THALES DIS AlS Deutschland ELS31-US LTE Module User Manual hid elsx1 us

Gemalto M2M GmbH LTE Module hid elsx1 us

UserManual.wiki >

THALES DIS AlS Deutschland >

ELS31 US User Manual

User Manual

 M2M.GEMALTO.COMCinterion® ELS31-US/ELS51-USHardware Interface OverviewVersion: 01.000aDocId: ELS31-US_ELS51-US_HIO_v01.000a

Cinterion® ELS31-/ELS51-US Hardware Interface Overview Contents46ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 3 of 46Contents1 Introduction ................................................................................................................. 71.1 Key Features at a Glance .................................................................................. 71.2 ELS31-US/ELS51-US System Overview ......................................................... 102 Interface Characteristics .......................................................................................... 112.1 Application Interface ........................................................................................ 112.1.1 USB Interface...................................................................................... 112.1.2 Serial Interface ASC0 ......................................................................... 122.1.3 Serial Interface ASC1 ......................................................................... 132.1.4 UICC/SIM/USIM Interface................................................................... 142.1.5 GPIO Interface .................................................................................... 162.1.6 I2C Interface ........................................................................................ 172.1.7 SPI Interface ....................................................................................... 172.1.8 Pulse Counter ..................................................................................... 172.1.9 HSIC Interface (ELS51-US Only)........................................................ 172.1.10 SDIO Interface (ELS51-US Only) ....................................................... 182.1.11 Control Signals.................................................................................... 192.1.11.1 Status LED .......................................................................... 192.1.11.2 Fast Shutdown .................................................................... 192.2 RF Antenna Interface....................................................................................... 202.2.1 Antenna Installation ............................................................................ 212.2.2 RF Line Routing Design...................................................................... 222.2.2.1 RF Interface Signals Circuit Diagram Example................... 222.2.2.2 Line Arrangement Examples ............................................... 232.3 Sample Application .......................................................................................... 283 Operating Characteristics ........................................................................................ 303.1 Operating Modes ............................................................................................. 303.2 Power Supply................................................................................................... 304 Mechanical Dimensions, Mounting and Packaging............................................... 314.1 Mechanical Dimensions of ELS31-US/ELS51-US ........................................... 315 Regulatory and Type Approval Information ........................................................... 335.1 Directives and Standards................................................................................. 335.2 SAR requirements specific to portable mobiles ............................................... 355.3 Reference Equipment for Type Approval......................................................... 365.4 Compliance with FCC and IC Rules and Regulations ..................................... 37

Cinterion® ELS31-/ELS51-US Hardware Interface Overview Contents46ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 4 of 466 Document Information.............................................................................................. 396.1 Revision History ............................................................................................... 396.2 Related Documents ......................................................................................... 396.3 Terms and Abbreviations ................................................................................. 396.4 Safety Precaution Notes .................................................................................. 437 Appendix.................................................................................................................... 447.1 List of Parts and Accessories........................................................................... 44

Cinterion® ELS31-/ELS51-US Hardware Interface Overview Tab les46ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 5 of 46TablesTable 1: Signals of the SIM interface (SMT application interface) ............................... 14Table 2: GPIO lines and possible alternative assignment............................................ 16Table 3: SDIO interface features.................................................................................. 18Table 4: SDIO interface lines ....................................................................................... 18Table 5: Return loss in the active band........................................................................ 20Table 6: Overview of operating modes ........................................................................ 30Table 7: Directives ....................................................................................................... 33Table 8: Standards of North American type approval .................................................. 33Table 9: Standards of GCF type approval.................................................................... 33Table 10: Requirements of quality ................................................................................. 33Table 11: Standards of the Ministry of Information Industry of the People’s Republic of China............................................................................ 34Table 12: Toxic or hazardous substances or elements with defined concentration limits............................................................................................................... 34Table 13: Antenna gain limits for FCC and IC (TBD)..................................................... 37Table 14: List of parts and accessories.......................................................................... 44Table 15: Molex sales contacts (subject to change) ...................................................... 45

Cinterion® ELS31-/ELS51-US Hardware Interface Overview Figures46ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 6 of 46FiguresFigure 1: ELS31-US/ELS51-US system overview......................................................... 10Figure 2: USB circuit ..................................................................................................... 11Figure 3: Serial interface ASC0..................................................................................... 12Figure 4: Serial interface ASC1..................................................................................... 13Figure 5: External UICC/SIM/USIM card holder circuit ................................................. 15Figure 6: RF interface signals example......................................................................... 22Figure 7: Embedded Stripline with 65µm prepreg (1080) and 710µm core .................. 23Figure 8: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1 ................ 24Figure 9: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2............................ 25Figure 10: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1............................ 26Figure 11: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2............................ 27Figure 12: Schematic diagram of ELS31-US/ELS51-US sample application.................. 29Figure 13: ELS31-US/ELS51-US– top and bottom view................................................. 31Figure 14: Dimensions of ELS31-US/ELS51-US (all dimensions in mm) ....................... 32Figure 15: Dimensions of ELS31-US/ELS51-US (all dimensions in mm) - bottom view. 32Figure 16: Reference equipment for Type Approval ....................................................... 36

Cinterion® ELS31-/ELS51-US Hardware Interface Overview1 Introduction10ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 7 of 461 IntroductionThis document1 describes the hardware of the Cinterion® ELS31-US and ELS51-US modules. It helps you quickly retrieve interface specifications, electrical and mechanical details and in-formation on the requirements to be considered for integrating further components.The ELS31-US and ELS51-US modules include a baseband, a complete dual band RF front-end, memory and required circuitry to meet 3GPP E-UTRA (Long Term Evolution - LTE, Re-lease 10 set of specifications).The module variants differentiate a follows:- ELS31-US provides LTE connectivity with IP Services- ELS51-US adds a Linux execution environment available for customer applications1.1 Key Features at a Glance1. The document is effective only if listed in the appropriate Release Notes as part of the technical docu-mentation delivered with your Gemalto M2M product.Feature ImplementationGeneralFrequency bands LTE Triband: B2, B4, B12Output power Class 3 (+23dBm +-2dB) for LTE 1900, LTE FDD B2Class 3 (+23dBm +-2dB) for LTE AWS, LTE B4Class 3 (+23dBm +-2dB) for LTE 700, LTE FDD B12Power supply 3.3V to 4.5VOperating temperature (board temperature)Normal operation: -30°C to +80°CExtended operation: -40°C to +90°CPhysical Dimensions: 27.60mm x 18.80mm x 2.05mmWeight: approx. 3gRoHS All hardware components fully compliant with EU RoHS DirectiveLTE features3GPP Release 9 DL 10Mbps, UL 5MbpsLTE Cat. 1 data ratesSMS Point-to-point MT and MOText modeStorage in mobile equipmentSoftwareAT commands Hayes, 3GPP TS 27.007, TS 27.005, product specificSIM Application Toolkit SAT Release 99Firmware update Generic update from host application over ASC0 or USB modemOTA over ASC0 and over USB

Cinterion® ELS31-/ELS51-US Hardware Interface Overview1.1 Key Features at a Glance10ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 8 of 46InterfacesModule interface Surface mount device with solderable connection pads (SMT application interface). Land grid array (LGA) technology ensures high solder joint reli-ability and allows the use of an optional module mounting socket.For more information on how to integrate SMT modules see also [4]. This application note comprises chapters on module mounting and application layout issues as well as on SMT application development equipment.USB USB 2.0 High Speed (480Mbit/s) device interface, Full Speed (12Mbit/s)compliant2 serial interfaces ASC0:• 8-wire modem interface with status and control lines, unbalanced, asyn-chronous• Default baud rate: 115,200 baud• Adjustable baud rates: 4,800 to 921,600, no autobauding support• Supports RTS0/CTS0 hardware flow control. • Indication of incoming data/SMS on RING0 (can be used to wake uphost from power down modes)ASC1 (shared with GPIO lines):• 4-wire, unbalanced asynchronous interface• Default baud rate: 115,200 baud• Adjustable baud rates: 4,800bps to 921,600bps• Supports RTS1/CTS1 hardware flow controlUICC interface Supported SIM/USIM cards: 3V, 1.8VEmbedded UICC Module is prepared for an embedded UICCGPIO interface 20 pads of the application interface programmable as GPIO pads (17) or GPO pads (3):GP(I)Os can be configured as COUNTER, FST_SHDN, ASC0, ASC1, and SPI signal linesProgramming is done via AT commandsI2C interface Supports I2C serial interfaceSPI interface Supports SPI interfaceSDIO ELS51-US only:4 wire interface.HSIC ELS51-US only:High Speed Interchip Communication interface. ADC Analog-to-Digital Converter with one unbalanced analog input.Digitial audio interface Hardware prepared for future use.Antenna interface pads 50Ω LTE main antenna, 50LTE diversity antennaFeature Implementation

Cinterion® ELS31-/ELS51-US Hardware Interface Overview1.1 Key Features at a Glance10ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 9 of 46Power on/off, ResetPower on/off Switch-on by hardware signal ON Switch-off by AT command Switch off by hardware signal GPIO4/FST_SHDN instead of AT commandAutomatic switch-off in case of critical temperature and voltage conditions Reset Orderly shutdown and reset by AT commandEmergency reset by hardware signal EMERG_RSTEvaluation kitEvaluation module ELS31-US/ELS51-US module soldered onto a dedicated PCB that can be connected to an adapter in order to be mounted onto the DSB75.DSB75 DSB75 Development Support Board designed to test and type approve Gemalto M2M modules and provide a sample configuration for application engineering. A special adapter is required to connect the ELS31-US/ELS51-US evaluation module to the DSB75.Feature Implementation

Cinterion® ELS31-/ELS51-US Hardware Interface Overview1.2 ELS31-US/ELS51-US System Overview10ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 10 of 461.2 ELS31-US/ELS51-US System OverviewFigure 1: ELS31-US/ELS51-US system overviewGPIO interfaceI2CUSBASC0ASC0CONTROLPOWERANTENNA (LTE dual band)ModuleSIM interface(with SIM detection)SIM cardApplicationPower supplyEmergency resetONSerial modem interfaceSerial modem interfaceI2C34452112USBAntenna /div. Antenna2GPIOs7Status LED1FST_SHDN Fast shutdown11ADC ADC1COUNTER Pulse counter1GP(I)OsHSICSDIO43HSICSDIOSPI SPI3SPI SPI2ASC1 Serial interface4

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2 Interface Characteristics29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 11 of 462 Interface CharacteristicsELS31-US/ELS51-US is equipped with an SMT application interface that connects to the ex-ternal application. The SMT application interface incorporates the various application interfac-es as well as the RF antenna interfaces. 2.1 Application Interface2.1.1 USB InterfaceELS31-US/ELS51-US supports a USB 2.0 High Speed (480Mbit/s) device interface that is Full Speed (12Mbit/s) compliant. The USB interface is primarily intended for use as command and data interface and for downloading firmware. The VUSB line is used for cable detection only, this is to be supplied by the external device. The USB circuitry in the ELS31-US/ELS51-US is designed to meet the USB 2.0 specification for self-power.2.0”1.Figure 2: USB circuitTo properly connect the module's USB interface to the external application, a USB 2.0 compat-ible connector and cable or hardware design is required. Furthermore, the USB modem driver distributed with ELS31-US/ELS51-US needs to be installed.1. The specification is ready for download on http://www.usb.org/developers/docs/VBUSDPDNVREG (3V075)BATT+USB_DP2)lin. reg.GNDModuleDetection only VUSB_INUSB part1)RING0Host wakeup1) It is recommended to add EMI suppression filter (see section 2.1.3.1)USB_DN2)2) If the USB interface is operated in High Speed mode (480MHz), it is recommended to take special care routing the data lines USB_DP and USB_DN. Application layout should in this case implement a differential impedance of 90Ohm for proper signal integrity.SMT

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.1 Application Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 12 of 462.1.2 Serial Interface ASC0ELS31-US/ELS51-US offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITU-T V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state).ELS31-US/ELS51-US is designed for use as a DCE. Based on the conventions for DCE-DTE connections it communicates with the customer application (DTE) using the following signals:• Port TXD @ application sends data to the module’s TXD0 signal line• Port RXD @ application receives data from the module’s RXD0 signal lineFigure 3: Serial interface ASC0Features:• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,the modem control lines DTR0, DSR0, DCD0 and RING0.• Configured for 8 data bits, no parity and 1 stop bit. • ASC0 can be operated at fixed bit rates from 4800bps up to 921600bps.• Supports RTS0/CTS0 hardware flow control. Communication is possible by using only RXDand TXD lines, if RTS0 is pulled low. • Wake up from SLEEP mode by RTS0 activation. The ASC0 interface is dedicated to signaling via AT commands (3GPP standard 27.007 + mod-ule specific AT commands).

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.1 Application Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 13 of 462.1.3 Serial Interface ASC1ELS31-US/ELS51-US provides a 4-wire unbalanced, asynchronous modem interface ASC1conforming to ITU-T V.24 protocol DCE signaling. The electrical characteristics do not complywith ITU-T V.28. The significant levels are 0V (for low data bit or active state) and 1.8V (for highdata bit or inactive state). The ASC1 interface lines are originally available as GPIO lines. If configured as ASC1 lines, the GPIO lines are assigned as follows: GPIO16 --> RXD1, GPIO17 --> TXD1, GPIO18 --> RTS1 and GPIO19 --> CTS1. Configuration is done by AT command (see [1]: AT^SCFG). The configuration is non-volatile and becomes active after a module restart.ELS51-US is designed for use as a DCE. Based on the conventions for DCE-DTE connectionsit communicates with the customer application (DTE) using the following signals:• Port TXD @ application sends data to module’s TXD1 signal line• Port RXD @ application receives data from the module’s RXD1 signal lineFigure 4: Serial interface ASC1Features• Includes only the data lines TXD1 and RXD1 plus RTS1 and CTS1 for hardware hand-shake. • On ASC1 no RING line is available.• Configured for 8 data bits, no parity and 1 or 2 stop bits.• ASC1 can be operated at fixed bit rates from 4800 bps to 921600 bps.• Supports RTS1/CTS1 hardware flow control. Communication is possible by using only RXDand TXD lines, if RTS1 is pulled low.• Wake up from SLEEP mode by RTS0 activation.AT commands for signaling are not supported on ASC1 interface. ASC1 is intended only fordata transfer in a Linux environment.

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.1 Application Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 14 of 462.1.4 UICC/SIM/USIM InterfaceELS31-US/ELS51-US has an integrated UICC/SIM/USIM interface compatible with the 3GPP 31.102 and ETSI 102 221. This is wired to the host interface in order to be connected to an external SIM card holder. Five pads on the SMT application interface are reserved for the SIM interface. The UICC/SIM/USIM interface supports 3V and 1.8V SIM cards. The CCIN signal serves to detect whether a tray (with SIM card) is present in the card holder. The CCIN signal must be connected to V180 for the detection to work on the module. Other-wise the SIM card can never be detected by the module.Using the CCIN signal is mandatory for compliance with the GSM 11.11 recommendation if the mechanical design of the host application allows the user to remove the SIM card during oper-ation. To take advantage of this feature, an appropriate SIM card detect switch is required on the card holder. For example, this is true for the model supplied by Molex, which has been test-ed to operate with ELS31-US/ELS51-US and is part of the Gemalto M2M reference equipment submitted for type approval. See Section 7.1 for Molex ordering numbers.Note: No guarantee can be given, nor any liability accepted, if loss of data is encountered after removing the SIM card during operation. Also, no guarantee can be given for properly initializ-ing any SIM card that the user inserts after having removed the SIM card during operation. In this case, the application must restart ELS31-US/ELS51-US.Table 1: Signals of the SIM interface (SMT application interface)Signal DescriptionGND Separate ground connection for SIM card to improve EMC.CCCLK Chipcard clockCCVCC SIM supply voltage.CCIO Serial data line, input and output.CCRST Chipcard resetCCIN Input on the baseband processor for detecting a SIM card tray in the holder. If the SIM is removed during operation the SIM interface is shut down immediately to prevent destruc-tion of the SIM. The CCIN signal is by default low and will change to high level if a SIM card is inserted.The CCIN signal is mandatory for applications that allow the user to remove the SIM card during operation. The CCIN signal is solely intended for use with a SIM card. It must not be used for any other purposes. Failure to comply with this requirement may invalidate the type approval of ELS31-US/ELS51-US.

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.1 Application Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 15 of 46The figure below shows a circuit to connect an external SIM card holder.Figure 5: External UICC/SIM/USIM card holder circuitThe total cable length between the SMT application interface pads on ELS31-US/ELS51-US and the pads of the external SIM card holder must not exceed 100mm in order to meet the specifications of 3GPP TS 51.010-1 and to satisfy the requirements of EMC compliance.To avoid possible cross-talk from the CCCLK signal to the CCIO signal be careful that both lines are not placed closely next to each other. A useful approach is using a GND line to shield the CCIO line from the CCCLK line.The ELS31-US/ELS51-US includes embedded ESD protection for the SIM interface that com-plies to ETSI EN 301 489-1/7: Contact discharge: ± 4kV, air discharge: ± 8kV.SIMCCVCCCCRSTCCIOCCCLK220nF1nFCCINV180

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.1 Application Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 16 of 462.1.5 GPIO InterfaceELS31-US/ELS51-US offers a GPIO interface with 17 GPIO and 3 GPO lines. The lines areshared with other interfaces or functions: Fast shutdown (see Section 2.1.11.2), status LED(see Section 2.1.11.1), a pulse counter (see Section 2.1.8), ASC0 (see Section 2.1.2), ASC1(see Section 2.1.3), SPI (see Section 2.1.7), and HSIC (see Section 2.1.9).The following table shows the configuration variants for the GPIO pads. All variants are mutu-ally exclusive, i.e. a pad configured for instance as Status LED is locked for alternative usage.After startup, the above mentioned alternative GPIO line assignments can be configured usingAT commands (see [1]). The configuration is non-volatile and available after module restart.Notes:• GPO5, GPO23 and GPO26 are GPOs only.Table 2: GPIO lines and possible alternative assignmentGPIO Fast Shutdown Status LED Pulse Counter ASC0 ASC1 SPI HSICGPIO1 DTR0GPIO2 DCD0GPIO3 DSR0GPIO4 FST_SHDNGPO5 LEDGPIO6GPIO7GPIO8 COUNTERGPIO16 RXD1 AP_WAKEUPGPIO17 TXD1 HOST_ACTIVEGPIO18 RTS1 CP_WAKEUPGPIO19 CTS1 SUSPENDGPIO20GPIO21GPIO22GPO23GPIO24 RING0GPIO25GPO26 SPI_CS1GPIO27 SPI_CS2

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.1 Application Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 17 of 462.1.6 I2C InterfaceI2C is a serial, 8-bit oriented data transfer bus for bit rates up to 100kbps. It consists of two lines,the serial data line I2CDAT and the serial clock line I2CCLK. The module acts as a single mas-ter device, e.g. the clock I2CCLK is driven by the module. I2CDAT is a bi-directional line. Eachdevice connected to the bus is software addressable by a unique 7-bit address, and simplemaster/slave relationships exist at all times. The module operates as master-transmitter or asmaster-receiver. The customer application transmits or receives data only on request of themodule.The I2C interface can be powered via the V180 line of ELS31-US/ELS51-US. If connected tothe V180 line, the I2C interface will properly shut down when the module enters the PowerDown mode.Note: Good care should be taken when creating the PCB layout of the host application: Thetraces of I2CCLK and I2CDAT should be equal in length and as short as possible.2.1.7 SPI InterfaceThe ELS31-US/ELS51-US GPIO interface lines can be configured as Serial Peripheral Inter-face (SPI). The SPI is a synchronous serial interface for control and data transfer betweenELS31-US/ELS51-US and the external application. Only one application can be connected tothe SPI and the interface supports only master mode. The transmission rates are up to 6.5Mbit/s. The SPI interface comprises the two data lines SPI_MOSI and SPI_MISO, the clock lineSPI_CLK a well as the chip select lines SPI_CS1 and SPI_CS2.2.1.8 Pulse CounterThe GPIO8 line can be configured as pulse counter line COUNTER (for GPIOs see Section2.1.5). The pulse counter interface can be used, for example, as a clock - it is designed to mea-sure signals from 0 to 1000 pulses per second. Note that the pulse counter works in batchesof 8 pulses, i.e., the URC indicates the number of pulses counted in batches of 8 pulses. Formore information on how to use this feature see [1].2.1.9 HSIC Interface (ELS51-US Only)The (USB) High Speed Inter Chip (HSIC) interface can be used between the module and an external application processor, and is compliant to the High Speed USB 2.0 interface with 480Mbit/s. The maximum distance between module processor and external application proces-sor should not exceed 100mm.The HSIC interface comprises two signal lines (strobe - HSIC_STRB - and data - HSIC_DATA) used in a source synchronous serial interface with a 240MHz clock to provide a 480Mbps USB interface. The HSIC_STRB and HSIC_DATA lines are high-speed signals and should be rout-ed as 50Ohm impedance traces. The trace length of these signals should be balanced to min-imize timing skew and be no longer than 100mm.The HSIC interface implementation complies with the USB HSIC standard “High-Speed Inter-Chip USB Electrical Specification”, Version 1, September 23, 20071.1. The USB specifications are ready for download on http://www.usb.org/developers/docs/usb20_docs/

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.1 Application Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 18 of 462.1.10 SDIO Interface (ELS51-US Only)The Secure Digital Input Output (SDIO) interface can be used to for instance connect an SD card. The SDIO interface has the following features:Table 4 lists the six SDIO interface lines:Table 3: SDIO interface featuresFeature Description/ValueInterface Type SDIO/SD1 (1 data line), SDIO/SD4 (4 data lines), MMC4 (4 data lines)Voltage 1.8 VDMA Mode SDMA / ADMA1 / ADMA2Number of SLOTs 1Implement DDR mode YesCard inserted status YesSDIOCLK frequency Default Mode: 23 MHz maximumHigh Speed Mode: 46 MHz maximumUHS-I Mode: 92 MHzMax block length 2048 bytesSDIO interrupt support Yes, support SDIO/SD1, SDIO/SD4 mode interruptsTable 4: SDIO interface linesSignal Direction DescriptionSDIOCLK Out SD master clock output to SD/MMC/SDIO device.SDIOCMD I/O Command line.SDIO0 I/O Data lines. Only SDIO0 carries data in 1-bit SD mode, SDIO0..3 carry data in 4-bits mode.SDIO interrupt is multiplexed with SDIO1.SDIO1 I/OSDIO2 I/OSDIO3 I/O

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.1 Application Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 19 of 462.1.11 Control Signals2.1.11.1 Status LEDThe LED line can also be configured as GPO5 line, and can be used to drive a status LED thatindicates different operating modes of the module (for GPOs see Section 2.1.5). LED and GPOfunctionality are mutually exclusive.2.1.11.2 Fast ShutdownThe GPIO4 interface line can be configured as fast shutdown signal line FST_SHDN. The con-figured FST_SHDN line is an active low control signal. If enabled, a low impulse of 10 millisec-onds on the FST_SHDN line starts the fast shutdown procedure.The fast shutdown procedure still finishes any data activities on the module‘s flash file system, thus ensuring data integrity, but the module will no longer deregister gracefully from the network.

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.2 RF Antenna Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 20 of 462.2 RF Antenna InterfaceThe RF interface has an impedance of 50Ω. ELS31-US/ELS51-US is capable of sustaining a total mismatch at the antenna line without any damage, even when transmitting at maximum RF power.The external antenna must be matched properly to achieve best performance regarding radi-ated power, modulation accuracy and harmonic suppression. Antenna matching networks are not included on the ELS31-US/ELS51-US module and should be placed in the host application if the antenna does not have an impedance of 50Ω.Regarding the return loss ELS31-US/ELS51-US provides the following values in the active band:Table 5: Return loss in the active bandState of module Return loss of module Recommended return loss of applicationReceive > 8dB > 12dBTransmit not applicable > 12dB

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.2 RF Antenna Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 21 of 462.2.1 Antenna InstallationThe antenna is connected by soldering the antenna pads (RF_OUT, pad #59 and DIV_ANT, pad 56) its neighboring ground pads (GND, i.e., pads #55, #57, #58 and #60) directly to the application’s PCB. The antenna pad is the antenna reference point (ARP) for ELS31-US/ELS51-US. All RF data specified throughout this document is related to the ARP.The distance between the antenna RF pads and its neighboring GND pads has been optimized for best possible impedance. On the application PCB, special attention should be paid to these 3 pads, in order to prevent mismatch.The wiring of the antenna connection line, starting from the antenna pad to the application an-tenna should result in a 50Ω line impedance. Line width and distance to the GND plane needs to be optimized with regard to the PCB’s layer stack. Some examples are given in Section 2.2.2.To prevent receiver desensitization due to interferences generated by fast transients like high speed clocks on the application PCB, it is recommended to realize the antenna connection line using embedded Stripline rather than Micro-Stripline technology. Please see Section 2.2.2.2 for an example.For type approval purposes, the use of a 50Ω coaxial antenna connector (U.FL-R-SMT) might be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible to ELS31-US/ELS51-US‘s antenna pad.

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.2 RF Antenna Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 22 of 462.2.2 RF Line Routing Design2.2.2.1 RF Interface Signals Circuit Diagram ExampleFigure 6 is a topology reference, and it is recommended not to deviate from this circuit for your external application.The RF inter-connects called RF Port 1 and RF Port 2 are examples only. Depending on the RF antenna, the interfacing system will dictate the RF inter-connects.Figure 6: RF interface signals examplePlease be also aware of ESD protection required on the RF interface lines. ESD protection might be utilized through the above pi-network (primarily intended for managing any additional RF optimization needs), or by additional components in series with the pi-network illustrated above.

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.2 RF Antenna Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 23 of 462.2.2.2 Line Arrangement ExamplesSeveral dedicated tools are available to calculate line arrangements for specific applicationsand PCB materials - for example from http://www.polarinstruments.com/ (commercial software)or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software).Embedded StriplineThis figure below shows a line arrangement example for embedded stripline with 65µm FR4 prepreg (type: 1080) and 710µm FR4 core (4-layer PCB).Figure 7: Embedded Stripline with 65µm prepreg (1080) and 710µm core

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.2 RF Antenna Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 24 of 46Micro-StriplineThis section gives two line arrangement examples for micro-stripline. • Micro-Stripline on 1.0mm Standard FR4 2-Layer PCBThe following two figures show examples with different values for D1 (ground strip separa-tion).Figure 8: Micro-Stripline on 1.0mm standard FR4 2-layer PCB - example 1Antenna lineGround lineGround lineApplication board

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.2 RF Antenna Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 25 of 46Figure 9: Micro-Stripline on 1.0mm Standard FR4 PCB - example 2Antenna lineGround lineGround lineApplication board

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.2 RF Antenna Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 26 of 46• Micro-Stripline on 1.5mm Standard FR4 2-Layer PCBThe following two figures show examples with different values for D1 (ground strip separa-tion).Figure 10: Micro-Stripline on 1.5mm Standard FR4 PCB - example 1Antenna lineGround lineGround lineApplication board

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.2 RF Antenna Interface29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 27 of 46Figure 11: Micro-Stripline on 1.5mm Standard FR4 PCB - example 2Antenna lineGround lineGround lineApplication board

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.3 Sample Application29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 28 of 462.3 Sample ApplicationFigure 12 shows a typical example of how to integrate a ELS31-US/ELS51-US module with anapplication. Usage of the various host interfaces depends on the desired features of the appli-cation.Because of the high RF field density inside the module, it cannot be guaranteed that no selfinterference might occur, depending on frequency and the applications grounding concept. Thepotential interferers may be minimized by placing small capacitors (47pF) at suspected lines(e.g. RXD0, or ON). While developing SMT applications it is strongly recommended to provide test pointsfor certain signals, i.e., lines to and from the module - for debug and/or test purposes.The SMT application should allow for an easy access to these signals. For details onhow to implement test points see [4].The EMC measures are best practice recommendations. In fact, an adequate EMC strategy foran individual application is very much determined by the overall layout and, especially, the po-sition of components. For example, mounting the internal acoustic transducers directly on thePCB eliminates the need to use the ferrite beads shown in the sample schematic. Note: ELS31-US/ELS51-US is not intended for use with cables longer than 3m.DisclaimerNo warranty, either stated or implied, is provided on the sample schematic diagram shown inFigure 12 and the information detailed in this section. As functionality and compliance with na-tional regulations depend to a great amount on the used electronic components and the indi-vidual application layout manufacturers are required to ensure adequate design and operatingsafeguards for their products using ELS31-US/ELS51-US modules.

Cinterion® ELS31-/ELS51-US Hardware Interface Overview2.3 Sample Application29ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 29 of 46Figure 12: Schematic diagram of ELS31-US/ELS51-US sample applicationELS31/ELS51Main AntennaDiv. AntennaBATT+RFBATT+BBGPIOsLEDCOUNTERI2CCLKI2CDATGNDSDIOHSICONFST_SHUTDOWNASC0ASC1USBV180CCINCCVCCCCIOCCRSTCCCLKPower Supply33pF 33pF + 150µFLow ESR!2k2 2k2V180BlockingWiFiµC1nF 10pF10pF220nFSIMUSBInterfaces available only on ELS51

Cinterion® ELS31-/ELS51-US Hardware Interface Overview3 Operating Characteristics30ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 30 of 463 Operating Characteristics3.1 Operating ModesThe table below briefly summarizes the various operating modes referred to throughout thedocument. 3.2 Power SupplyELS31-US/ELS51-US needs to be connected to a power supply at the SMT application inter-face - 2 BATT lines and GND. There are two separate voltage domains for BATT:• BATT_BB with a line mainly for the baseband power supply.• BATT_RF with a line for the RF power amplifier supply.Please note that throughout the document BATT refers to both voltage domains and powersupply lines - BATT_BB and BATT_RF.The power supply of ELS31-US/ELS51-US has to be a single voltage source at BATT_BB andBATT_RF. It must be able to provide the current for all operation modes of the module. All the key functions for supplying power to the device are handled by the power managementsection of the analog controller. This IC provides the following features:• Stabilizes the supply voltages for the baseband using low drop linear voltage regulators anda DC-DC step down switching regulator.• Switches the module's power voltages for the power-up and -down procedures.• SIM switch to provide SIM power supply.Table 6: Overview of operating modesMode FunctionNormal opera-tionLTE IDLE No data transfer is in progress and the USB connection is suspended by host (or is not present) and no active communication via ASC0/ASC1. In IDLE mode, the software can be active or in SLEEP state.LTE DATA LTE data transfer in progress. Power consumption depends on network settings and data transfer rate. Power DownNormal shutdown after sending the power down command. Software is not active. Inter-faces are not accessible. Operating voltage remains applied.Airplane modeAirplane mode shuts down the radio part of the module, causes the module to log off from the LTE network and disables all AT commands whose execution requires a radio connec-tion.Airplane mode can be controlled by AT command (see [1]).In Airplane mode, the software can be active or in SLEEP state.

Cinterion® ELS31-/ELS51-US Hardware Interface Overview4 Mechanical Dimensions, Mounting and Packaging32ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 31 of 464 Mechanical Dimensions, Mounting and PackagingThe following sections describe the mechanical dimensions of ELS31-US/ELS51-US and give recommendations for integrating ELS31-US/ELS51-US into the host application.4.1 Mechanical Dimensions of ELS31-US/ELS51-US Figure 13 shows the top and bottom view of ELS31-US/ELS51-US and provides an overview of the board's mechanical dimensions. For further details see Figure 14. Figure 13: ELS31-US/ELS51-US– top and bottom viewProduct labelTop viewBottom view

Cinterion® ELS31-/ELS51-US Hardware Interface Overview4.1 Mechanical Dimensions of ELS31-US/ELS51-US32ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 32 of 46Figure 14: Dimensions of ELS31-US/ELS51-US (all dimensions in mm)Figure 15: Dimensions of ELS31-US/ELS51-US (all dimensions in mm) - bottom view0.118.80.127.60.31 0.04(PCB)2.05 0.1(TOTAL)TOP VIEW18.827.60.81.20.40.550.551.050.42.60.41.451.050.151.640.91.11.10.16#0550.7*&8

Cinterion® ELS31-/ELS51-US Hardware Interface Overview5 Regulatory and Type Approval Information38ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 33 of 465 Regulatory and Type Approval Information5.1 Directives and StandardsELS31-US/ELS51-US is designed to comply with the directives and standards listed below.It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical spec-ifications provided in the "ELS31-US/ELS51-US Hardware Interface Description".Table 7: Directives2002/95/EC (RoHS 1)2011/65/EC (RoHS 2)Directive of the European Parliament and of the Council of 27 January 2003 (and revised on 8 June 2011) on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)Table 8: Standards of North American type approvalCFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications, PCS); US Equipment Authorization FCCOET Bulletin 65 (Edition 97-01) Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic FieldsUL 60 950-1 Product Safety Certification (Safety requirements)California Leadfree Man-dateCovered by European RoHS requirementsRSS132 (Issue2)RSS133 (Issue5)Canadian StandardTable 9: Standards of GCF type approval3GPP TS 51.010-1 Digital cellular telecommunications system (Release 10); Mobile Station (MS) conformance specification;GCF-CC V3.58 Global Certification Forum - Certification CriteriaTable 10: Requirements of qualityIEC 60068 Environmental testingDIN EN 60529 IP codes

Cinterion® ELS31-/ELS51-US Hardware Interface Overview5.1 Directives and Standards38ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 34 of 46Table 12: Toxic or hazardous substances or elements with defined concentration limitsTable 11: Standards of the Ministry of Information Industry of the People’s Republic of ChinaSJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Sub-stances in Electronic Information Products” (2006-06).SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06).According to the “Chinese Administration on the Control of Pollution caused by Electronic Information Products” (ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Gemalto M2M Hardware Interface Description.Please see Table 12 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T 11363-2006.

Cinterion® ELS31-/ELS51-US Hardware Interface Overview5.2 SAR requirements specific to portable mobiles38ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 35 of 465.2 SAR requirements specific to portable mobilesMobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable ELS31-US/ELS51-US based applica-tions to be evaluated and approved for compliance with national and/or international regula-tions. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For US markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on US marketsES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment (MTE) in thefrequency range 30MHz - 6GHz Please note that SAR requirements are specific only for portable devices and not for mobile devices as defined below:• Portable device:A portable device is defined as a transmitting device designed to be used so that the radi-ating structure(s) of the device is/are within 20 centimeters of the body of the user.• Mobile device:A mobile device is defined as a transmitting device designed to be used in other than fixedlocations and to generally be used in such a way that a separation distance of at least 20centimeters is normally maintained between the transmitter's radiating structure(s) and thebody of the user or nearby persons. In this context, the term ''fixed location'' means that thedevice is physically secured at one location and is not able to be easily moved to anotherlocation.

Cinterion® ELS31-/ELS51-US Hardware Interface Overview5.3 Reference Equipment for Type Approval38ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 36 of 465.3 Reference Equipment for Type ApprovalThe Gemalto M2M reference setup submitted to type approve ELS31-US/ELS51-US (including a special approval adapter for the DSB75) is shown in the following figure1:Figure 16: Reference equipment for Type Approval1. For RF performance tests a mini-SMT/U.FL to SMA adapter with attached 6dB coaxial attenuator is cho-sen to connect the evaluation module directly to the GSM/UMTS test equipment instead of employingthe SMA antenna connectors on the ELS31-US/ELS51-US-DSB75 adapter as shown in Figure 16. Thefollowing products are recommended: Hirose SMA-Jack/U.FL-Plug conversion adapter HRMJ-U.FLP(40)(for details see see http://www.hirose-connectors.com/ or http://www.farnell.com/Aeroflex Weinschel Fixed Coaxial Attenuator Model 3T/4T (for details see http://www.aeroflex.com/ams/weinschel/pdfiles/wmod3&4T.pdf)AntennaGSM / GPRS / UMTS Antenna with 1m cable ASC0PCPower supplyLTEBase stationDSB75ASC1USBApproval adapter for DSB75SMAEvaluation moduleELS31ELS51USBEvaluation moduleELS31ELS51SIM cardTop viewBottom view

Cinterion® ELS31-/ELS51-US Hardware Interface Overview5.4 Compliance with FCC and IC Rules and Regulations38ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 37 of 465.4 Compliance with FCC and IC Rules and RegulationsThe Equipment Authorization Certification for the Gemalto M2M reference application de-scribed in Section 5.3 will be registered under the following identifiers:• ELS31-US:FCC Identifier: QIPELS31-US Industry Canada Certification Number: 7830A-ELS31US Granted to Gemalto M2M GmbH • ELS51-US:FCC Identifier: QIPELS51-US (not yet granted)Industry Canada Certification Number: 7830A-ELS51US (not yet granted)Granted to Gemalto M2M GmbH Manufacturers of mobile or fixed devices incorporating ELS31-US/ELS51-US modules are au-thorized to use the FCC Grants and Industry Canada Certificates of the ELS31-US/ELS51-US modules for their own final products according to the conditions referenced in these docu-ments. In this case, an FCC/ IC label of the module shall be visible from the outside, or the host device shall bear a second label stating "Contains FCC ID: QIPELS31-US" / "Contains FCC ID: QIPELS51-US", and accordingly “Contains IC: 7830A-ELS31US“ / “Contains IC: 7830A-ELS51US“. The integration is limited to fixed or mobile categorized host devices, where a sep-aration distance between the antenna and any person of min. 20cm can be assured during nor-mal operating conditions.For mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits in the following Table 9 for FCC and IC.IMPORTANT: Manufacturers of portable applications incorporating ELS31-US/ELS51-US modules are re-quired to have their final product certified and apply for their own FCC Grant and Industry Can-ada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 5.2 for detail).Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules and with Industry Canada license-exempt RSS standard(s). These limits are designed to provide reasonable protection against harmful inter-ference in a residential installation. This equipment generates, uses and can radiate radio fre-Table 13: Antenna gain limits for FCC and IC (TBD)Operating band FCC limit IC limit UnitMaximum gain in lower operating bands with f< 1GHz(LTE Bd12)8.72 6.10 dBiMaximum gain in higher operating bands with f=1700MHz(LTE Bd4)5.00 5.00 dBiMaximum gain in higher operating bands with f=1900MHz(LTE Bd2)8.01 8.01 dBi

Cinterion® ELS31-/ELS51-US Hardware Interface Overview5.4 Compliance with FCC and IC Rules and Regulations38ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 38 of 46quency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver isconnected.• Consult the dealer or an experienced radio/TV technician for help.This Class B digital apparatus complies with Canadian ICES-003.If Canadian approval is requested for devices incorporating ELS31US / ELS51-US modules the above note will have to be provided in the English and French language in the final user docu-mentation. Manufacturers/OEM Integrators must ensure that the final user documentation does not contain any information on how to install or remove the module from the final product.Notes (IC): (EN) This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Opera-tion is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.(FR) Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes: (1) cet appareil ne doit pas causer d'interférence et (2) cet appareil doit accepter toute interférence, notamment les interférences qui peuvent affecter son fonctionnement.(EN) Radio frequency (RF) Exposure InformationThe radiated output power of the Wireless Device is below the Industry Canada (IC) radio fre-quency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal operation is minimized.This device has also been evaluated and shown compliant with the IC RF Exposure limits un-der mobile exposure conditions (antennas at least 20cm from a person‘s body).(FR) Informations concernant l'exposltion aux fréquences radio (RF)La puissance de sortie émise par l'appareil de sans fiI est inférieure à la limite d'exposition aux fréquences radio d‘Industry Canada (IC). Utilisez l'appareil de sans fil de façon à minimiser les contacts humains lors du fonctionnement normal.Ce périphérique a également été évalué et démontré conforme aux limites d'exposition aux RF d'IC dans des conditions d'exposition à des appareils mobiles (les antennes se situent à moins de 20cm du corps d'une personne).

Cinterion® ELS31-/ELS51-US Hardware Interface Overview6 Document Information43ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 39 of 466 Document Information6.1 Revision HistoryNew document: "Cinterion® ELS31-/ELS51-US Hardware Interface Overview" v01.000a6.2 Related Documents[1] ELS31-US/ELS51-US AT Command Set[2] ELS31-US/ELS51-US Release Note[3] Application Note 40: Thermal Solutions[4] Application Note 48: SMT Module Integration[5] Universal Serial Bus Specification Revision 2.0, April 27, 20006.3 Terms and AbbreviationsChapter What is new-- Initial document setup.Abbreviation DescriptionADC Analog-to-digital converterAGC Automatic Gain ControlANSI American National Standards InstituteARFCN Absolute Radio Frequency Channel NumberARP Antenna Reference PointASC0/ASC1 Asynchronous Controller. Abbreviations used for first and second serial interface of the moduleB Thermistor ConstantBER Bit Error RateBTS Base Transceiver StationCB or CBM Cell Broadcast MessageCE Conformité Européene (European Conformity)CHAP Challenge Handshake Authentication ProtocolCPU Central Processing UnitCS Coding SchemeCSD Circuit Switched DataCTS Clear to SendDAC Digital-to-Analog ConverterDAI Digital Audio Interface

Cinterion® ELS31-/ELS51-US Hardware Interface Overview6.3 Terms and Abbreviations43ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 40 of 46dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-lawDCE Data Communication Equipment (typically modems, e.g. Gemalto M2M module)DCS 1800 Digital Cellular System, also referred to as PCNDRX Discontinuous ReceptionDSB Development Support BoxDSP Digital Signal ProcessorDSR Data Set ReadyDTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application)DTR Data Terminal ReadyDTX Discontinuous TransmissionEFR Enhanced Full RateEGSM Enhanced GSMEIRP Equivalent Isotropic Radiated PowerEMC Electromagnetic CompatibilityERP Effective Radiated PowerESD Electrostatic DischargeETS European Telecommunication StandardFCC Federal Communications Commission (U.S.)FDMA Frequency Division Multiple AccessFR Full RateGMSK Gaussian Minimum Shift KeyingGPIO General Purpose Input/OutputGPRS General Packet Radio ServiceGSM Global Standard for Mobile CommunicationsHiZ High ImpedanceHR Half RateHSIC High-Speed Inter-ChipI/O Input/OutputIC Integrated CircuitIMEI International Mobile Equipment IdentityISO International Standards OrganizationITU International Telecommunications Unionkbps kbits per secondLED Light Emitting DiodeLi-Ion/Li+ Lithium-IonLi battery Rechargeable Lithium Ion or Lithium Polymer batteryLTE Long Term EvolutionAbbreviation Description

Cinterion® ELS31-/ELS51-US Hardware Interface Overview6.3 Terms and Abbreviations43ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 41 of 46Mbps Mbits per secondMMI Man Machine InterfaceMO Mobile OriginatedMS Mobile Station (GSM module), also referred to as TEMSISDN Mobile Station International ISDN numberMT Mobile TerminatedNTC Negative Temperature CoefficientOEM Original Equipment ManufacturerPA Power AmplifierPAP Password Authentication ProtocolPBCCH Packet Switched Broadcast Control ChannelPCB Printed Circuit BoardPCL Power Control LevelPCM Pulse Code ModulationPCN Personal Communications Network, also referred to as DCS 1800PCS Personal Communication System, also referred to as GSM 1900PLL Phase Locked LoopPPP Point-to-point protocolPSK Phase Shift KeyingPSU Power Supply UnitR&TTE Radio and Telecommunication Terminal EquipmentRAM Random Access MemoryRF Radio FrequencyRLS Radio Link StabilityRoHS Restriction of the use of certain hazardous substances in electrical and electronic equipment. RTS Request to SendRx Receive DirectionSAR Specific Absorption RateSAW Surface Acoustic WaveSDIO Secure Digital Input OutputSELV Safety Extra Low VoltageSIM Subscriber Identification ModuleSMD Surface Mount DeviceSMS Short Message ServiceSMT Surface Mount TechnologySRAM Static Random Access MemoryTA Terminal adapter (e.g. GSM module)Abbreviation Description

Cinterion® ELS31-/ELS51-US Hardware Interface Overview6.3 Terms and Abbreviations43ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 42 of 46TDMA Time Division Multiple AccessTE Terminal Equipment, also referred to as DTETLS Transport Layer SecurityTx Transmit DirectionUART Universal asynchronous receiver-transmitterURC Unsolicited Result CodeUSSD Unstructured Supplementary Service DataVSWR Voltage Standing Wave RatioAbbreviation Description

Cinterion® ELS31-/ELS51-US Hardware Interface Overview6.4 Safety Precaution Notes43ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 43 of 466.4 Safety Precaution NotesThe following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating ELS31-US/ELS51-US. Manu-facturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manu-facture and intended use of the product. Gemalto M2M assumes no liability for customer’s fail-ure to comply with these precautions.When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-lines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hear-ing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufac-turer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-not be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both.Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any elec-trical equipment in potentially explosive atmospheres can constitute a safety hazard.Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger.Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-ing a vehicle, unless it is securely mounted in a holder for speakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphones must be installed by qualified personnel. Faulty installation or opera-tion can constitute a safety hazard.IMPORTANT!Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential com-munications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate those features before you can make an emergency call.Some networks require that a valid SIM card be properly inserted in the cellular termi-nal or mobile.

Cinterion® ELS31-/ELS51-US Hardware Interface Overview7 Appendix45ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 44 of 467 Appendix7.1 List of Parts and AccessoriesTable 14: List of parts and accessoriesDescription Supplier Ordering informationELS31-US Gemalto M2M Standard module Gemalto M2M IMEI:Packaging unit (ordering) number:L30960-N4520-A200Module label number:S30960-S4520-A200-11Customer IMEI modulePackaging unit (ordering) number:L30960-N4525-A200Module label number:S30960-S4520-A200-111. Note: At the discretion of Gemalto M2M, module label information can either be laser engraved on the module’s shielding or be printed on a label adhered to the module’s shielding.ELS51-US Gemalto M2M Standard module Gemalto M2M IMEI:Packaging unit (ordering) number:L30960-N4550-A200Module label number:S30960-S4550-A200-11Customer IMEI modulePackaging unit (ordering) number:L30960-N4555-A200Module label number:S30960-S4555-A200-11ELS31-US Evaluation Mod-uleGemalto M2M Ordering number: L30960-N4521-A200ELS51-US Evaluation Mod-uleGemalto M2M Ordering number: L30960-N4551-A200DSB75 Evaluation Kit Gemalto M2M Ordering number: L36880-N8811-A100DSB MiniCompact Evaluation BoardGemalto M2M Ordering number: L30960-N0030-A100Starter Kit B80 Gemalto M2M Ordering Number L30960-N0040-A100Multi-Adapter R1 for mount-ing ELS31-US/ELS51-US evaluation modules onto DSB75Gemalto M2M Ordering number: L30960-N0010-A100Approval adapter for mount-ing ELS31-US/ELS51-US evaluation modules onto DSB75Gemalto M2M Ordering number: L30960-N2301-A100SIM card holder incl. push button ejector and slide-in trayMolex Ordering numbers: 91228 91236Sales contacts are listed in Table 15.

Cinterion® ELS31-/ELS51-US Hardware Interface Overview7.1 List of Parts and Accessories45ELS31-US_ELS51-US_HIO_v01.000a 2016-12-28Confidential / PreliminaryPage 45 of 46Table 15: Molex sales contacts (subject to change)MolexFor further information please click:http://www.molex.comMolex Deutschland GmbHOtto-Hahn-Str. 1b69190 WalldorfGermanyPhone: +49-6227-3091-0Fax: +49-6227-3091-8100Email: mxgermany@molex.comAmerican HeadquartersLisle, Illinois 60532U.S.A.Phone: +1-800-78MOLEXFax: +1-630-969-1352Molex China DistributorsBeijing, Room 1311, Tower B, COFCO PlazaNo. 8, Jian Guo Men Nei Street, 100005BeijingP.R. ChinaPhone: +86-10-6526-9628 Fax: +86-10-6526-9730Molex Singapore Pte. Ltd.110, International RoadJurong Town, Singapore 629174Phone: +65-6-268-6868Fax: +65-6-265-6044Molex Japan Co. Ltd.1-5-4 Fukami-Higashi,Yamato-City,Kanagawa, 242-8585 JapanPhone: +81-46-265-2325Fax: +81-46-265-2365

Navigation menu