Silicon Laboratories Finland EM35X2 ETRX35x-LR Series Zigbee Modules User Manual TG ETRX35x LR PM 011 102

Telegesis (UK) Ltd ETRX35x-LR Series Zigbee Modules TG ETRX35x LR PM 011 102

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Telegesis TG-ETRX35X-LR-PM-011-101

ETRX351-LR AND ETRX357-LR Preliminary Product Manual

ETRX35x-LR ZIGBEE® MODULES

PRODUCT MANUAL

ETRX351-LR AND ETRX357-LR

Table of Contents

1 INTRODUCTION................................................................................................................... 5

1.1 Hardware Description ........................................................................................................ 5

2 PRODUCT APPROVALS..................................................................................................... 6

2.1 FCC Approvals...................................................................................................................6

2.1.1 FCC Labelling Requirements............................................................................................. 6

2.2 European Certification ....................................................... Error! Bookmark not defined.

2.3 Declarations of Conformity................................................. Error! Bookmark not defined.

2.4 IEEE 802.15.4.................................................................................................................... 6

2.5 The ZigBee® Protocol ....................................................................................................... 6

3 MODULE PINOUT................................................................................................................ 8

4 HARDWARE DESCRIPTION ............................................................................................. 10

4.1 Hardware Interface .......................................................................................................... 10

5 FIRMWARE DESCRIPTION............................................................................................... 11

5.1 Custom Firmware............................................................................................................. 11

5.2 Software Interface............................................................................................................ 12

6 ABSOLUTE MAXIMUM RATINGS..................................................................................... 13

7 RECOMMENDED OPERATING CONDITIONS ................................................................. 13

8 DC ELECTRICAL CHARACTERISTICS............................................................................ 14

9 DIGITAL I/O SPECIFICATIONS......................................................................................... 15

10 A/D CONVERTER CHARACTERISTICS ........................................................................... 16

11 AC ELECTRICAL CHARACTERISTICS............................................................................ 16

11.1 TX Power Characteristics ................................................................................................ 18

12 PHYSICAL DIMENSIONS .................................................................................................. 19

13 SOLDERING TEMPERATURE TIME PROFILE (FOR REFLOW SOLDERING) .............. 20

13.1 For Leaded Solder ........................................................................................................... 20

13.2 For Lead-free Solder........................................................................................................ 20

14 PRODUCT LABEL DRAWING........................................................................................... 21

15 RECOMMENDED FOOTPRINT ......................................................................................... 22

15.1 Example carrier board...................................................................................................... 23

16 RELIABILITY TESTS ......................................................................................................... 24

17 APPLICATION NOTES ...................................................................................................... 24

17.1 Safety Precautions........................................................................................................... 24

17.2 Design Engineering Notes ............................................................................................... 24

17.3 Storage Conditions .......................................................................................................... 25

ETRX351-LR AND ETRX357-LR

18 PACKAGING ...................................................................................................................... 25

18.1 Embossed Tape............................................................................................................... 25

18.2 Component Orientation.................................................................................................... 26

18.3 Reel Dimensions.............................................................................................................. 26

18.4 Packaging ........................................................................................................................ 26

19 ORDERING INFORMATION .............................................................................................. 27

20 TRADEMARKS................................................................................................................... 28

21 DISCLAIMER......................................................................................................................28

22 ROHS DECLARATION....................................................................................................... 28

23 DATA SHEET STATUS...................................................................................................... 28

24 LIFE SUPPORT POLICY.................................................................................................... 28

25 RELATED DOCUMENTS................................................................................................... 29

26 CONTACT INFORMATION ................................................................................................ 29

ETRX351-LR AND ETRX357-LR

The Telegesis ETRX351-LR and ETRX357-LR modules

are low power 2.4GHz ZigBee modules with an added PA

and LNA for highest possible link budget.

Based on the latest Ember EM351 and EM357 single chip

ZigBeeTM solution the new long range modules are footprint

compatible with the ETRX351 and ETRX357, thus

representing a drop-in replacement for all applications

where a high link budget is required.

The module’s unique AT-style command line interface

allows designers to quickly integrate ZigBee technology

without complex software engineering. For custom

application development the ETRX35x series integrates

with ease into Ember’s InSi

ht develo

ment environment.

Image not shown actual size; enlarged to show detail.

Module Features

• Small form factor, SMT module 25mm x 19mm

• Side Castellations for easy soldering and inspection

• 2 antenna options: Integrated chip antenna or U.FL

coaxial connector

• Industry’s first ARM® Cortex-M3 based family of ZigBee

modules

• Industry standard JTAG Programming and real time

network level debugging via the Ember InSight Port

• 192kB (ETRX357) and 128kB (ETRX351) flash and

12kbytes of RAM

• Lowest Deep Sleep Current of sub 1µA and multiple

sleep modes

• Wide supply voltage range (2.1 to 3.5V)

• 32.768kHz watch crystal can be added externally

• Module ships with standard Telegesis AT-style

command interface based on the ZigBee PRO feature

set

• Can act as an End Device, Router or Coordinator

• 24 general-purpose I/O lines including analogue inputs

(all GPIOs of the EM35x are accessible)

• Firmware upgrades via serial port or over the air

(password protected)

• Hardware supported encryption (AES-128)

• CE and FCC compliance, FCC modular approval

pending

• Operating temperature range: -40°C to +85°C

• Standard version without LNA and PA available in the

same form factor

Radio Features

• Based on the Ember EM351 and EM357 single chip

ZigBeeTM / IEEE802.15.4 solutions

• 2.4GHz ISM Band

• 250kbit/s over the air data rate

• 16 channels (IEEE802.15.4 Channel 11 to 26)

• +18dBm output power (adjustable down to -21dBm)

• High sensitivity of -105dBm typ. @ 1% packet error rate

• RX Current: 28mA, TX Current: approx 100mA at

18dBm

• Robust Wi-Fi and Bluetooth coexistence

Suggested Applications

• AMR – ZigBee Smart Energy applications

• Wireless Alarms and Security

• Home/Building Automation

• Wireless Sensor Networks

• M2M Industrial Controls

• Lighting and ventilation control

• Remote monitoring

• Environmental monitoring and control

Development Kit

• New Development kit containing everything required to

set up a mesh network quickly and evaluate range and

performance of the ETRX35x and its long range

version.

• AT-style software interface command dictionary can be

modified for high volume customers.

• Custom software development available upon request.

Example AT-Style Commands

AT+BCAST Send a Broadcast

AT+UCAST:<address> Send a Unicast

AT+EN Establish PAN network

AT+JN Join PAN

At power-up the last configuration is loaded from non-

volatile S-Registers, which can eliminate the need for an

additional host controller.

ETRX351-LR AND ETRX357-LR

1 Introduction

This document describes the Telegesis ETRX351-LR and ETRX357-LR ZigBee® long range

modules which have been designed to be easily integrated into another device and to provide a

fast, simple and low cost wireless mesh networking interface.

The Telegesis ETRX3 series modules are based on the Ember ZigBee® platform consisting of the

single chip EM351 or EM357 combined with the ZigBee PRO compliant EmberZNet meshing

stack. Integration into a wide range of applications is made easy using a simple AT style

command interface and advanced hardware design.

The configurable functionality of the Telegesis AT Commandset often allows the ETRX3 series

ZigBee modules to be used without an additional host microcontroller saving even more integration

time and costs. In addition to the Telegesis AT Commandset, the ETRX351-LR and ETRX357-LR

modules can be used with custom-built firmware and they represent an ideal platform for custom

firmware development in conjunction with the Ember development kits. The ETRX3 series shares

the same R3xx Telegesis firmware as the ETRX2 and the two devices can be used in the same

network.

No RF experience or expertise is required to add this powerful wireless networking capability to

your products. The ETRX351-LR and ETRX357-LR offer fast integration opportunities and the

shortest possible time to market for your product.

1.1 Hardware Description

The main building blocks of the ETRX351-LR and ETRX357-LR are the single chip EM351 and

EM357 from Ember, a Power Amplifier as well as a Low Noise Amplifier, a 24MHz reference

crystal and RF front-end circuitry optimized for best RF performance. The modules are available

with on-board antenna or alternatively a U.FL connector for attaching external antennae. Modules

with the U.FL connector are identified by the “HR” suffix.

The LNA and RF power amplifier of the LR devices improve the output power by 10dB and the

sensitivity by 5dB which will increase the range by approximately 600% relative to the standard

devices (where local regulations permit the use of the maximum output power).

The integrated antenna is an Antenova Rufa, and details of the radiation pattern etc are available

from the Antenova website [5].

Module Chip Flash RAM

ETRX351-LR EM351 128kB 12kB

ETRX351HR-LR EM351 128kB 12kB

ETRX357-LR EM357 192kB 12kB

ETRX357HR-LR EM357 192kB 12kB

Table 1: Memories

The ETRX351-LR and ETRX357-LR are used for ZigBee® (www.zigbee.org) applications. If you

wish to create your own custom firmware, and not use the pre-loaded Telegesis AT-Command

interface, you will need the InSight toolchain, consisting of InSight Desktop™ together with a

comprehensive integrated development environment (IDE) and C-language compiler toolchain

from Ember. The Ember development environment is not suitable for an 802.15.4-only application

that does not use the ZigBee layer.

ETRX351-LR AND ETRX357-LR

2 Product Approvals

The ETRX351-LR and ETRX357-LR have been designed to meet all national regulations for world-

wide use. In particular the following certifications have been obtained:

2.1 FCC Approvals

The Telegesis ETRX351-LR and ETRX357-LR with integrated Antenna has been tested to comply

with FCC CFR Part 15 (USA). The devices meet the requirements for modular transmitter

approval as detailed in the FCC public notice DA00.1407.transmitter.

This device complies with Part 15 of the FCC rules. Operation is subject to the following

two conditions: (1) this device may not cause harmful interference, and (2) this device must

accept any interference received, including interference that may cause undesired

operation.

While the applicant for a device into which the ETRX351-LR or ETRX357-LR or ETRX351HR-LR is

installed is not required to obtain a new authorization for the module, this does not preclude the

possibility that some other form of authorization or testing may be required for the end product.

The FCC requires the user to be notified that any changes or modifications made to this device

that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the

equipment.

2.2 FCC Labelling Requirements

When integrating the ETRX351-LR or ETRX357-LR into a product if must be ensured that the FCC

labelling requirements are met. This includes a clearly visible label on the outside of the finished

product specifying the Telegesis FCC identifier (FCC ID: S4GEM35X2) as well as the notice

above. This exterior label can use wording such as “Contains Transmitter Module FCC ID:

S4GEM35X2” or “Contains FCC ID: S4GEM35X2” although any similar wording that expresses

the same meaning may be used.

2.3 IEEE 802.15.4

IEEE 802.15.4 is a standard for low data rate, wireless networks (raw bit-rate within a radio packet

of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life

applications as well as mains-powered applications. It is the basis for the open ZigBee® Protocol.

2.4 The ZigBee® Protocol

The ZigBee® Protocol is a set of standards for wireless connectivity for use between any devices

over short to medium distances. The specification was originally ratified in December 2004, paving

the way for companies to start making low-power networks a reality.

ZigBee® uses an IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three

additional layers for networking, security and applications. What makes the specification unique is

its use of a mesh network architecture which, in bucket chain style, passes data from one node to

the next until it lands at its destination. The network is self-healing and adapts its routing as link

quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not

act as routers, but can therefore be put into a low-power sleep state.

FCC ID: S4GEM35X2

ETRX351-LR AND ETRX357-LR

The enhanced version of the ZigBee® standard (or ZigBee® 2006) was released in December

2006, adding new features and improvements to the only global wireless communication standard

enabling the development of easily deployable low-cost, low-power, monitoring and control

products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee

Alliance introduced the PRO featureset which offers advantages over earlier versions, including

• Truly self healing mesh networking

• Messages can now travel up to 30 hops

• Source-Routing for improved point to multipoint message transmission

• Improved security including Trust-Centre link keys

• New message types and options

The Telegesis AT Commandset, which by default ships on all ETRX3 series products is based on

the ZigBee PRO featureset. For more information on the Telegesis AT Commandset please refer

to the separate documentation at www.telegesis.com.

ETRX351-LR AND ETRX357-LR

3 Module Pinout

Figure 1: ETRX3 series Module Pinout (top view)

The table below gives details about the pin assignment for direct SMD soldering of the ETRX3

series modules to the application board. For more information on the alternate functions please

refer to [2]. Also refer to the Telegesis AT Commandset documentation to understand how the pre-

programmed firmware makes use of the individual I/Os.

All GND pads are connected within the module, but for best RF performance all of them should be

grounded externally.

ETRX35x

pad Designation Normal

function Alternate

function EM35x

pin Ember designation

1 GND GND GND

2 PC5 {1} I/O 11 TX_ACTIVE

3 PC6 I/O 13 OSC32B, nTX_ACTIVE

4 PC7 I/O 14 OSC32A, OSC32_EXT

5 PA7 {4} I/O 18 TIM1C4

6 PB3 {2} I/O CTS 19 SC1nCTS, SC1SCLK, TIM2C3

7 nReset nReset 12

8 PB4 {2} I/O RTS 20 TIM2C4, SC1nRTS, SC1nSSEL

9 PA0 I/O 21 TIM2C1, SC2MOSI

10 PA1 I/O 22 TIM2C3, SC2SDA, SC2MISO

11 PA2 I/O 24 TIM2C4, SC2SCL, SC2SCLK

12 PA3 I/O 25 SC2nSSEL, TRACECLK, TIM2C2

13 GND GND GND

14 PA4 I/O 26 ADC4, PTI_EN, TRACEDATA

15 PA5 {3} I/O 27 ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3

16 PA6 {4} I/O 29 TIM1C3

17 PB1 TXD 30 SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1

18 PB2 RXD 31 SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2

19 GND GND GND

20 GND GND GND

21 JTCK JTCK 32 SWCLK

ETRX351-LR AND ETRX357-LR

ETRX35x

pad Designation Normal

function Alternate

function EM35x

pin Ember designation

22 PC2 I/O 33 JTDO, SWO

23 PC3 I/O 34 JTDI

24 PC4 I/O 35 JTMS, SWDIO

25 PB0 I/O 36 VREF, IRQA, TRACECLK, TIM1CLK, TIM2MSK

26 PC1 I/O ADC3 38 ADC3, SWO, TRACEDATA0

27 PC0 {4} I/O 40 JRST, IRQD, TRACEDATA1

28 PB7 {4} I/O ADC2 41 ADC2, IRQC, TIM1C2

29 PB6 {4} I/O ADC1 42 ADC1, IRQB, TIM1C1

30 PB5 I/O ADC0 43 ADC0, TIM2CLK, TIM1MSK

31 GND GND GND

32 Vcc Vcc Vcc

33 GND GND GND

Table 2. Pin Information

Alternate functions depend on the firmware, but the R3xx functions are indicated here for

convenience.

Notes:

{1} PC5 is not usable on these long range versions of the ETRX35x as this GPIO is used as

TX_ACTIVE to control the external RF frontend.

{2} When using the Telegesis AT Commandset, RTS/CTS handshaking is selectable in firmware. See

the AT Command Manual.

{3} If PA5 is driven low at power-up or reset the module will boot up in the bootloader

{4} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 9)

ETRX351-LR AND ETRX357-LR

4 Hardware Description

24MHz

EM35x

I/O

UART

I / O

programming

5JTAG

Vcc

Vreg

RESET

Balun

integrated

antenna

U.FL socket

terminal

selection,

filtering and

matching

circuitry

LDO

1V8

1,8Vdc

LDO

1V25

Balun

LNA

Switch

Figure 2: Hardware Diagram

The ETRX351-LR and ETRX357-LR are based on the Ember EM351 and EM357 respectively in

addition to a discrete PA, LNA and RF switch added to the RF-Frontend. The EM351 and EM357

are fully integrated 2.4GHz ZigBee transceivers with a 32-bit ARM® Cortex M3TM microprocessor,

flash and RAM memory, and peripherals.

The industry standard serial wire and JTAG programming and debugging interfaces together with

the standard ARM system debug components help to streamline any custom software

development.

In addition to this a number of MAC functions are also implemented in hardware to help maintain

the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards.

The new advanced power management features allow faster wakeup from sleep and new power

down modes allow this 3rd generation module to offer a longer battery life than any 2nd generation

modules on the market.

The EM35x has fully integrated voltage regulators for both required 1.8V and 1.25V supply

voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset circuit

eliminates the need for any external monitoring circuitry. A 32.768kHz watch crystal can be

connected externally to pads 3 and 4 in case more accurate timing is required.

4.1 Hardware Interface

All GPIO pins of the EM351 or EM357 are accessible on the module’s pads. Whether signals are

used as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware.

When using the Telegesis AT Commandset please refer to the AT Commandset manual for this

information and when developing custom firmware please refer to the EM35x datasheet.

ETRX351-LR AND ETRX357-LR

5 Firmware Description

The modules will be pre-loaded with a standalone bootloader which supports over-the-air

bootloading as well as serial bootloading of new firmware.

In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and

power-cycle or reset the module. To avoid entering the standalone bootloader unintentionally

make sure not to pull this pin down during boot-up unless the resistance to ground is >10k. (A

pull-up is not required).

In addition to the standalone bootloader the modules also contain the current release of the

Telegesis AT-style command interface as described in the Telegesis AT command dictionary and

the Telegesis user guide. Check www.telegesis.com for updates. Each module comes with a

unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. The commands and

responses pass through the serial port of the ETRX35x-LR as ASCII text, so a simple terminal

application will usually suffice. We provide Telegesis Terminal but it is not an essential feature.

The pre-loaded AT-style command interface firmware is based on the latest EmberZNet meshing

stack which implements routers/coordinators as well as (sleepy) end devices. [End devices have

no routing responsibility and therefore are allowed to go to sleep, whilst still being able to send and

receive messages via a parent router. In addition to a classical (sleepy) end device the module

firmware also supports mobile (sleepy) end devices capable of changing their parent quickly

whenever they change their position within the network.]

A router is typically a mains powered device whilst a sleepy end device (SED) can be battery

powered.

The module is also able to act as a PAN coordinator and Trust Centre through external host

control. The AT style command line supplies all the tools required to set up and manage a ZigBee

network by allowing easy access to the low-level functionality of the stack.

The Telegesis firmware uses the meshing and self healing EmberZNet PRO stack to overcome

many of the limitations of the tree network topology of the ZigBee® 2006 stack by using the ZigBee

PRO featureset.

The Telegesis firmware also allows low-level access to physical parameters such as channel and

power level. Parameters that define the functionality of the ETRX35x module and also allow

standalone functionality are saved in non-volatile memory organised in so-called S-Registers. The

SPI and I2C buses are not supported by the current firmware release, but can be used with custom

firmware.

5.1 Custom Firmware

For high volume customers the firmware can be customised on request. Customers can use the

ETRX35x module as hardware only and develop their own firmware based on the EmberZNet

stack. In order to develop custom firmware the Ember Insight toolchain is required.

ETRX351-LR AND ETRX357-LR

5.2 Software Interface

Using the default firmware the ETRX35x-LR is controlled using a simple AT-style command

interface and (mostly) non-volatile S-Registers. In order to get a full listing of all the available AT-

Commands, please refer to the AT command dictionary document which corresponds to the

firmware revision you intend to use.

In addition to the command dictionary there are user guides explaining the features of the firmware

in more detail. If you need to find out which firmware resides on your module simply type “ATI”

followed by a carriage return and you will be prompted with the module’s manufacturing

information.

The Development Kit manual describes how to upgrade the firmware either via a serial link or over

the air.

ETRX351-LR AND ETRX357-LR

6 Absolute Maximum Ratings

Supply: 3.5V

Inputs: -0.3V to Vcc + 0.3V

Operating temperature: -40 to 85°C

No. Item Symbol Absolute Maximum Ratings Unit

1 Supply voltage VCC -0.3 to +3.5 Vdc

Voltage on any I/O[11:0] ,

SIF_CLK, SIF_MISO, SIF_MOSI,

SIF_LOADB, RESET

Vin -0.3 to VCC +0.3 Vdc

3 Storage temperature range Tstg -40 to +105 °C

4 Operating temperature range Top -40 to +85 °C

5 Input RF level Pmax 15 dBm

ESD on any pin {1} according to

Human Body Model (HBM) circuit

description

VTHHBM ±2 kV

7 Reflow temperature TDeath Please refer to chapter 13 °C

Table 3. Absolute Maximum Ratings

Note:

{1} Input must be current limited to the value specified.

The absolute maximum ratings given above should under no circumstances be violated.

Exceeding one or more of the limiting values may cause permanent damage to the device.

Caution! ESD sensitive device. Precautions should be used when handling the device

in order to prevent permanent damage.

7 Recommended Operating Conditions

No. Item Condition /

Remark Symbol Value Unit

Min Typ Max

1 Supply voltage VCC 2.1 3.5 Vdc

2 RF Input Frequency fC 2405 2480 MHz

3 RF Input Power pIN 0 dBm

4 Operating temperature

range Top -40 +85 °C

Table 4. Recommended Operating Conditions

ETRX351-LR AND ETRX357-LR

8 DC Electrical Characteristics

VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated

No. Item Condition /

Remark Symbol Value Unit

Min Typ Max

1 Module supply voltage VCC 2.1 3.5 Vdc

Quiescent current,

internal RC oscillator

disabled

ISLEEP 2.4 µA

Quiescent current,

internal RC oscillator

enabled

ISLEEP 2.8 µA

Quiescent current,

including

32.768kHz oscillator

ISLEEP 3.3 µA

5 Transmit current

consumption

at +18dBm

module output

power

ITXVCC 90 mA

Transmit Current

consumption

BOOST MODE

at +18dBm

module output

power

ITXVCC 100 mA

7 Transmit current

consumption

at min. module

output power ITXVCC tbd mA

8 Receive current

consumption

Total, 12MHz

clock speed IRX 30 mA

9 Receive current

consumption

Total, 24MHz

clock speed IRX 31 mA

Receive current

consumption

BOOST MODE

Total, 12MHz

clock speed IRX 31 mA

Receive current

consumption

BOOST MODE

Total, 24MHz

clock speed IRX 32 mA

12 MCU, RAM and flash,

radio off

12MHz clock

speed IMCU 7 mA

13 MCU, RAM and flash,

radio off

24MHz clock

speed IMCU 8 mA

14 Serial Controller Max data rate ISC 0.2 mA

15 Timer Max clock rate ITMR 0.25 mA

16 ADC Max sample rate IADC 1.1 mA

17 Wake time from deep

sleep

From wakeup

event to 1st

instruction

100 µs

18 Shutdown time

From last

instruction into

deep sleep

5 µs

Table 5. DC Electrical Characteristics

Please Note: The average current consumption during operation is dependent on the firmware

and the network load, therefore these figures are given in the command dictionary of the

respective firmware.

ETRX351-LR AND ETRX357-LR

9 Digital I/O Specifications

The digital I/Os of the ETRX35x module have the ratings shown below.

VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated

No. Item Condition /

Remark Symbol Value Unit

Min Typ Max

1 Low Schmitt switching

threshold

Schmitt input

threshold going

from high to low

VSWIL 0.42 x VCC 0.5 x VCC Vdc

2 High Schmitt switching

threshold

Schmitt input

threshold going

from low to high

VSWIH 0.62 x VCC 0.8 x VCC MHz

3 Input current for logic 0 IIL -0.5 µA

4 Input current for logic 1 IIH 0.5 µA

5 Input Pull-up resistor

value RIPU 24 29 34 k

6 Input Pull-down resistor

value RIPD 24 29 34 k

7 Output voltage for logic 0

IOL = 4mA (8mA) for

standard (high

current) pads

VOL 0 0.18 x VCC V

8 Output voltage for logic 1

IOH = 4mA (8mA)for

standard (high

current) pads

VOH 0.82 x VCC VCC V

9 Output Source Current Standard current

pad IOHS 4 mA

10 Output Sink current Standard current

pad IOLS 4 mA

11 Output Source Current High current pad IOHH 8 mA

12 Output Sink current High current pad IOLH 8 mA

13 Total output current IOH + IOL 40 mA

Table 6. Recommended Operating Conditions

ETRX351-LR AND ETRX357-LR

10 A/D Converter Characteristics

The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer

to section 10 of the EM35x datasheet.

No. Item

1 A/D resolution Up to 12 bits

2 A/D sample time for 5-bit conversion 5.33µs

3 A/D sample time for 12-bit conversion 682µs

4 Reference Voltage 1.25V or Vcc

Table 7. A/D Converter Characteristics

11 AC Electrical Characteristics

VCC = 3.0V, TAMB = 25°C, NORMAL MODE measured at 50Ω terminal load connected to the U.FL socket

No. Receiver Value Unit

Min Typ Max

1 Frequency range 2400 2500 MHz

2 Sensitivity for 1% Packet Error Rate (PER) -106 -105 -99 dBm

3 Sensitivity for 1% Packet Error Rate (PER) BOOST MODE -106 -105 -100 dBm

4 Saturation (maximum input level for correct operation) 0 dBm

5 High-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 35 dB

6 Low-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 35 dB

7 2nd High-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 43

8 2nd Low-Side Adjacent Channel Rejection

(1% PER and desired signal –82dBm acc. to [1]) 43

9 Channel Rejection for all other channels

(1% PER and desired signal –82dBm acc. to [1]) 40 dB

10 802.11g rejection centred at +12MHz or –13MHz

(1% PER and desired signal –82dBm acc. to [1]) 35 dB

11 Co-channel rejection

(1% PER and desired signal –82dBm acc. to [1]) -6 dBc

12 Relative frequency error

(2x40ppm required by [1]) -120 120 ppm

13 Relative timing error

(2x40ppm required by [1]) -120 120 ppm

14 Linear RSSI range 35 dB

Output power at highest power setting

NORMAL MODE

BOOST MODE

19 dBm

16 Output power at lowest power setting tbd dBm

17 Error vector magnitude as per IEEE802.15.4 7 15 %

18 Carrier frequency error -40 40 ppm

19 PSD mask relative

3.5MHz distance from carrier -20 dB

20 PSD mask absolute

3.5MHz distance from carrier -30 dBm

Table 8. AC Electrical Characteristics

ETRX351-LR AND ETRX357-LR

Please Note: For the relationship between EM35x power settings and module output power

please relate to chapter 11.1 of this document. When developing custom firmware the output

power settings described in this document relate directly to the EM35x power settings accessible

via the Ember stack API.

No. Synthesiser Characteristics Limit Unit

Min Typ Max

22 Frequency range 2400 2500 MHz

23 Frequency resolution 11.7 kHz

24 Lock time from off state, with correct VCO DAC settings 100 µs

25 Relock time, channel change or Rx/Tx turnaround 100 µs

26 Phase noise at 100kHz offset -71dBc/Hz

27 Phase noise at 1MHz offset -91dBc/Hz

28 Phase noise at 4MHz offset -103dBc/Hz

29 Phase noise at 10MHz offset -111dBc/Hz

Table 9. Synthesiser Characteristics

No. Power On Reset (POR) Specifications Limit Unit

Min Typ Max

30 VCC POR release 0.62 0.95 1.2 Vdc

31 VCC POR assert 0.45 0.65 0.85 Vdc

Table 10. Power On Reset Specifications

No. nRESET Specifications Limit Unit

Min Typ Max

32 Reset Filter Time constant 2.1 12 16 µs

33 Reset Pulse width to guarantee a reset 26 µs

34 Reset Pulse width guaranteed not to cause reset 0 1 µs

Table 11. nReset Specifications

ETRX351-LR AND ETRX357-LR

11.1 TX Power Characteristics

Important Note: For Band edge compliance it is required to limit the output power out of the

EM357 on channel 26 to a setting of -22dBm. Because of this it is recommended to not use

channel 26 on the ETRX35x-LR modules as the range will be significantly reduced on this channel.

The diagrams below show the typical output power and module current in dependency on module

supply voltage and EM35x power setting in NORMAL MODE and BOOST MODE.

Figure 3. Output Power vs. Power Setting

Figure 4. Output Power vs. Power Setting

Figure 5. Module Current vs. Power Setting

Figure 6. Output Power vs. Power Setting (BOOST MODE)

Figure 7. Module Current vs. Power Setting (BOOST MODE)

t.b.d

ETRX351-LR AND ETRX357-LR

12 Physical Dimensions

Figure 8. ETRX3 Physical Dimensions

Symbol Explanation Distance

L Length of the module 25.0mm

W Width of the module 19.0mm

H Height of the module 3.0mm

A1 Distance centre of pad PCB edge 0.9mm

A2 Pitch 1.27mm

R1 Keep-out Zone from corner of PCB 17.5mm

R2 Keep-out Zone from corner of PCB 4.1mm

X1 Distance centre of Antenna connector PCB edge 3.8mm

X2 Distance centre of Antenna connector PCB edge 2.8mm

Table 12. ETRX3 Physical Dimensions

For ideal RF performance when using the on-board antenna, the antenna should be located at the

corner of the carrier PCB. There should be no components, tracks or copper planes in the “keep-

out” area which should be as large as possible. When using the U.FL RF connector the “keep-out”

area doesn’t have to be kept. NB: The module transmit/receive range will depend on the antenna

used and also the housing of the finished product.

ETRX351-LR AND ETRX357-LR

13 Soldering Temperature Time Profile (for reflow soldering)

13.1 For Leaded Solder

Recommended temp. profile

for reflow soldering

Tem

[

°C

]

Time [s]

235°C max.

220

5°C

200°C

150 ±10°C

90 ±30s

10 ±1s

30 +20/-10s

Figure 9. Temperature Profile for Lead Solder

13.2 For Lead-free Solder

Our used temp. profile

for reflow soldering

Temp.[°C]

Time [s]

230°C -250°C max.

220°C

150°C – 190°C

90 ±30s

30 +20/-10s

Figure 10. Temperature Profile for Lead-free Solder

NB:

Maximum Reflow Cycles: 2

Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the

module on the bottom / underside of your pcb and re-flow).

ETRX351-LR AND ETRX357-LR

14 Product Label Drawing

Figure 11. Product Label

The label dimensions are 17.0mm x 17.0 mm. The label will withstand temperatures used during

reflow soldering. The characters “HR” are only present on the versions with the Hirose connector,

Imprint Description

ETRX357-LR Module Order code

000001 Indication for the serial number.

090101 Production Date Code in the format YYMMDD, e.g. 090602

01 Indication for batch number

02 Indication for the hardware revision

FCC ID: S4GEM35X2 FCC ID code for this product

2D-Barcode

Information in the Datamatrix 2D-Barcode are the serial number [6 characters], the Part-Order

code [12 characters], identifier for the batch number [2 characters], the identifier for the

hardware release [2 characters] and the production date code in the format Year-Month-Day

[6 characters], separated by a semicolon.

Table 13. ETRX35x-LR Label Details

ETRX351-LR AND ETRX357-LR

15 Recommended Footprint

In order to surface mount a ETRX3 series module, we recommend that you use pads which are

1mm wide and 1.2mm high. You must retain the “keep-out” zone shown in section 12, and ensure

that this area is free of copper tracks and/or copper planes/layers.

You must also ensure that there is no exposed copper on your layout which may contact with the

backside of the ETRX3 series module.

For best RF performance it is required to provide good ground connections to the ground pads of

the module. It is recommended to use multiple vias between each ground pad and a solid ground

plane to minimize inductivity in the ground path.

Figure 12. Recommended Footprint

The land pattern dimensions above serve as a guideline.

We recommend that you use the same pad dimensions for the solder paste screen as you have for

the copper pads. However these sizes and shapes may need to be varied depending on your

soldering processes and your individual production standards. We recommend a paste screen

thickness of 120µm to 150µm.

Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such

as through-hole vias, planes or tracks on your board component layer, should be located below the

ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use a multilayer PCB

containing an inner RF shielding ground plane, therefore there is no need to have an additional

copper plane directly under the ETRX3 series module.

ETRX351-LR AND ETRX357-LR

15.1 Example carrier board

Since the RF performance of the module with the on board antenna is strongly dependent on the

proper location of the module on its carrier board, Figure 13 shows the reference carrier board

which was used during testing by Telegesis.

Figure 13. Reference Board

For best performance it is recommended to locate the antenna towards the corner of the carrier

board and to respect the recommended keep-out areas as described in section 12.

Finally to provide a good reference ground to the on board antenna, the carrier board should have

a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will

suffice, but a degradation in radio performance could be the result.

ETRX351-LR AND ETRX357-LR

16 Reliability Tests

The measurements will be conducted after the module has been exposed to standard room

temperature and humidity for 1 hour.

No Item Limit Condition

1 Vibration test Electrical parameter should be

in specification

a) Freq.:10~50Hz,Amplitude:1.5mm

a) 20min. / cycle,1hrs. each of XYZ axis

b) Freq.:30~100Hz, 6G

b) 20min. / cycle,1hrs. each of XYZ axis

2 Shock test the same as the above Dropped onto hard wood from height of

50cm for 3 times

3 Heat cycle test the same as the above -40°C for 30min. and +85°C for 30min.;

each temperature 300 cycles

4 Moisture test the same as the above +60°C, 90% RH, 300h

5 Low temp. test the same as the above -40°C, 300h

6 High temp. test the same as the above +85°C, 300h

Table 14. Reliability Tests

17 Application Notes

17.1 Safety Precautions

These specifications are intended to preserve the quality assurance of products as individual

components.

Before use, check and evaluate their operation when mounted on your products. Abide by

these specifications when using the products. These products may short-circuit. If electrical

shocks, smoke, fire, and/or accidents involving human life are anticipated when a short

circuit occurs, then provide the following failsafe functions as a minimum:

(1) Ensure the safety of the whole system by installing a protection circuit and a protection

device.

(2) Ensure the safety of the whole system by installing a redundant circuit or another

system to prevent a single fault causing an unsafe status.

17.2 Design Engineering Notes

(1) Heat is the major cause of shortening the life of these products. Avoid assembly and

use of the target equipment in conditions where the product’s temperature may exceed

the maximum allowable.

(2) Failure to do so may result in degrading of the product’s functions and damage to the

product.

(3) If pulses or other transient loads (a large load applied in a short time) are applied to the

products, before use, check and evaluate their operation when assembled onto your

products.

(4) These products are not intended for other uses, other than under the special conditions

shown below. Before using these products under such special conditions, check their

ETRX351-LR AND ETRX357-LR

performance and reliability under the said special conditions carefully, to determine

whether or not they can be used in such a manner.

(5) In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where

liquid may splash.

(6) In direct sunlight, outdoors, or in a dusty environment

(7) In an environment where condensation occurs.

(8) In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2,

SO2, H2S, NH3, and NOx)

(9) If an abnormal voltage is applied due to a problem occurring in other components or

circuits, replace these products with new products because they may not be able to

provide normal performance even if their electronic characteristics and appearances

appear satisfactory.

(10) Mechanical stress during assembly of the board and operation has to be avoided.

(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not

permitted.

17.3 Storage Conditions

(1) The module must not be stressed mechanically during storage.

(2) Do not store these products in the following conditions or the performance

characteristics of the product, such as RF performance, may well be adversely

affected:

(3) Storage in salty air or in an environment with a high concentration of corrosive gas,

such as Cl2, H2S, NH3, SO2, or NOX

(4) Storage in direct sunlight

(5) Storage in an environment where the temperature may be outside the range of 5°C to

35°C range, or where the humidity may be outside the 45 to 85% range.

(6) Storage (before assembly of the end product) of the modules for more than one year

after the date of delivery at your company even if all the above conditions (1) to (3)

have been met, should be avoided.

18 Packaging

18.1 Embossed Tape

(1) Dimension of the tape

t.b.d.

ETRX351-LR AND ETRX357-LR

(2) Cover tape peel force

Force direction

Speed = 300mm/min.

Cover tape peel force

=0.098～0.68N ( 10～70g)

= 10deg

(3) Empty pockets

Empty pockets

Components

Empty pockets Top cover

Direction of

NB: Empty pockets in the component packed area will be less than two per reel and those empty

pockets will not be consecutive.

18.2 Component Orientation

Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges of the

carrier tape

(top view)

Component Orientation

Part No.

Direction

18.3 Reel Dimensions

(4) Quantity per reel: 400 pieces

(5) Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on

the reel

t.b.d.

18.4 Packaging

(6) Each reel will be packed in a hermetically-sealed bag

(7) Marking : Part No. / Quantity / Lot No. and manufacturer part# with bar-code

ETRX351-LR AND ETRX357-LR

19 Ordering Information

Ordering/Product Code Description

ETRX351-LR

ETRX357-LR

Telegesis Long Range ZigBee Module with Ember ZigBee®

Technology:

• Based on Ember EM351 or EM357

• Telegesis AT Style Command Interpreter and

• EmberZNet3.xx meshing and self-healing ZigBee PRO

stack

• Integrated 2.4GHz Antenna

ETRX3DVK Telegesis Development Kit with:

• 3 x USB Development Boards

• 3 x USB Cable

• 2 x ETRX35x on Carrier-Board

• 2 x ETRX35xHR on Carrier-Board

• 2 x ETRX35x-LR on Carrier-Board

• 2 x ETRX35xHR-LR on Carrier-Board

• 1 x ETRX2USB stick

• 2 x Large Antenna

• 2 x Small Stubby Antenna

Notes:

• Customers’ PO’s must state the Ordering/Product Code.

• There is no “blank” version of the ETRX35x-LR modules available. All Modules are pre-

programmed with the Telegesis AT style command interpreter based on the EmberZNet

stack. (Where customers wish to add their own firmware they can erase and write it to the

flash memory of the EM35x).

ETRX351-LR AND ETRX357-LR

20 Trademarks

All trademarks, registered trademarks and products names are the sole property of their respective

owners.

21 Disclaimer

Product and company names and logos referenced may either be trademarks or registered

trademarks of their respective companies. We reserve the right to make modifications and/or

improvements without prior notification. All information is correct at time of issue. Telegesis (UK)

Ltd does not convey any license under its patent rights or assume any responsibility for the use of

the described product

22 RoHS Declaration

Declaration of environmental compatibility for supplied products:

Hereby we declare to our best present knowledge based on the declaration of our suppliers that

this product does not contain the following substances which are banned by Directive 2002/95/EC

(RoHS) or if they do, contain a maximum concentration of 0,1% by weight in homogeneous

materials for:

• Lead and lead compounds

• Mercury and mercury compounds

• Chromium (VI)

• PBB (polybrominated biphenyl) category

• PBDE (polybrominated biphenyl ether) category

And a maximum concentration of 0.01% by weight in homogeneous materials for:

• Cadmium and cadmium compounds

23 Data Sheet Status

Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to

improve the design and supply the best possible product. Please consult the most recently issued

data sheet before initiating or completing a design.

24 Life Support Policy

This product is not designed for use in life support appliances, devices, or systems where

malfunction can reasonably be expected to result in a significant personal injury to the user, or as a

critical component in any life support device or system whose failure to perform can be reasonably

expected to cause the failure of the life support device or system, or to affect its safety or

effectiveness. Customers using or selling these products for use in such applications do so at their

own risk and agree to fully indemnify Telegesis (UK) Ltd. for any damages resulting.

ETRX351-LR AND ETRX357-LR

25 Related Documents

[1] IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical

Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-

WPANs)

[2] Datasheet EM35x, Ember. (www.ember.com)

[3] Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors -

Low Profile 1.9mm or 2.4mm Mated Height

[4] The ZigBee® specification (www.zigbee.org)

[5] Specification for Antenova Rufa Antenna (www.antenova.com)

26 Contact Information

Website: www.telegesis.com

E-mail sales@telegesis.com

Telegesis (UK) Limited

Abbey Barn Business Centre

Abbey Barn Lane

High Wycombe

Bucks

HP10 9QQ

Tel: +44 (0)1494 510199

Fax: +44 (0)5603 436999

Silicon Laboratories Finland EM35X2 ETRX35x-LR Series Zigbee Modules User Manual TG ETRX35x LR PM 011 102

Telegesis (UK) Ltd ETRX35x-LR Series Zigbee Modules TG ETRX35x LR PM 011 102

manual

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