Simcom 1403022014009 WCDMA/HSDPA Module User Manual SIM5320ALD

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Document Description	SIM5320ALD_User Manual
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Document Type	User Manual
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Date Submitted	2014-09-17 00:00:00
Date Available	2014-09-30 00:00:00
Creation Date	2014-08-27 17:27:21
Document Lastmod	2014-08-27 17:27:21
Document Title	SIM5320ALD_User Manual
Document Creator	WPS Office 个人版
Document Author:	xiaoyangyang

SIM5320ALD_User_Manual
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Document Title
SIM5320ALD User Manual
Version
1.01
Date
2014-08-20
Status
Release
Document Control ID
SIM5320ALD_User Manual_V1.01
Compliance Information
FCC Compliance Statement: This device complies with Part 15 of the FCC Rules . Operation is subject to
the following two conditions: 1. This device may not cause harmful interference, and 2. This device must
accept any interference received, including interference that may cause undesired operation. This device
must accept any interference received, including interference that may cause undesired operation. Product
that is a radio transmitter is labeled with FCC ID.
FCC Caution
(1)Exposure to Radio Frequency Radiation. This equipment must be installed and operated in accordance
with provided instructions and the antenna(s) used for this transmitter must be installed to provide a
separation distance of at least 20 cm from all persons and must not be collocated or operating in
conjunction with any other antenna or transmitter. End-users and installers must be provided with antenna
installation instructions and transmitter operating conditions for satisfying RF exposure compliance.
(2) Any changes or modifications not expressly approved by the grantee of this device could void the
user's authority to operate the equipment.
(3) This Transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
(4) Changes or modifications to this unit not expressly approved by the party responsible for compliance
could void the user authority to operate the equipment.
(5) the modules FCC ID is not visible when installed in the host, or
(6) if the host is marketed so that end users do not have straight forward commonly used methods for
access to remove the module so that the FCC ID of the module is visible; then an additional permanent
label referring to the enclosed module: Contains Transmitter Module FCC ID: UDV-1403022014009 or
Contains FCC ID: UDV-1403022014009 must be used.
General Notes
SIMCom offers this information as a service to its customers, to support application and engineering
efforts that use the products designed by SIMCom. The information provided is based upon requirements
specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search
for additional relevant information, including any information that may be in the customer’s possession.
Furthermore, system validation of this product designed by SIMCom within a larger electronic system
remains the responsibility of the customer or the customer’s system integrator. All specifications supplied
herein are subject to change.
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Copyright
This document contains proprietary technical information which is the property of SIMCom Limited,
copying of this document and giving it to others and the using or communication of the contents thereof,
are forbidden without express authority. Offenders are liable to the payment of damages. All rights
reserved in the event of grant of a patent or the registration of a utility model or design. All specification
supplied herein are subject to change without notice at any time.
Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2014
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Contents
Revision History............................................................................................................................................10
1 Introduction................................................................................................................................................11
1.1 Product Outline......................................................................................................................................11
1.2 Hardware Interface Overview............................................................................................................... 11
1.3 Hardware Diagram................................................................................................................................ 11
1.4 Functional Overview.............................................................................................................................12
2 Package Information................................................................................................................................. 13
2.1 Pin Configuration.................................................................................................................................. 13
2.2 Pin description.......................................................................................................................................17
2.3 Package Dimensions............................................................................................................................. 19
2.4 Footprint Recommendation...................................................................................................................21
3 Application Interface Specification..........................................................................................................22
3.1 Power Supply........................................................................................................................................ 22
3.1.1 Power Supply Pin........................................................................................................................... 22
3.1.2 Design Guide.................................................................................................................................. 22
3.1.3 RTC Backup....................................................................................................................................24
3.2 Power on/off Time Sequence................................................................................................................ 26
3.2.1 Power on Sequence.........................................................................................................................26
3.2.2 Power off Sequence........................................................................................................................ 28
3.3 UART Interface..................................................................................................................................... 29
3.3.1 Pin Description............................................................................................................................... 30
3.3.2 Application Guide...........................................................................................................................31
3.4 Audio Interfaces (For SIM5320ALD only）....................................................................................... 32
3.4.1 Pin Description............................................................................................................................... 32
3.4.2 Design Guide.................................................................................................................................. 32
3.4.3 Audio Parameter Characteristic......................................................................................................34
3.5 USIM Interface......................................................................................................................................35
3.5.1 Pin description................................................................................................................................ 35
3.5.2 Application Guide...........................................................................................................................36
3.5.3 Recommend Components...............................................................................................................36
3.6 I2C Interface..........................................................................................................................................37
3.6.1 Pin Description............................................................................................................................... 38
3.6.2 Signal Description.......................................................................................................................... 38
3.6.3 Design Guide.................................................................................................................................. 38
3.7 Keypad Interface................................................................................................................................... 38
3.7.1 Pin Description............................................................................................................................... 38
3.7.2 Application Guide...........................................................................................................................39
3.8 USB Interface........................................................................................................................................40
3.8.1 Application Guide...........................................................................................................................40
3.9 SPI Interface..........................................................................................................................................41
3.9.1 Pin Description............................................................................................................................... 41
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3.10 GPIO Interface.................................................................................................................................... 41
3.10.1 Pin Description............................................................................................................................. 41
3.10.2 Application Guide.........................................................................................................................42
3.11 PCM Interface..................................................................................................................................... 44
3.11.1 Pin Description............................................................................................................................. 44
3.11.2 Signal Description.........................................................................................................................45
3.12 Multi-functional interface................................................................................................................... 48
3.12.1 Sink Current Source......................................................................................................................48
3.12.2 Reset Function.............................................................................................................................. 49
3.12.3 ADC.............................................................................................................................................. 49
3.12.4 LDO.............................................................................................................................................. 50
4 RF Specification......................................................................................................................................... 50
4.1 RF Specification....................................................................................................................................50
4.2 Operating Specification.........................................................................................................................51
4.3 Antenna Design Guide.......................................................................................................................... 51
5 Reliability and Operating Characteristics.............................................................................................. 53
5.1 Electronic Characteristics..................................................................................................................... 53
5.2 Operating Mode.................................................................................................................................... 53
5.2.1 Operating Modes Overview........................................................................................................... 54
5.2.2 Minimize Power Consumption.......................................................................................................54
5.3 Current Consumption............................................................................................................................55
5.4 EMC and ESD Notes............................................................................................................................ 56
6 Guide for Production.................................................................................................................................57
6.1 Top and Bottom View of SIM5320ALD..............................................................................................57
6.2 Typical Solder Reflow Profile.............................................................................................................. 57
6.3 Moisture Sensitivity Level (MSL)........................................................................................................ 58
6.4 Stencil Foil Design Recommendation.................................................................................................. 58
6.5 Recommended Pad Design................................................................................................................... 59
Appendix........................................................................................................................................................60
A. System Design........................................................................................................................................60
B. SIM5320ALD GPIOs List......................................................................................................................61
C. Digital I/O Characteristics......................................................................................................................61
D. Related Documents................................................................................................................................ 62
E. Terms and Abbreviations........................................................................................................................63
F. Safety Caution......................................................................................................................................... 66
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Table Index
Table 1: General Feature....................................................................................................................................................10
Table 2: Pin definition....................................................................................................................................................... 14
Table 3: Pin description..................................................................................................................................................... 15
Table 4: Pin description..................................................................................................................................................... 20
Table 5: Power on timing...................................................................................................................................................25
Table 6: Power off timing.................................................................................................................................................. 26
Table 7: Pin description..................................................................................................................................................... 28
Table 8: Logic level........................................................................................................................................................... 28
Table 9: Pin description..................................................................................................................................................... 30
Table 10: MIC input characteristics...................................................................................................................................30
Table 11: Audio output characteristics...............................................................................................................................30
Table 12: Speaker output characteristics........................................................................................................................... 30
Table 13: Audio parameter.................................................................................................................................................32
Table 14: Electronic characteristic.....................................................................................................................................33
Table 15: Pin description................................................................................................................................................... 33
Table 17: Pin description................................................................................................................................................... 36
Table 18: Pin description................................................................................................................................................... 36
Table 19: GPIO configuration........................................................................................................................................... 37
Table 20: Electronic characteristic.....................................................................................................................................38
Table 21: Electronic characteristic.....................................................................................................................................39
Table 22: Pin description................................................................................................................................................... 39
Table 23: Electronic characteristic.....................................................................................................................................40
Table 24: Pin description................................................................................................................................................... 40
Table 25: LED status......................................................................................................................................................... 41
Table 26: Control status..................................................................................................................................................... 42
Table 27: Electronic characteristic.....................................................................................................................................42
Table 28: Pin description................................................................................................................................................... 43
Table 29: Timing parameters............................................................................................................................................. 44
Table 30: Timing parameters............................................................................................................................................. 45
Table 31: Electronic characteristic.....................................................................................................................................46
Table 32: Electronic Characteristics.................................................................................................................................. 48
Table 33: Electronic characteristic.....................................................................................................................................48
Table 34: Conducted transmission power..........................................................................................................................49
Table 35: Operating frequencies........................................................................................................................................ 49
Table 36: Conducted receive sensitivity............................................................................................................................ 49
Table 37: HSDPA throughout............................................................................................................................................ 49
Table 38: Absolute maximum ratings................................................................................................................................ 51
Table 39: Recommended operating ratings....................................................................................................................... 51
Table 40: Operating temperature....................................................................................................................................... 51
Table 41: Operating Modes Overview...............................................................................................................................52
Table 42: Current consumption......................................................................................................................................... 53
Table 43: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)............................................54
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Table 43: SIM5320ALD GPIOs list.................................................................................................................................. 58
Table 44: Digital I/O characteristics.................................................................................................................................. 58
Table 45: Related documents.............................................................................................................................................59
Table 46: Terms and Abbreviations................................................................................................................................... 60
Table 47: Safety caution.................................................................................................................................................... 63
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Figure Index
Figure 1: SIM5320ALD functional architecture............................................................................................................... 11
Figure 2: Pin view..............................................................................................................................................................14
Figure 3: Top dimensions (Unit: mm)............................................................................................................................... 19
Figure 4: Side dimensions (Unit: mm).............................................................................................................................. 19
Figure 5: Bottom dimensions (Unit: mm)......................................................................................................................... 20
Figure 6: Footprint recommendation (Unit: mm)..............................................................................................................20
Figure 8: VBAT input application circuit.......................................................................................................................... 22
Figure 9: Reference circuit of the LDO power supply...................................................................................................... 22
Figure 10: Reference circuit of the DCDC power supply................................................................................................. 23
Figure 11: RTC supply from capacitor.............................................................................................................................. 24
Figure 12: RTC supply from non-chargeable battery........................................................................................................ 24
Figure 13: RTC supply from rechargeable battery............................................................................................................ 24
Figure 14: Seiko XH414H-IV01E Charge-Discharge characteristic.................................................................................25
Figure 15: Power on Timing Sequence..............................................................................................................................26
Figure 16: Power off timing sequence...............................................................................................................................27
Figure 17: Full modem...................................................................................................................................................... 28
Figure 18: Null modem......................................................................................................................................................29
Figure 19: RI behaviour in NULL Modem........................................................................................................................30
Figure 20: RI behaviour in FULL Modem........................................................................................................................ 30
Figure 21: Speaker interface configuration....................................................................................................................... 32
Figure 22: Receiver interface configuration...................................................................................................................... 32
Figure 23: Microphone interface configuration.................................................................................................................33
Figure 24: USIM interface reference circuit......................................................................................................................35
Figure 25: Amphenol SIM card socket..............................................................................................................................36
Figure 26: Reference circuit.............................................................................................................................................. 38
Figure 27: USB interface................................................................................................................................................... 39
Figure 28: Application circuit............................................................................................................................................42
Figure 29: Flight mode switch...........................................................................................................................................43
Figure 30: Synchrony timing............................................................................................................................................. 44
Figure 31: EXT CODEC to MODULE timing..................................................................................................................45
Figure 32: MODULE to EXT CODEC timing..................................................................................................................45
Figure 33: Synchrony timing............................................................................................................................................. 46
Figure 34: EXT CODEC to MODULE timing..................................................................................................................46
Figure 35: MODULE to EXT CODEC timing..................................................................................................................46
Figure 36: Current drive.................................................................................................................................................... 48
Figure 37: Reset circuit......................................................................................................................................................48
Figure 38: Reference circuit.............................................................................................................................................. 49
Figure 39: Antenna matching circuit................................................................................................................................. 51
Figure 40: Top and bottom view of SIM5320ALD........................................................................................................... 56
Figure 41: The ramp-soak-spike reflow profile of SIM5320ALD.................................................................................... 56
Figure 42: Recommended pad........................................................................................................................................... 57
Figure 43: System design...................................................................................................................................................58
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Revision History
Data
Version
Description of change
Author
2014-08-20
1.01
Original
Libing
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1 Introduction
This document describes electronic specifications, RF specifications, function interface, mechanical
characteristic and testing conclusions of the SIMCom SIM5320ALD module. With the help of this
document and other SIM5320ALD software application notes, user guides, users can quickly understand
and use SIM5320ALD module to design and develop applications quickly.
1.1
Product Outline
Designed for global market, SIM5320ALD is a dual-band UMTS /HSDPA that works on frequencies of
WCDMA 1900/850MHz. The SIM5320ALD support HSDPA.
With a tiny configuration of 30*30*2.9 mm and integrated functions, SIM5320ALD can meet almost any
space requirement in users’ application, such as Smart phone, PDA phone, industrial handhelds,
machine-to-machine, vehicle applications, etc..
There are 80 pins on SIM5320ALD, which provide most application interfaces for customers’ board.
1.2
Hardware Interface Overview
Sub-interfaces are described in detail in the next chapter, which includes:
● Power Supply
● USB Interface
● Serial Interface
● Analog Audio Interfaces (SIM5320ALD only)
● SIM Interface
● GPIO
● ADC
● LDO Power Output
● Sink Current Source
● Keypad Interface
● SPI Interface
● RTC
● I2C Interface
1.3
Hardware Diagram
The global architecture of the SIM5320ALD Embedded module is described in the figure below.
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Figure 1: SIM5320ALD functional architecture
1.4
Functional Overview
Table 1: General Feature
Feature
Implementation
Power supply
Single supply voltage 3.3～4.2V
Dual-mode UMTS/HSDPA operation
● UMTS R99 data rates-384 kbps DL/UL
● HSDPA Category 5/6 -3.6 Mbps Category12-1.8 Mbps
● CSD feature: 9.6, 14.4, 64 kbps UL/DL
●
Transmission data
Audio features
(SIM5320ALD only)
SMS
SIM interface
Serial interface
Speech codec modes:
● Half Rate (ETS 06.20)
● Full Rate (ETS 06.10)
● Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
● AMR (WCDMA)
● A5/1, A5/2, and A5/3 ciphering
● MT, MO, CB, Text and PDU mode
● SMS storage: SIM card
● Support transmission of SMS alternatively over CSD.
choose preferred mode.
User can
Support identity card: 1.8V, 3V.
● Serial Port standard or null modem mode on Serial Port Interface
● Serial Port can be used to control module by sending AT command
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USB
Support USB2.0 Slave mode
Phonebook management
Support phonebook types: SM, FD, LD, RC, ON, MC.
SIM application toolkit
Support SAT class 3, GSM 11.14 Release 98
Support USAT
Real Time Clock
Timer function
Physical characteristics
PCM
(SIM5320ALD only)
Firmware upgrade
Temperature range
Support RTC
Programmable by AT command
Size:30*30*2.9mm
Weight:5.6g
Multiplex on GPIOs. 3 kinds of coding formats: 8 bit (-law or A-law)
and 16 bit (linear).
Firmware upgrade over USB interface
Operation temperature: -30°C to +80°C
● Storage temperature -40°C to +85°C
●
2 Package Information
2.1
Pin Configuration
All hardware interfaces which connect SIM5320ALD to customers’ application platform are through 80
pins pads (Metal half hole). Figure 2 is SIM5320ALD outline diagram.
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Figure 2: Pin view
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Table 2: Pin definition
Pin No.
Define
Pin No.
Define
GND
GND
POWER_ON
RESET
GND
SPI_CLK
SPI_MISO_DATA
SPI_MOSI_DATA
SPI_CS_N
10
GND
11
USB_VBUS
12
USB_DM
13
USB_DP
14
GND
15
RESERVED
16
RESERVED
17
USIM_DATA
18
USIM_RESET
19
USIM_CLK
20
V_USIM
21
NC
22
NC
23
NC
24
NC
25
NC
26
NC
27
KEYSENSE_N1
28
KEYSENSE_N0
29
KEYPAD_0
30
KEYPAD_2
31
KEYSENSE_N2
32
KEYSENSE_N3
33
KEYPAD_1
34
KEYPAD_4
35
KEYPAD_3
36
KEYSENSE_N4
37
GND
38
VBAT_BB
39
VBAT_BB
40
GND
41
GND
42
VRTC
43
GND
44
VREG_AUX
45
CURRENT_SINK
46
ADC2
47
ADC1
48
GPIO44
49
GPIO40
50
GPIO43
51
GPIO1
52
GPIO41
53
GPIO42
54
GPIO4
55
I2C_SCL
56
I2C_SDA
57
GND
58
GND
59
MAIN_ANT
60
GND
61
GND
62
VBAT_RF
63
VBAT_RF
64
GND
65
GND
66
UART_RTS
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67
UART_CTS
68
UART_RXD
69
UART_RI
70
UART_DCD
71
UART_TXD
72
UART_DTR
73
NC
74
NC
75
NC
76
NC
77
GND
78
GND
79
GPS_ANT
80
GND
2.2
Pin description
Table 3: Pin description
Pin name
I/O
Description
Comment
Power Supply
VBAT_RF/VBAT_BB
Power supply voltage
VRTC
I/O
Power supply for RTC
VREG_AUX
LDO power output
GND
If it is unused, keep open.
Ground
Power on/off
POWER_ON
POWER_ON should be pulled low at
least 64ms to power on or 500ms to
power off the module.
Differential audio input
If it is unused, connect to
ground through a 100N
capacitor.
Differential audio output
If these pins are unused，
keep open.
Audio interface
MIC1P
MIC1N
EAR1P
EAR1N
SPK_P
SPK_N
USIM interface
V_USIM
Voltage Supply for SIM card
Support 1.8V or 3V SIM card
USIM_DATA
I/O
SIM Data Output/Input
USIM_CLK
USIM_RESET
SIM Clock
SIM Reset
SPI_CLK
SPI clock
SPI_CS_N
SPI chip-select
All signals of SIM
interface
should
be
protected
against
ESD/EMC.
SPI interface
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SPI_MOSI_DATA
SPI (master only) master out/slave in
data
SPI_MISO_DATA
SPI (master only) master in/slave out
data
USB_VBUS
USB power supply input
USB_DP
I/O
USB_DM
I/O
USB
Plus (+) line of the differential,
They are compliant with
bi-directional USB signal to/from the
the USB 2.0 specification.
peripheral device.
Minus (-) line of the differential, If it is unused, keep open.
bi-directional USB signal to/from the
peripheral device.
Serial interface
UART_RXD
Receive Data
UART_TXD
Transmit Data
UART_RTS
Request to send
UART_CTS
Clear to Send
UART_RI
UART_DTR
UART_DCD
I/O
Ring Indicator
DTE get ready
Carrier detects
I2C_SDA
I/O
I2C data
I2C_SCL
I2C clock output
KEYPAD_0
Bit 0 drive to the pad matrix
KEYPAD_1
Bit 1 drive to the pad matrix
KEYPAD_2
Bit 2 drive to the pad matrix
KEYPAD_3
Bit 3 drive to the pad matrix
KEYPAD_4
Bit 4 drive to the pad matrix
KEYSENSE_N0
Bit 0 for sensing key press on pad
matrix
KEYSENSE_ N1
Bit 1 for sensing key press on pad
matrix
KEYSENSE_ N2
Bit 2 for sensing key press on pad
matrix
KEYSENSE_ N3
Bit 3 for sensing key press on pad
matrix
KEYSENSE_ N4
Bit 4 for sensing key press on pad
matrix
General Input PIN with module
wake/interrupt. It also can be If it is unused, keep open.
multiplexed as the PCM_DIN pin.
UART_RXD has been
pulled down with a 12kR
resistor to ground in the
module.
If it is unused, keep open.
I2C interface
Pulled up with a 2.2kR
resistor to 2.6V internally.
If it is unused, keep open.
Keypad interface
All Keypad pins can be
configured as GPIOs.
If it is unused, keep open.
PCM interface
PCM_DIN/GPIO0
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PCM_SYNC/GPIO2
PCM_CLK/GPIO3
PCM_DOUT/GPIO5
General Input PIN. It also can be
multiplexed as the PCM_SYNC pin.
General Output PIN. It also can be
multiplexed as the PCM_CLK pin.
General Output PIN. It also can be
multiplexed as the PCM_DOUT pin.
GPIOs
GPIO1
Output PIN as LED control for
network status.
GPIO4
Input PIN as RF operating control.
GPIO40
GPIO41
I/O
GPIO43
I/O
GPIO44
I/O
General input/output PIN.
GPIO42
I/O
General input/output PIN.
RESET
System reset in, active low.
CURRENT_SINK
Current source of ground-referenced
Refer to 3.13.1
current sink
ADC1
Analog Digital Converter Input
ADC2
Battery temperature ADC input pin
MAIN_ANT
I/O
ANT soldering pad
Output PIN as operating status
indicating of module.
General input/output PIN. It can be
used as wake/interrupt signal to host If it is unused, keep open.
from module
General input/output PIN. It can be
used as wake/interrupt signal to
module from host.
Other interface
2.3
Refer to 3.13.3
Package Dimensions
The following figure shows mechanical dimensions of SIM5320ALD.
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Figure 3: Top dimensions (Unit: mm)
Figure 4: Side dimensions (Unit: mm)
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Figure 5: Bottom dimensions (Unit: mm)
2.4
Footprint Recommendation
Figure 6: Footprint recommendation (Unit: mm)
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3 Application Interface Specification
3.1
Power Supply
The power supply pins of SIM5320ALD include VBAT_RF and VBAT_BB. VBAT_RF directly supplies
the power to RF PA; VBAT_BB supplies the power to the baseband system. For the VBAT_RF, the current
consumption rises typically to peak of more than 2A. So the power supply must be able to provide
sufficient current up to more than 2A. The following figure is the VBAT_RF voltage ripple wave at the
maximum power transmit phase.
Please refer to Figure 8—Application circuit VBAT_RF=4.0V, VBAT maximum output current =2A,
CA=100 µF tantalum capacitor (ESR=0.7Ω) and CB=1µF.
3.1.1
Power Supply Pin
Two VBAT_RF and two VBAT_BB pins are dedicated to connect the supply voltage.
Table 4: Pin description
Pin type
POWER
Pin name
Min
Typ
Max
Unit
VBAT_RF
3.3
3.8
4.2
VBAT_BB
3.3
3.8
4.2
Note: 1.Though the VBAT_RF and VBAT_BB are supplied by the same voltage level, they are different pins. VBAT_RF
is for RF section and VBAT_BB is for baseband system.
2. When the module is power off, users must pay attention to the issue about current leakage. Refer to Chapter 3.10.2
Note2.
3.1.2
Design Guide
Mostly, user connects the VBAT_RF and VBAT_BB pins with one power supply. Make sure that the input
voltage at the VBAT_BB pin will never drop below 3.3V even during a transmit burst when the current
consumption rises up to more than 2A. If the power voltage drops below 3.3V, the module may be shut
down automatically. Using a large tantalum capacitor (above 100uF) will be the best way to reduce the
voltage drops. If the power current cannot support up to 2A, users must introduce larger capacitor (typical
1000uF) to storage electric power.
For the consideration of RF performance and system stability, another large capacitor (above 100uF)
should be located at the VBAT_RF pin and some multi-layer ceramic chip (MLCC) capacitors (0.1uF)
need to be used for EMC because of their low ESR in high frequencies. Note that capacitors should be put
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beside VBAT_RF pins as close as possible. Also User should minimize the PCB trace impedance from the
power supply to the VBAT pins through widening the trace to 80 mil or more on the board. The following
figure is the recommended circuit.
Figure 8: VBAT input application circuit
There are three sections about how to design and optimize users’ power systems.
Power supply circuit
We recommend DCDC or LDO is used for the power supply of the module, make sure that the peak
current of power components can rise up to more than 2A. The following figure is the reference design of
+5V input power supply. The designed output for the power supply is 4.1V, here a linear regulator can be
used.
Figure 9: Reference circuit of the LDO power supply
If there is a big difference between the input voltage and the desired output (VBAT), a switching converter
power will be preferable because of its better efficiency, especially at the high current situation. The
following figure is the reference circuit. Note that DCDC may deprave RF performance because of ripple
current intrinsically.
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Figure 10: Reference circuit of the DCDC power supply
Voltage monitor
To monitor the power supply voltage, user can use the AT command “AT+CBC”, this command has two
parameters: the battery status and the voltage value (mV). It will return the capacity percentage and actual
value of battery (at the VBAT_BB pin). The voltage is continuously measured at intervals, whenever the
measured battery voltage is lower than a specific value set by the AT command “AT+CVALARM”. For
example, if the voltage value is set to be 3.4V, the following URC will be presented: “warning! voltage is
low: 3.3v”.
If the voltage is lower than a specific value which is set by the AT command “AT+CPMVT”, the module
will be powered off automatically and AT commands cannot be executed any more.
Note: Under-voltage warning function is disabled by default, user can enable it by the AT command “AT+CVALARM”.
Auto power off feature is disabled by default, user should set it by the AT command “AT+CPMVT” to an appropriate
value. Please refer to Document [1].
3.1.3
RTC Backup
The module uses RTC (Real Time Clock) to update and maintain inherent time and keeps system alive at
no power supply status. The RTC power supply of module can be provided by an external capacitor or a
battery (non-chargeable or rechargeable) through the VRTC. The following figures show various reference
circuits for RTC back up. The discharge current is less than 10uA. If this feature is used, please refer to the
AT commands “AT+CTZU” and “AT +CTZR”.

External capacitor backup
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Figure 11: RTC supply from capacitor

Non-chargeable battery backup
Figure 12: RTC supply from non-chargeable battery

Rechargeable battery backup
Figure 13: RTC supply from rechargeable battery
Note: The VRTC can be disabled, jus disconnect it in application circuit.
Coin-type rechargeable battery is recommended, such as XH414H-IV01E form Seiko can be used.
Typical charge-discharge curves for this battery are shown in the following figure.
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Figure 14: Seiko XH414H-IV01E Charge-Discharge characteristic
3.2
3.2.1
Power on/off Time Sequence
Power on Sequence
SIM5320ALD can be powered on by POWER_ON pin, which starts normal operating mode.
POWER_ON pin is pulled up with a 200kR resistor to 1.8V in module. User can power on the
SIM5320ALD by pulling the POWER_ON pin down for a short time. The power-on scenarios are
illustrated in the following figures.
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Figure 15: Power on Timing Sequence
Table 5: Power on timing
Parameter
Time value
Description
Min.
Typ.
Max.
180
Ton
The time to pull POWER_ON down to power on
64
TpD+
The time to indicate connecting with the network
Tpw+
The time to indicate the module is powered on
completely
Tuart
The time to enable UART
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Unit
ms
5.5
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Tusb
The time to enable USB
Note: Module could be automatically power on by connecting Power ON pin to Low level directly.
Before designing, please refer to Document [25] for more detail.
3.2.2
Power off Sequence
The following methods can be used to power down SIM5320ALD. These procedures will make module
disconnect from the network and allow the software to enter a safe state, and then save data before
completely powering the module off.
Method 1: Power off SIM5320ALD by pulling the POWER_ON pin down
● Method 2: Power off SIM5320ALD by AT command
●
User can power off the SIM5320ALD by pulling POWER_ON down for a specific time. The power off
scenario is illustrated in the following figure.
Figure 16: Power off timing sequence
Table 6: Power off timing
Parameter
Toff
Time value
Description
Min.
The time pulling POWER_ON down to power off
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0.5
Typ.
Max.
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TpD-
The time to indicate disconnecting from the network
Tpw-
The time to indicate the module power off completely
7.5
Tuart_off
The time to disable UART
Tusb_off
The time to disable USB
7.5
Tona
The time to power on again after Tpw-
User can also use the AT command “AT+CPOF” to power down the module. After that, the AT commands
cannot be executed any longer. The module enters the POWER DOWN mode, only the RTC is still active.
For details, refer to Document [1].
3.3
UART Interface
SIM5320ALD provides a UART (universal asynchronous serial transmission) port. It consists of a flexible
7-wire serial interface. The module is as the DCE (Data Communication Equipment) and the client PC is
as the DTE (Data Terminal Equipment). AT commands are entered and serial communication is performed
through UART interface.
In order to prevent the UART signals of the module damaged due to voltage spikes or ESD, some resistors
can be added on UART signals. The values of resistors are adjusted according to the actual circuit. The
resistors should be placed close to the module.
The application circuit is in the following figures.
Figure 17: Full modem
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Figure 18: Null modem
3.3.1
Pin Description
Table 7: Pin description
Pin type
UART
Pin name
Pin No.
I/O
Active voltage
Default Status
UART_RXD
68
Pull-Down
UART_TXD
71
Pull-Up
UART_RTS
66
UART_CTS
67
Pull-Up
UART_DTR
72
Pull-Up
UART_DCD
70
UART_RI
69
More pin information refers to chapter 2.2.
Table 8: Logic level
Parameter
Min
Max
Unit
Logic low input
0.3*VDD_EXT
Logic high input
0.7 *VDD_EXT
VDD_EXT +0.3
Logic low output
GND
0.2
Logic high output
VDD_EXT -0.2
VDD_EXT
Note: VDD_EXT (=2.6V) is e reference voltage in module internal interface.
All pins of all serial ports have 8mA driver capacity.
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3.3.2
Application Guide
If UART port is used in Null Modem, the pin “RI” can be used as an interrupt signal to HOST. Normally it
will keep high logic level until certain condition such as receiving SMS, voice call (CSD, video) or URC
reporting, then “RI” will change to low logic level to inform the master (client PC). It will stay low until
the master clears the interrupt event with AT command.
Figure 19: RI behaviour in NULL Modem
If Full Modem is used to establish communication between devices, the pin “RI” is another operation
status. Initially it keeps high, when a voice call or CSD call comes, the pin “RI” will change to low for
about 5900ms, then it will return to high level for 100ms. It will repeat this procedure until this call is
answered or hung up.
Figure 20: RI behaviour in FULL Modem
To comply with RS-232 protocol, the RS-232 level shifter chip should be used to connect SIM5320ALD
to the RS-232-C interface. In this connection, the TTL level and RS-232 level are converted mutually.
SIMCom recommends that user uses the SP3238ECA chip with a full modem. For more information
please refers to the RS-232 chip datasheet.
Note: SIM5320ALD supports the communication rate: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200,
230400, 460800, 921600, 3200000, 3686400, 4000000bps. Default rate is 115200bps.
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3.4
USIM Interface
The USIM provides the required subscription verification information to allow the mobile equipment to
attach to a UMTS network. Both 1.8V and 3.0V SIM Cards are supported.
3.4.1
Pin description
Table 14: Electronic characteristic
Pin name
3.0V mode
1.8V mode
Min
Typ
Max
Min
Typ
Max
V_USIM
2.7
3.00
3.3
1.65
1.8
2.0
USIM_RESET
0.8* V_USIM
3.00
V_USIM
0.8* V_USIM
1.8
V_USIM
USIM_CLK
0.7* V_USIM
3.00
V_USIM
0.8* V_USIM
1.8
V_USIM
USIM_DATA
0.7* V_USIM
3.00
V_USIM
0.8* V_USIM
1.8
V_USIM
Table 15: Pin description
Pin name
USIM_CLK
USIM_RESET
Pin
19
18
USIM_DATA
17
V_USIM
20
3.4.2
Description
USIM Card Clock
USIM Card Reset
USIM Card data I/O, which has been pulled up with a 22kR resistor to
V_USIM in module. Do not pull up or pull down in users’ application
circuit.
USIM Card Power output depends automatically on USIM mode，one
is 3.0V±10%, another is 1.8V±10%. Current is less than 50mA.
Application Guide
It is recommended to use an ESD protection component such as ST (www.st.com ) ESDA6V1W5 or ON
SEMI (www.onsemi.com ) SMF05C. Note that the SIM peripheral circuit should be close to the SIM card
socket. The reference circuit of the 8-pin SIM card holder is illustrated in the following figure.
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Figure 24: USIM interface reference circuit
Note: USIM_DATA has been pulled up with a 22kR resistor to V_USIM in module. A 220nF shut capacitor on V_USIM
is used to reduce interference. Use AT Commands to get information in USIM card. For more detail, please refer to
document [1].
3.4.3
Recommend Components
For 6 pins USIM socket, SIMCom recommend to use Amphenol C707 10M006 512 2. User can visit
http://www.amphenol.com for more information about the holder.
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Figure 25: Amphenol SIM card socket
Table 16: Amphenol USIM socket pin description
3.5
Pin
Signal
C1
USIM_VDD
C2
USIM_RST
Description
SIM Card Power supply, it can identify automatically the
SIM Card power mode ， one is 3.0V±10%, another is
1.8V±10%.
SIM Card Reset.
C3
C5
C6
C7
USIM_CLK
GND
VPP
USIM_DATA
SIM Card Clock.
Connect to GND.
Connect to USIM_VDD
SIM Card data I/O.
I2C Interface
I2C is used to communicate with peripheral equipments and can be operated as either a transmitter or
receiver, depending on the device function. Use AT Commands “AT+CRIIC and AT+CWIIC” to read/write
register values of related peripheral equipments connected with I2C interface.
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3.5.1
Pin Description
Table 17: Pin description
Pin name
Pin No.
Function
I2C_SDA
56
Serial interface data input and output
I2C_SCL
55
Serial interface clock input
3.5.2
Signal Description
Both SDA and SCL are bidirectional lines, connected to a positive supply via a pull-up resistor
respectively. When the bus is free, both lines are high.
3.5.3
Design Guide
For SIM5320ALD, the data on the I2C bus can be transferred at rates up to 400kbps. The number of
peripheral devices connected to the bus is solely dependent on the bus capacitance limit of 400pF. Note
that PCB traces length and bending are in users’ control to minimize load capacitance.
Note：I2C_SDA and I2C _SCL have been pulled up with two 2.2kR resistors to 2.6V level in module. So there is no need
to pull them up in users’ application circuit.
3.6
Keypad Interface
SIM5320ALD module provides a keypad interface that supports five sense lines, or columns, and five
keypad rows. The interface generates an interrupt when any key is pressed. Its operation voltage is 1.8V.
3.6.1
Pin Description
Table 18: Pin description
Pin name
Pin No.
Function
KEYSENSE_N0
KEYSENSE_N1
KEYSENSE_N2
28
27
31
Sensing keys
KEYSENSE_N3
32
KEYSENSE_N4
36
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KEYPAD_0
KEYPAD_1
KEYPAD_2
KEYPAD_3
KEYPAD_4
3.6.2
30
29
30
35
34
Driving pads
Application Guide
All keypad pins can be configured for GPIOs. These GPIOs also support interruption operation if used as
input pins. A typical circuit about the keypad (5*5 keypad matrix) is shown in the following figure.
Figure 26: Reference circuit
If these pins are configured for GPIOs, the sequence is listed in the following table.
Table 19: GPIO configuration
Keypad interface
GPIO No.
KEYPAD_4
GPIO6
KEYPAD_3
GPIO7
KEYPAD_2
GPIO8
KEYPAD_1
GPIO9
KEYPAD_0
GPIO10
KEYSENSE_N4
GPIO11
KEYSENSE_N 3
GPIO12
KEYSENSE_N 2
GPIO13
KEYSENSE_N 1
GPIO14
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KEYSENSE_N 0
GPIO15
Note: Refer to document [21] for detailed information of Keypad Application Note.
3.7
USB Interface
SIM5320ALD module contains a USB interface. This interface is compliant with the USB2.0 specification.
The USB2.0 specification requires hosts such as the computer to support all three USB speeds, namely
low-speed (1.5Mbps), full-speed (12Mbps) and high-speed (480Mbps). USB charging and USB-OTG is
not supported.
Table 20: Electronic characteristic
Pin name
Pin No.
USB_VBUS
11
USB_DP
13
USB_DM
12
3.7.1
Input voltage scope( V )
Min
Typ
Max
4.4
5.0
5.25
They are compliant with the USB 2.0 specification.
Application Guide
Currently SIM5320ALD supports the USB suspend and resume mechanism which can help to save power.
If no transaction is on USB bus, SIM5320ALD will enter suspend mode. When some events such as voice
call or receiving SMS happen, SIM5320ALD will resume normal mode automatically.
Figure 27: USB interface
Because of high bit rate on USB bus, pay attention to influence of junction capacitance of ESD component
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on USB data lines. Typically, the capacitance should be less than 4pF @1MHz.
Note：The SIM5320ALD has two kinds of interface (UART and USB) to connect to host CPU.
USB interface is mapped
to five virtual ports: “SIMTECH USB Modem”, “SIMTECH NMEA Device”, “SIMTECH ATCOM Device”,
“SIMTECH Diagnostics interface” and “SIMTECH Wireless Ethernet Adapter”.
3.8 SPI Interface
SPI interface of SIM5320ALD is master only. It provides a duplex, synchronous, serial communication
link with peripheral devices. Its operation voltage is 1.8V, with clock rates up to 26 MHz.
3.8.1
Pin Description
Table 21: Electronic characteristic
1.8V mode
Pin name
Min
Typ
Max
SPI_CLK
1.65
1.8
1.95
SPI_CS_N
1.65
1.8
1.95
SPI_MOMI_DATA
1.65
1.8
1.95
SPI_MIMO_DATA
1.65
1.8
1.95
Table 22: Pin description
Pin name
Pin No.
Function
SPI_CS
SPI chip-select; not mandatory in a point-to-point connection
SPI_MISO_DATA
SPI master in/slave out data
SPI_CLK
SPI clock
SPI_MOSI_DATA
SPI master out/slave in data
3.9
GPIO Interface
SIM5320ALD provides a limited number of GPIO pins. All GPIOs can be configured as inputs or outputs.
User can use AT Commands to read or write GPIOs status. Refer to ATC document for details.
3.9.1
Pin Description
Table 23: Electronic characteristic
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2.6V mode
Pin name
Min
Typ
Max
GPIO1
2.5
2.6
2.7
GPIO4
2.5
2.6
2.7
GPIO40
2.5
2.6
2.7
GPIO41
2.5
2.6
2.7
GPIO43
2.5
2.6
2.7
GPIO44
2.5
2.6
2.7
GPIO42
2.5
2.6
2.7
Note: If more GPIOs need to be used, users can configure GPIO on other multiple function interfaces, such as KEYPAD.
Please refer to GPIO list.
Table 24: Pin description
Pin name
Pin No.
I/O
Function
GPIO1
51
Output PIN as LED control for network status. If it is
unused, left open.
GPIO4
54
Input PIN as RF operating control.
H: Normal Mode L:Flight Mode
If it is unused, left open.
GPIO40
49
Output PIN as operating status indicating of module.
H: Power on
L: Power off
If it is unused, left open.
GPIO41
52
I/O
General input/output PIN. It can be used as wake/interrupt
signal to host from module If it is unused, left open.
GPIO42
53
I/O
General Purpose Input/Output Port.
GPIO43
50
I/O
General Purpose Input/Output Port. It can be used as
wake/interrupt signal to module from host. If it is unused, left
open.
GPIO44
48
I/O
General Purpose Input/Output Port
Note: The output driver current of GPIOs is 1mA at the lower supply voltage and 2mA at the higher supply voltage.
3.9.2
Application Guide
Network status
GPIO1 is used to control Network Status LED; application circuit is shown below.
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Figure 28: Application circuit
Note: The value of resistor Rx depends on LED characteristic.
Table 25: LED status
LED Status
Always On
200ms ON, 200ms OFF
800ms ON, 800ms OFF
Module Status
Searching Network/Call Connect
Data Transmit
Registered network
Off
Power off / Sleep
Flight mode control
GPIO4 controls SIM5320ALD module to enter or exit the Flight mode. In Flight mode, SIM5320ALD
closes RF function to prevent interference with other equipments or minimize current consumption.
Bidirectional ESD protection component is suggested to add on GPIO4.
Figure 29: Flight mode switch
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Table 26: Control status
GPIO4 Status
Low Level
High Level
Module operation
Flight Mode: RF is closed.
Normal Mode: RF is working.
Note：
1. When the module is powered off, make sure all digital interfaces (UART, etc) connected with peripheral devices have
no voltage higher than 0.3V. If users’ design cannot meet above conditions, high level voltages maybe occur in GPIO
pins because current leakage from above digital interfaces may occur.
3.9.3
Pin Description
Table 27: Electronic characteristic
DC Characteristics
Pin name
Min
Typ
Max
PCM_CLK
-0.3
2.6
2.9
PCM_SYNC
-0.3
2.6
2.9
PCM_DOUT
-0.3
2.6
2.9
PCM_DIN
-0.3
2.6
2.9
Table 28: Pin description
Pins
Pin No.
AUX_PCM
functionality
Primary PCM
functionality
Description
PCM_DIN/GPIO0
74
AUX_PCM_DIN
PCM_DIN
PCM data input
PCM_SYNC/GPIO2
75
AUX_PCM_SYNC
PCM_SYNC
PCM data synchrony
PCM_DOUT/GPIO5
73
AUX_PCM_DOUT
PCM_DOUT
PCM data output
PCM_CLK/GPIO3
76
AUX_PCM_CLK
PCM_CLK
PCM data clock
3.9.4
Signal Description
The default PCM interface in SIM5320 is the auxiliary PCM interface. The data changes on the high level
of PCM_CLK and is sampled at the falling edge of PCM_CLK in one period. Primary PCM is disabled
after every power-on or every reset event. So user must use AT command to enable the primary PCM
mode after powering on or resetting the module every time if user wants to use Primary PCM.SIM5320
PCM Interface can be operated in Master or Slave mode if it is configured to primary PCM. In Master
Mode, the Module drives the clock and sync signals that are sent to the external codec. When it is in Slave
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Mode, the external codec drives the clock and sync signals which are sent to the module. Both PCM
modes are discussed in this section followed by additional PCM topics.
Auxiliary PCM (128 KHz PCM clock)
-law coding is supported by the auxiliary PCM. The auxiliary codec port operates with standard
long-sync timing and a 128 KHz clock.
The AUX_PCM_SYNC runs at 8 KHz with 50% duty cycle.
Most -law codec support the 128 KHz clock.
Figure 30: Synchrony timing
Figure 31: EXT CODEC to MODULE timing
Figure 32: MODULE to EXT CODEC timing
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Table 29: Timing parameters
Parameter
Description
Min
Typ
Max
Unit
T(auxsync)
AUX_PCM_SYNC cycle time
–
125
μs
T(auxsynch)
AUX_PCM_SYNC high time
62.4
62.5
μs
T(auxsyncl)
AUX_PCM_SYNC low time
62.4
62.5
μs
T(auxclk)*
AUX_PCM_CLK cycle time
7.8
–
μs
T(auxclkh)
AUX_PCM_CLK high time
3.8
3.9
–
μs
T(auxclkl)
AUX_PCM_CLK low time
3.8
3.9
–
μs
T(suauxsync)
AUX_PCM_SYNC setup time high before
1.95
falling edge of PCM_CLK
–
–
μs
T(hauxsync)
AUX_PCM SYNC hold time after falling edge
1.95
of PCM_CLK
–
–
μs
T(suauxdin)
AUX_PCM_DIN setup time before falling
70
edge of AUX_PCM_CLK
–
–
ns
T(hauxdin)
AUX_PCM_DIN hold time after falling edge
20
of AUX_PCM_CLK
–
–
ns
T(pauxdout)
Delay from AUX_PCM_CLK
AUX_PCM_DOUT valid
–
50
ns
rising
to
–
*Note: T(auxclk) = 1/(128 KHz).
Primary PCM (2048 KHz PCM clock)
SIM5320 also supports 2.048 MHz PCM data and sync timing for -law codec. This is called the primary
PCM interface. User can use AT command to take the mode you want as discussed above.
Figure 33: Synchrony timing
Figure 34: EXT CODEC to MODULE timing
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Figure 35: MODULE to EXT CODEC timing
Table 30: Timing parameters
Parameter
Description
Min
Typ
Max
Unit
T(sync)
PCM_SYNC cycle time
–
125
–
μs
T(synch)
PCM_SYNC high time
400
500
–
ns
T(syncl)
PCM_SYNC low time
–
124.5
–
μs
T(clk)
PCM_CLK cycle time
–
488
–
ns
T(clkh)
PCM_CLK high time
–
244
–
ns
T(clkl)
PCM_CLK low time
–
244
–
ns
T(susync)
PCM_SYNC setup time high before falling edge of
60
PCM_CLK
–
–
ns
T(hsync)
PCM_SYNC hold time after falling edge of
60
PCM_CLK
–
–
ns
T(sudin)
PCM_DIN setup time before falling edge of
50
PCM_CLK
–
–
ns
T(hdin)
PCM_DIN hold
PCM_CLK
10
–
–
ns
T(pdout)
Delay from PCM_CLK rising to PCM_DOUT valid
–
–
350
ns
T(zdout)
Delay from PCM_CLK falling to PCM_DOUT
–
HIGH-Z
160
–
ns
time
after
falling
edge
of
Note: SIM5320 can transmit PCM data by USB except for PCM interface. Please refer to document [22] for more
information of PCM Application Note.
3.10 Multi-functional interface
SIM5320ALD merges functions for various applications. It can enrich users’ design and lower the cost of
users’ hardware.
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3.10.1 Sink Current Source
The dedicated pin (CURRENT_SINK) is intended for driving passive devices，such as LCD backlight, this
implementation is +5V tolerant and suitable for driving white LEDs. The high-current driver can maintain
a constant current which is set by the AT command “AT+ CLEDITST”, capable of up to 150 mA.
Table 31: Electronic characteristic
Symbol
Description
Min
Typ
Max
Unit
CURRENT_SINK
Input voltage
0.5
VDD
IO
Input current
150
mA
Since the driver is ground-referenced current sink, the operating device it drives must form a current path
between the VDD pin and the CURRENT_SINK pin. The following figure is for users reference.
Figure 36: Current drive
Note: The sinking current can be adjusted to meet design requirement through the AT command “AT+ CLEDITST =<0>,
”.The “value” ranges from 0 to 15,on behalf of the current changes from 0mA to 150mA in steps of 10mA.
3.10.2 Reset Function
SIM5320ALD also have a RESET pin (PIN4) to reset the module. This function is used as an emergency
reset only when AT command “AT+CPOF” and the POWER_ON pin has no effect. User can pull the
RESET pin to ground, then the module will reset.
This pin is already pulled up in module, so the external pull-up resistor is not necessary. A 100nF capacitor
close to the RESET pin is strongly recommended. A reference circuit is recommended in the following
figure.
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Figure 37: Reset circuit
Note：50ms
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