Silicon Laboratories Finland EM35X2 ETRX35x-LR Series Zigbee Modules User Manual TG ETRX35x LR PM 011 102
Telegesis (UK) Ltd ETRX35x-LR Series Zigbee Modules TG ETRX35x LR PM 011 102
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Telegesis
TG-ETRX35X-LR-PM-011-101
ETRX351-LR AND ETRX357-LR
Preliminary Product Manual
ETRX35x-LR ZIGBEE ® MODULES
PRODUCT MANUAL
©2010 Telegesis (UK) Ltd
ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
Table of Contents
1.1
2.1
2.1.1
2.2
2.3
2.4
2.5
INTRODUCTION................................................................................................................... 5
Hardware Description ........................................................................................................ 5
PRODUCT APPROVALS ..................................................................................................... 6
FCC Approvals................................................................................................................... 6
FCC Labelling Requirements............................................................................................. 6
European Certification ....................................................... Error! Bookmark not defined.
Declarations of Conformity................................................. Error! Bookmark not defined.
IEEE 802.15.4.................................................................................................................... 6
The ZigBee® Protocol ....................................................................................................... 6
MODULE PINOUT ................................................................................................................ 8
HARDWARE DESCRIPTION ............................................................................................. 10
4.1
5.1
5.2
Hardware Interface .......................................................................................................... 10
FIRMWARE DESCRIPTION............................................................................................... 11
Custom Firmware............................................................................................................. 11
Software Interface............................................................................................................ 12
ABSOLUTE MAXIMUM RATINGS..................................................................................... 13
RECOMMENDED OPERATING CONDITIONS ................................................................. 13
DC ELECTRICAL CHARACTERISTICS ............................................................................ 14
DIGITAL I/O SPECIFICATIONS......................................................................................... 15
10
A/D CONVERTER CHARACTERISTICS ........................................................................... 16
11
AC ELECTRICAL CHARACTERISTICS ............................................................................ 16
11.1
TX Power Characteristics ................................................................................................ 18
12
PHYSICAL DIMENSIONS .................................................................................................. 19
13
SOLDERING TEMPERATURE TIME PROFILE (FOR REFLOW SOLDERING) .............. 20
13.1
13.2
For Leaded Solder ........................................................................................................... 20
For Lead-free Solder........................................................................................................ 20
14
PRODUCT LABEL DRAWING ........................................................................................... 21
15
RECOMMENDED FOOTPRINT ......................................................................................... 22
15.1
Example carrier board...................................................................................................... 23
16
RELIABILITY TESTS ......................................................................................................... 24
17
APPLICATION NOTES ...................................................................................................... 24
17.1
17.2
17.3
Safety Precautions........................................................................................................... 24
Design Engineering Notes ............................................................................................... 24
Storage Conditions .......................................................................................................... 25
©2010 Telegesis (UK) Ltd
-2-
ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
18
18.1
18.2
18.3
18.4
PACKAGING ...................................................................................................................... 25
Embossed Tape............................................................................................................... 25
Component Orientation.................................................................................................... 26
Reel Dimensions.............................................................................................................. 26
Packaging ........................................................................................................................ 26
19
ORDERING INFORMATION .............................................................................................. 27
20
TRADEMARKS................................................................................................................... 28
21
DISCLAIMER...................................................................................................................... 28
22
ROHS DECLARATION....................................................................................................... 28
23
DATA SHEET STATUS...................................................................................................... 28
24
LIFE SUPPORT POLICY.................................................................................................... 28
25
RELATED DOCUMENTS ................................................................................................... 29
26
CONTACT INFORMATION ................................................................................................ 29
©2010 Telegesis (UK) Ltd
-3-
ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
The Telegesis ETRX351-LR and ETRX357-LR modules
are low power 2.4GHz ZigBee modules with an added PA
and LNA for highest possible link budget.
Based on the latest Ember EM351 and EM357 single chip
ZigBeeTM solution the new long range modules are footprint
compatible with the ETRX351 and ETRX357, thus
representing a drop-in replacement for all applications
where a high link budget is required.
Image not shown actual size; enlarged to show detail.
The module’s unique AT-style command line interface
allows designers to quickly integrate ZigBee technology
without complex software engineering. For custom
application development the ETRX35x series integrates
with ease into Ember’s InSight development environment.
Module Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Small form factor, SMT module 25mm x 19mm
Side Castellations for easy soldering and inspection
2 antenna options: Integrated chip antenna or U.FL
coaxial connector
Industry’s first ARM® Cortex-M3 based family of ZigBee
modules
Industry standard JTAG Programming and real time
network level debugging via the Ember InSight Port
192kB (ETRX357) and 128kB (ETRX351) flash and
12kbytes of RAM
Lowest Deep Sleep Current of sub 1µA and multiple
sleep modes
Wide supply voltage range (2.1 to 3.5V)
32.768kHz watch crystal can be added externally
Module ships with standard Telegesis AT-style
command interface based on the ZigBee PRO feature
set
Can act as an End Device, Router or Coordinator
24 general-purpose I/O lines including analogue inputs
(all GPIOs of the EM35x are accessible)
Firmware upgrades via serial port or over the air
(password protected)
Hardware supported encryption (AES-128)
CE and FCC compliance, FCC modular approval
pending
Operating temperature range: -40°C to +85°C
Standard version without LNA and PA available in the
same form factor
Suggested Applications
•
•
•
•
•
•
•
•
AMR – ZigBee Smart Energy applications
Wireless Alarms and Security
Home/Building Automation
Wireless Sensor Networks
M2M Industrial Controls
Lighting and ventilation control
Remote monitoring
Environmental monitoring and control
Development Kit
•
•
•
New Development kit containing everything required to
set up a mesh network quickly and evaluate range and
performance of the ETRX35x and its long range
version.
AT-style software interface command dictionary can be
modified for high volume customers.
Custom software development available upon request.
Example AT-Style Commands
AT+BCAST
AT+UCAST:
AT+EN
AT+JN
Send a Broadcast
Send a Unicast
Establish PAN network
Join PAN
At power-up the last configuration is loaded from nonvolatile S-Registers, which can eliminate the need for an
additional host controller.
Radio Features
• Based on the Ember EM351 and EM357 single chip
TM
ZigBee / IEEE802.15.4 solutions
• 2.4GHz ISM Band
• 250kbit/s over the air data rate
• 16 channels (IEEE802.15.4 Channel 11 to 26)
• +18dBm output power (adjustable down to -21dBm)
• High sensitivity of -105dBm typ. @ 1% packet error rate
• RX Current: 28mA, TX Current: approx 100mA at
18dBm
• Robust Wi-Fi and Bluetooth coexistence
©2010 Telegesis (UK) Ltd
-4-
ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
1 Introduction
This document describes the Telegesis ETRX351-LR and ETRX357-LR ZigBee® long range
modules which have been designed to be easily integrated into another device and to provide a
fast, simple and low cost wireless mesh networking interface.
The Telegesis ETRX3 series modules are based on the Ember ZigBee® platform consisting of the
single chip EM351 or EM357 combined with the ZigBee PRO compliant EmberZNet meshing
stack. Integration into a wide range of applications is made easy using a simple AT style
command interface and advanced hardware design.
The configurable functionality of the Telegesis AT Commandset often allows the ETRX3 series
ZigBee modules to be used without an additional host microcontroller saving even more integration
time and costs. In addition to the Telegesis AT Commandset, the ETRX351-LR and ETRX357-LR
modules can be used with custom-built firmware and they represent an ideal platform for custom
firmware development in conjunction with the Ember development kits. The ETRX3 series shares
the same R3xx Telegesis firmware as the ETRX2 and the two devices can be used in the same
network.
No RF experience or expertise is required to add this powerful wireless networking capability to
your products. The ETRX351-LR and ETRX357-LR offer fast integration opportunities and the
shortest possible time to market for your product.
1.1
Hardware Description
The main building blocks of the ETRX351-LR and ETRX357-LR are the single chip EM351 and
EM357 from Ember, a Power Amplifier as well as a Low Noise Amplifier, a 24MHz reference
crystal and RF front-end circuitry optimized for best RF performance. The modules are available
with on-board antenna or alternatively a U.FL connector for attaching external antennae. Modules
with the U.FL connector are identified by the “HR” suffix.
The LNA and RF power amplifier of the LR devices improve the output power by 10dB and the
sensitivity by 5dB which will increase the range by approximately 600% relative to the standard
devices (where local regulations permit the use of the maximum output power).
The integrated antenna is an Antenova Rufa, and details of the radiation pattern etc are available
from the Antenova website [5].
Module
ETRX351-LR
ETRX351HR-LR
ETRX357-LR
ETRX357HR-LR
Chip
EM351
EM351
EM357
EM357
Flash
128kB
128kB
192kB
192kB
RAM
12kB
12kB
12kB
12kB
Table 1: Memories
The ETRX351-LR and ETRX357-LR are used for ZigBee® (www.zigbee.org) applications. If you
wish to create your own custom firmware, and not use the pre-loaded Telegesis AT-Command
interface, you will need the InSight toolchain, consisting of InSight Desktop™ together with a
comprehensive integrated development environment (IDE) and C-language compiler toolchain
from Ember. The Ember development environment is not suitable for an 802.15.4-only application
that does not use the ZigBee layer.
©2010 Telegesis (UK) Ltd
-5-
ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
2 Product Approvals
The ETRX351-LR and ETRX357-LR have been designed to meet all national regulations for worldwide use. In particular the following certifications have been obtained:
2.1
FCC Approvals
The Telegesis ETRX351-LR and ETRX357-LR with integrated Antenna has been tested to comply
with FCC CFR Part 15 (USA). The devices meet the requirements for modular transmitter
approval as detailed in the FCC public notice DA00.1407.transmitter.
This device complies with Part 15 of the FCC rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired
operation.
FCC ID: S4GEM35X2
While the applicant for a device into which the ETRX351-LR or ETRX357-LR or ETRX351HR-LR is
installed is not required to obtain a new authorization for the module, this does not preclude the
possibility that some other form of authorization or testing may be required for the end product.
The FCC requires the user to be notified that any changes or modifications made to this device
that are not expressly approved by Telegesis (UK) Ltd. may void the user's authority to operate the
equipment.
2.2
FCC Labelling Requirements
When integrating the ETRX351-LR or ETRX357-LR into a product if must be ensured that the FCC
labelling requirements are met. This includes a clearly visible label on the outside of the finished
product specifying the Telegesis FCC identifier (FCC ID: S4GEM35X2) as well as the notice
above. This exterior label can use wording such as “Contains Transmitter Module FCC ID:
S4GEM35X2” or “Contains FCC ID: S4GEM35X2” although any similar wording that expresses
the same meaning may be used.
2.3
IEEE 802.15.4
IEEE 802.15.4 is a standard for low data rate, wireless networks (raw bit-rate within a radio packet
of 250kbps @2.4GHz) which focuses on low cost, low duty cycle, long primary battery life
applications as well as mains-powered applications. It is the basis for the open ZigBee® Protocol.
2.4
The ZigBee® Protocol
The ZigBee® Protocol is a set of standards for wireless connectivity for use between any devices
over short to medium distances. The specification was originally ratified in December 2004, paving
the way for companies to start making low-power networks a reality.
ZigBee® uses an IEEE 802.15.4 radio specification running on the 2.4GHz band, plus three
additional layers for networking, security and applications. What makes the specification unique is
its use of a mesh network architecture which, in bucket chain style, passes data from one node to
the next until it lands at its destination. The network is self-healing and adapts its routing as link
quality changes or nodes move. Furthermore, nodes can be defined as End Devices which do not
act as routers, but can therefore be put into a low-power sleep state.
©2010 Telegesis (UK) Ltd
-6-
ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
The enhanced version of the ZigBee® standard (or ZigBee® 2006) was released in December
2006, adding new features and improvements to the only global wireless communication standard
enabling the development of easily deployable low-cost, low-power, monitoring and control
products for homes, commercial buildings and industrial plant monitoring. In 2007 the ZigBee
Alliance introduced the PRO featureset which offers advantages over earlier versions, including
•
•
•
•
•
Truly self healing mesh networking
Messages can now travel up to 30 hops
Source-Routing for improved point to multipoint message transmission
Improved security including Trust-Centre link keys
New message types and options
The Telegesis AT Commandset, which by default ships on all ETRX3 series products is based on
the ZigBee PRO featureset. For more information on the Telegesis AT Commandset please refer
to the separate documentation at www.telegesis.com.
©2010 Telegesis (UK) Ltd
-7-
ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
3 Module Pinout
Figure 1: ETRX3 series Module Pinout (top view)
The table below gives details about the pin assignment for direct SMD soldering of the ETRX3
series modules to the application board. For more information on the alternate functions please
refer to [2]. Also refer to the Telegesis AT Commandset documentation to understand how the preprogrammed firmware makes use of the individual I/Os.
All GND pads are connected within the module, but for best RF performance all of them should be
grounded externally.
ETRX35x
pad
Designation
Normal
function
10
11
12
13
14
15
16
17
18
19
20
21
GND
PC5 {1}
PC6
PC7
PA7 {4}
PB3 {2}
nReset
PB4 {2}
PA0
PA1
PA2
PA3
GND
PA4
PA5 {3}
PA6 {4}
PB1
PB2
GND
GND
JTCK
GND
I/O
I/O
I/O
I/O
I/O
nReset
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
TXD
RXD
GND
GND
JTCK
©2010 Telegesis (UK) Ltd
Alternate
function
CTS
RTS
EM35x
pin
GND
11
13
14
18
19
12
20
21
22
24
25
GND
26
27
29
30
31
GND
GND
32
-8-
Ember designation
TX_ACTIVE
OSC32B, nTX_ACTIVE
OSC32A, OSC32_EXT
TIM1C4
SC1nCTS, SC1SCLK, TIM2C3
TIM2C4, SC1nRTS, SC1nSSEL
TIM2C1, SC2MOSI
TIM2C3, SC2SDA, SC2MISO
TIM2C4, SC2SCL, SC2SCLK
SC2nSSEL, TRACECLK, TIM2C2
ADC4, PTI_EN, TRACEDATA
ADC5, PTI_DATA, nBOOTMODE, TRACEDATA3
TIM1C3
SC1MISO, SC1MOSI, SC1SDA, SC1TXD, TIM2C1
SC1MISO, SC1MOSI, SC1SCL, SC1RXD, TIM2C2
SWCLK
ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
ETRX35x
pad
Designation
Normal
function
22
23
24
25
26
27
28
29
30
31
32
33
PC2
PC3
PC4
PB0
PC1
PC0 {4}
PB7 {4}
PB6 {4}
PB5
GND
Vcc
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
Vcc
GND
Alternate
function
ADC3
ADC2
ADC1
ADC0
EM35x
pin
33
34
35
36
38
40
41
42
43
GND
Vcc
GND
Ember designation
JTDO, SWO
JTDI
JTMS, SWDIO
VREF, IRQA, TRACECLK, TIM1CLK, TIM2MSK
ADC3, SWO, TRACEDATA0
JRST, IRQD, TRACEDATA1
ADC2, IRQC, TIM1C2
ADC1, IRQB, TIM1C1
ADC0, TIM2CLK, TIM1MSK
Table 2. Pin Information
Alternate functions depend on the firmware, but the R3xx functions are indicated here for
convenience.
Notes:
{1} PC5 is not usable on these long range versions of the ETRX35x as this GPIO is used as
TX_ACTIVE to control the external RF frontend.
{2} When using the Telegesis AT Commandset, RTS/CTS handshaking is selectable in firmware. See
the AT Command Manual.
{3} If PA5 is driven low at power-up or reset the module will boot up in the bootloader
{4} PA6, PA7, PB6, PB7 and PC0 can drive high current (see section 9)
©2010 Telegesis (UK) Ltd
-9-
ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
4 Hardware Description
Vcc
Vreg
I/O
LDO
1V8
1,8Vdc
integrated
antenna
Switch
LDO
1V25
A/D
EM35x
PA
Balun
RESET
LNA
Balun
rf
U.FL socket terminal
selection,
filtering and
matching
circuitry
I/O
UART
JTAG
RESET
programming
24MHz
Figure 2: Hardware Diagram
The ETRX351-LR and ETRX357-LR are based on the Ember EM351 and EM357 respectively in
addition to a discrete PA, LNA and RF switch added to the RF-Frontend. The EM351 and EM357
are fully integrated 2.4GHz ZigBee transceivers with a 32-bit ARM® Cortex M3TM microprocessor,
flash and RAM memory, and peripherals.
The industry standard serial wire and JTAG programming and debugging interfaces together with
the standard ARM system debug components help to streamline any custom software
development.
In addition to this a number of MAC functions are also implemented in hardware to help maintain
the strict timing requirements imposed by the ZigBee and IEEE802.15.4 standards.
The new advanced power management features allow faster wakeup from sleep and new power
down modes allow this 3rd generation module to offer a longer battery life than any 2nd generation
modules on the market.
The EM35x has fully integrated voltage regulators for both required 1.8V and 1.25V supply
voltages. The voltages are monitored (brown-out detection) and the built in power-on-reset circuit
eliminates the need for any external monitoring circuitry. A 32.768kHz watch crystal can be
connected externally to pads 3 and 4 in case more accurate timing is required.
4.1
Hardware Interface
All GPIO pins of the EM351 or EM357 are accessible on the module’s pads. Whether signals are
used as general purpose I/Os, or assigned to a peripheral function like ADC is set by the firmware.
When using the Telegesis AT Commandset please refer to the AT Commandset manual for this
information and when developing custom firmware please refer to the EM35x datasheet.
©2010 Telegesis (UK) Ltd
- 10 -
ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
5 Firmware Description
The modules will be pre-loaded with a standalone bootloader which supports over-the-air
bootloading as well as serial bootloading of new firmware.
In order to enter the standalone bootloader using a hardware trigger pull PA5 to ground and
power-cycle or reset the module. To avoid entering the standalone bootloader unintentionally
make sure not to pull this pin down during boot-up unless the resistance to ground is >10kΩ. (A
pull-up is not required).
In addition to the standalone bootloader the modules also contain the current release of the
Telegesis AT-style command interface as described in the Telegesis AT command dictionary and
the Telegesis user guide. Check www.telegesis.com for updates. Each module comes with a
unique 64-bit 802.15.4 identifier which is stored in non-volatile memory. The commands and
responses pass through the serial port of the ETRX35x-LR as ASCII text, so a simple terminal
application will usually suffice. We provide Telegesis Terminal but it is not an essential feature.
The pre-loaded AT-style command interface firmware is based on the latest EmberZNet meshing
stack which implements routers/coordinators as well as (sleepy) end devices. [End devices have
no routing responsibility and therefore are allowed to go to sleep, whilst still being able to send and
receive messages via a parent router. In addition to a classical (sleepy) end device the module
firmware also supports mobile (sleepy) end devices capable of changing their parent quickly
whenever they change their position within the network.]
A router is typically a mains powered device whilst a sleepy end device (SED) can be battery
powered.
The module is also able to act as a PAN coordinator and Trust Centre through external host
control. The AT style command line supplies all the tools required to set up and manage a ZigBee
network by allowing easy access to the low-level functionality of the stack.
The Telegesis firmware uses the meshing and self healing EmberZNet PRO stack to overcome
many of the limitations of the tree network topology of the ZigBee® 2006 stack by using the ZigBee
PRO featureset.
The Telegesis firmware also allows low-level access to physical parameters such as channel and
power level. Parameters that define the functionality of the ETRX35x module and also allow
standalone functionality are saved in non-volatile memory organised in so-called S-Registers. The
SPI and I2C buses are not supported by the current firmware release, but can be used with custom
firmware.
5.1
Custom Firmware
For high volume customers the firmware can be customised on request. Customers can use the
ETRX35x module as hardware only and develop their own firmware based on the EmberZNet
stack. In order to develop custom firmware the Ember Insight toolchain is required.
©2010 Telegesis (UK) Ltd
- 11 -
ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
5.2
Software Interface
Using the default firmware the ETRX35x-LR is controlled using a simple AT-style command
interface and (mostly) non-volatile S-Registers. In order to get a full listing of all the available ATCommands, please refer to the AT command dictionary document which corresponds to the
firmware revision you intend to use.
In addition to the command dictionary there are user guides explaining the features of the firmware
in more detail. If you need to find out which firmware resides on your module simply type “ATI”
followed by a carriage return and you will be prompted with the module’s manufacturing
information.
The Development Kit manual describes how to upgrade the firmware either via a serial link or over
the air.
©2010 Telegesis (UK) Ltd
- 12 -
ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
6 Absolute Maximum Ratings
Supply:
Inputs:
Operating temperature:
3.5V
-0.3V to Vcc + 0.3V
-40 to 85°C
No.
Item
Symbol
Absolute Maximum Ratings
Unit
Supply voltage
Voltage on any I/O[11:0] ,
SIF_CLK, SIF_MISO, SIF_MOSI,
SIF_LOADB, RESET
Storage temperature range
Operating temperature range
Input RF level
ESD on any pin {1} according to
Human Body Model (HBM) circuit
description
Reflow temperature
VCC
-0.3 to +3.5
Vdc
Vin
-0.3 to VCC +0.3
Vdc
Tstg
Top
Pmax
-40 to +105
-40 to +85
15
°C
°C
dBm
VTHHBM
±2
kV
TDeath
Please refer to chapter 13
°C
Table 3. Absolute Maximum Ratings
Note:
{1} Input must be current limited to the value specified.
The absolute maximum ratings given above should under no circumstances be violated.
Exceeding one or more of the limiting values may cause permanent damage to the device.
Caution! ESD sensitive device. Precautions should be used when handling the device
in order to prevent permanent damage.
7 Recommended Operating Conditions
No.
Condition /
Remark
Item
Symbol
Value
Min
Supply voltage
RF Input Frequency
RF Input Power
Operating temperature
range
Typ
Unit
Max
VCC
fC
pIN
2.1
2405
3.5
2480
Vdc
MHz
dBm
Top
-40
+85
°C
Table 4. Recommended Operating Conditions
©2010 Telegesis (UK) Ltd
- 13 -
ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
8 DC Electrical Characteristics
VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated
No.
Condition /
Remark
Item
Symbol
Value
Min
10
11
12
13
14
15
16
Module supply voltage
Quiescent current,
internal RC oscillator
disabled
Quiescent current,
internal RC oscillator
enabled
Quiescent current,
including
32.768kHz oscillator
Transmit current
consumption
Transmit Current
consumption
BOOST MODE
Transmit current
consumption
Receive current
consumption
Receive current
consumption
Receive current
consumption
BOOST MODE
Receive current
consumption
BOOST MODE
MCU, RAM and flash,
radio off
MCU, RAM and flash,
radio off
Serial Controller
Timer
ADC
17
Wake time from deep
sleep
18
Shutdown time
VCC
Unit
Typ
2.1
Max
3.5
Vdc
ISLEEP
2.4
µA
ISLEEP
2.8
µA
ISLEEP
3.3
µA
ITXVCC
90
mA
ITXVCC
100
mA
ITXVCC
tbd
mA
IRX
30
mA
IRX
31
mA
Total, 12MHz
clock speed
IRX
31
mA
Total, 24MHz
clock speed
IRX
32
mA
IMCU
mA
IMCU
mA
ISC
ITMR
IADC
0.2
0.25
1.1
mA
mA
mA
100
µs
µs
at +18dBm
module output
power
at +18dBm
module output
power
at min. module
output power
Total, 12MHz
clock speed
Total, 24MHz
clock speed
12MHz clock
speed
24MHz clock
speed
Max data rate
Max clock rate
Max sample rate
From wakeup
event to 1st
instruction
From last
instruction into
deep sleep
Table 5. DC Electrical Characteristics
Please Note: The average current consumption during operation is dependent on the firmware
and the network load, therefore these figures are given in the command dictionary of the
respective firmware.
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
9 Digital I/O Specifications
The digital I/Os of the ETRX35x module have the ratings shown below.
VCC = 3.0V, TAMB = 25°C, NORMAL MODE unless otherwise stated
No.
Condition /
Remark
Item
Symbol
Value
Min
Low Schmitt switching
threshold
High Schmitt switching
threshold
Schmitt input
threshold going
from high to low
Schmitt input
threshold going
from low to high
Input current for logic 0
Input current for logic 1
Input Pull-up resistor
value
Input Pull-down resistor
value
Output voltage for logic 0
Output voltage for logic 1
Output Source Current
10
Output Sink current
11
12
13
Output Source Current
Output Sink current
Total output current
Typ
Max
VSWIL
0.42 x VCC
0.5 x VCC
Vdc
VSWIH
0.62 x VCC
0.8 x VCC
MHz
-0.5
0.5
µA
µA
IIL
IIH
IOL = 4mA (8mA) for
standard (high
current) pads
IOH = 4mA (8mA)for
standard (high
current) pads
Standard current
pad
Standard current
pad
High current pad
High current pad
Unit
RIPU
24
29
34
kΩ
RIPD
24
29
34
kΩ
VOL
0.18 x VCC
VOH
0.82 x VCC
VCC
IOHS
mA
IOLS
mA
IOHH
IOLH
IOH + IOL
40
mA
mA
mA
Table 6. Recommended Operating Conditions
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
10 A/D Converter Characteristics
The ADC is a first-order sigma-delta converter. For additional information on the ADC please refer
to section 10 of the EM35x datasheet.
No.
Item
A/D resolution
A/D sample time for 5-bit conversion
A/D sample time for 12-bit conversion
Reference Voltage
Up to 12 bits
5.33µs
682µs
1.25V or Vcc
Table 7. A/D Converter Characteristics
11 AC Electrical Characteristics
VCC = 3.0V, TAMB = 25°C, NORMAL MODE measured at 50Ω terminal load connected to the U.FL socket
No.
Receiver
Min
10
11
12
13
14
15
16
17
18
19
20
Frequency range
Sensitivity for 1% Packet Error Rate (PER)
Sensitivity for 1% Packet Error Rate (PER) BOOST MODE
Saturation (maximum input level for correct operation)
High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
2nd High-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
2nd Low-Side Adjacent Channel Rejection
(1% PER and desired signal –82dBm acc. to [1])
Channel Rejection for all other channels
(1% PER and desired signal –82dBm acc. to [1])
802.11g rejection centred at +12MHz or –13MHz
(1% PER and desired signal –82dBm acc. to [1])
Co-channel rejection
(1% PER and desired signal –82dBm acc. to [1])
Relative frequency error
(2x40ppm required by [1])
Relative timing error
(2x40ppm required by [1])
Linear RSSI range
Output power at highest power setting
NORMAL MODE
BOOST MODE
Output power at lowest power setting
Error vector magnitude as per IEEE802.15.4
Carrier frequency error
PSD mask relative
3.5MHz distance from carrier
PSD mask absolute
3.5MHz distance from carrier
2400
-106
-106
Value
Typ
Unit
Max
-105
-105
2500
-99
-100
MHz
dBm
dBm
dBm
35
dB
35
dB
43
43
40
dB
35
dB
-6
dBc
-120
120
ppm
-120
120
ppm
35
16
17
dB
18
18
tbd
-40
19
19
15
40
dBm
dBm
ppm
-20
dB
-30
dBm
Table 8. AC Electrical Characteristics
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
Please Note: For the relationship between EM35x power settings and module output power
please relate to chapter 11.1 of this document. When developing custom firmware the output
power settings described in this document relate directly to the EM35x power settings accessible
via the Ember stack API.
No.
Synthesiser Characteristics
Limit
Typ
Min
22
23
24
25
26
27
28
29
Frequency range
Frequency resolution
Lock time from off state, with correct VCO DAC settings
Relock time, channel change or Rx/Tx turnaround
Phase noise at 100kHz offset
Phase noise at 1MHz offset
Phase noise at 4MHz offset
Phase noise at 10MHz offset
2400
11.7
Unit
Max
2500 MHz
kHz
100 µs
100 µs
-71dBc/Hz
-91dBc/Hz
-103dBc/Hz
-111dBc/Hz
Table 9. Synthesiser Characteristics
No.
30
31
Power On Reset (POR) Specifications
VCC POR release
VCC POR assert
Min
Limit
Typ
Max
Unit
0.62
0.45
0.95
0.65
1.2
0.85
Limit
Typ
Max
Vdc
Vdc
Table 10. Power On Reset Specifications
No.
nRESET Specifications
Min
32
33
34
Reset Filter Time constant
Reset Pulse width to guarantee a reset
Reset Pulse width guaranteed not to cause reset
2.1
26
12
Unit
16
µs
µs
µs
Table 11. nReset Specifications
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
11.1 TX Power Characteristics
Important Note: For Band edge compliance it is required to limit the output power out of the
EM357 on channel 26 to a setting of -22dBm. Because of this it is recommended to not use
channel 26 on the ETRX35x-LR modules as the range will be significantly reduced on this channel.
The diagrams below show the typical output power and module current in dependency on module
supply voltage and EM35x power setting in NORMAL MODE and BOOST MODE.
t.b.d
Figure 3. Output Power vs. Power Setting
t.b.d
Figure 4. Output Power vs. Power Setting
t.b.d
Figure 5. Module Current vs. Power Setting
t.b.d
Figure 6. Output Power vs. Power Setting (BOOST MODE)
t.b.d
Figure 7. Module Current vs. Power Setting (BOOST MODE)
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
12 Physical Dimensions
Figure 8. ETRX3 Physical Dimensions
Symbol
Explanation
Distance
A1
A2
R1
R2
X1
X2
Length of the module
Width of the module
Height of the module
Distance centre of pad PCB edge
Pitch
Keep-out Zone from corner of PCB
Keep-out Zone from corner of PCB
Distance centre of Antenna connector PCB edge
Distance centre of Antenna connector PCB edge
25.0mm
19.0mm
3.0mm
0.9mm
1.27mm
17.5mm
4.1mm
3.8mm
2.8mm
Table 12. ETRX3 Physical Dimensions
For ideal RF performance when using the on-board antenna, the antenna should be located at the
corner of the carrier PCB. There should be no components, tracks or copper planes in the “keepout” area which should be as large as possible. When using the U.FL RF connector the “keep-out”
area doesn’t have to be kept. NB: The module transmit/receive range will depend on the antenna
used and also the housing of the finished product.
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
13 Soldering Temperature Time Profile (for reflow soldering)
13.1 For Leaded Solder
10 ±1s
Recommended temp. profile
for reflow soldering
30 +20/-10s
235°C max.
Temp.[°C]
220 ±5°C
200°C
150 ±10°C
90 ±30s
Time [s]
Figure 9. Temperature Profile for Lead Solder
13.2 For Lead-free Solder
Our used temp. profile
for reflow soldering
Temp.[°C]
30 +20/-10s
230°C -250°C max.
220°C
150°C – 190°C
90 ±30s
Time [s]
Figure 10. Temperature Profile for Lead-free Solder
NB:
Maximum Reflow Cycles: 2
Opposite-side reflow is prohibited due to the module’s weight. (i.e. you must not place the
module on the bottom / underside of your pcb and re-flow).
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
14 Product Label Drawing
Figure 11. Product Label
The label dimensions are 17.0mm x 17.0 mm. The label will withstand temperatures used during
reflow soldering. The characters “HR” are only present on the versions with the Hirose connector,
Imprint
ETRX357-LR
000001
090101
01
02
FCC ID: S4GEM35X2
2D-Barcode
Description
Module Order code
Indication for the serial number.
Production Date Code in the format YYMMDD, e.g. 090602
Indication for batch number
Indication for the hardware revision
FCC ID code for this product
Information in the Datamatrix 2D-Barcode are the serial number [6 characters], the Part-Order
code [12 characters], identifier for the batch number [2 characters], the identifier for the
hardware release [2 characters] and the production date code in the format Year-Month-Day
[6 characters], separated by a semicolon.
Table 13. ETRX35x-LR Label Details
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
15 Recommended Footprint
In order to surface mount a ETRX3 series module, we recommend that you use pads which are
1mm wide and 1.2mm high. You must retain the “keep-out” zone shown in section 12, and ensure
that this area is free of copper tracks and/or copper planes/layers.
You must also ensure that there is no exposed copper on your layout which may contact with the
backside of the ETRX3 series module.
For best RF performance it is required to provide good ground connections to the ground pads of
the module. It is recommended to use multiple vias between each ground pad and a solid ground
plane to minimize inductivity in the ground path.
Figure 12. Recommended Footprint
The land pattern dimensions above serve as a guideline.
We recommend that you use the same pad dimensions for the solder paste screen as you have for
the copper pads. However these sizes and shapes may need to be varied depending on your
soldering processes and your individual production standards. We recommend a paste screen
thickness of 120µm to 150µm.
Although the undersides of the ETRX3 series modules are fully coated, no exposed copper, such
as through-hole vias, planes or tracks on your board component layer, should be located below the
ETRX3 series module in order to avoid ‘shorts’. All ETRX3 series modules use a multilayer PCB
containing an inner RF shielding ground plane, therefore there is no need to have an additional
copper plane directly under the ETRX3 series module.
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
15.1 Example carrier board
Since the RF performance of the module with the on board antenna is strongly dependent on the
proper location of the module on its carrier board, Figure 13 shows the reference carrier board
which was used during testing by Telegesis.
Figure 13. Reference Board
For best performance it is recommended to locate the antenna towards the corner of the carrier
board and to respect the recommended keep-out areas as described in section 12.
Finally to provide a good reference ground to the on board antenna, the carrier board should have
a ground plane spanning no less than 40 x 40mm. In many cases a smaller ground plane will
suffice, but a degradation in radio performance could be the result.
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
16 Reliability Tests
The measurements will be conducted after the module has been exposed to standard room
temperature and humidity for 1 hour.
No
Item
Limit
Condition
Vibration test
Electrical parameter should be
in specification
Shock test
the same as the above
Heat cycle test
the same as the above
Moisture test
Low temp. test
High temp. test
the same as the above
the same as the above
the same as the above
a) Freq.:10~50Hz,Amplitude:1.5mm
a) 20min. / cycle,1hrs. each of XYZ axis
b) Freq.:30~100Hz, 6G
b) 20min. / cycle,1hrs. each of XYZ axis
Dropped onto hard wood from height of
50cm for 3 times
-40°C for 30min. and +85°C for 30min.;
each temperature 300 cycles
+60°C, 90% RH, 300h
-40°C, 300h
+85°C, 300h
Table 14. Reliability Tests
17 Application Notes
17.1 Safety Precautions
These specifications are intended to preserve the quality assurance of products as individual
components.
Before use, check and evaluate their operation when mounted on your products. Abide by
these specifications when using the products. These products may short-circuit. If electrical
shocks, smoke, fire, and/or accidents involving human life are anticipated when a short
circuit occurs, then provide the following failsafe functions as a minimum:
(1)
Ensure the safety of the whole system by installing a protection circuit and a protection
device.
(2)
Ensure the safety of the whole system by installing a redundant circuit or another
system to prevent a single fault causing an unsafe status.
17.2 Design Engineering Notes
(1)
Heat is the major cause of shortening the life of these products. Avoid assembly and
use of the target equipment in conditions where the product’s temperature may exceed
the maximum allowable.
(2)
Failure to do so may result in degrading of the product’s functions and damage to the
product.
(3)
If pulses or other transient loads (a large load applied in a short time) are applied to the
products, before use, check and evaluate their operation when assembled onto your
products.
(4)
These products are not intended for other uses, other than under the special conditions
shown below. Before using these products under such special conditions, check their
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
performance and reliability under the said special conditions carefully, to determine
whether or not they can be used in such a manner.
(5)
In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where
liquid may splash.
(6)
In direct sunlight, outdoors, or in a dusty environment
(7)
In an environment where condensation occurs.
(8)
In an environment with a high concentration of harmful gas (e.g. salty air, HCl, Cl2,
SO2, H2S, NH3, and NOx)
(9)
If an abnormal voltage is applied due to a problem occurring in other components or
circuits, replace these products with new products because they may not be able to
provide normal performance even if their electronic characteristics and appearances
appear satisfactory.
(10) Mechanical stress during assembly of the board and operation has to be avoided.
(11) Pressing on parts of the metal cover or fastening objects to the metal cover is not
permitted.
17.3 Storage Conditions
(1)
The module must not be stressed mechanically during storage.
(2)
Do not store these products in the following conditions or the performance
characteristics of the product, such as RF performance, may well be adversely
affected:
(3)
Storage in salty air or in an environment with a high concentration of corrosive gas,
such as Cl2, H2S, NH3, SO2, or NOX
(4)
Storage in direct sunlight
(5)
Storage in an environment where the temperature may be outside the range of 5°C to
35°C range, or where the humidity may be outside the 45 to 85% range.
(6)
Storage (before assembly of the end product) of the modules for more than one year
after the date of delivery at your company even if all the above conditions (1) to (3)
have been met, should be avoided.
18 Packaging
18.1 Embossed Tape
(1)
Dimension of the tape
t.b.d.
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
(2)
Cover tape peel force
Force direction
Speed = 300mm/min.
θ = 10deg
Cover tape peel force
=0.098～0.68N (10～70g)
(3)
Empty pockets
Direction of
Empty pockets
Components Empty pockets Top cover
NB: Empty pockets in the component packed area will be less than two per reel and those empty
pockets will not be consecutive.
18.2 Component Orientation
Top cover tape will not obstruct the carrier tape holes and will not extend beyond the edges of the
carrier tape
(top view)
Part No.
Direction
Component Orientation
18.3 Reel Dimensions
(4)
Quantity per reel: 400 pieces
(5)
Marking: Part No. / Quantity / Lot No. and manufacturer part# with bar-code will be on
the reel
t.b.d.
18.4 Packaging
(6)
Each reel will be packed in a hermetically-sealed bag
(7)
Marking :
Part No. / Quantity / Lot No. and manufacturer part# with bar-code
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
19 Ordering Information
Ordering/Product Code
Description
ETRX351-LR
ETRX357-LR
Telegesis Long Range ZigBee Module with Ember ZigBee®
Technology:
•
•
•
•
ETRX3DVK
Based on Ember EM351 or EM357
Telegesis AT Style Command Interpreter and
EmberZNet3.xx meshing and self-healing ZigBee PRO
stack
Integrated 2.4GHz Antenna
Telegesis Development Kit with:
•
•
•
•
•
•
•
•
•
3 x USB Development Boards
3 x USB Cable
2 x ETRX35x on Carrier-Board
2 x ETRX35xHR on Carrier-Board
2 x ETRX35x-LR on Carrier-Board
2 x ETRX35xHR-LR on Carrier-Board
1 x ETRX2USB stick
2 x Large Antenna
2 x Small Stubby Antenna
Notes:
• Customers’ PO’s must state the Ordering/Product Code.
• There is no “blank” version of the ETRX35x-LR modules available. All Modules are preprogrammed with the Telegesis AT style command interpreter based on the EmberZNet
stack. (Where customers wish to add their own firmware they can erase and write it to the
flash memory of the EM35x).
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
20 Trademarks
All trademarks, registered trademarks and products names are the sole property of their respective
owners.
21 Disclaimer
Product and company names and logos referenced may either be trademarks or registered
trademarks of their respective companies. We reserve the right to make modifications and/or
improvements without prior notification. All information is correct at time of issue. Telegesis (UK)
Ltd does not convey any license under its patent rights or assume any responsibility for the use of
the described product
22 RoHS Declaration
Declaration of environmental compatibility for supplied products:
Hereby we declare to our best present knowledge based on the declaration of our suppliers that
this product does not contain the following substances which are banned by Directive 2002/95/EC
(RoHS) or if they do, contain a maximum concentration of 0,1% by weight in homogeneous
materials for:
•
•
•
•
•
Lead and lead compounds
Mercury and mercury compounds
Chromium (VI)
PBB (polybrominated biphenyl) category
PBDE (polybrominated biphenyl ether) category
And a maximum concentration of 0.01% by weight in homogeneous materials for:
•
Cadmium and cadmium compounds
23 Data Sheet Status
Telegesis (UK) Ltd. reserves the right to change the specification without notice, in order to
improve the design and supply the best possible product. Please consult the most recently issued
data sheet before initiating or completing a design.
24 Life Support Policy
This product is not designed for use in life support appliances, devices, or systems where
malfunction can reasonably be expected to result in a significant personal injury to the user, or as a
critical component in any life support device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or system, or to affect its safety or
effectiveness. Customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Telegesis (UK) Ltd. for any damages resulting.
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
ETRX351-LR AND ETRX357-LR
25 Related Documents
[1]
IEEE Standard 802.15.4 –2003 Wireless Medium Access Control (MAC) and Physical
Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LRWPANs)
[2]
Datasheet EM35x, Ember. (www.ember.com)
[3]
Datasheet U.FL-Series 2004.2 Hirose Ultra Small Surface Mount Coaxial Connectors Low Profile 1.9mm or 2.4mm Mated Height
[4]
The ZigBee® specification (www.zigbee.org)
[5]
Specification for Antenova Rufa Antenna (www.antenova.com)
26 Contact Information
Website:
E-mail
www.telegesis.com
sales@telegesis.com
Telegesis (UK) Limited
Abbey Barn Business Centre
Abbey Barn Lane
High Wycombe
Bucks
HP10 9QQ
UK
Tel: +44 (0)1494 510199
Fax: +44 (0)5603 436999
©2010 Telegesis (UK) Ltd
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ETRX35x-LR Preliminary Product Manual
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