Sierra Wireless MC8301 Multi-band Radio Module User Manual HW Integration Guide
Sierra Wireless Inc. Multi-band Radio Module HW Integration Guide
Manual
CDMA and GSM / UMTS Mini Card Hardware Integration Guide Proprietary and Confidential Includes: MC5725 MC8301V MC5725V MC8775 MC5727 MC8775V MC5727V MC8780 MC5728V MC8781 MC8790 MC8790V MC8791V MC8792V MC8795V MC8700 2130114 Rev 1.12.5 Preface Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well‐constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless accepts no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and Hazards Do not operate the Sierra Wireless modem in areas where blasting is in progress, where explosive atmospheres may be present, near medical equipment, near life support equipment, or any equipment which may be susceptible to any form of radio interference. In such areas, the Sierra Wireless modem MUST BE POWERED OFF. The Sierra Wireless modem can transmit signals that could interfere with this equipment. Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE POWERED OFF. When operating, the Sierra Wireless modem can transmit signals that could interfere with various onboard systems. Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. Sierra Wireless modems may be used at this time. The driver or operator of any vehicle should not operate the Sierra Wireless modem while in control of a vehicle. Doing so will detract from the driver or operatorʹs control and operation of that vehicle. In some states and provinces, operating such communications devices while in control of a vehicle is an offence. Limitation of Liability Rev 1.12.5 Jan.10 The information in this manual is subject to change without notice and does not represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR Proprietary and Confidential In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY. Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates aggregate liability arising under or in connection with the Sierra Wireless product, regardless of the number of events, occurrences, or claims giving rise to liability, be in excess of the price paid by the purchaser for the Sierra Wireless product. Patents Portions of this product may be covered by some or all of the following US patents: 5,515,013 5,629,960 5,845,216 5,847,553 5,878,234 5,890,057 5,929,815 6,169,884 6,191,741 6,199,168 6,339,405 6,359,591 6,400,336 6,516,204 6,561,851 6,643,501 6,653,979 6,697,030 6,785,830 6,845,249 6,847,830 6,876,697 6,879,585 6,886,049 6,968,171 6,985,757 7,023,878 7,053,843 7,106,569 7,145,267 7,200,512 7,295,171 7, 287,162 D442,170 D459,303 D599,256 D560,911 and other patents pending. This product includes technology licensed from QUALCOMM® 3G. Manufactured or sold by Sierra Wireless or its licensees under one or more patents licensed from InterDigital Group. Copyright ©2010 Sierra Wireless. All rights reserved. Trademarks AirCard® and “Heart of the Wireless Machine®” are registered trademarks of Sierra Wireless. Watcher® is a trademark of Sierra Wireless, registered in the European Community. Sierra Wireless, the Sierra Wireless logo, the red wave design, and the red‐tipped antenna are trademarks of Sierra Wireless. Windows® is a registered trademark of Microsoft Corporation. QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used under license. Linux® is a registered trademark of Linus Torvalds. Other trademarks are the property of the respective owners. Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Preface Contact Information Sales Desk: Phone: 1-604-232-1488 Hours: 8:00 AM to 5:00 PM Pacific Time E-mail: sales@sierrawireless.com Post: Sierra Wireless 13811 Wireless Way Richmond, BC Canada V6V 3A4 Fax: 1-604-231-1109 Web: www.sierrawireless.com Consult our website for up‐to‐date product descriptions, documentation, application notes, firmware upgrades, trouble‐ shooting tips, and press releases: www.sierrawireless.com Rev 1.12.5 Jan.10 Proprietary and Confidential In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 The Universal Development Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Required connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Guide organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Related documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Power Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Overview of operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Power signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Module power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disconnected state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Normal state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Low power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Usage models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 16 17 17 17 17 RF Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 RF connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Ground connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Antenna and cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Interference and sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Power supply noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Interference from other wireless devices . . . . . . . . . . . . . . . . . . . . . . . . . . Device-generated RF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 23 23 24 Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25 Rev 1.12.5 Jan.10 Proprietary and Confidential In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide System block diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Modes of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Sidetone support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Echo cancellation support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audio signal interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Audio function partitioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 29 29 30 31 32 Host / Module Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 LED output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Safety and hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 Important compliance information for North American users . . . . . . . . . . . 38 EU regulatory conformity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Brazil ANATEL homologation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Acronyms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 1 1: Introduction Sierra Wireless’ Mini Card modules form the radio component for the products in which they are embedded. Mini Cards are available for use on CDMA and GSM networks, including: Note: Throughout this document, MC57xx and MC8xxx refer to the entire suites of CDMA and GSM Mini Cards respectively. • MC5725 / MC5725V / MC5727 / MC5727V / MC5728V—Operate on CDMA networks using the CDMA IS‐95A, 1X, and 1xEV‐DO (IS‐856) network standards, and support GPS. • MC8775 / MC8775V—Operate on GSM networks using the GSM / GPRS / EDGE / UMTS / HSDPA network standards, and support Standalone GPS functionality. • MC8301V / MC8780 / MC8781 / MC8790 / MC8790V / MC8791V / MC8792V / MC8795V—Operate on GSM networks using the GSM / GPRS / EDGE / UMTS / HSDPA / HSUPA network standards, and support Standalone GPS, gpsOneXTRA™, A‐GPS, selected enhanced Navigation 2.0 features, and five NMEA sentences. • MC8700—Operates on GSM networks using the GSM / GPRS / EDGE / UMTS / HSDPA / HSUPA / HSPA+ network standards. Purpose of this guide This guide addresses issues that affect the integration of Sierra Wireless modules into host products, and includes design recommendations for the host products. Note: An understanding of network technology and experience in integrating hardware components into electronic equipment is assumed. The Universal Development Kit Sierra Wireless manufactures a Universal Development Kit (UDK) that facilitates all phases of the integration process. This kit is a hardware development platform that is designed to support multiple members of the wireless embedded module product family. It contains the hardware components that are typically necessary for evaluating and developing with the module, including: • Development board • Cables • Antennas • Other accessories Rev 1.12.5 Jan.10 Proprietary and Confidential In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide For instructions on setting up the UDK, see PCI Express Mini Card Dev Kit Quick Start Guide (Document 2130705). Required connectors Note: Contact vendors before choosing your connectors — the numbers included here are for reference only. Choose connectors that are appropriate to your design. When integrating these modules into your host device, you need the following connector types: • RF cables that mate with Hirose U.FL connectors (model U.FL #CL331‐0471‐0‐10). Modules include one or two connector jacks depending on individual module support for diversity or GPS functionality. • Industry‐standard mating connector for 52‐pin EDGE— some manufacturers include Tyco, Foxconn, and Molex. For example, the connector used on the Mini Card Dev Kit board is a Molex 67910‐0001. • Industry‐standard USIM connector (MC8xxx only)—the actual connector you use depends on how your device exposes the USIM socket. For example, the USIM connector used on the Mini Card Dev Kit board is an ITT CCM03‐ 3518. Guide organization This guide includes the following sections: 1. 2. 3. 4. 5. 6. 7. 8. Introduction (this section) Power Interface (p.15) Describes power control signals used by the module and discusses design issues related to power supply integration. RF Integration (p.19) Describes antenna connection methods and grounding issues, RF interference and desense issues. Audio Interface (p.25) Describes supported audio modes and related details. Host / Module Interfaces (p.35) Describes the USB interface for host / module communication, and the USIM interface for host / module integration. Regulatory Information (p.37) Describes regulatory approvals and regulatory information requirements. Acronyms and Definitions (p.41) Lists acronyms and definitions used throughout this guide. Index (p.121) Note: The term "host" always refers to the host device. 10 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Introduction Related documents This guide deals specifically with hardware integration issues that are unique to the MC57xx and MC8xxx modules. Table 1‐1 lists other documents referenced in this guide. Table 1-1: Related documentation Document title Description AT Command Set for User Equipment (UE) (Release 6) Standard AT commands for GSM / UMTS devices. CDMA 1X Standard Technical requirements for CDMA systems, including details on sleep cycle index (SCI) values. Download this document (3GPP TS 27.007) from www.3gpp.org. Order this document, CDMA 2000 Series Release A (2000) (document # TIA/EIA/IS-2000 Series, Release A) from www.tiaonline.org. CDMA CnS Reference (Document 2130754) CnS (Control and Status) messages that are supported by the MC5725 / MC5725V / MC5727 / MC5727V / MC5728V. CDMA AT Command Reference (Document 2130620) Proprietary, basic AT commands for the MC5725 / MC5725V / MC5727 / MC5727V / MC5728V. For MC8xxx-specific commands, see UMTS Modems Supported AT Command Reference (Document 2130617). CDMA Extended AT Command Reference (Document 2130621) Proprietary AT commands for the MC5725 / MC5725V / MC5727 / MC5727V / MC5728V. FCC Regulations - Part 15 Radio Frequency Devices This section of the FCC Code of Federal Regulations, Title 47 deals with radio frequency devices, including shielding requirements for embedded modules. For MC8xxx-specific commands, see MC87xx Modem Extended AT Command Reference (Document 2130616). Download this regulation from http://wireless.fcc.gov. Techniques for testing and measuring electrostatic discharge (ESD) immunity. IEC-61000-4-2 level 3 Order this document from www.iec.ch. MC5725 Mini Card Product Specification (Document 2130663) Features, mechanical and electrical specifications, and standards compliance of the MC5725. MC5725V Mini Card Product Specification (Document 2130671) Features, mechanical and electrical specifications, and standards compliance of the MC5725V. Rev 1.12.5 Jan.10 Proprietary and Confidential 11 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide Table 1-1: Related documentation (Continued) Document title 12 Description MC5727 Mini Card Product Specification (Document 2130958) Features, mechanical and electrical specifications, and standards compliance of the MC5727. MC5727V Mini Card Product Specification (Document 2131023) Features, mechanical and electrical specifications, and standards compliance of the MC5727V. MC5728V Mini Card Product Specification (Document 2111350) Features, mechanical and electrical specifications, and standards compliance of the MC5728V. MC8301V PCI Express Mini Card Product Specification (Document 2131326) Features, mechanical and electrical specifications, and standards compliance of the MC8301V. MC8775 PCI Express Mini Card Product Specification (Document 2130697) Features, mechanical and electrical specifications, and standards compliance of the MC8775. MC8775V with Audio PCI Express Mini Card Product Specification (Document 2130700) Features, mechanical and electrical specifications, and standards compliance of the MC8775V. MC8780 / MC8781 PCI Express Mini Card Product Specification (Document 2130782) Features, mechanical and electrical specifications, and standards compliance of the MC8780 / MC8781. MC8790 PCI Express Mini Card Product Specification (Document 2111279) Features, mechanical and electrical specifications, and standards compliance of the MC8790. MC8790V PCI Express Mini Card Product Specification (Document 2111280) Features, mechanical and electrical specifications, and standards compliance of the MC8790V. MC8791V PCI Express Mini Card Product Specification (Document 2131032) Features, mechanical and electrical specifications, and standards compliance of the MC8791V. MC8792V PCI Express Mini Card Product Specification (Document 2131033) Features, mechanical and electrical specifications, and standards compliance of the MC8792V. MC8795V PCI Express Mini Card Product Specification (Document 2131276) Features, mechanical and electrical specifications, and standards compliance of the MC8795V. MC8700 PCI Express Mini Card Product Specification (Document 2131202) Features, mechanical and electrical specifications, and standards compliance of the MC8700. Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Introduction Table 1-1: Related documentation (Continued) Document title Description MC87XX Modem CnS Reference (Document 2130602) CnS (Control and Status) messages supported by the MC8xxx series of modems. MC87xx Modem CnS Reference (Voice) (Document 2130817) Voice-related CnS (Control and Status) messages supported by the MC8301V, MC8775V, MC8790V,MC8791V, and MC8792V, and MC8795V. UMTS Modems Supported AT Command Reference (Document 2130617) Proprietary, basic AT commands for the MC8xxx. For MC57xx-specific commands, see the CDMA AT Command Reference (Document 2130620). MC87xx Modem Extended AT Command Reference (Document 2130616) Proprietary AT commands for the MC8xxx. For MC57xxspecific commands, see the CDMA Extended AT Command Reference (Document 2130621). Mobile Station (MS) Conformance Specification; Part 4: Subscriber Interface Module SIM testing methods. PCI Express Mini Card Dev Kit Quick Start Guide (Document 2130705) Setup and configuration of modules. PCI Express Mini Card Electromechanical Specification Revision 1.1 Download this document from www.pcisig.com. Universal Serial Bus Specification, Rev 2.0 Download this specification from www.usb.org. Rev 1.12.5 Jan.10 Download this document (3GPP TS 11.10-4) from www.3gpp.org. Proprietary and Confidential 13 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide 14 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 2 2: Power Interface Overview of operation Note: This chapter contains information for CDMA (MC57xx) and GSM (MC8xxx) modules. Information that is unique to specific module types is clearly identified. The module is designed to use a 3.3V (nominal) power supply, provided by the host. It is the host’s responsibility to provide safe and continuous power to the module at all times; the module does NOT have an independent power supply, or protection circuits to guard against electrical issues. The module’s power state is controlled by the host’s assertion / de‐assertion of the W_Disable# signal. The module also monitors its supply voltage and requests shutdown if the supply is insufficient. Power signals The module must be connected to a 3.3V power supply (as described in PCI Express Mini Card Electromechanical Specifi‐ cation Revision 1.1). The MC8xxx has more power pins than the MC57xx due to higher peak current requirements for GSM devices. For detailed pinout and voltage / current requirements of these modules, see the Product Specification Document for your Mini Card. Electrostatic discharge (ESD) You are responsible for ensuring that the host has adequate ESD protection on digital circuits and antenna ports: • (Operational) RF port (antenna launch and RF connector): IEC‐61000‐4‐2 — Level (Electrostatic Discharge Immunity Test) • (Non‐operational) Host connector interface: JESD22‐A114‐B +/‐ 1kV Human Body Model and JESD22‐C101 +/‐ 125 V Charged Device Model • MC5728V only: (Non‐operational) Host connector interface: JESD22‐A114‐B +/‐ 200V Human Body Model and JESD22‐C101 +/‐ 250 V Charged Device Model Rev 1.12.5 Jan.10 Proprietary and Confidential 15 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide MC5728V has placeholders for additional ESD devices, for cases where the device must, per customer requirements, meet the higher Human Body Model (+/‐1kV) ESD rating. Specific recommendations are provided where needed in this guide, however, the level of protection required depends on your application. Note: ESD protection is highly recommended for the USIM connector at the point where the contacts are exposed, and for any other signals from the host interface that would be subjected to ESD by the user of the product. Module power states The module has four power states: • Disconnected No power to the module. • Off Power to the module, but the module is powered off. • Normal The module is active. Several modes are possible (Receive, Transmit, Sleep, Shutdown). • Low power (“airplane mode”) The module is active, but RF is disabled. Note: The module unit defaults to the Normal state when VCC3.3 is first applied in the absence of W_Disable# control. State machines are implemented in the module to monitor the power supply and operating temperature. Disconnected state Note: The difference between the Disconnected and Off states is that, in the Off state, the module is still connected to the power source and draws minimal current. 16 This state occurs when there is no power to the module — the host power source is disconnected from the module and all voltages associated with the module are at 0 V. Whether the host device is also powered off depends on the power rail design. If the connection between the power rail and the module is controlled by the host, the host can stay powered on and cut the power to put the modem into the disconnected state. If the power rail is shared between the host device and the module, the host is powered off when the module is powered off. Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Power Interface Off state In this state, the host is powered up and the module is powered down (but still connected to the power source). The host keeps the module powered off by driving the W_Disable# signal low. In this state, the module draws minimal current. Normal state Note: This is the default state when VCC3.3 is first applied in the absence of W_Disable# control. This is the active state of the module. In this state: • The module is fully powered. • The module is capable of placing / receiving calls or estab‐ lishing data connections on the wireless network. • The USB interface is fully active. Low power mode In this state, RF (both Rx and Tx) is disabled in the module, but the USB interface is still active. This low power mode (ʺairplane modeʺ) is controlled by software commands through the host interface. For instructions on using the commands, refer to AT Command Set for User Equipment (UE) (Release 6) (+CFUN=0 command), CDMA CnS Reference (Document 2130754) (CNS_RADIO_POWER [0x1075] command), or MC87XX Modem CnS Reference (Document 2130602) (Disable Modem command). Usage models Usage models can be used to calculate expected current consumption. A sample usage model is provided in Table 2‐1. Table 2-1: Power consumption of a sample application Used by a field worker (data only) Rev 1.12.5 Jan.10 Used for remote data logging Upload (module Tx) 1000 kB/day 40 kB/h Download (module Rx) 500 kB/day 100 kB/day Coverage / data rate 1X / 80 kbps IS-95 / 14.4 kbps Proprietary and Confidential 17 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide Table 2-1: Power consumption of a sample application (Continued) Used by a field worker (data only) Used for remote data logging Hours of operation 8/day (off 16 hrs/day) 24/day Total power consumed over 24 hours 60 mAh 200 mAh This example model applies to a battery‐operated device. In practice, because the module is isolated from the battery (the host device manages the power source), the mAh ratings depend on the device’s supply efficiency. The module automatically enters slotted sleep mode when there is no transmission or reception occurring (SCI = 2). Transmit power is assumed to be +3 dBm. 18 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 3 3: RF Integration The MC8xxx operates on the frequencies detailed in Table 3‐1. Table 3-1: MC8xxx— RF parameters Product Rev 1.12.5 Jan.10 Band Frequencies (MHz) MC8301V MC8775 MC8775V MC8780 MC8781 MC8790 MC8790V MC8791V MC8792V MC8795V MC8700 GSM 850 (2%) CS Tx: 824–849 Rx: 869-894 EGSM 900 (2%) CS Tx: 880-915 Rx: 925-960 DCS 1800 (2%) CS Tx: 1710-1785 Rx: 1805-1880 PCS 1900 (2%) CS Tx: 1850-1910 Rx: 1930-1990 MC8301V MC8775 MC8775V MC8780 MC8781 MC8790 MC8790V MC8791V MC8792V MC8795V MC8700 Band I UMTS 2100 (0.1%) 12.2 kbps Tx: 1920–1980 Rx: 2110–2170 MC8301V MC8775 MC8775V MC8780 MC8781 MC8790 MC8790V MC8792V MC8795V MC8700 Band II UMTS 1900 (0.1%) 12.2 kbps Tx: 1850–1910 Rx: 1930–1990 MC8301V MC8775 MC8775V MC8780 MC8781 MC8790 MC8790V MC8795V MC8700 Band V UMTS 850 (0.1%) 12.2 kbps Tx: 824–849 Rx: 869–894 (Band VI is included as a subset of Band V) Proprietary and Confidential 19 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide Table 3-1: MC8xxx— RF parameters (Continued) Product Band Frequencies (MHz) MC8792V MC8795V MC8700 Band VIII UMTS 900 (0.1%) 12.2 kbps Tx: 880–915 Rx: 925–960 MC8301V MC8775V MC8780 MC8781 MC8790 MC8790V MC8791V MC8792V MC8795V GPS 1575.42 RF connection When attaching an antenna to the module: Note: To disconnect the antenna, make sure you use the Hirose U.FL connector removal tool (P/N UFL-LP-N-2(01)) to prevent damage to the module or coaxial cable assembly. 20 • Use a Hirose U.FL connector (model U.FL #CL331‐0471‐0‐10) to attach an antenna to a connection point on the module, as shown in Figure 3‐1 (the main RF connector on the top side; the diversity RF or GPS connector on the bottom side). • Match coaxial connections between the module and the antenna to 50 Ω. • Minimize RF cable losses to the antenna; the recommended maximum cable loss for antenna cabling is 0.5 dB. Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. RF Integration Figure 3-1: Antenna connection points and mounting holes Ground connection When connecting the module to system ground: • Prevent noise leakage by establishing a very good ground connection to the module through the host connector. • Connect to system ground using the two mounting holes at the top of the module (as shown in Figure 3‐1). • Minimize ground noise leakage into the RF. Depending on the host board design, noise could potentially be coupled to the module from the host board. This is mainly an issue for host designs that have signals traveling along the length of the module, or circuitry operating at both ends of the module interconnects. Rev 1.12.5 Jan.10 Proprietary and Confidential 21 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide Shielding The module is fully shielded to protect against EMI and to ensure compliance with FCC Part 15 ‐ “Radio Frequency Devices” (or equivalent regulations in other jurisdictions). Note: The module shields must NOT be removed. Antenna and cabling Note: Values in this guide are taken from the appropriate product specification documents (PSDs) (listed in Related documents, page 11) — in the case of a discrepancy between this document and the relevant PSD, use the value listed in the PSD. When selecting the antenna and cable, it is critical to RF perfor‐ mance to match antenna gain and cable loss. Choosing the correct antenna and cabling Consider the following points for proper matching of antennas and cabling: • The antenna (and associated circuitry) should have a nominal impedance of 50 Ω with a return loss ≤ 10 dB across each frequency band of operation. • The system gain value affects both radiated power and regulatory (FCC, IC, CE, etc.) test results. Developing custom antennas Consider the following points when developing custom‐ designed antennas: • A skilled RF engineer should do the development to ensure that the RF performance is maintained. • Identify the bands that need to be supported, particularly when both the MC57xx and MC8xxx will be installed in the same platform. In this case, you may want to develop separate antennas for maximum performance. Determining the antenna’s location Consider the following points when deciding where to put the antenna: • Antenna location may affect RF performance. Although the module is shielded to prevent interference in most applica‐ tions, the placement of the antenna is still very important — if the host device is insufficiently shielded, high levels of broadband or spurious noise can degrade the module’s performance. • Connecting cables between the module and the antenna must have 50 Ω impedance. If the impedance of the module is mismatched, RF performance is reduced significantly. 22 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. RF Integration • Antenna cables should be routed, if possible, away from noise sources (switching power supplies, LCD assemblies, etc.). If the cables are near the noise sources, the noise may be coupled into the RF cable and into the antenna. Disabling the diversity antenna • MC57xx — If your host device is not designed to use the MC57xx module’s diversity antenna, terminate the interface with a 50 Ω load. • MC8301V / MC8780 / MC8781 / MC8790 / MC8790V / MC8791V / MC8792V / MC8795V / MC8700 —Use the AT command !RXDEN=0 to disable receive diversity or !RXDEN=1 to enable receive diversity. Interference and sensitivity Note: These modules are based on ZIF (Zero Intermediate Frequency) technologies; when performing EMC (Electromagnetic Compatibility) tests, there are no IF (Intermediate Frequency) components from the module to consider. Note: Values in this guide are taken from the appropriate product specification documents (PSDs) (listed in Related documents, page 11) — in the case of a discrepancy between this document and the relevant PSD, use the value listed in the PSD. Rev 1.12.5 Jan.10 Several sources of interference can affect the RF performance of the module (RF desense). Common sources include power supply noise and device‐generated RF. RF desense can be addressed through a combination of mitigation techniques and radiated sensitivity measurement. Power supply noise Noise in the power supply can lead to noise in the RF signal. The power supply ripple limit for the module is no more than 200 mVp‐p 1 Hz to 100 kHz. This limit includes voltage ripple due to transmitter burst activity. Interference from other wireless devices Wireless devices operating inside the host device can cause interference that affects the module. To determine the most suitable locations for antennas on your host device, evaluate each wireless device’s radio system, considering the following: • Any harmonics, sub‐harmonics, or cross‐products of signals generated by wireless devices that fall in the module’s Rx range may cause spurious response, resulting in decreased Rx performance. • The Tx power and corresponding broadband noise of other wireless devices may overload or increase the noise floor of the module’s receiver, resulting in Rx desense. Proprietary and Confidential 23 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide The severity of this interference depends on the closeness of the other antennas to the module’s antenna. To determine suitable locations for each wireless device’s antenna, thoroughly evaluate your host device’s design. Device-generated RF All electronic computing devices generate RF interference that can negatively affect the receive sensitivity of the module. Note: The module can cause interference with other devices such as hearing aids and onboard speakers. Wireless devices such as the Mini Card transmit in bursts (pulse transients) for set durations (RF burst frequencies). Hearing aids and speakers convert these burst frequencies into audible frequencies, resulting in audible noise. The proximity of host electronics to the antenna in wireless devices can contribute to decreased Rx performance. Compo‐ nents that are most likely to cause this include: • Microprocessor and memory • Display panel and display drivers • Switching‐mode power supplies These and other high‐speed devices (in particular, the processor) can decrease Rx performance because they run at frequencies of tens of MHz. The rapid rise and fall of these clock signals generates higher‐order harmonics that often fall within the operating frequency band of the module, affecting the module’s receive sensitivity. Example On a sub‐system running at 40 MHz, the 22nd harmonic falls at 880 MHz, which is within the cellular receive frequency band. Note: In practice, there are usually numerous interfering frequencies and harmonics. The net effect can be a series of desensitized receive channels. 24 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 4 4: Audio Interface The MC5725V / MC5727V / MC5728V / MC8301V / MC8775V / MC8790V / MC8791V / MC8792V / MC8795V modules support six audio modes that may be required by a host audio system: • Handset • Headset • Car kit • Speakerphone • AUX (MC5727V / MC5728V modules are preconfigured for HAC [Hearing Aid Compatibility]) • TTY Note: Values in this guide are taken from the appropriate product specification documents (PSDs) (listed in Related documents, page 11) — in the case of a discrepancy between this document and the relevant PSD, use the value listed in the PSD. The modules support both a differential analog interface and PCM digital audio, and allow dynamic run‐time selection of the appropriate mode. Table 4‐1 summarizes the key audio features of these modules. Table 4-1: Audio features Feature Gain (adjustable) Transmit MC5725V: Receive Up to +12 dB • Up to +16 dB analog gain. MC5727V: • MIC_AMP1: Programmable to 0 dB or +24 dB. • MIC_AMP2: Programmable from -6 dB to +25.5 dB in steps of 1.5 dB. MC5728V: • Programmable to 0 dB or +24 dB. MC8301V / MC8775V / MC8790V / MC8791V / MC8792V / MC8795V: • Up to +48.5 dB analog gain available (when the analog interface is selected). Filtering stages Several adjustable high-pass and slope filters High-pass filter Noise suppression Supported n/a Echo cancellation Configurable for each audio mode (headset, handset, speakerphone, and car kit) n/a Output driver stage n/a Supported Rev 1.12.5 Jan.10 Proprietary and Confidential 25 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide Table 4-1: Audio features (Continued) Feature FIR (Finite Impulse Response) filtering Transmit Receive MC8xxx: • Option of providing 13 tap FIR filtering for receive and transmit paths to equalize the acoustic response of the speaker and microphone elements. Audio pass band 300 Hz–3.4 kHz These modules are intended to serve as an integral component of a more complex audio system—for example, a PDA with a separate codec interfaced to the Host Application processor. Usually, the interface between the module and the host audio system is set to line‐level amplitudes with no transducer considerations. The responsibility of the module codec or host codec for special functions is detailed in Table 4‐2. Table 4-2: Functions - responsibility codecs Function Responsible Codec Phone oriented (e.g., echo cancellation, FIR filtering) Module codec Path-switching Host codec Transducer interfaces Host codec Adjustable gain / volume settings Either DTMF / ringer tone generation Either Mixing Host codec System block diagrams Note: When integrating the module into your host platform, make sure the module has sufficient shielding to prevent RF interference. MC5725V / MC5727V system block Figure 4‐1 represents the MC5725V / MC5727V module’s audio system block, and includes the following features: • Module interconnects are shown on the left side of the diagram. The audio interface uses the signals: · MIC_P / MIC_N · SPK_P / SPK_N 26 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Audio Interface • Dynamic ranges for each programmable gain stage are Note: Make sure the host device includes DC blocking capacitors on the Audio In lines – the module does not include series capacitors. listed, with the following constraints: · MIC_AMP1 is programmable in discrete steps only · MIC_AMP2 (MC5727V only) is programmable in discrete steps only · CodecSTGain, when set to the minimum setting, effec‐ tively mutes sidetone in the module codec Figure 4-1: MC5725V / MC5727V Audio system block MIC_P TX_HPF_DIS_N TX_SLOPE_FILT_DIS_N MIC_N 57.3mVrms @ 0dBm0 HPF & Slope MIC_AMP1_GAIN +16dB +8dB +6dB -2dB CodecSTGain +12dB -48dB -96dB CodecRxGain AMP_SEL 001 010 100 SPK_N Echo Cancellation 10 01 MIC_SEL NS & AAGC +12dB -3dB -84dB TxPCMFilt TxVolume Tx FIR 13K CELP/ EVRC Encoder +12dB 0dB -84dB MIC_AMP2_BYP 22p nsSwitch CodecTxGain 13 bit A/D RF Filter 33n Encoder PCM I/F Audio In TX ADC DTMF Tx Gain DTMF Decoder DTMF Encoder Decoder RF Interface DTMF Rx Gain RX_HPF_DIS_N 35mW @ +3dBm0 13 bit D/A SPK_P HPF Rx FIR +12dB 0dB -81dB Audio Out AAGC 13K CELP/ EVRC Decoder RxVolume +12dB -25dB RxPCMFilt -84dB RX DAC MC5728V system block Figure 4‐2 represents the MC5728V module’s audio system block, and includes the following features: • Module interconnects are shown on the left side of the diagram. The audio interface uses the signals: · MIC_P / MIC_N · SPK_P / SPK_N Note: Make sure the host device includes DC blocking capacitors on the Audio In lines – the module does not include series capacitors. Rev 1.12.5 Jan.10 • Dynamic ranges for each programmable gain stage are listed, with the following constraints: · MIC_AMP1 is programmable to 0 dB or +24 dB only · CodecSTGain, when set to the minimum setting, effec‐ tively mutes sidetone in the module codec Proprietary and Confidential 27 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide Figure 4-2: MC5728V Audio system block TX ADC 57.3mVrms @ 0dBm0 Audio In nsSw itch HPF & Slope 13 bit A/D NS & AAGC TxPCMFilt +12dB -3dB -84dB TxVolume Tx FIR 13K CELP/ EVRC Encoder +12dB 0dB -84dB MIC_A MP1 0 dB or +24 dB MIC_SEL CodecSTGain 0dB -48dB -96dB 22 PCM I/F RF Filter 33n Encoder TX_HPF_DIS_N TX_SLOPE_FILT_DIS_ CodecTxGain CodecRxGain AMP_SEL Echo Cancellation MIC1P MIC1N DTMF Tx Gain DTMF Decoder DTMF Encoder Decoder RF Interface DTMF Rx Gain RX_HPF_DIS_N 35mW @ +3dBm0 SPK1P SPK1N 13 bit D/A HPF Rx FIR +12dB 0dB -84dB Audio Out AAGC 13K CELP/ EVRC Decoder RxVolume +12dB -25dB RxPCMFilt -84dB RX DAC MC8301V / MC8775V / MC8790V / MC8791V / MC8792V / MC8795V system block Figure 4‐3 represents the MC8301V/ MC8775V/ MC8790V / MC8791V / MC8792V / MC8795V module’s audio system block, and includes the following features: • Module interconnects are shown on the left side of the diagram. The analog audio interface uses the signals: · MIC_P / MIC_N · SPK_P / SPK_N Note: Make sure the host device includes DC blocking capacitors on the analog Audio In lines – the module does not include series capacitors. • The digital PCM audio interface uses the signals: · PCM_CLK · PCM_DIN · PCM_DOUT · PCM_SYNC • Dynamic ranges for each programmable gain stage are listed, with the following constraints: · MIC_AMP1 is programmable in 1.5 dB steps · CodecSTGain, when set to the minimum setting, effec‐ tively mutes sidetone in the module codec • When PCM audio is selected, the RX DAC and TX ADC blocks are bypassed—the external PCM codec controls transmit gain, receive gain, and sidetone gain. 28 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Audio Interface Note: Data mixing is not supported. If mixing of voice signal is required, it must be done by the host processor. Figure 4-3: MC8301V /MC8775V /MC8790V / MC8791V / MC8792V / MC8795V Audio system block PCM Audio interface MIC_P TX_HPF_DIS_N TX_SLOPE_FILT_DIS_N MIC_N 57.3mVrms @ 0dBm0 HPF & Slope NS & AAGC +12dB -3dB -84dB TxPCMFilt TxVolume Tx FIR 13K CELP/ EVRC Encoder +12dB 0dB -84dB MIC_AMP1_GAIN -6dB to +49.5dB in 1.5dB steps PCM I/F CodecSTGain +12dB -48dB -96dB 22p CodecRxGain AMP_SEL 001 010 100 SPK_N nsSwitch CodecTxGain 13 bit A/D RF Filter 33n Encoder Echo Cancellation Audio In TX ADC DTMF Tx Gain DTMF Decoder DTMF Encoder Decoder RF Interface DTMF Rx Gain RX_HPF_DIS_N 35mW @ +3dBm0 SPK_P 13 bit D/A HPF Rx FIR Audio Out +12dB 0dB -81dB AAGC 13K CELP/ EVRC Decoder RxVolume +12dB -25dB RxPCMFilt -84dB RX DAC Modes of operation These modules support six operational modes: headset, handset, car kit, speakerphone, AUX1, and TTY—end products can use any combination of these modes. The host device must use host‐modem messaging to tell the module which mode to use for each call. Sidetone support The sidetone path mixes the near‐end transmit voice to the near‐end receive. This gives the near‐end user some feedback that indicates that the call is up and that the audio system is functioning. The sidetone path can be enabled in either the PDA codec or the Mini Card modem—each path is equally valid. It should not be added to both devices, and for speakerphone or car kit applications, both sidetone paths should be disabled. 1. (MC5727V / MC5728V modules are preconfigured for HAC [Hearing Aid Compatibility]). Rev 1.12.5 Jan.10 Proprietary and Confidential 29 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide The typical handset sidetone is 12 dB below transmit voice levels. For Handset and Headset mode, the threshold of pain (+120 dBSPL) must not be exceeded at the maximum volume setting. A good target for the medium volume setting is +94 dBSPL, as this is a typical level for conversational speech. Most audio gain should be added to the host audio front end (within the PDA style codec gain blocks or amplifiers between the host codec and transducers). Refer to the appropriate Mini Card Product Specification Document for reference levels on the modem receive and transmit side. Echo cancellation support The Mini Card offers four modes of echo cancellation to support unique end‐unit audio capabilities (echo cancellation can also be turned off completely). All echo cancellation is near‐end (mobile TX) cancellation only. The network provides some level of far‐end echo cancellation. Table 4-3: Echo cancellation details Mode Handset Details • Short echo path (<16 ms travel time from speaker to microphone) • Handset design requires good isolation between speaker and microphone • Echo canceller allows full-duplex conversation with absolute minimum echo Headset • Short echo path (<16 ms travel time from speaker to microphone) • Headset design may allow higher echo than handset mode—microphone and speaker are physically closer • More aggressive echo canceller algorithm allows full-duplex conversation on headsets with good isolation Car kit • Long echo path (<64 ms travel time from speaker to microphone) • Loud echo • For use with hands-free car kit or speakerphone applications with mild distortion 30 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Audio Interface Table 4-3: Echo cancellation details Mode Details Speakerphone • Long echo path (<64 ms travel time from speaker to microphone) • Loud echo • For use with speakerphone applications with high distortion • Half-duplex algorithm, very aggressive in near-end Tx muting to eliminate transmitted echo Off Audio signal interface The differential microphone input offers superior noise rejection performance to the single‐ended approach. The termination of the differential pair rejects common signals (such as noise). The pair should be routed together for optimal noise rejection. Since MIC_P and MIC_N are high impedance inputs, it is important to isolate these from possible noise sources (toggling digital lines with fast edges). The speaker interface can be single‐ended or differential depending on product. Single‐ended speaker outputs rely on modem ground as an audio reference. The audio passband for both receive and transmit paths (speaker and microphone) extends from 300 Hz to 3.4 kHz. A programmable sidetone with a range from mute to unity gain is available for both headset and main audio paths. Sidetone should be muted for speakerphone use. Note that certain carriers now require use of hearing‐aid compatible transducers in a handset design. The Primary audio path can be interfaced directly to such devices. Refer to ANSI C63.19 for details regarding reduced RF emissions (ʺU3 ratingʺ) and inductive / telecoil coupling (ʺU3Tʺ rating) devices. Table 4-4: Primary audio signal interface Signal Rev 1.12.5 Jan.10 Pin # Type Directions Description MIC_P Analog Input Non-inverted microphone input (+) MIC_N Analog Input Inverted microphone input (-) Proprietary and Confidential 31 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide Table 4-4: Primary audio signal interface Signal Pin # Type Directions Description SPK_P Analog Output Non-inverted speaker output (+) SPK_N Analog Output Inverted speaker output (-) Table 4-5: PCM digital audio signal interface Signal Pin # Type Directions Description PCM_CLK 45 Digital Output PCM clock PCM_DIN 47 Digital Input (internal pull-down) PCM data in PCM_DOUT 49 Digital Output PCM data out PCM_SYNC 51 Digital Input (internal pull-down) PCM sync Audio function partitioning These phone‐oriented functions are usually under module control: • FIR filters—both transmit and receive path • Noise suppression—required due to high sensitivity and gain in transmit path • Echo cancellation—different for each audio path and environment (handset, headset, car kit, speakerphone) • High pass filtering / slope filtering functions—required per phone acoustic requirements • AGC (Automatic Gain Control)—normalizes audio volumes in varying acoustic environments • DTMF tones—the generation and detection of DTMF tones is required in both directions of the phone interface • Comfort noise—low level noise injected into receiver path for user ʺconnectionʺ experience • Simple ringers—digital and analog tones, melody ringers, MIDI with limited memory storage These functions are typically performed in the host codec: • Voice Memo—performed by the host if significant memory storage is required • Polyphonic ringtone—host often supports WAV, MIDI formats with significant memory storage • Audio path switching—turn on audio path depending on user interface selection, or headset detection 32 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Audio Interface • Audio path mixing—required for voice memo recording and playback via multiple audio paths • Transducer interface—host provides acoustic drivers, must occur outside of path switching and mixing These functions can be performed in either host or module codec, depending on balance of component selection and engineering resources: • Volume settings—adjustable gain settings based on user interface selections • Sidetone—careful placement of sidetone gain control is required to prevent the need to adjust sidetone gain with varying volume settings Rev 1.12.5 Jan.10 Proprietary and Confidential 33 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide 34 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. 5 5: Host / Module Interfaces LED output The module drives the LED output according to the PCI‐ Express Mini Card specification (summarized in Table 5‐1, below). Table 5-1: LED states State Indicates Characteristics Off Module is not powered. Light is off. On Module is powered and connected, but not transmitting or receiving. Light is on. Slow blink Module is powered and searching for a connection. LED is flashing at a steady, slow rate. • 250 ms ± 25% ON period • 0.2 Hz ± 25% blink rate Faster blink Module is transmitting or receiving. LED is flashing at a steady, faster rate. • Approximately 3 Hz blink rate Note: MC572x modules support customer-defined LED controls. Rev 1.12.5 Jan.10 Proprietary and Confidential 35 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide Figure 5-1: Example LED VCC 3.3V Current limiting Resistor LED MiniCard MIO 36 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. A A: Regulatory Information Important notice Because of the nature of wireless communications, trans‐ mission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost. Although significant delays or losses of data are rare when wireless devices such as the Sierra Wireless modem are used in a normal manner with a well‐constructed network, the Sierra Wireless modem should not be used in situations where failure to transmit or receive data could result in damage of any kind to the user or any other party, including but not limited to personal injury, death, or loss of property. Sierra Wireless and its affiliates accept no responsibility for damages of any kind resulting from delays or errors in data transmitted or received using the Sierra Wireless modem, or for failure of the Sierra Wireless modem to transmit or receive such data. Safety and hazards Do not operate your MC57xx / MC8xxx modem: • In areas where blasting is in progress • Where explosive atmospheres may be present including refuelling points, fuel depots, and chemical plants • Near medical equipment, life support equipment, or any equipment which may be susceptible to any form of radio interference. In such areas, the MC57xx / MC8xxx modem MUST BE POWERED OFF. Otherwise, the MC57xx / MC8xxx modem can transmit signals that could interfere with this equipment. In an aircraft, the MC57xx / MC8xxx modem MUST BE POWERED OFF. Otherwise, the MC57xx / MC8xxx modem can transmit signals that could interfere with various onboard systems and may be dangerous to the operation of the aircraft or disrupt the cellular network. Use of a cellular phone in an aircraft is illegal in some jurisdictions. Failure to observe this instruction may lead to suspension or denial of cellular telephone services to the offender, or legal action or both. Some airlines may permit the use of cellular phones while the aircraft is on the ground and the door is open. The MC57xx / MC8xxx modem may be used normally at this time. Rev 1.12.5 Jan.10 Proprietary and Confidential 37 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide Important compliance information for North American users The MC57xx / MC8xxx modem has been granted modular approval for mobile applications. Integrators may use the MC57xx / MC8xxx modem in their final products without additional FCC / IC (Industry Canada) certification if they meet the following conditions. Otherwise, additional FCC / IC approvals must be obtained. 38 1. At least 20 cm separation distance between the antenna and the user’s body must be maintained at all times. 2. To comply with FCC / IC regulations limiting both maximum RF output power and human exposure to RF radiation, the maximum antenna gain including cable loss in a mobile‐only exposure condition must not exceed 5 dBi in the cellular band and 4 dBi in the PCS band. 3. The MC57xx / MC8xxx modem and its antenna must not be co‐located or operating in conjunction with any other transmitter or antenna within a host device. 4. A label must be affixed to the outside of the end product into which the MC57xx / MC8xxx modem is incorporated, with a statement similar to the following: · For MC5725 / MC5725V: This device contains FCC ID: N7N‐MC5725 This equipment contains equipment certified under IC: 2417C‐MC5725 · For MC5727 / MC5727V: This device contains FCC ID: N7N‐MC5727 This equipment contains equipment certified under IC: 2417C‐MC5727 · For MC5728V: This device contains FCC ID: N7N‐MC5728 This equipment contains equipment certified under IC: 2417C‐MC5728 · For MC8301V: This device contains FCC ID: N7NMC8301 This equipment contains equipment certified under IC: 2417C‐MC8301 · For MC8775 / MC8775V: This device contains FCC ID: N7NMC8775 This equipment contains equipment certified under IC: 2417C‐MC8775 · For MC8780: This device contains FCC ID: N7NMC8780 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Regulatory Information · · · · · 5. For MC8781: This device contains FCC ID: N7NMC8781 This equipment contains equipment certified under IC: 2417C‐MC8781 For MC8790 / MC8790V: This device contains FCC ID: N7NMC8790 This equipment contains equipment certified under IC: 2417C‐MC8790 For MC8792V: This device contains FCC ID: N7NMC8792 This equipment contains equipment certified under IC: 2417C‐MC8792 For MC8795V: This device contains FCC ID: N7NMC8795 This equipment contains equipment certified under IC: 2417C‐MC8795 For MC8700: This device contains FCC ID: N7NMC8700 This equipment contains equipment certified under IC: 2417C‐MC8700 A user manual with the end product must clearly indicate the operating requirements and conditions that must be observed to ensure compliance with current FCC / IC RF exposure guidelines. The end product with an embedded MC57xx / MC8xxx modem may also need to pass the FCC Part 15 unintentional emission testing requirements and be properly authorized per FCC Part 15. Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS‐102. EU regulatory conformity Sierra Wireless hereby declares that the MC8301V, MC8775, MC8775V, MC8780, MC8790, MC8790V, MC8791V, MC8792V, MC8795V, and MC8700 modems conform with all essential requirements of Directive 1999/5/EC. MC8301V: MC8775, MC8775V, MC8780, MC8790, MC8790V, MC8791V, MC8792V: Rev 1.12.5 Jan.10 Proprietary and Confidential 39 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide MC8795V: MC8700: The Declaration of Conformity made under Directive 1999/5/ EC is available for viewing at the following location in the EU community: Sierra Wireless (UK), Limited Lakeside House 1 Furzeground Way, Stockley Park East Uxbridge, Middlesex UB11 1BD England Brazil ANATEL homologation (MC8790 somente) Este produto está homologado pela ANATEL, de acordo com os procedimentos regulamentados pela Resolução 242/2000, e atende aos requisitos técnicos aplicados. Para maiores informações, consulte o site da ANATEL www.anatel.gov.br. 40 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. B B: Acronyms and Definitions Table B-1: Acronyms and definitions Acronym or term Definition AGC Automatic Gain Control BER Bit Error Rate - a measure of receive sensitivity BLER Block Error Rate Call Box Base Station Simulator - Agilent E8285A or 8960, Rohde & Schwarz CMU200 CDMA Code Division Multiple Access dB Decibel = 10 x log10 (P1/P2) P1 is calculated power; P2 is reference power Decibel = 20 x log10 (V1/V2) V1 is calculated voltage, V2 is reference voltage dBm Decibels, relative to 1 mW - Decibel(mW) = 10 x log10 (Pwr (mW)/ 1mW) DUT Device Under Test EDGE Enhanced Data rates for GSM Evolution EM Embedded Module ESD ElectroStatic Discharge FER Frame Error Rate - a measure of receive sensitivity GPRS General Packet Radio Services GPS Global Positioning System GSM Global System for Mobile communications Hz Hertz = 1 cycle/second inrush current Peak current drawn when a device is connected or powered on IS-2000 3G radio standards for voice and data (CDMA only) IS-95 2G radio standards targeted for voice (cdmaONE) LDO Low Drop Out - refers to linear regulator Rev 1.12.5 Jan.10 Proprietary and Confidential 41 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide Table B-1: Acronyms and definitions Acronym or term 42 Definition MC5725 / MC5725V / MC5727 / MC5727V / MC5728V Sierra Wireless Mini Cards used on CDMA networks MC57xx Any of the following CDMA Mini Cards: MC5725 / MC5725V / MC5727 / MC5727V / MC5728V MC8301V / MC8775 / MC8775V / MC8780 / MC8781 / MC8790 / MC8790V / MC8791V / MC8792V / MC8795V / MC8700 Sierra Wireless Mini Cards used on GSM / UMTS networks MC8xxx Any of the following GSM / UMTS Mini Cards: MC8301V / MC8775 / MC8775V / MC8780 / MC8781 / MC8790 / MC8790V / MC8791V / MC8792V / MC8795V / MC8700 MHz MegaHertz = 10E6 Hertz (Hertz = 1 cycle/second) MIO Module Input/Output MPE Maximum Permissible Exposure — the level of radiation to which a person may be exposed without hazardous effect or adverse biological changes OTA Over-The-Air or Radiated through the antenna PCS Personal Communication System - PCS spans the 1.9 GHz radio spectrum RF Radio Frequency RMS Root Mean Square SA Selective Availability Sensitivity (Audio) Measure of lowest power signal that the receiver can measure Sensitivity (RF) Measure of lowest power signal at the receiver input that can provide a prescribed BER / BLER / SNR value at the receiver output. SIM Subscriber Identity Module SNR Signal to Noise Ratio SOF Start of Frame - a USB function UART Universal Asynchronous Receiver Transmitter UDK Universal Development Kit (PCI Express Mini Card Dev Kit) Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Acronyms and Definitions Table B-1: Acronyms and definitions Acronym or term Definition UMTS Universal Mobile Telecommunications System USB Universal Serial Bus USIM Universal Subscriber Identity Module VCC3.3 3.3 V supply voltage WCDMA Wideband Code Division Multiple Access — In this document, the term “UMTS” is used instead of “WCDMA”. XIM In this document, XIM is used as part of the contact identifiers for the USIM interface (XIM_VCC, XIM_CLK, etc.). Rev 1.12.5 Jan.10 Proprietary and Confidential 43 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide 44 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Index Numerics 1X CDMA Standard 11 acronyms and definitions 41–43 airplane mode 17 antenna connection and mounting points 21 connection considerations 20 custom, considerations 22 diversity antenna, disabling 23 limit, matching coaxial connections 20 location, considerations 22 matching, considerations 22 maximum cable loss 20 AT commands 3GPP specification, details 11 low power mode, setting 17 standard, MC57xx (reference document) 11 standard, MC8xxx (reference document) 13 AT commands, extended MC57xx, reference 11 MC8xxx, reference 13 AT commands, standard MC57xx, reference 11 MC8xxx, reference 13 audio features, summary 25 functions, host‐controlled 32 functions, module‐controlled 32 functions, responsible codecs 26 interface 25–33 path mixing, host‐controlled 33 path switching, host‐controlled 32 PCM digital, signal interface 32 primary, signal interface 31 signal interface 31 system block diagram, MC5725V 26 system block diagram, MC5727V 26 system block diagram, MC5728V 27 system block diagram, MC8xxxV 28 audio modes, supported 29 audio pass band 26 audio passband, Rx and Tx 31 automatic gain control (AGC) module‐controlled 32 car kit audio mode 25 car kit mode echo cancellation 30 CDMA 1X Standard 11 CnS MC57xx reference 11 MC8xxx reference 13 voice reference 13 codec for audio functions 26 comfort noise module‐controlled 32 connection grounding 21 connectors, required EDGE mating (52‐pin) 10 host‐module 10 RF, Hirose 10 USIM 10 current consumption, usage models 17 DCS 1800 RF parameters, MC8xxx 19 desense. See RF disconnected, module power state 16 diversity antenna disabling 23 DTMF codec 26 module‐controlled 32 echo cancellation audio feature 25 codec 26 details 30 module‐controlled 32 support, all modes 30 EDGE connector, manufacturers 10 EGSM 900 RF parameters, MC8xxx 19 electrostatic discharge. See ESD ESD protection requirements 15–16 testing techniques document (IEC‐61000‐4‐2) 11 cable loss antenna, maximum 20 Rev 1.12.5 Jan.10 FCC Proprietary and Confidential 45 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide regulations, relevant section 11 filtering high pass / slope filtering, module‐controlled 32 filtering stages, audio 25 FIR filtering audio feature 26 codec 26 module‐controlled 32 gain codec 26 distribution, audio 30 limits, adjustable 25 GPS band RF parameters, MC8xxx 20 grounding connection considerations 21 GSM 850 RF parameters, MC8xxx 19 handset audio mode 25 handset mode echo cancellation 30 headset audio mode 25 headset mode echo cancellation 30 impedance module‐antenna 22 interface audio signal 31 interference device generated 24 power supply noise 23 wireless devices 23 LED example 36 states 35 low power mode setting, AT commands 17 low power, module power state 17 MC5725 AT reference (extended) 11 AT reference (standard) 11 CnS reference 11 46 networks supported 9 product specification 11 MC5725V AT reference (extended) 11 AT reference (standard) 11 audio interface, supported 25 CnS reference 11 networks supported 9 product specification 11 MC5727 AT reference (extended) 11 AT reference (standard) 11 CnS reference 11 networks supported 9 product specification 12 MC5727V AT reference (extended) 11 AT reference (standard) 11 audio interface, supported 25 CnS reference 11 networks supported 9 product specification 12 MC5728V AT reference (extended) 11 AT reference (standard) 11 audio interface, supported 25 CnS reference 11 networks supported 9 product specification 12 MC8301V AT reference (extended), and MC8xxx 13 AT reference (standard), and MC8xxx 13 CnS reference, and MC8xxx 13 CnS voice reference, and MC8xxxV 13 networks supported 9 product specification 12 RF parameters 19 MC8700 AT reference (extended), and MC8xxx 13 AT reference (standard), and MC8xxx 13 CnS reference, and MC8xxx 13 networks supported 9 product specification 12 RF parameters 19 MC8775 AT reference (extended), and MC8xxx 13 AT reference (standard), and MC8xxx 13 CnS reference, and MC8xxx 13 networks supported 9 product specification 12 RF parameters 19 MC8775V AT reference (extended), and MC8xxx 13 AT reference (standard), and MC8xxx 13 audio interface, supported 25 CnS reference, and MC8xxx 13 CnS voice reference, and MC8xxxV 13 networks supported 9 product specification 12 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. Index RF parameters 19 MC8780 AT reference (extended), and MC8xxx 13 AT reference (standard), and MC8xxx 13 CnS reference, and MC8xxx 13 networks supported 9 product specification 12 RF parameters 19 MC8781 AT reference (extended), and MC8xxx 13 AT reference (standard), and MC8xxx 13 CnS reference, and MC8xxx 13 networks supported 9 product specification 12 RF parameters 19 MC8790 AT reference (extended), and MC8xxx 13 AT reference (standard), and MC8xxx 13 CnS reference, and MC8xxx 13 networks supported 9 product specification 12 RF parameters 19 MC8790V AT reference (extended), and MC8xxx 13 AT reference (standard), and MC8xxx 13 audio interface, supported 25 CnS reference, and MC8xxx 13 CnS voice reference, and MC8xxxV 13 networks supported 9 product specification 12 RF parameters 19 MC8791V AT reference (extended), and MC8xxx 13 AT reference (standard), and MC8xxx 13 audio interface, supported 25 CnS reference, and MC8xxx 13 CnS voice reference, and MC8xxxV 13 networks supported 9 product specification 12 RF parameters 19 MC8792V AT reference (extended), and MC8xxx 13 AT reference (standard), and MC8xxx 13 audio interface, supported 25 CnS reference, and MC8xxx 13 CnS voice reference, and MC8xxxV 13 networks supported 9 product specification 12 RF parameters 19 MC8795V AT reference (extended), and MC8xxx 13 AT reference (standard), and MC8xxx 13 audio interface, supported 25 CnS reference, and MC8xxx 13 CnS voice reference, and MC8xxxV 13 networks supported 9 product specification 12 RF parameters 19 Mini Card Rev 1.12.5 Jan.10 Dev Kit Quick Start Guide 13 PCI Express Specification 13 See also MC5725, MC5725V, MC5727, MC5727V, MC5728V, MC8775, MC8775V, MC8780, MC8781, MC8790, MC8790V, MC8791V, MC8792V, MC8795V, MC8700 mixing codec 26 networks supported, by module type 9 noise leakage, minimizing 21 RF interference, power supply 23 noise suppression audio feature 25 module‐controlled 32 normal, module power state 17 off, module power state 17 output driver stage, audio feature 25 path switching codec 26 PCI Express Mini Card specification 13 PCM digital audio, signal interface 32 PCS 1900 RF parameters, MC8xxx 19 polyphonic ringtone host‐controlled 32 power default state 17 disconnected, characteristics 16 normal, characteristics 17 off, characteristics 17 required supply voltage 15 signals, overview 15 state, disconnected 16 state, low power 17 state, normal 17 state, off 17 supply, RF interference 23 supply, ripple limit 23 product specification (PSD) 11, 12 PSD (Product Specification Document) 11, 12 regulatory information 37–40 Brazil 40 Proprietary and Confidential 47 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence. CDMA and GSM / UMTS Mini Card Hardware Integration Guide EU 39 FCC 38 limitation of liability 37 safety and hazards 37 RF antenna cable loss, maximum 20 antenna connection, considerations 20 cable type, required 10 desense device‐generated 24 interference other devices 24 power supply 23 wireless devices 23 parameters MC8xxx 19 parameters, MC8xxx DCS 1800 19 EGSM 900 19 GPS 20 GSM 850 19 PCS 1900 19 UMTS 1900 19 UMTS 2100 19 UMTS 850 19, 20 ringer tone codec 26 ringers module‐controlled 32 ringtone, polyphonic host‐controlled 32 testing ESD immunity, techniques document (IEC‐61000‐ 4‐2) 11 transducer interface host‐controlled 33 transducer interfaces codec 26 UDK (Universal Development Kit) components, included 9 UMTS 1900 RF parameters, MC8xxx 19 UMTS 2100 RF parameters, MC8xxx 19 UMTS 850 RF parameters, MC8xxx 19, 20 Universal Development Kit (UDK) components, included 9 Universal Serial Bus. See USB. usage models current consumption 17 USB specification 13 USIM connector type, required 10 shielding module, compliance 22 sidetone responsible codec 33 support 29 SIM testing methods, MS conformance specification 13 See also USIM speakerphone audio mode 25 speakerphone mode echo cancellation 31 system block MC5725V, audio 26 MC5727V, audio 26 MC5728V, audio 27 MC8xxxV, audio 28 48 voice memo host‐controlled 32 volume, setting responsible codec 33 W_Disable# Normal state 17 off state 17 ZIF (Zero Intermediate Frequency) 23 Proprietary and Confidential 2130114 In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
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