Sierra Wireless MC8781 850/900/1800/1900/2100 MHz Multi-band Module User Manual HW Integration Guide

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Date Submitted	2007-04-26 00:00:00
Date Available	2007-06-10 00:00:00
Creation Date	2007-03-16 20:08:49
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Document Lastmod	2007-03-16 20:15:32
Document Title	HW Integration Guide.book
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Document Author:	John

CDMA / GSM Mini Card
Hardware Integration Guide
Proprietary and Confidential
Includes:
MC5720 / MC5725 / MC5725V
MC8755 / MC8755V / MC8765
MC8775 / MC8775V
MC8780 / MC8781
2130114
Rev 1.4.1
Preface
Important Notice
Due to the nature of wireless communications, transmission
and reception of data can never be guaranteed. Data may be
delayed, corrupted (i.e., have errors) or be totally lost.
Although significant delays or losses of data are rare when
wireless devices such as the Sierra Wireless modem are used in
a normal manner with a well‐constructed network, the Sierra
Wireless modem should not be used in situations where failure
to transmit or receive data could result in damage of any kind
to the user or any other party, including but not limited to
personal injury, death, or loss of property. Sierra Wireless
accepts no responsibility for damages of any kind resulting
from delays or errors in data transmitted or received using the
Sierra Wireless modem, or for failure of the Sierra Wireless
modem to transmit or receive such data.
Safety and Hazards
Do not operate the Sierra Wireless modem in areas where
blasting is in progress, where explosive atmospheres may be
present, near medical equipment, near life support equipment,
or any equipment which may be susceptible to any form of
radio interference. In such areas, the Sierra Wireless modem
MUST BE POWERED OFF. The Sierra Wireless modem can
transmit signals that could interfere with this equipment.
Do not operate the Sierra Wireless modem in any aircraft,
whether the aircraft is on the ground or in flight. In aircraft, the
Sierra Wireless modem MUST BE POWERED OFF. When
operating, the Sierra Wireless modem can transmit signals that
could interfere with various onboard systems.
Note: Some airlines may permit the use of cellular phones while the
aircraft is on the ground and the door is open. Sierra Wireless
modems may be used at this time.
The driver or operator of any vehicle should not operate the
Sierra Wireless modem while in control of a vehicle. Doing so
will detract from the driver or operatorʹs control and operation
of that vehicle. In some states and provinces, operating such
communications devices while in control of a vehicle is an
offence.
Limitation of
Liability
Rev 1.4.1 Mar.07
The information in this manual is subject to change without
notice and does not represent a commitment on the part of
Sierra Wireless. SIERRA WIRELESS AND ITS AFFILIATES
SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL
DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL,
CONSEQUENTIAL, PUNITIVE OR EXEMPLARY DAMAGES
INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS OR
CDMA / GSM Mini Card Hardware Integration Guide
REVENUE OR ANTICIPATED PROFITS OR REVENUE
ARISING OUT OF THE USE OR INABILITY TO USE ANY
SIERRA WIRELESS PRODUCT, EVEN IF SIERRA WIRELESS
AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES OR THEY ARE
FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra
Wireless and/or its affiliates aggregate liability arising under or
in connection with the Sierra Wireless product, regardless of
the number of events, occurrences, or claims giving rise to
liability, be in excess of the price paid by the purchaser for the
Sierra Wireless product.
Patents
Portions of this product may be covered by some or all of the
following US patents:
5,515,013
5,629,960
5,845,216
5,847,553
5,878,234
5,890,057
5,929,815
6,169,884
6,191,741
6,199,168
6,339,405
6,359,591
6,400,336
6,516,204
6,561,851
6,643,501
6,653,979
6,697,030
6,785,830
6,845,249
6,847,830
6,876,697
6,879,585
6,886,049
6,968,171
6,985,757
7,023,878
7,053,843
7,106,569
D442,170
D459,303
and other patents pending.
This product includes
technology licensed from:
Licensed by QUALCOMM Incorporated under one or more of
the following United States patents and/or their counterparts
in other nations:
4,901,307
5,267,261
5,490,165
5,544,196
5,710,784
5,056,109
5,267,262
5,504,773
5,568,483
5,778,338
5,101,501
5,337,338
5,506,865
5,600,754
5,109,390
5,414,796
5,511,073
5,657,420
5,228,054
5,416,797
5,535,239
5,659,569
Manufactured or sold by Sierra Wireless or its licensees under
one or more patents licensed from InterDigital Group.
Copyright
©2007 Sierra Wireless. All rights reserved.
Trademarks
AirCard and “Heart of the Wireless Machine” are registered
trademarks of Sierra Wireless.
Sierra Wireless, the Sierra Wireless logo, the red wave design,
the red‐tipped antenna, and Watcher are trademarks of Sierra
Wireless.
Windows® is a registered trademark of Microsoft Corporation.
2130114
Preface
QUALCOMM® is a registered trademark of QUALCOMM
Incorporated. Used under license.
Other trademarks are the property of the respective owners.
Contact
Information
Sales Desk:
Phone: 1-604-232-1488
Hours: 8:00 AM to 5:00 PM Pacific Time
E-mail: sales@sierrawireless.com
Post: Sierra Wireless
13811 Wireless Way
Richmond, BC
Canada
V6V 3A4
Fax: 1-604-231-1109
Web: www.sierrawireless.com
Consult our website for up‐to‐date product descriptions,
documentation, application notes, firmware upgrades, trouble‐
shooting tips, and press releases:
www.sierrawireless.com
Rev 1.4.1 Mar.07
CDMA / GSM Mini Card Hardware Integration Guide
2130114
Table of Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
The Universal Development Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Required connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Guide organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Related documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Power Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Overview of operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Power signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Electrostatic discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Module power states . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disconnected state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Off state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Normal state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Low power mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Usage models . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12
12
12
13
13
13
RF Integration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
RF connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Ground connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Antenna and cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Interference and sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power supply noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interference from other wireless devices . . . . . . . . . . . . . . . . . . . . . . . . . .
Device-generated RF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
18
18
19
Host / Module Communication Interface . . . . . . . . . . . . . . . . . . . .21
Rev 1.4.1 Mar.07
CDMA / GSM Mini Card Hardware Integration Guide
LED output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Regulatory Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Important notice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Safety and hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Important compliance information for North American users . . . . . . . . . . . 24
Acronyms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2130114
1
1: Introduction
Sierra Wireless’ Mini Card modules form the radio component
for the products in which they are embedded. Mini Cards are
available for use on CDMA and GSM networks, including:
Note: Throughout this
document, MC57xx and MC87xx
refer to the entire suites of
CDMA and GSM Mini Cards
respectively.
• MC5720 and MC5725—operate on CDMA networks using
the IS‐95A and CDMA 1X, and 1xEV‐DO (IS‐856) network
standards
• MC8755 / MC8755V, MC8765, MC8775 / MC8775V, and
MC8780 / MC8781—operate on GSM networks using the
GSM / GPRS / EDGE / UMTS / HSDPA network standards
Purpose of this guide
This guide addresses issues that affect the integration of Sierra
Wireless modules into host products, and includes design
recommendations for the host products.
Note: An understanding of network technology and experience in
integrating hardware components into electronic equipment is
assumed.
The Universal Development Kit
Sierra Wireless manufactures a Universal Development Kit
(UDK) that facilitates all phases of the integration process.
This kit is a hardware development platform that is designed
to support multiple members of the Wireless Embedded
Module product family. It contains the hardware components
that are typically necessary for evaluating and developing with
the module, including:
• Development board
• Cables
• Antennas
• Other accessories
Rev 1.4.1 Mar.07
CDMA / GSM Mini Card Hardware Integration Guide
Required connectors
Note: Contact vendors before
choosing your connectors — the
numbers included here are for
reference only. Choose
connectors that are appropriate
to your design.
When integrating these modules into your host device, you
need the following connector types:
• RF cable that mates with Hirose U.FL connector (model
U.FL #CL331‐0471‐0‐10)
• Industry‐standard mating connector for 52‐pin EDGE—
some manufacturers include Tyco, Foxconn, and Molex. For
example, the connector used on the Mini Card Dev Kit
board is a Molex 67910‐0001.
• Industry‐standard USIM / RUIM connector—the actual
connector you use depends on how your device exposes the
USIM / RUIM socket. For example, the USIM / RUIM
connector used on the Mini Card Dev Kit board is an ITT
CCM03‐3518.
Guide organization
This guide includes the following sections:
1. Introduction (this section)
2. Power Interface (p.11)
Describes power control signals used by the module and
discusses design issues related to power supply
integration.
3. RF Integration (p.15)
Describes antenna connection methods and grounding issues,
RF interference and desense issues.
4. Host / Module Communication Interface (p.21)
Describes the USB interface for host / module communication,
and the USIM / RUIM interface for host / module integration.
5. Regulatory Information (p.23)
Describes regulatory approvals and regulatory information
requirements.
6. Acronyms and Definitions (p.27)
Lists acronyms and definitions used throughout this guide.
Note: The term "host" always refers to the host device.
Related documents
This guide deals specifically with hardware integration issues
that are unique to the MC57xx and MC87xx modules.
Table 1‐1 lists other documents referenced in this guide.
2130114
Introduction
Table 1-1: Related documentation
Document title
AT Command Set for User
Equipment (UE) (Release 6)
Description
This 3GPP technical specification describes standard AT
commands for GSM / UMTS devices.
Download this document (3GPP TS 27.007) from
www.3gpp.org.
CDMA 1X Standard
Technical requirements for CDMA systems, including
details on sleep cycle index (SCI) values.
Order this document, CDMA 2000 Series Release A
(2000) (document # TIA/EIA/IS-2000 Series, Release A)
from www.tiaonline.org.
EM5625 Embedded Module,
MC5720 MiniCard CnS
Reference (Document
2130643)
CnS (Control and Status) messages that are supported by
the MC5720 and the MC5725.
EM5625 Embedded Module,
MC5720 MiniCard AT
Command Reference
(Document 2130620)
Proprietary, basic AT commands for the MC5720 / 5725 /
5725V. For MC87xx-specific commands, see UMTS
Modems Supported AT Command Reference (Document
2130617).
EM5625 Embedded Module,
MC5720 MiniCard Extended AT
Command Reference
(Document 2130621)
Proprietary AT commands for the MC5720 / 5725 / 5725V.
For MC87xx-specific commands, see MC87xx Modem
Extended AT Command Reference (Document 2130616).
FCC Regulations - Part 15 Radio Frequency Devices
This section of the FCC Code of Federal Regulations, Title
47 deals with radio frequency devices, including shielding
requirements for embedded modules.
Download this regulation from http://wireless.fcc.gov.
IEC-61000-4-2 level 3
Techniques for testing and measuring electrostatic
discharge (ESD) immunity.
Order this document from www.iec.ch.
MC5720 MiniCard Product
Specification (Document
2130599)
Features, mechanical and electrical specifications, and
standards compliance of the MC5720.
MC5725 Mini Card Product
Specification (Document
2130663)
Features, mechanical and electrical specifications, and
standards compliance of the MC5725.
MC5725V Mini Card Product
Specification (Document
2130671)
Features, mechanical and electrical specifications, and
standards compliance of the MC5725V.
MC8755 / MC8765 PCI Express
Mini Card Product
Specification (Document
2130637)
Features, mechanical and electrical specifications, and
standards compliance of the MC8755 / MC8765.
Rev 1.4.1 Mar.07
CDMA / GSM Mini Card Hardware Integration Guide
Table 1-1: Related documentation (Continued)
Document title
10
Description
MC8755V with Audio PCI
Express Mini Card Product
Specification (Document
2130664)
Features, mechanical and electrical specifications, and
standards compliance of the MC8755V.
MC8775 PCI Express Mini Card
Product Specification
(Document 2130697)
Features, mechanical and electrical specifications, and
standards compliance of the MC8775.
MC8775V with Audio PCI
Express Mini Card Product
Specification (Document
2130700)
Features, mechanical and electrical specifications, and
standards compliance of the MC8775V.
MC8780/MC8781 PCI Express
Mini Card Product
Specification (Document
2130782)
Features, mechanical and electrical specifications, and
standards compliance of the MC8780 / MC8781.
MC8755/MC8765 Modem CnS
Reference (Document
2130602)
This document describes the CnS (Control and Status)
messages supported by the MC8755 / MC8755V /
MC8765 / MC8775 / MC8775V / MC8780 / MC8781.
MC87xx Modem Extended AT
Command Reference
(Document 2130616)
Proprietary AT commands for the MC87xx. For MC57xxspecific commands, see the EM5625 Embedded Module,
MC5720 MiniCard Extended AT Command Reference
(Document 2130621).
Mobile Station (MS)
Conformance Specification;
Part 4: Subscriber Interface
Module
This 3GPP technical specification describes SIM testing
methods.
PCI Express Mini Card Dev Kit
Quick Start Guide (Document
2130705)
This document describes the setup and configuration of
modules.
PCI Express Mini Card
Electromechanical
Specification Revision 1.1
Download this document from www.pcisig.com.
UMTS Modems Supported AT
Command Reference
(Document 2130617)
This document describes proprietary, basic AT commands
for the MC87xx. For MC57xx-specific commands, see the
EM5625 Embedded Module, MC5720 Mini-Card AT
Command Reference (Document 2130620).
Universal Serial Bus
Specification, Rev 2.0
Download this specification from www.usb.org.
Download this document (3GPP TS 11.10-4) from
www.3gpp.org.
2130114
2
2: Power Interface
Overview of operation
Note: This chapter contains information for both the CDMA (MC57xx)
and GSM (MC87xx) modules.
Information that is unique to specific module types is clearly
identified.
The module is designed to use a 3.3V (nominal) power supply,
provided by the host. It is the host’s responsibility to provide
safe and continuous power to the module at all times; the
module does NOT have an independent power supply, or
protection circuits to guard against electrical issues.
The module’s power state is controlled by the host’s assertion /
de‐assertion of the W_Disable# signal. The module also
monitors its supply voltage and requests shutdown if the
supply is insufficient.
Power signals
The module must be connected to a 3.3V power supply (as
described in PCI Express Mini Card Electromechanical Specifi‐
cation Revision 1.1).
The MC87xx has more power pins than the MC57xx due to
higher peak current requirements for GSM devices.
For detailed pinout and voltage / current requirements of these
modules, see the Product Specification Document for your
Mini Card.
Electrostatic discharge (ESD)
You are responsible for ensuring that the host has adequate
ESD protection on digital circuits and antenna ports:
• (Operational) RF port (antenna launch and RF connector):
IEC‐61000‐4‐2 — Level (Electrostatic Discharge Immunity Test)
• (Non‐operational) Host connector interface:
JESD22‐A114‐B +/‐ 1kV Human Body Model and
JESD22‐C101 +/‐ 125 V Charged Device Model
Specific recommendations are provided where needed in this
guide, however, the level of protection required depends on
your application.
Rev 1.4.1 Mar.07
Values in this guide are summarized from the product specification documents (PSDs) - the PSD takes precedence.
11
CDMA / GSM Mini Card Hardware Integration Guide
Note: ESD protection is highly recommended for the USIM / RUIM
connector at the point where the contacts are exposed, and for any
other signals from the host interface that would be subjected to ESD
by the user of the product.
Module power states
Note: The module unit defaults
to the Normal state when
VCC3.3 is first applied in the
absence of W_Disable# control.
The module has four power states:
• Disconnected
No power to the module.
• Off
Power to the module, but the module is powered off.
• Normal
The module is active. Several modes are possible (Receive,
Transmit, Sleep, Shutdown).
• Low power (“airplane mode”)
The module is active, but RF is disabled.
State machines are implemented in the module to monitor the
power supply and operating temperature.
Disconnected state
Note: The difference between
the Disconnected and Off states
is that in the Off state, the
module is still connected to the
power source and draws minimal
current.
This state occurs when there is no power to the module — the
host power source is disconnected from the module and all
voltages associated with the module are at 0 V.
Whether the host device is also powered off depends on the
power rail design. If the connection between the power rail
and the module is controlled by the host, the host can stay
powered on and cut the power to put the modem into the
disconnected state. If the power rail is shared between the host
device and the module, the host is powered off when the
module is powered off.
Off state
In this state, the host is powered up and the module is
powered down (but still connected to the power source).
The host keeps the module powered off by asserting (driving
low) the W_Disable# signal. In this state, the module draws
minimal current.
12
2130114
Values in this guide are summarized from the product specification documents (PSDs) - the PSD takes precedence.
Power Interface
Normal state
Note: This is the default state
when VCC3.3 is first applied in
the absence of W_Disable#
control.
This is the active state of the module. In this state:
• The module is fully powered.
• The module is capable of placing / receiving calls or estab‐
lishing data connections on the wireless network.
• The USB interface is fully active.
Low power mode
In this state, RF (both Rx and Tx) is disabled in the module, but
the USB interface is still active. This low power mode
(ʺairplane modeʺ) is controlled by software commands
through the host interface.
For instructions on using the commands, refer to AT Command
Set for User Equipment (UE) (Release 6) (+CFUN=0 command),
EM5625 Embedded Module, MC5720 MiniCard CnS Reference
(Document 2130643) (CNS_RADIO_POWER [0x1075] command),
or MC8755/MC8765 Modem CnS Reference (Document 2130602)
(Disable Modem command).
Usage models
Usage models can be used to calculate expected current
consumption. A sample usage model is provided in Table 2‐1.
Table 2-1: Power consumption of a sample application
Used by a field worker
(data only)
Used for remote data
logging
Upload (module
Tx)
1000 kB/day
40 kB/h
Download
(module Rx)
500 kB/day
100 kB/day
Coverage / data
rate
1X / 80 kbps
IS-95 / 14.4 kbps
Hours of
operation
8 / day (off 16 hrs / day)
24 / day
Total power
consumed over
24 hours
60 mAh
200 mAh
This example model applies to a battery‐operated device. In
practice, because the module is isolated from the battery (the
host device manages the power source), the mAh ratings
depend on the device’s supply efficiency.
Rev 1.4.1 Mar.07
Values in this guide are summarized from the product specification documents (PSDs) - the PSD takes precedence.
13
CDMA / GSM Mini Card Hardware Integration Guide
The module automatically enters slotted sleep mode when
there is no transmission or reception occurring (SCI = 2).
Transmit power is assumed to be +3 dBm.
14
2130114
Values in this guide are summarized from the product specification documents (PSDs) - the PSD takes precedence.
3
3: RF Integration
The MC87xx operates on the frequencies detailed in Table 3‐1.
Table 3-1: MC87xx — Supported frequencies
Product
Band
Frequencies
(MHz)
GSM 850
Tx: 824–849
Rx: 869-894
EGSM 900
Tx: 880-915
Rx: 925-960
DCS 1800
Tx: 1710-1785
Rx: 1805-1880
PCS 1900
Tx: 1850-1910
Rx: 1930-1990
MC8755 /
MC8755V /
MC8775 /
MC8775V /
MC8780 /
MC8781
Band I
UMTS 2100
Tx: 1920–1980
Rx: 2110–2170
MC8765 /
MC8775 /
MC8775V /
MC8780 /
MC8781
Band II
UMTS 1900
Tx: 1850–1910
Rx: 1930–1990
Band V
UMTS 850
Tx: 824–849
Rx: 869–894
MC8780 /
MC8781
GPS
Rx: 1575.42
MC8755 /
MC8755V /
MC8765 /
MC8775 /
MC8775V /
MC8780 /
MC8781
RF connection
When attaching an antenna to the module:
Note: To disconnect the
antenna, make sure you use the
Hirose U.FL connector removal
tool (P/N UFL-LP-N-2(01)) to
prevent damage to the module
or coaxial cable assembly.
• Use a Hirose U.FL connector (model
U.FL #CL331‐0471‐0‐10) to attach an antenna to a
connection point on the module, as shown in Figure 3‐1 (the
main RF connector on the top side; the diversity RF
connector on the bottom side).
• Match coaxial connections between the module and the
antenna to 50 Ω.
• Minimize RF cable losses to the antenna; the recommended
maximum cable loss for antenna cabling is 0.5 dB.
Rev 1.4.1 Mar.07
Values in this guide are summarized from the product specification documents (PSDs) - the PSD takes precedence.
15
CDMA / GSM Mini Card Hardware Integration Guide
Figure 3-1: Antenna connection points and mounting holes
Ground connection
When connecting the module to system ground:
• Prevent noise leakage by establishing a very good ground
connection to the module through the host connector.
• Connect to system ground using the two mounting holes at
the top of the module (as shown in Figure 3‐1).
• Minimize ground noise leakage into the RF.
Depending on the host board design, noise could potentially
be coupled to the module from the host board. This is
mainly an issue for host designs that have signals traveling
along the length of the module, or circuitry operating at
both ends of the module interconnects.
Shielding
The module is fully shielded to protect against EMI and to
ensure compliance with FCC Part 15 ‐ “Radio Frequency
Devices” (or equivalent regulations in other jurisdictions).
Note: The module shields must NOT be removed.
16
2130114
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
RF Integration
Antenna and cabling
Note: Values in this guide are
taken from the appropriate
product specification documents
(PSDs) (listed in Related
documents, page 8) — in the
case of a discrepancy between
this document and the relevant
PSD, use the value listed in the
PSD.
When selecting the antenna and cable, it is critical to RF perfor‐
mance to match antenna gain and cable loss.
Choosing the correct antenna and cabling
Consider the following points for proper matching of antennas
and cabling:
• The antenna (and associated circuitry) should have a
nominal impedance of 50 Ω with a return loss ≤ 10 dB
across each frequency band of operation.
• The system gain value affects both radiated power and
regulatory (FCC, IC, CE, etc.) test results.
Developing custom antennas
Consider the following points when developing custom‐
designed antennas:
• A skilled RF engineer should do the development to ensure
that the RF performance is maintained.
• Identify the bands that need to be supported, particularly
when both the MC57xx and MC87xx will be installed in the
same platform. In this case, you may want to develop
separate antennas for maximum performance.
Determining the antenna’s location
Consider the following points when deciding where to put the
antenna:
• Antenna location may affect RF performance. Although the
module is shielded to prevent interference in most applica‐
tions, the placement of the antenna is still very important —
if the host device is insufficiently shielded, high levels of
broadband or spurious noise can degrade the module’s
performance.
• Connecting cables between the module and the antenna
must have 50 Ω impedance. If the impedance of the module
is mismatched, RF performance is reduced significantly.
• Antenna cables should be routed, if possible, away from
noise sources (switching power supplies, LCD assemblies,
etc.). If the cables are near the noise sources, the noise may
be coupled into the RF cable and into the antenna.
Disabling the diversity antenna (MC57xx)
If your host device is not designed to use the MC57xx module’s
diversity antenna, terminate the interface with a 50 Ω ohm
load.
Rev 1.4.1 Mar.07
Values in this guide are summarized from the product specification documents (PSDs) - the PSD takes precedence.
17
CDMA / GSM Mini Card Hardware Integration Guide
Interference and sensitivity
Note: These modules are based
on ZIF (Zero Intermediate
Frequency) technologies; when
performing EMC
(Electromagnetic Compatibility)
tests, there are no IF
(Intermediate Frequency)
components from the module to
consider.
Note: Values in this guide are
taken from the appropriate
product specification documents
(PSDs) (listed in Related
documents, page 8) — in the
case of a discrepancy between
this document and the relevant
PSD, use the value listed in the
PSD.
Several sources of interference can affect the RF performance
of the module (RF desense). Common sources include power
supply noise and device‐generated RF.
RF desense can be addressed through a combination of
mitigation techniques and radiated sensitivity measurement.
Power supply noise
Noise in the power supply can lead to noise in the RF signal.
The power supply ripple limit for the module is no more than
200 mVp‐p 1 Hz to 100 kHz. This limit includes voltage ripple
due to transmitter burst activity.
Interference from other wireless devices
Wireless devices operating inside the host device can cause
interference that affects the module.
To determine the most suitable locations for antennas on your
host device, evaluate each wireless device’s radio system,
considering the following:
• Any harmonics, sub‐harmonics, or cross‐products of signals
generated by wireless devices that fall in the module’s Rx
range may cause spurious response, resulting in decreased
Rx performance.
• The Tx power and corresponding broadband noise of other
wireless devices may overload or increase the noise floor of
the module’s receiver, resulting in Rx desense.
The severity of this interference depends on the closeness of
the other antennas to the module’s antenna. To determine
suitable locations for each wireless device’s antenna,
thoroughly evaluate your host device’s design.
18
2130114
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
RF Integration
Device-generated RF
Note: The module can cause
interference with other devices
such as hearing aids and onboard speakers.
Wireless devices such as the
Mini Card transmit in bursts
(pulse transients) for set
durations (RF burst frequencies).
Hearing aids and speakers
convert these burst frequencies
into audible frequencies,
resulting in audible noise.
All electronic computing devices generate RF interference that
can negatively affect the receive sensitivity of the module
(RF desense).
The proximity of host electronics to the antenna in wireless
devices can contribute to RF desense. Components that are
most likely to cause RF desense include:
• Microprocessor and memory
• Display panel and display drivers
• Switching‐mode power supplies
These and other high‐speed devices (in particular, the
processor) can cause RF desense because they run at
frequencies of tens of MHz. The rapid rise and fall of these
clock signals generates higher‐order harmonics that often fall
within the operating frequency band of the module, causing
RF desense.
Example
On a sub‐system running at 40 MHz, the 22nd harmonic falls
at 880 MHz, which is within the cellular receive frequency
band.
Note: In practice, there are usually numerous interfering frequencies
and harmonics. The net effect can be a series of desensitized receive
channels.
Note: It is important to
investigate sources of localized
interference early in the design
cycle.
Rev 1.4.1 Mar.07
Values in this guide are summarized from the product specification documents (PSDs) - the PSD takes precedence.
19
CDMA / GSM Mini Card Hardware Integration Guide
20
2130114
In the event of a discrepancy in values between this guide and the Product Specification Document (PSD), the PSD takes precedence.
4
4: Host / Module Communication
Interface
This chapter provides information about the Host‐Module
communication interface (USB interface) and lists the extended
AT commands that may be useful for hardware integration
testing.
Note: On any given interface (USB, USIM/RUIM, etc.), leave unused
inputs and outputs as no-connects.
LED output
The module drives the LED output according to the PCI‐
Express Mini Card specification (summarized in Table 4‐1,
below).
Table 4-1: LED states
State
Indicates
Characteristics
Off
Module is not
powered.
Light is off.
On
Module is powered
and connected, but
not transmitting or
receiving.
Light is on.
Slow blink
Module is powered
and searching for a
connection.
LED is flashing at a steady,
slow rate.
Module is transmitting
or receiving.
LED is flashing intermittently,
proportional to data transfer
activity.
Intermittent
blink
• 250 ms ± 25% ON period
• 0.2 Hz ± 25% blink rate
• 50% duty cycle
• 3 Hz minimum blink rate
• 20 Hz maximum blink rate
Rev 1.4.1 Mar.07
Values in this guide are summarized from the product specification documents (PSDs) - the PSD takes precedence.
21
CDMA / GSM Mini Card Hardware Integration Guide
Figure 4-1: Example LED
VCC 3.3V
Current limiting Resistor
LED
MiniCard
MIO
22
2130114
Values in this guide are summarized from the product specification documents (PSDs) - the PSD takes precedence.
A
A: Regulatory Information
Important notice
Because of the nature of wireless communications, trans‐
mission and reception of data can never be guaranteed. Data
may be delayed, corrupted (i.e., have errors) or be totally lost.
Although significant delays or losses of data are rare when
wireless devices such as the Sierra Wireless modem are used in
a normal manner with a well‐constructed network, the Sierra
Wireless modem should not be used in situations where failure
to transmit or receive data could result in damage of any kind
to the user or any other party, including but not limited to
personal injury, death, or loss of property. Sierra Wireless and
its affiliates accept no responsibility for damages of any kind
resulting from delays or errors in data transmitted or received
using the Sierra Wireless modem, or for failure of the Sierra
Wireless modem to transmit or receive such data.
Safety and hazards
Do not operate your MC57xx / MC87xx modem:
• In areas where blasting is in progress
• Where explosive atmospheres may be present including
refuelling points, fuel depots, and chemical plants
• Near medical equipment, life support equipment, or any
equipment which may be susceptible to any form of radio
interference. In such areas, the MC57xx / MC87xx modem
MUST BE POWERED OFF. Otherwise, the MC57xx /
MC87xx modem can transmit signals that could interfere
with this equipment.
In an aircraft, the MC57xx / MC87xx modem MUST BE
POWERED OFF. Otherwise, the MC57xx / MC87xx modem
can transmit signals that could interfere with various onboard
systems and may be dangerous to the operation of the aircraft
or disrupt the cellular network. Use of a cellular phone in an
aircraft is illegal in some jurisdictions. Failure to observe this
instruction may lead to suspension or denial of cellular
telephone services to the offender, or legal action or both.
Some airlines may permit the use of cellular phones while the
aircraft is on the ground and the door is open. The MC57xx /
MC87xx modem may be used normally at this time.
Rev 1.4.1 Mar.07
23
CDMA / GSM Mini Card Hardware Integration Guide
Important compliance
information for North American
users
The MC57xx / MC87xx modem has been granted modular
approval for mobile applications. Integrators may use the
MC57xx / MC87xx modem in their final products without
additional FCC / IC (Industry Canada) certification if they
meet the following conditions. Otherwise, additional FCC / IC
approvals must be obtained.
1. At least 20 cm separation distance between the antenna and
the user’s body must be maintained at all times.
2. To comply with FCC / IC regulations limiting both maximum
RF output power and human exposure to RF radiation, the
maximum antenna gain including cable loss in a mobile‐only
exposure condition must not exceed:
· 8 dBi in the Cellular band and 4 dBi in the PCS band for the
MC8755 / MC8765
· 5 dBi in the Cellular band and 4 dBi in the PCS band for the
MC8775 / MC8780 / MC8781
· 4.65 dBi in the Cellular band and 3.35 dBi in the PCS band
for the MC5720 / MC5725
3. The MC57xx / MC87xx modem and its antenna must not
be co‐located or operating in conjunction with any other
transmitter or antenna within a host device.
4. A label must be affixed to the outside of the end product into
which the MC57xx / MC87xx modem is incorporated, with
a statement similar to the following:
· For MC5720:
This device contains FCC ID: N7N‐MC5720
This equipment contains equipment certified under
IC: 2417C‐MC5720
· For MC5725 / MC5725V:
This device contains FCC ID: N7N‐MC5725
This equipment contains equipment certified under
IC: 2417C‐MC5725
· For MC8755 / MC8755V:
This device contains FCC ID: N7NMC8755
· For MC8765:
This device contains FCC ID: N7NMC8765
This equipment contains equipment certified under
IC: 2417C‐MC8765
· For MC8775 / MC8775V:
This device contains FCC ID: N7NMC8775
This equipment contains equipment certified under
IC: 2417C‐MC8775
· For MC8780:
This device contains FCC ID: N7NMC8780
24
2130114
Regulatory Information
·
5.
For MC8781:
This device contains FCC ID: N7NMC8781
This equipment contains equipment certified under
IC: 2417C‐MC8781
A user manual with the end product must clearly indicate the
operating requirements and conditions that must be observed
to ensure compliance with current FCC / IC RF exposure
guidelines.
The end product with an embedded MC57xx / MC87xx
modem may also need to pass the FCC Part 15 unintentional
emission testing requirements and be properly authorized per
FCC Part 15.
Note: If this module is intended for use in a portable device,
you are responsible for separate approval to satisfy the SAR
requirements of FCC Part 2.1093 and IC RSS‐102.
Rev 1.4.1 Mar.07
25
CDMA / GSM Mini Card Hardware Integration Guide
26
2130114
B
B: Acronyms and Definitions
Table B-2: Acronyms and definitions
Acronym or term
Definition
AGC
Automatic Gain Control
BER
Bit Error Rate - a measure of receive sensitivity
BLER
Block Error Rate
Call Box
Base Station Simulator - Agilent E8285A or 8960, Rohde &
Schwarz CMU200
CDMA
Code Division Multiple Access
dB
Decibel = 10 x log10 (P1/P2)
P1 is calculated power; P2 is reference power
Decibel = 20 x log10 (V1/V2)
V1 is calculated voltage, V2 is reference voltage
dBm
Decibels, relative to 1 mW - Decibel(mW) = 10 x log10 (Pwr (mW)/
1mW)
DUT
Device Under Test
EDGE
Enhanced Data rates for GSM Evolution
EM
Embedded Module
ESD
ElectroStatic Discharge
FER
Frame Error Rate - a measure of receive sensitivity
GPRS
General Packet Radio Services
GPS
Global Positioning System
GSM
Global System for Mobile communications
Hz
Hertz = 1 cycle/second
inrush current
Peak current drawn when a device is connected or powered on
IS-2000
3G radio standards for voice and data (CDMA only)
IS-95
2G radio standards targeted for voice (cdmaONE)
LDO
Low Drop Out - refers to linear regulator
MC5720 / MC5725 /
MC5725V
Sierra Wireless Mini Cards used on CDMA networks
Rev 1.4.1 Mar.07
27
CDMA / GSM Mini Card Hardware Integration Guide
Table B-2: Acronyms and definitions
Acronym or term
28
Definition
MC57xx
Any of the following CDMA Mini Cards: MC5720 / MC5725
MC8755 / MC8755V /
MC8765 /
MC8775 / MC8775V
Sierra Wireless Mini Cards used on GSM networks
MC87xx
Any of the following CDMA Mini Cards: MC8755 / MC8755V /
MC8765 / MC8775 / MC8775V
MHz
MegaHertz = 10E6 Hertz (Hertz = 1 cycle/second)
MIO
Module Input/Output
MP
Mobile Product
MPE
Maximum Permissible Exposure — the level of radiation to which a
person may be exposed without hazardous effect or adverse
biological changes
OTA
Over-The-Air or Radiated through the antenna
PCS
Personal Communication System - PCS spans the 1.9 GHz radio
spectrum
RF
Radio Frequency
RMS
Root Mean Square
RUIM
Removable User Identity Module
SA
Selective Availability
Sensitivity (Audio)
Measure of lowest power signal that the receiver can measure
Sensitivity (RF)
Measure of lowest power signal at the receiver input that can
provide a prescribed BER/BLER/SNR value at the receiver output.
SIM
Subscriber Identity Module
SNR
Signal to Noise Ratio
SOF
Start of Frame - a USB function
UART
Universal Asynchronous Receiver Transmitter
UDK
Universal Development Kit (PCI Express Mini Card Dev Kit)
UMTS
Universal Mobile Telecommunications System
USB
Universal Serial Bus
USIM
Universal Subscriber Identity Module
VCC3.3
3.3 V supply voltage
2130114
Acronyms and Definitions
Table B-2: Acronyms and definitions
Acronym or term
Definition
WCDMA
Wideband Code Division Multiple Access — In this document, the
term “UMTS” is used instead of “WCDMA”.
XIM
In this document, XIM is used as part of the contact identifiers for
the USIM/RUIM interface (XIM_VCC, XIM_CLK, etc.). It indicates
either RUIM or USIM.
Rev 1.4.1 Mar.07
29
CDMA / GSM Mini Card Hardware Integration Guide
30
2130114
Index
Numerics
diversity antenna
disabling 17
1X
CDMA Standard 9
acronyms and definitions 27–29
airplane mode 13
antenna
connection and mounting points 16
connection considerations 15
custom, considerations 17
diversity antenna, disabling 17
limit, matching coaxial connections 15
location, considerations 17
matching, considerations 17
maximum cable loss 15
AT commands
3GPP specification, details 9
low power mode, setting 13
AT commands, extended
MC5720 / MC5725, reference 9
MC87xx, reference 10
AT commands, standard
MC5720 / MC5725, reference 9
MC87xx, reference 10
cable loss
antenna, maximum 15
CDMA
1X Standard 9
CnS
MC5720 / MC5725 reference 9
MC87xx reference 10
connection
grounding 16
connectors, required
EDGE mating (52‐pin) 8
host‐module 8
RF, Hirose 8
USIM/RUIM 8
current
consumption
usage models 13
DCS 1800
RF parameters, MC8755/8765/8775 15
desense. See RF
disconnected, module power state 12
Rev 1.4.1 Mar.07
EDGE connector, manufacturers 8
EGSM 900
RF parameters, MC8755/8765/8775 15
electrostatic discharge. See ESD
ESD
protection requirements 11–12
testing techniques document (IEC‐61000‐4‐2) 9
FCC
regulations, relevant section 9
grounding
connection considerations 16
GSM 850
RF parameters, MC8755/8765/8775 15
impedance
module‐antenna 17
interference
device generated 19
power supply noise 18
wireless devices 18
LED
example 22
state
intermittent blink 21
off 21
on 21
slow blink 21
low power mode
setting, AT commands 13
low power, module power state 13
MC5720
AT reference (extended), and MC5725 9
AT reference (standard), and MC5725 9
31
CDMA / GSM Mini Card Hardware Integration Guide
CnS reference, and MC5725 9
product specification 9
MC5725
AT reference (extended), and MC5720 9
AT reference (standard), and MC5720 9
CnS reference, and MC5720 9
product specification 9
MC5725V
product specification 9
MC8755
AT reference (extended), and MC87xx 10
AT reference (standard), and MC87xx 10
CnS reference, and MC87xx 10
product specification 9
MC8755/8765/8775
RF parameters 15
MC8755V
AT reference (extended), and MC87xx 10
AT reference (standard), and MC87xx 10
CnS reference, and MC87xx 10
product specification 10
MC8765
AT reference (extended), and MC87xx 10
AT reference (standard), and MC87xx 10
CnS reference, and MC87xx 10
product specification 9
MC8775
AT reference (extended), and MC87xx 10
AT reference (standard), and MC87xx 10
CnS reference, and MC87xx 10
product specification 10
MC8775V
AT reference (extended), and MC87xx 10
AT reference (standard), and MC87xx 10
CnS reference, and MC87xx 10
product specification 10
Mini Card
Dev Kit Quick Start Guide 10
PCI Express Specification 10
noise
leakage, minimizing 16
RF interference, power supply 18
normal, module power state 13
default state 13
disconnected, characteristics 12
normal, characteristics 13
off, characteristics 12
signals, overview 11
state, disconnected 12
state, low power 13
state, normal 13
state, off 12
supply, RF interference 18
supply, ripple limit 18
power interface 11–14
Product Specification Document. See PSD
PSD
MC5720 9
MC5725 9
MC5725V 9
MC8755/8765 9
MC8755V 10
MC8775 10
MC8775V 10
regulatory information
FCC 24
limitation of liability 23
safety and hazards 23
RF
antenna cable loss, maximum 15
antenna connection, considerations 15
cable type, required 8
desense
device‐generated 19
interference
other devices 19
power supply 18
wireless devices 18
parameters
DCS 1800 15
EGSM 900 15
GSM 850 15
MC8755/8765/8775 15
PCS 1900 15
UMTS 1900 15
UMTS 2100 15
UMTS 850 15
off, module power state 12
PCI Express
Mini Card specification 10
PCS 1900
RF parameters, MC8755/8765/8775 15
power
32
See also MC5720, MC5725, MC5725V, MC8755,
MC8755V, MC8765, MC8775, MC8775V 10
shielding
module, compliance 16
SIM
testing methods, MS conformance specification 10
SIM. See USIM/RUIM
2130114
Index
testing
ESD immunity, techniques document (IEC‐61000‐
4‐2) 9
UDK. See Universal Development Kit
UMTS 1900
RF parameters, MC8755/8765/8775 15
UMTS 2100
RF parameters, MC8755/8765/8775 15
UMTS 850
RF parameters, MC8755/8765/8775 15
Universal Development Kit
components, included 7
Universal Serial Bus. See USB
Rev 1.4.1 Mar.07
usage models
current consumption 13
USB
specification 10
USIM/RUIM
connector type, required 8
W_Disable#
Normal state 13
off state 12
power state, controlling 11
ZIF (Zero Intermediate Frequency) 18
33
CDMA / GSM Mini Card Hardware Integration Guide
34
2130114


---

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.6
Linearized                      : No
Encryption                      : Standard V2.3 (128-bit)
User Access                     : Print, Extract, Print high-res
Tagged PDF                      : Yes
Page Mode                       : UseOutlines
XMP Toolkit                     : 3.1-702
Producer                        : Acrobat Distiller 7.0.5 (Windows)
Creator Tool                    : FrameMaker 7.1
Modify Date                     : 2007:03:16 20:15:32-08:00
Create Date                     : 2007:03:16 20:08:49Z
Metadata Date                   : 2007:03:16 20:15:32-08:00
Format                          : application/pdf
Title                           : HW Integration Guide.book
Creator                         : John
Document ID                     : uuid:a42d4984-eb51-46d7-8c31-edb8863659ef
Instance ID                     : uuid:335d24c7-3df5-4f14-b499-c75cfbe1c88b
Page Count                      : 38
Author                          : John

EXIF Metadata provided by EXIF.tools