Simcom 1103022011008 GSM/GPRS/EDGE/WCDMA/HSDPA module User Manual SIM5320 HD V1 01

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SIM5320A_Hardware Design_V1.01
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Document Title
SIM5320A Hardware Design
Version
1.01
Date
2011-2-29
Status
Release
Document Control ID
SIM5320A_Hardware Design_V1.01
General Notes
SIMCom offers this information as a service to its customers, to support application and engineering
efforts that use the products designed by SIMCom. The information provided is based upon requirements
specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search
for additional relevant information, including any information that may be in the customer’s possession.
Furthermore, system validation of this product designed by SIMCom within a larger electronic system
remains the responsibility of the customer or the customer’s system integrator. All specifications supplied
herein are subject to change.
NOTICE:
This device complies with Part 15 of the FCC Rules [and with RSS-210 of Industry Canada].
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications made to this equipment not expressly approved by SIMCOM may void the
FCC authorization to operate this equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that interference will not occur in
a particular installation. If this equipment does cause harmful interference to radio or television
reception, which can be determined by turning the equipment off and on, the user is encouraged to try to
correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
• Consult the dealer or an experienced radio/TV technician for help.
This Class [B] digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe [B] est conforme à la norme NMB-003 du Canada.
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Radiofrequency radiation exposure Information:
The module does not contain antenna. It has an antenna PIN. The module is to be used in mobile
or fixed applications only. For other antenna(s) selection, the antenna gain including cable loss must
not exceed 7.2 dBi in the 850 MHz Cellular band and 3.5 dBi in the PCS 1900 MHz band, for the purpose
of satisfying the requirements of FCC 2.1043 and 2.1091. The antenna used for this module must be
installed to provide a separation distance of at least 20 cm from all persons, and must not be co-located
or operating in conjunction with other antennas or transmitters within a host device, except in accordance
with FCC multi-transmitter product procedures. Compliance of this module in all final product
configurations is the responsibility of the Grantee. OEM integrators must be provided with specific
information required to satisfy RF exposure compliance for all final host devices and installations. OEM
integrators can replace the antenna by themselves. They should comply with Consideration for antenna
selection and Consideration for antenna installation.
Copyright
This document contains proprietary technical information which is the property of SIMCom Limited,
copying of this document and giving it to others and the using or communication of the contents thereof,
are forbidden without express authority. Offenders are liable to the payment of damages. All rights
reserved in the event of grant of a patent or the registration of a utility model or design. All specification
supplied herein are subject to change without notice at any time.
Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2011
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Contents
Revision History ........................................................................................................................................ 10
Introduction .........................................................................................................................................11
1.1 Product Outline...............................................................................................................................11
1.2 Hardware Interface Overview.........................................................................................................11
1.3 Hardware Diagram......................................................................................................................... 12
1.4 Functional Overview...................................................................................................................... 12
Package Information .......................................................................................................................... 14
2.1 Pin Configuration........................................................................................................................... 14
2.2 Pin description ............................................................................................................................... 16
2.3 Package Dimensions ...................................................................................................................... 19
2.4 Footprint Recommendation ........................................................................................................... 20
Application Interface Specification................................................................................................... 21
3.1 Power Supply................................................................................................................................. 21
3.1.1 Power Supply Pin.................................................................................................................... 21
3.1.2 Design Guide .......................................................................................................................... 22
3.1.3 RTC Backup............................................................................................................................ 25
3.2 Power on/off Time Sequence ......................................................................................................... 27
3.2.1 Power on Sequence ................................................................................................................. 27
3.2.2 Power off Sequence ................................................................................................................ 28
3.3 UART Interface.............................................................................................................................. 30
3.3.1 Pin Description........................................................................................................................ 31
3.3.2 Application Guide................................................................................................................... 31
3.4 Audio Interfaces............................................................................................................................. 32
3.4.1 Pin Description........................................................................................................................ 33
3.4.2 Design Guide .......................................................................................................................... 33
3.4.3 Audio Parameter Characteristic .............................................................................................. 35
3.5 USIM Interface .............................................................................................................................. 36
3.5.1 Pin description ........................................................................................................................ 36
3.5.2 Application Guide................................................................................................................... 36
3.5.3 Recommend Components ....................................................................................................... 37
3.6 I2C Interface .................................................................................................................................. 38
3.6.1 Pin Description........................................................................................................................ 39
3.6.2 Signal Description................................................................................................................... 39
3.6.3 Design Guide .......................................................................................................................... 39
3.7 Keypad Interface............................................................................................................................ 39
3.7.1 Pin Description........................................................................................................................ 39
3.7.2 Application Guide................................................................................................................... 40
3.8 USB Interface ................................................................................................................................ 41
3.8.1 Application Guide................................................................................................................... 41
3.9 SPI Interface .................................................................................................................................. 42
3.9.1 Pin Description........................................................................................................................ 42
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3.10
GPIO Interface ........................................................................................................................... 43
3.10.1
Pin Description .................................................................................................................... 43
3.10.2
Application Guide ............................................................................................................... 44
3.11
PCM Interface ............................................................................................................................ 46
3.11.1
Pin Description .................................................................................................................... 46
3.11.2
Signal Description ............................................................................................................... 46
3.12
Global Positioning System ......................................................................................................... 50
3.12.1
Technical specification ........................................................................................................ 50
3.12.2
Operate Mode ...................................................................................................................... 50
3.12.3
Application Guide ............................................................................................................... 51
3.13
Multi-functional interface........................................................................................................... 52
3.13.1
Sink Current Source ............................................................................................................ 52
3.13.2
Reset Function ..................................................................................................................... 53
3.13.3
ADC..................................................................................................................................... 54
3.13.4
LDO..................................................................................................................................... 55
RF Specification .................................................................................................................................. 55
4.1 RF Specification ............................................................................................................................ 55
4.2 Operating Specification ................................................................................................................. 56
4.3 Antenna Design Guide................................................................................................................... 57
Reliability and Operating Characteristics........................................................................................ 59
5.1 Electronic Characteristics .............................................................................................................. 59
5.2 Operating Mode ............................................................................................................................. 59
5.2.1 Operating Modes Overview .................................................................................................... 60
5.2.2 Minimize Power Consumption ............................................................................................... 61
5.3 Current Consumption..................................................................................................................... 61
5.4 EMC and ESD Notes ..................................................................................................................... 64
Guide for Production.......................................................................................................................... 65
6.1 Top and Bottom View of SIM5320A ............................................................................................ 65
6.2 Typical Solder Reflow Profile ....................................................................................................... 65
6.3 Moisture Sensitivity Level (MSL) ................................................................................................. 66
6.4 Stencil Foil Design Recommendation ........................................................................................... 66
6.5 Recommended Pad Design ............................................................................................................ 67
Appendix .................................................................................................................................................... 68
A. System Design..................................................................................................................................... 68
B. SIM5320A GPIOs List........................................................................................................................ 69
C. Digital I/O Characteristics................................................................................................................... 69
D. Related Documents ............................................................................................................................. 70
E. Terms and Abbreviations..................................................................................................................... 71
F. Safety Caution...................................................................................................................................... 74
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Table Index
Table 1: SIM5320A series frequency bands.................................................................................................................... 11
Table 2: General Feature ................................................................................................................................................. 12
Table 3: Pin definition..................................................................................................................................................... 15
Table 4: Pin description................................................................................................................................................... 16
Table 5: Pin description................................................................................................................................................... 21
Table 6: Temperature table.............................................................................................................................................. 24
Table 7: Power on timing ................................................................................................................................................ 28
Table 8: Power off timing ............................................................................................................................................... 29
Table 9: Pin description................................................................................................................................................... 31
Table 10: Logic level....................................................................................................................................................... 31
Table 11: Pin description................................................................................................................................................. 33
Table 12: MIC input characteristics ................................................................................................................................ 33
Table 13: Audio output characteristics ............................................................................................................................ 33
Table 14: Speaker output characteristics ......................................................................................................................... 33
Table 15: Audio parameter .............................................................................................................................................. 35
Table 16: Electronic characteristic .................................................................................................................................. 36
Table 17: Pin description................................................................................................................................................. 36
Table 18: Pin description................................................................................................................................................. 39
Table 19: Pin description................................................................................................................................................. 40
Table 20: GPIO configuration......................................................................................................................................... 41
Table 21: Electronic characteristic .................................................................................................................................. 41
Table 22: Electronic characteristic .................................................................................................................................. 42
Table 23: Pin description................................................................................................................................................. 43
Table 24: Electronic characteristic .................................................................................................................................. 43
Table 25: Pin description................................................................................................................................................. 44
Table 26: LED status....................................................................................................................................................... 45
Table 27: Control status .................................................................................................................................................. 45
Table 28: Electronic characteristic .................................................................................................................................. 46
Table 29: Pin description................................................................................................................................................. 46
Table 30: Timing parameters........................................................................................................................................... 48
Table 31: Timing parameters........................................................................................................................................... 49
Table 32: Electronic characteristic .................................................................................................................................. 53
Table 33: Electronic Characteristics................................................................................................................................ 54
Table 34: Electronic characteristic .................................................................................................................................. 55
Table 35: Conducted transmission power ....................................................................................................................... 55
Table 36: Operating frequencies ..................................................................................................................................... 56
Table 37: Conducted receive sensitivity.......................................................................................................................... 56
Table 38: GPRS/EDGE data throughout ......................................................................................................................... 56
Table 39: HSDPA throughout.......................................................................................................................................... 57
Table 40: Absolute maximum ratings.............................................................................................................................. 59
Table 41: Recommended operating ratings ..................................................................................................................... 59
Table 42: Operating temperature..................................................................................................................................... 59
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Table 43: Operating Modes Overview ............................................................................................................................ 60
Table 44: Current consumption....................................................................................................................................... 62
Table 45: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) .......................................... 64
Table 46: SIM5320A GPIOs list ..................................................................................................................................... 69
Table 47: Digital I/O characteristics................................................................................................................................ 69
Table 48: Related documents .......................................................................................................................................... 70
Table 49: Terms and Abbreviations................................................................................................................................. 71
Table 50: Safety caution.................................................................................................................................................. 74
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Figure Index
Figure 1: SIM5320A functional architecture................................................................................................................... 12
Figure 2: Pin view........................................................................................................................................................... 14
Figure 3: Top dimensions (Unit: mm) ............................................................................................................................. 19
Figure 4: Side dimensions (Unit: mm) ............................................................................................................................ 19
Figure 5: Bottom dimensions (Unit: mm) ....................................................................................................................... 20
Figure 6: Footprint recommendation (Unit: mm)............................................................................................................ 20
Figure 7: VBAT_RF voltage drop during burst emission (GSM/GPRS)......................................................................... 21
Figure 8: VBAT input application circuit........................................................................................................................ 22
Figure 9: Reference circuit of the LDO power supply .................................................................................................... 23
Figure 10: Reference circuit of the DCDC power supply ............................................................................................... 23
Figure 11: Internal circuit................................................................................................................................................ 24
Figure 12: Application circuit ......................................................................................................................................... 25
Figure 13: RTC supply from capacitor............................................................................................................................ 25
Figure 14: RTC supply from non-chargeable battery ...................................................................................................... 26
Figure 15: RTC supply from rechargeable battery .......................................................................................................... 26
Figure 16: Seiko XH414H-IV01E Charge-Discharge characteristic............................................................................... 26
Figure 17: Power on Timing Sequence ........................................................................................................................... 27
Figure 18: Application circuit ......................................................................................................................................... 28
Figure 19: Power off timing sequence ............................................................................................................................ 29
Figure 20: Full modem.................................................................................................................................................... 30
Figure 21: Null modem ................................................................................................................................................... 30
Figure 22: RI behaviour in NULL Modem ..................................................................................................................... 32
Figure 23: RI behaviour in FULL Modem ...................................................................................................................... 32
Figure 24: Speaker interface configuration ..................................................................................................................... 34
Figure 25: Receiver interface configuration.................................................................................................................... 34
Figure 26: Microphone interface configuration .............................................................................................................. 34
Figure 27: USIM interface reference circuit ................................................................................................................... 37
Figure 28: Amphenol SIM card socket ........................................................................................................................... 38
Figure 29: Reference circuit............................................................................................................................................ 40
Figure 30: USB interface ................................................................................................................................................ 42
Figure 31: Application circuit ......................................................................................................................................... 44
Figure 32: Flight mode switch ........................................................................................................................................ 45
Figure 33: Synchrony timing .......................................................................................................................................... 47
Figure 34: EXT CODEC to MODULE timing................................................................................................................ 47
Figure 35: MODULE to EXT CODEC timing................................................................................................................ 48
Figure 36: Synchrony timing .......................................................................................................................................... 48
Figure 37: EXT CODEC to MODULE timing................................................................................................................ 49
Figure 38: MODULE to EXT CODEC timing................................................................................................................ 49
Figure 39: Active antenna circuit .................................................................................................................................... 51
Figure 40：Passive antenna circuit (Default) ................................................................................................................. 52
Figure 41: Current drive.................................................................................................................................................. 53
Figure 42: Reset circuit................................................................................................................................................... 54
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Figure 43: Reference circuit............................................................................................................................................ 54
Figure 44: Antenna matching circuit............................................................................................................................... 58
Figure 45: Top and bottom view of SIM5320A .............................................................................................................. 65
Figure 46: The ramp-soak-spike reflow profile of SIM5320A........................................................................................ 66
Figure 47: Recommended pad ........................................................................................................................................ 67
Figure 48: System design................................................................................................................................................ 68
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Revision History
Data
Version
Description of change
Author
2011-2-29
1.01
Original
Xiaoyangyang
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1 Introduction
This document describes electronic specifications, RF specifications, function interface, mechanical
characteristic and testing conclusions of the SIMCom SIM5320A module. With the help of this document
and other SIM5320A software application notes, user guides, users can quickly understand and use
SIM5320A module to design and develop applications quickly.
1.1
Product Outline
Designed for global market, SIM5320A is a quad-band GSM/GPRS/EDGE and dual-band UMTS /HSDPA
that works on frequencies of GSM 850MHz, EGSM 900 MHz, DCS 1800 MHz, PCS 1900MHz and
WCDMA 1900/850MHz. User can choose the module based on the wireless network configuration. In this
document, the entire radio band configuration of SIM5320A series is described in the following table.
Table 1: SIM5320A series frequency bands
Standard
GSM
WCDMA
Frequency
SIM5320A
GSM 850MHz
EGSM 900MHz
DCS1800MHz
PCS1900MHz
WCDMA 850MHz
WCDMA 900MHz
WCDMA 1900MHz
WCDMA 2100MHz
HSPA
HSDPA
HSUPA
With a tiny configuration of 30*30*2.9 mm and integrated functions, SIM5320A can meet almost any
space requirement in users’ application, such as Smart phone, PDA phone, industrial handhelds,
machine-to-machine, vehicle applications, etc..
There are 80 pins on SIM5320A, which provide most application interfaces for customers’ board.
1.2
Hardware Interface Overview
Sub-interfaces are described in detail in the next chapter, which includes:
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●
●
●
●
●
●
●
●
●
●
●
●
●
●
1.3
Power Supply
USB Interface
Serial Interface
Analog Audio Interfaces
SIM Interface
GPIO
ADC
LDO Power Output
Sink Current Source
PCM Interface
Keypad Interface
SPI Interface
RTC
I2C Interface
Hardware Diagram
The global architecture of the SIM5320A Embedded module is described in the figure below.
Figure 1: SIM5320A functional architecture
1.4
Functional Overview
Table 2: General Feature
Feature
Implementation
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Power supply
Single supply voltage 3.3～4.2V
●
●
Transmission data
●
●
●
●
GPS
SMS
SIM interface
Audio features(optional)
Serial interface
Dual-mode UMTS/HSDPA/EDGE/GPRS operation
GPRS Class B, multislot class 12 operation, Supports coding scheme:
CS1-4
EDGE multislot class 12 operation, Supports coding schemes
MSC1-9
UMTS R99 data rates-384 kbps DL/UL
HSDPA Category 5/6 -3.6 Mbps Category12-1.8 Mbps
CSD feature: 9.6, 14.4, 64 kbps UL/DL
Mobile-Assisted mode
Mobile-based mode
Standalone mode
● MT, MO, CB, Text and PDU mode
● SMS storage: SIM card
● Support transmission of SMS alternatively over CSD or GPRS.
User can choose preferred mode.
●
●
●
Support identity card: 1.8V, 3V.
Speech codec modes:
● Half Rate (ETS 06.20)
● Full Rate (ETS 06.10)
● Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
● AMR (WCDMA)
● AMR+QCP (GSM)
● A5/1, A5/2, and A5/3 ciphering
●
●
Serial Port standard or null modem mode on Serial Port Interface
Serial Port can be used to control module by sending AT command
USB
Support USB2.0 Slave mode
Phonebook management
Support phonebook types: SM, FD, LD, RC, ON, MC.
Support SAT class 3, GSM 11.14 Release 98
Support USAT
SIM application toolkit
Real Time Clock
Timer function
Physical characteristics
Firmware upgrade
PCM
Temperature range
Support RTC
Programmable by AT command
Size:30*30*2.9mm
Weight:5.6g
Firmware upgrade over USB interface
Multiplex on GPIOs. 3 kinds of coding formats: 8 bit (υ-law or A-law)
and 16 bit (linear).
●
●
Operation temperature: -30°C to +80°C
Storage temperature -40°C to +85°C
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2 Package Information
2.1
Pin Configuration
All hardware interfaces which connect SIM5320A to customers’ application platform are through 80 pins
pads (Metal half hole). Figure 2 is SIM5320A outline diagram.
Figure 2: Pin view
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Table 3: Pin definition
Pin No.
Define
Pin No.
Define
GND
GND
POWER_ON
RESET
GND
SPI_CLK
SPI_MISO_DATA
SPI_MOSI_DATA
SPI_CS_N
10
GND
11
USB_VBUS
12
USB_DM
13
USB_DP
14
GND
15
RESERVED
16
RESERVED
17
USIM_DATA
18
USIM_RESET
19
USIM_CLK
20
V_USIM
21
SPK_M
22
SPK_P
23
MIC1P
24
MIC1N
25
EAR1N
26
EAR1P
27
KEYSENSE_N1
28
KEYSENSE_N0
29
KEYPAD_0
30
KEYPAD_2
31
KEYSENSE_N2
32
KEYSENSE_N3
33
KEYPAD_1
34
KEYPAD_4
35
KEYPAD_3
36
KEYSENSE_N4
37
GND
38
VBAT_BB
39
VBAT_BB
40
GND
41
GND
42
VRTC
43
GND
44
VREG_AUX
45
CURRENT_SINK
46
ADC2
47
ADC1
48
GPIO44
49
GPIO40
50
GPIO43
51
GPIO1
52
GPIO41
53
GPIO42
54
GPIO4
55
I2C_SCL
56
I2C_SDA
57
GND
58
GND
59
MAIN_ANT
60
GND
61
GND
62
VBAT_RF
63
VBAT_RF
64
GND
65
GND
66
UART_RTS
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67
UART_CTS
68
UART_RXD
69
UART_RI
70
UART_DCD
71
UART_TXD
72
UART_DTR
73
PCM_DOUT
74
PCM_DIN
75
PCM_SYNC
76
PCM_CLK
77
GND
78
GND
79
GPS_ANT
80
GND
2.2
Pin description
Table 4: Pin description
Pin name
I/O
Description
Comment
Power Supply
VBAT_RF/VBAT_BB
Power supply voltage
VRTC
I/O
Power supply for RTC
VREG_AUX
LDO power output
GND
If it is unused, keep open.
Ground
Power on/off
POWER_ON
POWER_ON should be pulled low at
least 64ms to power on or 500ms to
power off the module.
Differential audio input
If it is unused, connect to
ground through a 100N
capacitor.
Differential audio output
If these pins are unused，
keep open.
Audio interface
MIC1P
MIC1N
EAR1P
EAR1N
SPK_P
SPK_N
USIM interface
V_USIM
Voltage Supply for SIM card
Support 1.8V or 3V SIM card
USIM_DATA
I/O
SIM Data Output/Input
USIM_CLK
USIM_RESET
SIM Clock
SIM Reset
SPI_CLK
SPI clock
SPI_CS_N
SPI chip-select
All signals of SIM
interface
should
be
protected
against
ESD/EMC.
SPI interface
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SPI_MOSI_DATA
SPI (master only) master out/slave in
data
SPI_MISO_DATA
SPI (master only) master in/slave out
data
USB_VBUS
USB power supply input
USB_DP
I/O
USB_DM
I/O
USB
Plus (+) line of the differential,
bi-directional USB signal to/from the
peripheral device.
Minus (-) line of the differential,
bi-directional USB signal to/from the
peripheral device.
They are compliant with
the USB 2.0 specification.
If it is unused, keep open.
Serial interface
UART_RXD
Receive Data
UART_TXD
Transmit Data
UART_RTS
Request to send
UART_CTS
Clear to Send
UART_RI
UART_DTR
UART_DCD
I/O
Ring Indicator
DTE get ready
Carrier detects
I2C_SDA
I/O
I2C data
I2C_SCL
I2C clock output
KEYPAD_0
Bit 0 drive to the pad matrix
KEYPAD_1
Bit 1 drive to the pad matrix
KEYPAD_2
Bit 2 drive to the pad matrix
KEYPAD_3
Bit 3 drive to the pad matrix
KEYPAD_4
Bit 4 drive to the pad matrix
KEYSENSE_N0
Bit 0 for sensing key press on pad
matrix
KEYSENSE_ N1
Bit 1 for sensing key press on pad
matrix
KEYSENSE_ N2
Bit 2 for sensing key press on pad
matrix
KEYSENSE_ N3
Bit 3 for sensing key press on pad
matrix
KEYSENSE_ N4
Bit 4 for sensing key press on pad
matrix
General Input PIN with module
wake/interrupt. It also can be
multiplexed as the PCM_DIN pin.
UART_RXD has been
pulled down with a 12kR
resistor to ground in the
module.
If it is unused, keep open.
I2C interface
Pulled up with a 2.2kR
resistor to 2.6V internally.
If it is unused, keep open.
Keypad interface
All Keypad pins can be
configured as GPIOs.
If it is unused, keep open.
PCM interface
PCM_DIN/GPIO0
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If it is unused, keep open.
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PCM_SYNC/GPIO2
PCM_CLK/GPIO3
PCM_DOUT/GPIO5
General Input PIN. It also can be
multiplexed as the PCM_SYNC pin.
General Output PIN. It also can be
multiplexed as the PCM_CLK pin.
General Output PIN. It also can be
multiplexed as the PCM_DOUT pin.
GPIOs
GPIO1
Output PIN as LED control for
network status.
GPIO4
Input PIN as RF operating control.
GPIO40
GPIO41
I/O
GPIO43
I/O
GPIO44
I/O
General input/output PIN.
GPIO42
I/O
General input/output PIN.
RESET
System reset in, active low.
CURRENT_SINK
Current source of ground-referenced
current sink
Refer to 3.13
ADC1
Analog Digital Converter Input
Refer to 3.13
ADC2
Battery temperature ADC input pin
Detailed description please
refers to chapter 3.1.2.
MAIN_ANT
I/O
ANT soldering pad
GPS_ANT
I/O
GPS ANT soldering pad
Output PIN as operating status
indicating of module.
General input/output PIN. It can be
used as wake/interrupt signal to host
from module
General input/output PIN. It can be
used as wake/interrupt signal to
module from host.
If it is unused, keep open.
Other interface
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2.3
Package Dimensions
The following figure shows mechanical dimensions of SIM5320A.
Figure 3: Top dimensions (Unit: mm)
Figure 4: Side dimensions (Unit: mm)
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Figure 5: Bottom dimensions (Unit: mm)
2.4
Footprint Recommendation
Figure 6: Footprint recommendation (Unit: mm)
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3 Application Interface Specification
3.1
Power Supply
The power supply pins of SIM5320A include VBAT_RF and VBAT_BB. VBAT_RF directly supplies the
power to RF PA; VBAT_BB supplies the power to the baseband system. For the VBAT_RF, the ripple due
to GSM/GPRS emission burst (every 4.615ms）may cause voltage drop, and the current consumption rises
typically to peak of 2A. So the power supply must be able to provide sufficient current up to 2A. The
following figure is the VBAT_RF voltage ripple wave at the maximum power transmit phase.
The test condition: VBAT_RF=4.0V, VBAT maximum output current =2A, CA=100 µF tantalum capacitor
(ESR=0.7Ω) and CB=1µF(Please refer to Figure 8—Application circuit).
Figure 7: VBAT_RF voltage drop during burst emission (GSM/GPRS)
3.1.1
Power Supply Pin
Two VBAT_RF and two VBAT_BB pins are dedicated to connect the supply voltage.
Table 5: Pin description
Pin type
POWER
Pin name
Min
Typ
Max
Unit
VBAT_RF
3.3
3.8
4.2
VBAT_BB
3.3
3.8
4.2
Note: 1.Though the VBAT_RF and VBAT_BB are supplied by the same voltage level, they are different pins. VBAT_RF
is for RF section and VBAT_BB is for baseband system.
2. When the module is power off, users must pay attention to the issue about current leakage. Refer to Chapter 3.10.2
Note2.
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3.1.2
Design Guide
Mostly, user connects the VBAT_RF and VBAT_BB pins with one power supply. Make sure that the input
voltage at the VBAT_BB pin will never drop below 3.3V even during a transmit burst when the current
consumption rises up to 2A. If the power voltage drops below 3.3V, the module may be shut down
automatically. Using a large tantalum capacitor (above 100uF) will be the best way to reduce the voltage
drops. If the power current cannot support up to 2A, users must introduce larger capacitor (typical 1000uF)
to storage electric power, especially GPRS multiple time slots emission.
For the consideration of RF performance and system stability, another large capacitor (above 100uF)
should be located at the VBAT_RF pin and some multi-layer ceramic chip (MLCC) capacitors (0.1uF)
need to be used for EMC because of their low ESR in high frequencies. Note that capacitors should be put
beside VBAT_RF pins as close as possible. Also User should minimize the PCB trace impedance from the
power supply to the VBAT pins through widening the trace to 80 mil or more on the board. The following
figure is the recommended circuit.
Figure 8: VBAT input application circuit
There are three sections about how to design and optimize users’ power systems.
Power supply circuit
We recommend DCDC or LDO is used for the power supply of the module, make sure that the peak
current of power components can rise up to 2A. The following figure is the reference design of +5V input
power supply. The designed output for the power supply is 4.1V, here a linear regulator can be used.
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C101
100uF
C102
1uF
U101 MIC29302
1 ON/
OFF
PWR_CTRL
Vout
Vin
GND
DC INPUT
FB 5
FB101
VBAT
270 OHM
R101
100K
+ C103
C104
330uF 100nF
R102
43K
Figure 9: Reference circuit of the LDO power supply
If there is a big difference between the input voltage and the desired output (VBAT), a switching converter
power will be preferable because of its better efficiency, especially at the high current situation. The
following figure is the reference circuit. Note that DCDC may deprave RF performance because of ripple
current intrinsically.
Figure 10: Reference circuit of the DCDC power supply
Voltage monitor
To monitor the power supply voltage, user can use the AT command “AT+CBC”, this command has two
parameters: the battery status and the voltage value (mV). It will return the capacity percentage and actual
value of battery (at the VBAT_BB pin). The voltage is continuously measured at intervals, whenever the
measured battery voltage is lower than a specific value set by the AT command “AT+CVALARM”. For
example, if the voltage value is set to be 3.4V, the following URC will be presented: “warning! voltage is
low: 3.3v”.
If the voltage is lower than a specific value which is set by the AT command “AT+CPMVT”, the module
will be powered off automatically and AT commands cannot be executed any more.
Note: Under-voltage warning function is disabled by default, user can enable it by the AT command “AT+CVALARM”.
Auto power off feature is disabled by default, user should set it by the AT command “AT+CPMVT” to an appropriate
value. Please refer to Document [1].
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Temperature monitor
ADC interface can be used to monitor the temperature of power components to avoid over temperature. An
external NTC resistor (such as NCP15XH103F03RC) can be used to measure the device temperature. The
ADC1 pin can be used as external voltage detection. Please refer to Chapter 3.17. ADC2 is the ADC input
pin for temperature detection. The following figure shows the application circuit.
Figure 11: Internal circuit
From above figure, the input voltage can be calculated:
Vadc=2.2* Rt/（Rt+9.76 ）(V)
Rt is a NTC thermistor.
The default temperature VS Vadc voltage table is shown below.
Table 6: Temperature table
Temperature degree(℃)
Vadc (mV)
-30
1887
-20
1814
-10
1711
1574
10
1408
20
1224
30
1035
40
856
50
695
60
558
70
446
80
355
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Make sure that the NTC thermistor can meet the above requirement. User can also add some resistors to
get desired voltage. The value of R1, R2 can be calculated according to the NTC curve and the above table.
Please refer to the following circuit for user’s application.
Figure 12: Application circuit
Normally R1=750Ω. Then the input voltage can be calculated by the following formula:
Vadc=2.2* Rf/（Rf+9.76+0.75 ）(V)
—— Rf= Rt*R2/(Rt+R2)
User can take out R2 value through the existing Vadc and the value of NTC thermistor in a specific
temperature.
3.1.3
RTC Backup
The module uses RTC (Real Time Clock) to update and maintain inherent time and keeps system alive at
no power supply status. The RTC power supply of module can be provided by an external capacitor or a
battery (non-chargeable or rechargeable) through the VRTC. The following figures show various reference
circuits for RTC back up. The discharge current is less than 10uA. If this feature is used, please refer to the
AT commands “AT+CTZU” and “AT +CTZR”.
External capacitor backup
MODULE
VRTC
RTC
Core
Non-chargeable
Backup Battery
Figure 13: RTC supply from capacitor
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Non-chargeable battery backup
Figure 14: RTC supply from non-chargeable battery
Rechargeable battery backup
Figure 15: RTC supply from rechargeable battery
Note: The VRTC can be disabled, jus disconnect it in application circuit.
Coin-type rechargeable battery is recommended, such as XH414H-IV01E form Seiko can be used.
Typical charge-discharge curves for this battery are shown in the following figure.
Figure 16: Seiko XH414H-IV01E Charge-Discharge characteristic
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3.2
3.2.1
Power on/off Time Sequence
Power on Sequence
SIM5320A can be powered on by POWER_ON pin, which starts normal operating mode.
POWER_ON pin is pulled up with a 200kR resistor to 1.8V in module. User can power on the SIM5320A
by pulling the POWER_ON pin down for a short time. The power-on scenarios are illustrated in the
following figures.
1.8V
200K
Power
on / off logic
POWER_ON
4.7K
Turn on/ off impulse
MODULE
47K
Figure 17: Power on Timing Sequence
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Table 7: Power on timing
Parameter
Description
Time value
Unit
Ton
The time to pull POWER_ON down to power on
64< Ton<180
ms
TpD+
The time to indicate connecting with the network
>5.5
Tpw+
The time to indicate the module is powered on
completely
>4.5
Tuart
The time to enable UART
>4.7
Tusb
The time to enable USB
>9
Automatic power on
If user needs to power on SIM5320A automatically whenever the VBAT pins are connected to the power
supply, then POWER_ON pin is just pulled to ground by a resistance in circuit directly. The following is
the reference circuit.
1.8V
RESET
Reset impulse
200K
Power
on /off logic
POWER _ON
R1
10 K
MODULE
VBAT
50ms7
Tpw-
The time to indicate the module power off completely
>7.5
Tuart_off
The time to disable UART
>6
Tusb_off
The time to disable USB
>7.5
User can also use the AT command “AT+CPOF” to power down the module. After that, the AT commands
cannot be executed any longer. The module enters the POWER DOWN mode, only the RTC is still active.
For details, refer to Document [1].
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3.3
UART Interface
SIM5320A provides a UART (universal asynchronous serial transmission) port. It consists of a flexible
7-wire serial interface. The module is as the DCE (Data Communication Equipment) and the client PC is
as the DTE (Data Terminal Equipment). AT commands are entered and serial communication is performed
through UART interface. The application circuit is in the following figures.
Figure 20: Full modem
Figure 21: Null modem
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3.3.1
Pin Description
Table 9: Pin description
Pin type
UART
Pin name
Pin No.
I/O
Active voltage
Default Status
UART_RXD
68
Pull-Down
UART_TXD
71
Pull-Up
UART_RTS
66
UART_CTS
67
Pull-Up
UART_DTR
72
Pull-Up
UART_DCD
70
UART_RI
69
More pin information refers to chapter 2.2.
Table 10: Logic level
Parameter
Min
Max
Unit
Logic low input
0.3*VDD_EXT
Logic high input
0.7 *VDD_EXT
VDD_EXT +0.3
Logic low output
GND
0.2
Logic high output
VDD_EXT -0.2
VDD_EXT
Note: VDD_EXT (=2.6V) is e reference voltage in module internal interface.
All pins of all serial ports have 8mA driver capacity.
3.3.2
Application Guide
If UART port is used in Null Modem, the pin “RI” can be used as an interrupt signal to HOST. Normally it
will keep high logic level until certain condition such as receiving SMS, voice call (CSD, video) or URC
reporting, then “RI” will change to low logic level to inform the master (client PC). It will stay low until
the master clears the interrupt event with AT command.
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Figure 22: RI behaviour in NULL Modem
If Full Modem is used to establish communication between devices, the pin “RI” is another operation
status. Initially it keeps high, when a voice call or CSD call comes, the pin “RI” will change to low for
about 5900ms, then it will return to high level for 100ms. It will repeat this procedure until this call is
answered or hung up.
Figure 23: RI behaviour in FULL Modem
To comply with RS-232 protocol, the RS-232 level shifter chip should be used to connect SIM5320A to
the RS-232-C interface. In this connection, the TTL level and RS-232 level are converted mutually.
SIMCom recommends that user uses the SP3238ECA chip with a full modem. For more information
please refers to the RS-232 chip datasheet.
Note: SIM5320A supports the communication rate: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200,
230400, 460800, 921600, 3200000, 3686400, 4000000bps. Default rate is 115200bps.
3.4
Audio Interfaces
SIM5320A provides two analog signal outputs and one analog input. MIC1P/N is used as microphone,
EAR1P/N and SPK_P/N are used as audio output. Regarding audio parameters configuration, please refer
to the ATC manual.
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3.4.1
Pin Description
Table 11: Pin description
Audio channel
Normal
Hand-free
Pin name
MIC1P
MIC1N
EAR1P
EAR1N
MIC1P
MIC1N
SPK_P
SPK_N
Pin No.
23
24
26
25
23
24
22
21
Function
MIC positive input
MIC negative input
Receiver positive output
Receiver negative output
MIC positive input
MIC negative input
Loudspeaker positive output
Loudspeaker negative output
Table 12: MIC input characteristics
Parameter
Working Voltage
Min
Typ
1.8
Max
Unit
Working Current
External Microphone Load Resistance
0.07
1.2
0.4
2.2
mA
k Ohms
Table 13: Audio output characteristics
Parameter
Normal
(EAR_P,EAR_N)
Differential
Load resistance
Output power
Min
27
Typ
32
50
Max
Unit
Ohm
mW
Table 14: Speaker output characteristics
Parameter
Quiescent Current
Output power(1KHz)
3.4.2
Min
Typ
2.5
500
Max
Unit
mA
mW
Design Guide
There are three audio channels in SIM5320A，including speaker output , receiver output and microphone
input.
SPEAKER circuit in SIM5320A is a Class-D amplifier, optional EMI filter is shown in the following
figure; these components (two ferrite beads and two capacitors) can reduce electromagnetic interference. If
used, they should be located beside SPK_P and SPK_N pins. Considerable current flows in the channels,
so wider PCB traces are recommended (~ 20 mils).
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Figure 24: Speaker interface configuration
Figure 25: Receiver interface configuration
Figure 26: Microphone interface configuration
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Note: SIM5320A has integrated MIC bias circuit. There is no need to pull the MIC1P and MIC1N up to the external
power, just connect it to microphone. MIC1P and MIC1N must be differential lines.
3.4.3
Audio Parameter Characteristic
Main audio parameters can be changed to satisfy users’ requirement. Here primary register parameters and
related description are listed. User can adjust them through AT command. For more detail please refers to
Audio Application Document.
Table 15: Audio parameter
Parameter
Influence to
Range
Gain range
Calculation
AT command
micAmp1
MICP/MICN
analogue amplifier
gain before ADC
0…1
0…24dB
2 steps
AT+CMICAMP1
txVol
Digital gain of input
signal after ADC
0,
1...65535
Mute,
-84...+12dB
20 * log
(txVol/
16384)
AT+CTXVOL
txGain
Digital gain of input
signal
after
summation
of
sidetone
0,
1...65535
Mute,
-84...+12dB
20 * log
(txGain/
16384)
AT+CTXGAIN
txFilter
Input PCM 13-tap
filter parameters, 7
values
0...65535
---
MATLAB
calculate
AT+CTXFTR
rxGain
Digital
gain
of
output signal after
summation
of
sidetone
0,
1...65535
Mute,
-84...+12dB
20 * log
(rxGain/
16384)
AT+CRXGAIN
rxVol
Digital Volume of
output signal after
speech
decoder,
before summation of
sidetone and DAC
-300…300
dbm
-300…300d
bm
AT+CLVL
AT+CVLVL
AT+CRXVOL
stGain
Digital attenuation
of sidetone
0, 1...65535
Mute,
-96...0dB
20 * log
(stGain/
16384) -12
AT+SIDET
rxFilter
Output PCM 13-tap
filter parameters, 7
values
0...65535
---
MATLAB
calculate
AT+CRXFTR
Note: If users require better experience on audio, users should modify these parameters according to their own electronic
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and mechanical design.
3.5
USIM Interface
The USIM provides the required subscription verification information to allow the mobile equipment to
attach to a GSM or UMTS network. Both 1.8V and 3.0V SIM Cards are supported.
3.5.1
Pin description
Table 16: Electronic characteristic
Pin name
3.0V mode
1.8V mode
Min
Typ
Max
Min
Typ
Max
V_USIM
2.7
3.00
3.3
1.65
1.8
2.0
USIM_RESET
0.8* V_USIM
3.00
V_USIM
0.8* V_USIM
1.8
V_USIM
USIM_CLK
0.7* V_USIM
3.00
V_USIM
0.8* V_USIM
1.8
V_USIM
USIM_DATA
0.7* V_USIM
3.00
V_USIM
0.8* V_USIM
1.8
V_USIM
Table 17: Pin description
Pin name
USIM_CLK
USIM_RESET
Pin
19
18
USIM_DATA
17
V_USIM
20
3.5.2
Description
USIM Card Clock
USIM Card Reset
USIM Card data I/O, which has been pulled up with a 22kR resistor to
V_USIM in module. Do not pull up or pull down in users’ application
circuit.
USIM Card Power output depends automatically on USIM mode，one
is 3.0V±10%, another is 1.8V±10%. Current is less than 50mA.
Application Guide
It is recommended to use an ESD protection component such as ST (www.st.com ) ESDA6V1W5 or ON
SEMI (www.onsemi.com ) SMF05C. Note that the SIM peripheral circuit should be close to the SIM card
socket. The reference circuit of the 8-pin SIM card holder is illustrated in the following figure.
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Figure 27: USIM interface reference circuit
Note: USIM_DATA has been pulled up with a 22kR resistor to V_USIM in module. A 220nF shut capacitor on V_USIM
is used to reduce interference. Use AT Commands to get information in USIM card. For more detail, please refer to
document [1].
3.5.3
Recommend Components
For 6 pins USIM socket, SIMCom recommend to use Amphenol C707 10M006 512 2. User can visit
http://www.amphenol.com for more information about the holder.
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Figure 28: Amphenol SIM card socket
Table 19: Amphenol USIM socket pin description
3.6
Pin
Signal
C1
USIM_VDD
C2
USIM_RST
Description
SIM Card Power supply, it can identify automatically the
SIM Card power mode，one is 3.0V±10%, another is
1.8V±10%.
SIM Card Reset.
C3
C5
C6
C7
USIM_CLK
GND
VPP
USIM_DATA
SIM Card Clock.
Connect to GND.
Connect to USIM_VDD
SIM Card data I/O.
I2C Interface
I2C is used to communicate with peripheral equipments and can be operated as either a transmitter or
receiver, depending on the device function. Use AT Commands “AT+CRIIC and AT+CWIIC” to read/write
register values of related peripheral equipments connected with I2C interface.
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3.6.1
Pin Description
Table 18: Pin description
Pin name
I2C_SDA
Pin No.
56
Function
Serial interface data input and output
I2C_SCL
55
Serial interface clock input
3.6.2
Signal Description
Both SDA and SCL are bidirectional lines, connected to a positive supply via a pull-up resistor
respectively. When the bus is free, both lines are high.
3.6.3
Design Guide
For SIM5320A, the data on the I2C bus can be transferred at rates up to 400kbps. The number of
peripheral devices connected to the bus is solely dependent on the bus capacitance limit of 400pF. Note
that PCB traces length and bending are in users’ control to minimize load capacitance.
Note：I2C_SDA and I2C _SCL have been pulled up with two 2.2kR resistors to 2.6V level in module. So there is no need
to pull them up in users’ application circuit.
3.7
Keypad Interface
SIM5320A module provides a keypad interface that supports five sense lines, or columns, and five keypad
rows. The interface generates an interrupt when any key is pressed. Its operation voltage is 1.8V.
3.7.1
Pin Description
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Table 19: Pin description
Pin name
Pin No.
Function
KEYSENSE_N0
KEYSENSE_N1
KEYSENSE_N2
28
27
31
Sensing keys
KEYSENSE_N3
32
KEYSENSE_N4
KEYPAD_0
KEYPAD_1
KEYPAD_2
KEYPAD_3
KEYPAD_4
36
30
29
30
35
34
3.7.2
Driving pads
Application Guide
All keypad pins can be configured for GPIOs. These GPIOs also support interruption operation if used as
input pins. A typical circuit about the keypad (5*5 keypad matrix) is shown in the following figure.
Figure 29: Reference circuit
If these pins are configured for GPIOs, the sequence is listed in the following table.
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Table 20: GPIO configuration
Keypad interface
GPIO No.
KEYPAD_4
GPIO6
KEYPAD_3
GPIO7
KEYPAD_2
GPIO8
KEYPAD_1
GPIO9
KEYPAD_0
GPIO10
KEYSENSE_N4
GPIO11
KEYSENSE_N 3
GPIO12
KEYSENSE_N 2
GPIO13
KEYSENSE_N 1
GPIO14
KEYSENSE_N 0
GPIO15
Note: Refer to document [23] for detailed information of Keypad Application Note.
3.8
USB Interface
SIM5320A module contains a USB interface. This interface is compliant with the USB2.0 specification.
The USB2.0 specification requires hosts such as the computer to support all three USB speeds, namely
low-speed (1.5Mbps), full-speed (12Mbps) and high-speed (480Mbps). USB charging and USB-OTG is
not supported.
Table 21: Electronic characteristic
Pin name
Pin No.
USB_VBUS
11
USB_DP
13
USB_DM
12
3.8.1
Input voltage scope( V )
Min
Typ
Max
4.4
5.0
5.25
They are compliant with the USB 2.0 specification.
Application Guide
Currently SIM5320A supports the USB suspend and resume mechanism which can help to save power.
If no transaction is on USB bus, SIM5320A will enter suspend mode. When some events such as voice call
or receiving SMS happen, SIM5320A will resume normal mode automatically.
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Figure 30: USB interface
Because of high bit rate on USB bus, pay attention to influence of junction capacitance of ESD component
on USB data lines. Typically, the capacitance should be less than 4pF @1MHz.
Note：The SIM5320A has two kinds of interface (UART and USB) to connect to host CPU.
USB interface is mapped to
five virtual ports: “SIMTECH USB Modem”, “SIMTECH NMEA Device”, “SIMTECH ATCOM Device”, “SIMTECH
Diagnostics interface” and “SIMTECH Wireless Ethernet Adapter”.
3.9 SPI Interface
SPI interface of SIM5320A is master only. It provides a duplex, synchronous, serial communication link
with peripheral devices. Its operation voltage is 1.8V, with clock rates up to 26 MHz.
3.9.1
Pin Description
Table 22: Electronic characteristic
1.8V mode
Pin name
Min
Typ
Max
SPI_CLK
1.65
1.8
1.95
SPI_CS_N
1.65
1.8
1.95
SPI_MOMI_DATA
1.65
1.8
1.95
SPI_MIMO_DATA
1.65
1.8
1.95
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Table 23: Pin description
Pin name
Pin No.
Function
SPI_CS
SPI chip-select; not mandatory in a point-to-point connection
SPI_MISO_DATA
SPI master in/slave out data
SPI_CLK
SPI clock
SPI_MOSI_DATA
SPI master out/slave in data
3.10 GPIO Interface
SIM5320A provides a limited number of GPIO pins. All GPIOs can be configured as inputs or outputs.
User can use AT Commands to read or write GPIOs status. Refer to ATC document for details.
3.10.1 Pin Description
Table 24: Electronic characteristic
2.6V mode
Pin name
Min
Typ
Max
GPIO1
2.5
2.6
2.7
GPIO4
2.5
2.6
2.7
GPIO40
2.5
2.6
2.7
GPIO41
2.5
2.6
2.7
GPIO43
2.5
2.6
2.7
GPIO44
2.5
2.6
2.7
GPIO42
2.5
2.6
2.7
Note: If more GPIOs need to be used, users can configure GPIO on other multiple function interfaces, such as PCM.
Please refer to GPIO list.
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Table 25: Pin description
Pin name
Pin No.
I/O
Function
GPIO1
51
Output PIN as LED control for network status. If it is
unused, left open.
GPIO4
49
Input PIN as RF operating control.
H: Normal Mode L:Flight Mode
If it is unused, left open.
GPIO40
54
Output PIN as operating status indicating of module.
H: Power on
L: Power off
If it is unused, left open.
GPIO41
52
I/O
General input/output PIN. It can be used as wake/interrupt
signal to host from module If it is unused, left open.
GPIO42
53
I/O
General Purpose Input/Output Port.
GPIO43
50
I/O
General Purpose Input/Output Port. It can be used as
wake/interrupt signal to module from host. If it is unused, left
open.
GPIO44
48
I/O
General Purpose Input/Output Port
Note: The output driver current of GPIOs is 1mA at the lower supply voltage and 2mA at the higher supply voltage.
3.10.2 Application Guide
Network status
GPIO1 is used to control Network Status LED; application circuit is shown below.
Figure 31: Application circuit
Note: The value of resistor Rx depends on LED characteristic.
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Table 26: LED status
LED Status
Always On
200ms ON, 200ms OFF
800ms ON, 800ms OFF
Module Status
Searching Network/Call Connect
Data Transmit
Registered network
Off
Power off / Sleep
Flight mode control
GPIO4 controls SIM5320A module to enter or exit the Flight mode. In Flight mode, SIM5320A closes RF
function to prevent interference with other equipments or minimize current consumption. Bidirectional
ESD protection component is suggested to add on GPIO4.
Figure 32: Flight mode switch
Table 27: Control status
GPIO4 Status
Low Level
High Level
Module operation
Flight Mode: RF is closed.
Normal Mode: RF is working.
Note：1. For SIM5320A, GPIO0, GPIO2, GPIO3 and GPIO5 have multiplex function, user can use them as PCM
interface to connect extend codec. Refer to section 3.10 and document [1] for details.
2. When the module is powered off, make sure all digital interfaces (PCM UART, etc) connected with peripheral devices
have no voltage higher than 0.3V. If users’ design cannot meet above conditions, high level voltages maybe occur in
GPIO pins because current leakage from above digital interfaces may occur.
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3.11 PCM Interface
SIM5320A provides hardware PCM interface for external codec. The PCM interface enables
communication with an external codec to support hands-free applications. SIM5320A PCM interface can
be used in two modes: the default mode is auxiliary PCM (8 KHz long sync mode at 128 KHz PCM CLK);
the other mode is primary PCM (8 KHz short sync mode at 2048 KHz PCM CLK). In short-sync
(primary PCM) mode, SIM5320A can be a master or a slave. In long-sync (auxiliary PCM) mode,
SIM5320A is always a master. SIM5320A also supports 3 kinds of coding formats: 8 bits (υ-law or A-law)
and 16 bits (linear).
Note: PCM interface is multiplexed from GPIO (default setting). The AT command “AT+CPCM” is used to switch
between PCM and GPIO functions. Please refer to document [22] and document [1] for details.
3.11.1 Pin Description
Table 28: Electronic characteristic
2.6V mode
Pin name
Min
Typ
Max
PCM_CLK
2.5
2.6
2.7
PCM_SYNC
2.5
2.6
2.7
PCM_DOUT
2.5
2.6
2.7
PCM_DIN
2.5
2.6
2.7
Table 29: Pin description
Pins
Pin No.
AUX_PCM
functionality
Primary PCM
functionality
Description
PCM_DIN/GPIO0
74
AUX_PCM_DIN
PCM_DIN
PCM data input
PCM_SYNC/GPIO2
75
AUX_PCM_SYNC
PCM_SYNC
PCM data synchrony
PCM_DOUT/GPIO5
73
AUX_PCM_DOUT
PCM_DOUT
PCM data output
PCM_CLK/GPIO3
76
AUX_PCM_CLK
PCM_CLK
PCM data clock
3.11.2 Signal Description
The default PCM interface in SIM5320A is the auxiliary PCM interface. The data changes on the high
level of PCM_CLK and is sampled at the falling edge of PCM_CLK in one period. Primary PCM is
disabled after every power-on or every reset event. So user must use AT command to enable the primary
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PCM mode after powering on or resetting the module every time if user wants to use Primary
PCM.SIM5320A PCM Interface can be operated in Master or Slave mode if it is configured to primary
PCM. In Master Mode, the Module drives the clock and sync signals that are sent to the external codec.
When it is in Slave Mode, the external codec drives the clock and sync signals which are sent to the
module. Both PCM modes are discussed in this section followed by additional PCM topics.
Auxiliary PCM (128 KHz PCM clock)
υ-law coding is supported by the auxiliary PCM. The auxiliary codec port operates with standard
long-sync timing and a 128 KHz clock. The AUX_PCM_SYNC runs at 8 KHz with 50% duty cycle.
Most υ-law codec support the 128 KHz clock.
Figure 33: Synchrony timing
Figure 34: EXT CODEC to MODULE timing
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Figure 35: MODULE to EXT CODEC timing
Table 30: Timing parameters
Parameter
Description
Min
Typ
Max
Unit
T(auxsync)
AUX_PCM_SYNC cycle time
–
125
μs
T(auxsynch)
AUX_PCM_SYNC high time
62.4
62.5
μs
T(auxsyncl)
AUX_PCM_SYNC low time
62.4
62.5
μs
T(auxclk)*
AUX_PCM_CLK cycle time
7.8
–
μs
T(auxclkh)
AUX_PCM_CLK high time
3.8
3.9
–
μs
T(auxclkl)
AUX_PCM_CLK low time
3.8
3.9
–
μs
T(suauxsync)
AUX_PCM_SYNC setup time high before
falling edge of PCM_CLK
1.95
–
–
μs
T(hauxsync)
AUX_PCM SYNC hold time after falling edge
of PCM_CLK
1.95
–
–
μs
T(suauxdin)
AUX_PCM_DIN setup time before falling
edge of AUX_PCM_CLK
70
–
–
ns
T(hauxdin)
AUX_PCM_DIN hold time after falling edge
of AUX_PCM_CLK
20
–
–
ns
T(pauxdout)
Delay from AUX_PCM_CLK
AUX_PCM_DOUT valid
–
–
50
ns
rising
to
*Note: T(auxclk) = 1/(128 KHz).
Primary PCM (2048 KHz PCM clock)
SIM5320A also supports 2.048 MHz PCM data and sync timing for υ-law codec. This is called the
primary PCM interface. User can use AT command to take the mode you want as discussed above.
Figure 36: Synchrony timing
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Figure 37: EXT CODEC to MODULE timing
Figure 38: MODULE to EXT CODEC timing
Table 31: Timing parameters
Parameter
Description
Min
Typ
Max
Unit
T(sync)
PCM_SYNC cycle time
–
125
–
μs
T(synch)
PCM_SYNC high time
400
500
–
ns
T(syncl)
PCM_SYNC low time
–
124.5
–
μs
T(clk)
PCM_CLK cycle time
–
488
–
ns
T(clkh)
PCM_CLK high time
–
244
–
ns
T(clkl)
PCM_CLK low time
–
244
–
ns
T(susync)
PCM_SYNC setup time high before falling edge of
PCM_CLK
60
–
–
ns
T(hsync)
PCM_SYNC hold time after falling edge of
PCM_CLK
60
–
–
ns
T(sudin)
PCM_DIN setup time before falling edge of
PCM_CLK
50
–
–
ns
T(hdin)
PCM_DIN hold
PCM_CLK
10
–
–
ns
T(pdout)
Delay from PCM_CLK rising to PCM_DOUT valid
–
–
350
ns
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T(zdout)
Delay from PCM_CLK falling to PCM_DOUT
HIGH-Z
–
160
–
ns
Note: SIM5320A can transmit PCM data by USB except for PCM interface. Please refer to document [22] for more
information of PCM Application Note.
3.12 Global Positioning System
SIM5320A merges GPS satellite and network information to provide a high-availability solution that
offers industry-leading accuracy and performance. This solution performs well, even in very challenging
environmental conditions where conventional GPS receivers fail, and provides a platform to enable
wireless operators to address both location-based services and emergency mandates.
3.12.1 Technical specification
Tracking sensitivity
-157 dBm
Cold-start sensitivity
-144 dBm
Accuracy (Open Sky)
<2m (CEP50)
TTFF (Open Sky)
Hot start <1s
Cold start 35s（good signal）/ 100s(weak signal)
Receiver Type
12-channel, GPS L1 Frequency (1575.42MHz), C/A Code
Update rate
Default 1 Hz
GPS data format
NMEA-0183
GPS Current consumption (WCDMA/GSM Sleep mode)
100mA (Total supply current)
GPS antenna
Passive/Active antenna
Note: Performance will vary depending on the environment, antenna type and signal conditions and so on.
3.12.2 Operate Mode
SIM5320A supports both A-GPS and S-GPS, and then provides three operating modes: mobile-assisted
mode, mobile-based mode and standalone mode. A-GPS includes mobile-assisted and mobile-based mode.
In mobile-assisted mode, when a request for position location is issued, available network information is
provided to the location server (e.g. Cell-ID) and assistance is requested from the location server. The
location server sends the assistance information to the handset. The handset/mobile unit measures the GPS
observables and provides the GPS measurements along with available network data (that is appropriate for
the given air interface technology) to the location server. The location server then calculates the position
location and returns results to the requesting entity.
In mobile-based mode, the assistant data provided by the location server encompasses not only the
information required to assist the handset in measuring the satellite signals, but also the information
required to calculate the handset’s position. Therefore, rather than provide the GPS measurements and
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available network data back to the location server, the mobile calculates the location on the handset and
passes the result to the requesting entity.
In standalone (autonomous) mode, the handset demodulates the data directly from the GPS satellites.
This mode has some reduced cold-start sensitivity, and a longer time to first fix as compared to the assisted
modes. However, it requires no server interaction and works out of network coverage.
This combination of GPS measurements and available network information provides:
High-sensitivity solution that works in all terrains: Indoor, outdoor, urban, and rural
● High availability that is enabled by using both satellite and network information
●
Therefore, while network solutions typically perform poorly in rural areas and areas of poor cell
geometry/density, and while unassisted, GPS-only solutions typically perform poorly indoors. The
SIM5320A GPS solution provides optimal time to fix, accuracy, sensitivity, availability, and reduced
network utilization in both of these environments, depending on the given condition.
3.12.3 Application Guide
Users can adopt an active antenna or a passive antenna as GPS signal transceiver. In this document, all
GPS specification mentioned is from passive antenna. The following is the reference circuit.
Figure 39: Active antenna circuit
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Figure 40：Passive antenna circuit (Default)
In above figures, the components C1 and L1, L2 are used for antenna matching, the values of the
components can only be obtained after the antenna tuning usually, and they are provided by antenna
vendor.C2 in Figure 39 is used for DC isolation. In active antenna circuit, users must use an external
LDO/DCDC to provide VDD voltage whose value should be taken according active antenna characteristic,
and VDD can be shut down to avoid consuming additional current when not being used.
GPS can be used by NMEA port. User can select NMEA as output through UART or USB. NMEA
sentences are automatic and no command is provided. NMEA sentences include GSV, GGA, RMC, GSA,
and VTG. Before using GPS, user should configure SIM5320A in proper operating mode by AT command.
Please refer to related document for details. SIM5320A can also get position location information through
AT directly.
Note:GPS is closed by default, it could be started by AT+CGPS. The AT command has two parameters, the first is on/off,
and the second is GPS mode. Default mode is standalone mode.
AGPS mode needs more support from the mobile telecommunication network. Refer to AGPS application document for
details.
3.13 Multi-functional interface
SIM5320A merges functions for various applications. It can enrich users’ design and lower the cost of
users’ hardware.
3.13.1 Sink Current Source
The dedicated pin (CURRENT_SINK) is intended for driving passive devices，such as LCD backlight, this
implementation is +5V tolerant and suitable for driving white LEDs. The high-current driver can maintain
a constant current which is set by the AT command “AT+ CLEDITST”, capable of up to 150 mA.
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Table 32: Electronic characteristic
Symbol
Description
Min
Typ
Max
Unit
CURRENT_SINK
Input voltage
0.5
VDD
IO
Input current
150
mA
Since the driver is ground-referenced current sink, the operating device it drives must form a current path
between the VDD pin and the CURRENT_SINK pin. The following figure is for users reference.
VBAT
Pin 45 is +5V tolerantsuitable for driving white
LEDs
Passive
device
CURRENT_SINK
High
current
MODULE
Current Controls
Figure 41: Current drive
Note: The sinking current can be adjusted to meet design requirement through the AT command “AT+ CLEDITST =<0>,
”.The “value” ranges from 0 to 15,on behalf of the current changes from 0mA to 150mA in steps of 10mA.
3.13.2 Reset Function
SIM5320A also have a RESET pin (PIN4) to reset the module. This function is used as an emergency reset
only when AT command “AT+CPOF” and the POWER_ON pin has no effect. User can pull the RESET
pin to ground, then the module will reset.
This pin is already pulled up in module, so the external pull-up resistor is not necessary. A 100nF capacitor
close to the RESET pin is strongly recommended. A reference circuit is recommended in the following
figure.
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Figure 42: Reset circuit
Note：50ms 1A
FB101 300 OHM
Power supply
C101
100uF
C102
100nF
C103
22pF
GPS_ANT
GND
GND
GND
80
VBAT_RF
VBAT_BB
38
63
61
VBAT_RF
GND
VBAT_BB
GND
39
37
GND
40
POWER_ON
>64ms
GPIO1
51
Power supply
C104
100uF
C105
100nF
R105
300R
LED
Network
Status
R106 10K
R104 47K
GPIO4
20~200ms
USB_VBUS
USB_DM
USB_DP
RESET
TVS
71
68
67
66
69
70
72
UART_TXD
UART_RXD
UART_CTS
UART_RTS
UART_RI
UART_DCD
UART_DTR
SIM_DATA
L102
NC
R107 10K
Turn on/off impulse
Reset impulse
C107
33pF
78
GND
GND
GND
L101
NC
77
62
64
R103 4.7K
79
17
19
18
20
SIM_CLK
SIM_RST
SIM_VDD
C109
220nF
TVS
SMF05C
23
MIC
32R
24
26
25
8R
0.5W
22
21
ESD & Decoupling
capacitors required.
Please refers to Audio
interface chapter.
HOST_WAKEUP
MODULE_WAKEUP
UART_TXD
UART_RXD
UART_CTS
UART_RTS
UART_RI
KEYSENSE_N0
KEYSENSE_N1
UART_DCD
UART_DTR
KEYSENSE_N2
KEYSENSE_N3
KEYSENSE_N4
KEYPAD_3
KEYPAD_4
PCM_DIN/GPIO0
PCM_SYNC/GPIO2
PCM_DOUT/GPIO5
PCM_CLK/GPIO3
74
75
73
76
KEYPAD_0
KEYPAD_1
KEYPAD_2
SPK_P
SPK_N
49
52
53
50
48
GPIO40
GPIO41
GPIO42
GPIO43
GPIO44
10
14
41
43
65
GND
GND
GND
GND
GND
GND
GND
GND
SPI_CLK_N
SPI_MISO_DATA
SPI_MOSI_DATA
SPI_CS
CURRENT_SINK
USB_VBUS
Audio CODEC Chip
or
DSP
45
VREG_AUX
44
IIC_SCL
IIC_SDA
ADC1
55
56
ADC2
Reserve
Reserve
VRTC
RF ON/OFF
USB_DM
USB_DP
If USB interface is used， connect
USB_VBUS to DC 4.4V-5.25V
28
27
31
32
36
29
33
30
35
36
USIM_DATA
USIM_CLK
USIM_RESET
V_USIM
MIC1P
MIC1N
EAR1P
EAR1N
54
11
12
13
LCD
Display
Output : DC 1.5-3V
VREG_AUX
I2C_SCL
I2C_SDA
47
HKADC
Input range:0-2.2V
46
15
16
42
C108
100uF
If RTC is unused， keep
VRTC pin open.
Figure 48: System design
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B. SIM5320A GPIOs List
Table 46: SIM5320A GPIOs list
Name
PCM_DIN
STATUS_LED
PCM_SYNC
PCM_CLK
RF_SWITCH
PCM_OUT
KEYPAD_4
KEYPAD_3
KEYPAD_2
KEYPAD_1
KEYPAD_0
KEYSENSE_N4
KEYSENSE_N3
KEYSENSE_N2
KEYSENSE_N1
KEYSENSE_N0
UART1_CTS
UART1_RFR
UART1_DTR
UART_DCD
UART_RI
GPIO40
GPIO41
GPIO42
GPIO43
GPIO44
GPIO Index
10
11
12
13
14
15
33
34
35
36
37
40
41
42
43
44
Default Function
GPIO Interrupt [LEVEL/LOW]
Status led
GPIO [IN]
GPIO [OUT/LOW]
RF Switch
GPIO [OUT/LOW]
Keypad
Keypad
Keypad
Keypad
Keypad
Keypad
Keypad
Keypad
Keypad
Keypad
CTS
RTS
DTR wake up module
DCD
RI wake up host
Module power up status
Wake up host
GPIO
Wake up module
GPIO
Alternate Function
PCM_DIN
GPIO
PCM_SYNC
PCM_CLK
Enable/Disable RF subsystem
PCM_OUT
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
C. Digital I/O Characteristics
Table 47: Digital I/O characteristics
Parameter
Description
2.6V Mode
1.8V Mode
Unit
Min
Typ
Max
Min
Typ
Max
VREG_AUX
LDO output
2.6
2.9
1.8
1.84
VIH
High-level
input voltage
1.69
2.6
2.9
1.17
1.8
2.1
VIL
Low-level
input voltage
-0.3
0.91
-0.3
0.63
VOH
High-level
1.17
2.6
2.6
0.81
1.8
1.8
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output voltage
VOL
Low-level
output voltage
0.45
0.45
IIH
Input
high
leakage
current
uA
IIL
Input
leakage
current
-1
-1
uA
CIN
Input
capacitance
pF
low
Note: These parameters are for digital interface pins, such as keypad, GPIO, I2C, UART, SPI and DEBUG. The
SIM5320A includes two kinds of voltages: 1.8v and 2.6v. Digital I/O specifications under both conditions are presented in
the above tables.
D. Related Documents
Table 48: Related documents
SN
[1]
[2]
Document name
SIM5320A_ATC_V1.00
ITU-T
Draft
new
recommendationV.25ter
Remark
SIM5320A_ATC_V1.00
Serial asynchronous automatic dialing and control
Digital cellular telecommunications (Phase 2+); AT command set
for GSM Mobile Equipment (ME)
Support GSM 07.10 multiplexing protocol
Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment (DTE –
DCE) interface for Short Message Service (SMS) and Cell
Broadcast Service (CBS)
Digital cellular telecommunications system (Phase 2+);
Specification of the SIM Application Toolkit for the Subscriber
Identity Module – Mobile Equipment (SIM – ME) interface
Digital cellular telecommunications system (Phase 2+);
Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
Digital cellular telecommunications system (Phase 2+); Alphabets
and language-specific information
Digital cellular telecommunications system (Phase 2)； Mobile
Station (MS) conformance specification； Part 1: Conformance
specification
[3]
GSM 07.07
[4]
GSM 07.10
[5]
GSM 07.05
[6]
GSM 11.14
[7]
GSM 11.11
[8]
GSM 03.38
[9]
GSM 11.10
[10]
3GPP TS 51.010-1
Digital cellular telecommunications system (Release 5); Mobile
Station (MS) conformance specification
[11]
3GPP TS 34.124
Electromagnetic Compatibility (EMC) for mobile terminals and
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ancillary equipment.
Electromagnetic Compatibility (EMC) for mobile terminals and
ancillary equipment.
Technical Specification Group Radio Access Network; Terminal
conformance specification; Radio transmission and reception
(FDD)
User Equipment (UE) conformance specification; Part 3: Abstract
Test Suites.
Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
IMT-2000. Third Generation cellular networks; Part 2:
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article
3.2 of the R&TTE Directive
Electromagnetic compatibility and Radio Spectrum Matters (ERM);
Electromagnetic Compatibility (EMC) standard for radio
equipment and services; Part 24: Specific conditions for IMT-2000
CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio
and ancillary equipment
[12]
3GPP TS 34.121
[13]
3GPP TS 34.123-1
[14]
3GPP TS 34.123-3
[15]
EN 301 908-02 V2.2.1
[16]
EN 301 489-24 V1.2.1
[17]
IEC/EN60950-1(2001)
Safety of information technology equipment (2000)
[18]
3GPP TS 51.010-1
Digital cellular telecommunications system (Release 5); Mobile
Station (MS) conformance specification
[19]
GCF-CC V3.23.1
Global Certification Forum - Certification Criteria
[20]
2002/95/EC
Directive of the European Parliament and of the Council of 27
January 2003 on the restriction of the use of certain hazardous
substances in electrical and electronic equipment (RoHS)
[21]
[22]
[23]
Audio Application Note
V1.01
PCM Application Note
V1.02
Keypad
Application
Note V1.01
Audio Application Note V1.01
PCM Application Note V1.02
Keypad Application Note V1.01
[24]
Sleep_Application_Note
[25]
Waking_up_Applicatio
n_Note
Waking_up_Application_Note
[26]
Module
SMT Note
Sleep_Application_Note
secondary-SMT-UGD
E. Terms and Abbreviations
Table 49: Terms and Abbreviations
Abbreviation
ADC
ARP
BER
BTS
CS
Description
Analog-to-Digital Converter
Antenna Reference Point
Bit Error Rate
Base Transceiver Station
Coding Scheme
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CSD
CTS
DAC
DRX
DSP
DTE
DTR
DTX
EFR
EGSM
EMC
ESD
ETS
FCC
FD
FDMA
FR
GMSK
GPRS
GSM
HR
I2C
IMEI
Inorm
Imax
kbps
Li-Ion
MO
MS
MT
PAP
PBCCH
PCB
PCS
RF
RMS
RTC
Rx
SIM
SMS
SPI
TDMA
TE
TX
UART
VSWR
Vmax
Vnorm
Circuit Switched Data
Clear to Send
Digital-to-Analog Converter
Discontinuous Reception
Digital Signal Processor
Data Terminal Equipment (typically computer, terminal, printer)
Data Terminal Ready
Discontinuous Transmission
Enhanced Full Rate
Enhanced GSM
Electromagnetic Compatibility
Electrostatic Discharge
European Telecommunication Standard
Federal Communications Commission (U.S.)
SIM fix dialing phonebook
Frequency Division Multiple Access
Full Rate
Gaussian Minimum Shift Keying
General Packet Radio Service
Global Standard for Mobile Communications
Half Rate
Inter-Integrated Circuit
International Mobile Equipment Identity
Normal Current
Maximum Load Current
Kilo bits per second
Lithium-Ion
Mobile Originated
Mobile Station (GSM engine), also referred to as TE
Mobile Terminated
Password Authentication Protocol
Packet Switched Broadcast Control Channel
Printed Circuit Board
Personal Communication System, also referred to as GSM 1900
Radio Frequency
Root Mean Square (value)
Real Time Clock
Receive Direction
Subscriber Identification Module
Short Message Service
serial peripheral interface
Time Division Multiple Access
Terminal Equipment, also referred to as DTE
Transmit Direction
Universal Asynchronous Receiver & Transmitter
Voltage Standing Wave Ratio
Maximum Voltage Value
Normal Voltage Value
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Vmin
VIHmax
VIHmin
VILmax
VILmin
VImax
VImin
VOHmax
VOHmin
VOLmax
VOLmin
SM
NC
EDGE
HSDPA
HSUPA
ZIF
WCDMA
VCTCXO
USIM
UMTS
UART
Minimum Voltage Value
Maximum Input High Level Voltage Value
Minimum Input High Level Voltage Value
Maximum Input Low Level Voltage Value
Minimum Input Low Level Voltage Value
Absolute Maximum Input Voltage Value
Absolute Minimum Input Voltage Value
Maximum Output High Level Voltage Value
Minimum Output High Level Voltage Value
Maximum Output Low Level Voltage Value
Minimum Output Low Level Voltage Value
SIM phonebook
Not connect
Enhanced data rates for GSM evolution
High Speed Downlink Packet Access
High Speed Uplink Packet Access
Zero intermediate frequency
Wideband Code Division Multiple Access
Voltage control temperature-compensated crystal oscillator
Universal subscriber identity module
Universal mobile telecommunications system
Universal asynchronous receiver transmitter
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F. Safety Caution
Table 50: Safety caution
Marks
Requirements
When in a hospital or other health care facility, observe the restrictions about the use of
mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive
to not operate normally for RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to prevent
interference with communication systems. Forget to think much of these instructions
may lead to the flight safety or offend against local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any electrical
equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios, computers
or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
networks and cannot be guaranteed to connect in all conditions, for example no mobile
fee or a invalid SIM card. While you are in this condition and need emergent help,
please remember using emergency calls. In order to make or receive calls, the cellular
terminal or mobile must be switched on and in a service area with adequate cellular
signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate
those features before you can make an emergency call.
Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.
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Smart Machine Smart Decision
Contact us:
Shanghai SIMCom Wireless Solutions Ltd.
Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R.
China 200335
Tel: +86 21 3235 3300
Fax: +86 21 3235 3301
URL: www.sim.com/wm
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2011-2-29

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