 dB
(Sets modem in Diagnostic mode)
(MC8775V / MC8785V / MC8790V / MC8791V / MC8792V)
a.
AT!UNLOCK=””
(Unlocks extended AT
command set)
b.
Rev 1.9.1 Feb.09
AT!AVSETDEV=0,0,0
(Unmutes speaker and
microphone for audio profile 0)
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
c.
AT!AVCODECSTG=0,FFFF
(Sets sidetone gain for
audio profile 0)
3.
Take measurements using the following commands (Note
that the module has a gain of 4 dB in audio loopback
mode.)
Press the ACV button to measure the AC level.
· Expected range: 1–2.5 VAC
b. Press the FREQ button to measure the frequency.
· Expected value: 1 kHz
c. Press the Shift and THD buttons at the same time to
measure the total harmonic distortion.
· Expected value: < 1%
d. Reset the audio parameters:
· (MC5725V / MC5727V / MC5728V)
AT!AVAUDIOLPBK=0
(Disables audio loop‐back
mode)
· (MC8775V / MC8785V / MC8790V / MC8791V /
MC8792V)
AT!AVDEF
(Sets configurable audio
parameters to default values)
a.
Note: Actual measured results
will vary, depending on your
testing setup.
Quality assurance testing
Note: QA is an ongoing process
based on random samples from
a finished batch of devices.
The quality assurance tests that you perform on your finished
products should be designed to verify the performance and
quality of your devices.
The following are some testing suggestions that can confirm
that the antenna is interfaced properly, and the RF module is
calibrated and performs to specifications:
• Module registration on cellular networks
• Power consumption
• Originate and terminate data and voice (if applicable) calls
• Cell hand‐off
• Transmitter and receiver tests
• FER (Frame Error Rate) as an indicator of receiver sensi‐
tivity / performance
• Channel and average power measurements to verify that
the device is transmitting within product specifications
• RF sensitivity tests
• MC57xx‐specific:
· Waveform quality tests (calculating the “rho” parameter)
to compare the CDMA signal’s power distribution
against the ideal distribution—rho must be >0.97 with
max freq error of 0.5 to pass.
· FER testing—test the receiver sensitivity for conditions
of minimum cell power. FER can be measured for the
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Testing
specified receiver sensitivity of ‐104 dBm. The objective
of this test is to determine if the FER measured is within
the acceptable limits for the specified receiver sensitivity
of the module. Unlike the FER tests performed during
production testing, this test determines the receiver
performance without the influence of the noise factor
(AWGN), but with extremely low cell power. The
reported FER and the confidence level must be <1% and
>95% respectively for the test to be considered a pass.
• MC87xx‐specific:
· RF sensitivity testing: BER / BLER for different bands
and modes
· Transmitter and receiver tests (based on relevant sections
of the 3GPP TS51010 and 3GPP 34121 documents)
Suggested testing equipment
To perform production and post‐production tests, you require
appropriate testing equipment.
Figure 8‐2 shows a suggested test station for use with devices
incorporating either the MC57xx or the MC87xx.
In the test station as shown, a test computer coordinates
testing between the host device with an integrated module and
the measurement equipment. If the test computer does not
have direct access to the module, then the host device must
have custom software to forward instructions from the test
computer to the module.
This suggested station setup includes:
• Audio analyzer—to evaluate Tx
• Power meter—to evaluate current consumption for Tx and
Rx in various modes
• Signal generator—to evaluate Rx
When using this setup, you can allow the signal generator to
run continuously throughout the production testing
procedure.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Figure 8-2: Recommended production test setup
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Testing
Figure 8-3: Recommended Dev Kit test setup
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A
A: Antenna Specification
This appendix describes electrical performance criteria for
main path, diversity path, and GPS antennas used with
MC57xx modules (CDMA networks) and MC87xx modules
(GSM / EDGE / UMTS networks).
Required antennas
Table A‐1 lists minimum required antenna types for each
module and the maximum antenna gain, including cable loss,
in a mobile‐only exposure condition.
Note: If your system uses both the MC87xx and MC57xx, the fiveband antenna can be used for both modules. However, improved
antenna performance may be attained if a dual-band main-path
antenna is designed and optimized specifically for the MC57xx.
Table A-1: Required antennas and maximum antenna gain by module type
Antenna type (minimum)
Module
Main
Diversity / GPS
Maximum antenna gain a
Cellular band
(dBi)
PCS band
(dBi)
MC5725
5.1
4.15
MC5725V
5.1
4.15
5.1
4.15
5.1
4.15
MC5728
TBD
TBD
MC5728V
TBD
TBD
MC5727
2-band (Cellular / PCS)
3-band (Cellular / PCS / GPS)
MC5727V
MC8775
N.America: 2-band
(Cellular/PCS)
Eur/Asia: 3-band
World: 5-band
n/a
MC8775V
N.America: 2-band
(Cellular/PCS)
Eur/Asia: 3-band
World: 5-band
1-band (GPS)
MC8780
Eur/Asia: 3-band
3-band (Cellular / IMT / GPS)
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table A-1: Required antennas and maximum antenna gain by module type
Antenna type (minimum)
Module
Main
Maximum antenna gain a
Diversity / GPS
Cellular band
(dBi)
PCS band
(dBi)
MC8781
N.America: 2-band
(Cellular / PCS)
3-band (Cellular / PCS / GPS)
MC8785V
MC8790
MC8790V
MC8791V
MC8792V
N.America: 2-band
(Cellular/PCS)
Eur/Asia: 3-band
World: 5-band
N.America: 3-band (Cell / PCS / GPS)
Eur/Asia: 3-band (Cell / IMT / GPS)
World: 4-band (Cell / IMT / PCS / GPS)
a. Gain limits in this table are as reported on FCC grants for each module, for consideration against RF exposure and ERP / EIRP limits.
Frequency bands
Table A‐2 and Table A‐3 summarize the frequency bands that
must be supported by main, diversity, and GPS antennas for
CDMA and UMTS modules.
Table A-2: Supported frequency bands (CDMA modules)
Module
MC57xx
Band
Cell
PCS
GPS
Antenna
Mode
Frequency
range
Main /
Diversity (Rx)
Tx
824–849
Rx
869–894
Main /
Diversity (Rx)
Tx
1850–1910
Rx
1930–1990
Diversity or separate
GPS antenna
Rx
1574–1576
Table A-3: Supported frequency bands (UMTS modules)
Main antenna
Module
102
850
900
Diversity / GPS antenna
1800
1900
2100
GPS
850
900
1900
MC8775
MC8775V
Ya
MC8780
Yb
MC8781
Yb
MC8785V
Yb
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Antenna Specification
Table A-3: Supported frequency bands (UMTS modules)
Main antenna
Module
850
900
Diversity / GPS antenna
1800
1900
2100
GPS
850
900
1900
2100
MC8790
Yb
MC8790V
Yb
MC8791V
Yb
MC8792V
Yb
a. GPS supported on separate GPS antenna
b. GPS supported on diversity antenna
Table A-4: Supported frequency bands (main / diversity / GPS antennas)
Frequency band
Frequency
range (MHz)
Supported network types
GSM
GPRS
EDGE
UMTS
Main Antenna
850 (North America)
Tx: 824–849
Rx: 869–894
900 (Europe)
Tx: 880–915
Rx: 925–960
1800 (Europe)
Tx: 1710–1785
Rx: 1805–1880
1900 (North America)
Tx: 1850–1910
Rx: 1930–1990
2100 (Europe)
Tx: 1920–1980
Rx: 2110–2170
Diversity / GPS Antenna (if GPS is enabled)
UMTS850 (North America)
Rx: 869-894
UMTS1900 (PCS North America)
Rx: 1930–1990
UMTS2100 (IMT Europe)
Rx: 2110–2170
GPS (Worldwide)
Rx: 1574–1576
Secondary (GPS) Antenna
GPS (Worldwide)
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Antenna design
Design of main path, diversity path, and GPS antennas is
determined by the host device OEM and their designated
antenna designer.
Note: Modems that support diversity and GPS can use the same
secondary (diversity) antenna for both.
Note: Antennas should be designed BEFORE the industrial design is
finished to make sure that the best antennas can be developed.
General antenna design requirements
In addition to passing the specific tests described in Testing
beginning on page 106, the main path and diversity / GPS path
antennas should satisfy the following requirements:
• Antenna impedance at feeding terminal = 50 Ω (A simple
matching circuit with six or fewer components is acceptable
at the feeding terminal.)
• Nominally omni‐directional radiation pattern in the
azimuth plane
Main antenna design requirements
In addition to passing the specific tests described in Testing
beginning on page 106, the main path antenna should satisfy
the following requirements:
• Must handle 2 W RF power on low bands and 1 W on high
bands
Measure the power using the following criteria:
• Measure power endurance over a period of 4 hours
(estimated talk time) using a 2 W CW signal—set the
frequency of the CW test signal to the middle of the PCS Tx
band (1880 MHz for PCS).
• Visual inspection must prove there is no damage to the
antenna structure and matching components.
• VSWR / TIS / TRP measurements taken before and after this
test must show similar results.
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Antenna Specification
Diversity antenna design requirements
(MC57xx / MC8780 / MC8781 / MC8785V /
MC8790 / MC8790V / MC8791V /
MC8792V)
Antenna diversity is required for end user performance and
enhanced coverage on CDMA networks (800 MHz /
1900 MHz) for MC57xx, and on UMTS networks (850 MHz /
1900 MHz / 2100 MHz) for MC8780 / MC8781 / MC8785V /
MC8790 / MC8790V / MC8791V / MC8792V. (See Table A‐3 on
page 102 for UMTS diversity support by module.)
In addition to passing the specific tests described in Testing
beginning on page 106, the diversity path antenna should
satisfy the following requirement:
• Receive performance, measured by forward link
throughput, must be 0 to 3 dB better than a single antenna
Performance goals
When designing the antenna system, consider the following
performance goals:
• 0dB gain antenna (or better)
• Diversity antenna receive performance to be similar to
primary antenna
• Separation distance or polarity separation to achieve
diversity antenna isolation of 10db (minimum)—otherwise
the receive antenna picks up too much power radiating
from the primary antenna
GPS antenna design requirements
(MC57xx / MC8775V / MC878x)
A second antenna is required to access GPS functionality—if
the modem also supports diversity, the same antenna can be
used.
In addition to passing the specific tests described in Testing
beginning on page 106, the diversity path antenna should
satisfy the following requirements:
• Field of view (FOV): Omni‐directional in azimuth, ‐45° to
+90° in elevation
• Polarization (average Gv/Gh): > 0 dB. Vertical linear polar‐
ization is sufficient (no need to optimize for circular polar‐
ization)
• Free space average gain (Gv+Gh) over FOV: > ‐6 dBi
(preferably > ‐3 dBi). Note: Average gain is the sum of
average values (Gv + Gh) where both Gv and Gh are
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
•
•
•
•
measured (and averaged) over ‐45° to +90° in elevation and
± 180° in azimuth.
Maximum gain and uniform coverage in the high elevation
angle and zenith. Gain in the azimuth plane is not desired.
Average 3D gain: > ‐5 dBi
Typical VSWR: < 2:1
Polarization: any other than LHCP (left‐hand circular
polarized) is acceptable
The same design procedures outlined in Interference and
sensitivity on page 41 apply to the GPS path as well.
Testing
The performance specifications described in this section are
valid while the antenna is mounted in the host device with the
antenna feed cable routed in its final application configuration.
The following guidelines apply to the tests in this section:
• Perform electrical measurements at room temperature
(+20°C to +26°C) unless otherwise specified
• For main and diversity path antennas, make sure the
antennas (including contact device, coaxial cable,
connectors, and matching circuit with no more than six
components, if required) have nominal impedances of 50 Ω
across the frequency bands in Table A‐4.
• All tests (except isolation / correlation coefficient) — test the
main or diversity antenna with the other antenna termi‐
nated.
• Any metallic part of the antenna system that is exposed to
the outside environment needs to meet the electrostatic
discharge tests per IEC61000‐4‐2 (conducted discharge
+8kV).
• The functional requirements of the antenna system are
tested and verified while the MiniCard antenna is
integrated in the host device.
Note: Additional testing, including active performance tests,
mechanical, and accelerated life tests can be discussed with Sierra
Wireless’ engineering services. Contact your Sierra Wireless representative for assistance.
Voltage Standing Wave Ratio (VSWR)
Measure VSWR for each antenna (main, diversity) using the
following criteria:
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Antenna Specification
• Measure VSWR in free space at the antenna’s coaxial
connector (feeding terminal) when the antenna is installed
in the host device with the cable routed to the Mini Card
slot.
• Use an HP8753E network analyzer (or equivalent).
Table A-5: VSWR (Voltage Standing Wave Ratio)
Frequency
(MHz)
Typical VSWR
Worst-case
VSWR at band
edges
Notes
Main antenna
824–849
2.5:1
850-band Tx
869–880
3.5:1
850-band Rx excluding
part inside 900-band Tx
880–915
2.5:1
900-band Tx
925–960
3.5:1
900-band Rx
1710–1785
2.5:1
1800-band Tx
1805–1850
3.5:1
1800-band Rx excluding
part inside 1900-band Tx
1850–1910
2.5:1
1900-band Tx
1920–1980
2.5:1
2100-band Tx and part of
1900-band Rx
1980–1990
3.5:1
Part of 1900-band Rx
outside of 2100-band Tx
2110–2170
3.5:1
2100-band Rx
Diversity / GPS antenna
Rev 1.9.1 Feb.09
869–894
< 3:1
<3.5:1
1930–1990
< 3:1
<3.5:1
2110–2170
< 3:1
<3.5:1
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VSWR < 2:1
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Efficiency
Table A‐6 details the minimum total radiated efficiency for
main and, if supported, diversity antennas.
Table A-6: Minimum total radiated efficiency a
Mode
Main
Diversity
Transmit (Tx)
50%
n/a
Receive (Rx)
30%
25%
a. Total efficiency is measured at the RF connector. It includes mismatch losses, losses in the
matching circuit, and antenna losses.
Antenna-to-antenna isolation
(MC57xx / MC8775V / MC878x)
Use a network analyzer to measure isolation between the main
and secondary antenna pairs over the operating Tx / Rx
frequency bands described in Table A‐4 on page 103.
Table A‐7 details the minimum isolation allowed over the
various frequency bands for the applicable antenna pairs.
Table A-7: Minimum Main–Secondary antenna isolation
Isolation (dB)
Antenna pair
850 / 900 band
Main / Diversity (Tx and Rx)
Main (Tx) / GPS
GPS band
8 (cell)
15
DCS / PCS /
UMTS band
8 (PCS / UMTS)
15
15
When you perform these tests:
• If the antennas can be moved, test all positions for both the
main and secondary antennas.
• Collect worst‐case isolation data.
• Make sure all other wireless devices (Bluetooth or WLAN
antennas, etc.) are turned OFF to avoid interference. For
details, see Interference from other wireless devices on
page 41.
Note: System performance below the minimum isolation specification
could cause damage to the module, resulting in below-average
system performance.
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Antenna Specification
Peak gain and radiation patterns
Table A‐8 describes the peak and average antenna gain limits
for the main path and diversity path antennas.
Note: Sierra Wireless recommends using antenna efficiency as the
primary parameter for evaluating the antenna system.
Antenna Peak Gain is not a good indication of antenna performance
when integrated with a host device; the antenna does NOT provide
omni-directional gain patterns. Peak Gain performance can be
affected by parameters such as antenna size, location, design type,
etc. The antenna gain patterns remain fixed unless one or more of
these parameters changes.
Table A-8: Peak and average antenna gain
Peak gain a
Average gain b
Main
> +1 dBi
> -3 dBi
Diversity
> -3 dBi
> -6 dBi
Antenna
a. Vertical / horizontal polarizations
b. Vertical / horizontal polarizations combined, over ±45° in elevation and ±180° in azimuth
Fading correlation coefficient
(MC57xx / MC878x)
Measure the fading (envelope) correlation coefficient between
the main and diversity antennas over the operating Rx
frequency bands described in Table A‐4.
The maximum allowed fading correlation coefficient over any
of the bands is 0.5.
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B
B: Regulatory Information
Important notice
Because of the nature of wireless communications, trans‐
mission and reception of data can never be guaranteed. Data
may be delayed, corrupted (i.e., have errors) or be totally lost.
Although significant delays or losses of data are rare when
wireless devices such as the Sierra Wireless modem are used in
a normal manner with a well‐constructed network, the Sierra
Wireless modem should not be used in situations where failure
to transmit or receive data could result in damage of any kind
to the user or any other party, including but not limited to
personal injury, death, or loss of property. Sierra Wireless and
its affiliates accept no responsibility for damages of any kind
resulting from delays or errors in data transmitted or received
using the Sierra Wireless modem, or for failure of the Sierra
Wireless modem to transmit or receive such data.
Safety and hazards
Do not operate your MC57xx / MC87xx modem:
• In areas where blasting is in progress
• Where explosive atmospheres may be present including
refuelling points, fuel depots, and chemical plants
• Near medical equipment, life support equipment, or any
equipment which may be susceptible to any form of radio
interference. In such areas, the MC57xx / MC87xx modem
MUST BE POWERED OFF. Otherwise, the MC57xx /
MC87xx modem can transmit signals that could interfere
with this equipment.
In an aircraft, the MC57xx / MC87xx modem MUST BE
POWERED OFF. Otherwise, the MC57xx / MC87xx modem
can transmit signals that could interfere with various onboard
systems and may be dangerous to the operation of the aircraft
or disrupt the cellular network. Use of a cellular phone in an
aircraft is illegal in some jurisdictions. Failure to observe this
instruction may lead to suspension or denial of cellular
telephone services to the offender, or legal action or both.
Some airlines may permit the use of cellular phones while the
aircraft is on the ground and the door is open. The MC57xx /
MC87xx modem may be used normally at this time.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Important compliance
information for North American
users
The MC57xx / MC87xx modem has been granted modular
approval for mobile applications. Integrators may use the
MC57xx / MC87xx modem in their final products without
additional FCC / IC (Industry Canada) certification if they
meet the following conditions. Otherwise, additional FCC / IC
approvals must be obtained.
112
1.
At least 20 cm separation distance between the antenna
and the user’s body must be maintained at all times.
2.
To comply with FCC / IC regulations limiting both
maximum RF output power and human exposure to RF
radiation, the maximum antenna gain including cable loss
in a mobile‐only exposure condition must not exceed the
levels detailed in Table A‐1, “Required antennas and
maximum antenna gain by module type,” on page 101.
3.
The MC57xx / MC87xx modem and its antenna must not
be co‐located or operating in conjunction with any other
transmitter or antenna within a host device.
4.
A label must be affixed to the outside of the end product
into which the MC57xx / MC87xx modem is incorporated,
with a statement similar to the following:
· For MC5725 / MC5725V:
This device contains FCC ID: N7N‐MC5725
This equipment contains equipment certified under
IC: 2417C‐MC5725
· For MC5727 / MC5727V:
This device contains FCC ID: N7N‐MC5727
This equipment contains equipment certified under
IC: 2417C‐MC5727
· For MC5728 / MC5728V:
This device contains FCC ID: N7N‐MC5728
This equipment contains equipment certified under
IC: 2417C‐MC5728
· For MC8775 / MC8775V:
This device contains FCC ID: N7NMC8775
This equipment contains equipment certified under
IC: 2417C‐MC8775
· For MC8780:
This device contains FCC ID: N7NMC8780
· For MC8781:
This device contains FCC ID: N7NMC8781
This equipment contains equipment certified under
IC: 2417C‐MC8781
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Regulatory Information
·
·
·
5.
For MC8785V:
This device contains FCC ID: N7NMC8785
This equipment contains equipment certified under
IC: 2417C‐MC8785
For MC8790 / MC8790V:
This device contains FCC ID: N7NMC8790
This equipment contains equipment certified under
IC: 2417C‐MC8790
For MC8792V:
This device contains FCC ID: N7NMC8792
This equipment contains equipment certified under
IC: 2417C‐MC8792
A user manual with the end product must clearly indicate
the operating requirements and conditions that must be
observed to ensure compliance with current FCC / IC RF
exposure guidelines.
The end product with an embedded MC57xx / MC87xx
modem may also need to pass the FCC Part 15 unintentional
emission testing requirements and be properly authorized per
FCC Part 15.
Note: If this module is intended for use in a portable device,
you are responsible for separate approval to satisfy the SAR
requirements of FCC Part 2.1093 and IC RSS‐102.
EU regulatory conformity
Sierra Wireless hereby declares that the MC8775, MC8775V,
MC8780, MC8781, MC8785V, MC8790, MC8790V, MC8791V,
and MC8792V modems conform with all essential require‐
ments of Directive 1999/5/EC.
The Declaration of Conformity made under Directive 1999/5/
EC is available for viewing at the following location in the EU
community:
Sierra Wireless (UK), Limited
Lakeside House
1 Furzeground Way, Stockley Park East
Uxbridge, Middlesex
UB11 1BD
England
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C
C: Acronyms and Definitions
Table C-9: Acronyms and definitions
Acronym or term
Definition
AGC
Automatic Gain Control
BER
Bit Error Rate - a measure of receive sensitivity
BLER
Block Error Rate
Call Box
Base Station Simulator - Agilent E8285A or 8960, Rohde &
Schwarz CMU200
CDMA
Code Division Multiple Access
dB
Decibel = 10 x log10 (P1/P2)
P1 is calculated power; P2 is reference power
Decibel = 20 x log10 (V1/V2)
V1 is calculated voltage, V2 is reference voltage
dBm
Decibels, relative to 1 mW - Decibel(mW) = 10 x log10 (Pwr (mW)/
1mW)
DUT
Device Under Test
EDGE
Enhanced Data rates for GSM Evolution
EM
Embedded Module
ESD
ElectroStatic Discharge
FER
Frame Error Rate - a measure of receive sensitivity
GPRS
General Packet Radio Services
GPS
Global Positioning System
GSM
Global System for Mobile communications
Hz
Hertz = 1 cycle/second
inrush current
Peak current drawn when a device is connected or powered on
IS-2000
3G radio standards for voice and data (CDMA only)
IS-95
2G radio standards targeted for voice (cdmaONE)
LDO
Low Drop Out - refers to linear regulator
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table C-9: Acronyms and definitions
Acronym or term
116
Definition
MC5725 / MC5725V /
MC5727 / MC5727V /
MC5728 / MC5728V
Sierra Wireless Mini Cards used on CDMA networks
MC57xx
Any of the following CDMA Mini Cards: MC5725 / MC5725V /
MC5727 / MC5727V / MC5728 / MC5728V
MC8775 / MC8775V /
MC8780 / MC8781 /
MC8785V / MC8790 /
MC8790V / MC8791V /
MC8792V
Sierra Wireless Mini Cards used on GSM / UMTS networks
MC87xx
Any of the following GSM / UMTS Mini Cards: MC8775 / MC8775V /
MC8780 / MC8781 / MC8785V / MC8790 / MC8790V / MC8791V /
MC8792V
MHz
MegaHertz = 10E6 Hertz (Hertz = 1 cycle/second)
MIO
Module Input/Output
MPE
Maximum Permissible Exposure — the level of radiation to which a
person may be exposed without hazardous effect or adverse
biological changes
OTA
Over-The-Air or Radiated through the antenna
PCS
Personal Communication System - PCS spans the 1.9 GHz radio
spectrum
RF
Radio Frequency
RMS
Root Mean Square
SA
Selective Availability
Sensitivity (Audio)
Measure of lowest power signal that the receiver can measure
Sensitivity (RF)
Measure of lowest power signal at the receiver input that can
provide a prescribed BER / BLER / SNR value at the receiver
output.
SIM
Subscriber Identity Module
SNR
Signal to Noise Ratio
SOF
Start of Frame - a USB function
UART
Universal Asynchronous Receiver Transmitter
UDK
Universal Development Kit (PCI Express Mini Card Dev Kit)
UMTS
Universal Mobile Telecommunications System
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Acronyms and Definitions
Table C-9: Acronyms and definitions
Acronym or term
Definition
USB
Universal Serial Bus
USIM
Universal Subscriber Identity Module
VCC3.3
3.3 V supply voltage
WCDMA
Wideband Code Division Multiple Access — In this document, the
term “UMTS” is used instead of “WCDMA”.
XIM
In this document, XIM is used as part of the contact identifiers for
the USIM interface (XIM_VCC, XIM_CLK, etc.).
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
118
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In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
Index
Numerics
1X
CDMA Standard 13
acceptance tests 77
acronyms and definitions 115–117
airplane mode 19
anechoic chamber, OTA testing 43
antenna
connection and mounting points 39
connection considerations 39
custom, considerations 40
design requirements, diversity antenna 105
design requirements, general 104
design requirements, GPS 105
design requirements, main antenna 104
diversity antenna, disabling 41
diversity, MC57xx 105
frequency bands, supported 102
GPS, MC8775V / MC8780 / MC8781 105
limit, matching coaxial connections 39
location, considerations 40
matching, considerations 40
maximum cable loss 39
specification 101–109
testing 106
antennas
design checklist 75
frequency bands supported, by antenna type
103
frequency bands supported, MC57xx 102
frequency bands supported, MC87xx 102
required, by module type and gain 101
AT commands
3GPP specification, details 13
extended, MC57xx 68
extended, MC87xx 69
extended, overview 68
low power mode, setting 20
standard, MC57xx (reference document) 13
standard, MC87xx (reference document) 15
AT commands, extended
MC57xx, reference 13
MC87xx, reference 15
AT commands, standard
MC57xx, reference 13
MC87xx, reference 15
audio
features, summary 51
functions, host‐controlled 58
functions, module‐controlled 58
functions, responsible codecs 52
Rev 1.9.1 Feb.09
interface 51–59
path mixing, host‐controlled 59
path switching, host‐controlled 58
PCM digital, signal interface 58
primary, signal interface 57
signal interface 57
system block diagram, MC5725V 52
system block diagram, MC5727V 52
system block diagram, MC8775V 54
audio modes, supported 55
audio pass band 51
audio passband, Rx and Tx 57
automatic gain control (AGC)
module‐controlled 58
BER (Bit Error Rate) 45
bit error rate (BER)
measure of sensitivity, MC87xx 45
cable loss
antenna, maximum 39
capacitance
inrush current, effect on 25
capacitors
with USIM 68
with XIM_DATA / XIM_CLK 67
car kit audio mode 51
car kit mode
echo cancellation 56
CDMA
1X Standard 13
cellular band
RF parameters, MC57xx 37
certification tests 78
checklist, design 75
CnS
MC57xx reference 13
MC87xx reference 15
notification issued, state change
temperature 23
voltage 21
codec
for audio functions 52
comfort noise
module‐controlled 58
communications, host to modem
design checklist 76
connection
grounding 39
connectors, required
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
EDGE mating (52‐pin) 12
host‐module 12
RF, Hirose 12
USIM 12
current
consumption 27–35
usage models 35
peak inrush current, calculation 25
specifications, MC57xx 28
specifications, MC8775/75V 28–30
specifications, MC8780/81 30–31
specifications, MC8785V 31–32, 32–33
current, consumption 27
DCS 1800
RF parameters, MC87xx 37
sensitivity, test results 48
desense. See RF
design checklist
antennas 75
component placement 75
EMI/ESD 76
host/modem communications 76
power 75
thermal 76
device
positioning, sensitivity testing 45
disconnected, module power state 19
diversity antenna
disabling 41
DTMF
codec 52
module‐controlled 58
echo cancellation
audio feature 51
codec 52
details 56
module‐controlled 58
support, all modes 56
EDGE connector, manufacturers 12
efficiency
test criteria 108
EGSM 900
RF parameters, MC87xx 37
sensitivity, test results 47
electrostatic discharge. See ESD
ESD
design checklist 76
protection requirements 18
testing techniques document (IEC‐61000‐4‐2) 14
120
fading correlation coefficient
test criteria 109
FCC
regulations, relevant section 13
FER (Frame Error Rate) 45
filtering
high pass / slope filtering, module‐controlled 58
filtering stages, audio 51
filtering, RF desense 43
FIR filtering
audio feature 51
codec 52
module‐controlled 58
frame error rate (FER)
measure of sensitivity, MC57xx 45
frequency bands, supported 102
gain
codec 52
distribution, audio 56
limits, adjustable 51
gain, antenna
test criteria 109
GPS band
RF parameters, MC57xx 37
RF parameters, MC87xx 38
GPS sensitivity
conducted, RF parameter, MC87xx 37
grounding
connection considerations 39
GSM 1900
sensitivity, test results 48
GSM 850
RF parameters, MC87xx 37
sensitivity, test results 47
handset audio mode 51
handset mode
echo cancellation 56
handshaking
USB 62
headset audio mode 51
headset mode
echo cancellation 56
Host⁄Module interface 61–71
I/O rise time requirements 67
impedance
module‐antenna 41
USIM 67
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Index
inrush currents
description 24
host power supply applied 25
model, MC57xx 24
model, MC87xx 25
W_Disable# deasserted 25
interface
audio signal 57
interference
device generated 42
power supply noise 41
wireless devices 41
isolation
test criteria 108
LED
example 65
states 64
low power mode
setting, AT commands 20
state change from normal, temperature 23
state change from normal, voltage 21
state change to normal, temperature 23
state change to normal, voltage 21
temperature trigger levels 22
voltage trigger levels 20
low power, module power state 19–20
MC5725
AT commands, extended 68
AT reference (extended) 13
AT reference (standard) 13
CnS reference 13
networks supported 11
product specification 14
RF parameters (MC57xx) 37
MC5725V
AT commands, extended 68
audio interface, supported 51
product specification 14
RF parameters (MC57xx) 37
MC5727
AT reference (extended) 13
AT reference (standard) 13
CnS reference 13
RF parameters (MC57xx) 37
MC5727V
AT commands, extended 68
audio interface, supported 51
RF parameters (MC57xx) 37
MC57xx
current specifications 28
sensitivity test results 46
sensitivity, defined 45
Rev 1.9.1 Feb.09
MC8755
CnS reference, and MC87xx 15
MC8755V
CnS reference, and MC87xx 15
MC8765
CnS reference, and MC87xx 15
MC8775
AT commands, extended, and MC87xx 69
AT reference (extended), and MC87xx 15
AT reference (standard), and MC87xx 15
CnS reference, and MC87xx 15
current specifications 28–30
networks supported 11
product specification 14
RF parameters 37
MC8775V
AT commands, extended, and MC87xx 69
AT reference (extended), and MC87xx 15
AT reference (standard), and MC87xx 15
audio interface, supported 51
CnS reference, and MC87xx 15
current specifications 28–30
networks supported 11
pins, connector (2.6V) 61
product specification 14, 15
RF parameters 37
MC8780
AT commands, extended, and MC87xx 69
AT reference (extended), and MC87xx 15
AT reference (standard), and MC87xx 15
current specifications 30–31
networks supported 11
power consumption 34
product specification 14
RF parameters 37
MC8781
AT commands, extended, and MC87xx 69
AT reference (extended), and MC87xx 15
AT reference (standard), and MC87xx 15
current specifications 30–31
networks supported 11
power consumption 34
product specification 14
RF parameters 37
MC8785V
current specifications 31–32, 32–33
networks supported 11
MC87xx
sensitivity test results 47–50
sensitivity, defined 45
Mini Card
Dev Kit Quick Start Guide 15
PCI Express Specification 15
See also MC5725, MC5725V, MC5727, MC5727V,
MC8775, MC8775V, MC8780, MC8781,
MC8785V
minicom
downloading and installing 84
mixing
Proprietary and Confidential
121
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
CDMA and GSM / UMTS Mini Card Hardware Integration Guide
codec 52
modes
deep sleep, description 34
operating 34
shutdown, description 34
sleep, description 34
transmit / receive, description 34
module
power states 18–24
networks
supported, by module type 11
noise
leakage, minimizing 39
RF interference, power supply 41
noise suppression
audio feature 51
module‐controlled 58
normal mode
state change from low power, temperature 23
state change from low power, voltage 21
state change to low power, temperature 23
state change to low power, voltage 21
normal, module power state 19
off, module power state 19
output driver stage, audio feature 51
path loss, OTA testing 44
path switching
codec 52
PCB
multi‐layer, shielding for RF desense 43
PCI Express
Mini Card specification 15
PCM digital audio, signal interface 58
PCS 1900
RF parameters, MC87xx 37
PCS band
RF parameters, MC57xx 37
pins
connector (2.6V), MC8775V 61
polyphonic ringtone
host‐controlled 58
power
consumption, MC8780/81 34
current consumption, overview 27
default state 19
design checklist 75
disconnected, characteristics 19
normal, characteristics 19
off, characteristics 19
122
off, state change, temperature 23
off, state change, voltage 21
power‐up timing 26
ramp‐up timing 26
required supply voltage 17
signals, overview 17
state machine, temperature monitoring 22–24
state machine, voltage monitoring 20–22
state, disconnected 19
state, low power 19–20
state, normal 19
state, off 19
states, module 18–24
supply, RF interference 41
supply, ripple limit 41
transmit, wave form 26
power interface 17–35
product specification (PSD) 14
production tests 79
PSD (Product Specification Document) 14
quality assurance tests 96
regulatory information 111–113
EU 113
FCC 112
limitation of liability 111
safety and hazards 111
resistors, external pull‐up 67
resume
mode, USB 63
RF
antenna cable loss, maximum 39
antenna connection, considerations 39
cable type, required 12
desense
device‐generated 42
harmonic energy, filtering 43
mitigation suggestions 42
shielding suggestions 43
integration 37–50
interference
other devices 42
power supply 41
wireless devices 41
level lowered automatically, high temperature 24
parameters
cellular band, MC57xx 37
GPS, MC57xx 37
MC57xx 37
MC87xx 37
PCS band, MC57xx 37
parameters, MC87xx
DCS 1800 37
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Index
EGSM 900 37
GPS 38
GSM 850 37
PCS 1900 37
UMTS 1900 38
UMTS 2100 38
UMTS 850 38
ringer tone
codec 52
ringers
module‐controlled 58
ringtone, polyphonic
host‐controlled 58
Rx band
RF parameters, MC57xx 37
Rx sensitivity
conducted, RF parameter, MC87xx 37
RF parameter, MC57xx 37
SCI (Slot Cycle Index) 28
SED
see Smart Error Detection
sensitivity
conducted, RF parameter, MC87xx 37
defined, MC57xx and MC87xx 45
GPS conducted, MC87xx 37
MC57xx, defined (frame error rate) 45
MC87xx, defined (bit error rate) 45
measurements 47–50
radiated measurement, overview 43
RF parameter, MC57xx 37
test results
MC57xx 46
MC87xx 47–50
testing
device under test, positioning 45
testing, overview 43
testing, path loss calculation 44
sensitivity, OTA test chamber configuration 43
shielding
module, compliance 40
reducing RF desense 43
sidetone
responsible codec 59
support 55
SIM
testing methods, MS conformance specification 15
See also USIM
Slot Cycle Index 28
Smart Error Detection
detecting module reset 34
speakerphone audio mode 51
speakerphone mode
echo cancellation 57
state machine
temperature monitoring 22–24
voltage monitoring 20–22
Rev 1.9.1 Feb.09
suspend
mode, USB 63
system block
MC5725V, audio 52
MC5727V, audio 52
MC8775V, audio 54
temperature monitoring state machine
trigger levels 22
temperature, module. See thermal
test
efficiency 108
fading correlation coefficient 109
gain, antenna 109
isolation 108
VSWR (Voltage Standing Wave Ratio) 106
testing
overview 77
acceptance tests 77
audio loop‐back, MC5725V / MC5727V / MC8775V
94
certification tests 78
equipment, suggested 97
ESD immunity, techniques document (IEC‐61000‐
4‐2) 14
GPS receiver, MC8775V / MC8780 / MC8781 93
manual functional test, suggested 80
production tests 79
quality assurance tests 96
RF receive path, MC57xx 88
RF receive path, MC87xx 90
RF transmission path, MC57xx 85
RF transmission path, MC87xx 86
sensitivity, OTA test chamber configuration 43
suggestions 77–99
testing, path loss calculation 45
thermal
considerations 73–74
design checklist 76
dissipation, factors affecting 73
dissipation, suggestions 73
RF shield temperature, maximum 74
testing, module 73–74
timing
power ramp‐up 26
power‐up 26
transducer interface
host‐controlled 59
transducer interfaces
codec 52
transmit power wave form 26
Tx band
RF parameters, MC57xx 37
Tx power
conducted, RF parameter, MC87xx 37
RF parameters, MC57xx 37
Proprietary and Confidential
123
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
CDMA and GSM / UMTS Mini Card Hardware Integration Guide
UDK (Universal Development Kit)
components, included 11
UMTS 1900
RF parameters, MC87xx 38
sensitivity, test results 50
UMTS 2100
RF parameters, MC87xx 38
sensitivity, test results 50
UMTS 850
RF parameters, MC87xx 38
sensitivity, test results 49
Universal Development Kit (UDK)
components, included 11
Universal Serial Bus. See USB.
usage models
current consumption 35
USB
enumeration, power‐up 26
handshaking 62
host driver requirements 63
interface
host⁄module communication 62–64
overview 62
resume mode 63
specification 15
suspend mode 63
USIM
capacitor recommendations 68
card contacts 66
clock rate 67
connector type, required 12
electrical specifications 67
impedance, connectors 67
124
interface diagram 66
interface, overview 65
operation 67–68
pin assignments 65
socket placement 68
voice memo
host‐controlled 58
voltage monitoring state machine
trigger levels 20
Voltage Standing Wave Ratio (VSWR)
test criteria 106
volume, setting
responsible codec 59
VSWR (Voltage Standing Wave Ratio)
test criteria 106
W_Disable#
deasserted, causes inrush current event 25
de‐asserted, peak current 25
inrush currents 24
module, powering off 21, 23
Normal state 19
off state 19
ZIF (Zero Intermediate Frequency) 41
Proprietary and Confidential
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