THALES DIS AlS Deutschland MC55I-W Quadband GSM/GPRS Module User Manual hio
Gemalto M2M GmbH Quadband GSM/GPRS Module hio
08 user guide
MC55i-W
Version: 01.301
DocId: MC55i-W_HIO_v01.301
Hardware Interface Overview
GENERAL NOTE
THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PROD-
UCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY
EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CON-
TAINS INFORMATION ON CINTERION PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT
ARE SUBJECT TO CHANGE AT CINTERION'S DISCRETION. CINTERION WIRELESS MODULES
GMBH GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT
TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS;
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EXTENT PERMITTED BY APPLICABLE LAW, CINTERION WIRELESS MODULES GMBH DIS-
CLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED
PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PRO-
VIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE
SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW.
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tents and communication thereof to others without express authorization are prohibited. Offenders will
be held liable for payment of damages. All rights created by patent grant or registration of a utility model
or design patent are reserved.
Copyright © 2011, Cinterion Wireless Modules GmbH
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MC55-W Hardware Interface Overview
2
Document Name: MC55-W Hardware Interface Overview
Version: 01.301
Date: 2011-3-8
DocId: MC55i-W_HIO_v01.301
Status Confidential / Released
Supported Products: MC55i-W
MC55i-W Hardware Interface Overview
Contents
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Contents
1 Introduction ................................................................................................................. 6
1.1 Related documents............................................................................................ 6
1.2 Terms and Abbreviations................................................................................... 7
1.3 Regulatory and Type Approval Information ..................................................... 10
1.3.1 Directives and Standards.................................................................... 10
1.3.2 SAR Requirements Specific to Portable Mobiles................................ 13
1.3.3 Safety Precautions.............................................................................. 14
2 Product Concept ....................................................................................................... 15
2.1 MC55i-W Key Features at a Glance ................................................................ 15
3 Application Interface................................................................................................. 17
3.1 Operating Modes ............................................................................................. 18
4 Antenna Interface...................................................................................................... 19
5 Electrical, Reliability and Radio Characteristics.................................................... 20
5.1 Absolute Maximum Ratings ............................................................................. 20
5.2 Operating Temperatures.................................................................................. 21
5.3 Storage Conditions .......................................................................................... 22
5.4 Reliability Characteristics................................................................................. 23
5.5 Electrical Specifications of the Application Interface........................................ 24
5.6 Power Supply Ratings...................................................................................... 25
6 Mechanics.................................................................................................................. 26
6.1 Mechanical Dimensions of MC55i-W............................................................... 26
6.2 Board-to-Board Connector............................................................................... 27
6.2.1 Mechanical Dimensions of the Hirose DF12 Connector ..................... 28
7 Reference Approval .................................................................................................. 29
7.1 Reference Equipment for Type Approval......................................................... 29
7.2 Compliance with FCC Rules and Regulations................................................. 30
MC55i-W Hardware Interface Overview
Tables
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Tables
Table 1: Directives ....................................................................................................... 10
Table 2: Standards of North American type approval .................................................. 10
Table 3: Standards of European type approval............................................................ 10
Table 4: Requirements of quality ................................................................................. 11
Table 5: Standards of the Ministry of Information Industry of the
People’s Republic of China............................................................................ 11
Table 6: Toxic or hazardous substances or elements with defined concentration limits 12
Table 7: Overview of operating modes ........................................................................ 18
Table 8: Return loss..................................................................................................... 19
Table 9: Absolute maximum ratings............................................................................. 20
Table 10: Board temperature ......................................................................................... 21
Table 11: Ambient temperature according to IEC 60068-2 (w/o forced air circulation).. 21
Table 12: Ambient temperature with forced air circulation (air speed 0.9m/s)............... 21
Table 13: Storage conditions ......................................................................................... 22
Table 14: Summary of reliability test conditions............................................................. 23
Table 15: Power supply ratings...................................................................................... 25
Table 16: Ordering information DF12 series.................................................................. 27
Table 17: Electrical and mechanical characteristics of the Hirose DF12C connector.... 27
MC55i-W Hardware Interface Overview
Figures
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Figures
Figure 1: Pin assignment .............................................................................................. 24
Figure 2: MC55i-W – top view....................................................................................... 26
Figure 3: Hirose DF12C receptacle on MC55i-W.......................................................... 27
Figure 4: Header Hirose DF12 series............................................................................ 27
Figure 5: Mechanical dimensions of Hirose DF12 connector........................................ 28
Figure 6: Reference equipment for approval................................................................. 29
MC55i-W Hardware Interface Overview
1 Introduction
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1 Introduction
This document1 describes the hardware of the MC55i-W module that connects to the cellular
device application and the air interface. It helps you quickly retrieve interface specifications,
electrical and mechanical details and information on the requirements to be considered for in-
tegrating further components.
1.1 Related documents
[1] MC55i-W AT Command Set
[2] MC55i-W Release Notes
Prior to using the MC55i-W modules or upgrading to a new firmware release, please carefully
read the latest product information.
For further information visit the Cinterion Wireless Modules Website:
http://www.cinterion.com
1. The document is effective only if listed in the appropriate Release Notes as part of the technical
documentation delivered with your Cinterion Wireless Modules product.
MC55i-W Hardware Interface Overview
1.2 Terms and Abbreviations
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1.2 Terms and Abbreviations
Abbreviation Description
ADC Analog-to-Digital Converter
AFC Automatic Frequency Control
AGC Automatic Gain Control
ANSI American National Standards Institute
ARFCN Absolute Radio Frequency Channel Number
ARP Antenna Reference Point
ASC0 / ASC1 Asynchronous Serial Controller. Abbreviations used for first and second serial inter-
face of MC55i-W
ASIC Application Specific Integrated Circuit
B Thermistor Constant
B2B Board-to-board connector
BER Bit Error Rate
BTS Base Transceiver Station
CB or CBM Cell Broadcast Message
CE Conformité Européene (European Conformity)
CHAP Challenge Handshake Authentication Protocol
CPU Central Processing Unit
CS Coding Scheme
CSD Circuit Switched Data
CTS Clear to Send
DAC Digital-to-Analog Converter
DAI Digital Audio Interface
dBm0 Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law
DCE Data Communication Equipment (typically modems, e.g. GSM module)
DCS 1800 Digital Cellular System, also referred to as PCN
DRX Discontinuous Reception
DSB Development Support Box
DSP Digital Signal Processor
DSR Data Set Ready
DTE Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM
application)
DTR Data Terminal Ready
DTX Discontinuous Transmission
EFR Enhanced Full Rate
EGSM Enhanced GSM
MC55i-W Hardware Interface Overview
1.2 Terms and Abbreviations
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EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
ETS European Telecommunication Standard
FCC Federal Communications Commission (U.S.)
FDMA Frequency Division Multiple Access
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPRS General Packet Radio Service
GSM Global Standard for Mobile Communications
HiZ High Impedance
HR Half Rate
I/O Input/Output
IC Integrated Circuit
IMEI International Mobile Equipment Identity
ISO International Standards Organization
ITU International Telecommunications Union
kbps kbits per second
LED Light Emitting Diode
Li-Ion Lithium-Ion
Mbps Mbits per second
MMI Man Machine Interface
MO Mobile Originated
MS Mobile Station (GSM module), also referred to as TE
MSISDN Mobile Station International ISDN number
MT Mobile Terminated
MTTF Mean time to failure
NTC Negative Temperature Coefficient
OEM Original Equipment Manufacturer
PA Power Amplifier
PAP Password Authentication Protocol
PBCCH Packet Switched Broadcast Control Channel
PCB Printed Circuit Board
PCL Power Control Level
PCM Pulse Code Modulation
PCN Personal Communications Network, also referred to as DCS 1800
PCS Personal Communication System, also referred to as GSM 1900
Abbreviation Description
MC55i-W Hardware Interface Overview
1.2 Terms and Abbreviations
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PDU Protocol Data Unit
PLL Phase Locked Loop
PPP Point-to-point protocol
PSU Power Supply Unit
R&TTE Radio and Telecommunication Terminal Equipment
RAM Random Access Memory
RF Radio Frequency
RMS Root Mean Square (value)
ROM Read-only Memory
RTC Real Time Clock
Rx Receive Direction
SAR Specific Absorption Rate
SELV Safety Extra Low Voltage
SIM card Subscriber Identification Module card; specifies a UICC with SIM application
SMS Short Message Service
SRAM Static Random Access Memory
TA Terminal adapter (e.g. GSM module)
TDMA Time Division Multiple Access
TE Terminal Equipment, also referred to as DTE
Tx Transmit Direction
UART Universal asynchronous receiver-transmitter
UICC USIM Integrated Circuit Card
UMTS Universal Mobile Telecommunications System
URC Unsolicited Result Code
USIM UMTS Subscriber Identification Module
USSD Unstructured Supplementary Service Data
VSWR Voltage Standing Wave Ratio
Phonebook abbreviations
FD SIM fixdialing phonebook
LD SIM last dialling phonebook (list of numbers most recently dialled)
MC Mobile Equipment list of unanswered MT calls (missed calls)
ME Mobile Equipment phonebook
ON Own numbers (MSISDNs) stored on SIM or ME
RC Mobile Equipment list of received calls
SM SIM phonebook
Abbreviation Description
MC55i-W Hardware Interface Overview
1.3 Regulatory and Type Approval Information
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1.3 Regulatory and Type Approval Information
1.3.1 Directives and Standards
MC55i-W has been designed to comply with the directives and standards listed below. It is the
responsibility of the application manufacturer to ensure compliance of the final product with all
provisions of the applicable directives and standards as well as with the technical specifications
provided in the "MC55i-W Hardware Interface Description".2
2. Manufacturers of applications which can be used in the US shall ensure that their applications have a
PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module.
Table 1: Directives
99/05/EC Directive of the European Parliament and of the council of 9 March 1999
on radio equipment and telecommunications terminal equipment and the
mutual recognition of their conformity (in short referred to as R&TTE Direc-
tive 1999/5/EC).
The product is labeled with the CE conformity mark
2002/95/EC Directive of the European Parliament and of the Council
of 27 January 2003 on the restriction of the use of certain
hazardous substances in electrical and electronic equip-
ment (RoHS)
Table 2: Standards of North American type approval
CFR Title 47 Code of Federal Regulations, Part 22 and Part 24 (Telecommunications,
PCS); US Equipment Authorization FCC
UL 60 950 Product Safety Certification (Safety requirements)
NAPRD.03 V5.4 Overview of PCS Type certification review board Mobile Equipment Type
Certification and IMEI control
PCS Type Certification Review board (PTCRB)
RSS132 (Issue2)
RSS133 (Issue5) Canadian Standard
Table 3: Standards of European type approval
3GPP TS 51.010-1 Digital cellular telecommunications system (Phase 2); Mobile Station (MS)
conformance specification
ETSI EN 301 511 V9.0.2 Candidate Harmonized European Standard (Telecommunications series)
Global System for Mobile communications (GSM); Harmonized standard
for mobile stations in the GSM 900 and DCS 1800 bands covering essen-
tial requirements under article 3.2 of the R&TTE directive (1999/5/EC)
(GSM 13.11 version 7.0.1 Release 1998)
GCF-CC V3.40 Global Certification Forum - Certification Criteria
ETSI EN 301 489-1
V1.8.1 Candidate Harmonized European Standard (Telecommunications series)
Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-
tro Magnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 1: Common Technical Requirements
MC55i-W Hardware Interface Overview
1.3 Regulatory and Type Approval Information
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ETSI EN 301 489-7
V1.3.1 Candidate Harmonized European Standard (Telecommunications series)
Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Elec-
tro Magnetic Compatibility (EMC) standard for radio equipment and ser-
vices; Part 7: Specific conditions for mobile and portable radio and ancillary
equipment of digital cellular radio telecommunications systems (GSM and
DCS)
EN 60950-1:2006 Safety of information technology equipment
Table 4: Requirements of quality
IEC 60068 Environmental testing
DIN EN 60529 IP codes
Table 5: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11363-2006 “Requirements for Concentration Limits for Certain Hazardous Sub-
stances in Electronic Information Products” (2006-06).
SJ/T 11364-2006 “Marking for Control of Pollution Caused by Electronic
Information Products” (2006-06).
According to the “Chinese Administration on the Control
of Pollution caused by Electronic Information Products”
(ACPEIP) the EPUP, i.e., Environmental Protection Use
Period, of this product is 20 years as per the symbol
shown here, unless otherwise marked. The EPUP is valid only as long as
the product is operated within the operating limits described in the Cin-
terion Wireless Modules Hardware Interface Description.
Please see Table 6 for an overview of toxic or hazardous substances or
elements that might be contained in product parts in concentrations
above the limits defined by SJ/T 11363-2006.
Table 3: Standards of European type approval
MC55i-W Hardware Interface Overview
1.3 Regulatory and Type Approval Information
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1.3.2 SAR Requirements Specific to Portable Mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module
must be in accordance with the guidelines for human exposure to radio frequency energy. This
requires the Specific Absorption Rate (SAR) of portable MC55i-W based applications to be
evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for portable use. For European and US
markets the relevant directives are mentioned below. It is the responsibility of the manufacturer
of the final product to verify whether or not further standards, recommendations or directives
are in force outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to Electro-
magnetic Fields (EMFs) from Mobile Telecommunication Equipment
(MTE) in the frequency range 30MHz - 6GHz
Products intended for sale on European markets
EN 50360: Product standard to demonstrate the compliance of mobile phones
with the basic restrictions related to human exposure to electro-
magnetic fields (300MHz - 3GHz)
MC55i-W Hardware Interface Overview
1.3 Regulatory and Type Approval Information
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1.3.3 Safety Precautions
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating MC55i-W. Manufacturers of the
cellular terminal are advised to convey the following safety information to users and operating
personnel and to incorporate these guidelines into all manuals supplied with the product. Fail-
ure to comply with these precautions violates safety standards of design, manufacture and in-
tended use of the product. Cinterion Wireless Modules GmbH assumes no liability for customer
failure to comply with these precautions.
When in a hospital or other health care facility, observe the restrictions on the use of
mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guide-
lines posted in sensitive areas. Medical equipment may be sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment and hearing
aids can be affected by interference from cellular terminals or mobiles placed close to
the device. If in doubt about potential danger, contact the physician or the manufac-
turer of the device to verify that the equipment is properly shielded. Pacemaker
patients are advised to keep their hand-held mobile away from the pacemaker, while
it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it can-
not be switched on inadvertently. The operation of wireless appliances in an aircraft is
forbidden to prevent interference with communications systems. Failure to observe
these instructions may lead to the suspension or denial of cellular services to the
offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any electri-
cal equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. Remember that interference can occur if it is used close to TV sets,
radios, computers or inadequately shielded equipment. Follow any special regulations
and always switch off the cellular terminal or mobile wherever forbidden, or when you
suspect that it may cause interference or danger.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when driv-
ing a vehicle, unless it is securely mounted in a holder for handsfree operation. Before
making a call with a hand-held terminal or mobile, park the vehicle.
Handsfree devices must be installed by qualified personnel. Faulty installation or oper-
ation can constitute a safety hazard.
IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular networks.
Because of this, connection cannot be guaranteed at all times under all conditions.
Therefore, you should never rely solely upon any wireless device for essential commu-
nications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile must be
switched on and in a service area with adequate cellular signal strength.
Some networks do not allow for emergency calls if certain network services or phone
features are in use (e.g. lock functions, fixed dialling etc.). You may need to deactivate
those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the cellular termi-
nal or mobile.
SOS
MC55i-W Hardware Interface Overview
2 Product Concept
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2 Product Concept
2.1 MC55i-W Key Features at a Glance
Feature Implementation
General
Frequency bands Quad band: GSM 850/900/1800/1900MHz
GSM class Small MS
Output power (according
to Release 99, V5) Class 4 (+33dBm ±2dB) for EGSM850
Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
Power supply 3.3V < VBATT+ < 4.8V
Operating temperature
(board temperature) Normal operation: -30°C to +85°C
Restricted operation: -40°C to -30°C and +85°C to +90°C
Physical Dimensions: 32.5mm x 35mm x max. 3.1mm
Weight: approx. 6g
RoHS All hardware components fully compliant with EU RoHS Directive
GSM / GPRS features
Data transfer GPRS:
• Multislot Class 10
• Full PBCCH support
• Mobile Station Class B
• Coding Scheme 1 – 4
CSD:
• V.110, RLP, non-transparent
• 2.4, 4.8, 9.6, 14.4kbps
•USSD
PPP-stack for GPRS data transfer
SMS Point-to-point MT and MO
Cell broadcast
Text and PDU mode
Storage: SIM card plus 25 SMS locations in mobile equipment
Transmission of SMS alternatively over CSD or GPRS. Preferred mode can
be user defined.
Fax Group 3; Class 2
Audio Speech codecs:
• Half Rate (ETS 06.20)
• Full Rate (ETS 06.10)
• Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
• Adaptive Multi Rate AMR
Handsfree operation, echo cancellation, noise reduction, 7 different ringing
tones / melodies
MC55i-W Hardware Interface Overview
2.1 MC55i-W Key Features at a Glance
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Software
AT commands Hayes 3GPP TS 27.007, TS 27.005, Cinterion Wireless Modules
AT commands for RIL compatibility
SIM Application Toolkit Supports SAT class 3, GSM 11.14 Release 99, support of letter class “c”
TCP/IP stack Protocols: TCP, UDP, HTTP, FTP, SMTP, POP3
Access by AT commands
Firmware update Windows executable for update over serial interface ASC0
Interfaces
2 serial interfaces ASC0:
• 8-wire modem interface with status and control lines, unbalanced, asyn-
chronous
• Fixed bit rates: 300bps to 230,000bps
• Autobauding: 1,200bps to 230,000bps
• Supports RTS0/CTS0 hardware handshake and software XON/XOFF
flow control.
• Multiplex ability according to GSM 07.10 Multiplexer Protocol.
ASC1:
• 4-wire, unbalanced asynchronous interface
• Fixed bit rates: 300bps to 230,000bps
• Supports RTS1/CTS1 hardware handshake and software XON/XOFF
flow control
Audio 1 analog interface
1 digital interface (PCM)
SIM interface Supported SIM cards: 3V, 1.8V
External SIM card reader has to be connected via interface connector (note
that card reader is not part of MC55i-W)
Antenna 50. External antenna can be connected via antenna connector or solder-
able pad.
Module interface 50-pin board-to-board connector
Power on/off, Reset
Power on/off Switch-on by hardware pin IGT
Switch-off by AT command (AT^SMSO)
Automatic switch-off in case of critical temperature and voltage conditions
Reset Orderly shutdown and reset by AT command
Special features
Real time clock Timer functions via AT commands
Phonebook SIM and phone
TTY/CTM support Integrated CTM modem
Evaluation kit
DSB75 DSB75 Evaluation board designed to test and type approve Cinterion Wire-
less Module and provide a sample configuration for application engineer-
ing. A special adapter is required to connect the module to the DSB75.
Feature Implementation
MC55i-W Hardware Interface Overview
3 Application Interface
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3 Application Interface
MC55i-W is equipped with a 50-pin board-to-board connector that connects to the external ap-
plication. The host interface incorporates several sub-interfaces: power supply, SIM interface,
serial interface ASC0, serial interface ASC1, analog audio interface, and DAI/PCM interface
(for details see Chapter 2 and Section 5.5).
MC55i-W Hardware Interface Overview
3.1 Operating Modes
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3.1 Operating Modes
The table below briefly summarizes the various operating modes referred to in the following
sections.
Table 7: Overview of operating modes
Mode Function
Normal operation GSM / GPRS
SLEEP Various powersave modes set with AT+CFUN command.
Software is active to minimum extent. If the module was reg-
istered to the GSM network in IDLE mode, it is registered and
paging with the BTS in SLEEP mode, too. Power saving can
be chosen at different levels: The NON-CYCLIC SLEEP mode
(AT+CFUN=0) disables the AT interface. The CYCLIC SLEEP
modes AT+CFUN= 7 and 9 alternatingly activate and deacti-
vate the AT interfaces to allow permanent access to all AT
commands.
GSM IDLE Software is active. Once registered to the GSM network, pag-
ing with BTS is carried out. The module is ready to send and
receive.
GSM TALK Connection between two subscribers is in progress. Power
consumption depends on network coverage individual set-
tings, such as DTX off/on, FR/EFR/HR, hopping sequences,
antenna.
GPRS IDLE Module is ready for GPRS data transfer, but no data is cur-
rently sent or received. Power consumption depends on net-
work settings and GPRS configuration (e.g. multislot settings).
GPRS DATA GPRS data transfer in progress. Power consumption depends
on network settings (e.g. power control level), uplink / down-
link data rates and GPRS configuration (e.g. used multislot
settings).
Power Down Normal shutdown after sending the AT^SMSO command. Only a voltage regulator
is active for powering the RTC. Software is not active. Interfaces are not accessi-
ble. Operating voltage (connected to BATT+) remains applied.
Alarm mode Restricted operation launched by RTC alert function while the module is in Power
Down mode. Module will not be registered to GSM network. Limited number of AT
commands is accessible.
MC55i-W Hardware Interface Overview
4 Antenna Interface
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4 Antenna Interface
The RF interface has an impedance of 50. MC55i-W is capable of sustaining a total mismatch
at the antenna connector or pad without any damage, even when transmitting at maximum RF
power.
The external antenna must be matched properly to achieve best performance regarding radi-
ated power, DC-power consumption and harmonic suppression. Matching networks are not in-
cluded on the MC55i-W PCB and should be placed in the host application.
Regarding the return loss MC55i-W provides the following values:
The connection of the antenna or other equipment must be decoupled from DC voltage. This
is necessary because the antenna connector is DC coupled to ground via an inductor for ESD
protection.
Table 8: Return loss
State of module Return loss of module Recommended return loss of application
Receive > 8dB > 12dB
Transmit not applicable > 12dB
Idle < 5dB not applicable
MC55i-W Hardware Interface Overview
5 Electrical, Reliability and Radio Characteristics
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5 Electrical, Reliability and Radio Characteristics
5.1 Absolute Maximum Ratings
Absolute maximum ratings for supply voltage and voltages on digital and analog pins of MC55i-
W are listed in Table 9. Exceeding these values will cause permanent damage to MC55i-W.
Table 9: Absolute maximum ratings
Parameter Min Max Unit
Supply voltage BATT+ -0.3 +6.0 V
Voltage at digital pins in normal operation -0.3 +3.3 V
Voltage at all digital pins in Power Down mode -0.3 +0.3 V
Voltage at SIM interface, CCVCC 1.8V in normal Operation -0.3 +2.2 V
Voltage at SIM interface, CCVCC 2.85V in normal Operation -0.3 +3.3 V
Voltage at analogue pins in normal operation -0.3 +3.0 V
Voltage at analogue pins in Power Down mode -0.3 +0.3 V
VDDLP -0.3 +2.5 V
MC55i-W Hardware Interface Overview
5.2 Operating Temperatures
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5.2 Operating Temperatures
Please note that the module’s lifetime, i.e., the MTTF (mean time to failure) may be reduced, if
operated outside the restriced temperature range. A special URC reports whether the module
enters or leaves the restriced temperature range (see [1]; AT^SCTM).
Note that within the specified operating temperature ranges the board temperature may vary
to a great extent depending on operating mode, used frequency band, radio output power and
current supply voltage.
When data are transmitted over GPRS the quad band module variant automatically reverts to
a lower Multislot Class if the temperature rises to the limit specified for normal operation and,
vice versa, returns to the higher Multislot Class if the temperature is back to normal.
Table 10: Board temperature
Parameter Min Typ Max Unit
Normal operation -30 +25 +85 °C
Restricted operation -40 to -30 +85 to +90 °C
Automatic shutdown1
Temperature measured on MC55i-W board
1. Due to temperature measurement uncertainty, a tolerance of ±3°C on the thresholds may occur.
<-40 --- >+90 °C
Table 11: Ambient temperature according to IEC 60068-2 (w/o forced air circulation)
Parameter Min Typ Max Unit
GSM Call @ max. RF-Power -40 +75 °C
GPRS Class 8 @ max. RF-Power -40 +75 °C
GPRS Class 10 @ max. RF-Power (quad band only) -40 +60 °C
Table 12: Ambient temperature with forced air circulation (air speed 0.9m/s)
Parameter Min Typ Max Unit
GSM Call @ max. RF-Power -40 +80 °C
GPRS Class 8 @ max. RF-Power -40 +80 °C
GPRS Class 10 @ max. RF-Power (quad band only) -40 +70 °C
MC55i-W Hardware Interface Overview
5.3 Storage Conditions
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5.3 Storage Conditions
The conditions stated below are only valid for modules in their original packed state in weather
protected, non-temperature-controlled storage locations. Normal storage time under these
conditions is 12 months maximum.
Table 13: Storage conditions
Type Condition Unit Reference
Air temperature:
Low
High -40
+85 °C ETS 300 019-2-1: T1.2, IEC 60068-2-1 Ab
ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb
Humidity relative:
Low
High
Condens.
10
90 at 30°C
90-100 at 30°C
%---
ETS 300 019-2-1: T1.2, IEC 60068-2-56
Cb
ETS 300 019-2-1: T1.2, IEC 60068-2-30
Db
Air pressure:
Low
High 70
106 kPa IEC TR 60271-3-1: 1K4
IEC TR 60271-3-1: 1K4
Movement of surrounding air 1.0 m/s IEC TR 60271-3-1: 1K4
Water:
rain, dripping, icing and frosting Not allowed --- ---
Radiation:
Solar
Heat 1120
600 W/m2ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb
ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb
Chemically active substances Not recom-
mended IEC TR 60271-3-1: 1C1L
Mechanically active substances Not recom-
mended IEC TR 60271-3-1: 1S1
Vibration sinusoidal:
Displacement
Acceleration
Frequency range
1.5
5
2-9 9-200
mm
m/s2
Hz
IEC TR 60271-3-1: 1M2
Shocks:
Shock spectrum
Duration
Acceleration
semi-sinusoidal
1
50 ms
m/s2
IEC 60068-2-27 Ea
MC55i-W Hardware Interface Overview
5.4 Reliability Characteristics
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5.4 Reliability Characteristics
The test conditions stated below are an extract of the complete test specifications.
Table 14: Summary of reliability test conditions
Type of test Conditions Standard
Vibration Frequency range: 10-20 Hz; acceleration: 3.1mm
amplitude
Frequency range: 20-500 Hz; acceleration: 5g
Duration: 2h per axis = 10 cycles; 3 axes
DIN IEC 60068-2-6
Shock half-sinus Acceleration: 500g
Shock duration: 1msec
1 shock per axis
6 positions (± x, y and z)
DIN IEC 60068-2-27
Dry heat Temperature: +70 ±2°C
Test duration: 16 h
Humidity in the test chamber: < 50%
EN 60068-2-2 Bb ETS
300019-2-7
Temperature
change (shock) Low temperature: -40°C ±2°C
High temperature: +85°C ±2°C
Changeover time: < 30s (dual chamber system)
Test duration: 1 h
Number of repetitions: 100
DIN IEC 60068-2-14 Na
ETS 300019-2-7
Damp heat cyclic High temperature: +55°C ±2°C
Low temperature: +25°C ±2°C
Humidity: 93% ±3%
Number of repetitions: 6
Test duration: 12h + 12h
DIN IEC 60068-2-30 Db
ETS 300019-2-5
Cold (constant
exposure) Temperature: -40 ±2°C
Test duration: 16 h DIN IEC 60068-2-1
MC55i-W Hardware Interface Overview
5.5 Electrical Specifications of the Application Interface
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5.5 Electrical Specifications of the Application Interface
The Hirose DF12C board-to-board connector on MC55i-W is a 50-pin double-row receptacle.
The names and the positions of the pins can be seen from Figure 2 which shows the top view
of MC55i-W.
Figure 1: Pin assignment
1 CCCLK Not connected 50
2 CCVCC Not connected 49
3 CCIO EPP 48
4 CCRST EPN 47
5 CCIN VMICN 46
6 CCGND VMICP 45
7RXDDAI MICP 44
8TFSDAI MICN 43
9SCLK AGND 42
10 TXDDAI IGT 41
11 RFSDAI EMERG_RST 40
12 Do not use DCD0 39
13 STATUS CTS1 38
14 RXD1 CTS0 37
15 RXD0 RTS1 36
16 TXD1 DTR0 35
17 TXD0 RTS0 34
18 VDDLP DSR0 33
19 Not connected RING0 32
20 Not connected VDD 31
21 GND BATT+ 30
22 GND BATT+ 29
23 GND BATT+ 28
24 GND BATT+ 27
25 GND BATT+ 26
MC55i-W Hardware Interface Overview
5.6 Power Supply Ratings
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5.6 Power Supply Ratings
Table 15: Power supply ratings
Description Conditions Min Typ Max Unit
BATT+ Supply voltage Directly measured at module.
Voltage must stay within the min/
max values, including voltage drop,
ripple and spikes.
3.3 4.0 4.8 V
Maximum allowed
voltage drop during
transmit burst
Normal condition, power control
level for Pout max
400 mV
Voltage ripple Normal condition, power control
level for Pout max
@ f<250kHz
@ f>250kHz 105
30
mVpp
IVDDLP OFF state supply
current RTC backup @ BATT+ = 0V 6.0 µA
IBATT+1
1. With an impedance of ZLOAD=50Ohm at the antenna connector.
OFF state supply
current POWER DOWN mode 45 µA
Average supply
current SLEEP mode2 @ DRX = 9
2. ASC0, ASC1 inactive
Measurements start 6 minutes after switching on the module,
Averaging times: SLEEP mode - 3 minutes; transfer modes - 1.5 minutes,
Communication tester settings: no neighbour cells, no cell reselection etc.,
RMC (Reference Measurement Channel)
1.3 mA
SLEEP mode2 @ DRX = 5 1.6 mA
SLEEP mode2 @ DRX = 2 2.2 mA
IDLE mode2 @ DRX = 2 9.5 mA
Voice call GSM850/900, PCL=5 180 mA
GPRS data transfer
GSM850/900 PCL=5, (1Tx/ 4Rx) 170 mA
GPRS data transfer
GSM850/900 PCL=5, (2Tx/ 3Rx) 310 mA
Voice call GSM1800/1900, PCL=0 135 mA
GPRS data transfer
GSM1800/1900 PCL=0, (1Tx/ 4Rx) 130 mA
GPRS data transfer
GSM1800/1900 PCL=0, (2Tx/ 3Rx) 230 mA
Voice call GSM850, PCL=5 1.35 1.383A
Peak current during
GSM transmission
burst
Voice call GSM900, PCL=5 1.30 1.353
3. At total mismatch.
A
Voice call GSM1800, PCL=0 0.95 0.983A
Voice call GSM1900, PCL=0 0.89 0.923A
MC55i-W Hardware Interface Overview
6 Mechanics
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6 Mechanics
The following sections describe the mechanical dimensions of MC55i-W and give recommen-
dations for integrating MC55i-W into the host application.
6.1 Mechanical Dimensions of MC55i-W
Figure 2 shows the top view on MC55i-W and provides an overview of the mechanical dimen-
sions of the board.
Length: 35mm
Width: 32.5mm
Height: 3.1mm (including board-to-board connector), 2.9mm (excluding connector)
Weight: 6g
Figure 2: MC55i-W – top view
Pin 1
Pin 50
MC55i-W Hardware Interface Overview
6.2 Board-to-Board Connector
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6.2 Board-to-Board Connector
This section provides specifications for the 50-pin board-to-board connector which serves as
physical interface to the host application. The receptacle assembled on the MC55i-W PCB is
type Hirose DF12C. Mating headers from Hirose are available in different stacking heights.
Note: The headers listed above are without boss and metal fitting. Please contact Hirose for
details on other types of mating headers. Asterixed HRS numbers denote different types of
packaging.
Figure 3: Hirose DF12C receptacle on MC55i-W Figure 4: Header Hirose DF12 series
Table 16: Ordering information DF12 series
Item Part number Stacking
height (mm) HRS number
Receptacle on MC55i-W DF12C(3.0)-50DS-0.5V(81) 3 - 5 537-0694-9-81
Headers DF12 series DF12E(3.0)-50DP-0.5V(81)
DF12E(3.5)-50DP-0.5V(81)
DF12E(4.0)-50DP-0.5V(81)
DF12E(5.0)-50DP-0.5V(81)
3.0
3.5
4.0
5.0
537-0834-6-**
537-0534-2-**
537-0559-3-**
537-0584-0-**
Table 17: Electrical and mechanical characteristics of the Hirose DF12C connector
Parameter Specification (50 pin board-to-board connector)
Number of contacts 50
Quantity delivered 2000 connectors per tape & reel
Voltage 50V
Rated current 0.3A max per contact
Resistance 0.05 per contact
Dielectric withstanding voltage 500V RMS min
Operating temperature -45°C...+125°C
Contact material phosphor bronze (surface: gold plated)
Insulator material PA , beige natural
Stacking height 3.0 mm ; 3.5 mm ; 4.0 mm ; 5.0 mm
Insertion force 21.8N
Withdrawal force 1st 10N
Withdrawal force 50th 10N
Maximum connection cycles 50
MC55i-W Hardware Interface Overview
7 Reference Approval
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7 Reference Approval
7.1 Reference Equipment for Type Approval
The Cinterion Wireless Modules reference setup submitted to type approve MC55i-W consists
of the following components:
Figure 6: Reference equipment for approval
Antenna
GSM Antenna with 1m
cable
ASC0
PC
Power
supply
GSM / GPRS / UMTS
Base Station
DSB75
Audio Test System
Handset
ASC1
SIM Card
SMA
Audio
Module
Module
Module extern with flexible
cable and 50-to-80 adapter
to DSB75
MC55i-W Hardware Interface Overview
7.2 Compliance with FCC Rules and Regulations
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7.2 Compliance with FCC Rules and Regulations
The Equipment Authorization Certification for the Cinterion Wireless Modules reference appli-
cation described in Section 7.1 will be registered under the following identifiers:
FCC Identifier: QIPMC55I-W
Industry Canada Certification Number: 7830A-MC55IW
Granted to Cinterion Wireless Modules GmbH
Manufacturers of mobile or fixed devices incorporating MC55i-W modules are authorized to
use the FCC Grants and Industry Canada Certificates of the MC55i-W modules for their own
final products according to the conditions referenced in these documents. In this case, the FCC
label of the module shall be visible from the outside, or the host device shall bear a second label
stating "Contains FCC ID QIPMC55I-W", and accordingly "Contains IC 7830A-MC55IW".
IMPORTANT:
Manufacturers of portable applications incorporating MC55i-W modules are required to have
their final product certified and apply for their own FCC Grant and Industry Canada Certificate
related to the specific portable mobile. This is mandatory to meet the SAR requirements for por-
table mobiles (see Section 1.3.2 for detail).
Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.