Sony 6220501-BV Transmitter module for mobile applications User Manual 02 0006 Rev A GM47 Design Guidelines

Sony Mobile Communications Inc Transmitter module for mobile applications 02 0006 Rev A GM47 Design Guidelines

Exhibit 8 Design Guidelines

GM 47/GM 48Design Guidelines
CEThe product described in this manual conforms to the TTE directive 91/263/EEC and EMC directive89/336/EEC. The product fulfils the requirements according to ETS 300 342-1.The information contained in this document is the proprietary information of Sony Ericsson MobileCommunications. The contents are confidential and any disclosure to persons other than the officers,employees, agents or subcontractors of the owner or licensee of this document, without the prior writtenconsent of Sony Ericsson Mobile Communications, is strictly prohibited.Further, no portion of this publication may be reproduced, stored in a retrieval system, or transmitted inany form or by any means, electronic or mechanical, including photocopying and recording, without theprior written consent of Sony Ericsson Mobile Communications, the copyright holder.First edition (January 2002)Sony Ericsson Mobile Communications. publishes this manual without making any warranty as to thecontent contained herein. Further Sony Ericsson Mobile Communications. reserves the right to makemodifications, additions and deletions to this manual due to typographical errors, inaccurate information,or improvements to programs and/or equipment at any time and without notice. Such changes will,nevertheless be incorporated into new editions of this manual.All rights reserved.©Sony Ericsson Mobile Communications., 2002Publication number:Printed in UKTrademarksAIX is a trademark owned by International Business Machines Corporation
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 3 Contents1INTRODUCTION ...........................................................................................................51.1 OVERVIEW ...............................................................................................................51.2 PRECAUTIONS...........................................................................................................51.3 ABBREVIATIONS ........................................................................................................52MECHANICAL INTEGRATION.......................................................................................72.1 PHYSICAL DIMENSIONS...............................................................................................73ELECTRICAL INTEGRATION........................................................................................83.1 GENERAL.................................................................................................................83.2 GROUNDING .............................................................................................................93.2.1 The Analogue Ground.......................................................................................93.2.2 The Digital Ground (DGND)...............................................................................93.3 EXTERNAL SUPPLY TO MODULE.................................................................................103.3.1 Power Supply (VCC).......................................................................................103.4 GENERAL RECOMMENDATIONS ..................................................................................113.5 SIM CONNECTIONS ..................................................................................................133.6 AUDIO CONNECTIONS...............................................................................................143.6.1 Analogue Audio..............................................................................................143.6.2 Advanced Portable Hands Free Functionality...................................................153.7 RF AND ANTENNA INTEGRATION.................................................................................163.8 INTERFACING TO A 3.3V µPROCESSOR.......................................................................173.9 SOFTWARE DOWNLOAD AND LOGGING CIRCUITRY .........................................................174DEVELOPERS BOARD...............................................................................................184.1 POWER CIRCUIT......................................................................................................184.2 SIM CIRCUIT..........................................................................................................185PART NUMBERS........................................................................................................205.1 SYSTEM CONNECTOR ...............................................................................................205.2 RF CONNECTOR......................................................................................................205.3 SIM CARD HOLDER..................................................................................................205.4 SUPPLIERS .............................................................................................................205.4.1 Imperial connectors ........................................................................................205.4.2 IMS connectors ..............................................................................................216TYPE APPROVAL.......................................................................................................226.1 DOCUMENTATION REQUIRED......................................................................................226.2 POWER SUPPLY ......................................................................................................226.3 SIM TESTING..........................................................................................................236.4 EMC/ESD & SAFETY ..............................................................................................236.5 RF TESTING ...........................................................................................................236.5.1 GM47.............................................................................................................236.5.2 GM48.............................................................................................................236.6 SAR WARNING........................................................................................................246.7 OTHER TA ISSUES ...................................................................................................246.7.1 External Application software...........................................................................246.7.2 GM47 software updates ..................................................................................24APPENDIX I - TECHNICAL DATA ......................................................................................25APPENDIX II – GM47/48 PIN OUT......................................................................................27
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 4APPENDIX III GSM TRANSMIT WAVEFORM CHARACTERISTICS.....................................30
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 51 Introduction1.1 OverviewThe GM47/48 belong to a new generation of Sony Ericsson MobileCommunications GSM modules. This document describes the maincharacteristics and functionality of the GM 47/48, two dual bandproducts for 900/ 1800 MHz and 850/1900 MHz GSM bandsrespectively.This document should be used in conjunction with either the GM 47/48Integrators Manual or GM47/48 Technical Description and is intendedto aid the system integrator both designing the module into theirapplication and gaining the correct approvals.1.2 PrecautionsThe GM47/48 should be handled like any mobile station. In theIntegrators’ Manual you will find more information about safety andproduct care. Never exceed these limits to ensure the module is notdamaged.1.3 AbbreviationsAbbreviation ExplanationBT BluetoothCBS Cell Broadcast ServiceCBM Cell Broadcast MessagingCSD Circuit Switch DataDCE Data Circuit Terminating EquipmentDTE Data Terminal EquipmentDTMF Dual Tone Multi FrequencyEFR Enhanced Full Rate codecEMC Electro-Magnetic CompatibilityETSI European Telecommunications Standards InstituteFR Full Rate codecGPRS General Packet Radio ServiceGPS Global Positioning SystemGSM Global System for Mobile ComunicationHR Half Rate codecHSCSD High Speed Circuit Switched DataITU-T International Telecommunication Union – TelecommunicationsStandardisation SectorME Mobile Equipment
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 6MO Mobile OriginatedMS Mobile StationMT Mobile TerminatedPCM Pulse Code ModulationPDU Protocol Data UnitRLP Radio Link ProtocolRF Radio FrequencyRTC Real Time ClockSDP Service Discovery ProtocolSMS Short Message ServiceSIM Subscriber Identity ModuleTBD To Be Defined
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 72 Mechanical IntegrationThe GM 47/48 are protected with AISI 304 Stainless Steel coverssuitable to fulfil the environmental and EMC requirements.Dimensions, the position of the different connectors and mountingholes are shown in figure 2.1.2.1 Physical DimensionsFigure 2.1 Physical dimensions of GM 47/48
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 83 Electrical Integration3.1 GeneralThe electrical connections to the module (except the antenna), are setthrough the System Connector Interface.The connector shall allow the following connections: board to boardand board to cable.See section 5 for suppliers and part numbers.The figure 3.1 below indicates the pin numbering scheme.Figure 3.1 GM 47/48. View from the underside
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 93.2 GroundingPins Name Description2, 4, 6, 8, 10, 12 DGND Digital Ground60 AGND Analogue GroundThere are two ground signals in GM 47/48, Analogue Ground (AGND)and Digital Ground (DGND). The analogue Ground is connected to pinnumber 60, and the Digital Ground is connected to the SystemConnector Interface through pin numbers 2, 4, 6, 8, 10 and 12.Note: All the Ground pins have to be connected to the application. TheAGND is connected to the DGND in the ME, and only there. It isimportant that the AGND and the DGND are separated in theapplication.3.2.1 The Analogue GroundThe AGND lead is the analogue audio reference ground. It is the returnsignal for Audio To Mobile Station (ATMS) and Audio From MobileStation (AFMS).It is connected to the Digital Ground (DGND) inside the module andonly there. The application shall not connect DGND and AGND.Parameter LimitImax ≅12.5mA3.2.2 The Digital Ground (DGND)DGND is the reference for all digital signals in the System Interface.It shall also be the DC return for the power supply on VCC andSERVICE. Each DGND pin is rated at 0.5 A. All DGND pins areconnected internally in the module.Parameter LimitIaverage < 0.5 A No DGND pin can withstand over 0.5 AImax < 600 mA (100 mA each)
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 103.3 External Supply to ModulePins Name Description1, 3, 5, 7, 9, 11 VCC Regulated Power SupplyConnect all of the pins together in the application in order to carry thecurrent drawn by the module.3.3.1 Power Supply (VCC)The VCC supplies the module with external power. Any other voltageneeded is generated internally.Parameter Mode LimitVoltage to be applied Nominal 3.6 VoltsTolerance 3.4 Volts - 4.0 VoltsMaximum voltage drop duringtransmit burst 200mVOver voltages 5.5 VoltsCurrent Drive capability at TX Full Power < 600 mA (average))< 2 A (Peak)GM 47/48 does not have internal capacitance to supply the largecurrent peaks during GSM transmission. Therefore on bursttransmission the application DC source is responsible for providing theappropriate current.Recommendations to the design of power supplies are given in thefollowing sections.V13.6VC1220uF CF100uFLow ESRCBULK1000uFLow ESRRLINE100mohmRRX120ohm30mA LoadRTX1.8ohm2A LoadJ1577usec1:8 Duty Cycle'RLINE' represents resistanceof circuit between PSU andGM47/GM48.L133uH+++2 AmpVccFigure 3.2 - Simplified Power Supply Reference Model
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 113.3.2 General RecommendationsThe power supply conditions for the GM47/48 Vcc connection are asfollows:Maximum voltage drop duringtransmit burst 200mVMaximum Ripple TBD : [estimate 50mV]Table 3.1Recommended ESR on CBULK : <100mΩRecommended Maximum DC resistance between PSU and GM47 Vcc: <200mΩRecommended minimum CBULK : 1000µF [see tables below]The following tables provide a quick indication to recommendedCBULK capacitance to maintain Vcc drop <200mV for different PSUcurrent delivery and DC resistance between PSU and Module Vcc.CBULK ESR = 50mΩRLINE = 50mΩPSU LIMIT CBULK (min) Transmit BurstVcc Dip (approx)≥ 2.0 Amp 1000µF120mV1.5 Amp *2500µF170mV1.0 Amp *6000µF160mV0.5 Amp *10000µF165mVTable 3.2CBULK ESR = 50mΩRLINE = 100mΩPSU LIMIT CBULK (min) Transmit BurstVcc Dip (approx)≥ 2.0 Amp 1500µF200mV1.5 Amp 4000µF150mV1.0 Amp *6000µF170mV0.5 Amp *10000µF180mVTable 3.3CBULK ESR = 50mΩRLINE = 150mΩPSU LIMIT CBULK (min) Transmit BurstVcc Dip (approx)≥ 2.0 Amp 4000µF200mV1.5 Amp 5000µF190mV1.0 Amp *6000µF190mV0.5 Amp *10000µF200mVTable 3.4
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 12CBULK ESR = 50mΩRLINE = 200mΩPSU LIMIT CBULK (min) Transmit BurstVcc Dip (approx)≥ 2.0 Amp 6000µF200mV1.5 Amp 6000µF190mV1.0 Amp 6000µF190mV0.5 Amp *12000µF200mVTable 3.5Note: When this capacitance is used with the PSU conditions stated,the PSU will reach current limit. Although this condition on Vcc willnot adversely affect the module performance, this may not be acondition appropriate to the supply and may adversely affect otherdevices sharing the PSU output. If the PSU cannot be driven to currentlimit, please select a non-current limiting configuration of CBULK andRLINE. It is the responsibility of the application developer to ensurecorrect operation of the PSU.Further details of the GSM burst transmission waveform are given inappendix III.3.3.3 On/Off signalThe on/off line should be attached to an open collector drive ormomentary contact switch otherwise the module alarm clock featurewill not operate. The on/off line is wired Red internally with the alarmwake up signal.
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 133.4 SIM connectionsAll track lengths between the SIM card and the module must be keptbelow 15cm. This is due to the voltage drop/capacitance associatedwith the extra track length and it has type approval issues as it willaffect timing.This is primarily designed as a 3 Volts SIM interface, but if a 5 VoltsSIM card is connected to it the interface will automatically detect thisand adjust the appropriate parameters.SIM connections are shown below.Figure 3.2 SIM ConnectionsPoints to note regarding SIM connection• The SIM does not need protection between it and the module, ifprotection is put in great care must be taken as SIM testing fortype approval is very sensitive to capacitance in the lines.• De-coupling for Vcc is required, testing has been carried outusing a 2.2uF ceramic capacitor.• It is recommended that SIM circuitry is run at the opposite end ofthe module as a precaution.
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 143.5 Audio ConnectionsAudio connections for both of the analogue paths are shown below.3.5.1 Analogue AudioPin Signal Dir. Description57 AFMS OAudio From Mobile Station59 ATMS IAudio To Mobile Station60 AGND -Ground (return) for analogue audioATMS and AFMS are the audio input and output for the module.Figure 3.3 shows the connection of the analogue audio signals ATMSand AFMS to the CODEC. An Advanced Portable Hands Freeaccessory is also shown to clarify the connections.Simplified CircuitCODECATMSMICAGNDAFMSAudio Out<20 ohmsBias0V or 2V or 2.5VAudio In70K Ohms2.7KSwitch2.2uSpeakerGM47Figure 3.3. Analogue Audio Signal Connections.It shall be possible to use the analogue audio signals in different modes.• Hands-Free - This is the state referred to as Audio To MobileStation ATMS and Audio From Mobile Station AFMS, which
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 15will be used by audio accessories like handsets or Hands Freeequipment.• Portable Hands Free - This state activates a differentamplification factor in the GM47 and activates a microphone biaslevel of 2V in ATMS when a call is in progress.This is the default state at power-on..Audio Circuit Electrical characteristicsAll sources must be AC-coupled except the Portable HandsFreemicrophone, which shall be DC-coupled in order to supply DC currentto the Portable HandsFree microphone. AC coupling prevents incorrectbiasing or damage of the ATMS input. The capacitor must have a valuegreater than shown below to avoid attenuation of low frequencies.Application driving impedance (0.3 – 3.5 kHz) ≤ 300 ΩAC coupling capacitance ≥ 1 µFModule input impedance (0.3 – 3.5 kHz) > 50 kΩLow frequency cut-off. (-3 dB) 300 Hz ± 50 HzHigh frequency cut-off. (-3 dB) > 3500 ± 50 HzHands-Freemode 0VOutput DC bias level PortableHands FreeMode2.0V ± 0.1VAdditional Gain in Portable Hands Free Mode 28.5 dBTable 1. ATMS Levels. Audio Levels3.5.2 Advanced Portable Hands Free FunctionalityThis functionality consists in the detection of a push button pressconnecting ATMS to AGND for a certain period of time. This willcreate a change in the microphone DC bias level.Microphone bias current at 2V1< 0.3 mAActivated2< 100 ΩDC impedance for push button Deactivated3> 10 kΩ [TBC]Portable Handsfree electrical data 1 Bias current >0.7mA will cause false indication of button activation (Threshold is 100mV).2 2V x ( 100 Ω / ( 2700 Ω + 100 Ω )) = 71 mV. Threshold is 100mV.3 Lower impedance will reduce bias on microphone.
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 16AFMS is the analogue audio output from the module. When it is active,the output is derived from the PCM digital audio by the decoder part ofthe CODEC. The PCM data comes from PCMI on the systemconnector.It is also used as an ear-piece driver for the Portable Hands Freeaccessory.Zout4 (0.3 – 3.5 kHz) ≅ 120 ΩOutput capacitance 2.2 µFDrive capability into 5 kΩ (0.3 – 3.5 kHz) > 2.4 Vpp [TBC]Drive capability into1.5 kΩ (0.3 – 3.5 kHz) > 2.2 Vpp [TBC]Levels5(THD<5%)Drive capability into 150 Ω (at 1 kHz) > 1.3 Vpp [TBC]Table 2. AFMS Levels. Audio Levels3.6 RF and antenna IntegrationThe rules for RF and antenna integration are general good practiceguidelines i.e.• Ensure the antenna is a good 50Ω match across the GSM 900/1800bands for GM47 and GSM 850/1900 bands for GM48.• Antenna installation should be, where possible, not close to largemetal objects as this will affect the matching mentioned above.• A specifically designed antenna for the GSM signals beingoperated at will ensure the best reception.If these are followed there should be no issues in terms of RF.Please also see section 6.6 regarding SAR. 4 Output impedance includes impedance of EMC filter which is 100 Ω.5 Need to check output drive levels with 100R EMI filter.
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 173.7 Interfacing to a 3.3V µProcessorAlthough the inputs to the modules can withstand a certain degree ofover voltage they should not be purposefully driven at a higher voltagethan that quoted in the pin out in appendix II.This particularly applies to the serial com ports used to send andreceive the commands to and from the module. Level shifting I/C’s arerequired to interface to the module.An example of a suitable device is a Max3372 for level shifting, pleasefollow the below link for the data sheet. Note : ESD protection is not arequirement for the level shifter.http://pdfserv.maxim-ic.com/arpdf/MAX3372E-MAX3393E.pdf3.8 Software download and logging circuitryBelow the circuitry is shown which allows software download andlogging to be performed.VCC 3V6MAX3380EVIO 2V7CTMSCFMSVCC0.1uF1,3,5,7,9,112,4,6,8,10,1234584546SERVICE140.1uFON/OFF325TDRDDTE9 pinD-Type0.1uF0.1uF0.1uF0.1uFVLFonFoffR1OUTR1INT1INT1OUTGNDV+V-++++C1+C1-C2+C2-1519 13 201751148123218 61GM47 SYSTEM CONNECTOR9T2INR2IN14The data sheet for the Maxim device can be found athttp://pdfserv.maxim-ic.com/arpdf/MAX3380E-MAX3381E.pdf
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 184 Developers BoardThe developers board is the reference design against which the modulehas been type approved, the circuit diagram for this is available uponrequest from customer support4.1 Power CircuitA 3A simple switcher step down voltage regulator has been used toproduce the module Vcc. Two 6800µF capacitors are located adjacentto the module to cope with the GSM current pulses. The capacitors arelow ESR type approximately 16mΩ.4.2 SIM CircuitThe SIM holder has been connected directly to the module, theSIMVCC decoupling capacitor has been omitted and should be presentfor all designs.Note: Provision was made for additional ESD protection on the boardfor development purposes.This is not required and the devices have been removed from theSIMDATA and SIMCLK signals to minimise capacitance on theselines.4.3 On/Off switchThe on/off line is connected to a momentary contact switch, thisensures correct operation of the alarm clock feature in the module.4.4 Programming circuitryThe data lines are converted between 2.7V & 5V logic and thenbetween 5V & RS232 levels. The data signal into the module ispowered from the VIO supply interface which ensures isolation of thesignal when the module is off.To invoke programming mode the jumper JP27 is used. The Vppflashsignal path is no longer used.
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 194.5 EMCThe circuit ground is bonded to the metal chassis of the developers kitbox, all signal connections are filtered via ferrite chokes.4.6 Data signals:The data and handshake lines are converted between 2.7V & 5V logicand then between 5V & RS232 levels. The data signal and handshakelines into the module are powered from the VIO supply interface whichensures isolation of the signal when the module is off.Diodes D3-5,D7 & D8 are not fitted.
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 205 Part numbers5.1 System connectorA connector that can be used to interface to the system connector is theSamtech FLE or SFMC or CLP series, the female part number is CLP-130-02-F-D.This connector or an equivalent can be sourced from imperialconnectors below, again this company is just an example of onesupplier.5.2 RF connectorMMCX is a standard RF connector and should be able to be sourcedfrom most suppliers.5.3 SIM card holderThe data sheet for the SIM holder that is used on the developers boardis available on request from customer support.The card holder is a lockable type as problems have been experiencedin the past with the slide in holders.5.4 SuppliersBelow are listed suppliers of connectors which SonyEricsson uses, thequality or availability of components cannot be guaranteed.5.4.1 Imperial connectorsImperial connectors have a good selection of SIM holders, the MMCXRF connector and the system connector.SIM card readerFor the SIM card reader follow the linkhttp://www.imperial-connect.co.uk/products/sim.html
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 21System connectorFor the system connector followhttp://www.imperial-connect.co.uk/products/prodprofile127.htmlclick on ITRQPGA thumbnail.5.4.2 IMS connectorsConnector cables from MMCX to SMA can be ordered from thissupplier normally with a 2-3 week lead time.
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 226 Type ApprovalThe system integrator has to get CE marking for the integrated solutionwith the GSM module in Europe (GM47) and the FCC approval in theUS (GM48). The system integrator only has to show compliance withthe essential requirements of the module by the integration of it into theapplication.If the external elements are designed according to the guidelines of thisdocument the testing would be the following:• Integration with GM47• EMC in all modes of operation• Safety• Integration with the GM48• FCC approvals of all applicable partsSony Ericsson recommends that all these tests are performed by thecustomer in an accredited test house. After that, all documentationtogether with the test reports and certificates of the application shouldbe sent to Sony Ericsson in order to register the application to theaccessories list for the approval of the module, this will aid theapproval of the application world wide.6.1 Documentation requiredThe system integrator is required to produce a document which will besubmitted to the test house containing the following information.• Summary of the application• Hardware description• Block diagram with an explanation• Schematics• PCB/Component layout• Bill of materialsThis documentation will also be required for Sony Ericsson to add theapplication to the list of approved accessories for the module inaddition to the test reports and certificates obtained from the test house.6.2 Power supplyIt is essential the application power supply is designed to comply withthe specification in section 3. This will be sufficient to pass typeapproval, no RF testing will be required if it meets these specifications.
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 236.3 SIM TestingSIM testing does not need to be carried out since it is a passivecomponent. Points to note regarding the implementation of the SIMcard holder are as follows.• SIM presence must be implemented to comply with the moduleapproval conditions.• Any manufacturers SIM card holder can be used and this can alsobe either 6 or 8 pins.6.4 EMC/ESD & SafetyEMC and safety tests according to the ITU/GSM and FCC standardswill have to be completed as part of the mandatory testing. The GM47/48 were originally type approved outside of a metal box. Additionalshielding is not strictly required the external application. This is theresponsibility of the system integrator. Overall ESD protection shouldbe guaranteed by the system integrator.The EMC standard which the application must be tested to is EN 301489-7, this can be found at the following web site.http://www.etsi.org/getastandard/home.htmThe safety standard which the application must be tested to is EN60950, the can be found at the following web sitehttp://www.iec.ch/For the GM48 FCC part 15 regulations, these can be found athttp://www.fcc.gov/6.5 RF Testing6.5.1 GM47As long as the antenna connected to the module is of the correctimpedance as specified in section 3.7 and is passive further RF testingfor TA is not required. Although it should be noted that radiationperformance is the responsibility of the system integrator.6.5.2 GM48According to the US rules (GM48) any change in RF path i.e. theantenna path will require new approval according to FCC part 22 and24.
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 246.6 SAR warningIf the application is using an antenna which is less than 20cm awayfrom the any part of the users body, integrators are legally obliged topublish SAR figures for the product. This testing would need to becarried out by the system integrator.Even if SAR measurements are not required it is considered goodpractice to insert a warning in any manual produced indicating it is aradio product and that care should be taken.6.7 Other TA issues6.7.1 External Application softwareIf the software of the external application is changed it has no effectupon the type approval certificate issued to it.6.7.2 GM47 software updatesIf the GM47 software is updated there should be no further actionrequired by the system integrator as accessories lists are generallycarried across between TA certificates and any software supplied bySony Ericsson will be fully Type Approved.
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 25Appendix I - Technical DataMechanical specificationsMaximum length: 50 mmMaximum width: 33 mmMaximum thickness: 6.82 mm (without system connector pins length)Weight: 18,5 gPower supply voltage, normal operationVoltage: 3.6V NominalTolerance ±0.2VRipple: <100mV @ 200KHz, <20mV @>200KHzVoltage must always stay within a normal operating range, ripple included.Power consumption: Speech mode < 600 mA (< 2 A peak)Idle mode: 5 mASwitched off: < 100 µARadio specificationsFrequency range: GM 47: EGSM 900 MHz and 1800 MHz (Dual Band)GM 48: GSM 850 MHz and 1900 MHz (Dual Band)Maximum RF output power: 2 W / 1 WAntenna impedance: 50 ΩSIM cardSIM card interface: 3 V or 5 VSupport of external SIM cardEnvironmental specificationsOperating temperature range: -25 0C to +55 0CStorage temperature range: -40 0C to +85 0CMaximum relative humidity: 95% at +40 0CStationary vibration, sinusoidal: Displacement: 7.5 mm Acceleration amplitude: 20 m/s2 40m/s2 Frequency range: 2-8 Hz 8-200 Hz 200-500 HzStationary vibration, random Acceleration spectral density (m2/s2): 0.96 2.88 0.96Frequency range: 5-10 10-200 200-500 60 min per/axisNon-stationary vibration, includingshock Shock response spectrum I, peak acceleration: - 3 shocks ineach axis and direction: 300 m/s2, 11 ms
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 26Shock response spectrum II, peak acceleration: - 3 shocks ineach axis and direction: 1000 m/s2, 6 msBump: Acceleration 250 m/s2Free fall transportation: 1.2 mRolling pitching transportation: Angle: ±35 degrees, period: 8sStatic load: 10 kPaLow air pressure/high air pressure: 70 kPa / 106 kPaStorageSMS Storage capacity 40 in MEUpto 25 on SIM (SIM dependent)Phone book capacity 100DACParameter Value UnitsResolution 8bitOutput voltage swing for Code=00HEX 0.138 ± 0.1 VOutput voltage swing for Code=FFHEX 2.61 ± 0.2 VNominal Step Size 9.668 ± 0.1 mVLinear Code Range 8-247 (8H-F7H)LSBAbsolute Error during Linear Range ±100 mVConversion Speed <100 µsADCParameter Value UnitsResolution 8bitInput voltage for Code=00H0.01 ± 0.01 VInput voltage for Code=FFH2.75 ± 0.1 VNominal Step Size 10.742 mVAccuracy ±3LSBInput Impedance >1 MΩConversion Time to within 0.5bit <100 µs
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 27Appendix II – GM47/48 Pin outPin Signal Name Dir Signal Type Description1. VCC -Supply Power Supply2. DGND - - Digital Ground3. VCC -Supply Power Supply4. DGND - - Digital Ground5. VCC -Supply Power Supply6. DGND - - Digital Ground7. VCC -Supply Power Supply8. DGND - - Digital Ground9. VCC -Supply Power Supply10. DGND - - Digital Ground11. VCC -Supply Power Supply12. DGND - - Digital Ground13. Reserved for future use14. ON/OFF IInternal pull up,open drain Turns the module on/offFormer WAKE_B15. SIMVCC -Dig. 3/5 V SIM card power supplyPower output for SIM Card from module16. SIMPRESENCE IInternal pull up,open drain SIM PresenceA "1" shall indicate that the SIM is missing;a "0" that it is inserted.17. SIMRST ODig. 3/5 V SIM card reset18. SIMDATA I/O Dig. 3/5 V SIM card data19. SIMCLK ODig. 3/5 V SIM card clock20. DAC OAnalogue Digital to Analogue converter21. IO1 I/O Digital, 2.75 General purpose input/output 122. IO2 I/O Digital, 2.75 General purpose input/output 223. IO3 I/O Digital, 2.75 General purpose input/output 324. IO4 I/O Digital, 2.75 General purpose input/output 425. VRTC ISupply 1.5 V Voltage for real time clock26. ADC1 IAnalogue Analogue to Digital converter 127. ADC2 IAnalogue Analogue to Digital converter 228. ADC3 IAnalogue Analogue to Digital converter 329. SDA I/O 2.75, internalpullup I2C Data30. SCL O2.75, internalpullup I2C Clock31. BUZZER ODig. 2.75 Buzzer output from module
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 2832. TIMESTAMP ODig. 2.75 TimestampTimestamp is reserved for future use, if A-GPS is implemented on network side.33. LED ODig. 2.75 Flashing LED34. VIO OPower Out 2.75 Module powered indication.The VIO is a 2.75 V output that couldpower external devices to transmit datatowards the GSM device to a 75mA max.35. TX_ON ODig 2.75 This output shall indicate when the GSMmodule is going to transmit the burst.36. RI ODig. 2.75 Ring Indicator37. DTR IDig. 2.75 Data Terminal Ready38. DCD ODig. 2.75 Data Carrier Detect39. RTS IDig. 2.75 Request To Send40. CTS ODig. 2.75 Clear To Send41. TD IDig. 2.75 Transmitted DataData from DTE (host) to DCE (module).[former DTMS]42. RD ODig. 2.75 Received DataData from DCE (module) to DTE (host).[former DFMS]43. TD3 IDig. 2.75 UART3 TransmissionData from DTE (host) to DCE (module).[former DTMS]44. RD3 ODig. 2.75 UART3 ReceptionData from DTE (host) to DCE (module).[former DTMS]Data from DCE (module) to DTE (host).[former DFMS]45. TD2 IDig. 2.75 UART2 ReceptionFormer CTMS. Used for flashing46. RD2 ODig. 2.75 UART2 TransmissionData from DCE (module) to DTE (host).[former DFMS]Former CFMS. Used for flashing47. PCMULD IDig. 2.75 DSP PCM digital audio input48. PCMDLD ODig. 2.75 DSP PCM digital audio output49. PCMO ODig. 2.75 Codec PCM digital audio output50. PCMI IDig. 2.75 Codec PCM digital audio input51. PCMSYNC ODig. 2.75 DSP PCM frame sync52. PCMCLK ODig. 2.75 DSP PCM clock output53. MICP IAnalogue Microphone input positive54. MICN IAnalogue Microphone input negative55. BEARP OAnalogue Speaker output positive
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 2956. BEARN OAnalogue Speaker output negative57. AFMS OAnalogue Audio output from module58. SERVICE I12V/2.7V Flash programming voltage for the MS.Enable logger information if no flashingFormer VPPFLASH59. ATMS IAnalogue Audio input to module60. AGND - - Analogue ground
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 30Appendix III GSM transmit waveform characteristicsThe simplified GSM loading characteristics and power supply referencemodel in relation to the GM47 system connector is represented infigure 1. J1 represents the interface to the GM47 system connector andthe voltage there is referenced Vcc.Figure 2 shows a 1:8 cycle with the receive burst occurring in timeslot1 and transmit in timeslot 6. Some of the quiet period is used by themodule to ‘listen’ to other GSM base-stations.In simple terms the module can draw up to 2 Amps during the transmitburst. The receive burst can draw up to 100mA. As the currentconsumption of the receive burst does not normally cause problems forpower supply current drain, the simplified PSU model in figure 1combines the receive, monitor and idle frames into an average currentconsumption around 30mA. The transmit burst requires specialattention.1 2 3 4 5 6 7 8 1 2Receive Transmit Monitor Receive577 µs4.6 mstimeslotFigure 1 - Simplified GSM Timing DiagramThere are three main areas to consider in order to meet the transmitburst requirements: PSU current capability, resistance between thesupply and module (RLINE), and bulk capacitance (CBULK) at the moduleVcc connection. The effect that each of these parameters has on thewaveform shape at Vcc is indicated in figure 3.
GM47/48 Design GuidelinesBA/SEM/MSC 02:0006 Rev PA1 31ABCDEFG577 µsTRANSMITGM47 VccFigure 2 - Transmit Burst Vcc WaveformA. The sharp fall in voltage in this region is caused by the ESRof the capacitors (mounted as close to the module Vcc pinsas possible.B. The RC discharge is controlled by CBULK, RLINE, and RTX.C. If the PSU cannot supply the 2A max load of the GM47 andcurrent limit is reached the discharge of CBULK goes linear.If current limit is not reached then section ‘B’ will continue forthe length of the transmit burst. Current limit will be reachedwhen the voltage dropped across RLINE reaches V = ILIM *RLINE.D. The sharp fall in voltage in this region is again caused by theESR of the capacitors.E. CBULK will charge linearly while the supply is in current limit.This section is not relevant while the PSU is not currentlimited.F. The RC charge is controlled by CBULK and RLINE.G. Once the transmit burst is finished, the 1:8 duty cycle shouldensure that there is sufficient time for the PSU to fullyrecover before the next transmit burst.

Navigation menu