Simcom 1103022011008 GSM/GPRS/EDGE/WCDMA/HSDPA module User Manual SIM5320 HD V1 01
Shanghai Simcom Ltd. GSM/GPRS/EDGE/WCDMA/HSDPA module SIM5320 HD V1 01
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User Manual
SIM5320A_Hardware Design_V1.01
Smart Machine Smart Decision
Document Title SIM5320A Hardware Design
Version 1.01
Date 2011-2-29
Status Release
Document Control ID SIM5320A_Hardware Design_V1.01
General Notes
SIMCom offers this information as a service to its customers, to support application and engineering
efforts that use the products designed by SIMCom. The information provided is based upon requirements
specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search
for additional relevant information, including any information that may be in the customer’s possession.
Furthermore, system validation of this product designed by SIMCom within a larger electronic system
remains the responsibility of the customer or the customer’s system integrator. All specifications supplied
herein are subject to change.
NOTICE:
This device complies with Part 15 of the FCC Rules [and with RSS-210 of Industry Canada].
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications made to this equipment not expressly approved by SIMCOM may void the
FCC authorization to operate this equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that interference will not occur in
a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try to
correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help.
This Class [B] digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe [B] est conforme à la norme NMB-003 du Canada.
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Radiofrequency radiation exposure Information:
The module does not contain antenna. It has an antenna PIN. The module is to be used in mobile
or fixed applications only. For other antenna(s) selection, the antenna gain including cable loss must
not exceed 7.2 dBi in the 850 MHz Cellular band and 3.5 dBi in the PCS 1900 MHz band, for the purpose
of satisfying the requirements of FCC 2.1043 and 2.1091. The antenna used for this module must be
installed to provide a separation distance of at least 20 cm from all persons, and must not be co-located
or operating in conjunction with other antennas or transmitters within a host device, except in accordance
with FCC multi-transmitter product procedures. Compliance of this module in all final product
configurations is the responsibility of the Grantee. OEM integrators must be provided with specific
information required to satisfy RF exposure compliance for all final host devices and installations. OEM
integrators can replace the antenna by themselves. They should comply with Consideration for antenna
selection and Consideration for antenna installation.
Copyright
This document contains proprietary technical information which is the property of SIMCom Limited,
copying of this document and giving it to others and the using or communication of the contents thereof,
are forbidden without express authority. Offenders are liable to the payment of damages. All rights
reserved in the event of grant of a patent or the registration of a utility model or design. All specification
supplied herein are subject to change without notice at any time.
Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2011
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Contents
Revision History ........................................................................................................................................ 10
1 Introduction .........................................................................................................................................11
1.1 Product Outline...............................................................................................................................11
1.2 Hardware Interface Overview.........................................................................................................11
1.3 Hardware Diagram......................................................................................................................... 12
1.4 Functional Overview...................................................................................................................... 12
2 Package Information.......................................................................................................................... 14
2.1 Pin Configuration........................................................................................................................... 14
2.2 Pin description ............................................................................................................................... 16
2.3 Package Dimensions...................................................................................................................... 19
2.4 Footprint Recommendation ........................................................................................................... 20
3 Application Interface Specification................................................................................................... 21
3.1 Power Supply................................................................................................................................. 21
3.1.1 Power Supply Pin.................................................................................................................... 21
3.1.2 Design Guide .......................................................................................................................... 22
3.1.3 RTC Backup............................................................................................................................ 25
3.2 Power on/off Time Sequence ......................................................................................................... 27
3.2.1 Power on Sequence ................................................................................................................. 27
3.2.2 Power off Sequence ................................................................................................................ 28
3.3 UART Interface.............................................................................................................................. 30
3.3.1 Pin Description........................................................................................................................ 31
3.3.2 Application Guide................................................................................................................... 31
3.4 Audio Interfaces............................................................................................................................. 32
3.4.1 Pin Description........................................................................................................................ 33
3.4.2 Design Guide .......................................................................................................................... 33
3.4.3 Audio Parameter Characteristic .............................................................................................. 35
3.5 USIM Interface .............................................................................................................................. 36
3.5.1 Pin description ........................................................................................................................ 36
3.5.2 Application Guide................................................................................................................... 36
3.5.3 Recommend Components ....................................................................................................... 37
3.6 I2C Interface .................................................................................................................................. 38
3.6.1 Pin Description........................................................................................................................ 39
3.6.2 Signal Description................................................................................................................... 39
3.6.3 Design Guide .......................................................................................................................... 39
3.7 Keypad Interface............................................................................................................................ 39
3.7.1 Pin Description........................................................................................................................ 39
3.7.2 Application Guide................................................................................................................... 40
3.8 USB Interface ................................................................................................................................ 41
3.8.1 Application Guide................................................................................................................... 41
3.9 SPI Interface .................................................................................................................................. 42
3.9.1 Pin Description........................................................................................................................ 42
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3.10 GPIO Interface ........................................................................................................................... 43
3.10.1 Pin Description .................................................................................................................... 43
3.10.2 Application Guide ............................................................................................................... 44
3.11 PCM Interface ............................................................................................................................ 46
3.11.1 Pin Description .................................................................................................................... 46
3.11.2 Signal Description ............................................................................................................... 46
3.12 Global Positioning System ......................................................................................................... 50
3.12.1 Technical specification ........................................................................................................ 50
3.12.2 Operate Mode ...................................................................................................................... 50
3.12.3 Application Guide ............................................................................................................... 51
3.13 Multi-functional interface........................................................................................................... 52
3.13.1 Sink Current Source ............................................................................................................ 52
3.13.2 Reset Function..................................................................................................................... 53
3.13.3 ADC..................................................................................................................................... 54
3.13.4 LDO..................................................................................................................................... 55
4 RF Specification.................................................................................................................................. 55
4.1 RF Specification ............................................................................................................................ 55
4.2 Operating Specification ................................................................................................................. 56
4.3 Antenna Design Guide................................................................................................................... 57
5 Reliability and Operating Characteristics........................................................................................ 59
5.1 Electronic Characteristics .............................................................................................................. 59
5.2 Operating Mode ............................................................................................................................. 59
5.2.1 Operating Modes Overview.................................................................................................... 60
5.2.2 Minimize Power Consumption ............................................................................................... 61
5.3 Current Consumption..................................................................................................................... 61
5.4 EMC and ESD Notes ..................................................................................................................... 64
6 Guide for Production.......................................................................................................................... 65
6.1 Top and Bottom View of SIM5320A ............................................................................................ 65
6.2 Typical Solder Reflow Profile ....................................................................................................... 65
6.3 Moisture Sensitivity Level (MSL)................................................................................................. 66
6.4 Stencil Foil Design Recommendation ........................................................................................... 66
6.5 Recommended Pad Design ............................................................................................................ 67
Appendix .................................................................................................................................................... 68
A. System Design..................................................................................................................................... 68
B. SIM5320A GPIOs List........................................................................................................................ 69
C. Digital I/O Characteristics................................................................................................................... 69
D. Related Documents ............................................................................................................................. 70
E. Terms and Abbreviations..................................................................................................................... 71
F. Safety Caution...................................................................................................................................... 74
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Table Index
Table 1: SIM5320A series frequency bands.................................................................................................................... 11
Table 2: General Feature ................................................................................................................................................. 12
Table 3: Pin definition..................................................................................................................................................... 15
Table 4: Pin description................................................................................................................................................... 16
Table 5: Pin description................................................................................................................................................... 21
Table 6: Temperature table.............................................................................................................................................. 24
Table 7: Power on timing................................................................................................................................................ 28
Table 8: Power off timing ............................................................................................................................................... 29
Table 9: Pin description................................................................................................................................................... 31
Table 10: Logic level....................................................................................................................................................... 31
Table 11: Pin description................................................................................................................................................. 33
Table 12: MIC input characteristics ................................................................................................................................ 33
Table 13: Audio output characteristics ............................................................................................................................ 33
Table 14: Speaker output characteristics......................................................................................................................... 33
Table 15: Audio parameter.............................................................................................................................................. 35
Table 16: Electronic characteristic .................................................................................................................................. 36
Table 17: Pin description................................................................................................................................................. 36
Table 18: Pin description................................................................................................................................................. 39
Table 19: Pin description................................................................................................................................................. 40
Table 20: GPIO configuration......................................................................................................................................... 41
Table 21: Electronic characteristic .................................................................................................................................. 41
Table 22: Electronic characteristic .................................................................................................................................. 42
Table 23: Pin description................................................................................................................................................. 43
Table 24: Electronic characteristic .................................................................................................................................. 43
Table 25: Pin description................................................................................................................................................. 44
Table 26: LED status....................................................................................................................................................... 45
Table 27: Control status .................................................................................................................................................. 45
Table 28: Electronic characteristic .................................................................................................................................. 46
Table 29: Pin description................................................................................................................................................. 46
Table 30: Timing parameters........................................................................................................................................... 48
Table 31: Timing parameters........................................................................................................................................... 49
Table 32: Electronic characteristic .................................................................................................................................. 53
Table 33: Electronic Characteristics................................................................................................................................ 54
Table 34: Electronic characteristic .................................................................................................................................. 55
Table 35: Conducted transmission power ....................................................................................................................... 55
Table 36: Operating frequencies ..................................................................................................................................... 56
Table 37: Conducted receive sensitivity.......................................................................................................................... 56
Table 38: GPRS/EDGE data throughout ......................................................................................................................... 56
Table 39: HSDPA throughout.......................................................................................................................................... 57
Table 40: Absolute maximum ratings.............................................................................................................................. 59
Table 41: Recommended operating ratings ..................................................................................................................... 59
Table 42: Operating temperature..................................................................................................................................... 59
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Table 43: Operating Modes Overview ............................................................................................................................ 60
Table 44: Current consumption....................................................................................................................................... 62
Table 45: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) .......................................... 64
Table 46: SIM5320A GPIOs list ..................................................................................................................................... 69
Table 47: Digital I/O characteristics................................................................................................................................ 69
Table 48: Related documents .......................................................................................................................................... 70
Table 49: Terms and Abbreviations................................................................................................................................. 71
Table 50: Safety caution.................................................................................................................................................. 74
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Figure Index
Figure 1: SIM5320A functional architecture................................................................................................................... 12
Figure 2: Pin view........................................................................................................................................................... 14
Figure 3: Top dimensions (Unit: mm)............................................................................................................................. 19
Figure 4: Side dimensions (Unit: mm)............................................................................................................................ 19
Figure 5: Bottom dimensions (Unit: mm) ....................................................................................................................... 20
Figure 6: Footprint recommendation (Unit: mm)............................................................................................................ 20
Figure 7: VBAT_RF voltage drop during burst emission (GSM/GPRS)......................................................................... 21
Figure 8: VBAT input application circuit........................................................................................................................ 22
Figure 9: Reference circuit of the LDO power supply .................................................................................................... 23
Figure 10: Reference circuit of the DCDC power supply ............................................................................................... 23
Figure 11: Internal circuit................................................................................................................................................ 24
Figure 12: Application circuit ......................................................................................................................................... 25
Figure 13: RTC supply from capacitor............................................................................................................................ 25
Figure 14: RTC supply from non-chargeable battery ...................................................................................................... 26
Figure 15: RTC supply from rechargeable battery .......................................................................................................... 26
Figure 16: Seiko XH414H-IV01E Charge-Discharge characteristic............................................................................... 26
Figure 17: Power on Timing Sequence ........................................................................................................................... 27
Figure 18: Application circuit ......................................................................................................................................... 28
Figure 19: Power off timing sequence ............................................................................................................................ 29
Figure 20: Full modem.................................................................................................................................................... 30
Figure 21: Null modem ................................................................................................................................................... 30
Figure 22: RI behaviour in NULL Modem ..................................................................................................................... 32
Figure 23: RI behaviour in FULL Modem ...................................................................................................................... 32
Figure 24: Speaker interface configuration ..................................................................................................................... 34
Figure 25: Receiver interface configuration.................................................................................................................... 34
Figure 26: Microphone interface configuration .............................................................................................................. 34
Figure 27: USIM interface reference circuit ................................................................................................................... 37
Figure 28: Amphenol SIM card socket ........................................................................................................................... 38
Figure 29: Reference circuit............................................................................................................................................ 40
Figure 30: USB interface ................................................................................................................................................ 42
Figure 31: Application circuit ......................................................................................................................................... 44
Figure 32: Flight mode switch ........................................................................................................................................ 45
Figure 33: Synchrony timing .......................................................................................................................................... 47
Figure 34: EXT CODEC to MODULE timing................................................................................................................ 47
Figure 35: MODULE to EXT CODEC timing................................................................................................................ 48
Figure 36: Synchrony timing .......................................................................................................................................... 48
Figure 37: EXT CODEC to MODULE timing................................................................................................................ 49
Figure 38: MODULE to EXT CODEC timing................................................................................................................ 49
Figure 39: Active antenna circuit .................................................................................................................................... 51
Figure 40：Passive antenna circuit (Default) ................................................................................................................. 52
Figure 41: Current drive.................................................................................................................................................. 53
Figure 42: Reset circuit................................................................................................................................................... 54
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Figure 43: Reference circuit............................................................................................................................................ 54
Figure 44: Antenna matching circuit............................................................................................................................... 58
Figure 45: Top and bottom view of SIM5320A .............................................................................................................. 65
Figure 46: The ramp-soak-spike reflow profile of SIM5320A........................................................................................ 66
Figure 47: Recommended pad ........................................................................................................................................ 67
Figure 48: System design................................................................................................................................................ 68
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Revision History
Data Version Description of change Author
2011-2-29 1.01 Original Xiaoyangyang
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1 Introduction
This document describes electronic specifications, RF specifications, function interface, mechanical
characteristic and testing conclusions of the SIMCom SIM5320A module. With the help of this document
and other SIM5320A software application notes, user guides, users can quickly understand and use
SIM5320A module to design and develop applications quickly.
1.1 Product Outline
Designed for global market, SIM5320A is a quad-band GSM/GPRS/EDGE and dual-band UMTS /HSDPA
that works on frequencies of GSM 850MHz, EGSM 900 MHz, DCS 1800 MHz, PCS 1900MHz and
WCDMA 1900/850MHz. User can choose the module based on the wireless network configuration. In this
document, the entire radio band configuration of SIM5320A series is described in the following table.
Table 1: SIM5320A series frequency bands
Standard Frequency SIM5320A
GSM 850MHz 3
EGSM 900MHz 3
DCS1800MHz 3
GSM
PCS1900MHz 3
WCDMA 850MHz 3
WCDMA 900MHz
WCDMA 1900MHz 3
WCDMA
WCDMA 2100MHz
HSDPA 3
HSPA
HSUPA
With a tiny configuration of 30*30*2.9 mm and integrated functions, SIM5320A can meet almost any
space requirement in users’ application, such as Smart phone, PDA phone, industrial handhelds,
machine-to-machine, vehicle applications, etc..
There are 80 pins on SIM5320A, which provide most application interfaces for customers’ board.
1.2 Hardware Interface Overview
Sub-interfaces are described in detail in the next chapter, which includes:
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● Power Supply
● USB Interface
● Serial Interface
● Analog Audio Interfaces
● SIM Interface
● GPIO
● ADC
● LDO Power Output
● Sink Current Source
● PCM Interface
● Keypad Interface
● SPI Interface
● RTC
● I2C Interface
1.3 Hardware Diagram
The global architecture of the SIM5320A Embedded module is described in the figure below.
Figure 1: SIM5320A functional architecture
1.4 Functional Overview
Table 2: General Feature
Feature Implementation
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Power supply Single supply voltage 3.3～4.2V
Transmission data
● Dual-mode UMTS/HSDPA/EDGE/GPRS operation
● GPRS Class B, multislot class 12 operation, Supports coding scheme:
CS1-4
● EDGE multislot class 12 operation, Supports coding schemes
MSC1-9
● UMTS R99 data rates-384 kbps DL/UL
● HSDPA Category 5/6 -3.6 Mbps Category12-1.8 Mbps
● CSD feature: 9.6, 14.4, 64 kbps UL/DL
GPS
● Mobile-Assisted mode
● Mobile-based mode
● Standalone mode
SMS
● MT, MO, CB, Text and PDU mode
● SMS storage: SIM card
● Support transmission of SMS alternatively over CSD or GPRS.
User can choose preferred mode.
SIM interface Support identity card: 1.8V, 3V.
Audio features(optional)
Speech codec modes:
● Half Rate (ETS 06.20)
● Full Rate (ETS 06.10)
● Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
● AMR (WCDMA)
● AMR+QCP (GSM)
● A5/1, A5/2, and A5/3 ciphering
Serial interface ● Serial Port standard or null modem mode on Serial Port Interface
● Serial Port can be used to control module by sending AT command
USB Support USB2.0 Slave mode
Phonebook management Support phonebook types: SM, FD, LD, RC, ON, MC.
SIM application toolkit Support SAT class 3, GSM 11.14 Release 98
Support USAT
Real Time Clock Support RTC
Timer function Programmable by AT command
Physical characteristics Size:30*30*2.9mm
Weight:5.6g
Firmware upgrade Firmware upgrade over USB interface
PCM Multiplex on GPIOs. 3 kinds of coding formats: 8 bit (υ-law or A-law)
and 16 bit (linear).
Temperature range ● Operation temperature: -30°C to +80°C
● Storage temperature -40°C to +85°C
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2 Package Information
2.1 Pin Configuration
All hardware interfaces which connect SIM5320A to customers’ application platform are through 80 pins
pads (Metal half hole). Figure 2 is SIM5320A outline diagram.
Figure 2: Pin view
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Table 3: Pin definition
Pin No. Define Pin No. Define
1 GND 2 GND
3 POWER_ON 4 RESET
5 GND 6 SPI_CLK
7 SPI_MISO_DATA 8 SPI_MOSI_DATA
9 SPI_CS_N 10 GND
11 USB_VBUS 12 USB_DM
13 USB_DP 14 GND
15 RESERVED 16 RESERVED
17 USIM_DATA 18 USIM_RESET
19 USIM_CLK 20 V_USIM
21 SPK_M 22 SPK_P
23 MIC1P 24 MIC1N
25 EAR1N 26 EAR1P
27 KEYSENSE_N1 28 KEYSENSE_N0
29 KEYPAD_0 30 KEYPAD_2
31 KEYSENSE_N2 32 KEYSENSE_N3
33 KEYPAD_1 34 KEYPAD_4
35 KEYPAD_3 36 KEYSENSE_N4
37 GND 38 VBAT_BB
39 VBAT_BB 40 GND
41 GND 42 VRTC
43 GND 44 VREG_AUX
45 CURRENT_SINK 46 ADC2
47 ADC1 48 GPIO44
49 GPIO40 50 GPIO43
51 GPIO1 52 GPIO41
53 GPIO42 54 GPIO4
55 I2C_SCL 56 I2C_SDA
57 GND 58 GND
59 MAIN_ANT 60 GND
61 GND 62 VBAT_RF
63 VBAT_RF 64 GND
65 GND 66 UART_RTS
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67 UART_CTS 68 UART_RXD
69 UART_RI 70 UART_DCD
71 UART_TXD 72 UART_DTR
73 PCM_DOUT 74 PCM_DIN
75 PCM_SYNC 76 PCM_CLK
77 GND 78 GND
79 GPS_ANT 80 GND
2.2 Pin description
Table 4: Pin description
Pin name I/O Description Comment
Power Supply
VB AT_R F/ VBAT _BB Power supply voltage
VRTC I/O Power supply for RTC
VREG_AUX O LDO power output
If it is unused, keep open.
GND Ground
Power on/off
POWER_ON I
POWER_ON should be pulled low at
least 64ms to power on or 500ms to
power off the module.
Audio interface
MIC1P
MIC1N
I Differential audio input
If it is unused, connect to
ground through a 100N
capacitor.
EAR1P
EAR1N
O
SPK_P
SPK_N
O
Differential audio output If these pins are unused，
keep open.
USIM interface
V_USIM O Voltage Supply for SIM card
Support 1.8V or 3V SIM card
USIM_DATA I/O SIM Data Output/Input
USIM_CLK O SIM Clock
USIM_RESET O SIM Reset
All signals of SIM
interface should be
protected against
ESD/EMC.
SPI interface
SPI_CLK O SPI clock
SPI_CS_N O SPI chip-select
If it is unused, keep open.
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SPI_MOSI_DATA O SPI (master only) master out/slave in
data
SPI_MISO_DATA I SPI (master only) master in/slave out
data
USB
USB_VBUS I USB power supply input
USB_DP I/O
Plus (+) line of the differential,
bi-directional USB signal to/from the
p
eri
p
heral device.
USB_DM I/O
Minus (-) line of the differential,
bi-directional USB signal to/from the
p
eri
p
heral device.
They are compliant with
the USB 2.0 specification.
If it is unused, keep open.
Serial interface
UART_RXD I Receive Data
UART_TXD O Transmit Data
UART_RTS O Request to send
UART_CTS I Clear to Send
UART_RI O Ring Indicator
UART_DTR I/O DTE get ready
UART_DCD O Carrier detects
UART_RXD has been
pulled down with a 12kR
resistor to ground in the
module.
If it is unused, keep open.
I2C interface
I2C_SDA I/O I2C data
I2C_SCL O I2C clock output
Pulled up with a 2.2kR
resistor to 2.6V internally.
If it is unused, keep open.
Keypad interface
KEYPAD_0 O Bit 0 drive to the pad matrix
KEYPAD_1 O Bit 1 drive to the pad matrix
KEYPAD_2 O Bit 2 drive to the pad matrix
KEYPAD_3 O Bit 3 drive to the pad matrix
KEYPAD_4 O Bit 4 drive to the pad matrix
KEYSENSE_N0 I Bit 0 for sensing key press on pad
matrix
KEYSENSE_ N1 I Bit 1 for sensing key press on pad
matrix
KEYSENSE_ N2 I Bit 2 for sensing key press on pad
matrix
KEYSENSE_ N3 I Bit 3 for sensing key press on pad
matrix
KEYSENSE_ N4 I Bit 4 for sensing key press on pad
matrix
All Keypad pins can be
configured as GPIOs.
If it is unused, keep open.
PCM interface
PCM_DIN/GPIO0 I
General Input PIN with module
wake/interrupt. It also can be
multiplexed as the PCM_DIN pin.
If it is unused, keep open.
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PCM_SYNC/GPIO2 I General Input PIN. It also can be
multiplexed as the PCM_SYNC pin.
PCM_CLK/GPIO3 O General Output PIN. It also can be
multiplexed as the PCM_CLK pin.
PCM_DOUT/GPIO5 O General Output PIN. It also can be
multiplexed as the PCM_DOUT pin.
GPIOs
GPIO1 O Output PIN as LED control for
network status.
GPIO4 I Input PIN as RF operating control.
GPIO40 O Output PIN as operating status
indicating of module.
GPIO41 I/O
General input/output PIN. It can be
used as wake/interrupt signal to host
from module
GPIO43 I/O
General input/output PIN. It can be
used as wake/interrupt signal to
module from host.
GPIO44 I/O General input/output PIN.
GPIO42 I/O General input/output PIN.
If it is unused, keep open.
Other interface
RESET I System reset in, active low.
CURRENT_SINK I Current source of ground-referenced
current sink Refer to 3.13
ADC1 I Analog Digital Converter Input Refer to 3.13
ADC2 I Battery temperature ADC input pin Detailed description please
refers to chapter 3.1.2.
MAIN_ANT I/O ANT soldering pad
GPS_ANT I/O GPS ANT soldering pad
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2.3 Package Dimensions
The following figure shows mechanical dimensions of SIM5320A.
Figure 3: Top dimensions (Unit: mm)
Figure 4: Side dimensions (Unit: mm)
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Figure 5: Bottom dimensions (Unit: mm)
2.4 Footprint Recommendation
Figure 6: Footprint recommendation (Unit: mm)
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3 Application Interface Specification
3.1 Power Supply
The power supply pins of SIM5320A include VBAT_RF and VBAT_BB. VBAT_RF directly supplies the
power to RF PA; VBAT_BB supplies the power to the baseband system. For the VBAT_RF, the ripple due
to GSM/GPRS emission burst (every 4.615ms）may cause voltage drop, and the current consumption rises
typically to peak of 2A. So the power supply must be able to provide sufficient current up to 2A. The
following figure is the VBAT_RF voltage ripple wave at the maximum power transmit phase.
The test condition: VBAT_RF=4.0V, VBAT maximum output current =2A, CA=100 µF tantalum capacitor
(ESR=0.7Ω) and CB=1µF(Please refer to Figure 8—Application circuit).
Figure 7: VBAT_RF voltage drop during burst emission (GSM/GPRS)
3.1.1 Power Supply Pin
Two VBAT_RF and two VBAT_BB pins are dedicated to connect the supply voltage.
Table 5: Pin description
Pin type Pin name Min Typ Max Unit
VBAT_RF 3.3 3.8 4.2 V
POWER
VBAT_BB 3.3 3.8 4.2 V
Note: 1.Though the VBAT_RF and VBAT_BB are supplied by the same voltage level, they are different pins. VBAT_RF
is for RF section and VBAT_BB is for baseband system.
2. When the module is power off, users must pay attention to the issue about current leakage. Refer to Chapter 3.10.2
Note2.
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3.1.2 Design Guide
Mostly, user connects the VBAT_RF and VBAT_BB pins with one power supply. Make sure that the input
voltage at the VBAT_BB pin will never drop below 3.3V even during a transmit burst when the current
consumption rises up to 2A. If the power voltage drops below 3.3V, the module may be shut down
automatically. Using a large tantalum capacitor (above 100uF) will be the best way to reduce the voltage
drops. If the power current cannot support up to 2A, users must introduce larger capacitor (typical 1000uF)
to storage electric power, especially GPRS multiple time slots emission.
For the consideration of RF performance and system stability, another large capacitor (above 100uF)
should be located at the VBAT_RF pin and some multi-layer ceramic chip (MLCC) capacitors (0.1uF)
need to be used for EMC because of their low ESR in high frequencies. Note that capacitors should be put
beside VBAT_RF pins as close as possible. Also User should minimize the PCB trace impedance from the
power supply to the VBAT pins through widening the trace to 80 mil or more on the board. The following
figure is the recommended circuit.
Figure 8: VBAT input application circuit
There are three sections about how to design and optimize users’ power systems.
Power supply circuit
We recommend DCDC or LDO is used for the power supply of the module, make sure that the peak
current of power components can rise up to 2A. The following figure is the reference design of +5V input
power supply. The designed output for the power supply is 4.1V, here a linear regulator can be used.
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Vin Vout
ON/
OFF
GND
FB
3
+
PWR_CTRL
R102
R101
FB101 VBAT
100K
43K
270 OHM
+C103
330uF
C104
100nF
U101 MIC29302
5
4
1
2
C101 C102
100uF 1uF
DC INPUT
Figure 9: Reference circuit of the LDO power supply
If there is a big difference between the input voltage and the desired output (VBAT), a switching converter
power will be preferable because of its better efficiency, especially at the high current situation. The
following figure is the reference circuit. Note that DCDC may deprave RF performance because of ripple
current intrinsically.
Figure 10: Reference circuit of the DCDC power supply
Voltage monitor
To monitor the power supply voltage, user can use the AT command “AT+CBC”, this command has two
parameters: the battery status and the voltage value (mV). It will return the capacity percentage and actual
value of battery (at the VBAT_BB pin). The voltage is continuously measured at intervals, whenever the
measured battery voltage is lower than a specific value set by the AT command “AT+CVALARM”. For
example, if the voltage value is set to be 3.4V, the following URC will be presented: “warning! voltage is
low: 3.3v”.
If the voltage is lower than a specific value which is set by the AT command “AT+CPMVT”, the module
will be powered off automatically and AT commands cannot be executed any more.
Note: Under-voltage warning function is disabled by default, user can enable it by the AT command “AT+CVALARM”.
Auto power off feature is disabled by default, user should set it by the AT command “AT+CPMVT” to an appropriate
value. Please refer to Document [1].
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Temperature monitor
ADC interface can be used to monitor the temperature of power components to avoid over temperature. An
external NTC resistor (such as NCP15XH103F03RC) can be used to measure the device temperature. The
ADC1 pin can be used as external voltage detection. Please refer to Chapter 3.17. ADC2 is the ADC input
pin for temperature detection. The following figure shows the application circuit.
Figure 11: Internal circuit
From above figure, the input voltage can be calculated:
Vadc=2.2* Rt/（Rt+9.76 ）(V) Rt is a NTC thermistor.
The default temperature VS Vad c voltage table is shown below.
Table 6: Temperature table
Temperature degree(℃) Vadc (mV)
-30 1887
-20 1814
-10 1711
0 1574
10 1408
20 1224
30 1035
40 856
50 695
60 558
70 446
80 355
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Make sure that the NTC thermistor can meet the above requirement. User can also add some resistors to
get desired voltage. The value of R1, R2 can be calculated according to the NTC curve and the above table.
Please refer to the following circuit for user’s application.
Figure 12: Application circuit
Normally R1=750Ω. Then the input voltage can be calculated by the following formula:
Vadc=2.2* Rf/（Rf+9.76+0.75 ）(V) —— Rf= Rt*R2/(Rt+R2)
User can take out R2 value through the existing Vadc and the value of NTC thermistor in a specific
temperature.
3.1.3 RTC Backup
The module uses RTC (Real Time Clock) to update and maintain inherent time and keeps system alive at
no power supply status. The RTC power supply of module can be provided by an external capacitor or a
battery (non-chargeable or rechargeable) through the VRTC. The following figures show various reference
circuits for RTC back up. The discharge current is less than 10uA. If this feature is used, please refer to the
AT commands “AT+CTZU” and “AT +CTZR”.
z External capacitor backup
RTC
Core
MODULE
VRTC
Non-chargeable
Backup Battery
Figure 13: RTC supply from capacitor
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z Non-chargeable battery backup
Figure 14: RTC supply from non-chargeable battery
z Rechargeable battery backup
Figure 15: RTC supply from rechargeable battery
Note: The VRTC can be disabled, jus disconnect it in application circuit.
Coin-type rechargeable battery is recommended, such as XH414H-IV01E form Seiko can be used.
Typical charge-discharge curves for this battery are shown in the following figure.
Figure 16: Seiko XH414H-IV01E Charge-Discharge characteristic
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3.2 Power on/off Time Sequence
3.2.1 Power on Sequence
SIM5320A can be powered on by POWER_ON pin, which starts normal operating mode.
POWER_ON pin is pulled up with a 200kR resistor to 1.8V in module. User can power on the SIM5320A
by pulling the POWER_ON pin down for a short time. The power-on scenarios are illustrated in the
following figures.
4.7 K
47K
Turn on/ off impulse
POWER_ON
Power
on / off logic
200K
1.8V
MODULE
Figure 17: Power on Timing Sequence
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Table 7: Power on timing
Parameter Description Time value Unit
Ton The time to pull POWER_ON down to power on 64< Ton<180 ms
TpD+ The time to indicate connecting with the network >5.5 s
Tpw+ The time to indicate the module is powered on
completely >4.5 s
Tuart The time to enable UART >4.7 s
Tusb The time to enable USB >9 s
Automatic power on
If user needs to power on SIM5320A automatically whenever the VBAT pins are connected to the power
supply, then POWER_ON pin is just pulled to ground by a resistance in circuit directly. The following is
the reference circuit.
10 K
POWER _ON Power
on /off logic
200K
1.8V
MODULE
R1
RESET
Reset impulse
V
IL
<0. 3V
50ms<t<200ms
VBAT
RESET
( Input)
Figure 18: Application circuit
Note: After automatically powering on the module by pulling down POWER_ON pin to ground anytime, USB/UART may
not communicate normally with host, so it is suggested that SIM5320A should be reset by RESET pin.
3.2.2 Power off Sequence
The following methods can be used to power down SIM5320A. These procedures will make module
disconnect from the network and allow the software to enter a safe state, and then save data before
completely powering the module off.
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● Method 1: Power off SIM5320A by pulling the POWER_ON pin down
● Method 2: Power off SIM5320A by AT command
User can power off the SIM5320A by pulling POWER_ON down for a specific time. The power off
scenario is illustrated in the following figure.
Figure 19: Power off timing sequence
Table 8: Power off timing
Parameter Description Time value Unit
Toff The time pulling POWER_ON down to power off 0.5< Toff<5 s
TpD- The time to indicate disconnecting from the network >7 s
Tpw- The time to indicate the module power off completely >7.5 s
Tuart_off The time to disable UART >6 s
Tusb_off The time to disable USB >7.5 s
User can also use the AT command “AT+ C POF ” to power down the module. After that, the AT commands
cannot be executed any longer. The module enters the POWER DOWN mode, only the RTC is still active.
For details, refer to Document [1].
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3.3 UART Interface
SIM5320A provides a UART (universal asynchronous serial transmission) port. It consists of a flexible
7-wire serial interface. The module is as the DCE (Data Communication Equipment) and the client PC is
as the DTE (Data Terminal Equipment). AT commands are entered and serial communication is performed
through UART interface. The application circuit is in the following figures.
Figure 20: Full modem
Figure 21: Null modem
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3.3.1 Pin Description
Table 9: Pin description
Pin type Pin name Pin No. I/O Active voltage Default Status
UART_RXD 68 I H Pull-Down
UART_TXD 71 O H Pull-Up
UART_RTS 66 O H
UART_CTS 67 I H Pull-Up
UART_DTR 72 I H Pull-Up
UART_DCD 70 O H
UART
UART_RI 69 O H
More pin information refers to chapter 2.2.
Table 10: Logic level
Parameter Min Max Unit
Logic low input 0 0.3*VDD_EXT V
Logic high input 0.7 *VDD_EXT VDD_EXT +0.3 V
Logic low output GND 0.2 V
Logic high output VDD_EXT -0.2 VDD_EXT V
Note: VDD_EXT (=2.6V) is e reference voltage in module internal interface.
All pins of all serial ports have 8mA driver capacity.
3.3.2 Application Guide
If UART port is used in Null Modem, the pin “RI” can be used as an interrupt signal to HOST. Normally it
will keep high logic level until certain condition such as receiving SMS, voice call (CSD, video) or URC
reporting, then “RI” will change to low logic level to inform the master (client PC). It will stay low until
the master clears the interrupt event with AT command.
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Figure 22: RI behaviour in NULL Modem
If Full Modem is used to establish communication between devices, the pin “RI” is another operation
status. Initially it keeps high, when a voice call or CSD call comes, the pin “RI” will change to low for
about 5900ms, then it will return to high level for 100ms. It will repeat this procedure until this call is
answered or hung up.
Figure 23: RI behaviour in FULL Modem
To comply with RS-232 protocol, the RS-232 level shifter chip should be used to connect SIM5320A to
the RS-232-C interface. In this connection, the TTL level and RS-232 level are converted mutually.
SIMCom recommends that user uses the SP3238ECA chip with a full modem. For more information
please refers to the RS-232 chip datasheet.
Note: SIM5320A supports the communication rate: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200,
230400, 460800, 921600, 3200000, 3686400, 4000000bps. Default rate is 115200bps.
3.4 Audio Interfaces
SIM5320A provides two analog signal outputs and one analog input. MIC1P/N is used as microphone,
EAR1P/N and SPK_P/N are used as audio output. Regarding audio parameters configuration, please refer
to the ATC manual.
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3.4.1 Pin Description
Table 11: Pin description
Audio channel Pin name Pin No. Function
MIC1P 23 MIC positive input
MIC1N 24 MIC negative input
EAR1P 26 Receiver positive output
Normal
EAR1N 25 Receiver negative output
MIC1P 23 MIC positive input
MIC1N 24 MIC negative input
SPK_P 22 Loudspeaker positive output
Hand-free
SPK_N 21 Loudspeaker negative output
Table 12: MIC input characteristics
Parameter Min Typ Max Unit
Working Voltage - 1.8 - V
Working Current 0.07 0.4 1 mA
External Microphone Load Resistance 1.2 2.2 k Ohms
Table 13: Audio output characteristics
Parameter Min Typ Max Unit
Load resistance 27 32 - Ohm Normal
(EAR_P,EAR_N) Differential Output power - 50 - mW
Table 14: Speaker output characteristics
Parameter Min Typ Max Unit
Quiescent Current - 2.5 4 mA
Output power(1KHz) - 500 - mW
3.4.2 Design Guide
There are three audio channels in SIM5320A，including speaker output , receiver output and microphone
input.
SPEAKER circuit in SIM5320A is a Class-D amplifier, optional EMI filter is shown in the following
figure; these components (two ferrite beads and two capacitors) can reduce electromagnetic interference. If
used, they should be located beside SPK_P and SPK_N pins. Considerable current flows in the channels,
so wider PCB traces are recommended (~ 20 mils).
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Figure 24: Speaker interface configuration
Figure 25: Receiver interface configuration
Figure 26: Microphone interface configuration
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Note: SIM5320A has integrated MIC bias circuit. There is no need to pull the MIC1P and MIC1N up to the external
power, just connect it to microphone. MIC1P and MIC1N must be differential lines.
3.4.3 Audio Parameter Characteristic
Main audio parameters can be changed to satisfy users’ requirement. Here primary register parameters and
related description are listed. User can adjust them through AT command. For more detail please refers to
Audio Application Document.
Table 15: Audio parameter
Parameter Influence to Range Gain range Calculation AT command
micAmp1
MICP/MICN
analogue amplifier
gain before ADC
0…1 0…24dB 2 steps AT+CMICAMP1
txVol Digital gain of input
signal after ADC
0,
1...65535
Mute,
-84...+12dB
20 * log
(txVol/
16384)
AT+CTXVOL
txGain
Digital gain of input
signal after
summation of
sidetone
0,
1...65535
Mute,
-84...+12dB
20 * log
(txGain/
16384)
AT+CTXGAIN
txFilter
Input PCM 13-tap
filter parameters, 7
values
0...65535 --- MATLAB
calculate AT+CTXFTR
rxGain
Digital gain of
output signal after
summation of
sidetone
0,
1...65535
Mute,
-84...+12dB
20 * log
(rxGain/
16384)
AT+CRXGAIN
rxVol
Digital Volume of
output signal after
speech decoder,
before summation of
sidetone and DAC
-300…300 dbm -300…300d
bm
AT+CLVL
AT+CVLVL
AT+CRXVOL
stGain Digital attenuation
of sidetone 0, 1...65535 Mute,
-96...0dB
20 * log
(stGain/
16384) -12
AT+SIDET
rxFilter
Output PCM 13-tap
filter parameters, 7
values
0...65535 --- MATLAB
calculate AT+CRXFTR
Note: If users require better experience on audio, users should modify these parameters according to their own electronic
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and mechanical design.
3.5 USIM Interface
The USIM provides the required subscription verification information to allow the mobile equipment to
attach to a GSM or UMTS network. Both 1.8V and 3.0V SIM Cards are supported.
3.5.1 Pin description
Table 16: Electronic characteristic
Table 17: Pin description
3.5.2 Application Guide
It is recommended to use an ESD protection component such as ST (www.st.com ) ESDA6V1W5 or ON
SEMI (www.onsemi.com ) SMF05C. Note that the SIM peripheral circuit should be close to the SIM card
socket. The reference circuit of the 8-pin SIM card holder is illustrated in the following figure.
3.0V mode 1.8V mode
Pin name Min Typ Max Min Typ Max
V_USIM 2.7 3.00 3.3 1.65 1.8 2.0
USIM_RESET 0.8* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM
USIM_CLK 0.7* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM
USIM_DATA 0.7* V_USIM 3.00 V_USIM 0.8* V_USIM 1.8 V_USIM
Pin name Pin Description
USIM_CLK 19 USIM Card Clock
USIM_RESET 18 USIM Card Reset
USIM_DATA 17
USIM Card data I/O, which has been pulled up with a 22kR resistor to
V_USIM in module. Do not pull up or pull down in users’ application
circuit.
V_USIM 20 USIM Card Power output depends automatically on USIM mode，one
is 3.0V±10%, another is 1.8V±10%. Current is less than 50mA.
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Figure 27: USIM interface reference circuit
Note: USIM_DATA has been pulled up with a 22kR resistor to V_USIM in module. A 220nF shut capacitor on V_USIM
is used to reduce interference. Use AT Commands to get information in USIM card. For more detail, please refer to
document [1].
3.5.3 Recommend Components
For 6 pins USIM socket, SIMCom recommend to use Amphenol C707 10M006 512 2. User can visit
http://www.amphenol.com for more information about the holder.
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Figure 28: Amphenol SIM card socket
Table 19: Amphenol USIM socket pin description
Pin Signal Description
C1 USIM_VDD
SIM Card Power supply, it can identify automatically the
SIM Card power mode，one is 3.0V±10%, another is
1.8V±10%.
C2 USIM_RST SIM Card Reset.
C3 USIM_CLK SIM Card Clock.
C5 GND Connect to GND.
C6 VPP Connect to USIM_VDD
C7 USIM_DATA SIM Card data I/O.
3.6 I2C Interface
I2C is used to communicate with peripheral equipments and can be operated as either a transmitter or
receiver, depending on the device function. Use AT Commands “AT+CRIIC and AT+CWIIC” to read/write
register values of related peripheral equipments connected with I2C interface.
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3.6.1 Pin Description
Table 18: Pin description
3.6.2 Signal Description
Both SDA and SCL are bidirectional lines, connected to a positive supply via a pull-up resistor
respectively. When the bus is free, both lines are high.
3.6.3 Design Guide
For SIM5320A, the data on the I2C bus can be transferred at rates up to 400kbps. The number of
peripheral devices connected to the bus is solely dependent on the bus capacitance limit of 400pF. Note
that PCB traces length and bending are in users’ control to minimize load capacitance.
Note
：
I2C_SDA and I2C _SCL have been pulled up with two 2.2kR resistors to 2.6V level in module. So there is no need
to pull them up in users’ application circuit.
3.7 Keypad Interface
SIM5320A module provides a keypad interface that supports five sense lines, or columns, and five keypad
rows. The interface generates an interrupt when any key is pressed. Its operation voltage is 1.8V.
3.7.1 Pin Description
Pin name Pin No. Function
I2C_SDA 56 Serial interface data input and output
I2C_SCL 55 Serial interface clock input
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Table 19: Pin description
Pin name Pin No. Function
KEYSENSE_N0 28
KEYSENSE_N1 27
KEYSENSE_N2 31
KEYSENSE_N3 32
KEYSENSE_N4 36
Sensing keys
KEYPAD_0 30
KEYPAD_1 29
KEYPAD_2 30
KEYPAD_3 35
KEYPAD_4 34
Driving pads
3.7.2 Application Guide
All keypad pins can be configured for GPIOs. These GPIOs also support interruption operation if used as
input pins. A typical circuit about the keypad (5*5 keypad matrix) is shown in the following figure.
Figure 29: Reference circuit
If these pins are configured for GPIOs, the sequence is listed in the following table.
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Table 20: GPIO configuration
Keypad interface GPIO No.
KEYPAD_4 GPIO6
KEYPAD_3 GPIO7
KEYPAD_2 GPIO8
KEYPAD_1 GPIO9
KEYPAD_0 GPIO10
KEYSENSE_N4 GPIO11
KEYSENSE_N 3 GPIO12
KEYSENSE_N 2 GPIO13
KEYSENSE_N 1 GPIO14
KEYSENSE_N 0 GPIO15
Note: Refer to document [23] for detailed information of Keypad Application Note.
3.8 USB Interface
SIM5320A module contains a USB interface. This interface is compliant with the USB2.0 specification.
The USB2.0 specification requires hosts such as the computer to support all three USB speeds, namely
low-speed (1.5Mbps), full-speed (12Mbps) and high-speed (480Mbps). USB charging and USB-OTG is
not supported.
Table 21: Electronic characteristic
Input voltage scope( V )
Pin name Pin No. Min Typ Max
USB_VBUS 11 4.4 5.0 5.25
USB_DP 13
USB_DM 12
They are compliant with the USB 2.0 specification.
3.8.1 Application Guide
Currently SIM5320A supports the USB suspend and resume mechanism which can help to save power.
If no transaction is on USB bus, SIM5320A will enter suspend mode. When some events such as voice call
or receiving SMS happen, SIM5320A will resume normal mode automatically.
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Figure 30: USB interface
Because of high bit rate on USB bus, pay attention to influence of junction capacitance of ESD component
on USB data lines. Typically, the capacitance should be less than 4pF @1MHz.
Note
：
The SIM5320A has two kinds of interface (UART and USB) to connect to host CPU. USB interface is mapped to
five virtual ports: “SIMTECH USB Modem”, “SIMTECH NMEA Device”, “SIMTECH ATCOM Device”, “SIMTECH
Diagnostics interface” and “SIMTECH Wireless Ethernet Adapter”.
3.9 SPI Interface
SPI interface of SIM5320A is master only. It provides a duplex, synchronous, serial communication link
with peripheral devices. Its operation voltage is 1.8V, with clock rates up to 26 MHz.
3.9.1 Pin Description
Table 22: Electronic characteristic
1.8V mode
Pin name Min Typ Max
SPI_CLK 1.65 1.8 1.95
SPI_CS_N 1.65 1.8 1.95
SPI_MOMI_DATA 1.65 1.8 1.95
SPI_MIMO_DATA 1.65 1.8 1.95
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Table 23: Pin description
3.10 GPIO Interface
SIM5320A provides a limited number of GPIO pins. All GPIOs can be configured as inputs or outputs.
User can use AT Commands to read or write GPIOs status. Refer to ATC document for details.
3.10.1 Pin Description
Table 24: Electronic characteristic
Note: If more GPIOs need to be used, users can configure GPIO on other multiple function interfaces, such as PCM.
Please refer to GPIO list.
Pin name Pin No. Function
SPI_CS 9 SPI chip-select; not mandatory in a point-to-point connection
SPI_MISO_DATA 7 SPI master in/slave out data
SPI_CLK 6 SPI clock
SPI_MOSI_DATA 8 SPI master out/slave in data
2.6V mode
Pin name Min Typ Max
GPIO1 2.5 2.6 2.7
GPIO4 2.5 2.6 2.7
GPIO40 2.5 2.6 2.7
GPIO41 2.5 2.6 2.7
GPIO43 2.5 2.6 2.7
GPIO44 2.5 2.6 2.7
GPIO42 2.5 2.6 2.7
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Table 25: Pin description
Note: The output driver current of GPIOs is 1mA at the lower supply voltage and 2mA at the higher supply voltage.
3.10.2 Application Guide
Network status
GPIO1 is used to control Network Status LED; application circuit is shown below.
Figure 31: Application circuit
Note: The value of resistor Rx depends on LED characteristic.
Pin name Pin No. I/O Function
GPIO1 51 O Output PIN as LED control for network status. If it is
unused, left open.
GPIO4 49 I
Input PIN as RF operating control.
H: Normal Mode L:Flight Mode
If it is unused, left open.
GPIO40 54 O
Output PIN as operating status indicating of module.
H: Power on L: Power off
If it is unused, left open.
GPIO41 52 I/O General input/output PIN. It can be used as wake/interrupt
signal to host from module If it is unused, left open.
GPIO42 53 I/O General Purpose Input/Output Port.
GPIO43 50 I/O
General Purpose Input/Output Port. It can be used as
wake/interrupt signal to module from host. If it is unused, left
open.
GPIO44 48 I/O General Purpose Input/Output Port
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Table 26: LED status
LED Status Module Status
Always On Searching Network/Call Connect
200ms ON, 200ms OFF Data Transmit
800ms ON, 800ms OFF Registered network
Off Power off / Sleep
Flight mode control
GPIO4 controls SIM5320A module to enter or exit the Flight mode. In Flight mode, SIM5320A closes RF
function to prevent interference with other equipments or minimize current consumption. Bidirectional
ESD protection component is suggested to add on GPIO4.
Figure 32: Flight mode switch
Table 27: Control status
GPIO4 Status Module operation
Low Level Flight Mode: RF is closed.
High Level Normal Mode: RF is working.
Note
：
1. For SIM5320A, GPIO0, GPIO2, GPIO3 and GPIO5 have multiplex function, user can use them as PCM
interface to connect extend codec. Refer to section 3.10 and document [1] for details.
2. When the module is powered off, make sure all digital interfaces (PCM UART, etc) connected with peripheral devices
have no voltage higher than 0.3V. If users’ design cannot meet above conditions, high level voltages maybe occur in
GPIO pins because current leakage from above digital interfaces may occur.
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3.11 PCM Interface
SIM5320A provides hardware PCM interface for external codec. The PCM interface enables
communication with an external codec to support hands-free applications. SIM5320A PCM interface can
be used in two modes: the default mode is auxiliary PCM (8 KHz long sync mode at 128 KHz PCM CLK);
the other mode is primary PCM (8 KHz short sync mode at 2048 KHz PCM CLK). In short-sync
(primary PCM) mode, SIM5320A can be a master or a slave. In long-sync (auxiliary PCM) mode,
SIM5320A is always a master. SIM5320A also supports 3 kinds of coding formats: 8 bits (υ-law or A-law)
and 16 bits (linear).
Note: PCM interface is multiplexed from GPIO (default setting). The AT command “AT+CPCM” is used to switch
between PCM and GPIO functions. Please refer to document [22] and document [1] for details.
3.11.1 Pin Description
Table 28: Electronic characteristic
2.6V mode
Pin name Min Typ Max
PCM_CLK 2.5 2.6 2.7
PCM_SYNC 2.5 2.6 2.7
PCM_DOUT 2.5 2.6 2.7
PCM_DIN 2.5 2.6 2.7
Table 29: Pin description
Pins Pin No. AUX_PCM
functionality
Primary PCM
functionality Description
PCM_DIN/GPIO0 74 AUX_PCM_DIN PCM_DIN PCM data input
PCM_SYNC/GPIO2 75 AUX_PCM_SYNC PCM_SYNC PCM data synchrony
PCM_DOUT/GPIO5 73 AUX_PCM_DOUT PCM_DOUT PCM data output
PCM_CLK/GPIO3 76 AUX_PCM_CLK PCM_CLK PCM data clock
3.11.2 Signal Description
The default PCM interface in SIM5320A is the auxiliary PCM interface. The data changes on the high
level of PCM_CLK and is sampled at the falling edge of PCM_CLK in one period. Primary PCM is
disabled after every power-on or every reset event. So user must use AT command to enable the primary
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PCM mode after powering on or resetting the module every time if user wants to use Primary
PCM.SIM5320A PCM Interface can be operated in Master or Slave mode if it is configured to primary
PCM. In Master Mode, the Module drives the clock and sync signals that are sent to the external codec.
When it is in Slave Mode, the external codec drives the clock and sync signals which are sent to the
module. Both PCM modes are discussed in this section followed by additional PCM topics.
Auxiliary PCM (128 KHz PCM clock)
υ-law coding is supported by the auxiliary PCM. The auxiliary codec port operates with standard
long-sync timing and a 128 KHz clock. The AUX_PCM_SYNC runs at 8 KHz with 50% duty cycle.
Most υ-law codec support the 128 KHz clock.
Figure 33: Synchrony timing
Figure 34: EXT CODEC to MODULE timing
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Figure 35: MODULE to EXT CODEC timing
Table 30: Timing parameters
Parameter Description Min Typ Max Unit
T(auxsync) AUX_PCM_SYNC cycle time – 125 - μs
T(auxsynch) AUX_PCM_SYNC high time 62.4 62.5 - μs
T(auxsyncl) AUX_PCM_SYNC low time 62.4 62.5 - μs
T(auxclk)* AUX_PCM_CLK cycle time - 7.8 – μs
T(auxclkh) AUX_PCM_CLK high time 3.8 3.9 – μs
T(auxclkl) AUX_PCM_CLK low time 3.8 3.9 – μs
T(suauxsync) AUX_PCM_SYNC setup time high before
falling edge of PCM_CLK 1.95 – – μs
T(hauxsync) AUX_PCM SYNC hold time after falling edge
of PCM_CLK 1.95 – – μs
T(suauxdin) AUX_PCM_DIN setup time before falling
edge of AUX_PCM_CLK 70 – – ns
T(hauxdin) AUX_PCM_DIN hold time after falling edge
of AUX_PCM_CLK 20 – – ns
T(pauxdout) Delay from AUX_PCM_CLK rising to
AUX_PCM_DOUT valid – – 50 ns
*Note: T(auxclk) = 1/(128 KHz).
Primary PCM (2048 KHz PCM clock)
SIM5320A also supports 2.048 MHz PCM data and sync timing for υ-law codec. This is called the
primary PCM interface. User can use AT command to take the mode you want as discussed above.
Figure36:Synchronytiming
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Figure 37: EXT CODEC to MODULE timing
Figure 38: MODULE to EXT CODEC timing
Table 31: Timing parameters
Parameter Description Min Typ Max Unit
T(sync) PCM_SYNC cycle time – 125 – μs
T(synch) PCM_SYNC high time 400 500 – ns
T(syncl) PCM_SYNC low time – 124.5 – μs
T(clk) PCM_CLK cycle time – 488 – ns
T(clkh) PCM_CLK high time – 244 – ns
T(clkl) PCM_CLK low time – 244 – ns
T(susync) PCM_SYNC setup time high before falling edge of
PCM_CLK 60 – – ns
T(hsync) PCM_SYNC hold time after falling edge of
PCM_CLK 60 – – ns
T(sudin) PCM_DIN setup time before falling edge of
PCM_CLK 50 – – ns
T(hdin) PCM_DIN hold time after falling edge of
PCM_CLK 10 – – ns
T(pdout) Delay from PCM_CLK rising to PCM_DOUT valid – – 350 ns
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T(zdout) Delay from PCM_CLK falling to PCM_DOUT
HIGH-Z – 160 – ns
Note: SIM5320A can transmit PCM data by USB except for PCM interface. Please refer to document [22] for more
information of PCM Application Note.
3.12 Global Positioning System
SIM5320A merges GPS satellite and network information to provide a high-availability solution that
offers industry-leading accuracy and performance. This solution performs well, even in very challenging
environmental conditions where conventional GPS receivers fail, and provides a platform to enable
wireless operators to address both location-based services and emergency mandates.
3.12.1 Technical specification
Tracking sensitivity -157 dBm
Cold-start sensitivity -144 dBm
Accuracy (Open Sky) <2m (CEP50)
TTFF (Open Sky) Hot start <1s Cold start 35s（good signal）/ 100s(weak signal)
Receiver Type 12-channel, GPS L1 Frequency (1575.42MHz), C/A Code
Update rate Default 1 Hz
GPS data format NMEA-0183
GPS Current consumption (WCDMA/GSM Sleep mode) 100mA (Total supply current)
GPS antenna Passive/Active antenna
Note: Performance will vary depending on the environment, antenna type and signal conditions and so on.
3.12.2 Operate Mode
SIM5320A supports both A-GPS and S-GPS, and then provides three operating modes: mobile-assisted
mode, mobile-based mode and standalone mode. A-GPS includes mobile-assisted and mobile-based mode.
In mobile-assisted mode, when a request for position location is issued, available network information is
provided to the location server (e.g. Cell-ID) and assistance is requested from the location server. The
location server sends the assistance information to the handset. The handset/mobile unit measures the GPS
observables and provides the GPS measurements along with available network data (that is appropriate for
the given air interface technology) to the location server. The location server then calculates the position
location and returns results to the requesting entity.
In mobile-based mode, the assistant data provided by the location server encompasses not only the
information required to assist the handset in measuring the satellite signals, but also the information
required to calculate the handset’s position. Therefore, rather than provide the GPS measurements and
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available network data back to the location server, the mobile calculates the location on the handset and
passes the result to the requesting entity.
In standalone (autonomous) mode, the handset demodulates the data directly from the GPS satellites.
This mode has some reduced cold-start sensitivity, and a longer time to first fix as compared to the assisted
modes. However, it requires no server interaction and works out of network coverage.
This combination of GPS measurements and available network information provides:
● High-sensitivity solution that works in all terrains: Indoor, outdoor, urban, and rural
● High availability that is enabled by using both satellite and network information
Therefore, while network solutions typically perform poorly in rural areas and areas of poor cell
geometry/density, and while unassisted, GPS-only solutions typically perform poorly indoors. The
SIM5320A GPS solution provides optimal time to fix, accuracy, sensitivity, availability, and reduced
network utilization in both of these environments, depending on the given condition.
3.12.3 Application Guide
Users can adopt an active antenna or a passive antenna as GPS signal transceiver. In this document, all
GPS specification mentioned is from passive antenna. The following is the reference circuit.
Figure 39: Active antenna circuit
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Figure 40：Passive antenna circuit (Default)
In above figures, the components C1 and L1, L2 are used for antenna matching, the values of the
components can only be obtained after the antenna tuning usually, and they are provided by antenna
vendor.C2 in Figure 39 is used for DC isolation. In active antenna circuit, users must use an external
LDO/DCDC to provide VDD voltage whose value should be taken according active antenna characteristic,
and VDD can be shut down to avoid consuming additional current when not being used.
GPS can be used by NMEA port. User can select NMEA as output through UART or USB. NMEA
sentences are automatic and no command is provided. NMEA sentences include GSV, GGA, RMC, GSA,
and VTG. Before using GPS, user should configure SIM5320A in proper operating mode by AT command.
Please refer to related document for details. SIM5320A can also get position location information through
AT directly.
Note:GPS is closed by default, it could be started by AT+CGPS. The AT command has two parameters, the first is on/off,
and the second is GPS mode. Default mode is standalone mode.
AGPS mode needs more support from the mobile telecommunication network. Refer to AGPS application document for
details.
3.13 Multi-functional interface
SIM5320A merges functions for various applications. It can enrich users’ design and lower the cost of
users’ hardware.
3.13.1 Sink Current Source
The dedicated pin (CURRENT_SINK) is intended for driving passive devices，such as LCD backlight, this
implementation is +5V tolerant and suitable for driving white LEDs. The high-current driver can maintain
a constant current which is set by the AT command “AT+ CLEDITST”, capable of up to 150 mA.
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Table 32: Electronic characteristic
Symbol Description Min Typ Max Unit
CURRENT_SINK Input voltage 0.5 VDD 5 V
IO Input current - - 150 mA
Since the driver is ground-referenced current sink, the operating device it drives must form a current path
between the VDD pin and the CURRENT_SINK pin. The following figure is for users reference.
MODULE
CURRENT_SINK
Pin 45 is +5V tolerant-
suitable for driving white
LEDs
Current Controls
Passive
device
+
-
VBAT
High
current
Figure 41: Current drive
Note: The sinking current can be adjusted to meet design requirement through the AT command “AT+ CLEDITST =<0>,
<value>”.The “value” ranges from 0 to 15,on behalf of the current changes from 0mA to 150mA in steps of 10mA.
3.13.2 Reset Function
SIM5320A also have a RESET pin (PIN4) to reset the module. This function is used as an emergency reset
only when AT command “AT+CPOF” and the POWER_ON pin has no effect. User can pull the RESET
pin to ground, then the module will reset.
This pin is already pulled up in module, so the external pull-up resistor is not necessary. A 100nF capacitor
close to the RESET pin is strongly recommended. A reference circuit is recommended in the following
figure.
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Figure 42: Reset circuit
Note
：
50ms<t<200ms. ESD components are suggested to be used on Reset pin.
3.13.3 ADC
SIM5320A has a dedicated ADC that is available for digitizing analog signals such as battery voltage and
so on; it is on PIN 47, namely ADC1. This ADC1 is 8 bit successive-approximation circuit, and electronic
specification is shown in the following table.
Table 33: Electronic Characteristics
Specification Min Typ Max Unit Comments/Conditions
Resolution 8 Bits
Differential nonlinearity -4 +4 LSB
Integral nonlinearity -8 +8 LSB
Gain Error -2.5 +2.5 %
Offset Error -4 +40 LSB
Analog Vdd = ADC reference
2.4MHz sample rate
Input Range GND 2.2V V
Input serial resistance 2 kΩ Sample and hold switch resistance
Input capacitance 53 pF
Power-down to wakeup 9.6 19.2 μs
User can introduce a signal in the ADC pin directly and use the AT command “AT+CADC” to get the raw
data which is between 0 and 255. The data can be transformed to any type such as voltage, temperature etc.
Please refer to Chapter 3.1.2 and document [1].
Figure 43: Reference circuit
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Note: The input signal voltage value in ADC must not be higher than 2.2V.
3.13.4 LDO
SIM5320A has a LDO power output, namely VREG_AUX. The LDO is available and output voltage is
2.85v by default, rated for 250mA. User can switch the LDO on or off by the AT command
“AT+CVAUXS” and configure its output voltage by the AT command “AT+CVAUXV”.
Table 34: Electronic characteristic
Symbol Description Min Typ Max Unit
VREG_AUX Output voltage 1.5 2.85 3.05 V
IO Output current - - 250 mA
4 RF Specification
4.1 RF Specification
Table 35: Conducted transmission power
Frequency Max Min
GSM850 33dBm ±2dB 5dBm ± 5dB
E-GSM900 33dBm ±2dB 5dBm ± 5dB
DCS1800 30dBm ±2dB 0dBm ± 5dB
PCS1900 30dBm ±2dB 0dBm ± 5dB
GSM850 (8-PSK) 27dBm ±3dB 5dBm ± 5dB
E-GSM900 (8-PSK) 27dBm ±3dB 5dBm ± 5dB
DCS1800 (8-PSK) 26dBm +3/-4dB 0dBm ±5dB
PCS1900(8-PSK) 26dBm +3/-4dB 0dBm ±5dB
WCDMA 2100 24dBm +1/-3dB -56dBm ±5dB
WCDMA 1900 24dBm +1/-3dB -56dBm ±5dB
WCDMA 850 24dBm +1/-3dB -56dBm ±5dB
WCDMA 900 24dBm + 1/-3dB -56dBm ±5dB
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Table 36: Operating frequencies
Frequency Receiving Transmission
GSM850 869 ～894 MHz 824 ～849 MHz
E-GSM900 925 ～960 MHz 880 ～915 MHz
DCS1800 1805～1880 MHz 1710～1785 MHz
PCS1900 1930～1990 MHz 1850～1910 MHz
WCDMA 2100 2110～2170 MHz 1920～1980 MHz
WCDMA1900 1930～1990 MHz 1850～1910 MHz
WCDMA 850 869 ～894 MHz 824 ～849 MHz
WCDMA 900 925 ～960 MHz 880 ～915 MHz
Table 37: Conducted receive sensitivity
Frequency Receive sensitivity
GSM850 < -106dBm
E-GSM900 < -106dBm
DCS1800 < -106dBm
DCS1800 < -106dBm
WCDMA 2100 < -108dBm
WCDMA 1900 < -108dBm
WCDMA 850 < -106dBm
WCDMA 900 < -106dBm
4.2 Operating Specification
SIM5320A can support high rate data by GSM/WCDMA wireless network. In the different network
environment, data transmission rate shifts depending on modulation and encoding.
Table 38: GPRS/EDGE data throughout
Function Coding schemes 1 Timeslot 2 Timeslot 4 Timeslot
CS-1 9.05kbps 18.1kbps 36.2kbps
CS-2 13.4kbps 26.8kbps 53.6kbps
CS-3 15.6kbps 31.2kbps 62.4kbps
GPRS
CS-4 21.4kbps 42.8kbps 85.6kbps
MCS-1 8.80kbps 17.6kbps 35.20kbps
MCS-2 11.2kbps 22.4kbps 44.8kbps
MCS-3 14.8kbps 29.6kbps 59.2kbps
MCS-4 17.6kbps 35.2kbps 70.4kbps
MCS-5 22.4kbps 44.8kbps 89.6kbps
MCS-6 29.6kbps 59.2kbps 118.4kbps
MCS-7 44.8kbps 89.6kbps 179.2kbps
MCS-8 54.4kbps 108.8kbps 217.6kbps
EDGE
MCS-9 59.2kbps 118.4kbps 236.8kbps
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Table 39: HSDPA throughout
Category Supported Max supported
HS-DSCH codes
Theoretical max
peak rate(Mbps) Modulation
Category1 5 1.2 16QAM,QPSK
Category2 5 1.2 16QAM,QPSK
Category3 5 1.8 16QAM,QPSK
Category4 5 1.8 16QAM,QPSK
Category5 3 5 3.6 16QAM,QPSK
Category6 3 5 3.6 16QAM,QPSK
Category7 10 7.2 16QAM,QPSK
Category8 10 7.2 16QAM,QPSK
Category9 15 10.0 16QAM,QPSK
Category10 15 14.0 16QAM,QPSK
Category11 5 0.9 QPSK
Category12 3 5 1.8 QPSK
Note: Actual throughout rates depend on network configuration, network loading, signal condition and so on.
4.3 Antenna Design Guide
SIM5320A provides RF antenna interface. Customer’s antenna should be located in the host board and
connected to module’s antenna pad through micro-strip line or other types of RF trace and the trace
impedance must be controlled in 50Ω. SIMCom recommends that the total insertion loss between the
antenna pad and antenna should meet the following requirements:
● GSM900/GSM850<0.5dB
● DCS1800/PCS1900 <0.9dB
● WCDMA 2100/1900<0.9dB
● WCDMA 900/850<0.5dB
To facilitate the antenna tuning and certification test, a RF connector and an antenna matching circuit
should be added. The following figure is the recommended circuit.
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Figure 44: Antenna matching circuit
In this figure, the components R1,C1,C2 and R2 is used for antenna matching, the value of components
can only be got after the antenna tuning, usually, they are provided by antenna vendor. By default, the R1,
R2 are 0 ohm resistors, and the C1, C2 are reserved for tuning.
The RF test connector in the figure is used for the conducted RF performance test, and should be placed as
close as to the module’s antenna pin. The traces impedance between components must be controlled in
50ohm.
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5 Reliability and Operating Characteristics
5.1 Electronic Characteristics
Absolute maximum rating for digital and analog pins of SIM5320A are listed in the following table:
Table 40: Absolute maximum ratings
Parameter Min Max Unit
Voltage at digital pins (1.8v mode) -0.3 1.8+0.3 V
Voltage at digital pins (2.6v mode) -0.3 2.6+0.3 V
Voltage at VBAT -0.5 6.0 V
Voltage at VRTC 1.5 3.2 V
Voltage at USB_VBUS -0.5 6.0 V
Table 41: Recommended operating ratings
Parameter Min Typ Max Unit
Voltage at digital pins (1.8v mode) 1.65 1.8 1.95 V
Voltage at digital pins (2.6v mode) 2.5 2.6 2.7 V
Voltage at VBAT 3.3 3.8 4.2 V
Voltage at VRTC 1.5 - 3.0 V
Voltage at USB_VBUS 4.75 5 5.25 V
The operating temperature and power specification is listed in the following table.
Table 42: Operating temperature
Parameter Min Typ Max Unit
Ambient temperature -30 25 80 ℃
Storage temperature -40 25 +85 ℃
Note: SIMCom recommends user to install a heat sink on the module shielding case if SIM5320A operates in WCDMA
band.
5.2 Operating Mode
The following table summarizes the various operating modes, each operating modes will be referred to in
the following chapters.
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5.2.1 Operating Modes Overview
Table 43: Operating Modes Overview
Mode Function
Sleep mode GSM/WCDM
A SLEEP
Module will automatically enter SLEEP mode if DTR is set to high
level and there is no on air or hardware interrupt (such as GPIO
interrupt or data on serial port).
In this case, the current consumption of module will be reduced to the
minimal level.
In SLEEP mode, the module can still receive paging message，voice
call and SMS.
GSM IDLE Software is active. Module has registered to the GSM network, and
the module is ready to communicate.
GSM
GSM TALK
Connection between two subscribers is in progress. In this case, the
power consumption depends on network settings (DTX off/on,
FR/EFR/HR, hopping sequences, etc.) and antenna.
GPRS
STANDBY
Module is ready for GPRS data transfer, but no data is currently sent
or received. In this case, power consumption depends on network
settings and GPRS configuration.
GPRS
GPRS DATA
There is GPRS data transfer (PPP or TCP or UDP) in progress. In this
case, power consumption is related with network settings (e.g. power
control level), uplink/downlink data rates and GPRS configuration
(e.g. used multi-slot settings).
EDGE
STANDBY
Module is ready for data transfer in EDGE mode, but no data is
currently sent or received. In this case, power consumption depends
on network settings and EDGE configuration
EDGE
EDGE DATA
There is EDGE data transfer (PPP or TCP or UDP) in progress. In this
case, power consumption is related with network settings (e.g. power
control level), uplink/downlink data rates and EDGE configuration.
WCDMA
IDLE
Module has registered to the WCDMA network, and the module is
ready to communicate.
WCDMA WCDMA
TALK
Module is active in WCDMA mode. The power consumption depends
on network settings.
HSDPA IDLE
Module is ready for data transmission, but no data is currently sent or
received. Power consumption depends on network settings and
HSDPA configuration
HSDPA
HSDPA
DATA
There is HSDPA data transfer (PPP or TCP or UDP) in progress. In
this case, power consumption is related with network settings (e.g.
power control level), uplink/downlink data rates and HSDPA
configuration
Power down
Module can be powered down by the AT command “AT+CPOF” or the POWER_ON
pin. The power management unit shuts down the power supply of the module, only the
power supply of RTC is remained. The serial interface is not accessible. Operating
voltage (connected to VBAT) remains applied.
Minimum
functionality
mode
The AT command “AT+CFUN” can be used to set the module to a minimum
functionality mode without removing the power supply. In this mode, the RF part of
the module will not work or the SIM card will not be accessible, or both will be closed,
and the serial port is still accessible. The power consumption in this mode is very low.
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5.2.2 Minimize Power Consumption
There are two modes that SIM5320A achieves low power consumption.
Sleep mode
If peripheral equipments stops working, and there is no on air or hardware interrupts (such as GPIO
interrupts or data on UART), SIM5320A will enter sleep mode automatically. In this mode, SIM5320A can
still receive paging，voice call or SMS from network. If USB interface of SIM5320A is connected to host
CPU, but host CPU does not support USB suspending, then SIM5320A will not enter sleep mode. After
USB is disconnected, SIM5320A will enter sleep mode.
Note: When UART interface is connected with host CPU, SIM5320A can not enter sleep mode until RXD is pulled down
by the host CPU. If the module is in the idle mode, make sure to pull the RXD to low level by host CPU. SIMCom
recommends using GPIO43 or UART_DTR to wake up the module from host CPU and to use GPIO41 or UART_RI to
wake up the host CPU. Before designing, pay attention to how to realize waking function and refer to Document[24] and
Document[25] for more detail.
Minimum functionality mode
Minimum functionality mode ceases a majority function of module, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality levels.
● AT+CFUN=0: Minimum functionality
● AT+CFUN=1: Full functionality (Default)
● AT+CFUN=4: Disable RF function of the module (Flight mode)
If SIM5320A has been set to minimum functionality mode, the module will firstly enter sleep mode, then
the RF function and SIM card function will be closed. In this case, the serial port is still accessible, but RF
function or SIM card will be unavailable. When SIM5320A is in minimum functionality or flight mode, it
can return to full functionality by the AT command “AT+CFUN=1”.
Note: For flight mode, please refer to Chapter 2.12.2.
5.3 Current Consumption
The current consumption in suspended mode and without USB connection is listed in the table below.
Here, “suspended mode” means that SIM5320A is connected to USB bus, but it does not transfer data.
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Table 44: Current consumption
GSM Sleep mode (without USB connection)
GSM850
Sleep @DRX=2 4.5mA
Sleep @DRX=5 2.7mA
Sleep @DRX=9 2.3mA
GSM900
Sleep @DRX=2 4.5mA
Sleep @DRX=5 2.7mA
Sleep @DRX=9 2.3mA
DCS1800
Sleep @DRX=2 4.5mA
Sleep @DRX=5 2.7mA
Sleep @DRX=9 2.3mA
PCS1900
Sleep @DRX=2 4.5mA
Sleep @DRX=5 2.7mA
Sleep @DRX=9 2.3mA
GSM Sleep Mode (with USB suspended)
GSM850
Sleep @DRX=2 4.6mA
Sleep @DRX=5 2.8mA
Sleep @DRX=9 2.5mA
GSM900
Sleep @DRX=2 4.6mA
Sleep @DRX=5 2.8mA
Sleep @DRX=9 2.5mA
DCS1800
Sleep @DRX=2 4.6mA
Sleep @DRX=5 2.8mA
Sleep @DRX=9 2.5mA
PCS1900
Sleep @DRX=2 4.6mA
Sleep @DRX=5 2.8mA
Sleep @DRX=9 2.5mA
Voice Call
GSM850 @power level #5 <300mA,Typical 305mA
GSM 900 @power level #5 <300mA,Typical 305mA
DCS1800 @power level #0 <250mA,Typical 237mA
PCS1900 @power level #0 <250mA,Typical 237mA
GPRS Data
DATA mode, GPRS ( 1 Rx,4 Tx ) CLASS 12
GSM 850 @power level #5 <660mA,Typical 488mA
GSM 900 @power level #5 <660mA,Typical 484mA
DCS1800 @power level #0 <530mA,Typical 346mA
PCS1900 @power level #0 <530mA,Typical 353mA
DATA mode, GPRS ( 3Rx, 2 Tx ) CLASS 12
GSM 850 @power level #5 <460mA,Typical 335mA
GSM 900 @power level #5 <440mA,Typical 332mA
DCS1800 @power level #0 <400mA,Typical 260mA
PCS1900 @power level #0 <300mA,Typical 263mA
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EDGE Data
DATA mode, EDGE( 1 Rx,4 Tx ) CLASS 12
GSM 850 @power level #8 <500mA,Typical 335mA
GSM 900 @power level #8 <500mA,Typical 332mA
DCS1800 @power level #2 <450mA,Typical 291mA
PCS1900 @power level #2 <450mA,Typical 293mA
DATA mode, EDGE( 3Rx, 2 Tx ) CLASS 12
GSM 850 @power level #8 <330mA,Typical 235mA
GSM 900 @power level #8 <330mA,Typical 231mA
DCS1800 @power level #2 <300mA,Typical 206mA
PCS1900 @power level #2 <300mA,Typical 209mA
UMTS Sleep Mode (without USB connection)
WCDMA 2100
Sleep @DRX=9 2.2mA
Sleep @DRX=8 2.7 mA
Sleep @DRX=6 4.7mA
WCDMA 1900
Sleep @DRX=9 2.2mA
Sleep @DRX=8 2.7 mA
Sleep @DRX=6 4.7mA
WCDMA 850
Sleep @DRX=9 2.2mA
Sleep @DRX=8 2.7 mA
Sleep @DRX=6 4.7mA
WCDMA 900
Sleep @DRX=9 2.2mA
Sleep @DRX=8 2.7 mA
Sleep @DRX=6 4.7mA
UMTS Sleep Mode (with USB suspended)
WCDMA 2100
Sleep @DRX=9 2.4mA
Sleep @DRX=8 2.8 mA
Sleep @DRX=6 4.8mA
WCDMA 1900
Sleep @DRX=9 2.4mA
Sleep @DRX=8 2.8 mA
Sleep @DRX=6 4.8mA
WCDMA 850
Sleep @DRX=9 2.4mA
Sleep @DRX=8 2.8 mA
Sleep @DRX=6 4.8mA
WCDMA 900
Sleep @DRX=9 2.4mA
Sleep @DRX=8 2.8 mA
Sleep @DRX=6 4.8mA
UMTS Talk
WCDMA 2100
@Power 23dBm Typical 539mA
@Power 21dBm Typical 461mA
@Power 10dBm Typical 195mA
WCDMA 1900
@Power 23dBm Typical 604mA
@Power 21dBm Typical 507mA
@Power 10dBm Typical 195mA
WCDMA 850 @Power 23dBm Typical 517mA
@Power 21dBm Typical 419mA
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@Power 10dBm Typical 189mA
WCDMA 900
@Power 23dBm Typical 524mA
@Power 21dBm Typical 417mA
@Power 10dBm Typical 179mA
HSDPA Data
WCDMA 2100
@Power 23dBm CQI=22 Typical 550mA
@Power 21dBm CQI=5 Typical 520mA
@Power -5dBm CQI=22 Typical 270mA
WCDMA 1900
@Power 23dBm CQI=22 Typical 610mA
@Power 21dBm CQI=5 Typical 540mA
@Power -5dBm CQI=22 Typical 270mA
WCDMA 850
@Power 23dBm CQI=22 Typical 550mA
@Power 21dBm CQI=5 Typical 490mA
@Power -5dBm CQI=22 Typical 220mA
WCDMA 900
@Power 23dBm CQI=22 Typical 550mA
@Power 21dBm CQI=5 Typical 490mA
@Power -5dBm CQI=22 Typical 220mA
5.4 EMC and ESD Notes
EMC tests should be performed to detect any potential problems. Possible harmful emissions radiate by
the application to the RF receiver in the receiver band. RF emissions interfere with audio input/output. It is
recommended to shield the sensitive components and trace with common ground and user can add beads
where necessary.
Normally SIM5320A is mounted on customer host board. Although some ESD components have been
added in SIM5320A, to prevent ESD, user should put some ESD components on customers’ board. The
ESD components should be placed beside the connectors which human body might touch, such as SIM
card holder, audio jacks, switches, keys, etc. The following table is the SIM5320A ESD measurement
performance; the results are from SIMCom EVB test.
Table 45: The ESD performance measurement table (Temperature: 25 , Humidity:℃ 45%)
Part Contact discharge Air discharge
VBAT,GND ±4KV ±6KV
UART,USB ±2KV ±6KV
Antenna port ±4KV ±6KV
Other ports ±2KV ±2KV
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6 Guide for Production
6.1 Top and Bottom View of SIM5320A
Figure 45: Top and bottom view of SIM5320A
These test points are only used for module manufacturing and testing. They are not for customer’s
application.
6.2 Typical Solder Reflow Profile
For customer convenience, SIMCom provides a typical example for a commonly used soldering profile. In
final board assembly, the typical solder reflow profile will be determined by the largest component on the
board, as well as the type of solder/flux used and PCB stack-up. Therefore the soldering profile shown
below is only a generic recommendation and should be adjusted to the specific application and
manufacturing constraints.
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Figure 46: The ramp-soak-spike reflow profile of SIM5320A
For details about secondary SMT, please refer to document [26].
6.3 Moisture Sensitivity Level (MSL)
SIM5320A is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-020.
After the prescribed time limit exceeded, users should bake modules for 192 hours in drying equipment
(<5% RH) at 40° C +5° C/-0° C, or 72 hours at 85° C +5° C/-5° C. Note that plastic tray is not
heat-resistant, users must not use the tray to bake at 85° C or the tray may be damaged.
6.4 Stencil Foil Design Recommendation
The recommended thickness of stencil foil is more than 0.18mm.
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6.5 Recommended Pad Design
Module Outline
A
B
A:B=1.0mm:0.8mm
Figure 47: Recommended pad
Note: More designing details refer to Figure 6.
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Appendix
A. System Design
C103C102C101
VBAT_RF
VBAT_RF
VBAT_BB
Power supply
100uF 100nF 22pF
UART_TXD
UART_RXD
UART_CTS
UART_RTS
UART_RI
UART_DCD
UART_DTR
C109
220nF
V_USIM
USIM_RESET
USIM_CLK
USIM_DATA
VBAT_BB
62
63
38
39
C105C104
100uF 100nF
Power supply
61
64
GND
GND
37
40
GND
GND
POWER_ON
RESET
3
4
Reset impulse
20~200ms
4.7K
47K
Turn on/off impulse
>64ms
UART_TXD
UART_RXD
UART_CTS
UART_RTS
UART_RI
UART_DCD
UART_DTR
71
68
67
66
69
70
72
23
1GND
GND
0R
C107C106
Main Antenna
NC NC
MAIN_ANT
59
58
GND
GND
57
C107
GPS Antenna
33pF
GPS_ANT 79
78
GND
GND
77 NC
L101 NC
L102
GND 80
GND
60
SIM_DATA
SIM_VDD
SIM_RST
SIM_CLK
SMF05C
EAR1N
EAR1P
MIC1N
MIC1P
SPK_N
SPK_P
24
26
25
22
21
MIC
32R
8R
0.5W
ESD & Decoupling
capacitors required.
Please refers to Audio
interface chapter.
GPIO4
USB_VBUS
RF ON/OFF
11
12
GPIO1
10K
10K
300R
LED
Network
Status
USB_DP 13
32
USB_DM
USB_VBUS
USB_DM
USB_DP
28
27
31
36
29
33
35
30
36
KEYSENSE_N0
KEYSENSE_N2
KEYSENSE_N1
KEYSENSE_N3
KEYPAD_0
KEYSENSE_N4
KEYPAD_1
KEYPAD_3
KEYPAD_2
KEYPAD_4
76
74
75
73
6
7
9
8
45
PCM_DIN/GPIO0
PCM_DOUT/GPIO5
PCM_SYNC/GPIO2
PCM_CLK/GPIO3
SPI_CLK_N
SPI_MISO_DATA
SPI_CS
SPI_MOSI_DATA
CURRENT_SINK
123
456
789
*0#
Audio CODEC Chip
or
DSP
LCD
Display
51
54
VREG_AUX VREG_AUX
44
IIC_SCL I2C_SCL
55
IIC_SDA I2C_SDA
56
ADC1 HKADC
Input range:0-2.2V
ADC2
47
46
Reserve
Reserve
15
16
VRTC
17
19
18
20
42
C108
If RTC is unused， keep
VRTC pin open.
GPIO40
52
53
50
48
49
GPIO41
GPIO42
GPIO43
GPIO44
5GND
GND
2
10
14 GND
GND
43 GND
GND
41
65
Output : DC 1.5-3V
R102
R103
R104
R105
R106
R107
TVS
If USB interface is used， connect
USB_VBUS to DC 4.4V-5.25V
100uF
HOST_WAKEUP
MODULE_WAKEUP
TVS
FB101 300 OHM
Ferrite Beads Rated current > 1A
Figure 48: System design
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B. SIM5320A GPIOs List
Table 46: SIM5320A GPIOs list
Name GPIO Index Default Function Alternate Function
PCM_DIN 0 GPIO Interrupt [LEVEL/LOW] PCM_DIN
STATUS_LED 1 Status led GPIO
PCM_SYNC 2 GPIO [IN] PCM_SYNC
PCM_CLK 3 GPIO [OUT/LOW] PCM_CLK
RF_SWITCH 4 RF Switch Enable/Disable RF subsystem
PCM_OUT 5 GPIO [OUT/LOW] PCM_OUT
KEYPAD_4 6 Keypad GPIO
KEYPAD_3 7 Keypad GPIO
KEYPAD_2 8 Keypad GPIO
KEYPAD_1 9 Keypad GPIO
KEYPAD_0 10 Keypad GPIO
KEYSENSE_N4 11 Keypad GPIO
KEYSENSE_N3 12 Keypad GPIO
KEYSENSE_N2 13 Keypad GPIO
KEYSENSE_N1 14 Keypad GPIO
KEYSENSE_N0 15 Keypad GPIO
UART1_CTS 33 CTS GPIO
UART1_RFR 34 RTS GPIO
UART1_DTR 35 DTR wake up module GPIO
UART_DCD 36 DCD GPIO
UART_RI 37 RI wake up host GPIO
GPIO40 40 Module power up status GPIO
GPIO41 41 Wake up host GPIO
GPIO42 42 GPIO GPIO
GPIO43 43 Wake up module GPIO
GPIO44 44 GPIO GPIO
C. Digital I/O Characteristics
Table 47: Digital I/O characteristics
2.6V Mode 1.8V Mode
Parameter Description Min Typ Max Min Typ Max Unit
VREG_AUX LDO output 0 2.6 2.9 0 1.8 1.84 V
VIH High-level
input voltage 1.69 2.6 2.9 1.17 1.8 2.1 V
VIL Low-level
input voltage -0.3 0 0.91 -0.3 0 0.63 V
VOH High-level 1.17 2.6 2.6 0.81 1.8 1.8 V
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output voltage
VOL Low-level
output voltage 0 0 0.45 0 0 0.45 V
IIH
Input high
leakage
current
- - 1 - - 1 uA
IIL
Input low
leakage
current
-1 - - -1 - - uA
CIN Input
capacitance - - 7 - - 7 pF
Note: These parameters are for digital interface pins, such as keypad, GPIO, I2C, UART, SPI and DEBUG. The
SIM5320A includes two kinds of voltages: 1.8v and 2.6v. Digital I/O specifications under both conditions are presented in
the above tables.
D. Related Documents
Table 48: Related documents
SN Document name Remark
[1] SIM5320A_ATC_V1.00 SIM5320A_ATC_V1.00
[2] ITU-T Draft new
recommendationV.25ter Serial asynchronous automatic dialing and control
[3] GSM 07.07 Digital cellular telecommunications (Phase 2+); AT command set
for GSM Mobile Equipment (ME)
[4] GSM 07.10 Support GSM 07.10 multiplexing protocol
[5] GSM 07.05
Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment (DTE –
DCE) interface for Short Message Service (SMS) and Cell
Broadcast Service (CBS)
[6] GSM 11.14
Digital cellular telecommunications system (Phase 2+);
Specification of the SIM Application Toolkit for the Subscriber
Identity Module – Mobile Equipment (SIM – ME) interface
[7] GSM 11.11
Digital cellular telecommunications system (Phase 2+);
Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
[8] GSM 03.38 Digital cellular telecommunications system (Phase 2+); Alphabets
and language-specific information
[9] GSM 11.10
Digital cellular telecommunications system (Phase 2)； Mobile
Station (MS) conformance specification； Part 1: Conformance
specification
[10] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile
Station (MS) conformance specification
[11] 3GPP TS 34.124 Electromagnetic Compatibility (EMC) for mobile terminals and
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ancillary equipment.
[12] 3GPP TS 34.121 Electromagnetic Compatibility (EMC) for mobile terminals and
ancillary equipment.
[13] 3GPP TS 34.123-1
Technical Specification Group Radio Access Network; Terminal
conformance specification; Radio transmission and reception
(FDD)
[14] 3GPP TS 34.123-3 User Equipment (UE) conformance specification; Part 3: Abstract
Test Suites.
[15] EN 301 908-02 V2.2.1
Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
IMT-2000. Third Generation cellular networks; Part 2:
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article
3.2 of the R&TTE Directive
[16] EN 301 489-24 V1.2.1
Electromagnetic compatibility and Radio Spectrum Matters (ERM);
Electromagnetic Compatibility (EMC) standard for radio
equipment and services; Part 24: Specific conditions for IMT-2000
CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio
and ancillary equipment
[17] IEC/EN60950-1(2001) Safety of information technology equipment (2000)
[18] 3GPP TS 51.010-1 Digital cellular telecommunications system (Release 5); Mobile
Station (MS) conformance specification
[19] GCF-CC V3.23.1 Global Certification Forum - Certification Criteria
[20] 2002/95/EC
Directive of the European Parliament and of the Council of 27
January 2003 on the restriction of the use of certain hazardous
substances in electrical and electronic equipment (RoHS)
[21] Audio Application Note
V1.01 Audio Application Note V1.01
[22] PCM Application Note
V1.02 PCM Application Note V1.02
[23] Keypad Application
Note V1.01 Keypad Application Note V1.01
[24] Sleep_Application_Note Sleep_Application_Note
[25] Waking_up_Applicatio
n_Note
Waking_up_Application_Note
[26] Module
secondary-SMT-UGD
SMT Note
E. Terms and Abbreviations
Table 49: Terms and Abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
ARP Antenna Reference Point
BER Bit Error Rate
BTS Base Transceiver Station
CS Coding Scheme
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CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DRX Discontinuous Reception
DSP Digital Signal Processor
DTE Data Terminal Equipment (typically computer, terminal, printer)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FCC Federal Communications Commission (U.S.)
FD SIM fix dialing phonebook
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HR Half Rate
I2C Inter-Integrated Circuit
IMEI International Mobile Equipment Identity
Inorm Normal Current
Imax Maximum Load Current
kbps Kilo bits per second
Li-Ion Lithium-Ion
MO Mobile Originated
MS Mobile Station (GSM engine), also referred to as TE
MT Mobile Terminated
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCS Personal Communication System, also referred to as GSM 1900
RF Radio Frequency
RMS Root Mean Square (value)
RTC Real Time Clock
Rx Receive Direction
SIM Subscriber Identification Module
SMS Short Message Service
SPI serial peripheral interface
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
TX Transmit Direction
UART Universal Asynchronous Receiver & Transmitter
VSWR Voltage Standing Wave Ratio
Vmax Maximum Voltage Value
Vnorm Normal Voltage Value
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Vmin Minimum Voltage Value
VIHmax Maximum Input High Level Voltage Value
VIHmin Minimum Input High Level Voltage Value
VILmax Maximum Input Low Level Voltage Value
VILmin Minimum Input Low Level Voltage Value
VImax Absolute Maximum Input Voltage Value
VImin Absolute Minimum Input Voltage Value
VOHmax Maximum Output High Level Voltage Value
VOHmin Minimum Output High Level Voltage Value
VOLmax Maximum Output Low Level Voltage Value
VOLmin Minimum Output Low Level Voltage Value
SM SIM phonebook
NC Not connect
EDGE Enhanced data rates for GSM evolution
HSDPA High Speed Downlink Packet Access
HSUPA High Speed Uplink Packet Access
ZIF Zero intermediate frequency
WCDMA Wideband Code Division Multiple Access
VCTCXO Voltage control temperature-compensated crystal oscillator
USIM Universal subscriber identity module
UMTS Universal mobile telecommunications system
UART Universal asynchronous receiver transmitter
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F. Safety Caution
Table 50: Safety caution
Marks Requirements
When in a hospital or other health care facility, observe the restrictions about the use of
mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive
to not operate normally for RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to prevent
interference with communication systems. Forget to think much of these instructions
may lead to the flight safety or offend against local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any electrical
equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios, computers
or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
networks and cannot be guaranteed to connect in all conditions, for example no mobile
fee or a invalid SIM card. While you are in this condition and need emergent help,
please remember using emergency calls. In order to make or receive calls, the cellular
terminal or mobile must be switched on and in a service area with adequate cellular
signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate
those features before you can make an emergency call.
Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.
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Contact us:
Shanghai SIMCom Wireless Solutions Ltd.
Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R.
China 200335
Tel: +86 21 3235 3300
Fax: +86 21 3235 3301
URL: www.sim.com/wm