Contents
- 1. User Manual
- 2. Users Manual
User Manual
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| Document ID | 3505317 |
| Application ID | mWo88oJoOU78nbUaHWc8+Q== |
| Document Description | User Manual |
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| Document Type | User Manual |
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| Filesize | 123.66kB (1545760 bits) |
| Date Submitted | 2017-08-10 00:00:00 |
| Date Available | 2017-08-10 00:00:00 |
| Creation Date | 2017-08-10 11:57:22 |
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| Document Author: | eason-ys_wang |
Smart Module SIMT 1502 ________________________________________________________________ Hardware Version: V1.2 Software Version:CB03_8909_V4.4_20160901 Manufacturer SHANGHAI SIMCOM LIMITED Building A,SIM Technology Building,No.633, District Jinzhong Road, Changning Expert Importers: Datalogic Srl Address: Via San Vitalino 13 – 40012 Lippo di Calderara di Reno SHANGHAI SIMCOM LIMITED This device is restricted to indoor operation only in the band 5150 - 5350 MHz. (Only for devices that support 802.11 5 GHz functions) This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment. Please notice that if the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains FCC ID: UDV-20170406” any similar wording that expresses the same meaning may be used. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with a minimum distance of 20cm between the radiator & your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. The module is limited to OEM installation ONLY. The OEM integrator is responsible for ensuring that the end-user has no manual instruction to remove or install module. The module is limited to installation in mobile application; A separate approval is required for all other operating configurations, including portable configurations with respect to Part 2.1093 and difference antenna configurations. There is requirement that the grantee provide guidance to the host manufacturer for compliance with Part 15B requirements. This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. SHANGHAI SIMCOM LIMITED (1)the device for operation in the band 5150-5250 MHz is only for indoor use to reduce the potential for harmful interference to co-channel mobile satellite systems; (2)the maximum antenna gain permitted for devices in the bands 5250-5350 MHz and 5470-5725 MHz shall comply with the e.i.r.p. limit; and (3)the maximum antenna gain permitted for devices in the band 5725-5850 MHz shall comply with the e.i.r.p. limits specified for point-to-point and non point-to-point operation as appropriate. (4) Users should also be advised that high-power radars are allocated as primary users (i.e. priority users) of the bands 5250-5350 MHz and 5650-5850 MHz and that these radars could cause interference and/or damage to LE-LAN devices. (i) les dispositifs fonctionnant dans la bande 5 150-5 250 MHz sont réservés uniquement pour uneutilisation à l’intérieur afin de réduire les risques de brouillage préjudiciable aux systèmes de satellites mobiles utilisant les mêmes canaux; (ii) le gain maximal d’antenne permis pour les dispositifs utilisant les bandes 5 250-5 350 MHz et5 470-5 725 MHz doit se conformer à la limite de p.i.r.e.; (iii) le gain maximal d’antenne permis (pour les dispositifs utilisant la bande 5 725-5 850 MHz) doit se conformer à la limite de p.i.r.e. spécifiée pour l’exploitation point à point et non point à point, selon le cas. (iiii) De plus, les utilisateurs devraient aussi être avisés que les utilisateurs de radars de haute puissancesont désignés utilisateurs principaux (c.-à-d., qu’ils ont la priorité) pour les bandes 5 250-5 350 MHz et 5 650-5 850 MHz et que ces radars pourraient causer du brouillage et/ou des dommages aux dispositifs LAN-EL. SHANGHAI SIMCOM LIMITED Contents _____________________________________________________________________________ 1 Introduction ....................................................................................................................................................................... 6 1.1 Documentation overview ..................................................................................................................................... 6 1.2 Key features .......................................................................................................................................................... 6 1.2.1 Feature introduction ................................................................................................................................. 6 1.2.2 Summary of features ................................................................................................................................. 6 1.3 Block diagram....................................................................................................................................................... 8 1.4 Terms and acronyms ............................................................................................................................................ 9 2 Interface Definitions........................................................................................................................................................ 12 2.1 Interface configuration ...................................................................................................................................... 12 2.2 Pin definitions ..................................................................................................................................................... 13 3 Electrical Specifications .................................................................................................................................................. 18 3.1 Operating conditions .......................................................................................................................................... 18 3.2 Current test report ............................................................................................................................................. 19 4 Application Interface Specifications ............................................................................................................................... 20 4.1 Power interface ................................................................................................................................................... 20 4.2 PMIC GPIO and MPP interface ....................................................................................................................... 20 4.3 USB interface ...................................................................................................................................................... 21 4.4 Audio interface ................................................................................................................................................... 21 4.5 Camera interface ................................................................................................................................................ 22 4.6 Display interface ................................................................................................................................................. 24 4.7 CTP interface ...................................................................................................................................................... 25 4.8 SD interface......................................................................................................................................................... 25 4.9 Sensors interface................................................................................................................................................. 26 4.10 Side keys interface ............................................................................................................................................ 26 4.11 Battery connector interface ............................................................................................................................. 26 4.12 I2C , UART and SPI interface......................................................................................................................... 27 4.12.1 UART...................................................................................................................................................... 27 4.12.2 I2C .......................................................................................................................................................... 28 4.12.2 SPI........................................................................................................................................................... 28 SHANGHAI SIMCOM LIMITED 4.13 Other interface.................................................................................................................................................. 29 4.13.1 Camera flash Signal .............................................................................................................................. 29 4.13.2 PM_VIB_DRV_N Signal....................................................................................................................... 29 4.13.3 VCOIN Signal ........................................................................................................................................ 29 4.13.4 RF Signal input port.............................................................................................................................. 30 5 Mechanical Specification ................................................................................................................................................ 31 5.1 Overview ............................................................................................................................................................. 31 5.2 SIMT1502 specifications .................................................................................................................................... 31 5.2.1 SIMT1502 from factor ............................................................................................................................ 31 5.2.2 SIMT1502 PCB details............................................................................................................................ 32 5.3 System BTB connector specifications ............................................................................................................... 33 5.3.1 BTB connector ......................................................................................................................................... 33 6 RF Specification .............................................................................................................................................................. 34 6.1 R&D parameters ................................................................................................................................................ 33 6.1.1 SIMT1502’s BT&WIFI ........................................................................................................................... 33 6.1.2 SIMT1502 WiFi bands and bandwidth ................................................................................................. 35 6.1.3 SIMT1502 WiFi transmission type and supported Modulation.......................................................... 36 6.1.4 SIMT1502 BT frequency and channels ................................................................................................. 36 6.1.5 SIMT1502 BT transmission type and supported Modulation ............................................................. 36 6.1.6 About how the co-existance between WLAN and BT is managed ...................................................... 36 7 Declaration of Conformity (DoC) ................................................................................................................... 34 SHANGHAI SIMCOM LIMITED 1 Introduction 1.1 Documentation overview This document describes electrical specifications, RF specifications, function interface, mechanical information and testing conclusions of the SIMT1502. With the help of this document, the users can easily and quickly use SIMT1502 on their own applications. 1.2 Key features 1.2.1 Feature introduction SIMT1502 is a very powerful baseband module with 124 pins interface. As a baseband module for Smartphone/Music player-enabled devices and applications/camera phones/Multimedia phones/ many other terminals,SIMT1502 supports Data-service and many peripheral equipment, which can be supported by Qualcomm’s ® MSM8909 platform. 1.2.2 Summary of features SIMT1502 features are listed on the following table (Table1-1) Table1-1 SIMT1502 features Feature Processors Processors Memory support System memory via EBI External memory via SDC1 Multimedia Display interfaces ■ MIPI_DSI ■ General display features Camera interfaces ■ Number of CSIs ■ Primary (CSI0) ■ Secondary (CSI1) ■ Configurations supported Capability ■ Qualcomm’s® MSM8909:Quad-ARM® Cortex™-A7 application processors up to 1GHz + 512KB L2 cache ■ Modem system: QDSP6 v5 core at up to 691MHz 768 kB L2 caches ■ RPM system :Cortex-M3 for the RPM ■ 1x LPDDR3 SDRAM: 2GB SDRAM + 16GB EMMC; 32-bit wide; up to 533 MHz ■ eMMC v4.5/SD flash devices One ■ 4-lane – 1.5 Gbps per lane; WVGA, up to HD(720p), 60fps ■ Color depth – 24-bit pp(RGB888) ■ Panel types – Most MIPI DSI compliant panels supported; ■ Two; 1.5 Gbps per lane ■ 2-lane MIPI_CSI0；supports CMOS and CCD sensors Up to 8MP sensors ■ 1-lane MIPI_CSI1；webcam support 5MP ■ I2C controls SHANGHAI SIMCOM LIMITED Video applications performance Graphics Audio Codec ■ Low-power audio ■ Voice codec support ■ Audio codec support ■ Enhanced audio ■ Synthesizer Audio inputs Audio outputs Connectivity BLSP ports ■ UART ■ I2C ■ SPI (master only) USB interface Secure digital interfaces Wireless connectivity ■ WLAN ■ Bluetooth Touch screen support Temperature Operating Temperature Storage Temperature ■Encode: H.264 BP/MP – HD(720p),30 fps MPEG-4 SP/H.263P0 –WVGA, 30 fps VP8 – WVGA, 30 fps ■ Encode: H.264 BP/MP/HP – 1080p, 30 fps MPEG-4 SP/ASP – 1080p, 30 fps DivX 4x/5x/6x – 1080p, 30 fps H.263 P0 – WVGA, 30 fps VP8 – 1080p, 30 fps (HEVC) H.265 MP 8 bit–1080p, 30 fps ■ Adreno™ 304; up to 400 MHz 3D graphics accelerator Integrated within the MSM8909 device ■ Low power audio for mp3 and AAC playback; surround sound ■ Versatile – many audio playback & voice modes; encoders for audio; many concurrency modes ■ G711; Raw PCM; QCELP; EVRC, -B, -WB; AMR-NB, -WB; GSM-EFR, -FR, -HR; ■ MP3; AAC+, eAAC; AMR-NB, -WB, G.711, WMA 9/10 Pro ■ Dolby Digital Plus and DTS-HD surround Fluence™ Noise Cancellation； QAudioFX/Qconcert/QEnsemble; 128-voice polyphony wavetable ■ Up to 3 analog microphones, with integrated MIC bias ■ Four outputs : Earpiece Mono AB Headphones Stereo AB Speaker 800mW CLASS-D 6,4 at 4-bits each, 2 at 2-bits each; multiplexed serial interface functions ■ Yes – two ports up to 4 Mbps ■ Yes – cameras, sensors, NFC, SMB charger, etc. ■ Yes – cameras, sensors, etc. ■ One USB 2.0 high-speed ■ Up to two ports, both dual-voltage ■ One 8-bit and one 4-bit ■ SD 3.0; SD/MMC card; eMMC v4.5 With WCN3660B ■ WCN3660B : 802.11 a/b/g/n , 2.4G and 5G ■ BT 4.0 LE and earlier ■ Capacitive panels via external IC (I2C, SPI, & interrupts) -10 to 60℃ -30 to 80℃ SHANGHAI SIMCOM LIMITED 1.3 Block diagram PMU_MPP_2_PWM PM_PWR_ON 79 78 76 82 USB_HS_ID PM_RES_IN_N 84 DEBUG VREF_BAT_THERM 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 MIPI FOR SUB CAMERA 90 BAT_THERM GPIO28/SCAM_RST_N GPIO27/SCAM_MCLK MIPI_CSI1_LANE0_P MIPI_CSI1_LANE0_N MIPI_CSI1_CLK_P MIPI_CSI1_CLK_N MIC3_IN_P MIC2_IN_P CDC_HS_DET SPKR_DRV_M SPKR_DRV_P CDC_EARO_M CDC_EARO_P MIC_GND MIC1_IN_P MIC_BIAS1 CDC_HPH_R CDC_HPH_REF CDC_HPH_L GPIO_14 GPIO_15 GPIO_6/UART_CTS_N GPIO_7/UART_RFR_N GPIO_4/UART_TX GPIO_5/UART_RX JTAG CONNECTOR Disable internal Charging 61 74 75 77 85 87 92 124 89 107 109 88 USB OPT1 OVP R=0Ω VCHG PMIC_INT VPH_PWR RESIN_N AUDIO FET&SNS PS_HOLD VREG_L11_2P95V PM_VIB_DRV_N VREG_L12_2P95V VBUS_USBIN VPH_PWR VPH_PWR VCOIN VREG_L17_2P85V VREG_L6_1P8V VBATT PM8909 SPMI_CLK SPMI_DATA 81 83 ENTERN_LDO_CTL GPIO [0:4] GYRO_EN_PM PMU_GPIO01 PMU_GPIO02 BOOST_BYP_BYP UIM_BATT_ALARM CXO_EN （BBCLK_EN） VDD_RX_BIAS(1.25V) MPP [0:4] CXO_IN (BBCLK 19.2MHz) Home row (2WLED * 20mA) WLED CTL-PWM MODULE OUTPUT SLEEP_CLK 32.768KHz PA_THERM XO 19.2MHz GPIO_111/UART_CTS_N/SDA 28 SDC1 GPIO_13/TS_INT_N GPIO_18/TS_12C_SDA GPIO_19/TS_12C_SCL GPIO_12/TS_RST_N 33 34 35 36 GPIO_38/SD_CARD_DET_N 37 GPIO_20/UART_TX GPIO_21/UART_RX GPIO_90/KPSNS0 GPIO_91/KPSNS1 GPIO_92/KPSNS2 USB_DM USB_DP 38 39 40 41 42 44 45 GPIO_22/AUDIO_PA_EN 47 GPIO_28 48 GPIO_0/MI2S_WS 49 GPIO_1/MI2S_CLK 50 GPIO_2/MI2S_D0 51 GPIO_3/MI2S_D1 52 GPIO_16/ACCEL_INT_1 53 SDC2_CMD 54 SDC2_DATA0 55 SDC2_DATA1 56 SDC2_DATA2 57 SDC2_DATA3 58 SDC2_CLK 59 GPIO_98 60 GPIO_29 63 GPIO_30 64 GPIO_52 EMMC_NAND RF_CLK1 GPIO_112/UART_RFR_N/SCL 29 MEMORY Touchscreen SENSOR： _N;12C LPDDR3 EBI0 19.2 MHz RF_CLK2 CHO_TX_I/O USB WTR4905 RF COUP LER SWITCH GPS_RX_I/O 93 SWITCH CHO_RX_I/O SAW CHO_GP_DATA LNA 94 SAW PM8909 XO_G PDET_IN WCN T_FLASH CARD 2.4G WLAN_IO Coaxial line IPEX-3 RF connector BT/WLAN/FM SSBI 48MHz 65 66 67 68 69 70 MIPI FOR LCM CAM _ 12C MIPI FOR Main camera 128 127 126 125 123 MAIN BOARD 95 114 91 80 15 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 73 GPIO_65 BTB 64 10 11 12 13 14 62 GND GPIO_25 NC NC GPIO_31 GPIO_32 GPIO_36 GPIO_58 GPIO_93 GPIO_94 GPIO_95 GPIO_96 GPIO_97 GPIO_110 46 43 GPIO_35/MCAM_RST_N 32 GPIO_11/CAM_I2C_SCL GPIO_10/CAM_I2C_SDA GPIO_34/MCAM_STANDBY_N 112 122 GPIO_26/MCAM_CLK 121 GPIO_33 120 MIPI_CSI0_CLK_P 119 MIPI_CSI0_CLK_N 118 MIPI_CSI0_LANE2_N 117 MIPI_CSI0_LANE2_P 116 MIPI_CSI0_LANE1_P 115 MIPI_CSI0_LANE1_N 111 113 110 108 GPIO_9 106 GPIO_8 105 MIPI_DSI0_LANE0_N 104 MIPI_DSI0_LANE0_P 103 MIPI_DSI0_LANE1_N 102 MIPI_DSI0_LANE1_P 101 MIPI_DSI0_LANE2_N 100 MIPI_DSI0_LANE2_P 99 MIPI_DSI0_LANE3_N 98 MIPI_DSI0_LANE3_P 97 MIPI_DSI0_CLK_N 96 MIPI_DSI0_CLK_P 86 GPIO_24 72 71 Figure1-2 BT_WIFI_IN 5G WCN3660B BT_STROBE MSM8909 31 30 5G_WIFI GND GND GND GND GND GND GND GND GND GND GND GND GND CND GND SIMT1502 functional block diagram SHANGHAI SIMCOM LIMITED 1.4 Terms and acronyms Table1-2 Terms and acronyms Term ADC AGC AVS BER BNSP bps BT CA CDMA CRC CSI CTP DAC DBHSPA DC-HSPA+ DCUPA DDR DMB DRM DSI DSP EBI EDGE EDR ETB QDSS EV-DO FDD GNSS GPIO GPRS GPS GPU GRFC GSM HDCP HSDPA HSIC HSPA+ Definition Analog-to-digital converter Automatic gain control Adaptive voltage scaling Bit error rate Bare nanoscale packaging Bits per second Bluetooth Carrier aggregation Code division multiple access Cyclic redundancy code Camera serial interface Capacitive touch panel Digital-to-analog converter Dual-band HSPA Dual-carrier HSPA+ Dual-carrier HSPA Double data rate Digital mobile broadcast Digital Rights Management Display serial interface Digital signal processor External bus interface Enhanced data rates for GSM evolution Enhanced data rate Embedded trace buffer Embedded trace macrocell Evolution data optimized Frequency division duplex Global navigation satellite system General-purpose input/output General packet radio services Global positioning system Graphics processing unit Generic RF controller Global system for mobile communications High-bandwidth digital content protection High-speed downlink packet access High-speed inter-chip High-speed packet access SHANGHAI SIMCOM LIMITED Table1-2 Terms and acronyms (cont.) Term HSUPA I2C I2S ISP JTAG kbps LCD LPA LPASS LPDDR LSB LTE MBP MDM MIPI MPM MSB MTP NSP PA PCM PI PDM PM PNSP PO PVS RBDS RDS RLP RPM SBI SD SDC SEE SFS SIM SMT SPI Definition High-speed uplink packet access Inter-integrated circuit Inter-IC sound Image signal processing Joint Test Action Group (ANSI/ICEEE Std. 1149.1-1990) kilobits per second Liquid crystal display Low-power audio Low-power audio subsystem Low-power DDR Defines whether the LSB is the least significant bit or least significant byte. All instances of LSB used in this manual are assumed to be LSByte, unless otherwise specified. Long term evolution Mobile broadcast platform Mobile data modem Mobile industry processor interface Modem power management Defines whether the MSB is the most significant bit or most significant byte. All instances of MSB used in this manual are assumed to be MSByte, unless otherwise specified. Modem test platform Nanoscale package Power amplifier Pulse-coded modulation Power in Pulse-density modulation Power management Package-on-package nanoscale package Power out Process voltage scaling Radio broadcast data system Radio data system Radio link protocol Resource power manager Serial bus interface Secure digital Secure digital controller Secure Execution Environment Secure file system Subscriber identity module Surface mount technology Serial peripheral interface 10 SHANGHAI SIMCOM LIMITED Table1-2 Terms and acronyms (cont.) Term SPMI sps SPSS SSBI SVS TAP TBD TCXO TDD TSIF UART UICC UMTS USB USIM WCDMA WCN WLAN WTR XO ZIF Definition System power management interface Symbols per second (or samples per second) Smart peripheral subsystem Single-wire SBI Static voltage scaling Test access port To be discussed Temperature-compensated crystal oscillator Time division duplexing Transport stream interface Universal asynchronous receiver transmitter Universal integrated circuit card Universal mobile telecommunications system Universal serial bus UMTS subscriber identity module Wideband code division multiple access Wireless connectivity network Wireless local area network Wafer-scale RF transceiver Crystal oscillator Zero intermediate frequency 11 SHANGHAI SIMCOM LIMITED 2 Interface Definitions _______________________________________________________________________________ 2.1 Interface configuration Figure2-1 Interface configuration 12 SHANGHAI SIMCOM LIMITED 2.2 Pin definitions Table2-1 Pin# SIMT1502 Pin definitions Default EVB Pad name NC GND SCAM_RST_N SCAM_RST_N SCAM_MCLK SCAM_MCLK MIPI_CSI1_LANE0_P MIPI_CSI1_LANE0_P MIPI_CSI1_LANE0_M MIPI_CSI1_LANE0_M Pad characteristics GPIO GPIO_28 VDD GPIO_27 P3 P3 Type DO; B-PD:nppukp DO; B-PD:nppukp AI, AO AI, AO MIPI Functional description Configurable I/O; Sub Camera reset Configurable I/O; Sub camera clock MIPI camera serial interface1 lane0 –positive MIPI camera serial interface1 lane0–negative MIPI camera serial interface1 clock –positive MIPI camera serial interface1 clock–negative Microphone 3 input, single-ended Microphone 2 input, single-ended MIPI_CSI1_CLK_P MIPI_CSI1_CLK_P AI MIPI_CSI1_CLK_M MIPI_CSI1_CLK_M AI MIC3_IN_P MIC3_IN_P AI 10 MIC2_IN_P MIC3_IN_P AI 11 HS_DET HS_DET DI Headset detection 12 SPKR_DRV_M SPKR_DRV_M AO Speaker driver output, M 13 SPKR_DRV_P SPKR_DRV_P AO Speaker driver output, P 14 EARO_M EARO_M AO AO 15 EARO_P EARO_P 16 MIC_GND MIC_GND 17 MIC1_IN MIC1_IN AI 18 19 MIC_BIAS1 MIC_BIAS1 AO Earpiece amplifier output, differential minus Earpiece amplifier output, differential plus Microphone1 input, single-ended Mic Bias output voltage HPH_R HPH_R AO Headphone right output 20 HPH_REF HPH_REF AI Headphone driver amplifier ground reference 21 HPH_L HPH_L AO Headphone left output 22 GPIO_14 BQ_I2C_SDA GPIO_14 P3 23 GPIO_15 BQ_I2C_SCL GPIO_15 P3 24 UART1_CTS_N UART1_CTS_N GPIO_6 P3 25 UART1_RFR_N UART1_RFR_N GPIO_7 P3 26 UART1_TX UART1_TX GPIO_4 P3 27 UART1_RX UART1_RX GPIO_5 28 UART2_CTS_N/SDA SE4500_ILL /N5600_AIM_ON GPIO_111 Audio (only) P3 P3 B; B-PD:nppukp DO; B-PD:nppukp B; B-PD:nppukp B; B-PD:nppukp B; B-PD:nppukp B; B-PD:nppukp DO; B-PD:nppukp Configurable I/O; SPI or I2C BLSP#4 Configurable I/O; SPI or I2C BLSP#4 Configurable I/O; UART, SPI, or I2C BLSP#1 Configurable I/O; UART, SPI, or I2C BLSP#1 Configurable I/O; UART, SPI, BLSP#1 Configurable I/O; UART, SPI, BLSP#1 Configurable I/O; UART, SPI or I2C BLSP#2 13 SHANGHAI SIMCOM LIMITED SE955_TRIGGER /N5600_ILL P3 DO; B-PD:nppukp AI 29 UART2_CTS_N/SCL 30 NC 31 WIFI_BT_RF 32 GND 33 TS_IN_N TS_IN_N 34 TS_I2C_SDA TS_I2C_SDA GPIO_18 P3 35 TS_I2C_SCL TS_I2C_SCL GPIO_19 P3 36 TS_RST_N TS_RST_N GPIO_12 P3 37 SD_CARD_DET_N MIPI_SW_EN GPIO_38 P3 38 UART2_TX UART2_TX GPIO_20 P3 39 UART2_RX UART2_RX GPIO_21 P3 40 KYPD_SNS0 KYPD_SNS0 GPIO_90 P3 41 KYPD_SNS1 KYPD_SNS1 GPIO_91 P3 42 KYPD_SNS2 / KYPD_INT GPIO_92 P3 43 GND 44 45 USB_DM USB_DM USB_DP USB_DP 46 GND 47 AUDIO_PA_EN 48 WIFI_BT_RF GPIO_112 GPIO_13 P3 DI; B-PD:nppukp B; B-PD:nppukp DO; B-PD:nppukp DO; B-PD:nppukp DO; B-PD:nppukp B; B-PD:nppukp B; B-PD:nppukp DI; B-PD:nppukp DI; B-PD:nppukp DI; B-PD:nppukp USB OTG_PSEL GPIO_22 P3 GPIO23 RS232_UART_SEL GPIO_23 P3 49 MI2S_WS SE955_CTS /N5600_PWR GPIO_0 P3 50 MI2S_SCK SE955_RFR /N5600_RST GPIO_1 P3 51 MI2S_D0 RS232_EN GPIO_2 P3 52 MI2S_D1 USB_RST /GP_OUT GPIO_3 P3 53 ACCEL_INT1 SE955_UART_SEL GPIO_16 P3 54 SDC2_CMD SDC2_CMD P2 BH-PD:nppukp 55 SDC2_DATA_0 SDC2_DATA_0 P2 BH-PD:nppukp 56 SDC2_DATA_1 SDC2_DATA_1 P2 BH-PD:nppukp 57 SDC2_DATA_2 SDC2_DATA_2 P2 BH-PD:nppukp 58 SDC2_DATA_3 SDC2_DATA_3 P2 BH-PD:nppukp 59 SDC2_CLK SDC2_CLK P2 BH-NP:pdpukp 60 MI2S_2_MCLK SCAN_KEY 61 VREG_L11_2P95V VREG_L11_SDC SD (only) GPIO_98 POWER P3 AI, AO AI, AO DO; B-PD:nppukp DO; B-PD:nppukp DI; B-PD:nppukp DI; B-PD:nppukp DO; B-PD:nppukp DI; B-PD:nppukp DO; B-PD:nppukp DI; B-PD:nppukp PO Configurable I/O; UART, SPI or I2C BLSP#2 2.4G WIFI signal Configurable I/O; Touch screen interrupt Configurable I/O; Touch screen I2C Configurable I/O; Touch screen I2C Configurable I/O; Touch screen reset Configurable I/O; Secure digital card detection Configurable I/O; UART,SPI BLSP#2 Configurable I/O; UART,SPI BLSP#2 Keypad sense bit 0; Configurable I/O Keypad sense bit 1; Configurable I/O Keypad sense bit 2; Configurable I/O USB data – minus USB data – plus Configurable I/O Configurable I/O Configurable I/O; SPI; MI2S #2 word select (L/R) Configurable I/O; SPI; MI2S #2 bit clock Configurable I/O; SPI; MI2S #2 serial data channel 0 Configurable I/O; SPI; MI2S #2 serial data channel 1 Configurable I/O; Accelerometer interrupt 1 Secure digital controller 2 command Secure digital controller 2 data bit 0 Secure digital controller 2 data bit 1 Secure digital controller 2 data bit 2 Secure digital controller 2 data bit 3 Secure digital controller 2 clock Configurable I/O PMIC output for SDC (only) 14 SHANGHAI SIMCOM LIMITED 62 GND 63 GPIO_29 CAM_I2C_SDA GPIO_29 P3 64 GPIO_30 CAM_I2C_SCL GPIO_30 P3 65 UIM2_PRESENT KYPD_EN GPIO_52 P3 PM_KYPD_PWR_N PM_KYPD_PWR_N PMU CTR DI 77 PM_VIB_DRV_N PM_VIB_DRV_N PMU CTR PO 78 USB_HS_ID USB_HS_ID_MAIN USB AI 79 PMU_MPP_2_PWM PWM_OUT PMU CTR DO 80 GND 81 PMU_GPIO01 NFC_ENABLE PMU GPIO1 DO-Z;DI 82 PM_RESIN_N PM_RESIN_N PMU CTR DI PMU GPIO2 DO-Z;DI PMU CTR AO PO DI; B-PD:nppukp PI AI AI;AO AI 66 67 68 69 70 71 72 73 74 75 76 B; B-PD:nppukp DO; B-PD:nppukp DO; B-PD:nppukp Camera I2C SDA (only) Camera I2C SCL (only) Configurable I/O; NC GND NC 83 PMU_GPIO02 NFC_1P8V_EN 84 VREF_BAT_THERM VREF_BAT_THERM 85 VREG_L12_2P95V VREG_L12_SDC POWER 86 GPIO_24 LCD_TE0 GPIO_24 P3 87 88 89 90 91 92 93 94 95 VBUS_USBIN VBUS_USBIN POWER VBAT VBATT BAT SNS VCOIN VCOIN POWER BAT_THERM BAT_THERM 96 MIPI_DSI0_CLK_P MIPI_DSI0_CLK_P AO 97 MIPI_DSI0_CLK_M MIPI_DSI0_CLK_M AO 98 MIPI_DSI0_LANE3_P MIPI_DSI0_LANE3_P 99 MIPI_DSI0_ LANE3_M MIPI_DSI0_ LANE3_M AI, AO 100 MIPI_DSI0_ LANE 2_P MIPI_DSI0_ LANE 2_P AI, AO 101 MIPI_DSI0_ LANE2_M MIPI_DSI0_ LANE2_M AI, AO Power on key (only) Vibration motor driver output control USB OTG ID Configurable I/O; LED current sink; LCM PWM Configurable GPIO; PMIC reset (only) Configurable GPIO; Reference voltage for battery thermistor PMIC output for SDC (only) Configurable I/O USB Voltage Battery SNS RTC Battery therm monitor GND VBAT/VPH VPH_PWR SYS Power POWER NC NC GND MIPI AI, AO MIPI display serial interface0 clock – positive MIPI display serial interface 0 clock – negative MIPI display serial interface 0 lane 3 – positive MIPI display serial interface 0 lane 3 – negative MIPI display serial interface 0 lane 2 – positive MIPI display serial interface 0 lane 2 – negative 15 SHANGHAI SIMCOM LIMITED 102 MIPI_DSI0_ LANE1_P MIPI_DSI0_ LANE1_P 103 MIPI_DSI0_ LANE1_M MIPI_DSI0_ LANE1_M AI, AO AI, AO MIPI 104 MIPI_DSI0_ LANE0_P MIPI_DSI0_ LANE0_P AI, AO 105 MIPI_DSI0_ LANE0_M MIPI_DSI0_ LANE0_M AI, AO 106 GPIO_8 LCD_RST_N GPIO_8 107 VREG_L17_2P85V VREG_L17_2P85V POWER 108 GPIO_9 CAM_FLASH_EN GPIO_9 109 VREG_L6_1P8V VREG_L6_1P8V POWER 110 CCI_I2C_SDA I2C_SDA GPIO_10 111 CCI_I2C_SCL I2C_SCL GPIO_11 112 MCAM_RST_N MCAM_RST_N GPIO_35 113 MCAM_STANDBY_N MCAM_STANDBY_N GPIO_34 114 GND 115 MIPI_CSI0_LANE1_M MIPI_CSI0_LANE1_M AI, AO 116 MIPI_CSI0_ LANE1_P MIPI_CSI0_ LANE1_P AI, AO 117 MIPI_CSI0_ LANE2_P MIPI_CSI0_ LANE2_P AI, AO 118 MIPI_CSI0_ LANE2_M MIPI_CSI0_ LANE2_M 119 MIPI_CSI0_CLK_M MIPI_CSI0_CLK_M AI 120 MIPI_CSI0_CLK_P MIPI_CSI0_CLK_P AI 121 GPIO_33 SCAM_PWDN GPIO_33 122 MCAM_MCLK MCAM_MCLK GPIO_26 123 124 GND DO; B-PD:nppukp PO DO; B-PD:nppukp PO B; B-PD:nppukp DO; B-PD:nppukp DO; B-PD:nppukp DO; B-PD:nppukp MIPI VBAT/VPH Table2-2 Pin# VPH_PWR AI, AO DO; B-PD:nppukp DO; B-PD:nppukp GND MIPI display serial interface 0 lane 1 – positive MIPI display serial interface 0 lane 1 – negative MIPI display serial interface 0 lane 0 – positive MIPI display serial interface 0 lane 0 – negative Configurable I/O PMIC output General-purpose wakeup PMIC output Configurable I/O; I2C Configurable I/O; I2C Configurable I/O; Main Camera reset; Configurable I/O; Main Camera standby MIPI camera serial interface 0 lane 1 – negative MIPI camera serial interface 0 lane 1 – positive MIPI camera serial interface 0 lane 2 – positive MIPI camera serial interface 0 lane 2 – negative MIPI camera serial interface 0 CLK – negative MIPI camera serial interface 0 CLK – positive Sub Camera PWND Main Camera clock GND SYS Power POWER SIMT1502 BTB connector pin definitions Pad name GND GPIO_25 NC Default EVB Pad characteristics GPIO Voltage P3 P3 USB_SW_EN GPIO_25 GPIO_31 / TC358746_RST GPIO_31 GPIO_32 REFCLK GPIO_32 GPIO_36 CHG_INT GPIO_36 P3 GPIO_58 GYRO_INT_EN GPIO_58 P3 Type DO; B-PD:nppukp Functional description Configurable I/O NC P3 DO; B-PD:nppukp DO; B-PD:nppukp DI; B-PD:nppukp DO; B-PD:nppukp Configurable I/O Configurable I/O Configurable I/O Configurable I/O 16 SHANGHAI SIMCOM LIMITED GPIO_93 OTG_EN GPIO_93 10 GPIO_94 ALSP_INT_N GPIO_94 P3 11 GPIO_95 CHG_EN GPIO_95 P3 12 GPIO_96 VBUS_OTG_EN GPIO_96 P3 13 GPIO_97 NFC_DWL_REQ GPIO_97 P3 14 GPIO_110 NFC_INT_N GPIO_110 P3 15 GPIO_65 MAG_RESET GPIO_65 P3 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 GND P3 DO; BB-PD:nppukp DI; BB-PD:nppukp DO; BB-PD:nppukp DO; BB-PD:nppukp DI; B-PD:nppukp DI; B-PD:nppukp DI; B-PD:nppukp Configurable I/O Configurable I/O Configurable I/O Configurable I/O Configurable I/O Configurable I/O Configurable I/O GND GND GND GND GND GND GND GND GND GND GND GND GND GND NOTE:I/O parameter definitions Symbol General purpose wakeup AI Analog input AO Analog output Bidirectional digital with CMOS input CSI Supply voltage for MIPI_CSI circuits and I/Os; tied to VDD_MIPI_CSI (1.8 V only) DI Digital input(CMOS) DO Digital output(CMOS) DSI Supply voltage for MIPI_DSI I/Os; tied to VDD_QFPROM_PRG (1.8 V only) High-voltage tolerant KP Contains an internal weak keeper device (keepers cannot drive external buses) NP Contains no internal pull PD Contains an internal pulldown device PU Contains an internal pullup device PI Power input PO Power output Selectable supply for GPIO circuits; options include: V_G VIN0: 3.6 V VIN1: 3.075 V VIN2: 1.2 V VIN3: 1.8 V V_INT Internally generated voltage supply voltage for some power on circuits High-impedance (high-Z) output 17 SHANGHAI SIMCOM LIMITED 3 Electrical Specifications _______________________________________________________________________________ 3.1 Operating conditions 1.8 V digital I/O characteristics (P3) ): VDD_P3GPIOs DualDual-voltage 1.8 V/2.95 V digital I/O characteristics ： VDD_P2SDC2 18 SHANGHAI SIMCOM LIMITED 3.2 Current test report This Current test report based on the EVB board, Vbat=3.8V. All values are typical unless otherwise specified. 1. 2. 3. During suspend (Airplane mode, no UIM, system in sleep mode): 2.9mA. During suspend (WIFI wake up, BT off, system in sleep mode): 3.0mA. Module power off (Do not remove the battery): 75uA(Without Vcoin); 250uA(With Vcoin). 19 SHANGHAI SIMCOM LIMITED 4 Application Interface Specifications _______________________________________________________________________________ 4.1 Power interface The power supply of SIMT1502 comes from PM8909. See Table4-1 Table4-1 Power source description Signal Pin# VREG_L11_2P95V VREG_L12_2P95V VREG_L17_2P85V VREG_L6_1P8V 61 85 107 109 Signal Pin# VBAT_SNS VBAT/VPH VBAT/VPH 88 92 124 Direction PI/PO PO PO PO PO Min 1.75 1.75 1.75 1.75 Voltage(V) Typ 2.95 1.8/2.95 2.85 1.8 Max 3.337 3.337 3.337 3.337 Current(mA) Max 600 50 420 200 Direction Functions PI/PO PI Battery SNS PI/PO SYS Power PI/PO SYS Power VBAT means battery, VPH means SYS Power. If you use the SIMT1502’s internal charging management, they are the same function and they must be connected together. If you use external charging management, PIN88 is Battery only and PIN92/124 is VPH only. You can see it in SIMT1502_HW_compatibility design of the modification.pdf document. 4.2 PMIC GPIO and MPP interface SIMT1502 have two PMIC GPIO interface and one PMIC Multipurpose interface.See Table4-2. Table4-2 PMIC GPIO and MPP interface description GPIO/MPP PMU_GPIO01 PMU_GPIO02 PMU_MPP_2_PWM Pin# 81 83 79 Functions RFCLK1_EN RFCLK2_EN PWM output Two GPIOs are available. Some likely GPIO applications, which are described elsewhere: clock outputs; external current driver control; external LDO, SMPS, or power gate controls; status bit; XO controller input; and level translator. One MPP are available. MPP can be configured as PWM, and MPP can be configured as analog output buffers. 20 SHANGHAI SIMCOM LIMITED 4.3 USB interface SIMT1502 contains a USB interface which support On-The-Go. It is compliant with the USB2.0 specification. The USB2.0 specification requires hosts to support all three USB speeds, low-speed (1.5Mbps), full-speed (12Mbps) and high-speed (480Mbps). See Table4-3 and Figure4-1 for more details. Table4-3 USB interface description Signal USB_DM USB_DP USB_HS_ID VBUS_USBIN Figure4-1 4.4 Pin# 44 45 78 87 Description USB 2.0 serial data minus USB 2.0 serial data plus USB OTG ID USB_IN Direction AI/AO AI/AO AI POWER USB application diagram Audio interface Codec integrated within PMU No SLIMBUS No digital mic support Audio inputs: Up to three analog microphones, with integrated mic bias; Audio output : Headphones with headset detection; Differential earpiece; Differential loud speaker driver; Single-ended line output See Table4-4 and Figure4-2for more details. 21 SHANGHAI SIMCOM LIMITED Table4-4 Audio interface description Signal Pin# MIC3_IN MIC2_IN HS_DET SPKR_DRV_M SPKR_DRV_P EARO_M EARO_P MIC_GND MIC1_IN MIC_BIAS HPH_R HPH_REF HPH_L 10 11 12 13 14 15 16 17 18 19 20 21 Figure4-2 4.5 Description Microphone 3 input, single-ended Microphone 2 input, single-ended Headset detection Speaker driver output, minus Speaker driver output, plus Earpiece amplifier output, differential minus Earpiece amplifier output, differential plus GND Microphone 1 input, single-ended Microphone bias output voltage Headphone right output Headphone driver amplifier ground reference Headphone left output Direction AI/AO AI AI AI AO AO AO AO GND AI AO AO AI AO Audio application diagram Camera interface SIMT1502 contains two camera interface. Primary camera interface use 2-lane MIPI_CSI0, supports CMOS and CCD sensors, up to 8MP sensors. Secondary camera interface use 1-lane MIPI_CSI1, and 1.5Gbps per lane. Both are controlled by I2C bus. See Table4-5 and Figure4-3for more details. Table4-5 Camera interface description Signal Pin# Description SCAM_RST_N SCAM_MCLK1 MIPI_CSI1_LN0_P MIPI_CSI1_LN0_N Camera0 (front camera) reset Camera0 master clock 1 MIPI camera serial interface 1 lane 0 – positive MIPI camera serial interface 1 lane 0 – negative Direction AI/AO DO DO AI,AO AI, AO 22 SHANGHAI SIMCOM LIMITED MIPI_CSI1_CLK_P MIPI_CSI1_CLK_N CAM_PWDN CAM_I2C_SDA CAM_I2C_SCL CAM1_RST_N CAM1_STANDBY_N MIPI_CSI0_LN1_N MIPI_CSI0_LN1_P MIPI_CSI0_LN2_P MIPI_CSI0_LN2_N MIPI_CSI0_CLK_N MIPI_CSI0_CLK_P CAM_MCLK0 Figure4-3 121 63 64 112 113 115 116 117 118 119 120 122 MIPI camera serial interface 1 clock – positive MIPI camera serial interface 1 clock – negative Camera0 PWDN Camera I2C,SDA Camera I2C,SCL Camera 1 (rear camera) reset Camera 1 (rear camera) standby MIPI camera serial interface 0 clock – negative MIPI camera serial interface 0 clock – positive MIPI camera serial interface 0 lane 2 – positive MIPI camera serial interface 0 lane 2 – negative MIPI camera serial interface 0 clock – negative MIPI camera serial interface 0 clock – positive Camera1 master clock 0 AI AI DO DO DO DO AI,AO AI,AO AI,AO AI,AO AI AI DO CSI application diagram Normally, camera need 2.85V and 1.8V voltage, we can use external LDO to replace VREG_L6_1P8 and VERG_L17_2P85.At the same time, if the rear camera have AF function, another external LDO is necessary. 23 SHANGHAI SIMCOM LIMITED 4.6 Display interface SIMT1502 contains one display interface. The interface use MIPI display serial interface, support up to four lanes. Support for the resolution of WVGA, qHD and 720p LCM.. The backlight circuit is not contained in SIMT1502, which must be designed in external circuit. See Table4-6 and Figure4-4for more details. Table4-6 Display interface description Signal Pin# DSI_LCD_TE0 PMU_MPP3_WM MIPI_DSI_CLK_P MIPI_DSI_CLK_N MIPI_DSI_LN3_P MIPI_DSI_LN3_N MIPI_DSI_LN2_P MIPI_DSI_LN2_N MIPI_DSI_LN1_P MIPI_DSI_LN1_N MIPI_DSI_LN0_P MIPI_DSI_LN0_N LCD_ID DSI_RST_N 86 79 96 97 98 99 100 101 102 103 104 105 106 108 Figure4-4 Description LCD data write sync signal PWM MIPI display serial interface 0 clock – positive MIPI display serial interface 0 clock – negative MIPI display serial interface 0 lane 3 – positive MIPI display serial interface 0 lane 3 –negative MIPI display serial interface 0 lane 2 – positive MIPI display serial interface 0 lane 2 – negative MIPI display serial interface 0 lane 1 – positive MIPI display serial interface 0 lane 1 – negative MIPI display serial interface 0 lane 0 – positive MIPI display serial interface 0 lane 0 – negative LCD ID pin General-purpose wakeup Direction AI/AO DO DO AO AO AI,AO AI,AO AI,AO AI,AO AI,AO AI,AO AI,AO AI,AO DI DO Display application diagram 24 SHANGHAI SIMCOM LIMITED 4.7 CTP interface SIMT1502 contains one CTP interface, the panel is controlled by I2C bus. See Table4-7 and Figure4-5 for more details. Table4-7 Signal Pin# TS_INT_N TS_I2C_SDA TS_I2C_SCL TS_RST_N 33 34 35 36 Figure4-5 4.8 CTP interface description Description Touchscreen interrupt Touchscreen I2C,SDA Touchscreen I2C,SCL Touchscreen reset Direction AI/AO DI DO DO CTP application diagram SD interface SIMT1502 contains a SD interface, the clock output up to 200MHz,need support 1.8/2.95V dual-voltage. If SD connector have detect pin, the hot plug function can be done. See Table4-8 and Figure4-6 for more details. Table4-8 SD interface description Signal Pin# SD_CARD_DET__N SDC2_CMD SDC2_DATA_0 SDC2_DATA_1 SDC2_DATA_2 SDC2_DATA_3 SDC2_CLK 37 54 55 56 57 58 59 Description Secure digital card detection Secure digital controller 2 command Secure digital controller 2 data bit 0 Secure digital controller 2 data bit 1 Secure digital controller 2 data bit 2 Secure digital controller 2 data bit 3 Secure digital controller 2 clock Direction AI/AO DI AI,AO AI,AO AI,AO AI,AO AI,AO AI,AO 25 SHANGHAI SIMCOM LIMITED Figure4-6 4.9 SD interface application diagram Sensors interface SIMT1502 support many sensors via I2C bus, the circuit structure is similar to camera interface. SIMT1502 does not contain necessary pull_up resistors internal, which must be designed in external circuit. 4.10 Side keys interface SIMT1502 contains a few keys interfaces, which can be used as functional side keys. KYPD_SNS0,KYPD_SNS1and KYPD_SNS2 can compose matrix keyboard, also can be used as normal configurable GPIO. See Table4-9 for more details. Table4-9 Side keys interface description Signal Pin# KYPD_SNS0 KYPD_SNS1 KYPD_SNS2 PM_KYPD_PWR_N PM_RESIN_N 40 41 42 76 82 4.11 Description Keypad sense bit 0 Keypad sense bit 1 Keypad sense bit 2 Power on key PMIC reset input Direction DI/DO DI DI DI DI DI Battery connector interface 26 SHANGHAI SIMCOM LIMITED SIMT1502 must be provided voltage by external voltage source. See Table4-10 for more details. Table4-10 Battery connector description Signal Pin# BAT_THERM VBATT VBATT 90 88/92/124(No External Charging IC) 88 (With External Charging IC) 2/32/43/46/62/73/80/91/95/ 114/123/125/126/127/128 GND 4.12 Description Battery therm monitor Battery positive supply Battery positive supply Direction AI/AO AI AI AI Ground I2C , UART and SPI interface 4.12.1 UART SIMT1502 contains two groups UART_DM .The UART_DM is used to support high-speed UART operation up to 4 Mbps for debug and system log. UART only supports Slow_IrDA. See Table4-11 and Figure4-7 for more details: Table4-11 UART interface description Signal Pin# GPIO_4 GPIO_5 GPIO_6 GPIO_7 GPIO_20 GPIO_21 GPIO_111 GPIO_112 26 27 24 25 38 39 28 29 Figure4-7 Description UART1 UART1 UART1 UART1 UART2 UART2 UART2 UART2 TX RX CTS_N RTS_N TX RX CTS_N RTS_N Direction I/O UART application diagram 27 SHANGHAI SIMCOM LIMITED 4.12.2 I2C SIMT1502 contains two groups special functional and four groups configurable I2C, which multiplexed with UART function. I2C pins use GPIOs configured as open-drain outputs; the pull-up resistor(2.2K) must be provided by external circuit(1.8V). High speed mode I2C running at 3.4 MHz. See Table4-12 Table4-12 I2C interface description Signal Pin# TS_I2C_SDA TS_I2C_SCL CCI_I2C_SDA CCI_I2C_SCL 34 35 63 64 Description Touchscreen/ SENSORS I2C,SDA Touchscreen/ SENSORS I2C,SCL Camera I2C,SDA Camera I2C,SCL Direction AI/AO DO DO The rest of I2C interface is multiplexed with UART function. See Table4-13 for more details. Table4-13 I2C interface alternate function description Signal Pin# GPIO_6 GPIO_7 GPIO_111 GPIO_112 GPIO_14 GPIO_15 GPIO_10 GPIO_11 24 25 28 29 22 23 110 111 Alternate function UART2 CTS_N/GP UART2 RTS_N/GP UART2 CTS_N/GP UART2 RTS_N/GP SPI4 CS_N/GP SPI4 CLK/GP SPI6 CS_N/GP SPI6 CLK/GP BLSP#1_I2C_SDA_B BLSP#1_I2C_SCL_B BLSP#2_I2C_SDA_B BLSP#2_I2C_SCL_B BLSP4#_I2C_SDA_B BLSP4#_I2C_SCL_B BLSP6#_I2C_SDA_B BLSP6#_I2C_SCL_B 4.12.2 SPI SIMT1502 contains three groups configurable SPI, which multiplexed with UART/I2C function. But, SIMT1502 only be used for master device. See Table4-14 Table4-14 SPI interface alternate function description 28 SHANGHAI SIMCOM LIMITED 4.13 Signal Pin# GPIO_4 GPIO_5 GPIO_6 GPIO_7 GPIO_20 GPIO_21 GPIO_111 GPIO_112 GPIO_0 GPIO_1 GPIO_2 GPIO_3 26 27 24 25 38 39 28 29 49 50 51 52 Description SPI1 SPI1 SPI1 SPI1 SPI2 SPI2 SPI2 SPI2 SPI3 SPI3 SPI3 SPI3 MOSI MISO CS_N CLK MOSI MISO CS_N CLK MOSI MISO CS_N CLK Direction I/O Other interface 4.13.1 Camera flash Signal These camera flash signal provide flash and torch mode enable. The FLASH_NOW trigger the camera flash into torch mode. The FLASH_EN enable the camera flash to flash mode. 4.13.2 PM_VIB_DRV_N Signal The PM_VIB_DRV_N is used to control vibration intensity. The vibration driver is a programmable voltage output that is referenced to VDD; when off, its output voltage is VDD. The motor is connected between VDD and the PM_VIB_DRV_N pin. See Table4-15 Table4-15 PM_VIB_DRV_N Signal Signal Pin# PM_VIB_DRV_N 77 4.13.3 Description Vibration motor driver output control Direction I/O PO VCOIN Signal VCOIN requires either a lithium manganese dioxide rechargeable coin cell or a keep-alive capacitor, so that the appropriate oscillator and real-time clock circuits continue to run when the phone is off. See Table4-16 Table4-16 VCOIN Signal Signal Pin# Description Direction I/O 29 SHANGHAI SIMCOM LIMITED VCOIN 4.13.4 89 Sense input or charge output AI,AO RF Signal input port SIMT1502 contains four RF signal input port: BT/WIFI. See Table4-16 and Figure4-8 for more details: Table4-17 RF Signal input port Signal Pin# RF_IN_2 WIFI_BT_RF 30 31 Description 5G_WIFI BT/WIFI Direction I/O AI,AO AI,AO If you want to use 5G_WIFI, you must use the RF Cable Line (IPX-3) connect the RF base, which close to BTB connect on SIMT1502.See Figure4-8 for more details Figure4-8 5G_WIFI: Red part 30 SHANGHAI SIMCOM LIMITED 5 Mechanical Specification _______________________________________________________________________________ 5.1 Overview This specification defines a small form factor module for systems in which a Stamp hole package add-in module can not be used due to mechanical system design constraints. The specification defines a smaller module based on a single 124-pin Leadless Chip Carriers encapsulation for system interfaces by card edge type. The specification also defines the Stamp hole package system. 5.2 SIMT1502 specifications There is Stamp hole package add-in SIMT1502 size. For purposes of the drawings in this specification, the following notes apply: All dimensions are in millimeters, unless otherwise specified. All dimensions tolerances are ± 0.15 mm, unless otherwise specified. Dimensions marked with an asterisk (*) are overall envelope dimensions and include space allowances for insulation to comply with regulatory and safety requirements. Insulating material shall not interfere with or obstruct mounting holes or grounding pads. 5.2.1 SIMT1502 from factor The SIMT1502 form factor is specified by Figure5-1. The figure illustrates a module example application. The hatched area shown in this figure represents the available component volume for the SIMT1502’s circuitry. Figure5-1 SIMT1502 form factor 31 SHANGHAI SIMCOM LIMITED 5.2.2 SIMT1502 PCB details The following figures (Figure5-2) provide the printed circuit board (PCB) details required to fabricate the PCB. The PCB for this application is expected to be 1.2 mm thick. The steel net thickness is 0.12mm (Figure5-3). Figure5-2 SIMT1502 Pads The dimension tolerance is ± 0.005 mm (±0.2mil). Figure5-3 SIMT1502 Steel net The dimension tolerance is ± 0.005 mm (±0.2mil). 32 SHANGHAI SIMCOM LIMITED 5.3 System BTB connector specifications The SIMT1502 have a BTB connector In order to more GPIO interface 5.3.1 BTB connector The BTB connector is 30-pin card edge type connector. Detailed dimensions should be obtained from the connector manufacturer. Figure5-4 shows the BTB connector. We use AXE530127 as socket and AXE630127 as header. Figure5-4 BTB connector 33 SHANGHAI SIMCOM LIMITED 6 RF Specification _______________________________________________________________________________ 6.1 R&D parameters All measurements are taken at module RF I/O pins (pin 31 for BT/WIFI and RF connector for 5G_WIFI) with IQ2015. All typical performance specifications are based on operation at room temperature (+25°C) using default parameter settings and nominal supply voltages, such as VBAT = 3.8V. 6.1.1 SIMT1502’s BT&WIFI Table6-1 BT&WIFI (For CE) Item specifications BT TX Power<10dBm BLE TX Power<5dBm WIFI TX Power<22dBm The sensitivity of 5G WiFi CH36 have separate standards as follow Table6-2 CH36. Table6-2 CH36 802.11a 802.11n 6.1.2 6M 54M MCS0-HT20 MCS7-HT20 MCS0-HT40 MCS7-HT40 <-83dB <-68dB <-83dB <-66dB <-83dB <-64dB SIMT1502 WiFi bands and bandwidth The SIMT1502 WiFi bands and bandwidth is specified by Table6-3 and Table6-4. 2.4GHz WiFi only support 20MHz channels bandwidth. 5GHz WiFi can support both 20MHz and 40MHz channels bandwidth. Table6-3 2.4G WiFi channels Channel Frequency(MHz) CHAN1 2412 34 SHANGHAI SIMCOM LIMITED CHAN2 CHAN3 CHAN4 CHAN5 CHAN6 CHAN7 CHAN8 CHAN9 CHAN10 CHAN11 CHAN12 CHAN13 2417 2422 2427 2432 2437 2442 2447 2452 2457 2462 2467 2472 Table6-4 5G WiFi channels 20MHz 40MHz Channel Frequency Channel Frequency CHAN36 CHAN40 CHAN44 CHAN48 CHAN52 CHAN56 CHAN60 CHAN64 CHAN100 CHAN104 CHAN108 CHAN112 CHAN116 CHAN120 CHAN124 CHAN128 CHAN132 CHAN136 CHAN140 CHAN144 CHAN149 CHAN153 CHAN157 CHAN161 CHAN165 5180 5200 5220 5240 5260 5280 5300 5320 5500 5520 5540 5560 5580 5600 5620 5640 5660 5680 5700 5720 5745 5765 5785 5805 5825 5190 5210 5230 5250 5270 5290 5310 5510 5530 5550 5570 5590 5610 5630 5650 5670 5690 5710 5755 5775 5795 5815 CHAN38 CHAN42 CHAN46 CHAN50 CHAN54 CHAN58 CHAN62 CHAN102 CHAN106 CHAN110 CHAN114 CHAN118 CHAN122 CHAN126 CHAN130 CHAN134 CHAN138 CHAN142 CHAN151 CHAN155 CHAN159 CHAN163 6.1.3 SIMT1502 WiFi transmission type and supported Modulation The SIMT1502 WiFi transmission type and supported Modulation is specified by Table6-5. Table6-5 WiFi transmission type and supported Modulation 35 SHANGHAI SIMCOM LIMITED 802.11B 802.11A / G 802.11N (HT20) 802.11N (HT40) Data Rate(Mbps) Modulation Format 1Mbps(DSSS) 2Mbps(DSSS) 5.5Mbps(CCK) 11Mbps(CCK) 6Mbps(OFDM) 9Mbps(OFDM) 12Mbps(OFDM) 18Mbps(OFDM) 24Mbps(OFDM) 36Mbps(OFDM) 48Mbps(OFDM) 54Mbps(OFDM) 6.5Mbps(MCS0) 13Mbps(MCS1) 19.5Mbps(MCS2) 26Mbps(MCS3) 39Mbps(MCS4) 52Mbps(MCS5) 58.5Mbps(MCS6) 65Mbps(MCS7) 13.5Mbps(MCS0) 27Mbps(MCS1) 40.5Mbps(MCS2) 54Mbps(MCS3) 81Mbps(MCS4) 108Mbps(MCS5) 121.5Mbps(MCS6) 135Mbps(MCS7) DBPSK DQPSK DQPSK DQPSK BPSK BPSK QPSK QPSK 16QAM 16QAM 64QAM 64QAM BPSK QPSK QPSK 16QAM 16QAM 64QAM 64QAM 64QAM BPSK QPSK QPSK 16QAM 16QAM 64QAM 64QAM 64QAM 6.1.4 SIMT1502 BT frequency and channels The SIMT1502 BT operating frequency is 2400MHz-2483.5MHz.The channel in BT2.0 is CH0-CH79, and the channel in BT4.0 is CH1-CH39. 6.1.5 SIMT1502 BT transmission type and supported Modulation SIMT1502 can support standard Bluetooth FHSS in BR/EDR and BLE. And the supported modulation of BT as following:GFSK, Pi/4DPSK, 8DPSK, the supported modulation of BLE is GFSK. 6.1.6 About how the co-existance between WLAN and BT is managed 2.4G and BT works as TDD. But 5G and BT could work at the same time. But FTM can't test this scenario.If you want to verify BTC, you will need to test throughput or at least mission mode RF performance. 36 SHANGHAI SIMCOM LIMITED 37 SHANGHAI SIMCOM LIMITED Declaration of Conformity (DoC) is in conformity with the relevant Union harmonization legislation: Radio Equipment directive: 2014 / 53 / EU with reference to the following standards applied: EN 301 489-1 V2.2.0 (2017-03); EN 301 489-17 V3.2.0 (2017-03) EN 55032:2015+AC:2016-07 EN 61000-4-2:2009 EN 61000-4-3:2006+A1:2008+A2:2010 EN 300 328 V2.1.1 (2016-11) EN 301 893 V2.1.1 (2017-05); EN 62311:2008 EN 60950-1:2006+A11:2009+A1:2010+A12:2011+A2:2013 38
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