Silicon Laboratories Finland EM35X2 ETRX35x-LR Series Zigbee Modules User Manual TG ETRX35x LR PM 011 102

Telegesis (UK) Ltd ETRX35x-LR Series Zigbee Modules TG ETRX35x LR PM 011 102

manual

Telegesis TG-ETRX35X-LR-PM-011-101 ETRX351-LR AND ETRX357-LR Preliminary Product Manual ©2010 Telegesis (UK) Ltd ETRX35x-LR Preliminary Product Manual ETRX35x-LR ZIGBEE® MODULES PRODUCT MANUAL
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 2 - ETRX35x-LR Preliminary Product Manual Table of Contents 1 INTRODUCTION................................................................................................................... 5 1.1 Hardware Description ........................................................................................................ 5 2 PRODUCT APPROVALS..................................................................................................... 6 2.1 FCC Approvals...................................................................................................................6 2.1.1 FCC Labelling Requirements............................................................................................. 6 2.2 European Certification ....................................................... Error! Bookmark not defined. 2.3 Declarations of Conformity................................................. Error! Bookmark not defined. 2.4 IEEE 802.15.4.................................................................................................................... 6 2.5 The ZigBee® Protocol ....................................................................................................... 6 3 MODULE PINOUT................................................................................................................ 8 4 HARDWARE DESCRIPTION ............................................................................................. 10 4.1 Hardware Interface .......................................................................................................... 10 5 FIRMWARE DESCRIPTION............................................................................................... 11 5.1 Custom Firmware............................................................................................................. 11 5.2 Software Interface............................................................................................................ 12 6 ABSOLUTE MAXIMUM RATINGS..................................................................................... 13 7 RECOMMENDED OPERATING CONDITIONS ................................................................. 13 8 DC ELECTRICAL CHARACTERISTICS............................................................................ 14 9 DIGITAL I/O SPECIFICATIONS......................................................................................... 15 10 A/D CONVERTER CHARACTERISTICS ........................................................................... 16 11 AC ELECTRICAL CHARACTERISTICS............................................................................ 16 11.1 TX Power Characteristics ................................................................................................ 18 12 PHYSICAL DIMENSIONS .................................................................................................. 19 13 SOLDERING TEMPERATURE TIME PROFILE (FOR REFLOW SOLDERING) .............. 20 13.1 For Leaded Solder ........................................................................................................... 20 13.2 For Lead-free Solder........................................................................................................ 20 14 PRODUCT LABEL DRAWING........................................................................................... 21 15 RECOMMENDED FOOTPRINT ......................................................................................... 22 15.1 Example carrier board...................................................................................................... 23 16 RELIABILITY TESTS ......................................................................................................... 24 17 APPLICATION NOTES ...................................................................................................... 24 17.1 Safety Precautions........................................................................................................... 24 17.2 Design Engineering Notes ............................................................................................... 24 17.3 Storage Conditions .......................................................................................................... 25
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 3 - ETRX35x-LR Preliminary Product Manual 18 PACKAGING ...................................................................................................................... 25 18.1 Embossed Tape............................................................................................................... 25 18.2 Component Orientation.................................................................................................... 26 18.3 Reel Dimensions.............................................................................................................. 26 18.4 Packaging ........................................................................................................................ 26 19 ORDERING INFORMATION .............................................................................................. 27 20 TRADEMARKS................................................................................................................... 28 21 DISCLAIMER......................................................................................................................28 22 ROHS DECLARATION....................................................................................................... 28 23 DATA SHEET STATUS...................................................................................................... 28 24 LIFE SUPPORT POLICY.................................................................................................... 28 25 RELATED DOCUMENTS................................................................................................... 29 26 CONTACT INFORMATION ................................................................................................ 29
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 4 - ETRX35x-LR Preliminary Product Manual The Telegesis ETRX351-LR and ETRX357-LR modules are low power 2.4GHz ZigBee modules with an added PA and LNA for highest possible link budget. Based on the latest Ember EM351 and EM357 single chip ZigBeeTM solution the new long range modules are footprint compatible with the ETRX351 and ETRX357, thus representing a drop-in replacement for all applications where a high link budget is required. The module’s unique AT-style command line interface allows designers to quickly integrate ZigBee technology without complex software engineering. For custom application development the ETRX35x series integrates with ease into Ember’s InSight development environment.Image not shown actual size; enlarged to show detail. Module Features • Small form factor, SMT module 25mm x 19mm • Side Castellations for easy soldering and inspection • 2 antenna options: Integrated chip antenna or U.FL coaxial connector • Industry’s first ARM® Cortex-M3 based family of ZigBee modules • Industry standard JTAG Programming and real time network level debugging via the Ember InSight Port • 192kB (ETRX357) and 128kB (ETRX351) flash and 12kbytes of RAM • Lowest Deep Sleep Current of sub 1µA and multiple sleep modes • Wide supply voltage range (2.1 to 3.5V) • 32.768kHz watch crystal can be added externally • Module ships with standard Telegesis AT-style command interface based on the ZigBee PRO feature set • Can act as an End Device, Router or Coordinator • 24 general-purpose I/O lines including analogue inputs (all GPIOs of the EM35x are accessible) • Firmware upgrades via serial port or over the air (password protected) • Hardware supported encryption (AES-128) • CE and FCC compliance, FCC modular approval pending • Operating temperature range: -40°C to +85°C • Standard version without LNA and PA available in the same form factor Radio Features • Based on the Ember EM351 and EM357 single chip ZigBeeTM / IEEE802.15.4 solutions • 2.4GHz ISM Band • 250kbit/s over the air data rate • 16 channels (IEEE802.15.4 Channel 11 to 26) • +18dBm output power (adjustable down to -21dBm) • High sensitivity of -105dBm typ. @ 1% packet error rate • RX Current: 28mA, TX Current: approx 100mA at 18dBm • Robust Wi-Fi and Bluetooth coexistence Suggested Applications • AMR – ZigBee Smart Energy applications • Wireless Alarms and Security • Home/Building Automation • Wireless Sensor Networks • M2M Industrial Controls • Lighting and ventilation control • Remote monitoring • Environmental monitoring and control Development Kit • New Development kit containing everything required to set up a mesh network quickly and evaluate range and performance of the ETRX35x and its long range version. • AT-style software interface command dictionary can be modified for high volume customers. • Custom software development available upon request. Example AT-Style Commands AT+BCAST Send a Broadcast AT+UCAST:<address> Send a Unicast AT+EN Establish PAN network AT+JN Join PAN At power-up the last configuration is loaded from non- volatile S-Registers, which can eliminate the need for an additional host controller.
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 5 - ETRX35x-LR Preliminary Product Manual 1 Introduction This document describes the Telegesis ETRX351-LR and ETRX357-LR ZigBee® long range modules which have been designed to be easily integrated into another device and to provide a fast, simple and low cost wireless mesh networking interface. The Telegesis ETRX3 series modules are based on the Ember ZigBee® platform consisting of the single chip EM351 or EM357 combined with the ZigBee PRO compliant EmberZNet meshing stack. Integration into a wide range of applications is made easy using a simple AT style command interface and advanced hardware design. The configurable functionality of the Telegesis AT Commandset often allows the ETRX3 series ZigBee modules to be used without an additional host microcontroller saving even more integration time and costs. In addition to the Telegesis AT Commandset, the ETRX351-LR and ETRX357-LR modules can be used with custom-built firmware and they represent an ideal platform for custom firmware development in conjunction with the Ember development kits. The ETRX3 series shares the same R3xx Telegesis firmware as the ETRX2 and the two devices can be used in the same network. No RF experience or expertise is required to add this powerful wireless networking capability to your products. The ETRX351-LR and ETRX357-LR offer fast integration opportunities and the shortest possible time to market for your product. 1.1 Hardware Description The main building blocks of the ETRX351-LR and ETRX357-LR are the single chip EM351 and EM357 from Ember, a Power Amplifier as well as a Low Noise Amplifier, a 24MHz reference crystal and RF front-end circuitry optimized for best RF performance. The modules are available with on-board antenna or alternatively a U.FL connector for attaching external antennae. Modules with the U.FL connector are identified by the “HR” suffix. The LNA and RF power amplifier of the LR devices improve the output power by 10dB and the sensitivity by 5dB which will increase the range by approximately 600% relative to the standard devices (where local regulations permit the use of the maximum output power). The integrated antenna is an Antenova Rufa, and details of the radiation pattern etc are available from the Antenova website [5]. Module Chip Flash RAM ETRX351-LR EM351 128kB 12kB ETRX351HR-LR EM351 128kB 12kB ETRX357-LR EM357 192kB 12kB ETRX357HR-LR EM357 192kB 12kB Table 1: Memories The ETRX351-LR and ETRX357-LR are used for ZigBee® (www.zigbee.org) applications. If you wish to create your own custom firmware, and not use the pre-loaded Telegesis AT-Command interface, you will need the InSight toolchain, consisting of InSight Desktop™ together with a comprehensive integrated development environment (IDE) and C-language compiler toolchain from Ember. The Ember development environment is not suitable for an 802.15.4-only application that does not use the ZigBee layer.
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 6 - ETRX35x-LR Preliminary Product Manual 2 Product Approvals The ETRX351-LR and ETRX357-LR have been designed to meet all national regulations for world-wide use. In particular the following certifications have been obtained: 2.1 FCC Approvals The Telegesis ETRX351-LR and ETRX357-LR with integrated Antenna has been tested to comply with FCC CFR Part 15 (USA). The devices meet the requirements for modular transmitter approval as detailed in the FCC public notice DA00.1407.transmitter. This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. While the applicant for a device into which the ETRX351-LR or ETRX357-LR or ETRX351HR-LR is installed is not required to obtain a new authorization for the module, this does not preclude the possibility that some other form of authorization or testing may be required for the end product. The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the equipment. 2.2 FCC Labelling Requirements When integrating the ETRX351-LR or ETRX357-LR into a product if must be ensured that the FCC labelling requirements are met. This includes a clearly visible label on the outside of the finished product specifying the Telegesis FCC identifier (FCC ID: S4GEM35X2) as well as the notice above. This exterior label can use wording such as “Contains Transmitter Module FCC ID: S4GEM35X2” or “Contains FCC ID: S4GEM35X2” although any similar wording that expresses the same meaning may be used. 2.3 IEEE 802.15.4 IEEE 802.15.4 is a standard for low data rate, wireless networks (raw bit-rate within a radio packet of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life applications as well as mains-powered applications. It is the basis for the open ZigBee® Protocol. 2.4 The ZigBee® Protocol The ZigBee® Protocol is a set of standards for wireless connectivity for use between any devices over short to medium distances. The specification was originally ratified in December 2004, paving the way for companies to start making low-power networks a reality. ZigBee® uses an IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three additional layers for networking, security and applications. What makes the specification unique is its use of a mesh network architecture which, in bucket chain style, passes data from one node to the next until it lands at its destination. The network is self-healing and adapts its routing as link quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not act as routers, but can therefore be put into a low-power sleep state. FCC ID: S4GEM35X2
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 7 - ETRX35x-LR Preliminary Product Manual The enhanced version of the ZigBee® standard (or ZigBee® 2006) was released in December 2006, adding new features and improvements to the only global wireless communication standard enabling the development of easily deployable low-cost, low-power, monitoring and control products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee Alliance introduced the PRO featureset which offers advantages over earlier versions, including • Truly self healing mesh networking • Messages can now travel up to 30 hops • Source-Routing for improved point to multipoint message transmission • Improved security including Trust-Centre link keys • New message types and options The Telegesis AT Commandset, which by default ships on all ETRX3 series products is based on the ZigBee PRO featureset. For more information on the Telegesis AT Commandset please refer to the separate documentation at www.telegesis.com.
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 8 - ETRX35x-LR Preliminary Product Manual 3 Module Pinout Figure 1: ETRX3 series Module Pinout (top view) The table below gives details about the pin assignment for direct SMD soldering of the ETRX3 series modules to the application board. For more information on the alternate functions please refer to [2]. Also refer to the Telegesis AT Commandset documentation to understand how the pre-programmed firmware makes use of the individual I/Os. All GND pads are connected within the module, but for best RF performance all of them should be grounded externally. ETRX35x pad Designation Normal function Alternate function EM35x pin Ember designation 1 GND GND GND 2 PC5 {1} I/O 11 TX_ACTIVE 3 PC6 I/O 13 OSC32B, nTX_ACTIVE 4 PC7 I/O 14 OSC32A, OSC32_EXT 5 PA7 {4} I/O 18 TIM1C4 6 PB3 {2} I/O CTS 19 SC1nCTS, SC1SCLK, TIM2C3 7 nReset nReset 12 8 PB4 {2} I/O RTS 20 TIM2C4, SC1nRTS, SC1nSSEL 9 PA0 I/O 21 TIM2C1, SC2MOSI 10 PA1 I/O 22 TIM2C3, SC2SDA, SC2MISO 11 PA2 I/O 24 TIM2C4, SC2SCL, SC2SCLK 12 PA3 I/O 25 SC2nSSEL, TRACECLK, TIM2C2 13 GND GND GND 14 PA4 I/O 26 ADC4, PTI_EN, TRACEDATA 15 PA5 {3} I/O 27 ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3 16 PA6 {4} I/O 29 TIM1C3 17 PB1 TXD 30 SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1 18 PB2 RXD 31 SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2 19 GND GND GND 20 GND GND GND 21 JTCK JTCK 32 SWCLK
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 9 - ETRX35x-LR Preliminary Product Manual ETRX35x pad Designation Normal function Alternate function EM35x pin Ember designation 22 PC2 I/O 33 JTDO, SWO 23 PC3 I/O 34 JTDI 24 PC4 I/O 35 JTMS, SWDIO 25 PB0 I/O 36 VREF, IRQA, TRACECLK, TIM1CLK, TIM2MSK 26 PC1 I/O ADC3 38 ADC3, SWO, TRACEDATA0 27 PC0 {4} I/O 40 JRST, IRQD, TRACEDATA1 28 PB7 {4} I/O ADC2 41 ADC2, IRQC, TIM1C2 29 PB6 {4} I/O ADC1 42 ADC1, IRQB, TIM1C1 30 PB5 I/O ADC0 43 ADC0, TIM2CLK, TIM1MSK 31 GND GND GND 32 Vcc Vcc Vcc 33 GND GND GND Table 2. Pin Information Alternate functions depend on the firmware, but the R3xx functions are indicated here for convenience. Notes: {1} PC5 is not usable on these long range versions of the ETRX35x as this GPIO is used as TX_ACTIVE to control the external RF frontend. {2} When using the Telegesis AT Commandset, RTS/CTS handshaking is selectable in firmware. See the AT Command Manual. {3} If PA5 is driven low at power-up or reset the module will boot up in the bootloader {4} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 9)
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 10 - ETRX35x-LR Preliminary Product Manual 4 Hardware Description 24MHzEM35x I/O UART I / Oprogramming5JTAG VccVreg RESET RESETBalun integrated antenna U.FL socket rf terminal selection, filtering and matching circuitry LDO 1V8 1,8VdcA/D LDO 1V25 Balun PA LNA Switch Figure 2: Hardware Diagram The ETRX351-LR and ETRX357-LR are based on the Ember EM351 and EM357 respectively in addition to a discrete PA, LNA and RF switch added to the RF-Frontend. The EM351 and EM357 are fully integrated 2.4GHz ZigBee transceivers with a 32-bit ARM® Cortex M3TM microprocessor, flash and RAM memory, and peripherals. The industry standard serial wire and JTAG programming and debugging interfaces together with the standard ARM system debug components help to streamline any custom software development. In addition to this a number of MAC functions are also implemented in hardware to help maintain the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards. The new advanced power management features allow faster wakeup from sleep and new power down modes allow this 3rd generation module to offer a longer battery life than any 2nd generation modules on the market. The EM35x has fully integrated voltage regulators for both required 1.8V and 1.25V supply voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset circuit eliminates the need for any external monitoring circuitry. A 32.768kHz watch crystal can be connected externally to pads 3 and 4 in case more accurate timing is required. 4.1 Hardware Interface All GPIO pins of the EM351 or EM357 are accessible on the module’s pads. Whether signals are used as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware. When using the Telegesis AT Commandset please refer to the AT Commandset manual for this information and when developing custom firmware please refer to the EM35x datasheet.
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 11 - ETRX35x-LR Preliminary Product Manual 5 Firmware Description The modules will be pre-loaded with a standalone bootloader which supports over-the-air bootloading as well as serial bootloading of new firmware. In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and power-cycle or reset the module. To avoid entering the standalone bootloader unintentionally make sure not to pull this pin down during boot-up unless the resistance to ground is >10k. (A pull-up is not required). In addition to the standalone bootloader the modules also contain the current release of the Telegesis AT-style command interface as described in the Telegesis AT command dictionary and the Telegesis user guide. Check www.telegesis.com for updates. Each module comes with a unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. The commands and responses pass through the serial port of the ETRX35x-LR as ASCII text, so a simple terminal application will usually suffice. We provide Telegesis Terminal but it is not an essential feature. The pre-loaded AT-style command interface firmware is based on the latest EmberZNet meshing stack which implements routers/coordinators as well as (sleepy) end devices. [End devices have no routing responsibility and therefore are allowed to go to sleep, whilst still being able to send and receive messages via a parent router. In addition to a classical (sleepy) end device the module firmware also supports mobile (sleepy) end devices capable of changing their parent quickly whenever they change their position within the network.] A router is typically a mains powered device whilst a sleepy end device (SED) can be battery powered. The module is also able to act as a PAN coordinator and Trust Centre through external host control. The AT style command line supplies all the tools required to set up and manage a ZigBee network by allowing easy access to the low-level functionality of the stack. The Telegesis firmware uses the meshing and self healing EmberZNet PRO stack to overcome many of the limitations of the tree network topology of the ZigBee® 2006 stack by using the ZigBee PRO featureset. The Telegesis firmware also allows low-level access to physical parameters such as channel and power level. Parameters that define the functionality of the ETRX35x module and also allow standalone functionality are saved in non-volatile memory organised in so-called S-Registers. The SPI and I2C buses are not supported by the current firmware release, but can be used with custom firmware. 5.1 Custom Firmware For high volume customers the firmware can be customised on request. Customers can use the ETRX35x module as hardware only and develop their own firmware based on the EmberZNet stack. In order to develop custom firmware the Ember Insight toolchain is required.
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 12 - ETRX35x-LR Preliminary Product Manual 5.2 Software Interface Using the default firmware the ETRX35x-LR is controlled using a simple AT-style command interface and (mostly) non-volatile S-Registers. In order to get a full listing of all the available AT-Commands, please refer to the AT command dictionary document which corresponds to the firmware revision you intend to use. In addition to the command dictionary there are user guides explaining the features of the firmware in more detail. If you need to find out which firmware resides on your module simply type “ATI” followed by a carriage return and you will be prompted with the module’s manufacturing information. The Development Kit manual describes how to upgrade the firmware either via a serial link or over the air.
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 13 - ETRX35x-LR Preliminary Product Manual 6 Absolute Maximum Ratings Supply: 3.5V Inputs: -0.3V to Vcc + 0.3V Operating temperature: -40 to 85°C No. Item Symbol Absolute Maximum Ratings Unit 1 Supply voltage VCC -0.3 to +3.5 Vdc 2 Voltage on any I/O[11:0] , SIF_CLK, SIF_MISO, SIF_MOSI, SIF_LOADB, RESET Vin -0.3 to VCC +0.3 Vdc 3 Storage temperature range Tstg -40 to +105 °C 4 Operating temperature range Top -40 to +85 °C 5 Input RF level Pmax 15 dBm 6 ESD on any pin {1} according to Human Body Model (HBM) circuit description VTHHBM ±2 kV 7 Reflow temperature TDeath Please refer to chapter 13 °C Table 3. Absolute Maximum Ratings Note: {1} Input must be current limited to the value specified. The absolute maximum ratings given above should under no circumstances be violated. Exceeding one or more of the limiting values may cause permanent damage to the device. Caution! ESD sensitive device. Precautions should be used when handling the device in order to prevent permanent damage. 7 Recommended Operating Conditions No. Item Condition / Remark Symbol Value Unit Min Typ Max 1 Supply voltage VCC 2.1 3.5 Vdc 2 RF Input Frequency fC 2405 2480 MHz 3 RF Input Power pIN 0 dBm 4 Operating temperature range Top -40 +85 °C Table 4. Recommended Operating Conditions
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 14 - ETRX35x-LR Preliminary Product Manual 8 DC Electrical Characteristics VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated No. Item Condition / Remark Symbol Value Unit Min Typ Max 1 Module supply voltage VCC 2.1 3.5 Vdc 2 Quiescent current, internal RC oscillator disabled ISLEEP 2.4 µA 3 Quiescent current, internal RC oscillator enabled ISLEEP 2.8 µA 4 Quiescent current, including 32.768kHz oscillator ISLEEP 3.3 µA 5 Transmit current consumption at +18dBm module output power ITXVCC 90 mA 6 Transmit Current consumption BOOST MODE at +18dBm module output power ITXVCC 100 mA 7 Transmit current consumption at min. module output power ITXVCC tbd mA 8 Receive current consumption Total, 12MHz clock speed IRX 30 mA 9 Receive current consumption Total, 24MHz clock speed IRX 31 mA 10 Receive current consumption BOOST MODE Total, 12MHz clock speed IRX 31 mA 11 Receive current consumption BOOST MODE Total, 24MHz clock speed IRX 32 mA 12 MCU, RAM and flash, radio off 12MHz clock speed IMCU 7 mA 13 MCU, RAM and flash, radio off 24MHz clock speed IMCU 8 mA 14 Serial Controller Max data rate ISC 0.2 mA 15 Timer Max clock rate ITMR 0.25 mA 16 ADC Max sample rate IADC 1.1 mA 17 Wake time from deep sleep From wakeup event to 1st instruction 100 µs 18 Shutdown time From last instruction into deep sleep 5 µs Table 5. DC Electrical Characteristics Please Note: The average current consumption during operation is dependent on the firmware and the network load, therefore these figures are given in the command dictionary of the respective firmware.
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 15 - ETRX35x-LR Preliminary Product Manual 9 Digital I/O Specifications The digital I/Os of the ETRX35x module have the ratings shown below. VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated No. Item Condition / Remark Symbol Value Unit Min Typ Max 1 Low Schmitt switching threshold Schmitt input threshold going from high to low VSWIL 0.42 x VCC 0.5 x VCC Vdc 2 High Schmitt switching threshold Schmitt input threshold going from low to high VSWIH 0.62 x VCC 0.8 x VCC MHz 3 Input current for logic 0 IIL -0.5 µA 4 Input current for logic 1 IIH 0.5 µA 5 Input Pull-up resistor value RIPU 24 29 34 k 6 Input Pull-down resistor value RIPD 24 29 34 k 7 Output voltage for logic 0 IOL = 4mA (8mA) for standard (high current) pads VOL 0 0.18 x VCC V 8 Output voltage for logic 1 IOH = 4mA (8mA)for standard (high current) pads VOH 0.82 x VCC VCC V 9 Output Source Current Standard current pad IOHS 4 mA 10 Output Sink current Standard current pad IOLS 4 mA 11 Output Source Current High current pad IOHH 8 mA 12 Output Sink current High current pad IOLH 8 mA 13 Total output current IOH + IOL 40 mA Table 6. Recommended Operating Conditions
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 16 - ETRX35x-LR Preliminary Product Manual 10 A/D Converter Characteristics The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer to section 10 of the EM35x datasheet. No. Item 1 A/D resolution Up to 12 bits 2 A/D sample time for 5-bit conversion 5.33µs 3 A/D sample time for 12-bit conversion 682µs 4 Reference Voltage 1.25V or Vcc Table 7. A/D Converter Characteristics 11 AC Electrical Characteristics VCC = 3.0V, TAMB = 25°C, NORMAL MODE measured at 50Ω terminal load connected to the U.FL socket No. Receiver Value Unit Min Typ Max 1 Frequency range 2400 2500 MHz 2 Sensitivity for 1% Packet Error Rate (PER) -106 -105 -99 dBm 3 Sensitivity for 1% Packet Error Rate (PER) BOOST MODE -106 -105 -100 dBm 4 Saturation (maximum input level for correct operation) 0 dBm 5 High-Side Adjacent Channel Rejection (1% PER and desired signal –82dBm acc. to [1]) 35 dB 6 Low-Side Adjacent Channel Rejection (1% PER and desired signal –82dBm acc. to [1]) 35 dB 7 2nd High-Side Adjacent Channel Rejection (1% PER and desired signal –82dBm acc. to [1]) 43 8 2nd Low-Side Adjacent Channel Rejection (1% PER and desired signal –82dBm acc. to [1]) 43 9 Channel Rejection for all other channels (1% PER and desired signal –82dBm acc. to [1]) 40 dB 10 802.11g rejection centred at +12MHz or –13MHz (1% PER and desired signal –82dBm acc. to [1]) 35 dB 11 Co-channel rejection (1% PER and desired signal –82dBm acc. to [1]) -6 dBc 12 Relative frequency error (2x40ppm required by [1]) -120 120 ppm 13 Relative timing error (2x40ppm required by [1]) -120 120 ppm 14 Linear RSSI range 35 dB 15 Output power at highest power setting NORMAL MODE BOOST MODE 16 17 18 18 19 19 dBm 16 Output power at lowest power setting tbd dBm 17 Error vector magnitude as per IEEE802.15.4 7 15 % 18 Carrier frequency error -40 40 ppm 19 PSD mask relative 3.5MHz distance from carrier -20 dB 20 PSD mask absolute 3.5MHz distance from carrier -30 dBm Table 8. AC Electrical Characteristics
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 17 - ETRX35x-LR Preliminary Product Manual Please Note: For the relationship between EM35x power settings and module output power please relate to chapter 11.1 of this document. When developing custom firmware the output power settings described in this document relate directly to the EM35x power settings accessible via the Ember stack API. No. Synthesiser Characteristics Limit Unit Min Typ Max 22 Frequency range 2400 2500 MHz 23 Frequency resolution 11.7 kHz 24 Lock time from off state, with correct VCO DAC settings 100 µs 25 Relock time, channel change or Rx/Tx turnaround 100 µs 26 Phase noise at 100kHz offset -71dBc/Hz 27 Phase noise at 1MHz offset -91dBc/Hz 28 Phase noise at 4MHz offset -103dBc/Hz 29 Phase noise at 10MHz offset -111dBc/Hz Table 9. Synthesiser Characteristics No. Power On Reset (POR) Specifications Limit Unit Min Typ Max 30 VCC POR release 0.62 0.95 1.2 Vdc 31 VCC POR assert 0.45 0.65 0.85 Vdc Table 10. Power On Reset Specifications No. nRESET Specifications Limit Unit Min Typ Max 32 Reset Filter Time constant 2.1 12 16 µs 33 Reset Pulse width to guarantee a reset 26 µs 34 Reset Pulse width guaranteed not to cause reset 0 1 µs Table 11. nReset Specifications
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 18 - ETRX35x-LR Preliminary Product Manual 11.1 TX Power Characteristics Important Note: For Band edge compliance it is required to limit the output power out of the EM357 on channel 26 to a setting of -22dBm. Because of this it is recommended to not use channel 26 on the ETRX35x-LR modules as the range will be significantly reduced on this channel. The diagrams below show the typical output power and module current in dependency on module supply voltage and EM35x power setting in NORMAL MODE and BOOST MODE. Figure 3. Output Power vs. Power Setting Figure 4. Output Power vs. Power Setting Figure 5. Module Current vs. Power Setting Figure 6. Output Power vs. Power Setting (BOOST MODE) Figure 7. Module Current vs. Power Setting (BOOST MODE) t.b.dt.b.dt.b.dt.b.dt.b.d
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 19 - ETRX35x-LR Preliminary Product Manual 12 Physical Dimensions Figure 8. ETRX3 Physical Dimensions Symbol Explanation Distance L Length of the module 25.0mm W Width of the module 19.0mm H Height of the module 3.0mm A1 Distance centre of pad PCB edge 0.9mm A2 Pitch 1.27mm R1 Keep-out Zone from corner of PCB 17.5mm R2 Keep-out Zone from corner of PCB 4.1mm X1 Distance centre of Antenna connector PCB edge 3.8mm X2 Distance centre of Antenna connector PCB edge 2.8mm Table 12. ETRX3 Physical Dimensions For ideal RF performance when using the on-board antenna, the antenna should be located at the corner of the carrier PCB. There should be no components, tracks or copper planes in the “keep-out” area which should be as large as possible. When using the U.FL RF connector the “keep-out” area doesn’t have to be kept. NB: The module transmit/receive range will depend on the antenna used and also the housing of the finished product.
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 20 - ETRX35x-LR Preliminary Product Manual 13 Soldering Temperature Time Profile (for reflow soldering) 13.1 For Leaded Solder Recommended temp. profile for reflow soldering Temp.[°C] Time [s] 235°C max. 220 ±5°C 200°C150 ±10°C 90 ±30s 10 ±1s 30 +20/-10s Figure 9. Temperature Profile for Lead Solder 13.2 For Lead-free Solder Our used temp. profile for reflow soldering Temp.[°C] Time [s] 230°C -250°C max. 220°C150°C – 190°C 90 ±30s 30 +20/-10s Figure 10. Temperature Profile for Lead-free Solder NB: Maximum Reflow Cycles: 2 Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the module on the bottom / underside of your pcb and re-flow).
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 21 - ETRX35x-LR Preliminary Product Manual 14 Product Label Drawing Figure 11. Product Label The label dimensions are 17.0mm x 17.0 mm. The label will withstand temperatures used during reflow soldering. The characters “HR” are only present on the versions with the Hirose connector, Imprint Description ETRX357-LR Module Order code 000001 Indication for the serial number. 090101 Production Date Code in the format YYMMDD, e.g. 090602 01 Indication for batch number 02 Indication for the hardware revision FCC ID: S4GEM35X2 FCC ID code for this product 2D-Barcode Information in the Datamatrix 2D-Barcode are the serial number [6 characters], the Part-Order code [12 characters], identifier for the batch number [2 characters], the identifier for the hardware release [2 characters] and the production date code in the format Year-Month-Day [6 characters], separated by a semicolon. Table 13. ETRX35x-LR Label Details
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 22 - ETRX35x-LR Preliminary Product Manual 15 Recommended Footprint In order to surface mount a ETRX3 series module, we recommend that you use pads which are 1mm wide and 1.2mm high. You must retain the “keep-out” zone shown in section 12, and ensure that this area is free of copper tracks and/or copper planes/layers. You must also ensure that there is no exposed copper on your layout which may contact with the backside of the ETRX3 series module. For best RF performance it is required to provide good ground connections to the ground pads of the module. It is recommended to use multiple vias between each ground pad and a solid ground plane to minimize inductivity in the ground path. Figure 12. Recommended Footprint The land pattern dimensions above serve as a guideline. We recommend that you use the same pad dimensions for the solder paste screen as you have for the copper pads. However these sizes and shapes may need to be varied depending on your soldering processes and your individual production standards. We recommend a paste screen thickness of 120µm to 150µm. Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such as through-hole vias, planes or tracks on your board component layer, should be located below the ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use a multilayer PCB containing an inner RF shielding ground plane, therefore there is no need to have an additional copper plane directly under the ETRX3 series module.
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 23 - ETRX35x-LR Preliminary Product Manual 15.1 Example carrier board Since the RF performance of the module with the on board antenna is strongly dependent on the proper location of the module on its carrier board, Figure 13 shows the reference carrier board which was used during testing by Telegesis. Figure 13. Reference Board For best performance it is recommended to locate the antenna towards the corner of the carrier board and to respect the recommended keep-out areas as described in section 12. Finally to provide a good reference ground to the on board antenna, the carrier board should have a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will suffice, but a degradation in radio performance could be the result.
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 24 - ETRX35x-LR Preliminary Product Manual 16 Reliability Tests The measurements will be conducted after the module has been exposed to standard room temperature and humidity for 1 hour. No Item Limit Condition 1 Vibration test Electrical parameter should be in specification a) Freq.:10~50Hz,Amplitude:1.5mm a) 20min. / cycle,1hrs. each of XYZ axis b) Freq.:30~100Hz, 6G b) 20min. / cycle,1hrs. each of XYZ axis 2 Shock test the same as the above Dropped onto hard wood from height of 50cm for 3 times 3 Heat cycle test the same as the above -40°C for 30min. and +85°C for 30min.; each temperature 300 cycles 4 Moisture test the same as the above +60°C, 90% RH, 300h 5 Low temp. test the same as the above -40°C, 300h 6 High temp. test the same as the above +85°C, 300h Table 14. Reliability Tests 17 Application Notes 17.1 Safety Precautions These specifications are intended to preserve the quality assurance of products as individual components. Before use, check and evaluate their operation when mounted on your products. Abide by these specifications when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, then provide the following failsafe functions as a minimum: (1) Ensure the safety of the whole system by installing a protection circuit and a protection device. (2) Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. 17.2 Design Engineering Notes (1) Heat is the major cause of shortening the life of these products. Avoid assembly and use of the target equipment in conditions where the product’s temperature may exceed the maximum allowable. (2) Failure to do so may result in degrading of the product’s functions and damage to the product. (3) If pulses or other transient loads (a large load applied in a short time) are applied to the products, before use, check and evaluate their operation when assembled onto your products. (4) These products are not intended for other uses, other than under the special conditions shown below. Before using these products under such special conditions, check their
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 25 - ETRX35x-LR Preliminary Product Manual performance and reliability under the said special conditions carefully, to determine whether or not they can be used in such a manner. (5) In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. (6) In direct sunlight, outdoors, or in a dusty environment (7) In an environment where condensation occurs. (8) In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOx) (9) If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. (10) Mechanical stress during assembly of the board and operation has to be avoided. (11) Pressing on parts of the metal cover or fastening objects to the metal cover is not permitted. 17.3 Storage Conditions (1) The module must not be stressed mechanically during storage. (2) Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance, may well be adversely affected: (3) Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX (4) Storage in direct sunlight (5) Storage in an environment where the temperature may be outside the range of 5°C to 35°C range, or where the humidity may be outside the 45 to 85% range. (6) Storage (before assembly of the end product) of the modules for more than one year after the date of delivery at your company even if all the above conditions (1) to (3) have been met, should be avoided. 18 Packaging 18.1 Embossed Tape (1) Dimension of the tape t.b.d.
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 26 - ETRX35x-LR Preliminary Product Manual (2) Cover tape peel force Force directionSpeed = 300mm/min.Cover tape peel force =0.098～0.68N ( 10～70g) = 10deg (3) Empty pockets Empty pockets Components Empty pockets Top cover Direction of g NB: Empty pockets in the component packed area will be less than two per reel and those empty pockets will not be consecutive. 18.2 Component Orientation Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges of the carrier tape (top view) Component Orientation Part No. Direction 18.3 Reel Dimensions (4) Quantity per reel: 400 pieces (5) Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on the reel t.b.d. 18.4 Packaging (6) Each reel will be packed in a hermetically-sealed bag (7) Marking : Part No. / Quantity / Lot No. and manufacturer part# with bar-code
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 27 - ETRX35x-LR Preliminary Product Manual 19 Ordering Information Ordering/Product Code Description ETRX351-LR ETRX357-LR Telegesis Long Range ZigBee Module with Ember ZigBee® Technology: • Based on Ember EM351 or EM357 • Telegesis AT Style Command Interpreter and • EmberZNet3.xx meshing and self-healing ZigBee PRO stack • Integrated 2.4GHz Antenna ETRX3DVK Telegesis Development Kit with: • 3 x USB Development Boards • 3 x USB Cable • 2 x ETRX35x on Carrier-Board • 2 x ETRX35xHR on Carrier-Board • 2 x ETRX35x-LR on Carrier-Board • 2 x ETRX35xHR-LR on Carrier-Board • 1 x ETRX2USB stick • 2 x Large Antenna • 2 x Small Stubby Antenna Notes: • Customers’ PO’s must state the Ordering/Product Code. • There is no “blank” version of the ETRX35x-LR modules available. All Modules are pre-programmed with the Telegesis AT style command interpreter based on the EmberZNet stack. (Where customers wish to add their own firmware they can erase and write it to the flash memory of the EM35x).
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 28 - ETRX35x-LR Preliminary Product Manual 20 Trademarks All trademarks, registered trademarks and products names are the sole property of their respective owners. 21 Disclaimer Product and company names and logos referenced may either be trademarks or registered trademarks of their respective companies. We reserve the right to make modifications and/or improvements without prior notification. All information is correct at time of issue. Telegesis (UK) Ltd does not convey any license under its patent rights or assume any responsibility for the use of the described product 22 RoHS Declaration Declaration of environmental compatibility for supplied products: Hereby we declare to our best present knowledge based on the declaration of our suppliers that this product does not contain the following substances which are banned by Directive 2002/95/EC (RoHS) or if they do, contain a maximum concentration of 0,1% by weight in homogeneous materials for: • Lead and lead compounds • Mercury and mercury compounds • Chromium (VI) • PBB (polybrominated biphenyl) category • PBDE (polybrominated biphenyl ether) category And a maximum concentration of 0.01% by weight in homogeneous materials for: • Cadmium and cadmium compounds 23 Data Sheet Status Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. Please consult the most recently issued data sheet before initiating or completing a design. 24 Life Support Policy This product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Telegesis (UK) Ltd. for any damages resulting.
ETRX351-LR AND ETRX357-LR ©2010 Telegesis (UK) Ltd - 29 - ETRX35x-LR Preliminary Product Manual 25 Related Documents [1] IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) [2] Datasheet EM35x, Ember. (www.ember.com) [3] Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height [4] The ZigBee® specification (www.zigbee.org) [5] Specification for Antenova Rufa Antenna (www.antenova.com) 26 Contact Information Website: www.telegesis.com E-mail sales@telegesis.com Telegesis (UK) Limited Abbey Barn Business Centre Abbey Barn Lane High Wycombe Bucks HP10 9QQ UK Tel: +44 (0)1494 510199 Fax: +44 (0)5603 436999

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