Telit Communications S p A DE910-DUAL DUAL BAND CDMA/GPS module User Manual

Telit Communications S.p.A. DUAL BAND CDMA/GPS module

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User Manual

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Date Submitted2015-05-14 00:00:00
Date Available2015-05-15 00:00:00
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Document TitleUser Manual

DE910 Series Hardware User
Guide
1vv0300951 Rev.9 – 2015-05-11
DE910 Series Hardware User Guide
1vv0300951 Rev.9 – 2015-05-11
APPLICABILITY TABLE
PRODUCT
DE910-DUAL
DE910-SC
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DE910 Series Hardware User Guide
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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be entirely reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products described
herein and reserves the right to revise this document and to make changes from time to time
in content hereof with no obligation to notify any person of revisions or changes. Telit does
not assume any liability arising out of the application or use of any product, software, or
circuit described herein; neither does it convey license under its patent rights or the rights of
others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in your
country. Such references or information must not be construed to mean that Telit intends to
announce such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a
product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer
programs, including the exclusive right to copy or reproduce in any form the copyrighted
computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW
computer programs contained in the Telit products described in this instruction manual may
not be copied (reverse engineered) or reproduced in any manner without the express written
permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products
shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any
license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied
SW, except for the normal non-exclusive, royalty free license to use that arises by operation
of law in the sale of a product.
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DE910 Series Hardware User Guide
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Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the operation
of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic
Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s)
specifically disclaim any expressed or implied warranty of fitness for such High Risk
Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
Copyright © Telit Communications S.p.A. 2013.
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DE910 Series Hardware User Guide
1vv0300951 Rev.9 – 2015-05-11
Contents
1.
Introduction ................................................. 8
1.1.
Scope ..................................................... 8
1.2.
Audience .................................................. 8
1.3.
Contact Information, Support .............................. 8
1.4.
Document Organization ..................................... 9
1.5.
Text Conventions ......................................... 10
1.6.
Related Documents ........................................ 10
2.
General Product Description ................................. 11
2.1.
Overview ................................................. 11
2.2.
Product Specifications ................................... 12
2.3.
RoHS Compliance .......................................... 13
3.
DE910 Module Connections .................................... 14
3.1.
Pin-Out .................................................. 14
3.1.1.
3.1.2.
4.
Hardware Commands ........................................... 21
4.1.
Turning on the DE910 module .............................. 21
4.1.1.
4.2.
4.3.
Shutdown by Software Command ............................... 24
Hardware Shutdown .......................................... 24
Hardware Reset ........................................... 25
4.3.1.
4.4.
Initialization and Activation State ........................ 21
Turning off the DE910 module ............................. 23
4.2.1.
4.2.2.
5.
LGA Pads Layout (DE910-DUAL) ............................... 19
LGA Pads Layout (DE910-SC) ................................. 20
Hardware Unconditional Shutdown ............................ 25
Summary of Turning ON and OFF the Module ................. 26
Power Supply ................................................ 27
5.1.
Power Supply Requirements ................................ 27
5.2.
General Design Rules ..................................... 29
5.2.1.
5.2.2.
5.2.3.
5.2.4.
5.2.5.
Electrical Design Guidelines ............................... 29
+ 5V Input Source Power Supply Design Guidelines ........... 29
+12V Input Source Power Supply Design Guidelines ........... 30
Battery Source Power Supply Design Guidelines .............. 31
Thermal Design Guidelines .................................. 31
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DE910 Series Hardware User Guide
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5.2.6.
6.
Power Supply PCB layout Guidelines ......................... 32
Antenna ..................................................... 35
6.1.
CDMA Antenna Requirements ................................ 35
6.1.1.
6.1.2.
6.1.3.
CDMA antenna – PCB line Guidelines ......................... 36
PCB Guidelines in case of FCC certification ................ 37
CDMA Antenna – Installation Guidelines ..................... 39
6.2.
Antenna Diversity Requirements ........................... 40
6.3.
GNSS Antenna Requirements ................................ 41
6.3.1.
6.3.2.
6.3.3.
6.3.4.
6.3.5.
Combined GNSS Antenna ...................................... 41
Linear and Patch GNSS Antenna .............................. 41
The Design Considerations to enhanced GNSS performance ..... 41
GNSS Antenna – PCB Line Guidelines ......................... 44
GNSS Antenna – Installation Guidelines ..................... 44
7.
USB Port .................................................... 45
8.
Serial Port ................................................. 46
8.1.
Modem Serial Port 1 ...................................... 47
8.2.
Modem Serial Port 2 ...................................... 48
8.3.
RS232 Level Translation .................................. 48
9.
Audio Section Overview ...................................... 51
9.1.
Electrical Characteristics ............................... 51
9.1.1.
CODEC Example.............................................. 51
10. General Purpose I/O ......................................... 52
10.1.
Logic Level Specification .............................. 53
10.2.
Using a GPIO Pad as Input .............................. 53
10.3.
Using a GPIO Pad as Output ............................. 54
10.4.
Using the Temperature Monitor Function ................. 54
10.4.1.
Short Description ........................................ 54
10.5.
Indication of Network Service Availability ............. 55
10.6.
RTC Bypass Output ...................................... 56
10.7.
VAUX/PWRMON Power Output ............................... 57
11. DAC and ADC section ......................................... 58
11.1.
DAC Converter .......................................... 58
11.1.1.
Description .............................................. 58
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11.1.2.
11.1.3.
11.2.
Enabling DAC ............................................. 58
Low Pass Filter Example .................................. 59
ADC Converter .......................................... 59
11.2.1.
11.2.2.
Description .............................................. 59
Using ADC Converter ...................................... 59
12. Test Point .................................................. 60
13. Mounting the Module on your Board ........................... 61
13.1.
General ................................................ 61
13.2.
Module Finishing & Dimensions .......................... 61
13.3.
Recommended foot print for the application ............. 62
13.4.
Stencil ................................................ 63
13.5.
PCB Pad Design ......................................... 63
13.6.
Recommendations for PCB Pad Dimensions (mm) ............ 63
13.7.
Solder Paste ........................................... 65
13.7.1.
Solder Reflow ............................................ 65
14. Packing System .............................................. 67
14.1.
Tray ................................................... 67
14.2.
Reel ................................................... 69
14.2.1.
14.2.2.
14.2.3.
14.3.
Carrier Tape Detail ...................................... 69
Reel Detail .............................................. 70
Packaging Detail ......................................... 70
Moisture Sensibility ................................... 71
15. Application Design Guide .................................... 72
15.1.
Download and Debug Port ................................ 72
16. Conformity Assessment Issues (Problèmes d'évaluation de
conformité)...................................................... 73
17. Safety Recommendations ...................................... 76
18. Document History ............................................ 77
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DE910 Series Hardware User Guide
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1.
Introduction
1.1.
Scope
The aim of this document is the description of typical hardware solutions useful for
developing a product with the Telit DE910 module.
1.2.
Audience
This document is intended for Telit customers who are about to implement their applications
using our DE910 modules.
1.3.
Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit Technical Support Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where to buy the Telit modules or for recommendations on
accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Please keep us informed of comments
and suggestions for improvements.
Telit appreciates feedback from the users of our information.
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DE910 Series Hardware User Guide
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1.4.
Document Organization
This document contains the following chapters:
Chapter 1: “Introduction” provides a scope for this document, target audience, contact and
support information, and text conventions.
Chapter 2: “General Product Description” gives an overview of the features of the product.
Chapter 3: “DE910 Module Connections” deals with the pin out configuration and layout.
Chapter 4: “Hardware Commands” How to operate the module via hardware.
Chapter 5: “Power supply” Power supply requirements and general design rules.
Chapter 6: “Antenna” The antenna connection and board layout design are the most important
parts in the full product design.
Chapter 7: “USB Port” The USB port on the Telit DE910 is the core of the interface between
the module and OEM hardware.
Chapter 8: “Serial ports” Refers to the serial ports of the Telit DE910.
Chapter 9: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the
DE910 Telit Module.
Chapter 10: “General Purpose I/O” How the general purpose I/O pads can be configured.
Chapter 11: “DAC and ADC section” Deals with these two kinds of converters.
Chapter 12: “Test Pont” Deals with Test Point.
Chapter 13: “Mounting the DE910 on the application board” Mechanical dimensions and
recommendations on how to mount the module on the user’s board.
Chapter 14: “Packing System” Deals with packing system.
Chapter 15: “Application Design Guide” Deals with the design of host system for download
or upgrade.
Chapter 16: “Conformity Assessment Issues” provides some fundamental hints about the
conformity assessment that the final application might need.
Chapter 17: “Safety Recommendation” provides some safety recommendations that must be
followed by the customer in the design of the application that makes use of the Telit DE910.
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DE910 Series Hardware User Guide
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1.5.
Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module. If
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when
integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6.
Related Documents

Digital Voice Interface Application Note, 80000NT10061A

Product Description, 80392ST10096A

Telit EVK2 User Guide, 1vv0300704
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Page 10 of 77
DE910 Series Hardware User Guide
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2.
General Product Description
2.1.
Overview
The aim of this document is the description of typical hardware solutions useful for
developing a product with the Telit DE910 module.
In this document all the basic functions of a mobile device will be taken into account; for each
one of them a proper hardware solution will be suggested and eventually the wrong solutions
and common errors to be avoided will be evidenced. Obviously this document cannot
embrace all hardware solutions and products that may be designed. Avoiding the discussed
wrong solutions must be considered as mandatory. While the suggested hardware
configurations must not be considered mandatory, the information given must be used as a
guide and a starting point for properly developing a product with the Telit DE910 module.
NOTE:
The integration of the CDMA 1xRTT/1xEV-DO Rev. A module within a user application
must be done according to the design rules described in this manual.
The information presented in this document is believed to be accurate and reliable. However,
no responsibility is assumed by Telit Communication S.p.A. for its use, such as any
infringement of patents or other rights of third parties. No license is granted by implication or
otherwise under any patent rights of Telit Communication S.p.A. other than for circuitry
embodied in Telit products. This document is subject to change without notice.
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DE910 Series Hardware User Guide
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2.2.
Product Specifications
DE910 Specifications
Data Service






Location solution
gpsOne
Air Interface
Frequency Bands
CDMA 1xRTT
CDMA 1xEV-DO Rev. A
DE910-DUAL: 800/1900MHz
DE910-SC: 800MHz
CDMA 1xRTT: 153.6 Kbps (full-duplex)
CDMA 1xEV-DO Rev. A: 3.1Mbps (F/L),
1.8Mbps (R/L)

Max. RF out power
Typical conducted sensitivity
CDMA BC0: Power class 3 (24.4dBm) for 1xRTT,
Power class 3 (24dBm) for 1xEV-DO
 CDMA BC1: Power class 2 (24.4dBm) for 1xRTT,
Power class 2 (24dBm) for 1xEV-DO
a. CDMA
 1xRTT: Better than –108dBm
 1xEV-DO: Better than –109dBm
b. GNSS
 Acquisition sensitivity: –145dBm
 Navigation sensitivity: –160dBm
 Tracking sensitivity: –161dBm
 Cold-start sensitivity: –145dBm
 TTFF: 32 sec @–130dBm
Device dimensions
28.2mm(L) x 28.2mm(W) x 2.05mm(T)
Weight
3.8g
Storage and Operating
Temperature Range
–40 ~ +85°C
Normal operating voltage range 3.4 ~ 4.2V
IO voltage
1.8V
Hardware design

RX diversity on all band


144 Land-Grid-Array interface
10 general I/O ports maximum including multifunctional I/Os
State LED output
1 A/D converter
1 D/A converter (PDM output)
Full RS232 CMOS UART: baud rate up to 4Mbps
Reserved two wires CMOS UART for debugging
USB 2.0: baud rate up to 480Mbps
Primary antenna
RX Diversity antenna
GPS&GLONASS antenna
Interface
Antenna









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DE910 Series Hardware User Guide
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Audio
PCM interface for Digital audio
Message
SMS (MO/MT)

Approvals

2.3.
Regulatory:
- DE910-DUAL: FCC, IC
- DE910-SC: CCC, SRRC
Carrier: Verizon, Sprint, Aeris
RoHS Compliance
As a part of Telit’s corporate policy of environmental protection, the DE910 complies with
the RoHS (Restriction of Hazardous Substances) directive of the European Union (EU
Directive 2011/65/EU).
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Page 13 of 77
DE910 Series Hardware User Guide
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3.
DE910 Module Connections
3.1.
Pin-Out
Pin
Signal
I/O
Function
USB HS 2.0 Communication Port
I/O USB differential Data(+)
B15 USB_D+
I/O USB differential Data(-)
C15 USB_DI
Power sense for the internal USB transceiver
A13 VBUS
Asynchronous UART – Prog. / data +HW Flow Control
Serial data input from DTE
N15 C103/TXD
Serial data output to DTE
M15 C104/RXD
Input for Data terminal ready signal (DTR) from DTE
M14 C108/DTR
Input for Request to send signal (RTS) from DTE
L14 C105/RTS
C106/CTS
Output for Clear to send signal (CTS) to DTE
P15
Output for Data carrier detect signal (DCD) to DTE
N14 C109/DCD
Output for Data set ready signal (DSR) to DTE
P14 C107/DSR
Output for Ring indicator signal (RI) to DTE
R14 C125/RING
Asynchronous Auxiliary UART
Auxillary UART (TX Data to DTE)
D15 TX_AUX
Auxillary UART (RX Data from DTE)
E15 RX_AUX
RUIM Card Interface
RUIMVCC
External RUIM signal - Power supply for the SIM
A3
RUIMIO
I/O External RUIM signal - Data I/O
A5
RUIMCLK
External RUIM signal - Clock
A6
RUIMRST
External RUIM signal - Reset
A7
Digital Voice interface (DVI)
DVI_WA0
I/O Digital Voice interface (WA0)
B9
DVI_RX
Digital Voice interface (RX)
B6
DVI_TX
Digital Voice interface (TX)
B7
DVI_CLK
I/O Digital Voice interface (CLK)
B8
Digital IO
GPIO_01
I/O GPIO_01 / STAT LED
C8
GPIO_02
I/O GPIO_02
C9
I/O GPIO_03
C10 GPIO_03
I/O GPIO_04
C11 GPIO_04
I/O GPIO_05
B14 GPIO_05
I/O GPIO_06
C12 GPIO_06
I/O GPIO_07 / DAC_OUT
C13 GPIO_07
I/O GPIO_08
K15 GPIO_08
I/O GPIO_09
L15 GPIO_09
I/O GPIO_10
G15 GPIO_10
ADC Section
ADC_IN1
AI
Analog/Digital converter input
B1
RF Section
Type
5V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
1.8/3V
1.8/3V
1.8/3V
1.8/3V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
CMOS 1.8V
A/D
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DE910 Series Hardware User Guide
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Pin
Signal
ANTENNA
K1
ANT_DIV
F1
GPS Section
ANT_GPS
R9
GPS_LNA_EN
R7
Miscellaneous Function
I/O
Function
Type
I/O
CDMA Antenna (50Ohm)
CDMA Antenna Diversity Input (50Ohm)
RF
RF
GPS Antenna (50Ohm)
Output enable for External LNA supply
RF
CMOS 1.8V
CMOS 1.8V
R13
HW_SHUTDOWN*
Hardware unconditional shutdown
R12
ON_OFF*
Input Command for Power ON/Software shutdown
C14
VRTC
Power
R11
VAUX/PWRMON
VRTC Backup Capacitor
Supply Output for external accessories / Power ON
Monitor
Test Point
Test Point
Test Point
Test Point
Test Point
Test Point
Test Point
TP
TP
TP
TP
TP
TP
TP
Main Power Supply (Baseband)
Main Power Supply (Baseband)
Main Power Supply (PAM)
Main Power Supply (PAM)
Main Power Supply (PAM)
Main Power Supply (PAM)
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Power
Power
Power
Power
Power
Power
Test Point
TP1
C3
TP2
C4
TP3
C5
TP4
C6
TP5
C7
TP6
D3
TP7
E3
Power Supply
VBATT
M1
VBATT
M2
VBATT_PA
N1
VBATT_PA
N2
VBATT_PA
P1
VBATT_PA
P2
GND
E1
GND
G1
GND
H1
GND
J1
GND
L1
GND
A2
GND
E2
GND
F2
GND
G2
GND
H2
GND
J2
GND
K2
GND
L2
GND
R2
GND
M3
GND
N3
GND
P3
GND
R3
GND
D4
Open collector
CMOS 1.8V
Open collector
1.8V
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DE910 Series Hardware User Guide
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Pin
Signal
GND
M4
GND
N4
GND
P4
GND
R4
GND
N5
GND
P5
GND
R5
GND
N6
GND
P6
GND
R6
GND
P8
GND
R8
GND
P9
P10 GND
R10 GND
M12 GND
B13 GND
P13 GND
E14 GND
Reserved
Reserved
C1
Reserved
D1
Reserved
B2
Reserved
C2
Reserved
D2
Reserved
B3
Reserved
F3
Reserved
G3
Reserved
H3
Reserved
J3
Reserved
K3
Reserved
L3
Reserved
A4
Reserved
B4
Reserved
B5
Reserved
N7
Reserved
P7
Reserved
A8
Reserved
N8
Reserved
A9
Reserved
N9
A10 Reserved
B10 Reserved
B11 Reserved
N10 Reserved
A11 Reserved
N11 Reserved
I/O
Function
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Ground
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Type
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Pin
P11
A12
B12
D12
N12
P12
D13
E13
F13
G13
H13
J13
K13
L13
M13
N13
A14
D14
F14
G14
H14
J14
K14
F15
H15
J15
Signal
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
I/O
Function
Type
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
NOTE:
RUIM interface is reserved for Verizon/Sprint/Aeris variants and it is applicable only to
RUIM variants of DE910 (DE910-SC)
WARNING:
Reserved pins must not be connected.
NOTE:
The following table is listing the main Pinout differences between the DE910 variants.
Product
BC0
BC1
GPS
Notes
DE910-DUAL
Yes
Yes
Yes
Reserved pads: A3, A5, A6, A7
DE910-SC
Yes
No
Yes
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NOTE:
Almost all pins not in use must be left disconnected. The only exceptions are the following
pins:
PAD
Signal
M1,M2,N1,N2,P1,P2
E1,G1,H1,J1,L1,A2,E2,
F2,G2,H2,J2,K2,L2,R2,
M3,N3,P3,R3,D4,M4,N
4,P4,R4,N5,P5,R5,N6,P
6,R6,P8,R8,P9,P10,R10,
M12,B13,P13,E14
R12
R13
VBATT&VBATT_PA
B15
USB_D+
C15
USB_D-
A13
VBUS
N15
C103/TXD
M15
C104/RXD
L14
C105/RTS
P15
C106/CTS
D15
TXD_AUX
E15
RXD_AUX
K1
Main Antenna
F1
R9
C3,C4,C5,C6,C7,D3,E3
GND
ON_OFF*
HW_SHUTDOWN*
If not used should be connected to
a Test Point
If not used should be connected to
a Test Point
If not used should be connected to
a Test Point
If not used should be connected to
a Test Point
If not used should be connected to
a Test Point
If the flow control is not used it
should be connected to GND
If not used should be connected to
a Test Point
If not used should be connected to
a Test Point
If not used should be connected to
a Test Point
If not used it could be left
unconnected, but has to be
ANT_DIV (If supported disabled by the related AT
by the product)
Command (AT#RXDIV): please
refer to the AT User Guide for the
related syntax
ANT_GPS (If supported If the GPS is not used it could be
by the product)
left unconnected
Test Point
RTS must be connected to the GND (on the module side) if flow control is not used.
The above pins are also necessary to debug the application incorporating the module.
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3.1.1.
LGA Pads Layout (DE910-DUAL)
ADC_IN1
RES
RES
GND
ANT_DIV
GND
GND
GND
ANTENNA
GND
VBATT
VBATT_PA
VBATT_PA
GND
RES
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_PA
VBATT_PA
GND
RES
RES
TP1
TP6
TP7
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
RES
RES
TP2
GND
GND
GND
GND
GND
RES
RES
TP3
GND
GND
GND
RES
DVI_RX
TP4
GND
GND
GND
RES
DVI_TX
TP5
RES
RES
GPS_LNA_E
RES
DVI_CLK
GPIO_01
RES
GND
GND
RES
DVI_W A0
GPIO_02
RES
GND
ANT_GPS
10
RES
RES
GPIO_03
RES
GND
GND
10
11
RES
RES
GPIO_04
RES
RES
12
RES
RES
GPIO_06
RES
GND
RES
RES
13
USB_VBUS
GND
GPIO_07
RES
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RTS
C108/DTR
C109/DCD
C107/DSR C125/RING 14
USB_D+
USB_D-
TX_AUX
RX_AUX
RES
GPIO_10
RES
RES
GPIO_08
GPIO_09
C104/RXD
C103/TXD
C106/CTS
15
VAUX/PW R
11
MON
ON_OFF*
12
HW _SHUTD
13
OW N*
15
Top View
NOTE:
The pin defined as RES must be considered RESERVED and not connected on any pin in the
application. The related area on the application has to be kept empty.
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3.1.2.
LGA Pads Layout (DE910-SC)
ADC_IN1
RES
RES
GND
ANT_DIV
GND
GND
GND
ANTENNA
GND
VBATT
VBATT_PA
VBATT_PA
GND
RES
RES
RES
GND
GND
GND
GND
GND
GND
GND
VBATT
VBATT_PA
VBATT_PA
GND
RUIM VCC
RES
TP1
TP6
TP7
RES
RES
RES
RES
RES
RES
GND
GND
GND
GND
RES
RES
TP2
GND
GND
GND
GND
GND
RUIMIO
RES
TP3
GND
GND
GND
RUIM CLK
DVI_RX
TP4
GND
GND
GND
RUIM RST
DVI_TX
TP5
RES
RES
GPS_LNA_E
RES
DVI_CLK
GPIO_01
RES
GND
GND
RES
DVI_W A0
GPIO_02
RES
GND
ANT_GPS
10
RES
RES
GPIO_03
RES
GND
GND
10
11
RES
RES
GPIO_04
RES
RES
12
RES
RES
GPIO_06
RES
GND
RES
RES
13
USB_VBUS
GND
GPIO_07
RES
RES
RES
RES
RES
RES
RES
RES
RES
RES
GND
14
RES
GPIO_05
VRTC
RES
GND
RES
RES
RES
RES
RES
C105/RTS
C108/DTR
C109/DCD
C107/DSR C125/RING 14
USB_D+
USB_D-
TX_AUX
RX_AUX
RES
GPIO_10
RES
RES
GPIO_08
GPIO_09
C104/RXD
C103/TXD
C106/CTS
15
VAUX/PW R
11
MON
ON_OFF*
12
HW _SHUTD
13
OW N*
15
Top View
NOTE:
The pin defined as RES must be considered RESERVED and not connected on any pin in the
application. The related area on the application has to be kept empty.
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4.
Hardware Commands
4.1.
Turning on the DE910 module
To turn on the DE910, the pad ON_OFF* must be tied low for at least 1 second and then
released.
The maximum current that can be drained from the ON_OFF* pad is 0.1 mA.
A simple circuit to power on the module is illustrated below:
4.1.1.
Initialization and Activation State
Upon turning on DE910 module, the DE910 module is not active yet because the boot
sequence of DE910 is still executing internally. It takes about 10 seconds to complete the
initialization of the module internally.
For this reason, it would be useless to try to access DE910 during the Initialization state as
below. The DE910 module needs at least 10 seconds after the PWRMON goes High to
become operational by reaching the activation state.
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During the Initialization state, any kind of AT-command is not available. DTE must wait for
the Activation state to communicate with DE910.
To check if the DE910 has powered on, the hardware line PWRMON must be monitored.
When PWRMON goes high, the module has powered on.
NOTE:
Do not use any pull up resistor on the ON_OFF* line. It is pulled up internally. Using a pull
up resistor may bring latch up problems on the DE910 power regulator and improper power
on/off of the module. The line ON_OFF* must be connected only in open collector
configuration.
NOTE:
In this document all the lines are inverted. Active low signals are labeled with a name that
ends with "*" or with a bar over the name.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the DE910 module when the module is powered OFF
or during an ON/OFF transition.
For example:
1. To drive the ON_OFF* pad with a totem pole output of a +3/5 V microcontroller
(uP_OUT1):
2. To drive the ON_OFF* pad directly with an ON/OFF button:
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4.2.
Turning off the DE910 module
Turning off the device can be done in two ways:

By software command (see DE910 Software User Guide)

By hardware shutdown
When the device is shut down by software command or by hardware shutdown, it issues a
detach request to the network that informs the network that the device will no longer be
reachable.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the DE910 when the module is powered OFF or
during an ON/OFF transition.
The following flow chart shows the proper turnoff procedure:
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4.2.1.
Shutdown by Software Command
The DE910 can be shut down by a software command.
When a shutdown command is sent, the DE910 goes into the finalization state and will shut
down PWRMON at the end of this state.
The period of the finalization state can vary according to the state of the DE910 so it cannot
be fixed definitely.
Normally it will be above 10 seconds after sending a shutdown command and DTE should
monitor the status of PWRMON to see the actual power off.
TIP:
To check if the device has powered off hardware line PWRMON must be monitored. When
PWRMON goes low, the device has powered off.
4.2.2.
Hardware Shutdown
To turn OFF the DE910 the pad ON_OFF* must be tied low for at least 2 seconds and then
released. The same circuitry and timing for the power on must be used.
When the hold time of ON_OFF* is above 2 seconds, the DE910 goes into the finalization
state and will shut down PWRMON at the end of this state.
The period of the finalization state can vary according to the state of the DE910 so it cannot
be fixed definitely.
Normally it will be above 10 seconds after releasing ON_OFF* and DTE should monitor the
status of PWRMON to see the actual power off.
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TIP:
To check if the device has powered off, hardware line PWRMON must be monitored. When
PWRMON goes low, the device has powered off.
4.3.
Hardware Reset
WARNING:
The Hardware Reset must not be used during normal operation of the device since it does not
detach the device from the network. It shall be kept as an emergency exit procedure to be
done in the rare case that the device gets stuck waiting for some network.
4.3.1.
Hardware Unconditional Shutdown
To unconditionally shutdown the DE910, the pad HW_SHUTDOWN* must be tied low for at
least 200 milliseconds and then released.
A simple circuit to unconditionally shutdown the module is illustrated below:
NOTE:
Do not use any pull up resistor on the HW_SHUTDOWN* line or any totem pole digital
output. Using a pull up resistor may bring latch up problems on the DE910 power regulator
and result in improper functioning of the module. The line HW_SHUTDOWN* must be
connected only in open collector configuration.
TIP:
The unconditional hardware Shutdown must always be implemented on the boards and the
software must use it only as an emergency exit procedure.
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For example:
To drive the HW_SHUTDOWN* pad with a totem pole output of a +3/5 V microcontroller
(uP_OUT2):
4.4.
Summary of Turning ON and OFF the Module
The chart below describes the overall sequences for turning the module ON and OFF.
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DE910 Series Hardware User Guide
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5.
Power Supply
The power supply circuitry and board layout are a very important part in the full product
design and they strongly reflect on the product’s overall performance. Read carefully the
requirements and the guidelines that follow for a proper design.
5.1.
Power Supply Requirements
The external power supply must be connected to VBATT & VBATT_PA signals and must
fulfill the following requirements:
Power Supply
Nominal Supply Voltage
3.8V
Normal Operating Voltage Range
3.4V ~ 4.2V
Extended Operating Voltage Range
3.3V ~ 4.5V
NOTE:
The Operating Voltage Range MUST never be exceeded. Special care must be taken when
designing the application’s power supply section to avoid having an excessive voltage drop.
If the voltage drop is exceeding the limits it could cause a Power Off of the module..
Behavior in the extended operating voltage range might deviate from 3GPP2 specification.
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Current Consumption
Average
(mA)
Mode
Power off current (Typical)
15uA(*1)
No call in progress (slot cycle index=2, hybrid mode)
Standby mode
GPS=off
<15
GPS=on
<65
GPS=off
<25
GPS=on
<70
AT+CFUN=1
Normal mode; full functionality of the module
AT+CFUN=4
GPS=off
AT+CFUN=5
GPS=on
Disabled TX and RX; modules is not registered on the
network
<2.5(*2) Full functionality with power saving; Module
registered on the network can receive incoming call
<65
sand SMS
A call in progress
Tx and Rx mode
Antenna
Diversity=off
Mode Description
GPS=off
670
GPS=on
735
GPS=off
700
GPS=on
705
GPS=off
650
GPS=on
730
GPS=off
640
GPS=on
685
CDMA 1x call
Antenna
Diversity=on
Antenna
Diversity=off
1xEV-DO call
Antenna
Diversity=on
(*1)The off current is the total supply current from the main battery with the PMIC off and the
32 kHz XTAL oscillator on.
(*2) Standby current consumption depends on network configuration or module configuration.
NOTE:
The Operating Voltage Range MUST never be exceeded. Special care must be taken in order
to fulfill min/max supply voltage requirement.
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TIP:
The electrical design for the power supply should be made ensuring it will be capable of a
peak current output of at least 1A.
5.2.
General Design Rules
The principal guidelines for the Power Supply Design embrace three different design steps:

the electrical design

the thermal design

the PCB layout
5.2.1.
Electrical Design Guidelines
The electrical design of the power supply depends strongly on the power source where this
power is drained. We will distinguish them into three categories:

+5V input (typically PC internal regulator output)

+12V input (typically automotive)

Battery
5.2.2.
+ 5V Input Source Power Supply Design
Guidelines

The desired output for the power supply is 3.8V, hence there is not a big
difference between the input source and the desired output so a linear regulator
can be used. A switching power supply will not be suitable because of the low
drop-out requirements.

When using a linear regulator, a proper heat sink must be provided in order to
dissipate the power generated.

A Bypass low ESR capacitor of adequate capacity must be provided in order to
cut the current absorption peaks close to the DE910. A 100μF tantalum capacitor
is usually suited.

Make sure the low ESR capacitor on the power supply output (usually a tantalum
one) is rated at least 10V.

A protection diode must be inserted close to the power input in order to save the
DE910 from power polarity inversion.
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An example of a linear regulator with 5V input:
5.2.3.
+12V Input Source Power Supply Design
Guidelines

The desired output for the power supply is 3.8V, hence due to the big difference
between the input source and the desired output, a linear regulator is not suitable
and must not be used. A switching power supply would be preferable because of
its better efficiency, especially with the 1A peak current load represented by
DE910.

When using a switching regulator, a 500 kHz or more switching frequency
regulator is preferable because of its smaller inductor size and its faster transient
response. This allows the regulator to respond quickly to the current peaks
absorption.

In any case, the frequency and switching design selection is related to the
application to be developed due to the fact the switching frequency could also
generate EMC interferences.

For car PB battery the input voltage can rise up to 15.8V and this must be kept in
mind when choosing components: all components in the power supply must
withstand this voltage.

A bypass low ESR capacitor of adequate capacity must be provided in order to
cut the current absorption peaks. A 100μF tantalum capacitor is usually suited for
this.

Make sure the low ESR capacitor on the power supply output (usually a tantalum
one) is rated at least 10V.

For car applications a spike protection diode must be inserted close to the power
input in order to clean the supply from spikes.

A protection diode must be inserted close to the power input in order to save the
DE910 from power polarity inversion. This can be the same diode as for spike
protection.
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An example of switching regulator with 12V input is in the schematic below:
5.2.4.
Battery Source Power Supply Design
Guidelines
The desired nominal output for the power supply is 3.8V and the maximum voltage allowed is
4.2V. A single 3.7V lithium-ion cell battery type is ideal to supply power to the Telit DE910
module.
WARNING:
The three battery cells (Ni/Cd or Ni/MH 3.6V nom. battery types or 4V PB types) MUST
NOT be used directly because their maximum voltage can rise over the absolute maximum
voltage for the DE910 and cause damage. USE only Li-Ion battery types.

A bypass low (usually a 100uF tantalum) ESR capacitor with adequate capacity
must be provided in order to cut the current absorption peaks.

Make sure the low ESR capacitor (usually a tantalum) is rated at least 10V.

A protection diode must be inserted close to the power input in order to protect
the DE910 module from power polarity inversions when connecting the battery.

The battery capacity must be at least 500mAh in order to withstand the current
peaks of 1A. The suggested battery capacity is from 500mAh to 1000mAh.
5.2.5.
Thermal Design Guidelines
The thermal design for the power supply heat sink must be done with the following
specifications:

Average current consumption during CDMA 1x / 1xEV-DO transmission @PWR
level max : 750 mA
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
Average GPS current during GPS ON (Power Saving disabled) in DE910 : 55
mA
NOTE:
The average consumption during transmissions depends on the power level at which the
device is requested to transmit via the network. The average current consumption hence varies
significantly.
Considering the very low current during idle, especially if the Power Saving function is
enabled, it is possible to consider from the thermal point of view that the device absorbs
current significantly only during calls.
If we assume that the device stays in transmission for short periods of time (a few minutes)
and then remains for quite a long time in idle (one hour), then the power supply always has
time to cool down between the calls and the heat sink could be smaller than the calculated for
750mA maximum RMS current. There could even be a simple chip package (no heat sink).
Moreover in average network conditions the device is requested to transmit at a lower power
level than the maximum and hence the current consumption will be less than 750mA (usually
around 250 mA).
For these reasons the thermal design is rarely a concern and the simple ground plane where
the power supply chip is placed can be enough to ensure a good thermal condition and avoid
overheating.
The heat generated by the DE910 must be taken into consideration during transmission at
24.4dBm max during calls. This generated heat will be mostly conducted to the ground plane
under the DE910. The application must be able to dissipate heat.
In the CDMA 1x/1xEV-DO mode, since DE910 emits RF signals continuously during
transmission, special attention must be paid to how to dissipate the heat generated.
The current consumption will be up to about 750mA in CDMA 1x continuously at the
maximum TX output power (24.4dBm). Thus, you must arrange the area on the application
PCB must be as large as possible under DE910.
The DE910 must be mounted on the large ground area of the application board and make
many ground vias to dissipate the heat.
5.2.6.
Power Supply PCB layout Guidelines
As seen in the electrical design guidelines, the power supply must have a low ESR capacitor
on the output to cut the current peaks and a protection diode on the input to protect the supply
from spikes and polarity inversion. The placement of these components is crucial for the
correct operation of the circuitry. A misplaced component can be useless or can even decrease
the power supply performance.

The bypass low ESR capacitor must be placed close to the Telit DE910 power
input pads, or if the power supply is a switching type, the capacitor can be placed
close to the inductor to cut the ripple if the PCB trace from the capacitor to
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DE910 is wide enough to ensure a drop-less connection even during the 1A
current peaks.

The protection diode must be placed close to the input connector where the power
source is drained.

The PCB traces from the input connector to the power regulator IC must be wide
enough to ensure no voltage drops occur when the 1A current peaks are absorbed.
While a voltage drop of hundreds of mV may be acceptable from the power loss
point of view, the same voltage drop may not be acceptable from the noise point
of view. If the application does not have an audio interface but only uses the data
feature of the Telit DE910, then this noise is not as disruptive and the power
supply layout design can be more forgiving.

The PCB traces to DE910 and the Bypass capacitor must be wide enough to
ensure no significant voltage drops occur when the 1A current peaks are absorbed.
This is a must for the same above-mentioned reasons. Try to keep this trace as
short as possible.

The PCB traces connecting the switching output to the inductor and the switching
diode must be kept as short as possible by placing the inductor and the diode very
close to the power switching IC (only for switching power supply). This is done
in order to reduce the radiated field (noise) at the switching frequency (usually
100-500 kHz).

The use of a good common ground plane is suggested.

The placement of the power supply on the board must be done in a way to
guarantee that the high current return paths in the ground plane are not
overlapped with any noise sensitive circuitry such as the microphone
amplifier/buffer or earphone amplifier.

The power supply input cables must be kept separate from noise sensitive lines
such as microphone/earphone cables.

The insertion of EMI filter on VBATT pins is suggested in those designs where
antenna is placed close to battery or supply lines.
A ferrite bead like Murata BLM18EG101TN1 or Taiyo Yuden P/N
FBMH1608HM101 can be used for this purpose.
The below figure shows the recommended circuit:
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DE910 Series Hardware User Guide
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6.
Antenna
The antenna connection and board layout design are the most important parts in the full
product design and they strongly reflect on the product’s overall performance. Read carefully
and follow the requirements and the guidelines for a proper design.
6.1.
CDMA Antenna Requirements
The antenna for a Telit DE910 device must fulfill the following requirements:
CDMA Antenna Requirements
Frequency range
Bandwidth
Depending on the frequency band(s) provided by the
network operator, the customer must use the most suitable
antenna for that/those band(s)
70 MHz in CDMA BC0
140 MHz in CDMA BC1
Gain
Gain < 5.12dBi in CDMA BC0
Gain < 6.12dBi in CDMA BC1
Impedance
50 Ohm
Input power
> 24.4dBm Average Power in CDMA
VSWR absolute max
≤ 5:1 (Limit to avoid permanent damage)
VSWR recommended
≤ 2:1 (Limit to fulfill all regulatory requirement)
When using the Telit DE910, since there’s no antenna connector on the module, the antenna
must be connected to the DE910 antenna pad (K1) by means of a transmission line
implemented in the PCB.
In the case that the antenna is not directly connected at the antenna pad of the DE910, then a
PCB line is required.
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This transmission line shall fulfill the following requirements:
Antenna Line on PCB Requirements
Characteristic Impedance
50Ohm
Max Attenuation
0.3dB
Coupling with other signals shall be avoided
Cold End (Ground Plane) of antenna shall be equipotential to the DE910 ground pads
Furthermore if the device is developed for the US and/or Canada market, it must comply with
the FCC and/or IC approval requirements:
This device is to be used only for mobile and fixed application. The antenna(s) used for this
transmitter must be installed to provide a separation distance of at least 20 cm from all
persons and must not be co-located or operating in conjunction with any other antenna or
transmitter. End-Users must be provided with transmitter operation conditions for satisfying
RF exposure compliance. OEM integrators must ensure that the end user has no manual
instructions to remove or install the DE910 module. Antennas used for this OEM module
must not exceed 5dBi gain for mobile and fixed operating configurations.
6.1.1.











CDMA antenna – PCB line Guidelines
Make sure that the transmission line’s characteristic impedance is 50ohm.
Keep line on the PCB as short as possible since the antenna line loss shall be less than
around 0.3dB.
Line geometry should have uniform characteristics, constant cross section, avoid
meanders and abrupt curves.
Any kind of suitable geometry/structure ( Microstrip, Stripline, Coplanar, Grounded
Coplanar Waveguide … ) can be used for implementing the printed transmission line
afferent the antenna.
If a Ground plane is required in line geometry, that plane has to be continuous and
sufficiently extended so the geometry can be as similar as possible to the related
canonical model.
Keep, if possible, at least one layer of the PCB used only for the Ground plane; If
possible, use this layer as reference Ground plane for the transmission line.
It is wise to surround (on both sides) of the PCB transmission line with Ground. Avoid
having other signal tracks facing directly the antenna line track.
Avoid crossing any un-shielded transmission line footprint with other tracks on
different layers.
The Ground surrounding the antenna line on PCB has to be strictly connected to the
main Ground plane by means of via holes (once per 2mm at least) placed close to the
ground edges facing line track.
Place EM noisy devices as far as possible from DE910 antenna line.
Keep the antenna line far away from the DE910 power supply lines.
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

If EM noisy devices are present on the PCB hosting the DE910, such as fast switching
ICs, take care of shielding them with a metal frame cover.
If EM noisy devices are not present around the line, use of geometries like Micro strip
or Grounded Coplanar Waveguide are preferred since they typically ensure less
attenuation when compared to a Strip line having same length.
6.1.2.
PCB Guidelines in case of FCC
certification
In the case FCC certification is required for an application using DE910-DUAL,
according to FCC KDB 996369 for modular approval requirements, the transmission
line has to be similar to that implemented on module’s interface board and described in
the following chapter.
6.1.2.1.1.1. Transmission line design
During the design of the DE910 interface board, the placement of components has been
chosen properly, in order to keep the line length as short as possible, thus leading to
lowest power losses possible. A Grounded Coplanar Waveguide (G-CPW) line has
been chosen, since this kind of transmission line ensures good impedance control and
can be implemented in an outer PCB layer as needed in this case. A SMA female
connector has been used to feed the line.
The interface board is realized on a FR4, 4-layers PCB. Substrate material is
characterized by relative permittivity εr = 4.6 ± 0.4 @ 1 GHz, TanD= 0.019 ÷ 0.026 @
1 GHz.
A characteristic impedance of nearly 50 Ω is achieved using trace width = 1.1 mm,
clearance from coplanar ground plane = 0.3 mm each side. The line uses reference
ground plane on layer 3, while copper is removed from layer 2 underneath the line.
Height of trace above ground plane is 1.335 mm. Calculated characteristic impedance is
51.6 Ω, estimated line loss is less than 0.1 dB. The line geometry is shown below:
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6.1.2.1.1.2. Transmission line measurements
HP8753E VNA (Full-2-port calibration) has been used in this measurement session. A
calibrated coaxial cable has been soldered at the pad corresponding to RF output; a
SMA connector has been soldered to the board in order to characterize the losses of the
transmission line including the connector itself. During Return Loss / impedance
measurements, the transmission line has been terminated to 50 Ω load.
Return Loss plot of line under test is shown below:
Line input impedance (in Smith Chart format, once the line has been terminated to 50 Ω
load) is shown in the following figure:
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Insertion Loss of G-CPW line plus SMA connector is shown below:
6.1.3.




CDMA Antenna – Installation Guidelines
Install the antenna in a place covered by the CDMA signal.
If the device antenna in the application is located greater then 20cm from the human
body and there are no co-located transmitters then the Telit FCC/IC approvals can be
re-used by the end product.
Antenna shall not be installed inside metal cases.
Antenna shall be installed also according antenna manufacture instructions.
WARNING:
Consider a mechanical design and a low-capacitance ESD protection device to protect DE910
or customer specific requirements from ESD event to Antenna port (K1).
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6.2.
Antenna Diversity Requirements
This product includes an input for a second RX antenna to improve the radio sensitivity. The
function is called Antenna Diversity.
CDMA Antenna Diversity Requirements
Frequency range
Depending frequency band(s) provided by the network operator,
the customer must use the most suitable antenna for that/those
band(s)
Bandwidth
70 MHz in CDMA BC0
140 MHz in CDMA BC1
Impedance
50 Ohm
When using the Telit DE910, since there’s no antenna connector on the module, the antenna
must be connected to the DE910 antenna pad (F1) by means of a transmission line
implemented on the PCB.
In the case that the antenna is not directly connected at the antenna pad of DE910, then a PCB
line is required.
NOTE:
If the RX Diversity is not used/connected, disable the Diversity functionality using the
AT#CRXD command and leave the pad F1 unconnected. Please refer to the AT command
User Guide in detail.
WARNING:
Consider a mechanical design and a low-capacitance ESD protection device to protect DE910
or customer specific requirements from ESD event to Antenna port (F1).
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6.3.
GNSS Antenna Requirements
The use of an active GNSS antenna is required to achieve better performance.
The module is provided with a Digital Output signal to enable the external LNA (pad R7).
Parameter
Min
Max
Output high level
1.35V
1.8V
Output low level
0.0V
0.45V
6.3.1.
Combined GNSS Antenna
The use of combined CDMA/GNSS antenna is not recommended. This solution could
generate extremely poor GNSS reception and also the combined antenna requires an
additional diplexer and adds a loss in the RF route.
6.3.2.
Linear and Patch GNSS Antenna
Using this type of antenna introduces at least 3dB of loss if compared to a circularly polarized
(CP) antenna. Having a spherical gain response instead of a hemispherical gain response
could aggravate the multipath behaviour & create poor position accuracy.
6.3.3.
The Design Considerations to enhanced
GNSS performance
Depending on the characteristics and requirements unique to the customer’s designs, the use
of an external LNA or an external active antenna may be required to achieve best
performance.
The optional external LNA should be dimensioned to avoid an excessive LNA gain that can
introduce jamming, spurious, degrade IIP3, and saturate the receiver.
The configurations of an external device must fulfill the following requirements:



An external passive antenna (GPS only)
An external active antenna (GPS or GNSS)
An external passive antenna, GNSS pre-Filter , and GNSS LNA (GPS or GNSS)
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NOTE:
The external GNSS LNA and GNSS pre-Filter shall be required for GLONASS application.
GNSS LNA requirement shall fulfill the following specifications.
 Frequency = 1565 ~ 1606MHz
 Power Gain|S21|2 = 14 ~ 17dB
 NF < 1dB
GNSS pre-Filter requirement shall fulfill the following requirements.
 Source and Load Impedance = 50Ohm
 Insertion Loss (1575.42 ~ 1576.42MHz) = 1.4dB (Max)
 Insertion Loss (1565.42 ~ 1585.42MHz) = 2.0dB (Max)
 Insertion Loss (1597.5515 ~ 1605.886MHZ) = 2.0dB (Max)
The external active antenna for the Telit DE910 device must fulfill the following
requirements:
GNSS Antenna Requirements
Frequency range
Bandwidth
1575.42MHz (GPS L1)
1597.55 ~ 1605.89MHz (GLONASS)
±1.023MHz (GPS L1)
8.34MHz (GLONASS)
Impedance
50 Ohm
LNA NF
< 1dB
LNA Gain
14 ~ 17dB
LNA Input Voltage
3.0V or 5.0V
NOTE:
The maximum DC voltage applicable to ANT_GPS pin is 5V. In case this is exceeded, a
series capacitor has to be included in the design to avoid exceeding the maximum input DC
level.
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An example of GNSS antenna supply circuit is shown in the following image:
When using the Telit DE910, since there’s no antenna connector on the module, the antenna
must be connected to the DE910 through the PCB with the antenna pad.
In the case that the antenna is not directly connected at the antenna pad of the DE910, then a
PCB line is required.
This line of transmission shall fulfill the following requirements:
Antenna Line on PCB Requirements
Characteristic Impedance
50Ohm
Max Attenuation
0.3dB
Coupling with other signals shall be avoided
Cold End (Ground Plane) of antenna shall be equipotential to the DE910 ground pads
Furthermore if the device is developed for the US and/or Canada market, it must comply with
the FCC and/or IC requirements.
This device is to be used only for mobile and fixed application.
WARNING:
The DE910 software is implemented differently depending on the configurations of an
external device. Please refer to the AT command User Guide in detail.
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6.3.4.










Ensure that the antenna line impedance is 50ohm.
Keep line on the PCB as short as possible to reduce the loss.
Antenna line must have uniform characteristics, constant cross section, avoid meanders
and abrupt curves.
Keep one layer of the PCB used only for the Ground plane; if possible.
Surround (on the sides, over and under) the antenna line on PCB with Ground. Avoid
having other signal tracks directly facing the antenna line track.
The Ground around the antenna line on PCB has to be strictly connected to the main
Ground plane by placing vias once per 2mm at least.
Place EM noisy devices as far as possible from DE910 antenna line.
Keep the antenna line far away from the DE910 power supply lines.
If EM noisy devices are around the PCB hosting the DE910, such as fast switching ICs,
take care of shielding of antenna line by burying it inside the layers of PCB and
surround it with Ground planes; or shield it with a metal frame cover.
If you do not have EM noisy devices around the PCB of DE910, use a strip line on the
superficial copper layer for the antenna line. The line attenuation will be lower than a
buried one.
6.3.5.




GNSS Antenna – PCB Line Guidelines
GNSS Antenna – Installation Guidelines
The DE910, due to its sensitivity characteristics, is capable of performing a fix inside
buildings. However, the sensitivity could be affected by the building characteristics i.e.
shielding.
The Antenna must not be co-located or operating in conjunction with any other antenna
or transmitter.
Antenna shall not be installed inside metal cases.
Antenna shall be installed also according antenna manufacture instructions.
WARNING:
Consider a mechanical design and a low-capacitance ESD protection device to protect DE910
or customer specific requirements from ESD event to GPS port (R9).
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7.
USB Port
The DE910 module includes a Universal Serial Bus (USB) transceiver, which operates at
USB high-speed (480Mbits/sec).
It is compliant with the USB 2.0 specification and can be used for diagnostic monitoring,
control and data transfers.
The table below describes the USB interface signals:
Pin
Signal
I/O
Function
B15
USB_D+
I/O
USB differential Data(+)
C15
USB_D-
I/O
USB differential Data(-)
A13
VBUS
Power sense for the internal USB transceiver
Type
5V
The USB_DPLUS and USB_DMINUS signals have a clock rate of 480MHz. The signal
traces should be routed carefully. Trace lengths, number of vias and capacitive loading should
be minimized. The impedance value should be as close as possible to 90 Ohms differential.
WARNING:
Consider a mechanical design and a low-capacitance ESD protection device to protect DE910
or customer specific requirements from ESD event to USB lines (B15, C15 and A13).
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8.
Serial Port
The serial ports on the Telit DE910 are the interface between the module and OEM hardware.
2 serial ports are available on the module:


Modem Serial Port 1 (Main)
Modem Serial Port 2 (Auxiliary)
Several configurations can be designed for the serial port on the OEM hardware.
The most common are:



RS232 PC comport
Microcontroller UART@1.8V(Universal Asynchronous Receiver Transmit)
Microcontroller UART@5V or other voltages different from 1.8V
Depending on the type of serial port on the OEM hardware, a level translator circuit may be
needed to make the system work.
Serial port 1 is a +1.8V UART with all the 7 RS232 signals.
Serial port 2 is a +1.8V Auxiliary UART.
The electrical characteristics of the serial port are explained in the following tables:
Absolute Maximum Ratings -Not Functional
Parameter
Input level on non-power pin with respect to ground
Min
Max
-0.3
+2.3V
Operating Range - Interface levels
Parameter
Min
Max
Input high level
1.5V
2.1 V
Input low level
-0.3V
0.35V
Output high level
1.35V
1.8V
Output low level
0V
0.45V
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8.1.
Modem Serial Port 1
Serial port 1 on the DE910 is a +1.8V UART with all 7 RS232 signals.
It differs from the PC-RS232 in the signal polarity (RS232 is reversed) and levels.
Pin
Signal
I/O
Function
Type
N14
DCD
Data Carrier Detect
1.8V
M15
RXD
Transmit line *see Note
1.8V
N15
TXD
Receive line *see Note
1.8V
M14
DTR
Data Terminal Ready
1.8V
P14
DSR
Data Set Ready
1.8V
L14
RTS
Request to Send
1.8V
P15
CTS
Clear to Send
1.8V
R14
RI
Ring Indicator
1.8V
The following table shows the typical input value(pulled inside the baseband chipset) and
status for input lines all module states:
Signal/State
OFF
RESET
ON
Powersaving
PU tied to
unknown
PD:
21K~210K
PD:
21K~210K
PU:
39K~390K
PU:
39K~390K
PU:
39K~390K
1.8V
TXD
RTS
DTR
NOTE:
For minimum implementation, only the TXD and RXD lines must be connected, the other
lines can be left open provided a software flow control is implemented.
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the DE910 when the module is powered off or during
an ON/OFF transition.
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NOTE:
According to V.24, RX/TX signal names are referred to the application side. Therefore, on the
DE910 side these signals are in the opposite direction: TXD on the application side will be
connected to the receive line (here named TXD/ rx_uart ) of the DE910 serial port and vice
versa for RX.
NOTE:
High-speed UART supports up to 4Mbps. Please refer to the AT command User Guide in
detail.
WARNING:
Consider a mechanical design and a low-capacitance ESD protection device to protect DE910
or customer specific requirements from ESD event to UART port (M15, N15, P15 and L14).
8.2.
Modem Serial Port 2
Serial port 2 on the DE910 is a +1.8V UART with only the RX and TX signals.
The signals of the DE910 serial port are:
Pin
Signal
I/O
Function
Type
D15
TX_AUX
Auxillary UART (TX Data to DTE)
1.8V
E15
RX_AUX
Auxillary UART (RX Data from DTE)
1.8V
NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the DE910 when the module is powered off or during
an ON/OFF transition.
8.3.
RS232 Level Translation
In order to interface the Telit DE910 with a PC com port or a RS232 (EIA/TIA-232)
application, a level translator is required. This level translator must:


Invert the electrical signal in both directions
Change the level from 0/1.8V to +/-15V
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Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets accept signals with lower
levels on the RS232 side (EIA/TIA-562), allowing a lower voltage-multiplying ratio on the
level translator. Note that the negative signal voltage must be less than 0V and hence some
sort of level translation is always required.
The simplest way to translate the levels and invert the signal is by using a single chip level
translator. There are a multitude of them, differing in the number of drivers and receivers and
in the levels (be sure to get a true RS232 level translator not a RS485 or other standards).
By convention the driver is the level translator from the 0-1.8V UART to the RS232 level.
The receiver is the translator from the RS232 level to 0-1.8V UART.
In order to translate the whole set of control lines of the UART you will need:
 5 drivers
 3 receivers
An example of RS232 level adaption circuitry could be accomplished using a MAXIM
transceiver (MAX218).
In this case the chipset is capable of translating directly from 1.8V to the RS232 levels
(Example on 4 signals only).
NOTE:
In this case the length of the lines on the application has to be taken into account to avoid
problems in case of High-speed rates on RS232.
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The RS232 serial port lines are usually connected to a DB9 connector with the following
layout:
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9.
Audio Section Overview
The DE910 module doesn’t support an analog audio interface and supports one Digital Audio
bus.
In order to develop an application including an Analog Audio it is necessary to add a
dedicated CODEC on the Application design.
For further information, please refer to the “Digital Voice Interface Application Note”.
9.1.
Electrical Characteristics
The product is providing one Digital Audio Interface (DVI) on the following Pins:
Pin
Signal
I/O
Function
B9
DVI_WA0
I/O
Digital Voice interface (WA0)
B6
DVI_RX
Digital Voice interface (RX)
B7
DVI_TX
Digital Voice interface (TX)
B8
DVI_CLK
I/O
Digital Voice interface (CLK)
Type
1.8V
9.1.1.
CODEC Example
Please refer to the Digital Voice Interface Application note.
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10.
General Purpose I/O
The general-purpose I/O pads can be configured to act in three different ways:



Input
Output
Alternate function (internally controlled)
Input pads can only be read and report the digital value (high or low) present on the pad at the
read time.
Output pads can only be written to set the value of the pad or queried.
An alternate function pad is internally controlled by the DE910 firmware and acts depending
on the function implemented.
The following GPIOs are available on the DE910.
Pin
Signal
C8
GPIO_01
C9
GPIO_02
C10
GPIO_03
C11
GPIO_04
B14
GPIO_05
C12
GPIO_06
C13
GPIO_07
K15
GPIO_08
L15
GPIO_09
G15
GPIO_10
I/O
Function
I/O
Configurable GPIO
I/O
Configurable GPIO
I/O
Configurable GPIO
I/O
Configurable GPIO
I/O
Configurable GPIO
I/O
Configurable GPIO
I/O
I/O
I/O
I/O
Configurable GPIO
Drive Strength
Type
2 mA
1.8V
2 mA
2 mA
2 mA
2 mA
2 mA
2 mA
Configurable GPIO
2 mA
Configurable GPIO
2 mA
Configurable GPIO
2 mA
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
1.8V
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10.1.
Logic Level Specification
Where not specifically stated, all the interface circuits work at 1.8V CMOS logic levels.
The following table shows the logic level specifications used in the DE910 interface circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital pin (CMOS 1.8) with respect to ground
-0.3V
2.3V
Operating Range - Interface levels (1.8V CMOS)
Parameter
Min
Max
Input high level
1.5V
2.1V
Input low level
0.0V
0.35V
Output high level
1.35V
1.8V
Output low level
0.0V
0.45V
Current characteristics
Parameter
10.2.
Typical
Output Current
2mA
Input Current
30uA
Using a GPIO Pad as Input
The GPIO pads, when used as inputs, can be connected to a digital output of another device
and report its status, provided this device has interface levels compatible with the 1.8V
CMOS levels of the GPIO.
If the digital output of the device is connected with the GPIO input, the pad has interface
levels different from the 1.8V CMOS. It can be buffered with an open collector transistor with
a 4.7KΩ pull-up resistor to 1.8V.
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NOTE:
In order to avoid a back powering effect it is recommended to avoid having any HIGH logic
level signal applied to the digital pins of the module when it is powered OFF or during an
ON/OFF transition.
10.3.
Using a GPIO Pad as Output
The GPIO pads, when used as outputs, can drive 1.8V CMOS digital devices or compatible
hardware. When set as outputs, the pads have a push-pull output and therefore the pull-up
resistor may be omitted.
10.4.
Using the Temperature Monitor Function
10.4.1. Short Description
The Temperature Monitor is a function of the module that permits control of its internal
temperature and if properly set (see the #TEMPMON command on AT Interface guide) raises
to High Logic level a GPIO when the maximum temperature is reached.
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10.5.
Indication of Network Service Availability
The STAT_LED pin status shows information on the network service availability and Call
status. In the DE910 modules, the STAT_LED usually needs an external transistor to drive an
external LED. Because of the above, the status indicated in the following table is reversed
with respect to the pin status:
LED status
Permanently off
Fast blinking
(Period 1s, Ton 0,5s)
Slow blinking
(Period 3s, Ton 0,3s)
Permanently on
Device Status
Device off
Net search / Not registered / turning off
Registered full service
a call is active
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10.6.
RTC Bypass Output
The VRTC pin brings out the Real Time Clock supply, which is separate from the rest of the
digital part, allowing only RTC to be active when all the other parts of the device are off. To
this power output a backup capacitor can be added in order to increase the RTC autonomy
during power off of the battery. No devices must be powered from this pin.
For additional details on the Backup solutions please refer to the related application note
(xE910 RTC Backup Application Note).
VRTC also supplies reference power to help DE910 check the time from SMPL (Sudden
Momentary Power Loss).
So it is recommended as best practice to connect VRTC to a shunt capacitor (VRTC to GND)
and the acceptable capacitor value is:
Parameter
Keep-alive capacitor
on Pad no. = C14
Min
6.8uF
NOTE:
SMPL (Sudden Momentary Power Loss) : SMPL feature initiates a power-on sequence if the
monitored system voltage; VBATT drops out of range and then returns in range within a
programmable interval. SMPL achieves immediate and automatic recovery from momentary
power loss such as a brief battery disconnect.
NOTE:
VBATT must be supplied in order to use RTC function.
NOTE:
It is recommended to add a keep-alive capacitor on VRTC.
WARNING:
NO devices must be powered from this pin.
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10.7.
VAUX/PWRMON Power Output
A regulated power supply output is provided in order to supply small devices from the
module. This output is active when the module is ON and goes OFF when the module is shut
down. The operating range characteristics of the supply are:
Operating Range – VAUX/PWRMON power supply
Parameter
Output voltage
Min
Typical
Max
1.77V
1.8V
1.83V
200mA
Output current
Output bypass capacitor
(Inside the module)
2.2μF
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11.
DAC and ADC section
11.1.
DAC Converter
11.1.1. Description
The DE910 module provides a Digital to Analog Converter. The signal (named DAC_OUT)
is available on pin C13 of the DE910 module and on pin 6 of PL302 on Interface Board
(CS1467D).
The on board DAC is in the range from 0 to 1023. However, an external low-pass filter is
necessary.
Parameter
Min
Max
Units
Voltage range (filtered)
1.8
Volt
Range
1023
Steps
The precision is 1023 steps, so since the maximum voltage is 2V, the integrated voltage could
be calculated with the following formula:
Integrated output voltage = 2 * value / 1023
DAC_OUT line must be integrated (for example with a low band pass filter) in order to obtain
an analog voltage.
11.1.2. Enabling DAC
An AT command is available to use the DAC function.
The command is: AT#DAC[=[,]]
 - scale factor of the integrated output voltage (0..1023 ~ 10 bit precision)
it must be present if =1
Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.
NOTE:
The DAC frequency is selected internally. D/A converter must not be used during
POWERSAVING.
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11.1.3. Low Pass Filter Example
11.2.
ADC Converter
11.2.1. Description
The on board ADC is 8-bit converter. It is able to read a voltage level in the range of 0 ~ 1.2
volts applied on the ADC pin input and store and convert it into 8 bit word.
Parameter
Min
Max
Units
Input Voltage range
1.2
Volt
AD conversion
bits
Resolution
< 10
mV
Input Resistance
Mohm
The DE910 provides one Analog to Digital Converter.
The input lines are:
ADC available on pin B1 and Pin 7 of PL102 on Interface Board (CS1467D)
11.2.2. Using ADC Converter
An AT command is available to use the ADC function.
The command is AT#ADC=1,2. The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the full description of this
function.
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12.
Test Point
These pins are needed in order to analyze DE910 on the application board.
The signals of the DE910 are:
PAD
C3
C4
C5
C6
C7
D3
E3
Signal
TP1
TP2
TP3
TP4
TP5
TP6
TP7
I/O
Function
Test Point
Test Point
Test Point
Test Point
Test Point
Test Point
Test Point
Type
TP
TP
TP
TP
TP
TP
TP
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13.
Mounting the Module on your Board
13.1.
General
The DE910 has been designed in order to be compliant with a standard lead-free SMT process.
13.2.
Module Finishing & Dimensions
Top view
Bottom view
(Dimensions in mm)
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13.3.
Recommended foot print for the application
144 pins
< Top View >
In order to easily rework the DE910 it is suggested to consider having a 1.5 mm placement
inhibit area around the module on the application.
It is also suggested, as a common rule for an SMT component, to avoid having a mechanical
part of the application in direct contact with the module.
NOTE:
In the customer application, the region under WIRING INHIBIT (see figure) must be clear
from signal or ground paths.
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13.4.
Stencil
Stencil’s apertures layout can be the same as the recommended footprint (1:1). we suggest a
thickness of stencil foil ≥ 120 µm.
13.5.
PCB Pad Design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
PCB
13.6.
Recommendations for PCB Pad Dimensions (mm)
It is not recommended to place via or micro-via not covered by solder resist in an area of 0.3
mm around the pads unless it carries the same signal as the pad itself (see following figure).
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Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB Pad Surfaces:
Finish
Electro-less Ni / Immersion Au
Layer thickness (um)
3 ~ 7 / 0.05 ~ 0.15
Properties
good solder ability protection,
high shear force values
The PCB must be able to resist the higher temperatures which are occurring at the lead-free
process. This issue should be discussed with the PCB-supplier. Generally, the wettability of
tin-lead solder paste on the described surface plating is better compared to lead-free solder
paste.
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13.7.
Solder Paste
Solder Paste
Lead free
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
13.7.1. Solder Reflow
The following is the recommended solder reflow profile:
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Pb-Free Assembly
3℃/second max
150℃
200℃
60 ~ 180 seconds
Tsmax to TL
- Ramp-up Rate
3℃/second max
Time maintained above:
- Temperature (TL)
- Time (tL)
217℃
60 ~150 seconds
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Profile Feature
Pb-Free Assembly
Peak Temperature (TP)
245 +0/-5℃
Time within 5℃ of actual Peak Temperature (tP)
10 ~30 seconds
Ramp-down Rate
6 ℃/second max
Time 25℃ to Peak Temperature
8 minutes max
NOTE:
All temperatures refer to topside of the package, measured on the package body surface.
WARNING:
The DE910 module withstands one reflow process only.
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14.
Packing System
The DE910 modules are packaged on trays of 20 pieces each. These trays can be used in SMT
processes for pick & place handling.
14.1.
Tray
WARNING:
These trays can withstand a maximum temperature of 65℃.
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14.2.
Reel
The DE910 can be packaged on reels of 200 pieces each.
See figure for module positioning into the carrier.
14.2.1. Carrier Tape Detail
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14.2.2. Reel Detail
14.2.3. Packaging Detail
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14.3.
Moisture Sensibility
The DE910 is a Moisture Sensitive Device level 3, in accordance with standard IPC/JEDEC
J-STD-020, take care all the relatives requirements for using this kind of components.
Moreover, the customer has to take care of the following conditions:
a) Calculated shelf life in sealed bag: 12 months at <40°C and <90% relative humidity (RH).
b) Environmental condition during the production: 30°C / 60% RH according to IPC/JEDEC
J-STD-033A paragraph 5.
c) The maximum time between the opening of the sealed bag and the reflow process must be
168 hours if condition b) “IPC/JEDEC J-STD-033A paragraph 5.2” is respected
d) Baking is required if conditions b) or c) are not respected
e) Baking is required if the humidity indicator inside the bag indicates 10% RH or more
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15.
Application Design Guide
15.1.
Download and Debug Port
One of the following options should be chosen in the design of host system in order to
download or upgrade the Telit’s software and debug DE910 when DE910 is already mounted
on a host system.
Users who use both of UART and USB interfaces to communicate DE910
Must implement a download method in a host system for upgrading DE910 when it’s
mounted.
Users who use USB interface only to communicate DE910
Must arrange UART port in a host system for upgrading or debugging DE910 when it’s
mounted.
Users who use UART interface only to communicate DE910
Must arrange USB port in a host system for upgrading or debugging DE910 when it’s
mounted.
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16.
Conformity Assessment Issues
(Problèmes d'évaluation de conformité)
The DE910 is FCC/IC Approved as a module to be installed in other devices. This device
should be used only for fixed and mobile applications and if the final product after
integration is intended for portable use, a new application and FCC is required.
Le DE910 est approuvé FCC/IC comme module à installer dans d'autres dispositifs. Ce
dispositif doit être utilisé uniquement pour des applications fixes et mobiles et si le produit
fini est prévu après intégration pour un usage portatif, une nouvelle application et la FCC est
requise
The user is cautioned that this device should be used only as specified within this manual to
meet RF exposure requirements.
L'utilisateur est averti que ce dispositif doit être utilisé uniquement comme spécifié dans ce
manuel pour répondre aux normes d'exposition aux ondes rf.
Use of this device in a manner inconsistent with this manual could lead to excessive RF
exposure conditions.
L'utilisation de ce dispositif en quelque sorte contradictoire avec ce manuel a pu mener aux
états excessifs d'exposition de rf.
The DE910 conforms to the following US Directives:
• Use of RF Spectrum. Standards: FCC47 Part 22&24
• EMC Standards: FCC47 Part 15
Le DE910 est conforme aux directives suivantes des USA
• Utilisation de spectre de rf. Normes : FCC47 partie 22&24
• Normes d'EMC : FCC47 partie 15
This device complies with Part 15 of the FCC Rules.
Ce dispositif est conforme à la partie 15 des règles FCC.
Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and
(2) This device must accept any interference, including interference that may cause
undesired operation of the device.
Le fonctionnement est sujet aux deux conditions suivantes :
(1) ce dispositif peut ne pas causer l'interférence nocive, et
(2) ce dispositif doit accepter aucune interférence, y compris un interférence qui
pourrait causer le fonctionnement non désiré du dispositif.
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The user must refer to below information to meet the FCC/IC's RF exposure rules and
regulations when they design:
Lors de la conception, l'utilisateur doit se référer à l'information ci-dessous pour remplir les
conditions et règlementations FCC/IC' d’exposition aux ondes RF:
• The system antenna(s) used for this transmitter must be installed to provide a
separation distance of at least 20 cm from all the persons and must not be co-located
or operating in conjunction with any other antenna or transmitter.
Le système d’antenne utilisé pour cet émetteur doit être installé à une distance d’au
moins de 20 cm de toute personne et ne doit pas être co-implanté ou opérer en même
temps que n'importe quelle autre antenne ou émetteur.
• The system antenna(s) used for this module must not exceed 5.12dBi in CDMA BC0
and 6.12dBi in CDMA BC1 for mobile and fixed or mobile operating configurations.
Le système d’ antenne utilisé pour ce module ne doit pas dépasser 5.12dBi en
CDMA BC0 et 6.12dBi en CDMA BC1 pour des configurations mobiles et fixes ou
des configurations opérant en mode mobile.
• Users and installers must be provided with antenna installation instructions and
transmitter operating conditions for satisfying RF exposure compliance.
Manufacturers of mobile, fixed or portable devices incorporating this module are
advised to clarify any regulatory questions and to have their complete product tested
and approved for FCC compliance.
Les instructions d’installation de l’antenne ainsi que les conditions de
fonctionnement de l’émetteur doivent être remis aux utilisateurs et aux installateurs
conformément à la règlementation sur l’exposition aux ondes rf. Des fabricants des
dispositifs mobiles, fixes ou portables incorporant ce module sont invités à clarifier
toutes les questions de normalisation et à avoir leur produit complètement testé pour
la mise en conformité FCC.
• DE910 is intended for the OEM integrator only.
DE910 est prévu pour l'intégrateur OEM seulement.
• The user is required to see the Grant of Equipment document for other restrictions.
L'utilisateur doit se referrer au document « Grant of equipment » pour d'autres
restrictions.
• DE910 must be operated and used with a locally approved access point.
DE910 doit être actionné et utilisé avec un point d'accès localement approuvé.
• The radio transmitter(IC ID: 5131A-DE910DUAL) has been approved by Industry
Canada to operate with the antenna type listed in this manual with the maximum
permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain
indicated for that type, are strictly prohibited for use with this device.
L'émetteur radio (identification d'IC : 5131A-DE910DUAL) a été approuvé par
Industry Canada pour fonctionner avec le type d'antenne énuméré dans ce manuel
avec le gain autorisé maximum et l'impédance d’antenne exigée pour chaque type
d'antenne indiqué. Les types d'antenne non inclus dans cette liste, ayant un gain
supérieur au gain maximum indiqué pour ce type, sont strictement interdits pour un
usage avec ce dispositif.
• If antenna is co-located or operating in conjunction with any other antenna or
transmitter then additional FCC/IC testing may be required.
Si l'antenne est co-situé ou opérant en conjonction avec tout autre antenne ou
transmetteur puis tests FCC / IC supplémentaire peut être nécessaire.
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• This device is granted for use in Mobile only configurations only in which the
antennas used for this transmitter must be installed to provide a separation distance
of at least 20cm from all persons and not be co-located with any other transmitters
except in accordance with FCC multi-transmitter product procedures.
Ce dispositif est accordée pour une utilisation à Mobile Seules les configurations
dans lequel seules les antennes utilisées pour cet émetteur doivent être installés pour
fournir une distance de séparation d'au moins 20 cm de toutes les personnes et ne pas
être co-localisés avec d'autres émetteurs sauf en conformité avec la FCC procédures
de produits multi-émetteur.
• This module is not certified for simultaneous transmissions with other co-located
transmitters. Additional testing and certification may be necessary when this module
transmits simultaneously with any other radiating source. The OEM integrator is
responsible for testing their end-product for any additional compliance requirements.
If an intentional radiator incorporates more than one antenna or other radiating
source and these radiating sources are designed to emit at the same time,
measurements of conducted and radiated emissions shall be performed with all
radiating sources that are to be employed emitting. In no event may the measured
emissions of the composite system exceed the highest level permitted for an
individual component. The OEM integrator must demonstrate that the final host
product is compliant with all transmitters operating simultaneously, if applicable.
Ce module est pas certifié pour transmissions simultanées avec d'autres émetteurs colocalisés. Essai et de certification supplémentaires peuvent être nécessaires lors de ce
module transmet simultanément avec toute autre source de rayonnement.
L'intégrateur OEM est responsable de tester leur produit final pour toutes les
exigences de conformité supplémentaires. Si un radiateur intentionnel incorpore plus
d'une antenne ou d'une autre source de rayonnement et de ces sources de
rayonnement sont conçus pour émettre en même temps, les mesures des émissions
conduites et rayonnées sont effectuées avec toutes les sources rayonnantes qui sont à
employer électroluminescente. En aucun cas, les émissions mesurées du système
composite peuvent dépasser le plus haut niveau autorisé pour un composant
individuel. L'intégrateur OEM doit démontrer que le produit hôte final est conforme
à tous les émetteurs fonctionnant simultanément, le cas échéant.
The following regulatory and safety notices must be published in documentation supplied
to the end user of the product or system incorporating an adapter in compliance with local
regulations.
•
Host system including DE910 must be labeled with
“Contains transmitter module with
FCC ID: RI7DE910-DUAL and IC ID: 5131A-DE910DUAL”
Les notices de normalisation et de sécurité doivent se trouver dans la documentation
fournie à l'utilisateur du produit ou du système incorporant un adaptateur conforme aux
règlementations locales.
•
Le système hôte comprenant DE910 doit être marqué avec « Contient un module
émetteur avec IDENTIFICATION FCC : RI7DE910-DUAL et identification IC :
5131A-DE910DUAL »
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17.
Safety Recommendations
READ CAREFULLY
Be sure the use of this product is allowed in the country and in the environment required. The
use of this product may be dangerous and has to be avoided in the following areas:
 Where it can interfere with other electronic devices in environments such as hospitals,
airports, aircrafts, etc.
 Where there is risk of explosion such as gasoline stations, oil refineries, etc. It is the
responsibility of the user to enforce the country’s regulations and the specific
environmental regulation.
Do not disassemble the product; any evidence of tampering will compromise the warranty
validity. Follow the instructions of the hardware user guides for a correct wiring of the
product. The product has to be supplied with a stabilized voltage source and the wiring has to
conform to the security and fire prevention regulations. The product has to be handled with
care, avoiding any contact with the pads because electrostatic discharges may damage the
product itself.
The system integrator is responsible for the functioning of the final product; therefore, care
has to be taken with the external components of the module as well as of any project or
installation issue because of the risk of disturbing the CDMA network or external devices or
having impact on security. Should there be any doubt, please refer to the technical
documentation and the regulations in force. Every module has to be equipped with a proper
antenna with specific characteristics. The antenna has to be installed with care in order to
avoid any interference with other electronic devices and has to guarantee a minimum distance
from the body (20 cm). In case this requirement cannot be satisfied, the system integrator has
to assess the final product against SAR regulations.
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18.
Document History
Revision
Date
2011-12-09
2012-03-07
2012-07-03
2012-12-20
2013-04-08
2013-04-16
2013-06-03
2013-11-26
2014-11-12
2015-05-11
Changes
Release for Beta samples
Release for Verizon
Verizon TA update
8.2. Modem Serial Port2
12.2. Module Finishing & Dimensions
3.1. Pin-out : Auxiliary UART and RUIM IF
3.1.1. LGA Pads Layout
5.1. Power Supply Requirements
8.1. Modem Serial Port1
14.1 Download and Debug Port
3. DE910 Module Connections
3.1. Pin-Out
5.1. Power Supply Requirements
8.1. Modem Serial Port1
12.4. Stencil
2.2. Product Specifications
2.2. Product Specifications
4.2. Turning off the DE910 module
5.2.6. Power Supply PCB layout Guidelines
6.3.3. The Design Considerations to enhanced GNSS performance
12.7.1. Solder Reflow
13. Packing System
3. DE910 module connections
6.1.2. PCB Guidelines in case of FCC certification
10.6. RTC Bypass Output
16. Conformity Assessment Issues
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