TDK SESUB BU 14808 Bluetooth SMART Transceiver User Manual TDK SESUB General Introduction Standard Ver

Download:
Mirror Download [FCC.gov]
Document ID	2526388
Application ID	aYH/aXsliTL3hKkdMP1nlQ==
Document Description	Users Manual
Short Term Confidential	No
Permanent Confidential	No
Supercede	No
Document Type	User Manual
Display Format	Adobe Acrobat PDF - pdf
Filesize	42.25kB (528143 bits)
Date Submitted	2015-02-06 00:00:00
Date Available	2015-02-06 00:00:00
Creation Date	2015-01-23 19:18:35
Producing Software	Adobe PDF Library 11.0
Document Lastmod	2015-01-23 19:18:39
Document Title	TDK SESUB General Introduction (Standard Ver)
Document Creator	PowerPoint 用 Acrobat PDFMaker 11
Document Author:	New Product Promotion Office

SP14808 Bluetooth Module User’s Guide
An Integrated 2.4GHz Bluetooth SMART Compliant Transceiver Module
TDK Corporation
Thin Film Device Center
SESUB BU
Revision FC
2015.1.1
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
SP14808 Bluetooth M odule
SP14808 is a Bluetooth Smart compliant Module which is composed by world smallest size of
TDK module SESUB-PAN-D14580 and Chip Antenna.
SP14808 equips a 2.4GHz band chip antenna, a 32.768kHz sleep clock resonator.
It is covered with a metal shield case on top.
Inside View
Bottom View
Top View
(Under Metal shield case)
SP14808
14.0
xxxxxxx
Ｒ 006-x
xxxxx
12.0
Metal shield case
Connector
DF23C-30DS-0.5V(92) [Hirose]
SP14808
Covered with a metal shield case
Ready for radio certification
SESUB-PAN-D14580
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
SP14808 Bluetooth M odule
SP14808 is composed by BLE Module
(SESUB-PAN-D14580), Flash Memory, Antenna,
Crystal, and some more passive components
(Capacitors, Inductors, Connector).
SESUB-PAN-D14580 is BLE Module from TDK
and it contains Dialog Semiconductor BLE IC
(DA14580) inside.
SESUB-PAN-D14580 has a 50 ohm RF output.
On the SP14808, this RF output is connected to
a Ceramic CHIP antenna.
System Block Diagram
SP14808
Crystal for sleep timer
32.768kHz +/- 20ppm
Ceramic CHIP ANT
ANT016008LC2442MA2
BLE M odule
TDK SESUB-PAN-D14580
2402~2480MHz
Impedance
Matching Circuit
Filter
50 ohm
RF output
Dialog
Semiconductor
DA14580
Flash Memory
Crystal
Resonator
16 MHz
Board to Board Connector
DF23C-30DP-0.5V
Power Supply 3.0V
Analog and Digital I/O
(2.35V ~ 3.3V)
I2C UART
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
SP14808 M echanical Dim ensions
1.05
7.0
4.5
CL
4.5
1.0±0.2
CL
CL
1.05
7.0
CL
0.8
6.0
0.8±0.1
3.1±0.2
6.0
1.25
1.2
Unit in mm
Tolerance ±0.15mm unless otherwise noted.
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
General Requirem ent under Operation
Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
Item
Min
Max
Unit
Supply voltage range
-0.1
3.6
Storage temperature range
-40
+85
℃
ESD (charged Device Model)
500
ESD (Human Body Model)
1000
Min
Max
Unit
Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
Nr
Item
Operating supply voltage range
2.35
3.3
Operating ambient temperature range, Ta
-20
+70
℃
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
General Perform ance
Electrical Characteristics
Measured on SP14801 EM board with the condition of Ta=25℃+/-10℃ and VBAT = 3.0V
Value
Item
Condition
Unit
Min
Typ
Max
Rx mode Current
DCDC converter assumed ideal
5.0
mA
Tx mode Current
DCDC converter assumed ideal
5.0
mA
Deep sleep current
8kB retention RAM active
0.9
μA
General RF Characteristics
Measured on SP14801 EM board with the condition of Ta=25℃+/-10℃ and VBAT = 3.0V
Value
Item
Unit
Condition
Min
Operational frequency range
Typ
2402
Max
2480
MHz
Channel spacing
MHz
Number of RF Channels
40
Ch
RF Port impedance
50
Ohm
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
General Perform ance
RF Characteristics
Measured on SP14801 EM board with the condition of Ta=25℃+/-10℃ and VDD = 3.0V, fc=2440MHz
Value
Item
Condition
Unit
Min
Tx Output power
Maximum output power setting
Tx Frequency accuracy
Maximum output power setting
-150
Typ
Max
dBm
+150
kHz
275
kHz
-70
dBm
Tx modulation characteristics
Delta F1
Receiver sensitivity level
[measured by Packet Error Rate]
225
Packet error rate : ≦30.8%
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
SP14808 PCB Connector Pin Assignm ent
Pin #
Description
Pin #
Descpription
A01
VBAT3V
B01
GND
A02
VCC M
B02
P0_7
A03
P0_1
B03
WP#
A04
P0_2
B04
P0_5
A05
GND
B05
GND
A06
P0_6
B06
P0_3
A07
HOLD#
B07
GND
A08
P0_0
B08
GND
A09
P0_4
B09
SW CLK
A10
VPP
B10
SWDIO
A11
GND
B11
P1_1
A12
GND
B12
P1_0
A13
GND
B13
RST
A14
P1_2
B14
VDCDC
A15
P1_3
B15
VBAT1V
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
SP14808 SESUB-PAN-D14580 EM Schem atic
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
SP14808 Bill Of M aterials
SMD
Side
Mount
Top
1608 Size Chip Antenna/0.15mm min pitch land
Remarks
ANT016008LCS2442MA2
Description
Designator
ANT1
Quantity
Mount
Top
0603 Size Ceramic Capacitor 1uF
Ceramic Capacitor 1uF 0603/C0603X5R0J105M030BC
C7
Mount
Bottom
30pins 0.5mm pich Hirose Connector/DF23 2x15
DF23C-30DP-0.5V
J1
Mount
Top
1005 Size Inductor 1.6nH
1005 Size 1.6nH Inductor MHQ1005P1N6BT
L1, L2
Mount
Top
0603 Size Resistor 10K
10K:RK73B1HTTC103J
R1, R2
Mount
Top
0603 Size Resistor 10K
10K:RK73B1HTTC103J
R3
Mount
Bottom
1005 Size Resistor 0
0:RK73Z1ETTP
R7
Mount
Bottom
1005 Size Resistor 0
0:RK73Z1ETTP
R8
Mount
Top
2x3mm Size 8pin MXIC IC/MO-252 USON 8L 0.5mm pitch
Flash Memory : MX25V1006E-USON
U2
Mount
Top
3.5x3.5mm Size Module/0.4mm pad pitch,0.2mm pad
SESUB-PAN-D14580
U1
Mount
Top
2012 Size 2pin Epson Toyocom Xtal/2.05x1.2mm
FC-12M 32.768KHZ 7.0 +20.0/-20.0
X1
Mount
Top
P01C-1111-06 SHIELD CASE
P01C-1111-06 SHIELD CASE
S1
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
10
Reference I nform ation
1. Bluetooth Core Technical Specification document, version 4.1
https://www.bluetooth.org/en-us/specification/adopted-specifications
https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=282159
2. Dialog Semiconductor DA14580 Low Power Bluetooth Smart System-on-Chip Datasheet
3. Dialog Semiconductor DA14580 Software Development Guide (UM-B-003)
4. Dialog Semiconductor DA14580 Peripheral Drivers User manual (UM-B-004)
5. Dialog Semiconductor DA14580 Bluetooth Low Energy Software Development Kit (SDK)
6. Dialog Semiconductor DA14580 End product testing and programming guidelines (AN-B-020)
7. Dialog Semiconductor DA14580 supply current measurements (AN-B-015)
8. Keil Embedded Workbench for ARM Cortex-M series devices programming
http://www.keil.com
9. For all other related technical documents, visit Texas Instruments Low-Power RF web site.
http://support.dialog-semiconductor.com/
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
11
Certain Instructions.
User shall operate SP14808 within TDK’s recommended specifications and environmental considerations per the user’s guide, accompanying
documentation, and any other applicable requirements. Exceeding the specified ratings (including but not limited to input and output voltage,
current, power, and environmental ranges) for SP14808 may cause property damage, personal injury or death.
If there are questions concerning these ratings, user should contact a TDK field representative prior to connecting interface electronics
including input power and intended loads.
Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent
damage to the SP14808 and/or interface electronics.
Please consult the applicable user's guide prior to connecting any load to the SP14808 output. If there is uncertainty as to the load
specification, please contact a TDK field representative.
Agreement to Defend, Indemnify and Hold Harmless.
User agrees to defend, indemnify, and hold TDK, its directors, officers, employees, agents, representatives, affiliates, licensors and their
representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out
of, or in connection with, any handling and/or use of SP14808.
User’s indemnity shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if SP14808 fail to perform as
described or expected.
Safety-Critical or Life-Critical Applications.
User agrees that SP14808 shall not be used as, or incorporated into, all or any part of safety critical applications (such as life support),
and a failure of a TDK product considered for purchase by user for use in user’s product would reasonably be expected to cause severe
personal injury or death such as devices which are classified as FDA Class III or similar classification.
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
12
REGULATORY COMPLIANCE INFORMATION
Caution
This device complies with part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the
equipment.
FCC Radio-Frequency Exposure and Approval Conditions:
1. This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. The antenna(s) used for this
transmitter must not be collocated or operating in conjunction with any other antenna or transmitter within a host device,
except in accordance with FCC multi-transmitter product procedures..
2. The regulatory label on the final system must include the statement: “Contains FCC ID:2ACNB14808” or using electronic labeling method as
documented in KDB784748.
3. The final system integrator must ensure there is no instruction provided in the user manual or customer documentation indicating how to
install or remove the transmitter module except such device has implemented two-ways authentication between module and the host
system.
All specifications are subject to change without notice.
© TDK Corporation 2013-2014
13


---

Source Exif Data:

File Type                       : PDF
File Type Extension             : pdf
MIME Type                       : application/pdf
PDF Version                     : 1.5
Linearized                      : Yes
Author                          : New Product Promotion Office
Create Date                     : 2015:01:23 19:18:35+09:00
Modify Date                     : 2015:01:23 19:18:39+09:00
Subject                         : Japanese
Language                        : JA
Tagged PDF                      : Yes
XMP Toolkit                     : Adobe XMP Core 5.4-c005 78.147326, 2012/08/23-13:03:03
Metadata Date                   : 2015:01:23 19:18:39+09:00
Creator Tool                    : PowerPoint 用 Acrobat PDFMaker 11
Document ID                     : uuid:7b763595-4eed-417f-98d5-c6b7120de3f3
Instance ID                     : uuid:f2b51e6f-d481-403b-bb7e-0b9042299b0c
Format                          : application/pdf
Title                           : TDK SESUB General Introduction (Standard Ver)
Description                     : Japanese
Creator                         : New Product Promotion Office
Producer                        : Adobe PDF Library 11.0
Manager                         : SP6D0
Company                         : TDK Corporation
Comments                        : This Material can be applied for Non-NDA customers
Page Layout                     : SinglePage
Page Count                      : 14

EXIF Metadata provided by EXIF.tools