THALES DIS AlS Deutschland MC55I-W Quadband GSM/GPRS Module User Manual hio

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MC55i-W
Version:
DocId:
01.301
MC55i-W_HIO_v01.301
Hardware Interface Overview

MC55-W Hardware Interface Overview

Document Name:
MC55-W Hardware Interface Overview
Version:
01.301
Date:
2011-3-8
DocId:
MC55i-W_HIO_v01.301
Status
Confidential / Released
Supported Products:
MC55i-W
GENERAL NOTE
THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY
EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON CINTERION PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT
ARE SUBJECT TO CHANGE AT CINTERION'S DISCRETION. CINTERION WIRELESS MODULES
GMBH GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT
TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS;
DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT
AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN
"AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM
EXTENT PERMITTED BY APPLICABLE LAW, CINTERION WIRELESS MODULES GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED
PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE
SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW.
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will
be held liable for payment of damages. All rights created by patent grant or registration of a utility model
or design patent are reserved.
Copyright © 2011, Cinterion Wireless Modules GmbH
Trademark Notice
Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the
United States and/or other countries. All other registered trademarks or trademarks mentioned in this
document are property of their respective owners.
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MC55i-W Hardware Interface Overview
Contents
30

Contents
Introduction ................................................................................................................. 6
1.1
Related documents ............................................................................................ 6
1.2
Terms and Abbreviations ................................................................................... 7
1.3
Regulatory and Type Approval Information ..................................................... 10
1.3.1 Directives and Standards.................................................................... 10
1.3.2 SAR Requirements Specific to Portable Mobiles................................ 13
1.3.3 Safety Precautions.............................................................................. 14
Product Concept ....................................................................................................... 15
2.1
MC55i-W Key Features at a Glance ................................................................ 15
Application Interface................................................................................................. 17
3.1
Operating Modes ............................................................................................. 18
Antenna Interface...................................................................................................... 19
Electrical, Reliability and Radio Characteristics.................................................... 20
5.1
Absolute Maximum Ratings ............................................................................. 20
5.2
Operating Temperatures.................................................................................. 21
5.3
Storage Conditions .......................................................................................... 22
5.4
Reliability Characteristics ................................................................................. 23
5.5
Electrical Specifications of the Application Interface........................................ 24
5.6
Power Supply Ratings...................................................................................... 25
Mechanics.................................................................................................................. 26
6.1
Mechanical Dimensions of MC55i-W ............................................................... 26
6.2
Board-to-Board Connector............................................................................... 27
6.2.1 Mechanical Dimensions of the Hirose DF12 Connector ..................... 28
Reference Approval .................................................................................................. 29
7.1
Reference Equipment for Type Approval ......................................................... 29
7.2
Compliance with FCC Rules and Regulations ................................................. 30
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MC55i-W Hardware Interface Overview
Tables
92

Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:
Table 15:
Table 16:
Table 17:
Directives .......................................................................................................
Standards of North American type approval ..................................................
Standards of European type approval............................................................
Requirements of quality .................................................................................
Standards of the Ministry of Information Industry of the
People’s Republic of China ............................................................................
Toxic or hazardous substances or elements with defined concentration limits
Overview of operating modes ........................................................................
Return loss .....................................................................................................
Absolute maximum ratings.............................................................................
Board temperature .........................................................................................
Ambient temperature according to IEC 60068-2 (w/o forced air circulation)..
Ambient temperature with forced air circulation (air speed 0.9m/s) ...............
Storage conditions .........................................................................................
Summary of reliability test conditions.............................................................
Power supply ratings......................................................................................
Ordering information DF12 series ..................................................................
Electrical and mechanical characteristics of the Hirose DF12C connector....
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MC55i-W Hardware Interface Overview
Figures
92

Figures
Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
Figure 6:
Pin assignment ..............................................................................................
MC55i-W – top view .......................................................................................
Hirose DF12C receptacle on MC55i-W..........................................................
Header Hirose DF12 series............................................................................
Mechanical dimensions of Hirose DF12 connector........................................
Reference equipment for approval.................................................................
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26
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MC55i-W Hardware Interface Overview
1 Introduction
14

Introduction
This document1 describes the hardware of the MC55i-W module that connects to the cellular
device application and the air interface. It helps you quickly retrieve interface specifications,
electrical and mechanical details and information on the requirements to be considered for integrating further components.
1.1
[1]
[2]
Related documents
MC55i-W AT Command Set
MC55i-W Release Notes
Prior to using the MC55i-W modules or upgrading to a new firmware release, please carefully
read the latest product information.
For further information visit the Cinterion Wireless Modules Website:
http://www.cinterion.com
1.
The document is effective only if listed in the appropriate Release Notes as part of the technical
documentation delivered with your Cinterion Wireless Modules product.
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1.2 Terms and Abbreviations
14
1.2

Terms and Abbreviations
Abbreviation
Description
ADC
Analog-to-Digital Converter
AFC
Automatic Frequency Control
AGC
Automatic Gain Control
ANSI
American National Standards Institute
ARFCN
Absolute Radio Frequency Channel Number
ARP
Antenna Reference Point
ASC0 / ASC1
Asynchronous Serial Controller. Abbreviations used for first and second serial interface of MC55i-W
ASIC
Application Specific Integrated Circuit
Thermistor Constant
B2B
Board-to-board connector
BER
Bit Error Rate
BTS
Base Transceiver Station
CB or CBM
Cell Broadcast Message
CE
Conformité Européene (European Conformity)
CHAP
Challenge Handshake Authentication Protocol
CPU
Central Processing Unit
CS
Coding Scheme
CSD
Circuit Switched Data
CTS
Clear to Send
DAC
Digital-to-Analog Converter
DAI
Digital Audio Interface
dBm0
Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law
DCE
Data Communication Equipment (typically modems, e.g. GSM module)
DCS 1800
Digital Cellular System, also referred to as PCN
DRX
Discontinuous Reception
DSB
Development Support Box
DSP
Digital Signal Processor
DSR
Data Set Ready
DTE
Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM
application)
DTR
Data Terminal Ready
DTX
Discontinuous Transmission
EFR
Enhanced Full Rate
EGSM
Enhanced GSM
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1.2 Terms and Abbreviations
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
Abbreviation
Description
EMC
Electromagnetic Compatibility
ESD
Electrostatic Discharge
ETS
European Telecommunication Standard
FCC
Federal Communications Commission (U.S.)
FDMA
Frequency Division Multiple Access
FR
Full Rate
GMSK
Gaussian Minimum Shift Keying
GPRS
General Packet Radio Service
GSM
Global Standard for Mobile Communications
HiZ
High Impedance
HR
Half Rate
I/O
Input/Output
IC
Integrated Circuit
IMEI
International Mobile Equipment Identity
ISO
International Standards Organization
ITU
International Telecommunications Union
kbps
kbits per second
LED
Light Emitting Diode
Li-Ion
Lithium-Ion
Mbps
Mbits per second
MMI
Man Machine Interface
MO
Mobile Originated
MS
Mobile Station (GSM module), also referred to as TE
MSISDN
Mobile Station International ISDN number
MT
Mobile Terminated
MTTF
Mean time to failure
NTC
Negative Temperature Coefficient
OEM
Original Equipment Manufacturer
PA
Power Amplifier
PAP
Password Authentication Protocol
PBCCH
Packet Switched Broadcast Control Channel
PCB
Printed Circuit Board
PCL
Power Control Level
PCM
Pulse Code Modulation
PCN
Personal Communications Network, also referred to as DCS 1800
PCS
Personal Communication System, also referred to as GSM 1900
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1.2 Terms and Abbreviations
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
Abbreviation
Description
PDU
Protocol Data Unit
PLL
Phase Locked Loop
PPP
Point-to-point protocol
PSU
Power Supply Unit
R&TTE
Radio and Telecommunication Terminal Equipment
RAM
Random Access Memory
RF
Radio Frequency
RMS
Root Mean Square (value)
ROM
Read-only Memory
RTC
Real Time Clock
Rx
Receive Direction
SAR
Specific Absorption Rate
SELV
Safety Extra Low Voltage
SIM card
Subscriber Identification Module card; specifies a UICC with SIM application
SMS
Short Message Service
SRAM
Static Random Access Memory
TA
Terminal adapter (e.g. GSM module)
TDMA
Time Division Multiple Access
TE
Terminal Equipment, also referred to as DTE
Tx
Transmit Direction
UART
Universal asynchronous receiver-transmitter
UICC
USIM Integrated Circuit Card
UMTS
Universal Mobile Telecommunications System
URC
Unsolicited Result Code
USIM
UMTS Subscriber Identification Module
USSD
Unstructured Supplementary Service Data
VSWR
Voltage Standing Wave Ratio
Phonebook abbreviations
FD
SIM fixdialing phonebook
LD
SIM last dialling phonebook (list of numbers most recently dialled)
MC
Mobile Equipment list of unanswered MT calls (missed calls)
ME
Mobile Equipment phonebook
ON
Own numbers (MSISDNs) stored on SIM or ME
RC
Mobile Equipment list of received calls
SM
SIM phonebook
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1.3 Regulatory and Type Approval Information
14
1.3
Regulatory and Type Approval Information
1.3.1
Directives and Standards

MC55i-W has been designed to comply with the directives and standards listed below. It is the
responsibility of the application manufacturer to ensure compliance of the final product with all
provisions of the applicable directives and standards as well as with the technical specifications
provided in the "MC55i-W Hardware Interface Description".2
Table 1: Directives
99/05/EC
Directive of the European Parliament and of the council of 9 March 1999
on radio equipment and telecommunications terminal equipment and the
mutual recognition of their conformity (in short referred to as R&TTE Directive 1999/5/EC).
The product is labeled with the CE conformity mark
2002/95/EC
Directive of the European Parliament and of the Council
of 27 January 2003 on the restriction of the use of certain
hazardous substances in electrical and electronic equipment (RoHS)
Table 2: Standards of North American type approval
CFR Title 47
Code of Federal Regulations, Part 22 and Part 24 (Telecommunications,
PCS); US Equipment Authorization FCC
UL 60 950
Product Safety Certification (Safety requirements)
NAPRD.03 V5.4
Overview of PCS Type certification review board Mobile Equipment Type
Certification and IMEI control
PCS Type Certification Review board (PTCRB)
RSS132 (Issue2)
RSS133 (Issue5)
Canadian Standard
Table 3: Standards of European type approval
3GPP TS 51.010-1
Digital cellular telecommunications system (Phase 2); Mobile Station (MS)
conformance specification
ETSI EN 301 511 V9.0.2
Candidate Harmonized European Standard (Telecommunications series)
Global System for Mobile communications (GSM); Harmonized standard
for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC)
(GSM 13.11 version 7.0.1 Release 1998)
GCF-CC V3.40
Global Certification Forum - Certification Criteria
ETSI EN 301 489-1
V1.8.1
Candidate Harmonized European Standard (Telecommunications series)
Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for radio equipment and services; Part 1: Common Technical Requirements
2.
Manufacturers of applications which can be used in the US shall ensure that their applications have a
PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module.
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1.3 Regulatory and Type Approval Information
14

Table 3: Standards of European type approval
ETSI EN 301 489-7
V1.3.1
Candidate Harmonized European Standard (Telecommunications series)
Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for radio equipment and services; Part 7: Specific conditions for mobile and portable radio and ancillary
equipment of digital cellular radio telecommunications systems (GSM and
DCS)
EN 60950-1:2006
Safety of information technology equipment
Table 4: Requirements of quality
IEC 60068
Environmental testing
DIN EN 60529
IP codes
Table 5: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11363-2006
“Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06).
SJ/T 11364-2006
“Marking for Control of Pollution Caused by Electronic
Information Products” (2006-06).
According to the “Chinese Administration on the Control
of Pollution caused by Electronic Information Products”
(ACPEIP) the EPUP, i.e., Environmental Protection Use
Period, of this product is 20 years as per the symbol
shown here, unless otherwise marked. The EPUP is valid only as long as
the product is operated within the operating limits described in the Cinterion Wireless Modules Hardware Interface Description.
Please see Table 6 for an overview of toxic or hazardous substances or
elements that might be contained in product parts in concentrations
above the limits defined by SJ/T 11363-2006.
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1.3 Regulatory and Type Approval Information
14

Table 6: Toxic or hazardous substances or elements with defined concentration limits
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1.3 Regulatory and Type Approval Information
14
1.3.2

SAR Requirements Specific to Portable Mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module
must be in accordance with the guidelines for human exposure to radio frequency energy. This
requires the Specific Absorption Rate (SAR) of portable MC55i-W based applications to be
evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for portable use. For European and US
markets the relevant directives are mentioned below. It is the responsibility of the manufacturer
of the final product to verify whether or not further standards, recommendations or directives
are in force outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1
Considerations for evaluation of human exposure to Electromagnetic Fields (EMFs) from Mobile Telecommunication Equipment
(MTE) in the frequency range 30MHz - 6GHz
Products intended for sale on European markets
EN 50360:
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Product standard to demonstrate the compliance of mobile phones
with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz)
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1.3 Regulatory and Type Approval Information
14
1.3.3

Safety Precautions
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating MC55i-W. Manufacturers of the
cellular terminal are advised to convey the following safety information to users and operating
personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Cinterion Wireless Modules GmbH assumes no liability for customer
failure to comply with these precautions.
When in a hospital or other health care facility, observe the restrictions on the use of
mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment and hearing
aids can be affected by interference from cellular terminals or mobiles placed close to
the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker
patients are advised to keep their hand-held mobile away from the pacemaker, while
it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is
forbidden to prevent interference with communications systems. Failure to observe
these instructions may lead to the suspension or denial of cellular services to the
offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. Remember that interference can occur if it is used close to TV sets,
radios, computers or inadequately shielded equipment. Follow any special regulations
and always switch off the cellular terminal or mobile wherever forbidden, or when you
suspect that it may cause interference or danger.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for handsfree operation. Before
making a call with a hand-held terminal or mobile, park the vehicle.
Handsfree devices must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard.
SOS
IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular networks.
Because of this, connection cannot be guaranteed at all times under all conditions.
Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile must be
switched on and in a service area with adequate cellular signal strength.
Some networks do not allow for emergency calls if certain network services or phone
features are in use (e.g. lock functions, fixed dialling etc.). You may need to deactivate
those features before you can make an emergency call.
Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.
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MC55i-W Hardware Interface Overview
2 Product Concept
16
Product Concept
2.1
MC55i-W Key Features at a Glance
Feature

Implementation
General
Frequency bands
Quad band: GSM 850/900/1800/1900MHz
GSM class
Small MS
Output power (according
to Release 99, V5)
Class 4 (+33dBm ±2dB) for EGSM850
Class 4 (+33dBm ±2dB) for EGSM900
Class 1 (+30dBm ±2dB) for GSM1800
Class 1 (+30dBm ±2dB) for GSM1900
Power supply
3.3V < VBATT+ < 4.8V
Operating temperature
(board temperature)
Normal operation: -30°C to +85°C
Restricted operation: -40°C to -30°C and +85°C to +90°C
Physical
Dimensions: 32.5mm x 35mm x max. 3.1mm
Weight: approx. 6g
RoHS
All hardware components fully compliant with EU RoHS Directive
GSM / GPRS features
Data transfer
GPRS:
• Multislot Class 10
• Full PBCCH support
• Mobile Station Class B
• Coding Scheme 1 – 4
CSD:
• V.110, RLP, non-transparent
• 2.4, 4.8, 9.6, 14.4kbps
• USSD
PPP-stack for GPRS data transfer
SMS
Point-to-point MT and MO
Cell broadcast
Text and PDU mode
Storage: SIM card plus 25 SMS locations in mobile equipment
Transmission of SMS alternatively over CSD or GPRS. Preferred mode can
be user defined.
Fax
Group 3; Class 2
Audio
Speech codecs:
• Half Rate (ETS 06.20)
• Full Rate (ETS 06.10)
• Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
• Adaptive Multi Rate AMR
Handsfree operation, echo cancellation, noise reduction, 7 different ringing
tones / melodies
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2.1 MC55i-W Key Features at a Glance
16
Feature

Implementation
Software
AT commands
Hayes 3GPP TS 27.007, TS 27.005, Cinterion Wireless Modules
AT commands for RIL compatibility
SIM Application Toolkit
Supports SAT class 3, GSM 11.14 Release 99, support of letter class “c”
TCP/IP stack
Protocols: TCP, UDP, HTTP, FTP, SMTP, POP3
Access by AT commands
Firmware update
Windows executable for update over serial interface ASC0
Interfaces
2 serial interfaces
ASC0:
• 8-wire modem interface with status and control lines, unbalanced, asynchronous
• Fixed bit rates: 300bps to 230,000bps
• Autobauding: 1,200bps to 230,000bps
• Supports RTS0/CTS0 hardware handshake and software XON/XOFF
flow control.
• Multiplex ability according to GSM 07.10 Multiplexer Protocol.
ASC1:
• 4-wire, unbalanced asynchronous interface
• Fixed bit rates: 300bps to 230,000bps
• Supports RTS1/CTS1 hardware handshake and software XON/XOFF
flow control
Audio
1 analog interface
1 digital interface (PCM)
SIM interface
Supported SIM cards: 3V, 1.8V
External SIM card reader has to be connected via interface connector (note
that card reader is not part of MC55i-W)
Antenna
50. External antenna can be connected via antenna connector or solderable pad.
Module interface
50-pin board-to-board connector
Power on/off, Reset
Power on/off
Switch-on by hardware pin IGT
Switch-off by AT command (AT^SMSO)
Automatic switch-off in case of critical temperature and voltage conditions
Reset
Orderly shutdown and reset by AT command
Special features
Real time clock
Timer functions via AT commands
Phonebook
SIM and phone
TTY/CTM support
Integrated CTM modem
Evaluation kit
DSB75
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DSB75 Evaluation board designed to test and type approve Cinterion Wireless Module and provide a sample configuration for application engineering. A special adapter is required to connect the module to the DSB75.
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3 Application Interface
18

Application Interface
MC55i-W is equipped with a 50-pin board-to-board connector that connects to the external application. The host interface incorporates several sub-interfaces: power supply, SIM interface,
serial interface ASC0, serial interface ASC1, analog audio interface, and DAI/PCM interface
(for details see Chapter 2 and Section 5.5).
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3.1 Operating Modes
18
3.1

Operating Modes
The table below briefly summarizes the various operating modes referred to in the following
sections.
Table 7: Overview of operating modes
Mode
Function
Normal operation
GSM / GPRS
SLEEP
Various powersave modes set with AT+CFUN command.
Software is active to minimum extent. If the module was registered to the GSM network in IDLE mode, it is registered and
paging with the BTS in SLEEP mode, too. Power saving can
be chosen at different levels: The NON-CYCLIC SLEEP mode
(AT+CFUN=0) disables the AT interface. The CYCLIC SLEEP
modes AT+CFUN= 7 and 9 alternatingly activate and deactivate the AT interfaces to allow permanent access to all AT
commands.
GSM IDLE
Software is active. Once registered to the GSM network, paging with BTS is carried out. The module is ready to send and
receive.
GSM TALK
Connection between two subscribers is in progress. Power
consumption depends on network coverage individual settings, such as DTX off/on, FR/EFR/HR, hopping sequences,
antenna.
GPRS IDLE
Module is ready for GPRS data transfer, but no data is currently sent or received. Power consumption depends on network settings and GPRS configuration (e.g. multislot settings).
GPRS DATA
GPRS data transfer in progress. Power consumption depends
on network settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot
settings).
Power Down
Normal shutdown after sending the AT^SMSO command. Only a voltage regulator
is active for powering the RTC. Software is not active. Interfaces are not accessible. Operating voltage (connected to BATT+) remains applied.
Alarm mode
Restricted operation launched by RTC alert function while the module is in Power
Down mode. Module will not be registered to GSM network. Limited number of AT
commands is accessible.
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MC55i-W Hardware Interface Overview
4 Antenna Interface
19
Antenna Interface
The RF interface has an impedance of 50. MC55i-W is capable of sustaining a total mismatch
at the antenna connector or pad without any damage, even when transmitting at maximum RF
power.
The external antenna must be matched properly to achieve best performance regarding radiated power, DC-power consumption and harmonic suppression. Matching networks are not included on the MC55i-W PCB and should be placed in the host application.
Regarding the return loss MC55i-W provides the following values:
Table 8: Return loss
State of module
Return loss of module
Recommended return loss of application
Receive
> 8dB
> 12dB
Transmit
not applicable
> 12dB
Idle
< 5dB
not applicable
The connection of the antenna or other equipment must be decoupled from DC voltage. This
is necessary because the antenna connector is DC coupled to ground via an inductor for ESD
protection.
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MC55i-W Hardware Interface Overview
5 Electrical, Reliability and Radio Characteristics
25
Electrical, Reliability and Radio Characteristics
5.1
Absolute Maximum Ratings
Absolute maximum ratings for supply voltage and voltages on digital and analog pins of MC55iW are listed in Table 9. Exceeding these values will cause permanent damage to MC55i-W.
Table 9: Absolute maximum ratings
Parameter
Min
Max
Unit
Supply voltage BATT+
-0.3
+6.0
Voltage at digital pins in normal operation
-0.3
+3.3
Voltage at all digital pins in Power Down mode
-0.3
+0.3
Voltage at SIM interface, CCVCC 1.8V in normal Operation
-0.3
+2.2
Voltage at SIM interface, CCVCC 2.85V in normal Operation -0.3
+3.3
Voltage at analogue pins in normal operation
-0.3
+3.0
Voltage at analogue pins in Power Down mode
-0.3
+0.3
VDDLP
-0.3
+2.5
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5.2 Operating Temperatures
25
5.2
Operating Temperatures
Please note that the module’s lifetime, i.e., the MTTF (mean time to failure) may be reduced, if
operated outside the restriced temperature range. A special URC reports whether the module
enters or leaves the restriced temperature range (see [1]; AT^SCTM).
Table 10: Board temperature
Parameter
Min
Typ
Max
Unit
Normal operation
-30
+25
+85
°C
Restricted operation
-40 to -30
+85 to +90 °C
Automatic shutdown
Temperature measured on MC55i-W board
1.
<-40
---
>+90
°C
Due to temperature measurement uncertainty, a tolerance of ±3°C on the thresholds may occur.
Table 11: Ambient temperature according to IEC 60068-2 (w/o forced air circulation)
Parameter
Min
GSM Call @ max. RF-Power
Typ
Max
Unit
-40
+75
°C
GPRS Class 8 @ max. RF-Power
-40
+75
°C
GPRS Class 10 @ max. RF-Power (quad band only)
-40
+60
°C
Max
Unit
Table 12: Ambient temperature with forced air circulation (air speed 0.9m/s)
Parameter
Min
Typ
GSM Call @ max. RF-Power
-40
+80
°C
GPRS Class 8 @ max. RF-Power
-40
+80
°C
GPRS Class 10 @ max. RF-Power (quad band only)
-40
+70
°C
Note that within the specified operating temperature ranges the board temperature may vary
to a great extent depending on operating mode, used frequency band, radio output power and
current supply voltage.
When data are transmitted over GPRS the quad band module variant automatically reverts to
a lower Multislot Class if the temperature rises to the limit specified for normal operation and,
vice versa, returns to the higher Multislot Class if the temperature is back to normal.
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5.3 Storage Conditions
25
5.3
Storage Conditions
The conditions stated below are only valid for modules in their original packed state in weather
protected, non-temperature-controlled storage locations. Normal storage time under these
conditions is 12 months maximum.
Table 13: Storage conditions
Type
Condition
Unit
Reference
Air temperature:
Low
High
-40
+85
°C
ETS 300 019-2-1: T1.2, IEC 60068-2-1 Ab
ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb
Humidity relative:
Low
High
Condens.
10
90 at 30°C
90-100 at 30°C
Air pressure:
Low
High
70
106
kPa
IEC TR 60271-3-1: 1K4
IEC TR 60271-3-1: 1K4
Movement of surrounding air
1.0
m/s
IEC TR 60271-3-1: 1K4
Water:
rain, dripping, icing and frosting Not allowed
---
---
Radiation:
Solar
Heat
W/m2 ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb
ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb
Chemically active substances
1120
600
Not recommended
IEC TR 60271-3-1: 1C1L
Mechanically active substances Not recommended
IEC TR 60271-3-1: 1S1
Vibration sinusoidal:
Displacement
Acceleration
Frequency range
1.5
2-9 9-200
mm
m/s2
Hz
Shocks:
Shock spectrum
Duration
Acceleration
semi-sinusoidal
50
ms
m/s2
MC55i-W_HIO_v01.301
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--ETS 300 019-2-1: T1.2, IEC 60068-2-56
Cb
ETS 300 019-2-1: T1.2, IEC 60068-2-30
Db
IEC TR 60271-3-1: 1M2
IEC 60068-2-27 Ea
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MC55i-W Hardware Interface Overview
5.4 Reliability Characteristics
25
5.4

Reliability Characteristics
The test conditions stated below are an extract of the complete test specifications.
Table 14: Summary of reliability test conditions
Type of test
Conditions
Standard
Vibration
Frequency range: 10-20 Hz; acceleration: 3.1mm
amplitude
Frequency range: 20-500 Hz; acceleration: 5g
Duration: 2h per axis = 10 cycles; 3 axes
DIN IEC 60068-2-6
Shock half-sinus
Acceleration: 500g
Shock duration: 1msec
1 shock per axis
6 positions (± x, y and z)
DIN IEC 60068-2-27
Dry heat
Temperature: +70 ±2°C
Test duration: 16 h
Humidity in the test chamber: < 50%
EN 60068-2-2 Bb ETS
300019-2-7
Temperature
change (shock)
Low temperature: -40°C ±2°C
High temperature: +85°C ±2°C
Changeover time: < 30s (dual chamber system)
Test duration: 1 h
Number of repetitions: 100
DIN IEC 60068-2-14 Na
High temperature: +55°C ±2°C
Low temperature: +25°C ±2°C
Humidity: 93% ±3%
Number of repetitions: 6
Test duration: 12h + 12h
DIN IEC 60068-2-30 Db
Temperature: -40 ±2°C
Test duration: 16 h
DIN IEC 60068-2-1
Damp heat cyclic
Cold (constant
exposure)
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ETS 300019-2-5
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MC55i-W Hardware Interface Overview
5.5 Electrical Specifications of the Application Interface
25
5.5
Electrical Specifications of the Application Interface
The Hirose DF12C board-to-board connector on MC55i-W is a 50-pin double-row receptacle.
The names and the positions of the pins can be seen from Figure 2 which shows the top view
of MC55i-W.
CCCLK
Not connected
50
CCVCC
Not connected
49
CCIO
EPP
48
CCRST
EPN
47
CCIN
VMICN
46
CCGND
VMICP
45
RXDDAI
MICP
44
TFSDAI
MICN
43
SCLK
AGND
42
10
TXDDAI
IGT
41
11
RFSDAI
EMERG_RST
40
12
Do not use
DCD0
39
13
STATUS
CTS1
38
14
RXD1
CTS0
37
15
RXD0
RTS1
36
16
TXD1
DTR0
35
17
TXD0
RTS0
34
18
VDDLP
DSR0
33
19
Not connected
RING0
32
20
Not connected
VDD
31
21
GND
BATT+
30
22
GND
BATT+
29
23
GND
BATT+
28
24
GND
BATT+
27
25
GND
BATT+
26
Figure 1: Pin assignment
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MC55i-W Hardware Interface Overview
5.6 Power Supply Ratings
25
5.6
Power Supply Ratings
Table 15: Power supply ratings
BATT+
Description
Conditions
Min
Typ
Max
Unit
Supply voltage
Directly measured at module.
Voltage must stay within the min/
max values, including voltage drop,
ripple and spikes.
3.3
4.0
4.8
Maximum allowed
voltage drop during
transmit burst
Normal condition, power control
level for Pout max
400
mV
Voltage ripple
Normal condition, power control
level for Pout max
@ f<250kHz
@ f>250kHz
mVpp
105
30
IVDDLP
OFF state supply
current
RTC backup @ BATT+ = 0V
6.0
µA
IBATT+1
OFF state supply
current
POWER DOWN mode
45
µA
Average supply
current
SLEEP mode2 @ DRX = 9
1.3
mA
1.6
mA
2.2
mA
IDLE mode @ DRX = 2
9.5
mA
Voice call GSM850/900, PCL=5
180
mA
GPRS data transfer
GSM850/900 PCL=5, (1Tx/ 4Rx)
170
mA
GPRS data transfer
GSM850/900 PCL=5, (2Tx/ 3Rx)
310
mA
Voice call GSM1800/1900, PCL=0
135
mA
GPRS data transfer
GSM1800/1900 PCL=0, (1Tx/ 4Rx)
130
mA
GPRS data transfer
GSM1800/1900 PCL=0, (2Tx/ 3Rx)
230
mA
Voice call GSM850, PCL=5
1.35
1.383
SLEEP mode @ DRX = 5
SLEEP mode @ DRX = 2
1.
2.
3.
Peak current during Voice call GSM900, PCL=5
GSM transmission
Voice call GSM1800, PCL=0
burst
1.30
1.353
0.95
0.98
Voice call GSM1900, PCL=0
0.89
0.923
With an impedance of ZLOAD=50Ohm at the antenna connector.
ASC0, ASC1 inactive
Measurements start 6 minutes after switching on the module,
Averaging times: SLEEP mode - 3 minutes; transfer modes - 1.5 minutes,
Communication tester settings: no neighbour cells, no cell reselection etc.,
RMC (Reference Measurement Channel)
At total mismatch.
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MC55i-W Hardware Interface Overview
6 Mechanics
28
Mechanics
The following sections describe the mechanical dimensions of MC55i-W and give recommendations for integrating MC55i-W into the host application.
6.1
Mechanical Dimensions of MC55i-W
Figure 2 shows the top view on MC55i-W and provides an overview of the mechanical dimensions of the board.
Length:
Width:
Height:
35mm
32.5mm
3.1mm (including board-to-board connector), 2.9mm (excluding connector)
Weight:
6g
Pin 1
Pin 50
Figure 2: MC55i-W – top view
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6.2 Board-to-Board Connector
28
6.2
Board-to-Board Connector
This section provides specifications for the 50-pin board-to-board connector which serves as
physical interface to the host application. The receptacle assembled on the MC55i-W PCB is
type Hirose DF12C. Mating headers from Hirose are available in different stacking heights.
Figure 3: Hirose DF12C receptacle on MC55i-W
Figure 4: Header Hirose DF12 series
Table 16: Ordering information DF12 series
Item
Part number
Stacking
height (mm)
HRS number
Receptacle on MC55i-W
DF12C(3.0)-50DS-0.5V(81)
3-5
537-0694-9-81
Headers DF12 series
DF12E(3.0)-50DP-0.5V(81)
DF12E(3.5)-50DP-0.5V(81)
DF12E(4.0)-50DP-0.5V(81)
DF12E(5.0)-50DP-0.5V(81)
3.0
3.5
4.0
5.0
537-0834-6-**
537-0534-2-**
537-0559-3-**
537-0584-0-**
Note: The headers listed above are without boss and metal fitting. Please contact Hirose for
details on other types of mating headers. Asterixed HRS numbers denote different types of
packaging.
Table 17: Electrical and mechanical characteristics of the Hirose DF12C connector
Parameter
Specification (50 pin board-to-board connector)
Number of contacts
50
Quantity delivered
2000 connectors per tape & reel
Voltage
50V
Rated current
0.3A max per contact
Resistance
0.05  per contact
Dielectric withstanding voltage
500V RMS min
Operating temperature
-45°C...+125°C
Contact material
phosphor bronze (surface: gold plated)
Insulator material
PA , beige natural
Stacking height
3.0 mm ; 3.5 mm ; 4.0 mm ; 5.0 mm
Insertion force
21.8N
Withdrawal force 1st
Withdrawal force 50
10N
th
Maximum connection cycles
MC55i-W_HIO_v01.301
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10N
50
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MC55i-W Hardware Interface Overview
6.2 Board-to-Board Connector
28
6.2.1

Mechanical Dimensions of the Hirose DF12 Connector
Figure 5: Mechanical dimensions of Hirose DF12 connector
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MC55i-W Hardware Interface Overview
7 Reference Approval
30
Reference Approval
7.1
Reference Equipment for Type Approval
The Cinterion Wireless Modules reference setup submitted to type approve MC55i-W consists
of the following components:
Antenna
GSM / GPRS / UMTS
Base Station
GSM Antenna with 1m
cable
ASC0
PC
ASC1
SMA
Module
DSB75
Power
supply
SIM Card
Audio
Module
Module extern with flexible
cable and 50-to-80 adapter
to DSB75
Handset
Audio Test System
Figure 6: Reference equipment for approval
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7.2 Compliance with FCC Rules and Regulations
30
7.2

Compliance with FCC Rules and Regulations
The Equipment Authorization Certification for the Cinterion Wireless Modules reference application described in Section 7.1 will be registered under the following identifiers:
FCC Identifier: QIPMC55I-W
Industry Canada Certification Number: 7830A-MC55IW
Granted to Cinterion Wireless Modules GmbH
Manufacturers of mobile or fixed devices incorporating MC55i-W modules are authorized to
use the FCC Grants and Industry Canada Certificates of the MC55i-W modules for their own
final products according to the conditions referenced in these documents. In this case, the FCC
label of the module shall be visible from the outside, or the host device shall bear a second label
stating "Contains FCC ID QIPMC55I-W", and accordingly "Contains IC 7830A-MC55IW".
IMPORTANT:
Manufacturers of portable applications incorporating MC55i-W modules are required to have
their final product certified and apply for their own FCC Grant and Industry Canada Certificate
related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable mobiles (see Section 1.3.2 for detail).
Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
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