THALES DIS AlS Deutschland PCS3 CDMA 1XRTT MODULE User Manual Rev

Gemalto M2M GmbH CDMA 1XRTT MODULE Rev

User Manual Rev

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PCS3
Version:
Document:
01.000-03
PCS3_HD_v01.000-03
Hardware Interface Description

PCS3 Hardware Interface Description
Document Name:
PCS3 Hardware Interface Description
Version:
01.000-03
Date:
2013-10-21
Document:
PCS3_HD_v01.000-03
Status
Confidential / Preliminary

GENERAL NOTE
THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE "PRODUCT") IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY
EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON CINTERION PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT
ARE SUBJECT TO CHANGE AT CINTERION'S DISCRETION. CINTERION WIRELESS MODULES
GMBH GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT
TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS;
DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT
AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN
"AS IS" BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM
EXTENT PERMITTED BY APPLICABLE LAW, CINTERION WIRELESS MODULES GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED
PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE
SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW.
Copyright
Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will
be held liable for payment of damages. All rights created by patent grant or registration of a utility model
or design patent are reserved.
Copyright © 2013, Cinterion Wireless Modules GmbH
Trademark Notice
Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the
United States and/or other countries. CDMA2000 is a registered certification mark of the Telecommunications Industry Association. All other registered trademarks or trademarks mentioned in this document
are property of their respective owners.
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PCS3 Hardware Interface Description
Contents

Contents
Document History ....................................................................................................... 8
Introduction .............................................................................................................. 10
1.1
Related Documents ......................................................................................... 10
1.2
Terms and Abbreviations ................................................................................. 10
1.3
Regulatory and Type Approval Information ..................................................... 13
1.3.1 Directives and Standards ................................................................... 13
1.3.2 SAR requirements specific to portable mobiles .................................. 15
1.3.3 SELV Requirements ........................................................................... 16
1.3.4 Safety Precautions ............................................................................. 16
Product Concept ....................................................................................................... 18
2.1
Key Features at a Glance ................................................................................ 18
2.2
PCS3 System Overview .................................................................................. 20
2.3
Circuit Concept ................................................................................................ 21
Application Interface ................................................................................................ 22
3.1
Operating Modes ............................................................................................. 23
3.2
Power Supply .................................................................................................. 24
3.2.1 Monitoring Power Supply by AT Command ........................................ 25
3.3
Power-Up / Power-Down Scenarios ................................................................ 26
3.3.1 Turn on PCS3 ..................................................................................... 26
3.3.2 Signal States after Startup .................................................................. 27
3.3.3 Turn off PCS3 Using AT Command .................................................... 28
3.3.4 Configuring the IGT Line for Use as ON/OFF Switch ......................... 29
3.3.5 Automatic Shutdown ........................................................................... 30
3.3.5.1 Thermal Shutdown .............................................................. 31
3.3.5.2 Undervoltage Shutdown ...................................................... 32
3.3.5.3 Overvoltage Shutdown ........................................................ 32
3.3.6 Automatic Reset ................................................................................. 32
3.3.7 Turn off PCS3 in Case of Emergency..………………………………....33
3.4
Power Saving .................................................................................................. 34
3.4.1 Power Saving while Attached to CDMA Networks .............................. 34
3.4.2 Timing of the CTS0 Signal, CDMA ..................................................... 34
3.4.3 Wake up from or Disabling Power Saving .......................................... 35
3.5
RTC Backup .................................................................................................... 36
3.6
USB Interface .................................................................................................. 37
3.6.1 Reducing Power Consumption ........................................................... 38
3.7
Serial Interface ASC0 ...................................................................................... 39
3.8
Analog Audio Interface .................................................................................... 41
3.8.1 Microphone Inputs and Supply ........................................................... 42
3.8.2 Loudspeaker Output ........................................................................... 45
3.9
Digital Audio Interface ..................................................................................... 46
3.9.1 Pulse Code Modulation Interface (PCM) ............................................ 46
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Contents
3.10

3.9.2 Inter I2C Interface .............................................................................. 48
Control Signals ................................................................................................ 50
3.10.1 PWR_IND Signal ................................................................................ 50
3.10.2 Network Connectivity Status Signals .................................................. 50
3.10.3 Behavior of the RING0 Line (ASC0 Interface only) ............................. 51
3.10.4 Host Wakeup ...................................................................................... 51
3.10.5 Low Current Indicator ......................................................................... 52
3.10.6 RING0 (ASC0), WAKEUP and LCI_IND Startup Behavior ................. 53
Antenna Interfaces ................................................................................................... 55
4.1
CDMA Antenna Interface ................................................................................. 55
4.1.1 Antenna Installation ............................................................................ 56
4.1.2 RF Line Routing Design ..................................................................... 57
4.1.2.1 Line Arrangement Examples ............................................... 57
4.1.2.2 Routing Example ................................................................ 59
Electrical, Reliability and Radio Characteristics .................................................... 62
5.1
Absolute Maximum Ratings ............................................................................. 62
5.2
Operating Temperatures ................................................................................. 63
5.3
Storage Conditions .......................................................................................... 63
5.4
Reliability Characteristics ................................................................................ 64
5.5
Pad Assignment and Signal Description .......................................................... 64
5.6
Power Supply Ratings ..................................................................................... 72
5.7
Electrical Characteristics of the Voiceband Part .............................................. 73
5.7.1 Setting Audio Parameters by AT Commands ..................................... 73
5.7.2 Audio Programming Model ................................................................. 74
5.7.3 Characteristics of Audio Modes .......................................................... 75
5.7.4 Voiceband Receive Path .................................................................... 77
5.7.5 Voiceband Transmit Path ................................................................... 77
5.8
RF Antenna Interface Characteristics .............................................................. 78
5.9
Electrostatic Discharge .................................................................................... 79
Mechanics, Mounting and Packaging ..................................................................... 81
6.1
Mechanical Dimensions of PCS3 .................................................................... 81
6.2
Mounting PCS3 onto the Application Platform ................................................. 83
6.2.1 SMT PCB Assembly ........................................................................... 83
6.2.1.1 Land Pattern and Stencil ..................................................... 83
6.2.1.2 Board Level Characterization .............................................. 85
6.2.2 Moisture Sensitivity Level ................................................................... 85
6.2.3 Soldering Conditions and Temperature .............................................. 86
6.2.3.1 Reflow Profile ..................................................................... 86
6.2.3.2 Maximum Temperature and Duration .................................. 87
6.3
Durability and Mechanical Handling ................................................... 88
6.3.1.1 Storage Life ........................................................................ 88
6.3.1.2 Processing Life ................................................................... 88
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6.4

6.3.1.3 Baking ................................................................................ 88
6.3.1.4 Electrostatic Discharge ....................................................... 88
Packaging ....................................................................................................... 89
6.4.1 Tape and Reel .................................................................................... 89
6.4.1.1 Orientation .......................................................................... 89
6.4.1.2 Barcode Label ..................................................................... 90
6.4.2 Shipping Materials .............................................................................. 91
6.4.2.1 Moisture Barrier Bag ........................................................... 91
6.4.2.2 Transportation Box .............................................................. 93
Sample Application .................................................................................................. 94
Reference Approval .................................................................................................. 96
8.1
Reference Equipment for Type Approval ......................................................... 96
8.2
Compliance with FCC and IC Rules and Regulations ..................................... 97
Appendix ................................................................................................................... 98
9.1
List of Parts and Accessories .......................................................................... 98
9.2
Mounting Advice Sheet .................................................................................. 100
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Tables

Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:
Table 15:
Table 16:
Table 17:
Table 18:
Table 19:
Table 20:
Table 21:
Table 22:
Table 23:
Table 24:
Table 25:
Table 26:
Table 27:
Table 28:
Table 29:
Table 30:
Table 31:
Table 32:
Table 33:
Directives ........................................................................................................ 13
Standards of North American type approval ................................................... 13
Requirements of quality................................................................................... 13
Standards of the Ministry of Information Industry of the
People’s Republic of China ............................................................................. 14
Toxic or hazardous substances or elements with defined concentration
limits ................................................................................................................ 14
Overview of operating modes.......................................................................... 23
Signal states. ................................................................................................... 27
Temperature dependent behavior ................................................................... 31
DCE-DTE wiring of ASC0................................................................................ 40
Feedback resistor values versus input gain .................................................... 43
Configuration combinations for the PCM interface .......................................... 46
Overview of PCM signal functions................................................................... 46
Overview of I2C signal functions ...................................................................... 48
Host wakeup lines ........................................................................................... 51
Low current indicator line ................................................................................ 52
Return loss in the active band ......................................................................... 55
Absolute maximum ratings .............................................................................. 62
Board temperature .......................................................................................... 63
Storage conditions........................................................................................... 63
Summary of reliability test conditions .............................................................. 64
Overview: Pad assignments ............................................................................ 65
Signal description ............................................................................................ 68
Power supply ratings ....................................................................................... 72
Audio parameters adjustable by AT command ............................................... 73
Voiceband characteristics ............................................................................... 75
Voiceband receive path. .................................................................................. 77
Voiceband transmit path.................................................................................. 77
RF Antenna interface CDMA. .......................................................................... 78
Electrostatic values ......................................................................................... 80
Reflow temperature ratings ............................................................................. 87
List of parts and accessories. .......................................................................... 98
Molex sales contacts (subject to change) ....................................................... 99
Hirose sales contacts (subject to change) ....................................................... 99
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Figures
Figures
Figure 1:
Figure 2:
Figure 3:
Figure 4:
Figure 5:
Figure 6:
Figure 7:
Figure 8:
Figure 9:
Figure 10:
Figure 11:
Figure 12:
Figure 13:
Figure 14:
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Figure 16:
Figure 17:
Figure 18:
Figure 19:
Figure 20:
Figure 21:
Figure 22:
Figure 23:
Figure 24:
Figure 25:
Figure 26:
Figure 27:
Figure 28:
Figure 29:
Figure 30:
Figure 31:
Figure 32:
Figure 33:
Figure 34:
Figure 35:
Figure 36:
Figure 37:
Figure 38:
Figure 39:
Figure 40:
Figure 41:
Figure 42:
Figure 43:
Figure 44:
Figure 45:
PCS3 system overview .................................................................................. 20
PCS3 block diagram ....................................................................................... 21
Decoupling capacitor(s) for BATT+ ................................................................. 24
Power-on with IGT .......................................................................................... 26
Signal states during turn-off procedure ........................................................... 28
Timing of IGT if used as ON/OFF switch ........................................................ 29
Shutdown by EMERG_OFF signal ................................................................. 33
RTC supply variants ....................................................................................... 36
USB circuit ...................................................................................................... 37
Serial interface ASC0 ..................................................................................... 39
Structure of Audio Input and Supply ............................................................... 42
Single ended microphone connection ............................................................. 44
Differential microphone connection ................................................................ 44
Line input ........................................................................................................ 45
Differential loudspeaker connection ................................................................ 45
Line output connection ................................................................................... 45
PCM timing short frame (master/slave, 256, 512 or 2048KHz) ....................... 47
PCM timing long frame (master, 128kHz) ....................................................... 47
I2C interface timing ......................................................................................... 49
Dual microphone design example with I2S interface ....................................... 49
PWR_IND signal ............................................................................................. 50
LED Circuit (Example). ................................................................................... 50
Low current indication timing .......................................................................... 52
RING0 (ASC0), WAKEUP and LCI_IND startup behavior .............................. 53
Antenna pads ................................................................................................. 56
Coated coplanar strip with ground .................................................................. 57
Differnetia coated coplanar strip with ground ................................................. 58
Routing to application‘s RF connector ............................................................ 59
PCS3 evaluation board layer table ................................................................. 59
PCS3 bottom view: Pad assignments ............................................................. 66
Audio programming model ............................................................................. 74
PCS3 – top and bottomview ........................................................................... 81
Dimensions of PCS3 (all dimensions in mm) .................................................. 82
Land pattern (top view) ................................................................................... 83
Recommended design for 110 micron thick stencil (top view) ........................ 84
Recommended design for 150 micron thick stencil (top view) ........................ 84
Reflow Profile ................................................................................................. 86
Carrier tape .................................................................................................... 89
Roll direction ................................................................................................... 89
Barcode label on tape reel .............................................................................. 90
Moisture barrier bag (MBB) with imprint ......................................................... 91
Moisture Sensitivity Label ............................................................................... 92
Humidity Indicator Card - HIC ......................................................................... 93
PCS3 sample application ............................................................................... 95
Reference equipment for type approval .......................................................... 96
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PVS8 Hardware Interface Description
0 Document History
Document History
New document: "PCS3 Hardware Interface Description" Version 01.000-03
Chapter
What is new
--
Initial document release
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PCS3 Hardware Interface Description
1 Introduction

Introduction
The document1 describes the hardware of the PCS3 module, designed to connect to a cellular
device application and the air interface. It helps you quickly retrieve interface specifications,
electrical and mechanical details and information on the requirements to be considered for integrating further components.
1.1
[1]
[2]
[3]
[4]
[5]
Related Documents
PCS3 AT Command Set
PCS3 Release Notes
DSB75 Support Box - Evaluation Kit for Cinterion Wireless Modules
Application Note 48: SMT Module Integration
Universal Serial Bus Specification Revision 2.0, April 27, 2000
1.2
Terms and Abbreviations
Abbreviation
Description
ANSI
American National Standards Institute
AMR
Adaptive Multi-rate
ARP
Antenna Reference Point
BB
Baseband
BC
Band Class
BEP
Bit Error Probability
BTS
Base Transceiver Station
CB or CBM
Cell Broadcast Message
CDMA
Code Division Multiple Access
CE
Conformité Européene (European Conformity)
CS
Coding Scheme
CS
Circuit Switched
CSD
Circuit Switched Data
CTM
Cellular Text Modem
DAC
Digital-to-Analog Converter
DCS
Digital Cellular System
DL
Download
DRX
Discontinuous Reception
DSB
Development Support Board
1.
The document is effective only if listed in the appropriate Release Notes as part of the technical
documentation delivered with your Cinterion Wireless Modules product.
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1.2 Terms and Abbreviations
Abbreviation
Description
DSP
Digital Signal Processor
DTMF
Dual Tone Multi Frequency
DTX
Discontinuous Transmission
EFR
Enhanced Full Rate
EMC
Electromagnetic Compatibility
ERP
Effective Radiated Power
ESD
Electrostatic Discharge
ETSI
European Telecommunications Standards Institute
EVRC
Enhanced Variable Rate Codec
FCC
Federal Communications Commission (U.S.)
FDD
Frequency Division Duplex
FDMA
Frequency Division Multiple Access
FL
Forward Link
FR
Full Rate
GPS
Global Positioning System
HiZ
High Impedance
HR
Half Rate
I/O
Input / Output
IF
Intermediate Frequency
IMEI
International Mobile Equipment Identity
ISO
International Standards Organization
ITU
International Telecommunications Union
kbps
Kbit per second
LED
Light Emitting Diode
LGA
Land Grid Array
MBB
Moisture barrier bag
Mbps
Mbit per second
MCS
Modulation and Coding Scheme
MO
Mobile Originated
MS
Mobile Station, also referred to as TE
MSL
Moisture Sensitivity Level
MT
Mobile Terminated
NB
Narrow Band
NMEA
National Marine Electronics Association
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1.2 Terms and Abbreviations
Abbreviation
Description
NTC
Negative Temperature Coefficient
PBCCH
Packet Switched Broadcast Control Channel
PCB
Printed Circuit Board
PCL
Power Control Level
PCM
Pulse Code Modulation
PCS
Personal Communication System, also referred to as GSM 1900
PD
Pull Down resistor (appr. 100k)
PDU
Protocol Data Unit
PS
Packet Switched
PU
Pull Up resistor (appr. 100k)
QAM
Quadrature Amplitude Modulation
RF
Radio Frequency
RL
Reverse Link
ROPR
Radio Output Power Reduction
RTC
Real Time Clock
Rx
Receive Direction
SAR
Specific Absorption Rate
SCI
Slot Cycle Index
SELV
Safety Extra Low Voltage
SLIC
Subscriber Line Interface Circuit
SMPL
Sudden Momentary Power Loss
SMD
Surface Mount Device
SMS
Short Message Service
SMT
Surface Mount Technology
SNR
Signal-to-Noise Ratio
SRAM
Static Random Access Memory
SRB
Signaling Radio Bearer
SUPL
Secure User Plane Location
TDMA
Time Division Multiple Access
TE
Terminal Equipment
TPC
Transmit Power Control
TTFF
Time To First Fix
TX
Transmit Direction
UL
Upload
URC
Unsolicited Result Code
USB
Universal Serial Bus
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1.3 Regulatory and Type Approval Information
1.3
Regulatory and Type Approval Information
1.3.1
Directives and Standards

PCS3 has been designed to comply with the directives and standards listed below.
It is the responsibility of the application manufacturer to ensure compliance of the final product
with all provisions of the applicable directives and standards as well as with the technical specifications provided in the "PCS3 Hardware Interface Description".1
Table 1: Directives
2002/95/EC
Directive of the European Parliament and of the Council of
27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(RoHS)
Table 2: Standards of North American type approval
CFR Title 47
Code of Federal Regulations, Part 22, Part 24 and Part 27; US Equipment
Authorization FCC
OET Bulletin 65
(Edition 97-01)
Evaluating Compliance with FCC Guidelines for Human Exposure to Radiofrequency Electromagnetic Fields
UL 60 950-1
Product Safety Certification (Safety requirements)
NAPRD.03 V5.11
Overview of PCS Type certification review board Mobile Equipment Type
Certification and IMEI control
PCS Type Certification Review board (PTCRB)
RSS132, RSS133,
RSS139
Canadian Standard
Table 3: Requirements of quality
IEC 60068
Environmental testing
DIN EN 60529
IP codes
1.
Manufacturers of applications which can be used in the US shall ensure that their applications have a
PTCRB approval. For this purpose they can refer to the PTCRB approval of the respective module.
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1.3 Regulatory and Type Approval Information

Table 4: Standards of the Ministry of Information Industry of the People’s Republic of China
SJ/T 11363-2006
“Requirements for Concentration Limits for Certain Hazardous Substances
in Electronic Information Products” (2006-06).
SJ/T 11364-2006
“Marking for Control of Pollution Caused by Electronic
Information Products” (2006-06).
According to the “Chinese Administration on the Control of
Pollution caused by Electronic Information Products”
(ACPEIP) the EPUP, i.e., Environmental Protection Use
Period, of this product is 20 years as per the symbol
shown here, unless otherwise marked. The EPUP is valid only as long as
the product is operated within the operating limits described in the Cinterion
Hardware Interface Description.
Please see Table 5 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the
limits defined by SJ/T 11363-2006.
Table 5: Toxic or hazardous substances or elements with defined concentration limits
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1.3 Regulatory and Type Approval Information
1.3.2

SAR requirements specific to portable mobiles
Mobile phones, PDAs or other portable transmitters and receivers incorporating a CDMA module must be in accordance with the guidelines for human exposure to radio frequency energy.
This requires the Specific Absorption Rate (SAR) of portable PCS3 based applications to be
evaluated and approved for compliance with national and/or international regulations.
Since the SAR value varies significantly with the individual product design manufacturers are
advised to submit their product for approval if designed for portable use. For US markets the
relevant directives are mentioned below. It is the responsibility of the manufacturer of the final
product to verify whether or not further standards, recommendations or directives are in force
outside these areas.
Products intended for sale on US markets
ES 59005/ANSI C95.1 Considerations for evaluation of human exposure to electromagnetic
fields (EMFs) from mobile telecommunication equipment (MTE) in the
frequency range 30MHz - 6GHz
IMPORTANT:
Manufacturers of portable applications based on PCS3 modules are required to have their final
product certified and apply for their own FCC Grant and Industry Canada Certificate related to
the specific portable mobile.
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1.3 Regulatory and Type Approval Information
1.3.3

SELV Requirements
The power supply connected to the PCS3 module shall be in compliance with the SELV requirements defined in EN 60950-1.
1.3.4
Safety Precautions
The following safety precautions must be observed during all phases of the operation, usage,
service or repair of any cellular terminal or mobile incorporating PCS3. Manufacturers of the
cellular terminal are advised to convey the following safety information to users and operating
personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Cinterion Wireless Modules assumes no liability for customer’s
failure to comply with these precautions.
When in a hospital or other health care facility, observe the restrictions on the use of
mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy.
The operation of cardiac pacemakers, other implanted medical equipment and hearing
aids can be affected by interference from cellular terminals or mobiles placed close to
the device. If in doubt about potential danger, contact the physician or the manufacture of the device to verify that the equipment is properly shielded. Pacemaker
patients are advised to keep their hand-held mobile away from the pacemaker, while
it is on.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is
forbidden to prevent interference with communications systems. Failure to observe
these instructions may lead to the suspension or denial of cellular services to the
offender, legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard.
Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. Remember that interference can occur if it is used close to TV sets,
radios, computers or inadequately shielded equipment. Follow any special regulations
and always switch off the cellular terminal or mobile wherever forbidden, or when you
suspect that it may cause interference or danger.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for speakerphone operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
Speakerphones must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard.
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1.3 Regulatory and Type Approval Information

IMPORTANT!
Cellular terminals or mobiles operate using radio signals and cellular networks.
Because of this, connection cannot be guaranteed at all times under all conditions.
Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls.
Remember, in order to make or receive calls, the cellular terminal or mobile must be
switched on and in a service area with adequate cellular signal strength.
Some networks do not allow for emergency calls if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may need to deactivate
those features before you can make an emergency call.
Bear in mind that exposure to excessive levels of noise can cause physical damage
to users! With regard to acoustic shock, the cellular application must be designed to
avoid unintentional increase of amplification, e.g. for a highly sensitive earpiece. A protection circuit should be implemented in the cellular application.
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PCS3 Hardware Interface Description
2 Product Concept
Product Concept
2.1
Key Features at a Glance
Feature

Implementation
General
Frequency bands
CDMA: Dual band (BC0/BC1/BC10), 800/1900MHz
Power supply
3.3V < VBATT+ < 4.2V
Operating temperature
(board temperature)
Normal operation: -30°C to +85°C
Restricted operation: -40°C to +95°C
Physical
Dimensions: 33mm x 29mm x 2mm
Weight: approx. 4g
RoHS
All hardware components fully compliant with EU RoHS Directive
CDMA features
3GPP2 CDMA2000
1xRTT Advanced data rates:
FL max. 307.2kbps, RL max. 307.2kbps
SMS
Point-to-point MT and MO
Cell broadcast
Text and PDU mode
General
Power saving modes
Software
AT commands
Hayes, 3GPP TS 27.007 and 27.005, and proprietary Cinterion Wireless
Modules commands as well as provider specific CDMA commands
Audio
Audio speech codecs
3GPP2: EVRC, EVRC-B (4GV-NB), QCELP, AMR-NB
Speakerphone operation, echo cancellation, noise suppression, 6 ringing
tones, TTY support
Software update
Generic firmware update from host application over ASC0 or USB
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2.1 Key Features at a Glance
Feature

Implementation
Interfaces
Module interface
Surface mount device with solderable connection pads (SMT application
interface).
Land grid array (LGA) technology ensures high solder joint reliability and
provides the possibility to use an optional module mounting socket.
For more information on how to integrate SMT modules see also [4]. This
application note comprises chapters on module mounting and application
layout issues as well as on additional SMT application development
equipment.
Antenna
50Ohms. CDMA main antenna
USB
USB 2.0 Full Speed (12Mbit/s) device interface
Serial interface
ASC0:
• 8-wire modem interface with status and control lines, unbalanced,
asynchronous
• Adjustable baud rates from 1,200bps up to 921,600bps
• Supports RTS0/CTS0 hardware flow control
Status
Signal line to indicate network connectivity state
Audio
1 analog interface with microphone feeding
1 digital interface: PCM
Power on/off, Reset
Power on/off
Switch-on by hardware signal IGT
Switch-off by AT command (AT^SMSO)
Automatic switch-off in case of critical temperature or voltage conditions
Reset
Orderly shutdown and reset by AT command
Emergency-off
Emergency-off by hardware signal EMERG_OFF if IGT is not active
Special Features
Phonebook
Phone
TTY/CTM support
TTY only
Antenna
SAIC (Single Antenna Interference Cancellation) / DARP (Downlink
Advanced Receiver Performance)
Rx diversity (receiver type 3i - 16-QAM)
Over-the-air provisioning
Verizon specific OTASP (Over-the-Air Service Provisioning) and OTAPA
(Over-the-Air Parameter Administration)
Evaluation kit
Evaluation module
PCS3 module soldered onto a dedicated PCB that can be connected to
an adapter in order to be mounted onto the DSB75.
DSB75
DSB75 Development Support Board designed to test and type approve
Cinterion Wireless Modules and provide a sample configuration for application engineering. A special adapter is required to connect the PCS3
evaluation module to the DSB75.
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PCS3 Hardware Interface Description
2.2 PCS3 System Overview
2.2
PCS3 System Overview
CDMA Main
Antenna
Application
Host Application
Controller
Analog
audio
Power
supply
Digital
audio
PCM or I2C
Codec
LCI
Low current
indication
Wakeup
Power for Application
(VEXT)
Power Indication
(PWR_IND)
Serial
ASC0
Host Wakeup
USB
Modem Interface
CDMA Module
RTC
IGT,
Emergency Off
Net state/
status
or
PSU
On/Off
Application
Figure 1: PCS3 system overview
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PCS3 Hardware Interface Description
2.2 PCS3 System Overview
2.3
Circuit Concept
Figure 2 shows a block diagram of the PCS3 module and illustrates the major functional components:
Baseband block:
• CDMA controller/transceiver/power supply
• NOR Flash/pSRAM memory with multiplexed address data bus
• Audio codec
• Application interface (SMT with connecting pads)
RF section:
• RF transceiver
• RF power amplifier/frontend
• RF filter
• Antenna pad
MCP Memory
64Mb pSRAM
128Mb NOR flash memory
CDMA2000 BC0, BC10
BC0, BC10 TX: 817-849 MHz
BC0, BC10 RX: 862-894 MHz
BC0, BC10
Duplexer
EBI1
TX_LB1
BC0, BC10
PA
PRX_LB1
Interface
(USB, UART, I2C, CSIM)
Diplexer
BATT+
BC1
Duplexer
TX_MB1
BC1 PA
PRX_MB2
CDMA2000 BC1
TX: 1850-1910 MHz
RX: 1930-1990 MHz
QSC1105
GPIO
156 pad
LGA
ADCx_in
Analog Audio Interface
(MICP, MICN, EPP, EPN)
To QSC1105 Digtal Core
To QSC1105 RX ADC, RF1
1.3V
To QSC1105 TX, RX ADC
To QSC1105 RF2
2.2V
To Memory, QSC1105 digital P1, VEXT,
To QSC1105 digital P3
To QSC1105 digital P4
Digital Audio Interface
VEXT
IGT, EMERG_OFF
PWR_IND, STATUS
1.8V
JTAG
2.85V
19.2MHz
Xtal
BATT+_CDMA
To PA
Figure 2: PCS3 block diagram
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3 Application Interface

Application Interface
PCS3 is equipped with an SMT application interface that connects to the external application.
The host interface incorporates several sub-interfaces described in the following sections:
•
•
•
•
•
•
•
•
Operating modes - see Section 3.1
Power supply - see Section 3.2
RTC backup - see Section 3.5
Serial interface USB - see Section 3.6
Serial interface ASC0 - Section 3.7
Analog audio interface - see Section 3.8
Digital audio interface (PCM) - see Section 3.9
Status and control lines: IGT, EMERG_OFF, PWR_IND, STATUS - see Table 22
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3.1 Operating Modes
3.1

Operating Modes
The table below briefly summarizes the various operating modes referred to in the following
chapters.
Table 6: Overview of operating modes
Mode
Function
CDMA SLEEP
Normal
operation
Power saving set automatically when no call is in progress and the USB
connection is suspended by host or not present and no active communication via ASC0.
CDMA IDLE
Power saving disabled (see [1]: AT^SCFG "MEopMode/
PwrSave",) or an USB connection not suspended, but
no call in progress.
CDMA TALK/
CDMA DATA
CDMA data transfer in progress. Power consumption depends on network settings and data transfer rate.
Power
Down
Normal shutdown after sending the AT^SMSO command. Only a voltage regulator is active
for powering the RTC. Software is not active. Interfaces are not accessible. Operating voltage (connected to BATT+) remains applied.
Airplane
mode
Airplane mode shuts down the radio part of the module, causes the module to log off from
the CDMA network and disables all AT commands whose execution requires a radio connection.
Airplane mode can be controlled by AT command (see [1]).
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PCS3 Hardware Interface Description
3.2 Power Supply
3.2
Power Supply
PCS3 needs to be connected to a power supply at the SMT application interface - 6 lines each
BATT+ and GND. There are three separate voltage domains for BATT+:
• BATT+_CDMA with 2 lines for the first power amplifier supply
• BATT+_CDMA with 2 lines for the second power amplifier supply
• BATT+ with 2 lines for the general power management.
The main power supply from an external application has to be a single voltage source and has
to be expanded to three sub paths (star structure). Capacitors should be placed as close as
possible to the BATT+ pads. Figure 3 shows two sample circuits (minimum requirement and
recommended alternative) for decoupling capacitors for BATT+.
Module
SMT interface
BATT+
BATT+_CDMA
BATT+_CDMA
BATT+
Minimum requirement
Decoupling capacitor
e.g. 100…220µF
Ultra-low ESR
GND
Module
SMT interface
BATT+
BATT+_CDMA
BATT+_CDMA
BATT+
Recommended alternative
3x
Decoupling capacitors
e.g. 47µF X5R MLCC
GND
Figure 3: Decoupling capacitor(s) for BATT+
In addition, the VDDLP signal on the SMT application interface may be connected to an external capacitor or a battery to backup the RTC (see Section 3.5).
The power supply of PCS3 must be able to provide the peak current during the uplink transmission.
All key functions for supplying power to the device are handled by the power management IC.
It provides the following features:
• Stabilizes the supply voltages for the baseband using switching regulators and low drop linear voltage regulators.
• Switches the module's power voltages for the power-up and -down procedures.
• Delivers, across the VEXT line, a regulated voltage for an external application. This voltage
is not available in Power-down mode and can be reduced via AT command to save power
(see Table 22: VEXT).
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3.2 Power Supply
3.2.1

Monitoring Power Supply by AT Command
To monitor the supply voltage you can use the AT^SBV command which returns the averaged
value related to BATT+ and GND at the SMT application interface.
The module continuously measures the voltage at intervals depending on the operating mode
of the RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode to 50s
when PCS3 is in Limited Service (deregistered). The displayed voltage (in mV) is averaged
over the last measuring period before the AT^SBV command was executed.
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PCS3 Hardware Interface Description
3.3 Power-Up / Power-Down Scenarios
3.3
Power-Up / Power-Down Scenarios
In general, be sure not to turn on PCS3 while it is beyond the safety limits of voltage and temperature stated in Section 6.1. PCS3 would immediately switch off after having started and detected these inappropriate conditions. In extreme cases this can cause permanent damage to
the module.
3.3.1
Turn on PCS3
When the PCS3 module is in Power-down mode, it can be started to Normal mode by driving
the IGT (ignition) line to ground. it is recommended to use an open drain/collector driver to
avoid current flowing into this signal line. Pulling this signal low triggers a power-on sequence.
To turn on PCS3 IGT has to be kept active at least 100ms. After turning on PCS3 IGT should
be set inactive to prevent the module from turning on again after a shut down by AT command
or EMERG_OFF. For details on signal states during startup see also Section 3.3.2 and Section
3.10.6.
IGT
0ms
Power
supply
active
Module
Firmware start up, command interface initialization
~28ms
Function
active
~5s
BATT+
>100ms
IGT
PWR_IND
VEXT
EMERG_OFF
ASC0
CTS0
USB*
Initial state
Intermediate state
Initial state
Intermediate state
Undefined state
* USB interface may take up to 5s to reach its active state (typ. 4s)
Figure 4: Power-on with IGT
Note: After power up IGT should remain high. Also note that with a USB connection the USB
host may take more than 5 seconds to set up the virtual COM port connection.
After startup or mode change the following URCs sent to every port able to receive AT commands indicating the module’s ready state:
• "^SYSSTART" indicates that the module has entered Normal mode.
• "^SYSSTART AIRPLANE MODE" indicates that the module has entered Airplane mode.
These URCs notify the external application that the first AT command can be sent to the module. If these URCs are not used to detect then the only way of checking the module’s ready
state is polling. To do so, try to send characters (e.g. “at”) until the module is responding.
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3.3 Power-Up / Power-Down Scenarios
3.3.2
Signal States after Startup
Table 7 describes the various states each interface signal passes through after startup and during operation.
Signals are in an initial state while the module is initializing. Once the startup initialization has
completed, i.e. when the software is running, all signals are in defined state. The state of several signals will change again once the respective interface is activated or configured by AT
command (for more information see also Section 3.10.6).
Table 7: Signal states
Signal name
Power on reset
Startup phase
Duration appr. 150ms
Duration appr. 4s
State after first
firmware initialization
After 4-4.5s
RXD0
PD
PU
O, H
TXD0
PD
PD
I, PD
CTS0
PD
PU
O, L
RTS0
PD
PD
I, PD
DTR0
PD
PU
I, PU
DCD0
PD
PU1
O, H
DSR0
PU
PU
O, L
RING0
PU
PU
O, H
WAKEUP
PD
PD
PD
LCI_IND
PD
PD
PD
PWR_IND
O, L
O, L
O, L
STATUS
PD
PD
PD
PCM
PD
PD
PD
1.
No external pull down allowed during this phase.
L = Low level
H = High level
I = Input
O = Output
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PD = Pull down resistor with appr. 100k
PD(…k) = Pull down resistor with ...k
PU = Pull up resistor with appr. 100k
PU(…k) = Pull up resistor with ...k
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PCS3 Hardware Interface Description
3.3 Power-Up / Power-Down Scenarios
3.3.3
Turn off PCS3 Using AT Command
The best and safest approach to powering down PCS3 is to issue the AT^SMSO command.
This procedure lets PCS3 log off from the network and allows the software to enter into a secure
state and safe data before disconnecting the power supply. The mode is referred to as Power
Down mode. In this mode, only the RTC stays active. After sending AT^SMSO do not enter any
other AT commands. To verify that the module turned off it is possible to monitor the PWR_IND
signal. A high state of the PWR_IND signal line definitely indicates that the module is switched
off.
Be sure not to disconnect the supply voltage VBATT+ before the module has been switched off
and the PWR_IND signal has gone high. Otherwise you run the risk of losing data.
While PCS3 is in Power-down mode the application interface is switched off and must not be
fed from any other source. Therefore, your application must be designed to avoid any current
flow into any digital signal lines of the application interface, especially of the serial interfaces.
No special care is required for the USB interface which is protected from reverse current.
Power down
PWR_IND
BATT+
See note 1
VEXT
0.5ms
See note 2
approx.
12ms
Reset
State
Digital outputs
Digital inputs driven by application
Figure 5: Signal states during turn-off procedure
Note 1: The power supply voltage (BATT+) may be disconnected resp. switched off only after
having reached Power Down mode as indicated by the PWR_IND signal going high.
Note 2: Depending on capacitance load from host application.
Note 3: After module shutdown by means of AT command, please allow for a time period of at
least 1s before restarting the module.
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3.3 Power-Up / Power-Down Scenarios
3.3.4
Configuring the IGT Line for Use as ON/OFF Switch
The IGT line can be configured for use in two different switching modes: You can set the IGT
line to switch on the module only, or to switch it on and off. The switching mode is determined
by the parameter "MEShutdown/OnIgnition" of the AT^SCFG command. This approach is useful for application manufacturers who wish to have an ON/OFF switch installed on the host device.
By factory default, the ON/OFF switch mode of IGT is disabled:
at^scfg=meshutdown/onignition
^SCFG: "MEShutdown/OnIgnition","off"
OK
# Query the current status of IGT.
# IGT can be used only to switch on PCS3.
IGT works as described in Section 3.3.1.
To configure IGT for use as ON/OFF switch:
at^scfg=meshutdown/onignition
^SCFG: "MEShutdown/OnIgnition","on"
OK
# Enable the ON/OFF switch mode of IGT.
# IGT can be used to switch on and off PCS3.
We strongly recommend taking great care before changing the switching mode of the IGT line.
To ensure that the IGT line works properly as ON/OFF switch it is of vital importance that the
following conditions are met.
Switch-on condition: If the PCS3 is off, the IGT line must be asserted for at least 100ms before
being released.
Switch-off condition: If the PCS3 is on, the IGT line must be asserted for at least 2.1s before
being released. The module switches off after the line is released. The
switch-off routine is identical with the procedure initiated by AT^SMSO, i.e.
the software performs an orderly shutdown as described in Section 3.3.3.
Before switching off the module wait at least 5 seconds after startup.
Figure 6: Timing of IGT if used as ON/OFF switch
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3.3 Power-Up / Power-Down Scenarios
3.3.5

Automatic Shutdown
Automatic shutdown takes effect if:
• The PCS3 board is exceeding the critical limits of overtemperature or undertemperature
• Undervoltage or overvoltage is detected
The automatic shutdown procedure is equivalent to the power down initiated with the AT^SMSO
command, i.e. PCS3 logs off from the network and the software enters a secure state avoiding
loss of data.
Alert messages transmitted before the device switches off are implemented as Unsolicited Result Codes (URCs). The presentation of the temperature URCs can be enabled or disabled with
the AT commands AT^SCTM. The URC presentation mode varies with the condition, please
see Section 3.3.5.1 to Section 3.3.5.3 for details. For further instructions on AT commands refer
to [1].
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3.3 Power-Up / Power-Down Scenarios
3.3.5.1

Thermal Shutdown
The board temperature is constantly monitored by an internal NTC resistor located on the PCB.
The values detected by the NTC resistor are measured directly on the board and therefore, are
not fully identical with the ambient temperature.
Each time the board temperature goes out of range or back to normal, PCS3 instantly displays
an alert (if enabled).
• URCs indicating the level "1" or "-1" allow the user to take appropriate precautions, such as
protecting the module from exposure to extreme conditions. The presentation of the URCs
depends on the settings selected with the AT^SCTM write command:
AT^SCTM=1: Presentation of URCs is always enabled.
AT^SCTM=0 (default): Presentation of URCs is enabled during the 15 second guard period
after start-up of PCS3. After expiry of the 15 second guard period, the presentation will be
disabled, i.e. no URCs with alert levels "1" or ''-1" will be generated.
• URCs indicating the level "2" or "-2" are instantly followed by an orderly shutdown. The presentation of these URCs is always enabled, i.e. they will be output even though the factory
setting AT^SCTM=0 was never changed.
The maximum temperature ratings are stated in Section 6.2. Refer to Table 8 for the associated
URCs.
Table 8: Temperature dependent behavior
Sending temperature alert (15sec after PCS3 start-up, otherwise only if URC presentation enabled)
^SCTM_B:
Caution: Board close to over temperature limit, i.e., board is 5°C below over
temperature limit.
^SCTM_B: -1
Caution: Board close to under temperature limit, i.e., board is 5°C above undertemperature limit.
^SCTM_B:
Board back to uncritical temperature range, i.e., board is 6°C below its over- or
above its under temperature limit.
Automatic shutdown (URC appears no matter whether or not presentation was enabled)
^SCTM_B:
Alert: Board equal or beyond over temperature limit. PCS3 switches off.
^SCTM_B: -2
Alert: Board equal or below under temperature limit. PCS3 switches off.
The AT^SCTM command can also be used to check the present status of the board. Depending
on the selected mode, the read command returns the current board temperature in degrees
Celsius or only a value that indicates whether the board is within the safe or critical temperature
range. See [1] for further instructions.
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3.3 Power-Up / Power-Down Scenarios
3.3.5.2

Under voltage Shutdown
If the measured battery voltage is no more sufficient to set up a call the following URC will be
presented:
^SBC: Under voltage.
The URC indicates that the module is close to the under voltage threshold. If under voltage
persists the module keeps sending the URC several times before switching off automatically.
This type of URC does not need to be activated by the user. It will be output automatically when
fault conditions occur.
3.3.5.3
Over voltage Shutdown
The overvoltage shutdown threshold is 100mV above the maximum supply voltage VBATT+
specified in Table 22.
When the supply voltage approaches the overvoltage shutdown threshold the module will send
the following URC:
^SBC: Overvoltage warning
This alert is sent once.
When the overvoltage shutdown threshold is exceeded the module will send the following URC
^SBC: Overvoltage shutdown
before it shuts down cleanly:
This type of URC does not need to be activated by the user. It will be output automatically when
fault conditions occur.
Keep in mind that several PCS3 components are directly linked to BATT+ and, therefore, the
supply voltage remains applied at major parts of PCS3, even if the module is switched off.
Especially the power amplifier is very sensitive to high voltage and might even be destroyed.
3.3.6
Automatic Reset
An automatic reset takes effect if
• A sudden momentary power loss (SMPL) occurs - e.g., a very brief battery disconnect - and
the power returns within 2 seconds.
The SMPL feature ensures that if VBATT+ drops out-of-range (< 2.55V nominal) and then returns into range within 2 seconds, the power-on sequence is executed and the module switches
on again. Thus the SMPL feature achieves immediate and automatic recovery from momentary
power loss such as a brief battery disconnect.
To employ the SMPL feature the VDDLP line has to supplied for at least 2 seconds after a
possible power loss (e.g., by connecting a 10µF capacitor).
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3.3 Power-Up / Power-Down Scenarios
3.3.7
Turn off PCS3 in Case of Emergency
Caution: Use the EMERG_OFF line only when, due to serious problems, the software is not
responding for more than 5 seconds. Pulling the EMERG_OFF line causes the loss of all
information stored in the volatile memory. Therefore, this procedure is intended only for use in
case of emergency, e.g. if PCS3 does not respond, if reset or shutdown via AT command fails.
The EMERG_OFF line is available on the application interface and can be used to switch off
the module. To control the EMERG_OFF line it is recommended to use an open drain / collector
driver.
To switch off, the EMERG_OFF line must be pulled to ground for longer than 40ms. After the
40ms and an additional delay period of 500ms the module shuts down as shown in Figure 7.
BATT+
Shut Down
PWR_IND
EMERG_OFF
VEXT
>40ms
40ms
500ms
Figure 7: Shutdown by EMERG_OFF signal
Please note that the power supply voltage (BATT+) may be disconnected resp. switched off
only after having reached Shut Down as indicated by the PWR_IND signal going high. The
power supply has to be available (again) before the module is restarted.
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3.4 Power Saving
3.4

Power Saving
PCS3 is able to reduce its functionality to a minimum (during the so-called SLEEP mode) in
order to minimize its current consumption. The following sections explain the module’s CTS0
behavior and also mention how to wake up from or disable the so-called SLEEP mode.
The implementation of the USB host interface also influences the module’s power saving
behavior and therefore its current consumption. For more information see Section 3.6.
Note. The module’s SLEEP mode current consumption can be reduced significantly (0.8mA)
by enabling the VEXT power save mode. Hence, it is recommended to enable power saving on
VEXT if at all possible. For more information see Table 22: VEXT.
Another feature influencing the current consumption is the configuration of the GNSS antenna
interface. For details see Section 6.9.
3.4.1
Power Saving while Attached to CDMA Networks
The so-called slotted paging in CDMA is similar to the WCDMA paging timing cycles for power
saving.
During normal CDMA operation, i.e., the module is connected to a CDMA network, the duration
of a power saving period varies. It may be calculated using the following formula:
T=2i * 1.28s (16 slots of 80ms)
The slot cycle index i is determined by the CDMA network and can be an integer between -4
to 7 inclusive. The typical value is 2. Therefore, the typical power saving period would be
(22)*1.28s = 5.12s.
3.4.2
Timing of the CTS0 Signal, CDMA
As long as PCS3 is operated via the ASC0 interface and not in power saving mode, the CTS0
line is always active. This means that while attached to a network the CTS0 signal will be tem
poraly active during each paging.
After a concluding activity on the serial interface ASC0 - and depending on the module’s other
activities - it takes by default 5 seconds before CTS0 goes inactive (again) and power saving
starts. The 5 second delay period can be configured using the AT^SCFG parameter "MEopMode/PwrSave", (see [1]).
With regard to programming or using timeouts, the UART must take the varying CTS0 inactivity
periods into account.
Note: Hardware handshaking is mandatory if employing PCS3’s ASC0 interface with enabled
power saving. Thus AT commands are only recognized by the module while CTS0 is active.
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3.4 Power Saving
3.4.3

Wake up from or Disabling Power Saving
The RTS0 line can be used to wake up the module from its power saving SLEEP mode. RTS0
activation (high to low transition) may be employed to cut short pauses between listening to
paging messages. Following an RTS toggle the module will return to SLEEP mode 5 seconds
after the last character was sent over the interface. This default delay period can be configured
using the AT^SCFG parameter "MEopMode/PwrSave", .
If not regularly woken up from power saving (through network requirements or by means of
RTS toggling as described above), the power saving timeout recommended for the AT^SCFG
parameter "MEopMode/PwrSave", ensures that the module regularly
wakes up from its power saving state (SLEEP mode). It is recommended to configure a regular
module wake up, especially if the radio interface is switched off (Airplane mode) and the module is connected via serial interface (i.e., AT^SDPORT=2) to an external application without direct access to its RTS0 line (e.g., an application using standard Windows/Linux serial device
drivers).
The AT^SCFG parameter "MEopMode/PwrSave", can be used to disable
power saving completely, i.e., the module will no longer enter SLEEP mode but remain in IDLE
mode instead. Please note that if this setting is used to avoid implementing hardware handshaking on ASC0, it is mandatory to have RTS0 pulled down or left open (an internal pull down
is available).
For more information on power saving and the appropriate AT^SCFG parameters to configure
the power save behavior see [1].
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3.5 RTC Backup
3.5
RTC Backup
The internal Real Time Clock of PCS3 is supplied from a separate voltage regulator in the power supply component which is also active when PCS3 is in Power Down mode and BATT+ is
available.
In addition, you can use the VDDLP line on the SMT interface to backup the RTC from an external capacitor or a battery (rechargeable or non-chargeable). The capacitor is charged from
the internal LDO of PCS3. If the voltage supply at BATT+ is disconnected the RTC can be powered by the capacitor. The size of the capacitor determines the duration of buffering when no
voltage is applied to PCS3, i.e. the greater the capacitor the longer PCS3 will save the date and
time. It limits the output current of an empty capacitor or battery.
Figure 8 show various sample configurations.
Module
Non chargeable battery
BATT+
Chargeable battery
Capacitor
0.8k
LDO
Processor and power
management
1k
VDDLP
SMT interface
3.2V
or
or
RTC
GND
Figure 8: RTC supply variants
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PCS3 Hardware Interface Description
3.6 USB Interface
3.6
USB Interface
PCS3 supports a USB 2.0 Full Speed (12Mbit/s) compliant. The USB interface is primarily
intended for use as command and data interface and for downloading firmware.
The external application is responsible for supplying the VUSB_IN line. This line is used for cable detection only. The USB part (driver and transceiver) is supplied by means of BATT+. This
is because PCS3 is designed as a self-powered device compliant with the “Universal Serial Bus
Specification Revision 2.0”1.
Module
SMT
VREG (3.8V)
lin. reg.
BATT+
GND
1)
USB part
VBUS
Detection only
VUSB_IN
RS
RS
DP
DN
Host wakeup
2)
USB_DP
2)
USB_DN
RING0
WAKEUP
1)
All serial (including RS)and pull-up resistors for data lines are implemented.
The USB interface is operated in Full Speed (12Mbit/s), it is recommended to take special
care routing the data lines USB_DP and USB_DN. Application layout should in this
case implement a differential impedance of 90Ohm for proper signal integrity.
2)
Figure 9: USB circuit
To properly connect the module's USB interface to the external application, a USB 2.0 compatible connector and cable or hardware design is required. For more information on the USB related electrical signals see Table 22.
1.
The specification is ready for download on http://www.usb.org/developers/docs/
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3.6 USB Interface
3.6.1

Reducing Power Consumption
While a USB connection is active, the module will never switch into SLEEP Mode. Only if the
USB interface is in Suspended state or Detached (i.e., VUSB_IN = 0) is the module able to
switch into SLEEP mode thereby saving power. There are two possibilities to enable power reduction mechanisms:
•
Recommended implementation of USB Suspend/Resume/Remote Wakeup:
The USB host should be able to bring its USB interface into the Suspended state as
described in the “Universal Serial Bus Specification Revision 2.0“1. For this functionality to
work, the VUSB_IN line should always be kept enabled. On incoming calls and other events
PCS3 will then generate a Remote Wakeup request to resume the USB host controller.
See also [5] (USB Specification Revision 2.0, Section 10.2.7, p.282):
"If USB System wishes to place the bus in the Suspended state, it commands the Host Controller to stop all bus traffic, including SOFs. This causes all USB devices to enter the Suspended state. In this state, the USB System may enable the Host Controller to respond to
bus wakeup events. This allows the Host Controller to respond to bus wakeup signaling to
restart the host system."
•
Implementation for legacy USB applications not supporting USB Suspend/Resume:
As an alternative to the regular USB suspend and resume mechanism it is possible to
employ the RING0 or WAKEUP line to wake up the host application in case of incoming
calls or events signalized by URCs while the USB interface is in Detached state (i.e.,
VUSB_IN = 0). Every wakeup event will force a new USB enumeration. Therefore, the
external application has to carefully consider the enumeration timings to avoid loosing any
signalled events. For details on this host wakeup functionality see Section 3.10.4.
1.
The specification is ready for download on http://www.usb.org/developers/docs/
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PCS3 Hardware Interface Description
3.7 Serial Interface ASC0
3.7

Serial Interface ASC0
PCS3 offers an 8-wire unbalanced, asynchronous modem interface ASC0 conforming to ITUT V.24 protocol DCE signalling. The electrical characteristics do not comply with ITU-T V.28.
The significant levels are 0V (for low data bit or active state) and 1.8V (for high data bit or inactive state). For electrical characteristics please refer to Table 22. For an illustration of the interface line’s startup behavior see Section 3.10.6.
PCS3 is designed for use as a DCE. Based on the conventions for DCE-DTE connections it
communicates with the customer application (DTE) using the following signals:
• Port TXD @ application sends data to the module’s TXD0 signal line
• Port RXD @ application receives data from the module’s RXD0 signal line
Figure 10: Serial interface ASC0
Features:
• Includes the data lines TXD0 and RXD0, the status lines RTS0 and CTS0 and, in addition,
the modem control lines DTR0, DSR0, DCD0 and RING0.
• ASC0 is designed for controlling voice calls, transferring data and for controlling the module
with AT commands.
• Full multiplexing capability allows the interface to be partitioned into virtual channels.
• The RING0 signal serves to indicate incoming calls and other types of URCs (Unsolicited
Result Code). It can also be used to send pulses to the host application, for example to
wake up the application from power saving state. See [1] for details on how to configure the
RING0 line by AT^SCFG.
• Configured for 8 data bits, no parity and 1 stop bit.
• ASC0 can be operated at fixed bit rates from 9600bps up to 921600bps.
• Supports RTS0/CTS0 hardware flow control.
• Wake up from SLEEP mode by RTS0 activation (high to low transition).
Note. If the ASC0 serial interface is the application’s only interface, it is suggested to connect
test points on the USB signal lines as a potential tracing possibility.
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PCS3 Hardware Interface Description
3.7 Serial Interface ASC0
Table 9: DCE-DTE wiring of ASC0
V.24 circuit DCE
DTE
Line function
Signal direction
Line function
Signal direction
103
TXD0
Input
TXD
Output
104
RXD0
Output
RXD
Input
105
RTS0
Input
RTS
Output
106
CTS0
Output
CTS
Input
108/2
DTR0
Input
DTR
Output
107
DSR0
Output
DSR
Input
109
DCD0
Output
DCD
Input
125
RING0
Output
RING
Input
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PCS3 Hardware Interface Description
3.8 Analog Audio Interface
3.8

Analog Audio Interface
PCS3 has an analog audio interface with a balanced analog microphone input and a balanced
analog earpiece output. A supply voltage and an analog ground connection are provided at
dedicated lines.
PCS3 offers eight audio modes which can be selected with the AT^SNFS command. The electrical characteristics of the voiceband part vary with the audio mode. For example, sending and
receiving amplification, sidetone paths, noise suppression etc. depend on the selected mode
and can in parts be altered with AT commands (except for mode 1).
Please refer to Section 6.7 for specifications of the audio interface and an overview of the audio
parameters. Detailed instructions on using AT commands are presented in [1]. Table 25 summarizes the characteristics of the various audio modes and shows what parameters are supported in each mode.
When shipped from factory, all audio parameters of PCS3 are set to audio mode 1. This is the
default configuration optimized for the Votronic HH-SI-30.3/V1.1/0 handset and used for type
approving the Cinterion Wireless Modules reference configuration. Audio mode 1 has fix parameters which cannot be modified. To adjust the settings of the Votronic handset simply
change to another audio mode.
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PCS3 Hardware Interface Description
3.8 Analog Audio Interface
3.8.1
Microphone Inputs and Supply
The differential microphone inputs MICP and MICN present variable impedances depending
on the gain. The microphone inputs must be decoupled by capacitors Ck (typical 1µF). The input stage uses a differential operational amplifier circuit with programmable resistors in the input and the feedback path. The detailed structure of this stage and the following uplink path is
shown in Figure 11. The input can be controlled by the AT command AT^SNFI. Command parameters with their effect are mentioned in the figure and marked in . More information
about audio AT commands can be found in Section 6.7 and [1].
Module
Rs
VMIC
0dBm
Ck
VMIC
or 24dBm
MICN
AGND
PCM
Ck
MICP

Rs
AGND
AGND
GND
GND
GND Line leading burst current
V Noise
Connection Resistance
Application GND
Figure 11: Structure of Audio Input and Supply
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3.8 Analog Audio Interface

MICP leads the signal via to the non-inverting input of the operational amplifier which is then
connected via to AGND. The gain of the input stage can be programmed by the parameter
, A gain stage follows that can be set to 0dB or 24dB using . If 24dB is
spec- ified, the common mode rejection ratio is reduced accordingly.
Finally, the uplink gain can be scaled in the PCM path by the parameter.
It is recommended to use the AGND line for grounding the microphone circuit. AGND provides
for the same module ground potential the analog circuits of the module refer to. AGND must
not be connected to the system GND anywhere. Otherwise high burst peak currents may flow
across AGND causing humming in the uplink audio signal.
A regulated power supply for electret microphones is available at VMIC. The voltage at VMIC
is rated at 1.8V at 3mA and is available while audio is active (e.g., during a call).
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PCS3 Hardware Interface Description
3.8 Analog Audio Interface
The following figures show possible microphone and line connections.
470
2k2
VMIC
2k2
1µF
MICP
Module
10µF
MICN
1µF
5k6
AGND
Figure 12: Single ended microphone connection
The configuration shown in Figure 12 is suitable for short distances between microphone and
module. A typical electric microphone has a metal case connected to its ground pad. Since this
is routed directly to AGND, electro static discharges applied to the microphone will be easily
led away. It is recommended to use an additional RC-filter for VMIC (for example 470 Ohm and
10µF as shown in the figure) in case a high microphone gain is necessary.
If the microphone lines are longer, use the configuration shown in Figure 13. It is recommended
to use an additional RC-filter for VMIC (for example 1kOhm, 10µF and 1kOhm as shown in the
figure) in case a high microphone gain is necessary.
1k
VMIC
1k
1µF
MICP
10µF
Module
MICN
1µF
1k
1k
AGND
Figure 13: Differential microphone connection
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PCS3 Hardware Interface Description
3.8 Analog Audio Interface
Line output device
100nF
MICP
Module
MICN
-1
100nF
Figure 14: Line input
Using the line input configuration the output level of the ground related balanced source should
be as high as possible to achieve the best SNR. Since the input impedance of PCS3 is quite
high at low gains, the coupling capacitances may be smaller.
3.8.2
Loudspeaker Output
PCS3 provides a differential loudspeaker output EPP/EPN. If it is used as line output, the application should provide a capacitor decoupled differential input to eliminate humming. A single
ended connection to a speaker or a line input is strongly not recommended.
The following figures show the typical output configurations.
EPP
Module
EPN
Figure 15: Differential loudspeaker connection
EPP
Module
EPN
Figure 16: Line output connection
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PCS3 Hardware Interface Description
3.9 Digital Audio Interface
3.9
Digital Audio Interface
PCS3 supports a digital audio interface that can be employed either as pulse code modulation
(see Section 3.9.1) or as inter IC sound interface (see Section 3.9.2). Operation of these interface variants is mutually exclusive.
3.9.1
Pulse Code Modulation Interface (PCM)
PCS3’s PCM interface can be used to connect audio devices capable of pulse code modulation. The PCM functionality allows the use of a codec like the Freescale MC145483. Using the
AT^SAIC command you can activate and configure the PCM interface (see [1]).
The PCM interface supports the following modes:
• Master mode, slave mode
• Short frame synchronization
• 256kHz, 512kHz and 2048kHz bit clock
• Additional master mode with 128kHz, long frame synchronization
For the PCM interface configuration the parameters , and
of the AT^SAIC command can be configured. The following table lists possible combinations:
Table 11: Configuration combinations for the PCM interface
Configuration

Master, 128kHz, long frame
0 or 1
Master, 256kHz, short frame
0 or 1
Master, 512kHz, short frame
0 or 1
Master, 2048kHz, short frame
0 or 1
Slave, 256kHz, short frame
Slave, 512kHz, short frame
Slave, 2048kHz, short frame
In slave mode must be set according the source clock frequency. Being in master
mode clock and frame synchronization signals may be permanently switched on by
parameter. These signals may be used for clocking digital audio periphery
outside a call.
Table 12 lists the available PCM interface signals.
Table 12: Overview of PCM signal functions
Signal name on
SMT application
interface
Signal
configuration
inactive1
Signal
direction:
Master
Signal
direction:
Slave
Description
PCM_OUT
PD
PCM Data from PCS3 to external
codec
PCM_IN
PD
PCM Data from external codec to
PCS3
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PCS3 Hardware Interface Description
3.9 Digital Audio Interface
Table 12: Overview of PCM signal functions
Signal name on
SMT application
interface
Signal
configuration
inactive1
Signal
direction:
Master
Signal
direction:
Slave
Description
PCM_FSC
PD
Frame synchronization signal to/from
external codec
PCM_CLK
PD
Bit clock to/from external codec
1.
Inactive means no call, no tone generation and no external clock mode. PD = Pull down
The timing of a PCM short frame is shown in Figure 17. The timing for master and slave mode
is identical, except for the PCM_FSC and PCM_CLK signal direction (see Table 12).
125 µs
PCM_CLK
PCM_FSC
PCM_OUT
MSB
14
13
12
LSB
MSB
PCM_IN
MSB
14
13
12
LSB
MSB
Figure 17: PCM timing short frame (External codec 2048KHz)
The timing of a PCM long frame for the additional 128kHz master mode is shown in Figure 18.
PCM_CLK
PCM_FSC
PCM_OUT
LSB
MSB
14
13
LSB
MSB
14
PCM_IN
LSB
MSB
14
13
LSB
MSB
14
Figure 18: PCM timing long frame (master, 128kHz)
Please note that PCM data is always formatted as 16-bit uncompressed two’s complement. Also, all PCM data and frame synchronization signals are written to the PCM bus on the rising
clock edge and read on the falling edge.
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PCS3 Hardware Interface Description
3.9 Digital Audio Interface
3.9.2
I2C Interface
PCS3’s I2C compatible interface for FM radio support and Camera
I2C_SDA and I2C_SCL: I2C control bus Serial data line of the I2C bus (I2C_SDA) – the
standard required pull-up resistor is placed on the QSC device side; a pull-up resistor is not
required in the camera module. Serial clock line of the I2C bus (I2C_SCL) – the standard
required pull-up resistor is placed on the QSC device side; a pull-up resistor is not required in
the camera module.
The I2C interface features and limitation:
Two-wire bus for inter-IC communication
Support for external devices fabricated using any process (1.8 V only)
Support for external functions such as camera sensors, microcontrollers, FM radio ICs, LCD
driver, stereo DAC, and keyboard interface
Two operating modes with different transfer rates
Standard-mode: up to ~100 kbps
Fast-mode: up to ~400 kbps
The controller functions only as an I2C master, not a slave
Table 13 lists the available I2C interface signals.
Table 13: Overview of I2C signal functions
Signal name
Alternate
name
Signal configuration
inactive1
I/O
Description
I2CDAT
I2CDAT
PD
I/O
Serial data line of the I2C bus
I2CCLK
2CCLK
PD
I/O
Serial clock line of the I2C bus
1.
Inactive means no call, no tone generation and no external clock mode. PD = Pull down
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3.10 Control Signals
3.10
Control Signals
3.10.1
PWR_IND Signal
PWR_IND notifies the on/off state of the module. High state of PWR_IND indicates that the
module is switched off. The state of PWR_IND immediately changes to low when IGT is pulled
low. For state detection an external pull-up resistor is required.
Module
SMT interface
e.g. BATT+
Power supply
On/Off
(open drain
driver)
PWR_IND
Figure 21: PWR_IND signal
3.10.2
Network Connectivity Status Signals
The STATUS line serves to indicate the module’s network connectivity state and can be used
to control an externally connected LED as shown in Figure 22. To operate the LED a buffer,
e.g. a transistor or gate, must be included in the external application.
VCC
LED
STATUS
0 = LED off
1 = LED on
GND
Figure 22: LED Circuit (Example)
For electrical characteristics of the STATUS line see Table 22. The network connectivity signal
function is volatile and has to be activated after module startup with AT^SLED. For details on
the command as well as status and mode indications through blinking intervals see [1].
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3.10 Control Signals
3.10.3
Behavior of the RING0 Line (ASC0 Interface only)
The RING0 line is available on the first serial interface ASC0 (see also Section 3.7). The signal
serves to indicate incoming calls and other types of URCs (Unsolicited Result Code).
Although not mandatory for use in a host application, it is strongly suggested that you connect
the RING0 line to an interrupt line of your application. In this case, the application can be designed to receive an interrupt when a falling edge on RING0 occurs. This solution is most effective, particularly, for waking up an application from power saving. Note that if the RING0 line
is not wired, the application would be required to permanently poll the data and status lines of
the serial interface at the expense of a higher current consumption. Therefore, utilizing the
RING0 line provides an option to significantly reduce the overall current consumption of your
application.
The RING0 line behavior and usage can be configured by AT command. For details see [1]:
AT^SCFG.
3.10.4
Host Wakeup
If no call, data or message transfer is in progress, the host may shut down its own USB interface to save power. If a call or other request (URC) arrives, the host can be notified of this event
and be woken up again by a state transition of either the RING0 or the WAKEUP line. This functionality should only be used with legacy USB applications not supporting the recommended
USB suspend and resume mechanism as described in in the “Universal Serial Bus Specification Revision 2.0“1 (see also Section 3.6.1).
The behaviour of these RING0 or WAKEUP lines as host wakeup line has to be enabled and
configured by AT command (see [1]: AT^SCFG). Possible states are listed in Table 14. Please
note that it is not possible to use both lines in parallel. The WAKEUP signal just inverts the
RING0 signal in order to meet different application needs.
Table 14: Host wakeup lines
Signal
I/O
Description
RING0
Inactive to active low transition:
0 = The host shall wake up
1 = No wake up request
WAKEUP
Inactive to active high transition:
0 = No wake up request
1 = The host shall wake up
1.
The specification is ready for download on http://www.usb.org/developers/docs/
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3.10 Control Signals
3.10.5
Low Current Indicator
A low current indication is optionally available over the LC_IND line. By default, low current indication is disabled.
For the LC_IND signal to work as a low current indicator the feature has to be enabled by AT
command (see [1]: AT^SCFG: MEopMode/PowerMgmt/LCI).
If enabled, the LC_IND signal is high when the module is sleeping. During its sleep the module
will for the most part be slow clocked with 32kHz RTC.
Table 15: Low current indicator line
Signal
I/O/P
Description
LC_IND
Inactive to active high transition:
0 = High current consumption
The module draws its power via BATT+
1 = Low current consumption (only reached during SLEEP mode)
The module draws only a low current via BATT+
LC_IND
IBATT+
tLC
ILCpk
(typ. 150mA)
ILCmax <100mA
tLCpk<100µs
tLCru>
300µs
Figure 23: Low current indication timing
tLC
tLCpk
tLCru
ILCpk
ILCmax
Time for the IBATT+ current consumption: ILCmax<100mA.
Max. time duration for the inrush current peak at the end of the low current period.
When the LC_IND signal becomes inactive (low) the current ramps up to the
maximum low current value within tLCru.
When the module turns from sleep to normal operation some internal supply
voltages will be switched on. That causes a small inrush current peak.
During the low current period tLC the current consumption does not exceed
the ILCmax value.
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3.10 Control Signals
3.10.6
RING0 (ASC0), WAKEUP and LCI_IND Startup Behavior
Table 24 shows the startup behavior of the control lines described in the above sections.
SDPORT=4
Power startup undefined
ASC0 set up (by firmware)
ASC0 ready (by firmware)
1st init (power on reset)
URC Wake up signalling
2nd init (startup phase)
Firmware start
Sleep mode
„SYSSTART“
CTS0
RXD0
1)
RING0
1)
„keep“
DSR0
DCD0
TXD0
RTS0
DTR0
1)
1)
„keep“
WAKEUP
2)
LCI_IND
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0.6ms
2.6ms
appr. 4.0s...4.5s
appr. 1.5s
appr. 34ms
(depends on BATT+
capacitors 0 ms
0.6ms
151ms
undefined (port not supplied)
100ms 1)
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PCS3 Hardware Interface Description
5 Antenna Interfaces
Wakeup State
RING0
WAKEUP
Configuration
1)
(P)
"local"
AT^SCFG="URC/Ringline", "asc0"
"off"
"wakeup"
Configuration
"0"
"1" (P)
AT^SCFG=
"2"
"URC/Ringline/ActiveTime",
"keep"
2)
Pull down (appr. 100k)
iven high driven
low dashed line:
lternative funtion
low (active) low (PD)
low (active) low (PD)
high
low (PD)
high
high (active)
Wakeup Active Time
for RING0, WAKEUP
4.6ms-9ms
100ms
1s
keeps active until
1st time enter sleep mode
(P) Power up default value
If needed: During runtime the LCI feature has to be enabled by
AT^SCFG="MEopMode/PowerMgmt/LCI","enabled"
Figure 24: RING0 (ASC0), WAKEUP and LCI_IND startup behavior
Antenna Interfaces
5.1
CDMA Antenna Interface
The PCS3 only CDMA main Antenna, PCS3 didn’t have GPS for a GNSS receiver
The PCS3 CDMA antenna interface comprises a main CDMA antenna as well as an optional
CDMA Rx diversity antenna to improve signal reliability and quality1. The interface has an
impedance of 50ohm PCS3 is capable of sustaining a total mismatch at the antenna interface
without any damage, even when transmitting at maximum RF power.
The external antenna must be matched properly to achieve best performance regarding
radiation power, modulation accuracy and harmonic suppression. Matching networks are not
included on the PCS3 PCB and should be placed in the host application, if the antenna does
not have an impedance of 50ohm
Regarding the return loss PCS3 provides the following values in the active band:
Table 16: Return loss in the active band
State of module
Return loss of module
Recommended return loss of application
Receive
> 8dB
> 12dB
Transmit
not applicable
> 12dB
Idle
< 5dB
not applicable
1.
By delivery default the optional CDMA Rx diversity antenna is configured as available for the module. To
avoid negative side effects and performance degradation it is recommended to disable the diversity antenna path if
- the host application does not support a diversity antenna
- the host application includes a diversity antenna - but a network simulator is used for development and
performance tests.
Please refer to [1] for details on how to configure antenna settings.
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PCS3 Hardware Interface Description
5.1 CDMA Antenna Interface
5.1.1
Antenna Installation
The antenna is connected by soldering the antenna pads and their neighboring ground pads
directly to the application’s PCB.
10
11
12
13
14
15
16
BATT
BATT
GND
ANT
CDMA
GND
nc
GND
nc
GND
nc
BATT+
_CDMA
BATT+
_CDMA
nc
GND
nc
GND
Figure 25: Antenna pads
The distance between the antenna pads and their neighboring GND pads has been optimized
for best possible impedance. To prevent mismatch, special attention should be paid to these
pads on the application’ PCB.
The wiring of the antenna connection, starting from the antenna pad to the application’s antenna should result in a 50
line impedance. Line width and distance to the GND plane need
to be optimized with regard to the PCB’s layer stack. Some examples are given in Section
5.1.2.
To prevent receiver desensitization due to interferences generated by fast transients like high
speed clocks on the external application PCB, it is recommended to realize the antenna connection line using embedded Stripline rather than Micro-Stripline technology. Please see Section 5.1.2 for examples of how to design the antenna connection in order to achieve the
required 50
line impedance.
For type approval purposes, the use of a 50 coaxial antenna connector (U.FL-R-SMT) might
be necessary. In this case the U.FL-R-SMT connector should be placed as close as possible
to PCS3‘s antenna pad.
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5.1 CDMA Antenna Interface
5.1.2
5.1.2.1

RF Line Routing Design
Line Arrangement Examples
Several dedicated tools are available to calculate line arrangements for specific applications
and PCB materials - for example from http://www.polarinstruments.com/ (commercial software)
or from http://web.awrcorp.com/Usa/Products/Optional-Products/TX-Line/ (free software).
Coated coplanar strips with ground
This section gives two line arrangement examples for differential coated coplanar strip with
ground
Figure 26:
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coated coplanar strip with ground
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PCS3 Hardware Interface Description
5.1 CDMA Antenna Interface

Differential coated coplanar strips with ground
This section gives two line arrangement examples for differential coated coplanar strip with
ground
Figure 27: differential coated coplanar strip with ground
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PCS3 Hardware Interface Description
5.1 CDMA Antenna Interface
5.1.2.2
Routing Example
Interface to RF Connector
Figure 28 shows a sample connection of a module‘s antenna pad at the bottom layer of the
module PCB with an application PCB‘s coaxial antenna connector. Line impedance depends
on line width, but also on other PCB characteristics like dielectric, height and layer gap. The
sample stripline width of 0.33mm is recommended for an application with a PCB layer stack
resembling the one of the PCS3 evaluation board shown in Figure 29. For different layer stacks
the stripline width will have to be adapted accordingly.
GND
e.g.
ANT_
MAIN
GND
Stripline (50Ohm) on top layer
of evaluation board from
antenna pad to module edge
Width = 0.33 mm
Ground connection
Edge of module PCB
50Ohm micro stripline
GND
GND
E.g., U.FL antenna
connector
Figure 28: Routing to application‘s RF connector
Figure 29: PCS3 evaluation board layer table
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PCS3 Hardware Interface Description
6 Electrical, Reliability and Radio Characteristics
Electrical, Reliability and Radio Characteristics
6.1
Absolute Maximum Ratings
The absolute maximum ratings stated in Table 17 are stress ratings under any conditions.
Stresses beyond any of these limits will cause permanent damage to PCS3.
Table 17: Absolute maximum ratings
Parameter
Min
Max
Unit
Supply voltage BATT+
-0.5
+4.2
Voltage at all digital lines in POWER DOWN mode
-0.3
+0.3
Voltage at digital lines in normal operation
-0.3
+2.1
Voltage at analog audio lines in normal operation
(VMIC=on)
-0.3
+1.8
Voltage at analog audio lines during audio off mode
(VMIC=off)
-0.3
+0.3
VDDLP input voltage
-0.3
+3.5
Microphone supply (VMIC) maximum current to GND
mA
VEXT maximum current shorted to GND
-300
mA
VUSB_IN, USB_DN, USB_DP
-0.3
5.75
Voltage at PWR_IND line
-0.5
5.5
mA
VBATT+
PWR_IND input current if PWR_IND= low
-0.5
Voltage at following signals:
IGT, EMERG_OFF
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PCS3 Hardware Interface Description
6.2 Operating Temperatures
6.2
Operating Temperatures
Table 18: Board temperature
Parameter
Operating temperature range
Min
Typ
Max
Unit
-30
+25
+85
°C
+95
°C
>+95
°C
Restricted temperature range
-40
Automatic shutdown2
Temperature measured on PCS3 board
<-40
1.
2.
---
Restricted operation allows normal mode speech calls or data transmission for limited time until automatic thermal shutdown takes effect. Within the restricted temperature range (outside the operating
temperature range) the specified electrical characteristics may be in- or decreased.
Due to temperature measurement uncertainty, a tolerance on the stated shutdown thresholds may occur.
The possible deviation is in the range of ± 2°C at the overtemperature and undertemperature limit.
6.3
Storage Conditions
The conditions stated below are only valid for modules in their original packed state in weather
protected, non-temperature-controlled storage locations. Normal storage time under these
conditions is 12 months maximum.
Table 19: Storage conditions
Type
Condition
Unit
Reference
Air temperature: Low
High
-25
+40
°C
IPC/JEDEC J-STD-033A
Humidity relative: Low
High
10
90 at 40°C
IPC/JEDEC J-STD-033A
Air pressure:
70
106
kPa
IEC TR 60271-3-1: 1K4
IEC TR 60271-3-1: 1K4
Movement of surrounding air
1.0
m/s
IEC TR 60271-3-1: 1K4
Water: rain, dripping, icing and
frosting
Not allowed
---
---
Radiation:
1120
600
W/m2 ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb
ETS 300 019-2-1: T1.2, IEC 60068-2-2 Bb
Low
High
Solar
Heat
Chemically active substances
Not recommended
IEC TR 60271-3-1: 1C1L
Mechanically active substances
Not recommended
IEC TR 60271-3-1: 1S1
Vibration sinusoidal:
Displacement
Acceleration
Frequency range
1.5
2-9 9-200
Shocks:
Shock spectrum
Duration
Acceleration
semi-sinusoidal
ms
50
m/s2
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IEC TR 60271-3-1: 1M2
mm
m/s2
Hz
IEC 60068-2-27 Ea
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PCS3 Hardware Interface Description
6.4 Reliability Characteristics
6.4
Reliability Characteristics
The test conditions stated below are an extract of the complete test specifications.
Table 20: Summary of reliability test conditions
Type of test
Conditions
Standard
Vibration
Frequency range: 10-20Hz; acceleration: 5g
Frequency range: 20-500Hz; acceleration: 20g
Duration: 20h per axis; 3 axes
DIN IEC 60068-2-61
Shock half-sinus
Acceleration: 500g
Shock duration: 1msec
1 shock per axis
6 positions (± x, y and z)
DIN IEC 60068-2-27
Dry heat
Temperature: +70 ±2×C
Test duration: 16h
Humidity in the test chamber: < 50%
EN 60068-2-2 Bb
ETS 300 019-2-7
Temperature
change (shock)
Low temperature: -40×C ±2×C
High temperature: +85×C ±2×C
Changeover time: < 30s (dual chamber system)
Test duration: 1h
Number of repetitions: 100
DIN IEC 60068-2-14 Na
High temperature: +55×C ±2×C
Low temperature: +25×C ±2×C
Humidity: 93% ±3%
Number of repetitions: 6
Test duration: 12h + 12h
DIN IEC 60068-2-30 Db
Temperature: -40 ±2×C
Test duration: 16h
DIN IEC 60068-2-1
Damp heat cyclic
Cold (constant
exposure)
1.
6.5
ETS 300 019-2-7
ETS 300 019-2-5
For reliability tests in the frequency range 20-500Hz the Standard’s acceleration reference value was increased to 20g.
Pad Assignment and Signal Description
The SMT application interface on the PCS3 provides connecting pads to integrate the module
into external applications. The following Table 21 lists the pads’ assignments, Figure 32 (bottom view) and Figure 33 (top view) show the connecting pads’ numbering plan.
Please note that a number of connecting pads are marked as reserved for future use (rfu) or
ground (GND) and further qualified as either (dnu), (GND) or (nc):
• Pads marked "rfu" and qualified as "dnu" (do not use) may be soldered but should not be
connected to an external application.
• Pads marked "rfu" and qualified as "GND" (ground) are assigned to ground with PCS3 modules, but may have different assignments with future Cinterion products using the same pad
layout.
• Pads marked "GND" and qualified as "nc" (not connected) are internally not connected with
PCS3 modules but may be soldered and arbitrarily be connected to external ground.
Because with surface mount modules the heat is transported through the solder pads to the
external application’s PCB, it is generally recommended to solder all pads.
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PCS3 Hardware Interface Description
6.5 Pad Assignment and Signal Description
Table 21: Overview: Pad assignments
Pad
No.
Signal Name
Pad Signal Name
No.
Pad
No.
Signal Name
A4
A5
A6
A7
A8
A9
A10
A11
BATT+ CDMA2
GND
GND
nc
GND
GND
GND
GND
E2
E3
E4
E5
E12
E13
E14
E15
L2
L3
L4
L5
L6
L7
L8
L9
GND
GND
GND
nc
nc
nc
nc
nc
A12
nc
E16
L10
nc
13
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
GND
BATT+ CDMA
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
F1
F2
F3
F4
F13
F14
F15
F16
G1
G2
G3
G4
GND
GND
GND
GND
nc
nc
nc
EPP( voice&data variant
only )
EPN( voice&data variant
only)
GND
GND
GND
GND
nc
I2CCLK
I2CDAT
GPIO10
GND
GND
GND
nc
L11
L12
L13
L14
L15
L16
M2
M3
M4
M5
M6
M7
B14
STATUS
G13
nc
M8
C2
GND
G14
GPIO7
M9
C3
GND
G15
GPIO8
M10
nc
nc
nc
CCRST(option CSIM)
CCCLK(option CSIM)
IGT
GND
GND
PWR IND
VEXT
GND
PCM_IN( voice&data
variant only)
PCM_CLK( voice&data
variant only)
PCM_FSC( voice&data
variant only)
PCM_OUT( voice&data
variant only)
C4
C5
C6
C7
C8
C9
C10
C11
C12
C13
C14
C15
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
D16
E1
GND
GND
GND
GND
GND
GND
GND
GND
nc
nc
VMIC
AGND
GND
GND
GND
GND
nc
GND
GND
GND
GND
GND
GND
GND
GND
GND
MICP
MICN
nc
G16
H1
H2
H3
H4
H13
H14
H15
H16
J1
J2
J3
J4
J13
J14
J15
J16
K1
K2
K3
K4
K5
K12
K13
K14
K15
K16
L1
GPIO9
GND
GND
GND
GND
nc
GPIO4
GPIO5
GPIO6
GND
GND
GND
GND
nc
GPIO1
GPIO2
GPIO3
ANT CDMA
GND
GND
GND
GND
nc
nc
CCIO(option CSIM)
CCVCC(option CSIM)
nc
GND
M11
M12
M13
M14
M15
N3
N4
N5
N6
N7
N8
N9
N10
N11
N12
N13
N14
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
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nc
ADC2 IN
ADC1 IN
CCIN(option CSIM)
VDDLP
nc
nc
VUSB IN
nc
nc
CTS0
DCD0
RTS0
GND
nc
BATT+
EMERG OFF
USB DP
USB DN
nc
nc
DTR0
DSR0
RING0
RXD0
TXD0
BATT+
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PCS3 Hardware Interface Description
6.5 Pad Assignment and Signal Description
Figure 32: PCS3 bottom view: Pad assignments
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PCS3 Hardware Interface Description
6.5 Pad Assignment and Signal Description
Please note that the reference voltages listed in Table 22 are the values measured directly on
the PCS3 module. They do not apply to the accessories connected.
Table 22: Signal description
Function
Signal name
IO
Signal form and level
Comment
Power
supply
BATT+_CDMA
BATT+_CDMA
VImax = 4.2V
VInorm = 3.8V
VImin = 3.3V during Tx burst on board
Imax
800mA, during Tx burst
BATT+
Lines of BATT+ and GND
must be connected in parallel for supply purposes
because higher peak currents may occur.
VImax = 4.2V
VInorm = 3.8V
Minimum voltage must not
VImin = 3.3V during Tx burst on board fall below 3.3V including
Imax = 250mA
drop, ripple, spikes.
Power
supply
GND
External
supply
voltage
VEXT
Ground
Application Ground
CLmax = 1µF
VEXT may be used for
application circuits. Not
available in Power down
mode.
If unused keep line open
and enable power save
mode via AT^SCFG=
"MEopMode/PowerMgmt/
VEXT", "low" (see [1])
The external digital logic
must not cause any spikes
or glitches on voltage
VEXT.
High power mode:
VO = 1.80V +1% -5%
IOmax = -50mA
Power save mode:
VO = 1.80V +2% -5%
IOmax = -10mA
Ignition
IGT
RPU
160k , CI
1nF
VOHmax=1.85V
VIHmax =2.2V
VIHmin = 1.17V
VILmax = 300mV
Low impulse width > 100ms
This signal switches the
module ON.
It is recommended to drive
this line low by an open
drain or open collector
driver connected to GND.
Emergency Off
EMERG_OFF
RPU
It is recommended to drive
this line low by an open
drain or open collector
driver connected to GND.
160k , CI
1nF
VOHmax=1.85V
VIHmax =2.2V
VIHmin = 1.17V
VILmax = 300mV
~~|
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If unused keep line open.
|~~ low impulse width > 40ms
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PCS3 Hardware Interface Description
6.5 Pad Assignment and Signal Description
Table 22: Signal description
Function
Signal name
IO
Signal form and level
RTC
Back up
VDDLP
VOmax = 3.20V while BATT+ =>3.3V If unused keep line open.
RI = 1.8k 
To employ the SMPL feaVI = 1.5V…3.25V at Imax= 10µA while ture the VDDLP line has to
BATT+ = 0V
supplied for at least 2 seconds after a possible power
loss (e.g., by connecting a
10µF capacitor). See also
Section 3.3.6.
Comment
Connectivity Status
STATUS
VOLmax = 0.45V at I = 2mA
VOHmin = 1.35V at I = -2mA
VOHmax = 1.85V
Status signalling e.g. with
ext. LED circuit
Serial
Modem
Interface
ASC0
RXD0
If unused keep line open.
CTS0
VOLmax = 0.45V at I = 2mA
VOHmin = 1.35V at I = -2mA
VOHmax = 1.85V
DSR0
DCD0
RING0
TXD0
RTS0
DTR0
VMIC
Analog
Audio
interface
VILmax = 0.6V at 30µA
VIHmin = 1.20V at -30µA
VIHmax = 2V
VOtyp = 1.8V
Imax = 3 mA
Microphone supply for customer feeding circuits.
If unused keep line open.
EPP
EPN
Differential,
Minimum load resistance 32
typ. 5.0Vpp at no load
PCM level = +3dBm0, 1.02kHz sine
wave
Balanced output for earphone or balance output for
line out. See also Section
6.7.4.
If unused keep line open.
MICP
MICN
ZItyp = 94k
@ 0dB
gain ZItyp = 5.8k
30dB gain
Vinmax = 2.57Vpp
(for 3dBm0 @ 0dB gain)
Balanced differential microphone with external feeding
circuit (using VMIC and
AGND) or balanced differential line input. See also
Section 6.7.4.
Use coupling capacitors.
If unused keep lines open.
AGND
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Analog ground
Page 69 of 101
GND level for external
audio circuits
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PCS3 Hardware Interface Description
6.5 Pad Assignment and Signal Description
Table 22: Signal description
Function
Signal name
Pulse Code PCM_IN
Modulation
PCM_CLK
(PCM)
PCM_FSC
Inter IC
interface
(I2C)
Power
Indicator
IO
Signal form and level
PCM_OUT
VILmax = 0.6V at 30µA
V min = 1.20V at -30µA
I/O VIHmax = 2V
IH
I/O VOLmax = 0.45V at I = 2mA
VOHmin = 1.35V at I = -2mA
O VOHmax = 1.85V
I2CDAT
I2CCLK
PWR_IND
Comment
In Master mode PCM_FSC
and PCM_CLK are output
signals1.
In Slave mode PCM_FSC
and PCM_CLK are input
signals. See also Section
3.9.1.
If unused keep line open.
VOLmax = 0.45V at I = 2mA
VOHmin = 1.35V at I = -2mA
VOHmax = 1.85V
VIHmax = 5.5V
VOLmax = 0.4V at Imax = 2mA
PWR_IND (Power Indicator) notifies the module’s
on/off state.
PWR_IND is an open collector that needs to be connected to an external pullup resistor. Low state of the
open collector indicates
that the module is on. Vice
versa, high level notifies the
power-down mode.
Therefore, the signal may
be used to enable external
voltage regulators which
supply an external logic for
communication with the
module, e.g. level converters.
USB
Host
wakeup
VUSB_IN
USB_DN
USB_DP
I/O All electrical characteristics according
to USB Implementers’ Forum, USB
I/O 2.0 Full Speed Specification.
WAKEUP
PCS3_HD_v01.000
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VINmin = 3.0V
VINmax = 5.25V
Active current
IItyp = 105µA (max 130µA)
Suspend current
IItyp = 135µA (max 200µA)
VOLmax = 0.45V at I = 2mA
VOHmin = 1.35V at I = -2mA
VOHmax = 1.85V
Page 70 of 101
If the USB interface is not
used please connect this
line to GND.
If lines are unused keep
lines open.
USB only support Full
Speed mode operation
requires a differential
impedance of 90ohm

Can be used as a host
wakeup line similar to
RING0 (see Section
3.10.4)1.
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PCS3 Hardware Interface Description
6.5 Pad Assignment and Signal Description
Table 22: Signal description
Function
Signal name
IO
Signal form and level
Comment
Low
Current
Indication
LC_IND
VOLmax = 0.45V at I = 2mA
VOHmin = 1.35V at I = -2mA
VOHmax = 1.85V
If the function is enabled
(see Section 3.10.5)1.
VIHmax = 2V
RPD= appr. 100kOhm
If the function is disabled
(see Section 3.10.5)1.
1.
Signal state if not configured: I, PD (appr. 100k)
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PCS3 Hardware Interface Description
6.6 Power Supply Ratings
6.6
Power Supply Ratings
Table 23: Power supply ratings
Description
BATT+ Supply voltage
Conditions
Min Typ
Max Unit
Directly measured at Module.
Voltage must stay within the min/max values,
including voltage drop, ripple, spikes
3.3
4.2
400
mV
20
16
mVpp
mVpp
3.8
Maximum allowed Normal condition, power control level for
voltage drop dur- Pout max
ing transmit burst
Voltage ripple
Normal condition, power control level for
Pout max
@ f <= 250 kHz
@ f > 250 kHz
IVDDLP
@ 3V
OFF State supply
current
RTC backup @ BATT+ = 0V
4.0
µA
IBATT+ 1
OFF State supply
current
POWER DOWN
39
µA
Average CDMA
supply current
SLEEP2 (USB Suspend or Disconnected
and no communication via ASC0) @ SCI=0
mA
SLEEP2 (USB Suspend or Disconnected
and no communication via ASC0) @ SCI=2
mA
SLEEP2 (USB Suspend or Disconnected
and no communication via ASC0) @ SCI=7
mA
1xRTT Data transfer BC0 @ +24dBm
450
mA
1xRTT Data transfer BC1 @ +24dBm
500
mA
1xRTT Data transfer BC10 @ +24dBm
460
mA
IVUSB_IN
1.
2.
USB suspend and active ratings are mentioned in Table 22: VUSB_IN.
With an impedance of ZLOAD=50Ohm at the antenna connector.
Average time for SLEEP mode: 5min
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PCS3 Hardware Interface Description
6.7 Electrical Characteristics of the Voiceband Part
6.7
Electrical Characteristics of the Voiceband Part
6.7.1
Setting Audio Parameters by AT Commands
Audio mode 1 is the basic audio mode optimized for the Votronic reference handset (see Section 10.1). The default parameters are determined for type approval and are not adjustable with
AT commands.
The audio modes 2 to 8 can be temporarily adjusted according to the AT command parameters
listed in the table below. The audio parameters are set with the AT commands AT^SNFI as well
as AT^SNFO and stored volatile for the current audio mode (see [1]). For a model of how the
parameters influence the audio signal path see Section 6.7.2.
Table 24: Audio parameters adjustable by AT command
Parameter
Influence to
Range
Gain range
micAmp1
MICP/MICN second analog amplifier gain of before ADC
0,1
0 or 24dB
micTxVol
Digital gain of input signal after ADC 0,
1...65535
Calculation
AT^SNFI=
Mute,
-84...+12dB
20 * log (micTxVol/
16384)
AT^SNFO=
-57...+6dB
1dB steps
Digital Volume of output signal after 0,
speech decoder, before summation 1…41
of sidetone and DAC
Mute,
-48...+12dB
1.5dB steps
Digital attenuation of sidetone
Mute,
-96...0dB
cdcRxGain
Analog gain of output signal after
summation of sidetone
rxVol
stGain
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0...63
0,
1...65535
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20 * log (stGain/
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PCS3 Hardware Interface Description
6.7 Electrical Characteristics of the Voiceband Part
6.7.2
Audio Programming Model
The audio programming model shows how the signal path can be influenced by varying AT
command parameters: AT^SNFI allows to set the parameters , and,
whereas the parameters , and can be adjusted with AT^SNFO.
For more information on the AT commands and parameters see Section 6.7.1 and [1].
If the digital audio interface (PCM) is selected, the parameters , and
have no influence; because they are not involved in the signal paths.(PCS3 didn’t support I2S)
Application
gain=0dB

Digital logical channels:
I S right channel
Aux MIC
I S left channel / PCM mono
Main MIC
Codec
Echo
canceller,
PCM mono
I S left channel
Speaker
PCM /
IS
Interface
Noise
suppresson
IS
Interface
with
one or two
Microphones
Codec
VMIC

Speech
coder
Filter
flat gain=0dB
gain=0dB
MIC
gain=0dB
Microphon
e feeding
PCM

EP
Filter
32 Ohms
Speech
coder
flat gain=0dB
Module
Red: Audio mode parameters adjustable by AT commands
Orange: Selectable Audio Mode Parameter - on request adjustable by Cinterion
Figure 34: Audio programming model
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PCS3 Hardware Interface Description
6.7 Electrical Characteristics of the Voiceband Part
6.7.3
Characteristics of Audio Modes
The electrical characteristics of the voiceband part depend on the current audio mode set with AT command. All values are noted for default gains, e.g.
the default parameters are left unchanged.
Table 25: Voiceband characteristics
Audio mode no.
AT^SNFS=
11
Name
Default Handset
Router
User Handset
Headset
Speaker phone
Transparent
Purpose
DSB with
Votronic handset
Analog phone
interface
Mono Headset
Handheld
speakerphone
Direct access
to speech
coder
TX-Filters
Adjusted
Flat
Adjusted
Flat
Flat
Flat
RX-Filters
Adjusted to fit
artificial ear type
3.2 low leakage
Flat
Adjusted to fit
artificial ear type
3.2 low leakage
800Hz
800Hz
Flat
0 (0dB)
0x23FD (-5dB)
0 (0dB)
0x4000 (0dB)
0 (0dB)
0x23FD (-5dB)
1 (24dB)
0x4000 (0dB)
1 (24dB)
0xB461(9dB)
0 (0dB)
0x4000 (0dB)
0x2861 (-4dB)
33 (0dB)
0x261F (-16.5dB)
0x2000 (-6dB)
33 (0dB)
0x1000 (-24dB)
0x6570 (4dB)
33 (0dB)
0x0000 (mute)
0x4000 (0dB)
33 (0dB)
0x0000 (mute)
Default SNFI Parameters

Default SNFO Parameters 0x2861 (-4dB)
0x2000 (-6dB)

33 (0dB)
33 (0dB)

0x261F (-16.5dB) 0x0000 (mute)

Echo canceller mode
VOC_EC_ESEC
VOC_EC_ESEC VOC_EC_ESEC
VOC_EC_HEADSET VOC_EC_SPEAKER VOC_EC_OFF
Noise Supersession
VOC_NS_ON
VOC_NS_OFF VOC_NS_ON
VOC_NS_ON
VOC_NS_ON
VOC_NS_FF
Tx codec gain
0x4000 (0dB)
0x4000 (0dB)
0x4000 (0dB)
0x4000 (0dB)
0x4000 (0dB)
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6.7 Electrical Characteristics of the Voiceband Part
Table 25: Voiceband characteristics
Audio mode no.
AT^SNFS=
11
MIC input signal for
0dBm0, 2
f = 1024 Hz
15mV
650mV
EP output signal in mV
rms. @ 0dBm0,
1024 Hz, no load (default
gain) /
@ 3.14 dBm0
465mV 2.1Vpp
512mV 2.1Vpp 465mV 2.1Vpp
370mV 1.6Vpp 1485mV 5.7Vpp 1290mV 5.5Vpp
Sidetone gain at default
settings
-16.5dB
0dB
-24dB
15mV
12mV
-16.5dB
5mV
0dB
420mV
0dB
Digital audio characteristics (PCM)
Uplink gain at 1024Hz
14602(-1dBm)
16384(0dBm)
14602(-1dBm)
16384(0dBm)
16384(0dBm)
16384(0dBm)
Downlink gain at 1024Hz
25
33
25
32
32
33
Sidetone gain
5514(-21.5dBm)
5514(-21.5dBm)
12288(-15dBm)
1.
Fixed audio mode. Values cannot be adapted.
All values measured before the noise reduction attenuates the sine wave after a few seconds.
n.a. = not applicable
2.
Note: With regard to acoustic shock, the cellular application must be designed to avoid sending false AT commands that might increase amplification,
e.g. for a highly sensitive earpiece. A protection circuit should be implemented in the cellular application.
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6.7 Electrical Characteristics of the Voiceband Part
6.7.4
Voiceband Receive Path
Test conditions:
• The values specified below were tested to 1024Hz using AT^SNFO=57,33,0 in audio mode
6 during a voice call unless otherwise stated.
Table 26: Voiceband receive path
Parameter
Min
Typ
Max
Unit
Test condition / remark
Maximum differential output voltage
(peak to peak)
EPP to EPN
4.5
5.0
32 ,
No load,
@ 3.14dBm0 (Full Scale)
Nominal differential output voltage
(peak to peak)
EPP to EPN
3.1
3.4
32 ,
No load,
@ 0dBm0 (Nominal level)
Output bias voltage
1.5
From EPP or EPN to GND
Differential output load resistance
6.7.5

16
Voiceband Transmit Path
Test conditions:
• The values specified below were tested to 1024Hz using AT^SNFI=0,16,16384 in audio
mode 6 during a voice call unless otherwise stated.
Table 27: Voiceband transmit path
Parameter
Min
Typ
Max
Unit
Test condition / Remark
Full scale input voltage (peak to
peak) for 3.14dBm0
MICP to MICN
2.57
Balanced
Nominal input voltage (rms) for
0dBm0
MICP to MICN
0.64
Balanced
Input amplifier 1 gain (micAmp1)
24
dB
Set with AT^SNFI
Fine scaling by DSP (micTxVol)
-84
12
dB
Set with AT^SNFI
No load
@ 3mA
Microphone supply voltage VMIC
Microphone supply voltage VMIC
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6.8
RF Antenna Interface Characteristics
Table 28: RF Antenna interface CDMA
Parameter
Conditions
CDMA connectivity
BC0, BC1,BC10
Receiver Input Sensitivity @
ARP
CDMA BC0
1xRTT
-108.5
-110
dBm
CDMA BC1
1xRTT
-107.5
-108.5
dBm
CDMA BC10
1xRTT
-108.5
-110
dBm
CDMA BC0
1xRTT
+21
+21
+24
+24
+25
+25
dBm
CDMA BC1
1xRTT
+21
+21
+24
+24
+25
+25
dBm
+21
+21
+24
+24
+25
+25
dBm
RF Power@ ARP with
50Ohm Load
Min.
CDMA BC10
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6.10 Electrostatic Discharge
6.9
Electrostatic Discharge
The module is not protected against Electrostatic Discharge (ESD) in general. Consequently,
it is subject to ESD handling precautions that typically apply to ESD sensitive components.
Proper ESD handling and packaging procedures must be applied throughout the processing,
handling and operation of any application that incorporates a PCS3 module.
Special ESD protection provided on PCS3:
All antenna interfaces: Inductor/capacitor
BATT+: Inductor/capacitor
The remaining interfaces of PCS3 are not accessible to the user of the final product (since they
are installed within the device) and are therefore only protected according to the JEDEC
JESD22-A114D requirements.
PCS3 has been tested according to the following standards. Electrostatic values can be gathered from the following table.
Table 31: Electrostatic values
Specification / Requirements
Contact discharge
Air discharge
± 1kV Human Body Model
n.a.
All antenna interfaces
(CDMA/GNSS)
± 4kV
± 8kV
BATT+
± 4kV
± 8kV
JEDEC JESD22-A114D
All SMT interfaces
ETSI EN 301 489-1/7
Note: Please note that the values may vary with the individual application design. For example,
it matters whether or not the application platform is grounded over external devices like a computer or other equipment, such as the Cinterion Wireless Modules reference application described in Chapter 9.
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7 Mechanics, Mounting and Packaging
Mechanics, Mounting and Packaging
7.1
Mechanical Dimensions of PCS3

Figure 35 shows a 3D view1 of PCS3 and provides an overview of the board's mechanical dimensions. For further details see Figure 36.
Length:
33mm
Width:
29mm
Height:
2mm
Top view
Bottom view
Figure 35: PCS3 – top and bottom view
1.
The coloring of the 3D view does not reflect the module’s real color.
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7.1 Mechanical Dimensions of PCS3
Position marker
Internal use;
Not to be soldered
Figure 36: Dimensions of PCS3 (all dimensions in mm)
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7.2 Mounting PCS3 onto the Application Platform
7.2

Mounting PCS3 onto the Application Platform
This section describes how to mount PCS3 onto the PCBs (=printed circuit boards), including
land pattern and stencil design, board-level characterization, soldering conditions, durability
and mechanical handling. For more information on issues related to SMT module integration
see also [4].
Note: All SMT module pads need to be soldered to the application’s PCB. Not only must all supply pads and signals be connected appropriately, but all pads denoted as “Do not use“ will also
have to be soldered (but not electrically connected) in order to ensure the best possible mechanical stability.
7.2.1
7.2.1.1
SMT PCB Assembly
Land Pattern and Stencil
The land pattern and stencil design as shown below is based on Cinterion characterizations for
lead-free solder paste on a four-layer test PCB and a 110 respectively 150 micron-thick stencil.
The land pattern given in Figure 37 reflects the module‘s pad layout, including signal pads and
ground pads (for pad assignment see Section 6.5). Besides these pads there are ground areas
on the module's bottom side that must not be soldered, e.g., the position marker. To prevent
short circuits, it has to be ensured that there are no wires on the external application side that
may connect to these module ground areas.
Figure 37: Land pattern (top view)
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7.2 Mounting PCS3 onto the Application Platform

The stencil design illustrated in Figure 38 and Figure 39 is recommended by Cinterion as a result of extensive tests with Cinterion Daisy Chain modules.
Figure 38: Recommended design for 110 micron thick stencil (top view)
Figure 39: Recommended design for 150 micron thick stencil (top view)
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7.2 Mounting PCS3 onto the Application Platform
7.2.1.2

Board Level Characterization
Board level characterization issues should also be taken into account if devising an SMT process.
Characterization tests should attempt to optimize the SMT process with regard to board level
reliability. This can be done by performing the following physical tests on sample boards: Peel
test, bend test, tensile pull test, drop shock test and temperature cycling. Sample surface
mount checks are described in [4].
It is recommended to characterize land patterns before an actual PCB production, taking
individual processes, materials, equipment, stencil design, and reflow profile into account. For
land and stencil pattern design recommendations see also Section 7.2.1.1. Optimizing the
solder stencil pattern design and print process is necessary to ensure print uniformity, to
decrease sol- der voids, and to increase board level reliability.
Daisy chain modules for SMT characterization are available on request. For details refer to [4].
Generally, solder paste manufacturer recommendations for screen printing process
parameters and reflow profile conditions should be followed. Maximum ratings are described in
Section
7.2.3.
7.2.2
Moisture Sensitivity Level
PCS3 comprises components that are susceptible to damage induced by absorbed moisture.
Cinterion’s PCS3 module complies with the latest revision of the IPC/JEDEC J-STD-020
standard for moisture sensitive surface mount devices and is classified as MSL 4.
For additional MSL (=moisture sensitivity level) related information see Section 7.2.4 and Section 7.3.2.
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7.2 Mounting PCS3 onto the Application Platform
7.2.3
7.2.3.1

Soldering Conditions and Temperature
Reflow Profile
Figure 40: Reflow Profile
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7.2 Mounting PCS3 onto the Application Platform
Table 31: Reflow temperature ratings
Profile Feature
Pb-Free Assembly
Preheat & Soak
Temperature Minimum (TSmin)
Temperature Maximum (TSmax)
Time (tSmin to tSmax) (tS)
150°C
200°C
60-120 seconds
Average ramp up rate (TSmax to TP)
3K/second max.
Liquidous temperature (TL)
Time at liquidous (tL)
217°C
60-90 seconds
Peak package body temperature (TP)
245°C +0/-5°C
Time (tP) within 5 °C of the peak package body
temperature (TP)
30 seconds max.
Average ramp-down rate (TP to TSmax)
6 K/second max.
Time 25°C to maximum temperature
8 minutes max.
7.2.3.2
Maximum Temperature and Duration
The following limits are recommended for the SMT board-level soldering process to attach the
module:
• A maximum module temperature of 245°C. This specifies the temperature as measured at
the module’s top side.
• A maximum duration of 30 seconds at this temperature.
Please note that while the solder paste manufacturers' recommendations for best temperature
and duration for solder reflow should generally be followed, the limits listed above must not be
exceeded.
PCS3 is specified for one soldering cycle only. Once PCS3 is removed from the application,
the module will very likely be destroyed and cannot be soldered onto another application.
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7.2 Mounting PCS3 onto the Application Platform
7.2.4
7.2.4.1

Durability and Mechanical Handling
Storage Life
PCS3 modules, as delivered in tape and reel carriers, must be stored in sealed, moisture barrier
anti-static bags. The shelf life in a sealed moisture bag is an estimated 12 month. However, such
a life span requires a non-condensing atmospheric environment, ambient temperatures below
40°C and a relative humidity below 90%. Additional storage conditions are listed in Table 24.
7.2.4.2
Processing Life
PCS3 must be soldered to an application within 72 hours after opening the MBB (=moisture
barrier bag) it was stored in.
As specified in the IPC/JEDEC J-STD-033 Standard, the manufacturing site processing the
modules should have ambient temperatures below 30°C and a relative humidity below 60%.
7.2.4.3
Baking
Baking conditions are specified on the moisture sensitivity label attached to each MBB (see
Figure 45 for details):
• It is not necessary to bake PCS3, if the conditions specified in Section 7.2.4.1 and Section
7.2.4.2 were not exceeded.
• It is necessary to bake PCS3, if any condition specified in Section 7.2.4.1 and Section
7.2.4.2 was exceeded.
If baking is necessary, the modules must be put into trays that can be baked to at least 125°C.
Devices should not be baked in tape and reel carriers at any temperature.
7.2.4.4
Electrostatic Discharge
ESD (=electrostatic discharge) may lead to irreversible damage for the module. It is therefore
advisable to develop measures and methods to counter ESD and to use these to control the
electrostatic environment at manufacturing sites.
Please refer to Section 5.9 for further information on electrostatic discharge.
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7.3 Packaging
7.3
Packaging
7.3.1
Tape and Reel

The single-feed tape carrier for PCS3 is illustrated in Figure 41. The figure also shows the proper part orientation. The tape width is 44mm and the PCS3 modules are placed on the tape with
a 40mm pitch. The reels are 330mm in diameter with 100mm hubs. Each reel contains 500
modules.
7.3.1.1
Orientation
Figure 41: Carrier tape
Figure 42: Roll direction
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7.3 Packaging
7.3.1.2
Barcode Label
A barcode label provides detailed information on the tape and its contents. It is attached to the
reel.
Barcode label
Figure 43: Barcode label on tape reel
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7.3 Packaging
7.3.2

Shipping Materials
PCS3 is distributed in tape and reel carriers. The tape and reel carriers used to distribute PCS3
are packed as described below, including the following required shipping materials:
• Moisture barrier bag, including desiccant and humidity indicator card
• Transportation bag
7.3.2.1
Moisture Barrier Bag
The tape reels are stored inside an MBB (=moisture barrier bag), together with a humidity indicator card and desiccant pouches - see Figure 44. The bag is ESD protected and delimits moisture transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing or
tearing. The bag protects the PCS3 modules from moisture exposure. It should not be opened
until the devices are ready to be soldered onto the application.
Figure 44: Moisture barrier bag (MBB) with imprint
The label shown in Figure 45 summarizes requirements regarding moisture sensitivity, including shelf life and baking requirements. It is attached to the outside of the moisture barrier bag.
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7.3 Packaging

Figure 45: Moisture Sensitivity Label
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7.3 Packaging

MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag. The
humidity indicator card described below should be used to determine whether the enclosed
components have absorbed an excessive amount of moisture.
The desiccant pouches should not be baked or reused once removed from the MBB.
The humidity indicator card is a moisture indicator and is included in the MBB to show the approximate relative humidity level within the bag. Sample humidity cards are shown in Figure 46.
If the components have been exposed to moisture above the recommended limits, the units will
have to be rebaked.
Figure 46: Humidity Indicator Card - HIC
A baking is required if the humidity indicator inside the bag indicates 10% RH or more.
7.3.2.2
Transportation Box
Tape and reel carriers are distributed in a box, marked with a barcode label for identification
purposes. A box contains 2 reels with 500 modules each.
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8 Sample Application

Sample Application
Figure 47 shows a typical example of how to integrate an PCS3 module with an application.
The audio interface demonstrates the balanced connection of microphone and earpiece. This
solution is particularly well suited for internal transducers.
The PWR_IND line is an open collector that needs an external pull-up resistor which connects
to the voltage supply VCC µC of the microcontroller. Low state of the open collector pulls the
PWR_IND signal low and indicates that the PCS3 module is active, high level notifies the Power-down mode.
If the module is in Power-down mode avoid current flowing from any other source into the module circuit, for example reverse current from high state external control lines. Therefore, the
controlling application must be designed to prevent reverse flow. If an external level controller
is required, this can be done by using for example a 5V I/O tolerant buffer/driver like a
"74AVC4T245" with OE (Output Enable) controlled by PWR_IND.
While developing SMT applications it is strongly recommended to provide test points
for certain signals resp. lines to and from the module - for debug and/or test purposes.
The SMT application should allow for an easy access to these signals. For details on
how to implement test points see [4].
The EMC measures are best practice recommendations. In fact, an adequate EMC strategy for
an individual application is very much determined by the overall layout and, especially, the position of components.
Disclaimer:
No warranty, either stated or implied, is provided on the sample schematic diagram shown in
Figure 47 and the information detailed in this section. As functionality and compliance with national regulations depend to a great amount on the used electronic components and the individual application layout manufacturers are required to ensure adequate design and operating
safeguards for their products using PCS3 modules.
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9 Reference Approval
Reference Approval
9.1
Reference Equipment for Type Approval
The Cinterion Wireless Modules reference setup submitted to type approve PCS3 is shown in
Figure 48. The module (i.e., the evaluation module) is connected to the DSB75 by means of a
flex cable and a special DSB75 adapter. The CDMA test equipment is connected via edge
mount SMA connectors soldered to the module’s antenna pads.( (Only Main Antenna of
PCS3, Didn’t have GPS)
For ESD tests and evaluation purposes, it is also possible connect the module to the CDMA
test equipment through an SMA-to-Hirose-U.FL antenna cable and the SMA antenna
connectors of the DSB75 adapter.
A further option is to mount the evaluation module directly onto the DSB75 adapter’s 80-pin
board-to-board connector and to connect the test equipment as shown below.
Aud io
te st equ ipm ent
Vo tro nic
han dse t
D e tail:
E dg e m ou nt S M A c onn ec tor s
m an ua lly so ld ered to an ten na pa ds
S tan da rd
80 polig Flex
P CS3
eva lua tion
m o dule
PCS3
U ra nus
evaluation
m odu le
USB
COM1
(ASC 0)
D S B 7 5 ad a p te r
GNS S
test eq uipm en t
GNSS
AN T 3
AN T 2
C D M A D rx
CDMA
test eq uipm en t
AN T 1
Pow e r
Au dio
GN D
C D MA M a in
A udio
DSB7 5
USB
ca ble
PC
Po w er
supp ly
R S 2 32
cab le
Figure 48: Reference equipment for type approval
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10 Appendix
9.2

Compliance with FCC and IC Rules and Regulations
The Equipment Authorization Certification for the Cinterion Wireless Modules reference application described in Section 9.1 will be registered under the following identifiers:
FCC Identifier QIPPCS3
Industry Canada Certification Number: 7830A-PCS3
Granted to Cinterion Wireless Modules GmbH
Manufacturers of mobile or fixed devices incorporating PCS3 modules are authorized to use
the FCC Grants and Industry Canada Certificates of the PCS3 modules for their own final products according to the conditions referenced in these documents. In this case, the FCC label of
the module shall be visible from the outside, or the host device shall bear a second label stating
"Contains FCC ID QIPPCS3" and accordingly “Contains IC 7830A-PCS3“. The integration is
limited to fixed or mobile categorised host devices, where a separation distance between the
antenna and any person of min. 20cm can be assured during normal operating conditions. For
mobile and fixed operation configurations the antenna gain, including cable loss, must not exceed the limits 9.0 dBi (BC0), 9.0 dBi (BC10) and 7.5 dBi (BC1).
IMPORTANT:
Manufacturers of portable applications incorporating PCS3 modules are required to have their
final product certified and apply for their own FCC Grant and Industry Canada Certificate related to the specific portable mobile. This is mandatory to meet the SAR requirements for portable
mobiles (see Section 1.3.1 for detail).
Changes or modifications not expressly approved by the party responsible for compliance
could void the user's authority to operate the equipment.
Note-1: This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to part 15 of the FCC Rules and with Industry Canada licence-exempt RSS
standard(s). These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the
user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
• Consult the dealer or an experienced radio/TV technician for help.
This Class B digital apparatus complies with Canadian ICES-003.
Note-2: This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) This device may not cause harmful interference, and (2) this
device must accept any interference received, including interference that may cause
undesired operation.
This device complies with Industry Canada license-exempt RSS standard(s). Operation is
subject to the following two conditions:
(1) This device may not cause interference, and
(2) This device must accept any interference, including interference that may cause
undesired operation of the device.
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10 Appendix

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le
brouillage est susceptible d'en compromettre le fonctionnement."
CAN ICES-3(B)/ NMB-3(B)
10
Appendix
10.1
List of Parts and Accessories
Table 32: List of parts and accessories
Description
Supplier
Ordering information
PCS3
Cinterion
Standard module
Cinterion Wireless Modules IMEI:
Ordering number: L30960-N2650-A280
PCS3 Evaluation Module
Cinterion
Ordering number: L30960-N2651-TBD.
DSB75 Support Box
Cinterion
Ordering number: L36880-N8811-A100
DSB75 adapter for mounting
the PCS3 evaluation module
Cinterion
Ordering number: L30960-N2301-A100
Votronic Handset
VOTRONIC
Votronic HH-SI-30.3/V1.1/0
VOTRONIC
Entwicklungs- und Produktionsgesellschaft für elektronische Geräte mbH
Saarbrücker Str. 8
66386 St. Ingbert
Germany
Phone: +49-(0)6 89 4 / 92 55-0
Fax: +49-(0)6 89 4 / 92 55-88
Email: contact@votronic.com
U.FL antenna connector
Hirose or Molex Sales contacts are listed in Table 34 and Table 35.
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10.1 List of Parts and Accessories

Table 33: Molex sales contacts (subject to change)
Molex
For further information please click:
http://www.molex.com
Molex Deutschland GmbH
Otto-Hahn-Str. 1b
69190 Walldorf
Germany
Phone: +49-6227-3091-0
Fax: +49-6227-3091-8100
Email: mxgermany@molex.com
American Headquarters
Lisle, Illinois 60532
U.S.A.
Phone: +1-800-78MOLEX
Fax: +1-630-969-1352
Molex China Distributors
Beijing,
Room 1311, Tower B, COFCO Plaza
No. 8, Jian Guo Men Nei Street, 100005
Beijing
P.R. China
Phone: +86-10-6526-9628
Fax: +86-10-6526-9730
Molex Singapore Pte. Ltd.
110, International Road
Jurong Town,
Singapore 629174
Molex Japan Co. Ltd.
1-5-4 Fukami-Higashi,
Yamato-City,
Kanagawa, 242-8585
Japan
Phone: +65-6-268-6868
Fax: +65-6-265-6044
Phone: +81-46-265-2325
Fax: +81-46-265-2365
Table 34: Hirose sales contacts (subject to change)
Hirose Ltd.
For further information please click:
http://www.hirose.com
Hirose Electric (U.S.A.) Inc
2688 Westhills Court
Simi Valley, CA 93065
U.S.A.
Phone: +1-805-522-7958
Fax: +1-805-522-3217
Hirose Electric Europe B.V.
German Branch:
Herzog-Carl-Strasse 4
73760 Ostfildern
Germany
Phone: +49-711-456002-1
Fax: +49-711-456002-299
Email:info@hirose.de
Hirose Electric Europe B.V.
UK Branch:
First Floor, St. Andrews House,
Caldecotte Lake Business Park,
Milton Keynes MK7 8LE
Great Britain
Hirose Electric Co., Ltd.
5-23, Osaki 5 Chome,
Shinagawa-Ku
Tokyo 141
Japan
Hirose Electric Europe B.V.
Hogehillweg 8
1101 CC Amsterdam Z-O
Netherlands
Phone: +44-1908-369060
Fax: +44-1908-369078
Phone: +81-03-3491-9741
Fax: +81-03-3493-2933
Phone: +31-20-6557-460
Fax: +31-20-6557-469
PCS3_HD_v01.000
Confidential / Preliminary
Page 98 of 101
2013-10-21
PCS3 Hardware Interface Description
10.2 Mounting Advice Sheet
10.2

Mounting Advice Sheet
To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure it is
soldered flat against the host device (see also Section 7.2). The advice sheet on the next page
shows a number of examples for the kind of bending that may lead to mechanical damage of
the module (the module as part of an external application is integrated into a housing).
PCS3_HD_v01.000
Confidential / Preliminary
Page 99 of 101
2013-10-21
PCS3 Hardware Interface Description
10.2 Mounting Advice Sheet
PCS3_HD_v01.000
Confidential / Preliminary
Page 100 of 101

2013-10-21

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Gemalto M2M GmbH CDMA 1XRTT MODULE Rev

User Manual Rev

FCC ID Filing: QIPPCS3

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