Simcom 20170406 Smart Module User Manual

Shanghai Simcom Ltd. Smart Module

Contents

User Manual

Smart Module SIMT 1502 ________________________________________________________________ Hardware Version: V1.2 Software Version:CB03_8909_V4.4_20160901 Manufacturer SHANGHAI SIMCOM LIMITED Building A,SIM Technology Building,No.633, Jinzhong Road, Changning District Expert Importers: Datalogic Srl Address: Via San Vitalino 13 – 40012 Lippo di Calderara di Reno
SHANGHAI SIMCOM LIMITED 2 This device is restricted to indoor operation only in the band 5150 - 5350 MHz. (Only for devices that support 802.11 5 GHz functions) This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains FCC ID: UDV-20170406” any similar wording that expresses the same meaning may be used. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The module is limited to OEM installation ONLY. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application; A separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. There is requirement that the grantee provide guidance to the host manufacturer for compliance with Part 15B requirements. This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
SHANGHAI SIMCOM LIMITED 3 (1)the device for operation in the band 5150-5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems; (2)the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall comply with the e.i.r.p. limit; and (3)the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate. (4) Users should also be advised that high-power radars are allocated as primary users (i.e. priority users) of the bands 5250-5350 MHz and 5650-5850 MHz and that these radars could cause interference and/or damage to LE-LAN devices. (i) les dispositifs fonctionnant dans la bande 5 150-5 250 MHz sont réservés uniquement pour uneutilisation à l’intérieur afin de réduire les risques de brouillage préjudiciable aux systèmes de satellites mobiles utilisant les mêmes canaux; (ii) le gain maximal d’antenne permis pour les dispositifs utilisant les bandes 5 250-5 350 MHz et5 470-5 725 MHz doit se conformer à la limite de p.i.r.e.; (iii) le gain maximal d’antenne permis (pour les dispositifs utilisant la bande 5 725-5 850 MHz) doit se conformer à la limite de p.i.r.e. spécifiée pour l’exploitation point à point et non point à point, selon le cas. (iiii) De plus, les utilisateurs devraient aussi être avisés que les utilisateurs de radars de haute puissancesont désignés utilisateurs principaux (c.-à-d., qu’ils ont la priorité) pour les bandes 5 250-5 350 MHz et 5 650-5 850 MHz et que ces radars pourraient causer du brouillage et/ou des dommages aux dispositifs LAN-EL.
SHANGHAI SIMCOM LIMITED 4 Contents _____________________________________________________________________________ 1 Introduction ....................................................................................................................................................................... 6 1.1 Documentation overview ..................................................................................................................................... 6 1.2 Key features .......................................................................................................................................................... 6 1.2.1 Feature introduction ................................................................................................................................. 6 1.2.2 Summary of features ................................................................................................................................. 6 1.3 Block diagram ....................................................................................................................................................... 8 1.4 Terms and acronyms ............................................................................................................................................ 9 2 Interface Definitions ........................................................................................................................................................ 12 2.1 Interface configuration ...................................................................................................................................... 12 2.2 Pin definitions ..................................................................................................................................................... 13 3 Electrical Specifications .................................................................................................................................................. 18 3.1 Operating conditions .......................................................................................................................................... 18 3.2 Current test report ............................................................................................................................................. 19 4 Application Interface Specifications ............................................................................................................................... 20 4.1 Power interface ................................................................................................................................................... 20 4.2 PMIC GPIO and MPP interface ....................................................................................................................... 20 4.3 USB interface ...................................................................................................................................................... 21 4.4 Audio interface ................................................................................................................................................... 21 4.5 Camera interface ................................................................................................................................................ 22 4.6 Display interface ................................................................................................................................................. 24 4.7 CTP interface ...................................................................................................................................................... 25 4.8 SD interface ......................................................................................................................................................... 25 4.9 Sensors interface ................................................................................................................................................. 26 4.10 Side keys interface ............................................................................................................................................ 26 4.11 Battery connector interface ............................................................................................................................. 26 4.12 I2C , UART and SPI interface ......................................................................................................................... 27 4.12.1 UART ...................................................................................................................................................... 27 4.12.2 I2C .......................................................................................................................................................... 28 4.12.2 SPI........................................................................................................................................................... 28
SHANGHAI SIMCOM LIMITED 5 4.13 Other interface .................................................................................................................................................. 29 4.13.1 Camera flash Signal .............................................................................................................................. 29 4.13.2 PM_VIB_DRV_N Signal ....................................................................................................................... 29 4.13.3 VCOIN Signal ........................................................................................................................................ 29 4.13.4 RF Signal input port .............................................................................................................................. 30 5 Mechanical Specification ................................................................................................................................................ 31 5.1 Overview ............................................................................................................................................................. 31 5.2 SIMT1502 specifications .................................................................................................................................... 31 5.2.1 SIMT1502 from factor ............................................................................................................................ 31 5.2.2 SIMT1502 PCB details ............................................................................................................................ 32 5.3 System BTB connector specifications ............................................................................................................... 33 5.3.1 BTB connector ......................................................................................................................................... 33 6 RF Specification .............................................................................................................................................................. 34 6.1 R&D parameters ................................................................................................................................................ 33 6.1.1 SIMT1502’s BT&WIFI ........................................................................................................................... 33 6.1.2 SIMT1502 WiFi bands and bandwidth ................................................................................................. 35 6.1.3 SIMT1502 WiFi transmission type and supported Modulation .......................................................... 36 6.1.4 SIMT1502 BT frequency and channels ................................................................................................. 36 6.1.5 SIMT1502 BT transmission type and supported Modulation ............................................................. 36 6.1.6 About how the co-existance between WLAN and BT is managed ...................................................... 36 7 Declaration of Conformity (DoC) ................................................................................................................... 34
SHANGHAI SIMCOM LIMITED 6 1 Introduction 1.1 Documentation overview This document describes electrical specifications, RF specifications, function interface, mechanical information and testing conclusions of the SIMT1502. With the help of this document, the users can easily and quickly use SIMT1502 on their own applications. 1.2 Key features 1.2.1 Feature introduction SIMT1502 is a very powerful baseband module with 124 pins interface. As a baseband module for Smartphone/Music player-enabled devices and applications/camera phones/Multimedia phones/ many other terminals,SIMT1502 supports Data-service and many peripheral equipment, which can be supported by Qualcomm’s ® MSM8909 platform. 1.2.2 Summary of features SIMT1502 features are listed on the following table (Table1-1) Table1-1 SIMT1502 features Feature Capability Processors Processors ■ Qualcomm’s® MSM8909:Quad-ARM® Cortex™-A7 application processors up to 1GHz + 512KB L2 cache ■ Modem system: QDSP6 v5 core at up to 691MHz 768 kB L2 caches ■ RPM system :Cortex-M3 for the RPM Memory support System memory via EBI ■ 1x LPDDR3 SDRAM: 2GB SDRAM + 16GB EMMC; 32-bit wide; up to 533 MHz External memory via SDC1 ■ eMMC v4.5/SD flash devices Multimedia Display interfaces ■ MIPI_DSI ■ General display features One ■ 4-lane – 1.5 Gbps per lane; WVGA, up to HD(720p), 60fps ■ Color depth – 24-bit pp(RGB888) ■ Panel types – Most MIPI DSI compliant panels supported; Camera interfaces ■ Number of CSIs ■ Primary (CSI0) ■ Secondary (CSI1) ■ Configurations supported ■ Two; 1.5 Gbps per lane ■ 2-lane MIPI_CSI0；supports CMOS and CCD sensors Up to 8MP sensors ■ 1-lane MIPI_CSI1；webcam support 5MP ■ I2C controls
SHANGHAI SIMCOM LIMITED 7 Video applications performance ■Encode: H.264 BP/MP – HD(720p),30 fps MPEG-4 SP/H.263P0 –WVGA, 30 fps VP8 – WVGA, 30 fps ■ Encode: H.264 BP/MP/HP – 1080p, 30 fps MPEG-4 SP/ASP – 1080p, 30 fps DivX 4x/5x/6x – 1080p, 30 fps H.263 P0 – WVGA, 30 fps VP8 – 1080p, 30 fps (HEVC) H.265 MP 8 bit–1080p, 30 fps Graphics ■ Adreno™ 304; up to 400 MHz 3D graphics accelerator Audio Codec ■ Low-power audio ■ Voice codec support  ■ Audio codec support ■ Enhanced audio ■ Synthesizer Integrated within the MSM8909 device ■ Low power audio for mp3 and AAC playback; surround sound ■ Versatile – many audio playback & voice modes; encoders for audio; many concurrency modes ■ G711; Raw PCM; QCELP; EVRC, -B, -WB; AMR-NB, -WB; GSM-EFR, -FR, -HR; ■ MP3; AAC+, eAAC; AMR-NB, -WB, G.711, WMA 9/10 Pro ■ Dolby Digital Plus and DTS-HD surround Fluence™ Noise Cancellation； QAudioFX/Qconcert/QEnsemble; 128-voice polyphony wavetable Audio inputs ■ Up to 3 analog microphones, with integrated MIC bias Audio outputs ■ Four outputs : Earpiece Mono AB Headphones Stereo AB Speaker 800mW CLASS-D Connectivity BLSP ports ■ UART ■ I2C ■ SPI (master only) 6,4 at 4-bits each, 2 at 2-bits each; multiplexed serial interface functions ■ Yes – two ports up to 4 Mbps ■ Yes – cameras, sensors, NFC, SMB charger, etc. ■ Yes – cameras, sensors, etc. USB interface ■ One USB 2.0 high-speed Secure digital interfaces ■ Up to two ports, both dual-voltage ■ One 8-bit and one 4-bit ■ SD 3.0; SD/MMC card; eMMC v4.5 Wireless connectivity ■ WLAN ■ Bluetooth With WCN3660B ■ WCN3660B : 802.11 a/b/g/n , 2.4G and 5G ■ BT 4.0 LE and earlier Touch screen support ■ Capacitive panels via external IC (I2C, SPI, & interrupts) Temperature Operating Temperature -10 to 60℃ Storage Temperature -30 to 80℃
SHANGHAI SIMCOM LIMITED 8 1.3 Block diagram MAIN BOARDMSM8909WCN3660BPM8909WTR4905MEMORYGPIO28/SCAM_RST_N 3GPIO27/SCAM_MCLK 4MIPI_CSI1_LANE0_P 5MIPI_CSI1_LANE0_N 6MIPI_CSI1_CLK_P 7MIPI_CSI1_CLK_N 8MIC3_IN_P 9 MIC2_IN_P 10CDC_HS_DET 11SPKR_DRV_M 12SPKR_DRV_P 13CDC_EARO_M 14CDC_EARO_P 15MIC_GND 16MIC1_IN_P 17MIC_BIAS1 18CDC_HPH_R 19CDC_HPH_REF 20CDC_HPH_L 21GPIO_14 22GPIO_15 23GPIO_6/UART_CTS_N 24GPIO_7/UART_RFR_N 25GPIO_4/UART_TX 26GPIO_5/UART_RX 27GPIO_111/UART_CTS_N/SDA 28GPIO_112/UART_RFR_N/SCL 29 31 BT_WIFI_INGPIO_13/TS_INT_N 33GPIO_18/TS_12C_SDA 34GPIO_19/TS_12C_SCL 35GPIO_12/TS_RST_N 36GPIO_38/SD_CARD_DET_N 37GPIO_20/UART_TX 38GPIO_21/UART_RX 39GPIO_90/KPSNS0 40GPIO_91/KPSNS1 41GPIO_92/KPSNS2 42USB_DM 44USB_DP 45GPIO_22/AUDIO_PA_EN 47GPIO_28 48GPIO_0/MI2S_WS 49GPIO_1/MI2S_CLK 50GPIO_2/MI2S_D0 51GPIO_3/MI2S_D1 52GPIO_16/ACCEL_INT_1 53SDC2_CMD 54SDC2_DATA0 55SDC2_DATA1 56SDC2_DATA2 57SDC2_DATA3 58SDC2_CLK 5961 VREG_L11_2P95VGPIO_29 63GPIO_52 65666768697071 72 74 75 PM_PWR_ON 7677 PM_VIB_DRV_NUSB_HS_ID 78PMU_MPP_2_PWM 7981 PMU_GPIO01 PM_RES_IN_N 82VREF_BAT_THERM 8485 VREG_L12_2P95V86 GPIO_2487 VBUS_USBIN89 VCOIN BAT_THERM 9092 VPH_PWR93 96 MIPI_DSI0_CLK_P97 MIPI_DSI0_CLK_N98 MIPI_DSI0_LANE3_P99 MIPI_DSI0_LANE3_N100 MIPI_DSI0_LANE2_P101 MIPI_DSI0_LANE2_N102 MIPI_DSI0_LANE1_P103 MIPI_DSI0_LANE1_N104 MIPI_DSI0_LANE0_P105 MIPI_DSI0_LANE0_N106 GPIO_8107 VREG_L17_2P85V108 GPIO_9109 VREG_L6_1P8V110 GPIO_10/CAM_I2C_SDA111 GPIO_11/CAM_I2C_SCL112 GPIO_35/MCAM_RST_N113 GPIO_34/MCAM_STANDBY_N115 MIPI_CSI0_LANE1_N116 MIPI_CSI0_LANE1_P117 MIPI_CSI0_LANE2_P118 MIPI_CSI0_LANE2_N119 MIPI_CSI0_CLK_N120 MIPI_CSI0_CLK_P121 GPIO_33122 GPIO_26/MCAM_CLK124 VPH_PWR2324346626473809195114 123125126127128DEBUGWCNPDET_INWLAN_IOBT/WLAN/FM SSBIBT_STROBEXO_GPM8909RFGPS_RX_I/OCHO_TX_I/OCHO_RX_I/OCHO_GP_DATA SAW LNA SAWJTAGCONNECTORUSBT_FLASHCARDTouchscreenSENSOR：_N;12CMIPI FOR LCM MIPI FOR Main cameraMIPI FOR SUB CAMERACAM_ 12CSDC1EBI0EMMC_NANDLPDDR3AUDIOCXO_EN （BBCLK_EN）CXO_IN (BBCLK 19.2MHz)SLEEP_CLK 32.768KHzRESIN_NPS_HOLDSPMI_CLKSPMI_DATAPMIC_INTRF_CLK1RF_CLK219.2MHzUSBVPH_PWROVPVCHGFET&SNSXO19.2MHzGPIO[0:4]MPP[0:4]BOOST_BYP_BYPUIM_BATT_ALARMENTERN_LDO_CTLGYRO_EN_PMWLED CTL-PWM MODULE OUTPUTHome row (2WLE D * 20mA)PA_THERMVDD_RX_BIAS(1.25V)BTBGND 1GPIO_25 2NC 3NC 4GPIO_31 5GPIO_32 6GPIO_36 7GPIO_58 8GPIO_93 9GPIO_94 10GPIO_95 11GPIO_96 12GPIO_97 13GPIO_110 14GPIO_65 1530 GND29 GND28 GND27 GND26 GND25 GND24 GND23 GND22 GND21 GND20 GND19 GND18 GND17 CND16 GNDGPIO_98 60GPIO_30 6483 PMU_GPIO02 94 SWITCH2.4G5G 30 5G_WIFI88 VBATTR=0ΩOPT1Disable internal ChargingSWITCH COUPLER1 IPEX-3 RF connectorCoaxial line48MHz Figure1-2 SIMT1502 functional block diagram
SHANGHAI SIMCOM LIMITED 9 1.4 Terms and acronyms Table1-2 Terms and acronyms Term Definition ADC Analog-to-digital converter AGC Automatic gain control AVS Adaptive voltage scaling BER Bit error rate BNSP Bare nanoscale packaging bps Bits per second BT Bluetooth CA Carrier aggregation CDMA Code division multiple access CRC Cyclic redundancy code CSI Camera serial interface CTP Capacitive touch panel DAC Digital-to-analog converter DBHSPA Dual-band HSPA DC-HSPA+ Dual-carrier HSPA+ DCUPA Dual-carrier HSPA DDR Double data rate DMB Digital mobile broadcast DRM Digital Rights Management DSI Display serial interface DSP Digital signal processor EBI External bus interface EDGE Enhanced data rates for GSM evolution EDR Enhanced data rate ETB Embedded trace buffer QDSS Embedded trace macrocell EV-DO Evolution data optimized FDD Frequency division duplex GNSS Global navigation satellite system GPIO General-purpose input/output GPRS General packet radio services GPS Global positioning system GPU Graphics processing unit GRFC Generic RF controller GSM Global system for mobile communications HDCP High-bandwidth digital content protection HSDPA High-speed downlink packet access HSIC High-speed inter-chip HSPA+ High-speed packet access
SHANGHAI SIMCOM LIMITED 10 Table1-2 Terms and acronyms (cont.) Term Definition HSUPA High-speed uplink packet access I2C Inter-integrated circuit I2S Inter-IC sound ISP Image signal processing JTAG Joint Test Action Group (ANSI/ICEEE Std. 1149.1-1990) kbps kilobits per second LCD Liquid crystal display LPA Low-power audio LPASS Low-power audio subsystem LPDDR Low-power DDR LSB Defines whether the LSB is the least significant bit or least significant byte. All instances of LSB used in this manual are assumed to be LSByte, unless otherwise specified. LTE Long term evolution MBP Mobile broadcast platform MDM Mobile data modem MIPI Mobile industry processor interface MPM Modem power management MSB Defines whether the MSB is the most significant bit or most significant byte. All instances of MSB used in this manual are assumed to be MSByte, unless otherwise specified. MTP Modem test platform NSP Nanoscale package PA Power amplifier PCM Pulse-coded modulation PI Power in PDM Pulse-density modulation PM Power management PNSP Package-on-package nanoscale package PO Power out PVS Process voltage scaling RBDS Radio broadcast data system RDS Radio data system RLP Radio link protocol RPM Resource power manager SBI Serial bus interface SD Secure digital SDC Secure digital controller SEE Secure Execution Environment SFS Secure file system SIM Subscriber identity module SMT Surface mount technology SPI Serial peripheral interface
SHANGHAI SIMCOM LIMITED 11 Table1-2 Terms and acronyms (cont.) Term Definition SPMI System power management interface sps Symbols per second (or samples per second) SPSS Smart peripheral subsystem SSBI Single-wire SBI SVS Static voltage scaling TAP Test access port TBD To be discussed TCXO Temperature-compensated crystal oscillator TDD Time division duplexing TSIF Transport stream interface UART Universal asynchronous receiver transmitter UICC Universal integrated circuit card UMTS Universal mobile telecommunications system USB Universal serial bus USIM UMTS subscriber identity module WCDMA Wideband code division multiple access WCN Wireless connectivity network WLAN Wireless local area network WTR Wafer-scale RF transceiver XO Crystal oscillator ZIF Zero intermediate frequency
SHANGHAI SIMCOM LIMITED 12 2 Interface Definitions _______________________________________________________________________________ 2.1 Interface configuration Figure2-1 Interface configuration
SHANGHAI SIMCOM LIMITED 13 2.2 Pin definitions Table2-1 SIMT1502 Pin definitions Pin# Pad name Default EVB GPIO Pad characteristics Functional description VDD Type 1 NC 2 GND 3 SCAM_RST_N SCAM_RST_N GPIO_28* P3 DO; B-PD:nppukp Configurable I/O; Sub Camera reset 4 SCAM_MCLK SCAM_MCLK GPIO_27 P3 DO; B-PD:nppukp Configurable I/O; Sub camera clock 5 MIPI_CSI1_LANE0_P MIPI_CSI1_LANE0_P MIPI - AI, AO MIPI camera serial interface1 lane0 –positive 6 MIPI_CSI1_LANE0_M MIPI_CSI1_LANE0_M - AI, AO MIPI camera serial interface1 lane0–negative 7 MIPI_CSI1_CLK_P MIPI_CSI1_CLK_P - AI MIPI camera serial interface1 clock –positive 8 MIPI_CSI1_CLK_M MIPI_CSI1_CLK_M - AI MIPI camera serial interface1 clock–negative 9 MIC3_IN_P MIC3_IN_P Audio (only) - AI Microphone 3 input, single-ended 10 MIC2_IN_P MIC3_IN_P - AI Microphone 2 input, single-ended 11 HS_DET HS_DET - DI Headset detection 12 SPKR_DRV_M SPKR_DRV_M - AO Speaker driver output, M 13 SPKR_DRV_P SPKR_DRV_P - AO Speaker driver output, P 14 EARO_M EARO_M - AO Earpiece amplifier output, differential minus 15 EARO_P EARO_P - AO Earpiece amplifier output, differential plus 16 MIC_GND MIC_GND - - - 17 MIC1_IN MIC1_IN - AI Microphone1 input, single-ended 18 MIC_BIAS1 MIC_BIAS1 - AO Mic Bias output voltage 19 HPH_R HPH_R - AO Headphone right output 20 HPH_REF HPH_REF - AI Headphone driver amplifier ground reference 21 HPH_L HPH_L - AO Headphone left output 22 GPIO_14 BQ_I2C_SDA GPIO_14 P3 B; B-PD:nppukp Configurable I/O; SPI or I2C BLSP#4 23 GPIO_15 BQ_I2C_SCL GPIO_15 P3 DO; B-PD:nppukp Configurable I/O; SPI or I2C BLSP#4 24 UART1_CTS_N UART1_CTS_N GPIO_6 P3 B; B-PD:nppukp Configurable I/O; UART, SPI, or I2C BLSP#1 25 UART1_RFR_N UART1_RFR_N GPIO_7 P3 B; B-PD:nppukp Configurable I/O; UART, SPI, or I2C BLSP#1 26 UART1_TX UART1_TX GPIO_4 P3 B; B-PD:nppukp Configurable I/O; UART, SPI, BLSP#1 27 UART1_RX UART1_RX GPIO_5* P3 B; B-PD:nppukp Configurable I/O; UART, SPI, BLSP#1 28 UART2_CTS_N/SDA SE4500_ILL /N5600_AIM_ON GPIO_111* P3 DO; B-PD:nppukp Configurable I/O; UART, SPI or I2C BLSP#2
SHANGHAI SIMCOM LIMITED 14 29 UART2_CTS_N/SCL SE955_TRIGGER /N5600_ILL GPIO_112* P3 DO; B-PD:nppukp Configurable I/O; UART, SPI or I2C BLSP#2 30 NC 31 WIFI_BT_RF WIFI_BT_RF - - AI 2.4G WIFI signal 32 GND 33 TS_IN_N TS_IN_N GPIO_13* P3 DI; B-PD:nppukp Configurable I/O; Touch screen interrupt 34 TS_I2C_SDA TS_I2C_SDA GPIO_18 P3 B; B-PD:nppukp Configurable I/O; Touch screen I2C 35 TS_I2C_SCL TS_I2C_SCL GPIO_19 P3 DO; B-PD:nppukp Configurable I/O; Touch screen I2C 36 TS_RST_N TS_RST_N GPIO_12* P3 DO; B-PD:nppukp Configurable I/O; Touch screen reset 37 SD_CARD_DET_N MIPI_SW_EN GPIO_38* P3 DO; B-PD:nppukp Configurable I/O; Secure digital card detection 38 UART2_TX UART2_TX GPIO_20* P3 B; B-PD:nppukp Configurable I/O; UART,SPI BLSP#2 39 UART2_RX UART2_RX GPIO_21* P3 B; B-PD:nppukp Configurable I/O; UART,SPI BLSP#2 40 KYPD_SNS0 KYPD_SNS0 GPIO_90* P3 DI; B-PD:nppukp Keypad sense bit 0; Configurable I/O 41 KYPD_SNS1 KYPD_SNS1 GPIO_91* P3 DI; B-PD:nppukp Keypad sense bit 1; Configurable I/O 42 KYPD_SNS2 / KYPD_INT GPIO_92* P3 DI; B-PD:nppukp Keypad sense bit 2; Configurable I/O 43 GND 44 USB_DM USB_DM USB - AI, AO USB data – minus 45 USB_DP USB_DP - AI, AO USB data – plus 46 GND 47 AUDIO_PA_EN OTG_PSEL GPIO_22 P3 DO; B-PD:nppukp Configurable I/O 48 GPIO23 RS232_UART_SEL GPIO_23 P3 DO; B-PD:nppukp Configurable I/O 49 MI2S_WS SE955_CTS /N5600_PWR GPIO_0 P3 DI; B-PD:nppukp Configurable I/O; SPI; MI2S #2 word select (L/R) 50 MI2S_SCK SE955_RFR /N5600_RST GPIO_1 P3 DI; B-PD:nppukp Configurable I/O; SPI; MI2S #2 bit clock 51 MI2S_D0 RS232_EN GPIO_2 P3 DO; B-PD:nppukp Configurable I/O; SPI; MI2S #2 serial data channel 0 52 MI2S_D1 USB_RST /GP_OUT GPIO_3 P3 DI; B-PD:nppukp Configurable I/O; SPI; MI2S #2 serial data channel 1 53 ACCEL_INT1 SE955_UART_SEL GPIO_16 P3 DO; B-PD:nppukp Configurable I/O; Accelerometer interrupt 1 54 SDC2_CMD SDC2_CMD SD (only) P2 BH-PD:nppukp Secure digital controller 2 command 55 SDC2_DATA_0 SDC2_DATA_0 P2 BH-PD:nppukp Secure digital controller 2 data bit 0 56 SDC2_DATA_1 SDC2_DATA_1 P2 BH-PD:nppukp Secure digital controller 2 data bit 1 57 SDC2_DATA_2 SDC2_DATA_2 P2 BH-PD:nppukp Secure digital controller 2 data bit 2 58 SDC2_DATA_3 SDC2_DATA_3 P2 BH-PD:nppukp Secure digital controller 2 data bit 3 59 SDC2_CLK SDC2_CLK P2 BH-NP:pdpukp Secure digital controller 2 clock 60 MI2S_2_MCLK SCAN_KEY GPIO_98* P3 DI; B-PD:nppukp Configurable I/O 61 VREG_L11_2P95V VREG_L11_SDC POWER - PO PMIC output for SDC (only)
SHANGHAI SIMCOM LIMITED 15 62 GND 63 GPIO_29 CAM_I2C_SDA GPIO_29 P3 B; B-PD:nppukp Camera I2C SDA (only) 64 GPIO_30 CAM_I2C_SCL GPIO_30 P3 DO; B-PD:nppukp Camera I2C SCL (only) 65 UIM2_PRESENT KYPD_EN GPIO_52 P3 DO; B-PD:nppukp Configurable I/O; 66 NC 67 68 69 70 71 72 73 GND 74 NC 75 76 PM_KYPD_PWR_N PM_KYPD_PWR_N PMU CTR - DI Power on key (only) 77 PM_VIB_DRV_N PM_VIB_DRV_N PMU CTR - PO Vibration motor driver output control 78 USB_HS_ID USB_HS_ID_MAIN USB - AI USB OTG ID 79 PMU_MPP_2_PWM PWM_OUT PMU CTR - DO Configurable I/O; LED current sink; LCM PWM 80 GND 81 PMU_GPIO01 NFC_ENABLE PMU GPIO1 - DO-Z;DI Configurable GPIO; 82 PM_RESIN_N PM_RESIN_N PMU CTR - DI PMIC reset (only) 83 PMU_GPIO02 NFC_1P8V_EN PMU GPIO2 - DO-Z;DI Configurable GPIO; 84 VREF_BAT_THERM VREF_BAT_THERM PMU CTR - AO Reference voltage for battery thermistor 85 VREG_L12_2P95V VREG_L12_SDC POWER - PO PMIC output for SDC (only) 86 GPIO_24 LCD_TE0 GPIO_24 P3 DI; B-PD:nppukp Configurable I/O 87 VBUS_USBIN VBUS_USBIN POWER PI USB Voltage 88 VBAT VBATT BAT SNS AI Battery SNS 89 VCOIN VCOIN POWER AI;AO RTC 90 BAT_THERM BAT_THERM - AI Battery therm monitor 91 GND 92 VBAT/VPH VPH_PWR POWER SYS Power 93 NC 94 NC 95 GND 96 MIPI_DSI0_CLK_P MIPI_DSI0_CLK_P MIPI AO MIPI display serial interface0 clock – positive 97 MIPI_DSI0_CLK_M MIPI_DSI0_CLK_M AO MIPI display serial interface 0 clock – negative 98 MIPI_DSI0_LANE3_P MIPI_DSI0_LANE3_P AI, AO MIPI display serial interface 0 lane 3 – positive 99 MIPI_DSI0_ LANE3_M MIPI_DSI0_ LANE3_M AI, AO MIPI display serial interface 0 lane 3 – negative 100 MIPI_DSI0_ LANE 2_P MIPI_DSI0_ LANE 2_P AI, AO MIPI display serial interface 0 lane 2 – positive 101 MIPI_DSI0_ LANE2_M MIPI_DSI0_ LANE2_M AI, AO MIPI display serial interface 0 lane 2 – negative
SHANGHAI SIMCOM LIMITED 16 102 MIPI_DSI0_ LANE1_P MIPI_DSI0_ LANE1_P MIPI AI, AO MIPI display serial interface 0 lane 1 – positive 103 MIPI_DSI0_ LANE1_M MIPI_DSI0_ LANE1_M AI, AO MIPI display serial interface 0 lane 1 – negative 104 MIPI_DSI0_ LANE0_P MIPI_DSI0_ LANE0_P AI, AO MIPI display serial interface 0 lane 0 – positive 105 MIPI_DSI0_ LANE0_M MIPI_DSI0_ LANE0_M AI, AO MIPI display serial interface 0 lane 0 – negative 106 GPIO_8 LCD_RST_N GPIO_8 DO; B-PD:nppukp Configurable I/O 107 VREG_L17_2P85V VREG_L17_2P85V POWER PO PMIC output 108 GPIO_9 CAM_FLASH_EN GPIO_9 DO; B-PD:nppukp General-purpose wakeup 109 VREG_L6_1P8V VREG_L6_1P8V POWER PO PMIC output 110 CCI_I2C_SDA I2C_SDA GPIO_10 B; B-PD:nppukp Configurable I/O; I2C 111 CCI_I2C_SCL I2C_SCL GPIO_11* DO; B-PD:nppukp Configurable I/O; I2C 112 MCAM_RST_N MCAM_RST_N GPIO_35* DO; B-PD:nppukp Configurable I/O; Main Camera reset; 113 MCAM_STANDBY_N MCAM_STANDBY_N GPIO_34* DO; B-PD:nppukp Configurable I/O; Main Camera standby 114 GND 115 MIPI_CSI0_LANE1_M MIPI_CSI0_LANE1_M MIPI AI, AO MIPI camera serial interface 0 lane 1 – negative 116 MIPI_CSI0_ LANE1_P MIPI_CSI0_ LANE1_P AI, AO MIPI camera serial interface 0 lane 1 – positive 117 MIPI_CSI0_ LANE2_P MIPI_CSI0_ LANE2_P AI, AO MIPI camera serial interface 0 lane 2 – positive 118 MIPI_CSI0_ LANE2_M MIPI_CSI0_ LANE2_M AI, AO MIPI camera serial interface 0 lane 2 – negative 119 MIPI_CSI0_CLK_M MIPI_CSI0_CLK_M AI MIPI camera serial interface 0 CLK – negative 120 MIPI_CSI0_CLK_P MIPI_CSI0_CLK_P AI MIPI camera serial interface 0 CLK – positive 121 GPIO_33 SCAM_PWDN GPIO_33 DO; B-PD:nppukp Sub Camera PWND 122 MCAM_MCLK MCAM_MCLK GPIO_26 DO; B-PD:nppukp Main Camera clock 123 GND GND GND 124 VBAT/VPH VPH_PWR POWER SYS Power Table2-2 SIMT1502 BTB connector pin definitions Pin# Pad name Default EVB GPIO Pad characteristics Functional description Voltage Type 1 GND 2 GPIO_25 USB_SW_EN GPIO_25* P3 DO; B-PD:nppukp Configurable I/O 3 NC 4 NC 5 GPIO_31 / TC358746_RST GPIO_31* P3 DO; B-PD:nppukp Configurable I/O 6 GPIO_32 REFCLK GPIO_32 P3 DO; B-PD:nppukp Configurable I/O 7 GPIO_36 CHG_INT GPIO_36* P3 DI; B-PD:nppukp Configurable I/O 8 GPIO_58 GYRO_INT_EN GPIO_58* P3 DO; B-PD:nppukp Configurable I/O
SHANGHAI SIMCOM LIMITED 17 9 GPIO_93 OTG_EN GPIO_93 P3 DO; BB-PD:nppukp Configurable I/O 10 GPIO_94 ALSP_INT_N GPIO_94* P3 DI; BB-PD:nppukp Configurable I/O 11 GPIO_95 CHG_EN GPIO_95* P3 DO; BB-PD:nppukp Configurable I/O 12 GPIO_96 VBUS_OTG_EN GPIO_96* P3 DO; BB-PD:nppukp Configurable I/O 13 GPIO_97 NFC_DWL_REQ GPIO_97* P3 DI; B-PD:nppukp Configurable I/O 14 GPIO_110 NFC_INT_N GPIO_110* P3 DI; B-PD:nppukp Configurable I/O 15 GPIO_65 MAG_RESET GPIO_65* P3 DI; B-PD:nppukp Configurable I/O 16 GND 17 GND 18 GND 19 GND 20 GND 21 GND 22 GND 23 GND 24 GND 25 GND 26 GND 27 GND 28 GND 29 GND 30 GND NOTE:I/O parameter definitions Symbol * General purpose wakeup AI Analog input AO Analog output B Bidirectional digital with CMOS input CSI Supply voltage for MIPI_CSI circuits and I/Os; tied to VDD_MIPI_CSI (1.8 V only) DI Digital input(CMOS) DO Digital output(CMOS) DSI Supply voltage for MIPI_DSI I/Os; tied to VDD_QFPROM_PRG (1.8 V only) H High-voltage tolerant KP Contains an internal weak keeper device (keepers cannot drive external buses) NP Contains no internal pull PD Contains an internal pulldown device PU Contains an internal pullup device PI Power input PO Power output V_G Selectable supply for GPIO circuits; options include: VIN0: 3.6 V VIN1: 3.075 V VIN2: 1.2 V VIN3: 1.8 V V_INT Internally generated voltage supply voltage for some power on circuits Z High-impedance (high-Z) output
SHANGHAI SIMCOM LIMITED 18 3 Electrical Specifications _______________________________________________________________________________ 3.1 Operating conditions 1.8 V digital I/O characteristics1.8 V digital I/O characteristics1.8 V digital I/O characteristics1.8 V digital I/O characteristics ((((P3)))):::: VDD_P3GPIOs DualDualDualDual----voltage 1.8 V/2.95 V digital I/O characteristicsvoltage 1.8 V/2.95 V digital I/O characteristicsvoltage 1.8 V/2.95 V digital I/O characteristicsvoltage 1.8 V/2.95 V digital I/O characteristics ：：：： VDD_P2SDC2
SHANGHAI SIMCOM LIMITED 19 3.2 Current test report This Current test report based on the EVB board, Vbat=3.8V. All values are typical unless otherwise specified. 1. During suspend (Airplane mode, no UIM, system in sleep mode): 2.9mA. 2. During suspend (WIFI wake up, BT off, system in sleep mode): 3.0mA. 3. Module power off (Do not remove the battery): 75uA(Without Vcoin); 250uA(With Vcoin).
SHANGHAI SIMCOM LIMITED 20 4 Application Interface Specifications _______________________________________________________________________________ 4.1 Power interface The power supply of SIMT1502 comes from PM8909. See Table4-1 Table4-1 Power source description Signal Pin# Direction Voltage(V) Current(mA) PI/PO Min Typ Max Max VREG_L11_2P95V 61 PO 1.75 2.95 3.337 600 VREG_L12_2P95V 85 PO 1.75 1.8/2.95 3.337 50 VREG_L17_2P85V 107 PO 1.75 2.85 3.337 420 VREG_L6_1P8V 109 PO 1.75 1.8 3.337 200 Signal Pin# Direction Functions PI/PO VBAT_SNS 88 PI Battery SNS VBAT/VPH 92 PI/PO SYS Power VBAT/VPH 124 PI/PO SYS Power VBAT means battery, VPH means SYS Power. If you use the SIMT1502’s internal charging management, they are the same function and they must be connected together. If you use external charging management, PIN88 is Battery only and PIN92/124 is VPH only. You can see it in SIMT1502_HW_compatibility design of the modification.pdf document. 4.2 PMIC GPIO and MPP interface SIMT1502 have two PMIC GPIO interface and one PMIC Multipurpose interface.See Table4-2. Table4-2 PMIC GPIO and MPP interface description GPIO/MPP Pin# Functions PMU_GPIO01 81 RFCLK1_EN PMU_GPIO02 83 RFCLK2_EN PMU_MPP_2_PWM 79 PWM output Two GPIOs are available. Some likely GPIO applications, which are described elsewhere: clock outputs; external current driver control; external LDO, SMPS, or power gate controls; status bit; XO controller input; and level translator. One MPP are available. MPP can be configured as PWM, and MPP can be configured as analog output buffers.
SHANGHAI SIMCOM LIMITED 21 4.3 USB interface SIMT1502 contains a USB interface which support On-The-Go. It is compliant with the USB2.0 specification. The USB2.0 specification requires hosts to support all three USB speeds, low-speed (1.5Mbps), full-speed (12Mbps) and high-speed (480Mbps). See Table4-3 and Figure4-1 for more details. Table4-3 USB interface description Signal Pin# Description Direction USB_DM 44 USB 2.0 serial data minus AI/AO USB_DP 45 USB 2.0 serial data plus AI/AO USB_HS_ID 78 USB OTG ID AI VBUS_USBIN 87 USB_IN POWER Figure4-1 USB application diagram 4.4 Audio interface  Codec integrated within PMU  No SLIMBUS  No digital mic support  Audio inputs: Up to three analog microphones, with integrated mic bias;  Audio output : Headphones with headset detection; Differential earpiece; Differential loud speaker driver; Single-ended line output See Table4-4 and Figure4-2for more details.
SHANGHAI SIMCOM LIMITED 22 Table4-4 Audio interface description Signal Pin# Description Direction AI/AO MIC3_IN 9 Microphone 3 input, single-ended AI MIC2_IN 10 Microphone 2 input, single-ended AI HS_DET 11 Headset detection AI SPKR_DRV_M 12 Speaker driver output, minus AO SPKR_DRV_P 13 Speaker driver output, plus AO EARO_M 14 Earpiece amplifier output, differential minus AO EARO_P 15 Earpiece amplifier output, differential plus AO MIC_GND 16 GND GND MIC1_IN 17 Microphone 1 input, single-ended AI MIC_BIAS 18 Microphone bias output voltage AO HPH_R 19 Headphone right output AO HPH_REF 20 Headphone driver amplifier ground reference AI HPH_L 21 Headphone left output AO Figure4-2 Audio application diagram 4.5 Camera interface SIMT1502 contains two camera interface. Primary camera interface use 2-lane MIPI_CSI0, supports CMOS and CCD sensors, up to 8MP sensors. Secondary camera interface use 1-lane MIPI_CSI1, and 1.5Gbps per lane. Both are controlled by I2C bus. See Table4-5 and Figure4-3for more details. Table4-5 Camera interface description Signal Pin# Description Direction AI/AO SCAM_RST_N 3 Camera0 (front camera) reset DO SCAM_MCLK1 4 Camera0 master clock 1 DO MIPI_CSI1_LN0_P 5 MIPI camera serial interface 1 lane 0 – positive AI,AO MIPI_CSI1_LN0_N 6 MIPI camera serial interface 1 lane 0 – negative AI, AO
SHANGHAI SIMCOM LIMITED 23 MIPI_CSI1_CLK_P 7 MIPI camera serial interface 1 clock – positive AI MIPI_CSI1_CLK_N 8 MIPI camera serial interface 1 clock – negative AI CAM_PWDN 121 Camera0 PWDN DO CAM_I2C_SDA 63 Camera I2C,SDA B CAM_I2C_SCL 64 Camera I2C,SCL DO CAM1_RST_N 112 Camera 1 (rear camera) reset DO CAM1_STANDBY_N 113 Camera 1 (rear camera) standby DO MIPI_CSI0_LN1_N 115 MIPI camera serial interface 0 clock – negative AI,AO MIPI_CSI0_LN1_P 116 MIPI camera serial interface 0 clock – positive AI,AO MIPI_CSI0_LN2_P 117 MIPI camera serial interface 0 lane 2 – positive AI,AO MIPI_CSI0_LN2_N 118 MIPI camera serial interface 0 lane 2 – negative AI,AO MIPI_CSI0_CLK_N 119 MIPI camera serial interface 0 clock – negative AI MIPI_CSI0_CLK_P 120 MIPI camera serial interface 0 clock – positive AI CAM_MCLK0 122 Camera1 master clock 0 DO Figure4-3 CSI application diagram Normally, camera need 2.85V and 1.8V voltage, we can use external LDO to replace VREG_L6_1P8 and VERG_L17_2P85.At the same time, if the rear camera have AF function, another external LDO is necessary.
SHANGHAI SIMCOM LIMITED 24 4.6 Display interface SIMT1502 contains one display interface. The interface use MIPI display serial interface, support up to four lanes. Support for the resolution of WVGA, qHD and 720p LCM.. The backlight circuit is not contained in SIMT1502, which must be designed in external circuit. See Table4-6 and Figure4-4for more details. Table4-6 Display interface description Signal Pin# Description Direction AI/AO DSI_LCD_TE0 86 LCD data write sync signal DO PMU_MPP3_WM 79 PWM DO MIPI_DSI_CLK_P 96 MIPI display serial interface 0 clock – positive AO MIPI_DSI_CLK_N 97 MIPI display serial interface 0 clock – negative AO MIPI_DSI_LN3_P 98 MIPI display serial interface 0 lane 3 – positive AI,AO MIPI_DSI_LN3_N 99 MIPI display serial interface 0 lane 3 –negative AI,AO MIPI_DSI_LN2_P 100 MIPI display serial interface 0 lane 2 – positive AI,AO MIPI_DSI_LN2_N 101 MIPI display serial interface 0 lane 2 – negative AI,AO MIPI_DSI_LN1_P 102 MIPI display serial interface 0 lane 1 – positive AI,AO MIPI_DSI_LN1_N 103 MIPI display serial interface 0 lane 1 – negative AI,AO MIPI_DSI_LN0_P 104 MIPI display serial interface 0 lane 0 – positive AI,AO MIPI_DSI_LN0_N 105 MIPI display serial interface 0 lane 0 – negative AI,AO LCD_ID 106 LCD ID pin DI DSI_RST_N 108 General-purpose wakeup DO Figure4-4 Display application diagram
SHANGHAI SIMCOM LIMITED 25 4.7 CTP interface SIMT1502 contains one CTP interface, the panel is controlled by I2C bus. See Table4-7 and Figure4-5 for more details. Table4-7 CTP interface description Signal Pin# Description Direction AI/AO TS_INT_N 33 Touchscreen interrupt DI TS_I2C_SDA 34 Touchscreen I2C,SDA B TS_I2C_SCL 35 Touchscreen I2C,SCL DO TS_RST_N 36 Touchscreen reset DO Figure4-5 CTP application diagram 4.8 SD interface SIMT1502 contains a SD interface, the clock output up to 200MHz,need support 1.8/2.95V dual-voltage. If SD connector have detect pin, the hot plug function can be done. See Table4-8 and Figure4-6 for more details. Table4-8 SD interface description Signal Pin# Description Direction AI/AO SD_CARD_DET__N 37 Secure digital card detection DI SDC2_CMD 54 Secure digital controller 2 command AI,AO SDC2_DATA_0 55 Secure digital controller 2 data bit 0 AI,AO SDC2_DATA_1 56 Secure digital controller 2 data bit 1 AI,AO SDC2_DATA_2 57 Secure digital controller 2 data bit 2 AI,AO SDC2_DATA_3 58 Secure digital controller 2 data bit 3 AI,AO SDC2_CLK 59 Secure digital controller 2 clock AI,AO
SHANGHAI SIMCOM LIMITED 26 Figure4-6 SD interface application diagram 4.9 Sensors interface SIMT1502 support many sensors via I2C bus, the circuit structure is similar to camera interface. SIMT1502 does not contain necessary pull_up resistors internal, which must be designed in external circuit. 4.10 Side keys interface SIMT1502 contains a few keys interfaces, which can be used as functional side keys. KYPD_SNS0,KYPD_SNS1and KYPD_SNS2 can compose matrix keyboard, also can be used as normal configurable GPIO. See Table4-9 for more details. Table4-9 Side keys interface description Signal Pin# Description Direction DI/DO KYPD_SNS0 40 Keypad sense bit 0 DI KYPD_SNS1 41 Keypad sense bit 1 DI KYPD_SNS2 42 Keypad sense bit 2 DI PM_KYPD_PWR_N 76 Power on key DI PM_RESIN_N 82 PMIC reset input DI 4.11 Battery connector interface
SHANGHAI SIMCOM LIMITED 27 SIMT1502 must be provided voltage by external voltage source. See Table4-10 for more details. Table4-10 Battery connector description Signal Pin# Description Direction AI/AO BAT_THERM 90 Battery therm monitor AI VBATT 88/92/124(No External Charging IC) Battery positive supply AI VBATT 88 (With External Charging IC) Battery positive supply AI GND 2/32/43/46/62/73/80/91/95/ 114/123/125/126/127/128 Ground - 4.12 I2C , UART and SPI interface 4.12.1 UART SIMT1502 contains two groups UART_DM .The UART_DM is used to support high-speed UART operation up to 4 Mbps for debug and system log. UART only supports Slow_IrDA. See Table4-11 and Figure4-7 for more details: Table4-11 UART interface description Signal Pin# Description Direction I/O GPIO_4 26 UART1 TX O GPIO_5 27 UART1 RX I GPIO_6 24 UART1 CTS_N I GPIO_7 25 UART1 RTS_N O GPIO_20 38 UART2 TX O GPIO_21 39 UART2 RX I GPIO_111 28 UART2 CTS_N I GPIO_112 29 UART2 RTS_N O Figure4-7 UART application diagram
SHANGHAI SIMCOM LIMITED 28 4.12.2 I2C SIMT1502 contains two groups special functional and four groups configurable I2C, which multiplexed with UART function. I2C pins use GPIOs configured as open-drain outputs; the pull-up resistor(2.2K) must be provided by external circuit(1.8V). High speed mode I2C running at 3.4 MHz. See Table4-12 Table4-12 I2C interface description Signal Pin# Description Direction AI/AO TS_I2C_SDA 34 Touchscreen/ SENSORS I2C,SDA B TS_I2C_SCL 35 Touchscreen/ SENSORS I2C,SCL DO CCI_I2C_SDA 63 Camera I2C,SDA B CCI_I2C_SCL 64 Camera I2C,SCL DO The rest of I2C interface is multiplexed with UART function. See Table4-13 for more details. Table4-13 I2C interface alternate function description Signal Pin# Alternate function GPIO_6 24 UART2 CTS_N/GP BLSP#1_I2C_SDA_B GPIO_7 25 UART2 RTS_N/GP BLSP#1_I2C_SCL_B GPIO_111 28 UART2 CTS_N/GP BLSP#2_I2C_SDA_B GPIO_112 29 UART2 RTS_N/GP BLSP#2_I2C_SCL_B GPIO_14 22 SPI4 CS_N/GP BLSP4#_I2C_SDA_B GPIO_15 23 SPI4 CLK/GP BLSP4#_I2C_SCL_B GPIO_10 110 SPI6 CS_N/GP BLSP6#_I2C_SDA_B GPIO_11 111 SPI6 CLK/GP BLSP6#_I2C_SCL_B 4.12.2 SPI SIMT1502 contains three groups configurable SPI, which multiplexed with UART/I2C function. But, SIMT1502 only be used for master device. See Table4-14 Table4-14 SPI interface alternate function description
SHANGHAI SIMCOM LIMITED 29 Signal Pin# Description Direction I/O GPIO_4 26 SPI1 MOSI O GPIO_5 27 SPI1 MISO I GPIO_6 24 SPI1 CS_N O GPIO_7 25 SPI1 CLK O GPIO_20 38 SPI2 MOSI O GPIO_21 39 SPI2 MISO I GPIO_111 28 SPI2 CS_N O GPIO_112 29 SPI2 CLK O GPIO_0 49 SPI3 MOSI O GPIO_1 50 SPI3 MISO I GPIO_2 51 SPI3 CS_N O GPIO_3 52 SPI3 CLK O 4.13 Other interface 4.13.1 Camera flash Signal These camera flash signal provide flash and torch mode enable. The FLASH_NOW trigger the camera flash into torch mode. The FLASH_EN enable the camera flash to flash mode. 4.13.2 PM_VIB_DRV_N Signal The PM_VIB_DRV_N is used to control vibration intensity. The vibration driver is a programmable voltage output that is referenced to VDD; when off, its output voltage is VDD. The motor is connected between VDD and the PM_VIB_DRV_N pin. See Table4-15 Table4-15 PM_VIB_DRV_N Signal Signal Pin# Description Direction I/O PM_VIB_DRV_N 77 Vibration motor driver output control PO 4.13.3 VCOIN Signal VCOIN requires either a lithium manganese dioxide rechargeable coin cell or a keep-alive capacitor, so that the appropriate oscillator and real-time clock circuits continue to run when the phone is off. See Table4-16 Table4-16 VCOIN Signal Signal Pin# Description Direction I/O
SHANGHAI SIMCOM LIMITED 30 VCOIN 89 Sense input or charge output AI,AO 4.13.4 RF Signal input port SIMT1502 contains four RF signal input port: BT/WIFI. See Table4-16 and Figure4-8 for more details: Table4-17 RF Signal input port Signal Pin# Description Direction I/O RF_IN_2 30 5G_WIFI AI,AO WIFI_BT_RF 31 BT/WIFI AI,AO If you want to use 5G_WIFI, you must use the RF Cable Line (IPX-3) connect the RF base, which close to BTB connect on SIMT1502.See Figure4-8 for more details Figure4-8 5G_WIFI: Red part
SHANGHAI SIMCOM LIMITED 31 5 Mechanical Specification _______________________________________________________________________________ 5.1 Overview This specification defines a small form factor module for systems in which a Stamp hole package add-in module can not be used due to mechanical system design constraints. The specification defines a smaller module based on a single 124-pin Leadless Chip Carriers encapsulation for system interfaces by card edge type. The specification also defines the Stamp hole package system. 5.2 SIMT1502 specifications There is Stamp hole package add-in SIMT1502 size. For purposes of the drawings in this specification, the following notes apply:  All dimensions are in millimeters, unless otherwise specified.  All dimensions tolerances are ± 0.15 mm, unless otherwise specified.  Dimensions marked with an asterisk (*) are overall envelope dimensions and include space allowances for insulation to comply with regulatory and safety requirements.  Insulating material shall not interfere with or obstruct mounting holes or grounding pads. 5.2.1 SIMT1502 from factor The SIMT1502 form factor is specified by Figure5-1. The figure illustrates a module example application. The hatched area shown in this figure represents the available component volume for the SIMT1502’s circuitry. Figure5-1 SIMT1502 form factor
SHANGHAI SIMCOM LIMITED 32 5.2.2 SIMT1502 PCB details The following figures (Figure5-2) provide the printed circuit board (PCB) details required to fabricate the PCB. The PCB for this application is expected to be 1.2 mm thick. The steel net thickness is 0.12mm (Figure5-3). Figure5-2 SIMT1502 Pads The dimension tolerance is ± 0.005 mm (±0.2mil). Figure5-3 SIMT1502 Steel net The dimension tolerance is ± 0.005 mm (±0.2mil).
SHANGHAI SIMCOM LIMITED 33 5.3 System BTB connector specifications The SIMT1502 have a BTB connector In order to more GPIO interface 5.3.1 BTB connector The BTB connector is 30-pin card edge type connector. Detailed dimensions should be obtained from the connector manufacturer. Figure5-4 shows the BTB connector. We use AXE530127 as socket and AXE630127 as header. Figure5-4 BTB connector
SHANGHAI SIMCOM LIMITED 34 6 RF Specification _______________________________________________________________________________ 6.1 R&D parameters All measurements are taken at module RF I/O pins (pin 31 for BT/WIFI and RF connector for 5G_WIFI) with IQ2015. All typical performance specifications are based on operation at room temperature (+25°C) using default parameter settings and nominal supply voltages, such as VBAT = 3.8V. 6.1.1 SIMT1502’s BT&WIFI Table6-1 BT&WIFI (For CE) Item specifications BT TX Power<10dBm BLE TX Power<5dBm WIFI TX Power<22dBm The sensitivity of 5G WiFi CH36 have separate standards as follow Table6-2 CH36. Table6-2 CH36 802.11a 6 M <-83dB 54M <-68dB 802.11n MCS0-HT20 <-83dB MCS7-HT20 <-66dB MCS0-HT40 <-83dB MCS7-HT40 <-64dB 6.1.2 SIMT1502 WiFi bands and bandwidth The SIMT1502 WiFi bands and bandwidth is specified by Table6-3 and Table6-4. 2.4GHz WiFi only support 20MHz channels bandwidth. 5GHz WiFi can support both 20MHz and 40MHz channels bandwidth. Table6-3 2.4G WiFi channels Channel Frequency(MHz) CHAN1 2412
SHANGHAI SIMCOM LIMITED 35 CHAN2 2417 CHAN3 2422 CHAN4 2427 CHAN5 2432 CHAN6 2437 CHAN7 2442 CHAN8 2447 CHAN9 2452 CHAN10 2457 CHAN11 2462 CHAN12 2467 CHAN13 2472 Table6-4 5G WiFi channels 20MHz 40MHz Channel Frequency Channel Frequency CHAN36 5180 CHAN38 5190 CHAN40 5200 CHAN42 5210 CHAN44 5220 CHAN46 5230 CHAN48 5240 CHAN50 5250 CHAN52 5260 CHAN54 5270 CHAN56 5280 CHAN58 5290 CHAN60 5300 CHAN62 5310 CHAN64 5320 CHAN102 5510 CHAN100 5500 CHAN106 5530 CHAN104 5520 CHAN110 5550 CHAN108 5540 CHAN114 5570 CHAN112 5560 CHAN118 5590 CHAN116 5580 CHAN122 5610 CHAN120 5600 CHAN126 5630 CHAN124 5620 CHAN130 5650 CHAN128 5640 CHAN134 5670 CHAN132 5660 CHAN138 5690 CHAN136 5680 CHAN142 5710 CHAN140 5700 CHAN151 5755 CHAN144 5720 CHAN155 5775 CHAN149 5745 CHAN159 5795 CHAN153 5765 CHAN163 5815 CHAN157 5785 CHAN161 5805 CHAN165 5825 6.1.3 SIMT1502 WiFi transmission type and supported Modulation The SIMT1502 WiFi transmission type and supported Modulation is specified by Table6-5. Table6-5 WiFi transmission type and supported Modulation
SHANGHAI SIMCOM LIMITED 36 Data Rate(Mbps) Modulation Format 802.11B 1Mbps(DSSS) DBPSK 2Mbps(DSSS) DQPSK 5.5Mbps(CCK) DQPSK 11Mbps(CCK) DQPSK 802.11A / G 6Mbps(OFDM) BPSK 9Mbps(OFDM) BPSK 12Mbps(OFDM) QPSK 18Mbps(OFDM) QPSK 24Mbps(OFDM) 16QAM 36Mbps(OFDM) 16QAM 48Mbps(OFDM) 64QAM 54Mbps(OFDM) 64QAM 802.11N (HT20) 6.5Mbps(MCS0) BPSK 13Mbps(MCS1) QPSK 19.5Mbps(MCS2) QPSK 26Mbps(MCS3) 16QAM 39Mbps(MCS4) 16QAM 52Mbps(MCS5) 64QAM 58.5Mbps(MCS6) 64QAM 65Mbps(MCS7) 64QAM 802.11N (HT40) 13.5Mbps(MCS0) BPSK 27Mbps(MCS1) QPSK 40.5Mbps(MCS2) QPSK 54Mbps(MCS3) 16QAM 81Mbps(MCS4) 16QAM 108Mbps(MCS5) 64QAM 121.5Mbps(MCS6) 64QAM 135Mbps(MCS7) 64QAM 6.1.4 SIMT1502 BT frequency and channels The SIMT1502 BT operating frequency is 2400MHz-2483.5MHz.The channel in BT2.0 is CH0-CH79, and the channel in BT4.0 is CH1-CH39. 6.1.5 SIMT1502 BT transmission type and supported Modulation SIMT1502 can support standard Bluetooth FHSS in BR/EDR and BLE. And the supported modulation of BT as following:GFSK, Pi/4DPSK, 8DPSK, the supported modulation of BLE is GFSK. 6.1.6 About how the co-existance between WLAN and BT is managed 2.4G and BT works as TDD. But 5G and BT could work at the same time. But FTM can't test this scenario.If you want to verify BTC, you will need to test throughput or at least mission mode RF performance.
SHANGHAI SIMCOM LIMITED 37
SHANGHAI SIMCOM LIMITED 38 7 Declaration of Conformity (DoC) is in conformity with the relevant Union harmonization legislation: Radio Equipment directive: 2014 / 53 / EU with reference to the following standards applied: EN 301 489-1 V2.2.0 (2017-03); EN 301 489-17 V3.2.0 (2017-03) EN 55032:2015+AC:2016-07 EN 61000-4-2:2009 EN 61000-4-3:2006+A1:2008+A2:2010 EN 300 328 V2.1.1 (2016-11) EN 301 893 V2.1.1 (2017-05); EN 62311:2008 EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013

Navigation menu