Simcom 1103022011008 GSM/GPRS/EDGE/WCDMA/HSDPA module User Manual SIM5320 HD V1 01

Shanghai Simcom Ltd. GSM/GPRS/EDGE/WCDMA/HSDPA module SIM5320 HD V1 01

User Manual

SIM5320A_Hardware Design_V1.01
Smart Machine Smart Decision Document Title SIM5320A Hardware Design Version 1.01 Date 2011-2-29 Status Release Document Control ID SIM5320A_Hardware Design_V1.01 General Notes SIMCom offers this information as a service to its customers, to support application and engineering efforts that use the products designed by SIMCom. The information provided is based upon requirements specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search for additional relevant information, including any information that may be in the customer’s possession. Furthermore, system validation of this product designed by SIMCom within a larger electronic system remains the responsibility of the customer or the customer’s system integrator. All specifications supplied herein are subject to change. NOTICE: This device complies with Part 15 of the FCC Rules [and with RSS-210 of Industry Canada]. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications made to this equipment not expressly approved by SIMCOM may void the FCC authorization to operate this equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. This Class [B] digital apparatus complies with Canadian ICES-003. Cet appareil numérique de la classe [B] est conforme à la norme NMB-003 du Canada.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 3 Radiofrequency radiation exposure Information: The module does not contain antenna. It has an antenna PIN. The module is to be used in mobile or fixed applications only. For other antenna(s) selection, the antenna gain including cable loss must not exceed 7.2 dBi in the 850 MHz Cellular band and 3.5 dBi in the PCS 1900 MHz band, for the purpose of satisfying the requirements of FCC 2.1043 and 2.1091. The antenna used for this module must be installed to provide a separation distance of at least 20 cm from all persons, and must not be co-located or operating in conjunction with other antennas or transmitters within a host device, except in accordance with FCC multi-transmitter product procedures. Compliance of this module in all final product configurations is the responsibility of the Grantee. OEM integrators must be provided with specific information required to satisfy RF exposure compliance for all final host devices and installations. OEM integrators can replace the antenna by themselves. They should comply with Consideration for antenna selection and Consideration for antenna installation. Copyright This document contains proprietary technical information which is the property of SIMCom Limited, copying of this document and giving it to others and the using or communication of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of damages. All rights reserved in the event of grant of a patent or the registration of a utility model or design. All specification supplied herein are subject to change without notice at any time. Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2011
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 4Contents Revision History ........................................................................................................................................ 10 1 Introduction .........................................................................................................................................11 1.1 Product Outline...............................................................................................................................11 1.2 Hardware Interface Overview.........................................................................................................11 1.3 Hardware Diagram......................................................................................................................... 12 1.4 Functional Overview...................................................................................................................... 12 2 Package Information.......................................................................................................................... 14 2.1 Pin Configuration........................................................................................................................... 14 2.2 Pin description ............................................................................................................................... 16 2.3 Package Dimensions...................................................................................................................... 19 2.4 Footprint Recommendation ........................................................................................................... 20 3 Application Interface Specification................................................................................................... 21 3.1 Power Supply................................................................................................................................. 21 3.1.1 Power Supply Pin.................................................................................................................... 21 3.1.2 Design Guide .......................................................................................................................... 22 3.1.3 RTC Backup............................................................................................................................ 25 3.2 Power on/off Time Sequence ......................................................................................................... 27 3.2.1 Power on Sequence ................................................................................................................. 27 3.2.2 Power off Sequence ................................................................................................................ 28 3.3 UART Interface.............................................................................................................................. 30 3.3.1 Pin Description........................................................................................................................ 31 3.3.2 Application Guide................................................................................................................... 31 3.4 Audio Interfaces............................................................................................................................. 32 3.4.1 Pin Description........................................................................................................................ 33 3.4.2 Design Guide .......................................................................................................................... 33 3.4.3 Audio Parameter Characteristic .............................................................................................. 35 3.5 USIM Interface .............................................................................................................................. 36 3.5.1 Pin description ........................................................................................................................ 36 3.5.2 Application Guide................................................................................................................... 36 3.5.3 Recommend Components ....................................................................................................... 37 3.6 I2C Interface .................................................................................................................................. 38 3.6.1 Pin Description........................................................................................................................ 39 3.6.2 Signal Description................................................................................................................... 39 3.6.3 Design Guide .......................................................................................................................... 39 3.7 Keypad Interface............................................................................................................................ 39 3.7.1 Pin Description........................................................................................................................ 39 3.7.2 Application Guide................................................................................................................... 40 3.8 USB Interface ................................................................................................................................ 41 3.8.1 Application Guide................................................................................................................... 41 3.9 SPI Interface .................................................................................................................................. 42 3.9.1 Pin Description........................................................................................................................ 42
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 53.10 GPIO Interface ........................................................................................................................... 43 3.10.1 Pin Description .................................................................................................................... 43 3.10.2 Application Guide ............................................................................................................... 44 3.11 PCM Interface ............................................................................................................................ 46 3.11.1 Pin Description .................................................................................................................... 46 3.11.2 Signal Description ............................................................................................................... 46 3.12 Global Positioning System ......................................................................................................... 50 3.12.1 Technical specification ........................................................................................................ 50 3.12.2 Operate Mode ...................................................................................................................... 50 3.12.3 Application Guide ............................................................................................................... 51 3.13 Multi-functional interface........................................................................................................... 52 3.13.1 Sink Current Source ............................................................................................................ 52 3.13.2 Reset Function..................................................................................................................... 53 3.13.3 ADC..................................................................................................................................... 54 3.13.4 LDO..................................................................................................................................... 55 4 RF Specification.................................................................................................................................. 55 4.1 RF Specification ............................................................................................................................ 55 4.2 Operating Specification ................................................................................................................. 56 4.3 Antenna Design Guide................................................................................................................... 57 5 Reliability and Operating Characteristics........................................................................................ 59 5.1 Electronic Characteristics .............................................................................................................. 59 5.2 Operating Mode ............................................................................................................................. 59 5.2.1 Operating Modes Overview.................................................................................................... 60 5.2.2 Minimize Power Consumption ............................................................................................... 61 5.3 Current Consumption..................................................................................................................... 61 5.4 EMC and ESD Notes ..................................................................................................................... 64 6 Guide for Production.......................................................................................................................... 65 6.1 Top and Bottom View of SIM5320A ............................................................................................ 65 6.2 Typical Solder Reflow Profile ....................................................................................................... 65 6.3 Moisture Sensitivity Level (MSL)................................................................................................. 66 6.4 Stencil Foil Design Recommendation ........................................................................................... 66 6.5 Recommended Pad Design ............................................................................................................ 67 Appendix .................................................................................................................................................... 68 A. System Design..................................................................................................................................... 68 B. SIM5320A GPIOs List........................................................................................................................ 69 C. Digital I/O Characteristics................................................................................................................... 69 D. Related Documents ............................................................................................................................. 70 E. Terms and Abbreviations..................................................................................................................... 71 F. Safety Caution...................................................................................................................................... 74
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 6Table Index Table 1: SIM5320A series frequency bands.................................................................................................................... 11 Table 2: General Feature ................................................................................................................................................. 12 Table 3: Pin definition..................................................................................................................................................... 15 Table 4: Pin description................................................................................................................................................... 16 Table 5: Pin description................................................................................................................................................... 21 Table 6: Temperature table.............................................................................................................................................. 24 Table 7: Power on timing................................................................................................................................................ 28 Table 8: Power off timing ............................................................................................................................................... 29 Table 9: Pin description................................................................................................................................................... 31 Table 10: Logic level....................................................................................................................................................... 31 Table 11: Pin description................................................................................................................................................. 33 Table 12: MIC input characteristics ................................................................................................................................ 33 Table 13: Audio output characteristics ............................................................................................................................ 33 Table 14: Speaker output characteristics......................................................................................................................... 33 Table 15: Audio parameter.............................................................................................................................................. 35 Table 16: Electronic characteristic .................................................................................................................................. 36 Table 17: Pin description................................................................................................................................................. 36 Table 18: Pin description................................................................................................................................................. 39 Table 19: Pin description................................................................................................................................................. 40 Table 20: GPIO configuration......................................................................................................................................... 41 Table 21: Electronic characteristic .................................................................................................................................. 41 Table 22: Electronic characteristic .................................................................................................................................. 42 Table 23: Pin description................................................................................................................................................. 43 Table 24: Electronic characteristic .................................................................................................................................. 43 Table 25: Pin description................................................................................................................................................. 44 Table 26: LED status....................................................................................................................................................... 45 Table 27: Control status .................................................................................................................................................. 45 Table 28: Electronic characteristic .................................................................................................................................. 46 Table 29: Pin description................................................................................................................................................. 46 Table 30: Timing parameters........................................................................................................................................... 48 Table 31: Timing parameters........................................................................................................................................... 49 Table 32: Electronic characteristic .................................................................................................................................. 53 Table 33: Electronic Characteristics................................................................................................................................ 54 Table 34: Electronic characteristic .................................................................................................................................. 55 Table 35: Conducted transmission power ....................................................................................................................... 55 Table 36: Operating frequencies ..................................................................................................................................... 56 Table 37: Conducted receive sensitivity.......................................................................................................................... 56 Table 38: GPRS/EDGE data throughout ......................................................................................................................... 56 Table 39: HSDPA throughout.......................................................................................................................................... 57 Table 40: Absolute maximum ratings.............................................................................................................................. 59 Table 41: Recommended operating ratings ..................................................................................................................... 59 Table 42: Operating temperature..................................................................................................................................... 59
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 7Table 43: Operating Modes Overview ............................................................................................................................ 60 Table 44: Current consumption....................................................................................................................................... 62 Table 45: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) .......................................... 64 Table 46: SIM5320A GPIOs list ..................................................................................................................................... 69 Table 47: Digital I/O characteristics................................................................................................................................ 69 Table 48: Related documents .......................................................................................................................................... 70 Table 49: Terms and Abbreviations................................................................................................................................. 71 Table 50: Safety caution.................................................................................................................................................. 74
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 8Figure Index Figure 1: SIM5320A functional architecture................................................................................................................... 12 Figure 2: Pin view........................................................................................................................................................... 14 Figure 3: Top dimensions (Unit: mm)............................................................................................................................. 19 Figure 4: Side dimensions (Unit: mm)............................................................................................................................ 19 Figure 5: Bottom dimensions (Unit: mm) ....................................................................................................................... 20 Figure 6: Footprint recommendation (Unit: mm)............................................................................................................ 20 Figure 7: VBAT_RF voltage drop during burst emission (GSM/GPRS)......................................................................... 21 Figure 8: VBAT input application circuit........................................................................................................................ 22 Figure 9: Reference circuit of the LDO power supply .................................................................................................... 23 Figure 10: Reference circuit of the DCDC power supply ............................................................................................... 23 Figure 11: Internal circuit................................................................................................................................................ 24 Figure 12: Application circuit ......................................................................................................................................... 25 Figure 13: RTC supply from capacitor............................................................................................................................ 25 Figure 14: RTC supply from non-chargeable battery ...................................................................................................... 26 Figure 15: RTC supply from rechargeable battery .......................................................................................................... 26 Figure 16: Seiko XH414H-IV01E Charge-Discharge characteristic............................................................................... 26 Figure 17: Power on Timing Sequence ........................................................................................................................... 27 Figure 18: Application circuit ......................................................................................................................................... 28 Figure 19: Power off timing sequence ............................................................................................................................ 29 Figure 20: Full modem.................................................................................................................................................... 30 Figure 21: Null modem ................................................................................................................................................... 30 Figure 22: RI behaviour in NULL Modem ..................................................................................................................... 32 Figure 23: RI behaviour in FULL Modem ...................................................................................................................... 32 Figure 24: Speaker interface configuration ..................................................................................................................... 34 Figure 25: Receiver interface configuration.................................................................................................................... 34 Figure 26: Microphone interface configuration .............................................................................................................. 34 Figure 27: USIM interface reference circuit ................................................................................................................... 37 Figure 28: Amphenol SIM card socket ........................................................................................................................... 38 Figure 29: Reference circuit............................................................................................................................................ 40 Figure 30: USB interface ................................................................................................................................................ 42 Figure 31: Application circuit ......................................................................................................................................... 44 Figure 32: Flight mode switch ........................................................................................................................................ 45 Figure 33: Synchrony timing .......................................................................................................................................... 47 Figure 34: EXT CODEC to MODULE timing................................................................................................................ 47 Figure 35: MODULE to EXT CODEC timing................................................................................................................ 48 Figure 36: Synchrony timing .......................................................................................................................................... 48 Figure 37: EXT CODEC to MODULE timing................................................................................................................ 49 Figure 38: MODULE to EXT CODEC timing................................................................................................................ 49 Figure 39: Active antenna circuit .................................................................................................................................... 51 Figure 40：Passive antenna circuit (Default) ................................................................................................................. 52 Figure 41: Current drive.................................................................................................................................................. 53 Figure 42: Reset circuit................................................................................................................................................... 54
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 9Figure 43: Reference circuit............................................................................................................................................ 54 Figure 44: Antenna matching circuit............................................................................................................................... 58 Figure 45: Top and bottom view of SIM5320A .............................................................................................................. 65 Figure 46: The ramp-soak-spike reflow profile of SIM5320A........................................................................................ 66 Figure 47: Recommended pad ........................................................................................................................................ 67 Figure 48: System design................................................................................................................................................ 68
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 10 Revision History Data Version Description of change Author 2011-2-29 1.01 Original Xiaoyangyang
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 111 Introduction This document describes electronic specifications, RF specifications, function interface, mechanical characteristic and testing conclusions of the SIMCom SIM5320A module. With the help of this document and other SIM5320A software application notes, user guides, users can quickly understand and use SIM5320A module to design and develop applications quickly. 1.1 Product Outline Designed for global market, SIM5320A is a quad-band GSM/GPRS/EDGE and dual-band UMTS /HSDPA that works on frequencies of GSM 850MHz, EGSM 900 MHz, DCS 1800 MHz, PCS 1900MHz and WCDMA 1900/850MHz. User can choose the module based on the wireless network configuration. In this document, the entire radio band configuration of SIM5320A series is described in the following table. Table 1: SIM5320A series frequency bands Standard Frequency SIM5320A GSM 850MHz 3 EGSM 900MHz 3 DCS1800MHz 3 GSM PCS1900MHz 3 WCDMA 850MHz 3 WCDMA 900MHz WCDMA 1900MHz 3 WCDMA WCDMA 2100MHz HSDPA 3 HSPA HSUPA With a tiny configuration of 30*30*2.9 mm and integrated functions, SIM5320A can meet almost any space requirement in users’ application, such as Smart phone, PDA phone, industrial handhelds, machine-to-machine, vehicle applications, etc.. There are 80 pins on SIM5320A, which provide most application interfaces for customers’ board. 1.2 Hardware Interface Overview Sub-interfaces are described in detail in the next chapter, which includes:
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 12● Power Supply ● USB Interface ● Serial Interface ● Analog Audio Interfaces ● SIM Interface ● GPIO ● ADC ● LDO Power Output ● Sink Current Source ● PCM Interface ● Keypad Interface ● SPI Interface ● RTC ● I2C Interface 1.3 Hardware Diagram The global architecture of the SIM5320A Embedded module is described in the figure below. Figure 1: SIM5320A functional architecture 1.4 Functional Overview Table 2: General Feature Feature Implementation
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 13Power supply Single supply voltage 3.3～4.2V Transmission data ● Dual-mode UMTS/HSDPA/EDGE/GPRS operation ● GPRS Class B, multislot class 12 operation, Supports coding scheme: CS1-4 ● EDGE multislot class 12 operation, Supports coding schemes MSC1-9 ● UMTS R99 data rates-384 kbps DL/UL ● HSDPA Category 5/6 -3.6 Mbps Category12-1.8 Mbps ● CSD feature: 9.6, 14.4, 64 kbps UL/DL GPS ● Mobile-Assisted mode ● Mobile-based mode ● Standalone mode SMS ● MT, MO, CB, Text and PDU mode ● SMS storage: SIM card ● Support transmission of SMS alternatively over CSD or GPRS. User can choose preferred mode. SIM interface Support identity card: 1.8V, 3V. Audio features(optional) Speech codec modes: ● Half Rate (ETS 06.20) ● Full Rate (ETS 06.10) ● Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80) ● AMR (WCDMA) ● AMR+QCP (GSM) ● A5/1, A5/2, and A5/3 ciphering Serial interface ● Serial Port standard or null modem mode on Serial Port Interface ● Serial Port can be used to control module by sending AT command USB Support USB2.0 Slave mode Phonebook management Support phonebook types: SM, FD, LD, RC, ON, MC. SIM application toolkit Support SAT class 3, GSM 11.14 Release 98 Support USAT Real Time Clock Support RTC Timer function Programmable by AT command Physical characteristics Size:30*30*2.9mm Weight:5.6g Firmware upgrade Firmware upgrade over USB interface PCM Multiplex on GPIOs. 3 kinds of coding formats: 8 bit (υ-law or A-law) and 16 bit (linear). Temperature range ● Operation temperature: -30°C to +80°C ● Storage temperature -40°C to +85°C
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 142 Package Information 2.1 Pin Configuration All hardware interfaces which connect SIM5320A to customers’ application platform are through 80 pins pads (Metal half hole). Figure 2 is SIM5320A outline diagram. Figure 2: Pin view
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 15Table 3: Pin definition Pin No. Define Pin No. Define 1 GND 2 GND 3 POWER_ON 4 RESET 5 GND 6 SPI_CLK 7 SPI_MISO_DATA 8 SPI_MOSI_DATA 9 SPI_CS_N 10 GND 11 USB_VBUS 12 USB_DM 13 USB_DP 14 GND 15 RESERVED 16 RESERVED 17 USIM_DATA 18 USIM_RESET 19 USIM_CLK 20 V_USIM 21 SPK_M 22 SPK_P 23 MIC1P 24 MIC1N 25 EAR1N 26 EAR1P 27 KEYSENSE_N1 28 KEYSENSE_N0 29 KEYPAD_0 30 KEYPAD_2 31 KEYSENSE_N2 32 KEYSENSE_N3 33 KEYPAD_1 34 KEYPAD_4 35 KEYPAD_3 36 KEYSENSE_N4 37 GND 38 VBAT_BB 39 VBAT_BB 40 GND 41 GND 42 VRTC 43 GND 44 VREG_AUX 45 CURRENT_SINK 46 ADC2 47 ADC1 48 GPIO44 49 GPIO40 50 GPIO43 51 GPIO1 52 GPIO41 53 GPIO42 54 GPIO4 55 I2C_SCL 56 I2C_SDA 57 GND 58 GND 59 MAIN_ANT 60 GND 61 GND 62 VBAT_RF 63 VBAT_RF 64 GND 65 GND 66 UART_RTS
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 1667 UART_CTS 68 UART_RXD 69 UART_RI 70 UART_DCD 71 UART_TXD 72 UART_DTR 73 PCM_DOUT 74 PCM_DIN 75 PCM_SYNC 76 PCM_CLK 77 GND 78 GND 79 GPS_ANT 80 GND 2.2 Pin description Table 4: Pin description Pin name I/O Description Comment Power Supply VB AT_R F/ VBAT _BB Power supply voltage VRTC I/O Power supply for RTC VREG_AUX O LDO power output If it is unused, keep open. GND Ground Power on/off POWER_ON I POWER_ON should be pulled low at least 64ms to power on or 500ms to power off the module. Audio interface MIC1P MIC1N I Differential audio input If it is unused, connect to ground through a 100N capacitor. EAR1P EAR1N O SPK_P SPK_N O Differential audio output If these pins are unused，keep open. USIM interface V_USIM O Voltage Supply for SIM card Support 1.8V or 3V SIM card USIM_DATA I/O SIM Data Output/Input USIM_CLK O SIM Clock USIM_RESET O SIM Reset All signals of SIM interface should be protected against ESD/EMC. SPI interface SPI_CLK O SPI clock SPI_CS_N O SPI chip-select If it is unused, keep open.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 17SPI_MOSI_DATA O SPI (master only) master out/slave in data SPI_MISO_DATA I SPI (master only) master in/slave out data USB USB_VBUS I USB power supply input USB_DP I/O Plus (+) line of the differential, bi-directional USB signal to/from theperipheral device.USB_DM I/O Minus (-) line of the differential, bi-directional USB signal to/from theperipheral device.They are compliant with the USB 2.0 specification.If it is unused, keep open. Serial interface UART_RXD I Receive Data UART_TXD O Transmit Data UART_RTS O Request to send UART_CTS I Clear to Send UART_RI O Ring Indicator UART_DTR I/O DTE get ready UART_DCD O Carrier detects UART_RXD has been pulled down with a 12kR resistor to ground in the module. If it is unused, keep open. I2C interface I2C_SDA I/O I2C data I2C_SCL O I2C clock output Pulled up with a 2.2kR resistor to 2.6V internally.If it is unused, keep open. Keypad interface KEYPAD_0 O Bit 0 drive to the pad matrix KEYPAD_1 O Bit 1 drive to the pad matrix KEYPAD_2 O Bit 2 drive to the pad matrix KEYPAD_3 O Bit 3 drive to the pad matrix KEYPAD_4 O Bit 4 drive to the pad matrix KEYSENSE_N0 I Bit 0 for sensing key press on pad matrix KEYSENSE_ N1 I Bit 1 for sensing key press on pad matrix KEYSENSE_ N2 I Bit 2 for sensing key press on pad matrix KEYSENSE_ N3 I Bit 3 for sensing key press on pad matrix KEYSENSE_ N4 I Bit 4 for sensing key press on pad matrix All Keypad pins can be configured as GPIOs. If it is unused, keep open. PCM interface PCM_DIN/GPIO0 I General Input PIN with module wake/interrupt. It also can be multiplexed as the PCM_DIN pin. If it is unused, keep open.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 18PCM_SYNC/GPIO2 I General Input PIN. It also can be multiplexed as the PCM_SYNC pin. PCM_CLK/GPIO3 O General Output PIN. It also can be multiplexed as the PCM_CLK pin. PCM_DOUT/GPIO5 O General Output PIN. It also can be multiplexed as the PCM_DOUT pin. GPIOs GPIO1 O Output PIN as LED control for network status. GPIO4 I Input PIN as RF operating control. GPIO40 O Output PIN as operating status indicating of module. GPIO41 I/O General input/output PIN. It can be used as wake/interrupt signal to host from module GPIO43 I/O General input/output PIN. It can be used as wake/interrupt signal to module from host. GPIO44 I/O General input/output PIN. GPIO42 I/O General input/output PIN. If it is unused, keep open. Other interface RESET I System reset in, active low. CURRENT_SINK I Current source of ground-referenced current sink Refer to 3.13 ADC1 I Analog Digital Converter Input Refer to 3.13 ADC2 I Battery temperature ADC input pin Detailed description please refers to chapter 3.1.2. MAIN_ANT I/O ANT soldering pad GPS_ANT I/O GPS ANT soldering pad
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 192.3 Package Dimensions The following figure shows mechanical dimensions of SIM5320A. Figure 3: Top dimensions (Unit: mm) Figure 4: Side dimensions (Unit: mm)
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 20 Figure 5: Bottom dimensions (Unit: mm) 2.4 Footprint Recommendation Figure 6: Footprint recommendation (Unit: mm)
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 213 Application Interface Specification 3.1 Power Supply The power supply pins of SIM5320A include VBAT_RF and VBAT_BB. VBAT_RF directly supplies the power to RF PA; VBAT_BB supplies the power to the baseband system. For the VBAT_RF, the ripple due to GSM/GPRS emission burst (every 4.615ms）may cause voltage drop, and the current consumption rises typically to peak of 2A. So the power supply must be able to provide sufficient current up to 2A. The following figure is the VBAT_RF voltage ripple wave at the maximum power transmit phase. The test condition: VBAT_RF=4.0V, VBAT maximum output current =2A, CA=100 µF tantalum capacitor (ESR=0.7Ω) and CB=1µF(Please refer to Figure 8—Application circuit). Figure 7: VBAT_RF voltage drop during burst emission (GSM/GPRS) 3.1.1 Power Supply Pin Two VBAT_RF and two VBAT_BB pins are dedicated to connect the supply voltage. Table 5: Pin description Pin type Pin name Min Typ Max Unit VBAT_RF 3.3 3.8 4.2 V POWER VBAT_BB 3.3 3.8 4.2 V Note: 1.Though the VBAT_RF and VBAT_BB are supplied by the same voltage level, they are different pins. VBAT_RF is for RF section and VBAT_BB is for baseband system. 2. When the module is power off, users must pay attention to the issue about current leakage. Refer to Chapter 3.10.2 Note2.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 223.1.2 Design Guide Mostly, user connects the VBAT_RF and VBAT_BB pins with one power supply. Make sure that the input voltage at the VBAT_BB pin will never drop below 3.3V even during a transmit burst when the current consumption rises up to 2A. If the power voltage drops below 3.3V, the module may be shut down automatically. Using a large tantalum capacitor (above 100uF) will be the best way to reduce the voltage drops. If the power current cannot support up to 2A, users must introduce larger capacitor (typical 1000uF) to storage electric power, especially GPRS multiple time slots emission. For the consideration of RF performance and system stability, another large capacitor (above 100uF) should be located at the VBAT_RF pin and some multi-layer ceramic chip (MLCC) capacitors (0.1uF) need to be used for EMC because of their low ESR in high frequencies. Note that capacitors should be put beside VBAT_RF pins as close as possible. Also User should minimize the PCB trace impedance from the power supply to the VBAT pins through widening the trace to 80 mil or more on the board. The following figure is the recommended circuit. Figure 8: VBAT input application circuit There are three sections about how to design and optimize users’ power systems. Power supply circuit We recommend DCDC or LDO is used for the power supply of the module, make sure that the peak current of power components can rise up to 2A. The following figure is the reference design of +5V input power supply. The designed output for the power supply is 4.1V, here a linear regulator can be used.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 23Vin VoutON/OFFGNDFB3+PWR_CTRLR102R101FB101 VBAT100K43K270 OHM+C103330uFC104100nFU101 MIC293025412C101 C102100uF 1uFDC INPUT Figure 9: Reference circuit of the LDO power supply If there is a big difference between the input voltage and the desired output (VBAT), a switching converter power will be preferable because of its better efficiency, especially at the high current situation. The following figure is the reference circuit. Note that DCDC may deprave RF performance because of ripple current intrinsically. Figure 10: Reference circuit of the DCDC power supply Voltage monitor To monitor the power supply voltage, user can use the AT command “AT+CBC”, this command has two parameters: the battery status and the voltage value (mV). It will return the capacity percentage and actual value of battery (at the VBAT_BB pin). The voltage is continuously measured at intervals, whenever the measured battery voltage is lower than a specific value set by the AT command “AT+CVALARM”. For example, if the voltage value is set to be 3.4V, the following URC will be presented: “warning! voltage is low: 3.3v”. If the voltage is lower than a specific value which is set by the AT command “AT+CPMVT”, the module will be powered off automatically and AT commands cannot be executed any more. Note: Under-voltage warning function is disabled by default, user can enable it by the AT command “AT+CVALARM”. Auto power off feature is disabled by default, user should set it by the AT command “AT+CPMVT” to an appropriate value. Please refer to Document [1].
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 24Temperature monitor ADC interface can be used to monitor the temperature of power components to avoid over temperature. An external NTC resistor (such as NCP15XH103F03RC) can be used to measure the device temperature. The ADC1 pin can be used as external voltage detection. Please refer to Chapter 3.17. ADC2 is the ADC input pin for temperature detection. The following figure shows the application circuit. Figure 11: Internal circuit From above figure, the input voltage can be calculated: Vadc=2.2* Rt/（Rt+9.76 ）(V) Rt is a NTC thermistor. The default temperature VS Vad c voltage table is shown below. Table 6: Temperature table Temperature degree(℃) Vadc (mV) -30 1887 -20 1814 -10 1711 0 1574 10 1408 20 1224 30 1035 40 856 50 695 60 558 70 446 80 355
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 25Make sure that the NTC thermistor can meet the above requirement. User can also add some resistors to get desired voltage. The value of R1, R2 can be calculated according to the NTC curve and the above table. Please refer to the following circuit for user’s application. Figure 12: Application circuit Normally R1=750Ω. Then the input voltage can be calculated by the following formula: Vadc=2.2* Rf/（Rf+9.76+0.75 ）(V) —— Rf= Rt*R2/(Rt+R2) User can take out R2 value through the existing Vadc and the value of NTC thermistor in a specific temperature. 3.1.3 RTC Backup The module uses RTC (Real Time Clock) to update and maintain inherent time and keeps system alive at no power supply status. The RTC power supply of module can be provided by an external capacitor or a battery (non-chargeable or rechargeable) through the VRTC. The following figures show various reference circuits for RTC back up. The discharge current is less than 10uA. If this feature is used, please refer to the AT commands “AT+CTZU” and “AT +CTZR”. z External capacitor backup RTCCoreMODULEVRTCNon-chargeableBackup Battery Figure 13: RTC supply from capacitor
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 26z Non-chargeable battery backup Figure 14: RTC supply from non-chargeable battery z Rechargeable battery backup Figure 15: RTC supply from rechargeable battery Note: The VRTC can be disabled, jus disconnect it in application circuit. Coin-type rechargeable battery is recommended, such as XH414H-IV01E form Seiko can be used. Typical charge-discharge curves for this battery are shown in the following figure. Figure 16: Seiko XH414H-IV01E Charge-Discharge characteristic
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 273.2 Power on/off Time Sequence 3.2.1 Power on Sequence SIM5320A can be powered on by POWER_ON pin, which starts normal operating mode. POWER_ON pin is pulled up with a 200kR resistor to 1.8V in module. User can power on the SIM5320A by pulling the POWER_ON pin down for a short time. The power-on scenarios are illustrated in the following figures. 4.7 K47KTurn on/ off impulsePOWER_ONPower on / off logic200K1.8VMODULE Figure 17: Power on Timing Sequence
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 28Table 7: Power on timing Parameter Description Time value Unit Ton The time to pull POWER_ON down to power on 64< Ton<180 ms TpD+ The time to indicate connecting with the network >5.5 s Tpw+ The time to indicate the module is powered on completely >4.5 s Tuart The time to enable UART >4.7 s Tusb The time to enable USB >9 s Automatic power on If user needs to power on SIM5320A automatically whenever the VBAT pins are connected to the power supply, then POWER_ON pin is just pulled to ground by a resistance in circuit directly. The following is the reference circuit. 10 KPOWER _ON Power on /off logic200K1.8VMODULER1RESETReset impulseVIL<0. 3V50ms<t<200msVBATRESET( Input) Figure 18: Application circuit Note: After automatically powering on the module by pulling down POWER_ON pin to ground anytime, USB/UART may not communicate normally with host, so it is suggested that SIM5320A should be reset by RESET pin. 3.2.2 Power off Sequence The following methods can be used to power down SIM5320A. These procedures will make module disconnect from the network and allow the software to enter a safe state, and then save data before completely powering the module off.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 29 ● Method 1: Power off SIM5320A by pulling the POWER_ON pin down ● Method 2: Power off SIM5320A by AT command User can power off the SIM5320A by pulling POWER_ON down for a specific time. The power off scenario is illustrated in the following figure. Figure 19: Power off timing sequence Table 8: Power off timing Parameter Description Time value Unit Toff The time pulling POWER_ON down to power off 0.5< Toff<5 s TpD- The time to indicate disconnecting from the network >7 s Tpw- The time to indicate the module power off completely >7.5 s Tuart_off The time to disable UART >6 s Tusb_off The time to disable USB >7.5 s User can also use the AT command “AT+ C POF ” to power down the module. After that, the AT commands cannot be executed any longer. The module enters the POWER DOWN mode, only the RTC is still active. For details, refer to Document [1].
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 303.3 UART Interface SIM5320A provides a UART (universal asynchronous serial transmission) port. It consists of a flexible 7-wire serial interface. The module is as the DCE (Data Communication Equipment) and the client PC is as the DTE (Data Terminal Equipment). AT commands are entered and serial communication is performed through UART interface. The application circuit is in the following figures. Figure 20: Full modem Figure 21: Null modem
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 313.3.1 Pin Description Table 9: Pin description Pin type Pin name Pin No. I/O Active voltage Default Status UART_RXD 68 I H Pull-Down UART_TXD 71 O H Pull-Up UART_RTS 66 O H UART_CTS 67 I H Pull-Up UART_DTR 72 I H Pull-Up UART_DCD 70 O H UART UART_RI 69 O H More pin information refers to chapter 2.2. Table 10: Logic level Parameter Min Max Unit Logic low input 0 0.3*VDD_EXT V Logic high input 0.7 *VDD_EXT VDD_EXT +0.3 V Logic low output GND 0.2 V Logic high output VDD_EXT -0.2 VDD_EXT V Note: VDD_EXT (=2.6V) is e reference voltage in module internal interface. All pins of all serial ports have 8mA driver capacity. 3.3.2 Application Guide If UART port is used in Null Modem, the pin “RI” can be used as an interrupt signal to HOST. Normally it will keep high logic level until certain condition such as receiving SMS, voice call (CSD, video) or URC reporting, then “RI” will change to low logic level to inform the master (client PC). It will stay low until the master clears the interrupt event with AT command.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 32 Figure 22: RI behaviour in NULL Modem If Full Modem is used to establish communication between devices, the pin “RI” is another operation status. Initially it keeps high, when a voice call or CSD call comes, the pin “RI” will change to low for about 5900ms, then it will return to high level for 100ms. It will repeat this procedure until this call is answered or hung up. Figure 23: RI behaviour in FULL Modem To comply with RS-232 protocol, the RS-232 level shifter chip should be used to connect SIM5320A to the RS-232-C interface. In this connection, the TTL level and RS-232 level are converted mutually. SIMCom recommends that user uses the SP3238ECA chip with a full modem. For more information please refers to the RS-232 chip datasheet. Note: SIM5320A supports the communication rate: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. Default rate is 115200bps. 3.4 Audio Interfaces SIM5320A provides two analog signal outputs and one analog input. MIC1P/N is used as microphone, EAR1P/N and SPK_P/N are used as audio output. Regarding audio parameters configuration, please refer to the ATC manual.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 333.4.1 Pin Description Table 11: Pin description Audio channel Pin name Pin No. Function MIC1P 23 MIC positive input MIC1N 24 MIC negative input EAR1P 26 Receiver positive output Normal EAR1N 25 Receiver negative output MIC1P 23 MIC positive input MIC1N 24 MIC negative input SPK_P 22 Loudspeaker positive output Hand-free SPK_N 21 Loudspeaker negative output Table 12: MIC input characteristics Parameter Min Typ Max Unit Working Voltage - 1.8 - V Working Current 0.07 0.4 1 mA External Microphone Load Resistance 1.2 2.2 k Ohms Table 13: Audio output characteristics Parameter Min Typ Max Unit Load resistance 27 32 - Ohm Normal (EAR_P,EAR_N) Differential Output power - 50 - mW Table 14: Speaker output characteristics Parameter Min Typ Max Unit Quiescent Current - 2.5 4 mA Output power(1KHz) - 500 - mW 3.4.2 Design Guide There are three audio channels in SIM5320A，including speaker output , receiver output and microphone input. SPEAKER circuit in SIM5320A is a Class-D amplifier, optional EMI filter is shown in the following figure; these components (two ferrite beads and two capacitors) can reduce electromagnetic interference. If used, they should be located beside SPK_P and SPK_N pins. Considerable current flows in the channels, so wider PCB traces are recommended (~ 20 mils).
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 34 Figure 24: Speaker interface configuration Figure 25: Receiver interface configuration Figure 26: Microphone interface configuration
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 35Note: SIM5320A has integrated MIC bias circuit. There is no need to pull the MIC1P and MIC1N up to the external power, just connect it to microphone. MIC1P and MIC1N must be differential lines. 3.4.3 Audio Parameter Characteristic Main audio parameters can be changed to satisfy users’ requirement. Here primary register parameters and related description are listed. User can adjust them through AT command. For more detail please refers to Audio Application Document. Table 15: Audio parameter Parameter Influence to Range Gain range Calculation AT command micAmp1 MICP/MICN analogue amplifier gain before ADC 0…1 0…24dB 2 steps AT+CMICAMP1txVol Digital gain of input signal after ADC 0, 1...65535 Mute, -84...+12dB20 * log (txVol/ 16384) AT+CTXVOL txGain Digital gain of input signal after summation of sidetone 0, 1...65535 Mute, -84...+12dB20 * log (txGain/ 16384) AT+CTXGAIN txFilter Input PCM 13-tap filter parameters, 7 values 0...65535 --- MATLAB calculate AT+CTXFTR rxGain Digital gain of output signal after summation of sidetone 0, 1...65535 Mute, -84...+12dB20 * log (rxGain/ 16384) AT+CRXGAIN rxVol Digital Volume of output signal after speech decoder, before summation of sidetone and DAC -300…300 dbm -300…300dbm AT+CLVL AT+CVLVL AT+CRXVOL stGain Digital attenuation of sidetone 0, 1...65535 Mute, -96...0dB 20 * log (stGain/ 16384) -12 AT+SIDET rxFilter Output PCM 13-tap filter parameters, 7 values 0...65535 --- MATLAB calculate AT+CRXFTR Note: If users require better experience on audio, users should modify these parameters according to their own electronic
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 36and mechanical design. 3.5 USIM Interface The USIM provides the required subscription verification information to allow the mobile equipment to attach to a GSM or UMTS network. Both 1.8V and 3.0V SIM Cards are supported. 3.5.1 Pin description Table 16: Electronic characteristic Table 17: Pin description 3.5.2 Application Guide It is recommended to use an ESD protection component such as ST (www.st.com ) ESDA6V1W5 or ON SEMI (www.onsemi.com ) SMF05C. Note that the SIM peripheral circuit should be close to the SIM card socket. The reference circuit of the 8-pin SIM card holder is illustrated in the following figure. 3.0V mode 1.8V mode Pin name Min Typ Max Min Typ Max V_USIM 2.7 3.00 3.3 1.65 1.8 2.0 USIM_RESET 0.8* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM USIM_CLK 0.7* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM USIM_DATA 0.7* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM Pin name Pin Description USIM_CLK 19 USIM Card Clock USIM_RESET 18 USIM Card Reset USIM_DATA 17 USIM Card data I/O, which has been pulled up with a 22kR resistor to V_USIM in module. Do not pull up or pull down in users’ application circuit. V_USIM 20 USIM Card Power output depends automatically on USIM mode，one is 3.0V±10%, another is 1.8V±10%. Current is less than 50mA.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 37 Figure 27: USIM interface reference circuit Note: USIM_DATA has been pulled up with a 22kR resistor to V_USIM in module. A 220nF shut capacitor on V_USIM is used to reduce interference. Use AT Commands to get information in USIM card. For more detail, please refer to document [1]. 3.5.3 Recommend Components For 6 pins USIM socket, SIMCom recommend to use Amphenol C707 10M006 512 2. User can visit http://www.amphenol.com for more information about the holder.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 38 Figure 28: Amphenol SIM card socket Table 19: Amphenol USIM socket pin description Pin Signal Description C1 USIM_VDD SIM Card Power supply, it can identify automatically the SIM Card power mode，one is 3.0V±10%, another is 1.8V±10%. C2 USIM_RST SIM Card Reset. C3 USIM_CLK SIM Card Clock. C5 GND Connect to GND. C6 VPP Connect to USIM_VDD C7 USIM_DATA SIM Card data I/O. 3.6 I2C Interface I2C is used to communicate with peripheral equipments and can be operated as either a transmitter or receiver, depending on the device function. Use AT Commands “AT+CRIIC and AT+CWIIC” to read/write register values of related peripheral equipments connected with I2C interface.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 393.6.1 Pin Description Table 18: Pin description 3.6.2 Signal Description Both SDA and SCL are bidirectional lines, connected to a positive supply via a pull-up resistor respectively. When the bus is free, both lines are high. 3.6.3 Design Guide For SIM5320A, the data on the I2C bus can be transferred at rates up to 400kbps. The number of peripheral devices connected to the bus is solely dependent on the bus capacitance limit of 400pF. Note that PCB traces length and bending are in users’ control to minimize load capacitance. Note：I2C_SDA and I2C _SCL have been pulled up with two 2.2kR resistors to 2.6V level in module. So there is no need to pull them up in users’ application circuit. 3.7 Keypad Interface SIM5320A module provides a keypad interface that supports five sense lines, or columns, and five keypad rows. The interface generates an interrupt when any key is pressed. Its operation voltage is 1.8V. 3.7.1 Pin Description Pin name Pin No. Function I2C_SDA 56 Serial interface data input and output I2C_SCL 55 Serial interface clock input
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 40Table 19: Pin description Pin name Pin No. Function KEYSENSE_N0 28 KEYSENSE_N1 27 KEYSENSE_N2 31 KEYSENSE_N3 32 KEYSENSE_N4 36 Sensing keys KEYPAD_0 30 KEYPAD_1 29 KEYPAD_2 30 KEYPAD_3 35 KEYPAD_4 34 Driving pads 3.7.2 Application Guide All keypad pins can be configured for GPIOs. These GPIOs also support interruption operation if used as input pins. A typical circuit about the keypad (5*5 keypad matrix) is shown in the following figure. Figure 29: Reference circuit If these pins are configured for GPIOs, the sequence is listed in the following table.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 41Table 20: GPIO configuration Keypad interface GPIO No. KEYPAD_4 GPIO6 KEYPAD_3 GPIO7 KEYPAD_2 GPIO8 KEYPAD_1 GPIO9 KEYPAD_0 GPIO10 KEYSENSE_N4 GPIO11 KEYSENSE_N 3 GPIO12 KEYSENSE_N 2 GPIO13 KEYSENSE_N 1 GPIO14 KEYSENSE_N 0 GPIO15 Note: Refer to document [23] for detailed information of Keypad Application Note. 3.8 USB Interface SIM5320A module contains a USB interface. This interface is compliant with the USB2.0 specification. The USB2.0 specification requires hosts such as the computer to support all three USB speeds, namely low-speed (1.5Mbps), full-speed (12Mbps) and high-speed (480Mbps). USB charging and USB-OTG is not supported. Table 21: Electronic characteristic Input voltage scope( V ) Pin name Pin No. Min Typ Max USB_VBUS 11 4.4 5.0 5.25 USB_DP 13 USB_DM 12 They are compliant with the USB 2.0 specification. 3.8.1 Application Guide Currently SIM5320A supports the USB suspend and resume mechanism which can help to save power. If no transaction is on USB bus, SIM5320A will enter suspend mode. When some events such as voice call or receiving SMS happen, SIM5320A will resume normal mode automatically.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 42 Figure 30: USB interface Because of high bit rate on USB bus, pay attention to influence of junction capacitance of ESD component on USB data lines. Typically, the capacitance should be less than 4pF @1MHz. Note：The SIM5320A has two kinds of interface (UART and USB) to connect to host CPU. USB interface is mapped to five virtual ports: “SIMTECH USB Modem”, “SIMTECH NMEA Device”, “SIMTECH ATCOM Device”, “SIMTECH Diagnostics interface” and “SIMTECH Wireless Ethernet Adapter”. 3.9 SPI Interface SPI interface of SIM5320A is master only. It provides a duplex, synchronous, serial communication link with peripheral devices. Its operation voltage is 1.8V, with clock rates up to 26 MHz. 3.9.1 Pin Description Table 22: Electronic characteristic1.8V mode Pin name Min Typ Max SPI_CLK 1.65 1.8 1.95 SPI_CS_N 1.65 1.8 1.95 SPI_MOMI_DATA 1.65 1.8 1.95 SPI_MIMO_DATA 1.65 1.8 1.95
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 43Table 23: Pin description 3.10 GPIO Interface SIM5320A provides a limited number of GPIO pins. All GPIOs can be configured as inputs or outputs. User can use AT Commands to read or write GPIOs status. Refer to ATC document for details. 3.10.1 Pin Description Table 24: Electronic characteristic Note: If more GPIOs need to be used, users can configure GPIO on other multiple function interfaces, such as PCM. Please refer to GPIO list. Pin name Pin No. Function SPI_CS 9 SPI chip-select; not mandatory in a point-to-point connectionSPI_MISO_DATA 7 SPI master in/slave out data SPI_CLK 6 SPI clock SPI_MOSI_DATA 8 SPI master out/slave in data 2.6V mode Pin name Min Typ Max GPIO1 2.5 2.6 2.7 GPIO4 2.5 2.6 2.7 GPIO40 2.5 2.6 2.7 GPIO41 2.5 2.6 2.7 GPIO43 2.5 2.6 2.7 GPIO44 2.5 2.6 2.7 GPIO42 2.5 2.6 2.7
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 44Table 25: Pin description Note: The output driver current of GPIOs is 1mA at the lower supply voltage and 2mA at the higher supply voltage. 3.10.2 Application Guide Network status GPIO1 is used to control Network Status LED; application circuit is shown below. Figure 31: Application circuit Note: The value of resistor Rx depends on LED characteristic. Pin name Pin No. I/O Function GPIO1 51 O Output PIN as LED control for network status. If it is unused, left open. GPIO4 49 I Input PIN as RF operating control. H: Normal Mode L:Flight Mode If it is unused, left open. GPIO40 54 O Output PIN as operating status indicating of module. H: Power on L: Power off If it is unused, left open. GPIO41 52 I/O General input/output PIN. It can be used as wake/interrupt signal to host from module If it is unused, left open. GPIO42 53 I/O General Purpose Input/Output Port. GPIO43 50 I/O General Purpose Input/Output Port. It can be used as wake/interrupt signal to module from host. If it is unused, left open. GPIO44 48 I/O General Purpose Input/Output Port
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 45Table 26: LED status LED Status Module Status Always On Searching Network/Call Connect 200ms ON, 200ms OFF Data Transmit 800ms ON, 800ms OFF Registered network Off Power off / Sleep Flight mode control GPIO4 controls SIM5320A module to enter or exit the Flight mode. In Flight mode, SIM5320A closes RF function to prevent interference with other equipments or minimize current consumption. Bidirectional ESD protection component is suggested to add on GPIO4. Figure 32: Flight mode switch Table 27: Control status GPIO4 Status Module operation Low Level Flight Mode: RF is closed. High Level Normal Mode: RF is working. Note：1. For SIM5320A, GPIO0, GPIO2, GPIO3 and GPIO5 have multiplex function, user can use them as PCM interface to connect extend codec. Refer to section 3.10 and document [1] for details. 2. When the module is powered off, make sure all digital interfaces (PCM UART, etc) connected with peripheral devices have no voltage higher than 0.3V. If users’ design cannot meet above conditions, high level voltages maybe occur in GPIO pins because current leakage from above digital interfaces may occur.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 463.11 PCM Interface SIM5320A provides hardware PCM interface for external codec. The PCM interface enables communication with an external codec to support hands-free applications. SIM5320A PCM interface can be used in two modes: the default mode is auxiliary PCM (8 KHz long sync mode at 128 KHz PCM CLK); the other mode is primary PCM (8 KHz short sync mode at 2048 KHz PCM CLK). In short-sync (primary PCM) mode, SIM5320A can be a master or a slave. In long-sync (auxiliary PCM) mode, SIM5320A is always a master. SIM5320A also supports 3 kinds of coding formats: 8 bits (υ-law or A-law) and 16 bits (linear). Note: PCM interface is multiplexed from GPIO (default setting). The AT command “AT+CPCM” is used to switch between PCM and GPIO functions. Please refer to document [22] and document [1] for details. 3.11.1 Pin Description Table 28: Electronic characteristic 2.6V mode Pin name Min Typ Max PCM_CLK 2.5 2.6 2.7 PCM_SYNC 2.5 2.6 2.7 PCM_DOUT 2.5 2.6 2.7 PCM_DIN 2.5 2.6 2.7 Table 29: Pin description Pins Pin No. AUX_PCM functionality Primary PCM functionality Description PCM_DIN/GPIO0 74 AUX_PCM_DIN PCM_DIN PCM data input PCM_SYNC/GPIO2 75 AUX_PCM_SYNC PCM_SYNC PCM data synchronyPCM_DOUT/GPIO5 73 AUX_PCM_DOUT PCM_DOUT PCM data output PCM_CLK/GPIO3 76 AUX_PCM_CLK PCM_CLK PCM data clock 3.11.2 Signal Description The default PCM interface in SIM5320A is the auxiliary PCM interface. The data changes on the high level of PCM_CLK and is sampled at the falling edge of PCM_CLK in one period. Primary PCM is disabled after every power-on or every reset event. So user must use AT command to enable the primary
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 47PCM mode after powering on or resetting the module every time if user wants to use Primary PCM.SIM5320A PCM Interface can be operated in Master or Slave mode if it is configured to primary PCM. In Master Mode, the Module drives the clock and sync signals that are sent to the external codec. When it is in Slave Mode, the external codec drives the clock and sync signals which are sent to the module. Both PCM modes are discussed in this section followed by additional PCM topics. Auxiliary PCM (128 KHz PCM clock) υ-law coding is supported by the auxiliary PCM. The auxiliary codec port operates with standard long-sync timing and a 128 KHz clock. The AUX_PCM_SYNC runs at 8 KHz with 50% duty cycle. Most υ-law codec support the 128 KHz clock. Figure 33: Synchrony timing Figure 34: EXT CODEC to MODULE timing 
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 48Figure 35: MODULE to EXT CODEC timing Table 30: Timing parameters Parameter Description Min Typ Max Unit T(auxsync) AUX_PCM_SYNC cycle time – 125 - μs T(auxsynch) AUX_PCM_SYNC high time 62.4 62.5 - μs T(auxsyncl) AUX_PCM_SYNC low time 62.4 62.5 - μs T(auxclk)* AUX_PCM_CLK cycle time - 7.8 – μs T(auxclkh) AUX_PCM_CLK high time 3.8 3.9 – μs T(auxclkl) AUX_PCM_CLK low time 3.8 3.9 – μs T(suauxsync) AUX_PCM_SYNC setup time high before falling edge of PCM_CLK 1.95 – – μs T(hauxsync) AUX_PCM SYNC hold time after falling edge of PCM_CLK 1.95 – – μs T(suauxdin) AUX_PCM_DIN setup time before falling edge of AUX_PCM_CLK 70 – – ns T(hauxdin) AUX_PCM_DIN hold time after falling edge of AUX_PCM_CLK 20 – – ns T(pauxdout) Delay from AUX_PCM_CLK rising to AUX_PCM_DOUT valid – – 50 ns *Note: T(auxclk) = 1/(128 KHz). Primary PCM (2048 KHz PCM clock) SIM5320A also supports 2.048 MHz PCM data and sync timing for υ-law codec. This is called the primary PCM interface. User can use AT command to take the mode you want as discussed above. Figure36:Synchronytiming
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 49 Figure 37: EXT CODEC to MODULE timing Figure 38: MODULE to EXT CODEC timing Table 31: Timing parameters Parameter Description Min Typ Max Unit T(sync) PCM_SYNC cycle time – 125 – μs T(synch) PCM_SYNC high time 400 500 – ns T(syncl) PCM_SYNC low time – 124.5 – μs T(clk) PCM_CLK cycle time – 488 – ns T(clkh) PCM_CLK high time – 244 – ns T(clkl) PCM_CLK low time – 244 – ns T(susync) PCM_SYNC setup time high before falling edge of PCM_CLK 60 – – ns T(hsync) PCM_SYNC hold time after falling edge of PCM_CLK 60 – – ns T(sudin) PCM_DIN setup time before falling edge of PCM_CLK 50 – – ns T(hdin) PCM_DIN hold time after falling edge of PCM_CLK 10 – – ns T(pdout) Delay from PCM_CLK rising to PCM_DOUT valid – – 350 ns
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 50T(zdout) Delay from PCM_CLK falling to PCM_DOUT HIGH-Z – 160 – ns Note: SIM5320A can transmit PCM data by USB except for PCM interface. Please refer to document [22] for more information of PCM Application Note. 3.12 Global Positioning System SIM5320A merges GPS satellite and network information to provide a high-availability solution that offers industry-leading accuracy and performance. This solution performs well, even in very challenging environmental conditions where conventional GPS receivers fail, and provides a platform to enable wireless operators to address both location-based services and emergency mandates. 3.12.1 Technical specification Tracking sensitivity -157 dBm Cold-start sensitivity -144 dBm Accuracy (Open Sky) <2m (CEP50) TTFF (Open Sky) Hot start <1s Cold start 35s（good signal）/ 100s(weak signal) Receiver Type 12-channel, GPS L1 Frequency (1575.42MHz), C/A Code Update rate Default 1 Hz GPS data format NMEA-0183 GPS Current consumption (WCDMA/GSM Sleep mode) 100mA (Total supply current) GPS antenna Passive/Active antenna Note: Performance will vary depending on the environment, antenna type and signal conditions and so on. 3.12.2 Operate Mode SIM5320A supports both A-GPS and S-GPS, and then provides three operating modes: mobile-assisted mode, mobile-based mode and standalone mode. A-GPS includes mobile-assisted and mobile-based mode. In mobile-assisted mode, when a request for position location is issued, available network information is provided to the location server (e.g. Cell-ID) and assistance is requested from the location server. The location server sends the assistance information to the handset. The handset/mobile unit measures the GPS observables and provides the GPS measurements along with available network data (that is appropriate for the given air interface technology) to the location server. The location server then calculates the position location and returns results to the requesting entity. In mobile-based mode, the assistant data provided by the location server encompasses not only the information required to assist the handset in measuring the satellite signals, but also the information required to calculate the handset’s position. Therefore, rather than provide the GPS measurements and
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 51available network data back to the location server, the mobile calculates the location on the handset and passes the result to the requesting entity. In standalone (autonomous) mode, the handset demodulates the data directly from the GPS satellites. This mode has some reduced cold-start sensitivity, and a longer time to first fix as compared to the assisted modes. However, it requires no server interaction and works out of network coverage. This combination of GPS measurements and available network information provides: ● High-sensitivity solution that works in all terrains: Indoor, outdoor, urban, and rural ● High availability that is enabled by using both satellite and network information Therefore, while network solutions typically perform poorly in rural areas and areas of poor cell geometry/density, and while unassisted, GPS-only solutions typically perform poorly indoors. The SIM5320A GPS solution provides optimal time to fix, accuracy, sensitivity, availability, and reduced network utilization in both of these environments, depending on the given condition. 3.12.3 Application Guide Users can adopt an active antenna or a passive antenna as GPS signal transceiver. In this document, all GPS specification mentioned is from passive antenna. The following is the reference circuit. Figure 39: Active antenna circuit
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 52 Figure 40：Passive antenna circuit (Default) In above figures, the components C1 and L1, L2 are used for antenna matching, the values of the components can only be obtained after the antenna tuning usually, and they are provided by antenna vendor.C2 in Figure 39 is used for DC isolation. In active antenna circuit, users must use an external LDO/DCDC to provide VDD voltage whose value should be taken according active antenna characteristic, and VDD can be shut down to avoid consuming additional current when not being used. GPS can be used by NMEA port. User can select NMEA as output through UART or USB. NMEA sentences are automatic and no command is provided. NMEA sentences include GSV, GGA, RMC, GSA, and VTG. Before using GPS, user should configure SIM5320A in proper operating mode by AT command. Please refer to related document for details. SIM5320A can also get position location information through AT directly. Note:GPS is closed by default, it could be started by AT+CGPS. The AT command has two parameters, the first is on/off, and the second is GPS mode. Default mode is standalone mode. AGPS mode needs more support from the mobile telecommunication network. Refer to AGPS application document for details. 3.13 Multi-functional interface SIM5320A merges functions for various applications. It can enrich users’ design and lower the cost of users’ hardware. 3.13.1 Sink Current Source The dedicated pin (CURRENT_SINK) is intended for driving passive devices，such as LCD backlight, this implementation is +5V tolerant and suitable for driving white LEDs. The high-current driver can maintain a constant current which is set by the AT command “AT+ CLEDITST”, capable of up to 150 mA.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 53Table 32: Electronic characteristic Symbol Description Min Typ Max Unit CURRENT_SINK Input voltage 0.5 VDD 5 V IO Input current - - 150 mA Since the driver is ground-referenced current sink, the operating device it drives must form a current path between the VDD pin and the CURRENT_SINK pin. The following figure is for users reference. MODULECURRENT_SINKPin 45 is +5V tolerant-suitable for driving white LEDsCurrent ControlsPassive device+-VBATHighcurrent Figure 41: Current drive Note: The sinking current can be adjusted to meet design requirement through the AT command “AT+ CLEDITST =<0>, <value>”.The “value” ranges from 0 to 15,on behalf of the current changes from 0mA to 150mA in steps of 10mA. 3.13.2 Reset Function SIM5320A also have a RESET pin (PIN4) to reset the module. This function is used as an emergency reset only when AT command “AT+CPOF” and the POWER_ON pin has no effect. User can pull the RESET pin to ground, then the module will reset. This pin is already pulled up in module, so the external pull-up resistor is not necessary. A 100nF capacitor close to the RESET pin is strongly recommended. A reference circuit is recommended in the following figure.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 54 Figure 42: Reset circuit Note：50ms<t<200ms. ESD components are suggested to be used on Reset pin. 3.13.3 ADC SIM5320A has a dedicated ADC that is available for digitizing analog signals such as battery voltage and so on; it is on PIN 47, namely ADC1. This ADC1 is 8 bit successive-approximation circuit, and electronic specification is shown in the following table. Table 33: Electronic Characteristics Specification Min Typ Max Unit Comments/Conditions Resolution 8 Bits Differential nonlinearity -4 +4 LSB Integral nonlinearity -8 +8 LSB Gain Error -2.5 +2.5 % Offset Error -4 +40 LSB Analog Vdd = ADC reference 2.4MHz sample rate Input Range GND 2.2V V Input serial resistance 2 kΩ Sample and hold switch resistance Input capacitance 53 pF Power-down to wakeup 9.6 19.2 μs User can introduce a signal in the ADC pin directly and use the AT command “AT+CADC” to get the raw data which is between 0 and 255. The data can be transformed to any type such as voltage, temperature etc. Please refer to Chapter 3.1.2 and document [1]. Figure 43: Reference circuit
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 55Note: The input signal voltage value in ADC must not be higher than 2.2V. 3.13.4 LDO SIM5320A has a LDO power output, namely VREG_AUX. The LDO is available and output voltage is 2.85v by default, rated for 250mA. User can switch the LDO on or off by the AT command “AT+CVAUXS” and configure its output voltage by the AT command “AT+CVAUXV”. Table 34: Electronic characteristic Symbol Description Min Typ Max Unit VREG_AUX Output voltage 1.5 2.85 3.05 V IO Output current - - 250 mA 4 RF Specification 4.1 RF Specification Table 35: Conducted transmission power Frequency Max Min GSM850 33dBm ±2dB 5dBm ± 5dB E-GSM900 33dBm ±2dB 5dBm ± 5dB DCS1800 30dBm ±2dB 0dBm ± 5dB PCS1900 30dBm ±2dB 0dBm ± 5dB GSM850 (8-PSK) 27dBm ±3dB 5dBm ± 5dB E-GSM900 (8-PSK) 27dBm ±3dB 5dBm ± 5dB DCS1800 (8-PSK) 26dBm +3/-4dB 0dBm ±5dB PCS1900(8-PSK) 26dBm +3/-4dB 0dBm ±5dB WCDMA 2100 24dBm +1/-3dB -56dBm ±5dB WCDMA 1900 24dBm +1/-3dB -56dBm ±5dB WCDMA 850 24dBm +1/-3dB -56dBm ±5dB WCDMA 900 24dBm + 1/-3dB -56dBm ±5dB
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 56Table 36: Operating frequencies Frequency Receiving Transmission GSM850 869 ～894 MHz 824 ～849 MHz E-GSM900 925 ～960 MHz 880 ～915 MHz DCS1800 1805～1880 MHz 1710～1785 MHz PCS1900 1930～1990 MHz 1850～1910 MHz WCDMA 2100 2110～2170 MHz 1920～1980 MHz WCDMA1900 1930～1990 MHz 1850～1910 MHz WCDMA 850 869 ～894 MHz 824 ～849 MHz WCDMA 900 925 ～960 MHz 880 ～915 MHz Table 37: Conducted receive sensitivity Frequency Receive sensitivity GSM850 < -106dBm E-GSM900 < -106dBm DCS1800 < -106dBm DCS1800 < -106dBm WCDMA 2100 < -108dBm WCDMA 1900 < -108dBm WCDMA 850 < -106dBm WCDMA 900 < -106dBm 4.2 Operating Specification SIM5320A can support high rate data by GSM/WCDMA wireless network. In the different network environment, data transmission rate shifts depending on modulation and encoding. Table 38: GPRS/EDGE data throughout Function Coding schemes 1 Timeslot 2 Timeslot 4 Timeslot CS-1 9.05kbps 18.1kbps 36.2kbps CS-2 13.4kbps 26.8kbps 53.6kbps CS-3 15.6kbps 31.2kbps 62.4kbps GPRS CS-4 21.4kbps 42.8kbps 85.6kbps MCS-1 8.80kbps 17.6kbps 35.20kbps MCS-2 11.2kbps 22.4kbps 44.8kbps MCS-3 14.8kbps 29.6kbps 59.2kbps MCS-4 17.6kbps 35.2kbps 70.4kbps MCS-5 22.4kbps 44.8kbps 89.6kbps MCS-6 29.6kbps 59.2kbps 118.4kbps MCS-7 44.8kbps 89.6kbps 179.2kbps MCS-8 54.4kbps 108.8kbps 217.6kbps EDGE MCS-9 59.2kbps 118.4kbps 236.8kbps
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 57Table 39: HSDPA throughout Category Supported Max supported HS-DSCH codesTheoretical max peak rate(Mbps) Modulation Category1 5 1.2 16QAM,QPSK Category2 5 1.2 16QAM,QPSK Category3 5 1.8 16QAM,QPSK Category4 5 1.8 16QAM,QPSK Category5 3 5 3.6 16QAM,QPSK Category6 3 5 3.6 16QAM,QPSK Category7 10 7.2 16QAM,QPSK Category8 10 7.2 16QAM,QPSK Category9 15 10.0 16QAM,QPSK Category10 15 14.0 16QAM,QPSK Category11 5 0.9 QPSK Category12 3 5 1.8 QPSK Note: Actual throughout rates depend on network configuration, network loading, signal condition and so on. 4.3 Antenna Design Guide SIM5320A provides RF antenna interface. Customer’s antenna should be located in the host board and connected to module’s antenna pad through micro-strip line or other types of RF trace and the trace impedance must be controlled in 50Ω. SIMCom recommends that the total insertion loss between the antenna pad and antenna should meet the following requirements: ● GSM900/GSM850<0.5dB ● DCS1800/PCS1900 <0.9dB ● WCDMA 2100/1900<0.9dB ● WCDMA 900/850<0.5dB To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit should be added. The following figure is the recommended circuit.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 58 Figure 44: Antenna matching circuit In this figure, the components R1,C1,C2 and R2 is used for antenna matching, the value of components can only be got after the antenna tuning, usually, they are provided by antenna vendor. By default, the R1, R2 are 0 ohm resistors, and the C1, C2 are reserved for tuning. The RF test connector in the figure is used for the conducted RF performance test, and should be placed as close as to the module’s antenna pin. The traces impedance between components must be controlled in 50ohm.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 595 Reliability and Operating Characteristics 5.1 Electronic Characteristics Absolute maximum rating for digital and analog pins of SIM5320A are listed in the following table: Table 40: Absolute maximum ratings Parameter Min Max Unit Voltage at digital pins (1.8v mode) -0.3 1.8+0.3 V Voltage at digital pins (2.6v mode) -0.3 2.6+0.3 V Voltage at VBAT -0.5 6.0 V Voltage at VRTC 1.5 3.2 V Voltage at USB_VBUS -0.5 6.0 V Table 41: Recommended operating ratings Parameter Min Typ Max Unit Voltage at digital pins (1.8v mode) 1.65 1.8 1.95 V Voltage at digital pins (2.6v mode) 2.5 2.6 2.7 V Voltage at VBAT 3.3 3.8 4.2 V Voltage at VRTC 1.5 - 3.0 V Voltage at USB_VBUS 4.75 5 5.25 V The operating temperature and power specification is listed in the following table. Table 42: Operating temperature Parameter Min Typ Max Unit Ambient temperature -30 25 80 ℃ Storage temperature -40 25 +85 ℃ Note: SIMCom recommends user to install a heat sink on the module shielding case if SIM5320A operates in WCDMA band. 5.2 Operating Mode The following table summarizes the various operating modes, each operating modes will be referred to in the following chapters.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 605.2.1 Operating Modes Overview Table 43: Operating Modes Overview Mode Function Sleep mode GSM/WCDMA SLEEP Module will automatically enter SLEEP mode if DTR is set to high level and there is no on air or hardware interrupt (such as GPIO interrupt or data on serial port). In this case, the current consumption of module will be reduced to the minimal level. In SLEEP mode, the module can still receive paging message，voice call and SMS. GSM IDLE Software is active. Module has registered to the GSM network, and the module is ready to communicate. GSM GSM TALK Connection between two subscribers is in progress. In this case, the power consumption depends on network settings (DTX off/on, FR/EFR/HR, hopping sequences, etc.) and antenna. GPRS STANDBY Module is ready for GPRS data transfer, but no data is currently sent or received. In this case, power consumption depends on network settings and GPRS configuration. GPRS GPRS DATA There is GPRS data transfer (PPP or TCP or UDP) in progress. In this case, power consumption is related with network settings (e.g. power control level), uplink/downlink data rates and GPRS configuration (e.g. used multi-slot settings). EDGE STANDBY Module is ready for data transfer in EDGE mode, but no data is currently sent or received. In this case, power consumption depends on network settings and EDGE configuration EDGE EDGE DATA There is EDGE data transfer (PPP or TCP or UDP) in progress. In this case, power consumption is related with network settings (e.g. power control level), uplink/downlink data rates and EDGE configuration. WCDMA IDLE Module has registered to the WCDMA network, and the module is ready to communicate. WCDMA WCDMA TALK Module is active in WCDMA mode. The power consumption depends on network settings. HSDPA IDLE Module is ready for data transmission, but no data is currently sent or received. Power consumption depends on network settings and HSDPA configuration HSDPA HSDPA DATA There is HSDPA data transfer (PPP or TCP or UDP) in progress. In this case, power consumption is related with network settings (e.g. power control level), uplink/downlink data rates and HSDPA configuration Power down Module can be powered down by the AT command “AT+CPOF” or the POWER_ON pin. The power management unit shuts down the power supply of the module, only the power supply of RTC is remained. The serial interface is not accessible. Operating voltage (connected to VBAT) remains applied. Minimum functionality mode The AT command “AT+CFUN” can be used to set the module to a minimum functionality mode without removing the power supply. In this mode, the RF part of the module will not work or the SIM card will not be accessible, or both will be closed, and the serial port is still accessible. The power consumption in this mode is very low.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 615.2.2 Minimize Power Consumption There are two modes that SIM5320A achieves low power consumption. Sleep mode If peripheral equipments stops working, and there is no on air or hardware interrupts (such as GPIO interrupts or data on UART), SIM5320A will enter sleep mode automatically. In this mode, SIM5320A can still receive paging，voice call or SMS from network. If USB interface of SIM5320A is connected to host CPU, but host CPU does not support USB suspending, then SIM5320A will not enter sleep mode. After USB is disconnected, SIM5320A will enter sleep mode. Note: When UART interface is connected with host CPU, SIM5320A can not enter sleep mode until RXD is pulled down by the host CPU. If the module is in the idle mode, make sure to pull the RXD to low level by host CPU. SIMCom recommends using GPIO43 or UART_DTR to wake up the module from host CPU and to use GPIO41 or UART_RI to wake up the host CPU. Before designing, pay attention to how to realize waking function and refer to Document[24] and Document[25] for more detail. Minimum functionality mode Minimum functionality mode ceases a majority function of module, thus minimizing the power consumption. This mode is set by the AT command which provides a choice of the functionality levels. ● AT+CFUN=0: Minimum functionality ● AT+CFUN=1: Full functionality (Default) ● AT+CFUN=4: Disable RF function of the module (Flight mode) If SIM5320A has been set to minimum functionality mode, the module will firstly enter sleep mode, then the RF function and SIM card function will be closed. In this case, the serial port is still accessible, but RF function or SIM card will be unavailable. When SIM5320A is in minimum functionality or flight mode, it can return to full functionality by the AT command “AT+CFUN=1”. Note: For flight mode, please refer to Chapter 2.12.2. 5.3 Current Consumption The current consumption in suspended mode and without USB connection is listed in the table below. Here, “suspended mode” means that SIM5320A is connected to USB bus, but it does not transfer data.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 62Table 44: Current consumption GSM Sleep mode (without USB connection) GSM850 Sleep @DRX=2 4.5mA Sleep @DRX=5 2.7mA Sleep @DRX=9 2.3mA GSM900 Sleep @DRX=2 4.5mA Sleep @DRX=5 2.7mA Sleep @DRX=9 2.3mA DCS1800 Sleep @DRX=2 4.5mA Sleep @DRX=5 2.7mA Sleep @DRX=9 2.3mA PCS1900 Sleep @DRX=2 4.5mA Sleep @DRX=5 2.7mA Sleep @DRX=9 2.3mA GSM Sleep Mode (with USB suspended) GSM850 Sleep @DRX=2 4.6mA Sleep @DRX=5 2.8mA Sleep @DRX=9 2.5mA GSM900 Sleep @DRX=2 4.6mA Sleep @DRX=5 2.8mA Sleep @DRX=9 2.5mA DCS1800 Sleep @DRX=2 4.6mA Sleep @DRX=5 2.8mA Sleep @DRX=9 2.5mA PCS1900 Sleep @DRX=2 4.6mA Sleep @DRX=5 2.8mA Sleep @DRX=9 2.5mA Voice Call GSM850 @power level #5 <300mA,Typical 305mA GSM 900 @power level #5 <300mA,Typical 305mA DCS1800 @power level #0 <250mA,Typical 237mA PCS1900 @power level #0 <250mA,Typical 237mA GPRS Data DATA mode, GPRS ( 1 Rx,4 Tx ) CLASS 12 GSM 850 @power level #5 <660mA,Typical 488mA GSM 900 @power level #5 <660mA,Typical 484mA DCS1800 @power level #0 <530mA,Typical 346mA PCS1900 @power level #0 <530mA,Typical 353mA DATA mode, GPRS ( 3Rx, 2 Tx ) CLASS 12 GSM 850 @power level #5 <460mA,Typical 335mA GSM 900 @power level #5 <440mA,Typical 332mA DCS1800 @power level #0 <400mA,Typical 260mA PCS1900 @power level #0 <300mA,Typical 263mA
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 63EDGE Data DATA mode, EDGE( 1 Rx,4 Tx ) CLASS 12 GSM 850 @power level #8 <500mA,Typical 335mA GSM 900 @power level #8 <500mA,Typical 332mA DCS1800 @power level #2 <450mA,Typical 291mA PCS1900 @power level #2 <450mA,Typical 293mA DATA mode, EDGE( 3Rx, 2 Tx ) CLASS 12 GSM 850 @power level #8 <330mA,Typical 235mA GSM 900 @power level #8 <330mA,Typical 231mA DCS1800 @power level #2 <300mA,Typical 206mA PCS1900 @power level #2 <300mA,Typical 209mA UMTS Sleep Mode (without USB connection) WCDMA 2100 Sleep @DRX=9 2.2mA Sleep @DRX=8 2.7 mA Sleep @DRX=6 4.7mA WCDMA 1900 Sleep @DRX=9 2.2mA Sleep @DRX=8 2.7 mA Sleep @DRX=6 4.7mA WCDMA 850 Sleep @DRX=9 2.2mA Sleep @DRX=8 2.7 mA Sleep @DRX=6 4.7mA WCDMA 900 Sleep @DRX=9 2.2mA Sleep @DRX=8 2.7 mA Sleep @DRX=6 4.7mA UMTS Sleep Mode (with USB suspended) WCDMA 2100 Sleep @DRX=9 2.4mA Sleep @DRX=8 2.8 mA Sleep @DRX=6 4.8mA WCDMA 1900 Sleep @DRX=9 2.4mA Sleep @DRX=8 2.8 mA Sleep @DRX=6 4.8mA WCDMA 850 Sleep @DRX=9 2.4mA Sleep @DRX=8 2.8 mA Sleep @DRX=6 4.8mA WCDMA 900 Sleep @DRX=9 2.4mA Sleep @DRX=8 2.8 mA Sleep @DRX=6 4.8mA UMTS Talk WCDMA 2100 @Power 23dBm Typical 539mA @Power 21dBm Typical 461mA @Power 10dBm Typical 195mA WCDMA 1900 @Power 23dBm Typical 604mA @Power 21dBm Typical 507mA @Power 10dBm Typical 195mA WCDMA 850 @Power 23dBm Typical 517mA @Power 21dBm Typical 419mA
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 64@Power 10dBm Typical 189mA WCDMA 900 @Power 23dBm Typical 524mA @Power 21dBm Typical 417mA @Power 10dBm Typical 179mA HSDPA Data WCDMA 2100 @Power 23dBm CQI=22 Typical 550mA @Power 21dBm CQI=5 Typical 520mA @Power -5dBm CQI=22 Typical 270mA WCDMA 1900 @Power 23dBm CQI=22 Typical 610mA @Power 21dBm CQI=5 Typical 540mA @Power -5dBm CQI=22 Typical 270mA WCDMA 850 @Power 23dBm CQI=22 Typical 550mA @Power 21dBm CQI=5 Typical 490mA @Power -5dBm CQI=22 Typical 220mA WCDMA 900 @Power 23dBm CQI=22 Typical 550mA @Power 21dBm CQI=5 Typical 490mA @Power -5dBm CQI=22 Typical 220mA 5.4 EMC and ESD Notes EMC tests should be performed to detect any potential problems. Possible harmful emissions radiate by the application to the RF receiver in the receiver band. RF emissions interfere with audio input/output. It is recommended to shield the sensitive components and trace with common ground and user can add beads where necessary. Normally SIM5320A is mounted on customer host board. Although some ESD components have been added in SIM5320A, to prevent ESD, user should put some ESD components on customers’ board. The ESD components should be placed beside the connectors which human body might touch, such as SIM card holder, audio jacks, switches, keys, etc. The following table is the SIM5320A ESD measurement performance; the results are from SIMCom EVB test. Table 45: The ESD performance measurement table (Temperature: 25 , Humidity:℃ 45%) Part Contact discharge Air discharge VBAT,GND ±4KV ±6KV UART,USB ±2KV ±6KV Antenna port ±4KV ±6KV Other ports ±2KV ±2KV
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 656 Guide for Production 6.1 Top and Bottom View of SIM5320A Figure 45: Top and bottom view of SIM5320A These test points are only used for module manufacturing and testing. They are not for customer’s application. 6.2 Typical Solder Reflow Profile For customer convenience, SIMCom provides a typical example for a commonly used soldering profile. In final board assembly, the typical solder reflow profile will be determined by the largest component on the board, as well as the type of solder/flux used and PCB stack-up. Therefore the soldering profile shown below is only a generic recommendation and should be adjusted to the specific application and manufacturing constraints.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 66 Figure 46: The ramp-soak-spike reflow profile of SIM5320A For details about secondary SMT, please refer to document [26]. 6.3 Moisture Sensitivity Level (MSL) SIM5320A is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-020. After the prescribed time limit exceeded, users should bake modules for 192 hours in drying equipment (<5% RH) at 40° C +5° C/-0° C, or 72 hours at 85° C +5° C/-5° C. Note that plastic tray is not heat-resistant, users must not use the tray to bake at 85° C or the tray may be damaged. 6.4 Stencil Foil Design Recommendation The recommended thickness of stencil foil is more than 0.18mm.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 676.5 Recommended Pad Design Module OutlineABA:B=1.0mm:0.8mm Figure 47: Recommended pad Note: More designing details refer to Figure 6.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 68Appendix A. System Design C103C102C101VBAT_RFVBAT_RFVBAT_BBPower supply100uF 100nF 22pFUART_TXDUART_RXDUART_CTSUART_RTSUART_RIUART_DCDUART_DTRC109220nFV_USIMUSIM_RESETUSIM_CLKUSIM_DATAVBAT_BB62633839C105C104100uF 100nFPower supply6164GNDGND3740GNDGNDPOWER_ONRESET34Reset impulse20~200ms4.7K47KTurn on/off impulse>64msUART_TXDUART_RXDUART_CTSUART_RTSUART_RIUART_DCDUART_DTR71686766697072231GNDGND0RC107C106Main AntennaNC NCMAIN_ANT5958GNDGND57C107GPS Antenna33pFGPS_ANT 7978GNDGND77 NCL101 NCL102GND 80GND60SIM_DATASIM_VDDSIM_RSTSIM_CLKSMF05CEAR1NEAR1PMIC1NMIC1PSPK_NSPK_P2426252221MIC32R8R0.5WESD & Decoupling capacitors required.Please refers to Audio interface chapter.GPIO4USB_VBUSRF ON/OFF1112GPIO110K10K300RLEDNetwork StatusUSB_DP 1332USB_DMUSB_VBUSUSB_DMUSB_DP282731362933353036KEYSENSE_N0KEYSENSE_N2KEYSENSE_N1KEYSENSE_N3KEYPAD_0KEYSENSE_N4KEYPAD_1KEYPAD_3KEYPAD_2KEYPAD_476747573679845PCM_DIN/GPIO0PCM_DOUT/GPIO5PCM_SYNC/GPIO2PCM_CLK/GPIO3SPI_CLK_NSPI_MISO_DATASPI_CSSPI_MOSI_DATACURRENT_SINK123456789*0#Audio CODEC ChiporDSPLCDDisplay5154VREG_AUX VREG_AUX44IIC_SCL I2C_SCL55IIC_SDA I2C_SDA56ADC1 HKADCInput range:0-2.2VADC24746ReserveReserve1516VRTC1719182042C108If RTC is unused， keep VRTC pin open.GPIO405253504849GPIO41GPIO42GPIO43GPIO445GNDGND21014 GNDGND43 GNDGND4165Output : DC 1.5-3VR102R103R104R105R106R107TVSIf USB interface is used， connect USB_VBUS to DC 4.4V-5.25V100uFHOST_WAKEUPMODULE_WAKEUPTVSFB101 300 OHMFerrite Beads Rated current > 1A Figure 48: System design
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 69B. SIM5320A GPIOs List Table 46: SIM5320A GPIOs list Name GPIO Index Default Function Alternate Function PCM_DIN 0 GPIO Interrupt [LEVEL/LOW] PCM_DIN STATUS_LED 1 Status led GPIO PCM_SYNC 2 GPIO [IN] PCM_SYNC PCM_CLK 3 GPIO [OUT/LOW] PCM_CLK RF_SWITCH 4 RF Switch Enable/Disable RF subsystem PCM_OUT 5 GPIO [OUT/LOW] PCM_OUT KEYPAD_4 6 Keypad GPIO KEYPAD_3 7 Keypad GPIO KEYPAD_2 8 Keypad GPIO KEYPAD_1 9 Keypad GPIO KEYPAD_0 10 Keypad GPIO KEYSENSE_N4 11 Keypad GPIO KEYSENSE_N3 12 Keypad GPIO KEYSENSE_N2 13 Keypad GPIO KEYSENSE_N1 14 Keypad GPIO KEYSENSE_N0 15 Keypad GPIO UART1_CTS 33 CTS GPIO UART1_RFR 34 RTS GPIO UART1_DTR 35 DTR wake up module GPIO UART_DCD 36 DCD GPIO UART_RI 37 RI wake up host GPIO GPIO40 40 Module power up status GPIO GPIO41 41 Wake up host GPIO GPIO42 42 GPIO GPIO GPIO43 43 Wake up module GPIO GPIO44 44 GPIO GPIO C. Digital I/O Characteristics Table 47: Digital I/O characteristics 2.6V Mode 1.8V Mode Parameter Description Min Typ Max Min Typ Max Unit VREG_AUX LDO output 0 2.6 2.9 0 1.8 1.84 V VIH High-level input voltage 1.69 2.6 2.9 1.17 1.8 2.1 V VIL Low-level input voltage -0.3 0 0.91 -0.3 0 0.63 V VOH High-level 1.17 2.6 2.6 0.81 1.8 1.8 V
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 70output voltage VOL Low-level output voltage 0 0 0.45 0 0 0.45 V IIH Input high leakage current - - 1 - - 1 uA IIL Input low leakage current -1 - - -1 - - uA CIN Input capacitance - - 7 - - 7 pF Note: These parameters are for digital interface pins, such as keypad, GPIO, I2C, UART, SPI and DEBUG. The SIM5320A includes two kinds of voltages: 1.8v and 2.6v. Digital I/O specifications under both conditions are presented in the above tables. D. Related Documents Table 48: Related documents SN Document name Remark [1] SIM5320A_ATC_V1.00 SIM5320A_ATC_V1.00 [2] ITU-T Draft new recommendationV.25ter Serial asynchronous automatic dialing and control [3] GSM 07.07 Digital cellular telecommunications (Phase 2+); AT command set for GSM Mobile Equipment (ME) [4] GSM 07.10 Support GSM 07.10 multiplexing protocol [5] GSM 07.05 Digital cellular telecommunications (Phase 2+); Use of Data Terminal Equipment – Data Circuit terminating Equipment (DTE – DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS) [6] GSM 11.14 Digital cellular telecommunications system (Phase 2+); Specification of the SIM Application Toolkit for the Subscriber Identity Module – Mobile Equipment (SIM – ME) interface [7] GSM 11.11 Digital cellular telecommunications system (Phase 2+); Specification of the Subscriber Identity Module – Mobile Equipment (SIM – ME) interface [8] GSM 03.38 Digital cellular telecommunications system (Phase 2+); Alphabets and language-specific information [9] GSM 11.10 Digital cellular telecommunications system (Phase 2)； Mobile Station (MS) conformance specification； Part 1: Conformance specification [10] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification [11] 3GPP TS 34.124 Electromagnetic Compatibility (EMC) for mobile terminals and
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 71ancillary equipment. [12] 3GPP TS 34.121 Electromagnetic Compatibility (EMC) for mobile terminals and ancillary equipment. [13] 3GPP TS 34.123-1 Technical Specification Group Radio Access Network; Terminal conformance specification; Radio transmission and reception (FDD) [14] 3GPP TS 34.123-3 User Equipment (UE) conformance specification; Part 3: Abstract Test Suites. [15] EN 301 908-02 V2.2.1 Electromagnetic compatibility and Radio spectrum Matters (ERM); Base Stations (BS) and User Equipment (UE) for IMT-2000. Third Generation cellular networks; Part 2: Harmonized EN for IMT-2000, CDMA Direct Spread (UTRA FDD) (UE) covering essential requirements of article 3.2 of the R&TTE Directive [16] EN 301 489-24 V1.2.1 Electromagnetic compatibility and Radio Spectrum Matters (ERM); Electromagnetic Compatibility (EMC) standard for radio equipment and services; Part 24: Specific conditions for IMT-2000 CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio and ancillary equipment [17] IEC/EN60950-1(2001) Safety of information technology equipment (2000) [18] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile Station (MS) conformance specification [19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria [20] 2002/95/EC Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) [21] Audio Application Note V1.01 Audio Application Note V1.01 [22] PCM Application Note V1.02 PCM Application Note V1.02 [23] Keypad Application Note V1.01 Keypad Application Note V1.01 [24] Sleep_Application_Note Sleep_Application_Note [25] Waking_up_Application_Note Waking_up_Application_Note [26] Module secondary-SMT-UGD SMT Note E. Terms and Abbreviations Table 49: Terms and Abbreviations Abbreviation Description ADC Analog-to-Digital Converter ARP Antenna Reference Point BER Bit Error Rate BTS Base Transceiver Station CS Coding Scheme
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 72CSD Circuit Switched Data CTS Clear to Send DAC Digital-to-Analog Converter DRX Discontinuous Reception DSP Digital Signal Processor DTE Data Terminal Equipment (typically computer, terminal, printer) DTR Data Terminal Ready DTX Discontinuous Transmission EFR Enhanced Full Rate EGSM Enhanced GSM EMC Electromagnetic Compatibility ESD Electrostatic Discharge ETS European Telecommunication Standard FCC Federal Communications Commission (U.S.) FD SIM fix dialing phonebook FDMA Frequency Division Multiple Access FR Full Rate GMSK Gaussian Minimum Shift Keying GPRS General Packet Radio Service GSM Global Standard for Mobile Communications HR Half Rate I2C Inter-Integrated Circuit IMEI International Mobile Equipment Identity Inorm Normal Current Imax Maximum Load Current kbps Kilo bits per second Li-Ion Lithium-Ion MO Mobile Originated MS Mobile Station (GSM engine), also referred to as TE MT Mobile Terminated PAP Password Authentication Protocol PBCCH Packet Switched Broadcast Control Channel PCB Printed Circuit Board PCS Personal Communication System, also referred to as GSM 1900 RF Radio Frequency RMS Root Mean Square (value) RTC Real Time Clock Rx Receive Direction SIM Subscriber Identification Module SMS Short Message Service SPI serial peripheral interface TDMA Time Division Multiple Access TE Terminal Equipment, also referred to as DTE TX Transmit Direction UART Universal Asynchronous Receiver & Transmitter VSWR Voltage Standing Wave Ratio Vmax Maximum Voltage Value Vnorm Normal Voltage Value
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 73Vmin Minimum Voltage Value VIHmax Maximum Input High Level Voltage Value VIHmin Minimum Input High Level Voltage Value VILmax Maximum Input Low Level Voltage Value VILmin Minimum Input Low Level Voltage Value VImax Absolute Maximum Input Voltage Value VImin Absolute Minimum Input Voltage Value VOHmax Maximum Output High Level Voltage Value VOHmin Minimum Output High Level Voltage Value VOLmax Maximum Output Low Level Voltage Value VOLmin Minimum Output Low Level Voltage Value SM SIM phonebook NC Not connect EDGE Enhanced data rates for GSM evolution HSDPA High Speed Downlink Packet Access HSUPA High Speed Uplink Packet Access ZIF Zero intermediate frequency WCDMA Wideband Code Division Multiple Access VCTCXO Voltage control temperature-compensated crystal oscillator USIM Universal subscriber identity module UMTS Universal mobile telecommunications system UART Universal asynchronous receiver transmitter
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 74F. Safety Caution Table 50: Safety caution Marks Requirements When in a hospital or other health care facility, observe the restrictions about the use of mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive to not operate normally for RF energy interference. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is switched off. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communication systems. Forget to think much of these instructions may lead to the flight safety or offend against local legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. RF interference can occur if it is used close to TV sets, radios, computers or other electric equipment. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for hands free operation. Before making a call with a hand-held terminal or mobile, park the vehicle. GSM cellular terminals or mobiles operate over radio frequency signals and cellular networks and cannot be guaranteed to connect in all conditions, for example no mobile fee or a invalid SIM card. While you are in this condition and need emergent help, please remember using emergency calls. In order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency call if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate those features before you can make an emergency call. Also, some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.
Smart Machine Smart Decision SIM5320A_Hardware Design_V1.01 2011-2-29 75Contact us: Shanghai SIMCom Wireless Solutions Ltd. Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R. China 200335 Tel: +86 21 3235 3300 Fax: +86 21 3235 3301 URL: www.sim.com/wm

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