Sierra Wireless MC8301 Multi-band Radio Module User Manual HW Integration Guide

Sierra Wireless Inc. Multi-band Radio Module HW Integration Guide

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Date Submitted2010-02-22 00:00:00
Date Available2010-08-15 00:00:00
Creation Date2010-01-29 13:39:31
Producing SoftwareAcrobat Distiller 8.1.0 (Windows)
Document Lastmod2010-01-29 14:15:58
Document TitleHW Integration Guide
Document CreatorFrameMaker 8.0

CDMA and GSM / UMTS Mini Card
Hardware Integration Guide
Proprietary and Confidential
Includes:
MC5725
MC8301V
MC5725V
MC8775
MC5727
MC8775V
MC5727V
MC8780
MC5728V
MC8781
MC8790
MC8790V
MC8791V
MC8792V
MC8795V
MC8700
2130114
Rev 1.12.5
Preface
Important Notice
Due to the nature of wireless communications, transmission
and reception of data can never be guaranteed. Data may be
delayed, corrupted (i.e., have errors) or be totally lost.
Although significant delays or losses of data are rare when
wireless devices such as the Sierra Wireless modem are used in
a normal manner with a well‐constructed network, the Sierra
Wireless modem should not be used in situations where failure
to transmit or receive data could result in damage of any kind
to the user or any other party, including but not limited to
personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting
from delays or errors in data transmitted or received using the
Sierra Wireless modem, or for failure of the Sierra Wireless
modem to transmit or receive such data.
Safety and Hazards
Do not operate the Sierra Wireless modem in areas where
blasting is in progress, where explosive atmospheres may be
present, near medical equipment, near life support equipment,
or any equipment which may be susceptible to any form of
radio interference. In such areas, the Sierra Wireless modem
MUST BE POWERED OFF. The Sierra Wireless modem can
transmit signals that could interfere with this equipment.
Do not operate the Sierra Wireless modem in any aircraft,
whether the aircraft is on the ground or in flight. In aircraft, the
Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that
could interfere with various onboard systems.
Note: Some airlines may permit the use of cellular phones while the
aircraft is on the ground and the door is open. Sierra Wireless
modems may be used at this time.
The driver or operator of any vehicle should not operate the
Sierra Wireless modem while in control of a vehicle. Doing so
will detract from the driver or operatorʹs control and operation
of that vehicle. In some states and provinces, operating such
communications devices while in control of a vehicle is an
offence.
Limitation of
Liability
Rev 1.12.5 Jan.10
The information in this manual is subject to change without
notice and does not represent a commitment on the part of
Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL
DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL,
CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES
INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
REVENUE OR ANTICIPATED PROFITS OR REVENUE
ARISING OUT OF THE USE OR INABILITY TO USE ANY
SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS
AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE
FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra
Wireless and/or its affiliates aggregate liability arising under or
in connection with the Sierra Wireless product, regardless of
the number of events, occurrences, or claims giving rise to
liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.
Patents
Portions of this product may be covered by some or all of the
following US patents:
5,515,013
5,629,960
5,845,216
5,847,553
5,878,234
5,890,057
5,929,815
6,169,884
6,191,741
6,199,168
6,339,405
6,359,591
6,400,336
6,516,204
6,561,851
6,643,501
6,653,979
6,697,030
6,785,830
6,845,249
6,847,830
6,876,697
6,879,585
6,886,049
6,968,171
6,985,757
7,023,878
7,053,843
7,106,569
7,145,267
7,200,512
7,295,171
7, 287,162 D442,170
D459,303
D599,256
D560,911
and other patents pending.
This product includes technology licensed from
QUALCOMM® 3G.
Manufactured or sold by Sierra Wireless or its licensees under
one or more patents licensed from InterDigital Group.
Copyright
©2010 Sierra Wireless. All rights reserved.
Trademarks
AirCard® and “Heart of the Wireless Machine®” are registered
trademarks of Sierra Wireless. Watcher® is a trademark of
Sierra Wireless, registered in the European Community.
Sierra Wireless, the Sierra Wireless logo, the red wave design,
and the red‐tipped antenna are trademarks of Sierra Wireless.
Windows® is a registered trademark of Microsoft Corporation.
QUALCOMM® is a registered trademark of QUALCOMM
Incorporated. Used under license.
Linux® is a registered trademark of Linus Torvalds.
Other trademarks are the property of the respective owners.
Proprietary and Confidential
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Preface
Contact
Information
Sales Desk:
Phone: 1-604-232-1488
Hours: 8:00 AM to 5:00 PM Pacific Time
E-mail: sales@sierrawireless.com
Post: Sierra Wireless
13811 Wireless Way
Richmond, BC
Canada
V6V 3A4
Fax: 1-604-231-1109
Web: www.sierrawireless.com
Consult our website for up‐to‐date product descriptions,
documentation, application notes, firmware upgrades, trouble‐
shooting tips, and press releases:
www.sierrawireless.com
Rev 1.12.5 Jan.10
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
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Table of Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
The Universal Development Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Required connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Guide organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Related documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Power Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Overview of operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Power signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Module power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disconnected state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Normal state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Low power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Usage models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
16
16
17
17
17
17
RF Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
RF connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Ground connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Antenna and cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Interference and sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power supply noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interference from other wireless devices . . . . . . . . . . . . . . . . . . . . . . . . . .
Device-generated RF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
23
23
23
24
Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
System block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Modes of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Sidetone support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Echo cancellation support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio signal interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Audio function partitioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
26
29
29
30
31
32
Host / Module Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
LED output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Safety and hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Important compliance information for North American users . . . . . . . . . . . 38
EU regulatory conformity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Brazil ANATEL homologation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Acronyms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
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1
1: Introduction
Sierra Wireless’ Mini Card modules form the radio component
for the products in which they are embedded. Mini Cards are
available for use on CDMA and GSM networks, including:
Note: Throughout this
document, MC57xx and MC8xxx
refer to the entire suites of
CDMA and GSM Mini Cards
respectively.
• MC5725 / MC5725V / MC5727 / MC5727V / MC5728V—Operate
on CDMA networks using the CDMA IS‐95A, 1X, and
1xEV‐DO (IS‐856) network standards, and support GPS.
• MC8775 / MC8775V—Operate on GSM networks using the
GSM / GPRS / EDGE / UMTS / HSDPA network standards,
and support Standalone GPS functionality.
• MC8301V / MC8780 / MC8781 / MC8790 / MC8790V / MC8791V /
MC8792V / MC8795V—Operate on GSM networks using the
GSM / GPRS / EDGE / UMTS / HSDPA / HSUPA network
standards, and support Standalone GPS, gpsOneXTRA™,
A‐GPS, selected enhanced Navigation 2.0 features, and five
NMEA sentences.
• MC8700—Operates on GSM networks using the GSM /
GPRS / EDGE / UMTS / HSDPA / HSUPA / HSPA+ network
standards.
Purpose of this guide
This guide addresses issues that affect the integration of Sierra
Wireless modules into host products, and includes design
recommendations for the host products.
Note: An understanding of network technology and experience in
integrating hardware components into electronic equipment is
assumed.
The Universal Development Kit
Sierra Wireless manufactures a Universal Development Kit
(UDK) that facilitates all phases of the integration process.
This kit is a hardware development platform that is designed
to support multiple members of the wireless embedded
module product family. It contains the hardware components
that are typically necessary for evaluating and developing with
the module, including:
• Development board
• Cables
• Antennas
• Other accessories
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
For instructions on setting up the UDK, see PCI Express Mini
Card Dev Kit Quick Start Guide (Document 2130705).
Required connectors
Note: Contact vendors before
choosing your connectors — the
numbers included here are for
reference only. Choose
connectors that are appropriate
to your design.
When integrating these modules into your host device, you
need the following connector types:
• RF cables that mate with Hirose U.FL connectors (model
U.FL #CL331‐0471‐0‐10). Modules include one or two
connector jacks depending on individual module support
for diversity or GPS functionality.
• Industry‐standard mating connector for 52‐pin EDGE—
some manufacturers include Tyco, Foxconn, and Molex. For
example, the connector used on the Mini Card Dev Kit
board is a Molex 67910‐0001.
• Industry‐standard USIM connector (MC8xxx only)—the
actual connector you use depends on how your device
exposes the USIM socket. For example, the USIM connector
used on the Mini Card Dev Kit board is an ITT CCM03‐
3518.
Guide organization
This guide includes the following sections:
1.
2.
3.
4.
5.
6.
7.
8.
Introduction (this section)
Power Interface (p.15)
Describes power control signals used by the module and
discusses design issues related to power supply
integration.
RF Integration (p.19)
Describes antenna connection methods and grounding issues,
RF interference and desense issues.
Audio Interface (p.25)
Describes supported audio modes and related details.
Host / Module Interfaces (p.35)
Describes the USB interface for host / module communication,
and the USIM interface for host / module integration.
Regulatory Information (p.37)
Describes regulatory approvals and regulatory information
requirements.
Acronyms and Definitions (p.41)
Lists acronyms and definitions used throughout this guide.
Index (p.121)
Note: The term "host" always refers to the host device.
10
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Introduction
Related documents
This guide deals specifically with hardware integration issues
that are unique to the MC57xx and MC8xxx modules.
Table 1‐1 lists other documents referenced in this guide.
Table 1-1: Related documentation
Document title
Description
AT Command Set for User
Equipment (UE) (Release 6)
Standard AT commands for GSM / UMTS devices.
CDMA 1X Standard
Technical requirements for CDMA systems, including
details on sleep cycle index (SCI) values.
Download this document (3GPP TS 27.007) from
www.3gpp.org.
Order this document, CDMA 2000 Series Release A
(2000) (document # TIA/EIA/IS-2000 Series, Release A)
from www.tiaonline.org.
CDMA CnS Reference
(Document 2130754)
CnS (Control and Status) messages that are supported by
the MC5725 / MC5725V / MC5727 / MC5727V /
MC5728V.
CDMA AT Command Reference
(Document 2130620)
Proprietary, basic AT commands for the MC5725 /
MC5725V / MC5727 / MC5727V / MC5728V.
For MC8xxx-specific commands, see UMTS Modems
Supported AT Command Reference (Document 2130617).
CDMA Extended AT Command
Reference (Document
2130621)
Proprietary AT commands for the MC5725 / MC5725V /
MC5727 / MC5727V / MC5728V.
FCC Regulations - Part 15 Radio Frequency Devices
This section of the FCC Code of Federal Regulations, Title
47 deals with radio frequency devices, including shielding
requirements for embedded modules.
For MC8xxx-specific commands, see MC87xx Modem
Extended AT Command Reference (Document 2130616).
Download this regulation from http://wireless.fcc.gov.
Techniques for testing and measuring electrostatic
discharge (ESD) immunity.
IEC-61000-4-2 level 3
Order this document from www.iec.ch.
MC5725 Mini Card Product
Specification (Document
2130663)
Features, mechanical and electrical specifications, and
standards compliance of the MC5725.
MC5725V Mini Card Product
Specification (Document
2130671)
Features, mechanical and electrical specifications, and
standards compliance of the MC5725V.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 1-1: Related documentation (Continued)
Document title
12
Description
MC5727 Mini Card Product
Specification (Document
2130958)
Features, mechanical and electrical specifications, and
standards compliance of the MC5727.
MC5727V Mini Card Product
Specification (Document
2131023)
Features, mechanical and electrical specifications, and
standards compliance of the MC5727V.
MC5728V Mini Card Product
Specification (Document
2111350)
Features, mechanical and electrical specifications, and
standards compliance of the MC5728V.
MC8301V PCI Express Mini
Card Product Specification
(Document 2131326)
Features, mechanical and electrical specifications, and
standards compliance of the MC8301V.
MC8775 PCI Express Mini Card
Product Specification
(Document 2130697)
Features, mechanical and electrical specifications, and
standards compliance of the MC8775.
MC8775V with Audio PCI
Express Mini Card Product
Specification (Document
2130700)
Features, mechanical and electrical specifications, and
standards compliance of the MC8775V.
MC8780 / MC8781 PCI Express
Mini Card Product
Specification (Document
2130782)
Features, mechanical and electrical specifications, and
standards compliance of the MC8780 / MC8781.
MC8790 PCI Express Mini Card
Product Specification
(Document 2111279)
Features, mechanical and electrical specifications, and
standards compliance of the MC8790.
MC8790V PCI Express Mini
Card Product Specification
(Document 2111280)
Features, mechanical and electrical specifications, and
standards compliance of the MC8790V.
MC8791V PCI Express Mini
Card Product Specification
(Document 2131032)
Features, mechanical and electrical specifications, and
standards compliance of the MC8791V.
MC8792V PCI Express Mini
Card Product Specification
(Document 2131033)
Features, mechanical and electrical specifications, and
standards compliance of the MC8792V.
MC8795V PCI Express Mini
Card Product Specification
(Document 2131276)
Features, mechanical and electrical specifications, and
standards compliance of the MC8795V.
MC8700 PCI Express Mini Card
Product Specification
(Document 2131202)
Features, mechanical and electrical specifications, and
standards compliance of the MC8700.
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Introduction
Table 1-1: Related documentation (Continued)
Document title
Description
MC87XX Modem CnS
Reference (Document
2130602)
CnS (Control and Status) messages supported by the
MC8xxx series of modems.
MC87xx Modem CnS Reference
(Voice) (Document 2130817)
Voice-related CnS (Control and Status) messages
supported by the MC8301V, MC8775V,
MC8790V,MC8791V, and MC8792V, and MC8795V.
UMTS Modems Supported AT
Command Reference
(Document 2130617)
Proprietary, basic AT commands for the MC8xxx. For
MC57xx-specific commands, see the CDMA AT
Command Reference (Document 2130620).
MC87xx Modem Extended AT
Command Reference
(Document 2130616)
Proprietary AT commands for the MC8xxx. For MC57xxspecific commands, see the CDMA Extended AT
Command Reference (Document 2130621).
Mobile Station (MS)
Conformance Specification;
Part 4: Subscriber Interface
Module
SIM testing methods.
PCI Express Mini Card Dev Kit
Quick Start Guide (Document
2130705)
Setup and configuration of modules.
PCI Express Mini Card
Electromechanical
Specification Revision 1.1
Download this document from www.pcisig.com.
Universal Serial Bus
Specification, Rev 2.0
Download this specification from www.usb.org.
Rev 1.12.5 Jan.10
Download this document (3GPP TS 11.10-4) from
www.3gpp.org.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
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2
2: Power Interface
Overview of operation
Note: This chapter contains information for CDMA (MC57xx) and
GSM (MC8xxx) modules.
Information that is unique to specific module types is clearly
identified.
The module is designed to use a 3.3V (nominal) power supply,
provided by the host. It is the host’s responsibility to provide
safe and continuous power to the module at all times; the
module does NOT have an independent power supply, or
protection circuits to guard against electrical issues.
The module’s power state is controlled by the host’s assertion /
de‐assertion of the W_Disable# signal. The module also
monitors its supply voltage and requests shutdown if the
supply is insufficient.
Power signals
The module must be connected to a 3.3V power supply (as
described in PCI Express Mini Card Electromechanical Specifi‐
cation Revision 1.1).
The MC8xxx has more power pins than the MC57xx due to
higher peak current requirements for GSM devices.
For detailed pinout and voltage / current requirements of these
modules, see the Product Specification Document for your
Mini Card.
Electrostatic discharge (ESD)
You are responsible for ensuring that the host has adequate
ESD protection on digital circuits and antenna ports:
• (Operational) RF port (antenna launch and RF connector):
IEC‐61000‐4‐2 — Level (Electrostatic Discharge Immunity Test)
• (Non‐operational) Host connector interface:
JESD22‐A114‐B +/‐ 1kV Human Body Model and
JESD22‐C101 +/‐ 125 V Charged Device Model
• MC5728V only: (Non‐operational) Host connector interface:
JESD22‐A114‐B +/‐ 200V Human Body Model and
JESD22‐C101 +/‐ 250 V Charged Device Model
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
MC5728V has placeholders for additional ESD devices, for
cases where the device must, per customer requirements,
meet the higher Human Body Model (+/‐1kV) ESD rating.
Specific recommendations are provided where needed in this
guide, however, the level of protection required depends on
your application.
Note: ESD protection is highly recommended for the USIM connector
at the point where the contacts are exposed, and for any other signals
from the host interface that would be subjected to ESD by the user of
the product.
Module power states
The module has four power states:
• Disconnected
No power to the module.
• Off
Power to the module, but the module is powered off.
• Normal
The module is active. Several modes are possible (Receive,
Transmit, Sleep, Shutdown).
• Low power (“airplane mode”)
The module is active, but RF is disabled.
Note: The module unit defaults
to the Normal state when
VCC3.3 is first applied in the
absence of W_Disable# control.
State machines are implemented in the module to monitor the
power supply and operating temperature.
Disconnected state
Note: The difference between
the Disconnected and Off states
is that, in the Off state, the
module is still connected to the
power source and draws minimal
current.
16
This state occurs when there is no power to the module — the
host power source is disconnected from the module and all
voltages associated with the module are at 0 V.
Whether the host device is also powered off depends on the
power rail design. If the connection between the power rail
and the module is controlled by the host, the host can stay
powered on and cut the power to put the modem into the
disconnected state. If the power rail is shared between the host
device and the module, the host is powered off when the
module is powered off.
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Power Interface
Off state
In this state, the host is powered up and the module is
powered down (but still connected to the power source).
The host keeps the module powered off by driving the
W_Disable# signal low. In this state, the module draws minimal
current.
Normal state
Note: This is the default state
when VCC3.3 is first applied in
the absence of W_Disable#
control.
This is the active state of the module. In this state:
• The module is fully powered.
• The module is capable of placing / receiving calls or estab‐
lishing data connections on the wireless network.
• The USB interface is fully active.
Low power mode
In this state, RF (both Rx and Tx) is disabled in the module, but
the USB interface is still active. This low power mode
(ʺairplane modeʺ) is controlled by software commands
through the host interface.
For instructions on using the commands, refer to AT Command
Set for User Equipment (UE) (Release 6) (+CFUN=0 command),
CDMA CnS Reference (Document 2130754)
(CNS_RADIO_POWER [0x1075] command), or MC87XX
Modem CnS Reference (Document 2130602) (Disable Modem
command).
Usage models
Usage models can be used to calculate expected current
consumption. A sample usage model is provided in Table 2‐1.
Table 2-1: Power consumption of a sample application
Used by a field worker
(data only)
Rev 1.12.5 Jan.10
Used for remote data
logging
Upload (module
Tx)
1000 kB/day
40 kB/h
Download
(module Rx)
500 kB/day
100 kB/day
Coverage / data
rate
1X / 80 kbps
IS-95 / 14.4 kbps
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 2-1: Power consumption of a sample application (Continued)
Used by a field worker
(data only)
Used for remote data
logging
Hours of
operation
8/day (off 16 hrs/day)
24/day
Total power
consumed over
24 hours
60 mAh
200 mAh
This example model applies to a battery‐operated device. In
practice, because the module is isolated from the battery (the
host device manages the power source), the mAh ratings
depend on the device’s supply efficiency.
The module automatically enters slotted sleep mode when
there is no transmission or reception occurring (SCI = 2).
Transmit power is assumed to be +3 dBm.
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3
3: RF Integration
The MC8xxx operates on the frequencies detailed in Table 3‐1.
Table 3-1: MC8xxx— RF parameters
Product
Rev 1.12.5 Jan.10
Band
Frequencies (MHz)
MC8301V
MC8775
MC8775V
MC8780
MC8781
MC8790
MC8790V
MC8791V
MC8792V
MC8795V
MC8700
GSM 850
(2%) CS
Tx: 824–849
Rx: 869-894
EGSM 900
(2%) CS
Tx: 880-915
Rx: 925-960
DCS 1800
(2%) CS
Tx: 1710-1785
Rx: 1805-1880
PCS 1900
(2%) CS
Tx: 1850-1910
Rx: 1930-1990
MC8301V
MC8775
MC8775V
MC8780
MC8781
MC8790
MC8790V
MC8791V
MC8792V
MC8795V
MC8700
Band I
UMTS 2100
(0.1%) 12.2 kbps
Tx: 1920–1980
Rx: 2110–2170
MC8301V
MC8775
MC8775V
MC8780
MC8781
MC8790
MC8790V
MC8792V
MC8795V
MC8700
Band II
UMTS 1900
(0.1%) 12.2 kbps
Tx: 1850–1910
Rx: 1930–1990
MC8301V
MC8775
MC8775V
MC8780
MC8781
MC8790
MC8790V
MC8795V
MC8700
Band V
UMTS 850
(0.1%) 12.2 kbps
Tx: 824–849
Rx: 869–894
(Band VI is included as a
subset of Band V)
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 3-1: MC8xxx— RF parameters (Continued)
Product
Band
Frequencies (MHz)
MC8792V
MC8795V
MC8700
Band VIII
UMTS 900
(0.1%) 12.2 kbps
Tx: 880–915
Rx: 925–960
MC8301V
MC8775V
MC8780
MC8781
MC8790
MC8790V
MC8791V
MC8792V
MC8795V
GPS
1575.42
RF connection
When attaching an antenna to the module:
Note: To disconnect the
antenna, make sure you use the
Hirose U.FL connector removal
tool (P/N UFL-LP-N-2(01)) to
prevent damage to the module
or coaxial cable assembly.
20
• Use a Hirose U.FL connector (model
U.FL #CL331‐0471‐0‐10) to attach an antenna to a
connection point on the module, as shown in Figure 3‐1 (the
main RF connector on the top side; the diversity RF or GPS
connector on the bottom side).
• Match coaxial connections between the module and the
antenna to 50 Ω.
• Minimize RF cable losses to the antenna; the recommended
maximum cable loss for antenna cabling is 0.5 dB.
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RF Integration
Figure 3-1: Antenna connection points and mounting holes
Ground connection
When connecting the module to system ground:
• Prevent noise leakage by establishing a very good ground
connection to the module through the host connector.
• Connect to system ground using the two mounting holes at
the top of the module (as shown in Figure 3‐1).
• Minimize ground noise leakage into the RF.
Depending on the host board design, noise could potentially
be coupled to the module from the host board. This is
mainly an issue for host designs that have signals traveling
along the length of the module, or circuitry operating at
both ends of the module interconnects.
Rev 1.12.5 Jan.10
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Shielding
The module is fully shielded to protect against EMI and to
ensure compliance with FCC Part 15 ‐ “Radio Frequency
Devices” (or equivalent regulations in other jurisdictions).
Note: The module shields must NOT be removed.
Antenna and cabling
Note: Values in this guide are
taken from the appropriate
product specification documents
(PSDs) (listed in Related
documents, page 11) — in the
case of a discrepancy between
this document and the relevant
PSD, use the value listed in the
PSD.
When selecting the antenna and cable, it is critical to RF perfor‐
mance to match antenna gain and cable loss.
Choosing the correct antenna and cabling
Consider the following points for proper matching of antennas
and cabling:
• The antenna (and associated circuitry) should have a
nominal impedance of 50 Ω with a return loss ≤ 10 dB
across each frequency band of operation.
• The system gain value affects both radiated power and
regulatory (FCC, IC, CE, etc.) test results.
Developing custom antennas
Consider the following points when developing custom‐
designed antennas:
• A skilled RF engineer should do the development to ensure
that the RF performance is maintained.
• Identify the bands that need to be supported, particularly
when both the MC57xx and MC8xxx will be installed in the
same platform. In this case, you may want to develop
separate antennas for maximum performance.
Determining the antenna’s location
Consider the following points when deciding where to put the
antenna:
• Antenna location may affect RF performance. Although the
module is shielded to prevent interference in most applica‐
tions, the placement of the antenna is still very important —
if the host device is insufficiently shielded, high levels of
broadband or spurious noise can degrade the module’s
performance.
• Connecting cables between the module and the antenna
must have 50 Ω impedance. If the impedance of the module
is mismatched, RF performance is reduced significantly.
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RF Integration
• Antenna cables should be routed, if possible, away from
noise sources (switching power supplies, LCD assemblies,
etc.). If the cables are near the noise sources, the noise may
be coupled into the RF cable and into the antenna.
Disabling the diversity antenna
• MC57xx — If your host device is not designed to use the
MC57xx module’s diversity antenna, terminate the interface
with a 50 Ω load.
• MC8301V / MC8780 / MC8781 / MC8790 / MC8790V /
MC8791V / MC8792V / MC8795V / MC8700 —Use the AT
command !RXDEN=0 to disable receive diversity or
!RXDEN=1 to enable receive diversity.
Interference and sensitivity
Note: These modules are based
on ZIF (Zero Intermediate
Frequency) technologies; when
performing EMC
(Electromagnetic Compatibility)
tests, there are no IF
(Intermediate Frequency)
components from the module to
consider.
Note: Values in this guide are
taken from the appropriate
product specification documents
(PSDs) (listed in Related
documents, page 11) — in the
case of a discrepancy between
this document and the relevant
PSD, use the value listed in the
PSD.
Rev 1.12.5 Jan.10
Several sources of interference can affect the RF performance
of the module (RF desense). Common sources include power
supply noise and device‐generated RF.
RF desense can be addressed through a combination of
mitigation techniques and radiated sensitivity measurement.
Power supply noise
Noise in the power supply can lead to noise in the RF signal.
The power supply ripple limit for the module is no more than
200 mVp‐p 1 Hz to 100 kHz. This limit includes voltage ripple
due to transmitter burst activity.
Interference from other wireless devices
Wireless devices operating inside the host device can cause
interference that affects the module.
To determine the most suitable locations for antennas on your
host device, evaluate each wireless device’s radio system,
considering the following:
• Any harmonics, sub‐harmonics, or cross‐products of signals
generated by wireless devices that fall in the module’s Rx
range may cause spurious response, resulting in decreased
Rx performance.
• The Tx power and corresponding broadband noise of other
wireless devices may overload or increase the noise floor of
the module’s receiver, resulting in Rx desense.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
The severity of this interference depends on the closeness of
the other antennas to the module’s antenna. To determine
suitable locations for each wireless device’s antenna,
thoroughly evaluate your host device’s design.
Device-generated RF
All electronic computing devices generate RF interference that
can negatively affect the receive sensitivity of the module.
Note: The module can cause
interference with other devices
such as hearing aids and onboard speakers.
Wireless devices such as the
Mini Card transmit in bursts
(pulse transients) for set
durations (RF burst frequencies).
Hearing aids and speakers
convert these burst frequencies
into audible frequencies,
resulting in audible noise.
The proximity of host electronics to the antenna in wireless
devices can contribute to decreased Rx performance. Compo‐
nents that are most likely to cause this include:
• Microprocessor and memory
• Display panel and display drivers
• Switching‐mode power supplies
These and other high‐speed devices (in particular, the
processor) can decrease Rx performance because they run at
frequencies of tens of MHz. The rapid rise and fall of these
clock signals generates higher‐order harmonics that often fall
within the operating frequency band of the module, affecting
the module’s receive sensitivity.
Example
On a sub‐system running at 40 MHz, the 22nd harmonic falls
at 880 MHz, which is within the cellular receive frequency
band.
Note: In practice, there are usually numerous interfering frequencies
and harmonics. The net effect can be a series of desensitized receive
channels.
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4
4: Audio Interface
The MC5725V / MC5727V / MC5728V / MC8301V / MC8775V /
MC8790V / MC8791V / MC8792V / MC8795V modules support
six audio modes that may be required by a host audio system:
• Handset
• Headset
• Car kit
• Speakerphone
• AUX (MC5727V / MC5728V modules are preconfigured for
HAC [Hearing Aid Compatibility])
• TTY
Note: Values in this guide are
taken from the appropriate
product specification documents
(PSDs) (listed in Related
documents, page 11) — in the
case of a discrepancy between
this document and the relevant
PSD, use the value listed in the
PSD.
The modules support both a differential analog interface and
PCM digital audio, and allow dynamic run‐time selection of
the appropriate mode.
Table 4‐1 summarizes the key audio features of these modules.
Table 4-1: Audio features
Feature
Gain (adjustable)
Transmit
MC5725V:
Receive
Up to +12 dB
• Up to +16 dB analog gain.
MC5727V:
• MIC_AMP1: Programmable to 0 dB or +24 dB.
• MIC_AMP2: Programmable from -6 dB to
+25.5 dB in steps of 1.5 dB.
MC5728V:
• Programmable to 0 dB or +24 dB.
MC8301V / MC8775V / MC8790V / MC8791V /
MC8792V / MC8795V:
• Up to +48.5 dB analog gain available (when the
analog interface is selected).
Filtering stages
Several adjustable high-pass and slope filters
High-pass filter
Noise suppression
Supported
n/a
Echo cancellation
Configurable for each audio mode (headset,
handset, speakerphone, and car kit)
n/a
Output driver stage
n/a
Supported
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 4-1: Audio features (Continued)
Feature
FIR (Finite Impulse
Response) filtering
Transmit
Receive
MC8xxx:
• Option of providing 13 tap FIR filtering for receive and transmit
paths to equalize the acoustic response of the speaker and microphone elements.
Audio pass band
300 Hz–3.4 kHz
These modules are intended to serve as an integral component
of a more complex audio system—for example, a PDA with a
separate codec interfaced to the Host Application processor.
Usually, the interface between the module and the host audio
system is set to line‐level amplitudes with no transducer
considerations. The responsibility of the module codec or host
codec for special functions is detailed in Table 4‐2.
Table 4-2: Functions - responsibility codecs
Function
Responsible Codec
Phone oriented (e.g., echo
cancellation, FIR filtering)
Module codec
Path-switching
Host codec
Transducer interfaces
Host codec
Adjustable gain / volume settings
Either
DTMF / ringer tone generation
Either
Mixing
Host codec
System block diagrams
Note: When integrating the module into your host platform, make sure
the module has sufficient shielding to prevent RF interference.
MC5725V / MC5727V system block
Figure 4‐1 represents the MC5725V / MC5727V module’s audio
system block, and includes the following features:
• Module interconnects are shown on the left side of the
diagram. The audio interface uses the signals:
· MIC_P / MIC_N
· SPK_P / SPK_N
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Audio Interface
• Dynamic ranges for each programmable gain stage are
Note: Make sure the host device
includes DC blocking capacitors
on the Audio In lines – the
module does not include series
capacitors.
listed, with the following constraints:
· MIC_AMP1 is programmable in discrete steps only
· MIC_AMP2 (MC5727V only) is programmable in
discrete steps only
· CodecSTGain, when set to the minimum setting, effec‐
tively mutes sidetone in the module codec
Figure 4-1: MC5725V / MC5727V Audio system block
MIC_P
TX_HPF_DIS_N
TX_SLOPE_FILT_DIS_N
MIC_N
57.3mVrms
@ 0dBm0
HPF &
Slope
MIC_AMP1_GAIN
+16dB
+8dB
+6dB
-2dB
CodecSTGain
+12dB
-48dB
-96dB
CodecRxGain
AMP_SEL
001 010 100
SPK_N
Echo Cancellation
10 01
MIC_SEL
NS &
AAGC
+12dB
-3dB
-84dB
TxPCMFilt TxVolume
Tx FIR
13K CELP/
EVRC
Encoder
+12dB
0dB
-84dB
MIC_AMP2_BYP
22p
nsSwitch
CodecTxGain
13 bit A/D
RF Filter
33n
Encoder
PCM I/F
Audio In
TX ADC
DTMF Tx Gain
DTMF
Decoder
DTMF
Encoder
Decoder
RF
Interface
DTMF Rx Gain
RX_HPF_DIS_N
35mW @ +3dBm0
13 bit D/A
SPK_P
HPF
Rx FIR
+12dB
0dB
-81dB
Audio Out
AAGC
13K CELP/
EVRC
Decoder
RxVolume
+12dB
-25dB RxPCMFilt
-84dB
RX DAC
MC5728V system block
Figure 4‐2 represents the MC5728V module’s audio system
block, and includes the following features:
• Module interconnects are shown on the left side of the
diagram. The audio interface uses the signals:
· MIC_P / MIC_N
· SPK_P / SPK_N
Note: Make sure the host device
includes DC blocking capacitors
on the Audio In lines – the
module does not include series
capacitors.
Rev 1.12.5 Jan.10
• Dynamic ranges for each programmable gain stage are
listed, with the following constraints:
· MIC_AMP1 is programmable to 0 dB or +24 dB only
· CodecSTGain, when set to the minimum setting, effec‐
tively mutes sidetone in the module codec
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Figure 4-2: MC5728V Audio system block
TX ADC
57.3mVrms
@ 0dBm0
Audio In
nsSw itch
HPF &
Slope
13 bit A/D
NS &
AAGC
TxPCMFilt
+12dB
-3dB
-84dB
TxVolume
Tx FIR
13K CELP/
EVRC
Encoder
+12dB
0dB
-84dB
MIC_A MP1
0 dB or +24 dB
MIC_SEL
CodecSTGain
0dB
-48dB
-96dB
22
PCM I/F
RF Filter
33n
Encoder
TX_HPF_DIS_N
TX_SLOPE_FILT_DIS_
CodecTxGain
CodecRxGain
AMP_SEL
Echo Cancellation
MIC1P
MIC1N
DTMF Tx Gain
DTMF
Decoder
DTMF
Encoder
Decoder
RF
Interface
DTMF Rx Gain
RX_HPF_DIS_N
35mW @ +3dBm0
SPK1P
SPK1N
13 bit D/A
HPF
Rx FIR
+12dB
0dB
-84dB
Audio Out
AAGC
13K CELP/
EVRC
Decoder
RxVolume
+12dB
-25dB RxPCMFilt
-84dB
RX DAC
MC8301V / MC8775V / MC8790V / MC8791V / MC8792V /
MC8795V system block
Figure 4‐3 represents the MC8301V/ MC8775V/ MC8790V /
MC8791V / MC8792V / MC8795V module’s audio system block,
and includes the following features:
• Module interconnects are shown on the left side of the
diagram. The analog audio interface uses the signals:
· MIC_P / MIC_N
· SPK_P / SPK_N
Note: Make sure the host device
includes DC blocking capacitors
on the analog Audio In lines –
the module does not include
series capacitors.
• The digital PCM audio interface uses the signals:
· PCM_CLK
· PCM_DIN
· PCM_DOUT
· PCM_SYNC
• Dynamic ranges for each programmable gain stage are
listed, with the following constraints:
· MIC_AMP1 is programmable in 1.5 dB steps
· CodecSTGain, when set to the minimum setting, effec‐
tively mutes sidetone in the module codec
• When PCM audio is selected, the RX DAC and TX ADC
blocks are bypassed—the external PCM codec controls
transmit gain, receive gain, and sidetone gain.
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Audio Interface
Note: Data mixing is not supported. If mixing of voice signal is
required, it must be done by the host processor.
Figure 4-3: MC8301V /MC8775V /MC8790V / MC8791V / MC8792V / MC8795V Audio
system block
PCM Audio interface
MIC_P
TX_HPF_DIS_N
TX_SLOPE_FILT_DIS_N
MIC_N
57.3mVrms
@ 0dBm0
HPF &
Slope
NS &
AAGC
+12dB
-3dB
-84dB
TxPCMFilt TxVolume
Tx FIR
13K CELP/
EVRC
Encoder
+12dB
0dB
-84dB
MIC_AMP1_GAIN
-6dB to +49.5dB
in 1.5dB steps
PCM I/F
CodecSTGain
+12dB
-48dB
-96dB
22p
CodecRxGain
AMP_SEL
001 010 100
SPK_N
nsSwitch
CodecTxGain
13 bit A/D
RF Filter
33n
Encoder
Echo Cancellation
Audio In
TX ADC
DTMF Tx Gain
DTMF
Decoder
DTMF
Encoder
Decoder
RF
Interface
DTMF Rx Gain
RX_HPF_DIS_N
35mW @ +3dBm0
SPK_P
13 bit D/A
HPF
Rx FIR
Audio Out
+12dB
0dB
-81dB
AAGC
13K CELP/
EVRC
Decoder
RxVolume
+12dB
-25dB RxPCMFilt
-84dB
RX DAC
Modes of operation
These modules support six operational modes: headset,
handset, car kit, speakerphone, AUX1, and TTY—end products
can use any combination of these modes.
The host device must use host‐modem messaging to tell the
module which mode to use for each call.
Sidetone support
The sidetone path mixes the near‐end transmit voice to the
near‐end receive. This gives the near‐end user some feedback
that indicates that the call is up and that the audio system is
functioning.
The sidetone path can be enabled in either the PDA codec or
the Mini Card modem—each path is equally valid. It should
not be added to both devices, and for speakerphone or car kit
applications, both sidetone paths should be disabled.
1. (MC5727V / MC5728V modules are preconfigured for
HAC [Hearing Aid Compatibility]).
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
The typical handset sidetone is 12 dB below transmit voice
levels.
For Handset and Headset mode, the threshold of pain
(+120 dBSPL) must not be exceeded at the maximum volume
setting. A good target for the medium volume setting is
+94 dBSPL, as this is a typical level for conversational speech.
Most audio gain should be added to the host audio front end
(within the PDA style codec gain blocks or amplifiers between
the host codec and transducers). Refer to the appropriate Mini
Card Product Specification Document for reference levels on
the modem receive and transmit side.
Echo cancellation support
The Mini Card offers four modes of echo cancellation to
support unique end‐unit audio capabilities (echo cancellation
can also be turned off completely). All echo cancellation is
near‐end (mobile TX) cancellation only. The network provides
some level of far‐end echo cancellation.
Table 4-3: Echo cancellation details
Mode
Handset
Details
• Short echo path (<16 ms travel time from speaker to
microphone)
• Handset design requires good isolation between
speaker and microphone
• Echo canceller allows full-duplex conversation with
absolute minimum echo
Headset
• Short echo path (<16 ms travel time from speaker to
microphone)
• Headset design may allow higher echo than
handset mode—microphone and speaker are physically closer
• More aggressive echo canceller algorithm allows
full-duplex conversation on headsets with good
isolation
Car kit
• Long echo path (<64 ms travel time from speaker to
microphone)
• Loud echo
• For use with hands-free car kit or speakerphone
applications with mild distortion
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Audio Interface
Table 4-3: Echo cancellation details
Mode
Details
Speakerphone
• Long echo path (<64 ms travel time from speaker to
microphone)
• Loud echo
• For use with speakerphone applications with high
distortion
• Half-duplex algorithm, very aggressive in near-end
Tx muting to eliminate transmitted echo
Off
Audio signal interface
The differential microphone input offers superior noise
rejection performance to the single‐ended approach. The
termination of the differential pair rejects common signals
(such as noise). The pair should be routed together for optimal
noise rejection. Since MIC_P and MIC_N are high impedance
inputs, it is important to isolate these from possible noise
sources (toggling digital lines with fast edges).
The speaker interface can be single‐ended or differential
depending on product. Single‐ended speaker outputs rely on
modem ground as an audio reference.
The audio passband for both receive and transmit paths
(speaker and microphone) extends from 300 Hz to 3.4 kHz. A
programmable sidetone with a range from mute to unity gain
is available for both headset and main audio paths. Sidetone
should be muted for speakerphone use.
Note that certain carriers now require use of hearing‐aid
compatible transducers in a handset design. The Primary
audio path can be interfaced directly to such devices. Refer to
ANSI C63.19 for details regarding reduced RF emissions (ʺU3
ratingʺ) and inductive / telecoil coupling (ʺU3Tʺ rating)
devices.
Table 4-4: Primary audio signal interface
Signal
Rev 1.12.5 Jan.10
Pin #
Type
Directions
Description
MIC_P
Analog
Input
Non-inverted
microphone input (+)
MIC_N
Analog
Input
Inverted microphone
input (-)
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table 4-4: Primary audio signal interface
Signal
Pin #
Type
Directions
Description
SPK_P
Analog
Output
Non-inverted
speaker output (+)
SPK_N
Analog
Output
Inverted speaker
output (-)
Table 4-5: PCM digital audio signal interface
Signal
Pin #
Type
Directions
Description
PCM_CLK
45
Digital
Output
PCM clock
PCM_DIN
47
Digital
Input (internal
pull-down)
PCM data in
PCM_DOUT
49
Digital
Output
PCM data out
PCM_SYNC
51
Digital
Input (internal
pull-down)
PCM sync
Audio function partitioning
These phone‐oriented functions are usually under module
control:
• FIR filters—both transmit and receive path
• Noise suppression—required due to high sensitivity and
gain in transmit path
• Echo cancellation—different for each audio path and
environment (handset, headset, car kit, speakerphone)
• High pass filtering / slope filtering functions—required per
phone acoustic requirements
• AGC (Automatic Gain Control)—normalizes audio
volumes in varying acoustic environments
• DTMF tones—the generation and detection of DTMF tones
is required in both directions of the phone interface
• Comfort noise—low level noise injected into receiver path
for user ʺconnectionʺ experience
• Simple ringers—digital and analog tones, melody ringers,
MIDI with limited memory storage
These functions are typically performed in the host codec:
• Voice Memo—performed by the host if significant memory
storage is required
• Polyphonic ringtone—host often supports WAV, MIDI
formats with significant memory storage
• Audio path switching—turn on audio path depending on
user interface selection, or headset detection
32
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Audio Interface
• Audio path mixing—required for voice memo recording
and playback via multiple audio paths
• Transducer interface—host provides acoustic drivers, must
occur outside of path switching and mixing
These functions can be performed in either host or module
codec, depending on balance of component selection and
engineering resources:
• Volume settings—adjustable gain settings based on user
interface selections
• Sidetone—careful placement of sidetone gain control is
required to prevent the need to adjust sidetone gain with
varying volume settings
Rev 1.12.5 Jan.10
Proprietary and Confidential
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
34
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5
5: Host / Module Interfaces
LED output
The module drives the LED output according to the PCI‐
Express Mini Card specification (summarized in Table 5‐1,
below).
Table 5-1: LED states
State
Indicates
Characteristics
Off
Module is not
powered.
Light is off.
On
Module is powered
and connected, but
not transmitting or
receiving.
Light is on.
Slow blink
Module is powered
and searching for a
connection.
LED is flashing at a
steady, slow rate.
• 250 ms ± 25% ON
period
• 0.2 Hz ± 25% blink
rate
Faster blink
Module is
transmitting or
receiving.
LED is flashing at a
steady, faster rate.
• Approximately 3 Hz
blink rate
Note: MC572x modules
support customer-defined
LED controls.
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Figure 5-1: Example LED
VCC 3.3V
Current limiting Resistor
LED
MiniCard
MIO
36
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A
A: Regulatory Information
Important notice
Because of the nature of wireless communications, trans‐
mission and reception of data can never be guaranteed. Data
may be delayed, corrupted (i.e., have errors) or be totally lost.
Although significant delays or losses of data are rare when
wireless devices such as the Sierra Wireless modem are used in
a normal manner with a well‐constructed network, the Sierra
Wireless modem should not be used in situations where failure
to transmit or receive data could result in damage of any kind
to the user or any other party, including but not limited to
personal injury, death, or loss of property. Sierra Wireless and
its affiliates accept no responsibility for damages of any kind
resulting from delays or errors in data transmitted or received
using the Sierra Wireless modem, or for failure of the Sierra
Wireless modem to transmit or receive such data.
Safety and hazards
Do not operate your MC57xx / MC8xxx modem:
• In areas where blasting is in progress
• Where explosive atmospheres may be present including
refuelling points, fuel depots, and chemical plants
• Near medical equipment, life support equipment, or any
equipment which may be susceptible to any form of radio
interference. In such areas, the MC57xx / MC8xxx modem
MUST BE POWERED OFF. Otherwise, the MC57xx /
MC8xxx modem can transmit signals that could interfere
with this equipment.
In an aircraft, the MC57xx / MC8xxx modem MUST BE
POWERED OFF. Otherwise, the MC57xx / MC8xxx modem
can transmit signals that could interfere with various onboard
systems and may be dangerous to the operation of the aircraft
or disrupt the cellular network. Use of a cellular phone in an
aircraft is illegal in some jurisdictions. Failure to observe this
instruction may lead to suspension or denial of cellular
telephone services to the offender, or legal action or both.
Some airlines may permit the use of cellular phones while the
aircraft is on the ground and the door is open. The MC57xx /
MC8xxx modem may be used normally at this time.
Rev 1.12.5 Jan.10
Proprietary and Confidential
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Important compliance
information for North American
users
The MC57xx / MC8xxx modem has been granted modular
approval for mobile applications. Integrators may use the
MC57xx / MC8xxx modem in their final products without
additional FCC / IC (Industry Canada) certification if they
meet the following conditions. Otherwise, additional FCC / IC
approvals must be obtained.
38
1.
At least 20 cm separation distance between the antenna
and the user’s body must be maintained at all times.
2.
To comply with FCC / IC regulations limiting both
maximum RF output power and human exposure to RF
radiation, the maximum antenna gain including cable loss
in a mobile‐only exposure condition must not exceed 5 dBi
in the cellular band and 4 dBi in the PCS band.
3.
The MC57xx / MC8xxx modem and its antenna must not
be co‐located or operating in conjunction with any other
transmitter or antenna within a host device.
4.
A label must be affixed to the outside of the end product
into which the MC57xx / MC8xxx modem is incorporated,
with a statement similar to the following:
· For MC5725 / MC5725V:
This device contains FCC ID: N7N‐MC5725
This equipment contains equipment certified under
IC: 2417C‐MC5725
· For MC5727 / MC5727V:
This device contains FCC ID: N7N‐MC5727
This equipment contains equipment certified under
IC: 2417C‐MC5727
· For MC5728V:
This device contains FCC ID: N7N‐MC5728
This equipment contains equipment certified under
IC: 2417C‐MC5728
· For MC8301V:
This device contains FCC ID: N7NMC8301
This equipment contains equipment certified under
IC: 2417C‐MC8301
· For MC8775 / MC8775V:
This device contains FCC ID: N7NMC8775
This equipment contains equipment certified under
IC: 2417C‐MC8775
· For MC8780:
This device contains FCC ID: N7NMC8780
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Regulatory Information
·
·
·
·
·
5.
For MC8781:
This device contains FCC ID: N7NMC8781
This equipment contains equipment certified under
IC: 2417C‐MC8781
For MC8790 / MC8790V:
This device contains FCC ID: N7NMC8790
This equipment contains equipment certified under
IC: 2417C‐MC8790
For MC8792V:
This device contains FCC ID: N7NMC8792
This equipment contains equipment certified under
IC: 2417C‐MC8792
For MC8795V:
This device contains FCC ID: N7NMC8795
This equipment contains equipment certified under
IC: 2417C‐MC8795
For MC8700:
This device contains FCC ID: N7NMC8700
This equipment contains equipment certified under
IC: 2417C‐MC8700
A user manual with the end product must clearly indicate
the operating requirements and conditions that must be
observed to ensure compliance with current FCC / IC RF
exposure guidelines.
The end product with an embedded MC57xx / MC8xxx
modem may also need to pass the FCC Part 15 unintentional
emission testing requirements and be properly authorized per
FCC Part 15.
Note: If this module is intended for use in a portable device,
you are responsible for separate approval to satisfy the SAR
requirements of FCC Part 2.1093 and IC RSS‐102.
EU regulatory conformity
Sierra Wireless hereby declares that the MC8301V, MC8775,
MC8775V, MC8780, MC8790, MC8790V, MC8791V, MC8792V,
MC8795V, and MC8700 modems conform with all essential
requirements of Directive 1999/5/EC.
MC8301V:
MC8775, MC8775V, MC8780, MC8790, MC8790V, MC8791V,
MC8792V:
Rev 1.12.5 Jan.10
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
MC8795V:
MC8700:
The Declaration of Conformity made under Directive 1999/5/
EC is available for viewing at the following location in the EU
community:
Sierra Wireless (UK), Limited
Lakeside House
1 Furzeground Way, Stockley Park East
Uxbridge, Middlesex
UB11 1BD
England
Brazil ANATEL homologation
(MC8790 somente) Este produto está homologado pela
ANATEL, de acordo com os procedimentos regulamentados
pela Resolução 242/2000, e atende aos requisitos técnicos
aplicados.
Para maiores informações, consulte o site da ANATEL
www.anatel.gov.br.
40
Proprietary and Confidential
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B
B: Acronyms and Definitions
Table B-1: Acronyms and definitions
Acronym or term
Definition
AGC
Automatic Gain Control
BER
Bit Error Rate - a measure of receive sensitivity
BLER
Block Error Rate
Call Box
Base Station Simulator - Agilent E8285A or 8960, Rohde &
Schwarz CMU200
CDMA
Code Division Multiple Access
dB
Decibel = 10 x log10 (P1/P2)
P1 is calculated power; P2 is reference power
Decibel = 20 x log10 (V1/V2)
V1 is calculated voltage, V2 is reference voltage
dBm
Decibels, relative to 1 mW - Decibel(mW) = 10 x log10 (Pwr (mW)/
1mW)
DUT
Device Under Test
EDGE
Enhanced Data rates for GSM Evolution
EM
Embedded Module
ESD
ElectroStatic Discharge
FER
Frame Error Rate - a measure of receive sensitivity
GPRS
General Packet Radio Services
GPS
Global Positioning System
GSM
Global System for Mobile communications
Hz
Hertz = 1 cycle/second
inrush current
Peak current drawn when a device is connected or powered on
IS-2000
3G radio standards for voice and data (CDMA only)
IS-95
2G radio standards targeted for voice (cdmaONE)
LDO
Low Drop Out - refers to linear regulator
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
Table B-1: Acronyms and definitions
Acronym or term
42
Definition
MC5725 / MC5725V /
MC5727 / MC5727V /
MC5728V
Sierra Wireless Mini Cards used on CDMA networks
MC57xx
Any of the following CDMA Mini Cards: MC5725 / MC5725V /
MC5727 / MC5727V / MC5728V
MC8301V / MC8775 /
MC8775V /
MC8780 / MC8781 /
MC8790 / MC8790V /
MC8791V / MC8792V /
MC8795V / MC8700
Sierra Wireless Mini Cards used on GSM / UMTS networks
MC8xxx
Any of the following GSM / UMTS Mini Cards: MC8301V / MC8775 /
MC8775V / MC8780 / MC8781 / MC8790 / MC8790V / MC8791V /
MC8792V / MC8795V / MC8700
MHz
MegaHertz = 10E6 Hertz (Hertz = 1 cycle/second)
MIO
Module Input/Output
MPE
Maximum Permissible Exposure — the level of radiation to which a
person may be exposed without hazardous effect or adverse
biological changes
OTA
Over-The-Air or Radiated through the antenna
PCS
Personal Communication System - PCS spans the 1.9 GHz radio
spectrum
RF
Radio Frequency
RMS
Root Mean Square
SA
Selective Availability
Sensitivity (Audio)
Measure of lowest power signal that the receiver can measure
Sensitivity (RF)
Measure of lowest power signal at the receiver input that can
provide a prescribed BER / BLER / SNR value at the receiver
output.
SIM
Subscriber Identity Module
SNR
Signal to Noise Ratio
SOF
Start of Frame - a USB function
UART
Universal Asynchronous Receiver Transmitter
UDK
Universal Development Kit (PCI Express Mini Card Dev Kit)
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Acronyms and Definitions
Table B-1: Acronyms and definitions
Acronym or term
Definition
UMTS
Universal Mobile Telecommunications System
USB
Universal Serial Bus
USIM
Universal Subscriber Identity Module
VCC3.3
3.3 V supply voltage
WCDMA
Wideband Code Division Multiple Access — In this document, the
term “UMTS” is used instead of “WCDMA”.
XIM
In this document, XIM is used as part of the contact identifiers for
the USIM interface (XIM_VCC, XIM_CLK, etc.).
Rev 1.12.5 Jan.10
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
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Index
Numerics
1X
CDMA Standard 11
acronyms and definitions 41–43
airplane mode 17
antenna
connection and mounting points 21
connection considerations 20
custom, considerations 22
diversity antenna, disabling 23
limit, matching coaxial connections 20
location, considerations 22
matching, considerations 22
maximum cable loss 20
AT commands
3GPP specification, details 11
low power mode, setting 17
standard, MC57xx (reference document) 11
standard, MC8xxx (reference document) 13
AT commands, extended
MC57xx, reference 11
MC8xxx, reference 13
AT commands, standard
MC57xx, reference 11
MC8xxx, reference 13
audio
features, summary 25
functions, host‐controlled 32
functions, module‐controlled 32
functions, responsible codecs 26
interface 25–33
path mixing, host‐controlled 33
path switching, host‐controlled 32
PCM digital, signal interface 32
primary, signal interface 31
signal interface 31
system block diagram, MC5725V 26
system block diagram, MC5727V 26
system block diagram, MC5728V 27
system block diagram, MC8xxxV 28
audio modes, supported 29
audio pass band 26
audio passband, Rx and Tx 31
automatic gain control (AGC)
module‐controlled 32
car kit audio mode 25
car kit mode
echo cancellation 30
CDMA
1X Standard 11
CnS
MC57xx reference 11
MC8xxx reference 13
voice reference 13
codec
for audio functions 26
comfort noise
module‐controlled 32
connection
grounding 21
connectors, required
EDGE mating (52‐pin) 10
host‐module 10
RF, Hirose 10
USIM 10
current
consumption, usage models 17
DCS 1800
RF parameters, MC8xxx 19
desense. See RF
disconnected, module power state 16
diversity antenna
disabling 23
DTMF
codec 26
module‐controlled 32
echo cancellation
audio feature 25
codec 26
details 30
module‐controlled 32
support, all modes 30
EDGE connector, manufacturers 10
EGSM 900
RF parameters, MC8xxx 19
electrostatic discharge. See ESD
ESD
protection requirements 15–16
testing techniques document (IEC‐61000‐4‐2) 11
cable loss
antenna, maximum 20
Rev 1.12.5 Jan.10
FCC
Proprietary and Confidential
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
regulations, relevant section 11
filtering
high pass / slope filtering, module‐controlled 32
filtering stages, audio 25
FIR filtering
audio feature 26
codec 26
module‐controlled 32
gain
codec 26
distribution, audio 30
limits, adjustable 25
GPS band
RF parameters, MC8xxx 20
grounding
connection considerations 21
GSM 850
RF parameters, MC8xxx 19
handset audio mode 25
handset mode
echo cancellation 30
headset audio mode 25
headset mode
echo cancellation 30
impedance
module‐antenna 22
interface
audio signal 31
interference
device generated 24
power supply noise 23
wireless devices 23
LED
example 36
states 35
low power mode
setting, AT commands 17
low power, module power state 17
MC5725
AT reference (extended) 11
AT reference (standard) 11
CnS reference 11
46
networks supported 9
product specification 11
MC5725V
AT reference (extended) 11
AT reference (standard) 11
audio interface, supported 25
CnS reference 11
networks supported 9
product specification 11
MC5727
AT reference (extended) 11
AT reference (standard) 11
CnS reference 11
networks supported 9
product specification 12
MC5727V
AT reference (extended) 11
AT reference (standard) 11
audio interface, supported 25
CnS reference 11
networks supported 9
product specification 12
MC5728V
AT reference (extended) 11
AT reference (standard) 11
audio interface, supported 25
CnS reference 11
networks supported 9
product specification 12
MC8301V
AT reference (extended), and MC8xxx 13
AT reference (standard), and MC8xxx 13
CnS reference, and MC8xxx 13
CnS voice reference, and MC8xxxV 13
networks supported 9
product specification 12
RF parameters 19
MC8700
AT reference (extended), and MC8xxx 13
AT reference (standard), and MC8xxx 13
CnS reference, and MC8xxx 13
networks supported 9
product specification 12
RF parameters 19
MC8775
AT reference (extended), and MC8xxx 13
AT reference (standard), and MC8xxx 13
CnS reference, and MC8xxx 13
networks supported 9
product specification 12
RF parameters 19
MC8775V
AT reference (extended), and MC8xxx 13
AT reference (standard), and MC8xxx 13
audio interface, supported 25
CnS reference, and MC8xxx 13
CnS voice reference, and MC8xxxV 13
networks supported 9
product specification 12
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Index
RF parameters 19
MC8780
AT reference (extended), and MC8xxx 13
AT reference (standard), and MC8xxx 13
CnS reference, and MC8xxx 13
networks supported 9
product specification 12
RF parameters 19
MC8781
AT reference (extended), and MC8xxx 13
AT reference (standard), and MC8xxx 13
CnS reference, and MC8xxx 13
networks supported 9
product specification 12
RF parameters 19
MC8790
AT reference (extended), and MC8xxx 13
AT reference (standard), and MC8xxx 13
CnS reference, and MC8xxx 13
networks supported 9
product specification 12
RF parameters 19
MC8790V
AT reference (extended), and MC8xxx 13
AT reference (standard), and MC8xxx 13
audio interface, supported 25
CnS reference, and MC8xxx 13
CnS voice reference, and MC8xxxV 13
networks supported 9
product specification 12
RF parameters 19
MC8791V
AT reference (extended), and MC8xxx 13
AT reference (standard), and MC8xxx 13
audio interface, supported 25
CnS reference, and MC8xxx 13
CnS voice reference, and MC8xxxV 13
networks supported 9
product specification 12
RF parameters 19
MC8792V
AT reference (extended), and MC8xxx 13
AT reference (standard), and MC8xxx 13
audio interface, supported 25
CnS reference, and MC8xxx 13
CnS voice reference, and MC8xxxV 13
networks supported 9
product specification 12
RF parameters 19
MC8795V
AT reference (extended), and MC8xxx 13
AT reference (standard), and MC8xxx 13
audio interface, supported 25
CnS reference, and MC8xxx 13
CnS voice reference, and MC8xxxV 13
networks supported 9
product specification 12
RF parameters 19
Mini Card
Rev 1.12.5 Jan.10
Dev Kit Quick Start Guide 13
PCI Express Specification 13
See also MC5725, MC5725V, MC5727, MC5727V,
MC5728V, MC8775, MC8775V, MC8780,
MC8781, MC8790, MC8790V, MC8791V,
MC8792V, MC8795V, MC8700
mixing
codec 26
networks
supported, by module type 9
noise
leakage, minimizing 21
RF interference, power supply 23
noise suppression
audio feature 25
module‐controlled 32
normal, module power state 17
off, module power state 17
output driver stage, audio feature 25
path switching
codec 26
PCI Express
Mini Card specification 13
PCM digital audio, signal interface 32
PCS 1900
RF parameters, MC8xxx 19
polyphonic ringtone
host‐controlled 32
power
default state 17
disconnected, characteristics 16
normal, characteristics 17
off, characteristics 17
required supply voltage 15
signals, overview 15
state, disconnected 16
state, low power 17
state, normal 17
state, off 17
supply, RF interference 23
supply, ripple limit 23
product specification (PSD) 11, 12
PSD (Product Specification Document) 11, 12
regulatory information 37–40
Brazil 40
Proprietary and Confidential
47
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CDMA and GSM / UMTS Mini Card Hardware Integration Guide
EU 39
FCC 38
limitation of liability 37
safety and hazards 37
RF
antenna cable loss, maximum 20
antenna connection, considerations 20
cable type, required 10
desense
device‐generated 24
interference
other devices 24
power supply 23
wireless devices 23
parameters
MC8xxx 19
parameters, MC8xxx
DCS 1800 19
EGSM 900 19
GPS 20
GSM 850 19
PCS 1900 19
UMTS 1900 19
UMTS 2100 19
UMTS 850 19, 20
ringer tone
codec 26
ringers
module‐controlled 32
ringtone, polyphonic
host‐controlled 32
testing
ESD immunity, techniques document (IEC‐61000‐
4‐2) 11
transducer interface
host‐controlled 33
transducer interfaces
codec 26
UDK (Universal Development Kit)
components, included 9
UMTS 1900
RF parameters, MC8xxx 19
UMTS 2100
RF parameters, MC8xxx 19
UMTS 850
RF parameters, MC8xxx 19, 20
Universal Development Kit (UDK)
components, included 9
Universal Serial Bus. See USB.
usage models
current consumption 17
USB
specification 13
USIM
connector type, required 10
shielding
module, compliance 22
sidetone
responsible codec 33
support 29
SIM
testing methods, MS conformance specification 13
See also USIM
speakerphone audio mode 25
speakerphone mode
echo cancellation 31
system block
MC5725V, audio 26
MC5727V, audio 26
MC5728V, audio 27
MC8xxxV, audio 28
48
voice memo
host‐controlled 32
volume, setting
responsible codec 33
W_Disable#
Normal state 17
off state 17
ZIF (Zero Intermediate Frequency) 23
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