Telit Communications S p A GL865Q Quadband GSM/ GPRS Module User Manual 1vv0300910 GL865 Hardware User Guide r1

Telit Communications S.p.A. Quadband GSM/ GPRS Module 1vv0300910 GL865 Hardware User Guide r1

User Manual

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GL865 Hardware User Guide
1vv0300910 Rev.1 – 2011-07-22
GL865 Hardware User Guide
1vv0300910 Rev.1 – 2011-07-22
APPLICABILITY TABLE
PRODUCT
GL865 QUAD
GL865 DUAL
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GL865 Hardware User Guide
1vv0300910 Rev.1 – 2011-07-22
DISCLAIMER
The information contained in this document is the proprietary
information of Telit Communications S.p.A. and its affiliates
(“TELIT”). The contents are confidential and any disclosure to
persons
other
than
the
officers,
employees,
agents
or
subcontractors of the owner or licensee of this document,
without the prior written consent of Telit, is strictly
prohibited.
Telit makes every effort to
information it makes available.
Telit does not make any warranty
herein, and does not accept any
or damage of any kind incurred
information.
ensure the quality of the
Notwithstanding the foregoing,
as to the information contained
liability for any injury, loss
by use of or reliance upon the
Telit disclaims any and all responsibility for the application
of the devices characterized in this document, and notes that
the application of the device must comply with the safety
standards of the applicable country, and where applicable, with
the relevant wiring rules.
Telit reserves the right to make modifications, additions and
deletions to this document due to typographical errors,
inaccurate information, or improvements to programs and/or
equipment at any time and without notice. Such changes will,
nevertheless
be
incorporated
into
new
editions
of
this
application note.
All rights reserved.
© 2009, 2010 Telit Communications S.p.A.
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GL865 Hardware User Guide
1vv0300910 Rev.1 – 2011-07-22
Contents
1.
INTRODUCTION ......................................................................................................................................................... 6
1.1.
1.2.
1.3.
1.4.
1.5.
1.6.
1.7.
SCOPE .........................................................................................................................................................................6
AUDIENCE....................................................................................................................................................................6
CONTACT INFORMATION, SUPPORT ..................................................................................................................................6
DOCUMENT ORGANIZATION ............................................................................................................................................6
TEXT CONVENTIONS....................................................................................................................................................... 7
RELATED DOCUMENTS ...................................................................................................................................................8
DOCUMENT HISTORY .....................................................................................................................................................8
2.
OVERVIEW .............................................................................................................................................................. 10
3.
GL865 MECHANICAL DIMENSIONS .......................................................................................................................... 12
4.
GL865 MODULE CONNECTIONS ............................................................................................................................... 13
4.1.
4.2.
5.
PIN-OUT.................................................................................................................................................................. 13
PIN LAYOUT ............................................................................................................................................................... 16
HARDWARE COMMANDS ........................................................................................................................................ 17
5.1.
AUTO-TURNING ON THE GL865 ................................................................................................................................... 17
5.2.
TURNING OFF THE GL865 ........................................................................................................................................... 19
5.3.
RESETTING THE GL865 ................................................................................................................................................ 21
5.3.1.
Hardware Unconditional restart.................................................................................................................... 21
6.
POWER SUPPLY ....................................................................................................................................................... 23
6.1.
POWER SUPPLY REQUIREMENTS..................................................................................................................................... 23
6.2.
POWER CONSUMPTION ................................................................................................................................................ 24
6.3.
GENERAL DESIGN RULES ............................................................................................................................................... 25
6.3.1.
Electrical Design Guidelines ........................................................................................................................... 25
6.3.2.
Thermal Design Guidelines ............................................................................................................................ 29
6.3.3.
Power Supply PCB layout Guidelines ............................................................................................................. 30
7.
ANTENNA ................................................................................................................................................................ 32
7.1.
7.2.
7.3.
8.
GSM ANTENNA REQUIREMENTS .................................................................................................................................... 32
GSM ANTENNA - PCB LINE GUIDELINES.......................................................................................................................... 33
GSM ANTENNA - INSTALLATION GUIDELINES ................................................................................................................... 37
LOGIC LEVEL SPECIFICATIONS .................................................................................................................................. 38
8.1.
9.
RESET SIGNAL ............................................................................................................................................................. 39
SERIAL PORTS .......................................................................................................................................................... 41
9.1.
9.2.
9.3.
9.4.
10.
MODEM SERIAL PORT ............................................................................................................................................. 41
RS232 LEVEL TRANSLATION .......................................................................................................................................... 43
................................................................................................................................................................................ 46
5V UART LEVEL TRANSLATION ...................................................................................................................................... 47
AUDIO SECTION OVERVIEW ................................................................................................................................ 49
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10.1. ELECTRICAL CHARACTERISTICS........................................................................................................................................ 52
10.1.1.
Input Lines ..................................................................................................................................................... 52
10.1.2.
Output Lines................................................................................................................................................... 53
11.
GENERAL PURPOSE I/O ....................................................................................................................................... 55
11.1. GPIO LOGIC LEVELS..................................................................................................................................................... 56
11.2. USING A GPIO PAD AS INPUT ...................................................................................................................................... 57
11.3. USING A GPIO PAD AS OUTPUT .................................................................................................................................. 57
11.4. USING THE RFTXMON OUTPUT GPIO5......................................................................................................................... 57
11.5. USING THE ALARM OUTPUT GPIO6 ............................................................................................................................... 58
11.6. USING THE BUZZER OUTPUT GPIO7 ............................................................................................................................... 58
11.7. MAGNETIC BUZZER CONCEPTS....................................................................................................................................... 59
1.1.1 Short Description .................................................................................................................................................... 59
11.7.1.
Frequency Behaviour ..................................................................................................................................... 60
11.7.2.
Power Supply Influence .................................................................................................................................. 60
11.7.3.
Working Current Influence............................................................................................................................. 61
11.8. STAT LED INDICATION OF NETWORK SERVICE AVAILABILITY................................................................................................. 61
11.9. SIMIN DETECTION ...................................................................................................................................................... 62
11.10.
RTC BYPASS OUT .................................................................................................................................................... 64
11.11.
SIM HOLDER IMPLEMENTATION ................................................................................................................................ 64
12.
DAC AND ADC SECTION ....................................................................................................................................... 65
12.1. DAC CONVERTER ........................................................................................................................................................ 65
12.1.1.
Description ..................................................................................................................................................... 65
12.1.2.
Enabling DAC ................................................................................................................................................. 66
12.1.3.
Low Pass Filter Example................................................................................................................................. 66
12.2. ADC CONVERTER ........................................................................................................................................................ 67
12.2.1.
Description ..................................................................................................................................................... 67
12.2.2.
Using ADC Converter ..................................................................................................................................... 67
12.3. DEBUG OF THE GL865 IN PRODUCTION ........................................................................................................................... 67
13.
MOUNTING THE GL865 ON YOUR BOARD ........................................................................................................... 69
13.1. GENERAL ................................................................................................................................................................... 69
13.2. MODULE FINISHING & DIMENSIONS ................................................................................................................................ 69
13.3. RECOMMENDED FOOT PRINT FOR THE APPLICATION ........................................................................................................... 70
13.4. SOLDER PASTE ............................................................................................................................................................ 71
13.4.1.
GL865 Solder reflow....................................................................................................................................... 71
14.
14.1.
PACKING SYSTEM ................................................................................................................................................ 73
MOISTURE SENSIBILITY ................................................................................................................................................. 74
15.
CONFORMITY ASSESSMENT ISSUES ..................................................................................................................... 75
16.
SAFETY RECOMMANDATIONS ............................................................................................................................. 76
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GL865 Hardware User Guide
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1.
Introduction
1.1.
Scope
The aim of this document is the description of some hardware solutions
useful for developing a product with the Telit GL865 module.
1.2.
Audience
This document is intended for Telit customers, who are integrators,
about to implement their applications using our GL865 modules.
1.3.
Contact Information, Support
For general contact, technical support, to report documentation errors
and to order manuals, contact Telit’s Technical Support Center (TTSC)
at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or
for recommendations on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions
contact Telit’s Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed
of your comments and suggestions for improvements.
Telit appreciates feedback from the users of our information.
1.4.
Document Organization
This document contains the following chapters:
Chapter 1: “Introduction” provides a scope for this document, target
audience, contact and support information, and text conventions.
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Chapter 2: “Overview” provides an overview of the document.
Chapter 3: “GL865 Mechanical Dimensions”
Chapter 4: “GL865 Module
configuration and layout.
Chapter 5:
hardware.
“Hardware
Connections”
Commands”
How
to
deals
operate
with
on
the
the
pin
out
module
via
Chapter 6: “Power supply” Power supply requirements and general design
rules.
Chapter 7: “Antenna” The antenna connection and board layout design are
the most important parts in the full product design.
Chapter 8: “Logic Level specifications” Specific values adopted in the
implementation of logic levels for this module.
Chapter 9: “Serial ports” The serial port on the Telit GL865 is the
core of the interface between the module and OEM hardware
Chapter 10: “Audio Section overview” Refers to the audio blocks of the
Base Band Chip of the GL865 Telit Modules.
Chapter 11: “General Purpose I/O” How the general purpose I/O pads can
be configured.
Chapter 12
converters.
“DAC
and
ADC
Section”
Deals
with
these
two
kind
of
Chapter
13:
“Mounting
the
GL865
on
the
application
board”
Recommendations and specifics on how to mount the module on the user’s
board.
1.5.
Text Conventions
Danger – This information MUST be followed or catastrophic equipment
failure or bodily injury may occur.
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Caution or Warning – Alerts the user to important points about
integrating the module, if these points are not followed, the module
and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful
when integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6.
1.7.
Related Documents
•
Telit's GSM/GPRS Family Software User Guide, 1vv0300784
•
Audio settings application note , 80000NT10007a
•
Digital Voice Interface Application Note, 80000NT10004a
•
GL865 Product description, 80370ST10080a
•
SIM Holder Design Guides, 80000NT10001a
•
AT Commands Reference Guide, 80000ST10025a
•
Telit EVK2 User Guide, 1vv0300704
Document History
Revision
Date
Changes
ISSUE#0
2011-01-05
First ISSUE
ISSUE#1
2011-07-22
Add FCC IC note in Safety recommendations
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GL865 Hardware User Guide
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2.
Overview
The aim of this document is the description of some hardware
solutions useful for developing a product with the Telit GL865
module.
In this document all the basic functions of a mobile phone will
be taken into account; for each one of them a proper hardware
solution will be suggested and eventually the wrong solutions
and common errors to be avoided will be evidenced. Obviously
this document cannot embrace the whole hardware solutions and
products that may be designed. The wrong solutions to be avoided
shall be considered as mandatory, while the suggested hardware
configurations shall not be considered mandatory, instead the
information given shall be used as a guide and a starting point
for properly developing your product with the Telit GL865 module.
For further hardware details that may not be explained in this
document refer to the Telit GL865 Product Description document
where all the hardware information is reported.
NOTICE:
(EN) The integration of the GSM/GPRS GL865 cellular module within
user application shall be done according to the design rules
described in this manual.
(IT) L’integrazione del modulo cellulare GSM/GPRS GL865 all’interno
dell’applicazione dell’utente dovrà rispettare le indicazioni
progettuali descritte in questo manuale.
(DE) Die Integration des GL865 GSM/GPRS Mobilfunk-Moduls in ein Gerät
muß gemäß der in diesem Dokument beschriebenen Kunstruktionsregeln
erfolgen.
(SL) Integracija GSM/GPRS GL865 modula v uporabniški aplikaciji bo
morala upoštevati projektna navodila, opisana v tem piročniku.
(SP) La utilización del modulo GSM/GPRS GL865 debe ser conforme a los
usos para los cuales ha sido deseñado descritos en este manual del
usuario.
(FR) L’intégration du module cellulaire GSM/GPRS GL865 dans
l’application de l’utilisateur sera faite selon les règles de
conception décrites dans ce manuel.
(HE)
GL865
The information presented in this document is believed to be
accurate and reliable. However, no responsibility is assumed by
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GL865 Hardware User Guide
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Telit Communications S.p.A. for its use, nor any infringement of
patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under
any patent rights of Telit Communications S.p.A. other than for
circuitry embodied in Telit products. This document is subject
to change without notice.
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GL865 Hardware User Guide
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3.
GL865 Mechanical Dimensions
The GL865 overall dimensions are:
•
•
•
•
Length:
Width:
Thickness:
Weight
24.4 mm
24.4 mm
2.7 mm
2.48 g
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GL865 Hardware User Guide
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4.
GL865 module connections
4.1.
PIN-OUT
Pad
Signal
I/
Function
20
EAR-
AO
Earphone signal output, phase -
Audio
21
EAR+
AO
Earphone signal output, phase +
Audio
22
MIC-
AI
Mic.signal input; phase-
Audio
24
MIC+
AI
Mic.signal input; phase+
Audio
23
AGND
Analog Ground
SIM card interface
External SIM signal – Power supply for
the SIM
External SIM signal – Reset
1,8 / 3V
Note
Type
Audio
SIMVCC
10
SIMRST
11
SIMCLK
12
SIMIO
I/
All
GPI0
can be
program
med
SIMIN
Presence SIM input
(See para 11.9)
44
RXD_AUX
Auxiliary UART (RX Data)
CMOS 2.8V
45
TXD_AUX
Auxiliary UART (TX Data)
CMOS 2.8V
1,8 / 3V
External SIM signal – Clock
External SIM signal – Data I/O
1,8 / 3V
4.7K
Pull up
1,8 / 3V
CMOS 2.8V
Trace
C109/DCD/GPO
C125/RING/GPO
C107/DSR/GPO
C108/DTR/GPI
C105/RTS/GPI
C106/CTS/GPO
C103/TXD
Prog. / Data + HW Flow Control
Output for Data carrier detect signal
(DCD) to DTE
/ GP output
Output for Ring indicator signal (RI)
to DTE
/ GP output
Output for Data set ready signal (DSR)
to DTE
/ GP output
Input for Data terminal ready signal
(DTR) from DTE
/ GP input
Input for Request to send signal (RTS)
from DTE
/ GP input
Output for Clear to send signal (CTS)
to DTE
/ GP output
Serial data input (TXD) from DTE
C104/RXD
Serial data output to DTE
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
DAC and ADC
13
ADC_IN1
AI
Analog/Digital converter input
A/D
14
ADC_IN2
AI
Analog/Digital converter input
A/D
15
DAC_OUT
AO
Digital/Analog converter output
D/A
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Pad
Signal
I/
30
VRTC
AO
VRTC Backup
Power
47
RESET*
43
V_AUX / PWRMON
34
Antenna
Reset input
2.8V stabilized output Imax=100mA
/ Power ON monitor
Antenna output – 50 Ω
CMOS 1.8V
Power Out
2.8V
RF
42
GPIO_01 /
DVI_WA0
I/
41
GPIO_02 / JDR /
DVI_RX
I/
GPIO_03 /
DVI_TX
GPIO_04 / TX
Disable /
DVI_CLK
GPIO_05 /
RFTXMON
I/
Function
Note
Type
Miscellaneous Functions
GPIO
40
39
I/
GPIO01 Configurable GPIO
/ Digital Audio Interface (WA0)
GPIO02 Configurable GPIO / Jammer
Detect Report
/ Digital Audio Interface (RX)
GPIO03 Configurable GPIO
/ Digital Audio Interface (TX)
GPIO04 Configurable GPIO / TX Disable
input
/ Digital Audio Interface (CLK)
GPIO05 Configurable GPIO
/ Transmitter ON monitor
GPIO06 Configurable GPIO
/ ALARM
GPIO07 Configurable GPIO
/ Buzzer
GPIO08 Configurable GPIO
/ STAT LED
Power Supply
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
GPIO_07 /
BUZZER
GPIO_08 /
STAT_LED
I/
I/
I/
I/
38
VBATT
Main power supply (Baseband)
Power
37
VBATT_PA
Main power supply (Radio PA)
Power
23
AGND
AF Signal Ground (see audio section)
AF Signal
32
GND
Ground
Power
33
GND
Ground
Power
35
GND
Ground
Power
36
GND
Ground
Power
46
GND
Ground
Power
29
28
27
26
GPIO_06 / ALARM
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
CMOS 2.8V
RESERVED
48
16
17
18
19
25
31
WARNING:
Reserved pins must not be connected.
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NOTE:
If not used, almost all pins should be left disconnected. The
only exceptions are the following pins:
pin
38, 37
32, 33, 35, 36, 46
23
43
47
45
44
signal
VBATT & VBATT_PA
GND
AGND
TXD
RXD
RTS
V_AUX / PWRMON
RESET*
TXD_AUX
RXD_AUX
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4.2.
Pin Layout
TOP VIEW
NOTE:
The pin defined as NC/RFU has to be considered RESERVED and
don’t connect on any pin in the application.
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GL865 Hardware User Guide
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5.
5.1.
Hardware Commands
Auto-Turning ON the GL865
To Auto-turn on the GL865, the power supply must be applied on
the power pins VBATT and VBATT_PA, after 1000 m-seconds, the
V_AUX / PWRMON pin will be at the high logic level and the module
can be consider fully operating.
When the power supply voltage is lower than 3.4V, after 4000 mseconds, the V_AUX / PWRMON pin will be at the high logic level
and the module can be consider fully operating.
The following flow chart shows the proper turn on procedure:
Modem ON Proc.
Delay 300mS
PWR supply =
ON?
Enter AT
PWMON = ON?
AT answer in
1second ?
Delay 1s - 4s
for Low Voltage
Operating
PWMON = ON?
AT init sequence.
Modem Reset Proc.
Delay 1s
Start AT CMD.
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NOTE:
The power supply on the pins VBATT and VBATT_PA must be applied
at the same time or for the special application in the first
apply the VBATT_PA and in second time apply VBATT, never vice
versa in this case can be damage the unit.
NOTE:
In order to avoid a back powering effect it is recommended to
avoid having any HIGH logic level signal applied to the digital
pins of the GL865 when the module is powered OFF or during an
ON/OFF transition.
A flow chart showing the AT command managing procedure is displayed below:
Start AT CMD.
Delay 300mS
Enter AT
AT answer in
1second ?
AT init
sequence.
Disconnect PWR
supply
Modem ON Proc.
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5.2.
Turning OFF the GL865
Turning off of the device can be done in two ways:
•
General turn OFF
•
Processor turn OFF
General turn OFF – disconnect the power supply from the both
power pins VBATT and VBATT_PA at the same time. In this case all
parts of the module are in OFF condition, any power consumption
is present.
Processor turn OFF – disconnect the power supply only from the
power pin VBATT, the power pin VBATT_PA can be connected to
power supply, in this case a low, about 30uA, power consumption
is present
Before any of both OFF procedure will be applied, the AT#SYSHALT
AT command must be send (see AT Commands Reference Guide,
80000ST10025a), after the OK response message, check the V_AUX /
PWRMON pin, when the logic level is low the module can be
consider fully not operating and at this moment is possible
disconnect the Power Supply
The following flow chart shows the proper turnoff procedure:
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Modem OFF
Proc.
PWRMON = OFF?
Disconnect PWR
supply
Place AT command
AT#SYSHALT
Wait
PWRMON =OFF
or
15s timeout
Disconnect PWR
supply
Delay 1.5s
Modem ON
Proc.
TIP:
To check if the device has been powered off, the hardware line
PWRMON must be monitored. The device is powered off when PWRMON
goes low.
NOTE:
In order to avoid a back powering effect it is recommended to
avoid having any HIGH logic level signal applied to the digital
pins of the GL865 when the module is powered OFF or during an
ON/OFF transition.
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5.3.
Resetting the GL865
5.3.1.
Hardware Unconditional restart
WARNING:
The hardware unconditional Restart must not be used during
normal operation of the device since it does not detach the
device from the network. It shall be kept as an emergency exit
procedure to be done in the rare case that the device gets
stacked waiting for some network or SIM responses.
To unconditionally reboot the GL865, the pad RESET* must be tied
low for at least 200 milliseconds and then released.
NOTE:
Do not use any pull up resistor on the RESET* line nor any totem
pole digital output. Using pull up resistor may bring to latch
up problems on the GL865 power regulator and improper
functioning of the module. The line RESET* must be connected
only in open collector configuration; the transistor must be
connected as close as possible to the RESET* pin.
TIP:
The unconditional hardware restart must always be implemented on
the boards and the software must use it as an emergency exit
procedure.
A simple circuit to do it is:
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In the following
procedure:
flow
chart
is
detailed
the
proper
restart
Modem Reset
Proc.
Reset = LOW
Delay 200ms
Reset = HIGH
PWRMON =
OFF
Delay 1,5s
Disconnect PWR
supply
Modem ON
Proc.
Delay 1s
Start AT
CMD.
NOTE:
In order to avoid a back powering effect it is recommended to
avoid having any HIGH logic level signal applied to the digital
pins of the GL865 when the module is powered OFF or during an
ON/OFF transition.
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6.
Power Supply
The power supply circuitry and board layout are a very important
part in the full product design and they strongly reflect on the
product
overall
performances,
hence
read
carefully
the
requirements and the guidelines that will follow for a proper
design.
6.1.
Power Supply Requirements
The external power supply must be connected to VBATT & VBATT_PA
signals and must fulfill the following requirements:
POWER SUPPLY
Nominal Supply Voltage
Normal Operating Voltage
Range
Extended Operating Voltage
Range
3.8 V
3.4 V÷ 4.20 V
3.22 V÷ 4.50 V
NOTE:
The Operating Voltage Range MUST never be exceeded; care must be
taken in order to fulfil min/max voltage requirement.
NOTE:
Overshoot voltage (regarding MAX Extended Operating Voltage) and
drop in voltage (regarding MIN Extended Operating Voltage) MUST
never be exceeded;
The “Extended Operating Voltage Range” can be used only with
completely assumption and application of the HW User guide
suggestions.
NOTE:
When the power supply voltage is lower than 3.4V, after 4000 mseconds, the V_AUX / PWRMON pin will be at the high logic level
and the module can be consider fully operating. See para 5.1.
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6.2.
Power Consumption
The GL865 power consumptions are:
GL 865
Mode
Average
(mA)
SWITCHED OFF
Switched Off
<5uA
Switched Off
with
<650uA
AT#SYSHALT
Mode description
Module power supplied only on VBATT_PA pin,
the VBATT pin is not power supplied.
Module power supplied on VBATT_PA pin and
VBATT pin, the at command AT#SYSHALT is
applied.
IDLE mode
AT+CFUN=1
21,0
AT+CFUN=4
18,0
AT+CFUN=0 or
=5
3,9
2,5
2,4
1,5
CSD TX and RX mode
230
GSM900 CSD PL5
DCS1800 CSD
180
PL0
GPRS (class 8) 1TX
225
GSM900 PL5
175
DCS1800 PL0
GPRS (class 10) 2TX
GSM900 PL5
360
DCS1800 PL0
300
Normal mode: full functionality of the
module
Disabled TX and RX; module is not
registered on the network
Paging Multiframe 2
Paging Multiframe 3
Paging Multiframe 4
Paging Multiframe 9
GSM VOICE CALL
GPRS Sending data mode
GPRS Sending data mode
The GSM system is made in a way that the RF transmission is
not continuous, else it is packed into bursts at a base
frequency of about 216 Hz, and the relative current peaks
can be as high as about 2A. Therefore the power supply has
to be
designed in order to withstand with these current
peaks without big voltage drops; this means that both the
electrical design and the board layout must be designed for
this current flow.
If the layout of the PCB is not well designed a strong
noise floor is generated on the ground and the supply; this
will reflect on all the audio paths producing an audible
annoying noise at 216 Hz; if the voltage drop during the
peak current absorption is too much, then the device may
even shutdown as a consequence of the supply voltage drop.
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NOTE:
The electrical design for the Power supply should be made
ensuring it will be capable of a peak current output of at least
2 A.
6.3.
General Design Rules
The principal guidelines for the Power Supply Design embrace
three different design steps:
• the electrical design
• the thermal design
• the PCB layout.
6.3.1.
Electrical Design Guidelines
The electrical design of the power supply depends strongly from
the power source where this power is drained. We will
distinguish them into three categories:
• +5V input
(typically PC internal regulator output)
• +12V input (typically automotive)
• Battery
6.3.1.1.
+ 5V input Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V, hence there's
not a big difference between the input source and the desired
output and a linear regulator can be used. A switching power
supply will not be suited because of the low drop out
requirements.
When using a linear regulator, a proper heat sink shall be
provided in order to dissipate the power generated.
A Bypass low ESR capacitor of adequate capacity must be provided
in order to cut the current absorption peaks close to the GL865,
a 100µF tantalum capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output
(usually a tantalum one) is rated at least 10V.
A protection diode should be inserted close to the power input,
in order to save the GL865 from power polarity inversion.
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An example of linear regulator with 5V input is:
6.3.1.2.
+ 12V input Source Power Supply Design Guidelines
The desired output for the power supply is 3.8V, hence due to
the big difference between the input source and the desired
output, a linear regulator is not suited and shall not be used.
A switching power supply will be preferable because of its
better efficiency especially with the 2A peak current load
represented by the GL865.
When using a switching regulator, a 500kHz or more switching
frequency regulator is preferable because of its smaller
inductor size and its faster transient response. This allows the
regulator to respond quickly to the current peaks absorption.
In any case the frequency and Switching design selection is
related to the application to be developed due to the fact the
switching frequency could also generate EMC interferences.
For car PB battery the input voltage can rise up to 15,8V and
this should be kept in mind when choosing components: all
components in the power supply must withstand this voltage.
A Bypass low ESR capacitor of adequate capacity must be provided
in order to cut the current absorption peaks, a 100µF tantalum
capacitor is usually suited.
Make sure the low ESR capacitor on the power supply output
(usually a tantalum one) is rated at least 10V.
For Car applications a spike protection diode should be inserted
close to the power input, in order to clean the supply from
spikes.
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A protection diode should be inserted close to the power input,
in order to save the GL865 from power polarity inversion. This
can be the same diode as for spike protection.
An example of switching regulator with 12V input is in the below
schematic (split in 2 parts):
6.3.1.3.
Battery Source Power Supply Design Guidelines
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The desired nominal output for the power supply is 3.8V and the
maximum voltage allowed is 4.2V, hence a single 3.7V Li-Ion cell
battery type is suited for supplying the power to the Telit
GL865 module.
WARNING:
The three cells Ni/Cd or Ni/MH 3,6 V Nom. battery types or 4V PB
types MUST NOT BE USED DIRECTLY since their maximum voltage can
rise over the absolute maximum voltage for the GL865 and damage
it.
NOTE:
DON'T USE any Ni-Cd, Ni-MH, and Pb battery types directly
connected with GL865. Their use can lead to overvoltage on the
GL865 and damage it. USE ONLY Li-Ion battery types.
A Bypass low ESR capacitor of adequate capacity must be provided
in order to cut the current absorption peaks, a 100µF tantalum
capacitor is usually suited.
Make sure the low ESR capacitor (usually a tantalum one) is
rated at least 10V.
A protection diode should be inserted close to the power input,
in order to save the GL865 from power polarity inversion.
Otherwise the battery connector should be done in a way to avoid
polarity inversions when connecting the battery.
The battery capacity must be at least 500mAh in order to
withstand the current peaks of 2A; the suggested capacity is
from 500mAh to 1000mAh.
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6.3.2.
Thermal Design Guidelines
The thermal design for the power supply heat sink should be done
with the following specifications:
See para 7.2 Power Consumption
NOTE:
The average consumption during transmissions depends on the
power level at which the device is requested to transmit by the
network. The average current consumption hence varies
significantly.
Considering the very low current during idle, especially if
Power Saving function is enabled, it is possible to consider
from the thermal point of view that the device absorbs current
significantly only during calls.
For the heat generated by the GL865, you can consider it to be
during transmission 1W max during CSD/VOICE calls and 2W max
during class10 GPRS upload.
This generated heat will be mostly conducted to the ground plane
under the GL865; you must ensure that your application can
dissipate it.
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6.3.3.
Power Supply PCB layout Guidelines
As seen on the electrical design guidelines the power supply
shall have a low ESR capacitor on the output to cut the current
peaks and a protection diode on the input to protect the supply
from spikes and polarity inversion. The placement of these
components is crucial for the correct working of the circuitry.
A misplaced component can be useless or can even decrease the
power supply performances.
The Bypass low ESR capacitor must be placed close to the Telit
GL865 power input pads or in the case the power supply is a
switching type it can be placed close to the inductor to cut the
ripple provided the PCB trace from the capacitor to the GL865 is
wide enough to ensure a dropless connection even during the 2A
current peaks.
The protection diode must be placed close to the input connector
where the power source is drained.
The PCB traces from the input connector to the power regulator
IC must be wide enough to ensure no voltage drops occur when the
2A current peaks are absorbed. Note that this is not made in
order to save power loss but especially to avoid the voltage
drops on the power line at the current peaks frequency of 216 Hz
that will reflect on all the components connected to that supply,
introducing the noise floor at the burst base frequency. For
this reason while a voltage drop of 300-400 mV may be acceptable
from the power loss point of view, the same voltage drop may not
be acceptable from the noise point of view. If your application
doesn't have audio interface but only uses the data feature of
the Telit GL865, then this noise is not so disturbing and power
supply layout design can be more forgiving.
The PCB traces to the GL865 and the Bypass capacitor must be
wide enough to ensure no significant voltage drops occur when
the 2A current peaks are absorbed. This is for the same reason
as previous point. Try to keep this trace as short as possible.
The PCB traces connecting the Switching output to the inductor
and the switching diode must be kept as short as possible by
placing the inductor and the diode very close to the power
switching IC (only for switching power supply). This is done in
order to reduce the radiated field (noise) at the switching
frequency (100-500 kHz usually).
The use of a good common ground plane is suggested.
The placement of the power supply on the board should be done in
such a way to guarantee that the high current return paths in
the ground plane are not overlapped to any noise sensitive
circuitry as the microphone amplifier/buffer or earphone
amplifier.
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The power supply input cables should be kept separate from noise
sensitive lines such as microphone/earphone cables.
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7.
Antenna
The antenna connection and board layout design are
important aspect in the full product design as they
affect the product overall performances, hence read
and follow the requirements and the guidelines for
design.
7.1.
the most
strongly
carefully
a proper
GSM Antenna Requirements
As suggested on the Product Description the antenna and antenna
transmission line on PCB for a Telit GL865 device shall fulfil the
following requirements:
ANTENNA REQUIREMENTS
DUAL
QUAD
Frequency range
Gain
Impedance
Input power
VSWR absolute
max
VSWR recommended
824-894 MHz GSM850 band
880-960 MHz GSM900 band
1710-1885MHz DCS1800 band
1850-1990MHz PCS1900 band
1.4dBi @ GSM900 and 3dBi @
DCS1800
1.4dBi @ GSM850 and 3dBi @
PCS1900
50 Ohm
> 2 W
≤ 10:1 (limit to avoid
permanent damage)
≤
2:1 (limit to fulfil all
regulatory requirements)
880-960 MHz GSM900 band
1710-1885MHz MHz DCS1800
band
1.4dBi @ GSM900 and 3dBi @
DCS1800
50 Ohm
> 2 W
≤ 10:1 (limit to avoid
permanent damage)
≤
2:1 (limit to fulfil all
regulatory requirements)
When using the GL865, since there's no antenna connector on the
module, the antenna must be connected to the GL865 antenna pad
(pin 34) by means of a transmission line implemented on the PCB.
In the case the antenna is not directly connected at the antenna
pad of the GL865, then a PCB line is needed in order to connect
with it or with its connector.
This
line
of
requirements:
transmission
shall
fulfill
the
following
ANTENNA LINE ON PCB REQUIREMENTS
Characteristic
Impedance
Max Attenuation
50 Ohm
0,3 dB
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Coupling with other signals shall be
avoided
Cold End (Ground Plane) of antenna shall be
equipotential to the GL865 ground pins
7.2.
GSM Antenna - PCB line Guidelines
Make sure that the transmission line’s characteristic impedance
is 50Ω;
Keep the length of line on the PCB as short as possible, since
the antenna line loss shall be less than about 0,3 dB;
Line geometry should have uniform characteristics, constant
cross section, avoid meanders and abrupt curves;
Any kind of suitable geometry / structure (Microstrip, Stripline,
Coplanar, Grounded Coplanar Waveguide...) can be used for
implementing the printed transmission line afferent the antenna;
If a Ground plane is required in line geometry, that plane has
to be continuous and sufficiently extended, so the geometry can
be as similar as possible to the related canonical model;
Keep, if possible, at least one layer of the PCB used only for
the Ground plane. If possible, use this layer as reference
Ground plane for the transmission line;
It is wise to surround (on both sides) the PCB transmission line
with Ground, avoid having other signal tracks facing directly
the antenna line track.
Avoid crossing any un-shielded transmission line footprint with
other signal tracks on different layers;
The ground surrounding the antenna line on PCB has to be
strictly connected to the main Ground Plane by means of via
holes (once per 2mm at least), placed close to the ground edges
facing line track;
Place EM noisy devices as far as possible from GL865 antenna
line;
Keep the antenna line far away from the GL865 power supply
lines;
If EM noisy devices are present on the PCB hosting the GL865,
such as fast switching ICs, take care of the shielding of the
antenna line by burying it inside the layers of PCB and surround
it with Ground planes, or shield it with a metal frame cover.
If EM noisy devices are not present around the line, the use of
geometries like Microstrip or Grounded Coplanar Waveguide has to
be preferred, since they typically ensure less attenuation if
compared to a Stripline having same length;
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7.3.
PCB Guidelines in case of FCC certification
In the case FCC certification is required for an application using
GL865, according to FCC KDB 996369 for modular approval requirements,
the transmission line has to be similar to that implemented on GL865
interface board and described in the following chapter.
7.3.1.
Transmission line design
During the design of the GL865 interface board, the placement of
components has been chosen properly, in order to keep the line length
as short as possible, thus leading to lowest power losses possible. A
Grounded Coplanar Waveguide (G-CPW) line has been chosen, since this
kind of transmission line ensures good impedance control and can be
implemented in an outer PCB layer as needed in this case. A SMA
female connector has been used to feed the line.
The interface board is realized on a FR4, 4-layers PCB. Substrate
material is characterized by relative permittivity εr = 4.6 ± 0.4 @ 1
GHz, TanD= 0.019 ÷ 0.026 @ 1 GHz.
A characteristic impedance of nearly 50 Ω is achieved using trace
width = 1.1 mm, clearance from coplanar ground plane = 0.3 mm each
side. The line uses reference ground plane on layer 3, while copper
is removed from layer 2 underneath the line. Height of trace above
ground plane is 1.335 mm. Calculated characteristic impedance is 51.6
Ω, estimated line loss is less than 0.1 dB. The line geometry is
shown below:
0.3 mm
0.2 mm
6.
0.3 mm
L1
FR4
1.1 mm
L2
1.335 mm
0.035 mm
0.035 mm
0.035 mm
1.1 mm
L3
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7.3.2.
Transmission line measurements
HP8753E VNA (Full-2-port calibration) has been used in this
measurement session. A calibrated coaxial cable has been soldered at
the pad corresponding to GL865 RF output; a SMA connector has been
soldered to the board in order to characterize the losses of the
transmission line including the connector itself. During Return Loss
/ impedance measurements, the transmission line has been terminated
to 50 Ω load.
Return Loss plot of line under test is shown below:
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Line input impedance (in Smith Chart format, once the line has been
terminated to 50 Ω load) is shown in the following figure:
Insertion Loss of G-CPW line plus SMA connector is shown below:
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7.4.
GSM Antenna - Installation Guidelines
Install the antenna in a place covered by the GSM signal.
Antenna shall not be installed inside metal cases
Antenna shall be installed also according Antenna manufacturer
instructions.
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8.
Logic level specifications
Where not specifically stated, all the interface circuits work
at 2.8V CMOS logic levels. The following table shows the logic
level specifications used in the GL865 interface circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any digital -0.3V +3.1V
pin (CMOS 2.8) when on
Input level on any digital -0.3V +2.1V
pin (CMOS 1.8) when on
Input voltage on analog
-0.3V +3.0 V
pins when on
Operating Range - Interface levels (2.8V CMOS)
Level
Min
Max
Input high level
2.1V
3.1V
Input low level
0V
0.5V
Output high level
2.2V
3.1V
Output low level
0V
0.35V
For 1.8V signals:
Operating Range - Interface levels (1.8V CMOS)
Level
Min
Max
Input high level
1.6V
2.0V
Input low level
0V
0.4V
Output high level
1,65V
2.0V
Output low level
0V
0.35V
Current characteristics
Level
Typical
Output Current
1mA
Input Current
1uA
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8.1.
Reset signal
Signal
Function
I/O
RESET*
Phone reset I
pin
47
RESET* is used to reset the GL865. Whenever this signal is pulled
low, the GL865 is reset. When the device is reset it stops any
operation.
After
the
release
of
the
reset
GL865
is
unconditionally shut down, without doing any detach operation
from the network where it is registered. This behaviour is not a
proper shut down because any GSM device is requested to issue a
detach request on turn off. For this reason the Reset signal
must not be used to normally shutting down the device, but only
as an emergency exit in the rare case the device remains stuck
waiting for some network response.
The RESET* is internally controlled on start-up to achieve
always a proper power-on reset sequence, so there's no need to
control this pin on start-up. It may only be used to reset a
device already on that is not responding to any command.
NOTE:
Do not use this signal to power OFF the GL865. Use the ON/OFF
procedure to perform this function.
Reset Signal Operating levels:
Signal
Min
Max
RESET* Input high
RESET* Input low
1.8V(NOTE 2.1V
1)
0V
0.2V
this signal is internally pulled up so the pin can be left
floating if not used.
(NOTE1)
If unused, this signal may be left unconnected. If used, then it
must always be connected with an open collector transistor, to
permit to the internal circuitry the power on reset and under
voltage lockout functions.
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9.
Serial Ports
The serial port on the GL865 is the core of the
between the module and OEM hardware.
2 serial ports are available on the module:
MODEM SERIAL PORT 1 (MAIN)  for AT commands and Data
MODEM SERIAL PORT 2 (AUX)  for AT commands or Debug
9.1.
interface
MODEM SERIAL PORT
Several configurations can be designed for the serial port on
the OEM hardware, but the most common are:
RS232 PC com port
microcontroller UART @ 2.8V - 3V
(Universal Asynchronous
Receive Transmit)
microcontroller UART @ 5V or other voltages different from 2.8V
Depending from the type of serial port on the OEM hardware a
level translator circuit may be needed to make the system work.
The only configuration that doesn't need a level translation is
the 2.8V UART.
The serial port on the GL865 is a +2.8V UART with all the 7
RS232 signals. It differs from the PC-RS232 in the signal
polarity (RS232 is reversed) and levels. The levels for the
GL865 UART are the CMOS levels:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Input level on any -0.3V
digital pad when on
Input voltage on
-0.3V
analog pads when on
Max
+3.1V
+3.1V
Operating Range - Interface levels (2.8V CMOS)
Level
Min
Max
Input high level
VIH
Input low level
VIL
Output high level
VOH
Output low level
VOL
2.1V
3.1 V
0V
0.5V
2.2V
3.1V
0V
0.35V
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The signals of the GL865 serial port are:
RS232
Pin
Number
Signal
GL865
Pad Number
Name
DCD - dcd_uart
RXD - tx_uart
TXD - rx_uart
DTR - dtr_uart
GND
32, 33,
35, 36, 46
Ground
DSR - dsr_uart
Data Set Ready
RTS -rts_uart
Request to Send
CTS - cts_uart
Clear to Send
RI - ri_uart
Ring Indicator
Usage
Output from the GL865 that
indicates the carrier
presence
Transmit line *see Output transmit line of
Note
GL865 UART
Receive line *see Input receive of the GL865
Note
UART
Input to the GL865 that
Data Terminal
controls the DTE READY
Ready
condition
Data Carrier
Detect
ground
Output from the GL865 that
indicates the module is
ready
Input to the GL865 that
controls the Hardware flow
control
Output from the GL865 that
controls the Hardware flow
control
Output from the GL865 that
indicates the incoming call
condition
NOTE:
According to V.24, RX/TX signal names are referred to the
application side, therefore on the GL865 side these signal are
on the opposite direction: TXD on the application side will be
connected to the receive line (here named TXD/ rx_uart ) of the
GL865 serial port and viceversa for RX.
NOTE:
For a minimum implementation, only the TXD and RXD lines can be
connected, the other lines can be left open provided a software
flow control is implemented.
NOTE:
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In order to avoid a back powering effect it is recommended to
avoid having any HIGH logic level signal applied to the digital
pins of the GE865 when the module is powered off or during an
ON/OFF transition.
9.2.
RS232 level translation
In order to interface the GL865 with a PC com port or a RS232
(EIA/TIA-232) application a level translator is required. This
level translator must:
•
invert the electrical signal in both directions;
•
change the level from 0/2.8V to +15/-15V .
Actually, the RS232 UART 16450, 16550, 16650 & 16750 chipsets
accept signals with lower levels on the RS232 side (EIA/TIA-562),
allowing a lower voltage-multiplying ratio on the level
translator. Note that the negative signal voltage must be less
than 0V and hence some sort of level translation is always
required.
The simplest way to translate the levels and invert the signal
is by using a single chip level translator. There are a
multitude of them, differing in the number of drivers and
receivers and in the levels (be sure to get a true RS232 level
translator not a RS485 or other standards).
By convention the driver is the level translator from the 0-2.8V
UART to the RS232 level. The receiver is the translator from the
RS232 level to 0-2.8V UART.
In order to translate the whole set of control lines of the UART
you will need:
•
5 drivers
•
3 receivers
NOTE:
The digital input lines working at 2.8V CMOS have an absolute
maximum input voltage of 3.0V; therefore the level translator IC
shall not be powered by the +3.8V supply of the module. Instead,
it must be powered from a +2.7V / +2.9V (dedicated) power
supply.
This is because in this way the level translator IC outputs on
the module side (i.e. GL865 inputs) will work at +3.8V interface
levels, damaging the module inputs.
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An example of level translation circuitry of this kind is:
The example is done with a MAXIM MAX3237 Transceiver that could
accept supply voltages of 3V DC. Not exceeded with supply voltage
higher then 3.1VDC because this is the higher voltage limit of
module’s inputs.
NOTE:
In this case Vin has to be set with a value compatible with the
logic levels of the module. (Max 3.1V DC)
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Second solution could be done using a MAXIM transceiver (MAX218)
In this case the
compliance with RS232 (+-5V) is possible.
Another
level
adapting method could be done using a standard RS232 Transceiver
(MAX3237EAI) adding some resistors to adapt the levels on the
GL865 Input lines.
NOTE: In this case has to be taken in account the length of the
lines on the application to avoid problems in case of High-speed
rates on RS232.
The RS232 serial port lines are usually connected to a DB9
connector with the following layout:
9.3.
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9.4.
5V UART level translation
If the OEM application uses a microcontroller with a serial port
(UART) that works at a voltage different from 2.8 - 3V, then a
circuitry has to be provided to adapt the different levels of
the two set of signals. As for the RS232 translation there are a
multitude of single chip translators. For example a possible
translator circuit for a 5V TRANSMITTER/RECEIVER can be:
TIP:
Note that the TC7SZ07AE has open drain output; therefore the
resistor R2 is mandatory.
NOTE:
The UART input line TXD (rx_uart) of the GL865 is NOT internally
pulled up with a resistor, so there may be the need to place an
external 47KΩ pull-up resistor, either the DTR (dtr_uart) and
RTS (rts_uart) input lines are not pulled up internally, so an
external pull-up resistor of 47KΩ may be required.
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NOTE:
The input lines working at 2.8VCMOS can be pulled-up with 47KΩ
In case of reprogramming of the module has to be considered the
use of the RESET line to start correctly the activity.
The preferable configuration is having an external supply for
the buffer.
NOTE:
In order to avoid a back powering effect it is recommended to
avoid having any HIGH logic level signal applied to the digital
pins of the GL865 when the module is powered OFF or during an
ON/OFF transition.
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10.
Audio Section Overview
The Base Band Chip of the GL865 provides one input for audio to be transmitted
(Uplink), that can be connected directly to a microphone or an audio source.
The bias for the microphone is already provided by the product; so the connection can
be done in both following ways:
For more information refer to Telit document :
Audio Settings Application Note “.
“ 80000NT10007a
MIC connection
Vmic
1K
1u
220n
ADC
MIC/AF_IN+
1 ÷10u
INPUT
2.2K
220n
MIC/AF_IN-
AGND
MODULE
Integral Ground Plane
Vmic
1K
1u
220n
ADC
MIC/AF_IN+
INPUT
220n
MODULE
MIC/AF_IN-
AGND
1K
Wire Or Ground Plane
TIP: Since the J-FET transistor inside the microphone acts as
RF-detector-amplifier, ask vendor for a microphone with anti-EMI
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capacitor (usually a 33pF or a 10pF capacitor placed across the
output terminals inside the case).
LINE-IN connection
Vmic
1K
1u
1u
220n
ADC
MIC/AF_IN+
INPUT
1u
220n
MIC/AF_IN-
AGND
1K
AF_IN+
AF_IN-
MODULE
Vmic
1K
1u
ADC
220n
1u
MIC/AF_IN+
220n
1u
MIC/AF_IN-
INPUT
MODULE
AGND
1K
AF_IN+
Remote_GND
If the audio source is not a mike but a different device, the
following connections can be done.
Place a 1Kohm resistor to ground on the negative input, in order
to get balanced the input; than connect the source via 1uF
capacitor, so the DC current is blocked.
Since the input is differential, the common mode voltage noise
between the two (different) ground is rejected, provided that
both AF_IN+ & AF_IN- are connected directly onto the source.
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EAR connection connection
EAR+
DAC OUTPUT
EAR-
MODULE
The audio output of the GL865 is balanced, this is helpful to
double the level and to reject common mode (click and pop are
common mode and therefore rejected).
These outputs can drive directly a small loudspeaker with
electrical impedance not lower than 8Ohm.
TIP: in order to get the maximum audio level at a given output
voltage level (dBspl/Vrms), the following breaking through
procedure can be used. Have the loudspeaker as close as you can
to the listener (this simplify also the echo cancelling); choose
the loudspeaker with the higher sensitivity (dBspl per W);
choose loudspeakers with the impedance close to the limit (ex:
16 or 8 Ohm), in order to feed more power inside the transducer
(it increases the W/Vrms ratio). If this were not enough, an
external amplifier should be used.
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10.1.
Electrical Characteristics
10.1.1. Input Lines
Microphone/Line-in path
Line Type
Differential
Coupling capacitor
Differential input
resistance
≥ 1µF
1kΩ/2kΩ/2.2kΩ
Levels
To have 0dBm0 @1KHz
Differential input
(*)
voltage
AT#HFMICG=0
290mVrms
(*)
AT#HFMICG=1
(+6dB)
145mVrms
AT#HFMICG=2
(+12dB)
72mVrms
AT#HFMICG=3
(+18dB)
36mVrms
AT#HFMICG=4
(+24dB)
18mVrms
AT#HFMICG=5
(+30dB)
9mVrms
AT#HFMICG=6
(+36dB)
4.5mVrms
AT#HFMICG=7
(+42dB)
2.25mVrms
0 dBm0 in the network are -3.14 dBfs
TIP: The Electrect microphone is internally amplified by a JFet transistor, thus the sound is carried out as saturation
drain current; this means that the norton equivalence has to
be considered. The signal is converted to voltage on the
2.2KOhm resistance, from there on circuitry has to be routed
in order to not pick up common mode noise; beware of the
return path (ground).
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10.1.2. Output Lines
EAR/Line-out Output
Differential line
Direct connection
coupling
(VDC=1.3÷1.6V)
One EAR terminal
Single-ended line
connected via a DC-block
coupling
capacitor, the other one
left open
output load resistance
≥ 8 Ω
internal output
resistance
signal bandwidth
max. differential output
voltage
differential output
voltage
volume increment
volume steps
(*)
4 Ω (typ.)
250÷3400Hz
(@ -3dB with default
filter)
1120mVpp @3.14dBm0 (*)
550mVrms @0dBm0 (*)
2dB per step
0..10
in default condition: AT+CLVL=10, AT#HFRECG=0
TIP : We suggest driving the load differentially; this kills all
the common mode noises (click and pop, for example), the output
swing will double (+6dB) and the big output coupling capacitor
will be avoided.
However if particular OEM application needs, also a Single Ended
(S.E) circuitry can be implemented. The OEM circuitry shall be
designed to reduce the common mode noise typically generated by
the return path of the big currents.
In order to get the maximum power output from the device, the
resistance of the tracks has to be negligible in comparison to
the load.
WARNING. When in Single Ended configuration, the unused output
line must be left open: if this constraint is not respected, the
output stage will be damaged.
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11.
General Purpose I/O
The general purpose I/O pads can be configured to act in three
different ways:
• input
• output
• alternate function (internally controlled)
Input pads can only be read; they report the digital value (high
or low) present on the pad at the read time .
Output pads can only be written or queried and set the value of
the pad output.
An alternate function pad is internally controlled by the GL865
firmware and acts depending on the function implemented.
For Logic levels please refer to chapter 8.
The following table shows the available GPIO on the GL865.
Pin
Signal
I/O
Function
Type
Input / Default ON_OFF
output
State
state
current
State
during
Reset
42
GPIO_01 I/O
Configurable
GPIO
CMOS
2.8V
1uA/1mA
INPUT
41
GPIO_02 I/O
Configurable
GPIO
CMOS
2.8V
1uA/1mA
INPUT
40
GPIO_03 I/O
Configurable
GPIO
CMOS
2.8V
1uA/1mA
INPUT
39
GPIO_04 I/O
Configurable
GPIO
CMOS
2.8V
1uA/1mA
INPUT
29
GPIO_05 I/O
Configurable
GPIO
CMOS
2.8V
1uA/1mA
INPUT
28
GPIO_06 I/O
Configurable
GPIO
CMOS
2.8V
1uA/1mA
INPUT
27
GPIO_07 I/O
Configurable
GPIO
CMOS
2.8V
1uA/1mA
INPUT
26
GPIO_08 I/O
Configurable
GPIO
CMOS
2.8V
1uA/1mA
INPUT
Note
Alternate
function
DVI_WA0
Alternate
function JDR
and DVI_RX
Alternate
function
DVI_TX
Alternate
function TX
disable and
DVI_CLK
Alternate
function
RFTXMON
Alternate
function
ALARM
Alternate
function
BUZZER
Alternate
function
STAT_LED
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Also the UART ‘s control flow pins can be ubable as GPI/O.
Pin Signal I/O
Function
Type
Input / Default ON_OFF
output
State
state
current
State
during
Reset
GPO_A
Configurable
GPO
CMOS
2.8V
1uA/1mA
INPUT
GPO_B
Configurable
GPO
CMOS
2.8V
1uA/1mA
INPUT
GPO_C
Configurable
GPO
CMOS
2.8V
1uA/1mA
INPUT
GPI_E
Configurable
GPI
CMOS
2.8V
1uA/1mA
INPUT
GPI_F
Configurable
GPI
CMOS
2.8V
1uA/1mA
INPUT
GPO_D
Configurable
GPO
CMOS
2.8V
1uA/1mA
INPUT
11.1.
Note
Alternate
function
C109/DCD
Alternate
function
C125/RING
Alternate
function
C107/DSR
Alternate
function
C108/DTR
Alternate
function
C105/RTS
Alternate
function
C106/CTS
GPIO Logic levels
Where not specifically stated, all the interface circuits work
at 2.8V CMOS logic levels.
The following table shows the logic level specifications used in
the GL865 interface circuits:
Absolute Maximum Ratings -Not Functional
Parameter
Min
Max
Input level on any
digital pin
when on (CMOS 2.8)
Input level on any
digital pin
when on (CMOS 1.8)
Input voltage on
analog pins
when on
-0.3V
+3.1V
-0.3V
+2.1V
-0.3V
+3.0V
Operating Range - Interface levels (2.8V CMOS)
Level
Min
Max
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Input high level
Input low level
Output high
level
Output low level
11.2.
2.1V
0V
3.1V
0.5V
2.2V
3.1V
0V
0.35V
Using a GPIO Pad as INPUT
The GPIO pads, when used as inputs, can be connected to a
digital output of another device and report its status, provided
this device has interface levels compatible with the 2.8V CMOS
levels of the GPIO.
If the digital output of the device to be connected with the
GPIO input pad has interface levels different from the 2.8V CMOS,
then it can be buffered with an open collector transistor with a
47K pull up to 2.8V.
NOTE:
In order to avoid a back powering effect it is recommended to
avoid having any HIGH logic level signal applied to the digital
pins of the GL865 when the module is powered OFF or during an
ON/OFF transition.
TIP:
The V_AUX / PWRMON pin can be used for input pull up reference
or/and for ON/OFF monitoring.
11.3.
Using a GPIO Pad as OUTPUT
The GPIO pads, when used as outputs, can drive 2.8V CMOS digital
devices or compatible hardware. When set as outputs, the pads
have a push-pull output and therefore the pull-up resistor may
be omitted.
11.4.
Using the RFTXMON Output GPIO5
The GPIO5 pin, when configured as RFTXMON Output, is controlled
by the GL865 module and will rise when the transmitter is active
and fall after the transmitter activity is completed.
There are 2 different modes for this function:
1) Active during all the Call:
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For example, if a call is started, the line will be HIGH during
all the conversation and it will be again LOW after hanged up.
The line rises up 300ms before first TX burst and will became
again LOW from 500ms to 1s after last TX burst.
2) Active during all the TX activity:
The GPIO is following the TX bursts
Please refer to the AT User interface manual for additional
information on how to enable this function.
11.5.
Using the Alarm Output GPIO6
The GPIO6 pad, when configured as Alarm Output, is controlled by
the GL865 module and will rise when the alarm starts and fall
after the issue of a dedicated AT command.
This output can be used to controlling microcontroller or
application at the alarm time.
11.6.
Using the Buzzer Output GPIO7
The GPIO7 pad, when configured as Buzzer Output, is controlled
by the GL865 module and will drive a Buzzer driver with
appropriate square waves.
This permits to your application to easily implement Buzzer
feature with ringing tones or melody played at the call incoming,
tone playing on SMS incoming or simply playing a tone or melody
when needed.
A sample interface scheme is included below to give you an idea
of how to interface a Buzzer to the GPIO7:
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TR2
SMBT2907A
+V buzzer
R1
4,7K
D1
D1N4148
C1
33pF
R2
1K
GPIO7
TR1
BCR141W
NOTE:
To correctly drive a buzzer a driver must be provided, its
characteristics depend on the Buzzer and for them refer to your
buzzer vendor.
11.7.
Magnetic Buzzer Concepts
1.1.1 Short Description
A magnetic Buzzer is a sound-generating device with a coil
located in the magnetic circuit consisting of a permanent magnet,
an iron core, a high permeable metal disk and a vibrating
diaphragm.
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Drawing of the Magnetic Buzzer.
The disk and diaphragm are attracted to the core by the magnetic
field. When an oscillating signal is moved through the coil, it
produces a fluctuating magnetic field which vibrates the
diaphragm at a frequency of the drive signal. Thus the sound is
produced relative to the frequency applied.
Diaphragm movement.
11.7.1. Frequency Behaviour
The frequency behaviour represents the effectiveness of the
reproduction of the applied signals. Because performance is
related to a square driving waveform (whose amplitude varies
from 0V to Vpp), if you modify the waveform (e.g. from square to
sinus) the frequency response will change.
11.7.2. Power Supply Influence
Applying a signal whose amplitude is different from that
suggested by the manufacturer, the performance change following
the rule “if resonance frequency fo increases, amplitude
decreases”.
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Because resonance frequency depends on acoustic design, by
lowering the amplitude of the driving signal the response
bandwidth tends to become narrow, and vice versa.
Summarizing:
Vpp ↑  fo ↓
Vpp ↓ fo ↑
The risk is that the fo could easily fall outside of new
bandwidth; consequently the SPL could be much lower than the
WARNING:
It is very important to respect the sense of the applied
voltage: never apply to the "-" pin a voltage more positive than
the "+" pin: if this happens, the diaphragm vibrates in the
opposite direction with a high probability to be expelled from
its physical position. This damages the device permanently.
expected.
11.7.3. Working Current Influence
In the component data sheet you will find the value of MAX
CURRENT: this represents the maximum average current that can
flow at nominal voltage without current limitation. In other
words it is not the peak current, which could be twice or three
times higher. If driving circuitry does not support these peak
values, the SPL will never reach the declared level or the
oscillations will stop.
11.8.
STAT LED Indication of network service
availability
The STAT_LED pin status shows information on the network service
availability and Call status. In the GL865 modules, the STAT_LED
usually needs an external transistor to drive an external LED.
Therefore, the status indicated in the following table is
reversed with respect to the pin status. The AT command to
enable the function is AT#SLED=2, in order to save the function
use the AT command AT#SLEDSAV, the AT command AT#SLED=0 disable
the function and the functionality of GPIO8 can be used. (see AT
Command user guide)
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LED status
Permanently off
Fast blinking
(Period 1s, Ton
0,5s)
Slow blinking
(Period 3s, Ton
0,3s)
Permanently on
Device Status
Device off
Net search / Not
registered / turning
off
Registered full
service
a call is active
NOTE:
Don’t use the STAT LED function if the GPIO 8 function is
enabled and vice versa!
A schematic example could be:
11.9.
SIMIN
detect function
All the GPIO pins can be used as SIM DETECT input. The AT
Command used to enable the function is:
#SIMINCFG– SIMIN pin configuration
SELINT 2
AT#SIMINCFG = 
the general purpose I/O pin GPIO
Parameters:
 - GPIO pin number;
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supported range is from 1 to 8
(see chapter 11)
AT#SIMINCFG?
Read command reports the selected I/O
pin in the format:
#SIMINCFG: 1
AT#SIMINCFG =?
Test command reports supported range
of values for parameters in the
format:
#SIMINCFG : (0 – 8)
0 = disabled
Use the AT command AT#SIMDET=2 to enable the SIMIN detection
Use the AT command AT&W0 and AT&P0 to store the SIMIN detection
in the common profile (See AT Command user guide)
NOTE:
Don’t use the SIM IN function on the same pin where the GPIO
function is enabled and vice versa!
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11.10.
RTC Bypass out
The VRTC pin brings out the Real Time Clock supply, which is
separate from the rest of the digital part, allowing having only
RTC going on when all the other parts of the device are off.
To this power output a backup battery can be added in order to
increase the RTC autonomy during power off of the main battery
(power supply). NO Devices must be powered from this pin.
11.11. SIM Holder Implementation
Please refer to the related User Guide (SIM Holder Design Guides,
80000NT10001a).
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12.
DAC and ADC section
12.1.
DAC Converter
12.1.1. Description
The GL865 provides a Digital to Analog Converter. The signal
(named DAC_OUT) is available on pin 15 of the GL865.
The on board DAC is a 10 bit converter, able to generate a
analogue value based a specific input in the range from 0 up to
1023. However, an external low-pass filter is necessary
Voltage range
(filtered)
Range
Min
Max
2,6
Units
Volt
1023
Steps
The precision is 10 bits so, if we consider that the maximum
voltage is 2V, the integrated voltage could be calculated with
the following formula:
Integrated output voltage = (2 *value) / 1023
DAC_OUT line must be integrated (for example with a low band
pass filter) in order to obtain an analog voltage.
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12.1.2. Enabling DAC
An AT command is available to use the DAC function.
The command is:
AT#DAC= [ [, ]]
 - scale factor of the integrated output voltage (0..1023
- 10 bit precision)
it must be present if =1
Refer to SW User Guide or AT Commands Reference Guide for the
full description of this function.
NOTE:
The DAC frequency is selected internally. D/A converter must not
be used during POWERSAVING.
12.1.3. Low Pass Filter Example
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12.2.
ADC Converter
12.2.1. Description
The on board A/D are 11-bit converter. They are able to read a
voltage level in the range of 0÷2 volts applied on the ADC pin
input, store and convert it into 11 bit word.
Input
Voltage
range
AD conversion
Resolution
Min
Max
11
< 1
Units
Volt
bits
mV
The GL865 module provides 2 Analog to Digital Converters.
The input lines are:
ADC_IN1
available on pin 13
ADC_IN2
available on pin 14
12.2.2.
Using ADC Converter
An
AT command is available to use the ADC function.
The command is AT#ADC=1,2
The read value is expressed in mV
Refer to SW User Guide or AT Commands Reference Guide for the
full description of this function.
12.3.
Debug of the GL865 in production
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To test and debug the mounting of the GL865, we strongly
recommend to foreseen test pads on the host PCB, in order to
check the connection between the GL865 itself and the
application and to test the performance of the module connecting
it with an external computer. Depending by the customer
application, these pads include, but are not limited to the
following signals:
pin
38, 37
32, 33, 35, 36,
46
43
47
45
44
signal
VBATT & VBATT_PA
GND
TXD
RXD
RTS
V_AUX / PWRMON
RESET*
TXD_AUX
RXD_AUX
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13.
13.1.
Mounting the GL865 on your Board
General
The GL865 modules have been designed in order to be compliant
with a standard lead-free SMT process.
13.2.
Module finishing & dimensions
Bottom
View
Pin
Lead-free Alloy:
Surface finishing Ni/Au for all solder
pads
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13.3.
Recommended foot print for the application
Top View
In order to easily rework the GE865 is suggested to consider on the
application a 1.5 mm placement inhibit area around the module.
It is also suggested, as common rule for an SMT component, to avoid
having a mechanical part of the application in direct contact with
the module.
NOTE: In the customer application, the region under WIRING INHIBIT
(see figure) must be clear from signal or ground paths.
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13.4.
Solder paste
Solder
paste
Lead
free
Sn/Ag/Cu
We recommend to use only “no clean” solder paste in order to avoid
the cleaning of the modules after assembly
13.4.1. GL865 Solder reflow
The following is the recommended solder reflow profile
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Profile Feature
Average ramp-up rate (TL
to TP)
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
Tsmax to TL
– Ramp-up Rate
Time maintained above:
– Temperature (TL)
– Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual
Peak
Temperature (tp)
Ramp-down Rate
Time
25°C
to
Peak
Temperature
Pb-Free Assembly
3°C/second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
245 +0/-5°C
10-30 seconds
6°C/second max.
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on
the package body surface
WARNING:
The GL865 module withstands one reflow process only.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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GL865 Hardware User Guide
1vv0300910 Rev.1 – 2011-07-22
14.
Packing system
The GL865 modules are packaged on trays of 20 pieces each. This
is especially suitable for the GL865 according to SMT processes
for pick & place movement requirements.
NOTE:
All temperatures refer to topside of the package, measured on
the package body surface
WARNING:
These trays can withstand at the maximum temperature of 65° C.
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GL865 Hardware User Guide
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14.1.
Moisture sensibility
The level of moisture sensibility of GL865 is “3”, in according
with standard IPC/JEDEC J-STD-020, take care all the relatives
requirements for using this kind of components.
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GL865 Hardware User Guide
1vv0300910 Rev.1 – 2011-07-22
15.
Conformity Assessment Issues
The Telit GL865 Module has been assessed in order to satisfy the
essential requirements of the R&TTE Directive 1999/05/EC (Radio
Equipment & Telecommunications Terminal Equipments) to
demonstrate the conformity against the harmonised standards with
the final involvement of a Notified Body.
If the module is installed in conformance to the Telit
installation manuals, no further evaluation under Article 3.2 of
the R&TTE Directive and do not require further involvement of a
R&TTE Directive Notified Body for the final product.
In all other cases, or if the manufacturer of the final product
is in doubt, then the equipment integrating the radio module
must be assessed against Article 3.2 of the R&TTE Directive.
In all cases the assessment of the final product must be made
against the Essential requirements of the R&TTE Directive
Articles 3.1(a) and (b), Safety and EMC respectively, and any
relevant Article 3.3 requirements.
This Hardware User Guide contains all the information you may
need for developing a product meeting the R&TTE Directive.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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GL865 Hardware User Guide
1vv0300910 Rev.1 – 2011-07-22
16.
SAFETY RECOMMANDATIONS
READ CAREFULLY
Be sure the use of this product is allowed in the country and in
the environment required. The use of this product may be
dangerous and has to be avoided in the following areas:
 Where it can interfere with other electronic devices in
environments such as hospitals, airports, aircrafts, etc
 Where there is risk of explosion such as gasoline stations,
oil refineries, etc
It is responsibility of the user to enforce the
regulation and the specific environment regulation.
Do not disassemble the product;
compromise the warranty validity.
any
mark
of
country
tampering
will
We recommend following the instructions of the hardware user
guides for a correct wiring of the product. The product has to
be supplied with a stabilized voltage source and the wiring has
to be conforming to the security and fire prevention regulations.
The product has to be handled with care, avoiding any contact
with the pins because electrostatic discharges may damage the
product itself. Same cautions have to be taken for the SIM,
checking carefully the instruction for its use. Do not insert or
remove the SIM when the product is in power saving mode.
The system integrator is responsible of the functioning of the
final product; therefore, care has to be taken to the external
components of the module, as well as of any project or
installation issue, because the risk of disturbing the GSM
network or external devices or having impact on the security.
Should there be any doubt, please refer to the technical
documentation and the regulations in force.
Every module has to be equipped with a proper antenna with
specific characteristics. The antenna has to be installed with
care in order to avoid any interference with other electronic
devices and has to guarantee a minimum distance from the body
(20 cm). In case of this requirement cannot be satisfied, the
system integrator has to assess the final product against the
SAR regulation.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
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GL865 Hardware User Guide
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The European Community provides some Directives for the
electronic equipments introduced on the market. All the relevant
information’s are available on the European Community website:
http://ec.europa.eu/enterprise/sectors/rtte/documents/
The text of the Directive 99/05 regarding telecommunication
equipments is available, while the applicable Directives (Low
Voltage and EMC) are available at:
http://ec.europa.eu/enterprise/sectors/electrical
FCC Regulatory Requirements
This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received,
including interference that may cause undesired operation.
RF Exposure:
The antenna(s) used for this transmitter must be installed
to provide a separation distance of at least 20 cm from all
the persons and must not be co-located or operating in
conjunction with any other antenna or transmitter.
The system antenna(s) used for this module must not exceed
1,4dBi (850MHz) and 3.0dBi (1900MHz) for mobile and fixed
or mobile operating configurations.
Users and installers must be provided with antenna
installation instructions and transmitter operating
conditions for satisfying RF exposure compliance.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 77 of 79
GL865 Hardware User Guide
1vv0300910 Rev.1 – 2011-07-22
IC Regulatory Requirements
This device complies with Industry Canada license-exempt
RSS standard(s). Operation is subject to the following two
conditions:
(1) this device may not cause interference, and
(2) this device must accept any interference, including
interference that may cause undesired operation of the
device.
Le présent appareil est conforme aux CNR d'Industrie Canada
applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions
suivantes :
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
Under Industry Canada regulations, this radio transmitter
may only operate using an antenna of a type and maximum (or
lesser) gain approved for the transmitter by Industry
Canada. To reduce potential radio interference to other
users, the antenna type and its gain should be so chosen
that the equivalent isotropically radiated power (e.i.r.p.)
is not more than that necessary for successful
communication.
Conformément à la réglementation d'Industrie Canada, le
présent émetteur radio peut fonctionner avec une antenne
d'un type et d'un gain maximal (ou inférieur) approuvé pour
l'émetteur par Industrie Canada. Dans le but de réduire les
risques de brouillage radioélectrique à l'intention des
autres utilisateurs, il faut choisir le type d'antenne et
son gain de sorte que la puissance isotrope rayonnée
équivalente (p.i.r.e.) ne dépasse pas l'intensité
nécessaire à l'établissement d'une communication
satisfaisante.
The GL865-QUAD has been designed to comply with safety
requirements for exposure to radio waves (SAR) in
accordance with RSS-102.
Please follow the instructions
included in the user guide for product installation and use.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 78 of 79
GL865 Hardware User Guide
1vv0300910 Rev.1 – 2011-07-22
This radio transmitter GL865-QUAD has been approved by
Industry Canada to operate with antennas with maximum
permissible gain not exceeding 1,4dBi (850MHz) and 3.0dBi
(1900MHz).
Antenna types having a gain greater than the maximum gain
indicated are strictly prohibited for use with this device.
Le GL865-QUAD a été conçu pour se conformer aux exigences
de sécurité pour l'exposition aux ondes radio (SAR) en
conformité avec RSS-102. S'il vous plaît suivez les
instructions incluses dans le guide utilisateur pour
l'installation du produit et son utilisation.
Cet émetteur radio (numéro de modèle) a été approuvé par
Industrie Canada pour fonctionner avec des antennes avec un
gain maximal admissible de 1.4 dBi (850MHz) et 3.0dBi
(1900MHz).
Types d'antenne ayant un gain supérieur au gain maximal
indiqué est strictement interdit pour une utilisation avec
cet appareil.
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 79 of 79

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