Sierra Wireless Q52OMNI Dual mode transceiver User Manual
Sierra Wireless, Inc. Dual mode transceiver
User Manual
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| Date Submitted | 2008-12-03 00:00:00 |
| Date Available | 2008-12-03 00:00:00 |
| Creation Date | 2008-12-01 17:14:14 |
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| Document Lastmod | 2008-12-01 17:28:25 |
| Document Title | Q52 Omni Wireless CPU Product Technical Specification & Customer Design Guidelines |
| Document Creator | Acrobat PDFMaker 7.0.7 for Word |
| Document Author: | Wavecom |
Product Technical Specification &
Customer Design Guidelines
Q52 Omni Wireless CPU®
Reference: WI_DEV_ASSM_PTS_001
Revision: 004
Date: December 01, 2008
Q52 Omni Product
Technical Specification
Q52 Omni Wireless CPU®
Product Technical Specification &
Customer Design Guidelines
Reference: WI_DEV_ASSM_PTS_001
Revision: 004
Date: December 01, 2008
Powered by the Wavecom Operating System and Open AT®
© Confidential
Page 1 / 78
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Q52 Omni Product
Technical Specification
Document History
Level
Date
List of revisions
001
March 5, 2008
Creation
Wavecom
002
August 26, 2008
Update
Wavecom
003
November 14, 2008
Addition of the “Declaration of Conformity”
Wavecom
004
December 1, 2008
Update
Wavecom
Page 2 / 78
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Q52 Omni Product
Technical Specification
Overview
This document defines and specifies the Q52 Omni GSM/Orbcomm dual mode
transceiver.
Page 3 / 78
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Q52 Omni Product
Technical Specification
Table of Contents
References............................................................................................ 11
1.1
Reference Documents ........................................................................... 11
1.1.1
Wavecom Reference Documentation .............................................. 11
1.1.2
General Reference Documents....................................................... 11
1.2
List of Abbreviations ............................................................................. 12
General Description............................................................................... 15
2.1
General Information .............................................................................. 15
2.1.1
Overall Dimensions........................................................................ 15
2.1.2
Environment and Mechanics .......................................................... 15
2.1.3
Transceiver Features..................................................................... 15
2.1.4
Primary Interfaces ......................................................................... 16
2.1.5
Operating System .......................................................................... 16
2.2
Functional Description .......................................................................... 17
2.2.1
GSM Functionalities ...................................................................... 18
2.2.2
Orbcomm Functionality.................................................................. 18
2.3
Operating System.................................................................................. 18
Interfaces ............................................................................................. 19
3.1
System Connector ................................................................................. 19
3.2
Power Supply ........................................................................................ 20
3.2.1
Power Supply Description .............................................................. 20
3.2.2
Power Consumption....................................................................... 22
3.2.3
Recommendations for Less Consumption ..................................... 29
3.3
Electrical Information for Digital I/O....................................................... 30
3.4
Serial Interface ..................................................................................... 31
3.4.1
SPI Bus ......................................................................................... 31
3.4.2
I2C Bus ......................................................................................... 33
3.5
Main Serial Link (UART1) ....................................................................... 34
3.5.1
Features........................................................................................ 34
3.5.2
Pin Description of UART1 Interface ................................................ 35
3.6
Auxiliary Serial Link (UART2)................................................................. 38
3.6.1
Features........................................................................................ 38
3.7
General Purpose Input/Output................................................................ 39
Page 4 / 78
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Q52 Omni Product
Technical Specification
Analog to Digital Converters .................................................................. 40
3.8
3.8.1
Features........................................................................................ 40
3.8.2
Pins Description ............................................................................ 40
3.9
Digital to Analog Converter.................................................................... 41
3.9.1
Features........................................................................................ 41
3.9.2
Pin Description .............................................................................. 41
3.10 Analog Audio Interface .......................................................................... 42
3.10.1
Microphone Input .......................................................................... 42
3.10.2
Speaker Output Characteristics ..................................................... 44
3.10.3
Design Recommendation ............................................................... 45
3.10.4
Buzzer Output................................................................................ 48
3.11 ~ON
3.11.1
3.11.2
3.11.3
3.12
/ OFF Signal ................................................................................... 50
Features........................................................................................ 50
Pin Description .............................................................................. 50
Application.................................................................................... 50
External Interrupt.................................................................................. 55
3.13 BOOT Signal.......................................................................................... 55
3.13.1
Features........................................................................................ 56
3.13.2
Pin Description .............................................................................. 56
3.13.3
Application.................................................................................... 56
3.14
VREF_2V8 Output .................................................................................. 57
3.15 BAT-RTC (Backup Battery) .................................................................... 57
3.15.1
Interface Description..................................................................... 57
3.16
FLASH-LED Signal ................................................................................. 58
3.17 GPS Functionality.................................................................................. 59
3.17.1
Features (eRide Documentation Extract: For Information Only)....... 59
3.17.2
Performances (eRide Documentation Extract: For Information Only)59
3.18 RF Interface .......................................................................................... 65
3.18.1
RF Connections ............................................................................. 65
3.18.2
RF Performance............................................................................. 65
3.18.3
Transmitter Parameters................................................................. 66
3.18.4
Antenna Specifications ................................................................. 66
Technical Specifications ....................................................................... 67
4.1
Environmental Specifications ................................................................ 67
4.2
Mechanical Specifications..................................................................... 69
4.3
Antenna Cable....................................................................................... 70
4.4
GSM Antenna ........................................................................................ 70
Appendix............................................................................................... 71
Page 5 / 78
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Q52 Omni Product
Technical Specification
5.1
Standards and Recommendations.......................................................... 71
5.2
Declaration of Conformity...................................................................... 75
5.3
Safety Recommendations (for Information Only) .................................... 76
5.3.1
RF Safety ...................................................................................... 76
5.3.2
General Safety............................................................................... 77
Page 6 / 78
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Q52 Omni Product
Technical Specification
List of Figures
Figure 1: Top Level Architecture ........................................................................... 17
Figure 2: Power supply during burst emission...................................................... 21
Figure 3: Connected Mode Current Waveform ...................................................... 25
Figure 4: Slow Idle Mode Current Waveform ........................................................ 26
Figure 5: Fast Idle Mode Current Waveform ......................................................... 26
Figure 6: Transfer Mode Class 10 Current Waveform ........................................... 27
Figure 7: SPI Timing diagrams, Mode 0, Master, 4 wires ..................................... 31
Figure 8: I²C Timing diagrams, Master ................................................................. 33
Figure 9: Example of V24/CMOS serial link implementation for UART1................. 36
Figure 10: Example of full modem V24/CMOS serial link implementation for UART1
....................................................................................................................... 37
Figure 11: Example of MIC input connection with LC filter ................................... 43
Figure 12: Example of MIC input connection without LC filter .............................. 43
Figure 13: Example of Speaker connection ........................................................... 45
Figure 14: Capacitor near Microphone .................................................................. 46
Figure 15: Audio track design ............................................................................... 47
Figure 16: Example of buzzer implementation ...................................................... 49
Figure 17: Example of LED driven by the BUZZ-OUT output ................................. 49
Figure 18 : Example of ON/~OFF pin connection .................................................. 50
Figure 19 : Power-ON sequence (no PIN code activated) ...................................... 51
Figure 20 : Power-OFF sequence .......................................................................... 54
Figure 21: Boot Selection Application Example ..................................................... 56
Figure 22: Real Time Clock power supply ............................................................. 57
Figure 23: GPS TTFF, Hot Start Configuration ...................................................... 60
Figure 24: GPS TTFF, Warm Start Configuration .................................................. 61
Figure 25: GPS TTFF, Simulator Cold Start Configuration ..................................... 61
Figure 26: First Position Fix Accuracy Chart 01 .................................................... 62
Figure 27: First Position Fix Accuracy Chart 02 .................................................... 63
Figure 28: First Position Fix Accuracy Chart 03 .................................................... 64
Figure 29: Environmental classes ......................................................................... 68
Page 7 / 78
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Q52 Omni Product
Technical Specification
List of Tables
Table 1: GSM /GPRS Frequency............................................................................ 18
Table 2: System connector pinout ........................................................................ 20
Table 3: Power Supply Voltage ............................................................................. 21
Table 4: GSM power consumption without Open AT® processing ....................... 23
Table 5: Power consumption with Dhrystone Open AT® application .................... 24
Table 6: Power Supply Pin-out ............................................................................. 28
Table 7: CMOS Output / Input Electrical Characteristics for 2.8 volt signals.......... 30
Table 8: CMOS Output / Input Electrical Characteristics for 1.8 volt signals.......... 30
Table 9: Open Drain Electrical Characteristics....................................................... 30
Table 10: SPI Bus AC characteristics .................................................................... 32
Table 11: SPI Bus Configuration ........................................................................... 32
Table 12: SPI Bus Pin description ......................................................................... 32
Table 13: I²C Bus AC characteristics..................................................................... 34
Table 14: IC Bus Pin Description........................................................................... 34
Table 15: UART1 Pin Description.......................................................................... 35
Table 16: UART2 Pin Description.......................................................................... 38
Table 17: GPIOs Pin Description ........................................................................... 39
Table 18: ADCs Electrical Characteristics.............................................................. 40
Table 19: ADCs Pin Description ............................................................................ 40
Table 20: DAC Electrical Characteristics ............................................................... 41
Table 21: DAC Pin Description.............................................................................. 41
Table 22: MIC2 Pin Description ............................................................................ 42
Table 23: MIC2 Electrical Characteristics .............................................................. 42
Table 24: SPK Pin Description .............................................................................. 44
Table 25: SPK Electrical Characteristics ................................................................ 44
Table 26: Audio filtering Examples with Murata Components .............................. 47
Table 27: PWM/Buzzer Output Electrical Characteristics ...................................... 48
Table 28: PWM/Buzzer Output Pin Description..................................................... 48
Table 29: External Interrupt Pin description .......................................................... 55
Table 30: External Interrupt Electrical Characteristics ........................................... 55
Table 31: Boot Signal Mode ................................................................................. 56
Table 32: Boot Pin description .............................................................................. 56
Table 33: VREF_2V8 Pin Description ..................................................................... 57
Page 8 / 78
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Q52 Omni Product
Technical Specification
Table 34: VREF_2V8 Electrical Characteristics....................................................... 57
Table 35: Bat-RTC Pin Description........................................................................ 58
Table 36: Bat-RTC Electrical Characteristics ......................................................... 58
Table 37: Flash-LED Status................................................................................... 58
Table 38: Flash-LED Pin Description ..................................................................... 59
Table 39: Flash-LED Electrical Characteristics....................................................... 59
Table 40: GPS Functionality Performances ........................................................... 60
Table 41: GSM Antenna Specifications................................................................. 66
Page 9 / 78
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Q52 Omni Product
Technical Specification
Cautions
This platform contains a modular transmitter. This device is used for wireless
applications. Note that all electronics parts and elements are ESD sensitive.
Information provided herein by WAVECOM is accurate and reliable. However no
responsibility is assumed for its use and any of such WAVECOM information is
herein provided “as is” without any warranty of any kind, whether express or
implied.
General information about WAVECOM and its range of products is available at the
following internet address: http://www.wavecom.com
Trademarks
®
, inSIM®, “YOU MAKE IT, WE MAKE IT
®
WIRELESS” , WAVECOM , Wireless Microprocessor®, Wireless CPU®, Open AT®
and certain other trademarks and logos appearing on this document, are filed or
registered trademarks of Wavecom S.A. in France and/or in other countries. All
other company and/or product names mentioned may be filed or registered
trademarks of their respective owners.
®
Copyright
This manual is copyrighted by WAVECOM with all rights reserved. No part of this
manual may be reproduced, modified or disclosed to third parties in any form
without the prior written permission of WAVECOM.
No Warranty/No Liability
This document is provided “as is”. Wavecom makes no warranties of any kind,
either expressed or implied, including any implied warranties of merchantability,
fitness for a particular purpose, or noninfringement.
The recipient of the
documentation shall endorse all risks arising from its use. In no event shall
Wavecom be liable for any incidental, direct, indirect, consequential, or punitive
damages arising from the use or inadequacy of the documentation, even if
Wavecom has been advised of the possibility of such damages and to the extent
permitted by law.
Page 10 / 78
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Q52 Omni Product
Technical Specification
1 References
1.1
Reference Documents
For more details, several reference documents may be consulted. The Wavecom
reference documents are provided in the Wavecom document package, contrary to
the general reference documents which are not authored by Wavecom.
1.1.1 Wavecom Reference Documentation
[1]
Wireless Microprocessor® WMP100 Technical Specification
Reference: WM_DEV_WUP_PTS_004
[2]
WMP100 Development Kit User Guide
Reference: WM_DEV_WUP_UGD_001
[3]
AT Command Interface Guide for Open AT® Firmware v7.0
Reference: WM_DEV_OAT_UGD_059
1.1.2 General Reference Documents
[4]
“I²C Bus Specification”, Version 2.0, Philips Semiconductor 1998
[5]
ISO 7816-3 Standard
Page 11 / 78
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Q52 Omni Product
Technical Specification
1.2
List of Abbreviations
Abbreviation
Definition
AC
Alternating Current
ADC
Analog to Digital Converter
A/D
Analog to Digital conversion
AF
Audio-Frequency
AT
ATtention (prefix for modem commands)
AUX
AUXiliary
CAN
Controller Area Network
CB
Cell Broadcast
CEP
Circular Error Probable
CLK
CLocK
CMOS
Complementary Metal Oxide Semiconductor
CS
Coding Scheme
CTS
Clear To Send
DAC
Digital to Analog Converter
dB
Decibel
DC
Direct Current
DCD
Data Carrier Detect
DCE
Data Communication Equipment
DCS
Digital Cellular System
DR
Dynamic Range
DSR
Data Set Ready
DTE
Data Terminal Equipment
DTR
Data Terminal Ready
EFR
Enhanced Full Rate
E-GSM
Extended GSM
EMC
ElectroMagnetic Compatibility
EMI
ElectroMagnetic Interference
EMS
Enhanced Message Service
EN
ENable
ESD
ElectroStatic Discharges
FIFO
First In First Out
FR
Full Rate
Page 12 / 78
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Q52 Omni Product
Technical Specification
Abbreviation
Definition
FTA
Full Type Approval
GND
GrouND
GPI
General Purpose Input
GPC
General Purpose Connector
GPIO
General Purpose Input Output
GPO
General Purpose Output
GPRS
General Packet Radio Service
GPS
Global Positioning System
GSM
Global System for Mobile communications
HR
Half Rate
I/O
Input / Output
LED
Light Emitting Diode
LNA
Low Noise Amplifier
MAX
MAXimum
MIC
MICrophone
MIN
MINimum
MMS
Multimedia Message Service
MO
Mobile Originated
MT
Mobile Terminated
na
Not Applicable
NF
Noise Factor
NMEA
National Marine Electronics Association
NOM
NOMinal
NTC
Negative Temperature Coefficient
PA
Power Amplifier
Pa
Pascal (for speaker sound pressure measurements)
PBCCH
Packet Broadcast Control CHannel
PC
Personal Computer
PCB
Printed Circuit Board
PDA
Personal Digital Assistant
PFM
Power Frequency Modulation
PSM
Phase Shift Modulation
PWM
Pulse Width Modulation
RAM
Random Access Memory
RF
Radio Frequency
Page 13 / 78
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Q52 Omni Product
Technical Specification
Abbreviation
Definition
RFI
Radio Frequency Interference
RHCP
Right Hand Circular Polarization
RI
Ring Indicator
RST
ReSeT
RTC
Real Time Clock
RTCM
Radio Technical Commission for Maritime services
RTS
Request To Send
RX
Receive
SCL
Serial CLock
SDA
Serial DAta
SIM
Subscriber Identification Wireless CPU
SMS
Short Message Service
SPI
Serial Peripheral Interface
SPL
Sound Pressure Level
SPK
SPeaKer
SRAM
Static RAM
TBC
To Be Confirmed
TDMA
Time Division Multiple Access
TP
Test Point
TVS
Transient Voltage Suppressor
TX
Transmit
TYP
TYPical
UART
Universal Asynchronous Receiver-Transmitter
USB
Universal Serial Bus
USSD
Unstructured Supplementary Services Data
VSWR
Voltage Standing Wave Ratio
Page 14 / 78
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Q52 Omni Product
Technical Specification
2 General Description
2.1
General Information
The Q52 Omni is a dual mode GSM/Orbcomm transceiver consisting of an EGSM/GPRS 900/1800 and 850/1900 quad-band GSM transceiver combined with a
full function Orbcomm transceiver.
The operating mode of the dual mode
transceiver is managed by an internal communication controller that employs an
always best connected strategy with priority given to the GSM mode of operation
2.1.1 Overall Dimensions
Length: 114.55 mm
Width: 47.5 mm
Thickness: 16.2 mm
2.1.2 Environment and Mechanics
•
Green policy: RoHS compliant
•
Complete shielding
The Q52 Omni is compliant with RoHS (Restriction of Hazardous Substances in
Electrical and Electronic Equipment) Directive 2002/95/EC which sets limits for the
use of certain restricted hazardous substances. This directive states that “from 1st
July 2006, new electrical and electronic equipment put on the market does not
contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls
(PBB) or polybrominated diphenyl ethers (PBDE)”.
Transceivers which are compliant with this directive
are identified by the RoHs logo on their label.
2.1.3 Transceiver Features
•
2-Watt EGSM 900/GSM 850 radio
•
1-Watt GSM1800/1900 radio
•
Hardware GPRS class 10 capable
•
Internal GSM SIM card
•
5-Watt Orbcomm radio
Page 15 / 78
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Q52 Omni Product
Technical Specification
2.1.4 Primary Interfaces
•
Power supply
•
2 * UARTs Serial links
•
GSM Analog audio
•
Serial Protocol Interface (SPI)
•
I2C Interface
•
2 A/D inputs and 1 D/A output
•
Digital I/Os
•
GSM , GPS † and Orbcomm antenna ports
2.1.5 Operating System
•
Real Time Clock with calendar
•
Echo Cancellation + noise reduction (quadri codec)
•
Full GSM or GSM/GPRS Operating System stack
•
Full Orbcomm Operating System stack
•
Full GPS Operating System Stack ‡
One on Version with GPS functionnality
According to version
‡
According to version
†
Page 16 / 78
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Q52 Omni Product
Technical Specification
2.2
Functional Description
The top level architecture of the Q52 Omni is described below:
Figure 1: Top Level Architecture
Page 17 / 78
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Q52 Omni Product
Technical Specification
2.2.1 GSM Functionalities
The Radio Frequency (RF) range of the GSM transceiver complies with the Phase II
EGSM 900/DCS 1800 and GSM 850/PCS 1900 recommendations. The frequencies
are:
Transmit band (Tx)
Receive band (Rx)
GSM 850
824 to 849 MHz
869 to 894 MHz
E-GSM 900
880 to 915 MHz
925 to 960 MHz
DCS 1800
1710 to 1785 MHz
1805 to 1880 MHz
PCS 1900
1850 to 1910 MHz
1930 to 1990 MHz
Table 1: GSM /GPRS Frequency
2.2.2 Orbcomm Functionality
TBD
2.3
Operating System
The Operating System offers an extensive set of AT commands to control both the
GSM and Orbcomm functionality of the module.
The Operating System in the module is Open AT® compliant. This enables the
application developer to optionally integrate various types of specific process
applications such as vertical applications (telemetry, multimedia, automotive…) into
the internal ARM9 microprocessor.
Page 18 / 78
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Q52 Omni Product
Technical Specification
3 Interfaces
3.1
Pin
System Connector
Signal
Description
Dir
Pin Type
Alternate Function
BUZZ-OUT
Buzzer Output
Open Drain
VREF_2V8
Logic Voltage Reference
V-Ref
FLASH-LED
Flash LED Driver
Open Drain
BAT-RTC
Battery for RTC
I/O
GND
Chassis Ground
Ground
GND
Chassis Ground
Ground
SPK2
Speaker Audio from module
GND
Chassis Ground
Ground
AGND
Analog Reference
Ground
10
MIC2
Microphone Audio to module
Audio
11
DAC0
8 bit D/A Converter Output
0 - 2 volts
12
PWR_EN
Switches the module on/off
13
ADC0
10 bit A/D Converter Input
0 - 2 volts
14
ADC1
10 bit A/D Converter Input
0 - 2 volts
15
HW_SD
Hardware Shutdown
I/O
CMOS_2V8
16
EXT-INT0
External Interrupt Signal
CMOS_1V8
GPIO3
17
SPI-I
SPI
Input
interface)
(four
wire
CMOS_2V8
GPIO30
18
SPI1-IO
SPI1
Out
interface)
(four
wire
CMOS_2V8
GPIO29
(three
wire
I/O
CMOS_2V8
GPIO28
CMOS_2V8
GPIO31
SPI1
IO
interface)
Power
Audio
I/O
19
SPI-CLK
SPI1 Clock
20
SPI-CS
SPI1 Chip Select
21
GND
Chassis Ground
Ground
22
GND
Chassis Ground
Ground
23
DCD1
Data Carrier Detect_UART1
CMOS_2V8
GPIO43
24
RI1
Ring Indicator_UART1
CMOS_2V8
GPIO42
25
CTS1
Clear to Send_UART1
CMOS_2V8
GPIO39
Page 19 / 78
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Q52 Omni Product
Technical Specification
Pin
Signal
Description
Pin Type
Alternate Function
CMOS_2V8
GPIO41
26
DTR1
Data
Ready_UART1
27
TXD1
Transmit Data_UART1
CMOS_2V8
GPIO36
28
RTS1
Request to Send_UART1
CMOS_2V8
GPIO38
29
VCC_12V
12 VDC supply input
Power
30
RXD1
Receive Data_UART1
CMOS_2V8
31
VCC_12V
12 VDC supply input
Power
32
VCC_12V
12 VDC supply input
Power
33
VCC_3V6
3.6 VDC regulated supply
Power
34
VCC_3V6
3.6 VDC regulated supply
Power
35
SDA_I2C
Terminal
Dir
GPIO37
I/O
Open Drain
GPIO27
I C Data
36
SCL_I2C
I C Clock
Open Drain
GPIO26
37
TXD2
Transmit Data_UART2
CMOS_1V8
GPIO14
38
CTS2
Clear to Send_UART2
CMOS_1V8
GPIO16
39
RXD2
Receive Data_UART2
CMOS_1V8
GPIO15
40
RTS2
Request to Send_UART2
CMOS_1V8
GPIO17
Table 2: System connector pinout
3.2
Power Supply
3.2.1 Power Supply Description
The power supply required for the Q52Omni is a dual rail supply; VCC_3V6 and
VCC_12V. VCC_12V is only required to support Satellite mode operation. VCC_3V6
is used for GSM/GPRS, Satellite and GPS operation.
The power supply is one of the key issues in the design of a dual mode terminal.
Operation in GSM mode requires particularly careful attention to the ability of the
power supply to provide clean DC power.
Due to the burst emission mode used in GSM/GPRS, the VCC_3V6 power supply
must be able to deliver high current peaks in a short time. During the peaks, the
ripple (Uripp) on the supply voltage must not exceed a certain limit (see Table 3:
Power Supply Voltage).
•
In communication mode, a GSM/GPRS class 2 terminal emits 577μs radio
bursts every 4.615ms (see Figure 2).
Page 20 / 78
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Q52 Omni Product
Technical Specification
VCC 3V6
Uripp
Uripp
t = 577 µs
T = 4,615 ms
Figure 2: Power supply during burst emission
•
In communication mode, a GPRS class 10 terminal emits 1154μs radio
bursts every 4.615ms.
Only the VCC_3V6 (+3.6 VDC) power supply input is necessary during GSM mode
of operation
VCC_3V6:
•
Supplies the GSM RF components. It is essential to keep a minimum voltage
ripple at this connection in order to avoid any phase error.
The RF Power Amplifier current (2.0 A peak in GSM /GPRS mode) flows with a ratio
of:
•
1/8 of the time (around 577μs every 4.615ms for GSM /GPRS cl. 2) and
•
2/8 of the time (around 1154μs every 4.615ms for GSM /GPRS
cl. 10).
The rise time is around 10μs.
•
Supplies the GSM baseband components
Vmin
Vnom
Vmax
Ripple max (Uripp)
VCC_12V
11.0
13.6
16.0
TBD mVpp
VCC_3V61,
3.6
3.8
4.0
200mVrms
Table 3: Power Supply Voltage
(1): This value has to be guarantied during the burst (with 2.0A Peak in GSM or
GPRS mode)
(2): Max operating Voltage Stationary Wave Ratio (VSWR) 2:1
When the Wireless CPU® is in Alarm mode, no voltage must be applied on any pin
of the 40-pin connector except on VRTC (pin 4) for RTC operation or PWR_EN (pin
12) to power ON the dual mode Transceiver.
When supplying the Q52 OMNI with a battery, the total impedance
(battery+protections+PCB) on 3V6 should be <150 mOhms.
Page 21 / 78
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Q52 Omni Product
Technical Specification
3.2.2 Power Consumption
GSM power consumption is dependent on the configuration used. It is for this
reason that the following consumption values are given for each mode, RF band
and type of software used (AT or Open AT™).
All the following information is given assuming a 50 Ω RF output.
The following consumption values were obtained by performing measurements on
Wireless Microprocessor samples at a temperature of 25° C.
Three VCC_3V6 values are used to measure the consumption, VCC_3V6MIN (3.2V),
VCC_3V6MAX (4.8V) and VCC_3V6TYP (3.6V).
The average current is given for the three VBATT values and the peak current given
is the maximum current peak measured with the three VCC_3V6 voltages.
For a more detailed description of the operating modes, see the appendix of the AT
Command Interface Guide for Open AT® Firmware v7.0.
All following consumption measurement values have to be confirmed.
3.2.2.1
Power Consumption without Open AT® Processing
The following measurement results are relevant when:
•
There is no Open AT® application
•
The Open AT® application is disabled
•
No processing is required by the Open AT® application
Page 22 / 78
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Q52 Omni Product
Technical Specification
Operating mode
IMIN
average
VCC_3V6
=4.8V
Parameters
Alarm Mode
Fast Idle Mode
IMAX
average IMAX
unit
VCC_3V6 peak
=3.2V
21
16
15
Paging 9 (Rx burst occurrence ~2s)
15
17
18
160
RX
mA
Paging 2 (Rx burst occurrence ~0,5s)
17
18
19
160
RX
mA
1.5
1.6
1.7
160
RX
mA
160
RX
mA
Paging 9 (Rx burst occurrence ~2s)
Slow Idle Mode
INOM
average
VCC_3V6
=3.6V
Paging 2 (Rx burst occurrence ~0,5s)
(1.5 to 1.75)
(4 to 4.3)
(1.6 to 1.9) (1.7 to 2.05)
4.4
4.6
(4.4 to 4.75) (4.6 to 4.95)
µA
Fast Standby Mode
30
36
39
mA
Slow Standby Mode
1.4
1.4
1.5
mA
210
218
222
81
89
92
270
TX
mA
145
153
157
850
TX
mA
77
85
88
250
TX
mA
201
209
213
78
85
88
270
TX
mA
138
146
149
850
TX
mA
74
81
84
250
TX
mA
364
372
378
112
120
123
270
TX
mA
237
245
248
850
TX
mA
104
111
115
250
TX
mA
850/900 MHz
Connected Mode
1800/1900
MHz
850/900 MHz
Transfer Mode
class 8 (4Rx/1Tx)
1800/1900
MHz
850/900 MHz
Transfer Mode
class 10 (3Rx/2Tx)
1800/1900
MHz
PCL5 (TX power
33dBm)
PCL19 (TX power
6dBm)
PCL0 (TX power
33dBm)
PCL19 (TX power
6dBm)
PCL3 (TX power
33dBm)
PCL17 (TX power
5dBm)
PCL3 (TX power
30dBm)
PCL18 (TX power
0dBm)
PCL3
(TX
33dBm)
power
PCL17
5dBm)
power
(TX
PCL3
(TX
30dBm)
power
PCL18
0dBm)
power
(TX
1450
TX
1450
TX
1450
TX
mA
mA
mA
Table 4: GSM power consumption without Open AT® processing
TX
means that the current peak is the RF transmission burst (Tx burst)
RX
means that the current peak is the RF reception burst (Rx burst)
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Q52 Omni Product
Technical Specification
Slow Idle Mode consumption is depends on the SIM card used. Some SIM cards
respond faster than others, the longer the response time, the higher the
consumption. The measurements were performed with a large number of 3V SIM
cards, the results in brackets are the minimum and maximum currents measured
from among all the SIMs used.
3.2.2.2
Power consumption with Open AT® software
The Open AT™ software used is the Dhrystone application, the following
consumption results are measured during the run of the Dhrystone application.
Operating mode
IMIN
INOM
IMAX
average average average
Parameters
VBATT=4,8 VBATT=3,6 VBATT=3,2
Alarm Mode
IMAX
peak
uni
N/A
N/A
N/A
Paging 9 (Rx burst occurrence ~2s)
31
38
41
160
RX
mA
Paging 2 (Rx burst occurrence ~0,5s)
32
39
42
160
RX
mA
Paging 9 (Rx burst occurrence ~2s)
N/A
N/A
N/A
160
RX
mA
Paging 2 (Rx burst occurrence ~0,5s)
N/A
N/A
N/A
160
RX
mA
Fast Standby Mode
31
38
41
mA
Slow Standby Mode
N/A
N/A
N/A
mA
211
219
223
1450
82
90
93
270
TX
mA
146
154
159
850
TX
mA
78
85
89
250
TX
mA
202
210
214
1450
78
86
89
270
TX
mA
140
148
151
850
TX
mA
75
82
85
250
TX
mA
365
373
379
1450
113
121
125
270
TX
mA
239
247
250
850
TX
mA
105
113
117
250
TX
mA
Fast Idle Mode
Slow Idle Mode
850/900 MHz
Connected Mode
1800/1900
MHz
850/900 MHz
Transfer Mode
class 8 (4Rx/1Tx)
1800/1900
MHz
850/900 MHz
Transfer Mode
class 10 (3Rx/2Tx)
1800/1900
MHz
PCL5
(TX
33dBm)
power
PCL19
6dBm)
power
(TX
PCL0
(TX
33dBm)
power
PCL19
6dBm)
power
(TX
PCL3
(TX
33dBm)
power
PCL17
5dBm)
power
(TX
PCL3
(TX
30dBm)
power
PCL18
0dBm)
power
(TX
PCL3
(TX
33dBm)
power
PCL17
5dBm)
power
(TX
PCL3
(TX
30dBm)
power
PCL18
0dBm)
power
(TX
µA
TX
TX
TX
mA
mA
mA
Table 5: Power consumption with Dhrystone Open AT® application
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Q52 Omni Product
Technical Specification
TX
means that the current peak is the RF transmission burst (Tx burst)
RX
means that the current peak is the RF reception burst (Rx burst)
3.2.2.3
Consumption Waveform Samples
The consumption waveforms are given for EGSM900 network configuration with
AT software running on the internal ARM9 CPU.
The VCC_3V6 voltage is at the typical value of 3.6V.
Four significant operating mode consumption waveforms are described:
•
Connected Mode (PCL5: Tx power 33dBm)
•
Slow Idle mode (Paging 9)
•
Fast idle mode (Paging 9)
•
Transfer mode (GPRS class 10, PCL3: Tx power 33dBm )
The following waveform shows only the form of the current, for correct current
values, see sections 3.2.2.1 and 3.2.2.2.
3.2.2.3.1 Connected Mode Current Waveform
Connected mode 33dBm
Current(A) / Time (s)
1.6
TX PEAK
1.4
1.2
0.8
0.6
0.4
0.2
0.00
0.00
0.00
0.00
0.01
0.01
0.01
Figure 3: Connected Mode Current Waveform
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Q52 Omni Product
Technical Specification
3.2.2.3.2 Slow Idle Mode Current Waveform
Slow Idle mode
Paging ~2s
Current(A) / Time (s)
0.16
RX PEAK
0.14
0.12
0.1
0.08
0.06
0.04
0.02
-0.02
Figure 4: Slow Idle Mode Current Waveform
3.2.2.3.3 Fast Idle Mode Current Waveform
Fast Idle mode Paging ~2s
Current(A) / Time (s)
0.16
RX PEAK
0.14
0.12
0.1
0.08
0.06
0.04
0.02
Figure 5: Fast Idle Mode Current Waveform
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Q52 Omni Product
Technical Specification
3.2.2.3.4 Transfer Mode Class 10 Current Waveform
Transfer mode Class 10 33dBm
Current(A) / Time (s)
1.6
TX PEAK
1.4
1.2
0.8
0.6
0.4
0.2
0.00
0.00
0.00
0.00
0.01
0.01
0.01
Figure 6: Transfer Mode Class 10 Current Waveform
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Q52 Omni Product
Technical Specification
3.2.2.4
Satellite Mode Power Consumption
The satellite portion of Q52Omni draws current from both the VCC_3V6 and
VCC_12V power supply rails. In order to eliminate the GSM/GPRS radio from the
values below it was placed in the Fast Standby Mode.
Operating mode
Satellite TX Mode
Satellite non TX Mode
Power Supply Rail
IMAX
unit
VCC_3V6 (nominal voltage)
250
mA
VCC_12V (nominal voltage)
1500
mA
VCC_12V (nominal voltage)
20
mA
These values in the above table are only applicable to the Satellite in TX Mode
operation. The VCC_3V6 power supply rail is also used by the GSM/GPRS radio
and the GPS, so there power consumption needs must also be taken into account
for the power supply design.
3.2.2.5
Power Supply Pin-Out
Signal
Pin number
VCC_3V6
33,34
VCC_12V
29, 31,32
GND
5,6,8,21,22,
Table 6: Power Supply Pin-out
Page 28 / 78
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Q52 Omni Product
Technical Specification
3.2.3 Recommendations for Less Consumption
For a better consumption, in particular for the quiescent current, it is recommended
to drive the GPIOs like show in the table below.
SW driver
recommended
Muxed
with
I/O
GPIO14*
TXD2
I/O
1V8
0 logic level
GPIO15*
RXD2
I/O
1V8
0 logic level
GPIO16*
CTS2
I/O
1V8
0 logic level
GPIO17*
RTS2
I/O
1V8
0 logic level
GPIO24
HW-SD
I/O
2V8
0 logic level
GPIO26
SCL
I/O
Open drain
0 logic level
GPIO27
SDA
I/O
Open drain
0 logic level
GPIO28
SPI1-CLK
I/O
2V8
0 logic level
GPIO29
SPI1-IO
I/O
2V8
0 logic level
GPIO30
SPI1-I
I/O
2V8
0 logic level
GPIO31
SPI1-CS
I/O
2V8
0 logic level
GPIO46
EXT-INT
I/O
2V8
0 logic level
Signal
I/O type
Reset state
(output state)
* If available
If the FLASH-LED are not necessary it is possible to disable them.
For further details refer to document [3] AT Command Interface Guide for Open
AT® Firmware v7.0).
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Q52 Omni Product
Technical Specification
3.3
Electrical Information for Digital I/O
The CMOS signals of the Q52 OMNI shall only be considered valid when the level
of the VREF_2V8 signal is above 2.4V.
Parameters for CMOS_2V8 Signals
Limits
(Nominal voltage level is 2.8V)
Test
Conditions
Min
High level output voltage (IOH = 4mA)
VOH
2.4
Low level output voltage (IOL = -4mA)
VOL
High level input voltage (IIH = 60 µA)
VIH
Max
Volts
0.4
1.96
Units
3.2
Volts
Volts
Low level input voltage (IIL = 60 µA)
VIL
-0.5*
0.84
Volts
Table 7: CMOS Output / Input Electrical Characteristics for 2.8 volt signals
Parameters for CMOS_1V8 Signals
(Nominal voltage level is 1.8V)
Limits
Test
Conditions
Min
VOH
1.4
Max
Units
High level output voltage
(IOH= 4mA)
Volts
Low level output voltage
0.4
Volts
2.2*
Volts
VOL
(IOL = -4mA)
High level input voltage (IIH = 60 µA)
VIH
1.33
Low level input voltage (IIL = 60 µA)
-0.5*
0.54
Volts
VIL
Table 8: CMOS Output / Input Electrical Characteristics for 1.8 volt signals
Parameters for Open Drain Signals
FLASH-LED
BUZZ_OUT
SDA/GPIO27 and SCL/GPIO26
Parameter
Limits
Min
VOH
0.4V
IOL
8mA
VOL
0.4V
IOL
100mA
VTOLERATED
3.3V
VIH
2.0V
VIL
0.8V
VOL
0.4V
IOL
Table 9: Open Drain Electrical Characteristics
Max
3mA
Absolute Maximum Ratings
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Q52 Omni Product
Technical Specification
3.4
Serial Interface
3.4.1 SPI Bus
The SPI bus interface includes:
•
A Clock signal
•
A SPI Data output or SPI Data Input/Output signal depending on whether 4
or 3 wires SPI interface is selected
•
A SPI Data Input signal for applications using 4 wires interface
•
A SPI Chip Select signal
SPI bus characteristics:
•
Master mode operation
•
SPI speed is from 101.5 Kbit/s to 13 Mbit/s in master mode operation
•
3 or 4-wire interface
•
SPI-mode configuration: 0 to 3
•
1 to 16 bits data length
3.4.1.1
SPI Waveforms
Waveform for SPI transfer with 4-wire configuration in master mode 0 (slave select
signal is not represented).
CLK-cycle
SPI-CLK
Data-OUTdelay
SPI-IO
Data valid
Data-IN-setup
SPI-I
Data-IN-hold
Data valid
Figure 7: SPI Timing diagrams, Mode 0, Master, 4 wires
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Q52 Omni Product
Technical Specification
Signal
Description
Minimum
CLK-cycle
SPI clock frequency
0.1015
Typ
Maximum
Unit
13
MHz
10
ns
Data-OUT delay Data out ready delay time
Data-IN-setup
Data in setup time
ns
Data-OUT-hold
Data out hold time
ns
Table 10: SPI Bus AC characteristics
3.4.1.2
SPI Configuration
For a 4-wire SPI interface; SPI-IO is used as output only of data from the master
and SPI-I is used as input only.
For a three wire SPI interface; SPI-IO is used for both input and output of data
to/from the master.
Operation
Maximum
Speed
SPIMode
Duplex
3-wire type
4-wire type
Master
13 Mb/s
0,1,2,3
Half
SPI-CLK
SPI-CLK
SPI-IO
SPI-I
SPI-CS
SPI-IO
SPI-CS
Table 11: SPI Bus Configuration
3.4.1.3
SPI Bus Pin Description
Signal
Pin
I/O
number
I/O
type
Reset
state
Description
Multiplexed
with
SPI1-CLK
15
2V8
SPI Serial Clock
GPIO28
SPI1-IO
14
I/O
2V8
SPI Serial input/output
GPIO29
SPI1-I
13
2V8
SPI Serial input
GPIO30
SPI1-CS
16
2V8
SPI Slave Enable
GPIO31
Table 12: SPI Bus Pin description
See Chapter 3.2.3, “Electrical information for digital I/O” for Open drain, 2V8 and 1V8 voltage
characteristics and Reset state definitions.
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Q52 Omni Product
Technical Specification
3.4.2 I2C Bus
3.4.2.1
Features
The I2C interface includes a clock signal (SCL) and data signal (SDA) complying
with a 100Kbit/s-standard interface (standard mode: s-mode).
3.4.2.2
Characteristics
The I²C bus is always master.
The maximum speed transfer range is 400Kbit/s (fast mode: f-mode).
For more information on the bus, see the [4]“I²C Bus Specification”, Version 2.0,
Philips Semiconductor 1998
3.4.2.3
I²C Waveforms
I²C bus waveform in master mode configuration:
SCL-freq
T-high
SCL
T-start
T-data-
T-data-
hold
setup
T-stop
T-free
SDA
Data valid
Data valid
Figure 8: I²C Timing diagrams, Master
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Q52 Omni Product
Technical Specification
Signal
Description
Minimum
Typ Maximum
SCL-freq
I²C clock frequency
100
T-start
Hold time START condition
0.6
µs
T-stop
Setup time STOP condition
0.6
µs
T-free
Bus free time, STOP to START
1.3
µs
T-high
High period for clock
0.6
µs
T-data-hold
Data hold time
T-data-setup
Data setup time
100
400
Unit
KHz
0.9
µs
ns
Table 13: I²C Bus AC characteristics
3.4.2.4
I²C Bus Pin-Out
Signal
Pin
number
I/O
I/O type
Reset
state
Description
Multiplexed
with
SCL
36
Open drain
Serial Clock
GPIO26
SDA
35
I/O
Open drain
Serial Data
GPIO27
Table 14: IC Bus Pin Description
See Chapter 3.2.3, “Electrical information for digital I/O” for Open drain, 2V8 and 1V8 voltage
characteristics and Reset state definitions.
3.5
Main Serial Link (UART1)
The UART interface functions as a DCE serial device. A flexible 7-wire serial
interface is available, complying with V24 protocol signaling but not with V28
(electrical interface) due to a 2.8-Volt interface.
The signals are as follows:
3.5.1 Features
The maximum baud rate of the UART1 is 921 Kbit/s.
The signals are the follows:
•
TX data (CT103/TX)
•
RX data (CT104/RX)
•
Request To Send (~CT105/RTS)
•
Clear To Send (~CT106/CTS)
•
Data Terminal Ready (~CT108-2/DTR)
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Q52 Omni Product
Technical Specification
•
Data Carrier Detect (~CT109/DCD)
•
Ring Indicator (~CT125/RI).
3.5.2 Pin Description of UART1 Interface
Signal
Pin
number
I/
I/O
type
Reset
state
CT103/TXD1*
27
2V8
Transmit serial
data
GPIO36
CT104/RXD1*
30
2V8
Receive serial
data
GPIO37
~CT105/RTS1*
28
2V8
Request To Send
GPIO38
~CT106/CTS1*
25
2V8
Clear To Send
GPIO39
~CT108-2/DTR1*
26
2V8
Data Terminal
Ready
GPIO41
~CT109/DCD1*
23
2V8
Undefined
Data Carrier
Detect
GPIO43
~CT125/RI1*
24
2V8
Undefined
Ring Indicator
GPIO42
CT102/GND*
Chassis
GND
GND
Description
Multiplexed
with
Ground
Table 15: UART1 Pin Description
* According to PC view
See Wireless Microprocessor® WMP100 Technical Specification for Open drain, 2V8 and 1V8 voltage
characteristics and for Reset state definition.
The rise and fall time of the reception signals (mainly TXD_UART1) must be less
than 300 ns.
The Q52 Omni is designed to operate using all the serial interface signals. In
particular, it is mandatory to use RTS and CTS for hardware flow control in order to
avoid data corruption during transmission.
For the use case with 5-wire serial interface
•
Signal: CT103/TXD1*, CT104/RXD1*, ~CT105/RTS1*, ~CT106/CTS1*
•
The signal ~CT108-2/DTR1* must be managed following the V24 protocol
signalling if we want to use the slow idle mode
•
The other signals and their multiplexed are not available
•
Please refer to the document [3] AT Command Interface Guide for Open AT®
Firmware v7.0 for more information.
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Q52 Omni Product
Technical Specification
For the use case with 4-wire serial interface
•
CT103/TXD1*, CT104/RXD1*, ~CT105/RTS1*, ~CT106/CTS1*
•
The signal ~CT108-2/DTR1* must be configured at the low level
•
The other signals and their multiplexed are not available
•
Please refer to the document [3] AT Command Interface Guide for Open AT®
Firmware v7.0 for more information.
For the use case with 2-wire serial interface
•
This case is possible for connected external chip but not recommended (and
forbidden for AT command or modem use)
•
The external chip must be a flow control
•
CT103/TXD1*, CT104/RXD1*
•
The signal ~CT108-2/DTR1* must be configured at the low level
•
The signals ~CT105/RTS1*, ~CT106/CTS1* are not used, please configure
the AT command (AT+IFC=0,0 see document [3] AT Command Interface
Guide for Open AT® Firmware v7.0).
•
The signal ~CT105/RTS1* must be configured at the low level
•
The other signals and their multiplexed are not available
•
Please refer to the document [3] AT Command Interface Guide for Open AT®
Firmware v7.0 for more information.
V24/CMOS possible design:
12
Q52 Omni
( DCE )
~PWR_EN
27
CT103-TXD1 / GPIO36
30
CT104-RXD1 / GPIO37
28
~CT105-RTS1 / GPIO38
25
~CT106-CTS1 / GOPI39
Tx
Rx
RTS
Customer
Application
( DTE )
CTS
5, 6, 21, 22
GND
GND
Figure 9: Example of V24/CMOS serial link implementation for UART1
The design shown in the above figure is a basic design.
However, a more flexible design to access this serial link with all modem signals is
shown below
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Q52 Omni Product
Technical Specification
12
PWR_EN
2.8Volt
2x 15K
Q52 Omni
( DCE )
23
24
27
~CT109-DCD1 / GPIO43
~CT125-RI1 / GPIO42
CT103-TXD1 / GPIO36
30
CT104-RXD1 / GPIO37
28
~CT105-RTS1 / GPIO38
25
~CT106-CTS1 / GOPI39
26
GND
~CT108-2-DTR1 / GPIO41
GND
DCD
RI
Tx
Rx
Customer
Application
( DTE )
RTS
CTS
DTR
GND
Figure 10: Example of full modem V24/CMOS serial link implementation for
UART1
It is recommended to add a 15K-ohm pull-up resistor on ~CT125-RI1 and ~CT109DCD1 to set high level during reset state.
The UART1 interface is 2.8 Volt type, but is 3 Volt tolerant.
The Q52 Omni UART1 is designed to operate using all the serial interface signals.
In particular, it is mandatory to use RTS and CTS for hardware flow control in order
to avoid data corruption during transmission.
Warning: If you want to activate Power Down mode (Wavecom 32K mode) in your
Open AT® application, you need to wire the DTR pin to a GPIO. Please refer to the
document [3] AT Command Interface Guide for Open AT® Firmware v7.0 (see the
“Appendixes”) for more information on Wavecom 32K mode activation using the
Open AT® Software Suite.
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Q52 Omni Product
Technical Specification
3.6
Auxiliary Serial Link (UART2)
3.6.1 Features
The maximum baud rate of UART2 is 921 kbit/s.
For peripheral connectivity an auxiliary serial interface (UART2) is available on the
system connector only on series without GPS functionality. On Q52 Omni series
with GPS functionality GPIO16 and GPIO17 are available.
The signals are the follows:
•
TX data (CT103/TX)
•
RX data (CT104/RX)
•
Request To Send (~CT105/RTS)
•
Clear To Send (~CT106/CTS)
The Q52 Omni is designed to operate using all the serial interface signals. In
particular, it is mandatory to use RTS and CTS for hardware flow control in order to
avoid data corruption during transmission.
For the use case with 2-wire serial interface
•
This case is possible for connected external chip but not recommended (and
forbidden for AT command or modem use)
•
The external chip must be a flow control
•
CT103/TXD2*, CT104/RXD2*
•
The signals ~CT105/RTS2*, ~CT106/CTS2* are not used, please configure
the AT command (AT+IFC=0,0. Please refer to the document [3] AT
Command Interface Guide for Open AT® Firmware v7.0.
•
The signal ~CT105/RTS2* must be configured at the low level
•
The other signal and their multiplexed are not available
•
Please refer to the document [3] AT Command Interface Guide for Open AT®
Firmware v7.0 (see the “Appendixes”).
Signal
Pin
I/O
I/O type
Reset
state
Description
Multiplexed
with
TXD2
37
1V8
Transmit serial data
GPIO14
RXD2
39
1V8
Receive serial data
GPIO15
Clear To Send
GPIO16
Request To Send
GPIO17
number
CTS2
38
1V8
RTS2
40
1V8
Table 16: UART2 Pin Description
See Chapter 3.2.3, “Electrical information for digital I/O” for Open drain, 2V8 and 1V8 voltage
characteristics and Reset state definitions.
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Q52 Omni Product
Technical Specification
3.7
General Purpose Input/Output
The Q52 Omni provides up to 18 General Purpose I/Os. These pins are multiplexed
with other IO functions, so the number of pins programmed as GPIOs will depend
on the functionality required for a specific application
Signal
Pin
numb I/O I/O type*
er
Reset state
Multiplexed with
GPIO14/INT6
37
I/O
1V8**
TXD2
GPIO15
39
I/O
1V8**
RXD2
GPIO16
38
I/O
1V8
CTS2
GPIO17/INT17
40
I/O
1V8
RTS2
GPIO3/A26
49
I/O
2V8
INT0
GPIO26
44
I/O
Open drain
SCL
GPIO27
46
I/O
Open drain
SDA
GPIO28
23
I/O
2V8
SPI1-CLK
GPIO29
25
I/O
2V8
SPI1-IO
GPIO30
30
I/O
2V8
SPI1-I
GPIO31
31
I/O
2V8
SPI1-CS
GPIO36
71
I/O
2V8
TXD1
GPIO37
73
I/O
2V8
RXD1
GPIO38
72
I/O
2V8
RTS1
GPIO39
75
I/O
2V8
CTS1
GPIO41
76
I/O
2V8
DTR1
GPIO42
69
I/O
2V8
Undefined
RI1
GPIO43
70
2V8
Undefined
DCD1
Table 17: GPIOs Pin Description
See Chapter 3.2.3, “Electrical information for digital I/O” for Open drain, 2V8 and 1V8 voltage
characteristics and Reset state definitions.
**
If GPS functionality is available on Q52 Omni, these GPIOs are not available.
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Q52 Omni Product
Technical Specification
3.8
Analog to Digital Converters
3.8.1 Features
Two Analog to Digital Converter inputs are provided by the Q52 Omni. The
converters are 10-bit resolution, ranging from 0 to 2V.
Parameter
Min
Resolution
Typ
Max
Unit
10
bits
216
S/s
Integral Accuracy
15
mV
Differential Accuracy
2.5
mV
Sampling rate
Input signal range
Input
impedance
ADC0
1M
Ω
ADC1
1M
Ω
Table 18: ADCs Electrical Characteristics
3.8.2 Pins Description
Signal
Pin number
I/O
I/O type
Description
ADC0
18
Analog
A/D converter
ADC1
19
Analog
A/D converter
Table 19: ADCs Pin Description
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Q52 Omni Product
Technical Specification
3.9
Digital to Analog Converter
One Digital to Analog Converter (DAC) input is provided by the Q52 Omni.
3.9.1 Features
The converter is 8-bit resolution, guaranteed monotonic with a range from 0V to
2.3V.
This output assumes a typical external load of 2kΩ and 50pF in parallel to GND.
Parameter
Min
Typ
Max
Unit
bits
Maximum Output voltage
2.1
2.2
2.3
Minimum Output voltage
40
mV
Output voltage after reset
1.147
Integral Accuracy
-5
+5
LSB
Differential Accuracy
-1
+1
LSB
40
µs
µs
Resolution
Full scale settling time
(load: 50pF // 2kΩ to GND)
One LSB settling time
(load: 50pF // 2kΩ to GND )
Table 20: DAC Electrical Characteristics
3.9.2 Pin Description
Signal
Pin number
I/O
I/O type
Description
AUX-DAC0
11
Analog
D/A converter
Table 21: DAC Pin Description
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Q52 Omni Product
Technical Specification
3.10 Analog Audio Interface
The Q52 OMNI provides a single ended microphone input and single ended
speaker output for GSM audio I/O. An echo cancellation feature allows hands free
functionality in GSM voice mode.
3.10.1 Microphone Input
3.10.1.1 Features
The MIC input includes the biasing for an electret microphone, thus allowing easy
connection. The gain of the MIC input is internally adjusted and may be tuned
using an AT command. AC coupling is already embedded in the Q52 Omni.
When you design the audio analog interface be sure to have a very good ground
plane, a very good filtering as well as shielding in order to avoid any disturbance on
the audio path.
Signal
Pin
number
I/O
I/O type
Description
MIC2
10
Analog
Microphone input
Table 22: MIC2 Pin Description
3.10.1.2 Electrical Characteristics
Parameter
Min.
Typ
Max.
Unit
2.1
2.2
Output Current
0.5
1.5
mA
Impedance
single-ended
Internal AC coupling
100
Input
voltage*
Positive*
Internal
Biasing
Voltage
MIC to AGND
Negative
0.9
1.1
-0.9
nF
1.4
kΩ
7.35
Table 23: MIC2 Electrical Characteristics
•
•
**
The input voltage depends on the input microphone gain set by AT command.
Because MIC2 is internally biased, a coupling capacitor must be used to connect an
audio signal provided by an active generator. Only a passive microphone may be directly
connected to the MIC2 input.
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Q52 Omni Product
Technical Specification
3.10.1.3 Application Example
Figure 11: Example of MIC input connection with LC filter
*:Z2 is from 200Hz to 4kHz. For more characteristics refer to the chapter 3.14.1.1.2.
Internal input impedance value becomes 1100 ohms.
It is recommended to add L1 and C2 footprint to add a LC filter to try to eliminate
the TDMA noise.
When not used, the filter can be removed by replacing L1 by a 0 Ohm resistor and
by disconnecting C2, as the following schematic.
Figure 12: Example of MIC input connection without LC filter
*:Z2 is from 200Hz to 4kHz. For more characteristics refer to the chapter 3.14.1.1.2.
The capacitor C1 is highly recommended to eliminate the TDMA noise. C1 must be
close to the microphone.
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Q52 Omni Product
Technical Specification
Recommended components:
C1: 12pF to 33pF (depending of the design ,needs to be tuned )
C2: Must be tuned depending of the design.
L1: Must be tuned depending of the design.
3.10.2 Speaker Output Characteristics
3.10.2.1 Features
The connection is single-ended on SPK. Be sure to have a good ground plane, good
filtering and adequate shielding in order to avoid any disturbance on the audio
path.
Signal
Pin
number
I/O
I/O type
Description
SPK2
Analog
Speaker Output
Table 24: SPK Pin Description
3.10.2.2 Electrical Characteristics
Parameters
Min
Typ
Max
1.30
Unit
Biasing
voltage
SPK2
Output
swing
voltage
RL=8Ω: AT+VGR=6*
Vpp
RL=32Ω: AT+VGR=6*
2.5
Vpp
RL
Load resistance
Ω
IOUT
Output current; peak value; RL=8Ω
90
mA
POUT
RL=8Ω; AT+VGR=6*;
125
mW
RPD
Output pull-down resistance at power- 28
down
40
52
KΩ
VPD
Output DC voltage at power-down
100
mV
Table 25: SPK Electrical Characteristics
*The output voltage depends of the output speaker gain set by AT command. Please refer to the
document [3] AT Command Interface Guide for Open AT® Firmware v7.0.
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Q52 Omni Product
Technical Specification
3.10.2.3 Application Example
Figure 13: Example of Speaker connection
4.7 μF < C1 < 47 μF (depending on speaker characteristics and output power).
The connection between the Q52 Omni pin and the speaker must be designed to
keep the serial impedance lower than 1.5 Ω in single ended mode.
3.10.3 Design Recommendation
3.10.3.1
General
When speakers and microphones are exposed to the external environment, it is
recommended to add ESD protection as closed as possible to the speaker or
microphone, connected between the audio lines and a good ground.
You ensure to have a good ground plane, a good filtering as well as shielding, in
order to avoid any disturbance on the audio path.
It is important to select an appropriate microphone, speaker and filtering
components to avoid TDMA noise
3.10.3.2
Recommended Microphone Characteristics
•
The impedance of the microphone has to be around 2 kΩ.
•
Sensitivity from -40dB to –50 dB.
•
SNR > 50 dB.
•
Frequency response compatible with the GSM specifications.
To suppress TDMA noise, it is highly recommended to use microphones with two
internal decoupling capacitors:
-CM1=56pF (0402 package) for the TDMA noise coming from the demodulation of
the GSM 850 and GSM900 frequency signal.
-CM2=15pF (0402 package) for the TDMA noise coming from the demodulation of
the DCS/PCS frequency signal.
The capacitors have to be soldered in parallel of the microphone
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Q52 Omni Product
Technical Specification
CM
Figure 14: Capacitor near Microphone
3.10.3.3
Recommended Speaker Characteristics
•
Type of speakers: Electro-magnetic /10mW
•
Impedance: 8Ω for hands-free (SPK2)
•
Sensitivity: 110dB SPL min
•
Receiver frequency response compatible with the GSM specifications.
3.10.3.4
Recommended Filtering Components
When designing a GSM application, it is important to select the right audio filtering
components.
The strongest noise, called TDMA, is mainly due to the demodulation of the
GSM850/GSM900/DCS1800 and PCS1900 signal: A burst being produced every
4.615ms; the frequency of the TDMA signal is equal to 216.7Hz plus harmonics.
The TDMA noise can be suppress by filtering the RF signal using the right
decoupling components.
The types of filtering components are:
-RF decoupling inductors
-RF decoupling capacitors
A good “Chip S-Parameter” simulator is proposed by Murata, the following link
help to find it:
http://www.murata.com/designlib/mcsil.html
Using different Murata components, we could see that the value, the package and
the current rating can have different decoupling effects.
The table below shows some examples with different Murata components:
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Q52 Omni Product
Technical Specification
Package
0402
Filtered band
GSM900
GSM 850/900
DCS/PCS
Value
100nH
56pF
15pF
Types
Inductor
Capacitor
Capacitor
Position
Serial
Shunt
Shunt
Manufacturer
Murata
Murata
Murata
Rated
150mA
50V
50V
Reference
LQG15HSR10J02
or
LQG15HNR10J02
GRM1555C1H560JZ01
GRM1555C1H150JZ01
or
GRM1555C1H150JB01
Package
0603
Filtered band
GSM900
GSM 850/900
DCS/PCS
Value
100nH
47pF
10pF
Types
Inductor
Capacitor
Capacitor
Position
Serial
Shunt
Shunt
Manufacturer
Murata
Murata
Murata
Rated
300mA
50V
50V
Reference
LQG18HNR10J00
GRM1885C1H470JA01
or
GRM1885C1H470JB01
GRM1885C1H150JA01
or
GQM1885C1H150JB01
Table 26: Audio filtering Examples with Murata Components
3.10.3.5
Audio Track and PCB Layout Recommendation
To avoid TDMA noise, it is recommended to surround the audio tracks by ground:
Q52
Omni
Audio line
Ground
Plane
Connector Application
board
Figure 15: Audio track design
Note: Avoid digital tracks crossing under and over the audio tracks.
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Q52 Omni Product
Technical Specification
3.10.4 Buzzer Output
3.10.4.1 Features
This output is controlled by a PWM controller and can be used as buzzer or as
PWM.
BUZZ-OUT is an open drain output. A buzzer can be directly connected between
this output and VCC_MAIN. The maximum current is 100 mA (PEAK).
Parameter
Condition
VOL on
IPEAK
Minimum
Maximum
Unit
Iol = 100mA
0.4
VCC_MAIN (max)
100
mA
Hz
Frequency
TBD
TBD
Duty Cycle
TBD
TBD
Table 27: PWM/Buzzer Output Electrical Characteristics
3.10.4.2 Pinout
Signal
Pin
number
I/O
I/O type
Reset state
Description
BUZZ-OUT
Open drain
PWM/Buzzer output
Table 28: PWM/Buzzer Output Pin Description
See Chapter 3.2.3, “Electrical information for digital I/O” for Open drain, 2V8 and 1V8 voltage
characteristics and Reset state definitions.
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Q52 Omni Product
Technical Specification
3.10.4.3 Application Example
The maximum peak current is 100 mA and the maximum average current is 40
mA. A diode against transient peak voltage must be added as described below.
VBATT
R1
D1
Q52 Omni
C1
BUZZ-OUT
Figure 16: Example of buzzer implementation
Where:
•
R1 must be chosen in order to limit the current at IPEAK max
•
C1 = 0 to 100 nF (depending on the buzzer type)
•
D1 = BAS16 (for example)
Recommended characteristics for the buzzer:
•
electro-magnetic type
•
Impedance: 7 to 30 Ω
•
Sensitivity: 90 dB SPL min @ 10 cm
•
Current: 60 to 90 mA
The BUZZ-OUT output can also be used to drive a LED as shown in the Figure
below:
« BUZZER »
BUZZ-OUT
R1
470 Ω
VBATT
D1
Figure 17: Example of LED driven by the BUZZ-OUT output
R1 value can be accorded depending of the LED (D1) characteristics.
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Q52 Omni Product
Technical Specification
3.11 ~ON / OFF Signal
This input is used to switch ON or OFF the Wireless Microprocessor.
A low level signal has to be provided on the pin ON/~OFF to switch ON the
Wireless Microprocessor.. The voltage of this signal has to be maintained at 0.2 x
VBATT during a minimum of 1500ms. This signal can be left at low level until
switch off.
To switch OFF the Q52 OMNI the pin ~ON/OFF has to be released. The Wireless
Microprocessor can be switched off through the Operating System.
) Warning:
All external signals must be inactive when the Wireless Microprocessor is
OFF to avoid any damage when starting and allow Wireless Microprocessor
to start and stop correctly.
3.11.1 Features
Electrical Characteristics of the signal
Parameter
I/O type
VIL
CMOS
VIH
CMOS
Minimum
VBATT x 0.8
Maximum
Unit
VBATT x 0.2
VBATT
3.11.2 Pin Description
Signal
Pin number
I/O
I/O type
Description
~ON/OFF
U5
CMOS
Q52 Omni Power ON
3.11.3 Application
Figure 18 : Example of ON/~OFF pin connection
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Q52 Omni Product
Technical Specification
3.11.3.1
Power ON
Once Q52 Omni/Open AT® Software Suite v2.0 is powered, the application must
set the ON/OFF signal to low to start the Q52 Omni/Open AT® Software Suite v2.0
power ON sequence. The ~ON/OFF signal must be held low during a minimum
delay of Ton/off-hold (Minimum hold delay on the ~ON/OFF signal) to power-ON. After
this delay, an internal mechanism maintains the Q52 OMNI /Open AT® Software
Suite v2.0 in power ON condition.
During the power ON sequence, an internal reset is automatically performed by the
Q52 OMNI /Open AT® Software Suite v2.0 for 40ms (typically). During this phase,
any external reset should be avoided during this phase.
POWER SUPPLY
ON/OFF
Ton/off- hold
(2000ms min)
INTERNAL RST
Trst
(40ms typ)
AT answers «OK »
STATE OF THE MODULE
Module OFF
I BB+RF < 22µA
RESET mode
I BB+RF =20 to 40mA
Module ON
I BB+RF <120mA
(no loc. update)
Module READY
T initialization
(2000ms min)
SIM and Network dependent
Figure 19 : Power-ON sequence (no PIN code activated)
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Q52 Omni Product
Technical Specification
The duration of the firmware power-up sequence depends on:
•
The need to perform a recovery sequence if the power has been lost during a
flash memory modification.
Other factors have a minor influence
•
the number of parameters stored in EEPROM by the AT commands received
so far
•
the ageing of the hardware components, especially the flash memory
•
the temperature conditions
The recommended way to de-assert the ~ON/OFF signal is to use either an AT
command or WIND indicators: the application has to detect the end of the powerup initialization and de-assert ~ON/OFF afterwards.
•
Send an “AT” command and wait for the “OK” answer: once the initialization is
complete the AT interface answers « OK » to “AT” message * .
•
Wait for the “+WIND: 3” message: after initialization, the Q52 OMNI /Open AT®
Software Suite v2.0, if configured to do so, will return an unsolicited “+WIND:
3” message. The generation of this message is enabled or disabled via an AT
command.
Note:
• Please refer to the document [3] AT Command Interface Guide for Open AT®
Firmware v7.00 for more information on these commands.
Proceeding thus – by software detection - will always prevent the application from
de-asserting the ~ON/OFF signal too early.
If WIND indicators are disabled or AT commands unavailable or not used, it is still
possible to de-assert ~ON/OFF after a delay long enough (Ton/off-hold) to ensure that
the firmware has already completed its power-up initialization.
The table below gives the minimum values of Ton/off-hold:
Tinitialization minimum values
Open AT® Firmware
6.65 & above
Tinitialization
Safe evaluations of the firmware
power-up time
8s
The above figure take the worst cases into account: power-loss recovery
operations, slow flash memory operations in high temperature conditions, and so
on. But they are safe because they are large enough to ensure that ~ON/OFF is not
de-asserted too early.
Additional notes:
If the application manages hardware flow control, the AT command can be sent during the
initialisation phase.
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Q52 Omni Product
Technical Specification
1.
Typical power-up initialization time figures for best cases conditions (no
power-loss recovery, fast and new flash memory…) approximate 3.5
seconds in every firmware version. But releasing ~ON/OFF after this delay
does not guarantee that the application will actually start-up if for example
the power plug has been pulled off during a flash memory operation, like a
phone book entry update or an AT&W command…
2.
The ~ON/OFF signal can be left at a low level until switch OFF. But this is
not recommended as it will prevent the AT+CPOF command from
performing a clean power-off. (See also the note in the Power OFF chapter
for an alternate usage.)
3.
When using a battery as power source, it is not recommended to let this
signal high:
If the battery voltage is too low and the ~ON/OFF signal at high level, an
internal mechanism switches OFF the Q52 OMNI /Open AT® Software
Suite v1.0. This automatic process prevents the battery to be over
discharged and optimize its life span.
4.
During the power-ON sequence, an internal reset is automatically
performed by the Q52 OMNI /Open AT® Software Suite v2.0 for 40 ms
(typically). Any external reset should be avoided during this phase.
5.
After a reset (hardware or software), if the ~ON/OFF signal is OFF (High
level) the Q52 OMNI switches OFF.
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Q52 Omni Product
Technical Specification
3.11.3.2
Power OFF
To properly power OFF the Q52 OMNI/Open AT® Software Suite v2.0 the
application must set the ~ON/OFF signal and then send the AT+CPOF command to
deregister from the network and switch off the Q52 OMNI /Open AT® Software
Suite v2.0.
Once the « OK » response is issued by the Q52 OMNI /Open AT® Software Suite
v2.0, the power supply can be switched off.
POWER SUPPLY
ON/OFF
AT+CPOF
AT COMMAND
OK response
Network dependent
STATE OF T HE MODULE
Module
READY
Module OFF
IBB+RF<22µA
IBB+RF = overall current consumption (Base Band + RF pa rt)
Figure 20 : Power-OFF sequence
Note:
•
If the ~ON/OFF pin is maintained to ON (Low Level) then the module can’t be
switched OFF.
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Q52 Omni Product
Technical Specification
3.12 External Interrupt
The Q52 OMNI provides one external interrupt input. The interrupt input can be
activated on:
•
High to low edge
•
Low to high edge
•
Low to high and high to low edge
•
Low level
•
High level
When used, the interrupt input must not be left open.
If not used, it must be configured as a GPIO.
Signal
Pin
number
INT1
17
I/O I/O type
2V8
Reset
state
Description
Multiplexed
with
External Interrupt
GPIO3
Table 29: External Interrupt Pin description
See Chapter 3.2.3, “Electrical information for digital I/O” for Open drain, 2V8 and 1V8 voltage
characteristics and Reset state definitions.
Parameter
INT1
Minimum
VIL
VIH
Maximum
Unit
0.84
1.96
Table 30: External Interrupt Electrical Characteristics
3.13 BOOT Signal
A specific control signal BOOT is available to download the Q52 Omni only if the
standard XMODEM download, controlled with AT command, is not possible.
Specific PC software, provided by WAVECOM, is needed to perform this download,
specifically for the first download of the Flash memory.
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Q52 Omni Product
Technical Specification
3.13.1 Features
The BOOT signal is muxed with DCD1 pin.
The BOOT signal must be connected to the VCC_1V8 for this specific download.
BOOT
Operating mode
Leave open
Normal use
Comment
No download
DCD function
Leave open
Download XMODEM
DCD function
Download specific
AT command for Download
AT+WDWL
Need WAVECOM PC software
Table 31: Boot Signal Mode
For more information, see chapter 3.8.3.
This BOOT signal must be left open for normal use or XMODEM download.
3.13.2 Pin Description
Signal
Pin number
I/O
I/O type
Description
BOOT
(DCD pin)
23
1V8
Download mode selection
Table 32: Boot Pin description
3.13.3 Application
Figure 21: Boot Selection Application Example
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Q52 Omni Product
Technical Specification
3.14 VREF_2V8 Output
This output can only be used to connect pull-up resistor. VCC_2V8 must be used
as a reference supply. The voltage supply is available when the Q52 OMNI is on.
Signal
Pin number
I/O
I/O type
Description
VREF_2V8
Supply
Digital supply
Table 33: VREF_2V8 Pin Description
Parameter
VCC_2V8
Minimum
Typ
Maximum
Unit
2.74
2.8
2.86
15
mA
Output voltage
Output Current
Table 34: VREF_2V8 Electrical Characteristics
3.15 BAT-RTC (Backup Battery)
The Q52 Omni provides an input/output to connect a Real Time Clock power
supply.
3.15.1 Interface Description
This pin is used as a back-up power supply for the internal Real Time Clock. The
RTC is supported by the Q52 Omni when VCC_3V6 is available, but a back-up
power supply is needed to save date and time when the VCC_3V6 is switched off
(VCC_3V6 = 0V).
Q52 Omni
from VCC_3V6
to RTC
2.5V regulator
BATT-RTC (pin 4)
1.8V regulator
Figure 22: Real Time Clock power supply
If the RTC is not used, this pin can be left open.
If VCC_MAIN is available, the back-up battery can be charged by the internal 2.5V
power supply regulator.
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Q52 Omni Product
Technical Specification
Signal
Pin number
I/O
I/O type
Description
BATT-RTC
I/O
Supply
RTC Back-up supply
Table 35: Bat-RTC Pin Description
Parameter
Minimum
Input voltage
1.85
Typ
Maximum
Unit
2.5
Input current
consumption*
3.3
µA
Output voltage
2.45
Output current
mA
Table 36: Bat-RTC Electrical Characteristics
*Provided by an RTC back-up battery when Q52 OMNI VCC_MAIN power supply is off (VCC_MAIN =
0V).
3.16 FLASH-LED Signal
FLASH LED is an open drain output. A LED and a resistor can be directly connected
between this output and VCC_MAIN.
When the Q52 Omni CPU is ON, this output is used to indicate network status.
GSM
status
VCC_3V6 status
FLASH-LED status
Permanent
Q52 Omni switched ON, not
registered on the network
Slow flash
Q52 Omni switched ON,
registered on the network
LED ON for 200 ms, OFF
for 2 s
ON
Q52 OMNI GSM status
VCC_3V6 = 3.6V Quick flash
LED ON for 200 ms, OFF
for 600 ms
Very quick flash
LED ON for 100ms, OFF
for 200ms
Q52 Omni switched ON,
registered on the network,
communication in progress
Q52 Omni switched on,
software downloaded is either
corrupted or non-compatible
("BAD SOFTWARE")
Table 37: Flash-LED Status
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Q52 Omni Product
Technical Specification
Signal
Pin
number
I/O
I/O type
Reset state
Description
FLASHLED
Open Drain
Output
1 and
Undefined
LED driving
Table 38: Flash-LED Pin Description
See Chapter 3.2.3, “Electrical information for digital I/O” for Open drain, 2V8 and 1V8 voltage
characteristics and Reset state definitions.
FLASH-LED state is undefined during the software initialization time. During
software initialization time, for 2 seconds max after POWER_EN is pulled active
low, the FLASH-LED signal is toggling and does not provide Q52 Omni GSM
status. After the 2s period, the FLASH-LED provides the true status of the Q52
Omni GSM connection.
Parameter
Condition
Minimum
Typ
Maximum
Unit
VOL
0.4
IOUT
mA
Table 39: Flash-LED Electrical Characteristics
3.17 GPS Functionality
The Q52 Omni provides in option GPS functionality. The GPS is assumed by e-Ride
solution based on Opus III ® Chipsets. This part is controlled by a Q52 Omni’s
CPU.
For list of command available refer to AT command list…
3.17.1 Features (eRide Documentation Extract: For Information Only)
•
Supports GPS L-band C/A code channels and 2 additional dedicated WAAS
channels for enhanced accuracy
•
High indoor sensitivity of -161dBm achieved utilizing 44,000 effective
correlators (both in acquisition & tracking mode)
•
Fast TTFF of typically < 1s when in hot and 34s in cold start conditions
•
Accuracy of 2.5m outdoors (CEP 50%) and 10m indoors
•
User interface via a serial port, 1Hz update rate
3.17.2 Performances (eRide Documentation Extract: For Information Only)
Parameter
Conditions
Hot Start @-135 dBm
Hot Start @-155 dBm
All SV’s same level
Min
Typ
Max
Unit
13
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Q52 Omni Product
Technical Specification
Parameter
Conditions
Min
Typ
Max
Unit
33
67
34
83
Acquisition sensitivity,
hot start
-161
dBm
Acquisition sensitivity,
warm start
-146.5
dBm
-161
dBm
2.5
10
Warm Start @-135
dBm
All SV’s same level
Warm Start @-145
dBm
Cold Start @-135 dBm
Cold Start @-145 dBm
All SV’s same level
Tracking sensitivity
Position accuracy,
outdoors
Open sky, CEP 50%
Position accuracy,
indoors
CEP 50%
Table 40: GPS Functionality Performances
3.17.2.1 Time-to-First-Fix Charts
Figure 23: GPS TTFF, Hot Start Configuration
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Q52 Omni Product
Technical Specification
Figure 24: GPS TTFF, Warm Start Configuration
Figure 25: GPS TTFF, Simulator Cold Start Configuration
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Q52 Omni Product
Technical Specification
3.17.2.2 First Position Fix Accuracy Charts
Figure 26: First Position Fix Accuracy Chart 01
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Technical Specification
Figure 27: First Position Fix Accuracy Chart 02
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Technical Specification
Figure 28: First Position Fix Accuracy Chart 03
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Q52 Omni Product
Technical Specification
3.18 RF Interface
The RF impedance GSM, Orbcomm and GPS* antenna outputs is 50 Ohms
nominal and the DC impedance is 0 Ohm.
The GPS* antenna provides 3V biasing for active antenna.
3.18.1 RF Connections
The Q52 OMNI RF connections are assumed by FAKRA Type connectors:
•
RF Type
Fakra Type
Color
GSM/GPRS
Type D
Bordeaux Violet
Satellite
Type K
Curry Yellow
GPS*
Type C
Blue
*if available
•
•
•
3.18.2 RF Performance
GSM mode RF
recommendation.
performance
is
compliant
with
the
ETSI
GSM
05.05
The GSM Receiver parameters are:
•
GSM850 Reference Sensitivity = -108 dBm Static & TUHigh
•
E-GSM900 Reference Sensitivity = -108 dBm Static & TUHigh
•
DCS1800 Reference Sensitivity = -107 dBm Static & TUHigh
•
PCS1900 Reference Sensitivity = -107 dBm Static & TUHigh
•
Selectivity @ 200 kHz: > +9 dBc
•
Selectivity @ 400 kHz: > +41 dBc
•
Linear dynamic range: 63 dB
•
Co-channel rejection: >= 9 dBc
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Q52 Omni Product
Technical Specification
3.18.3 Transmitter Parameters
•
Maximum output power (EGSM & GSM850): 33 dBm +/- 2 dB at ambient
temperature
•
Maximum output power (GSM1800 & PCS1900): 30 dBm +/- 2 dB at bient
temperature
•
Minimum output power (EGSM & GSM850): 5 dBm +/- 5 dB at ambient
temperature
•
Minimum output power (GSM1800 & PCS1900): 0 dBm +/- 5 dB at ambient
temperature
3.18.4 Antenna Specifications
The antenna must meet the following requirements:
•
The optimum operating frequency depends on the application. A dual band
or quad band antenna shall operate in these frequency bands and have the
following characteristics:
Characteristic
Q52 Omni GSM Mode of Operation
E-GSM 900
DCS 1800
GSM 850
PCS 1900
TX Frequency
880 to
915 MHz
1710 to 1785
MHz
824 to
849 MHz
1850 to
1910 MHz
RX Frequency
925 to
960 MHz
1805
to 1880 MHz
869 to
894 MHz
1930 to
1990 MHz
Impedance
VSWR
50 Ohms
Rx max
1.5:1
Tx max
1.5:1
Typical
radiated gain
0dBi in one direction at least
Table 41: GSM Antenna Specifications
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Q52 Omni Product
Technical Specification
4 Technical Specifications
4.1
Environmental Specifications
Wavecom specifies the following temperature range for the Q52 OMNI dual mode
product.
The dual mode transceiver is compliant with the following operating class.
Conditions
Operating / Class A
Operating / Storage / Class B
Temperature range
-20 °C to +55°C
-40 °C to +85°C
Function Status Classification:
Class A:
The Wireless CPU® remains fully functional, meeting GSM performance criteria in
accordance with ETSI requirements, across the specified temperature range.
Class B:
The Wireless CPU® remains fully functional, across the specified temperature range.
Some GSM parameters may occasionally deviate from the ETSI specified
requirements and this deviation does not affect the ability of the Wireless CPU® to
connect to the cellular network and function fully.
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Q52 Omni Product
Technical Specification
Q52 Omni Transceiver
ENVIRONNEMENTAL CLASSES
TYPE OF TEST
STANDARDS
STORAGE
Class 1.2
TRANSPORTATION
Class 2.3
Cold
IEC 68-2.1
Ab test
-25° C
72 h
-40° C
72 h
-20° C (GSM900)
-10° C (GSM1800/1900)
16 h
16h
Dry heat
IEC 68-2.2
Bb test
+70° C
72 h
+70° C
72 h
+55° C
16 h
Change of temperature
IEC 68-2.14
Na/Nb test
Damp heat
cyclic
IEC 68-2.30
Db test
+30° C
2 cycles
90% - 100% RH
variant 1
Damp heat
IEC 68-2.56
Cb test
+30° C
Sinusoidal vibration
IEC 68-2.6
Fc test
Random vibration
wide band
IEC 68-3.36
Fdb test
-40° / +30° C
4 days
5 cycles
t1 = 3 h
+40° C
2 cycles
90% - 100% RH
variant 1
+40° C
4 days
OPERATING (PORT USE)
Class 7.3
-20° / +30° C (GSM900) 3 cycles
-10° / +30° C (GSM1800/1900):
3 cycles
t1 = 3 h
+40° C
2 cycles
90% - 100% RH
variant 1
+40° C
4 days
5 - 62 Hz
5 mm / s
62 - 200Hz :
2 m / s2
3 x 5 sweep cycles
5 - 20 Hz :
0.96 m2 / s3
20 - 500Hz :
- 3 dB / oct
3 x 10 min
10 -12 Hz
0.96 m2 / s3
12 - 150Hz :
- 3 dB / oct
3 x 30 min
Figure 29: Environmental classes
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Q52 Omni Product
Technical Specification
4.2
Mechanical Specifications
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Q52 Omni Product
Technical Specification
4.3
Antenna Cable
TBD
4.4
GSM Antenna
GSM antennas and support for antenna adaptation can be obtained from
manufacturers such as:
•
ALLGON (http://www.allgon.com )
•
IRSCHMANN (http://www.hirschmann.com/ )
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Q52 Omni Product
Technical Specification
5 Appendix
5.1
Standards and Recommendations
GSM ETSI, 3GPP, GCF and NAPRD03 recommendations for Phase II & FCC.
Specification Reference
Title
3GPP TS 45.005 v5.5.0
(2002-08) Release 5
Technical Specification Group GSM/EDGE. Radio
Access Network; Radio transmission and reception
GSM 02.07 V8.0.0
(1999-07)
Digital cellular telecommunications system (Phase 2+);
GSM 02.60 V8.1.0
(1999-07)
Digital cellular telecommunications system (Phase 2+);
GSM 03.60 V7.9.0
(2002-09)
Technical Specification Group Services and System
Aspects;
Mobile Stations (MS) features (GSM 02.07
version 8.0.0 Release 1999)
General Packet Radio Service (GPRS);
Service description, Stage 1 (GSM 02.60 version 8.1.0
Release 1999)
Digital cellular telecommunications system (Phase 2+);
General Packet Radio Service (GPRS);
Service description; Stage 2 (Release 1998)
3GPP TS 43.064 V5.0.0
(2002-04)
Technical Specification Group GERAN; Digital cellular
telecommunications system (Phase 2+); General Packet
Radio Service (GPRS); Overall description of the GPRS
radio interface; Stage 2 (Release 5)
3GPP TS 03.22 V8.7.0
(2002-08)
Technical Specification Group GSM/EDGE. Radio
Access Network; Functions related to Mobile Station
(MS) in idle mode and group receive mode; (Release
1999)
3GPP TS 03.40 V7.5.0
(2001-12)
Technical Specification Group Terminals;
Technical realization of the Short Message Service
(SMS)
(Release 1998)
3GPP TS 03.41 V7.4.0
(2000-09)
Technical Specification Group Terminals; Technical
realization of Cell Broadcast Service (CBS)
(Release 1998)
ETSI EN 300 903 V8.1.1
(2000-11)
Digital cellular telecommunications system (Phase 2+);
Transmission planning aspects of the speech service in
the GSM
Public Land Mobile Network (PLMN) system
(GSM 03.50 version 8.1.1 Release 1999)
Page 71 / 78
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Q52 Omni Product
Technical Specification
Specification Reference
Title
3GPP TS 04.06 V8.2.1
(2002-05)
Technical Specification Group GSM/EDGE Radio Access
Network; Mobile Station - Base Station System
(MS - BSS) interface; Data Link (DL) layer specification
(Release 1999)
3GPP TS 04.08 V7.18.0
(2002-09)
Technical Specification Group Core Network;
Digital cellular telecommunications system (Phase 2+);
Mobile radio interface layer 3 specification (Release
1998)
3GPP TS 04.10 V7.1.0
(2001-12)
Technical Specification Group Core Networks;
3GPP TS 04.11 V7.1.0
(2000-09)
Technical Specification Group Core Network; Digital
cellular telecommunications system (Phase 2+);
Point-to-Point (PP) Short Message Service (SMS)
support on mobile radio interface
Mobile radio interface layer 3 Supplementary services
specification; General aspects (Release 1998)
(Release 1998)
3GPP TS 45.005 v5.5.0
(2002-08)
Technical Specification Group GSM/EDGE. Radio
Access Network; Radio transmission and reception
(Release 5)
3GPP TS 45.008 V5.8.0
(2002-08)
Technical Specification Group GSM/EDGE
3GPP TS 45.010 V5.1.0
(2002-08)
Technical Specification Group GSM/EDGE
3GPP TS 46.010 V5.0.0
(2002-06)
Technical Specification Group Services and System
Aspects;
Radio Access Network; Radio subsystem link control
(Release 5)
Radio Access Network; Radio subsystem
synchronization (Release 5)
Full rate speech; Transcoding (Release 5)
3GPP TS 46.011 V5.0.0
(2002-06)
Technical Specification Group Services and System
Aspects;
Full rate speech; Substitution and muting of lost
frames for
full rate speech channels (Release 5)
3GPP TS 46.012 V5.0.0
(2002-06)
Technical Specification Group Services and System
Aspects;
Full rate speech; Comfort noise aspect for full rate
speech traffic channels (Release 5)
Page 72 / 78
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Q52 Omni Product
Technical Specification
Specification Reference
Title
3GPP TS 46.031 V5.0.0
(2002-06)
Technical Specification Group Services and System
Aspects;
Full rate speech; Discontinuous Transmission (DTX) for
full rate speech traffic channels (Release 5)
3GPP TS 46.032 V5.0.0
(2002-06)
Technical Specification Group Services and System
Aspects;
Full rate speech; Voice Activity Detector (VAD) for full
rate speech traffic channels (Release 5)
TS 100 913V8.0.0
(1999-08)
Digital cellular telecommunications system (Phase 2+);
GSM 09.07 V8.0.0
(1999-08)
Digital cellular telecommunications system (Phase 2+);
3GPP TS 51.010-1 v5.0.0
(2002-09)
Technical Specification Group GSM/EDGE ; Radio
Access Network ;Digital cellular telecommunications
system (Phase 2+);Mobile Station (MS) conformance
specification; Part 1: Conformance specification
(Release 5)
3GPP TS 51.011 V5.0.0
(2001-12)
Technical Specification Group Terminals; Specification
of the Subscriber Identity Module - Mobile Equipment
(SIM - ME) interface (Release 5)
ETS 300 641 (1998-03)
Digital cellular telecommunications system (Phase 2);
General on Terminal Adaptation Functions (TAF) for
Mobile Stations (MS) (GSM 07.01 version 8.0.0
Release 1999)
General requirements on interworking between the
Public Land Mobile Network (PLMN) and the Integrated
Services Digital Network (ISDN) or Public Switched
Telephone Network (PSTN) (GSM 09.07 version 8.0.0
Release 1999)
Specification of the 3 Volt Subscriber Identity Module Mobile Equipment (SIM-ME) interface (GSM 11.12
version 4.3.1)
GCF-CC V3.7.1 (2002-08)
Global Certification Forum – Certification criteria
NAPRD03 V2.6.0 (2002-06) North America Permanent Reference Document for
PTCRB tests
The Q52 Omni connected on a development kit board application is certified to be
in accordance with the following Rules and Regulations of the Federal
Communications Commission (FCC).
Power listed on the Gant is conducted for Part 22 and conducted for Part 24
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Q52 Omni Product
Technical Specification
This device contains GSM, GPRS Class 10 functions in the 900 and 1800MHz
Band which are not operational in U.S. Territories.
This device is to be used only for mobile and fixed applications. The antenna(s)
used for this transmitter must be installed to provide a separation distance of at
least 20cm from all persons and must not be co-located or operating in conjunction
with any other antenna or transmitter.
Users and installers must be provided with antenna installation instructions and
transmitter operating conditions for satisfying RF exposure compliance.
Antennas used for this OEM module must not exceed 3.1dBi gain for PCS 1900
MHz and 0.9dBi for GSM 850 MHz for mobile and fixed operating configurations.
This device is approved as a module to be installed in other devices.
Installed in other portable devices, the exposure conditions require a separate
equipment authorization.
The license module had a FCC ID label on the module itself. The FCC ID label must
be visible through a window or it must be visible when an access panel, door or
cover is easily removed.
If not, a second label must be placed on the outside of the device that contains the
following text:
Contains FCC ID: O9EQ52OMNI
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions:
(1) this device may not cause harmful interference,
(2) this device must accept any interference received, including
interference that may cause undesired operation.
IIMPORTANT: Manufacturers of mobile or fixed devices incorporating the Q52
Omni device are advised to:
• clarify any regulatory questions,
• have their completed product tested,
• have product approved for FCC compliance, and
• include instructions according to above mentioned RF exposure statements in
end product user manual.
Please note that changes or modifications not expressly approved by the party
responsible for compliance could void the user’s authority to operate the
equipment.
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Q52 Omni Product
Technical Specification
5.2
Declaration of Conformity
To Whom it May Concern:
We,
Wavecom
430 Davis Drive Suite 300
PO Box 13920
Research Triangle Park
NC 27709 USA
declare under our sole responsibility that the Product
Q52 OMNI
to which this declaration relates is in conformity with the
following standards or other normative documents
EN 301 721
EN 301-489-20
as they apply to the above referenced Product.
Research Triangle Park
Peter Cotterill
November 12, 2008
Certification Manager
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Q52 Omni Product
Technical Specification
5.3
Safety Recommendations (for Information Only)
IMPORTANT
FOR THE EFFICIENT AND SAFE OPERATION OF YOUR GSM APPLICATION
PLEASE READ THIS INFORMATION CAREFULLY
5.3.1
5.3.1.1
RF Safety
General
Your GSM terminal * is based on the GSM standard for cellular technology. The
GSM standard is spread all over the world. It covers Europe, Asia and some parts
of America and Africa. This is the most used telecommunication standard.
Your GSM terminal is actually a low power radio transmitter and receiver. It sends
out and receives radio frequency energy. When you use your GSM application, the
cellular system which handles your calls controls both the radio frequency and the
power level of your cellular modem.
5.3.1.2
Exposure to RF Energy
There has been some public concern about possible health effects of using GSM
terminals. Although research on health effects from RF energy has focused on the
current RF technology for many years, scientists have begun research regarding
newer radio technologies, such as GSM. After existing research had been
reviewed, and after compliance to all applicable safety standards had been tested,
it has been concluded that the product was fitted for use.
If you are concerned about exposure to RF energy there are things you can do to
minimize exposure. Obviously, limiting the duration of your calls will reduce your
exposure to RF energy. In addition, you can reduce RF exposure by operating your
cellular terminal efficiently by following the guidelines below.
5.3.1.3
Efficient Terminal Operation
For your GSM terminal to operate at the lowest power level, consistent with
satisfactory call quality:
If your terminal has an extendable antenna, extend it fully. Some models allow you
to place a call with the antenna retracted. However your GSM terminal operates
more efficiently with the antenna fully extended.
Do not hold the antenna when the terminal is "IN USE". Holding the antenna affects
call quality and may cause the modem to operate at a higher power level than
needed.
based on WISMO2D
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Q52 Omni Product
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5.3.1.4
Antenna Care and Replacement
Do not use the GSM terminal with a damaged antenna. If a damaged antenna
comes into contact with the skin, a minor burn may result. Replace a damaged
antenna immediately. Consult your manual to see if you may change the antenna
yourself. If so, use only a manufacturer-approved antenna. Otherwise, have your
antenna repaired by a qualified technician.
Use only the supplied or approved antenna. Unauthorized antennas, modifications
or attachments could damage the terminal and may contravene local RF emission
regulations or invalidate type approval.
5.3.2
General Safety
5.3.2.1
Driving
Check the laws and the regulations regarding the use of cellular devices in the area
where you have to drive as you always have to comply with them. When using
your GSM terminal while driving, please:
•
give full attention to driving,
•
pull off the road and park before making or answering a call if driving
conditions so require.
5.3.2.2
Electronic Devices
Most electronic equipment, for example in hospitals and motor vehicles is shielded
from RF energy. However RF energy may affect some improperly shielded
electronic equipment.
5.3.2.3
Vehicle Electronic Equipment
Check your vehicle manufacturer representative to determine if any on-board
electronic equipment is adequately shielded from RF energy.
5.3.2.4
Medical Electronic Equipment
Consult the manufacturer of any personal medical devices (such as pacemakers,
hearing aids, etc...) to determine if they are adequately shielded from external RF
energy.
Turn your terminal OFF in health care facilities when any regulations posted in the
area instruct you to do so. Hospitals or health care facilities may be using RF
monitoring equipment.
5.3.2.5
Aircraft
Turn your terminal OFF before boarding any aircraft.
•
Use it on the ground only with crew permission.
•
Do not use it in the air.
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To prevent possible interference with aircraft systems, Federal Aviation
Administration (FAA) regulations require you to have permission from a crew
member to use your terminal while the aircraft is on the ground. To prevent
interference with cellular systems, local RF regulations prohibit using your modem
while airborne.
5.3.2.6
Children
Do not allow children to play with your GSM terminal. It is not a toy. Children could
hurt themselves or others (by poking themselves or others in the eye with the
antenna, for example). Children could damage the modem, or make calls that
increase your modem bills.
5.3.2.7
Blasting Areas
To avoid interfering with blasting operations, turn your unit OFF when in a
"blasting area" or in areas posted: "turn off two-way radio". Construction crew often
uses remote control RF devices to set off explosives.
5.3.2.8
Potentially Explosive Atmospheres
Turn your terminal OFF when in any area with a potentially explosive atmosphere.
It is rare, but your modem or its accessories could generate sparks. Sparks in such
areas could cause an explosion or fire resulting in bodily injuries or even death.
Areas with a potentially explosive atmosphere are often, but not always, clearly
marked. They include fueling areas such as petrol stations; below decks on boats;
fuel or chemical transfer or storage facilities; and areas where the air contains
chemicals or particles, such as grain, dust, or metal powders.
Do not transport or store flammable gas, liquid, or explosives, in the compartment
of your vehicle which contains your terminal or accessories.
Before using your terminal in a vehicle powered by liquefied petroleum gas (such
as propane or butane) ensure that the vehicle complies with the relevant fire and
safety regulations of the country in which the vehicle is to be used.
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Source Exif Data:
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