Telit Communications S p A CC864-DUAL DUAL BAND CDMA/GPS Module User Manual

Telit Communications S.p.A. DUAL BAND CDMA/GPS Module Users Manual

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CC864-DUAL Hardware User Guide

80pppSTzzzzza Rev. 0.4 - dd/mm/yy

Notice

OEM integrators and installers are instructed that the phrase. This device contains

transmitter FCC ID: RI7CC864-DUAL must be placed on the outside of the host.

Warning: Exposure to Radio Frequency Radiation The radiated output

power of this device is far below the FCC radio frequency exposure

limits. Nevertheless, the device should be used in such a manner that

the potential for human contact during normal operation is minimized.

In order to avoid the possibility of exceeding the FCC radio

frequency exposure limits, human proximity to the antenna should

not be less than 20cm during normal operation. The gain of the

antenna for Cellular band must not exceed-2.0 dBi.

The gain of the antenna for PCS band must not exceed -3.0dBi.

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Disclaimer

The information contained in this document is the proprietary information of Telit

Communications S.p.A. and its affiliates (“TELIT”).

The contents are confidential and any disclosure to persons other than the officers,

employees, agents or subcontractors of the owner or licensee of this document,

without the prior written consent of Telit, is strictly prohibited.

Telit makes every effort to ensure the quality of the information it makes available.

Notwithstanding the foregoing, Telit does not make any warranty as to the

information contained herein, and does not accept any liability for any injury, loss or

damage of any kind incurred by use of or reliance upon the information.

Telit disclaims any and all responsibility for the application of the devices

characterized in this document, and notes that the application of the device must

comply with the safety standards of the applicable country, and where applicable,

with the relevant wiring rules.

Telit reserves the right to make modifications, additions and deletions to this

document due to typographical errors, inaccurate information, or improvements to

programs and/or equipment at any time and without notice.

Such changes will, nevertheless be incorporated into new editions of this document.

Printed in the US

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Contents

1. Introduction ................................................................................................................... 6

1.1. Scope ....................................................................................................................... 6

1.2. Audience .................................................................................................................. 6

1.3. Contact Information, Support ................................................................................... 6

1.4. Product Overview ..................................................................................................... 6

1.4.1. General Specifications .................................................................................................. 6

1.4.2. Receiver Specifications ................................................................................................. 7

1.4.3. Transmitter Specifications ............................................................................................. 7

1.4.4. gpsOne Receiver Specifications ................................................................................... 7

1.5. Safety Recommendations ........................................................................................ 7

1.5.1. Local regulations ........................................................................................................... 7

1.5.2. Wiring and Installation ................................................................................................... 8

1.5.3. Electrostatic Discharge .................................................................................................. 8

1.5.4. R-UIM Card ................................................................................................................... 8

1.5.5. Antennas ....................................................................................................................... 8

1.5.6. Disassembly .................................................................................................................. 8

1.6. Document Organization ........................................................................................... 8

1.7. Text Conventions ..................................................................................................... 9

1.8. Related Documents .................................................................................................. 9

1.9. Document History ..................................................................................................... 9

2. Mechanical Specifications ......................................................................................... 10

2.1. Module Dimensions ................................................................................................ 10

2.2. Interface Connector Specifications ......................................................................... 11

2.3. RF Connector Specifications .................................................................................. 12

2.4. Mounting ................................................................................................................ 13

3. Hardware Interface Description ................................................................................. 14

3.1. Overview ................................................................................................................ 14

3.2. Functions for Turning On and Off the Module ........................................................ 15

3.2.1. Turning On the CC864-Dual Module ........................................................................... 15

3.2.2. Turning Off the CC864-Dual Module ........................................................................... 16

3.2.2.1. Hardware Shutdown ............................................................................................. 16

3.2.2.2. Software Shutdown .............................................................................................. 16

3.2.3. Hardware Reset .......................................................................................................... 16

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3.3. Power Supply ......................................................................................................... 17

3.3.1. +5V Input Source Power Supply Design Guidelines ................................................... 18

3.3.2. +12V Input Source Power Supply Design Guidelines ................................................. 18

3.3.3. Battery Source Power Supply Design Guidelines ....................................................... 19

3.3.4. Battery Charge Control Circuitry Design Guideline ..................................................... 20

3.3.4.1. Trickle Charging ................................................................................................... 21

3.3.4.2. Constant Current Charging .................................................................................. 22

3.3.4.3. Constant Voltage Charging .................................................................................. 22

3.3.4.4. Pulse Charging ..................................................................................................... 22

3.3.5. Thermal Design Guidelines ......................................................................................... 23

3.3.6. Power Supply PCB Layout Guidelines ........................................................................ 23

3.4. Antenna Requirements .......................................................................................... 25

3.4.1. Antenna Installation Guideline ..................................................................................... 25

3.5. Logic level Specification ......................................................................................... 25

3.6. UART1 - Serial Interfaces ...................................................................................... 26

3.6.1. RS232C Interface and Level Translation .................................................................... 27

3.6.2. 5V UART Level Translation ......................................................................................... 28

3.7. External R-UIM Interface ........................................................................................ 29

3.7.1. R-UIM Design Guidelines ............................................................................................ 29

3.8. USB Interface ......................................................................................................... 30

3.9. Audio Interface ....................................................................................................... 30

3.9.1. General Design Rules ................................................................................................. 31

3.9.2. Handset Interface ........................................................................................................ 31

3.9.3. Headset Interface ........................................................................................................ 32

3.9.4. Car Kit Speakerphone Interface .................................................................................. 33

3.10. I2C Bus Interface ................................................................................................ 35

3.11. ADC/DAC Interface ............................................................................................. 35

3.11.1. ADC Converter ........................................................................................................ 35

3.11.1.1. Description ........................................................................................................... 35

3.11.1.2. Using ADC Converter ........................................................................................... 36

3.11.2. DAC Converter ........................................................................................................ 36

3.11.2.1. Description ........................................................................................................... 36

3.11.2.2. Enabling the DAC ................................................................................................. 36

3.11.2.3. Low Pass Filter Example ...................................................................................... 37

3.12. General Purpose I/O ........................................................................................... 37

3.12.1. Using a GPIO pin as Input ....................................................................................... 38

3.12.2. Using a GPIO pin as Output .................................................................................... 38

3.12.3. TGPIO_03/AUDIO MUTE ........................................................................................ 38

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3.12.4. TGPIO_04/RF Transmission Control ....................................................................... 38

3.12.5. TGPIO_05/RFTXMON ............................................................................................. 38

3.12.6. TGPIO_06/ALARM .................................................................................................. 39

3.12.7. TGPIO_07/BUZZER ................................................................................................ 39

3.12.8. TGPIO_08/POWER_SAVING ................................................................................. 40

3.12.9. TGPIO_11/VIBRATOR ............................................................................................ 40

3.12.10. TGPIO_12/CALL_KEY ............................................................................................ 40

3.12.11. TGPIO_13/ACTIVE .................................................................................................. 40

3.13. Miscellaneous Interface Signals ......................................................................... 41

3.13.1. VAUX1 ..................................................................................................................... 41

3.13.2. VRTC ....................................................................................................................... 41

3.13.3. STAT_LED ............................................................................................................... 42

3.13.4. PWRMON ................................................................................................................ 42

3.13.5. AXE .......................................................................................................................... 42

4. Development and Testing .......................................................................................... 44

5. Acronyms and Abbreviations .................................................................................... 45

6. Appendix: Pin Allocation ........................................................................................... 46

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1. Introduction

1.1. Scope

This document describes hardware solutions you can use to develop a product

containing the Telit CC864-Dual module, as follows:

• Describing the basic functions of the module

• Suggesting a proper hardware solution for each function

• Describing the wrong solutions and most common errors to be avoided

This document is not intended to provide an overall description of all hardware

solutions and all the products that may be designed.

The solutions suggested serve as a guide or starting point for you to be able to

correctly develop a product with the Telit CC864-Dual module.

However, avoiding the wrong solutions and most common errors described here

should be regarded as mandatory.

1.2. Audience

This manual is intended for hardware developers who design products that integrate

the CC864-DUAL module.

1.3. Contact Information, Support

For detailed information about where you can buy the Telit modules or for

recommendations on accessories and components visit http://www.telit.com

To register for product news and announcements or for product questions contact

Telit's Technical Support Center (TTSC).

1.4. Product Overview

The CC864-Dual module is a CDMA-1XRTT wireless module designed to have the

same form, fit and function as its GSM/GPRS counterpart product family, the GC864-

Dual.

This enables integrators and developers to design their applications once and take

advantage of the global coverage and service flexibility allowed by the combination of

the most prevalent cellular technologies worldwide.

With its ultra-compact design and extended operating temperature range, the Telit

CC864-Dual module is the perfect platform for m2m applications, mobile data and

computing devices. It also incorporates gpsOne capability for applications in mobile

environments such as telematics, personal and asset tracking.

1.4.1. General Specifications

Parameter Description

External access Code division multiple access

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CDMA protocol CDMA2000 1x Rel A and Rel B

Data Rate 153.6 Kb/s (full-duplex)

GPS SGPS / standalone

Vocoder EVRC, 13kQCELP, 4GV

Operating temperature -30° ~ +80°

1.4.2. Receiver Specifications

Parameters Descriptions

Frequency range Cellular: 869~894 MHz

PCS: 1930~1990 MHz

Channel number Cellular: 832

PCS: 1200

Sensitivity Better than -104 dBm

Input dynamic range -25dBm ~ -104 dBm

1.4.3. Transmitter Specifications

Parameters Descriptions

Frequency range Cellular: 824~849 MHz

PCS: 1850~1910 MHz

Channel number Cellular: 832

PCS: 1200

Power class Cellular: Class III

PCS: Class II

Power range 0.2 W (23 dBm) ~ 0.63 W (28 dBm)

Nominal power 0.27 W (24.31 dBm)

1.4.4. gpsOne Receiver Specifications

Parameters Descriptions

Frequency range L1, 1575.42 MHz

Receiver sensitivity -151 dBm

1.5. Safety Recommendations

1.5.1. Local regulations

Make sure that the use of this product is allowed in the country and in the

environment required.

The use of this product may be dangerous and thus must be avoided where:

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• It can interface with other electronic devices in environments such as

hospitals, airports, and so on.

• There is risk of explosion such as in the proximity of gasoline, oil refineries,

and so on.

You are responsible to enforce country and specific environment regulations on the

product. For further details refer to Chapter 1.7 for related documents.

1.5.2. Wiring and Installation

Always follow the instructions of this guide when wiring the product.

The product must be supplied with a stabilized voltage source, and the wiring must

conform to security and fire prevention regulations.

The installation of the external components of the module must be handled with care

in order to ensure the proper functioning of the product.

1.5.3. Electrostatic Discharge

The product must be handled with care, avoiding any contact with the pins because

electrostatic discharge can damage the product.

1.5.4. R-UIM Card

The R-UIM card must also be handled with care, always following the instructions for

its use.

Do not insert or remove the R-UIM when the product is in power saving mode.

1.5.5. Antennas

Every module must be equipped with a proper antenna with specific characteristics.

The antenna must be installed with care in order to avoid any interference with other

electronic devices, and it must also have a minimum distance of 20 cm from the body.

In case this requirement cannot be satisfied, the system integrator must assess the

final product against the applicable SAR regulations.

1.5.6. Disassembly

Do not disassemble the product.

Any evidence of tampering will void the warranty.

1.6. Document Organization

This manual contains the following chapters:

“Chapter 1: Introduction” provides a scope for this manual, target audience, contact

and support information, and text conventions.

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“Chapter 2: Mechanical Specifications” contains information on the dimensions of the

module, the interface connector and the RF connector, and on how to include the

module into external applications.

“Chapter 3: Hardware Interface Description” describes the hardware interfaces of the

product and provides guidelines for using the module in various applications.

“Chapter 4: Development and Testing” provides information on how to connect the

module to the Telit Evaluation Kit (EVK).

“Chapter 5: Acronyms and Abbreviations” provides definition for all the acronyms and

abbreviations used in this guide.

“Appendix: Pin Allocation” specifies the allocation of the pins on the connector that is

used for connecting the unit with external applications.

1.7. Text Conventions

Danger – This information MUST be followed or catastrophic equipment failure or

bodily injury may occur.

Caution or Warning – Alerts the user to important points about integrating the module,

if these points are not followed, the module and end user equipment may fail or

malfunction.

Tip or Information – Provides advice and suggestions that may be useful when

integrating the module.

1.8. Related Documents

The following documents are related to this user guide:

• CC864-DUAL Product Description – (Doc No)

• CC864-DUAL Software Description – (Doc No)

1.9. Document History

Doc rev # Date Changes Location in

Guide

0.3 01.03.2008 First version for Peer review

0.4 04.03.2008 Updates after review

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2. Mechanical Specifications

2.1. Module Dimensions

The CC864-DUAL overall dimensions are:

Length: 36.25 mm

Width: 30.00 mm*

Thickness: 4.65 mm*

*) Excluding solder pads.

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2.2. Interface Connector Specifications

The CC864-Dual module is equipped with a Molex 80-pin board-to-board connector

and P/N 0539490878 (male).

The mating part is Molex P/N 0541500878 (female).

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2.3. RF Connector Specifications

The CC864-Dual module is equipped with a Murata GSC type 50 Ohm RF connector,

and P/N MM9329-2700.

The suitable counterpart is Murata MXTK92 type or MXTK88 type connector.

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Mounting

The figure below shows the position of the Molex board-to-board connector and pin 1.

Tip: It is highly recommended to maintain a 1.5mm clearance from all wireless

modems to any components, including around the solder tabs.

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3. Hardware Interface Description

3.1. Overview

The CC864-Dual module has the following main interface function blocks:

• UART1 (used for AT commands)

• USB (used for diagnostic monitoring)

• R-UIM (UART2)

• GPIOs

• Audio (includes Analog I/O audio codecs and PCM interface)

• JTAG

• Miscellaneous pins (including I2C)

Antenna

QSC 6055

80 Pin Modem Interface Connector

RF Interface

US-PCS

Duplexer

Filter

PCS

LNA

PAM TX

Filter

Cellular

Duplexer

Filter

Cellular

LNA

PAM TX

Filter

Triplexer

USB

UART1

RUIM

GPIOs

CODEC

JTAG

Misc

To GPS

Dedicated

Antenna

ROM

RAM

CDMA Rx GPS

CDMA Tx

IIC

GPS

filter

LNA

GPS

Switch

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3.2. Functions for Turning On and Off the Module

3.2.1. Turning On the CC864-Dual Module

To turn on the module the ON/OFF Pin must be tied for at least one second, and

then released.

A Few Examples

1) Let's assume you need to drive the ON_OFF pin with a totem pole output of a +3/5

V microcontroller (uP_OUT1):

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2) Let's assume you need to drive the ON_OFF pin directly with an ON/OFF

button:

3.2.2. Turning Off the CC864-Dual Module

You can turn off the device with either a software command or a hardware shutdown

circuit.

When the device is shut down either way, it issues to the network a detach request

with the information that the device is not reachable any more.

Warning: Never disconnect power before the power off procedure is completed. If

you do, this may cause severe damage the module primarily due to the possibility of

memory corruption that renders the module inoperable.

3.2.2.1. Hardware Shutdown

To turn off the CC864-Dual module the ON/OFF Pin must be tied for at least one

second, and then released.

The same circuitry and timing as for power on must be used for be used for powering

off the module.

The device shuts down after you release the ON_OFF Pin.

3.2.2.2. Software Shutdown

Please refer the “Software User Guide” for information on how to shut down the

module using AT-commands.

3.2.3. Hardware Reset

To perform hardware reset and reboot the module, the RESET pin must be tied low

for at least 200 milliseconds, and then released.

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The following figure shows a sample circuit to accomplish this operation:

TIP: A hardware reset circuit should be always implemented on the host board but

the host should use it as an emergency reset procedure only.

Example

Let's assume you need to drive the RESET# pad with a totem pole output of a +3/5 V

microcontroller (uP_OUT2):

3.3. Power Supply

The electrical design of the power supply strongly depends on the power source from

which the power is drained. We will discuss the following three common categories:

• +5V input source supply (typically PC internal regulator output)

• +12V input source supply (typically automotive)

• Battery source supply

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3.3.1. +5V Input Source Power Supply Design Guidelines

The desired output for the power supply is 3.8V, hence there’s not a big difference

between the input source and the desired output and a linear regulator can be used. .

When using a linear regulator, a proper heat sink may be required in order to

dissipate the heat.

A bypass low ESR capacitor of adequate capacity must be provided in order to cut

the current absorption peaks close to the CC864-Dual module, a 100µF tantalum (or

equivalent) capacitor is suited for this purpose.

Make sure the low ESR capacitor on the power supply output (usually a tantalum) is

rated at least 10V.

A protection diode should be inserted close to the power input, in order to protect the

module from power polarity inversion.

A typical example of a linear regulator with 5V input is:

3.3.2. +12V Input Source Power Supply Design Guidelines

The desired output for the power supply is 3.8V, and due to the large difference

between the input voltage and the desired output, a linear regulator is not well suited

and should not be used. A switching power supply is preferred because of its better

efficiency with the 2A peak current load drawn by the CC864-Dual module.

When using a switching regulator, a 500 KHz or more switching frequency regulator

is preferable because of its smaller inductor size and faster transient response. This

allows the regulator to respond quickly to current peaks.

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In any case the frequency and switching design selection is related to the application

to be developed due to the fact the switching frequency could also generate EMC

interferences and the application must also take this into account.

For a car PB battery the input voltage can rise up to about 16V and when choosing

components, all components in the power supply must withstand this voltage.

Power supplies for automotive use are complicated and have to take a number of

issues into account, such as: over voltage, reverse polarity, cranking, load dump

booster batteries, forced charging etc

A bypass low ESR capacitor of adequate capacity must be provided in order to cut

the current absorption peaks; a 100µF tantalum (or equivalent) capacitor is suitable

for this purpose.

Make sure the low ESR capacitor on the power supply output (usually a tantalum) is

rated at least 10V.

For car applications a spike protection diode must be inserted close to the power

input, in order to clean the supply from spikes and a specific automotive grade

regulator is recommended.

A protection diode (which can be the same diode as in spike protection) must be

inserted close to the power input in order to save the CC864-Dual module from

power polarity inversion.

A typical example of a switching regulator with 12V input is:

3.3.3. Battery Source Power Supply Design Guidelines

The desired nominal output for the power supply is 3.8V and the maximum voltage

allowed is 4.2V, so that a single 3.7V lithium-ion cell battery type is ideal to supply

the power to the module.

Three regular battery cells (Ni/Cd or Ni/MH 3.6V nom. battery types or 4V PB types)

must not be used directly because their maximum voltage can rise over the absolute

maximum voltage for the CC864-Dual module and damage it.

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Warning: DO NOT USE any Ni-Cd, Ni-MH or Pb battery types directly connected to

the module! Their use can lead to overvoltage and damage the module. USE ONLY

Li-Ion battery types.

A bypass low (usually a 100uF tantalum) ESR capacitor with adequate capacity must

be provided in order to cut the current absorption peaks. Make sure the low ESR

capacitor (usually a tantalum) is rated at least 10V.A protection diode must be

inserted close to the power input, in order to protect the module from voltage polarity

inversion.

The suggested battery capacity is from 500mAh to 1000mAh.

3.3.4. Battery Charge Control Circuitry Design Guideline

The CC864-Dual module provides support circuitry for charging a lithium-ion battery,

utilizing four firmware-controlled charging modes:

• Trickle charging

• Constant current charging

• Constant voltage charging

• Pulsed charging

Battery voltage, external supply voltage, and total detected current measurements

are available to the module firmware through the analog multiplexer, which allow the

module firmware to monitor charging parameters, make decisions, and control the

charging process.

Note: This process is completely transparent to the application and is controlled by

the module firmware; it is described below for completeness and battery selection

purposes only.

• Charging begins with trickle charging, which limits the current and avoids

pulling the VDD down.

• Once a minimum battery voltage is established using trickle charging,

constant current charging is enabled by the firmware in order to charge the

battery quickly (this mode is sometimes called fast charging).

• When the Li-ion battery approaches its target voltage (through constant

current charging), the charge is completed using either constant voltage or

pulse charging.

Further description of all charging modes is provided in the sections below.

The following figure illustrates the main battery charging sequence.

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3.3.4.1. Trickle Charging

The module firmware and power management circuitry provides trickle charging of

the main battery when powered from VDD.

This mode is used by the module to raise a severely depleted battery’s voltage to a

level sufficient to begin fast charging.

Attempting fast charging with a high-current supply on a deeply discharged battery,

would cause the battery do draw excessive current, pull the VDD voltage down, and

possibly cause a module malfunction or shutdown due to an under-voltage lockout

condition.

In order to avoid these problems, the module provides a constant, low-current

charging mode: trickle charging.

Trickle charging is used by the module firmware until the main battery reaches a

predefined desired threshold, which is usually about 3.0V for Li-ion batteries.

The threshold varies with battery type and application, so there is no predefined

value implemented in the detection circuits.

The firmware stops the trickle charging based on battery voltage measurements and

battery type.

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3.3.4.2. Constant Current Charging

The Module firmware supports constant current charging of the main battery.

During constant current charging the battery is charged with a constant current of

600mA.

As the battery voltage rises and approaches its desired value of 4.2V the charging

current begins to decrease, indicating the end of constant current charging and the

beginning of residual charging.

The charging firmware monitors the voltage and takes the appropriate action to

terminate the constant current charging mode. Charging continues with residual

charging (either constant voltage or pulsed).

Note: In this application the charging firmware limits the charging current to 600mA.

3.3.4.3. Constant Voltage Charging

Once constant current charging of the lithium-ion battery is finished, the charging

continues using either constant voltage or pulsed techniques.

Constant voltage charging is similar to the constant current mode:

The battery voltage is constant while the charging current decreases exponentially

for the remaining charging process.

The end of the constant voltage charging is typically detected by allowing voltage

operation for a pre-determined duration beyond crossing the VBATDET threshold in

the internal charger IC (lasting for one and a half or two hours).

The firmware limits the predetermined duration, not allowing charging to continue

indefinitely, because charging for too long can damage the battery.

3.3.4.4. Pulse Charging

Pulse charging is implemented by switching the pass transistor on the internal

charger IC on and off.

The module and external electronics must draw minimal current so the battery’s open

circuit voltage can be measured accurately during the off interval.

Pulse charging, compared to constant voltage charging:

• Provides better voltage accuracy

• Reaches full charge more quickly

• Dissipates less transistor power when switching from constant current

charging

Pulse charging is enabled through firmware control, and it uses the same hardware

as constant current or constant voltage charging, but repetitiously opens and closes

the pass transistor to deliver current pulses to the battery

One purpose of pulsed operation is to check and recheck the battery’s open circuit

voltage, confirming a full charger before terminating the process.

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3.3.5. Thermal Design Guidelines

The thermal design for the module and its power supply needs to take the following

parameters into account:

Average current consumption during transmission at

Max level (23~24dBm) Cellular : 500mA

PCS : 580mA

Average current consumption during transmission at

Min level (-50dBm) Cellular : 130mA

PCS : 140mA

Average current during Idle mode

(when receiver circuit is on, transmitter circuit is off) 100mA

Average current during sleep mode

when receiver/transmitter circuits are off, only baseband

circuit is on)

1mA

Average current during hibernation mode

(All circuits are off except alarm circuit) 2.6uA

NOTE: The average current consumption during transmissions depends on the

power level at which the device is requested to transmit by the network.

Hence, the average current consumption varies significantly.

Considering the very low current during idle and sleep time, especially when the

power saving function is enabled, from a thermal point of view ,it is possible to

estimate that the device only draws significant current during calls.

An Example

If the device stays in transmission for a few minutes and then remains idle for an

hour, the power supply always has the time to cool down between the calls. The heat

sink can then be smaller than the calculated 700mA maximum RMS current, or there

can be no heat sink (simple chip package).

In average network conditions, the device is requested to transmit at a lower power

level than the maximum, and thus the current consumption is less than 700mA.

For these reasons, the thermal design is rarely a concern and the using the ground

plane where the power supply chip is placed as the heat sink can be enough to

ensure good thermal conditions and avoid overheating.

The generated heat is primarily conducted to the ground plane under the module and

the ambient air by convection, so you must ensure that your application can dissipate

the heat as required.

3.3.6. Power Supply PCB Layout Guidelines

Telit recommends that the power supply for the CC864-DUAL module to be designed

to meet the higher demands of a GSM/UMTS module.

The power supply will be slightly over-dimensioned for a CDMA module, but will allow

for the easy transition to another technology, if need be (GSM/UMTS 2A vs. CDMA

1A peak current consumption).

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The power supply implementation must have a low ESR capacitor on the output to

smooth the current peaks and should include a protection diode on the power supply

input to protect the supply from spikes and polarity inversion.

The placement of these components is crucial for the correct operation of the circuitry

and application.

A misplaced component can be ineffective or even decrease the power supply

performance:

• The Bypass low ESR capacitor must be placed close to the module power

input pads or in the case the power supply is a switching type it can be placed

close to the inductor to cut the ripple provided the PCB trace from the

capacitor to the module is wide enough to ensure no voltage drops during the

transmission current peaks.

• The protection diode must be placed close to the input connector where the

power source is drained.

• The PCB traces from the input connector to the power regulator IC must be

wide enough to ensure no voltage drops occur during the transmission

current peaks.

(GSM/UMTS specific consideration) Note that this is not made in order to

save power loss but especially to avoid the voltage drops on the power line at

the current peaks frequency of 216 Hz that will reflect on all the components

connected to that supply, introducing a noise floor at the burst base frequency.

For this reason, while a voltage drop of 300-400 mV may be acceptable from

the power loss point of view, the same voltage drop may not be acceptable

from the noise point of view.

If your application doesn't have audio interface but only uses the data feature

of the GSM /UMTS Wireless Modem, then this noise may not be so disturbing

and power supply layout design can be more forgiving.

• The PCB traces to module and the Bypass capacitor must be wide enough to

ensure no significant voltage drops occur during the GSM 2A/CDMA 1A

current peaks.

This is for the same reason as the previous point. Try to keep this trace as

short as possible.

• The PCB traces connecting the Switching output to the inductor and the

switching diode must be kept as short as possible by placing the inductor and

the diode very close to the power switching IC (only for switching power

supply). This is done in order to reduce the radiated field (noise) at the

switching frequency (usually 100-500 kHz).

• The use of a good common ground plane is suggested.

• The placement of the power supply on the board should be done in such a

way to guarantee that the high current return paths in the ground plane are

not overlapped to any noise sensitive circuitry as the microphone

amplifier/buffer or earphone amplifier.

The power supply input cables/traces should be kept separate from noise sensitive

lines such as microphone/earphone cables/traces.

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3.4. Antenna Requirements

Parameter Descriptions

Frequency range (CDMA) Tx: 824MHz ~ 849Mhz,

Rx: 869Mhz ~ 894MHz

Frequency range (PCS) Tx: 1850MHz ~ 1910MHz,

Rx: 1930MHz ~ 1990MHz

Frequency range (GPS) 1575.42MHz

Impedance 50 Ohm

Recommended VSWR < 2

Radiation pattern Omni-directional

Polarization Vertical

Note: if the device is developed for the US and/or Canadian market, it must comply

with the FCC and/or IC approval requirements.

3.4.1. Antenna Installation Guideline

Install the antenna in a place covered by the CDMA signal.

The antenna must be installed to provide a separation distance of at least 20 cm from

all persons and must not be co-located or operating in conjunction with any other

antenna or transmitter.

The antenna must be installed according to the antenna manufacturer instructions.

Warning: The antenna must not be installed inside metal cases.

3.5. Logic level Specification

The CC864-Dual module serial port is the core of the interface between the module

and the host hardware.

Depending on the serial port type of the host hardware, a level translator circuit may

be needed for the system to function properly. The only configuration that does not

need a level translation is interfacing to a 2.8V UART.

On the CC864-Dual module there are two UART ports, one is for UART1 and the

other is for R-UIM/UART2. It differs from the standard PC RS232C in signal polarity

(where RS232 is reversed) and in levels.

Where not specifically stated, the interface circuits work at 2.8V CMOS logic levels.

The following tables show the logic level specifications for the CC864-Dual module

interface circuits:

Operating Range – Interface levels (2.8V CMOS)

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Parameter Min Max

VIH (input high level) 1.76 V 3.0 V

VIL (input low level) -0.3 V 0.95 V

VOH (output high level) 2.25 V 2.7 V

VOL (output low level) 0.0 V 0.45 V

Operating Range – Interface levels (1.8V CMOS)

Parameter Min Max

VIH (input high level) 1.2V 2.1V

VIL (input low level) -0.3V 0.63V

VOH (output high level) 1.35V 1.8V

VOL (output low level) 0.0V 0.45V

3.6. UART1 - Serial Interfaces

The CC864-Dual module is capable of providing up to two universal asynchronous

(UART) ports.

The UART can also be used as the module’s serial data port for test and debug, and

can support additional interface functions such as an external keypad or ringer.

The UART1 can also be used to load and/or upgrade system firmware (in addition to

the USB port).

Default setting is UART1 for the AT-commands and UART2 for R-UIM

The following table lists the signals of the CC864-Dual module serial port:

RS232

Pin Nr Signal PIN

Number Name Usage

1 C109/DCD 32 Data Carrier

Detect

Output from the CC864-Dual

that indicates the carrier

presence

2 C104/RXD 26 Transmit line Output transmit line of CC864-

Dual UART

3 C103/TXD 25 Receive line Input receive of the CC864-

Dual UART

4 C108/DTR 29 Data Terminal

Ready

Input to the CC864-Dual

controlling the DTE READY

condition

5 GND 5,6,7 Ground Ground

6 C107/DSR 27 Data Set Ready Output from the CC864-Dual

indicating the module is ready

7 C105/RTS 31 Request to

Send

Input to the CC864-Dual

controlling the hardware flow

8 C106/CTS 28 Clear to Send Output from the CC864-Dual

controlling the hardware flow

9 C125/RING 30 Ring Indicator Output from the CC864-Dual

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indicating the incoming call

condition

NOTE: According to V.24, the RXD and TXD signal names are referred to from the

application side, therefore, on the module side, these signals are referred to in the

opposite direction: TXD on the application side will be connected to the receive line

(here named TXD/Receive line) of the module’s serial port and vice versa for RXD.

TIP: For a minimum implementation, the TXD and RXD lines only can be connected,

the other lines can be left open, provided a software flow control is implemented.

3.6.1. RS232C Interface and Level Translation

In order to interface the module with a PC com port or a RS232 (EIA/TIA-232)

application, a level translator is required.

The RS232 UART 16450, 16550, 16650 and 16750 chipsets accept signals with

lower levels on the RS232 side (EIA/TIA-562), allowing for a lower voltage-

multiplying ratio on the level translator.

Note that the negative signal voltage must be less than 0 V so that some form of

level translation is always required.

The simplest way to translate the levels and invert the signal is by using a single chip

level translator.

There are several of them, differing in the number of driver and receiver and in the

levels.

NOTE: Always make sure you use a true RS232 level translator and not a translator

for RS485 or any other standard.

By convention, the driver is the level translator from the 0-3V UART level to the

RS232 level, while the receiver is the translator from RS232 level to 0-3V UART.

In order to translate the whole set of control lines of the UART you need five drivers

and three receivers.

The figure below shows an example of level translation circuitry:

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The RS232 serial port lines are usually connected to a DB9 connector with the layout

shown in the following figure:

3.6.2. 5V UART Level Translation

If the host application uses a microcontroller with a serial port (UART) that works at a

voltage different from 2.8~3V, a circuitry must be provided to adapt the different

levels of the two signal sets.

As for the RS232 translation, there is a selection of single chip translators, but since

the translation requires very few components, a discrete design can also be used.

The following example shows a possible inexpensive translator circuit for a 5V

transmitter/receiver:

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The following example shows a possible inexpensive translator circuit for a 5V

receiver:

3.7. External R-UIM Interface

The Removable User Identify Module (R-UIM) is a smart card for CDMA cellular

applications, with the following features:

• It provides personal authentication information that allows the mobile station

or handset to be connected with the network

• It enables handset independence for the user

• It can be inserted into any CDMA R-UIM equipped handset, allowing the user

to receive or make calls, and also to receive other subscribed services from

any R-UIM equipped handset

The internal power management circuits, R-UIM circuits, and R-UIM pins allow for

2.85V cards via a direct connection.

3.7.1. R-UIM Design Guidelines

The table below contains the pin description of R-UIM holders.

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Pin No Signal Name Signal Description Direction

18 VREG_RUIM Power supply CC864-Dual  R-UIM

19 UIM_RST Reset signal CC864-Dual  R-UIM

20 UIM_DATA Serial data CC864-Dual  R-UIM

21 UIM_IN(PWR_DIS) Power disable CC864-Dual  R-UIM

22 UIM_CLK Clock CC864-Dual  R-UIM

3.8. USB Interface

The CC864-Dual module includes a universal serial bus (USB) transceiver, which

operates at USB low-speed (1.5Mbits/sec) and USB full-speed (12Mbits/sec).

It is compliant with the USB 2.0 specification and can be used for diagnostic

monitoring, control and data transfers.

The table below describes the USB interface signals:

Pin No Signal Usage

35 USB_ID Analog input to detect the USB peripheral type. Left floating,

grounded, or resistor to ground by the peripheral

48 USB_VBUS

Power supply for the internal USB transceiver. This pin is

configured as an analog input or/and output depending on

the type of peripheral device connected

79 USB_D+ Plus(+) line of the differential, bi-directional USB signal

to/from the peripheral device

80 USB_D- Minus(+) line of the differential, bi-directional USB signal

to/from the peripheral device

3.9. Audio Interface

The CC864-DUAL contains two different bi-directional audio blocks:

• MT lines can be used for handset function

• HF lines can be used for hands-free function or earphone function

Only one of the blocks can be active at a time, selected by the AXE input pin or by an

AT-command.

There are three types of audio interface configurations:

• Handset configurations (low power, typically a handset)

• Hands-free configurations (low power, typically an earphone)

• Car kit speakerphone configurations (high power, typically a speaker)

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3.9.1. General Design Rules

There are several possible configurations for the audio paths, but the two main types

are balanced and unbalanced microphone configurations.

You are recommended to keep the whole microphone path balanced even if this

means having two wires connecting the microphone instead of one needed in the

unbalanced case.

NOTE: The balanced circuitry is preferred because of its good common mode noise

rejection.

TIP: Keep the analog microphone traces on the PCB and any wires as short as

possible and make sure that the microphone traces on the PCB do not cross or run

parallel to noisy traces (especially power traces).

TIP: If your application requires an unbalanced microphone, keep the traces on the

PCB balanced and unbalance the path as close as possible to the microphone or

wire connector.

TIP: Put a ground trace connected to the ground plane by several vias all around the

microphone lines in order to simulate a shielded trace on the PCB.

The module provides two audio paths in the receive section; only one of the paths

can be active at a time, selectable by the AXE input signal or with an A- command.

The table below lists the audio connections that can be used for the CC864-Dual

module.

Pin number Pin name Pin type Functional description

16 MIC_MT- AI Microphone #1 input (-)

15 MIC_MT+ AI Microphone #1 input (+)

14 MIC_HF- AI Microphone #2 input (-)

13 MIC_HF+ AI Microphone #2 input (+)

10 EAR_HF- AO Headphone output #1 (right side)

9 EAR_HF+ AO Headphone output #2 (left side)

12 EAR_MT+ AO Earphone amplifier output (+)

11 EAR_MT- AO Earphone amplifier output (-)

3.9.2. Handset Interface

The earpiece output pins are connected directly to the handset earpiece, each with

its own bypass capacitor.

The capacitor value is selected to optimize performance in each design, but a value

of 100pF or less is suggested.

The output power for the differential EAR1 output is typically 50mW for a full-scale

+3dBm sine wave into a 32 Ohm speaker.

Each microphone pin requires a 2.2K bias resistor. The positive microphone terminal

is connected to the Bias power (1.8V) through one of the 2.2K resistors. The 1.8V

output provides up to 1mA bias current for the microphone. In addition, each

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connection includes a bypass capacitor (27pF is used in the example below), and a

100pF capacitor is connected across the differential pair near the earpiece.

The following figure shows a typical “handset”-interface.

MIC_MT-

1.8V

1uF

Earpiece

32

100pF

MIC1

27pF

2.2KΩ

MIC_MT+

EAR_MT-

EAR_MT+

CC864-Dual

Module

Pin 15

Pin 16

Pin 12

Pin 11

3.9.3. Headset Interface

This configuration uses a standard mono single-ended microphone interface.

The positive input contains the signal and is AC-coupled directly to the microphone,

while the negative input is AC-coupled to ground. A 100pF capacitor is connected

across the two AC-coupling capacitors on the microphone side.

A 27pF capacitor bypasses the microphone output.

The positive microphone terminal is connected to the bias voltage (1.8V) through a

2.2 Ohm bias resistor. The 1.8V output provides up to 1 mA bias current for the

microphone.

The bias power is bypassed by a 0.1uF capacitor.

The figure below shows the basic “headset”-configuration.

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MIC_HF-

1.8V

1uF

HS earpiece

16

33uF

100pF

MIC

27pF

2.2KΩ

MIC_HF+

EAR_HF-

EAR_HF+

CC864-Dual

Module

Pin 13

Pin 14

Pin 9

Pin 10

The module also supports a differential “headset” interface as shown in the figure

below.

MIC_HF-

1.8V

HS earpiece

32

100pF

MIC

27pF

2.2KΩ

MIC_HF+

EAR_HF-

EAR_HF+

CC864-Dual

Module

Pin 13

Pin 14

Pin 9

Pin 10

27pF

3.9.4. Car Kit Speakerphone Interface

For the “car kit speaker phone”configuration, the power output requirement is usually

at least 4W; therefore an amplifier is required to boost the CC864-Dual audio output.

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The design of the amplifier should comply with the following guidelines:

• The input to the amplifier must be taken from the “EAR_HF” audio path of the

module.

• The amplifier must have a mute control to be used while not in conversation

to eliminate the background noise, and to save power.

• The power to the amplifier must be decoupled as much as possible from the

CC864-Dual module power supply, by either keeping separate wires or by

placing bypass capacitors of adequate value close to the amplifier power

input Pins.

• The biasing voltage of the amplifier must be stabilized with low ESR (for

example, a tantalum) capacitor of adequate value.

The figure below shows an example of car kit amplifier schematic.

3.10. PCM Interface

The CC864-Dual module can support PCM interface. It can runs at 128kHz ~

2.048Mhz. The PCM interface enables communication with an external CODEC to

support hands-free application. Linear, -law, and A-law CODECs are supported by

the PCM interface.

PCM interface can be configured and controlled by either direct register access

through the CODEC_CTL register, or by the aDSP CODEC configuration command.

To change CODEC_CTL register, use AT-command.

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AT-command is

AT#DVI=<mode>[,<dviport>,<clockmode>].

Number Name I/O Description Level

36 PCM_CLOCK I/O PCM_CLOCK CMOS 2.8V

63 TGPIO_10/PCM_TX I/O TGPIO10 Configurable

GPIO/PCM_TX

CMOS 2.8V

65 TGPIO_18/PCM_RX I/O TGPIO18 Configurable

GPIO/PCM_RX

CMOS 2.8V

71 TGPIO_17/PCM_SYN

I/O TGPIO17 Configurable

GPIO/PCM_SYNC

CMOS 2.8V

3.11. I2C Bus Interface

The I2C is a two-wire bus for Inter-IC communication widely supported by peripheral

components.

Two wires (or lines); serial data (SDA) and serial clock (SCL) carry information

between the connected devices.

Each device is recognized by a unique address (whether it’s a microcontroller,

memory, LCD driver, stereo DAC, or keyboard interface) and can operate as either a

transmitter or receiver, depending on the device function.

Pin No Name Description

33 SCL Serial BUS Clock

34 SDA Serial BUS Data

3.12. ADC/DAC Interface

The CC864-Dual module provides three ADC converters and one DAC converter.

Pin No Name Description

37 ADC_IN1 Analog/Digital converter input

38 ADC_IN2 Analog/Digital converter input

39 ADC_IN3 Analog/Digital converter input

40 DAC_OUT Digital/Analog converter output

3.12.1. ADC Converter

3.12.1.1. Description

The CC864-Dual module provides three on-board ADC converters.

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Parameter Min Max

Input Voltage Range 0V 2.5 V

Resolution 10 bit

Accuracy 8 bit

Clock rate 2.4Mhz

Analog measurement output or sensor output (battery voltage, temperature etc) can

be connected to the ADC pin with proper signal conditioning and be read by an AT-

command.

3.12.1.2. Using ADC Converter

An AT-command is available to use the ADC function

The command is

AT#ADC=1,2

The read value is expressed in mV

Refer to SW User Guide or AT Commands Reference Guide for the full description of

this function.

3.12.2. DAC Converter

3.12.2.1. Description

The CC864-Dual module provides a digital to analog converter (DAC).

Parameter Min Max

Input Voltage Range 0V 2.8 V

Resolution 8 bit

Clock rate 4.8Mhz

The precision is 8 bits so, if we consider that the maximum voltage is 2V, the

integrated voltage could be calculated with the following formula:

Integrated output voltage = (2 × value)/255

3.12.2.2. Enabling the DAC

An AT-command is available to use the DAC function

The command is

AT#DAC[=<enable>[,<value>]]

<value> - scale factor of the integrated output voltage(0…255 -8 bit precision) and

must be present if <enable>=1

Refer to the SW User Guide or AT commands Reference Guide for the full

description of this function.

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3.12.2.3. Low Pass Filter Example

The DAC pin drives out the PDM (Pulse Density Modulation) signal. It is a square

wave output.

The application needs an additional RC filter to convert the PDM output to an analog

signal.

The figure below shows an example of Low Pass filter. Final tuning is needed to find

the exact values of resistors and capacitors for the target application.

3.13. General Purpose I/O

The general purpose I/O Pins can be configured to act in three different ways:

• Input: Input Pins can only be read. They report the digital value (high or low)

present on the Pin at the read time.

• Output: output Pins can be written or queried. They can be used to set the

value of the Pin output.

• Alternate function (internally controlled): An alternate function pin is

internally controlled by the CC864-Dual firmware and acts depending on the

currently selected function.

Pin Signal I/O Function Type Default

state On_OF

F state Alternative

Function

70 TGPIO_01 I/O Configurable GPIO CMOS 2.8V Input Low

74 TGPIO_02 I/O Configurable GPIO CMOS 2.8V Input Low

66 TGPIO_03 I/O Configurable GPIO CMOS 2.8V Input Low AUDIO MUTE

59 TGPIO_04 I/O Configurable GPIO CMOS 2.8V Input Low CONVERSATION

78 TGPIO_05 I/O Configurable GPIO CMOS 2.8V Input Low RFTXMON

68 TGPIO_06 I/O Configurable GPIO CMOS 2.8V Input ALARM

73 TGPIO_07 I/O Configurable GPIO CMOS 2.8V Input Low BUZZER

67 TGPIO_08 I/O Configurable GPIO CMOS 2.8V Input Low POWER_SAVING

76 TGPIO_09 I/O Configurable GPIO CMOS 2.8V Input Low

63 TGPIO_10 I/O Configurable GPIO CMOS 2.8V Input Low PCM_TX

57 TGPIO_11 I/O Configurable GPIO CMOS 2.8V Input Low VIBRATOR

62 TGPIO_12 I/O Configurable GPIO CMOS 2.8V Input Low CALL_KEY

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77 TGPIO_13 I/O Configurable GPIO CMOS 2.8V Input Low ACTIVE

60 TGPIO_14 I/O Configurable GPIO CMOS 2.8V Input Low

61 TGPIO_15 I/O Configurable GPIO CMOS 2.8V Input Low

75 TGPIO_16 I/O Configurable GPIO CMOS 2.8V Input Low

71 TGPIO_17 I/O Configurable GPIO CMOS 2.8V Input Low PCM_SYNC

65 TGPIO_18 I/O Configurable GPIO CMOS 2.8V Input Low PCM_RX

56 TGPIO_19 I/O Configurable GPIO CMOS 2.8V Input Low

58 TGPIO_20 I/O Configurable GPIO CMOS 2.8V Input Low

72 TGPIO_21 I/O Configurable GPIO CMOS 2.8V Input High

64 TGPIO_22 I/O Configurable GPIO CMOS 1.8V Input Low

Warning: TGPIO_22 has 1.8V CMOS level tolerance. This is to be compatible with

the Telit Unified Form Factor.

3.13.1. Using a GPIO pin as Input

The GPIO pins, when used as input, can be connected to a digital output of another

device to report its status, provided this device has interface levels compatible with

the 2.8V CMOS levels of the GPIO.

3.13.2. Using a GPIO pin as Output

The GPIO pins, when used as outputs, can drive 2.8V CMOS digital devices or

compatible hardware.

When set as outputs, the pins have a push-pull output and therefore the pull-up

resistor can be omitted.

3.13.3. TGPIO_03/AUDIO MUTE

This pin can be used to mute audio e.g. when an external audio amplifier is used for

the car kit speaker function.

It is always desirable to have a mute control on the amplifier, in order to turn it off

while the device is not sending signal to the output, so that the amplifier background

noise which may be audible during idle condition is cut off.

3.13.4. TGPIO_04/RF Transmission Control

When configured as RF transmission controlinput, this pin permits disabling the

transmitter when the GPIO is set to low by the application.

3.13.5. TGPIO_05/RFTXMON

When configured as RFTMON output, this pin is controlled by the CC864-Dual only.

It is High when the transmitter is active, and Low when the transmitter activity is

completed.

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For example, if a call is started, the line is high during all of the conversation (RF

Transmit) and low after the call is hung up.

3.13.6. TGPIO_06/ALARM

This pin, when configured as alarm output, is controlled by the CC864-Dual.

It goes high when the alarm starts, and low again after the issue of a dedicated AT-

command.

You can use this output to power up the module itself or the external application at

the alarm time, giving you the possibility to program a timely system wake-up to

perform periodic actions while completely turning off either the application or the

module during sleep periods, considerably reducing power consumption.

Refer to SW User Guide or AT commands Reference Guide for the full description of

this function.

3.13.7. TGPIO_07/BUZZER

This pin, when configured as buzzer output, is controlled by the module.

It drives a buzzer driver with appropriate square waves, and permits your application

to easily implement the buzzer feature with ringing tones, melody played at the call

incoming, tone playing on SMS incoming, or simply playing a tone or melody when

needed by your application.

The following figure shows an example of the TGPIO_07/BUZZER configuration:

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3.13.8. TGPIO_08/POWER_SAVING

When configured as power saving, the host gives this signal to the module, setting

the module into power saving mode.

This signal is active low.

When the module enters power saving mode, every active items, including the UART

port is turned off, so that current consumption is considerably reduced.

3.13.9. TGPIO_11/VIBRATOR

When configured as vibrator output, this pin is controlled by the module and it starts

with appropriate square waves.

For a reference, see the Buzzer circuitry in section 3.13.7.

3.13.10. TGPIO_12/CALL_KEY

When configured as call key, this pin is used to connect outgoing call or to respond to

incoming call.

If automatic answer is disabled, the equivalent AT command is “ATA”.

3.13.11. TGPIO_13/ACTIVE

When configured as active, this signal is used as a control signal to enable the buffer

between the module and the host.

When the reset procedure and boot sequence is successful, the module drives the

signal active high, and its output is low when the module is powered off.

Therefore, an external pull-down resistor is needed to define the state at power off if

this feature is used.

Note: Using buffers for most signals (except ON/OFF, RESET, STAT_LED) between

the module and the host to prevent leakage currents from the host (while powered

on) to the module (while powered off) is recommended. Leakage current can cause a

reset failure in the module.

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3.14. Miscellaneous Interface Signals

3.14.1. VAUX1

A regulated power supply output is provided in order to supply small devices from the

module itself.

This output is active when the module is on, and shuts off when the module is shut

down.

The operating range characteristics of the supply are listed in the table below:

Operating Range –VAUX1 Power supply

Parameters Min Typical Max

Output voltage 2.75V 2.85V 2.90V

Output current 150mA

Output bypass capacitor 1uF

3.14.2. VRTC

The VRTC pin brings out the real time clock supply, which is separated from the rest

of the module’s internal power supply, allowing the RTC to operate when all the other

parts of the devices are turned off.

A backup capacitor can be added to this pin.

The backup capacitor is charged when the module is on, and it supplies power to the

RTC circuit when the module is turned off.

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3.14.3. STAT_LED

This pin is an open collector output signal.

The STAT_LED pin status shows information on the network service availability and

Call status.

In the CC864-Dual module, the STAT_LED usually needs an external transistor to

drive an external LED.

Therefore, the status indicated in the following table is reversed with respect to the

pin status.

LED status Device Status

Permanently off Device off

Fast blinking(Period 1s, Ton 0.5s) Net search/Not registered/Turning off

Slow blinking(Period 3s, Ton 0.3s) Registered full service

Permanently on A call is active

3.14.4. PWRMON

This pin is internally connected to a power source of the internal interface voltage

corresponding to the 2.8V CMOS high level.

If the reset procedure or boot sequence is finished successfully, PWRMON is

changed to high state.

3.14.5. AXE

This pin can be used for audio path switching.

You can select the handset path or hand free path with this signal.

State Audio Path

Low Handset mode

(Tx: MIC_MT+/-, Rx:EAR_MT+/-)

High Hands free mode

(Tx:MIC_HF+/-, Rx:EAR_HF+/- or EAR_HF+)

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If this pin is set to a low state, the module uses the handset audio path. And if set to

a high state, the module changes the audio path to hands free mode from handset

mode.

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4. Development and Testing

In order to assist you with the development of your Telit CC864-Dual module based

application, Telit can supply the EVK2 Evaluation kit with appropriate power supply,

R-UIM card housing, RS232 serial port level translator, direct UART connection, USB

connection, Handset, Headset and Hands-free(car kit) audio and antenna.

The EVK2 provides a fully functional reference solution for a data/phone application.

The standard serial RS232 9-pin interface connector and USB interface provided on

the evaluation kit allow the connection of the EVK2 system to a PC or other DTE.

The development of the application utilizing the Telit CC864-Dual module must use

proper designs of all the interfaces to and from the module (for example, power

supply, audio paths, level translators), otherwise a decrease in the performance will

be introduced or, in the worst case, a faulty design can even lead to an operational

failure of the module.

In order to assist the hardware designer, the EVK2 board presents a series of

different solutions, which cover the most common design requirements on the market,

and which can be easily integrated in the OEM design as building blocks or can be

taken or can be taken as starting points to develop a specific solution.

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5. Acronyms and Abbreviations

Term Definition

ADC Analog-to-Digital Converter

CDMA Code Division Multiple Access

DAC Digital-to-Analog Converter

EVRC Enhanced Variable Rate CODEC

GPIO General Purpose Input / Output

GPS Global Positioning System

HF Hands-free

I2C Inter-Integrated Circuit

JDR Jammer Detector

JTAG Joint Test Action Group(ANSI/ICEEE Std. 1149.1-1990)

MT Micro Telephone or HandSet (MT or HS)

PCM Pulse Coded Modulation

PDM Pulse Density Modulation (in a DAC)

RTC Real Time Clock

R-UIM Removable User Identity Module

S-GPS Simultaneous-GPS

TGPIO Telit General Purpose Input / Output

UART Universal Asynchronous Receiver Transmitter

USB Universal Serial Bus

VAUX Voltage Auxiliary

ZIF Zero Intermediate Frequency

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6. Appendix: Pin Allocation

The table below lists the complete pin allocation on the system connector of the

CC864-DUAL.

Pin Signal I/O Function Internal

Pull up Type

Power Supply

1 VBATT - Main power supply Power

2 VBATT - Main power supply Power

3 VBATT - Main power supply Power

4 VBATT - Main power supply Power

5 GND - Ground Power

6 GND - Ground Power

7 GND - Ground Power

Audio

8 AXE I Hands free switching 100K CMOS

2.8V

9 EAR_HF+ AO Hands free ear output, phase+ Audio

10 EAR_HF- AO Hands free ear output, phase- Audio

11 EAR_MT+ AO Handset earphone signal output, phase+ Audio

12 EAR_MT- AO Handset earphone signal output, phase- Audio

13 MIC_HF+ AI Hands free microphone input ; phase+,

nominal level 3mVrms

Audio

14 MIC_HF- AI Hands free microphone input ; phase-,

nominal level 3mVrms

Audio

15 MIC_MT+ AI Handset microphone signal input ;

phase+, nominal level 50mVrms

Audio

16 MIC_MT- AI Handset microphone signal input ; phase-

, nominal level 50mVrms

Audio

R-UIM Card Interface

18 VREG_RUIM - Power supply for the UIM 2.8V

19 UIM_RST O Reset 2.8V

20 UIM_DATA I/O Data I/O 2.8V

21 UIM_IN I Presence(active low) 47K 2.8V

22 UIM_CLK O Clock 2.8V

QCOM Diagnostic Monitor

23 RX_TRACE I RX Data for debug monitor CMOS

2.8V

24 TX_TRACE O TX Data for debug monitor CMOS

2.8V

Program / Data + Hw Flow Control

25 C103/TXD I Serial data input (TXD) from DTE CMOS

2.8V

26 C104/RXD O Serial data output to DTE CMOS

2.8V

27 C107/DSR O Output for Data set ready signal (DSR) to CMOS

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DTE 2.8V

28 C106/CTS O Output for Clear to send signal (CTS) to

DTE

CMOS

2.8V

29 C108/DTR I Input for Data terminal ready signal (DTR)

from DTE

CMOS

2.8V

30 C125/RING O Output for Ring indicator signal (RI) to

DTE

CMOS

2.8V

31 C105/RTS I Input for Request to send signal (RTS)

from DTE

CMOS

2.8V

32 C109/DCD O Output for Data carrier detect signal

(DCD) to DTE

CMOS

2.8V

I2C

33 SCL I/O IIC Hardware interface CMOS

2.8V

34 SDA I/O IIC Hardware interface CMOS

2.8V

USB

35 USB_ID I USB_ID input 47K CMOS

2.8V

48 USB_VBUS AI/A

USB_VBUS power supply 5V

79 USB_D+ I/O USB Data(USB Internal Transceiver

In/Output)

2.8V~3.6V

80 USB_D- I/O USB Data(USB Internal Transceiver

In/Output)

2.8V~3.6V

DAC and ADC

37 ADC_IN1 AI Analog/Digital converter input A/D

38 ADC_IN2 AI Analog/Digital converter input A/D

39 ADC_IN3 AI Analog/Digital converter input A/D

40 DAC_OUT AO Digital/Analog converter output D/A(PWM)

PCM

36 PCM_CLOCK I/O Telit GPIO Configurable GPIO CMOS

2.8V

63 TGPIO_10/PCM_TX I/O Telit GPIO10 Configurable GPIO CMOS

2.8V

65 TGPIO_18/PCM_RX I/O Telit GPIO18 Configurable GPIO CMOS

2.8V

71 TGPIO_17/PCM_SY

I/O Telit GPIO17 Configurable GPIO CMOS

2.8V

Miscellaneous Functions

45 STAT_LED O Status indicator led CMOS

1.8V

46 GND - Ground Ground

49 PWRMON O Power ON Monitor CMOS

2.8V

50 VAUX1 - Power output for external accessories (AT

command driven)

2.85V/

150mA

51 CHARGE AI Charger input Li-Ion Power

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52 CHARGE AI Charger input Li-Ion Power

53 ON/OFF* I Input command for switching power ON

or OFF (toggle command). The pulse to

be sent to the CC864-DUAL must be

equal or greater than 1 second.

47k Pull up to

VBTT

54 RESET* I Reset input

55 VRTC Power

Telit GPIO

56 TGPIO_19 I/O Telit GPIO19 Configurable GPIO CMOS

2.8V

57 TGPIO_11/VIBRATO

I/O Telit GPIO11 Configurable GPIO/Vibrator CMOS

2.8V

58 TGPIO_20 I/O Telit GPIO20 Configurable GPIO CMOS

2.8V

59 TGPIO_04/CONVER

SATION

I/O Telit GPIO4 Configurable GPIO/

Conversation

CMOS

2.8V

60 TGPIO_14 I/O Telit GPIO14 Configurable GPIO CMOS

2.8V

61 TGPIO_15 I/O Telit GPIO15 Configurable GPIO CMOS

2.8V

62 TGPIO_12/AUDIO

CALL BUTTON

I/O Telit GPIO12 Configurable GPIO/ Audio

Call Button

CMOS

2.8V

64 TGPIO_22 I/O Telit GPIO22 Configurable GPIO CMOS

1.8V

66 TGPIO_03/AUDIO

MUTE

I/O Telit GPIO03 Configurable GPIO/ Audio

Mute

CMOS

2.8V

67 TGPIO_08/POWER_

SAVING

I/O Telit GPIO08 Configurable GPIO/ Power

saving mode

CMOS

2.8V

68 TGPIO_06/ALARM I/O Telit GPIO06 Configurable GPIO/ Power

wakeup

CMOS

2.8V

70 TGPIO_01 I/O Telit GPIO01 Configurable GPIO CMOS

2.8V

72 TGPIO_21 I/O Telit GPIO21 Configurable GPIO CMOS

2.8V

73 TGPIO_07/BUZZER I/O Telit GPIO07 Configurable GPIO/ Buzzer CMOS

2.8V(PWM

)

74 TGPIO_02 I/O Telit GPIO02 Configurable GPIO CMOS

2.8V

75 TGPIO_16 I/O Telit GPIO16 Configurable GPIO CMOS

2.8V

76 TGPIO_09 I/O Telit GPIO09 Configurable GPIO CMOS

2.8V

77 TGPIO_13/ACTIVE I/O Telit GPIO13 Configurable GPIO/

ACTIVE pin to protect current leakage

CMOS

2.8V

78 TGPIO_05/RFTXMO

I/O Telit GPIO05 Configurable GPIO/

Transmitter ON monitor

CMOS

2.8V

Reserved

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Warning: All reserved pins must be left open and unconnected; they may not be

used for any routing purposes on the application PCB (NC/NR pins). They are

reserved for internal Telit use or future expansion.

Telit Communications S p A CC864-DUAL DUAL BAND CDMA/GPS Module User Manual

Telit Communications S.p.A. DUAL BAND CDMA/GPS Module Users Manual

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